Display device

Abstract

A display device includes: a support member; a display panel disposed on the support member; a printed circuit board electrically connected to one side of the display panel; and at least one circuit film having one side and the other side facing each other and electrically connected to the display panel and the printed circuit board, respectively, in which at least a portion of the at least one circuit film is bent toward a back surface of the display panel, the support member includes at least one extension portion protruding from a side surface of the display panel and overlapping the circuit film on a back surface of the circuit film.

Description

Technical Field

[0001] The present disclosure relates to a display device. Background Art

[0002] The content described in this background technology section merely provides background information about the present disclosure and does not constitute prior art.

[0003] The display device may include a display area that displays a picture and a non-display area disposed to surround the display area. The display device requires not only a display panel that displays a picture but also various additional components, such as a driver integrated circuit or a circuit board.

[0004] An additional component may be disposed in the non-display area, or various connection components (eg, a printed circuit board) for connecting the additional component to the display panel may be disposed in the non-display area.

[0005] The non-display area in the display device is called the frame area. When the frame area becomes narrower, the user's immersion in the picture in the display area can be increased.

[0006] Therefore, consumer demand for display devices with reduced bezel area sizes is increasing. Summary of the invention

[0007] Since the narrower the border of a display device, the fuller the picture is, thereby increasing the user's immersion in the picture. Therefore, several studies are being conducted to reduce the border size. When the border size of a display device is reduced, the reliability of the display device may be adversely affected, which may degrade the performance of the display device.

[0008] Therefore, the inventors of the present disclosure recognized the problems as described above, and thus invented a new display device that can improve the reliability of the display device and reduce the frame size of the display device.

[0009] An object of an embodiment of the present disclosure is to provide a display device that can improve the reliability of the display device, thereby reducing the frame size of the display device.

[0010] The purpose of the present disclosure is not limited to the above-mentioned purpose. Other purposes and advantages not mentioned in the present disclosure can be understood based on the following description, and other purposes and advantages not mentioned in the present disclosure can be more clearly understood based on the embodiments of the present disclosure. In addition, it will be easily understood that the purposes and advantages of the present disclosure can be achieved using the devices shown in the claims and their combinations.

[0011] A display device according to an embodiment of the present disclosure may include: a supporting member; a display panel disposed on the supporting member; a printed circuit board electrically connected to one side of the display panel; and at least one circuit film having one side and another side opposite to each other and electrically connected to the display panel and the printed circuit board, respectively, wherein at least a portion of the at least one circuit film is bent toward the back side of the display panel, and wherein the supporting member includes at least one extension protruding from a side surface of the display panel and overlapping with the circuit film on the back side of the circuit film.

[0012] A display device according to an embodiment of the present disclosure may include: a supporting member; a display panel disposed on the supporting member; a printed circuit board electrically connected to one side of the display panel; and at least one circuit film electrically connected to the printed circuit board, wherein a portion of the at least one circuit film is bent, and wherein the supporting member overlaps with at least a portion of the circuit film in a protruding area of ​​the circuit film and includes at least one opening.

[0013] Specific details of other embodiments are included in the detailed description and accompanying drawings.

[0014] According to an embodiment of the present disclosure, a supporting member applied to a display device supports a circuit film, and thus a display device with a reduced frame size can be provided.

[0015] According to an embodiment of the present disclosure, a support member applied to a display device may include an extension portion, so that a frame size of the display device may be reduced, thereby improving performance and / or reliability of the display device.

[0016] According to an embodiment of the present disclosure, an extension portion of a support member applied to a display device includes an opening, so that damage to the reliability of a bent portion of the support member can be prevented, thereby providing a low-power display device with improved lifespan.

[0017] The effects of the present disclosure are not limited to the above-mentioned effects, and other effects not mentioned will be clearly understood by those skilled in the art from the following description.

[0018] The objects, solutions and effects of the present disclosure as described above do not specify the essential features of the claims. Therefore, the scope of the claims is not limited by the objects, solutions and effects of the disclosure as described above. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a diagram illustrating a display device according to an embodiment of the present disclosure.

[0020] Figure 2 is an exploded perspective view showing a display device according to an embodiment of the present disclosure.

[0021] Figure 3 is Figure 2A rear view of the display device in a state where some components are omitted.

[0022] Figure 4 It is along Figure 3 A cross-sectional view taken along line AA.

[0023] Figure 5 is a plan view showing a bent state of a supporting member in a display device.

[0024] Figure 6 is a plan view of a display device according to an embodiment of the present disclosure.

[0025] Figure 7 The present invention is a diagram showing an embodiment of the present invention. Figure 6 Graph of area A.

[0026] Figure 8 Another embodiment of the present disclosure is shown in FIG. Figure 6 Graph of area A.

[0027] Fig. 9 FIG. 2 is a diagram showing another embodiment according to the present disclosure. Figure 6 Graph of area A.

[0028] Fig.10 According to an embodiment of the present disclosure, Figure 1 A cross-sectional view of the display panel taken along line BB' in FIG. DETAILED DESCRIPTION

[0029] The advantages and features of the present disclosure and the methods for achieving these advantages and features will become apparent with reference to the embodiments and drawings described in detail below. However, the present disclosure is not limited to the embodiments disclosed below, but can be implemented in different forms. Therefore, these embodiments are described only to complete the present disclosure and fully inform the ordinary technicians of the technical field to which the present disclosure belongs, and the present disclosure is limited only by the scope of the claims.

[0030] The shapes, sizes, proportions, angles, quantities, etc. disclosed in the drawings used to illustrate the embodiments of the present disclosure are illustrative, and the present disclosure is not limited thereto. For simplicity and clarity of description, the elements in the drawings are not necessarily drawn to scale. The same reference numerals in different drawings represent the same or similar elements and therefore perform similar functions.

[0031] In addition, for the simplicity of description, the description and details of well-known steps and elements are omitted. In addition, in the following detailed description of the present disclosure, in order to provide a thorough understanding of the present disclosure, many specific details are set forth. However, it will be understood that the present disclosure can be practiced without these specific details. In other cases, well-known methods, procedures, components and circuits are not described in detail to avoid unnecessarily obscuring aspects of the present disclosure. The examples of various embodiments are further explained and described below. It should be understood that the description herein is not intended to limit the claims to the specific embodiments described. On the contrary, it is intended to cover substitutions, modifications and equivalents that may be included in the spirit and scope of the present disclosure defined by the appended claims.

[0032] The terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. As used herein, singular formation is intended to also include plural formation, unless the context clearly indicates otherwise. It will also be understood that when the terms "include", "have", "include" and "contain" are used in this specification, the features, integers, operations, elements and / or parts described are specified to exist, but one or more other features, integers, operations, elements, parts and / or parts thereof are not excluded from existence or addition. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. For example, the expression of "at least one of..." can modify the entire element list when it is after the element list, rather than modifying a single element in the list. In the interpretation of numerical values, errors or tolerances may also occur in numerical values ​​even without a clear description thereof.

[0033] Further, it will be understood that when a first element or layer is referred to as being “on” a second element or layer, the first element can be directly disposed on the second element, or can be indirectly disposed on the second element with a third element or layer disposed between the first element or layer and the second element or layer.

