Cutting fluid circulation system, wire cutting device and control method

Abstract

The invention provides a cutting fluid circulating system, a wire cutting device and a control method.The cutting fluid circulating system comprises a fluid collecting device, a fluid supplying device, a second filtering device, a heat exchanger and a spraying device which are connected with one another, and the fluid outlet end of the fluid collecting device is connected with an inlet of the second filtering device through a first fluid supplying pump; an outlet of the second filtering device is connected with an inlet of the spraying device to form a cutting fluid circulating system; the liquid supply device is connected to the liquid conveying pipeline of the liquid collecting device and the second filtering device in parallel, and the liquid supply pump is connected with the corresponding liquid collecting device and the second filtering device, so that the liquid supply device only provides new cutting liquid and does not participate in circulation of the cutting liquid, and the cutting liquid can be prevented from polluting the liquid supply device; according to the cutting fluid sequential system, the cleaning and pollution discharge processes of the fluid supply device after cutting is completed each time are omitted, the fluid supply efficiency and quality of the cutting fluid sequential system are guaranteed while the fluid replacement time is saved, continuous cutting of the wire cutting device can be achieved, and therefore the production efficiency of the wire cutting device is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of wire cutting equipment, and in particular to a cutting fluid circulation system, a wire cutting device and a control method for the cutting fluid circulation system. Background Art

[0002] Wire cutting equipment refers to equipment that achieves cutting (such as truncation, squaring, slicing, etc.) of the workpiece being cut (such as photovoltaic silicon, sapphire, semiconductors, silicon carbide, magnetic materials, etc.) by generating relative movement between the cutting wire and the workpiece being cut (such as photovoltaic silicon, sapphire, semiconductors, silicon carbide, magnetic materials, etc.). Taking the example of a slicer cutting silicon rods, during wire cutting, the silicon rods being cut are fixed on a feed mechanism, and the feed mechanism drives the silicon rods to move relative to the cutting wire net to achieve slicing. During the cutting process, in order to ensure the cutting performance of the cutting wire, it is necessary to continuously spray cutting fluid onto the cutting wire net. The first is to cool the cutting wire, the second is to disperse and rinse the silicon powder after cutting, and the third is to lubricate the cutting wire net. Figure 1 As shown, the cutting liquid circulation system in the prior art includes a liquid collecting device 2, a liquid supply device 3 (a liquid supply cylinder in the prior art), a liquid supply pump and a second filter device 4, etc., which are connected through a liquid supply pipeline to realize the circulation supply of cutting liquid during the cutting process (the liquid collecting device and other devices in the figure are connected through a return pipeline, and control valves are respectively provided on the return pipelines, and their purpose is only to empty the cutting liquid remaining in other devices when the cutting liquid circulation system stops working).

[0003] However, the silicon powder generated during the cutting process continuously enters the cutting fluid, causing the silicon powder content in the cutting fluid to gradually increase. The cutting fluid containing silicon powder enters the liquid supply cylinder, and then enters the second filter device through the liquid supply pump to filter out impurities in the cutting fluid for spraying. It should be noted that the silicon powder will not be filtered out in the second filter device, so as the cutting operation proceeds, the silicon powder content in the cutting fluid gradually increases. The silicon powder in the cutting fluid will reduce the lubrication and cooling effect of the cutting fluid, increase the probability of wire jump and wire breakage, and thus affect the cutting quality. At the same time, during the entire process, silicon powder and other substances will precipitate and accumulate on the inner wall of the liquid supply cylinder, so after each cutting is completed or regularly, the liquid supply cylinder needs to be specially drained and cleaned, and then new cutting fluid is introduced for the next cutting supply; silicon powder will also be deposited on the inner wall of the pipeline of the cutting liquid circulation system, which needs to be cleaned regularly. The above-mentioned drainage and cleaning process takes a long time, and the online cutting device needs to be shut down and wait for operation during this time, which reduces the working efficiency of the equipment.

[0004] In summary, a new cutting fluid circulation system is urgently needed to solve the problems existing in the prior art. Summary of the invention

[0005] In response to the above technical problems, the technical solution of the present invention provides a cutting fluid circulation system and a control method, which is conducive to adjusting the content of silicon powder in the cutting fluid of the cutting fluid circulation system during the cutting process, saving the step of cleaning the liquid supply cylinder, and improving the cutting quality and cutting efficiency.

[0006] The present invention provides a cutting liquid circulation system, comprising a liquid collecting device and a spraying device, wherein the liquid collecting device comprises a liquid collecting end and a liquid outlet end, wherein the liquid collecting end is used to collect the cutting liquid after spraying, and the liquid outlet end is connected to the spraying device to allow the cutting liquid to circulate; a new liquid interface for filling new cutting liquid is provided between the liquid collecting device and the spraying device.

[0007] A further optimization of the technical solution of the present invention further includes a liquid supply device, which is connected to the new liquid interface.

[0008] In a further optimization of the technical solution of the present invention, a control valve is provided between the liquid supply device and the new liquid interface.

[0009] In a further optimization of the technical solution of the present invention, the liquid supply device is a liquid supply cylinder or a centralized liquid supply system.

[0010] A further optimization of the technical solution of the present invention further includes a drain port for discharging old cutting fluid, and the drain port is located upstream of the new liquid interface.

[0011] According to a further optimization of the technical solution of the present invention, the liquid collecting device comprises a liquid collecting tank and a first filtering device, the first filtering device is arranged on the outlet of the liquid collecting tank, and the liquid discharge port is arranged in the liquid collecting tank.

[0012] According to a further optimization of the technical solution of the present invention, the liquid collecting device further comprises an overflow valve, and the overflow valve is arranged on the liquid discharge port.

[0013] According to a further optimization of the technical solution of the present invention, the liquid collecting device further comprises a funnel cylinder, the funnel cylinder is connected to the liquid collecting pool and is arranged below the liquid collecting pool.

