Vibration sensor and electronic device

Abstract

The invention discloses a vibration sensor and electronic equipment, and relates to the technical field of MEMS, the vibration sensor comprises a shell, a sensor assembly and a mass block, the shell is provided with a cavity, the sensor assembly comprises an ASIC chip and an MEMS chip which are arranged in the cavity, the MEMS chip is matched with the shell to form a back cavity and a front cavity, and the mass block is arranged in the cavity. The mass block is arranged on the MEMS chip; and a pressure equalizing channel which is communicated with the back cavity and the front cavity is arranged between the MEMS chip and the shell. The invention aims to provide the vibration sensor adopting the bone voiceprint recognition technology, the vibration sensor uses a single device to directly extract the sound signal of the vocal cord vibration of the user, the environmental noise can be eliminated, and the call effect is improved.

Description

Technical Field

[0001] The present invention relates to the field of MEMS technology, and in particular to a vibration sensor and an electronic device using the vibration sensor. Background Art

[0002] MEMS (Micro-Electro-Mechanical System) technology is a high-tech that has developed rapidly in recent years. It uses advanced semiconductor manufacturing processes to achieve mass production of sensors, drivers and other devices. Compared with corresponding traditional devices, MEMS devices have very obvious advantages in size, power consumption, weight and price.

[0003] Bone voiceprint is one of the biometric technologies with a very high recognition rate. Since the bone structure of a person is unique, the reflection of sound between bones is also unique. The bone sound reflection of each person is different. After collection, the system will analyze the voiceprint, detect and match it with the database to achieve the purpose of safely unlocking the mobile device. Therefore, it has a relatively high security. The bone voiceprint sensor is a sensor that uses the vibration of the acoustic membrane to instigate air flow and detects the flow signal.

[0004] With the rise of the TWS headset market, existing headsets usually use dual microphones for noise reduction when in use. However, the noise reduction effect of the dual microphone is poor. If the user is in a noisy environment, the noise reduction effect cannot meet the call needs, resulting in a significant decrease in call quality. Summary of the invention

[0005] The main purpose of the present invention is to provide a vibration sensor and an electronic device, aiming to provide a vibration sensor using bone voiceprint recognition technology, which uses a single device to directly extract the sound signal of the user's vocal cord vibration, thereby eliminating environmental noise and improving call quality.

[0006] To achieve the above object, the present invention provides a vibration sensor, which comprises:

[0007] A housing, wherein the housing is provided with a cavity;

[0008] A sensor assembly, wherein the sensor assembly comprises an ASIC chip and a MEMS chip disposed in the cavity, wherein the MEMS chip cooperates with the housing to form a back cavity and a front cavity; and

[0009] A mass block, wherein the mass block is arranged on the MEMS chip;

[0010] Wherein, a pressure equalizing channel connecting the back cavity and the front cavity is provided between the MEMS chip and the shell.

[0011] In one embodiment, the mass block is made of metal, and an insulating layer is provided between the mass block and the MEMS chip;

[0012] Or, the material of the mass block is non-metallic material;

[0013] Or, the mass block is a second adhesive layer;

[0014] Alternatively, the mass block includes a second adhesive layer and a counterweight portion, and the second adhesive layer is disposed between the counterweight portion and the MEMS chip.

[0015] In one embodiment, the vibration sensor further includes a limiting structure, which is disposed in the cavity and corresponds to and is spaced apart from the mass block.

[0016] In one embodiment, the housing includes a substrate and an outer shell, wherein the outer shell is connected to the substrate and encloses the cavity;

[0017] The ASIC chip is arranged on the substrate and electrically connected to the substrate, the MEMS chip is arranged on the substrate and spaced apart from the ASIC chip, and the MEMS chip is electrically connected to the ASIC chip;

[0018] The MEMS chip and the substrate are enclosed to form the back cavity, the MEMS chip, the substrate and the housing are enclosed to form the front cavity, and the pressure equalization channel is provided between the MEMS chip and the substrate.

[0019] In one embodiment, the MEMS chip comprises:

[0020] A substrate, the substrate being disposed on the base plate;

[0021] A sensitive film, wherein the sensitive film is arranged at an end of the substrate away from the base plate, and the mass block is arranged on the sensitive film;

[0022] The sensitive film, the substrate and the base plate are enclosed to form the back cavity, the sensitive film, the substrate, the base plate and the housing are enclosed to form the front cavity, and the pressure equalization channel is formed between the substrate and the base plate.

[0023] In one embodiment, a groove is formed on a side of the substrate facing the base plate, and the groove and the base plate are combined to form the pressure equalization channel;

[0024] And / or, a groove is formed on a side of the base plate facing the substrate, and the groove and the substrate are combined to form the pressure equalization channel;

[0025] And / or, a first groove is concavely formed on a side of the substrate facing the base plate, and a second groove is concavely formed on a side of the base plate facing the substrate, and the first groove and the second groove cooperate to form the pressure equalization channel;

[0026] And / or, a first adhesive layer is disposed between the substrate and the base plate, the first adhesive layer has a notch, and the notch, the substrate and the base plate are combined to form the pressure equalization channel.

[0027] In one embodiment, the sensitive film includes a diaphragm and a back pole, the diaphragm and the back pole are arranged opposite to each other and spaced apart to form a capacitor structure between the diaphragm and the back pole, and the mass block is arranged on the side of the diaphragm facing away from the back pole.

[0028] In one embodiment, the diaphragm includes two layers, the two layers of the diaphragm are respectively arranged on opposite sides of the back pole, and are respectively arranged opposite to the back pole and spaced apart, and the mass block is arranged on at least one layer of the diaphragm;

[0029] And / or, the diaphragm is provided with a first air leakage hole, and the mass block is arranged on the diaphragm and avoids the first air leakage hole;

[0030] And / or, the back pole is provided with a second air leakage hole connected to the back cavity.

[0031] In one embodiment, the ASIC chip is electrically connected to the substrate via a gold wire;

[0032] And / or, the MEMS chip is electrically connected to the ASIC chip via a gold wire;

[0033] And / or, a first pad is provided on a side of the substrate facing the cavity, and the first pad is welded and connected to the ASIC chip through a gold wire;

[0034] And / or, a second pad is further provided on a side of the substrate facing away from the housing, and the second pad is used for connecting to an external circuit.

[0035] In one embodiment, the substrate is provided with an air hole, and the MEMS chip is disposed on the substrate and arranged around the air hole so that the air hole is connected with the back cavity;

[0036] Alternatively, the shell is provided with an air hole, and the air hole is communicated with the front cavity.

[0037] In one embodiment, the vibration sensor further includes a sealing layer, and the sealing layer seals the air hole.

[0038] In one embodiment, the gap area of ​​the pressure equalization channel is greater than or equal to 200 square microns;

[0039] And / or, the pressure equalizing channel includes a plurality of pressure equalizing channels, and the plurality of pressure equalizing channels are arranged between the MEMS chip and the housing at intervals and surround the back cavity;

[0040] And / or, the vibration sensor further includes a protective layer, and the protective layer is arranged on the MEMS chip and / or the ASIC chip.

