Light-emitting module and display device

Abstract

The invention provides a light-emitting module and a display device. The light emitting module comprises a first substrate; a light-emitting element array disposed on the first substrate, the light-emitting element array including a plurality of light-emitting elements arranged in an array in a row direction and a column direction, each of the plurality of light-emitting elements including a first electrode and a second electrode, a driving current of the light-emitting elements being 1 milliamperes or more; the plurality of row driving chips are arranged on the first substrate, and at least one of the plurality of row driving chips is used for driving at least one row of light-emitting elements; the row driving chips are arranged on the first substrate, the column driving chips are arranged on the first substrate, at least one of the column driving chips is used for driving at least one column of light-emitting elements, and at least one of the row driving chips and at least one of the column driving chips are arranged at intervals in the row direction and the column direction; and at least one of the plurality of row driving chips is electrically connected with the first electrode of the at least one row of light-emitting elements, and at least one of the plurality of column driving chips is electrically connected with the second electrode of the at least one column of light-emitting elements.

Description

Light-emitting module and display device Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a light-emitting module and a display device. Background Art

[0002] Light emitting diode (LED) technology has been developed for nearly three decades, and its application range has been continuously expanding. For example, it can be applied to the display field and used as a backlight source for display devices or as an LED display screen. With the development of technology, sub-millimeter light emitting diode (Mini Light Emitting Diode, Mini LED) has gradually become a research hotspot in the field of display technology. For example, Mini LED can be used in the light-emitting module of a liquid crystal display device as a light-emitting element of the light-emitting module. In this way, by utilizing the advantages of Mini LED, the light-emitting module can achieve the advantages of thin thickness, zoned dimming, fast response, simple structure and long life.

[0003] The above information disclosed in this section is only for understanding the background of the inventive concept of the present disclosure and therefore the above information may contain information that does not constitute prior art.

[0004] Summary of the Invention

[0005] In one aspect, a light-emitting module is provided, comprising: a first substrate; a light-emitting element array arranged on the first substrate, the light-emitting element array comprising a plurality of light-emitting elements arranged in an array along row and column directions, each of the plurality of light-emitting elements comprising a first electrode and a second electrode, wherein a driving current of the light-emitting element is above 1 mA; a plurality of row driver chips arranged on the first substrate, at least one of the plurality of row driver chips being used to drive at least one row of light-emitting elements; and a plurality of column driver chips arranged on the first substrate, at least one of the plurality of column driver chips being used to drive at least one column of light-emitting elements, wherein at least one of the plurality of row driver chips and at least one of the plurality of column driver chips are spaced apart in both row and column directions; and at least one of the plurality of row driver chips is electrically connected to the first electrode of at least one row of light-emitting elements, and at least one of the plurality of column driver chips is electrically connected to the second electrode of at least one column of light-emitting elements.

[0006] According to some exemplary embodiments, the plurality of row driver chips are arranged in a column and spaced apart along the column direction; and / or the plurality of column driver chips are arranged in a row and spaced apart along the row direction.

[0007] According to some exemplary embodiments, the light-emitting module also includes a plurality of first wirings arranged on the first substrate, at least one of the plurality of first wirings extending along the row direction; and at least one of the row driver chips includes a first scanning signal terminal, and the first scanning signal terminal is electrically connected to the first electrodes of at least a portion of the light-emitting elements in at least one row of light-emitting elements through the plurality of first wirings.

[0008] According to some exemplary embodiments, the light-emitting module further includes a plurality of second traces arranged on the first substrate, at least one of the plurality of second traces extending along a column direction; and at least one of the column driver chips includes a first channel signal terminal, and the first channel signal terminal is electrically connected to the second electrodes of at least a portion of the light-emitting elements in at least one column of light-emitting elements through the plurality of second traces.

[0009] According to some exemplary embodiments, at least one of the row driver chips further includes a second scan signal terminal, which is electrically connected to the first electrodes of at least a portion of the light-emitting elements in at least one row through a plurality of the first traces.

[0010] According to some exemplary embodiments, for the same row driver chip, the first scan signal terminal is electrically connected to the first electrode of at least a portion of the light-emitting elements in the i-th row, and the second scan signal terminal is electrically connected to the first electrode of at least a portion of the light-emitting elements in the i+1-th row, where i is a positive integer greater than or equal to 1.

[0011] According to some exemplary embodiments, at least one of the column driver chips further includes a second channel signal terminal, which is electrically connected to the second electrodes of at least a portion of the light-emitting elements in at least one column of light-emitting elements through a plurality of the second traces.

[0012] According to some exemplary embodiments, for the same column driver chip, the first channel signal terminal is electrically connected to the second electrodes of at least a portion of the light-emitting elements in the j-th column, and the second channel signal terminal is electrically connected to the second electrodes of at least a portion of the light-emitting elements in the j+1-th column, where j is a positive integer greater than or equal to 1.

[0013] According to some exemplary embodiments, the row driver chip includes at least two first scan signal terminals and at least two second scan signal terminals; and one of the at least two first scan signal terminals is electrically connected to the first electrodes of a portion of the light-emitting elements in the i-th row, and the other of the at least two first scan signal terminals is electrically connected to the first electrodes of another portion of the light-emitting elements in the i-th row; and / or, one of the at least two second scan signal terminals is electrically connected to the first electrodes of a portion of the light-emitting elements in the i+1-th row, and the other of the at least two second scan signal terminals is electrically connected to the first electrodes of another portion of the light-emitting elements in the i+1-th row.

[0014] According to some exemplary embodiments, the column driver chip includes at least two first channel signal terminals and at least two second channel signal terminals; and one of the at least two first channel signal terminals is electrically connected to the second electrodes of a portion of the light-emitting elements in the j-th column, and the other of the at least two first channel signal terminals is electrically connected to the second electrodes of another portion of the light-emitting elements in the j-th column; and / or one of the at least two second channel signal terminals is electrically connected to the second electrodes of a portion of the light-emitting elements in the j+1-th column, and the other of the at least two second channel signal terminals is electrically connected to the second electrodes of another portion of the light-emitting elements in the j+1-th column.

[0015] According to some exemplary embodiments, the row driver chip also includes a first voltage signal terminal, a first ground terminal, a first input terminal and a first output terminal; and the light-emitting module also includes an external driver chip arranged on the first substrate, and the multiple row driver chips include a first row driver chip closest to the external driver chip, and the first voltage signal terminal, the first ground terminal and the first input terminal of the first row driver chip are electrically connected to the external driver chip through the first drive line, the first ground line and the first input signal line respectively.

[0016] According to some exemplary embodiments, the first voltage signal terminal, the first ground terminal and the first output terminal of one row driver chip among the multiple row driver chips are electrically connected to the first voltage signal terminal, the ground terminal and the first input terminal of another row driver chip adjacent in the column direction through the first voltage signal lead, the first ground lead and the first signal lead respectively; and the first voltage signal lead, the first ground lead and the first signal lead respectively extend along the column direction.

[0017] According to some exemplary embodiments, the first substrate includes an intersection area, and a first straight line extending in the row direction and extending through each column driver chip intersects with a second straight line extending in the column direction and extending through each row driver chip in the intersection area; and the plurality of row driver chips include a second row driver chip and a third row driver chip closest to the intersection area, and the plurality of column driver chips include a third column driver chip and a fourth column driver chip closest to the intersection area, the second row driver chip and the third row driver chip are located on opposite sides of the intersection area in the column direction, and the third column driver chip and the fourth column driver chip are located on opposite sides of the intersection area in the row direction.

[0018] According to some exemplary embodiments, the column driver chip also includes a second voltage signal terminal, a second ground terminal, a second input terminal and a second output terminal; and the multiple column driver chips include a first column driver chip and a second column driver chip closest to the side edge of the first substrate in the column direction, the second voltage signal terminal, the second ground terminal and the second input terminal of the first column driver chip are electrically connected to the external driver chip through the second drive line, the second ground line and the second input signal line, respectively, and the second voltage signal terminal, the second ground terminal and the second input terminal of the second column driver chip are electrically connected to the external driver chip through the third drive line, the third ground line and the third input signal line, respectively.

[0019] According to some exemplary embodiments, for a plurality of column driver chips located on the same side of the intersection area in the row direction, the second voltage signal terminal, the second ground terminal, and the second output terminal of one column driver chip among the plurality of column driver chips are electrically connected to the second voltage signal terminal, the second ground terminal, and the second input terminal of another column driver chip adjacent to the row direction through the second voltage signal lead, the second ground lead, and the second signal lead, respectively; and the second voltage signal lead, the second ground lead, and the second signal lead respectively extend along the row direction.

[0020] According to some exemplary embodiments, each of the second driving line, the second ground line and the second input signal line includes a first sub-portion, a second sub-portion, a third sub-portion and a fourth sub-portion connected in sequence, the first sub-portion is connected to the external driving chip, the fourth sub-portion is connected to the column driving chip, the second sub-portion extends along the row direction, the third sub-portion extends along the column direction, and the second sub-portion and the third sub-portion of each of the second driving line, the second ground line and the second input signal line are located in the peripheral area of ​​the first substrate.

[0021] According to some exemplary embodiments, a first voltage signal lead, a first ground lead, and a first signal lead for electrically connecting the second-row driver chip and the third-row driver chip extend through the intersection region.

[0022] According to some exemplary embodiments, the second voltage signal terminal, the second ground terminal and the second input terminal of the third column driver chip are electrically connected to the external driver chip through the fourth driving line, the fourth ground line and the fourth input signal line, respectively, and the second voltage signal terminal, the second ground terminal and the second input terminal of the fourth column driver chip are electrically connected to the external driver chip through the fifth driving line, the fifth ground line and the fifth input signal line, respectively.

[0023] According to some exemplary embodiments, each of the fourth driving line, the fourth ground line, and the fourth input signal line extends through the intersection region; and each of the fifth driving line, the fifth ground line, and the fifth input signal line extends through the intersection region.

[0024] According to some exemplary embodiments, at least one of the plurality of row driver chips is used to drive at least four rows of light emitting elements.

[0025] According to some exemplary embodiments, the row driver chip includes at least two first scan signal terminals and at least two second scan signal terminals; and one of the at least two first scan signal terminals is electrically connected to the first electrodes of a part of the light-emitting elements in at least two adjacent rows of light-emitting elements, and the other of the at least two first scan signal terminals is electrically connected to the first electrodes of another part of the light-emitting elements in at least two adjacent rows of light-emitting elements; and / or, one of the at least two second scan signal terminals is electrically connected to the first electrodes of a part of the light-emitting elements in at least two adjacent rows of light-emitting elements, and the other of the at least two second scan signal terminals is electrically connected to the first electrodes of another part of the light-emitting elements in at least two adjacent rows of light-emitting elements.

