Packaging structure, packaging method and camera module

Abstract

The invention discloses a packaging structure, a packaging method and a camera module, and the structure comprises a support, an optical filter disposed on the support, a photosensitive chip disposed at the lower end of the support, a circuit board disposed at the lower end of the photosensitive chip, and a packaging colloid disposed between the support and the circuit board. The lower end of the support is provided with a connecting part which protrudes in the direction away from the optical filter and is connected with the photosensitive chip, the support is further provided with a light-transmitting cavity penetrating through the support and the connecting part in the optical axis direction, the size of the connecting part is smaller than that of the photosensitive chip, and after the connecting part is connected with the photosensitive chip, a packaging gap is formed between the support and the circuit board. A plurality of connecting wires with one ends connected with the photosensitive chip and the other ends connected with the circuit board are all located in the packaging gap, the packaging colloid in the packaging gap enables the connecting wires to be sealed in the packaging gap, the size of the connecting part is smaller than that of the photosensitive chip, a certain safety distance is not reserved between the support and the connecting wires any more, and the placing space of the support is reduced. Therefore, the structure size can be reduced to realize lightening and thinning of equipment.

Description

Technical Field

[0001] The present invention belongs to the technical field of electronic products, and in particular relates to a packaging structure, a packaging method and a camera module. Background Art

[0002] The development of electronic technology has made the integration of components on circuit boards higher and higher. Mobile phones and other electronic devices are generally equipped with camera modules, which include circuit boards, photosensitive chips, filters, lens components, etc. Among them, the photosensitive chip needs to be packaged on the circuit board to achieve electrical signal connection between the photosensitive chip and the circuit board.

[0003] At present, the filter is usually pasted on the upper end of the bracket used to carry the filter, the lower end of the bracket is connected to the circuit board, and the photosensitive chip is set between the bracket and the circuit board. Because the two sides of the photosensitive chip are connected to the circuit board by gold wire, when packaging the photosensitive chip, a certain safety distance needs to be reserved between the bracket and the connecting gold wires and components on the circuit board to avoid contact or collision between the bracket and the gold wires and components, resulting in functional failure. Therefore, it is necessary to reserve a larger bracket ornament area on the circuit board for the bracket to connect to the circuit board. However, this packaging method will result in a larger overall packaging structure size, which is not conducive to the thinness of the device. Summary of the invention

[0004] In view of the technical problems in the prior art that the bracket requires a large space for ornaments and has a large size after packaging, which is not conducive to the lightweighting of the device, the present invention provides a packaging structure, a packaging method and a camera module.

[0005] In order to achieve the above object, the present invention adopts the following technical solution:

[0006] A packaging structure includes a bracket, a filter installed on the upper end of the bracket, a photosensitive chip arranged at the lower end of the bracket, a circuit board arranged at the lower end of the photosensitive chip, and a packaging colloid arranged between the bracket and the circuit board, the lower end of the bracket has a connecting part that protrudes away from the filter and is connected to the photosensitive chip, the bracket also has a light-transmitting cavity that passes through the bracket and the connecting part along the optical axis direction, the size of the connecting part is smaller than the size of the photosensitive chip, when the connecting part is connected to the photosensitive chip, a packaging gap is formed between the bracket and the circuit board, a number of connecting wires with one end connected to the photosensitive chip and the other end connected to the circuit board are all located in the packaging gap, and the packaging colloid is filled in the packaging gap so that the connecting wires are sealed in the packaging gap.

[0007] Furthermore, the upper end surface of the bracket is provided with a mounting groove which is recessed toward the connecting portion, and a light-transmitting hole communicating with the light-transmitting cavity is opened on the bottom surface of the mounting groove, and the filter is installed in the mounting groove and covers the light-transmitting hole.

[0008] Furthermore, the bottom surface of the mounting groove is defined as a first bonding surface, and the side wall of the mounting groove is defined as a second bonding surface. The second bonding surface is provided with a plurality of U-shaped grooves recessed toward the outside of the mounting groove, and the plurality of U-shaped grooves are distributed one-to-one at each corner position of the mounting groove.

[0009] Furthermore, the first bonding surface is provided with a U-shaped exhaust groove, and the notch of the U-shaped exhaust groove is communicated with the light-transmitting hole.

[0010] Furthermore, the second bonding surface is also provided with an avoidance groove for avoiding the U-shaped exhaust groove, and the avoidance groove is recessed toward the outside of the installation groove.