[0041] The present invention further provides an electronic device, which includes the vibration sensor mentioned above.

[0042] In one embodiment, the electronic device further includes a mainboard, and the vibration sensor is soldered to the mainboard by soldering.

[0043] In one embodiment, the mainboard is provided with a through hole corresponding to the air hole of the vibration sensor;

[0044] And / or, the electronic device further includes a complete housing, and the mainboard is sealedly connected to the complete housing.

[0045] The vibration sensor of the technical solution of the present invention arranges a cavity in the shell, so as to facilitate the use of the cavity to install, fix and protect the sensor component, and use the sensor component for detection or sensing; at the same time, by arranging the sensor component as an ASIC chip and a MEMS chip arranged in the cavity, the MEMS chip and the shell cooperate to form a back cavity and a front cavity, so that the vibration signal is transmitted to the MEMS chip through the shell, converted into an electrical signal by the MEMS chip for transmission, and transmitted to the ASIC chip, the ASIC chip is used to provide voltage for the MEMS chip, and process and amplify the signal output by the MEMS chip, so that the vibration sensor is The electronic device expresses the vibration signal, and further provides a pressure equalizing channel connecting the back cavity and the front cavity between the MEMS chip and the shell, thereby utilizing the pressure equalizing channel to reduce the damping of the MEMS chip and improve the sensitivity and signal-to-noise ratio; further, by providing a mass block on the MEMS chip, the mass block is utilized to improve the structural strength and sensitivity of the sensitive membrane of the MEMS chip, and the impact resistance of the sensitive membrane of the MEMS chip is improved, thereby reducing the probability of rupture and failure of the sensitive membrane of the MEMS chip, so that the vibration sensor adopts bone voiceprint recognition technology and uses a single device to directly extract the sound signal of the user's vocal cord vibration, which can eliminate environmental noise and improve call quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0047] Figure 1 A cross-sectional schematic diagram of an embodiment of a vibration sensor provided by the present invention;

[0048] Figure 2 A cross-sectional schematic diagram of another embodiment of the vibration sensor provided by the present invention;

[0049] Figure 3 A cross-sectional schematic diagram of another embodiment of the vibration sensor provided by the present invention;

[0050] Figure 4 A schematic diagram of a top view of the structure of an embodiment of a vibration sensor provided by the present invention without a housing;

[0051] Figure 5 A schematic diagram of a top view of another embodiment of the vibration sensor provided by the present invention with the housing removed;

[0052] Figure 6 A schematic diagram of a top view of the structure of an embodiment of a vibration sensor provided by the present invention without the housing and the MEMS chip;

[0053] Figure 7 A schematic diagram of a top view of another embodiment of the vibration sensor provided by the present invention without the housing and the MEMS chip;

[0054] Figure 8 A schematic diagram of a top view of another embodiment of the vibration sensor provided by the present invention without the housing and the MEMS chip;

[0055] Fig. 9 A bottom-up structural schematic diagram of an embodiment of a vibration sensor provided by the present invention;

[0056] Fig.10 A bottom view schematic diagram of the structure of another embodiment of the vibration sensor provided by the present invention;

[0057] Fig.11 A cross-sectional schematic diagram of an embodiment of an electronic device provided by the present invention;

[0058] Fig.12 A cross-sectional schematic diagram of another embodiment of the electronic device provided by the present invention.

[0059] Description of Figure Numbers:

[0060] 100. Vibration sensor; 1. Shell; 11. Cavity; 12. Air hole; 13. Base plate; 131. First pad; 132. Second pad; 14. Shell; 2. Sensor assembly; 21. ASIC chip; 22. MEMS chip; 221. Substrate; 222. Sensitive film; 223. First adhesive layer; 2231. Notch; 23. Gold wire; 24. Back cavity; 25. Front cavity; 26. Pressure equalizing channel; 3. Mass block; 31. Second adhesive layer; 32. Counterweight; 4. Limiting structure; 5. Protective layer; 6. Sealing layer; 700. Main board; 710. Through hole; 720. Solder; 800. Whole machine shell; 900. Electronic device.

[0061] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0062] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0063] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0064] At the same time, the meaning of "and / or" or "and / or" appearing in the full text includes three options. Taking "A and / or B" as an example, it includes option A, or option B, or a option in which both A and B are satisfied.

[0065] In addition, in the present invention, descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0066] MEMS (Micro-Electro-Mechanical System) technology is a high-tech that has developed rapidly in recent years. It uses advanced semiconductor manufacturing processes to achieve mass production of sensors, drivers and other devices. Compared with corresponding traditional devices, MEMS devices have very obvious advantages in size, power consumption, weight and price.

[0067] Bone voiceprint is one of the biometric technologies with a very high recognition rate. Since the bone structure of a person is unique, the reflection of sound between bones is also unique. The bone sound reflection of each person is different. After collection, the system will analyze the voiceprint, detect and match it with the database to achieve the purpose of safely unlocking the mobile device. Therefore, it has a relatively high security. The bone voiceprint sensor is a sensor that uses the vibration of the acoustic membrane to instigate air flow and thereby detects flow signals. Traditional bone voiceprint sensors usually include a vibration system and a microphone assembly. The vibration system is used to sense external vibration signals, and the airflow changes generated by the vibration are converted into electrical signals through the microphone assembly to express the vibration signal.

[0068] With the rise of the TWS headset market, existing headsets usually use dual microphones for noise reduction when in use. However, the noise reduction effect of the dual microphone is poor. If the user is in a noisy environment, the noise reduction effect cannot meet the call needs, resulting in a significant decrease in call quality.

[0069] Based on the above ideas and problems, the present invention proposes a vibration sensor 100. It can be understood that the vibration sensor 100 is applied to electronic devices. The electronic devices can be sound boxes, mobile phones, tablet computers, headphones and other sound-generating electronic products, which are not limited here.

[0070] In this embodiment, the vibration sensor 100 is a device manufactured based on MEMS technology. The vibration sensor 100 can convert vibration changes into capacitance changes, and then the ASIC chip converts the capacitance changes into electrical signals to express the vibration signal.

[0071] Please refer to Figures 1 to 10 As shown, in an embodiment of the present invention, the vibration sensor 100 includes a shell 1 and a sensor assembly 2, the shell 1 is provided with a cavity 11, the sensor assembly 2 includes an ASIC chip 21 and a MEMS chip 22 arranged in the cavity 11, the MEMS chip 22 cooperates with the shell 1 to form a back cavity 24 and a front cavity 25; wherein, a pressure equalizing channel 26 connecting the back cavity 24 and the front cavity 25 is provided between the MEMS chip 22 and the shell 1.

[0072] In this embodiment, the housing 1 is used to install, fix and protect the sensor assembly 2 and other components, that is, the housing 1 provides an installation base for the sensor assembly 2. It can be understood that the housing 1 can be a housing, box or box structure with a cavity 11, which is not limited here.