[0034] It will be understood that when an element or layer is referred to as being “connected to” or “coupled to” another element or layer, it can be directly on, directly connected to or coupled to the other element or layer, or one or more intervening elements or layers may be present. Additionally, it will be understood that when an element or layer is referred to as being “between” two elements or layers, it can be the only element or layer between the two elements or layers, or one or more intervening elements or layers may also be present.

[0035] In addition, as used herein, when a layer, film, region, plate, etc. is disposed "above" or "on top" of another layer, film, region, plate, etc., the former may directly contact the latter, or another layer, film, region, plate, etc. may be disposed between the former and the latter. As used herein, when a layer, film, region, plate, etc. is disposed "above" or "on top" of another layer, film, region, plate, etc., the former may directly contact the latter, and another layer, film, region, plate, etc. may not be disposed between the former and the latter. In addition, as used herein, when a layer, film, region, plate, etc. is disposed "below" or "below" of another layer, film, region, plate, etc., the former may directly contact the latter, or another layer, film, region, plate, etc. may be disposed between the former and the latter. As used herein, when a layer, film, region, plate, etc. is disposed "below" or "below" of another layer, film, region, plate, etc., the former may directly contact the latter, and another layer, film, region, plate, etc. may not be disposed between the former and the latter.

[0036] In the description of a temporal relationship, for example, the temporal sequence between two events, such as "after", "subsequently", "before", etc., unless "directly after", "directly followed", or "directly before" is not specified, another event may occur between the two events.

[0037] When a certain embodiment can be implemented differently, the function or operation specified in a specific block can occur in an order different from the order specified in the flow chart. For example, two consecutive blocks can actually be executed substantially simultaneously, or the two blocks can be executed in reverse order according to the functions or operations involved.

[0038] It will be understood that although the terms "first", "second", "third", etc. may be used herein to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the spirit and scope of the present disclosure, the first element, component, region, layer or part described below may be referred to as a second element, component, region, layer or part.

[0039] The features of the various embodiments of the present disclosure may be combined with each other in part or in whole, and may be technically related to each other or operate with each other. The embodiments may be tried independently of each other, and may be implemented together in a related relationship.

[0040] When interpreting numerical values, unless there is no separate explicit description of them, the values ​​are interpreted as including the error range.

[0041] Unless otherwise defined, all terms used herein, including technical and scientific terms, have the same meaning as those commonly understood by those skilled in the art to which the inventive concept belongs. It will be further understood that terms, such as those defined in general dictionaries, should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless explicitly defined as such herein.

[0042] For ease of explanation, spatially relative terms such as "below", "below", "below", "above", "above", etc. may be used herein to describe the relationship of one element or feature to another element or feature as shown in the drawings. It will be understood that, in addition to the directions depicted in the drawings, spatially relative terms are intended to include different orientations of the device in use or operation. For example, when the device in the drawings can be turned over, the elements described as "below" or "below" or "below" other elements or features will then be oriented to be "above" other elements or features. Therefore, the example terms "below" and "below" can include both the above and below directions. The device can be oriented in other ways, such as rotated 90 degrees or in other orientations, and the spatially relative descriptions used herein should be interpreted accordingly.

[0043] As used herein, "embodiment," "example," "aspect," etc. should not be construed as indicating that any aspect or design described is preferred or advantageous over other aspects or designs.

[0044] Furthermore, the term "or" means an inclusive or rather than an exclusive or. That is, unless otherwise stated or clear from the context, the statement "x employs a or b" means any of the natural inclusive combinations.

[0045] The terms used in the description below are selected as generally common terms in the relevant technical field. However, in addition to the terms depending on the development and / or changes of technology, conventions, preferences of technicians, etc., other terms may also exist. Therefore, the terms used in the description below should not be understood as limiting the technical ideas, but should be understood as examples of terms used to illustrate the embodiments.

[0046] In addition, in specific cases, the terms may be arbitrarily selected by the applicant, and in this case, their detailed meanings will be described in the corresponding description section. Therefore, the terms used in the following description should not be understood simply based on the names of the terms, but should be understood based on the meanings of the terms and the content throughout the specific implementation.

[0047] As used herein, the term "display device" in a narrow sense may include: a display device including a liquid crystal module (LCM), an organic light emitting diode (OLED) module, or a quantum dot (QD) module, the display device including a display panel and a driver for driving the display panel. In addition, the display device in a broad sense may include a laptop computer, a television, a computer monitor, an automobile device or an in-vehicle device display, a complete set of electronic devices, a complete set of devices, or a complete set of devices including a complete product or finished product including an LCM, an OLED module, or a QD module.

[0048] Therefore, the display device according to the present disclosure may include the display device itself in a narrow sense, and the display device itself includes, for example, LCM, OLED module, QD module, etc., and may include a complete set of devices as an application product or an end-user device in a broad sense, and the application product or end-user device includes a complete product or finished product including an LCM, OLED module or QD module.

[0049] In addition, in some cases, an LCM, OLED module or QD module consisting of a display panel and a driver can be described as a "display device" in a narrow sense. An electronic device that is a complete product including an LCM, an OLED module or a QD module can be described as a "complete set of devices" in a broad sense. For example, a display device in a narrow sense may include a display panel such as a liquid crystal panel, an organic light-emitting display panel or a quantum dot display panel, and a source PCB that is a controller for driving the display panel. A complete set of devices in a broad sense may include a display panel such as a liquid crystal panel, an organic light-emitting display panel or a quantum dot display panel, a source PCB that is a controller for driving the display panel, and a complete set of PCBs that are complete controllers that are electrically connected to the source PCB and control the complete set of devices.

[0050] As used herein, the display panel may be any type of display panel, such as a liquid crystal display panel, an organic light emitting diode (OLED) display panel, a quantum dot (QD) display panel, and an electroluminescent display panel. The display panel used in the present disclosure may not be limited to a specific display panel including a flexible substrate for an OLED display panel and a lower backplane support structure having a bendable frame. In addition, the display panel used in the display device according to an embodiment of the present disclosure is not limited to the shape or size of the display panel.

[0051] More specifically, when the display panel is implemented as an organic light emitting diode (OLED) display panel, the display panel may include a plurality of gate lines and a plurality of data lines, and pixels formed in regions where the gate lines and the data lines intersect each other, respectively. In addition, the display panel may be configured to include: an array including thin film transistors as elements for selectively applying voltages to individual pixels; an organic light emitting element layer on the array; and an encapsulation substrate or an encapsulation layer disposed on the array and covering the organic light emitting element layer. The encapsulation layer protects the thin film transistor and the organic light emitting element layer from external impacts, and may prevent moisture or oxygen from penetrating into the organic light emitting element layer. In addition, the light emitting layer formed on the array may include an inorganic light emitting layer, for example, a nano-sized material layer or quantum dots.

[0052] Figure 1 is a plan view showing a display device according to an embodiment of the present disclosure.

[0053] The display device 1 according to an embodiment of the present disclosure may include a display panel 100. The display panel 100 may include a display area AA disposed on a substrate 101 and a non-display area NA disposed to surround the display area AA.

[0054] The substrate 101 may be made of a flexible plastic material to be able to bend. For example, the substrate 101 may be made of polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), polyether sulfone (PES), polyarylate (PAR), polysulfone (PSF) or cyclic olefin copolymer (COC). However, the embodiments of the present disclosure are not limited thereto. For example, glass is not excluded as a material for the substrate 101. In another embodiment of the present disclosure, the substrate 101 may be made of a semiconductor material such as a silicon wafer.

