Display panel and manufacturing method thereof

Abstract

The invention relates to a display panel and a manufacturing method thereof. The manufacturing method of the display panel comprises the following steps: providing a substrate; forming a first electrode on the substrate; forming a pixel definition layer and a pixel definition hole penetrating through the pixel definition layer on one side, far away from the substrate, of the first electrode, and exposing a part of the first electrode from the corresponding pixel definition hole; a first metal material layer is formed, a part of the first metal material layer covers the first electrode exposed from the pixel definition hole, and the first metal material layer and the first electrode comprise materials with different etching rates; forming a partition structure on one side, far away from the first electrode, of the pixel definition layer; and etching the first metal material layer to form a first metal layer, so that the first electrode is exposed from the corresponding pixel definition hole. It is guaranteed that the structure of the first electrode is complete and free of etching damage, dark spots displayed on a screen body and other display problems caused by damage of the first electrode can be avoided, and the display effect of the display panel can be improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof. Background Art

[0002] Organic Light Emitting Display (OLED) has been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to its advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream in display devices.

[0003] However, the performance of current OLED display panels needs to be improved. Summary of the invention

[0004] Based on this, it is necessary to provide a display panel and a manufacturing method thereof to address the above technical issues.

[0005] In a first aspect, the present application provides a method for manufacturing a display panel, comprising the following steps:

[0006] providing a substrate;

[0007] forming a first electrode on the substrate;

[0008] forming a pixel definition layer and a pixel definition hole penetrating the pixel definition layer on a side of the first electrode away from the substrate, so that a portion of the first electrode is exposed from the corresponding pixel definition hole;

[0009] forming a first metal material layer, so that a portion of the first metal material layer covers the first electrode exposed from the pixel definition hole, and the first metal material layer and the first electrode include materials with different etching rates;

[0010] forming a partition structure on a side of the pixel definition layer away from the first electrode;

[0011] The first metal material layer is etched to form a first metal layer, so that the first electrode is exposed from the corresponding pixel definition hole.

[0012] In the manufacturing method of the above-mentioned display panel, before forming the partition structure, a first metal material layer is formed between the partition structure and the first electrode, and the first metal material layer is used to protect the first electrode to avoid the etching step of forming the partition structure from damaging the first electrode exposed by the pixel definition hole, and after forming the partition structure, the first metal material layer is etched to expose the surface of the first electrode through the pixel definition hole. Since the etching rates of the first metal material layer and the first electrode are different, the first metal material layer can be selectively etched by an etching solution, which can avoid damaging the first electrode during the etching process of the first metal material layer, ensure that the structure of the first electrode is intact and free of etching damage, and avoid dark spots on the screen and other display problems caused by damage to the first electrode, which is beneficial to improving the display effect of the display panel.

[0013] In one embodiment, etching the first metal material layer to form a first metal layer includes:

[0014] The first metal material layer is etched using a first etching solution, wherein the etching resistance of the first electrode to the first etching solution is greater than the etching resistance of the first metal material layer to the first etching solution;

[0015] The first etching solution has a high etching rate for the first metal material layer, and the first etching solution has a low etching rate for the first electrode;

[0016] Preferably, the etching rate of the first etching solution on the first electrode is zero;

[0017] Preferably, the first etching solution includes tetramethylammonium hydroxide; the material of the first electrode includes transparent metal oxide; and the material of the first metal material layer includes metal aluminum.

[0018] In this way, the first electrode has high etching resistance to the first etching solution, and the first etching solution is used to etch the first metal material layer, thereby preventing the first etching solution from damaging the first electrode, thereby ensuring that the surface of the first electrode is intact without etching damage.

[0019] In one embodiment, a partition structure is formed on a side of the pixel definition layer away from the first electrode, comprising:

[0020] forming a conductive material layer and a barrier material layer in sequence on a side of the pixel definition layer away from the substrate;

[0021] Patterning the barrier material layer to form a barrier portion and making the orthographic projection of the barrier portion on the substrate fall within the orthographic projection of the pixel definition layer on the substrate;

[0022] The conductive material layer in the pixel definition hole is removed by etching according to the blocking portion to form an isolator, wherein at least a portion of the orthographic projection outer contour of the blocking portion on the substrate is located at the periphery of the orthographic projection outer contour of the isolator on the substrate;

[0023] Preferably, the material of the separator includes at least one of metal copper or metal molybdenum;

[0024] Preferably, the material of the blocking portion includes a conductive material or an insulating material;

[0025] Preferably, the material of the barrier portion includes at least one of metallic titanium, titanium nitride, silicon nitride, silicon carbide or silicon oxynitride;

[0026] Preferably, the material of the pixel definition layer includes at least one of silicon nitride or silicon carbide.

[0027] In this way, in the etching step of forming the partition structure, the surface of the first electrode is protected by the first metal material layer, thereby preventing the first electrode from being damaged by etching.

[0028] In one embodiment, before forming the pixel definition layer, the first metal material layer is formed, the first metal material layer covers the top surface of the first electrode, and the orthographic projection of the first metal material layer on the substrate coincides with the orthographic projection of the first electrode on the substrate; etching the first metal material layer to form the first metal layer includes:

[0029] The first metal material layer in the pixel definition hole is removed by etching, and the first metal material layer between the first electrode and the pixel definition layer forms the first metal layer.

