Display panel, preparation method of display panel and display device

Abstract

The invention discloses a display panel, a preparation method of the display panel and a display device, the display panel comprises a substrate, an isolation structure, a light-emitting layer, a first electrode and a first packaging layer, the isolation structure is arranged on one side of the substrate, and a plurality of isolation openings are formed by enclosing; the light-emitting layer comprises a light-emitting unit at least partially located in the isolation opening; the first electrode is arranged on the side, away from the substrate, of the light-emitting unit, and the first electrode is in lap joint with the first isolation part; the first packaging layer comprises packaging parts located on the sides, away from the substrate, of the first electrodes, the packaging parts comprise first sub-parts formed by inorganic materials, the first sub-parts cover the first electrodes, and in all the packaging parts, the first sub-parts of at least two packaging parts are different in thickness.

Description

Technical Field

[0001] The present application belongs to the field of display technology, and in particular, relates to a display panel, a method for preparing a display panel, and a display device. Background Art

[0002] Organic Light Emitting Display (OLED) and flat-panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream in display devices.

[0003] However, the performance of current OLED display products needs to be improved. Summary of the invention

[0004] The purpose of the present application is to provide a display panel, a method for manufacturing a display panel and a display device, which can improve the performance of the display panel.

[0005] According to a first aspect of the present application, there is provided a display panel, comprising a substrate, an isolation structure, a light-emitting layer and a first encapsulation layer, wherein the isolation structure is arranged on one side of the substrate and encloses a plurality of isolation openings; the light-emitting layer comprises a light-emitting unit located at each isolation opening; a first electrode is arranged on a side of the light-emitting unit away from the substrate, the first electrode overlaps with the first isolation portion; the first encapsulation layer comprises an encapsulation portion located on a side of the first electrode away from the substrate, the encapsulation portion comprises a first sub-portion formed of an inorganic material, the first sub-portion covers the first electrode, and among the encapsulation portions, the thickness of the first sub-portions of at least two encapsulation portions are different.

[0006] In some embodiments, the encapsulation portion includes at least a first sub-portion and a second sub-portion, and the second sub-portion covers the first sub-portion;

[0007] The thickness of the second sub-section is greater than the thickness of the first sub-section;

[0008] Preferably, the isolation structure comprises a first isolation portion and a second isolation portion arranged on a side of the first isolation portion facing away from the substrate, and the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate.

[0009] Preferably, a gap is formed between a side of the first sub-portion facing away from the substrate and a side of the second isolation portion facing the substrate, and the second sub-portion fills the gap;

[0010] Preferably, the density of the first subsection is different from the density of the second subsection;

[0011] Preferably, the density of the first sub-section is greater than the density of the second sub-section, or the density of the first sub-section is less than the density of the second sub-section;

[0012] Preferably, the first subsection and / or the second subsection comprises an inorganic material containing silicon.

[0013] In some embodiments, the second sub-portion extends through the second isolation portion toward the sidewall of the isolation opening to a side of the second isolation portion facing away from the substrate;

[0014] Preferably, the first sub-section includes a first segment, a second segment and a third segment, the first segment is located on a side of the first electrode facing away from the substrate, the second segment is located on a side of the first isolation portion facing the isolation opening, and the third segment is located between a side wall of the second isolation portion facing the isolation opening and the second sub-section;

[0015] Preferably, the third segment also extends to a side of the second isolation portion facing away from the substrate.

[0016] In some embodiments, the packaging portion further includes a third sub-portion, the third sub-portion covering the second sub-portion;

[0017] Preferably, the third sub-portion extends to a side of the second isolation portion facing away from the substrate;

[0018] Preferably, the third sub-section includes a fourth segment and a fifth segment, the orthographic projection of the fourth segment on the substrate is located within the orthographic projection of the first electrode on the substrate, the fifth segment extends from the edge of the fourth segment to a side of the second isolation portion away from the substrate, and at least a portion of the fourth segment is protruding relative to the first isolation portion in a direction away from the substrate;

[0019] Preferably, the density of the first sub-section is greater than that of the second sub-section, and the density of the third sub-section is greater than that of the second sub-section;

[0020] Preferably, the density of the third subsection is greater than or equal to the density of the first subsection;

[0021] Preferably, the third subsection includes an inorganic material containing silicon.

[0022] In some embodiments, the plurality of light-emitting units include a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit, the plurality of encapsulation parts include a first encapsulation part, a second encapsulation part, and a third encapsulation part, the first encapsulation part is used to encapsulate the first light-emitting unit, the second encapsulation part is used to encapsulate the second light-emitting unit, and the third encapsulation part is used to encapsulate the third light-emitting unit;

[0023] Preferably, the thickness of the third sub-portion of the first encapsulation portion is greater than or equal to the thickness of the third sub-portion of the second encapsulation portion, and / or the thickness of the third sub-portion of the second encapsulation portion is greater than the thickness of the third sub-portion of the third encapsulation portion;

[0024] Preferably, the thickness of the first encapsulation part is greater than the thickness of the second encapsulation part, and the thickness of the second encapsulation part is greater than the thickness of the third encapsulation part.

[0025] In some embodiments, the plurality of light-emitting units include a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit, the plurality of encapsulation parts include a first encapsulation part, a second encapsulation part, and a third encapsulation part, the first encapsulation part is used to encapsulate the first light-emitting unit, the second encapsulation part is used to encapsulate the second light-emitting unit, the third encapsulation part is used to encapsulate the third light-emitting unit, and at least two of the first sub-part of the first encapsulation part, the first sub-part of the second encapsulation part, and the first sub-part of the third encapsulation part have different thicknesses.

[0026] In some embodiments, the thickness of the first encapsulation portion and / or the first sub-portion of the second encapsulation portion is less than the thickness of the first isolation portion;

[0027] Preferably, a ratio Z1 of the thickness of the first encapsulation portion and / or the first sub-portion of the second encapsulation portion to the thickness of the first isolation portion satisfies: 0.05≤Z1<1.

[0028] In some embodiments, the thickness of the first sub-portion of the third encapsulation portion is greater than the thickness of the first sub-portion of the first encapsulation portion and / or the second encapsulation portion;

[0029] Preferably, a ratio Z2 of the thickness of the first sub-portion of the third encapsulation portion to the thickness of the first encapsulation portion and / or the first sub-portion of the second encapsulation portion satisfies: 1<Z2≤12;

[0030] Preferably, the thickness of the first sub-portion of the first encapsulation portion is less than or equal to the thickness of the first sub-portion of the second encapsulation portion.

[0031] In some embodiments, a ratio Z3 of a thickness of the first sub-portion of the third encapsulation portion to a thickness of the first isolation portion satisfies: 0.1≤Z3≤1.2;

[0032] Preferably, the thickness of the first sub-portion of the third encapsulation portion is greater than or equal to the thickness of the first isolation portion.

[0033] In some embodiments, the thickness H1 of the first encapsulation portion and / or the first sub-portion of the second encapsulation portion satisfies: 500 angstroms ≤ H1 ≤ 5000 angstroms;

[0034] Preferably, the thickness H2 of the first sub-portion of the third encapsulation portion satisfies: 1000 angstroms ≤ H2 ≤ 6000 angstroms;

[0035] Preferably, the thickness H3 of the first isolation portion satisfies: 5000 angstroms ≤ H3 ≤ 10000 angstroms.

[0036] In some embodiments, the material of the first isolation portion includes a conductive material;

[0037] Preferably, the material of the second isolation portion includes a conductive material;

[0038] Preferably, the isolation structure further includes a third isolation portion, and the third isolation portion is located on a side of the first isolation portion facing the substrate.

[0039] In some embodiments, the display panel further includes a second encapsulation layer, and the second encapsulation layer is disposed on a side of the first encapsulation layer facing away from the substrate;

[0040] Preferably, the second encapsulation layer comprises an organic material;

[0041] Preferably, the display panel further comprises a third encapsulation layer, and the third encapsulation layer is arranged on a side of the second encapsulation layer away from the substrate;

[0042] Preferably, the third encapsulation layer comprises an inorganic material.

[0043] A second aspect of the present application provides a method for preparing a display panel, comprising:

[0044] An isolation structure is formed on one side of the substrate, the isolation structure encloses a plurality of isolation openings, the isolation structure comprises a first isolation portion and a second isolation portion arranged on a side of the first isolation portion away from the substrate, and an orthographic projection of the first isolation portion on the substrate is located within an orthographic projection of the second isolation portion on the substrate;

[0045] A light-emitting unit and a packaging part for packaging each light-emitting unit are formed in the isolation opening, the light-emitting unit includes a first electrode, the first electrode overlaps the first isolation part, the packaging part includes at least a first sub-part and a second sub-part, the first sub-part covers the first electrode, the second sub-part covers the first sub-part, the density of the first sub-part is different from the density of the second sub-part, and in each packaging part, the thickness of the first sub-part of at least two packaging parts is different.

[0046] In some embodiments, the step of forming a light emitting unit and an encapsulation portion for encapsulating each light emitting unit in the isolation opening includes:

[0047] Forming a first light emitting material layer, a first sub-encapsulation material layer, and a second sub-encapsulation material layer in sequence on a side of the isolation structure facing away from the substrate;

[0048] The first light-emitting material layer, the first sub-encapsulation material layer and the second sub-encapsulation material layer are patterned to form a first light-emitting unit and a first encapsulation part, wherein the first encapsulation part includes a first sub-part and a second sub-part, the first sub-part covers the first electrode, the second sub-part covers the first sub-part, and the density of the first sub-part is different from the density of the second sub-part;

[0049] forming a second light emitting material layer, a first sub-encapsulation material layer and a second sub-encapsulation material layer in sequence on a side of the isolation structure facing away from the substrate;

[0050] The second light-emitting material layer, the first sub-encapsulation material layer and the second sub-encapsulation material layer are patterned to form a second light-emitting unit and a second encapsulation part, wherein the second encapsulation part includes a first sub-part and a second sub-part, the first sub-part covers the first electrode, the second sub-part covers the first sub-part, and the density of the first sub-part is different from the density of the second sub-part;

[0051] forming a third light emitting material layer, a first sub-encapsulation material layer and a second sub-encapsulation material layer in sequence on a side of the isolation structure facing away from the substrate;

[0052] The third light-emitting material layer, the first sub-packaging material layer and the second sub-packaging material layer are patterned to form a third light-emitting unit and a third packaging part. The third packaging part includes a first sub-part and a second sub-part. The first sub-part covers the first electrode, and the second sub-part covers the first sub-part. The density of the first sub-part is different from the density of the second sub-part.