[0055] The display area AA may be an area where a plurality of sub-pixels PX are arranged and an image is displayed. Each of the plurality of sub-pixels PX may be a unit that emits light independently. A light-emitting element and a driving circuit may be provided in each of the plurality of sub-pixels PX. For example, a display element for displaying an image and a circuit unit for driving the display element may be provided in each of the plurality of sub-pixels PX. For example, when the display device is an organic light-emitting display device, the display element may include an organic light-emitting element. When the display device is a liquid crystal display device, the display element may include a liquid crystal light-emitting element. The plurality of sub-pixels PX may include a red sub-pixel PX, a green sub-pixel PX, a blue sub-pixel PX, and / or a white sub-pixel PX, etc. However, the embodiments of the present disclosure are not limited thereto.

[0056] The non-display area NA may be an area where no image is displayed. The non-display area NA may be an area where various wirings and driver ICs for driving the plurality of sub-pixels PX arranged in the display area AA are disposed. For example, at least one of the data driver 95 and the gate driver 91 may be disposed in the non-display area NA. However, embodiments of the present disclosure are not limited thereto.

[0057] The non-display area NA may be an area surrounding the display area AA. For example, the non-display area NA may be defined as surrounding the display area AA. For example, the non-display area NA may be an area extending from the display area AA, or may be an area where a plurality of sub-pixels PX are not disposed. However, the embodiments of the present disclosure are not limited thereto.

[0058] The non-display area NA where no image is displayed may be a bezel area, or may further include a bending area BA in which the substrate 101 is bent. However, embodiments of the present disclosure are not limited thereto.

[0059] A plurality of data lines DL and a plurality of gate lines GL may be arranged and disposed in the display area AA. For example, the plurality of data lines DL may extend in a row or column direction, and the plurality of gate lines GL may extend in a column or row direction. The subpixel PX may be disposed at the intersection of the data lines DL and the gate lines GL.

[0060] The sub-pixel PX of the display area AA may include a thin film transistor or an oxide semiconductor transistor (e.g., MOSFET) including a semiconductor layer. For example, the thin film transistor or the oxide semiconductor transistor may include an oxide semiconductor material. However, the embodiments of the present disclosure are not limited thereto. For example, the present disclosure is not limited by this term.

[0061] According to an embodiment of the present disclosure, a gate driver 91 including a gate driving circuit may be disposed in the non-display area NA. The gate driving circuit of the gate driver 91 may sequentially drive the pixel rows of the display area AA by sequentially supplying scan signals to a plurality of gate lines GL. For example, a pixel row may be a row of pixels connected to one gate line. The gate driving circuit may be referred to as a scan driving circuit. The present disclosure is not limited to this term.

[0062] According to an embodiment of the present disclosure, the gate driver 91 may be symmetrically arranged on two opposite sides of the display area AA in the left-right direction. However, the embodiment of the present disclosure is not limited thereto. For example, the gate driver 91 may include a scan driver and / or an EM (light emitting) driver.

[0063] The gate driving circuit may be composed of a thin film transistor having a polycrystalline semiconductor layer, or may be composed of a thin film transistor having an oxide semiconductor layer, or may be composed of a pair of thin film transistors, namely, a thin film transistor having a polycrystalline semiconductor layer and a thin film transistor having an oxide semiconductor layer. When the thin film transistors respectively disposed in the non-display area NA and the display area AA use the same semiconductor material, the thin film transistors respectively disposed in the non-display area NA and the display area AA may be simultaneously formed in the same process. However, the embodiments of the present disclosure are not limited thereto.

[0064] The gate driving circuit may include a shift register and a level shifter.

[0065] As in the display device according to the embodiment of the present disclosure, the gate driving circuit may be implemented in a GIP (gate in panel) form so as to be directly disposed on the substrate 101 .

[0066] The gate driver 91 including a gate driving circuit may sequentially supply a scan signal of an on voltage or an off voltage to the plurality of gate lines GL.

[0067] The gate driver 91 according to an embodiment of the present disclosure may include a thin film transistor using a polycrystalline semiconductor material as a semiconductor layer material, and may be directly formed on the substrate 101. Alternatively, the gate driver 91 according to an embodiment of the present disclosure may include a CMOS (Complementary Metal Oxide Semiconductor) composed of a thin film transistor using an oxide semiconductor material as a semiconductor layer material and a thin film transistor using a polycrystalline semiconductor material as a semiconductor layer material.

[0068] For example, the oxide semiconductor material may include at least one of an IGZO (InGaZnO) type oxide semiconductor material, an IZO (InZnO) type oxide semiconductor material, an IGZTO (InGaZnSnO) type oxide semiconductor material, an ITZO (InSnZnO) type oxide semiconductor material, a FIZO (FeInZnO) type oxide semiconductor material, a ZnO type oxide semiconductor material, a SIZO (SiInZnO) type oxide semiconductor material, and a ZnON (Zn oxynitride) type oxide semiconductor material. However, the embodiments of the present disclosure are not limited thereto.

[0069] When the gate driver 91 according to an embodiment of the present disclosure includes a thin film transistor having an oxide semiconductor layer and a thin film transistor having a polycrystalline semiconductor layer, high electron mobility in a channel can achieve high resolution and low power.

[0070] The display device 1 according to an embodiment of the present disclosure may further include a data driver 95, which includes a data driving circuit. When a specific gate line is turned on by a gate driver 91 including a gate driving circuit, the data driving circuit may convert image data into an analog data voltage and supply the analog data voltage to a plurality of data lines. For example, the gate drivers 91 may be symmetrically arranged on two opposite sides of the display area AA in the left-right direction, respectively. However, the embodiments of the present disclosure are not limited thereto.

[0071] The plurality of gate lines GL disposed on the substrate 101 may include a plurality of scan lines and a plurality of light emission control lines. The plurality of scan lines and the plurality of light emission control lines may transmit different types of gate signals (scan signals and light emission control signals) to gate nodes of different types of transistors (scan transistors and light emission control transistors).

[0072] The gate driver 91 including the gate driving circuit may include a scan driving circuit outputting scan signals to a plurality of scan lines of one type of gate lines GL and a light emitting driving circuit outputting light emitting control signals to a plurality of light emitting control lines of another type of gate lines.

[0073] The display panel 100 according to an embodiment of the present disclosure may further include a bending area BA, and the substrate 101 is bent in the bending area BA. However, the embodiments of the present disclosure are not limited thereto. The bending area BA may be an area where the substrate 101 is bent. The area of ​​the substrate 101 other than the bending area BA may remain in a flat state. The data line DL may pass through the bending area BA, and may include various data lines DL connected to the data pad.

[0074] Figure 2 is an exploded perspective view showing a display device according to an embodiment of the present disclosure. Figure 3 is Figure 2 A rear view of the display device in a state where some components are omitted. Figure 4 is a cross-sectional view of a display device according to an embodiment of the present disclosure. Figure 4 It is along Figure 3 A cross-sectional view taken along line AA' in FIG.

[0075] In one example, a display device according to an embodiment of the present disclosure may be installed on a vehicle to provide the driver and passengers of the vehicle with images or videos required for driving the vehicle. However, the present disclosure is not limited thereto, and a display device according to an embodiment of the present disclosure may be used when carried by a user rather than installed on a vehicle. Hereinafter, an example in which a display device is installed on a vehicle will be described. However, embodiments of the present disclosure are not limited thereto.