[0026] According to some exemplary embodiments, the light-emitting element includes two first electrodes and one second electrode, the two first electrodes are spaced apart in a row direction; and at least some of the plurality of second routing lines extend through a gap between the two first electrodes, the orthographic projections of the plurality of second routing lines on the substrate do not overlap with the orthographic projections of the first electrodes on the substrate, and the orthographic projections of the plurality of second routing lines on the substrate do not overlap with the orthographic projections of the plurality of first routing lines on the substrate.

[0027] According to some exemplary embodiments, the plurality of first traces and the plurality of second traces are located in a same conductive layer.

[0028] According to some exemplary embodiments, the light-emitting module further includes a connector arranged on the substrate, the connector being located in the intersection area, the connector and the light-emitting element array being located on the same side of the first substrate; and the second row driver chip and the third row driver chip being respectively connected to the connector, and the third column driver chip and the fourth column driver chip being respectively connected to the connector.

[0029] According to some exemplary embodiments, the light-emitting module further includes a connector arranged on the base substrate, the orthographic projection of the connector on the base substrate is located in the intersection area, the connector and the light-emitting element array are located on opposite sides of the first substrate; and the second row driver chip and the third row driver chip are respectively connected to the connector, and the third column driver chip and the fourth column driver chip are respectively connected to the connector.

[0030] In another aspect, a display device is provided, wherein the display device includes the light-emitting module as described above. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Other objects and advantages of the present disclosure will become apparent from the following description of the present disclosure with reference to the accompanying drawings, which will help to provide a comprehensive understanding of the present disclosure.

[0032] FIG1 is a schematic diagram of a partial structure of a display device according to an embodiment of the present disclosure;

[0033] FIG2 is a plan view of a light emitting module according to an embodiment of the present disclosure;

[0034] FIG3 is a plan view of a light emitting unit according to some exemplary embodiments of the present disclosure;

[0035] FIG4 is a schematic cross-sectional structural diagram of the light emitting module according to an embodiment of the present disclosure, taken along line AA′ in FIG3 ;

[0036] FIG5 is a schematic cross-sectional view of a light emitting module according to other embodiments of the present disclosure, taken along line AA′ in FIG3 ;

[0037] FIG6A is a schematic diagram of an IC driver architecture in the related art, FIG6B is a schematic diagram of a double-layer routing design in the related art, and FIG6C is a schematic diagram of a fan-out area in the related art;

[0038] FIG7 is a schematic diagram of a driving architecture of a light emitting element array according to some exemplary embodiments of the present disclosure;

[0039] 8A is a schematic diagram of a port layout of a row driver chip according to some exemplary embodiments of the present disclosure, FIG. 8B is a schematic diagram of an internal module structure of a row driver chip according to some exemplary embodiments of the present disclosure, FIG. 8C is a schematic diagram of a port layout of a column driver chip according to some exemplary embodiments of the present disclosure, and FIG. 8D is a schematic diagram of an internal module structure of a column driver chip according to some exemplary embodiments of the present disclosure;

[0040] FIG9 is a schematic diagram of a driving architecture of a light emitting element array according to some other exemplary embodiments of the present disclosure;

[0041] FIG10 is a schematic diagram of a driving architecture of a light emitting element array according to some further exemplary embodiments of the present disclosure;

[0042] FIG11 is a schematic diagram of a layout of output lines of a light emitting element array according to some exemplary embodiments of the present disclosure;

[0043] FIG12 is a schematic diagram of a layout of output lines of a light emitting element array according to other exemplary embodiments of the present disclosure;

[0044] FIG13A is a schematic structural diagram of a connector according to some exemplary embodiments of the present disclosure, and FIG13B is a schematic structural diagram of a connector according to other exemplary embodiments of the present disclosure; and

[0045] FIG. 14 is a schematic diagram of a display device according to some exemplary embodiments of the present disclosure.

[0046] It should be noted that, for the sake of clarity, in the drawings used to describe the embodiments of the present disclosure, the sizes of layers, structures or regions may be enlarged or reduced, that is, these drawings are not drawn according to the actual scale.

[0047] [Description of Reference Numerals]

[0048] 1-display device; 2-light-emitting module; 23-diffuser plate; 24-brightness enhancement film; 3-adhesive portion; 4-display panel; 5-back frame; 6-plastic frame; 7-buffer element; 8-color conversion layer; 9-support structure; 11-first substrate; 12-submillimeter LED chip array; 13-submillimeter LED chip; 201-N pad; 202-P pad; 203-light-emitting portion; 14-encapsulation layer; 15-transparent protective structure; 101-solder pad; 102-first conductive layer; 105-second conductive layer; 106-connecting lead; 1061-first lead; 1062-second lead; 107-binding pad; 108-second insulating layer; 1080-vent hole; 109-buffer layer; 110-first flat layer; 111-second flat layer; 112-reflective layer; 113-transparent electrode; 114-anisotropic conductive adhesive; 117-first insulating layer; μIC-micro integrated circuit; T-solder paste; 120-LED driver chip; 121-external 122-row driver chip; 1221-first scanning signal terminal; 1222-second scanning signal terminal; 1223-first voltage signal terminal; 1224-first ground terminal; 1225-first input terminal; 1226-first output terminal; 123-column driver chip; 1231-first channel signal terminal; 1232-second channel signal terminal; 1233-second voltage signal terminal; 1234-second ground terminal; 1235-second input terminal; 1236-second output terminal; 124-first electrode; 125-second electrode; 126-connector; 1261-plug port; 127-fan-out area. DETAILED DESCRIPTION

[0049] In the following description, for the purpose of explanation, many specific details are set forth to provide a comprehensive understanding of the various exemplary embodiments. However, it is apparent that the various exemplary embodiments can be implemented without these specific details or with one or more equivalent arrangements. In other cases, well-known structures and devices are shown in block diagram form to avoid unnecessarily obscuring the various exemplary embodiments. In addition, the various exemplary embodiments can be different, but not necessarily exclusive. For example, the specific shape, configuration, and characteristics of the exemplary embodiment can be used or implemented in another exemplary embodiment without departing from the inventive concept.

[0050] In the accompanying drawings, the sizes and relative sizes of the elements may be exaggerated for clarity and / or descriptive purposes. Thus, the sizes and relative sizes of the individual elements are not necessarily limited to those shown in the drawings. When the exemplary embodiments can be implemented differently, the specific process sequence can be performed differently from the described sequence. For example, two processes described in succession can be performed substantially simultaneously or in an order opposite to the described sequence. In addition, the same reference numerals represent the same elements.

[0051] When an element is described as being "on" another element, "connected to" another element, or "bound to" another element, the element may be directly on the other element, directly connected to the other element, or directly bound to the other element, or there may be an intermediate element. However, when an element is described as being "directly on" another element, "directly connected to" another element, or "directly bound to" another element, there is no intermediate element. Other terms and / or expressions used to describe the relationship between elements should be interpreted in a similar manner, for example, "between" versus "directly between", "adjacent" versus "directly adjacent", or "on" versus "directly on", etc. In addition, the term "connected" may refer to a physical connection, an electrical connection, a communication connection, and / or a fluid connection. In addition, the X-axis, Y-axis, and Z-axis are not limited to the three axes of a rectangular coordinate system, and may be interpreted in a broader sense. For example, the X-axis, Y-axis, and Z-axis may be perpendicular to each other, or may represent different directions that are not perpendicular to each other. For the purposes of this disclosure, “at least one of X, Y, and Z” and “at least one selected from the group consisting of X, Y, and Z” may be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z, such as XYZ, XYY, YZ, and ZZ. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0052] It should be understood that although the terms first, second, etc. may be used herein to describe different elements, these elements should not be limited by these terms. These terms are merely used to distinguish one element from another. For example, a first element may be named a second element, and similarly, a second element may be named a first element without departing from the scope of the exemplary embodiments.

[0053] In this article, inorganic light-emitting diodes refer to light-emitting elements made of inorganic materials, where LED refers to inorganic light-emitting elements that are different from OLEDs. Specifically, inorganic light-emitting elements can include sub-millimeter light-emitting diodes (Mini LED) and micro light-emitting diodes (Micro LED). Sub-millimeter light-emitting diodes (Mini LEDs) refer to small light-emitting diodes with a grain size between Micro LEDs and traditional LEDs. Typically, the grain size of Mini LEDs can be between 100 and 300 microns.

[0054] Herein, the light emitting element may include a light emitting diode, such as a sub-millimeter light emitting diode, a micro light emitting diode, etc. In addition, the light emitting element may also include a sensor element or a micro integrated circuit chip, etc.

[0055] PM drive mode, also known as passive addressing drive mode, connects the anode (P-electrode) of each column of LED pixels in the array to the column scan line (Data Current Source), while the cathode (N-electrode) of each row of LED pixels connects to the row scan line (Scan Line). When a specific Y-th column scan line and X-th row scan line are selected, the LED pixel at their intersection (X, Y) is illuminated. This high-speed, point-by-point scanning of the entire screen creates a display.

[0056] Herein, for the convenience of description, the component formed by assembling the light emitting module and the display panel is referred to as a display device, that is, the expression "display device" includes the light emitting module, the display panel and a frame combining the light emitting module and the display panel.

[0057] Figure 1 is a schematic diagram of a partial structure of a display device according to an embodiment of the present disclosure. For example, the display device shown in Figure 1 may be a liquid crystal display device. Referring to Figure 1 , the display device 1 may include a light-emitting module 2, a display panel 4 such as a liquid crystal display panel, a back frame 5, and a plastic frame 6.

[0058] It should be noted that in this article, the "back frame" has the characteristics of high strength and light weight. The material includes metal materials such as aluminum alloy, which plays a role in increasing the structural strength of the light-emitting module and supporting and protecting the light-emitting module; the "rubber frame" is a frame connected to the back frame and used to support components such as the display panel. The rubber frame is made of a soft and elastic material.