[0014] According to a further optimization of the technical solution of the present invention, the new liquid interface is arranged on the funnel cylinder, and the control valve between the liquid supply device and the funnel cylinder is a one-way valve.

[0015] A further optimization of the technical solution of the present invention further includes an initial liquid inlet, which is arranged between the funnel cylinder and the spray device, and the initial liquid inlet is connected to the liquid supply device through a liquid supply branch.

[0016] A further optimization of the technical solution of the present invention further includes a rotating cleaning device, which is connected in parallel to the infusion pipeline corresponding to the spray device.

[0017] According to a further optimization of the technical solution of the present invention, a second filtering device and a heat exchanger are sequentially connected between the liquid collecting device and the spraying device through a liquid infusion pipeline, and the new liquid interface is located upstream of the heat exchanger.

[0018] In a further optimization of the technical solution of the present invention, the new liquid interface is arranged between the second filtering device and the heat exchanger or between the liquid collecting device and the second filtering device.

[0019] According to a further optimization of the technical solution of the present invention, the number of the second filtering devices is two, and the two second filtering devices are respectively located between the liquid collecting device and the heat exchanger and between the heat exchanger and the spraying device.

[0020] In a further optimization of the technical solution of the present invention, a main flow meter is provided between the heat exchanger and the spray device; and a secondary flow meter is provided on the liquid supply branch connected to the new liquid interface.

[0021] In a further optimization of the technical solution of the present invention, a density meter is provided between the main flow meter and the spray device, and the density meter is used to detect the density of the cutting fluid.

[0022] A wire cutting device comprises the cutting fluid circulation system described above.

[0023] According to a further optimization of the technical solution of the present invention, the wire cutting device comprises a cutting chamber, the spray device is arranged in the cutting chamber, and the liquid collecting device is arranged at the bottom of the cutting chamber.

[0024] The technical solution of the present invention is further optimized. The wire cutting device includes a cutting roller, and the spraying device includes a left spraying unit and a right spraying unit. The controller of the cutting liquid circulation system controls the corresponding spraying device to spray in accordance with the direction of rotation of the wire cutting roller by detecting the direction of rotation of the wire cutting roller.

[0025] According to a further optimization of the technical solution of the present invention, the wire cutting device is a slicer.

[0026] A method for controlling the cutting fluid circulation system as described above comprises the following steps:

[0027] S1, initial state, charging new cutting fluid into the cutting fluid circulation system;

[0028] S2. When the cutting fluid is full, stop adding new cutting fluid and start the cutting fluid circulation system;

[0029] S3. Control the charging of new cutting fluid according to the cutting progress;

[0030] S4. After the workpiece is cut, close the cutting fluid circulation system.

[0031] Further optimization of the technical solution of the present invention is as follows: Step S3, the cutting progress is monitored and the charging of new cutting fluid is controlled according to the cutting progress.

[0032] In a further optimization of the technical solution of the present invention, the method for monitoring the cutting progress in step S3 is to set a detection module for the cutting depth of the workpiece, wherein the detection module is used to detect the cutting depth of the workpiece in real time and to fill new cutting fluid according to the cutting depth.

[0033] In a further optimization of the technical solution of the present invention, the method for monitoring the cutting progress in step S3 is to set a time monitoring module, wherein the time monitoring module is used to monitor the cutting time and to fill in new cutting fluid according to the cutting time.

[0034] According to a further optimization of the technical solution of the present invention, the method for monitoring the density of the cutting fluid in step S3 is to set a safe density value or a safe silicon powder concentration value in the controller of the cutting fluid circulation system, and to control the charging of new cutting fluid into the cutting fluid circulation system by comparing the detected real-time density value with the safe density value or converting the density value into a silicon powder concentration value and then comparing it with the safe silicon powder concentration value.

[0035] Further optimization of the technical solution of the present invention, step S4 further includes step S41: when the workpiece cutting is completed, the spray device is turned off, and the rotary cleaning device is turned on, so that the cutting fluid cleans the inner wall of the cutting chamber through the rotary cleaning device.

[0036] Further optimization of the technical solution of the present invention, step S3 further includes step S31: when cutting is abnormal, turn off the spray device, and start step S2 again when cutting returns to normal.

[0037] Further optimization of the technical solution of the present invention is that in step S4, after the workpiece is cut and the knife is retracted, the cutting fluid circulation system is closed.

[0038] Further optimization of the technical solution of the present invention also includes step S5: discharging the old cutting fluid, then filling in new cutting fluid, and opening the cutting fluid circulation system until the knife is retracted.

[0039] Further optimization of the technical solution of the present invention is to set a first liquid supply pump between the funnel cylinder of the liquid collecting device and the spraying device, set a new liquid interface between the funnel cylinder and the first liquid supply pump, and set a control valve between the funnel cylinder and the new liquid interface; the method of filling new cutting liquid in step S1 is: close the control valve between the funnel cylinder and the new liquid interface, open the first liquid supply pump, and fill the cutting liquid circulation system with new cutting liquid.

[0040] Further optimization of the technical solution of the present invention is that the new liquid interface is arranged on the funnel cylinder of the liquid collecting device, and a second liquid supply pump and a one-way valve are arranged on the liquid supply branch between the new liquid interface and the liquid supply device. The method of filling new cutting liquid in step S1 is: open the second liquid supply pump and fill the cutting liquid circulation system with new cutting liquid.

[0041] In a further optimization of the technical solution of the present invention, the new liquid interface is arranged on the funnel cylinder of the liquid collecting device, and an initial liquid inlet is arranged between the funnel cylinder of the liquid collecting device and the spraying device. The method of filling the new cutting liquid in step S1 is as follows: opening the first liquid supply pump, and filling the new cutting liquid into the cutting liquid circulation system through the initial liquid inlet.