[0073] In one embodiment, the housing 1 includes a substrate 13 and an outer shell 14 , and the outer shell 14 is connected to the substrate 13 to enclose a cavity 11 .

[0074] In this embodiment, if Figures 1 to 3 As shown, by configuring the housing 1 as a substrate 13 and an outer shell 14 , the cavity 11 formed by the substrate 13 and the outer shell 14 can provide a space for installing, fixing, protecting and shielding the sensor assembly 2 , thereby effectively preventing external elements and signals from affecting it.

[0075] It can be understood that the shell 14 of the housing 1 is a concave structure, the substrate 13 is a flat plate, and the shell 14 is buckled on the substrate 13 to form the cavity 11. Of course, the substrate 13 can also be set as a concave structure, the shell 14 is a cover plate, and the shell 14 is covered on the substrate 13 to form the cavity 11; or, the substrate 13 and the shell 14 are both set as concave structures, and are connected to each other to form the cavity 11, which is not limited here.

[0076] Optionally, the substrate 13 may be a circuit board. For example, the substrate 13 is a PCB board, on which circuits are printed to realize corresponding electrical functions, and the design may be selected according to actual needs. It should be noted that the PCB board may be a single-layer or multi-layer structure, for example, including a substrate layer, one or more copper foil layers, and one or more solder mask ink layers, and the selection may be based on the actual use scenario.

[0077] In this embodiment, the substrate 13 is provided with a circuit layer, a copper layer, and a mounting position for mounting the sensor assembly 2. The mounting position has contacts such as pads connected to the internal circuit of the substrate 13. The surface of the substrate 13 is provided with signal contacts for connecting to an external circuit. Optionally, the ASIC chip 21 is electrically connected to the substrate 13 via a gold wire 23.

[0078] Optionally, the housing 14 is a metal housing. In this embodiment, the housing 14 can be an integrally formed metal housing (the metal material can be selected from stainless steel, aluminum, aluminum alloy, copper, copper alloy, iron, iron alloy, etc.) or a non-metal housing coated with a metal material, so that electromagnetic shielding can be achieved. It can be understood that the longitudinal section of the housing 14 is U-shaped, and the housing 14 forms a closed cavity 11 with one end in the opening direction and the substrate 13 to achieve the outer wrapping of the sensor component 2 and the hardness support to protect the sensor component 2 from damage.

[0079] In one embodiment, if Figures 1 to 3 As shown, the housing 14 includes a top plate and a side plate, the top plate is arranged opposite to the base plate 13, the side plate is arranged at the periphery of the top plate and surrounds the sensor assembly 2, and one end of the side plate away from the top plate is connected to the base plate 13. It can be understood that the top plate and the side plate of the housing 14 form a concave structure, so that the top plate and the base plate 13 are arranged opposite and parallel, the side plate is located between the top plate and the base plate 13, and the top plate and the base plate 13 are enclosed to form the cavity 11.

[0080] It is understandable that when the housing 14 is a metal housing, the top plate and the side plates can be made of stainless steel, aluminum, aluminum alloy, copper, copper alloy, iron, iron alloy, etc., or a non-metallic plate structure coated with a metal material. The housing 14 can be used to wrap the sensor assembly 2 in the cavity. This arrangement effectively makes up for the shortcomings of the electromagnetic shielding capability of the substrate 13 in the related art, and can improve the electromagnetic shielding capability of the vibration sensor 100. Optionally, the top plate and the side plates are an integrally formed structure.

[0081] In one embodiment, the housing 14 and the substrate 13 are welded or bonded with conductive adhesive. It is understandable that the housing 14 and the substrate 13 can be connected by conductive adhesive or solder paste, etc., so that the electrical connection between the housing 14 and the substrate 13 can be achieved, thereby forming a conductive shielding cavity. The sensor component 2 is arranged in the cavity 11, which can prevent external electromagnetic interference, enhance the protection of both, and ensure the conversion performance of the sensor component 2. Of course, the housing 14 and the substrate 13 can also be connected by other conductive materials, which are not limited here.

[0082] In this embodiment, if Figures 1 to 3 As shown, the side plate of the housing 14 can be connected to the substrate 13 by welding or a conductive layer, and the conductive layer can be made of solder paste or conductive glue, which is not limited here. It can be understood that in order to improve the connection stability between the housing 14 and the substrate 13, a welding groove is provided on the side of the substrate 13 facing the housing 14, and the end of the side plate away from the top plate is partially accommodated and limited in the welding groove, and is connected to the substrate 13 by adhesive, conductive glue or solder paste, etc., which is not limited here.

[0083] Optionally, the shape of the structure formed by the shell 14 and the substrate 13 can be a cube, a cylinder, a sphere, etc., which is not limited here.

[0084] It should be noted that in order to fix the substrate 13 and the applied product or system and transmit electrical signals, in one embodiment, a second solder pad 132 is further provided on the side of the substrate 13 facing away from the housing 14, and the second solder pad 132 is used to connect to an external circuit.

[0085] Understandable, such as Fig. 9 and Fig.10As shown, the second pad 132 can be a solder point or solder foot, which can be conveniently soldered to the mainboard circuit of a specific product through SMT and other processes. Optionally, the second pad 132 can have 3 or 4 to improve the stability of structural connection and data transmission, which is not limited here.

[0086] In order to facilitate the transmission of the signal of the sensor component 2 to the substrate 13 and then to the external product or system via the substrate 13 , in one embodiment, a first solder pad 131 is provided on the side of the substrate 13 facing the cavity 11 , and the first solder pad 131 is soldered to the ASIC chip 21 via a gold wire 23 .

[0087] Understandable, such as Figures 4 to 8 As shown, the first pad 131 can be a solder point or a solder foot, and the solder foot or pad can be conveniently soldered to the mainboard circuit of a specific product through a process such as SMT. Optionally, the first pad 131 can have 2, 3 or 4 to improve the stability of the structural connection and data transmission, which is not limited here. Optionally, the gold wire 23 can be a gold wire or a copper wire, etc., which effectively improves the stability of the electrical connection.

[0088] Of course, in other embodiments, a solder pad may also be provided on the housing 14. For example, a solder pad is provided at one end of the housing 14 adjacent to the substrate 13, the solder pad is electrically connected to the substrate 13, and the sensor component 2 is electrically connected to the solder pad via a gold wire, etc., which is not limited here.

[0089] It can be understood that by providing a pad outside the housing 14, the structure of opening a through hole in the side wall of the housing 14 is effectively avoided, thereby effectively reducing the thickness of the side wall of the housing 14 and also improving the anti-electromagnetic interference performance of the vibration sensor 100. Optionally, the gold wire can be a gold wire or a copper wire, etc., which effectively improves the stability of the electrical connection.