[0053] In some embodiments, the thickness of the first sub-encapsulation material layer corresponding to the first light emitting material layer and the second light emitting material layer is smaller than the thickness of the first sub-encapsulation material layer corresponding to the third light emitting material layer.

[0054] In some embodiments, the step of sequentially forming a first light emitting material layer, a first sub-encapsulation material layer, and a second sub-encapsulation material layer on a side of the isolation structure facing away from the substrate further includes:

[0055] forming a third sub-packaging material layer on a side of the second sub-packaging material layer facing away from the substrate;

[0056] The step of patterning the first light-emitting material layer, the first sub-encapsulation material layer and the second sub-encapsulation material layer to form the first light-emitting unit and the first encapsulation part further includes:

[0057] Performing patterning on the third sub-encapsulation material layer to form a third sub-section located on a side of the second sub-section away from the substrate;

[0058] The step of sequentially forming a second light emitting material layer, a first sub-encapsulation material layer, and a second sub-encapsulation material layer on a side of the isolation structure away from the substrate further includes:

[0059] forming a third sub-packaging material layer on a side of the second sub-packaging material layer facing away from the substrate;

[0060] The step of patterning the second light emitting material layer, the first sub-encapsulation material layer and the second sub-encapsulation material layer to form a second light emitting unit and a second encapsulation part further includes:

[0061] Performing patterning on the third sub-encapsulation material layer to form a third sub-section located on a side of the second sub-section away from the substrate;

[0062] The step of sequentially forming a third light emitting material layer, a first sub-encapsulation material layer, and a second sub-encapsulation material layer on a side of the isolation structure facing away from the substrate further includes:

[0063] forming a third sub-packaging material layer on a side of the second sub-packaging material layer facing away from the substrate;

[0064] The step of patterning the third light-emitting material layer, the first sub-encapsulation material layer, and the second sub-encapsulation material layer to form a third light-emitting unit and a third encapsulation part further includes:

[0065] The third sub-encapsulation material layer is patterned to form a third sub-portion located on a side of the second sub-portion away from the substrate.

[0066] In some embodiments, the thickness of the third sub-encapsulation material layer corresponding to the first light emitting material layer and the second light emitting material layer is greater than the thickness of the third sub-encapsulation material layer corresponding to the third light emitting material layer.

[0067] A third aspect of the present application provides a display device, comprising any of the above display panels or a display panel prepared by any of the above preparation methods.

[0068] The present application provides a display panel, a method for preparing a display panel, and a display device. The display panel includes a substrate, an isolation structure, a light-emitting layer, and a first encapsulation layer. The isolation structure is arranged on one side of the substrate and encloses a plurality of isolation openings. The isolation structure includes a first isolation portion and a second isolation portion arranged on the side of the first isolation portion away from the substrate. The orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate. Therefore, the light-emitting material can be separated by the second isolation portion to form a plurality of light-emitting units, so that the light-emitting units are located in each isolation opening without using a mask, which can save costs. The light-emitting unit includes a first electrode, and the first electrode overlaps the first isolation portion. Therefore, the first electrodes of the plurality of light-emitting units can be connected to form a whole-surface electrode through the first isolation portion. The first encapsulation layer includes an encapsulation portion located on the side of each first electrode away from the substrate to encapsulate each light-emitting unit. Each packaging part includes at least a first sub-part and a second sub-part, the first sub-part covers the first electrode to package the corresponding light-emitting unit, and the second sub-part is located on the side of the first sub-part away from the substrate to cover the first sub-part, so that the light-emitting unit can be further packaged by the second sub-part, and the density of the first sub-part and the second sub-part is different, so that the performance of the packaging part can be improved by reasonably adjusting the density relationship between the first sub-part and the second sub-part. In addition, the thickness of the first sub-parts of at least two packaging parts in each packaging part is different. In the process of preparing the light-emitting unit and the packaging part, the light-emitting unit and the packaging part corresponding to the first sub-part with the smallest thickness can be prepared first, reducing the contact area between the material of the first sub-part of the packaging part prepared earlier and the side wall of the first isolation part facing the isolation opening, and even making the material of the first sub-part not contact the side wall of the first isolation part. When the material of the first sub-part in the partial isolation opening is subsequently etched and removed, the material of the first sub-part in the partial isolation opening can be easily etched and removed, reducing the risk of the material of the first sub-part remaining on the side wall of the first isolation part corresponding to the partial isolation opening, thereby improving the overlap yield of the first electrode of the light-emitting unit prepared later and the corresponding first isolation part. BRIEF DESCRIPTION OF THE DRAWINGS

[0069] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0070] Figure 1 A schematic cross-sectional view of a display panel provided in some embodiments of the present application;

[0071] Figure 2 Another cross-sectional schematic diagram of a display panel provided in some embodiments of the present application;

[0072] Figure 3 A schematic cross-sectional view of a display panel provided in some other embodiments of the present application;

[0073] Figure 4 A schematic cross-sectional view of a display panel provided in some other embodiments of the present application;

[0074] Figure 5 A flow chart of a method for preparing a display panel provided in some embodiments of the present application;

[0075] Figure 6 Another flow chart of a method for preparing a display panel provided in some embodiments of the present application.

[0076] The figures are as follows:

[0077] Display panel 100; substrate 10; isolation structure 20; isolation opening 21; first isolation portion 22; second isolation portion 23; light-emitting unit 30; first light-emitting unit 301; second light-emitting unit 302; third light-emitting unit 303; first electrode 31; light-emitting functional layer 32; second electrode 33; encapsulation portion 40; first encapsulation portion 401; second encapsulation portion 402; third encapsulation portion 403; first sub-portion 41; first segment 411; second segment 412; third segment 413; second sub-portion 42; third sub-portion 43; fourth segment 431; fifth segment 432; second encapsulation layer 50; third encapsulation layer 60. DETAILED DESCRIPTION

[0078] The following detailed description and drawings of the embodiments of the present application are used to illustrate the principles of the present application, but cannot be used to limit the scope of the present application, that is, the present application is not limited to the described embodiments.

[0079] In the description of the present application, it should be noted that, unless otherwise specified, "multiple" means more than two; the terms "upper", "lower", "left", "right", "inside", "outside", etc., indicating the orientation or positional relationship, are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. "Vertical" is not strictly vertical, but is within the allowable error range. "Parallel" is not strictly parallel, but is within the allowable error range.

[0080] Reference to "embodiments" in this application means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described in this application may be combined with other embodiments.

[0081] The directional words appearing in the following description are all directions shown in the figures, and do not limit the specific structure of this application. In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0082] An embodiment of the present application provides a display panel, which may be an organic light emitting diode (OLED) display panel, or other types of display panels, such as a micro light emitting diode (Micro Light Emitting Diode, Micro-LED) or a quantum dot light emitting diode (Quantum Light Emitting Diode, QLED) display panel.

[0083] See also Figure 1 and Figure 2 In a first aspect, the present application provides a display panel 100, comprising a substrate 10, an isolation structure 20, a light-emitting layer and a first encapsulation layer, wherein the isolation structure 20 is disposed on one side of the substrate 10 and encloses a plurality of isolation openings 21, the isolation structure 20 comprises a first isolation portion 22 and a second isolation portion 23 disposed on a side of the first isolation portion 22 away from the substrate 10, the orthographic projection of the first isolation portion 22 on the substrate 10 is located within the orthographic projection of the second isolation portion 23 on the substrate 10; the light-emitting layer comprises a light-emitting unit 30 located in each isolation opening 21, The first electrode 31 is arranged on the side of the light-emitting unit 30 away from the substrate 10, and the first electrode 31 overlaps the first isolation portion 22; the first encapsulation layer includes an encapsulation portion 40 located on the side of each first electrode 31 away from the substrate 10, and the encapsulation portion 40 includes at least a first sub-portion 41 and a second sub-portion 42, the first sub-portion 41 covers the first electrode 31, and the second sub-portion 42 covers the first sub-portion 41, the density of the first sub-portion 41 is different from the density of the second sub-portion 42, and in each encapsulation portion 40, the thickness of the first sub-portion 41 of at least two encapsulation portions 40 is different.

[0084] The substrate 10 includes a substrate and a driving circuit layer arranged on the substrate. The substrate can be a hard substrate made of materials such as glass or plastic, or a flexible substrate made of materials such as polyethersulfone (PES), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyarylate, polyimide (PI), polycarbonate (PC) or cellulose acetate propionate (CAP). A driving circuit for controlling the light emission of the light emitting unit 30 is arranged in the driving circuit layer. The driving circuit layer is generally composed of inorganic film layers such as a metal layer, a semiconductor layer (active layer), and an insulating layer. By patterning these inorganic film layers, a driving circuit for controlling the light emission of the light emitting unit 30 can be formed. There are many implementation methods for its specific circuit structure, which will not be repeated here.

[0085] The isolation structure 20 encloses a plurality of isolation openings 21. The isolation structure 20 includes a first isolation portion 22 and a second isolation portion 23 disposed on the side of the first isolation portion 22 away from the substrate 10. The orthographic projection of the first isolation portion 22 on the substrate 10 is located within the orthographic projection of the second isolation portion 23 on the substrate 10. Therefore, when the light-emitting material is deposited on the side of the isolation structure 20 away from the substrate 10, the light-emitting material can be separated by the isolation structure 20 to form a plurality of light-emitting units 30 disconnected from each other, thereby eliminating the need to use a precision mask plate to prepare the light-emitting unit 30, reducing the development and use of precision masks, and reducing preparation costs. In addition, each light-emitting unit 30 is disposed one-to-one in each isolation opening 21, thereby reducing carrier crosstalk in each light-emitting unit 30 and improving the display effect of the display panel 100. The composition, preparation, and other contents of the isolation structure 20 are described in patents PCT / CN2023 / 134518, 202310759370.2, 202310740412.8, 202310707209.0, 202311346196.5,

[0087] Further described in 202310909421.5 for reference.