[0042] According to a further optimization of the technical solution of the present invention, an overflow valve is provided in the liquid collecting tank of the liquid collecting device, and the method for detecting whether the cutting liquid is full in step S2 is: whether the liquid level of the cutting liquid in the liquid collecting tank reaches the height of the overflow valve outlet.

[0043] Compared with the prior art, the advantages of the technical solution of the present invention are:

[0044] 1. The cutting liquid circulation system of the present application is provided with a new liquid interface, and new cutting liquid is charged into the cutting liquid circulation system through the new liquid interface, which is conducive to adjusting the content of silicon powder in the circulating cutting liquid, so that the content of silicon powder in the circulating cutting liquid is reduced, thereby maintaining a good spraying or flushing effect, which is conducive to improving the cutting quality and cutting efficiency. In addition, the liquid supply device does not participate in the circulation of the cutting liquid, avoiding the cutting liquid containing silicon powder from contaminating the liquid supply device during the cutting process, saving the steps of draining and cleaning the liquid supply device, and is conducive to improving the cutting efficiency.

[0045] 2. In the cutting liquid circulation system of the present application, the liquid supply device only provides new cutting liquid, and an overflow valve is set at the discharge port of the liquid collecting device. When new cutting liquid is filled through the liquid supply device, as the cutting liquid capacity in the cutting liquid circulation system increases, the liquid level of the liquid collecting device increases. When the liquid level is higher than the overflow valve, the old cutting liquid in the liquid collecting device is discharged through the discharge port, which is beneficial to achieve the liquid supply balance of the cutting liquid circulation system. By filling in new cutting liquid and discharging old cutting liquid, it is beneficial to adjust and control the content of silicon powder in the circulating cutting liquid, thereby maintaining the content of silicon powder in the cutting liquid circulation system within a reasonable range, reducing the risk of wire jump or wire breakage caused by excessive silicon powder content in the cutting liquid, and reducing the risk of scratches on the cutting surface, which is beneficial to improving cutting quality and cutting efficiency. In addition, the wire cutting device using the cutting liquid circulation system of the present application saves the installation space of the liquid supply device, thereby reducing the space occupied by the wire cutting device.

[0046] 3. The cutting liquid circulation system of the present application can control the left spray unit and the right spray unit respectively according to the running direction of the cutting wire network, so that during the spraying process, the spraying direction of the cutting liquid is the same as the running direction of the cutting wire network, that is, the spraying is maintained in the direction of the cutting liquid, which is beneficial to reduce the problem of cutting liquid splashing during the cutting process, improve the working environment in the cutting room, and further reduce the risk of wire breakage or wire jumping caused by liquid splashing, back splashing, etc.

[0047] 4. The cutting fluid circulation system of the present application can renew the cutting fluid during the cutting process, which is beneficial for maintaining good lubrication and cooling properties of the cutting fluid; in addition, after the cutting is completed, the cutting fluid circulation system of the present application can selectively use new cutting fluid to clean the cutting chamber, which has better cleaning effect, is more convenient to use, and has higher work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] Hereinafter, the present invention will be described in more detail based on embodiments and with reference to the accompanying drawings.

[0049] Figure 1 It is a structural schematic diagram of a cutting fluid circulation system in the prior art;

[0050] Figure 2 It is a schematic diagram of the structure in which a new liquid interface is arranged on a funnel cylinder in the cutting liquid circulation system of the present invention;

[0051] Figure 3 It is a structural schematic diagram of a cutting liquid circulation system of the present invention in which a new liquid interface is arranged between a funnel cylinder and a first liquid supply pump;

[0052] Figure 4 It is a structural schematic diagram of a cutting liquid circulation system of the present invention in which a new liquid interface is arranged on a funnel cylinder and an initial liquid inlet is arranged at the same time;

[0053] Figure 5 It is a schematic diagram of spray control of the spray device in the cutting liquid circulation system of the present invention under different rotation directions of the cutting roller.

[0054] In the drawings, the same reference numerals are used for the same components. The drawings are not drawn to scale.

[0055] Description of labels:

[0056] 1- spray device; 11- left spray unit; 12- right spray unit; 13- cutting roller; 14- cutting wire net; 2- liquid collecting device; 21- first filtering device; 22- overflow valve; 23- funnel cylinder; 24- collecting tank; 3- liquid supply device; 31- liquid supply branch; 32- initial liquid inlet; 4- second filtering device; 5- heat exchanger; 6- trench; 61- reflux pipeline; 71- first liquid supply pump; 72- second liquid supply pump; 8- flow meter; 81- main flow meter; 82- secondary flow meter; 9- rotating cleaning device. DETAILED DESCRIPTION

[0057] The following is a description of the implementation of the present invention by specific embodiments. People familiar with the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0058] The terms used in the embodiments of the present invention are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. The singular forms "a", "said" and "the" used in the embodiments of the present invention and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings, and "multiple" generally includes at least two, but does not exclude the inclusion of at least one.

[0059] It should also be noted that the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a product or system including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such product or system. In the absence of further restrictions, the elements defined by the sentence "including one..." do not exclude the existence of other identical elements in the product or system including the elements. In the description of the present invention, it should be understood that the terms "upper", "lower", "bottom", "top", "front", "back", "inside", "outside", "left", "right" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0060] The following will be combined with the attached Figure 1-5 The present invention is further described.

