Environmental simulation device and control method thereof

Abstract

The present invention provides an environmental simulation device and a control method thereof, wherein the environmental simulation device is used to test semiconductor power devices, and the environmental simulation device includes: a sample box having a sealed cavity; a Peltier temperature controller, which is arranged in the sample box and has a bearing surface for bearing the semiconductor power device to be tested; a humidifier, which is arranged outside the sample box and is connected to the sealed cavity; a dryer, which is arranged outside the sample box and is connected to the sealed cavity; a voltage controller, which is arranged outside the sample box and is connected to the sealed cavity; a spray assembly, which includes a spray part arranged in the sealed cavity and located above the Peltier temperature controller; a detection assembly, which is arranged in the sample box; a power supply module, which is arranged outside the sample box and has a power supply terminal extending into the sealed cavity; and a controller, which is arranged outside the sample box. The technical solution of the present application can effectively solve the problem in the related art that it is difficult to perform performance testing on semiconductor power devices in various complex and harsh working environments.

Description

Technical Field

[0001] The present invention relates to the field of testing, and in particular to an environment simulation device and a control method thereof. Background Art

[0002] At present, the application scope of semiconductor power devices is gradually expanding, and my country's topographical environment is diverse and complex, resulting in many complex or harsh working environments. Semiconductor power devices have been widely used in scenarios such as commutation devices, electric vehicles, charging piles, energy storage, etc., and will be used in scenarios such as ships, aircraft, and aerospace in the future. In these application scenarios, devices face harsh environmental conditions such as wide temperature range (electric vehicles in summer and winter, plateaus and mountains, etc.), wide humidity range (coastal and desert), rapid temperature changes (such as aircraft takeoff and landing), high salinity (coastal), and low pressure (plateau). Sometimes, they will encounter more severe conditions caused by the coupling of one or more of the above harsh conditions.

[0003] As the voltage level of semiconductor power devices increases, it is necessary to conduct insulation performance tests in various complex and harsh working environments during the product development stage. However, current insulation evaluation equipment makes it difficult to conduct insulation performance tests on semiconductor power devices in various complex and harsh working environments. Summary of the invention

[0004] The main purpose of the present invention is to provide an environmental simulation device and a control method thereof to solve the problem in the related art that it is difficult to evaluate the insulation performance of semiconductor power devices in various complex and harsh working environments.

[0005] In order to achieve the above-mentioned purpose, according to one aspect of the present invention, there is provided an environmental simulation device for testing a semiconductor power device, the environmental simulation device comprising: a sample box having a sealed cavity; a Peltier temperature controller, arranged in the sample box and having a bearing surface for bearing a semiconductor power device to be tested; a humidifier, arranged outside the sample box and connected to the sealed cavity; a dryer, arranged outside the sample box and connected to the sealed cavity; a voltage controller, arranged outside the sample box and connected to the sealed cavity; a spray assembly, comprising a spray portion arranged in the sealed cavity and located above the Peltier temperature controller; a detection assembly, arranged in the sample box; a power supply module, arranged outside the sample box and having a power supply end extending into the sealed cavity, the power supply end being able to be conductively connected to the semiconductor power device for supplying power to the semiconductor power device; a controller, arranged outside the sample box and signal-connected to the Peltier temperature controller, the humidifier, the dryer, the voltage controller, the spray assembly and the detection assembly.

[0006] Furthermore, the environmental simulation device also includes a sample cover arranged above the Peltier temperature controller and at least partially connected to the closed cavity, and the semiconductor power device is arranged in the sample cover.

[0007] Furthermore, the humidifier includes a water tank, an atomizer arranged in the water tank, a first air inlet pipe connected between the sample box and the water tank, and a first control valve arranged on the first air inlet pipe, and the outlet end of the first air inlet pipe extends into the sample cover.

[0008] Furthermore, the dryer includes a drying box, a desiccant arranged in the drying box, a second air inlet pipe arranged between the drying box and the sample box, and a second control valve arranged on the second air inlet pipe, and the outlet end of the second air inlet pipe extends into the sample cover.

[0009] Furthermore, the pressure controller includes a vacuum pump, an exhaust pipe connected between the vacuum pump and the closed chamber, and a third control valve arranged on the exhaust pipe, and the inlet end of the exhaust pipe extends into the closed chamber.

[0010] Furthermore, the spray assembly also includes a liquid storage tank and a liquid infusion tube connected between the liquid storage tank and the spray part. The spray part includes a spray pipe located in the sample cover, and the spray pipe is provided with spray holes.

[0011] Furthermore, the detection component includes a temperature sensor, a humidity sensor, an air pressure sensor and a flow meter.

[0012] Furthermore, the environmental simulation device further includes a grounding plate arranged on the bearing surface, and the semiconductor power device is arranged on the grounding plate; and / or, the environmental simulation device further includes a heat sink arranged below the Peltier temperature controller.

[0013] According to another aspect of the present invention, a control method for an environmental simulation device is provided, which is used to control the above-mentioned environmental simulation device so that a closed chamber can simulate different preset environments, including aircraft take-off and landing environments, coastal environments, and polluted environments. The control method comprises: step S1: selecting a preset environment; step S2: controlling the environmental simulation device to simulate the preset environment according to the preset environment.

