Voice coil support, loudspeaker and electronic device

Abstract

The application provides a voice coil support, a loudspeaker and an electronic device, wherein the voice coil support contains sound-absorbing material, the content of the sound-absorbing material is 90-95% based on the total weight of the voice coil support, wherein the sound-absorbing material contains first sound-absorbing particles and second sound-absorbing particles, the diameter of the first sound-absorbing particles is 1-5 mu m, the diameter of the second sound-absorbing particles is 10-20 mu m, and the weight ratio of the first sound-absorbing particles to the second sound-absorbing particles is 1.5-9:1. The material of the voice coil support provided by the application is an acoustic enhancement material containing sound-absorbing material, the weight of the voice coil support is reduced, which is equivalent to reducing the vibration mass of the loudspeaker, the proportion of the voice coil in the vibration mass of the loudspeaker is increased, and thus the overall efficiency and sensitivity of the loudspeaker are improved; in addition, the sound-absorbing material has a large number of holes and pores, can quickly lead out the heat in the voice coil structure, and thus the heat dissipation of the loudspeaker can be improved.

Description

Technical Field

[0001] This invention relates to a voice coil bracket, a loudspeaker, and an electronic device, belonging to the field of electroacoustics technology, particularly the field of voice coil technology. Background Technology

[0002] Existing moving-coil loudspeakers typically consist of three parts:

[0003] ① The vibration system includes the diaphragm, voice coil, and centering support, etc.;

[0004] ② Magnetic circuit system, including permanent magnets, magnetic plates, and field core columns, etc.;

[0005] ③ Auxiliary systems, including basin racks, power strips, dust covers, etc.

[0006] When an audio current passes through the voice coil in a magnetic field, a magnetic field that varies with the audio current is generated. This magnetic field interacts with the magnetic field of the permanent magnet, causing the voice coil to vibrate along the axis and produce sound.

[0007] As the amplitude of the loudspeaker increases, the vibration space required for the voice coil also increases, making it impossible to position the voice coil in a better position. In this case, a support needs to be added to the voice coil to guide its position into the magnetic field. Alternatively, if the voice coil wall is too thin, it is prone to deformation, so an inner liner needs to be added to keep the voice coil in its original shape. In this case, a voice coil support is also required.

[0008] The voice coil support is the backbone of the entire voice coil, responsible for transmitting the driving force generated by the voice coil to the outside through mechanical wave radiation. Therefore, the voice coil support must be lightweight yet rigid, with a smooth inner surface and high temperature resistance after coating treatment. Common materials for voice coil supports include kraft paper, aluminum, and asbestos paper.

[0009] Therefore, providing a novel voice coil holder, loudspeaker, and electronic device has become a pressing technical problem that needs to be solved in this field. Summary of the Invention

[0010] To address the aforementioned shortcomings and deficiencies, the present invention aims to provide a voice coil holder, a loudspeaker, and electronic devices. By overcoming the weight limitations of the loudspeaker voice coil holder, the present invention improves the performance of loudspeakers and electronic devices, thereby meeting the overall sound requirements of the device.

[0011] To achieve the above objectives, in one aspect, the present invention provides a voice coil support, wherein the voice coil support comprises a sound-absorbing material, and the content of the sound-absorbing material is 90-95% based on 100% of the total weight of the voice coil support. The sound-absorbing material comprises a first sound-absorbing particle and a second sound-absorbing particle, wherein the diameter of the first sound-absorbing particle is 1-5 μm, the diameter of the second sound-absorbing particle is 10-20 μm, and the weight ratio of the first sound-absorbing particle to the second sound-absorbing particle is 1.5-9:1.

[0012] In one specific embodiment of the voice coil support described above in this invention, the density of the voice coil support is 0.5-1.0 g / cm³. 3 .

[0013] As a specific embodiment of the voice coil support described above in this invention, the first sound-absorbing particle and the second sound-absorbing particle are selected from one or more of porous powder materials such as zeolite molecular sieve, activated silica, activated carbon, porous calcium carbonate, and porous calcium silicate.