[0061] In the field of wire cutting technology, taking photovoltaic silicon rod cutting as an example, a wire cutting device is usually used in the process of processing silicon rods. Since the high-speed cutting wire will generate a lot of heat when cutting silicon rods, it will also generate cutting powder (silicon powder). In order to ensure the working performance of the cutting wire, cutting fluid is usually sprayed on the cutting wire net. The purpose is to lubricate and cool the cutting wire, silicon rod and other mechanisms; second, it can wash away the silicon powder generated in the cutting process. Therefore, when the online cutting device is working, as the cutting time increases, the content of silicon powder in the circulating cutting fluid will continue to increase. Because the filtering device cannot filter out the silicon powder, the increase in the silicon powder content in the cutting fluid will inevitably reduce the lubrication and cooling effects, thereby increasing the probability of wire jumpers and breakages, and aggravating the cutting line marks on the cutting surface, reducing the cutting quality and cutting efficiency. At the same time, due to the cutting fluid circulation system in the prior art, such as Figure 1 As shown, the liquid supply device 3 (specifically, the liquid supply cylinder) participates in the entire cutting liquid circulation system and provides a transfer function for the cutting liquid (i.e., after the spraying is completed, the cutting liquid containing silicon powder is collected and first enters the liquid supply cylinder, and then is transported to the spraying device again after transfer and storage in the liquid supply cylinder). As a result, silicon powder and other impurities will adhere to the inner wall of the liquid supply cylinder. Therefore, the cutting liquid in the liquid supply cylinder needs to be discharged regularly and the liquid supply cylinder needs to be cleaned, which is time-consuming and labor-intensive. At the same time, the wire cutting device is in standby mode during the process, which reduces work efficiency.

[0062] In response to the problems existing in the prior art, the technical solution of the present application provides a cutting liquid circulation system, including a spraying device for providing cutting liquid to the cutting area (the spraying device can spray cutting liquid to the cutting area, or during immersion cutting, the spraying device can fill cutting liquid into a fragment box containing cutting liquid. Spraying cutting liquid or filling cutting liquid into a fragment box containing cutting liquid both fall within the protection scope of the present application), and a liquid collecting device for collecting the cutting liquid after it acts on the cutting area. The liquid collecting device is connected to the spraying device so that the cutting liquid circulates in the cutting liquid circulation system; a new liquid interface for filling new cutting liquid into the cutting liquid circulation system is provided between the liquid collecting device and the spraying device, and new cutting liquid can be filled in during the process of spraying the cutting area to adjust or control the content of silicon powder in the cutting liquid circulation system, so that the silicon powder content is kept within a reasonable range, thereby improving the cutting quality. The cutting liquid circulation system of the present application can be selectively connected to a second filter device 4 and a heat exchanger, etc. In this embodiment, it is described as being connected to a second filter device 4 and a heat exchanger. When applied to a specific wire slicer, the cutting liquid sprayed by the spray device is collected at the liquid collecting end of the liquid collecting device (the liquid collecting end of the liquid collecting device 2 is the end where the cutting liquid flows in, and the liquid outlet is the end where the liquid collecting device 2 is connected to the downstream device as a whole); the liquid outlet of the liquid collecting device 2 is connected to the inlet of the second filter device 4 through a first liquid supply pump (for the convenience of expression, the liquid supply pump is defined as the first liquid supply pump, and the liquid supply pump on the liquid supply branch pipe 31 is defined as the second liquid supply pump hereinafter) 71, and the outlet of the second filter device 4 is connected to the inlet of the spray device 1 through a heat exchanger, thereby forming a closed-loop circulation system for the cutting liquid.

[0063] In one embodiment, the new liquid interface of the cutting liquid circulation system of the present application is connected to the liquid supply device 3, preferably, as Figure 3 The new liquid interface shown is arranged between the liquid collecting device 2 and the first liquid supply pump 71, and a control valve is arranged on the liquid supply branch pipe 31 between the liquid supply device 3 and the new liquid interface. By adjusting the valve, the liquid supply device 3 can be controlled to provide new cutting liquid to the cutting liquid circulation system.

[0064] In order to further improve the filtering effect of the cutting fluid circulation system, two second filtering devices 4 are provided in the cutting fluid circulation system of the present application, wherein one second filtering device 4 is connected between the liquid collecting device and the heat exchanger, and the other second filtering device 4 is connected between the heat exchanger 5 and the spray device 1, thereby performing double filtering on the circulating cutting fluid to prevent large particles of impurities from entering the spray device, thereby avoiding the risk of cutting line breakage or line jumping caused by large particles of impurities.

[0065] The cutting fluid circulation system of the present application is also provided with a drain port for discharging old cutting fluid, which is beneficial to the supply balance of the cutting fluid in the cutting fluid circulation system. While new cutting fluid is filled through the new liquid interface, the old cutting fluid can be discharged through the drain port, thereby reducing the silicon powder content of the cutting fluid in the cutting fluid circulation system and achieving the purpose of regulating the silicon powder content in the cutting fluid circulation system.

[0066] Preferably, the drain port is located upstream of the new liquid interface (the upstream described in the present technical solution is determined according to the flow direction of the cutting liquid in the infusion pipeline. For example, if the cutting liquid flows from the liquid collecting device to the second filter device 4, then the position of the liquid collecting device is upstream of the second filter device 4), so that the newly injected cutting liquid will not be discharged directly.

[0067] The liquid supply device 3 in the technical solution of the present application is a liquid supply cylinder or a centralized liquid supply system, etc. Preferably, a corresponding second liquid supply pump 72 is provided on the liquid supply branch pipe 31 to control the liquid supply flow rate of the new cutting liquid; this design can also reduce the volume of the wire cutting device, because the volume of the liquid supply cylinder in the prior art is relatively large and is generally provided at the bottom of the wire cutting device, and the wire cutting device needs to reserve space for the liquid supply cylinder. However, the present technical solution only needs to provide a new liquid interface on the wire cutting device, and there is no need to provide a storage space for the liquid supply cylinder, thereby reducing the volume of the entire wire cutting device.