[0014] Further, when the preset environment is an aircraft take-off and landing environment, step S2 includes: step S211: starting the humidifier, Peltier temperature controller and pressure controller to increase the humidity and air pressure in the closed chamber and cool the semiconductor power device; step S212: starting the dryer, Peltier temperature controller and pressure controller to reduce the humidity and air pressure in the closed chamber and heat the semiconductor power device; step S213: looping step S211 and step S212, and counting the number of executions after each execution of step S211 or step S212, and when the number of executions of step S211 or step S212 reaches a first preset number of times, exiting the loop.

[0015] Further, when the preset environment is a coastal environment, step S2 includes: step S221: adding salt solution into the humidifier; step S222: starting the humidifier, the dryer and the pressure controller to make the humidity in the closed chamber reach the preset humidity.

[0016] Further, when the preset environment is a polluted environment, step S2 includes: step S231: adding polluted liquid to the spray assembly; step S232: starting the spray assembly to spray the polluted liquid onto the semiconductor power device; step S233: starting the dryer, the Peltier temperature controller and the voltage controller to dry the semiconductor power device; step S234: looping step S232 and step S233, and counting the number of executions after each execution of step S232 or step S233, and when the number of executions of step S232 or step S233 reaches a second preset number of times, exiting the loop.

[0017] The technical solution of the present invention is applied, and the environmental simulation device includes a sample box, which has a closed cavity, which is isolated from the external environment but connected to a regulator such as a humidifier and a dryer to form a simulated various environmental spaces, and the semiconductor power device to be tested is placed in the closed cavity. The Peltier temperature controller is arranged in the closed cavity, which has heating and cooling functions, and forms a bearing surface for carrying the semiconductor power device to be tested, and can provide a suitable test temperature for the semiconductor power device. The humidifier, the dryer and the voltage controller are all connected to the closed cavity, and can be used to adjust the humidity and air pressure in the closed cavity. The spray assembly has a spray part located above the Peltier temperature controller, that is, the spray part is located above the semiconductor power device to be tested, and various preset liquids can be sprayed to the semiconductor power device during the test process through the spray part. The detection component is arranged in the sample box, and the detection component can measure environmental parameters such as temperature, humidity, and air pressure in the closed cavity, thereby facilitating the understanding of the situation in the closed cavity. The power supply module has a power supply end, which can be connected to the semiconductor power device, thereby providing power to the semiconductor power device, so that the semiconductor power device is in working state. The controller is signal-connected to the Peltier thermostat, humidifier, dryer, voltage controller, spray assembly and detection assembly. The controller receives the environmental parameters measured by the detection assembly and controls the Peltier thermostat, humidifier, dryer, voltage controller, and spray assembly to work alone or in coordination according to the environmental parameters to be simulated and the measurement parameters of the detection assembly, thereby simulating various complex and harsh working environments. Therefore, the technical solution of the present application can effectively solve the problem in the related art that it is difficult to perform performance testing on semiconductor power devices in various complex and harsh working environments. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings constituting a part of the present application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0019] Figure 1 A simplified structural diagram of an embodiment of an environment simulation device according to the present invention is shown;

[0020] Figure 2 Shows Figure 1 A simplified structural diagram of the sample cover of the environmental simulation device;

[0021] Figure 3 A flow chart showing an embodiment of a method for controlling an environment simulation device according to the present invention;

[0022] Figure 4 Shows Figure 3 An optional flow chart of a control method.

[0023] The above drawings include the following reference numerals:

[0024] 1. Semiconductor power devices;

[0025] 10. Sample box; 11. Sealed chamber;

[0026] 20. Peltier thermostat;

[0027] 30. Humidifier; 31. Water tank; 32. Atomizer; 33. First air inlet pipe; 34. First control valve;

[0028] 40. dryer; 41. drying box; 42. desiccant; 43. second air inlet pipe; 44. second control valve;

[0029] 50. pressure controller; 51. vacuum pump; 52. air extraction pipe; 53. third control valve;

[0030] 60. Spray assembly; 61. Spray unit; 62. Liquid storage tank; 63. Liquid infusion tube;

[0031] 70. Detection component; 71. Temperature sensor; 72. Humidity sensor; 73. Air pressure sensor; 74. Flow meter;

[0032] 80. Power supply module; 81. Power supply end; 82. First power supply;

[0033] 90. Controller;

[0034] 100. Sample cover;

[0035] 110. Grounding plate;

[0036] 120, radiator; 121, water cooling pump; 122, water cooling pipe; 123, water cooling plate;

[0037] 131. A second power source; 132. A relay. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means intended to limit the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0039] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0040] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps set forth in these embodiments do not limit the scope of the present invention. Meanwhile, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, method and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but in appropriate cases, the technology, method and equipment should be considered as a part of the specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, and therefore, once a certain item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.