[0030] This is conducive to reducing the etching time of the first metal material layer, reducing the contact time between the first electrode surface and the first etching solution, and can further reduce the etching damage on the first electrode surface, ensure the integrity of the first electrode structure, and avoid damage to the first electrode causing dark spots on the screen and other display problems.

[0031] In one embodiment, the first metal material layer is formed after the pixel definition layer is formed, and the first metal material layer is formed between the conductive layer and the pixel definition layer; etching the first metal material layer to form the first metal layer includes:

[0032] The first metal material layer in the pixel definition hole is removed by etching, and the first metal material layer below the insulator forms the first metal layer, and the orthographic projection outer contour of the first metal layer on the substrate is located outside the orthographic projection outer contour of the insulator on the substrate.

[0033] In this way, the first metal layer contacts the bottom surface of the conductive layer, which is beneficial to reducing the overall resistance of the partition structure and improving the conductivity of the partition structure.

[0034] In a second aspect, the present disclosure provides a display panel, including:

[0035] substrate;

[0036] A first electrode is disposed on one side of the substrate;

[0037] A pixel definition layer, disposed on a side of the first electrode away from the substrate, the pixel definition layer having a pixel definition hole corresponding to the first electrode, the pixel definition hole penetrating the pixel definition layer and exposing the corresponding first electrode;

[0038] A partition structure, disposed on a side of the pixel definition layer away from the first electrode;

[0039] The first metal layer is disposed between the partition structure and the first electrode, and the first metal layer and the first electrode include materials with different etching rates.

[0040] In the above-mentioned display panel, a first metal layer is arranged between the partition structure and the first electrode. On the one hand, the material layer used to form the first metal layer can protect the first electrode in the process of forming the partition structure to avoid the etching step of forming the partition structure from damaging the first electrode exposed by the pixel definition hole; on the other hand, since the etching rates of the first metal layer and the first electrode are different, after the partition structure is formed, the first metal can be selectively formed by the etching liquid to expose the surface of the first electrode through the pixel definition hole, which can avoid damaging the first electrode in the process of forming the first metal layer and ensure that the structure of the first electrode is intact without etching damage. It can avoid damage to the first electrode causing dark spots on the screen and other display problems, which is beneficial to improving the display effect of the display panel.

[0041] In one embodiment, the first electrode has a higher etching resistance to the first etching solution than the first metal layer has a higher etching resistance to the first etching solution;

[0042] The first etching solution has a high etching rate for the first metal layer, and the first etching solution has a low etching rate for the first electrode;

[0043] Preferably, the etching rate of the first etching solution on the first electrode is zero;

[0044] Preferably, the first etching solution includes tetramethylammonium hydroxide; the material of the first electrode includes transparent metal oxide; and the material of the first metal layer includes metal aluminum.

[0045] In this way, the first electrode has high etching resistance to the first etching solution, and the first metal layer is formed by etching with the first etching solution, thereby preventing the first etching solution from damaging the first electrode, ensuring the surface of the first electrode is intact and free of etching damage.

[0046] In one of the embodiments, the partition structure includes an isolating body and a blocking portion stacked in sequence, and at least a portion of an orthographic projection outer contour of the blocking portion on the substrate is located outside an orthographic projection outer contour of the isolating body on the substrate.

[0047] In one embodiment, the material of the separator includes at least one of metal copper or metal molybdenum;

[0048] In one embodiment, the material of the blocking portion includes a conductive material or an insulating material.

[0049] In one embodiment, the material of the barrier portion includes at least one of metal titanium, titanium nitride, silicon nitride, silicon carbide or silicon oxynitride.

[0050] Preferably, the material of the pixel definition layer includes at least one of silicon nitride or silicon carbide.

[0051] In this way, the partition structure forms an undercut structure with a larger upper portion and a smaller lower portion, and the partition structure can partition the light-emitting material in the pixel definition hole.

[0052] In one embodiment, the first metal layer is located between the pixel definition layer and the first electrode, a partial orthographic projection outer contour of the first metal layer on the substrate overlaps with a partial orthographic projection outer contour of the first electrode on the substrate, and another partial orthographic projection outer contour of the first metal layer on the substrate is located within the orthographic projection of the first electrode on the substrate.

[0053] In this way, the contact time between the surface of the first electrode and the etching solution during the formation of the first metal layer can be reduced, thereby avoiding damage to the first electrode that causes dark spots on the screen and other display problems.

[0054] In one of the embodiments, the first metal layer is located between the insulator and the pixel definition layer, and the orthographic projection outer contour of the first metal layer on the substrate is located outside the orthographic projection outer contour of the insulator on the substrate.