[0068] The liquid collecting device 2 provided in the present application includes a liquid collecting pool 24, an overflow valve 22 and a first filter device 21. The first filter device 21 is arranged at the outlet of the liquid collecting pool 24 and can preliminarily filter the impurities or foreign matter in the cutting liquid. The overflow valve 22 is arranged in the liquid collecting pool 24, and the overflow valve 22 is connected to the drain port and further connected to the outside of the cutting liquid circulation system, preferably, connected to the ditch 6. In an alternative embodiment, the drain port can be directly arranged in the liquid collecting pool 24, and the overflow valve can be installed on the drain port, so that the overflow valve 22 is higher than the bottom surface of the liquid collecting pool 24, and the cutting liquid containing silicon powder after spraying can be discharged only when the liquid level in the liquid collecting pool 24 rises to the height of the overflow valve. Specifically, when the liquid supply device 3 introduces new cutting liquid into the cutting liquid circulation system, since the cutting liquid capacity in the cutting liquid circulation system is fixed, the volume of cutting liquid participating in the circulation in the cutting liquid circulation system will increase, thereby raising the cutting liquid level in the liquid collecting tank 24, and the cutting liquid containing silicon powder will directly flow through the overflow valve 22 to the drain pipe of the drain port and then be discharged from the cutting liquid circulation system, thereby realizing the replacement of the old and new cutting liquids and the adjustment of the silicon powder content in the cutting liquid, which is beneficial to improving the spraying quality of the cutting liquid.

[0069] Preferably, when the drain port is directly arranged in the liquid collecting tank 24, a control switch is provided on the sewage pipe of the drain port. When new cutting fluid is charged into the cutting fluid circulation system, the control switch is opened at the same time to discharge the old cutting fluid containing silicon powder, optionally, into the ditch 6.

[0070] Preferably, a funnel cylinder 23 is provided at the lower part of the liquid collecting device 2, and the inlet end of the funnel cylinder 23 is connected to the liquid collecting pool 24, and the outlet end is connected to the second filtering device 4 (when the liquid collecting device 2 is provided with a funnel cylinder 23, the outlet end of the funnel cylinder 23 is the liquid outlet end of the liquid collecting device). The funnel cylinder 23 is beneficial to improving the stability of the supply of cutting liquid to the second filtering device 4 in the cutting liquid circulation system. At the same time, by changing the number or volume of the funnel cylinders 23, the overall volume of the cutting liquid circulation system can be adjusted.

[0071] In another embodiment, if Figure 2 As shown, the new liquid interface is arranged on the funnel cylinder 23, the liquid supply device 3 filled with new cutting liquid is connected to the funnel cylinder 23, and a second liquid supply pump 72 is arranged on the pipeline between the liquid supply device 3 and the funnel cylinder 23, and a one-way valve is arranged between the second liquid supply pump 72 and the funnel cylinder 23 (when the liquid supply device 3 is a liquid supply cylinder, the control valve between the liquid supply cylinder and the new liquid interface is set as a one-way valve), which can prevent the cutting liquid in the funnel cylinder from flowing back to the liquid supply cylinder during abnormal shutdown and contaminating the new cutting liquid in the liquid supply device 3. In another preferred embodiment, in order to prevent the charged new cutting liquid from entering the liquid collecting tank 24 and being directly discharged without passing through the spraying device, a one-way valve is also arranged between the funnel cylinder and the liquid collecting tank 24, so that the cutting liquid can only flow from the liquid collecting tank 24 to the funnel cylinder, thereby avoiding the waste of cutting liquid.

[0072] During the cutting process, new cutting liquid is extracted from the liquid supply device 3 by the second liquid supply pump 72, and enters the funnel cylinder 23, and then participates in the cutting liquid circulation. When new cutting liquid is injected into the cutting liquid circulation system, since the volume of the cutting liquid in the connecting pipeline is constant, the liquid level in the liquid collecting tank 24 will rise. When the liquid level is higher than the overflow port height of the overflow valve, the cutting liquid enters the overflow port and is then discharged through the drain port connected to the overflow valve, preferably, discharged into the ditch 6. During the cutting process, as new cutting liquid is continuously added, the old cutting liquid containing silicon powder is continuously discharged, and the silicon powder contained in the old cutting liquid is also discharged together, so that the content of silicon powder in the entire cutting liquid circulation system is reduced, thereby realizing the control and regulation of the content of silicon powder in the cutting liquid, and the control of the silicon powder content can be realized by adjusting the amount of replacement of the new and old cutting liquids.

[0073] In order to facilitate the cleaning and discharge of the cutting liquid in the cutting liquid circulation system in the present technical scheme, the second filter device 4, the heat exchanger 5 and the funnel cylinder 23 are respectively connected to the discharge port through the return pipe 61, and a control valve is provided on the corresponding return pipe 61. When the cutting is completed, the cutting liquid remaining in the cutting liquid circulation system (including the second filter device 4, the heat exchanger 5, the spray device 1 and the cutting liquid remaining in the funnel cylinder 23) can be directly discharged from the system by opening the control valve on the return pipe 61. Preferably, it is discharged into the ditch 6, and then new cutting liquid is filled into it through the liquid supply device 3. The next cutting can be carried out directly, avoiding the operation of draining and cleaning the liquid supply cylinder after use in the prior art, thereby reducing the investment in manpower and material resources and improving the cutting efficiency.

[0074] In a preferred embodiment, the cutting liquid circulation system of the present application is also provided with a rotary cleaning device 9, and the rotary cleaning device 9 is connected in parallel with the spray device 1. The specific connection method is that the rotary cleaning device 9 and the spray device 1 are respectively connected to the upstream heat exchanger through connecting pipes, and control valves are respectively provided on their respective connecting pipes, and the switching between the rotary cleaning device and the spray device is achieved by opening and closing the corresponding control valves. The rotary cleaning device 9 is arranged in the cutting chamber. When the cutting is completed, the spray device is closed, and the rotary cleaning device 9 is opened. The cutting environment is cleaned with the cutting liquid in the cutting liquid circulation system (which can be the circulating cutting liquid or the new cutting liquid filled by the liquid supply device 3). For example, when the cutting liquid circulation system of the present application is applied to a wire cutting machine, the rotary cleaning device 9 can clean the inner wall of the cutting chamber, which is convenient and quick, and is conducive to improving the cleaning efficiency of the cutting chamber.