[0090] In this embodiment, the sensor component 2 is disposed in the cavity 11, and the sensor component 2 can be disposed on the substrate 13, that is, the sensor component 2 is connected to the substrate 13, and is electrically connected to the substrate 13 through the gold wire 23; or, the sensor component 2 can be disposed in the housing 14, that is, the sensor component 2 is connected to the housing 14, and is electrically connected to the substrate 13 through the gold wire 23; or, part of the sensor component 2 is disposed on the substrate 13, part of the sensor component 2 is disposed on the housing 14, and the sensor component 2 is electrically connected to the substrate 13 through the gold wire 23, which is not limited here.

[0091] It can be understood that the sensor assembly 2 is mainly used in mobile terminals to receive sound and vibration signals and convert the vibration of sound and airflow into electrical signals. The sensor assembly 2 may include any type of component that can convert the vibration of sound and airflow into electrical signals, and may include MEMS components based on MEMS technology, such as but not limited to MEMS micro-capacitor sensors and / or MEMS micro-capacitor pole heads. The MEMS micro-capacitor pole heads may include a silicon diaphragm and a silicon back electrode for receiving sound. The silicon diaphragm may directly receive audio or vibration signals, which are transmitted to the micro-integrated circuit through the MEMS micro-capacitor sensor. The micro-integrated circuit converts and amplifies the high-resistance audio electrical signal into a low-resistance electrical signal, and at the same time, it is filtered by the RF anti-noise circuit and outputs an electrical signal that matches the front circuit, thus completing the sound-to-electric conversion.

[0092] In this embodiment, if Figures 1 to 8 As shown, the sensor assembly 2 includes a MEMS chip 22 and an ASIC chip 21. The MEMS chip 22 is electrically connected to the ASIC chip 21, and the MEMS chip 22 is provided with a sensitive film 222. Optionally, the MEMS chip 22 is electrically connected to the ASIC chip 21 via a gold wire 23.

[0093] It should be noted that the MEMS chip 22 can convert external physical and chemical signals into electrical signals. MEMS is the abbreviation of Micro-Electro-Mechanical System, and its Chinese name is micro-electromechanical system. In short, the MEMS chip 22 is an electronic mechanical system manufactured on a silicon chip using semiconductor technology. To put it more vividly, it is a micron-nano mechanical system that can convert external physical and chemical signals into electrical signals. This type of chip is most commonly used to undertake sensing functions, which is somewhat similar to the human sensory system in the entire large information system. For example, the MEMS microphone chip is equivalent to the human ear and can sense sound; the MEMS speaker chip is equivalent to the human mouth and can make sound; the MEMS accelerometer, gyroscope, and magnetic sensor chip are equivalent to the human cerebellum and can sense direction and speed; the MEMS pressure chip is equivalent to the human skin and can sense pressure; the MEMS chemical sensor is equivalent to the human nasal cavity and can sense taste and temperature and humidity. The device formed by encapsulating a MEMS chip 22 and an application-specific integrated circuit chip (ASIC chip 21) together is a MEMS sensor. That is, the vibration sensor 100 of the present application is a MEMS sensor.

[0094] In this embodiment, through the wire bonding process, the ASIC chip 21 is interconnected with the circuit of the substrate 13 of the shell 1 through the gold wire 23, so that the ASIC chip 21 can process the signal fed back by the MEMS chip 22 and transmit it to the substrate 13 of the shell 1, thereby connecting with the external circuit through the pads on the substrate 13 of the shell 1 to transmit the signal.

[0095] It can be understood that the process of connecting the electrodes on the MEMS chip 22 with the electrodes, pins or solder joints on the ASIC chip 21 by using wires is gold wire 23 bonding. In this embodiment, a wiring pad or pad structure is provided on the MEMS chip 22 and / or the ASIC chip 21, and the wiring pad or pad of the MEMS chip 22 is electrically connected to the wiring pad or pad of the ASIC chip 21 by gold wire 23 bonding. In this way, when the step of gold wire 23 bonding is performed, there will be no overflow of glue on the wiring pad as in the prior art, so the electrical performance of the MEMS chip 22 and the ASIC chip 21 after the gold wire 23 bonding can be guaranteed.

[0096] In this embodiment, the sensor component 2 is detected by the sensitive film 222 of the MEMS chip 22 via sound signals or vibration signals and converted into capacitance signals, and then the ASIC chip 21 converts the capacitance changes into electrical signals to achieve "sound-to-electricity" conversion and detection.

[0097] It should be noted that when the vibration sensor 100 is applied to electronic equipment, it can be electrically connected to an external circuit through the housing 1, or in the following embodiment, part of the substrate 13 of the housing 1 is located outside the cavity 11 for connecting to an external circuit. In addition, in this embodiment, the substrate 13 of the housing 1 can be a printed substrate 13, or a flexible substrate 13 or other components that can carry circuits, which are not limited here.

[0098] In this embodiment, a pressure equalizing channel 26 is provided between the MEMS chip 22 of the sensor assembly 2 and the shell 1, and the back cavity 24 and the front cavity 25 are connected by the pressure equalizing channel 26. In this way, when the sensitive membrane 222 of the MEMS chip 22 senses the vibration signal and vibrates accordingly, the damping can be reduced through the pressure equalizing channel 26, and the sensitivity and signal-to-noise ratio requirements can be adjusted, thereby improving the pickup sensitivity of the vibration signal of the bone voiceprint sensor.

[0099] In one embodiment, the vibration sensor 100 includes a shell 1, a sensor assembly 2 and a mass block 3, the shell 1 is provided with a cavity 11, the sensor assembly 2 includes an ASIC chip 21 and a MEMS chip 22 arranged in the cavity 11, the MEMS chip 22 cooperates with the shell 1 to form a back cavity 24 and a front cavity 25, and the mass block 3 is arranged on the MEMS chip 22; wherein, a pressure equalizing channel 26 connecting the back cavity 24 and the front cavity 25 is provided between the MEMS chip 22 and the shell 1.

[0100] The vibration sensor 100 of the present invention is provided with a cavity 11 in the shell 1, so that the cavity 11 is conveniently used to install, fix and protect the sensor component 2, and the sensor component 2 is used for detection or sensing; at the same time, the sensor component 2 is provided with an ASIC chip 21 and a MEMS chip 22 arranged in the cavity 11, so that the MEMS chip 22 cooperates with the shell 1 to form a back cavity 24 and a front cavity 25, so that the vibration signal is transmitted to the MEMS chip 22, converted into an electrical signal by the MEMS chip 22 for transmission, and transmitted to the ASIC chip 21, and the ASIC chip 21 is used to provide voltage for the MEMS chip 22, and process and amplify the signal output by the MEMS chip 22, so that the vibration sensor 100 is an electrical signal. The sub-device expresses the vibration signal, and further provides a pressure equalizing channel 26 connecting the back cavity 24 and the front cavity 25 between the MEMS chip 22 and the shell 1, so that the pressure equalizing channel 26 can be used to reduce the damping of the MEMS chip 22, and improve the sensitivity and signal-to-noise ratio; further, by setting a mass block 3 on the MEMS chip 22, the mass block 3 can be used to improve the structural strength and sensitivity of the sensitive membrane 222 of the MEMS chip 22, and the impact resistance of the sensitive membrane 222 of the MEMS chip 22 is improved, and the probability of rupture and failure of the sensitive membrane 222 of the MEMS chip 22 is reduced, so that the vibration sensor 100 adopts bone voiceprint recognition technology, and uses a single device to directly extract the sound signal of the user's vocal cord vibration, which can eliminate environmental noise and improve call quality.