[0041] like Figure 1 and Figure 2As shown, the present application provides an environmental simulation device for testing a semiconductor power device 1. An embodiment of the environmental simulation device of the present application includes a sample box 10, a Peltier temperature controller 20, a humidifier 30, a dryer 40, a voltage controller 50, a spray assembly 60, a detection assembly 70, a power supply module 80 and a controller 90. Among them, the sample box 10 has a closed chamber 11; the Peltier temperature controller 20 is arranged in the sample box 10 and has a bearing surface for bearing the semiconductor power device 1 to be tested; the humidifier 30 is arranged outside the sample box 10 and is connected to the closed chamber 11; the dryer 40 is arranged outside the sample box 10 and is connected to the closed chamber 11; the voltage controller 50 is arranged outside the sample box 10 and is connected to the closed chamber 11; the spray assembly 60 includes a spray part 61 arranged in the closed chamber 11 and located above the Peltier temperature controller 20; the detection assembly 70 is arranged in the sample box 10; the power supply module 80 is arranged outside the sample box 10 and has a power supply end 81 extending into the closed chamber 11, and the power supply end 81 can be conductively connected with the semiconductor power device 1 for supplying power to the semiconductor power device 1; the controller 90 is arranged outside the sample box 10 and is signal-connected to the Peltier temperature controller 20, the humidifier 30, the dryer 40, the voltage controller 50, the spray assembly 60 and the detection assembly 70.

[0042] The technical solution of this embodiment is applied, and the environmental simulation device includes a sample box 10, which has a closed chamber 11. The closed chamber 11 is isolated from the external environment but is connected to regulators such as a humidifier 30 and a dryer 40 to form a simulated various environmental spaces. The semiconductor power device 1 to be tested is placed in the closed chamber 11. The Peltier temperature controller 20 is arranged in the closed chamber 11, which has heating and cooling functions, and forms a bearing surface for carrying the semiconductor power device 1 to be tested, and can provide a suitable test temperature for the semiconductor power device 1. The humidifier 30, the dryer 40 and the voltage controller 50 are all connected to the closed chamber 11, and can be used to adjust the humidity and air pressure in the closed chamber. The spray assembly 60 has a spray part 61 located above the Peltier temperature controller 20, that is, the spray part 61 is located above the semiconductor power device 1 to be tested, and various preset liquids can be sprayed to the semiconductor power device 1 during the test process through the spray part 61. The detection component 70 is arranged in the sample box 10, and the detection component 70 can measure environmental parameters such as temperature, humidity, air pressure, etc. in the closed cavity 11, so as to facilitate understanding of the situation in the closed cavity 11. The power supply module 80 has a power supply terminal 81, and the power supply terminal 81 can be connected to the semiconductor power device 1, so as to realize power supply to the semiconductor power device 1, so that the semiconductor power device 1 is in a working state. The controller 90 is signal-connected with the Peltier temperature controller 20, the humidifier 30, the dryer 40, the voltage controller 50, the spray component 60 and the detection component 70. The controller 90 receives the environmental parameters measured by the detection component 70 and controls the Peltier temperature controller 20, the humidifier 30, the dryer 40, the voltage controller 50, and the spray component 60 to work alone or in cooperation according to the environmental parameters to be simulated and the measurement parameters of the detection component 70, so as to realize the simulation of various complex and harsh working environments. Therefore, the technical solution of this embodiment can effectively solve the problem in the related art that it is difficult to perform performance testing on semiconductor power devices in various complex and harsh working environments.

[0043] like Figure 1 and Figure 2As shown, the environmental simulation device also includes a second power supply 131 and a relay 132 arranged outside the sample box 10, and the relay 132 is connected between the Peltier thermostat 20 and the second power supply 131. In this embodiment, the semiconductor power device 1 is heated or cooled by the Peltier thermostat 20 to adjust the operating temperature of the semiconductor power device 1, so that the set temperature can be reached quickly and accurately. In addition, the semiconductor power device 1 is directly carried by the Peltier thermostat 20 to achieve contact heat transfer to heat up or cool down the semiconductor power device 1. Compared with the method of controlling the temperature using a high-temperature gas source or a low-temperature gas source in the related art, the temperature conduction speed is faster, and the temperature rise or drop of the semiconductor power device 1 can be uniformly controlled. In addition, by directly supporting the semiconductor power device 1 with the Peltier temperature controller 20 to control the temperature of the semiconductor power device 1, it is possible to adjust only the temperature of the semiconductor power device 1 without affecting other environmental parameters (such as air pressure and humidity) in the closed cavity 11, thereby achieving independent and accurate adjustment of each environmental parameter, achieving good coupling between temperature and other environmental parameters (such as humidity, air pressure, wind speed, etc.), and thus achieving simulation of a complex environment.

[0044] In this embodiment, by using the Peltier temperature controller 20, utilizing the Seebeck effect and the Peltier effect and cooperating with an external circuit, the heating, cooling and temperature control functions of the semiconductor power device 1 can be realized, and various temperature environments, cold start of the semiconductor power device 1 and other conditions can be created.