[0076] Reference Figures 2 to 4, a display device according to an embodiment of the present disclosure may include a display panel 100 , a board 60 disposed on the back surface of the display panel 100 , and a printed circuit board 300 and a circuit film 400 (chip on film, COF) electrically connected to the display panel 100 .

[0077] A moving image or a still image may be played or displayed on the display panel 100. For example, the moving image or the still image played or displayed on the display panel 100 may include navigation information required for driving a vehicle, a moving image captured by a camera mounted on the vehicle, or various other contents required by a driver or a passenger. However, embodiments of the present disclosure are not limited thereto.

[0078] The guide panel 200 may be disposed on the back side of the display panel 100. The guide panel 200 may be the backmost component of the display device. Various components of the display device including the display panel 100 may be mounted on the guide panel 200. For example, the guide panel 200 may be mounted in the cockpit area of ​​the vehicle. To this end, the guide panel 200 may be provided with necessary connection structures, such as screw holes.

[0079] The printed circuit board 300 may be electrically connected to the display panel 100. The printed circuit board 300 may include a device for communicating with an external device such as a camera and a main control module of the vehicle, and a device for driving the display panel 100 so that the display panel 100 plays or displays a still image or a moving image. An internal circuit may be provided in the printed circuit board 300. Various other active elements and passive elements may be included in the printed circuit board 300.

[0080] One side of the circuit film 400 may be electrically connected to the display panel 100, and the other side may be electrically connected to the printed circuit board 300. A portion of the circuit film 400 may be bent to surround the guide panel 200. Figure 2 An example in which the circuit film 400 is not bent is shown.

[0081] The circuit film 400 may be thin and made of a flexible material to be able to bend. The circuit film 400 may electrically connect the display panel 100 and the printed circuit board 300 to each other. For example, the circuit film 400 may be equipped with various active elements and passive elements, and may be equipped with a driving circuit that drives the display panel 100.

[0082] The driving circuit driving the display panel 100 may be configured to be distributed in the printed circuit board 300 and the circuit film 400. Figure 4 The circuit film 400 may be provided with a driving chip 500 constituting at least a portion of a driving circuit of the display panel 100. A plurality of circuit films 400 may be provided. Figure 3 , at least two circuit films 400 may be arranged to be spaced apart from each other.

[0083] The display device according to an embodiment of the present disclosure may further include a cover member 10, a first fixing member 20, a functional film 30, and a second fixing member 40 disposed on the front surface of the display panel 100. The second fixing member 40, the functional film 30, the first fixing member 20, and the cover member 10 may be sequentially stacked on the display panel 100. The display device according to an embodiment of the present disclosure may further include a support member 50 and a board 60 disposed on the back surface of the display panel 100 and serving as a support structure for supporting the display panel 100. Various components included in the display device may be formed in a thin shape to produce a thin display device.

[0084] The cover member 10 may be disposed at the front side of the display panel 100 to protect the display panel 100. The cover member 10 may be made of a transparent material so that light emitted from the display panel 100 may pass through the cover member 10.

[0085] In an embodiment, the functional film 30 may include a light angle adjustment structure for adjusting the visible range of the image displayed on the display panel 100. The light angle adjustment structure may be provided in a cross-sectional view with a trapezoidal pattern having an angle adjusted to adapt to the target visible range and may be provided in the functional film 30. The trapezoidal pattern may be made of a light shielding material. However, the embodiments of the present disclosure are not limited thereto. For example, the functional film 30 may include a polarizer that controls display characteristics (e.g., external light reflection, color calibration, brightness, etc.). In some cases, the functional film 30 may be omitted. In another example, the functional film 30 may be patterned on the uppermost surface of the display panel 100 or on the inner surface of the cover member 20. However, the embodiments of the present disclosure are not limited thereto. The first fixing member 20 may be provided between the cover member 10 and the functional film 30. One surface of the first fixing member 20 may be adhered to the cover member 10, and the other surface of the first fixing member 20 may be adhered to the functional film 30, so that the functional film 30 may be adhered to the cover member 10 by the first fixing member 20.

[0086] The second fixing member 40 may be disposed between the functional film 30 and the display panel 100. One surface of the second fixing member 40 may be adhered to the functional film 30, and the other surface of the second fixing member 40 may be adhered to the display panel 100, so that the functional film 30 may be adhered to the display panel 100 by the second fixing member 40.

[0087] Each of the first fixing member 20 and the second fixing member 40 may be made of a transparent material having good adhesiveness, such as OCA (Optically Clear Adhesive) or OCR (Optically Clear Resin). However, the embodiments of the present disclosure are not limited thereto.

[0088] The support member 50 may be disposed on the rear surface of the display panel 100. The support member 50 may be attached to the rear surface of the display panel 100 to prevent the display panel 100 from being bent and damaged. For example, the support member 50 may enhance the rigidity of the display panel 100 supported thereon.

[0089] The support member 50 may be provided in the form of, for example, a film and attached to the display panel 100. However, the embodiments of the present disclosure are not limited thereto.

[0090] The support member 50 may be attached to a surface (second surface) opposite to the surface (first surface) on which the light emitting element is disposed, of two opposite surfaces of the substrate of the display panel 100. The support member 50 may be implemented as a thin film made of polyethylene naphthalate (PEN), polyethylene terephthalate (PET), poly(ethylene ether phthalate), polycarbonate, polyarylate, polyetherimide, polyether sulfonate, polyimide, polyacrylate, or a combination thereof. Alternatively, the support member 50 may be implemented as thin glass, a dielectric shielding metal foil, a multilayer polymer film, or a polymer film made of a polymer material combined with nanoparticles or microparticles, etc. The support member 50 for supporting the display panel may be thicker than the display panel 100. However, the embodiments of the present disclosure are not limited thereto.

[0091] When the support member 50 is included in the display device, the rear surface of the display panel 100 may be attached to the support member 50, and then a fastening process of fastening the support member 50 to the board 60 may be performed. However, embodiments of the present disclosure are not limited thereto.

[0092] For example, the plate 60 may be disposed at the rear of the support member 50 and the front of the guide panel 200. The plate 60 may contact the rear of the support member 50 and may function as a heat sink to cool the display panel 100 by radiating heat generated from the display panel 100 to the outside.

[0093] The plate 60 may be made of a material that is easy to process as a metal sheet, has a high heat transfer rate, and has excellent resistance (eg, aluminum). The embodiments of the present disclosure are not limited thereto.

[0094] Figure 3 yes Figure 2 A rear view of a display device in which components such as a guide panel are omitted for ease of explanation. For example, Figure 3 It is shown Figure 2 A plan view of a state in which the circuit film is in a bent state. Figure 4 It is along Figure 3 A cross-sectional view taken along the line A-A' in FIG. Figure 3 to Figure 4, the circuit film 400 may be bent. For example, one side of the circuit film 400 may be connected to the display panel 100, and the other side of the circuit film 400 may be connected to the printed circuit board 300. The circuit film 400 may be bent so that the other side of the circuit film 400 and the printed circuit board 300 may be disposed on the back side of the display panel 100. For example, at least one circuit film 400 may be thin and made of a flexible material to be able to be bent. At least a portion of at least one circuit film 400 may be bent. The printed circuit board 300 may be electrically connected to one side of the display panel 100. Referring to Figure 4 , the display device according to the embodiment of the present disclosure further includes a driving chip 500 disposed on one side of the display panel 100 , and the driving chip 500 may be disposed on the circuit film 400 .