[0075] By setting a main flow meter 81 between the heat exchanger and the spray device 1, it is convenient to monitor the amount of cutting liquid flowing into the spray device 1. Preferably, a densitometer is set on the main flow meter 81 or between the main flow meter 81 and the spray device 1, which can detect the density of the cutting liquid in the cutting liquid circulation system in real time. By obtaining the density value of the cutting liquid, the concentration of silicon powder in the cutting liquid is calculated using the density formula and the molar concentration formula (specific concentration = (cutting liquid real-time monitoring density value-new cutting liquid density value) / [cutting liquid real-time monitoring density value*(1-new cutting liquid density value / silicon powder density value)]). By setting a fixed safety density value or a safety silicon powder concentration value in the controller of the cutting liquid circulation system (when setting the concentration value, the conversion formula needs to be programmed into the controller, and setting the density value only needs to convert the corresponding safety density value under a certain silicon powder concentration), the amount of new cutting liquid added to the circulating cutting liquid is controlled, so that the cutting liquid circulation system is more intelligent when working, and can use the best performance cutting liquid for spray cutting operations.

[0076] In order to facilitate the control of the amount of new cutting fluid filled into the cutting fluid circulation system, the present technical solution also provides a secondary flow meter 82 in the cutting fluid circulation system. The secondary flow meter 82 is provided on the liquid supply branch 31 between the liquid supply device 3 and the new liquid interface. The secondary flow meter 82 can be used to measure the amount of new cutting fluid added.

[0077] The present application also provides a wire cutting device, including a cutting chamber, a cutting roller and the cutting liquid circulation system described above. During the cutting process of the wire cutting device, the cutting roller 13 of the wire cutting device rotates alternately clockwise and counterclockwise, so that the corresponding cutting wire net 14 moves in a clockwise direction or a counterclockwise direction. When moving in a clockwise direction, the cutting liquid sprayed by the left spray unit 11 will enter the slit of the silicon rod driven by the moving cutting wire net. However, the cutting liquid sprayed by the right spray unit will be carried away by the cutting wire net in a direction away from the cutting joint and cannot act on the cutting position. Moreover, driven by the cutting wire net, the splashing degree of the cutting liquid will be aggravated. The present technical solution controls the spray device 1 upstream of the moving direction of the cutting wire net 14 to work by detecting the rotation direction of the cutting roller 13 or the moving direction of the cutting wire net 14, so as to reduce the splashing degree of the cutting liquid, thereby improving the working environment in the cutting chamber. For example, when the cutting roller 13 rotates clockwise, only the left spray unit 11 is controlled to spray liquid, and when the cutting roller 13 rotates counterclockwise, only the right spray unit 12 is controlled to spray liquid. Figure 5 Schematic diagram of the rotation direction of the cutting roller 13 and the spray control of the spray device. This method of controlling the spraying of the corresponding spray assembly according to the rotation direction of the cutting roller 13 is called trend spraying.

[0078] The control method of the cutting fluid circulation system in the technical solution of the present application comprises the following steps:

[0079] S1, initial state, charging new cutting fluid into the cutting fluid circulation system.

[0080] Open the control valve between the liquid supply device 3 and the new liquid interface to allow the new cutting liquid in the liquid supply device 3 to fill the cutting liquid circulation system. When filling the new cutting liquid, the first liquid supply pump can be used to provide the infusion power, or the second liquid supply pump can be used to provide the infusion power. Specifically, in the first initial liquid filling method, when the new liquid interface is set between the funnel cylinder 23 and the second filter device 4, the control valve between the first liquid supply pump and the funnel cylinder 23 is closed, and the control valve between the first liquid supply pump and the liquid supply device 3 (which can be a liquid supply cylinder or a centralized liquid supply system) is opened, and the new cutting liquid is started to be filled into the cutting liquid circulation system. When it is detected that the liquid level in the liquid collecting tank 24 reaches the height of the overflow valve outlet, the new cutting liquid is stopped. At this time, the cutting liquid circulation system is full of cutting liquid; the second initial liquid filling method is, when the new liquid interface is set on the funnel cylinder, the liquid supply control valve on the second liquid supply pump or the centralized liquid supply system is opened, and the first liquid supply pump can also be opened at the same time (at this time, the first liquid supply pump only provides power for the cutting liquid in the cutting liquid circulation system), and new cutting liquid is provided to the cutting liquid circulation system through the liquid supply device 3 until the liquid level in the liquid collecting tank 24 reaches the height of the overflow valve outlet, then the second liquid supply pump is closed, and the control valve between the funnel cylinder 23 and the liquid supply device 3 is closed to complete the initial liquid filling.

[0081] Another implementation method, such as Figure 4 As shown, the new liquid interface is arranged on the funnel cylinder 23, and an initial liquid inlet 32 ​​is arranged between the funnel cylinder and the first liquid supply pump. The initial liquid inlet 32 ​​is connected to the liquid supply device 3. In the initial state, new cutting liquid is filled into the cutting liquid circulation system through the initial liquid inlet 32 ​​until the liquid level in the liquid collecting tank 24 reaches the height of the overflow valve outlet. The initial liquid inlet 32 ​​is closed to complete the initial liquid filling, and new cutting liquid is injected through the new liquid interface during the cutting process.

[0082] S2. When the cutting fluid is full, stop supplying new cutting fluid and start the cutting fluid circulation system.

[0083] The method for judging whether the cutting liquid is full in this step is as follows: the first method is to detect whether there is liquid flowing out of the overflow valve in the cutting pool, as described in step S1, which will not be repeated here; the second method is to set a liquid level gauge in the funnel cylinder 23, and the liquid level gauge will feedback the liquid level information in real time. When it is detected that the cutting liquid in the funnel cylinder 23 is full, the control valve between the liquid supply device 3 and the new liquid interface is closed to start the cutting liquid circulation system.

[0084] S3. Control the charging of new cutting fluid according to the cutting progress.