[0088] The light-emitting unit 30 may include a first electrode 31, a light-emitting functional layer 32, and a second electrode 33 which are stacked. The first electrode 31 may be located on the side of the light-emitting functional layer 32 facing away from the substrate 10, and the second electrode 33 may be located on the side of the light-emitting functional layer 32 facing the substrate 10. The first electrode 31 overlaps the first isolating portion 22, so that the first electrodes 31 of multiple light-emitting units 30 may be electrically connected through the first isolating portion 22 to form a whole-surface electrode to ensure that the light-emitting unit 30 emits light normally. One of the first electrode 31 and the second electrode 33 may serve as the anode of the light-emitting unit 30, and the other may serve as the cathode of the light-emitting unit 30. The embodiment of the present application takes the first electrode 31 as the cathode of the light-emitting unit 30 and the second electrode 33 as the anode of the light-emitting unit 30 as an example. It should be noted that the light-emitting functional layer 32 can be formed by stacking multiple film layer structures. For example, the light-emitting functional layer 32 can include a stacked hole injection layer (Hole Inject Layer, HIL), a hole transport layer (Hole Transport Layer, HTL), a light-emitting layer, an electron injection layer (Electron Inject Layer, EIL) and an electron transport layer (Electron Transport Layer, ETL).

[0089] The first encapsulation layer includes an encapsulation portion 40 located on the side of each first electrode 31 away from the substrate 10. The encapsulation portion 40 is arranged one-to-one in each isolation opening 21. The encapsulation portion 40 can be used to independently encapsulate each light-emitting unit 30 to reduce the risk of the light-emitting unit 30 being affected by factors such as water vapor, thereby improving the reliability of the display panel 100. The encapsulation portion 40 includes a first sub-portion 41, which includes an inorganic material and can provide good mechanical support and encapsulation protection to prevent the display panel 100 from being affected by the environment. At the same time, it can further isolate harmful substances such as moisture and oxygen from the outside from entering the interior of the display panel 100, thereby improving the service life and stability of the display panel 100.

[0090] Each packaging part 40 includes at least a first sub-part 41 and a second sub-part 42. The first sub-part 41 covers the first electrode 31 to package the corresponding light-emitting unit 30. The second sub-part 42 is located on the side of the first sub-part 41 away from the substrate 10 to cover the first sub-part 41. Therefore, the light-emitting unit 30 can be further packaged by the second sub-part 42. At the same time, the second sub-part 42 can also protect the first sub-part 41 to prevent the first sub-part 41 from being etched and damaged by the etching material in the subsequent process, thereby improving the packaging effect of the light-emitting unit 30. In addition, the second sub-part 42 can also limit the first sub-part 41, so that the first sub-part 41 more firmly covers the side of the first electrode 31 away from the substrate 10, reducing the risk of the first sub-part 41 and the first electrode 31 separating and affecting the packaging effect. The first sub-part 41 and the second sub-part 42 have different densities. Specifically, the density of the first sub-part 41 can be greater than the density of the second sub-part 42, or less than the density of the second sub-part 42. This embodiment does not limit this. The first sub-portion 41 and the second sub-portion 42 have different densities, so the performance of the packaging portion 40 can be improved by reasonably adjusting the density relationship between the first sub-portion 41 and the second sub-portion 42 .

[0091] The multiple light-emitting units 30 may include a red light-emitting unit 30, a green light-emitting unit 30 and a blue light-emitting unit 30. Specifically, taking the example of preparing the red light-emitting unit 30 before the green light-emitting unit 30, since the precision mask plate is cancelled, during the preparation process of the red light-emitting unit 30, the red light-emitting material and the red packaging material corresponding to the red light-emitting unit 30 will fall into each isolation opening 21 in turn, and then the red light-emitting material and the red packaging material corresponding to a portion of the isolation openings 21 are selectively etched away, and the red light-emitting material and the red packaging material corresponding to another portion of the isolation openings 21 are retained, thereby forming a red light-emitting unit 30 and a packaging part 40 corresponding to the red light-emitting unit 30. Subsequently, a green light-emitting unit 30 and a packaging part 40 corresponding to the green light-emitting unit 30 are prepared. During the preparation process, the green light-emitting material and the green packaging material will fall into each isolation opening 21 in turn, and then the green light-emitting material and the green packaging material corresponding to a portion of the isolation openings 21 are selectively etched to remove, and the green light-emitting material and the green packaging material corresponding to another portion of the isolation openings 21 are retained to form a green light-emitting unit 30 and a packaging part 40 corresponding to the green light-emitting unit 30. In the process of removing the green light-emitting material and the green sealing material in some of the isolation openings 21, the green light-emitting material in the isolation openings 21 corresponding to the red light-emitting unit 30 and the green packaging material located on the side of the green light-emitting material away from the substrate 10 need to be removed, so that only the red light-emitting unit 30 for emitting red light and the packaging part 40 for packaging the red light-emitting unit 30 exist in the isolation openings 21 corresponding to the red light-emitting unit 30.

[0092] It can be understood that after the red packaging material falls into each isolation opening 21, part of the red first sub-portion material in the red packaging material will fall on the side wall of the first isolation portion 22 facing the isolation opening 21. If the thickness of the red first sub-portion material is large, its contact area with the first isolation portion 22 is large. When the red light-emitting material and the red packaging material corresponding to a portion of the isolation opening 21 are selectively etched subsequently, part of the red first sub-portion material may remain on the side wall of the first isolation portion 22 corresponding to the portion of the isolation opening 21. Therefore, when the green light-emitting unit 30 and the blue light-emitting unit 30 are subsequently prepared in the portion of the isolation opening 21, the red first sub-portion material remaining on the side wall of the first isolation portion 22 may affect the overlap yield of the first electrode 31 of the green light-emitting unit 30 and the blue light-emitting unit 30 and the first isolation portion 22, thereby affecting the performance of the display panel 100.

[0093] In view of this, the present application provides a display panel 100, wherein the thickness of the first sub-portions 41 of at least two packaging portions 40 in each packaging portion 40 is different. In the process of preparing the light-emitting unit 30 and the packaging portion 40, the light-emitting unit 30 and the packaging portion 40 corresponding to the first sub-portion 41 with the smallest thickness can be preferentially prepared, thereby reducing the contact area between the material of the first sub-portion 41 of the packaging portion 40 prepared earlier and the side wall of the first isolation portion 22 facing the isolation opening 21, and even making the material of the first sub-portion 41 not in contact with the side wall of the first isolation portion 22. When the material of the first sub-portion 41 in the partial isolation opening 21 is subsequently etched away, the material of the first sub-portion 41 in the partial isolation opening 21 can be easily etched away, thereby reducing the risk of the material of the first sub-portion 41 remaining on the side wall of the first isolation portion 22 corresponding to the partial isolation opening 21, thereby improving the overlap yield of the first electrode 31 of the light-emitting unit 30 prepared subsequently and the corresponding first isolation portion 22.

[0094] It should be noted that the thickness mentioned in this application may be the minimum thickness, which is specifically the minimum distance from the side of the film layer close to the substrate 10 to the side of the film layer away from the substrate 10, that is, the minimum distance between the two surfaces of the film layer along the thickness direction of the substrate 10.

[0095] Please continue reading Figure 1 In some embodiments, the thickness of the second sub-portion 42 is greater than the thickness of the first sub-portion 41 , thereby further improving the packaging effect of the light-emitting unit 30 and the limiting effect of the first sub-portion 41 .

[0096] Preferably, a gap is formed between a side of the first sub-portion 41 facing away from the substrate 10 and a side of the second isolation portion 23 facing the substrate 10 , and the second sub-portion 42 fills the gap.

[0097] Specifically, the orthographic projection of the first isolation portion 22 on the substrate 10 is located within the orthographic projection of the second isolation portion 23 on the substrate 10, and the second isolation portion 23 protrudes toward the isolation opening 21 relative to the first isolation portion 22. Therefore, when the first sub-portion 41 is arranged on the side of the first electrode 31 away from the substrate 10, there is usually a gap between the first sub-portion 41 and the second isolation portion 23. The second sub-portion 42 fills the gap, and the second sub-portion 42 is located on the side of the first sub-portion 41 away from the substrate 10, and is also located on the side of the first isolation portion 22 facing the isolation opening 21 and the side of the second isolation portion 23 facing the substrate 10, so that the second sub-portion 42 is in contact with the first sub-portion 41 and the isolation structure 20 at the same time. On the one hand, the invasion path of external impurities such as water vapor can be extended to improve the packaging effect of the light-emitting unit 30, and on the other hand, the structural strength of the second sub-portion 42 can be improved to reduce the risk of peeling of the second sub-portion 42. In addition, by filling the gap with the second sub-portion 42 , etching materials in subsequent processes can be prevented from entering the gap, thereby reducing the contact area between the packaging portion 40 and the etching materials in subsequent processes, and reducing the etching effect of the etching materials on the packaging portion 40 .

[0098] Preferably, the density of the first sub-portion 41 is greater than the density of the second sub-portion 42, which can improve the bonding ability between the first sub-portion 41 and the conductive material such as the first electrode 31, reduce the risk of the first sub-portion 41 peeling off relative to the conductive material such as the first electrode 31, and improve the packaging effect of the light-emitting unit 30. Alternatively, the density of the first sub-portion 41 is less than the density of the second sub-portion 42, which can improve the bonding ability between the second sub-portion 42 and the isolation structure 20. On the basis of packaging the corresponding light-emitting unit 30 through the first sub-portion 41, the corresponding light-emitting unit 30 can be further packaged through the second sub-portion 42 with a higher density to improve the packaging effect.

[0099] It should be noted that when the density of the first sub-portion 41 is greater than the density of the second sub-portion 42, during the preparation of the first sub-portion 41, its material is more likely to remain on the side wall of the first isolation portion 22 facing the isolation opening 21. Therefore, in the embodiment of the present application, the thickness of the first sub-portion 41 of at least two packaging portions 40 in each packaging portion 40 is different. In the process of preparing the light-emitting unit 30 and the packaging portion 40, the light-emitting unit 30 and the packaging portion 40 corresponding to the first sub-portion 41 with the smallest thickness can be prepared preferentially, thereby reducing the contact area between the material of the first sub-portion 41 of the packaging portion 40 prepared earlier and the side wall of the first isolation portion 22 facing the isolation opening 21, and even making the material of the first sub-portion 41 not in contact with the side wall of the first isolation portion 22. When the material of the first sub-portion 41 in the partial isolation opening 21 is subsequently etched away, the material of the first sub-portion 41 in the partial isolation opening 21 can be easily etched away, thereby reducing the risk of affecting the overlap between the first electrode 31 in the light-emitting unit 30 formed later and the corresponding first isolation portion 22 due to the residual material of the first sub-portion 41.