[0055] In this way, the wiring of the display panel can be further optimized. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0057] Figure 1 A process flow chart of a method for manufacturing a display panel provided in one embodiment of the present application;

[0058] Figure 2 A schematic diagram of a structure after a first electrode, a pixel definition layer and a first metal material layer are formed on a substrate according to an embodiment of the present application;

[0059] Figure 3 A schematic diagram of a structure after a conductive material layer and a barrier material layer are formed according to an embodiment of the present application;

[0060] Figure 4 A schematic diagram of a structure after a blocking portion is formed according to an embodiment of the present application;

[0061] Figure 5 A schematic diagram of a structure after a partition structure is formed according to an embodiment of the present application;

[0062] Figure 6 A schematic diagram of the structure of a display panel formed in one embodiment of the present application;

[0063] Figure 7 A schematic diagram of a structure after a first electrode layer and an initial first metal material layer are formed on a substrate according to another embodiment of the present application;

[0064] Figure 8 A schematic diagram of a structure after a first electrode, a pixel definition layer, and a first metal material layer are formed on a substrate according to another embodiment of the present application;

[0065] Fig. 9 A schematic diagram of a structure after a conductive material layer and a barrier material layer are formed according to another embodiment of the present application;

[0066] Fig.10 A schematic diagram of a structure after a blocking portion is formed according to another embodiment of the present application;

[0067] Fig.11 A schematic diagram of a structure after a partition structure is formed according to another embodiment of the present application;

[0068] Fig.12 It is a schematic structural diagram of a display panel formed according to another embodiment of the present application.

[0069] Description of reference numerals:

[0070] 10. Display panel; 11. Substrate; 12. First electrode; 12a. First electrode material layer; 13. Pixel definition layer; 131. Pixel definition hole; 14. First metal layer; 14a. First metal material layer; 14b. Initial first metal material layer; 15. Partition structure; 151. Conductive layer; 151a. Conductive material layer; 152. Blocking portion; 152a. Blocking material layer. DETAILED DESCRIPTION

[0071] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive.

[0072] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0073] When describing positional relationships, unless otherwise specified, when an element such as a layer, film, or substrate is referred to as being "on" another element, it can be directly on the other element or there can be intervening elements. Further, when a layer is referred to as being "under" another layer, it can be directly below or there can be one or more light-emitting units. It is also understood that when a layer is referred to as being "between" two layers, it can be the only layer between the two layers or there can be one or more light-emitting units.

[0074] In the case of using “including”, “having”, and “comprising” described herein, another component may be added unless a clear limiting term such as “only”, “consisting of”, etc. is used. Unless mentioned otherwise, a term in the singular form may include a plural form and should not be understood as being one in number.

[0075] It should be understood that although the terms "first", "second", etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element without departing from the scope of the present application.

[0076] It should also be understood that when interpreting an element, even if not explicitly described, the element is interpreted as including a range of error, which should be within the acceptable deviation range of the specific value determined by those skilled in the art. For example, "approximately", "approximately" or "substantially" can mean within one or more standard deviations, which are not limited here.

[0077] Furthermore, in the specification, the phrase “planar distribution schematic diagram” refers to a drawing when a target portion is viewed from above, and the phrase “cross-sectional schematic diagram” refers to a drawing when a section taken by vertically cutting the target portion is viewed from the side.

[0078] In addition, the drawings are not drawn to a 1:1 scale, and the relative sizes of the elements in the drawings are drawn only as examples and not necessarily according to the true scale.

[0079] As described in the background technology, the performance of the current OLED display panel needs to be improved. For example, when the current display panel is emitting light, local dark spots often appear on the display screen, which affects the display effect and the user's application experience. The inventors have found that in the manufacturing process of the display panel, the VSS wiring is formed after the first electrode. In the process of etching the VSS wiring, the etching step may damage the surface of the first electrode. When the display panel is emitting light, the etching damage on the surface of the first electrode produces local dark spots.

[0080] In view of this, the present application provides a display panel and a method for manufacturing the same. Before executing the step of forming a partition structure, a first metal material layer is formed to cover the first electrode exposed by the pixel definition hole. The first metal material layer is used to protect the first electrode to avoid damaging the surface of the first electrode during the process of forming the partition structure, thereby avoiding damage to the first electrode that causes dark spots on the screen and other display problems, which is beneficial to improving the display effect of the display panel and enhancing the user experience.

[0081] The present application provides a method for manufacturing a display panel 10. Figure 1 The process flow chart of the manufacturing method of the display panel 10 of this embodiment is shown.

[0082] It should be understood that although Figure 1 The steps in the flowchart are shown in sequence as indicated by the arrows, but these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified in this document, there is no strict order restriction for the execution of these steps, and these steps can be executed in other orders. Moreover, Figure 1At least part of the steps may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily executed at the same time, but can be executed at different times. The execution order of these sub-steps or stages is not necessarily sequential, but can be executed in turn or alternately with other steps or at least part of the sub-steps or stages of other steps.

[0083] The display panel 10 provided in this embodiment may include a rigid display panel having only a display function, or may include a rigid display panel having a touch function.

[0084] The contents of relevant patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, and PCT / CN2024 / 099072 are for reference only.

[0085] like Figure 1 As shown, the manufacturing method of the display panel 10 of this embodiment includes the following steps:

[0086] Step S10: providing a substrate 11;

[0087] like Figure 2 or Figure 8 As shown, the substrate 11 may be rigid glass or a thin metal sheet, etc. The present application embodiment will not discuss in detail the substrate 11 made of other materials, and those skilled in the art may select different types of materials according to actual needs.

[0088] Step S20: forming a first electrode 12 on the substrate 11;

[0089] like Figure 2 or Figure 8 As shown, a first electrode material layer 12a (see Figure 8 ), and then patterning the first electrode material layer 12a to form a plurality of first electrodes 12 that are spaced apart.