[0101] In one embodiment, the shell 1 includes a substrate 13 and an outer shell 14, the outer shell 14 is connected to the substrate 13, and encloses a cavity 11; the ASIC chip 21 is arranged on the substrate 13 and electrically connected to the substrate 13, the MEMS chip 22 is arranged on the substrate 13, and is separated from the ASIC chip 21, and the MEMS chip 22 is electrically connected to the ASIC chip 21; wherein, the MEMS chip 22 and the substrate 13 enclose a back cavity 24, the MEMS chip 22, the substrate 13 and the outer shell 14 enclose a front cavity 25, and a pressure equalization channel 26 is provided between the MEMS chip 22 and the substrate 13.

[0102] In this embodiment, if Figures 1 to 3 As shown, by arranging the MEMS chip 22 and the ASIC chip 21 of the sensor component 2 on the substrate 13, and making the MEMS chip 22 and the ASIC chip 21 spaced apart on the substrate 13, a back cavity 24 and a front cavity 25 are respectively formed on both sides of the sensitive film 222 of the MEMS chip 22, so that the ASIC chip 21 is located in the front cavity 25, and a pressure equalizing channel 26 is provided between the MEMS chip 22 and the substrate 13, so that the pressure equalizing channel 26 can be used to reduce the damping of the sensitive film 222 of the MEMS chip 22, and improve the sensitivity and signal-to-noise ratio.

[0103] Optionally, the MEMS chip 22 and the ASIC chip 21 of the sensor assembly 2 are both mounted on the substrate 13 through a glue layer, the MEMS chip 22 is electrically connected to the ASIC chip 21 through a gold wire 23 , and the ASIC chip 21 is electrically connected to the substrate 13 through a gold wire 23 .

[0104] It is understandable that the ASIC chip 21 can be coated with adhesive, and the ASIC chip 21 can be attached to the substrate 13, so that the ASIC chip 21 and the MEMS chip 22 are spaced apart, and the adhesive is baked to solidify the adhesive. It is understandable that the adhesive is a conductive adhesive, and the ASIC chip 21 is fixed to the substrate 13 by the adhesive to achieve electrical connection. The adhesive is heated and solidified to achieve a reinforcement effect.

[0105] Of course, in order to avoid the ASIC chip 21 adhesive being baked and cured and affecting the performance of the adhesive layer, the ASIC chip 21 can be mounted first, that is, after the ASIC chip 21 is mounted on the substrate 13, the MEMS chip 22 can be mounted on the substrate 13, which is not limited here.

[0106] In this embodiment, the ASIC chip 21 is electrically connected to the substrate 13 and the MEMS chip 22 respectively. With this arrangement, when the MEMS chip 22 converts the vibration signal of the diaphragm into an electrical signal, it can be transmitted to the ASIC chip 21 for identification and amplification, and then transmitted to the substrate 13 for external transmission.

[0107] It is understandable that the adhesive layer can be an adhesive, a packaging adhesive, etc., which is not limited here. In this embodiment, the adhesive layer is prepared by the following steps: a layer of high thermal conductivity resin liquid is spread on the second adhesive surface, a support body is spread on the high thermal conductivity resin liquid, and the high thermal conductivity resin liquid is poured into the layer formed by the support body to form a thermal conductive layer provided with a support body, and the first adhesive surface is spread on the surface of the thermal conductive layer to obtain the adhesive layer.

[0108] In this embodiment, the housing 14 and the substrate 13 are enclosed to form a closed cavity 11, and a portion of the substrate 13 provided with the sensor assembly 2 is provided in the cavity 11. At this time, the substrate 13 also exists on the side of the substrate 13 away from the housing 14 to play an electromagnetic shielding role, preventing external electromagnetic interference from entering the packaging structure through the circuit layer, so that the metal shielding role can be played in all directions of the cavity 11, so that the substrate 13 and the sensor assembly 2 in the cavity 11 are protected from the influence of electromagnetic interference, thereby improving the anti-electromagnetic interference capability of the vibration sensor 100. In addition, the use of the substrate 13 and the metal housing 14 to form the shielding shell 1 can improve the strength of the outer shell of the vibration sensor 100, so that the vibration sensor 100 has better mechanical strength and reliability.

[0109] In one embodiment, the housing 1 is provided with an air hole 12 communicating with the cavity 11. It is understandable that Figures 1 to 3 As shown, the air hole 12 is opened in the shell 14 or the substrate 13 of the housing 1. By arranging the air hole 12 on the housing 1, the air hole 12 can be used to balance the internal pressure of the sensor generated during the device reflow process.

[0110] In one embodiment, the MEMS chip 22 includes a substrate 221 and a sensitive film 222, the substrate 221 is arranged on the substrate 13, the sensitive film 222 is arranged at one end of the substrate 221 away from the substrate 13, and the mass block 3 is arranged on the sensitive film 222; wherein the sensitive film 222, the substrate 221 and the substrate 13 are enclosed to form a back cavity 24, the sensitive film 222, the substrate 221, the substrate 13 and the outer shell 14 are enclosed to form a front cavity 25, and a pressure equalization channel 26 is formed between the substrate 221 and the substrate 13.

[0111] In this embodiment, if Figures 1 to 3 As shown, the substrate 221 of the MEMS chip 22 supports and installs the sensitive film 222, so that the substrate 221 and the base plate 13 are enclosed to form a back cavity structure, and the sensitive film 222 is connected to the end of the substrate 221 away from the base plate 13, so that the back cavity structure formed by the sensitive film 222, the substrate 221 and the base plate 13 is enclosed to form a back cavity 24, and a front cavity 25 is formed on the outside of the MEMS chip 22.

[0112] It can be understood that by setting a sensitive film 222 for sensing vibration signals, the periphery of the sensitive film 222 is connected to the substrate 221. Since the elastic deformation of the sensitive film 222 is greater than the elastic deformation of the periphery of the sensitive film 222, the amplitude of the sensitive film 222 can be increased, thereby increasing the sensitivity of its sensing. Further, by setting the mass block 3 on the sensitive film 222, the structural strength and sensitivity of the sensitive film 222 of the MEMS chip 22 are improved, and the impact resistance of the sensitive film 222 of the MEMS chip 22 is improved, thereby reducing the probability of the sensitive film 222 of the MEMS chip 22 breaking and failing.