[0100] Preferably, the material of the first sub-portion 41 is the same as that of the second sub-portion 42 , which is beneficial to improving the bonding ability of the first sub-portion 41 and the second sub-portion 42 and reducing the risk of separation of the first sub-portion 41 and the second sub-portion 42 .

[0101] It should be noted that the material of the first sub-section 41 can be the same as the material of the second sub-section 42, which means that the first sub-section 41 and the second sub-section 42 contain the same elements, wherein the proportions of the elements can be different, so that the density of the first sub-section 41 is different from the density of the second sub-section 42.

[0102] Preferably, the first sub-section 41 and / or the second sub-section 42 include a silicon-containing inorganic material. Exemplarily, the first sub-section 41 and / or the second sub-section 42 may be made of materials such as silicon oxide, silicon nitride or silicon oxynitride, which can provide good mechanical support and packaging protection to prevent the display panel 100 from being affected by the environment, and can further isolate harmful substances such as moisture and oxygen from the outside from entering the interior of the display panel 100, thereby improving the service life and stability of the display panel 100.

[0103] Please continue reading Figure 1 In some embodiments, the second sub-portion 42 extends from the side wall of the second isolation portion 23 toward the isolation opening 21 to the side of the second isolation portion 23 away from the substrate 10, so as to further increase the contact area between the second sub-portion 42 and the isolation structure 20, extend the invasion path of impurities such as water vapor, and at the same time improve the bonding ability of the second sub-portion 42 with the isolation structure 20, reduce the risk of peeling relative to the isolation structure 20, so as to better encapsulate the light-emitting unit 30.

[0104] Preferably, the first sub-section 41 includes a first segment 411, a second segment 412 and a third segment 413, the first segment 411 is located on the side of the first electrode 31 facing away from the substrate 10, the second segment 412 is located on the side of the first isolation portion 22 facing the isolation opening 21, and the third segment 413 is located between the side wall of the second isolation portion 23 facing the isolation opening 21 and the second sub-section 42.

[0105] The first segment 411 of the first sub-portion 41 is located on the side of the first electrode 31 away from the substrate 10, and the second segment 412 is located on the side of the first isolation portion 22 toward the isolation opening 21, that is, part of the first sub-portion 41 extends from the side of the first electrode 31 away from the substrate 10 to the side wall of the first isolation portion 22 toward the isolation opening 21. The first sub-portion 41 not only covers the first electrode 31, but also covers part of the isolation structure 20, which can extend the invasion path of impurities such as water vapor, while improving the structural strength of the first sub-portion 41, reducing the risk of peeling of the first sub-portion 41, and improving the packaging effect.

[0106] It can be understood that, since the material of the first sub-section 41 is the same as that of the second sub-section 42 and the density of the first sub-section 41 is greater than that of the second sub-section 42, the bonding ability of the third segment 413 with the second sub-section 42 and the bonding ability of the third segment 413 with the second isolating portion 23 are both better than the bonding ability of the second sub-section 42 with the second isolating portion 23. Therefore, in these embodiments, by setting the first sub-section 41 to include the third segment 413, the third segment 413 is located between the side wall of the second isolating portion 23 facing the isolating opening 21 and the second sub-section 42, so that the second sub-section 42 is connected to the second isolating portion 23 through the third segment 413, compared with the second sub-section 42 directly contacting the second isolating portion 23, the bonding strength of the second sub-section 42 can be improved, and the risk of the second sub-section 42 peeling off relative to the isolating structure 20 can be reduced.

[0107] Preferably, the third segment 413 also extends to a side of the second isolation portion 23 away from the substrate 10 , so as to extend the invasion path between the third segment 413 and the second isolation portion 23 and improve the sealing effect.

[0108] See also Figure 3 In some embodiments, the packaging part 40 further includes a third sub-part 43, and the third sub-part 43 is arranged to cover the second sub-part 42. The third sub-part 43 can not only encapsulate the light-emitting unit 30 to further improve the encapsulation effect, but also protect the second sub-part 42 to prevent the second sub-part 42 from being damaged by etching materials in subsequent processes. In addition, by arranging the third sub-part 43 on the side of the second sub-part 42 away from the substrate 10, the third sub-part 43 can also limit the second sub-part 42 and the first sub-part 41, so that the second sub-part 42 and the first sub-part 41 are more secure.

[0109] Preferably, the first sub-section 41, the second sub-section 42 and the third sub-section 43 can be of the same material, for example, all silicon oxynitride; or they can be of different materials, for example, the first sub-section 41 is silicon nitride, the second sub-section 42 is silicon oxynitride, and the third sub-section 43 is silicon oxide; the combination is not limited thereto.

[0110] Preferably, the third sub-portion 43 extends to a side of the second isolation portion 23 away from the substrate 10 , so as to increase the contact area between the third sub-portion 43 and the second sub-portion 42 and improve the packaging effect.

[0111] Preferably, the third sub-portion 43 includes a fourth segment 431 and a fifth segment 432, the orthographic projection of the fourth segment 431 on the substrate 10 is located within the orthographic projection of the first electrode 31 on the substrate 10, the fifth segment 432 extends from the edge of the fourth segment 431 to the side of the second isolation portion 23 away from the substrate 10, and at least part of the fourth segment 431 is protruded relative to the first isolation portion 22 in a direction away from the substrate 10, so that the packaging portion 40 has sufficient thickness to ensure the packaging effect of the light-emitting unit 30.

[0112] Preferably, the density of the first sub-portion 41 is greater than that of the second sub-portion 42, which can improve the bonding ability of the first sub-portion 41 with the conductive material such as the first electrode 31, and reduce the risk of the first sub-portion 41 peeling off from the conductive material such as the first electrode 31. In addition, the density of the third sub-portion 43 is greater than that of the second sub-portion 42, which can improve the bonding ability of the third sub-portion 43 with the isolation structure 20, improve its packaging effect, and also improve the etching resistance of the third sub-portion 43, so that the third sub-portion 43 is not easily damaged by the etching material in the subsequent process, and improve the protection effect of the third sub-portion 43 on the second sub-portion 42 and the first sub-portion 41.

[0113] Preferably, the density of the third sub-portion 43 is greater than or equal to the density of the first sub-portion 41 , so as to further improve the etching resistance of the third sub-portion 43 .

[0114] Preferably, the material of the third sub-section 43 is the same as that of the second sub-section 42 , which is beneficial to improving the bonding ability of the second sub-section 42 and the third sub-section 43 and reducing the risk of separation of the second sub-section 42 and the third sub-section 43 .

[0115] Preferably, the third sub-portion 43 includes a silicon-containing inorganic material. Exemplarily, the third sub-portion 43 can be made of materials such as silicon oxide, silicon nitride or silicon oxynitride, which can provide good mechanical support and packaging protection to prevent the display panel 100 from being affected by the environment, and can further isolate harmful substances such as moisture and oxygen from the outside from entering the interior of the display panel 100, thereby improving the service life and stability of the display panel 100.

[0116] See also Figure 2 In some embodiments, the plurality of light-emitting units 30 include a first light-emitting unit 301, a second light-emitting unit 302, and a third light-emitting unit 303, and the plurality of encapsulation parts 40 include a first encapsulation part 401, a second encapsulation part 402, and a third encapsulation part 403, the first encapsulation part 401 is used to encapsulate the first light-emitting unit 301, the second encapsulation part 402 is used to encapsulate the second light-emitting unit 302, and the third encapsulation part 403 is used to encapsulate the third light-emitting unit 303.

[0117] Specifically, the first encapsulation part 401 is located on the side of the first light-emitting unit 301 away from the substrate 10, and is used to encapsulate the first light-emitting unit 301. The second encapsulation part 402 is located on the side of the second light-emitting unit 302 away from the substrate 10, and is used to encapsulate the second light-emitting unit 302. The third encapsulation part 403 is located on the side of the third light-emitting unit 303 away from the substrate 10, and is used to encapsulate the third light-emitting unit 303, so that each light-emitting unit 30 is individually encapsulated by each encapsulation part 40, thereby improving the encapsulation effect. Optionally, the isolation opening 21 includes a first isolation opening 21 for accommodating the first light-emitting unit 301, a second isolation opening 21 for accommodating the second light-emitting unit 302, and a third isolation opening 21 for accommodating the third light-emitting unit 303.

[0118] Optionally, the number of the first light-emitting unit 301, the second light-emitting unit 302, and the third light-emitting unit 303 can be multiple. Multiple first light-emitting units 301 can be prepared and formed in the same process step, multiple second light-emitting units 302 can be prepared and formed in the same process step, and multiple third light-emitting units 303 can be prepared and formed in the same process step. Optionally, multiple first light-emitting units 301 can be prepared first, then multiple second light-emitting units 302 can be prepared, and finally multiple third light-emitting units 303 can be prepared.

[0119] Correspondingly, the number of the first packaging part 401, the second packaging part 402 and the third packaging part 403 can also be multiple, and the multiple first packaging parts 401 can be prepared and formed in the same process step, and the multiple first packaging parts 401 can be prepared after the multiple first light-emitting units 301 are prepared and formed. The multiple second packaging parts 402 can be prepared and formed in the same process step, and the multiple second packaging parts 402 can be prepared after the multiple second light-emitting units 302 are prepared and formed. The multiple third packaging parts 403 can be prepared and formed in the same process step, and the multiple third packaging parts 403 can be prepared after the multiple third light-emitting units 303 are prepared and formed.

[0120] Preferably, the thickness of the third subsection 43 of the first packaging part 401 is greater than or equal to the thickness of the third subsection 43 of the second packaging part 402 , and / or the thickness of the third subsection 43 of the second packaging part 402 is greater than the thickness of the third subsection 43 of the third packaging part 403 .