[0014] In order to further enhance the acoustic enhancement effect of the sound-absorbing material, as a specific embodiment of the voice coil support described above in this invention, the zeolite molecular sieve includes one or a combination of several of the following: MFI structure molecular sieve, FER structure molecular sieve, CHA structure molecular sieve, MEL structure molecular sieve, TON structure molecular sieve, MER type molecular sieve, BEA type molecular sieve, and MTT structure molecular sieve.

[0015] In one specific embodiment of the voice coil support described above in this invention, the zeolite molecular sieve is a ZSM-5 molecular sieve.

[0016] As a specific embodiment of the voice coil support described above in this invention, the zeolite molecular sieve includes micropores with a pore size of 0.3-0.7 nm and mesopores with a pore size of 10-30 nm.

[0017] In one specific embodiment of the voice coil support described above in this invention, the voice coil support further comprises an adhesive for bonding the sound-absorbing materials together, wherein the oven-dry content of the adhesive is 5-10% based on 100% of the total weight of the voice coil support; wherein the adhesive is an organic adhesive. This means that the material of the voice coil support of this invention is an acoustic reinforcement material, wherein the acoustic reinforcement material comprises sound-absorbing materials and an adhesive for bonding the sound-absorbing materials together.

[0018] As a specific embodiment of the voice coil support described above in this invention, the organic adhesive includes one or a combination of several of the following: polyacrylate, acrylic copolymer, polyurethane, polystyrene butadiene emulsion, polystyrene acrylate, polystyrene acetate emulsion, polyvinyl acetate emulsion, silicone resin, and polybutadiene rubber emulsion.

[0019] In one specific embodiment of the voice coil support described above in this invention, the axial cross-sectional shape of the voice coil support is Z-shaped or L-shaped, etc., and the radial cross-section is a rounded rectangle, a circle, or a near-circular shape, etc. The voice coil support is cylindrical in shape; for example, when the radial cross-section is circular, the voice coil support is cylindrical in shape. Furthermore, the Z-shape can be a Z-shape in the strict sense, or it can be a Z-shape with two connected sides at right angles, specifically as follows... Figure 2 As shown. The present invention designs the axial cross-sectional shape of the voice coil support as Z-shaped or L-shaped, which can increase the bonding area between the voice coil support and the diaphragm, thereby increasing the adhesion of the center adhesive.

[0020] This invention does not impose specific requirements on the manufacturing method of the voice coil support, which can be reasonably adjusted according to the actual needs of on-site operations. For example, in some embodiments of this invention, sound-absorbing particles and adhesives can be mixed to prepare a slurry, and then the slurry can be molded to obtain the voice coil support.

[0021] There are many key parameters for loudspeakers, such as resonant frequency F0, sound pressure level, harmonic distortion (THD), and higher harmonic distortion (HOHD). Among them, resonant frequency F0 is one of the most important indicators of a loudspeaker, as it represents the level of the loudspeaker's low-frequency characteristics.

[0022] Based on the principles of proton vibration;

[0023] The formula for calculating F0 is shown in formula (1) below:

[0024] Formula (1);

[0025] In formula (1):

[0026] F0 is the resonant frequency of the loudspeaker unit, measured in Hz;

[0027] The equivalent mass of the vibration system (including the air load mass) is expressed in kg.

[0028] The equivalent compliance of the vibration system is expressed in m / N.

[0029] Among them, the equivalent mass of the vibration system The total weight includes the voice coil, voice coil support, diaphragm, centering support, and adhesive, with the voice coil support accounting for a significant portion of the total weight. The lower the ratio, the higher the mid-frequency sensitivity.

[0030] On the other hand, the present invention also provides a loudspeaker, including one or more acoustic sensors and one or more housings, wherein the one or more acoustic sensors and the one or more housings are combined to form a rear cavity of the loudspeaker, wherein the voice coil support of the loudspeaker is the voice coil support described above.

[0031] In one specific embodiment of the loudspeaker described above in this invention, when the axial cross-sectional shape of the voice coil support is Z-shaped, the entire outer end face of any end of the Z-shaped voice coil support is connected to the diaphragm; when the axial cross-sectional shape of the voice coil support is L-shaped, the entire outer end face of one side of the L-shaped voice coil support is connected to the diaphragm.