[0113] In the present embodiment, the pressure equalizing channel 26 is formed between the substrate 221 of the MEMS chip 22 and the substrate 13. Optionally, a groove is provided on the side of the substrate 221 facing the substrate 13, so that when the substrate 221 is connected to the substrate 13, the groove and the substrate 13 enclose the pressure equalizing channel 26. Of course, a groove is provided on the side of the substrate 13 facing the substrate 221, so that when the substrate 13 is connected to the substrate 221, the groove and the substrate 221 enclose the pressure equalizing channel 26; or, a first groove is provided on the side of the substrate 221 facing the substrate 13, and a second groove is provided on the side of the substrate 13 facing the substrate 221, so that when the substrate 221 is connected to the substrate 13, the first groove and the second groove cooperate to form the pressure equalizing channel 26, which is not limited here.

[0114] Of course, if Figures 1 to 3 , Figures 6 to 8As shown, the substrate 221 of the MEMS chip 22 is connected to the base plate 13 through an adhesive layer, that is, a first adhesive layer 223 is provided between the substrate 221 and the base plate 13. Optionally, the first adhesive layer 223 has a notch 2231, so that the notch 2231, the substrate 221 and the base plate 13 enclose a pressure equalization channel 26, which is not limited here.

[0115] In order to reduce damping, a pressure equalizing channel 26 is left between the MEMS chip 22 and the substrate 13. The damping can be adjusted by adjusting the size and number of the pressure equalizing channel 26 to achieve the sensitivity and signal-to-noise ratio requirements of the product.

[0116] It is understandable that one or more pressure equalizing channels 26 may be provided between the MEMS chip 22 and the substrate 13. Optionally, the pressure equalizing channel 26 includes a plurality of pressure equalizing channels 26, which are spaced between the MEMS chip 22 and the housing 1 and are arranged around the back cavity 24. In this embodiment, the gap area of ​​the pressure equalizing channel 26 is greater than or equal to 200 square microns. It should be noted that the gap area of ​​the pressure equalizing channel 26 is adjusted according to actual needs and is not limited here.

[0117] In one embodiment, the sensitive film 222 includes a diaphragm and a back electrode, which are arranged opposite to each other and spaced apart to form a capacitor structure between the diaphragm and the back electrode, and the mass block 3 is arranged on the side of the diaphragm facing away from the back electrode.

[0118] In this embodiment, the sensitive film 222 can be a piezoelectric structure or a capacitive structure, which is not limited here. For example, when the sensitive film 222 is a piezoelectric structure, it includes a diaphragm and piezoelectric materials arranged on both sides of the diaphragm. The diaphragm is excited by the sound signal to vibrate the diaphragm, so that the pressure of the piezoelectric material changes, thereby outputting a corresponding electrical signal. When the sensitive film 222 is a capacitive structure, the back plate and the diaphragm are opposite to each other, and the back plate and the diaphragm are respectively provided with conductive layers that can be energized. However, the energized layers are insulated from each other. In this way, the back plate and the diaphragm form a capacitor structure.

[0119] Optionally, the back electrode of the MEMS chip 22 is generally made of single crystal silicon, polycrystalline silicon, silicon nitride or other materials, and the outer shape of the back electrode is roughly a cube.

[0120] It is understandable that when the sensitive film 222 is powered on, the diaphragm and the back electrode will carry charges of opposite polarity to form a capacitor structure, so the diaphragm will move toward the back electrode under the action of electrostatic force, thereby changing the capacitance between the diaphragm and the back electrode to form an electrical signal. Optionally, the diaphragm is arranged in a roughly annular shape and fixed to the back electrode and the substrate 221. Such an arrangement ensures that all positions of the diaphragm can be well fixed, thereby improving the stability of the diaphragm vibration.

[0121] Optionally, the outer contour of the diaphragm may be polygonal, elliptical or circular, and the specific shape may be set according to actual needs.

[0122] In this embodiment, the material of the mass block 3 includes a deformable flexible material. With such a configuration, the mass block 3 can, on the one hand, strengthen the structural strength of the sensitive membrane 222, and on the other hand, will not excessively increase the stiffness of the sensitive membrane 222, so that the diaphragm of the sensitive membrane 222 can vibrate or undergo a plane displacement, etc., thereby measuring corresponding data information and ensuring the detection effect.

[0123] Optionally, the thickness of the diaphragm can be between 1um and 10um. When the thickness of the diaphragm is large, it is insensitive to slight vibration excitation and the detection effect is poor; when the thickness of the diaphragm is small, the structural strength is reduced. When the thickness of the diaphragm can be between 1um and 10um, on the one hand, it can ensure good structural strength, and on the other hand, it can ensure detection sensitivity to slight vibration excitation. It can be understood that the thickness of the diaphragm can also be 3um, 5um, 7um, 9um, etc., which can ensure good structural strength on the one hand, and on the other hand, it can ensure detection sensitivity to slight vibration excitation.

[0124] In some embodiments, in order to make the diaphragm stiffness of the sensitive membrane 222 smaller than the stiffness of the diaphragm periphery or back pole, the thickness of the diaphragm can be made thinner, or its structural strength can be reduced by providing a corrugated or rectangular toothed structure, or the material of the diaphragm can be set to a softer material, while the diaphragm periphery or back pole can be set to a stronger material, etc., which will not be elaborated here.

[0125] In this embodiment, the thickness of the mass block 3 gradually decreases from the center of the diaphragm to the periphery of the sensitive film 222. Since the middle of the diaphragm is the place with the largest amplitude, the amplitude of the diaphragm near the center will be greater than that of the diaphragm near the edge or the substrate 221. Therefore, gradually reducing the thickness of the mass block 3 from the center of the diaphragm to the periphery can make the mass block 3 strengthen the structure at the center of the diaphragm, and ensure the stability of the structure of the sensitive film 222 near the diaphragm where the amplitude is the largest.

[0126] Optionally, the diaphragm of the sensitive film 222 is integrally formed and configured to be able to pass electrical signals. During production, it can be formed by deposition, etching and patterning techniques, and this molding process is common knowledge among those skilled in the art. The diaphragm can be made of single crystal silicon, polycrystalline silicon or conductive metal materials well known to those skilled in the art, and can also be made of a laminated material in which a conductive material and a non-conductive material are stacked together.

[0127] In one embodiment, the diaphragm includes two layers, the two diaphragms are respectively arranged on opposite sides of the back pole, and are respectively arranged opposite to the back pole and spaced apart, and the mass block 3 is arranged on at least one diaphragm layer.

[0128] It can be understood that there are two layers of diaphragms, which are arranged on opposite sides of the back pole, and the diaphragms of the two sensitive films 222 are provided with mass blocks 3. Optionally, mass blocks 3 are provided on both layers of diaphragms, thereby improving the strength of the two layers of diaphragms and ensuring the working stability of the vibration sensor 100.

[0129] It should be noted that the diaphragm of the sensitive film 222 can be a double diaphragm design or a single diaphragm design, which is not limited here. The mass block 3 contacts the diaphragm of the sensitive film 222, but not the back electrode.

[0130] In one embodiment, the diaphragm is provided with a first air leakage hole, the mass block 3 is arranged on the diaphragm and avoids the first air leakage hole. The back pole is provided with a second air leakage hole connected to the back cavity 24.