[0090] The first electrode 12 may be an anode electrode of a pixel.

[0091] Step S30: forming a pixel definition layer 13 and a pixel definition hole 131 penetrating the pixel definition layer 13 on a side of the first electrode 12 away from the substrate 11 , such that a portion of the first electrode 12 is exposed from the corresponding pixel definition hole 131 ;

[0092] like Figure 2 or Figure 8 As shown, the pixel definition layer 13 can be formed by atomic layer deposition (ALD) or chemical vapor deposition (CVD) process, and then the pixel definition layer 13 is patterned to form a plurality of pixel definition holes 131 corresponding to the plurality of first electrodes 12 , each pixel definition hole 131 penetrates the pixel definition layer 13 and exposes the top surface of the corresponding first electrode 12 .

[0093] The pixel definition layer 13 may include a single layer or multiple layers of inorganic material.

[0094] Step S40: forming a first metal material layer 14 a, so that a portion of the first metal material layer 14 a covers the first electrode 12 exposed from the pixel definition hole 131, and the first metal material layer 14 a and the first electrode 12 include materials with different etching rates;

[0095] like Figure 2 or Figure 8 As shown, the first metal material layer 14a can be formed before the pixel definition layer 13, or can be formed after the pixel definition layer 13. The first metal material layer 14a can be formed by PVD deposition, and the first metal material layer 14a covers the top surface of the first electrode 12.

[0096] The first metal material layer 14a and the first electrode 12 include materials with different etching rates. The first metal material layer 14a can be selectively etched by an etching solution, so that the first metal material layer 14a protects the first electrode 12 from being damaged by etching.

[0097] Step S50: forming a partition structure 15 on a side of the pixel definition layer 13 away from the first electrode 12;

[0098] Step S60 : etching the first metal material layer 14 a to form the first metal layer 14 , so that the first electrode 12 is exposed from the corresponding pixel definition hole 131 .

[0099] The first metal layer 14 formed by etching the first metal material layer 14a is disposed between the partition structure 15 and the first electrode 12. In one example, Figure 6 As shown, the first metal layer 14 is disposed between the partition structure 15 and the pixel definition layer 13; Fig.12 As shown, the first metal layer 14 is disposed between the pixel definition layer 13 and the first electrode 12 .

[0100] In the manufacturing method of the above-mentioned display panel 10, before forming the partition structure 15, a first metal material layer 14a is formed between the partition structure 15 and the first electrode 12, and the first metal material layer 14a is used to protect the first electrode 12 to avoid the etching step of forming the partition structure 15 from damaging the first electrode 12 exposed by the pixel definition hole 131, and after forming the partition structure 15, the first metal layer 14 is etched to expose the surface of the first electrode 12 through the pixel definition hole 131. Since the etching rates of the first metal material layer 14a and the first electrode 12 are different, the first metal material layer 14a can be selectively etched by the etching solution, which can avoid damaging the first electrode 12 during the etching process of the first metal material layer 14a, ensure that the structure of the first electrode 12 is intact and free of etching damage, and avoid damage to the first electrode 12 that causes dark spots on the screen and other display problems, which is beneficial to improving the display effect of the display panel 10.

[0101] In one embodiment, referring to Figure 5 , Figure 6 or refer to Fig.11 , Fig.12 , step S60 etches the first metal material layer 14a to form the first metal layer 14, including: etching the first metal material layer 14a with a first etching solution, wherein the first electrode 12 has a higher etching resistance to the first etching solution than the first metal material layer 14a. In this way, the first electrode 12 has a high etching resistance to the first etching solution, and the first metal material layer 14a is etched with the first etching solution to avoid the first etching solution damaging the first electrode 12, thereby ensuring that the surface of the first electrode 12 is intact and free of etching damage.

[0102] The first etching solution has a high etching rate for the first metal material layer 14 a , and the first etching solution has a low etching rate for the first electrode 12 .

[0103] Preferably, the etching rate of the first etching solution on the first electrode 12 is zero.

[0104] Preferably, the first etching solution includes tetramethylammonium hydroxide; the material of the first electrode 12 includes a transparent metal oxide; and the material of the first metal material layer 14a includes metal aluminum.

[0105] The first electrode 12 may include a single-layer structure or a multi-layer structure. In one example, the first electrode 12 includes a single-layer transparent metal oxide layer, such as an indium tin oxide layer. In another example, the first electrode 12 includes a multi-layer structure, and the top layer of the first electrode 12 is a transparent metal oxide, for example, the first electrode 12 includes an indium tin oxide layer, a metal silver layer, and an indium tin oxide layer stacked in sequence.

[0106] In this way, it can be ensured that the top surface of the first electrode 12 is completely undamaged during the etching process of the first metal material layer 14a, thereby ensuring the structural integrity of the first electrode 12 and avoiding dark spots on the screen and other display problems caused by damage to the first electrode 12.