[0032] In one specific embodiment of the loudspeaker described above in this invention, the voice coil support is provided with one or more holes for heat dissipation.

[0033] In one specific embodiment of the loudspeaker described above, the rear cavity of the loudspeaker is filled with sound-absorbing material. When the sound-absorbing material is filled into the rear cavity of the loudspeaker, the voice coil support, also made of sound-absorbing material and connected to the voice coil, is located within the rear cavity separated by the diaphragm. However, it is located inside the loudspeaker unit and does not occupy conventional rear cavity space. This can be considered as increasing the amount of sound-absorbing material filled into the rear cavity, thereby achieving a capacity expansion effect.

[0034] The sound-absorbing material filled in the rear cavity of the loudspeaker can be a conventional sound-absorbing material or a sound-absorbing material of the same material as the voice coil support.

[0035] In another aspect, the present invention also provides an electronic device, wherein the speaker of the electronic device is the speaker described above.

[0036] As a specific embodiment of the electronic device described above in this invention, the electronic device includes smartphones, TWS earphones, headphones, smart glasses, smartwatches, VR devices, AR devices, tablet computers, or thin and light laptops, etc.

[0037] Compared with the prior art, the beneficial technical effects achieved by the present invention include:

[0038] (1) The voice coil support provided by the present invention is made of acoustic enhancement material, which includes sound-absorbing material, reduces the weight of the voice coil support, which is equivalent to reducing the vibration mass of the loudspeaker, i.e., the equivalent mass of the vibration system in the above formula (1), and is equivalent to increasing the proportion of the voice coil in the vibration mass of the loudspeaker, thereby improving the overall efficiency and sensitivity of the loudspeaker.

[0039] (2) The voice coil support provided by the present invention is made of acoustic enhancement material, which includes sound-absorbing material. The sound-absorbing material has a large number of holes and pores, which can quickly dissipate the heat in the voice coil structure, thereby improving the heat dissipation of the loudspeaker.

[0040] (3) The mechanical strength of the voice coil bracket provided by the present invention basically meets the requirements of ordinary voice coil bracket material and meets the working conditions when used in miniature loudspeaker unit. Attached Figure Description

[0041] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0042] Figure 1 This is a graph showing the SPL (Sound Pressure Level) curves of the first speaker unit and the comparison speaker unit in Test Example 1 of the present invention.

[0043] Figure 2 This is a schematic diagram showing the positional relationship between the voice coil support, diaphragm, and voice coil in the first loudspeaker unit in Application Example 1 of the present invention.

[0044] Figure 3 This is a schematic diagram showing the positional relationship between the voice coil support, diaphragm, and voice coil in the second loudspeaker unit in Application Example 1 of the present invention.

[0045] Figure 4 This is a schematic diagram showing the positional relationship between the voice coil support, diaphragm, and voice coil in the third loudspeaker unit in Application Example 1 of the present invention.

[0046] Figure 5 This is a schematic diagram showing the positional relationship between the voice coil support, diaphragm, and voice coil in the fourth loudspeaker unit in Application Example 1 of the present invention.

[0047] Figure 6 This is a schematic diagram showing the positional relationship between the voice coil support, diaphragm, and voice coil in the fifth loudspeaker unit in Application Example 1 of the present invention.

[0048] Figure 7This is a schematic diagram showing the positional relationship between the voice coil support, diaphragm, and voice coil in the sixth loudspeaker unit in Application Example 1 of the present invention.

[0049] Explanation of main icon numbers:

[0050] 1. Diaphragm;

[0051] 2. Voice coil support;

[0052] 3. Voice coil. Detailed Implementation

[0053] It should be noted that the term "comprising" and any variations thereof in the specification, claims, and accompanying drawings of this invention are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or devices.

[0054] The "range" disclosed in this invention is given in the form of a lower limit and an upper limit. It can be one or more lower limits and one or more upper limits, respectively. A given range is defined by selecting a lower limit and an upper limit. The selected lower and upper limits define the boundaries of the particular range. All ranges defined in this way are composable, meaning that any lower limit can be combined with any upper limit to form a range. For example, if ranges of 60-120 and 80-110 are listed for specific parameters, it is also expected that ranges of 60-110 and 80-120 are also expected. Furthermore, if the listed minimum range values ​​are 1 and 2, and the listed maximum range values ​​are 3, 4, and 5, then the following ranges are all expected: 1-3, 1-4, 1-5, 2-3, 2-4, and 2-5.