[0059] In an embodiment of the present disclosure, the light-emitting module 2 may be a direct-type light-emitting module. FIG2 is a planar schematic diagram of a light-emitting module according to an embodiment of the present disclosure. With reference to FIG1 and FIG2 , the light-emitting module 2 may include a light-emitting substrate. For example, the light-emitting substrate may include a first substrate 11, a sub-millimeter light-emitting diode chip array 12 arranged on the first substrate 11, and an encapsulation layer 14 covering the sub-millimeter light-emitting diode chip array 12. For example, the material of the first substrate may include any one of polyimide, PEN resin, or silicone resin. The encapsulation layer 14 includes a layered structure for encapsulating the sub-millimeter light-emitting diode chip array 12 on the first substrate 11. In some exemplary embodiments, an encapsulation glue is applied to the surface of the sub-millimeter light-emitting diode chip in the light-emitting substrate, and the encapsulation layer 14 is formed after drying. The material of the encapsulation glue may include a transparent light-curing or heat-curing resin, that is, the material of the encapsulation layer 14 may be a transparent protective glue. In some embodiments, the encapsulation layer 14 may include a plurality of transparent protective structures 15.

[0060] It should be noted that rectangular frames are used in Figures 1 and 2 to represent sub-millimeter LED chips, but it can be understood that the cross-sectional shape of the sub-millimeter LED chip in the embodiment of the present disclosure is not limited to a rectangle, and can be any shape such as a circle or a polygon.

[0061] The sub-millimeter LED chip array 12 may include a plurality of sub-millimeter LED chips 13, which are spaced apart along the first direction X and the second direction Y, that is, arranged in an array on the first substrate 11. Each sub-millimeter LED chip 13 is in electrical communication with the first substrate 11. The first substrate 11 is provided with solder pads corresponding to the sub-millimeter LED chips, and the sub-millimeter LED chips are fixedly connected to the corresponding solder pads, thereby forming a sub-millimeter LED chip array 12 on the first substrate 11. It should be understood that the density of the sub-millimeter LED chip array 12 depends on the luminous efficiency power of the sub-millimeter LED chips, the power consumption requirements of the light-emitting substrate, and the brightness requirements.

[0062] For example, the first direction X and the second direction Y are perpendicular to each other, and the third direction Z is perpendicular to the first direction X and the second direction Y.

[0063] In the embodiments of the present disclosure, sub-millimeter light-emitting diode chips are applied to the light-emitting module, which is conducive to realizing a more sophisticated local dimming design of the light-emitting module, achieving high dynamic contrast, and realizing regional dimming, so that the light-emitting module has the advantages of better light transmittance uniformity, higher contrast, and more light and dark details.

[0064] For example, the first substrate 11 can be directly connected to the inner surface of the back frame 5. As shown in Figure 1, the light-emitting module 2 can include a bonding portion 3, for example, the bonding portion 3 can include double-sided tape. The first substrate 11 and the back frame 5 are respectively located on either side of the bonding portion 3 and contact the upper and lower surfaces of the bonding portion 3, respectively.

[0065] Continuing with FIG1 , the light-emitting module 2 may further include an optical film assembly. For example, the optical film assembly may include optical films such as a diffuser plate 23 and a brightness enhancement film 24. It should be understood that the optical film assembly may also include other types of optical films, and the type of optical films included in the optical film assembly may be selected based on actual usage requirements.

[0066] Referring to Figure 1 , the plastic frame 6 is used to support the display panel 4. For example, a buffer element 7, such as foam, is provided between the supporting surface of the plastic frame 6 and the lower polarizer of the display panel 4. A portion of the plastic frame 6 may overlap the back frame 5. The back frame 5 may have side walls, and the side walls of the plastic frame 6 are connected to the side walls of the back frame 5 by means of, for example, a snap-fit ​​connection or a threaded connection.

[0067] For example, the light-emitting module 2 may further include a color conversion layer 8. For example, the sub-millimeter LED chip 13 may be a sub-millimeter LED chip that emits blue light. The color conversion layer 8 may convert the blue light emitted by the sub-millimeter LED chip 13 into light of different colors, such as red, green, or white. For example, the color conversion layer 8 may be located above the diffuser plate 23. Alternatively, the color conversion layer 8 may be located below the diffuser plate 23. The embodiments of the present disclosure do not impose any particular limitations on this.

[0068] Continuing with Figure 1 , the optical film assembly is positioned on the light-emitting side of the light-emitting substrate. For displays sized approximately 25 inches and larger, an optical distance (OD) is required between the light-emitting substrate and the optical film assembly 2 to ensure uniform light output and ensure display uniformity. Therefore, the light-emitting module also includes a support structure 9 to ensure this distance. For displays sized 25 inches or smaller, the optical distance (OD) may not be required; that is, the light-emitting substrate and the optical film assembly 2 are in direct contact, and thus the light-emitting module may not include the support structure 9.

[0069] It should be noted that, while FIG1 schematically illustrates a diffuser plate 23 and a brightness enhancement film 24, the optical film assembly in the embodiments of the present disclosure may also include other types of optical films. Furthermore, each of the diffuser plate 23 and the brightness enhancement film 24 may include a single layer or multiple layers.

[0070] There is a certain spacing distance GAP between the optical film group and the display panel 4, that is, there is no direct contact between the two. For example, a cavity structure can make the light emitted from the optical film group uniformly enter the display panel 4, which is conducive to achieving display uniformity.

[0071] It is understandable that, since the first substrate of the light-emitting module may include different types of light-emitting elements, the distribution density of the light-emitting elements mentioned in the embodiment of the present disclosure refers to the distribution density of the light-emitting elements of the same type that are the most numerous in the light-emitting module. For example, the first substrate of the light-emitting module includes three types of light-emitting elements: sub-millimeter light-emitting diode chips, micro integrated circuit chips, and temperature sensors. Among them, the number of sub-millimeter light-emitting diode chips is the largest. Then, the distribution density of the sub-millimeter light-emitting diode chips 12 on the first substrate can be greater than or equal to 1 / 6mm. 2 .

[0072] For example, when the distribution density of the sub-millimeter LED chips 13 increases, the thickness of the optical film in the optical film group, for example, the thickness of the diffuser 23, can be reduced, thereby further reducing the overall thickness of the light-emitting module and, accordingly, reducing the overall weight of the light-emitting module.

[0073] In some embodiments, a light-emitting unit includes only one sub-millimeter LED chip 13. In other embodiments, a light-emitting unit may include multiple sub-millimeter LED chips 13, for example, two or more sub-millimeter LED chips 13, without specific limitation. In some embodiments, the multiple sub-millimeter LED chips 13 included in a light-emitting unit may be connected in series, in parallel, or in a combination of series and parallel, without specific limitation.

[0074] FIG3 is a plan view of a light-emitting unit according to some exemplary embodiments of the present disclosure, which schematically shows that a light-emitting unit includes four sub-millimeter light-emitting diode chips 13 arranged in series. For example, the micro-integrated circuit μIC can provide signals to four sub-millimeter light-emitting diode chips 13 in one light-emitting unit. In some embodiments, one micro-integrated circuit μIC can also provide signals to multiple light-emitting units. On the light-emitting substrate including the micro-integrated circuit μIC, a transparent protective structure 15 is provided on the side of the sub-millimeter light-emitting diode chip 13 away from the light-emitting substrate. The transparent protective structure 15 can protect the wrapped micro-integrated circuit uIC. In addition, for ease of production, the transparent protective structure 15 above the micro-integrated circuit uIC and the transparent protective structure 15 above the sub-millimeter light-emitting diode chip 13 have the same production requirements, and the two are prepared and formed in the same process flow.

[0075] It can be understood that in the embodiment of the present disclosure, the light-emitting substrate of the light-emitting module includes a light-emitting area and a peripheral area. Among them, all sub-millimeter light-emitting diode chips 13 and micro-integrated circuits μIC are arranged in the light-emitting area, and the sub-millimeter light-emitting diode chips 13 and micro-integrated circuits μIC are electrically connected to the corresponding pads on the light-emitting substrate through a series of processes such as picking up, transferring, and fixing. The peripheral area is used to connect to an external driving circuit, such as a flexible printed circuit board (FPC) or a printed circuit board (PCB). For example, by setting a binding pad 107 in the peripheral area, it can be electrically connected to the gold finger structure on the circuit board.

[0076] FIG4 is a schematic cross-sectional view of the light-emitting module according to an embodiment of the present disclosure, taken along line AA' in FIG3 . Referring to FIG2 through FIG4 , the sub-millimeter LED chip 13 includes a light-emitting portion 203 and two pins 201 and 202 (respectively, an N pad and a P pad), each of which is connected to a pad 101 via solder paste T. Each pad 101 is then connected based on the position of the sub-millimeter LED chip 13 in the electrical circuit. Specifically, in FIG3 , the P pad of the sub-millimeter LED chip 13 in the lower left corner is connected to the driving voltage line VLED, the N pad of the sub-millimeter LED chip 13 in the lower left corner is connected to the P pad of the sub-millimeter LED chip 13 in the upper left corner, the N pad of the sub-millimeter LED chip 13 in the upper left corner is connected to the P pad of the sub-millimeter LED chip 13 in the upper right corner, the N pad of the sub-millimeter LED chip 13 in the upper right corner is connected to the P pad of the sub-millimeter LED chip 13 in the lower right corner, and the N pad of the sub-millimeter LED chip 13 in the lower right corner is connected to the output terminal of the micro-integrated circuit μIC. In some embodiments, the micro-integrated circuit μIC can have multiple pins, for example, 4 pins, which are respectively connected to the pads on the light-emitting substrate through solder paste, and each pad is respectively connected to the source power line PWR, the common voltage line GND, the address line DI, and the sub-millimeter light-emitting diode chip 13 in the corresponding light-emitting unit.

[0077] In some embodiments, referring to FIG. 2 to FIG. 4 , the light emitting module may further include: a first conductive layer 102, which is generally used to arrange various signal lines, such as a common voltage line GND, a drive voltage line VLED, a source power line PWR, an address line DI, etc. Optionally, the thickness of the first conductive layer 102 is about 1.5 μm-7 μm, and its material may include copper, for example, a stacked material such as MoNb / Cu / MoNb may be formed by sputtering, wherein the material on the side of the stacked layer close to the first substrate 11 is MoNb, and the thickness is about 1.5 μm-7 μm. It is mainly used to improve the adhesion between the film layer and the first substrate 11. The middle layer material of the stack is Cu, which is the preferred material for the electrical signal transmission channel. The material on the side away from the first substrate 11 is MoNb, with a thickness of about It can be used to protect the middle layer and prevent the surface of the middle layer with low resistivity from being exposed and oxidized. Since the thickness of a single sputtering generally does not exceed 1 μm, multiple sputterings are required to form the first conductive layer 102 with a thickness exceeding 1 μm. In addition, the first conductive layer 102 can also be formed by electroplating. Specifically, a seed layer can be formed using MoNiTi to increase the nucleation density of metal grains in the subsequent electroplating process, and then copper with low resistivity is produced by electroplating, and then an anti-oxidation layer is produced. The material can be MoNiTi. Optionally, the surface of the first conductive layer 102 away from the first substrate 11 can be covered by a first insulating layer 117 to ensure the reliability and stability of the electrical path.