[0095] Figure 5 is Figure 4 A plan view of a state in which a support member is bent in a display device. For example, Figure 5 yes Figure 3 A plan view in which the extension 51 of the support member 50 is visible. Figure 6 is a plan view of a support member according to an embodiment of the present disclosure.

[0096] Reference Figure 4 and Figure 5 According to an embodiment, the support member 50 may include at least one extension 51 protruding from a side of the display panel 100. For example, in the non-display area NA of the display device, the extension 51 of the support member 50 may overlap the circuit film 400 on the back side of the circuit film 400. For example, the extension 51 of the support member 50 may be bent from one side of the support member 50 toward the back side of the display panel 100. For example, the circuit film 400 disposed on the extension 51 may be bent toward the back side of the display panel 100. For example, the circuit film 400 disposed on the extension 51 may be bent in the same direction as the direction in which the extension 51 is bent. The embodiments of the present disclosure are not limited thereto.

[0097] For example, at least one extension portion 51 of the support member 50 may be bent from one side of the support member 50 toward the back side of the display panel 100. For example, the driving chip 500 may be disposed on the back side of the display panel 100. For example, the driving chip 500 may be disposed on the back side of the circuit film 400. The embodiments of the present disclosure are not limited thereto.

[0098] Reference Figure 4In order to achieve a narrow frame, the frame size of the non-display area NA can be reduced as the size of the protruding area 400P of the bent circuit film 400 is reduced. For example, the circuit film 400 is bent by stretching the circuit film as much as possible to minimize the size of the protruding area 400P of the circuit film 400. The circuit film 400 and the display panel 100 cannot be reliably connected to each other at the connection area 450, so that the display panel 100 may be connected to the pad 140 (see FIG. 1 ) of the display panel 100. Fig.10 ) and an electrical signal defect occurs due to damage to the circuit film 400. For example, when there is a layer supporting the bent portion 400a of the circuit film 400, the size of the protruding area 400P of the circuit film 400 can be minimized. For example, the support member 50 may include at least one extension 51 protruding from the side of the display panel 100. For example, the support member 50 may at least partially overlap the circuit film 400 in the protruding area 400P of the circuit film 400.

[0099] For example, the extension 51 of the support member 50 may include a curved portion 51a that supports the back side of the circuit film 400. For example, the extension 51 of the support member 50 may include a non-contact portion 51b that does not contact the circuit film 400. For example, the tip of the extension 51 of the support member 50 may be prevented from contacting the circuit film 400, so that interference or damage to the circuit film 400 that is thinner and softer than the support member 50 may be prevented. The embodiments of the present disclosure are not limited thereto.

[0100] For example, at least one extension portion 51 of the support member 50 may include a contact portion 51c contacting the circuit film 400 and disposed between the bent portion 51a and the non-contact portion 51b not contacting the circuit film 400. The embodiments of the present disclosure are not limited thereto.

[0101] Figure 6 is a plan view of a support member according to an embodiment of the present disclosure.

[0102] Reference Figures 2 to 6 , for example, at least one extension 51 of the support member 50 may include a plurality of extensions that may be spaced apart from each other. The number of extensions 51 of the support member 50 according to an embodiment of the present disclosure may be equal to the number of circuit films 400. For example, at least one extension 51 of the support member 50 may overlap with at least one circuit film 400. For example, at least a portion of the support member 50 may contact with at least one circuit film 400. For example, at least one extension 51 of the support member 50 may at least partially contact with at least one circuit film 400. For example, the extension 51 of the support member 50 may be disposed on the back side of the circuit film 400, and may correspond one to one with the circuit film 400. The embodiments of the present disclosure are not limited thereto.

[0103] For example, the extension portion 51 of the support member 50 may not be divided into parts spaced apart from each other, but may have an integral structure. Therefore, there may be a region where the extension portion 51 does not overlap with the circuit film 400 .

[0104] For example, the number of at least one extension 51 of the support member 50 may be different from the number of at least one circuit film 400. The number of circuit films 400 and / or the number of extensions 51 of the support member 50 in the drawings according to the embodiments of the present disclosure are merely examples. However, the embodiments of the present disclosure are not limited thereto.

[0105] For example, the material of the support member 50 and the material of the circuit film 400 may be different from each other. The material of the support member 50 may include, for example, polyethylene terephthalate (PET). The material of the circuit film 400 may include, for example, polyimide (PI). However, the embodiments of the present disclosure are not limited thereto, and the material of the support member 50 and the material of the circuit film 400 may be the same as each other.

[0106] For example, the thickness of the support member 50 and the thickness of the circuit film 400 may be different from each other. For example, since the support member 50 supports the display panel 100, the support member 50 may be thicker than the circuit film 400 connecting the printed circuit board 300 and the display panel 100 to each other.

[0107] Figure 7 The present invention is a diagram showing an embodiment of the present invention. Figure 6 Graph of area A.

[0108] Reference Figure 7 , for example, the support member 50 may include at least one opening 55. For example, at least one extension 51 of the support member 50 may include at least one opening 55. According to the present disclosure, at least one opening 55 of at least one extension 51 of the support member 50 may include a straight line shape (or pattern). However, the embodiments of the present disclosure are not limited thereto. For example, since the support member 50 may be made of plastic, at least one opening 55 of at least one extension 51 of the support member 50 may include a mesh pattern to prevent cracks and operational failures due to shrinkage or expansion in different environments such as high temperature, low temperature, and high humidity. For example, the support member 50 may include an extension 51 for supporting and / or guiding the circuit film 400, and the extension 51 may include an opening 55 for ensuring quality in a reliable environment. For example, at least one of the shapes of the opening 55 may be bent in the same direction as the direction in which the extension is bent. For example, the straight line shape (mesh pattern) of the opening 55 may be bent in the direction in which at least one extension 51 of the support member 50 is bent. The embodiments of the present disclosure are not limited thereto.

[0109] Figure 8 Another embodiment of the present disclosure is shown in FIG. Figure 6 Figure 1. Figure 8 According to another embodiment of the present disclosure, at least one opening 56 of at least one extension 52 of the support member 50 may include a square hole shape (pattern). However, the embodiments of the present disclosure are not limited thereto. For example, at least one of the shapes of the opening 56 may be bent in the direction in which the extension is bent. For example, the square hole shape of the opening 56 may be bent in the direction in which at least one extension 52 of the support member 50 is bent. The embodiments of the present disclosure are not limited thereto.

[0110] Fig. 9 FIG. 2 is a diagram showing another embodiment according to the present disclosure. Figure 6 Figure 1. Fig. 9 According to another embodiment of the present disclosure, at least one opening 57 of at least one extension 53 of the support member 50 may include a circular or fine circular pattern. The embodiments of the present disclosure are not limited thereto. For example, at least one of the shapes of the opening 57 may be curved in the direction in which the extension is curved. For example, the fine circular hole shape of the opening 57 may be curved in the direction in which at least one extension 53 of the support member 50 is curved. The embodiments of the present disclosure are not limited thereto.

[0111] Fig.10 According to one embodiment of the present disclosure, Figure 1 A cross-sectional view of the display panel taken along line BB' in FIG.