[0055] In this invention, unless otherwise specified, the numerical range "ab" represents a shortened representation of any combination of real numbers between a and b, where a and b are real numbers. For example, the numerical range "0-5" indicates that all real numbers between "0-5" have been listed in this invention, and "0-5" is simply a shortened representation of these numerical combinations.

[0056] In this invention, unless otherwise specified, all embodiments and preferred embodiments mentioned in this invention can be combined with each other to form new technical solutions.

[0057] In this invention, unless otherwise specified, all technical features and preferred features mentioned in this invention can be combined with each other to form new technical solutions.

[0058] In this invention, unless otherwise specified, the term "two kinds" as used in this specification means "at least two kinds".

[0059] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying tables, drawings, and embodiments. The embodiments described below are some, but not all, embodiments of this invention, and are only used to illustrate the invention, and should not be considered as limiting the scope of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention. Where specific conditions are not specified in the embodiments, conventional conditions or conditions recommended by the manufacturer shall be followed. Reagents or instruments whose manufacturers are not specified are all conventional products that can be purchased commercially.

[0060] Example 1

[0061] This embodiment provides a voice coil support, wherein the voice coil support is made of acoustic reinforcement material, comprising sound-absorbing material and an adhesive for bonding the sound-absorbing material together, wherein the sound-absorbing material content is 90% and the oven-dry content of the adhesive is 10% based on the total weight of the voice coil support (100%).

[0062] The sound-absorbing material comprises a first sound-absorbing particle and a second sound-absorbing particle, wherein the average diameter of the first sound-absorbing particle is 1 μm, the average diameter of the second sound-absorbing particle is 12 μm, and the weight ratio of the first sound-absorbing particle to the second sound-absorbing particle is 90:10.

[0063] The density of the voice coil support is 0.50 g / cm³. 3 ;

[0064] Both the first and second sound-absorbing particles are ZSM-5 molecular sieves, including micropores with a pore size of 0.3-0.7 nm and mesopores with a pore size of 10-30 nm.

[0065] The adhesive is polyacrylate;

[0066] The axial cross-sectional shape of the voice coil support is Z-shaped, and the radial cross-section is a rounded rectangle (i.e., racetrack-shaped).

[0067] Example 2

[0068] This embodiment provides a voice coil bracket, wherein the voice coil bracket is made of acoustic reinforcement material, comprising sound-absorbing material and adhesive for bonding the sound-absorbing material together, wherein the sound-absorbing material content is 92% and the oven-dry content of the adhesive is 8% based on the total weight of the voice coil bracket (100%).

[0069] The sound-absorbing material comprises a first sound-absorbing particle and a second sound-absorbing particle, wherein the average diameter of the first sound-absorbing particle is 2 μm, the average diameter of the second sound-absorbing particle is 15 μm, and the weight ratio of the first sound-absorbing particle to the second sound-absorbing particle is 80:20.

[0070] The density of the voice coil support is 0.61 g / cm³. 3 ;

[0071] Both the first and second sound-absorbing particles are MER-type molecular sieves, including micropores with a pore size of 0.3-0.7 nm and mesopores with a pore size of 10-30 nm.

[0072] The adhesive is a polystyrene butadiene emulsion;

[0073] The voice coil support has an L-shaped axial cross-section and a circular radial cross-section.

[0074] Example 3

[0075] This embodiment provides a voice coil support, wherein the voice coil support is made of acoustic reinforcement material, comprising sound-absorbing material and adhesive for bonding the sound-absorbing material together, wherein the sound-absorbing material content is 93% and the oven-dry content of the adhesive is 7% based on the total weight of the voice coil support (100%).

[0076] The sound-absorbing material comprises a first sound-absorbing particle and a second sound-absorbing particle, wherein the average diameter of the first sound-absorbing particle is 5 μm, the average diameter of the second sound-absorbing particle is 18 μm, and the weight ratio of the first sound-absorbing particle to the second sound-absorbing particle is 70:30.