[0045] like Figure 1 and Figure 2As shown, in this embodiment, the environmental simulation device also includes a sample cover 100 arranged above the Peltier temperature controller 20 and at least partially connected to the closed chamber 11, and the semiconductor power device 1 is arranged in the sample cover 100. Among them, the sample cover 100 is a square cover body with one side and a bottom surface open, the bottom surface of the sample cover 100 is fixed and tightly connected to the bearing surface, and a plurality of mounting holes are arranged on the sample cover 100. The first air inlet pipe 33, the second air inlet pipe 43, the temperature sensor 71 and the humidity sensor 72 mentioned later are all arranged in the mounting holes and connected to the inside of the sample cover 100. In this way, in the process of complex environment simulation, dry and wet air can be directly blown to the top of the semiconductor power device 1, which improves the test efficiency. The temperature sensor 71 and the humidity sensor 72 are arranged close to the semiconductor power device 1 and directly test the temperature and humidity of the small environment inside the sample cover 100, which can avoid the situation where the temperature and humidity inside the large environment in the closed chamber 11 are unevenly distributed and affect the measurement results. In addition, a plurality of movable guide plates are provided on the top surface of the sample cover 100, which are rotatably connected to the top surface of the sample cover 100 and can change their posture according to the test requirements to change the flow rate of the air on the surface of the semiconductor power device 1 (which is also one of the parameters that need to be controlled for complex environment simulation). In addition, since the sample cover 100 is provided, during the test, it is sufficient to ensure that the microenvironment inside the sample cover 100 meets the set environmental parameter requirements, without the need to ensure that the entire closed cavity 11 meets the set environmental parameters, which can achieve more precise control.

[0046] like Figure 1 and Figure 2 As shown, the humidifier 30 includes a water tank 31, an atomizer 32 arranged in the water tank 31, a first air inlet pipe 33 connected between the sample box 10 and the water tank 31, and a first control valve 34 arranged on the first air inlet pipe 33, and the outlet end of the first air inlet pipe 33 extends into the sample cover 100. The water tank 31 is provided with a first air inlet. When the humidifier 30 is working, the atomizer 32 can atomize the water in the water tank 31, so that the atomized water follows the gas flowing into the first air inlet through the first air inlet pipe 33 and enters the closed chamber 11, so as to achieve the effect of increasing the humidity in the closed chamber 11. When used specifically, various salt solutions can also be added to the water tank, so that the first air inlet pipe 33 transports salt mist into the closed chamber 11, thereby simulating a coastal environment with high salinity, for example. The first control valve 34 can adjust the on-off and opening of the first air inlet pipe 33, so as to accurately control the air flow rate transported by the first air inlet pipe 33 to the closed chamber 11.

[0047] like Figure 1As shown, the dryer 40 includes a drying box 41, a desiccant 42 disposed in the drying box 41, a second air inlet pipe 43 disposed between the drying box 41 and the sample box 10, and a second control valve 44 disposed on the second air inlet pipe 43, and the outlet end of the second air inlet pipe 43 extends into the sample cover 100. The drying box 41 is provided with a second air inlet. When the dryer 40 is working, the desiccant 42 can absorb water vapor in the gas entering through the second air inlet, so that the airflow entering the closed chamber 11 through the second air inlet pipe 43 is a dry airflow, so as to reduce the humidity in the closed chamber 11. The second control valve 44 can adjust the on-off and opening of the second air inlet pipe 43, so as to accurately control the airflow rate delivered to the closed chamber 11 by the second air inlet pipe 43.

[0048] like Figure 1 As shown, the pressure controller 50 includes a vacuum pump 51, an exhaust pipe 52 connected between the vacuum pump 51 and the closed chamber 11, and a third control valve 53 arranged on the exhaust pipe 52, and the inlet end of the exhaust pipe 52 extends into the closed chamber 11. The exhaust pipe 52 connects the closed chamber 11 and the vacuum pump 51, and the vacuum pump 51 can extract the gas in the closed chamber 11 through the exhaust pipe 52 to reduce the air pressure in the closed chamber 11. The third control valve 53 can adjust the on-off and opening of the exhaust pipe 52 to accurately control the air flow rate extracted by the exhaust pipe 52.

[0049] Through the linkage between the humidifier 30 , the dryer 40 and the pressure controller 50 , the air pressure and humidity inside the closed chamber 11 (specifically, the air pressure and humidity of the microenvironment inside the sample cover 100 ) can be adjusted.

[0050] Specifically, in this embodiment, the first control valve 34 , the second control valve 44 and the third control valve 53 are controllable electric ball valves.

[0051] like Figure 1 and Figure 2 As shown, the spray assembly 60 also includes a liquid storage tank 62 and a liquid infusion tube 63 connected between the liquid storage tank 62 and the spray part 61, and the spray part 61 includes a spray pipe located in the sample cover 100, and a spray hole is provided on the spray pipe. Liquids such as saline and contaminated liquid can be stored inside the liquid storage tank 62. When the spray assembly 60 is working, the saline or contaminated liquid stored inside the liquid storage tank 62 can flow to the spray part 61 via the liquid infusion tube 63. The spray part 61 is provided with a spray hole, and the saline or contaminated liquid is sprayed to the surface of the semiconductor power device 1 through the spray hole to simulate rainfall or a polluted environment. Among them, the aperture of the spray hole is between 0.2mm and 1mm.