[0121] It is understandable that, in the process of preparing the display panel 100, the first light-emitting unit 301 and the first packaging part 401 are first formed in the first isolation opening 21, and then the second light-emitting unit 302 and the second packaging part 402 are formed in the second isolation opening 21, and finally the third light-emitting unit 303 and the third packaging part 403 are formed in the third isolation opening 21. In the process of forming the second light-emitting unit 302 and the second packaging part 402, it is necessary to etch and remove the second light-emitting material and the corresponding packaging material located on the side of the first packaging part 401 away from the substrate 10. In this process, part of the material of the first packaging part 401 may be removed simultaneously. Similarly, when forming the third light-emitting unit 303 and the third packaging part 403, the etching material used to etch the third light-emitting material and the corresponding packaging material may cause etching damage to the first packaging part 401 and the second packaging part 402.

[0122] Therefore, in these embodiments, the thickness of the third sub-portion 43 of the first encapsulation part 401 is greater than or equal to the thickness of the third sub-portion 43 of the second encapsulation part 402. Before the second light-emitting unit 302 and the second encapsulation part 402 are formed, the thickness of the third sub-portion 43 of the first encapsulation part 401 is greater, so that the third sub-portion 43 of the first encapsulation part 401 has sufficient etching resistance to resist etching damage of the etching material in the subsequent process, thereby ensuring the packaging reliability of the first encapsulation part 401. Similarly, the thickness of the third sub-portion 43 of the second encapsulation part 402 is greater than the thickness of the third sub-portion 43 of the third encapsulation part 403. Before the third light-emitting unit 303 and the third encapsulation part 403 are formed, the thickness of the third sub-portion 43 of the second encapsulation part 402 is greater, so that the third sub-portion 43 of the second encapsulation part 402 has sufficient etching resistance to resist etching damage of the etching material in the subsequent process, thereby ensuring the packaging reliability of the second encapsulation part 402.

[0123] Preferably, the thickness of the first packaging part 401 is greater than the thickness of the second packaging part 402 , and the thickness of the second packaging part 402 is greater than the thickness of the third packaging part 403 .

[0124] It should be noted that the thickness of the first packaging part 401 refers to the sum of the thicknesses of the first sub-part 41, the second sub-part 42 and the third sub-part 43 in the first packaging part 401, the thickness of the second packaging part 402 refers to the sum of the thicknesses of the first sub-part 41, the second sub-part 42 and the third sub-part 43 in the second packaging part 402, and the thickness of the third packaging part 403 refers to the sum of the thicknesses of the first sub-part 41, the second sub-part 42 and the third sub-part 43 in the third packaging part 403.

[0125] In these embodiments, the thickness of the first encapsulation part 401 is set to be greater than the thickness of the second encapsulation part 402, so as to ensure the encapsulation effect of the first encapsulation part 401 on the first light-emitting unit 301 and reduce the risk of failure of the first encapsulation part 401 due to the influence of subsequent processes. Similarly, the thickness of the second encapsulation part 402 is greater than the thickness of the third encapsulation part 403, so as to ensure the encapsulation effect of the second encapsulation part 402 on the second light-emitting unit 302 and reduce the risk of failure of the second encapsulation part 402 due to the influence of subsequent processes.

[0126] Please continue reading Figure 2 In some embodiments, the plurality of light-emitting units 30 include a first light-emitting unit 301, a second light-emitting unit 302, and a third light-emitting unit 303, the plurality of encapsulation parts 40 include a first encapsulation part 401, a second encapsulation part 402, and a third encapsulation part 403, the first encapsulation part 401 is used to encapsulate the first light-emitting unit 301, the second encapsulation part 402 is used to encapsulate the second light-emitting unit 302, the third encapsulation part 403 is used to encapsulate the third light-emitting unit 303, and at least two of the first sub-part 41 of the first encapsulation part 401, the first sub-part 41 of the second encapsulation part 402, and the first sub-part 41 of the third encapsulation part 403 have different thicknesses. Therefore, in the process of preparing each light-emitting unit 30 and each encapsulation part 40, it can be preferentially prepared The light-emitting unit 30 and the packaging part 40 corresponding to the first sub-part 41 with the smallest thickness reduce the contact area between the material of the first sub-part 41 of the packaging part 40 prepared earlier and the side wall of the first isolation part 22 facing the isolation opening 21, and even make the material of the first sub-part 41 not in contact with the side wall of the first isolation part 22. When the material of the first sub-part 41 in the partial isolation opening 21 is subsequently etched away, the material of the first sub-part 41 in the partial isolation opening 21 can be easily etched away, reducing the risk of the material of the first sub-part 41 remaining on the side wall of the first isolation part 22 corresponding to the partial isolation opening 21, thereby improving the overlap yield of the first electrode 31 of the light-emitting unit 30 prepared subsequently and the corresponding first isolation part 22.

[0127] In some embodiments, the thickness of the first sub-portion 41 of the first packaging portion 401 and / or the second packaging portion 402 is less than the thickness of the first isolation portion 22, which can reduce the risk of material of the first sub-portion 41 of the first packaging portion 401 and / or the second packaging portion 402 remaining on the side wall of the first isolation portion 22 corresponding to the subsequently formed third light-emitting unit 303, thereby improving the overlap yield of the first electrode 31 of the subsequently formed third light-emitting unit 303 and the first isolation portion 22.

[0128] Preferably, the ratio Z1 of the thickness of the first sub-portion 41 of the first packaging part 401 and / or the second packaging part 402 to the thickness of the first isolation part 22 satisfies: 0.05≤Z1<1, so as to reasonably set the relationship between the thickness of the first sub-portion 41 of the first packaging part 401 and / or the second packaging part 402 and the thickness of the first isolation part 22, so that the first sub-portion 41 of the first packaging part 401 and / or the second packaging part 402 has better packaging capability, and at the same time reduces the risk of material of the first sub-portion 41 of the first packaging part 401 and / or the second packaging part 402 remaining on the side wall of the first isolation part 22 corresponding to the subsequently formed third light-emitting unit 303.

[0129] It can be understood that the ratio of the thickness of the first sub-portion 41 of the first packaging portion 401 and / or the second packaging portion 402 to the thickness of the first isolation portion 22 is greater than or equal to 0.05 and less than 1. For example, the ratio can be 0.05, 0.1, 0.3, 0.5, 0.7, 0.9, 0.95, etc.

[0130] Please continue reading Figure 2 In some embodiments, the thickness of the first sub-portion 41 of the third encapsulation portion 403 is greater than the thickness of the first sub-portion 41 of the first encapsulation portion 401 and / or the second encapsulation portion 402 .

[0131] Specifically, since the third encapsulation part 403 is prepared after each light-emitting unit 30, the material of the first sub-part 41 of the third encapsulation part 403 will not remain on the side wall of the first isolation part 22, so the thickness of the first sub-part 41 of the third encapsulation part 403 can be increased to improve its encapsulation effect on the third light-emitting unit 303.

[0132] Preferably, a ratio Z2 of the thickness of the first sub-portion 41 of the third packaging portion 403 to the thickness of the first sub-portion 41 of the first packaging portion 401 and / or the second packaging portion 402 satisfies: 1<Z2≤12, so that the first sub-portion 41 of the third packaging portion 403 has good packaging capability.

[0133] It should be noted that the ratio of the thickness of the first sub-portion 41 of the third packaging part 403 to the thickness of the first sub-portion 41 of the first packaging part 401 and / or the second packaging part 402 is greater than 1 and less than or equal to 12. For example, the ratio can be 1.2, 3, 4, 6, 8, 10, 12, etc.

[0134] Preferably, the thickness of the first sub-portion 41 of the first packaging portion 401 is less than or equal to the thickness of the first sub-portion 41 of the second packaging portion 402. When the thickness of the first sub-portion 41 of the first packaging portion 401 is less than the thickness of the first sub-portion 41 of the second packaging portion 402, the first packaging portion 401 can be prepared first, and then the second packaging portion 402 can be prepared, thereby reducing the risk of the material of the first sub-portion 41 of the first packaging portion 401 remaining in the isolation opening 21 corresponding to the second packaging portion 402. When the thickness of the first sub-portion 41 of the first packaging portion 401 is equal to the thickness of the first sub-portion 41 of the second packaging portion 402, the difficulty of preparing the first sub-portion 41 of the first packaging portion 401 and the second packaging portion 402 can be reduced.

[0135] Please continue reading Figure 2 In some embodiments, a ratio Z3 of the thickness of the first sub-portion 41 of the third packaging portion 403 to the thickness of the first isolation portion 22 satisfies: 0.1≤Z3≤1.2, so as to reasonably set the relationship between the thickness of the first sub-portion 41 of the third packaging portion 403 and the thickness of the first isolation portion 22, so that the third packaging portion 403 has good packaging capability to improve its packaging effect on the third light-emitting unit 303.

[0136] Preferably, the thickness of the first sub-portion 41 of the third packaging portion 403 is greater than or equal to the thickness of the first isolation portion 22 , so as to further improve the packaging capability of the third packaging portion 403 .

[0137] Please continue reading Figure 2 In some embodiments, the thickness H1 of the first sub-portion 41 of the first packaging portion 401 and / or the second packaging portion 402 satisfies: 500 angstroms ≤ H1 ≤ 5000 angstroms. For example, the thickness of the first sub-portion 41 of the first packaging portion 401 and / or the second packaging portion 402 may be 500 angstroms, 700 angstroms, 900 angstroms, 2000 angstroms, 3000 angstroms, 5000 angstroms, etc., so that the first sub-portion 41 of the first packaging portion 401 and / or the second packaging portion 402 has better packaging capabilities, and at the same time can reduce the risk of material of the first sub-portion 41 of the first packaging portion 401 and / or the second packaging portion 402 remaining on the side wall of the first isolation portion 22 corresponding to the subsequently formed third light-emitting unit 303.

[0138] Optionally, the thickness H2 of the first sub-portion 41 of the third packaging portion 403 satisfies: 1000 angstroms ≤ H2 ≤ 6000 angstroms. For example, the thickness of the first sub-portion 41 of the third packaging portion 403 can be 1000 angstroms, 2000 angstroms, 3000 angstroms, 4000 angstroms, 6000 angstroms, etc., so that the first sub-portion 41 of the third packaging portion 403 has good packaging capabilities.

[0139] Preferably, the thickness H3 of the first isolation portion 22 satisfies: 5000 angstroms ≤ H3 ≤ 10000 angstroms. For example, the thickness of the first isolation portion 22 can be 5000 angstroms, 6000 angstroms, 7000 angstroms, 8000 angstroms, 10000 angstroms, etc., so as to reasonably set the thickness of the first isolation portion 22 and improve the isolation effect of the isolation structure 20.