[0107] In one embodiment, step S50 forms a partition structure 15 on a side of the pixel definition layer 13 away from the first electrode 12, including:

[0108] Step S51: forming a conductive material layer 151 a and a barrier material layer 152 a in sequence on a side of the pixel definition layer 13 away from the substrate 11 ;

[0109] Reference Figure 3 or refer to Fig. 9 A conductive material layer 151a and a barrier material layer 152a may be deposited in sequence by ALD, CVD or PVD. The conductive material layer 151a covers the first metal material layer 14a in the pixel definition hole 131. The conductive material layer 151a is separated from the first electrode 12 by the first metal material layer 14a. The barrier material layer 152a covers the side of the conductive material layer 151a away from the substrate 11.

[0110] Step S52: Patterning the blocking material layer 152a to form a blocking portion 152 and making the orthographic projection of the blocking portion 152 on the substrate 11 fall within the orthographic projection of the pixel definition layer 13 on the substrate 11; the blocking portion 152 formed by the patterned blocking material layer 152a is referred to Figure 4 or refer to Fig.10 shown.

[0111] Step S53: Etching away the conductive material layer 151a in the pixel definition hole 131 according to the blocking portion 152 to form an isolator, wherein at least part of the orthographic projection outer contour of the blocking portion 152 on the substrate 11 is located outside the orthographic projection outer contour of the isolator 151 on the substrate 11 .

[0112] Reference Figure 5 or refer to Fig.11 , the conductive material layer 151a exposed by the blocking portion 152 is etched by a wet process, so that the conductive material layer 151a is disconnected, exposing the first metal material layer 14a, and the retained conductive material layer 151a is etched to form the isolation body 151, and at least part of the orthographic projection outer contour of the blocking portion 152 on the substrate 11 is located outside the orthographic projection outer contour of the isolation body 151 on the substrate 11. In this way, in the etching step of forming the partition structure 15, the surface of the first electrode 12 is protected by the first metal material layer 14a, so that the process of forming the partition structure 15 does not damage the first electrode 12.

[0113] It should be noted that the pixel definition hole 131 of the display panel 10 forms a light-emitting unit (not shown in the figure). In one example, the light-emitting unit includes a first electrode 12, a light-emitting functional part, and a second electrode. The light-emitting functional part and the second electrode are sequentially stacked in the pixel definition hole 131, and the light-emitting functional part contacts the top surface of the first electrode. By making the outer contour of the orthographic projection of the blocking part 152 on the substrate 11 located outside the outer contour of the orthographic projection of the isolating body 151 on the substrate 11, it is equivalent to forming an undercut structure of the partition structure 15 with a "large upper part and small lower part", that is, the partition structure 15 has an "eaves", so that the partition structure 15 can isolate the light-emitting material of the light-emitting unit.

[0114] In one embodiment, the material of the spacer 151 includes at least one of metal copper or metal molybdenum. In this way, the light-emitting unit can be electrically connected to the spacer 151 through the second electrode, so that the wiring arrangement of the display panel 10 is more optimized.

[0115] In one embodiment, the material of the blocking portion 152 includes a conductive material or an insulating material.

[0116] In one embodiment, the material of the barrier 152 includes at least one of metal titanium, titanium nitride, silicon nitride, silicon carbide or silicon oxynitride. For example, the material of the barrier 152 includes metal titanium. In this way, by providing a stacked metal layer, the resistance of the partition structure 15 can be reduced, thereby reducing the power consumption of the display panel 10.

[0117] In one example, the barrier 152 includes a metal titanium layer and a titanium nitride layer stacked in sequence; in another embodiment, the barrier 152 includes a titanium nitride layer and a silicon nitride layer stacked in sequence; in yet another embodiment, the barrier 152 includes a silicon nitride layer and a silicon oxynitride layer stacked in sequence.

[0118] In one embodiment, the material of the pixel definition layer 13 includes at least one of silicon nitride or silicon carbide. In one example, the pixel definition layer 13 includes a silicon oxide layer and a silicon nitride layer stacked in sequence.

[0119] In one embodiment, referring to Figure 8-Figure 12 , before forming the pixel definition layer 13, a first metal material layer 14a is formed, the first metal material layer 14a covers the top surface of the first electrode 12, and the orthographic projection of the first metal material layer 14a on the substrate 11 coincides with the orthographic projection of the first electrode 12 on the substrate 11; that is, step S40 is performed before step S30. Figure 7In step S20, after depositing the first electrode material 12a on the substrate 11, an initial first metal material layer 14b is deposited, and then the initial first metal material layer 14b and the first electrode material 12a are patterned layer by layer to form a plurality of first electrodes 12 arranged at intervals and a first metal material layer 14a correspondingly covering the first electrodes 12. After forming the pixel definition layer 13, part of the pixel definition layer 13 is filled between the first metal material layers 14a and between the first electrodes 12, and the pixel definition hole 131 exposes part of the top surface of the first metal material layer 14a on the first electrode 12. The partition structure 15 is formed on the pixel definition layer 13, and the bottom surface of the insulator 151 is connected to the pixel definition layer 13.

[0120] In this embodiment, step S60 of etching the first metal material layer 14 a to form the first metal layer 14 includes: etching away the first metal material layer 14 a in the pixel definition hole 131 and etching away the first metal material layer 14 a between the first electrode 12 and the pixel definition layer 13 to form the first metal layer 14 .