[0131] It can be understood that the first air leakage hole is located at the center or periphery of the diaphragm of the sensitive membrane 222. The diaphragm vibrates after being stimulated by a vibration signal or a pressure signal. In the vibration sensor 100, since the second air leakage hole is set on the back pole, there may be an imbalance in the air pressure on both sides of the diaphragm. The first air leakage hole is set so that the air pressure on the two sides of the diaphragm can be balanced to a certain extent, ensuring the uniformity of the diaphragm vibration, thereby reducing the signal noise sensed by the diaphragm. In addition, the first air leakage hole can reduce the structural strength of the diaphragm and improve the vibration amplitude and vibration sensitivity of the sensitive membrane 222.

[0132] It should be noted that the number and aperture of the first air leakage holes can be set according to actual needs, which will not be elaborated here. It can be understood that in order to prevent the mass block 3 from affecting the air pressure on the opposite sides of the diaphragm, the mass block 3 is arranged away from the first air leakage holes. Of course, in other embodiments, the mass block 3 is provided with a vent hole or other structure corresponding to the first air leakage hole, which is not limited here.

[0133] In one embodiment, the mass block 3 is made of metal, and an insulating layer is provided between the mass block 3 and the MEMS chip 22. It is understandable that when the mass block 3 is made of metal, in order to prevent the mass block 3 from affecting the working condition of the sensitive film 222 of the MEMS chip 22, an insulating layer is provided between the mass block 3 and the sensitive film 222 of the MEMS chip 22; or, an insulating layer is coated on the diaphragm of the sensitive film 222, which is not limited here.

[0134] Optionally, the material of the mass block 3 is a non-metallic material. Alternatively, the mass block 3 can be a second adhesive layer 31. The material of the second adhesive layer 31 can be silica gel, etc., which is not limited here.

[0135] In one embodiment, if Figure 1 As shown, the mass block 3 includes a second adhesive layer 31 and a weight portion 32 , and the second adhesive layer 31 is disposed between the weight portion 32 and the MEMS chip 22 .

[0136] Understandable, such as Figure 4 and Figure 5 As shown, the pickup sensitivity of the sensitive film 222 of the MEMS chip 22 to the vibration signal can be adjusted by adjusting the density or volume, coverage area or thickness of the mass block 3. The specific settings can be made according to actual needs and are not limited here.

[0137] In this embodiment, the material of the weight portion 32 can be a metal material or a non-metal material. Alternatively, the material of the weight portion 32 includes a conductive material, for example, the insulating material of the weight portion 32 can be a nitrogen-containing film or a plastic film or a rubber film, etc., and the conductive material can include a silicon-containing film, etc.

[0138] In one embodiment, the vibration sensor 100 further includes a limiting structure 4 , which is disposed in the cavity 11 and corresponds to and is spaced from the mass block 3 .

[0139] In this embodiment, if Figure 1 As shown, by setting a limiting structure 4 in the cavity 11 of the shell 1, the limiting structure 4 can avoid excessive acceleration of the sensitive membrane 222, thereby limiting the displacement of the mass block 3 and avoiding damage to the sensitive membrane 222 of the MEMS chip 22 caused by excessive displacement.

[0140] In one embodiment, if Figure 1 and Figure 2 As shown, the substrate 13 is provided with an air hole 12 , and the MEMS chip 22 is disposed on the substrate 13 and is disposed around the air hole 12 so that the air hole 12 is connected with the back cavity 24 .

[0141] In one embodiment, if Figure 3 As shown, the housing 14 is provided with an air hole 12 , and the air hole 12 is communicated with the front cavity 25 .

[0142] In one embodiment, if Fig.11 and Fig.12 As shown, the vibration sensor 100 further includes a sealing layer 6 , and the sealing layer 6 blocks the air hole 12 .

[0143] It can be understood that the air hole 12 is provided on the shell 1, and the air hole 12 can be used to balance the internal pressure of the sensor generated during the device reflow process. Optionally, the air hole 12 is provided on the substrate 13 or the shell 14 of the shell 1, which is not limited here. In this embodiment, the provision of the sealing layer 6 can play a sealing role. By sealing the air hole 12 by the sealing layer 6, it can be ensured that the bone voiceprint sensor only picks up the voice vibration signal and isolates the sound signal transmitted through the air. Optionally, the sealing layer 6 can be a tape or glue, etc., which is not limited here.

[0144] In this embodiment, the sealing layer 6 can be sealed with a sealing layer 6 (such as tape or glue) after the terminal SMT mounting, which is not limited here.

[0145] In one implementation, the vibration sensor 100 further includes a protection layer 5 , and the protection layer 5 is disposed on the MEMS chip 22 and / or the ASIC chip 21 .

[0146] In this embodiment, if Figures 1 to 8 As shown, by providing a protective layer 5, the MEMS chip 22 and / or the ASIC chip 21 are protected by the protective layer 5. Optionally, the ASIC chip 21 is provided with a protective layer 5, so that the reliability of the ASIC chip 21 can be improved. Of course, in other embodiments, the protective layer 5 can also be provided on the sensitive film 222 of the MEMS chip 22 as a mass block 3, or can be provided on the mass block 3, which is not limited here. Optionally, the protective layer 5 is a protective glue.

[0147] Of course, the material of the protective layer 5 can be epoxy resin. In this embodiment, the protective layer 5 can also wrap the gold wire 23, so that the gold wire 23 can be protected and fixed, and the sensor component 2 can be protected from external impact, and the PAD can be protected from chemical corrosion in life. The protective layer 5 has insulating properties and can protect the sensor component 2 from static electricity breakdown in a dusty environment.

[0148] like Fig.11 and Fig.12 As shown, the present invention further provides an electronic device 900, which includes the above-mentioned vibration sensor 100. The specific structure of the vibration sensor 100 refers to the above-mentioned embodiment. Since the electronic device adopts all the technical solutions of all the above-mentioned embodiments, it at least has all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be described one by one here.

[0149] In this embodiment, the electronic device can be but is not limited to an electric toothbrush, a mobile phone, a laptop computer, a tablet computer, a personal digital assistant (PDA), an e-book reader, an MP325 (Moving Picture Experts Group Audio Layer III) player, an MP4 (Moving Picture Experts Group Audio Layer IV) player, a wearable device, a navigator, a handheld game console, etc., and is not limited here.

[0150] In one embodiment, if Fig.11 and Fig.12As shown, the electronic device 900 further includes a mainboard 700 , and the vibration sensor 100 is soldered to the mainboard 700 by solder 720 .

[0151] It is understandable that, in order to facilitate terminal assembly, a second pad 132 is provided on the substrate 13 of the housing 1 of the vibration sensor 100. Optionally, the second pad 132 may be an annular pad, which surrounds the air hole 12 provided on the substrate 13; or, the second pad 132 may be a solder point, a solder foot, or a square pad, etc., which is not limited here.