[0140] It can be understood that the embodiment of the present application can reduce the material of the first encapsulation part 401 and / or the first sub-part 41 of the second encapsulation part 402 remaining on the side wall of the first isolation part 22 while ensuring the encapsulation effect of the first sub-part 41 of each encapsulation part 40 on the corresponding light-emitting unit 30 by reasonably setting the thickness of the first isolation part 22, the thickness of the first sub-part 41 of the first encapsulation part 401 and / or the second encapsulation part 402, and the thickness of the first sub-part 41 of the third encapsulation part 403, thereby reducing the risk of the first electrode 31 of the light-emitting unit 30 formed later being affected by the residual material of the first sub-part 41.

[0141] In some embodiments, the material of the first isolation portion 22 includes a conductive material, so that the first electrode 31 of each light-emitting unit 30 can be connected through the first isolation portion 22 to form a whole-surface electrode, ensuring that the display panel 100 emits light normally.

[0142] Preferably, the material of the second isolation portion 23 includes a conductive material, which can reduce the resistivity of the isolation structure 20 .

[0143] Preferably, the isolation structure 20 further includes a third isolation portion, which is located on a side of the first isolation portion 22 facing the substrate 10 , so that the isolation opening 21 has a large height difference, so as to separate the light-emitting material and the packaging material.

[0144] See also Figure 4 In some embodiments, the display panel 100 further includes a second encapsulation layer 50 , which is disposed on a side of the first encapsulation layer away from the substrate 10 to further prevent external moisture, oxygen, etc. from entering the display panel 100 .

[0145] Preferably, the second encapsulation layer 50 includes an organic material. The second encapsulation layer 50 may be made of an organic material such as a polymer. The thickness of the second encapsulation layer 50 may be greater than that of the first encapsulation layer, and the second encapsulation layer 50 has a stronger flexibility, so it can better adapt to the bending and curvature of the display panel 100. In addition, the organic material can also buffer external forces. Optionally, the second encapsulation layer 50 can be prepared by an inkjet printing process, which is conducive to improving production efficiency and reducing production costs.

[0146] Preferably, the display panel 100 further includes a third encapsulation layer 60 , and the third encapsulation layer 60 is disposed on a side of the second encapsulation layer 50 away from the substrate 10 , so as to further improve the encapsulation effect.

[0147] Preferably, the third encapsulation layer 60 includes inorganic materials, thereby providing good mechanical support and encapsulation protection to prevent the display panel 100 from being affected by the environment, and further isolating harmful substances such as moisture and oxygen from the outside from entering the interior of the display panel 100 .

[0148] See also Figure 5 In a second aspect, the present application provides a method for preparing a display panel 100, comprising:

[0149] S10. An isolation structure 20 is formed on one side of the substrate 10. The isolation structure 20 encloses a plurality of isolation openings 21. The isolation structure 20 includes a first isolation portion 22 and a second isolation portion 23 disposed on a side of the first isolation portion 22 facing away from the substrate 10. The orthographic projection of the first isolation portion 22 on the substrate 10 is located within the orthographic projection of the second isolation portion 23 on the substrate 10.

[0150] S20. A light-emitting unit 30 and a packaging portion 40 for packaging each light-emitting unit 30 are formed in the isolation opening 21. The light-emitting unit 30 includes a first electrode 31. The first electrode 31 overlaps the first isolation portion 22. The packaging portion 40 includes at least a first sub-portion 41 and a second sub-portion 42. The first sub-portion 41 covers the first electrode 31, and the second sub-portion 42 covers the first sub-portion 41. The density of the first sub-portion 41 is different from that of the second sub-portion 42. In each packaging portion 40, the thickness of the first sub-portion 41 of at least two packaging portions 40 is different.

[0151] In these embodiments, an isolation structure 20 is first formed on one side of the substrate 10, and the isolation structure 20 encloses a plurality of isolation openings 21. The isolation structure 20 includes a first isolation portion 22 and a second isolation portion 23 disposed on the side of the first isolation portion 22 away from the substrate 10, and the orthographic projection of the first isolation portion 22 on the substrate 10 is located within the orthographic projection of the second isolation portion 23 on the substrate 10. Subsequently, a light-emitting unit 30 and a packaging portion 40 for packaging each light-emitting unit 30 are formed in the isolation opening 21. The light-emitting unit 30 includes a first electrode 31, and the first electrode 31 overlaps the first isolation portion 22. The packaging portion 40 includes at least a first sub-portion 41 and a second sub-portion 42. The first sub-portion 41 covers the first electrode 31, and the second sub-portion 42 covers the first sub-portion 41. The density of the first sub-portion 41 is different from that of the second sub-portion 42, so that the light-emitting unit 30 is packaged together by the first sub-portion 41 and the second sub-portion 42 having different densities, so as to improve the packaging effect. In each packaging part 40, the thickness of the first sub-part 41 of at least two packaging parts 40 is different. In the process of preparing the light-emitting unit 30 and the packaging part 40, the light-emitting unit 30 and the packaging part 40 corresponding to the first sub-part 41 with the smallest thickness can be prepared preferentially, thereby reducing the contact area between the material of the first sub-part 41 of the packaging part 40 prepared earlier and the side wall of the first isolation part 22 facing the isolation opening 21, and even making the material of the first sub-part 41 not in contact with the side wall of the first isolation part 22. When the material of the first sub-part 41 in the partial isolation opening 21 is subsequently etched away, the material of the first sub-part 41 in the partial isolation opening 21 can be easily etched away, thereby reducing the risk of the material of the first sub-part 41 remaining on the side wall of the first isolation part 22 corresponding to the partial isolation opening 21, thereby improving the overlap yield of the first electrode 31 of the light-emitting unit 30 prepared subsequently and the corresponding first isolation part 22.

[0152] See also Figure 6 In some embodiments, the step of forming the light emitting unit 30 and the encapsulation portion 40 for encapsulating each light emitting unit 30 in the isolation opening 21 includes:

[0153] S21, sequentially forming a first light emitting material layer, a first sub-encapsulation material layer, and a second sub-encapsulation material layer on a side of the isolation structure 20 facing away from the substrate 10. Specifically, the first sub-encapsulation material layer is located on a side of the first light emitting material layer facing away from the substrate 10, and the second sub-encapsulation material layer is located on a side of the first sub-encapsulation material layer facing away from the substrate 10.

[0154] S22, patterning the first light-emitting material layer, the first sub-encapsulation material layer, and the second sub-encapsulation material layer to form a first light-emitting unit 301 and a first encapsulation part 401, wherein the first encapsulation part 401 includes a first sub-part 41 and a second sub-part 42, wherein the first sub-part 41 covers the first electrode 31, and the second sub-part 42 covers the first sub-part 41, and the density of the first sub-part 41 is different from the density of the second sub-part 42. Specifically, patterning is performed on the first light-emitting material layer, the first sub-encapsulation material layer, and the second sub-encapsulation material layer, that is, part of the first light-emitting material layer, the first sub-encapsulation material layer, and the second sub-encapsulation material layer is removed, and part of the first light-emitting material layer, the first sub-encapsulation material layer, and the second sub-encapsulation material layer on the side of the isolation opening 21 and the isolation structure 20 facing away from the substrate 10 is retained to form the first light-emitting unit 301 and the first encapsulation part 401 including the first sub-part 41 and the second sub-part 42.

[0155] S23, sequentially forming a second light emitting material layer, a first sub-encapsulation material layer, and a second sub-encapsulation material layer on a side of the isolation structure 20 away from the substrate 10. The first sub-encapsulation material layer is located on a side of the second light emitting material layer away from the substrate 10, and the second sub-encapsulation material layer is located on a side of the first sub-encapsulation material layer away from the substrate 10.

[0156] S24, patterning the second light-emitting material layer, the first sub-encapsulation material layer, and the second sub-encapsulation material layer to form a second light-emitting unit 302, wherein the second encapsulation part 402 includes a first sub-part 41 and a second sub-part 42, wherein the first sub-part 41 covers the first electrode 31, and the second sub-part 42 covers the first sub-part 41, and the density of the first sub-part 41 is different from the density of the second sub-part 42. Specifically, patterning is performed on the second light-emitting material layer, the first sub-encapsulation material layer, and the second sub-encapsulation material layer, that is, part of the second light-emitting material layer, the first sub-encapsulation material layer, and the second sub-encapsulation material layer is removed, and part of the second light-emitting material layer, the first sub-encapsulation material layer, and the second sub-encapsulation material layer on the side of the isolation opening 21 and the isolation structure 20 away from the substrate 10 is retained to form the second light-emitting unit 302 and the second encapsulation part 402 including the first sub-part 41 and the second sub-part 42.

[0157] S24, sequentially forming a third light emitting material layer, a first sub-encapsulation material layer, and a second sub-encapsulation material layer on a side of the isolation structure 20 away from the substrate 10. The first sub-encapsulation material layer is located on a side of the third light emitting material layer away from the substrate 10, and the second sub-encapsulation material layer is located on a side of the first sub-encapsulation material layer away from the substrate 10.

[0158] S26, patterning the third light-emitting material layer, the first sub-encapsulation material layer, and the second sub-encapsulation material layer to form a third light-emitting unit 303 and a third encapsulation part 403, wherein the third encapsulation part 403 includes a first sub-part 41 and a second sub-part 42, wherein the first sub-part 41 covers the first electrode 31, and the second sub-part 42 covers the first sub-part 41, and the density of the first sub-part 41 is different from the density of the second sub-part 42. Specifically, patterning is performed on the third light-emitting material layer, the first sub-encapsulation material layer, and the second sub-encapsulation material layer, that is, part of the third light-emitting material layer, the first sub-encapsulation material layer, and the second sub-encapsulation material layer is removed, and part of the third light-emitting material layer, the first sub-encapsulation material layer, and the second sub-encapsulation material layer on the side of the isolation opening 21 and the isolation structure 20 away from the substrate 10 is retained to form a third light-emitting unit 303 and a third encapsulation part 403 including the first sub-part 41 and the second sub-part 42.