[0112] Reference Fig.10 The display panel 100 of the display device 1 according to an embodiment of the present disclosure includes a substrate 101, a thin film transistor T, a planarization layer 107, a light emitting element 120, a bank 115, a pad 140, a dam 130, an encapsulation part 150 and a touch unit 160.

[0113] The thin film transistor T is disposed on the substrate 101. The thin film transistor T transmits a data voltage to a plurality of sub-pixels.

[0114] The substrate 101 supports various components of the display panel 100. The substrate 101 may be made of a transparent insulating material such as glass or plastic. When the substrate 101 is made of plastic, the substrate may be referred to as a plastic film or a plastic substrate. For example, the substrate 101 may be in the form of a film comprising one of a polyimide-based polymer, a polyester-based polymer, a silicon-based polymer, an acrylic polymer, a polyolefin-based polymer, and a copolymer thereof. However, the embodiments of the present disclosure are not limited thereto. For example, since polyimide is a material that can be applied to a high temperature process and can be coated, it can be used as a material for a plastic substrate. The substrate (array substrate) may include elements and functional layers formed on the substrate 101, such as a switching TFT, a driving TFT connected to the switching TFT, a light-emitting element 120 connected to the driving TFT, and an encapsulation unit 150. However, the embodiments of the present disclosure are not limited thereto.

[0115] A buffer layer may be provided on the substrate 101. The buffer layer may protect the thin film transistor (TFT) from impurities (eg, alkali ions) leaking from the substrate 101 or a layer below the substrate 101. The buffer layer may be made of silicon oxide (SiO x ), silicon nitride (SiN x ) or multiple layers thereof. However, the embodiments of the present disclosure are not limited thereto.

[0116] The thin film transistor T may be disposed on a substrate 101 or a buffer layer. The thin film transistor T may include an active layer 102, a gate insulating layer 103, a gate 104, an interlayer insulating layer 105, a source 106, and a drain 108. The active layer 102 is disposed on the substrate 101 or the buffer layer. The active layer 102 may be made of polycrystalline silicon (p-Si), wherein a predetermined region of the active layer may be doped with impurities. In addition, the active layer 102 may be made of amorphous silicon (a-Si), or may be made of various organic semiconductor materials such as pentacene. The active layer 102 may be made of an oxide. However, with respect to the material constituting the active layer 102, the embodiments of the present disclosure are not limited thereto. The active layer 102 may be a semiconductor layer. However, the present disclosure is not limited to the terms used herein.

[0117] The gate 104 may be disposed on top of or below the active layer 102 according to the structure of the thin film transistor T. The gate 104 may be made of each of various conductive materials such as magnesium (Mg), aluminum (Al), nickel (Ni), chromium (Cr), molybdenum (Mo), tungsten (W), gold (Au), or alloys thereof. However, the embodiments of the present disclosure are not limited thereto.

[0118] The gate insulating layer 103 may be disposed between the active layer 102 and the gate 104. The gate insulating layer 103 may be a layer for electrically insulating the gate 104 and the active layer 102 from each other, and may be made of an insulating material. For example, the gate insulating layer 103 may be formed of silicon oxide (SiO x ) or silicon nitride (SiN x ) is a single layer or a double layer. However, the embodiments of the present disclosure are not limited thereto. The gate insulating layer 103 may be a first insulating layer. However, the embodiments of the present disclosure are not limited thereto.

[0119] A source electrode 106 and a drain electrode 108 electrically connected to the active layer 102 and spaced apart from each other may be disposed on the interlayer insulating layer 105. Each of the source electrode 106 and the drain electrode 108 may be made of a conductive material such as copper (Cu), aluminum (Al), molybdenum (Mo), titanium (Ti), or an alloy thereof. However, the embodiments of the present disclosure are not limited thereto. The interlayer insulating layer 105 may be a second insulating layer. However, the embodiments of the present disclosure are not limited thereto.

[0120] According to the structure of the thin film transistor T, in order to electrically insulate the gate 104 from each of the source 106 and the drain 108 , an interlayer insulating layer 105 may be further disposed between the gate 104 and each of the source 106 and the drain 108 . However, the embodiments of the present disclosure are not limited thereto.

[0121] The planarization layer 107 may be disposed on the thin film transistor T. The planarization layer 107 protects the thin film transistor T and planarizes a portion of the top of the thin film transistor T. The planarization layer 107 may be disposed in the display area AA. The planarization layer 107 may not be disposed in the entirety or a portion of the non-display area NA. For example, the planarization layer 107 may be formed in various shapes. The planarization layer 107 may be made of, for example, an organic insulating film made of BCB (benzocyclobutene) or acrylic resin, or, for example, a silicon nitride film (SiN x ) or silicon oxide film (SiO x ) is composed of an inorganic insulating film. The planarization layer 107 can be formed as a single layer or a double layer or a multilayer. That is, various modifications can be made to the planarization layer 107. However, the embodiments of the present disclosure are not limited thereto. The planarization layer 107 can be formed with a contact hole CH for electrically connecting the thin film transistor T and the light emitting element 120 to each other. The planarization layer 107 can be a third insulating layer or a protective layer. However, the embodiments of the present disclosure are not limited thereto.

[0122] The light emitting element 120 is disposed on the planarization layer 107 . The light emitting element 120 may be a self-luminous element that emits light by itself, and may operate when receiving a voltage from a transistor, etc. The light emitting element 120 may include a first electrode 112 , a light emitting layer 114 , and a second electrode 116 .

[0123] For example, the light emitting element 120 may include a first electrode 112 formed on the planarization layer 107, a light emitting layer 114 disposed on the first electrode 112, and a second electrode 116 disposed on the light emitting layer 114. For example, the light emitting element 120 may be a self-luminous element that emits light by itself, and may operate when receiving a voltage from a thin film transistor T or the like.

[0124] The first electrode 112 may be electrically connected to the drain electrode 108 of the driving thin film transistor T via the contact hole CH. The first electrode 112 may be made of a conductive material capable of supplying holes to the light emitting layer 114. When the display panel 100 is a top emission type display panel, the first electrode 112 may be made of an opaque conductive material having a high reflectivity. For example, the first electrode 112 may be made of silver (Ag), aluminum (Al), gold (Au), molybdenum (Mo), tungsten (W), chromium (Cr), or an alloy thereof. However, the embodiments of the present disclosure are not limited thereto.

[0125] The bank 115 is disposed on the first electrode 112 and the planarization layer 107. The bank 115 may serve as an insulating layer to distinguish adjacent sub-pixels from each other. The bank 115 may be disposed to open a portion of the first electrode 112. The bank 115 may be made of an organic insulating material and may be disposed to cover an edge of the first electrode 112. However, the embodiments of the present disclosure are not limited thereto.

[0126] The bank 115 is formed in the remaining area except the light emitting area EA. Therefore, the bank 115 may have a bank hole defined therein, which exposes a portion of the first electrode 112 corresponding to the light emitting area. The bank 115 may be made of, for example, silicon nitride (SiN x ) or silicon oxide (SiO x ) or an organic insulating material such as BCB, acrylic resin or polyimide resin. However, the embodiments of the present disclosure are not limited thereto.