[0011] Furthermore, the axes of the light-transmitting hole and the light-transmitting cavity are on the same straight line, the shape of the light-transmitting hole is the same as that of the light-transmitting cavity, and each corner position of the light-transmitting hole and the light-transmitting cavity is in the shape of an arc chamfer.

[0012] Furthermore, the lower end surface of the bracket has a protrusion extending toward a direction away from the filter, and the lower end surface of the bracket and the side wall of the protrusion form two L-shaped bonding areas arranged at intervals, and a first sub-gap is formed between the L-shaped bonding area and the circuit board; the end surface of the protrusion on one side close to the filter is connected to the first end of the connecting portion, and the end surface of the protrusion on one side away from the filter forms a second sub-gap with the circuit board, and the first sub-gap and the second sub-gap together form the packaging gap; the second end of the connecting portion is bonded to the non-photosensitive area of ​​the photosensitive chip.

[0013] Furthermore, the packaging colloid is a low-pressure injection molding colloid.

[0014] A camera module comprises a packaging structure and a lens assembly connected to the upper end of the packaging structure, wherein the lens assembly comprises a lens base with a lower end bonded to a bracket and a lens connected to the upper end of the lens base.

[0015] A packaging method comprises the following steps:

[0016] 1) Evenly apply glue on the upper end surface of the circuit board, align the photosensitive chip with the corresponding position of the upper end surface of the circuit board, and press the photosensitive chip to make the photosensitive chip and the circuit board initially bonded;

[0017] 2) heating and curing the glue so that a compact cured layer is formed on the upper end surface of the circuit board and the photosensitive chip;

[0018] 3) The photosensitive chip is connected to a pad on the photosensitive chip by one end of a connecting wire through wire bonding, and the other end of the connecting wire is connected to a pad on the circuit board through wire bonding;

[0019] 4) A circle of glue is coated on the non-photosensitive area of ​​the upper end surface of the photosensitive chip or the lower end surface of the connecting portion, the connecting portion of the bracket is aligned with the non-photosensitive area, and is bonded to the non-photosensitive area of ​​the photosensitive chip through the glue. After bonding, the light-transmitting cavity is opposite to the photosensitive area of ​​the photosensitive chip;

[0020] 5) injecting a low-pressure injection-molded encapsulation colloid into the encapsulation gap by low-pressure injection molding;

[0021] 6) placing the above packaging structure in a glue pre-curing environment to pre-curing the glue;

[0022] 7) heating and curing the packaging structure;

[0023] 8) Remove the residual glue on the surface of the packaging structure.

[0024] In summary, the beneficial effects of the present invention are as follows: First, the bracket is connected to the photosensitive chip through a connecting part whose size is smaller than that of the photosensitive chip. Therefore, when processing the ornaments, the space required for the ornaments is smaller. After the connecting part is connected to the photosensitive chip, the bracket is above the connecting line, and relies on the packaging colloid to fill between the bracket and the circuit board to seal the connecting line. There is no need to reserve space for ornaments on the side of the circuit board located on the connecting line, so the size of the packaging structure can be reduced. Second, the installation groove is a recessed groove, and the filter is bonded to the installation groove and connected to the bracket by sinking, which can reduce the height of the structure, thereby realizing a thinner camera module. Third, U-shaped grooves are provided at each corner position in the installation groove, and the U-shaped grooves are recessed toward the outside of the installation groove, which can leave a larger space for glue overflow when pasting the filter to prevent the glue from being squeezed onto the surface of the filter to generate stray light. 4. When the above packaging method is used for packaging, after the photosensitive chip is connected to the circuit board through the connecting wire, the size of the connecting part is smaller than the photosensitive chip. When the connecting part is bonded to the non-photosensitive area, not only can the space for the bracket be reduced, but the lower end surface of the bracket always maintains a height difference with the upper end surface of the circuit board. The gap between the two is used to accommodate the connecting wire. Therefore, when the staff is bonding, even if the position of the bracket needs to be adjusted, it is not easy for the bracket to touch the connecting wire, thereby reducing the probability of functional failure due to contact, helping to improve bonding efficiency and reduce the production of defective products. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a structural schematic diagram of a packaging structure provided by the present invention.

[0026] Figure 2 yes Figure 1 Top view of the .

[0027] Figure 3 yes Figure 2 AA section view.