[0159] In these embodiments, a first light-emitting unit 301 and a first packaging portion 401 for packaging the first light-emitting unit 301 are first formed in the first partial isolation opening 21, and then a second light-emitting unit 302 and a second packaging portion 402 for packaging the second light-emitting unit 302 are formed in the second partial isolation opening 21. Finally, a third light-emitting unit 303 and a third packaging portion 403 for packaging the third light-emitting unit 303 are formed in the third partial isolation opening 21, so that each light-emitting unit 30 is independently packaged by each packaging portion 40.

[0160] Optionally, the thickness of the first sub-encapsulation material layer located on the side of the first light-emitting material layer away from the substrate 10 may be less than or equal to the first sub-encapsulation material layer located on the side of the second light-emitting material layer away from the substrate 10, and the thickness of the first sub-encapsulation material layer located on the side of the first light-emitting material layer away from the substrate 10 may be less than the first sub-encapsulation material layer located on the side of the third light-emitting material layer away from the substrate 10, so that the thickness of the first sub-portion 41 of the first encapsulation part 401 is less than or equal to the thickness of the first sub-portion 41 of the second encapsulation part 402, and the thickness of the first sub-portion 41 of the first encapsulation part 401 is less than the thickness of the first sub-portion 41 of the third encapsulation part 403, so that the risk of the material of the first sub-portion 41 remaining in the isolation openings 21 corresponding to the second encapsulation part 402 and the third encapsulation part 403 during the preparation process of the first encapsulation part 401 can be reduced. The thickness of the first sub-encapsulation material layer corresponding to the second light-emitting material layer is less than the thickness of the first sub-encapsulation material layer corresponding to the third light-emitting material layer, so that the thickness of the first sub-portion 41 of the second encapsulation part 402 is less than the thickness of the first sub-portion 41 of the third encapsulation part 403.

[0161] In some embodiments, the step of sequentially forming a first light emitting material layer, a first sub-encapsulation material layer, and a second sub-encapsulation material layer on a side of the isolation structure 20 facing away from the substrate 10 further includes:

[0162] forming a third sub-encapsulation material layer on a side of the second sub-encapsulation material layer facing away from the substrate 10;

[0163] The step of patterning the first light emitting material layer, the first sub-encapsulation material layer and the second sub-encapsulation material layer to form the first light emitting unit 301 and the first encapsulation part 401 further includes:

[0164] The third sub-encapsulation material layer is patterned to form a third sub-portion 43 located on a side of the second sub-portion 42 away from the substrate 10;

[0165] The step of sequentially forming a second light emitting material layer, a first sub-encapsulation material layer, and a second sub-encapsulation material layer on a side of the isolation structure 20 facing away from the substrate 10 further includes:

[0166] forming a third sub-encapsulation material layer on a side of the second sub-encapsulation material layer facing away from the substrate 10;

[0167] The step of patterning the second light emitting material layer, the first sub-encapsulation material layer and the second sub-encapsulation material layer to form the second light emitting unit 302 and the second encapsulation part 402 further includes:

[0168] The third sub-encapsulation material layer is patterned to form a third sub-portion 43 located on a side of the second sub-portion 42 away from the substrate 10;

[0169] The step of sequentially forming a third light emitting material layer, a first sub-encapsulation material layer, and a second sub-encapsulation material layer on a side of the isolation structure 20 facing away from the substrate 10 further includes:

[0170] forming a third sub-encapsulation material layer on a side of the second sub-encapsulation material layer facing away from the substrate 10;

[0171] The step of patterning the third light emitting material layer, the first sub-encapsulation material layer and the second sub-encapsulation material layer to form the third light emitting unit 303 and the third encapsulation part 403 further includes:

[0172] The third sub-encapsulation material layer is patterned to form a third sub-portion 43 located on a side of the second sub-portion 42 facing away from the substrate 10 .

[0173] In these embodiments, when the first light-emitting material layer, the first sub-encapsulation material layer and the second sub-encapsulation material layer are sequentially formed on the side of the isolation structure 20 away from the substrate 10, a third sub-encapsulation material layer is also formed on the side of the second sub-encapsulation material layer away from the substrate 10, and when part of the first light-emitting material layer, the first sub-encapsulation material layer and the second sub-encapsulation material layer are removed and the first light-emitting material layer, the first sub-encapsulation material layer and the second sub-encapsulation material layer in the isolation opening 21 are retained, part of the third sub-encapsulation material layer is also removed and the third sub-encapsulation material layer in the isolation opening 21 is retained to form a third sub-portion 43 located on the side of the second sub-portion 42 away from the substrate 10, so as to further encapsulate the first light-emitting unit 301 through the third sub-portion 43 to further improve the encapsulation effect, and at the same time, the second sub-portion 42 can also be protected by the third sub-portion 43 to prevent the second sub-portion 42 from being etched and damaged by the etching material in the subsequent process. In addition, the third sub-portion 43 can also limit the second sub-portion 42 and the first sub-portion 41, so that the second sub-portion 42 and the first sub-portion 41 are more secure.

[0174] Similarly, when the second light-emitting material layer, the first sub-encapsulation material layer and the second sub-encapsulation material layer are sequentially formed on the side of the isolation structure 20 away from the substrate 10, a third sub-encapsulation material layer is also formed on the side of the second sub-encapsulation layer away from the substrate 10, and when part of the second light-emitting material layer, the first sub-encapsulation material layer and the second sub-encapsulation material layer are removed and the second light-emitting material layer, the first sub-encapsulation material layer and the second sub-encapsulation material layer in the isolation opening 21 are retained, part of the third sub-encapsulation material layer is also removed and the third sub-encapsulation material layer in the isolation opening 21 is retained to form a third sub-portion 43 located on the side of the second sub-portion 42 away from the substrate 10, so as to further encapsulate the second light-emitting unit 302 through the third sub-portion 43 to further improve the encapsulation effect, and at the same time, the second sub-portion 42 can also be protected by the third sub-portion 43 to prevent the second sub-portion 42 from being etched and damaged by the etching material in the subsequent process. In addition, the third sub-portion 43 can also limit the second sub-portion 42 and the first sub-portion 41, so that the second sub-portion 42 and the first sub-portion 41 are more secure.

[0175] When the third light-emitting material layer, the first sub-encapsulation material layer and the second sub-encapsulation material layer are formed in sequence on the side of the isolation structure 20 away from the substrate 10, the third sub-encapsulation material layer is also formed on the side of the second sub-encapsulation layer away from the substrate 10, and when part of the third light-emitting material layer, the first sub-encapsulation material layer and the second sub-encapsulation material layer are removed and the third light-emitting material layer, the first sub-encapsulation material layer and the second sub-encapsulation material layer in part of the isolation opening 21 are retained, part of the third sub-encapsulation material layer is also removed and the third sub-encapsulation material layer in part of the isolation opening 21 is retained to form a third sub-portion 43 located on the side of the second sub-portion 42 away from the substrate 10, so that the third light-emitting unit 303 is further encapsulated by the third sub-portion 43 to further improve the encapsulation effect, and at the same time, the second sub-portion 42 and the first sub-portion 41 can be limited by the third sub-portion 43, so that the second sub-portion 42 and the first sub-portion 41 are more secure.

[0176] In some embodiments, the thickness of the third sub-packaging material layer corresponding to the first light-emitting material layer and the second light-emitting material layer is greater than the thickness of the third sub-packaging material layer corresponding to the third light-emitting material layer, so that the thickness of the third sub-portion 43 of the first packaging part 401 and the thickness of the third sub-portion 43 of the second packaging part 402 are greater than the thickness of the third sub-portion 43 of the third packaging part 403.

[0177] In some embodiments, there is only a first encapsulation layer on the light-emitting layer, different light-emitting layers correspond to different first encapsulation layers, and at least two first encapsulation layers have different thicknesses.

[0178] Taking into account the process and yield issues, when there is only a first packaging layer on the light-emitting layer, the etching residue problem is improved by thinning the thickness of the previously evaporated color first packaging layer.

[0179] In a third aspect, the present application provides a display device, including any of the display panels 100 described above or a display panel 100 prepared by any of the preparation methods described above. Since the display device adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described one by one here.

[0180] The display device may be any device with a display function, for example, a mobile phone, a tablet computer, a laptop computer, a PDA, an in-vehicle electronic device, a wearable device, an ultra-mobile personal computer (UMPC), a netbook, or a personal digital assistant (PDA), etc. It may also be a non-mobile device such as a personal computer (PC), a television (TV), a teller machine, or an automated machine.

[0181] Although the embodiments disclosed in this application are as above, the contents described are only embodiments adopted for facilitating the understanding of this application and are not intended to limit the present invention. Any technician in the technical field to which this application belongs can make any modifications and changes in the form and details of implementation without departing from the spirit and scope disclosed in this application, but the scope of protection of this application shall still be subject to the scope defined in the attached claims.

[0182] The above is only a specific implementation of the present application. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the replacement of other connection methods described above can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here. It should be understood that the protection scope of the present application is not limited to this. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in this application, and these modifications or replacements should be included in the protection scope of the present application.

Claims

1. A display panel, characterized in that: include: substrate; An isolation structure is disposed on one side of the substrate and encloses a plurality of isolation openings; a light-emitting layer, comprising a light-emitting unit at least partially located in the isolation opening; A first electrode is disposed on a side of the light-emitting unit away from the substrate, and the first electrode overlaps the first isolation portion; The first encapsulation layer includes an encapsulation portion located on the side of the first electrode away from the substrate, the encapsulation portion includes a first sub-portion formed of an inorganic material, the first sub-portion covers the first electrode, and among the encapsulation portions, the first sub-portions of at least two of the encapsulation portions have different thicknesses.

2. The display panel according to claim 1, characterized in that: The packaging portion at least includes the first sub-portion and the second sub-portion, and the second sub-portion covers the first sub-portion; Preferably, the thickness of the second sub-section is greater than the thickness of the first sub-section; Preferably, the isolation structure comprises a first isolation portion and a second isolation portion provided on a side of the first isolation portion away from the substrate, and an orthographic projection of the first isolation portion on the substrate is located within an orthographic projection of the second isolation portion on the substrate; Preferably, a gap is formed between a side of the first sub-portion facing away from the substrate and a side of the second isolation portion facing the substrate, and the second sub-portion fills the gap; Preferably, the density of the first subsection is different from the density of the second subsection; Preferably, the density of the first sub-section is greater than the density of the second sub-section, or the density of the first sub-section is less than the density of the second sub-section; Preferably, the first subsection and / or the second subsection comprises an inorganic material containing silicon.