[0078] In some embodiments, referring to FIG. 2 to FIG. 4 , the light emitting module may further include: a second conductive layer 105, which is generally used to set pads and connecting leads 106. Optionally, the film thickness of the second conductive layer 105 is approximately The pads are used to bond various electrical components. For example, they may include pads 101 located in the light-emitting area for mounting the sub-millimeter LED chip 13, and / or pads for mounting functional components such as micro-integrated circuit chips or sensors, as well as bonding pads 107 located in the peripheral area for connection to the circuit board. The surface of the pads facing away from the first substrate 11 needs to be partially exposed before being connected to the light-emitting component. To prevent oxidation of the pads when exposed to air during the substrate fabrication process and the process of placing the light-emitting element on the substrate, an anti-oxidation material layer can be applied only to the exposed surface area of ​​the pads, i.e., the surface of the pad area will have an additional layer than the area where the connecting lead 106 is located. Alternatively, the second conductive layer 105 can be configured as a stacked structure of at least two layers, with the film layer away from the first substrate 11 being made of an oxidation-resistant metal or alloy material. Specifically, it can be composed of a stacked structure of, for example, MoNb / Cu / CuNi. The bottom layer of the stack, MoNb, is primarily used to improve adhesion. The middle layer of Cu in the stack, due to its low resistivity, is primarily used to transmit electrical signals. The top layer of CuNi in the stack prevents oxidation of the middle layer and ensures a secure connection to the light-emitting element. The connecting lead 106 can include a first lead 1061 extending along a first direction X and a second lead 1062 extending along a second direction Y. The surfaces of the first and second leads 1061, 1062 away from the first substrate 11 are covered by a second insulating layer 108 to ensure the reliability and stability of the electrical path.

[0079] In some embodiments, as shown in FIG4 , the light-emitting module may further include: a buffer layer 109 located between the first substrate 11 and the first conductive layer 102; a first flat layer 110 located between the first insulating layer 117 and the second conductive layer 105; a second flat layer 111 and a reflective layer 112 located sequentially on the side of the second insulating layer 108 facing away from the second conductive layer 105; a transparent electrode 113 located on the bonding pad 107 in the peripheral region; and an anisotropic conductive adhesive 114 located between the transparent electrode 113 and the flexible printed circuit board (FPC). The buffer layer 109 prevents impurities in the first substrate 11 from affecting the conductivity of the first conductive layer 102; the first flat layer 110 provides a flat surface for fabricating the second conductive layer 105; the second flat layer 111 provides a flat surface for subsequent bonding of the sub-millimeter LED chip 13; the reflective layer 112 may be made of white ink to increase the reflectivity of the light-emitting substrate and reduce light loss; and the transparent electrode 113 and anisotropic conductive adhesive 114 are used to electrically connect the bonding pad 107 in the peripheral region to the flexible printed circuit board (FPC).

[0080] Figure 5 is a schematic cross-sectional view of a light-emitting module according to other embodiments of the present disclosure, taken along line AA' in Figure 3. To clearly illustrate the film layer structure on the light-emitting substrate, the sub-millimeter light-emitting diode chip is not shown in Figure 5. As shown in Figure 5, the light-emitting substrate of the light-emitting module may include: a first substrate 11; a buffer layer 109 located on the first substrate 11; a first conductive layer 102 located on the side of the buffer layer 109 away from the first substrate 11; a first insulating layer 117 located on the side of the first conductive layer 102 away from the first substrate 11; a first planar layer 110 located on the side of the first insulating layer 117 away from the first substrate 11; a second conductive layer 105 located on the side of the first planar layer 110 away from the first substrate 11; a second insulating layer 108 located on the side of the second conductive layer 105 away from the first substrate 11; and a second planar layer 111 located on the side of the second insulating layer 108 away from the first substrate 11.

[0081] As shown in Figure 5, the second insulating layer 108 is located between the first planar layer 110 and the second planar layer 111. If the second planar layer 111 is made of an organic insulating material, multiple vent holes 1080 can be provided in the second insulating layer 108. Each of these vent holes 1080 exposes a portion of the first planar layer 110 located below. During the manufacturing process of the light-emitting substrate, gas accumulated in the first planar layer 110 can be released through the vent holes 1080, thereby preventing warping and peeling of the light-emitting substrate film and improving product yield.

[0082] For example, in the embodiment shown in FIG5 , a plurality of vent holes 1080 are provided. However, this is merely illustrative and not a limitation of the embodiments of the present disclosure. In other embodiments, a greater number or a smaller number of vent holes may be provided.

[0083] Figure 6A is a schematic diagram of an IC driver architecture in the related art. Figure 6B is a schematic diagram of a double-layer routing design in the related art. Figure 6C is a schematic diagram of a fan-out region in the related art.

[0084] As shown in FIG6A , in current local dimming (PM) solutions, LED driver chips 120 are all integrated into rows and columns. For example, the inputs to the LED driver IC 120 include, for example, a digital voltage DVDD, a serial peripheral interface SPI, a vertical synchronization signal VSYNC, and a power supply PVDD. The LED driver IC 120 uniformly drives all rows and columns in the light-emitting element array. The LED driver IC 120 drives the scanning of each row of the light-emitting element array via a plurality of first leads 1061, and drives the channel signal transmission of each column of the light-emitting element array via a plurality of second leads 1062. Therefore, all high LED currents must pass through the LED driver IC 120, resulting in higher power consumption and higher temperature. It is understood that the light-emitting element array can be, for example, a sub-millimeter light-emitting diode chip array 12, or other types of light-emitting element arrays, and the embodiments of the present disclosure are not limited thereto.

[0085] To address the aforementioned concentrated power consumption issue, some exemplary embodiments of the present disclosure provide a light-emitting module and a display device including the light-emitting module. For example, some exemplary embodiments of the present disclosure provide a light-emitting module and a display device. Figure 7 is a schematic diagram of a driving architecture for a light-emitting element array according to some exemplary embodiments of the present disclosure. 7 , the light-emitting module includes: a first substrate; a light-emitting element array provided on the first substrate, the light-emitting element array including a plurality of light-emitting elements arranged in an array along row and column directions, each of the plurality of light-emitting elements including a first electrode 124 and a second electrode 125; a plurality of row driver chips 122 provided on the first substrate, at least one of the plurality of row driver chips 122 being used to drive at least one row of light-emitting elements; and a plurality of column driver chips 123 provided on the first substrate, at least one of the plurality of column driver chips 123 being used to drive at least one column of light-emitting elements, wherein at least one of the plurality of row driver chips 122 and at least one of the plurality of column driver chips 123 are spaced apart in both the row and column directions; and at least one of the plurality of row driver chips 122 is electrically connected to the first electrode 124 of at least one row of light-emitting elements, and at least one of the plurality of column driver chips 123 is electrically connected to the second electrode 125 of at least one column of light-emitting elements.

[0086] In an embodiment of the present disclosure, a plurality of row driver chips 122 and a plurality of column driver chips 123 are provided for each row and column of the light-emitting element array, and the row driver chips 122 and column driver chips 123 are spaced apart so that the scanning of each row of the light-emitting element array is driven by the plurality of row driver chips 122, and the input of the channel signal (digital signal) of each column is driven by the plurality of column driver chips 123. When driving a row or multiple rows of light-emitting elements, the row driver chips 122 are electrically connected to the row or multiple rows of light-emitting elements via a first electrode 124, such as an anode or positive electrode. When driving a column or multiple columns of light-emitting elements, the column driver chips 123 are electrically connected to the row or multiple columns of light-emitting elements via a second electrode 125, such as a cathode or negative electrode. In an embodiment of the present disclosure, the driving current of the light-emitting elements is greater than 1 mA. For example, the light-emitting elements may include sub-millimeter light-emitting diodes. In this case, if a single driver chip is used to provide driving current to each light-emitting element, the power consumption of the single driver chip will be relatively high. In the embodiments of the present disclosure, by driving the rows and columns of the light-emitting element array by row driver chip 122 and column driver chip 123 respectively, the power consumption can be evenly distributed to row driver chip 122 and column driver chip 123, which is beneficial to the overall heat dissipation of the backplane, reducing the temperature and improving the user experience and service life of the product.

[0087] Figure 8A is a schematic diagram of the port layout of a row driver chip according to some exemplary embodiments of the present disclosure. Figure 8B is a schematic diagram of the internal module structure of a row driver chip according to some exemplary embodiments of the present disclosure. Figure 8C is a schematic diagram of the port layout of a column driver chip according to some exemplary embodiments of the present disclosure. Figure 8D is a schematic diagram of the internal module structure of a column driver chip according to some exemplary embodiments of the present disclosure.

[0088] As shown in FIG. 7 , a plurality of row driver chips 122 are arranged in a column and spaced apart along the column direction; and / or a plurality of row driver chips 123 are arranged in a row and spaced apart along the row direction.

[0089] In some exemplary embodiments of the present disclosure, the light-emitting module includes, for example, four row driver chips 122 and four column driver chips 123. Each row driver chip 122 drives two rows of light-emitting elements, and each column driver chip 123 drives two columns of light-emitting elements. The light-emitting element array can be precisely controlled down to the four light-emitting elements intersecting two rows and two columns.

[0090] It is understandable that the number of row driver chips 122 and column driver chips 123 may be other than that shown in FIG7 , and the number of row driver chips 122 and column driver chips 123 may be the same or different. That is, one row driver chip 122 can drive a row of light-emitting elements or multiple rows of light-emitting elements. Similarly, one column driver chip 123 can drive a column of light-emitting elements or multiple columns of light-emitting elements. There is no fixed correspondence between the number of row driver chips 122 and column driver chips 123. In actual applications, the number of row driver chips 122 and column driver chips 123 needs to be determined based on various factors such as product size, line current limit, and resolution requirements.