[0052] like Figure 1As shown, the detection component 70 includes a temperature sensor 71, a humidity sensor 72, an air pressure sensor 73 and a flow meter 74. Among them, temperature, humidity and air pressure are the main control parameters of the environmental simulator. These parameters in the closed chamber 11 are measured by the temperature sensor 71, the humidity sensor 72 and the air pressure sensor 73 and fed back to the controller 90, which can realize closed-loop control, thereby more accurately realizing the regulation and control of these parameters in the closed chamber 11. The flow meter 74 is arranged at the outlet end of the first air inlet pipe 33 and the second air inlet pipe 43, and can measure the gas flow rate in the first air inlet pipe 33 and the second air inlet pipe 43, thereby realizing accurate control of the humidifier 30 and the dryer 40. Among them, the temperature sensor 71 can be a thermocouple structure. The temperature sensor 71, the humidity sensor 72, the air pressure sensor 73 and the flow meter 74 are connected to the controller 90 through a sleeve.

[0053] The environment simulation device may also include a display. The controller 90 collects detection signals of the temperature sensor 71, the humidity sensor 72, the air pressure sensor 73, the flow meter 74, and the current and voltage signals of the semiconductor power device 1. These signals are processed by software and displayed in real time on the display. The controller 90 is a PID controller. The controller 90 realizes synchronous control of the air pressure, humidity and temperature of the semiconductor power device 1 in the closed chamber 11 through the relay 132, the first control valve 34, the second control valve 44 and the third control valve 53 connected between the second power supply 131 and the Peltier temperature controller 20.

[0054] like Figure 2 As shown, the environment simulation device further includes a grounding plate 110 disposed on the bearing surface, and the semiconductor power device 1 is disposed on the grounding plate 110 .

[0055] like Figure 1 and Figure 2 As shown, in this embodiment, the power supply module 80 includes a first power supply 82, and the first power supply 82 can apply an adjustable high voltage to the semiconductor power device 1 through the power supply terminal 81. The power supply module has overcurrent protection and automatic failure judgment functions of the semiconductor power device 1. A sleeve structure is provided on the periphery of the power supply terminal 81, and the sleeve structure is penetrated through the side wall of the sample box 10 so that the power supply terminal 81 can extend into the closed cavity 11. The power supply terminal 81 includes a high-voltage terminal and a grounding terminal, the high-voltage terminal is connected to the surface of the semiconductor power device 1, and the grounding terminal is connected to the grounding plate 110.

[0056] Among them, the power supply module 80 can provide 0-15kV industrial frequency AC, positive polarity DC and industrial frequency positive polarity square wave voltage, which can simulate the test conditions of the insulation standard, the working conditions of the semiconductor power device 1 in the cut-off state and the voltage conditions under the working conditions of the semiconductor power device 1 repeatedly opened and closed, and has a delayed relay protection device as a judgment condition for whether the semiconductor power device 1 passes the test. The power supply module 80 extends into the interior of the sample box 10 through a voltage-resistant cable and a pollution-resistant wall bushing.

[0057] like Figure 1 and Figure 2 As shown, the environmental simulation device also includes a radiator 120 disposed below the Peltier thermostat 20. Specifically, in this embodiment, the radiator 120 is a water-cooled structure, including a water-cooling pump 121 disposed outside the sample box 10, a water-cooling plate 123 disposed below the Peltier thermostat 20, and a water-cooling pipe 122 connected between the water-cooling pump 121 and the water-cooling plate 123, wherein the water-cooling pipe 122 is disposed in a multi-stage bending manner inside the water-cooling plate 123 to increase the cooling area of ​​the water-cooling plate 123. When the Peltier thermostat 20 is in the cooling mode, the radiator 120 can take out the heat of the hot end plate of the Peltier thermostat 20, thereby improving the cooling performance of the Peltier thermostat 20 and realizing rapid cooling of the semiconductor power device 1.

[0058] like Figure 3 and Figure 4 As shown, the present application also provides a control method for an environmental simulation device, which is used to control the above-mentioned environmental simulation device so that the closed chamber 11 can simulate different preset environments, and the different preset environments include aircraft take-off and landing environments, coastal environments, and polluted environments. The control method of this embodiment includes:

[0059] Step S1: Select a preset environment;

[0060] Step S2: controlling the environment simulation device to simulate the preset environment according to the preset environment.

[0061] The above-mentioned environmental simulation device can effectively solve the problem in the related art that it is difficult to perform performance testing on semiconductor power devices in various complex and harsh working environments. The control method for controlling the environmental simulation device also has the above-mentioned advantages.

[0062] Specifically, the environment simulation device has multiple environment modes built in, that is, the environment simulation device can simulate multiple preset environments, where the multiple preset environments include but are not limited to aircraft take-off and landing environments, coastal environments, and polluted environments.