[0121] This is beneficial to reducing the etching time of the first metal material layer 14a, reducing the contact time between the surface of the first electrode 12 and the first etching solution, and can further reduce the etching damage on the surface of the first electrode 12, thereby ensuring the structural integrity of the first electrode 12 and avoiding damage to the first electrode 12 that causes dark spots on the screen and other display problems.

[0122] In one embodiment, referring to Figure 2-Figure 6 , after forming the pixel definition layer 13, a first metal layer material layer 14a is formed, and the first metal material layer 14a is formed between the insulator 151 and the pixel definition layer 13; that is, step S40 is performed after step S30, and after forming the pixel definition layer 13, the first metal material layer 14a is deposited to form the first metal material layer 14a, and the first metal material layer 14a covers the top surface of the pixel definition layer 13 and the top surface of the first electrode 12 exposed by the pixel definition hole 131, the partition structure 15 is formed on the first metal material layer 14a, and the bottom surface of the insulator 151 is connected to the first metal material layer 14a.

[0123] In this embodiment, step S60 etches the first metal material layer 14a to form the first metal layer 14, including: etching and removing the first metal material layer 14a in the pixel defining hole 131, the first metal material layer 14a under the insulator 151 forms the first metal layer 14, and the orthographic outer contour of the first metal layer 14 on the substrate 11 is located outside the orthographic outer contour of the insulator 151 on the substrate 11.

[0124] The cross-sectional shape formed by the first metal layer 14 , the insulator 151 and the blocking portion 152 is similar to an I-shape, which is beneficial for connecting the second electrode first metal layer 14 of the light-emitting unit with the partition structure 15 .

[0125] In this way, the first metal layer 14 contacts the bottom surface of the insulator 151 , which is beneficial to reducing the overall resistance of the partition structure 15 , improving the conductivity of the partition structure 15 , and reducing the power consumption of the display panel 10 .

[0126] Based on the same inventive concept, an embodiment of the present application provides a display panel 10 , which may include a rigid display panel 10 having only a display function, or may include a rigid display panel 10 having a touch function.

[0127] Reference Figure 6 or Fig.12 As shown, the display panel 10 includes a substrate 11, a first electrode 12, a pixel definition layer 13, a partition structure 15 and a first metal layer 14. The substrate 11 can be rigid glass or a thin metal sheet, etc. The present application embodiment will not discuss other materials of the substrate 11 in detail, and those skilled in the art can select different types of materials according to actual needs. The first electrode 12 is disposed on one side of the substrate 11; the pixel definition layer 13 is disposed on a side of the first electrode 12 away from the substrate 11, the pixel definition layer 13 has a pixel definition hole 131 corresponding to the first electrode 12, and the pixel definition hole 131 exposes the first electrode 12, wherein a plurality of first electrodes 12 are disposed on the substrate 11, the plurality of first electrodes 12 are arranged at intervals, the pixel definition layer 13 has a plurality of pixel definition holes 131 corresponding to the plurality of first electrodes 12, the pixel definition holes 131 penetrate the pixel definition layer 13 and expose the corresponding first electrodes 12; the partition structure 15 is disposed on a side of the pixel definition layer 13 away from the first electrode 12; the first metal layer 14 is disposed between the partition structure 15 and the first electrode 12, and the first metal layer 14 and the first electrode 12 include materials with different etching rates. The first metal layer 14 is disposed between the partition structure 15 and the pixel definition layer 13, or the first metal layer 14 can be disposed between the pixel definition layer 13 and the first electrode 12.

[0128] In the above-mentioned display panel 10, a first metal layer 14 is arranged between the partition structure 15 and the first electrode 12. On the one hand, the material layer used to form the first metal layer 14 protects the first electrode 12 during the process of forming the partition structure 15 to avoid the etching step of forming the partition structure 15 from damaging the first electrode 12 exposed by the pixel definition hole 131; on the other hand, since the first metal layer 14 and the first electrode 12 include materials with different etching rates, after the partition structure 15 is formed, the first metal layer 14 can be selectively etched by an etching solution to expose the surface of the first electrode 12, which can avoid damaging the first electrode 12 during the process of forming the first metal layer 14, ensure that the structure of the first electrode 12 is intact and free of etching damage, and avoid damage to the first electrode 12 causing dark spots on the screen and other display problems, which is beneficial to improving the display effect of the display panel 10.

[0129] In one embodiment, referring to Figure 6 or Fig.12 As shown, the first electrode 12 has a higher etching resistance to the first etching solution than the first metal layer 14. Thus, the first electrode 12 has a high etching resistance to the first etching solution, and the first metal layer 14 is etched with the first etching solution to avoid the first etching solution damaging the first electrode 12, thereby ensuring the surface of the first electrode 12 is intact and free of etching damage.

[0130] The first etching solution has a high etching rate for the first metal layer 14 , and the first etching solution has a low etching rate for the first electrode 12 .

[0131] Preferably, the etching rate of the first etching solution on the first electrode 12 is zero.

[0132] Preferably, the first etching solution includes tetramethylammonium hydroxide; the material of the first electrode 12 includes a transparent metal oxide; and the material of the first metal layer 14 includes metal aluminum.

[0133] In one example, the first electrode 12 includes a single layer of transparent metal oxide layer, such as an indium tin oxide layer. In another example, not shown in the drawings of this example, the first electrode 12 includes a multilayer structure, and the top layer of the first electrode 12 is a transparent metal oxide, for example, the first electrode 12 includes an indium tin oxide layer, a metal silver layer, and an indium tin oxide layer stacked in sequence.