[0091] As shown in Figures 7 and 8A, the light-emitting module also includes, for example, a plurality of first wirings arranged on the first substrate, at least one of the plurality of first wirings extending along the row direction; and at least one row driver chip 122 includes a first scanning signal terminal 1221, and the first scanning signal terminal 1221 is electrically connected to the first electrode 124 of at least a portion of the light-emitting elements in at least one row of light-emitting elements through the plurality of first wirings.

[0092] For example, as shown in FIG7 and FIG8A, at least one row driver chip 122 further includes a second scan signal terminal 1222, which is electrically connected to the first electrodes 124 of at least a portion of the light-emitting elements in at least one row of light-emitting elements through a plurality of first traces.

[0093] Among them, for the same row driver chip 122, the first scanning signal terminal 1221 is electrically connected to the first electrode 124 of at least a part of the light-emitting elements in the i-th row, and the second scanning signal terminal 1222 is electrically connected to the first electrode 124 of at least a part of the light-emitting elements in the i+1-th row, where i is a positive integer greater than or equal to 1.

[0094] Specifically, the row driver chip 122 includes, for example, at least two first scan signal terminals 1221 and at least two second scan signal terminals 1222; and one of the at least two first scan signal terminals 1221 is electrically connected to the first electrodes 124 of a portion of the light-emitting elements in the i-th row, and the other of the at least two first scan signal terminals 1221 is electrically connected to the first electrodes 124 of another portion of the light-emitting elements in the i-th row; and / or, one of the at least two second scan signal terminals 1222 is electrically connected to the first electrodes 124 of a portion of the light-emitting elements in the i+1-th row, and the other of the at least two second scan signal terminals 1222 is electrically connected to the first electrodes 124 of another portion of the light-emitting elements in the i+1-th row.

[0095] In some exemplary embodiments of the present disclosure, the first trace is, for example, a first lead 1061, the first scan signal terminal 1221 is, for example, MUX1, the second scan signal terminal 1222 is, for example, MUX2, and the first electrode 124 is, for example, an anode or positive electrode. Multiple first leads 1061 extend along the row direction, and FIG. 7 , for example, includes 16 first leads 1061. Among them, each row driver chip 122, for example, includes two first scanning signal terminals 1221 on the upper side. From top to bottom, the two first scanning signal terminals 1221 on the upper side of the first row driver chip 122 respectively drive the eight light-emitting elements in the first row through a first lead 1061, the two first scanning signal terminals 1221 on the upper side of the second row driver chip 122 drive the eight light-emitting elements in the third row, the two first scanning signal terminals 1221 on the upper side of the third row driver chip 122 drive the eight light-emitting elements in the fifth row, and the two first scanning signal terminals 1221 on the upper side of the fourth row driver chip 122 drive the eight light-emitting elements in the seventh row. Each row driver chip 122, for example, further includes two second scanning signal terminals 1222 on the lower side. From top to bottom, the two second scanning signal terminals 1222 on the lower side of the first row driver chip 122 drive the eight light-emitting elements in the second row through a first lead 1061 respectively. The two second scanning signal terminals 1222 on the lower side of the second row driver chip 122 drive the eight light-emitting elements in the fourth row. The two second scanning signal terminals 1222 on the lower side of the third row driver chip 122 drive the eight light-emitting elements in the sixth row. The two second scanning signal terminals 1222 on the lower side of the fourth row driver chip 122 drive the eight light-emitting elements in the eighth row.

[0096] It is understandable that the number of the first scan signal terminal 1221 and / or the second scan signal terminal 1222 in each row driver chip 122 can be one or more, which can be determined specifically according to the number of row driver chips 122, the number of rows of the light-emitting element array to be driven, and the position of the row driver chip 122, and is not limited in the present disclosure. The first scan signal terminal 1221 can also be located on the lower side of the row driver chip 122, that is, the second scan signal terminal 1222 can also be located on the upper side of the row driver chip 122. The row driver chip 122 can be located in the middle of the light-emitting element array, or on the left and right sides of the light-emitting element array. Depending on the position of the row driver chip 122, the first scan signal terminal 1221 or the second scan signal terminal 1222 can drive a portion of the light-emitting elements in a row, or drive the light-emitting elements of the entire row.

[0097] For example, as shown in Figures 7 and 8C, the light-emitting module also includes a plurality of second traces arranged on the first substrate, at least one of the plurality of second traces extending along the column direction; and at least one column driver chip 123 includes a first channel signal terminal 1231, and the first channel signal terminal 1231 is electrically connected to the second electrode 125 of at least a portion of the light-emitting elements in at least one column of light-emitting elements through the plurality of second traces.

[0098] For example, as shown in FIG7 and FIG8C , at least one column driver chip 123 further includes a second channel signal terminal 1232 , which is electrically connected to the second electrodes 125 of at least a portion of the light emitting elements in at least one column of light emitting elements through a plurality of second traces.

[0099] For the same column driver chip 123, the first channel signal terminal 1231 is electrically connected to the second electrodes 125 of at least a portion of the light-emitting elements in the j-th column, and the second channel signal terminal 1232 is electrically connected to the second electrodes 125 of at least a portion of the light-emitting elements in the j+1-th column, where j is a positive integer greater than or equal to 1.

[0100] Specifically, the column driver chip 123 includes at least two first channel signal terminals 1231 and at least two second channel signal terminals 1232; and one of the at least two first channel signal terminals 1231 is electrically connected to the second electrodes 125 of a portion of the light-emitting elements in the j-th column, and the other of the at least two first channel signal terminals 1231 is electrically connected to the second electrodes 125 of another portion of the light-emitting elements in the j-th column; and / or, one of the at least two second channel signal terminals 1232 is electrically connected to the second electrodes 125 of a portion of the light-emitting elements in the j+1-th column, and the other of the at least two second channel signal terminals 1232 is electrically connected to the second electrodes 125 of another portion of the light-emitting elements in the j+1-th column.

[0101] In some exemplary embodiments of the present disclosure, the second trace is, for example, a second lead 1062, the first channel signal terminals 1231 are, for example, CH1 and CH3, the second channel signal terminals 1232 are, for example, CH2 and CH4, and the second electrode 125 is, for example, a cathode or a negative electrode. Multiple second leads 1062 extend along the column direction, and FIG. 7 , for example, includes 16 second leads 1062. Each column driver chip 123 includes, for example, two first channel signal terminals 1231 on the left side. From left to right, the two first channel signal terminals 1231 on the left side of the first column driver chip 123 respectively drive the eight light-emitting elements in the first column through a second lead 1062. The two first channel signal terminals 1231 on the left side of the second column driver chip 123 drive the eight light-emitting elements in the third column. The two first channel signal terminals 1231 on the left side of the third column driver chip 123 drive the eight light-emitting elements in the fifth column. The two first channel signal terminals 1231 on the left side of the fourth column driver chip 123 drive the eight light-emitting elements in the seventh column. For example, each column driver chip 123 further includes two second channel signal terminals 1232 on the right side. From left to right, the two second channel signal terminals 1232 on the right side of the first column driver chip 123 respectively drive the eight light-emitting elements in the second column through a second lead 1062. The two second channel signal terminals 1232 on the right side of the second column driver chip 123 drive the eight light-emitting elements in the fourth column. The two second channel signal terminals 1232 on the right side of the third column driver chip 123 drive the eight light-emitting elements in the sixth column. The two second channel signal terminals 1232 on the right side of the fourth column driver chip 123 drive the eight light-emitting elements in the eighth column.

[0102] It is understood that the number of first channel signal terminals 1231 and / or second channel signal terminals 1232 in each column driver chip 123 can be one or more, and can be determined specifically based on the number of column driver chips 123, the number of columns of the light-emitting element array to be driven, and the location of the column driver chips 123, and is not limited in this disclosure. The first channel signal terminal 1231 can also be located on the right side of the column driver chip 123, that is, the second channel signal terminal 1232 can also be located on the left side of the column driver chip 123. The column driver chip 123 can be located in the middle of the light-emitting element array or on the upper and lower sides of the light-emitting element array. Depending on the location of the column driver chip 123, the first channel signal terminal 1231 or the second channel signal terminal 1232 can drive a portion of the light-emitting elements in a column or drive the light-emitting elements in the entire column.

[0103] For example, as shown in Figures 7 and 8A, the row driver chip 122 also includes a first voltage signal terminal 1223, a first ground terminal 1224, a first input terminal 1225 and a first output terminal 1226; and the light-emitting module also includes an external driver chip 121 arranged on the first substrate, and the multiple row driver chips 122 include a first row driver chip 122 closest to the external driver chip 121, and the first voltage signal terminal 1223, the first ground terminal 1224 and the first input terminal 1225 of the first row driver chip 122 are electrically connected to the external driver chip 121 through the first driving line, the first ground line and the first input signal line, respectively. The first voltage signal terminal 1223, the first ground terminal 1224 and the first output terminal 1226 of one row driver chip 122 among the multiple row driver chips 122 are electrically connected to the first voltage signal terminal 1223, the first ground terminal 1224 and the first input terminal 1225 of another row driver chip 122 adjacent in the column direction through the first voltage signal lead, the first ground lead and the first signal lead respectively; and the first voltage signal lead, the first ground lead and the first signal lead respectively extend along the column direction.

[0104] In some exemplary embodiments of the present disclosure, the first voltage signal terminal 1223 is, for example, VLED, the first ground terminal 1224 is, for example, GND, the first input terminal 1225 is, for example, DI, and the first output terminal 1226 is, for example, DO. If the external driver chip 121 is disposed on one side of the fan-out region 127 where the output lines are concentrated, the fourth row driver chip 122 from the top is the first row driver chip 122 closest to the external driver chip 121. The first voltage signal terminal 1223, first ground terminal 1224, and first input terminal 1225 of the fourth row driver chip 122 are electrically connected to the external driver chip 121 via a first drive line, a first ground line, and a first input signal line, respectively. Furthermore, the first voltage signal terminal 1223, first ground terminal 1224, and first output terminal 1226 of the fourth row driver chip 122 are electrically connected to the first voltage signal terminal 1223, first ground terminal 1224, and first input terminal 1225 of the third row driver chip 122 above them via the first voltage signal lead, first ground lead, and first signal lead, respectively. In a similar manner, the first voltage signal lead, first ground lead, and first signal lead extend along the column direction from the third row driver chip 122 to the second row driver chip 122, and then from the second row driver chip 122 to the first row driver chip 122, thereby achieving electrical signal connectivity for all rows of the light-emitting element array.