[0028] Figure 4 yes Figure 3 Schematic diagram of the structure when the encapsulation colloid is not filled.

[0029] Figure 5 It is a schematic diagram of the three-dimensional structure of the bracket in the present invention.

[0030] Figure 6 yes Figure 5 Schematic diagram of the structure of the bottom surface of the middle bracket.

[0031] Figure 7 It is a structural schematic diagram of a camera module provided by the present invention.

[0032] In the figure, 100-bracket, 110-connecting part, 120-light-transmitting cavity, 130-installing groove, 131-light-transmitting hole, 132-first bonding surface, 1320-U-shaped exhaust groove, 133-second bonding surface, 1330-U-shaped groove, 1331-avoidance groove, 140-protrusion, 141-L-shaped bonding area, 200-filter, 300-photosensitive chip, 310-connecting line, 400-circuit board, 500-packaging colloid, 600-packaging gap, 700-lens assembly, 710-lens base, 720-lens. DETAILED DESCRIPTION

[0033] The present invention is further described below in conjunction with specific drawings.

[0034] The photosensitive chip needs to be packaged on a circuit board. The bracket currently used has a free opening at the bottom, and the surrounding side walls surround the photosensitive chip. In addition, a certain safety distance needs to be reserved between the side walls of the bracket and the connecting wires.

[0035] See also Figure 1 and Figure 2The present invention provides a packaging structure, including a bracket 100, a filter 200 installed at the upper end of the bracket 100, a photosensitive chip 300 arranged at the lower end of the bracket 100, a circuit board 400 arranged at the lower end of the photosensitive chip 300, and a packaging colloid 500 arranged between the bracket 100 and the circuit board 400. The lower end of the bracket 100 has a connecting portion 110 protruding away from the filter 200 and connected to the photosensitive chip 300. The bracket 100 also has a light-transmitting cavity 120 that passes through the bracket 100 and the connecting portion 110 along the optical axis. Please refer to Figure 3 The size of the connecting portion 110 is smaller than the size of the photosensitive chip 300. When the connecting portion 110 is connected to the photosensitive chip 300, please refer to Figure 4 , a packaging gap 600 is formed between the bracket 100 and the circuit board 400. A plurality of connecting wires 310 connected to the photosensitive chip 300 at one end and connected to the circuit board 400 at the other end are all located in the packaging gap 600, and the packaging colloid 500 is filled in the packaging gap 600 so that the connecting wires 310 are sealed in the packaging gap 600. The connecting portion 110 protrudes from the bottom surface of the bracket 100 toward the photosensitive chip 300. When the connecting portion 110 is connected to the photosensitive chip 300, there is a height difference between the circuit board 400 and the bracket 100, and the gap between the two is the packaging gap 600. The connecting wires 310 are accommodated in the packaging gap 600. After the packaging colloid 500 is injected into the packaging gap 600, the connecting wires 310 and the components on the circuit board 400 can be sealed. The photosensitive chip 300 is packaged between the bracket 100 and the circuit board 400 to prevent dust from entering and affecting the imaging. Moreover, the size of the connecting portion 110 connected to the photosensitive chip 300 is smaller than that of the photosensitive chip, and a larger space for ornaments is no longer required. The connecting wire 310 is located in the packaging gap 600, and a certain safety distance is no longer reserved between the bracket 100 and the connecting wire 310, thereby further reducing the space for ornaments of the bracket 100, thereby reducing the size of the bracket 100, and thus reducing the overall size of the packaging structure, which is conducive to making the device lighter and thinner.

[0036] See also Figure 5 The top surface of the bracket 100 is provided with a mounting groove 130 that is recessed toward the direction close to the connecting portion 110, and a light-transmitting hole 131 that communicates with the light-transmitting cavity 120 is opened at the bottom surface of the mounting groove 130, and the optical filter 200 is installed in the mounting groove 130 and covers the light-transmitting hole 131. The mounting groove 130 is a recessed groove. After the optical filter 200 is installed in the mounting groove 130, compared with the traditional structure of installing the optical filter on the surface of the bracket, after the optical filter 200 is installed on the bracket 100 in a sinking manner, the height of the packaging structure can be reduced and the thickness of the device can be reduced.