[0077] The density of the voice coil support is 0.78 g / cm³. 3 ;

[0078] Both the first and second sound-absorbing particles are ION structure molecular sieves, including micropores with a pore size of 0.3-0.7 nm and mesopores with a pore size of 10-30 nm;

[0079] The adhesive is an organosilicon resin;

[0080] The axial cross-sectional shape of the voice coil support is Z-shaped, and the radial cross-section is nearly circular.

[0081] Example 4

[0082] This embodiment provides a voice coil support, wherein the voice coil support is made of acoustic reinforcement material, comprising sound-absorbing material and an adhesive for bonding the sound-absorbing material together, wherein the sound-absorbing material content is 95% and the oven-dry content of the adhesive is 5% based on the total weight of the voice coil support (100%).

[0083] The sound-absorbing material comprises a first sound-absorbing particle and a second sound-absorbing particle, wherein the average diameter of the first sound-absorbing particle is 5 μm, the average diameter of the second sound-absorbing particle is 20 μm, and the weight ratio of the first sound-absorbing particle to the second sound-absorbing particle is 60:40.

[0084] The density of the voice coil support is 0.95 g / cm³. 3 ;

[0085] Both the first and second sound-absorbing particles are BEA-type molecular sieves, including micropores with a pore size of 0.3-0.7 nm and mesopores with a pore size of 10-30 nm.

[0086] The adhesive is a polyvinyl acetate emulsion;

[0087] The axial cross-sectional shape of the voice coil support is L-shaped, and the radial cross-section is a rounded rectangle (i.e., racetrack-shaped).

[0088] Example 5

[0089] This embodiment provides a voice coil support, which differs from the voice coil support provided in Embodiment 1 only in that the axial cross-sectional shape of the voice coil support is different. The axial cross-sectional shape of the voice coil support in this embodiment is I-shaped.

[0090] Comparative Example 1

[0091] This comparative example provides a voice coil holder, wherein the voice coil holder is made of aluminum alloy, with an axial cross-sectional shape of Z-shape and a radial cross-section of rounded rectangle (i.e., racetrack shape), and its density is 2.7 g / cm³. 3 .

[0092] Application Example 1

[0093] This application example provides a series of 0918 loudspeaker drivers (9mm*18mm in size), wherein the voice coil supports are the voice coil supports provided in Examples 1-5. The loudspeaker drivers with the voice coil support provided in Example 1 are respectively designated as the first loudspeaker driver and the sixth loudspeaker driver, and the loudspeaker drivers with the voice coil supports provided in Examples 2-5 are respectively designated as the second to fifth loudspeaker drivers. The positional relationships between the voice coil support, diaphragm, and voice coil in the first to sixth loudspeaker drivers are shown in the schematic diagrams below. Figures 2-7 As shown. From Figure 2 As can be seen, the axial cross-sectional shape of the voice coil support 2 is Z-shaped, and the entire outer end face of both ends of the Z-shaped voice coil support 2 is connected to the diaphragm 1 and the voice coil 3, respectively; from Figure 7As can be seen, the axial cross-sectional shape of the voice coil support 2 is Z-shaped. The entire top surface (outer end face) of the upper end of the Z-shaped voice coil support 2 is connected to the diaphragm 1, and the voice coil 3 is hooked onto the lower end of the Z-shaped voice coil support 2; from Figure 3 As can be seen, the axial cross-sectional shape of the voice coil support 2 is L-shaped. The entire top surface (outer end face) of one side of the L-shaped voice coil support 2 is connected to the diaphragm 1, and the outer surface of the other side is connected to the side of the voice coil 3. Figure 4 As can be seen, the axial cross-sectional shape of the voice coil support 2 is also L-shaped. The entire top surface (outer end face) of one side of the L-shaped voice coil support 2 is connected to the diaphragm 1, and the inner surface of the other side is connected to the side of the voice coil 3. Figure 5 As can be seen, the axial cross-sectional shape of the voice coil support 2 is also L-shaped. The entire top surface (outer end face) of one side of the L-shaped voice coil support 2 is connected to the diaphragm 1, and the bottom end of the other side is connected to the top of the voice coil 3. Figure 6 As can be seen, the axial cross-sectional shape of the voice coil support 2 is I-shaped, and the entire outer end face of both ends of the I-shaped voice coil support 2 is connected to the diaphragm 1 and the voice coil 3, respectively.