[0105] As shown in Figure 8B, the row driver chip 122 includes, for example, a register, a switch driver module, a channel switch module, and a data processing module, which are sequentially communicatively connected. The register, for example, is used to connect a first input terminal 1225 and a first output terminal 1226 to store scan instructions. The switch driver module, for example, is used to connect a first voltage signal terminal 1223 and a first ground terminal 1224 to control the on / off switching of the input circuit voltage and the ground voltage. The channel switch module is used to connect various scan signal terminals, such as MUX1...MUXn, to control the on / off switching of each row scan signal. The data processing module is used to process data that controls row scans.

[0106] For example, as shown in Figures 7 and 8C, the column driver chip 123 also includes a second voltage signal terminal 1233, a second ground terminal 1234, a second input terminal 1235 and a second output terminal 1236; and the multiple column driver chips 123 include a first column driver chip 123 and a second column driver chip 123 that are closest to the side edge of the first substrate in the column direction, the second voltage signal terminal 1233, the second ground terminal 1234 and the second input terminal 1235 of the first column driver chip 123 are electrically connected to the external driver chip 121 through the second driving line, the second ground line and the second input signal line, respectively, and the second voltage signal terminal 1233, the second ground terminal 1234 and the second input terminal 1235 of the second column driver chip 123 are electrically connected to the external driver chip 121 through the third driving line, the third ground line and the third input signal line, respectively.

[0107] Among them, each of the second driving line, the second ground line and the second input signal line includes a first sub-portion, a second sub-portion, a third sub-portion and a fourth sub-portion connected in sequence, the first sub-portion is connected to the external driving chip 121, the fourth sub-portion is connected to the column driving chip 123, the second sub-portion extends along the row direction, and the third sub-portion extends along the column direction. The second sub-portion and the third sub-portion of each of the second driving line, the second ground line and the second input signal line are both located in the peripheral area of ​​the first substrate.

[0108] In some exemplary embodiments of the present disclosure, the second voltage signal terminal 1233 is, for example, VCC, the second ground terminal 1234 is, for example, GND, the second input terminal 1235 is, for example, DI, and the second output terminal 1236 is, for example, DO. The first and fourth column driver chips 123 from left to right are the first column driver chip 123 and the second column driver chip 123 closest to the side edge of the first substrate. The second voltage signal terminal 1233, the second ground terminal 1234, and the second input terminal 1235 of the first column driver chip 123 are electrically connected to the external driver chip 121 via a second drive line, a second ground line, and a second input signal line, respectively. The second voltage signal terminal 1233, the second ground terminal 1234, and the second input terminal 1235 of the fourth column driver chip 123 are electrically connected to the external driver chip 121 via a third drive line, a third ground line, and a third input signal line, respectively. The first column driver chip 123 and the fourth column driver chip 123 respectively extend their wires to the edge of the light emitting element array through the fourth sub-portion, and then respectively pass through the third sub-portion and the second sub-portion along the edge of the light emitting element array, and finally are connected to the external driver chip 121 through the first sub-portion.

[0109] As shown in Figure 8D, the column driver chip 123 includes, for example, a register, a reference constant current source, a channel driver module, and a data processing module, all of which are communicatively connected in sequence. The register, for example, is connected to a second input terminal 1235 and a second output terminal 1236 to store channel instructions. The reference constant current source, for example, is connected to a second voltage signal terminal 1233 and a second ground terminal 1234 to control the on / off switching of the input circuit voltage and the ground voltage. The channel driver module is connected to each channel signal terminal, such as CH1...CHn, to control the on / off switching of each column channel signal. The data processing module processes data that controls the transmission of column channel signals.

[0110] As shown in FIG. 7 , the first substrate includes an intersection region, where a first straight line extending along the row direction and passing through each column driver chip 123 intersects with a second straight line extending along the column direction and passing through each row driver chip 122 .

[0111] For multiple column driver chips 123 located on the same side of the intersection area in the row direction, the second voltage signal terminal 1233, the second ground terminal 1234 and the second output terminal 1236 of one column driver chip 123 among the multiple column driver chips 123 are electrically connected to the second voltage signal terminal 1233, the second ground terminal 1234 and the second input terminal 1235 of another column driver chip 123 adjacent to the row direction through the second voltage signal lead, the second ground lead and the second signal lead respectively; and the second voltage signal lead, the second ground lead and the second signal lead respectively extend along the row direction.

[0112] In some exemplary embodiments of the present disclosure, the second voltage signal terminal 1233, second ground terminal 1234, and second output terminal 1236 of a first column driver chip 123 are electrically connected to the second voltage signal terminal 1233, second ground terminal 1234, and second input terminal 1235 of a second column driver chip 123 adjacent to the right via a second voltage signal lead, a second ground lead, and a second signal lead. In a similar manner, the second voltage signal lead, the second ground lead, and the second signal lead extend leftward along the row direction from the fourth column driver chip 123 to the third column driver chip 123, thereby achieving electrical signal connectivity for all columns of the light-emitting element array.

[0113] As shown in FIG7 , the plurality of row driver chips 122 include a second row driver chip 122 and a third row driver chip 122 that are closest to the intersection region. The second row driver chip 122 and the third row driver chip 122 are located on opposite sides of the intersection region in the column direction. A first voltage signal lead, a first ground lead, and a first signal lead for electrically connecting the second row driver chip 122 and the third row driver chip 122 extend through the intersection region.

[0114] In some exemplary embodiments of the present disclosure, the second row driver chip 122 and the third row driver chip 122 are, for example, the second row driver chip 122 and the third row driver chip 122 from the top, respectively. A first voltage signal lead, a first ground lead, and a first signal lead for electrically connecting the second row driver chip 122 and the third row driver chip 122 extend through the intersection region.

[0115] FIG. 9 is a schematic diagram of a driving architecture of a light emitting element array according to some other exemplary embodiments of the present disclosure.

[0116] As shown in FIG9 , the plurality of column driver chips 123 include, for example, a third column driver chip 123 and a fourth column driver chip 123 closest to the intersection region. The third column driver chip 123 and the fourth column driver chip 123 are located on opposite sides of the intersection region in the row direction.

[0117] Specifically, the second voltage signal terminal 1233, the second ground terminal 1234, and the second input terminal 1235 of the third column driver chip 123 are electrically connected to the external driver chip 121 via the fourth drive line, the fourth ground line, and the fourth input signal line, respectively. The second voltage signal terminal 1233, the second ground terminal 1234, and the second input terminal 1235 of the fourth column driver chip 123 are electrically connected to the external driver chip 121 via the fifth drive line, the fifth ground line, and the fifth input signal line, respectively. As shown in FIG9 , each of the fourth drive line, the fourth ground line, and the fourth input signal line extends through an intersection region; and each of the fifth drive line, the fifth ground line, and the fifth input signal line extends through an intersection region.

[0118] In other exemplary embodiments of the present disclosure, the light-emitting module includes, for example, two row driver chips 122 and four column driver chips 123. Each row driver chip 122 drives two rows of light-emitting elements, and each column driver chip 123 drives two columns of light-emitting elements. The light-emitting element array can be precisely controlled down to the four light-emitting elements intersecting two rows and two columns. The third column driver chip 123 is, for example, the second column driver chip 123 from the left, and the fourth column driver chip 123 is, for example, the third column driver chip 123. The second voltage signal terminal 1233, the second ground terminal 1234, and the second input terminal 1235 of the second column driver chip 123 are electrically connected to the external driver chip 121 via a fourth drive line, a fourth ground line, and a fourth input signal line, respectively. The second voltage signal terminal 1233, the second ground terminal 1234, and the second input terminal 1235 of the third column driver chip 123 are electrically connected to the external driver chip 121 via a fifth drive line, a fifth ground line, and a fifth input signal line, respectively. The solution of FIG9 provides another wiring layout of the column driver chip 123 , which avoids routing along the edge of the light-emitting element array and reduces the size of the black edge (non-luminous area) at the screen frame.

[0119] FIG. 10 is a schematic diagram of a driving architecture of a light emitting element array according to some further exemplary embodiments of the present disclosure.

[0120] As shown in FIG. 10 , at least one of the plurality of row driver chips 122 is used to drive at least four rows of light emitting elements.

[0121] In which, the row driver chip 122 includes at least two first scan signal terminals 1221 and at least two second scan signal terminals 1222; and one of the at least two first scan signal terminals 1221 is electrically connected to the first electrodes 124 of a part of the light-emitting elements in at least two adjacent rows of light-emitting elements, and the other of the at least two first scan signal terminals 1221 is electrically connected to the first electrodes 124 of another part of the light-emitting elements in at least two adjacent rows of light-emitting elements; and / or, one of the at least two second scan signal terminals 1222 is electrically connected to the first electrodes 124 of a part of the light-emitting elements in at least two adjacent rows of light-emitting elements, and the other of the at least two second scan signal terminals 1222 is electrically connected to the first electrodes 124 of another part of the light-emitting elements in at least two adjacent rows of light-emitting elements.

[0122] In some further exemplary embodiments of the present disclosure, the light-emitting module includes, for example, one row driver chip 122 and four column driver chips 123. The row driver chip 122 includes, for example, two first scanning signal terminals 1221 on the upper side, which drive the 16 light-emitting elements in the first and second rows respectively through two first leads 1061. The row driver chip 122 also includes, for example, two second scanning signal terminals 1222 on the lower side, which drive the 16 light-emitting elements in the third and fourth rows respectively through one first lead 1061. The row driver chip 122 drives four rows of light-emitting elements, and each column driver chip 123 drives two columns of light-emitting elements. The control of the light-emitting element array is, for example, eight light-emitting elements intersecting four rows and two columns. The solution of Figure 9 reduces the number of row driver chips 122 while relatively reducing a certain resolution. The structural design and preparation are also simpler, reducing costs, and is suitable for some screen usage scenarios that are not very sensitive to resolution requirements.

[0123] Alternatively, by increasing the size of row driver chip 122, adding more MUX channels, and strengthening the chip's driving capabilities, more rows of LEDs can share a single MUX, for example, three or four rows. Similarly, a single column driver chip 123 can drive multiple columns of LEDs. By customizing MUX driver chips with different channel counts and CH constant current driver chips, greater flexibility can be achieved in current backlight zoning applications, allowing for a variety of zoning products.