3. The display panel according to claim 1, characterized in that: The second sub-portion extends through the second isolation portion toward the side wall of the isolation opening to a side of the second isolation portion away from the substrate; Preferably, the first sub-section includes a first segment, a second segment and a third segment, the first segment is located on a side of the first electrode facing away from the substrate, the second segment is located on a side of the first isolation portion facing the isolation opening, and the third segment is located between a side wall of the second isolation portion facing the isolation opening and the second sub-section; Preferably, the third segment also extends to a side of the second isolation portion facing away from the substrate.

4. The display panel according to claim 1, characterized in that: The packaging portion further includes a third sub-portion, and the third sub-portion covers the second sub-portion; Preferably, the third sub-portion extends to a side of the second isolation portion facing away from the substrate; Preferably, the third sub-portion includes a fourth segment and a fifth segment, the orthographic projection of the fourth segment on the substrate is located within the orthographic projection of the first electrode on the substrate, the fifth segment extends from the edge of the fourth segment to a side of the second isolation portion away from the substrate, and at least a portion of the fourth segment is protruding relative to the first isolation portion in a direction away from the substrate; Preferably, the density of the first sub-section is greater than the density of the second sub-section, and the density of the third sub-section is greater than the density of the second sub-section; Preferably, the density of the third sub-section is greater than or equal to the density of the first sub-section; Preferably, the third sub-portion includes an inorganic material containing silicon. Preferably, the first sub-portion, the second sub-portion and the third sub-portion are made of the same material or different materials.

5. The display panel according to claim 4, characterized in that: The plurality of light-emitting units include a first light-emitting unit, a second light-emitting unit and a third light-emitting unit, the plurality of encapsulation parts include a first encapsulation part, a second encapsulation part and a third encapsulation part, the first encapsulation part is used to encapsulate the first light-emitting unit, the second encapsulation part is used to encapsulate the second light-emitting unit, and the third encapsulation part is used to encapsulate the third light-emitting unit; Preferably, the thickness of the third sub-portion of the first encapsulation portion is greater than or equal to the thickness of the third sub-portion of the second encapsulation portion, and / or the thickness of the third sub-portion of the second encapsulation portion is greater than the thickness of the third sub-portion of the third encapsulation portion; Preferably, the thickness of the first encapsulation portion is greater than the thickness of the second encapsulation portion, and the thickness of the second encapsulation portion is greater than the thickness of the third encapsulation portion.

6. The display panel according to any one of claims 1 to 5, characterized in that: The multiple light-emitting units include a first light-emitting unit, a second light-emitting unit and a third light-emitting unit, and the multiple encapsulation parts include a first encapsulation part, a second encapsulation part and a third encapsulation part. The first encapsulation part is used to encapsulate the first light-emitting unit, the second encapsulation part is used to encapsulate the second light-emitting unit, and the third encapsulation part is used to encapsulate the third light-emitting unit. At least two of the first sub-part of the first encapsulation part, the first sub-part of the second encapsulation part and the first sub-part of the third encapsulation part have different thicknesses.

7. The display panel according to claim 6, characterized in that: The thickness of the first encapsulation portion and / or the first sub-portion of the second encapsulation portion is smaller than the thickness of the first isolation portion; Preferably, a ratio Z1 of the thickness of the first encapsulation portion and / or the first sub-portion of the second encapsulation portion to the thickness of the first isolation portion satisfies: 0.05≤Z1<1.

8. The display panel according to claim 6, characterized in that: The thickness of the first sub-portion of the third encapsulation portion is greater than the thickness of the first sub-portion of the first encapsulation portion and / or the first sub-portion of the second encapsulation portion; Preferably, a ratio Z2 of the thickness of the first sub-portion of the third encapsulation portion to the thickness of the first encapsulation portion and / or the first sub-portion of the second encapsulation portion satisfies: 1<Z2≤12; Preferably, the thickness of the first sub-portion of the first encapsulation portion is less than or equal to the thickness of the first sub-portion of the second encapsulation portion.

9. The display panel according to claim 6, characterized in that: A ratio Z3 of a thickness of the first sub-portion of the third encapsulation portion to a thickness of the first isolation portion satisfies: 0.1≤Z3≤1.2; Preferably, the thickness of the first sub-portion of the third encapsulation portion is greater than or equal to the thickness of the first isolation portion.

10. The display panel according to claim 6, characterized in that: The thickness H1 of the first encapsulation part and / or the first sub-part of the second encapsulation part satisfies: 500 angstroms ≤ H1 ≤ 5000 angstroms; Preferably, the thickness H2 of the first sub-portion of the third encapsulation portion satisfies: 1000 angstroms ≤ H2 ≤ 6000 angstroms; Preferably, a thickness H3 of the first isolation portion satisfies: 5000 angstroms ≤ H3 ≤ 10000 angstroms.

11. The display panel according to any one of claims 1 to 5, characterized in that: The material of the first isolation portion includes a conductive material; Preferably, the material of the second isolation portion includes a conductive material; Preferably, the isolation structure further includes a third isolation portion, and the third isolation portion is located on a side of the first isolation portion facing the substrate.

12. The display panel according to any one of claims 1 to 5, characterized in that: The display panel further comprises a second encapsulation layer, wherein the second encapsulation layer is arranged on a side of the first encapsulation layer away from the substrate; Preferably, the second encapsulation layer comprises an organic material; Preferably, the display panel further comprises a third encapsulation layer, and the third encapsulation layer is arranged on a side of the second encapsulation layer away from the substrate; Preferably, the third encapsulation layer comprises an inorganic material.

13. A method for preparing a display panel, characterized in that: include: An isolation structure is formed on one side of the substrate, the isolation structure encloses a plurality of isolation openings, the isolation structure comprises a first isolation portion and a second isolation portion arranged on a side of the first isolation portion away from the substrate, and an orthographic projection of the first isolation portion on the substrate is located within an orthographic projection of the second isolation portion on the substrate; A light-emitting unit and a packaging part for packaging each light-emitting unit are formed in the isolation opening, the light-emitting unit includes a first electrode, the first electrode overlaps the first isolation part, the packaging part includes at least a first sub-part and a second sub-part, the first sub-part covers the first electrode, the second sub-part covers the first sub-part, the density of the first sub-part is different from the density of the second sub-part, and in each of the packaging parts, the thickness of the first sub-parts of at least two of the packaging parts is different.

14. The preparation method according to claim 13, characterized in that: The step of forming a light-emitting unit and an encapsulation portion for encapsulating each light-emitting unit in the isolation opening includes: forming a first light emitting material layer, a first sub-encapsulation material layer, and a second sub-encapsulation material layer in sequence on a side of the isolation structure away from the substrate; The first light-emitting material layer, the first sub-encapsulation material layer and the second sub-encapsulation material layer are patterned to form a first light-emitting unit and a first encapsulation portion, wherein the first encapsulation portion includes a first sub-portion and a second sub-portion, wherein the first sub-portion covers the first electrode, and the second sub-portion covers the first sub-portion, and the density of the first sub-portion is different from the density of the second sub-portion; forming a second light emitting material layer, a first sub-encapsulation material layer, and a second sub-encapsulation material layer in sequence on a side of the isolation structure away from the substrate; The second light-emitting material layer, the first sub-encapsulation material layer and the second sub-encapsulation material layer are patterned to form a second light-emitting unit and a second encapsulation part, wherein the second encapsulation part includes a first sub-part and a second sub-part, the first sub-part covers the first electrode, the second sub-part covers the first sub-part, and the density of the first sub-part is different from the density of the second sub-part; forming a third light emitting material layer, a first sub-encapsulation material layer, and a second sub-encapsulation material layer in sequence on a side of the isolation structure away from the substrate; The third light-emitting material layer, the first sub-packaging material layer and the second sub-packaging material layer are patterned to form a third light-emitting unit and a third packaging part, the third packaging part includes a first sub-part and a second sub-part, the first sub-part covers the first electrode, the second sub-part covers the first sub-part, and the density of the first sub-part is different from the density of the second sub-part.

15. The preparation method according to claim 14, characterized in that: The thickness of the first sub-encapsulation material layer corresponding to the first light-emitting material layer and the second light-emitting material layer is smaller than the thickness of the first sub-encapsulation material layer corresponding to the third light-emitting material layer.

16. The preparation method according to claim 14, characterized in that: The step of sequentially forming a first light emitting material layer, a first sub-encapsulation material layer, and a second sub-encapsulation material layer on a side of the isolation structure away from the substrate further includes: forming a third sub-packaging material layer on a side of the second sub-packaging material layer facing away from the substrate; The step of patterning the first light-emitting material layer, the first sub-encapsulation material layer, and the second sub-encapsulation material layer to form the first light-emitting unit and the first encapsulation part further includes: Performing patterning on the third sub-encapsulation material layer to form a third sub-portion located on a side of the second sub-portion away from the substrate; The step of sequentially forming a second light emitting material layer, a first sub-encapsulation material layer, and a second sub-encapsulation material layer on a side of the isolation structure away from the substrate further includes: forming a third sub-packaging material layer on a side of the second sub-packaging material layer facing away from the substrate; The step of patterning the second light emitting material layer, the first sub-encapsulation material layer and the second sub-encapsulation material layer to form the second light emitting unit and the second encapsulation part further includes: Performing patterning on the third sub-encapsulation material layer to form a third sub-portion located on a side of the second sub-portion away from the substrate; The step of sequentially forming a third light emitting material layer, a first sub-encapsulation material layer, and a second sub-encapsulation material layer on a side of the isolation structure away from the substrate further includes: forming a third sub-packaging material layer on a side of the second sub-packaging material layer facing away from the substrate; The step of patterning the third light-emitting material layer, the first sub-encapsulation material layer, and the second sub-encapsulation material layer to form the third light-emitting unit and the third encapsulation part further includes: The third sub-encapsulation material layer is patterned to form a third sub-portion located on a side of the second sub-portion away from the substrate.

17. The preparation method according to claim 16, characterized in that: The thickness of the third sub-encapsulation material layer corresponding to the first light emitting material layer and the second light emitting material layer is greater than the thickness of the third sub-encapsulation material layer corresponding to the third light emitting material layer.

18. A display device, characterized in that: A display panel comprising any one of claims 1-12 or a display panel prepared by the preparation method of any one of claims 13-17.

Images