[0063] like Figure 4 As shown, when the preset environment is an aircraft take-off and landing environment, step S2 includes:

[0064] Step S211: starting the humidifier 30, the Peltier temperature controller 20 and the voltage controller 50 to increase the humidity and air pressure in the sealed chamber 11 and cool the semiconductor power device 1;

[0065] Step S212: starting the dryer 40, the Peltier temperature controller 20 and the voltage controller 50 to reduce the humidity and air pressure in the sealed chamber 11 and heat the semiconductor power device 1;

[0066] Step S213: Execute step S211 and step S212 in a loop, and count the number of executions after each execution of step S211 or step S212. When the number of executions of step S211 or step S212 reaches a first preset number, exit the loop.

[0067] In this embodiment, the Peltier temperature controller 20 controls the temperature of the semiconductor power device 1 to simulate the influence of the change of the actual ambient temperature on the semiconductor power device 1. When the simulated actual ambient temperature gradually increases, the semiconductor power device 1 is cooled by the Peltier temperature controller 20; when the simulated actual ambient temperature gradually decreases, the semiconductor power device 1 is heated by the Peltier temperature controller 20.

[0068] In step S211, by starting the humidifier 30, the Peltier temperature controller 20 and the voltage controller 50, the humidity and air pressure in the closed chamber 11 can be increased and the semiconductor power device 1 can be cooled, thereby simulating an environment in which the humidity, air pressure and temperature increase when an aircraft passes through the clouds downward; in step S212, by starting the dryer 40, the Peltier temperature controller 20 and the voltage controller 50, the humidity and air pressure in the closed chamber 11 can be reduced and the semiconductor power device 1 can be heated, thereby simulating an environment in which the humidity, air pressure and temperature decrease when an aircraft passes through the clouds upward.

[0069] It should be noted that in the present embodiment, the temperature control of the semiconductor power device 1 is achieved by solid heat transfer between the Peltier thermostat 20 and the semiconductor power device 1. Therefore, when simulating the landing process of an aircraft, the actual ambient temperature gradually increases. However, since the Peltier thermostat 20 controls the temperature of the semiconductor power device 1 rather than the ambient temperature, the semiconductor power device 1 needs to be cooled so that the ambient temperature is hotter than the semiconductor power device 1. Similarly, when simulating the take-off process of an aircraft, the actual ambient temperature gradually decreases. However, since the Peltier thermostat 20 controls the temperature of the semiconductor power device 1 rather than the ambient temperature, the semiconductor power device 1 needs to be heated so that the ambient temperature is colder than the semiconductor power device 1.

[0070] It should be noted that the above-mentioned humidity, temperature and air pressure are all relative, that is, the humidity in step S211 is higher than the humidity in step S212, the temperature of the semiconductor power device 1 in step S211 is lower than the temperature in step S212, and the air pressure in step S211 is higher than the air pressure in step S212.

[0071] Since the adjustment of humidity, temperature and air pressure is a process, the humidity value, temperature value and air pressure value also change gradually, that is, the process of executing step S211 is a process in which the ambient humidity gradually increases, the temperature of the semiconductor power device 1 gradually decreases, and the ambient pressure gradually increases (that is, the process of the aircraft landing), and the process of executing step S212 is a process in which the ambient humidity gradually decreases, the temperature of the semiconductor power device 1 gradually increases, and the ambient pressure gradually decreases (that is, the process of the aircraft taking off).

[0072] By cyclically executing step S211 and step S212, it is possible to cyclically simulate the environmental conditions during the landing and take-off stages of the aircraft, wherein step S211 is a condensation step and step S212 is an evaporation step.

[0073] In this embodiment, since the Peltier thermostat 20 is used to directly carry the semiconductor power device 1, the temperature of the semiconductor power device 1 can be directly raised or lowered without affecting or slightly affecting other environmental parameters, thereby achieving independent control of multiple environmental parameters, avoiding the mutual influence between the parameters and increasing the difficulty of control. Specifically, the air pressure is regulated by the flow control of the vacuum pump 51; the humidity value of the dry and wet air can be adjusted according to a certain mixing ratio before entering the closed chamber 11, thereby achieving that no matter what the air pressure or gas flow rate in the closed chamber 11 is, the humidity of the dry and wet air remains unchanged; the temperature is achieved through solid heat conduction between the Peltier thermostat 20 and the semiconductor power device 1, that is, the Peltier thermostat 20 directly heats or cools the semiconductor power device 1, which is independent of the air, thereby achieving independent regulation of air pressure, humidity and temperature.

[0074] In addition, the environment simulation device also includes a PID controller, which is combined with the detection component 70 to achieve real-time self-controlled negative feedback adjustment of various parameters.

[0075] The air pressure values ​​in step S211 and step S212 can be set according to the relevant air pressure values ​​of the simulated environment. For example, in aviation applications, the general high-risk air pressure range is 0.5 bar-1 bar, in aerospace applications, the air pressure is below 0.01 bar, and in plateau environments, the air pressure is 0.5-0.7 bar. In the specific simulation process, the air pressure sensor 73 measures the air pressure inside the closed cavity 11 in real time, and the sampling frequency is generally 100,000 times per second.