[0134] In this way, the top surface of the first electrode 12 is completely undamaged during the process of etching to form the first metal layer 14, thereby ensuring the structural integrity of the first electrode 12 and preventing the first electrode 12 from being damaged and causing dark spots on the screen and other display problems.

[0135] In one embodiment, referring to Figure 6 or Fig.12 As shown, the partition structure 15 includes an isolator 151 and a blocking portion 152 stacked in sequence, and at least a portion of the orthographic projection outer contour of the blocking portion 152 on the substrate 11 is located outside the orthographic projection outer contour of the isolator 151 on the substrate 11. In this way, in the etching step of forming the partition structure 15, the surface of the first electrode 12 is protected by the material layer of the first metal layer 14, so as to avoid damage to the first electrode 12 during the process of forming the partition structure 15. At the same time, the partition structure 15 can isolate the light-emitting material of the light-emitting unit.

[0136] In one embodiment, the material of the spacer 151 includes at least one of metal copper or metal molybdenum. In this way, the light-emitting unit can be electrically connected to the spacer 151 through the second electrode, so that the wiring arrangement of the display panel 10 is more optimized.

[0137] In one embodiment, the material of the blocking portion 152 includes a conductive material or an insulating material.

[0138] Preferably, the material of the barrier 152 includes at least one of metal titanium, titanium nitride, silicon nitride, silicon carbide or silicon oxynitride. For example, the material of the barrier 152 includes metal titanium. In this way, by providing a stacked metal layer, the resistance of the partition structure 15 can be reduced, thereby reducing the power consumption of the display panel 10.

[0139] In one example, the barrier 152 includes a metal titanium layer and a titanium nitride layer stacked in sequence; in another embodiment, the barrier 152 includes a titanium nitride layer and a silicon nitride layer stacked in sequence; in yet another embodiment, the barrier 152 includes a silicon nitride layer and a silicon oxynitride layer stacked in sequence.

[0140] In one embodiment, the material of the pixel definition layer 13 includes at least one of silicon nitride or silicon carbide.

[0141] In one embodiment, referring to Fig.12 As shown, the first metal layer 14 is located between the pixel definition layer 13 and the first electrode 12, the outer contour of a portion of the orthographic projection of the first metal layer 14 on the substrate 11 overlaps with the outer contour of a portion of the orthographic projection of the first electrode 12 on the substrate 11, and the outer contour of another portion of the orthographic projection of the first metal layer 14 on the substrate 11 is located within the orthographic projection of the first electrode 12 on the substrate 11. In this way, it is helpful to reduce the contact time between the surface of the first electrode 12 and the etching solution during the etching process of the first metal layer 14, and avoid damage to the first electrode 12, resulting in dark spots on the screen and other display problems.

[0142] In some other embodiments, the orthographic projection outer contour of the first metal layer 14 on the substrate 11 may not overlap with a portion of the orthographic projection outer contour of the first electrode 12 on the substrate 11 .

[0143] In one embodiment, referring to Figure 6 As shown, the first metal layer 14 is located between the insulator 151 and the pixel definition layer 13 , and the orthographic projection outer contour of the first metal layer 14 on the substrate 151 is located outside the orthographic projection outer contour of the insulator 51 on the substrate 11 .

[0144] In this way, the first metal layer 14 contacts the bottom surface of the insulator 151, which is beneficial to reducing the overall resistance of the partition structure 15, improving the conductivity of the partition structure 15, and reducing the power consumption of the display panel 10; at the same time, the cross-sectional shape jointly formed by the first metal layer 14, the insulator 151 and the blocking portion 152 is similar to an I-shape, which is beneficial to the connection between the second electrode first metal layer 14 of the light-emitting unit and the partition structure 15.

[0145] In a third aspect, the present disclosure provides a display device, including a display panel 10 manufactured by the manufacturing method of the display panel 10 in the first aspect, or including a display panel 10 in the second aspect.

[0146] In the above-mentioned display device, a first metal layer 14 is arranged between the partition structure 15 and the first electrode 12. On the one hand, the material layer used to form the first metal layer 14 protects the first electrode 12 during the process of forming the partition structure 15, so as to avoid the etching step of forming the partition structure 15 from damaging the first electrode 12 exposed by the pixel definition hole 131, and avoid the etching process of forming the partition structure 15 from damaging the surface of the first electrode 12; on the other hand, after the partition structure 15 is formed, the first metal layer 14 is etched to expose the surface of the first electrode 12 through the pixel definition hole 131, which can avoid the process of forming the first metal layer 14 from damaging the first electrode 12, ensure that the structure of the first electrode 12 is intact and free of etching damage, and avoid damage to the first electrode 12 causing dark spots on the screen and other display problems, which is beneficial to improving the display effect of the display panel 10.

[0147] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0148] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A method for manufacturing a display panel, characterized in that: The following steps are involved: providing a substrate; forming a first electrode on the substrate; forming a pixel definition layer and a pixel definition hole penetrating the pixel definition layer on a side of the first electrode away from the substrate, so that a portion of the first electrode is exposed from the corresponding pixel definition hole; forming a first metal material layer, so that a portion of the first metal material layer covers the first electrode exposed from the pixel definition hole, and the first metal material layer and the first electrode include materials with different etching rates; forming a partition structure on a side of the pixel definition layer away from the first electrode; The first metal material layer is etched to form a first metal layer, so that the first electrode is exposed from the corresponding pixel definition hole.