[0124] In the related art, due to the intersection of row and column wiring, the wiring is bound to be complicated, and at least a double-layer board design is required. The wiring is shown in Figure 6B. The horizontal thick solid line in the figure represents, for example, the row drive connection line, that is, the first lead 1061, and the vertical thin solid line represents, for example, the column drive connection line, that is, the second lead 1062. In this embodiment, the row drive connection line transmits, for example, a high multiplexing (MUX) signal, and the column drive connection line transmits, for example, a channel (CH) signal. In the figure on the left side of Figure 6B, each MUX signal drives a row of light-emitting elements, that is, MUX1 corresponds to the first row drive connection line, MUX2 corresponds to the second row drive connection line, and MUXn corresponds to the nth row drive connection line. Each CH signal drives a column of light-emitting elements, that is, CH1 corresponds to the first column of light-emitting elements, CH2 corresponds to the second column of light-emitting elements, and CHn corresponds to the nth column of light-emitting elements. Each light-emitting element can be controlled individually, which helps improve screen resolution. However, starting from the second row, each row drive line will cross, for example, the first n-1 column drive lines. To avoid short circuits and signal interference, the row drive lines and column drive lines need to be arranged on different layers of the circuit board, i.e., a double-layer board structure. In the diagram on the right side of Figure 6B, each MUX signal drives two rows of light-emitting elements, i.e., MUX1 corresponds to the first and second row drive lines, MUX2 corresponds to the third and fourth row drive lines, and MUXn corresponds to the n-1th and nth row drive lines. Each CH signal drives half of the light-emitting elements in a column, i.e., CH1-1 corresponds to the odd-numbered light-emitting elements in the first column, CH2-1 corresponds to the even-numbered light-emitting elements in the first column, CH1-2 corresponds to the odd-numbered light-emitting elements in the second column, CH2-2 corresponds to the even-numbered light-emitting elements in the second column, CH1-n corresponds to the odd-numbered light-emitting elements in the nth column, and CH2-n corresponds to the even-numbered light-emitting elements in the nth column. This reduces the number of traces, but also reduces resolution. Row driver lines also cross some column driver lines. To avoid short circuits and signal interference, the row driver lines and the column driver lines corresponding to odd and even rows need to be placed on separate layers of the circuit board, resulting in a three-layer board structure. As the number of rows of light-emitting elements driven by the same MUX signal increases, the number of layers of the circuit board containing the row and column driver lines also increases, further increasing the thickness of the product.

[0125] Furthermore, in related art, as shown in FIG6C , when routing wires at the edge of the backplane, the fan-out region 127 where the wires are routed takes up a larger area, widening the frame. Furthermore, all row and column signals are concentrated in fan-out region 127 and routed in parallel with close spacing, resulting in significant interference between the row and column signals.

[0126] FIG. 11 is a schematic diagram of a layout of output lines of a light emitting element array according to some exemplary embodiments of the present disclosure.

[0127] As shown in FIG11 , the light-emitting element includes, for example, two first electrodes 124 and one second electrode 125, the two first electrodes 124 being spaced apart in the row direction; and at least some of the plurality of second traces extending through the gap between the two first electrodes 124. The orthographic projections of the plurality of second traces on the substrate do not overlap with the orthographic projections of the first electrodes 124 on the substrate, and the orthographic projections of the plurality of second traces on the substrate do not overlap with the orthographic projections of the plurality of first traces on the substrate. The plurality of first traces and the plurality of second traces are located on the same conductive layer.

[0128] In some further exemplary embodiments of the present disclosure, the light-emitting element is changed from the conventional two electrodes, one positive and one negative, to three electrodes, for example, two positive and one negative. There is a gap between the two positive electrodes to allow the second lead 1062 to pass through, so when the first lead 1061 connects the light-emitting elements horizontally, it will not intersect with the second lead 1062 of the longitudinal wiring, and the second lead 1062 will not contact the two positive electrodes passed through, so that the first lead 1061 and the second lead 1062 can be set on the same layer of the circuit board. The thickness of the product is reduced. At the same time, a connector 126 can be set in the intersection area to lead out the relevant drive lines, ground lines and input signal lines connected to the row driver chip 122 and the column driver chip 123 respectively, and electrically connect them to the external driver chip 121. The introduction of the connector 126 greatly reduces the complexity of the output lines of the row driver chip 122 and the column driver chip 123, avoids the generation of the fan-out area 127 of the concentrated output lines, and further reduces the size of the black edge (non-luminous area) at the screen frame.

[0129] FIG. 12 is a schematic diagram of a layout of output lines of a light emitting element array according to some other exemplary embodiments of the present disclosure.

[0130] As shown in FIG12 , a conventional light-emitting element with one positive electrode and one negative electrode may also be used, that is, by providing a connector 126 in the intersection area, the relevant driving lines, grounding lines and input signal lines respectively connected to the row driver chip 122 and the column driver chip 123 are led out and electrically connected to the external driver chip 121. This can also avoid the generation of a fan-out area 127 where the output lines are concentrated, thereby reducing the size of the black edge (non-luminous area) at the screen frame.

[0131] Fig. 13A is a schematic diagram of the structure of a connector according to some exemplary embodiments of the present disclosure. Fig. 13B is a schematic diagram of the structure of a connector according to some other exemplary embodiments of the present disclosure.

[0132] As shown in FIG13A , the light-emitting module further includes a connector 126 disposed on the base substrate, the connector 126 being located in the intersection region, and the connector 126 and the light-emitting element array being located on the same side of the first substrate; the second-row driver chip 122 and the third-row driver chip 122 are respectively connected to the connector 126, and the third-column driver chip 123 and the fourth-column driver chip 123 are respectively connected to the connector 126. Alternatively, as shown in FIG13B , the light-emitting module further includes a connector 126 disposed on the base substrate, the orthographic projection of the connector 126 on the base substrate being located in the intersection region, and the connector 126 and the light-emitting element array being located on opposite sides of the first substrate; the second-row driver chip 122 and the third-row driver chip 122 are respectively connected to the connector 126, and the third-column driver chip 123 and the fourth-column driver chip 123 are respectively connected to the connector 126.

[0133] In some exemplary embodiments of the present disclosure, the connector 126 is, for example, a common connector, and the connector 126 pads are located on the same side of the backlight panel as the FFC (Flexible Flat Cable), and the substrate is, for example, a PCB (Printed Circuit Board). The common connector is located on the same side of the PCB as the row driver chip 122 and the column driver chip 123. The second row driver chip 122 and the third row driver chip 122 are respectively connected to the connector 126, and the second column driver chip 123 and the third column driver chip 123 are respectively connected to the connector 126. The connection method is, for example, soldering the relevant drive lines, ground lines, and input signal lines to the pads of the common connector, for example, by inserting an FPC (Flexible Printed Circuit) into the socket 1261 on the connector 126 to connect the external driver chip 121.

[0134] In other exemplary embodiments of the present disclosure, the connector 126 is, for example, a punch-hole connector, and the connector 126 pads are located on opposite sides of the backlight panel from the FFC, and the substrate is, for example, an aluminum substrate. The punch-hole connector is used to connect the wiring port 1261 of the external driver chip 121 to the row driver chip 122 and the column driver chip 123 on opposite sides of the aluminum substrate. The second row driver chip 122 and the third row driver chip 122 are respectively connected to the connector 126, and the second column driver chip 123 and the third column driver chip 123 are respectively connected to the connector 126. The connection method is, for example, to solder the relevant drive lines, ground lines, and input signal lines to the pads on the light-emitting element side of the punch-hole connector, and to connect the external driver chip 121 by, for example, inserting the FFC flexible flat cable through the guide edge into the wiring port 1261 on the opposite side of the aluminum substrate.

[0135] Preferably, by combining the above-mentioned 3-pin LED and perforated connector, a single-layer aluminum substrate can be used to design a backlight backplane, resulting in better heat dissipation and lower costs, further improving the performance of the entire display product and having an unparalleled competitive advantage.

[0136] It is understandable that the material of the substrate can be other materials besides PCB and aluminum substrate, such as glass. When it is a non-metallic backlight product such as glass-based, side technology (row driver chip 122 and column driver chip 123 are on the side) can be used to implement the technical solution of the present disclosure.

[0137] In summary, this PM Mini LED backlight driver solution places the MUX driver IC and CH constant current driver IC separately on the LED side of the backplane, evenly distributing power consumption to the row and column driver ICs. This facilitates overall heat dissipation and reduces backplane temperature. Furthermore, routing complexity is significantly reduced, with fewer outgoing wires in the fan-out area, resulting in minimal interference and significantly improved performance. Combined with standard connectors, this solution enables an ultra-narrow bezel design for the entire product, significantly reducing costs.

[0138] Some exemplary embodiments of the present disclosure further provide a display device. Figure 14 is a schematic diagram of a display device according to some exemplary embodiments of the present disclosure. Referring to Figure 14 , the display device includes the above-mentioned light-emitting module.

[0139] The display device may be any product or component having a display function. For example, the display device may be a smart phone, a mobile phone, a navigation device, a television (TV), a car stereo, a laptop computer, a tablet computer, a portable multimedia player (PMP), a personal digital assistant (PDA), etc.

[0140] It should be understood that the display device according to some exemplary embodiments of the present disclosure has all the features and advantages of the above-mentioned light-emitting module. These features and advantages can be referred to the above description of the light-emitting substrate and will not be repeated here.

[0141] As used herein, the terms "substantially," "about," "approximately," and other similar terms are used as terms of approximation rather than as terms of degree, and are intended to account for the inherent deviations in measured or calculated values ​​that would be recognized by one of ordinary skill in the art. To account for factors such as process fluctuations, measurement problems, and errors associated with the measurement of a particular quantity (i.e., limitations of the measurement system), "about" or "approximately," as used herein, are inclusive of the stated value and mean within an acceptable range of deviation for the particular value as determined by one of ordinary skill in the art. For example, "approximately" can mean within one or more standard deviations, or within ±10% or ±5% of the stated value.

[0142] Although some embodiments according to the general inventive concept of the present disclosure have been illustrated and described, it will be appreciated by those skilled in the art that changes may be made to these embodiments without departing from the principles and spirit of the general inventive concept of the present disclosure, the scope of which is defined by the claims and their equivalents.