[0076] Among them, the execution duration of step S211 and step S212 is set according to the actual situation, or designed according to the equivalent standard of the accelerated experiment. For experiments that do not need to control the rate of change of environmental parameters, the experimental time is generally the actual climb and descent time of the aircraft, which is 20-60 minutes. For experiments that need to control the rate of change of parameters, evaporation and condensation need to be controlled in sections, specifically dividing 40 minutes into multiple stages, each stage is 1-5 minutes.

[0077] The number of cycles of step S211 and step S212 (i.e., the first preset number) is set according to the duration of the reliability experiment. Generally, such reliability experiments will last for 168 hours or 1000 hours, which means that assuming each cycle lasts for 1 hour, 168-1000 cycles are required. Short-term mechanism research experiments can also be carried out, and the number of cycles of such experiments is generally within 5 times.

[0078] like Figure 4 As shown, when the preset environment is a coastal environment, step S2 includes:

[0079] Step S221: adding saline solution into the humidifier 30;

[0080] Step S222: Start the humidifier 30, the dryer 40 and the pressure controller 50 to make the humidity in the sealed chamber 11 reach a preset humidity.

[0081] Specifically, the composition and concentration of the salt solution can be adjusted according to the type and content of salt in the air of the environment in which the semiconductor power device 1 is to work, and then the salt solution is added to the water tank 31 of the humidifier 30. The salt solution can form salt mist after being atomized by the atomizer 32, and the salt mist enters the closed chamber 11 together with the airflow flowing in through the first air inlet. By reasonably controlling the gas flow rate of the first air inlet and the working efficiency of the atomizer 32, the salt content of the airflow entering the closed chamber 11 can be controlled, thereby accurately simulating the high humidity and high salt mist conditions on ships or in coastal areas, and performing high-voltage external insulation tests on the semiconductor power device 1.

[0082] During the experiment, the preset humidity is generally set at 60%-90%, which can be obtained according to the coastal or offshore environment. The duration of the experiment is generally 168-1000 hours, and the duration can also be shortened by increasing salinity and humidity for accelerated experiments.

[0083] The above coastal environment simulation can be used to test ships in service at sea, electric vehicles in coastal areas, or semiconductor power devices 1 with exposed electrodes on offshore wind power converter valves. In the above environment, the semiconductor power device 1 is exposed to the salt spray environment for a long time, and the insulating material will be corroded, resulting in electrical breakdown.

[0084] like Figure 4 As shown, when the preset environment is a polluted environment, step S2 includes:

[0085] Step S231: adding contaminated liquid into the spray assembly 60;

[0086] Step S232: starting the spray assembly 60 to spray the contamination liquid onto the semiconductor power device 1;

[0087] Step S233: starting the dryer 40, the Peltier temperature controller 20 and the voltage controller 50 to dry the semiconductor power device 1;

[0088] Step S234: Execute step S232 and step S233 in a loop, and count the number of executions after each execution of step S232 or step S233. When the number of executions of step S232 or step S233 reaches a second preset number, exit the loop.

[0089] The above steps can accurately simulate the scene in which the semiconductor power device 1 is repeatedly polluted and dried in rain or in a liquid polluted environment, causing pollutants to be deposited on the surface. Specifically, it is the process of vehicles such as cars, ships, and airplanes passing through clouds and rain. During the service of the semiconductor power device 1 for more than ten years, pollutants gradually accumulate on the surface of the device. The gradual accumulation of pollutants will eventually cause electrical breakdown. In step S232, the spray flow rate of the spray assembly 60 is generally 50-500km / h. In step S233, the Peltier temperature controller 20 heats the shell temperature of the semiconductor power device 1 to 40℃-70℃.

[0090] In specific implementation, step S232 may last for 1 hour to 2 hours, and step S233 may last for 20 minutes.

[0091] During specific implementation, the environmental simulation device of this embodiment can be used to simulate one or more environmental conditions in an aircraft take-off and landing environment, a coastal environment, and a polluted environment at the same time, and can test and study the external insulation performance of the semiconductor power device 1 under high temperature and high humidity environments, condensation effects in low temperature and high humidity environments, and low temperature and low pressure plateaus or high altitudes.

[0092] A changing environment may have an adverse effect on the semiconductor power device 1. The environmental simulation device of this embodiment can regulate the rate and range of change of air pressure, temperature, humidity and salt spray, and simulate the environmental changes when the semiconductor power device 1 is used in a moving car or an airplane taking off and landing.

[0093] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the devices or elements referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present invention. The directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0094] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" may include both "above" and "below". The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used herein are interpreted accordingly.

[0095] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the present invention.