2. The method for manufacturing a display panel according to claim 1, characterized in that: Etching the first metal material layer to form a first metal layer includes: The first metal material layer is etched using a first etching solution, wherein the etching resistance of the first electrode to the first etching solution is greater than the etching resistance of the first metal material layer to the first etching solution; The first etching solution has a high etching rate for the first metal material layer, and the first etching solution has a low etching rate for the first electrode; Preferably, the etching rate of the first etching solution on the first electrode is zero; Preferably, the first etching solution includes tetramethylammonium hydroxide; the material of the first electrode includes transparent metal oxide; and the material of the first metal material layer includes metal aluminum.

3. The method for manufacturing a display panel according to claim 1, wherein: A partition structure is formed on a side of the pixel definition layer away from the first electrode, comprising: forming a conductive material layer and a barrier material layer in sequence on a side of the pixel definition layer away from the substrate; Patterning the barrier material layer to form a barrier portion and making the orthographic projection of the barrier portion on the substrate fall within the orthographic projection of the pixel definition layer on the substrate; The conductive material layer in the pixel definition hole is removed by etching according to the blocking portion to form an isolator, wherein at least a portion of the orthographic projection outer contour of the blocking portion on the substrate is located at the periphery of the orthographic projection outer contour of the isolator on the substrate; Preferably, the material of the separator includes at least one of metal copper or metal molybdenum; Preferably, the material of the blocking portion includes a conductive material or an insulating material; Preferably, the material of the barrier portion includes at least one of metallic titanium, titanium nitride, silicon nitride, silicon carbide or silicon oxynitride; Preferably, the material of the pixel definition layer includes at least one of silicon nitride or silicon carbide.

4. The method for manufacturing a display panel according to claim 3, characterized in that: Before forming the pixel definition layer, the first metal material layer is formed, the first metal material layer covers the top surface of the first electrode, and the orthographic projection of the first metal material layer on the substrate coincides with the orthographic projection of the first electrode on the substrate; Etching the first metal material layer to form a first metal layer includes: The first metal material layer in the pixel definition hole is removed by etching, and the first metal material layer between the first electrode and the pixel definition layer forms the first metal layer.

5. The method for manufacturing a display panel according to claim 3, characterized in that: forming the first metal material layer after forming the pixel definition layer, wherein the first metal material layer is formed between the conductive layer and the pixel definition layer; Etching the first metal material layer to form a first metal layer includes: The first metal material layer in the pixel definition hole is removed by etching, and the first metal material layer below the insulator forms the first metal layer, and the orthographic projection outer contour of the first metal layer on the substrate is located outside the orthographic projection outer contour of the insulator on the substrate.

6. A display panel, characterized in that: include: substrate; A first electrode is disposed on one side of the substrate; A pixel definition layer, disposed on a side of the first electrode away from the substrate, the pixel definition layer having a pixel definition hole corresponding to the first electrode, the pixel definition hole penetrating the pixel definition layer and exposing the corresponding first electrode; A partition structure, disposed on a side of the pixel definition layer away from the first electrode; The first metal layer is disposed between the partition structure and the first electrode, and the first metal layer and the first electrode include materials with different etching rates.

7. The display panel according to claim 6, characterized in that: The first electrode has a higher etching resistance to the first etching solution than the first metal layer has a higher etching resistance to the first etching solution; The first etching solution has a high etching rate for the first metal layer, and the first etching solution has a low etching rate for the first electrode; Preferably, the etching rate of the first etching solution on the first electrode is zero; Preferably, the first etching solution includes tetramethylammonium hydroxide; the material of the first electrode includes transparent metal oxide; and the material of the first metal layer includes metal aluminum.

8. The display panel according to claim 6 or 7, characterized in that: The partition structure comprises an isolating body and a blocking portion stacked in sequence, wherein at least a portion of an orthographic projection outer contour of the blocking portion on the substrate is located at the periphery of an orthographic projection outer contour of the isolating body on the substrate; Preferably, the material of the separator includes at least one of metal copper or metal molybdenum; Preferably, the material of the blocking portion includes a conductive material or an insulating material; Preferably, the material of the barrier portion includes at least one of metallic titanium, titanium nitride, silicon nitride, silicon carbide or silicon oxynitride; Preferably, the material of the pixel definition layer includes at least one of silicon nitride or silicon carbide.

9. The display panel according to claim 8, characterized in that: The first metal layer is located between the pixel definition layer and the first electrode, a partial orthographic projection outer contour of the first metal layer on the substrate overlaps with a partial orthographic projection outer contour of the first electrode on the substrate, and another partial orthographic projection outer contour of the first metal layer on the substrate is located within the orthographic projection of the first electrode on the substrate.

10. The display panel according to claim 8, characterized in that: The first metal layer is located between the insulator and the pixel definition layer, and the orthographic projection outer contour of the first metal layer on the substrate is located at the periphery of the orthographic projection outer contour of the insulator on the substrate.

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