[0037] The bottom surface of the mounting groove 130 is defined as a first bonding surface 132, and the side wall of the mounting groove 130 is defined as a second bonding surface 133. The second bonding surface 133 is provided with a plurality of U-shaped grooves 1330 that are recessed toward the outside of the mounting groove 130, and the plurality of U-shaped grooves 1330 are distributed one by one at each corner position of the mounting groove 130. Glue is applied to the first bonding surface 132, and the filter 200 is bonded to the mounting groove 130. After the glue is squeezed, it will approach the second bonding surface 133. The U-shaped grooves 1330 provided on the second bonding surface 133 are used as a glue overflow space to prevent the glue from being squeezed onto the surface of the filter 200, which will change the light transmittance of the filter 200 and cause stray light.

[0038] The axis of the light-transmitting hole 131 and the axis of the light-transmitting cavity 120 are on the same straight line, which improves the light transmission efficiency. The shape of the light-transmitting hole 131 is the same as that of the light-transmitting cavity 120, and the inner cavity of the light-transmitting hole 131 actually overlaps with part of the light-transmitting cavity 120, so that the light can maintain good consistency when passing through, reducing the light distortion or loss caused by shape mismatch. The corners of the light-transmitting hole 131 and the light-transmitting cavity 120 are all chamfered in arc shape. When subjected to external force, the chamfer can disperse stress and reduce the risk of structural damage.

[0039] See also Figure 6 The lower end surface of the bracket 100 has a protruding portion 140 protruding in a direction away from the filter 200. The lower end surface of the bracket 100 and the side wall of the protruding portion 140 form two L-shaped bonding areas 141 arranged at intervals. A first sub-gap is formed between the L-shaped bonding area 141 and the circuit board 400. The end surface of the protruding portion 140 close to the filter 200 is connected to the first end of the connecting portion 110. The end surface of the protruding portion 140 away from the filter 200 forms a second sub-gap with the circuit board 400. The first sub-gap and the second sub-gap together form the packaging gap 600. The protruding portion 140 protrudes toward the photosensitive chip 300, and the connecting portion 110 is connected to the lower end of the protruding portion 140, which can reasonably increase the height difference between the circuit board 400 and the bracket 100, so as to facilitate the accommodation of the connecting wire 310.

[0040] The second end of the connecting portion 110 is bonded to the non-photosensitive area of ​​the photosensitive chip 300, and the first bonding surface 132 is provided with a U-shaped exhaust groove 1320, and the notch of the U-shaped exhaust groove 1320 is communicated with the light-transmitting hole 131. The second bonding surface 133 is also provided with an escape groove 1331 for avoiding the U-shaped exhaust groove 1320, and the escape groove 1331 is recessed toward the outside of the mounting groove 130, which can avoid a larger exhaust space. The U-shaped exhaust groove 1320 keeps the internal and external air pressure balanced to prevent the formation of a closed space in the light-transmitting hole 131 during bonding, which will affect the heating and curing of the glue at the position of the connecting portion 110.

[0041] The packaging colloid 500 is a low-pressure injection molding colloid, which usually has good insulation performance and can effectively isolate the electrical contact between the bracket 100 and the circuit board 400 to prevent electrical faults such as short circuits. The packaging colloid 500 can be tightly filled in the packaging gap 600 to form a solid packaging structure, effectively enhancing the structural strength of the entire packaging structure to prevent damage caused by vibration or impact, and has good sealing performance, which can effectively prevent external impurities such as dust and water vapor from entering the packaging structure, protecting the internal precision components from pollution and erosion.

[0042] A packaging method comprises the following steps:

[0043] 1) Apply glue evenly on the upper end surface of the circuit board 400, align the photosensitive chip 300 with the corresponding position of the upper end surface of the circuit board 400, and gently press the photosensitive chip 300 to initially bond the photosensitive chip 300 to the circuit board 400.

[0044] 2) Curing the glue so that a compact cured layer is formed on the upper end surface of the circuit board 400 and the photosensitive chip 300. In this step, the glue can be cured by heating.

[0045] 3) One end of the connecting wire 310 (i.e., gold wire) on the photosensitive chip 300 is connected to a pad on the photosensitive chip 300 by wire bonding, and the other end of the connecting wire 310 is connected to a pad on the circuit board 400 by wire bonding, thereby achieving electrical connection.

[0046] 4) A circle of glue is coated on the non-photosensitive area of ​​the upper end surface of the photosensitive chip 300 or the lower end surface of the connecting portion 110, and the connecting portion 110 of the bracket 100 is aligned with the non-photosensitive area and attached, and the connecting portion 110 is bonded to the non-photosensitive area of ​​the photosensitive chip 300 by glue.