[0096] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An environmental simulation device, characterized in that: Used to test a semiconductor power device (1), the environmental simulation device comprises: A sample box (10) having a sealed cavity (11); A Peltier temperature controller (20), arranged in the sample box (10) and having a bearing surface for bearing the semiconductor power device (1) to be tested; a humidifier (30), arranged outside the sample box (10) and connected to the sealed chamber (11); a dryer (40) disposed outside the sample box (10) and in communication with the sealed chamber (11); A pressure controller (50) disposed outside the sample box (10) and in communication with the sealed chamber (11); A spray assembly (60), comprising a spray portion (61) disposed in the sealed chamber (11) and located above the Peltier temperature controller (20); A detection component (70) is arranged in the sample box (10); a power supply module (80), arranged outside the sample box (10) and having a power supply end (81) extending into the sealed cavity (11), wherein the power supply end (81) can be conductively connected to the semiconductor power device (1) to supply power to the semiconductor power device (1); a controller (90) disposed outside the sample box (10) and signal-connected to the Peltier temperature controller (20), the humidifier (30), the dryer (40), the pressure controller (50), the spray assembly (60), and the detection assembly (70); The environmental simulation device further comprises a sample cover (100) arranged above the Peltier temperature controller (20) and at least partially connected to the sealed chamber (11), and the semiconductor power device (1) is arranged in the sample cover (100); A plurality of movable flow guide plates are also arranged on the top surface of the sample cover (100), and the movable flow guide plates are rotatably connected to the top surface of the sample cover (100).

2. The environmental simulation device according to claim 1, characterized in that: The humidifier (30) comprises a water tank (31), an atomizer (32) arranged in the water tank (31), a first air inlet pipe (33) connected between the sample box (10) and the water tank (31), and a first control valve (34) arranged on the first air inlet pipe (33), wherein the outlet end of the first air inlet pipe (33) extends into the sample cover (100).

3. The environmental simulation device according to claim 1, characterized in that: The dryer (40) comprises a drying box (41), a desiccant (42) arranged in the drying box (41), a second air inlet pipe (43) arranged between the drying box (41) and the sample box (10), and a second control valve (44) arranged on the second air inlet pipe (43), wherein the outlet end of the second air inlet pipe (43) extends into the sample cover (100).

4. The environmental simulation device according to claim 1, characterized in that: The pressure controller (50) comprises a vacuum pump (51), an exhaust pipe (52) connected between the vacuum pump (51) and the closed chamber (11), and a third control valve (53) arranged on the exhaust pipe (52), wherein the inlet end of the exhaust pipe (52) extends into the closed chamber (11).

5. The environmental simulation device according to claim 1, characterized in that: The spray assembly (60) further comprises a liquid storage tank (62) and a liquid infusion tube (63) connected between the liquid storage tank (62) and the spray part (61); the spray part (61) comprises a spray pipe located in the sample cover (100); and the spray pipe is provided with spray holes.

6. The environment simulation device according to any one of claims 1 to 5, characterized in that: The detection component (70) comprises a temperature sensor (71), a humidity sensor (72), an air pressure sensor (73) and a flow meter (74).

7. The environment simulation device according to any one of claims 1 to 5, characterized in that: The environmental simulation device further comprises a grounding plate (110) arranged on the bearing surface, the semiconductor power device (1) being arranged on the grounding plate (110); and / or, The environmental simulation device also includes a heat sink (120) arranged below the Peltier temperature controller (20).

8. A control method for an environmental simulation device, characterized in that: Used to control the environmental simulation device according to any one of claims 1 to 7, so that the closed chamber (11) can simulate different preset environments, wherein the different preset environments include an aircraft take-off and landing environment, a coastal environment and a polluted environment, and the control method comprises: Step S1: Select the preset environment; Step S2: controlling the environment simulation device to simulate the preset environment according to the preset environment.

9. The control method according to claim 8, characterized in that: When the preset environment is the aircraft take-off and landing environment, step S2 includes: Step S211: starting the humidifier (30), the Peltier temperature controller (20) and the voltage controller (50) to increase the humidity and air pressure in the sealed chamber (11) and cool the semiconductor power device (1); Step S212: starting the dryer (40), the Peltier temperature controller (20) and the voltage controller (50) to reduce the humidity and air pressure in the sealed chamber (11) and heat the semiconductor power device (1); Step S213: Execute step S211 and step S212 in a loop, and count the number of executions after each execution of step S211 or step S212. When the number of executions of step S211 or step S212 reaches a first preset number, exit the loop.

10. The control method according to claim 8, characterized in that: When the preset environment is the coastal environment, step S2 includes: Step S221: adding saline solution into the humidifier (30); Step S222: starting the humidifier (30), the dryer (40) and the pressure controller (50) so that the humidity in the sealed chamber (11) reaches a preset humidity.

11. The control method according to claim 8, characterized in that: When the preset environment is the polluted environment, step S2 includes: Step S231: adding contaminated liquid into the spray assembly (60); Step S232: starting the spray assembly (60) to spray the contaminated liquid onto the semiconductor power device (1); Step S233: starting the dryer (40), the Peltier temperature controller (20) and the voltage controller (50) to dry the semiconductor power device (1); Step S234: Execute step S232 and step S233 in a loop, and count the number of executions after each execution of step S232 or step S233, and exit the loop when the number of executions of step S232 or step S233 reaches a second preset number of times.

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