Claims

1. A light-emitting module, comprising: a first substrate; a light-emitting element array provided on the first substrate, the light-emitting element array comprising a plurality of light-emitting elements arranged in an array along row and column directions, each of the plurality of light-emitting elements comprising a first electrode and a second electrode, wherein a driving current of the light-emitting element is greater than 1 mA; a plurality of row driver chips disposed on the first substrate, at least one of the plurality of row driver chips being configured to drive at least one row of light emitting elements; and A plurality of column driver chips are provided on the first substrate, at least one of the plurality of column driver chips is used to drive at least one column of light emitting elements, Wherein, at least one of the plurality of row driver chips and at least one of the plurality of column driver chips are spaced apart in both the row direction and the column direction; and At least one of the plurality of row driver chips is electrically connected to the first electrode of at least one row of light emitting elements, and at least one of the plurality of column driver chips is electrically connected to the second electrode of at least one column of light emitting elements.

2. The light emitting module according to claim 1, wherein: The plurality of row driver chips are arranged in a column and spaced apart along the column direction; and / or, The plurality of column driver chips are arranged in a row and spaced apart along the row direction.

3. The light emitting module according to claim 1 or 2, wherein: The light-emitting module further includes a plurality of first wirings provided on the first substrate, at least one of the plurality of first wirings extending along a row direction; as well as At least one of the row driver chips includes a first scan signal terminal, and the first scan signal terminal is electrically connected to the first electrodes of at least a portion of the light emitting elements in at least one row of light emitting elements through a plurality of the first wirings.

4. The light emitting module according to claim 3, wherein: The light-emitting module further includes a plurality of second wirings provided on the first substrate, at least one of the plurality of second wirings extending along a column direction; as well as At least one of the column driver chips includes a first channel signal terminal, and the first channel signal terminal is electrically connected to the second electrodes of at least a part of the light emitting elements in at least one column of light emitting elements through a plurality of the second wirings.

5. The light emitting module according to claim 4, wherein: At least one of the row driver chips further includes a second scan signal terminal, and the second scan signal terminal is electrically connected to the first electrodes of at least a portion of the light emitting elements in at least one row of light emitting elements through a plurality of the first wirings.

6. The light emitting module according to claim 5, wherein: For the same row driver chip, the first scanning signal terminal is electrically connected to the first electrodes of at least a portion of the light-emitting elements in the i-th row, and the second scanning signal terminal is electrically connected to the first electrodes of at least a portion of the light-emitting elements in the i+1-th row, where i is a positive integer greater than or equal to 1.

7. The light emitting module according to claim 6, wherein: At least one of the column driver chips further includes a second channel signal terminal, and the second channel signal terminal is electrically connected to the second electrodes of at least a part of the light emitting elements in at least one column of light emitting elements through a plurality of the second wirings.

8. The light emitting module according to claim 7, wherein: For the same column driver chip, the first channel signal terminal is electrically connected to the second electrodes of at least a portion of the light-emitting elements in the j-th column, and the second channel signal terminal is electrically connected to the second electrodes of at least a portion of the light-emitting elements in the j+1-th column, where j is a positive integer greater than or equal to 1.

9. The light emitting module according to claim 8, wherein: The row driver chip includes at least two first scan signal terminals and at least two second scan signal terminals; as well as One of the at least two first scan signal terminals is electrically connected to the first electrodes of a portion of the light-emitting elements in the i-th row, and the other of the at least two first scan signal terminals is electrically connected to the first electrodes of another portion of the light-emitting elements in the i-th row; and / or, one of the at least two second scan signal terminals is electrically connected to the first electrodes of a portion of the light-emitting elements in the i+1-th row, and the other of the at least two second scan signal terminals is electrically connected to the first electrodes of another portion of the light-emitting elements in the i+1-th row.

10. The light emitting module according to claim 9, wherein: The column driver chip includes at least two first channel signal terminals and at least two second channel signal terminals; as well as One of the at least two first channel signal terminals is electrically connected to the second electrodes of a portion of the light-emitting elements in the j-th column, and the other of the at least two first channel signal terminals is electrically connected to the second electrodes of another portion of the light-emitting elements in the j-th column; and / or one of the at least two second channel signal terminals is electrically connected to the second electrodes of a portion of the light-emitting elements in the j+1-th column, and the other of the at least two second channel signal terminals is electrically connected to the second electrodes of another portion of the light-emitting elements in the j+1-th column.

11. The light emitting module according to claim 10, wherein: The row driver chip further includes a first voltage signal terminal, a first ground terminal, a first input terminal and a first output terminal; and The light-emitting module also includes an external driving chip arranged on the first substrate, and the multiple row driving chips include a first row driving chip closest to the external driving chip, and the first voltage signal terminal, the first ground terminal and the first input terminal of the first row driving chip are electrically connected to the external driving chip through the first driving line, the first ground line and the first input signal line respectively.

12. The light emitting module according to claim 11, wherein: The first voltage signal terminal, the first ground terminal and the first output terminal of one of the plurality of row driver chips are electrically connected to the first voltage signal terminal, the ground terminal and the first input terminal of another row driver chip adjacent in the column direction through the first voltage signal lead, the first ground lead and the first signal lead respectively; and The first voltage signal lead, the first ground lead and the first signal lead extend along a column direction respectively.

13. The light emitting module according to claim 5, wherein: The first substrate includes an intersection area, where a first straight line extending in a row direction and passing through each column driver chip intersects with a second straight line extending in a column direction and passing through each row driver chip; as well as The plurality of row driver chips include a second row driver chip and a third row driver chip that are closest to the intersection area, and the plurality of column driver chips include a third column driver chip and a fourth column driver chip that are closest to the intersection area, the second row driver chip and the third row driver chip are located on opposite sides of the intersection area in the column direction, and the third column driver chip and the fourth column driver chip are located on opposite sides of the intersection area in the row direction.

14. The light emitting module according to any one of claims 6 to 13, wherein: The column driver chip further includes a second voltage signal terminal, a second ground terminal, a second input terminal, and a second output terminal; and The multiple column driver chips include a first column driver chip and a second column driver chip closest to the side edge of the first substrate in the column direction, the second voltage signal terminal, the second ground terminal and the second input terminal of the first column driver chip are electrically connected to the external driver chip through the second drive line, the second ground line and the second input signal line, respectively, and the second voltage signal terminal, the second ground terminal and the second input terminal of the second column driver chip are electrically connected to the external driver chip through the third drive line, the third ground line and the third input signal line, respectively.

15. The light emitting module according to claim 14, wherein: For a plurality of column driver chips located on the same side of the intersection area in the row direction, a second voltage signal terminal, a second ground terminal, and a second output terminal of one of the plurality of column driver chips are electrically connected to a second voltage signal terminal, a second ground terminal, and a second input terminal of another column driver chip adjacent to the row direction through a second voltage signal lead, a second ground lead, and a second signal lead, respectively; and The second voltage signal lead, the second ground lead and the second signal lead extend along the row direction respectively.

16. The light emitting module according to claim 15, wherein: Each of the second driving line, the second ground line and the second input signal line includes a first sub-portion, a second sub-portion, a third sub-portion and a fourth sub-portion connected in sequence, the first sub-portion is connected to the external driving chip, the fourth sub-portion is connected to the column driving chip, the second sub-portion extends along the row direction, and the third sub-portion extends along the column direction, and the second sub-portion and the third sub-portion of each of the second driving line, the second ground line and the second input signal line are located in the peripheral area of ​​the first substrate.

17. The light emitting module according to claim 16, wherein: A first voltage signal lead, a first ground lead, and a first signal lead for electrically connecting the second row driver chip and the third row driver chip extend through the intersection area.

18. The light emitting module according to any one of claims 6 to 13, wherein: The second voltage signal terminal, the second ground terminal and the second input terminal of the third column driver chip are electrically connected to the external driver chip through the fourth driving line, the fourth ground line and the fourth input signal line respectively, and the second voltage signal terminal, the second ground terminal and the second input terminal of the fourth column driver chip are electrically connected to the external driver chip through the fifth driving line, the fifth ground line and the fifth input signal line respectively.

19. The light emitting module according to claim 18, wherein: Each of the fourth driving line, the fourth ground line, and the fourth input signal line extends through the intersection region; as well as Each of the fifth driving line, the fifth ground line, and the fifth input signal line extends through the intersection region.

20. The light emitting module according to claim 5, wherein: At least one of the plurality of row driver chips is used to drive at least four rows of light emitting elements.

21. The light emitting module according to claim 20, wherein: The row driver chip includes at least two first scan signal terminals and at least two second scan signal terminals; and One of the at least two first scan signal terminals is electrically connected to the first electrodes of a portion of the light-emitting elements in at least two adjacent rows of light-emitting elements, and the other of the at least two first scan signal terminals is electrically connected to the first electrodes of another portion of the light-emitting elements in at least two adjacent rows of light-emitting elements; and / or one of the at least two second scan signal terminals is electrically connected to the first electrodes of a portion of the light-emitting elements in at least two adjacent rows of light-emitting elements, and the other of the at least two second scan signal terminals is electrically connected to the first electrodes of another portion of the light-emitting elements in at least two adjacent rows of light-emitting elements.

22. The light emitting module according to claim 5, wherein: The light emitting element includes two first electrodes and one second electrode, and the two first electrodes are arranged at intervals in a row direction; as well as At least some of the plurality of second traces extend through the gap between the two first electrodes, the orthographic projections of the plurality of second traces on the substrate do not overlap with the orthographic projections of the first electrode on the substrate, and the orthographic projections of the plurality of second traces on the substrate do not overlap with the orthographic projections of the plurality of first traces on the substrate.

23. The light emitting module according to claim 22, wherein: The plurality of first routing lines and the plurality of second routing lines are located in the same conductive layer.

24. The light emitting module according to claim 23, wherein: The light emitting module further comprises a connector provided on the substrate, the connector being located in the intersection region, and the connector and the light emitting element array being located on the same side of the first substrate; and The second row driver chip and the third row driver chip are respectively connected to the connector, and the third column driver chip and the fourth column driver chip are respectively connected to the connector.

25. The light emitting module according to claim 23, wherein: The light emitting module further comprises a connector provided on the base substrate, wherein an orthographic projection of the connector on the base substrate is located in the intersection region, and the connector and the light emitting element array are located on opposite sides of the first substrate; as well as The second row driver chip and the third row driver chip are respectively connected to the connector, and the third column driver chip and the fourth column driver chip are respectively connected to the connector.

26. A display device, wherein: The display device includes the light emitting module according to any one of claims 1 to 25.

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