[0152] In this embodiment, the second pad 132 of the vibration sensor 100 is soldered to the mainboard 700 by soldering 720. The mainboard 700 may be a circuit board or a control board of a terminal such as an electronic device 900, which is not limited here.

[0153] In one embodiment, the main board 700 is provided with a through hole 710 corresponding to the air hole 12 of the vibration sensor 100. Fig.11 As shown, when the substrate 13 of the housing 1 of the vibration sensor 100 is provided with the air hole 12, the main board 700 is provided with a through hole 710 corresponding to the air hole 12. At this time, the sealing layer 6 can be provided on the main board 700 to seal the through hole 710, thereby achieving the sealing of the air hole 12, which is not limited here.

[0154] It can be understood that when the substrate 13 of the housing 1 of the vibration sensor 100 is not provided with the air hole 12, the main board 700 is not provided with the through hole 710, that is, the housing 14 of the housing 1 is provided with the air hole 12. In this case, the sealing layer 6 can be directly provided on the housing 14 to seal the air hole 12, such as Fig.12 shown.

[0155] In one embodiment, if Fig.11 and Fig.12 As shown, the electronic device 900 further includes a whole housing 800, and the mainboard 700 is sealed to the whole housing 800. It is understandable that the vibration sensor 100 or the mainboard 700 can be directly bonded and sealed to the whole housing 800, and bonding and sealing with the whole housing 800 can ensure the fit between the vibration sensor 100 and the whole housing 800, and can better transmit the vibration signal with less signal attenuation.

[0156] The above descriptions are only optional embodiments of the present invention, and are not intended to limit the patent scope of the present invention. All equivalent structural changes made using the contents of the present invention's specification and drawings, or directly / indirectly applied in other related technical fields, are included in the patent protection scope of the present invention.

Claims

1. A vibration sensor, characterized in that: The vibration sensor comprises: A housing, wherein the housing is provided with a cavity; A sensor assembly, wherein the sensor assembly comprises an ASIC chip and a MEMS chip disposed in the cavity, wherein the MEMS chip cooperates with the housing to form a back cavity and a front cavity; and A mass block, wherein the mass block is arranged on the MEMS chip; Wherein, a pressure equalizing channel connecting the back cavity and the front cavity is provided between the MEMS chip and the shell.

2. The vibration sensor according to claim 1, characterized in that The mass block is made of metal, and an insulating layer is provided between the mass block and the MEMS chip; Or, the material of the mass block is non-metallic material; Or, the mass block is a second adhesive layer; Alternatively, the mass block includes a second adhesive layer and a counterweight portion, and the second adhesive layer is disposed between the counterweight portion and the MEMS chip.

3. The vibration sensor according to claim 1, characterized in that The vibration sensor further comprises a limiting structure, which is arranged in the cavity and corresponds to and is spaced from the mass block.

4. The vibration sensor according to claim 1, characterized in that The housing comprises a base plate and an outer shell, wherein the outer shell is connected to the base plate and encloses the cavity; The ASIC chip is arranged on the substrate and electrically connected to the substrate, the MEMS chip is arranged on the substrate and spaced apart from the ASIC chip, and the MEMS chip is electrically connected to the ASIC chip; The MEMS chip and the substrate are enclosed to form the back cavity, the MEMS chip, the substrate and the housing are enclosed to form the front cavity, and the pressure equalization channel is provided between the MEMS chip and the substrate.

5. The vibration sensor according to claim 4, characterized in that The MEMS chip comprises: A substrate, the substrate being disposed on the base plate; A sensitive film, wherein the sensitive film is arranged at an end of the substrate away from the base plate, and the mass block is arranged on the sensitive film; The sensitive film, the substrate and the base plate are enclosed to form the back cavity, the sensitive film, the substrate, the base plate and the housing are enclosed to form the front cavity, and the pressure equalization channel is formed between the substrate and the base plate.

6. The vibration sensor according to claim 5, characterized in that A groove is formed on a side of the substrate facing the base plate, and the groove and the base plate are combined to form the pressure equalization channel; And / or, a groove is formed on a side of the base plate facing the substrate, and the groove and the substrate are combined to form the pressure equalization channel; And / or, a first groove is concavely formed on a side of the substrate facing the base plate, and a second groove is concavely formed on a side of the base plate facing the substrate, and the first groove and the second groove cooperate to form the pressure equalization channel; And / or, a first adhesive layer is disposed between the substrate and the base plate, the first adhesive layer has a notch, and the notch, the substrate and the base plate are combined to form the pressure equalization channel.

7. The vibration sensor according to claim 5, characterized in that The sensitive film comprises a diaphragm and a back electrode, wherein the diaphragm and the back electrode are arranged opposite to each other and spaced apart to form a capacitor structure between the diaphragm and the back electrode, and the mass block is arranged on a side of the diaphragm facing away from the back electrode.

8. The vibration sensor according to claim 7, characterized in that The diaphragm comprises two layers, the two layers of the diaphragm are respectively arranged on opposite sides of the back pole, and are respectively arranged opposite to the back pole and spaced apart, and the mass block is arranged on at least one layer of the diaphragm; And / or, the diaphragm is provided with a first air leakage hole, and the mass block is arranged on the diaphragm and avoids the first air leakage hole; And / or, the back pole is provided with a second air leakage hole connected to the back cavity.

9. The vibration sensor according to claim 4, characterized in that: The ASIC chip is electrically connected to the substrate via a gold wire; And / or, the MEMS chip is electrically connected to the ASIC chip via a gold wire; And / or, a first pad is provided on a side of the substrate facing the cavity, and the first pad is welded and connected to the ASIC chip through a gold wire; And / or, a second pad is further provided on a side of the substrate facing away from the housing, and the second pad is used for connecting to an external circuit.

10. The vibration sensor according to claim 4, characterized in that The substrate is provided with an air hole, and the MEMS chip is arranged on the substrate and around the air hole so that the air hole is connected with the back cavity; Alternatively, the shell is provided with an air hole, and the air hole is communicated with the front cavity.

11. The vibration sensor according to claim 10, characterized in that The vibration sensor further includes a sealing layer, and the sealing layer seals the air hole.

12. The vibration sensor according to any one of claims 1 to 11, characterized in that: The gap area of ​​the pressure equalizing channel is greater than or equal to 200 square microns; And / or, the pressure equalizing channel includes a plurality of pressure equalizing channels, and the plurality of pressure equalizing channels are arranged between the MEMS chip and the housing at intervals and surround the back cavity; And / or, the vibration sensor further includes a protective layer, and the protective layer is arranged on the MEMS chip and / or the ASIC chip.

13. An electronic device, characterized in that: The electronic device comprises the vibration sensor according to any one of claims 1 to 12.

14. The electronic device according to claim 13, characterized in that: The electronic device also includes a mainboard, and the vibration sensor is soldered to the mainboard by soldering.

15. The electronic device according to claim 14, characterized in that: The mainboard is provided with a through hole corresponding to the air hole of the vibration sensor; And / or, the electronic device further includes a complete housing, and the mainboard is sealedly connected to the complete housing.

Images