[0047] In the above step 4), the glue is cured by heating so that the connecting portion 110 is firmly bonded to the photosensitive chip 300 . After bonding, the light-transmitting cavity 120 is opposite to the photosensitive area of ​​the photosensitive chip 300 .

[0048] In the above step 4), the U-shaped exhaust groove 1320 is sealed with UV glue, and the glue is cured to prevent dust from entering the interior of the packaging structure during use.

[0049] 5) The low-pressure injection molding packaging colloid 500 is injected into the packaging gap 600 by low-pressure injection molding. The packaging colloid 500 encapsulates the connecting wires 310 and the components on the circuit board 400 for protection.

[0050] 6) Placing the above packaging structure in a glue pre-curing environment to pre-curing the glue. In this step, the glue is pre-cured by subjecting it to light treatment or heating with a heating device.

[0051] 7) Before removing the external mold of the packaging structure, place the packaging structure in a heating device for heating and curing. During the heating process, the glue will gradually soften and flow, forming a tight bonding layer on the upper end surface of the circuit board 400 and the lower end surface of the bracket 100.

[0052] 8) Removing the residual glue on the surface of the packaging structure. In this step, chemical solvents, precision scrapers or ultrasonic cleaning agents can be used to peel the residual glue from the surface of the packaging structure.

[0053] See also Figure 7 A camera module, a packaging structure and a lens assembly 700 connected to the upper end of the packaging structure, wherein the lens assembly 700 includes a lens base 710 bonded to the bracket 100 at the lower end and a lens 720 connected to the upper end of the lens base 710. The bracket 100 is above the connecting line 310, and the side wall of the bracket 100 is no longer required to be located on one side of the connecting line 310 and at a certain distance. Therefore, the space for the ornaments of the bracket 100 is reduced, and the packaging structure connected to the lens base 710 can be reduced in size. The filter 200 is sunken and installed in the installation groove 130, which can reduce the height of the camera module and make the device thinner and lighter.

[0054] The above packaging structure, packaging method and camera module, first, the bracket 100 is connected to the photosensitive chip 300 through the connecting part 110 which is smaller than the photosensitive chip 300, so when processing the ornaments, the required ornament space is smaller. After the connecting part 110 is connected to the photosensitive chip 300, the bracket 100 is above the connecting line 310, and the packaging colloid 500 is filled between the bracket 100 and the circuit board 400 to seal the connecting line 310. The side of the circuit board 400 located on the connecting line 310 no longer needs to reserve the ornament space, so the size of the packaging structure can be reduced. Second, the installation groove 130 is a recessed groove, and the filter 200 is bonded in the installation groove 130 and connected to the bracket 100 by sinking, which can reduce the height of the structure, thereby realizing a thinner camera module. 3. U-shaped grooves 1330 are provided at each corner position in the installation groove 130. The U-shaped grooves 1330 are recessed toward the outside of the installation groove 130, which can leave a larger space for glue overflow when pasting the filter 200, so as to prevent the glue from being squeezed onto the surface of the filter 200 to generate stray light. 4. When the above packaging method is used for packaging, after the photosensitive chip 300 is connected to the circuit board 300 through the connecting wire 310, the size of the connecting part 110 is smaller than the photosensitive chip 300. When the connecting part 110 is bonded to the non-photosensitive area, not only can the ornament space of the bracket 100 be reduced, but also the lower end surface of the bracket 100 always maintains a height difference with the upper end surface of the circuit board 400. The gap between the two is used to accommodate the connecting wire 310. Therefore, when the staff is bonding, even if the position of the bracket 100 is adjusted, it is not easy for the bracket 100 to touch the connecting wire 310, thereby reducing the probability of functional failure due to contact, which helps to improve the bonding efficiency and reduce the production of defective products.

[0055] The above are only implementation modes of the present invention, and are not intended to limit the patent scope of the present invention. Any equivalent structure made using the contents of the present invention's specification and drawings, directly or indirectly used in other related technical fields, are also within the patent protection scope of the present invention.