[0127] The light-emitting layer 114 is disposed on a portion of the first electrode 112 that is not covered by the bank 115 so as to be exposed. The light-emitting layer 114 may include a light-emitting layer, an electron injection layer, an electron transport layer, an electron blocking layer, a hole transport layer, a hole blocking layer, and a hole injection layer. However, the embodiments of the present disclosure are not limited thereto. The light-emitting layer may be composed of a single light-emitting layer structure that emits light of a single color, or may be composed of a plurality of light-emitting layers to emit white light that is a mixture of light beams emitted from a plurality of light-emitting layers. A charge generation layer may be further disposed between adjacent light-emitting layers in the plurality of light-emitting layers.

[0128] Reference Fig.10, showing that the light emitting layers 114 respectively disposed in the sub-pixels are disconnected from each other. However, the embodiments of the present disclosure are not limited thereto. For example, the light emitting layer 114 may be formed as a single layer spanning across a plurality of sub-pixels or across a portion of a plurality of sub-pixels.

[0129] The second electrode 116 may be disposed on the light emitting layer 114. The second electrode 116 may be made of a conductive material that can supply electrons to the light emitting layer 114. For example, the second electrode 116 may be made of a transparent conductive oxide such as indium tin zinc oxide (ITZO), zinc oxide (ZnO) and tin oxide (TO), or an ytterbium (Yb) alloy. However, the embodiments of the present disclosure are not limited thereto. The second electrode 116 may be formed as a very thin film made of a metal material. However, the embodiments of the present disclosure are not limited thereto. When the display panel 100 is a top-emitting display panel, the second electrode 116 may be made of a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO) or a transflective metal alloy such as a MgAg alloy, so that the light generated from the light emitting layer 114 can be emitted upward from the second electrode 116.

[0130] Reference Fig.10 , showing that the second electrodes 116 respectively disposed in the sub-pixels are connected to each other. However, the embodiments of the present disclosure are not limited thereto. Like the first electrodes 112, the second electrodes 116 respectively disposed in the sub-pixels are disconnected from each other. However, the embodiments of the present disclosure are not limited thereto.

[0131] The light-emitting layer 114 may be an organic light-emitting layer made of an organic material. However, the embodiments of the present disclosure are not limited thereto. For example, the light-emitting layer 114 may be an inorganic light-emitting layer including an inorganic semiconductor layer such as a quantum dot material, or an organic-inorganic hybrid light-emitting layer. In some cases, the light-emitting layer 114 may have a micro-LED or mini-LED arrangement.

[0132] The display area AA may include a plurality of light emitting areas EA and a non-light emitting area NEA between adjacent ones of the plurality of light emitting areas EA.

[0133] The region in which each of the plurality of light-emitting elements 120 is provided may be each of the plurality of light-emitting regions EA. Each of the plurality of light-emitting regions EA may be a region that can independently emit light of one color, and may be a region corresponding to a plurality of sub-pixels, and may be a region in which the embankment 110 is not provided. For example, the plurality of light-emitting regions EA may include, but are not limited to, a red light-emitting region, a green light-emitting region, and a blue light-emitting region. The plurality of light-emitting regions EA may be arranged to be spaced apart from each other. For example, the plurality of light-emitting regions EA may be arranged in a row direction and a column direction, and thus may be arranged in a matrix form. However, the embodiments of the present disclosure are not limited thereto.

[0134] The region where the plurality of light emitting elements 120 are not provided may be a non-light emitting region NEA. The non-light emitting region NEA may be a region provided between adjacent light emitting regions among the plurality of light emitting regions EA, and may be a region provided with the embankment 110. Since the non-light emitting region NEA is provided to surround the plurality of light emitting regions EA, the non-light emitting region NEA may be in a mesh form. However, the embodiments of the present disclosure are not limited thereto.

[0135] The dam 130 may be provided in the non-display area NA. For example, the dam 130 may be provided on the substrate 101 and provided in the non-display area NA. The dam 130 may be provided to prevent the material of the organic encapsulation layer 152 of the encapsulation part 150 from spreading, and the encapsulation part 150 is provided to cover the display area AA. For example, the dam 130 may suppress the material of the organic encapsulation layer 152 of the encapsulation part 150 from overflowing. One or more dams 130 may be provided, and the number of dams provided is not limited to a specific number.

[0136] The pad 140 is disposed in the non-display area NA. The pad 140 may be disposed outside the dam 130. A signal may be input to a circuit area or a driving chip formed in the substrate 101 via the pad 140. For example, the pad 140 may supply a signal supplied from an external source to a circuit area, a driving chip, etc. of the substrate 101. For example, the pad 140 may supply a signal for driving the touch unit 160 to the touch unit 160, and receive a signal generated by a touch input of a user from the touch unit 160.

[0137] For example, refer to Figure 4 and Fig.10 , the contact portion 51 c of the at least one extension portion 51 of the support member 50 may overlap the dam 130 and / or the pad 140 in the non-display area NA of the display panel 100 .

[0138] The encapsulation portion 150 is disposed on the light emitting element 120. The encapsulation portion 150 may be used as a sealing member that protects the light emitting material and the electrode material of the light emitting element 120 from external moisture, oxygen, impact, etc., to prevent the light emitting material and the electrode material of the light emitting element 120 from being oxidized. The encapsulation portion 150 may be disposed to cover the entire display area AA where the light emitting element 120 is disposed. The encapsulation portion 150 may be disposed to cover a portion of the non-display area NA extending from the display area AA. The encapsulation portion 150 may include a first inorganic encapsulation layer 151 made of an inorganic material, an organic encapsulation layer 152 made of an organic material and disposed on the first inorganic encapsulation layer 151, and a second inorganic encapsulation layer 153 disposed on the organic encapsulation layer 152. However, the embodiments of the present disclosure are not limited thereto.

[0139] The first inorganic encapsulation layer 151 seals the display area AA and prevents oxygen and moisture from penetrating into the display area AA to protect the light emitting element 120. The first inorganic encapsulation layer 151 may be disposed not only in the display area AA but also in the non-display area NA extending from the display area AA, and thus may be disposed to cover the dam 130 of the non-display area NA. The first inorganic encapsulation layer 151 may be made of, for example, silicon nitride (SiN x ), silicon oxide (SiO x ), silicon oxynitride (SiON), etc. However, the embodiments of the present disclosure are not limited thereto.

[0140] The organic encapsulation layer 152 is disposed on the first inorganic encapsulation layer 151. The organic encapsulation layer 152 may flatten a portion on top of the first inorganic encapsulation layer 151 and may fill cracks that may occur in the first inorganic encapsulation layer 151. When foreign matter is deposited on the first inorganic encapsulation layer 151, the organic encapsulation layer 152 may flatten a portion on top of the foreign matter. The organic encapsulation layer 152 may be disposed in a portion of the display area AA and the non-display area NA extending from the display area AA, and may be disposed inside the dam 130. The organic encapsulation layer 152 may be made of an epoxy-based polymer or an acrylic polymer. However, embodiments of the present disclosure are not limited thereto.

[0141] The second inorganic encapsulation layer 153 is disposed on the organic encapsulation layer 152. The second inorganic encapsulation layer 153 contacts the first inorganic encapsulation layer 151 in the outer region of the display unit 100, so that the second inorganic encapsulation layer 153 and the first inorganic encapsulation layer 151 together can seal the organic encapsulation layer 152. The second inorganic encapsulation layer 153 may be disposed in a portion of the non-display area NA extending from the display area AA. The second inorganic encapsulation layer 153 may be disposed in contact with a portion of the first inorganic encapsulation layer 151 disposed in the non-display area NA. The second inorganic encapsulation layer 153 may be made of, for example, silicon nitride (SiN x ), silicon oxide (SiO x ), silicon oxynitride (SiON), etc. However, the embodiments of the present disclosure are not limited thereto.