[0094] The voice coil brackets provided in Embodiments 1-5 of this invention can better achieve the technical effect of lightweight brackets. Compared with the I-shaped voice coil bracket used in Embodiment 5, the L-shaped and Z-shaped voice coil brackets used in Embodiments 1-4 of this invention can also ensure the connection effect between the L-shaped and Z-shaped voice coil brackets and the diaphragm, because the connection surface area between the L-shaped and Z-shaped voice coil brackets and the diaphragm is larger.

[0095] Comparative Application Example 1

[0096] This comparative application example provides a 0918 speaker unit (9mm*18mm in size), wherein the voice coil support is the same as the voice coil support provided in Comparative Example 1, and is referred to as the comparative speaker unit.

[0097] Test Example 1

[0098] This test example uses existing conventional methods in the field (test equipment: SoundCheck 15.0 electroacoustic testing system; test method: 2.83V 10cm baffle test) to measure the SPL (Sound Pressure Level) of the first to fifth loudspeaker units and the control loudspeaker unit. The voice coil support weight, the equivalent mass of the vibration system, and the obtained SPL experimental results are shown in Table 1 below. Figure 1 As shown.

[0099] Table 1

[0100]

[0101] From Table 1 and Figure 1It can be seen that, compared to the comparative loudspeaker unit, the first to fifth loudspeaker units, respectively using the voice coil supports provided in Embodiments 1 to 5 of this invention, show a significant reduction in the weight of the voice coil supports in the first to fourth loudspeaker units from 7.13 mg to 1.05 mg, 1.13 mg, 1.24 mg, 1.38 mg, and 1.41 mg, respectively. Correspondingly, The concentrations decreased from 45.04 mg to 38.92 mg, 39.04 mg, 39.15 mg, 39.29 mg, and 39.32 mg, respectively. This is equivalent to increasing the proportion of the voice coil in the vibrating mass of the loudspeaker, thereby improving the overall efficiency and sensitivity of the loudspeaker. Specifically, at the same frequency, the SPL of the first to fourth loudspeaker units were all higher than that of the control unit. The low-frequency (300 Hz) SPL increased by 0.98 dB, 0.94 dB, 0.81 dB, 0.66 dB, and 0.23 dB, respectively, while the high-frequency (2 kHz) SPL increased by 1.28 dB, 1.27 dB, 1.17 dB, 1.09 dB, and 0.38 dB, respectively. Furthermore, as can be seen from Table 1, the performance of the first to fourth loudspeaker units using the voice coil supports provided in Embodiments 1 to 4 of the present invention is slightly better than that of the fifth loudspeaker unit using the voice coil support provided in Embodiment 5 of the present invention. This may be because the performance of L-shaped and Z-shaped voice coil supports is better than that of I-shaped voice coil supports.

[0102] In summary, compared with the prior art, the beneficial technical effects achieved by the embodiments of the present invention include:

[0103] (1) The voice coil support provided in the embodiment of the present invention is made of acoustic enhancement material, which includes sound-absorbing material, reduces the weight of the voice coil support, which is equivalent to reducing the vibration mass of the loudspeaker, i.e., the equivalent mass of the vibration system in the above formula (1), and is equivalent to increasing the proportion of the voice coil in the vibration mass of the loudspeaker, thereby improving the overall efficiency and sensitivity of the loudspeaker.

[0104] (2) The axial cross-sectional shape of the voice coil support provided in the embodiment of the present invention is Z-shaped or L-shaped, which increases the bonding area between the voice coil support and the diaphragm, thereby increasing the bonding force of the center adhesive.

[0105] (3) The voice coil support provided in the embodiments of the present invention is made of acoustic enhancement material, which includes sound-absorbing material. The sound-absorbing material has a large number of holes and pores, which can quickly dissipate the heat in the voice coil structure, thereby improving the heat dissipation of the loudspeaker.