[0085] By monitoring the cutting progress and controlling the charging of new cutting fluid in real time according to the cutting progress, the flow rate of the new cutting fluid can be set according to the cutting depth of the silicon rod. For example, when the cutting depth of the silicon rod is less than 10mm, the flow rate is set to 0, that is, no new cutting fluid is charged. As the cutting depth of the silicon rod increases, the content of silicon powder in the cutting fluid of the cutting fluid circulation system will become higher and higher. The flow rate of the new cutting fluid is set to a certain value (the setting value is determined according to the size of the silicon rod, the feed speed and the diameter of the cutting wire used, that is, the flow rate of the new cutting fluid is set according to the flow rate of the silicon powder cut off). The purpose of controlling the silicon powder content in the cutting fluid circulation system is achieved by charging new cutting fluid and discharging the old cutting fluid.

[0086] An alternative technical solution is to set a time monitoring module, which is used to monitor the cutting time and set the flow rate of new cutting fluid according to the cutting time. For example, the time when the wire cutting device starts working is recorded first, and the flow rate is set to 0 in the first 15 minutes of cutting the silicon rod, that is, no new cutting fluid is added. As the cutting time increases, the content of silicon powder in the cutting fluid of the cutting fluid circulation system will become higher and higher. The flow rate of the new cutting fluid is set to a certain value, and the purpose of controlling the content of silicon powder in the cutting fluid circulation system is achieved by filling new cutting fluid and discharging the old cutting fluid.

[0087] S4. After the workpiece is cut, close the cutting fluid circulation system.

[0088] After the cutting is completed, the control valves between the funnel cylinder 23, the second filter device 4, the heat exchanger 5 and the drain port are opened respectively to discharge the remaining cutting fluid in the cutting fluid circulation system into the ditch 6, thereby preventing the silicon powder in the remaining cutting fluid from being deposited.

[0089] In the traditional cutting process, the cutting fluid after spraying will splash when it touches the cutting wire net or silicon rod during the cutting process, so silicon powder, cutting fluid, etc. will also adhere to the inner wall of the cutting chamber, so step S41 is also set, that is, when the workpiece is cut, the control valve of the spray device 1 is closed, and the control valve of the rotating cleaning device 9 is opened, so that the cutting fluid passes through the rotating cleaning device 9 to clean the inner wall of the cutting chamber, wherein the rotating cleaning device is a rotating spray pipe. In this step, the circulating cutting fluid can be used to clean the inner wall of the cutting chamber, or the reflux valve connected to the ditch 6 in the circulating delivery pipeline can be opened before cleaning the cutting chamber to discharge the cutting fluid containing a certain amount of silicon powder, and then the cutting fluid circulation system is filled with new cutting fluid to clean the inner wall of the cutting chamber.

[0090] Since the cutting equipment may be shut down for some reasons during operation, in order to avoid wasting the cutting fluid in the cutting equipment, step S31 is further set on the basis of step S3: when it is detected that the wire cutting device is abnormally shut down, the cutting fluid circulation system is turned off, and step S2 is started again when the wire cutting device returns to normal. Specifically, the rotation information of the cutting roller can be detected by the sensor to determine whether the cutting fluid circulation system needs to be restarted.

[0091] Preferably, the technical solution also includes step S5, that is, when the wire cutting device completes cutting, the control valve on the sewage pipeline corresponding to the discharge port of the liquid collecting device 2 is opened, and the control valve on the return pipeline 61 corresponding to the second filter device 4 is opened, and all the cutting liquid in the cutting liquid circulation system is discharged through the return pipeline 61, and then the cutting liquid circulation system is filled with new cutting liquid. Please refer to step S1 for details, which will not be repeated here. When the wire cutting device performs the retracting process, the spray device is turned on to spray the cutting liquid, which can improve the retracting efficiency and increase the cleanliness of the cut silicon wafers and the cut wire net.

[0092] The control system for circulating spraying of cutting fluid in the present technical solution can be controlled in combination with a control circuit and a controller. Since the technical personnel in this field can implement it when the above control method and control structure are clear, no specific description is given here.

[0093] Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative work should fall within the scope of protection of the present invention.

[0094] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0095] Although the present invention has been described with reference to preferred embodiments, various modifications may be made thereto and parts thereof may be replaced by equivalents without departing from the scope of the present invention. In particular, the various technical features mentioned in the various embodiments may be combined in any manner as long as there are no structural conflicts. The present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A cutting fluid circulation system, characterized in that: It includes a liquid collecting device, a liquid supply device and a spraying device. The liquid collecting device includes a liquid collecting end and a liquid outlet end. The liquid collecting end is used to collect the cutting liquid after spraying, and the liquid outlet end is connected with the spraying device to allow the cutting liquid to circulate. A new liquid interface for filling new cutting liquid is provided between the liquid collecting device and the spraying device. The liquid supply device is connected with the new liquid interface.

2. The cutting fluid circulation system according to claim 1, characterized in that: A control valve is arranged between the liquid supply device and the new liquid interface.

3. The cutting fluid circulation system according to claim 1, characterized in that: The liquid supply device is a liquid supply cylinder or a centralized liquid supply system.

4. The cutting fluid circulation system according to claim 1, characterized in that: It also includes a drain port for discharging old cutting fluid, and the drain port is located upstream of the new fluid interface.

5. The cutting fluid circulation system according to claim 4, characterized in that: The liquid collecting device comprises a liquid collecting tank and a first filtering device, wherein the first filtering device is arranged on the outlet of the liquid collecting tank, and the liquid discharge port is arranged in the liquid collecting tank.

6. The cutting fluid circulation system according to claim 5, characterized in that: The liquid collecting device further comprises an overflow valve, and the overflow valve is arranged on the liquid discharge port.

7. The cutting fluid circulation system according to claim 6, characterized in that: The liquid collecting device further comprises a funnel cylinder, which is connected to the liquid collecting pool and is arranged below the liquid collecting pool.