Claims

1. A packaging structure, characterized in that: The invention comprises a bracket, a filter installed at the upper end of the bracket, a photosensitive chip arranged at the lower end of the bracket, a circuit board arranged at the lower end of the photosensitive chip, and a packaging colloid arranged between the bracket and the circuit board. The lower end of the bracket has a connecting portion which protrudes away from the filter and is connected to the photosensitive chip. The bracket also has a light-transmitting cavity which passes through the bracket and the connecting portion along the optical axis direction. The size of the connecting portion is smaller than the size of the photosensitive chip. When the connecting portion is connected to the photosensitive chip, a packaging gap is formed between the bracket and the circuit board. A plurality of connecting wires with one end connected to the photosensitive chip and the other end connected to the circuit board are all located in the packaging gap. The packaging colloid is filled in the packaging gap so that the connecting wires are sealed in the packaging gap.

2. The packaging structure according to claim 1, characterized in that: The upper end surface of the bracket is provided with a mounting groove which is recessed toward the connecting portion, and a light-transmitting hole communicating with the light-transmitting cavity is opened on the bottom surface of the mounting groove. The filter is installed in the mounting groove and covers the light-transmitting hole.

3. The packaging structure according to claim 2, characterized in that: The bottom surface of the mounting groove is defined as a first bonding surface, and the side wall of the mounting groove is defined as a second bonding surface. The second bonding surface is provided with a plurality of U-shaped grooves recessed toward the outside of the mounting groove, and the plurality of U-shaped grooves are distributed one-to-one at each corner position of the mounting groove.

4. The packaging structure according to claim 3, characterized in that: The first bonding surface is provided with a U-shaped exhaust groove, and the notch of the U-shaped exhaust groove is communicated with the light-transmitting hole.

5. The packaging structure according to claim 4, characterized in that: The second bonding surface is also provided with an avoidance groove for avoiding the U-shaped exhaust groove, and the avoidance groove is recessed toward the outside of the installation groove.

6. The packaging structure according to claim 2, characterized in that: The axes of the light-transmitting hole and the light-transmitting cavity are on the same straight line, the shape of the light-transmitting hole is the same as that of the light-transmitting cavity, and each corner position of the light-transmitting hole and the light-transmitting cavity is in the shape of an arc chamfer.

7. The packaging structure according to claim 1, characterized in that: The lower end surface of the bracket has a protrusion extending toward the direction away from the filter, and the lower end surface of the bracket and the side wall of the protrusion form two L-shaped bonding areas arranged at intervals, and a first sub-gap is formed between the L-shaped bonding area and the circuit board; the end surface of the protrusion on one side close to the filter is connected to the first end of the connecting portion, and the end surface of the protrusion on the side away from the filter forms a second sub-gap with the circuit board, and the first sub-gap and the second sub-gap together form the packaging gap; the second end of the connecting portion is bonded to the non-photosensitive area of ​​the photosensitive chip.

8. The packaging structure according to any one of claims 1 to 7, characterized in that: The packaging colloid is a low-pressure injection molding colloid.

9. A camera module, characterized in that: It comprises a packaging structure as described in any one of claims 1 to 7 and a lens assembly connected to the upper end of the packaging structure, wherein the lens assembly comprises a lens base with a lower end bonded to the bracket and a lens connected to the upper end of the lens base.

10. A packaging method, characterized in that: The steps include: 1) Evenly apply glue on the upper end surface of the circuit board, align the photosensitive chip with the corresponding position of the upper end surface of the circuit board, and press the photosensitive chip to make the photosensitive chip and the circuit board initially bonded; 2) heating and curing the glue so that a compact cured layer is formed on the upper end surface of the circuit board and the photosensitive chip; 3) The photosensitive chip is connected to a pad on the photosensitive chip by one end of a connecting wire through wire bonding, and the other end of the connecting wire is connected to a pad on the circuit board through wire bonding; 4) A circle of glue is coated on the non-photosensitive area of ​​the upper end surface of the photosensitive chip or the lower end surface of the connecting portion, the connecting portion of the bracket is aligned with the non-photosensitive area, and is bonded to the non-photosensitive area of ​​the photosensitive chip through the glue. After bonding, the light-transmitting cavity is opposite to the photosensitive area of ​​the photosensitive chip; 5) injecting a low-pressure injection molding encapsulation colloid into the encapsulation gap by low-pressure injection molding; 6) placing the above packaging structure in a glue pre-curing environment to pre-curing the glue; 7) heating and curing the above packaging structure; 8) Remove the residual glue on the surface of the packaging structure.

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