[0106] (4) The mechanical strength of the voice coil bracket provided in the embodiments of the present invention basically meets the requirements of ordinary voice coil bracket materials and meets the working conditions requirements when used in miniature loudspeaker units.

[0107] The above description is merely a specific embodiment of the present invention and should not be construed as limiting the scope of the invention. Therefore, any substitution of equivalent components or equivalent changes and modifications made within the scope of protection of this patent should still fall within the scope of this patent. Furthermore, the technical features, technical features and technical inventions, and technical inventions in this invention can be freely combined and used.

Claims

1. A voice coil support, characterized in that, The voice coil support comprises sound-absorbing material, and the content of the sound-absorbing material is 90-95% based on the total weight of the voice coil support (100%). The sound-absorbing material comprises first sound-absorbing particles and second sound-absorbing particles. The diameter of the first sound-absorbing particles is 1-5 μm, the diameter of the second sound-absorbing particles is 10-20 μm, and the weight ratio of the first sound-absorbing particles to the second sound-absorbing particles is 1.5-9:

1.

2. The voice coil support according to claim 1, characterized in that, The density of the voice coil support is 0.5-1.0 g / cm³. 3 .

3. The voice coil support according to claim 1, characterized in that, The first sound-absorbing particle and the second sound-absorbing particle are selected from one or more of the following: zeolite molecular sieve, activated silica, activated carbon, porous calcium carbonate, and porous calcium silicate.

4. The voice coil support according to claim 3, characterized in that, The zeolite molecular sieve includes one or a combination of several of the following: MFI structured molecular sieve, FER structured molecular sieve, CHA structured molecular sieve, MEL structured molecular sieve, ION structured molecular sieve, TON structured molecular sieve, MER type molecular sieve, BEA type molecular sieve, and MTT structured molecular sieve.

5. The voice coil support according to claim 4, characterized in that, The zeolite molecular sieve is ZSM-5 molecular sieve.

6. The voice coil support according to any one of claims 3-5, characterized in that, The zeolite molecular sieve includes micropores with a pore size of 0.3-0.7 nm and mesopores with a pore size of 10-30 nm.

7. The voice coil support according to claim 1 or 2, characterized in that, The voice coil holder also includes an adhesive for bonding the sound-absorbing material together, wherein the oven-dry content of the adhesive is 5-10% based on 100% of the total weight of the voice coil holder; wherein the adhesive is an organic adhesive.

8. The voice coil support according to claim 7, characterized in that, The organic adhesive includes one or a combination of several of the following: polyacrylate, acrylic copolymer, polyurethane, polystyrene butadiene emulsion, polystyrene acrylate, polystyrene acetate emulsion, polyvinyl acetate emulsion, silicone resin, and polybutadiene rubber emulsion.

9. The voice coil support according to any one of claims 1-5, characterized in that, The axial cross-sectional shape of the voice coil support is Z-shaped or L-shaped, and the radial cross-section is a rounded rectangle, a circle, or a near-circular shape.

10. A loudspeaker, comprising one or more acoustic sensors and one or more housings, wherein the one or more acoustic sensors and the one or more housings are combined to form a rear cavity of the loudspeaker, characterized in that, The voice coil support of the loudspeaker is the voice coil support as described in any one of claims 1-9.

11. The loudspeaker according to claim 10, characterized in that, When the axial cross-sectional shape of the voice coil support is Z-shaped, the entire outer end face of any end of the Z-shaped voice coil support is connected to the diaphragm; when the axial cross-sectional shape of the voice coil support is L-shaped, the entire outer end face of one side of the L-shaped voice coil support is connected to the diaphragm.

12. The loudspeaker according to claim 10 or 11, characterized in that, The rear cavity of the loudspeaker is filled with sound-absorbing material.

13. An electronic device, characterized in that, The speaker of the electronic device is the speaker according to any one of claims 10-12.

14. The electronic device according to claim 13, characterized in that, The electronic devices include smartphones, TWS earphones, headphones, smart glasses, smartwatches, VR devices, AR devices, tablets, or thin and light laptops.

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