8. The cutting fluid circulation system according to claim 7, characterized in that: The new liquid interface is arranged on the funnel cylinder, and the control valve between the liquid supply device and the funnel cylinder is a one-way valve.

9. The cutting fluid circulation system according to claim 8, characterized in that: It also includes an initial liquid inlet, which is arranged between the funnel cylinder and the spray device, and is connected to the liquid supply device through a liquid supply branch.

10. The cutting fluid circulation system according to any one of claims 1 to 7, characterized in that: It also includes a rotary cleaning device, which is connected in parallel to the infusion pipeline corresponding to the spraying device.

11. The cutting fluid circulation system according to claim 10, characterized in that: A second filtering device and a heat exchanger are sequentially connected between the liquid collecting device and the spraying device through a liquid infusion pipeline, and the new liquid interface is located upstream of the heat exchanger.

12. The cutting fluid circulation system according to any one of claims 1 to 9 or 11, characterized in that: The new liquid interface is arranged between the second filtering device and the heat exchanger or between the liquid collecting device and the second filtering device.

13. The cutting fluid circulation system according to claim 12, characterized in that: There are two second filter devices, and the two second filter devices are respectively located between the liquid collecting device and the heat exchanger and between the heat exchanger and the spraying device.

14. The cutting fluid circulation system according to claim 11, characterized in that: A main flow meter is arranged between the heat exchanger and the spray device; and a secondary flow meter is arranged on the liquid supply branch connected to the new liquid interface.

15. The cutting fluid circulation system according to claim 14, characterized in that: A densitometer is arranged between the main flow meter and the spray device, and the densitometer is used to detect the density of the cutting fluid.

16. A wire cutting device, characterized in that: A cutting fluid circulation system comprising any one of claims 1-15.

17. The wire cutting device according to claim 16, characterized in that: The wire cutting device comprises a cutting chamber, the spray device is arranged in the cutting chamber, and the liquid collecting device is arranged at the bottom of the cutting chamber.

18. The cutting fluid circulation system according to claim 17, characterized in that: The wire cutting device comprises a cutting roller, and the spraying device comprises a left spraying unit and a right spraying unit. The controller of the cutting liquid circulation system controls the corresponding spraying device to spray in accordance with the direction of rotation of the wire cutting roller by detecting the direction of rotation of the wire cutting roller.

19. The wire cutting device according to claim 17, characterized in that: The wire cutting device is a slicer.

20. The control method of the cutting fluid circulation system according to any one of claims 1 to 15 or the cutting fluid circulation system in the wire cutting device according to claims 16 to 19, characterized in that: The following steps are involved: S1, initial state, charging new cutting fluid into the cutting fluid circulation system; S2. When the cutting fluid is full, stop adding new cutting fluid and start the cutting fluid circulation system; S3, controlling the charging of new cutting fluid according to the cutting progress or the density of the cutting fluid; S4. After the workpiece is cut, close the cutting fluid circulation system.

21. The control method of the cutting fluid circulation system according to claim 20, characterized in that: Step S3: monitoring the cutting progress and controlling the charging of new cutting fluid according to the cutting progress.

22. The control method of the cutting fluid circulation system according to claim 21, characterized in that: The method for monitoring the cutting progress in step S3 is to set a detection module for the cutting depth of the workpiece, wherein the detection module is used to detect the cutting depth of the workpiece in real time and to fill new cutting fluid according to the cutting depth.

23. The control method of the cutting fluid circulation system according to claim 21, characterized in that: The method for monitoring the cutting progress in step S3 is to set a time monitoring module, wherein the time monitoring module is used to monitor the cutting time and fill in new cutting fluid according to the cutting time.

24. The control method of the cutting fluid circulation system according to claim 20, characterized in that: The method for monitoring the density of the cutting fluid in step S3 is to set a safe density value or a safe silicon powder concentration value in the controller of the cutting fluid circulation system, and control the charging of new cutting fluid into the cutting fluid circulation system by comparing the detected real-time density value with the safe density value or converting the density value into a silicon powder concentration value and then comparing it with the safe silicon powder concentration value.

25. The control method of the cutting fluid circulation system according to claim 20, characterized in that: Step S4 further includes step S41: when the workpiece cutting is completed, the spray device is turned off, and the rotary cleaning device is turned on, so that the cutting fluid cleans the inner wall of the cutting chamber through the rotary cleaning device.

26. The control method of the cutting fluid circulation system according to claim 20, characterized in that: Step S3 further includes step S31: when cutting is abnormal, turning off the spray device, and starting step S2 again when cutting returns to normal.

27. The control method of the cutting fluid circulation system according to claim 20, characterized in that: In step S4, after the workpiece is cut and the knife is retracted, the cutting fluid circulation system is closed.

28. The control method of the cutting fluid circulation system according to claim 20, characterized in that: The method further comprises step S5: discharging old cutting fluid, then filling in new cutting fluid, and opening the cutting fluid circulation system until the cutting tool is retracted.

29. The control method of the cutting fluid circulation system according to claim 20, characterized in that: The method for filling new cutting fluid in step S1 is: closing the control valve between the funnel cylinder and the new fluid interface, opening the first fluid supply pump, and filling the cutting fluid circulation system with new cutting fluid.

30. The control method of the cutting fluid circulation system according to claim 20, characterized in that: The method for filling new cutting fluid in step S1 is: turning on the second fluid supply pump to fill the cutting fluid circulation system with new cutting fluid.

31. The control method of the cutting fluid circulation system according to claim 20, characterized in that: The method for filling new cutting fluid in step S1 is: turning on the first fluid supply pump and filling the new cutting fluid into the cutting fluid circulation system through the initial fluid inlet.

32. The control method of the cutting fluid circulation system according to claim 20, characterized in that: The method for detecting whether the cutting fluid is full in step S2 is: whether the liquid level of the cutting fluid in the liquid collecting pool reaches the height of the overflow valve outlet.

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