[0142] exist Fig.10 , the encapsulation part 150 is illustrated as including a first inorganic encapsulation layer 151, an organic encapsulation layer 152, and a second inorganic encapsulation layer 153. However, the number of inorganic encapsulation layers included in the encapsulation part 150 and the number of organic encapsulation layers included in the encapsulation part 150 are not limited thereto.

[0143] The touch unit 160 is disposed on the encapsulation part 150. The touch unit 160 may be disposed in the display area AA including the light emitting element 120, and may sense a touch input. The touch unit 160 may detect external touch information input to the touch unit 160 using a user's finger or a touch pen. The touch unit 160 may include a first protective layer 161, a second protective layer 162, an organic insulating layer 167, a first touch electrode 164, and a second touch electrode 165.

[0144] The first protective layer 161 may be disposed on the encapsulation part 150. The first protective layer 161 may be in contact with the second inorganic encapsulation layer 153 of the encapsulation part 150. The first protective layer 161 may be made of an inorganic material. For example, the first protective layer 161 may be made of, for example, silicon nitride (SiN x ), silicon oxide (SiO x ), silicon oxide nitride (SiON x ) etc. However, the embodiments of the present disclosure are not limited thereto.

[0145] The first touch electrode 164 is disposed on the first protective layer 161. The first touch electrode 164 is disposed in the non-luminous area NEA and is disposed on the first protective layer 161. The first touch electrode 164 may include patterns spaced apart from each other and arranged along the X-axis direction and the Y-axis direction. For example, the first touch electrode 164 may include a plurality of patterns spaced apart from each other and arranged along the X-axis direction and a plurality of patterns spaced apart from each other and arranged along the Y-axis direction. The first touch electrode 164 supplies a touch drive signal to drive the touch unit 160. In addition, the first touch electrode 164 may send touch information detected by the touch unit 160 to the driver IC. The first touch electrode 164 may be in the form of a mesh. However, the embodiments of the present disclosure are not limited thereto. The first touch electrode 164 may be made of a metal material. However, the embodiments of the present disclosure are not limited thereto.

[0146] The second protective layer 162 may be disposed on the first touch electrode 164 and the first protective layer 161. The second protective layer 162 may prevent a short circuit between patterns of the first touch electrode 164 adjacent to each other.

[0147] The second touch electrode 165 may be disposed on the second protective layer 162. The second protective layer 162 may be made of an inorganic material. For example, the second protective layer 162 may be made of, for example, silicon nitride (SiN x ), silicon oxide (SiO x ) or silicon oxynitride (SiON x ) is made of inorganic materials. However, the embodiments of the present disclosure are not limited thereto.

[0148] For example, the pad 140 and the second touch electrode 165 may be electrically connected to the circuit film 400 through the conductive adhesive layer 395. However, the embodiments of the present disclosure are not limited thereto.

[0149] The display device according to the embodiment of the present disclosure can be applied to mobile devices, video phones, smart watches, watch phones, wearable devices, foldable devices, rollable devices, bendable devices, flexible devices, bending devices, sliding devices, variable devices, electronic notebooks, electronic books, portable multimedia players (PMP), personal digital assistants (PDA), MP3 players, mobile medical devices, desktop PCs, laptop PCs (personal computers), netbook computers, workstations, navigation, car navigation, car display devices, car devices, cinema devices, cinema display devices, televisions, wallpaper devices, signage devices, game devices, laptop computers, monitors, cameras, video cameras and household appliances. In addition, the display device of the present disclosure can be applied to organic light emitting lighting devices or inorganic light emitting lighting devices.

[0150] A display device according to an embodiment of the present disclosure can be described as follows.

[0151] A first aspect of the present disclosure provides a display device, comprising: a supporting member; a display panel disposed on the supporting member; a printed circuit board electrically connected to one side of the display panel; and at least one circuit film having one side and another side opposite to each other and electrically connected to the display panel and the printed circuit board, respectively, wherein at least a portion of the at least one circuit film is bent toward the back side of the display panel, and wherein the supporting member includes at least one extension protruding from the side of the display panel and overlapping with the circuit film on the back side of the circuit film.

[0152] In the display device of the first aspect, the display device further includes: a driving chip disposed on the back side of the display panel, wherein the driving chip is disposed on the back side of the circuit film.

[0153] In the display device of the first aspect, the extension portion is bent from one side of the support member toward the rear surface of the display panel.

[0154] In the display device of the first aspect, at least one extending portion of the support member further includes at least one opening.

[0155] In the display apparatus of the first aspect, the at least one extending portion of the supporting member includes a plurality of extending portions spaced apart from each other.

[0156] In the display device of the first aspect, the number of the at least one extending portion of the support member is equal to the number of the at least one circuit film.

[0157] In the display device of the first aspect, the material of the support member and the material of the circuit film are different from each other.

[0158] In the display device of the first aspect, the thickness of the support member and the thickness of the circuit film are different from each other.

[0159] In the display device of the first aspect, the thickness of the support member is greater than the thickness of the circuit film.

[0160] In the display device of the first aspect, the extending portion of the support member further includes a non-contact portion that does not contact the circuit film.

[0161] In the display device of the first aspect, at least one opening of the extending portion of the support member has a linear shape.

[0162] In the display device of the first aspect, at least one opening of the extending portion of the support member has a circular shape.

[0163] In the display device of the first aspect, the circuit film includes polyimide.

[0164] In the display device of the first aspect, at least one of the shapes of the opening is curved in a direction in which the extending portion is curved.

[0165] In the display device of the first aspect, the support member includes polyethylene terephthalate.

[0166] A second aspect of the present disclosure provides a display device comprising: a supporting member; a display panel disposed on the supporting member; a printed circuit board electrically connected to one side of the display panel; and at least one circuit film electrically connected to the printed circuit board, wherein a portion of the at least one circuit film is bent, wherein the supporting member overlaps with at least a portion of the circuit film in a protruding area of ​​the circuit film and includes at least one opening.

[0167] In the display device of the second aspect, the support member includes at least one extending portion protruding from a side surface of the display panel.

[0168] In the display device of the second aspect, the support member includes a non-contact portion that does not contact the circuit film.

[0169] In the display device of the second aspect, the support member includes a curved portion that supports the rear surface of the circuit film.

[0170] In the display device of the second aspect, the pad is provided in the non-display area of ​​the display panel, wherein the pad is electrically connected to the circuit film through the conductive adhesive layer.

[0171] Although the embodiments of the present disclosure have been described in more detail with reference to the accompanying drawings, the present disclosure is not necessarily limited to these embodiments and can be modified in various ways within the scope of the technical spirit of the present disclosure. Therefore, the embodiments disclosed in the present disclosure are intended to describe rather than limit the technical concept of the present disclosure, and the scope of the technical concept of the present disclosure is not limited by these embodiments. Therefore, it should be understood that the above-mentioned embodiments are not restrictive in all aspects, but illustrative.

Claims

1. A display device, comprising: Supporting members; A display panel is arranged on the supporting member; a printed circuit board electrically connected to one side of the display panel; as well as at least one circuit film having one side and another side facing each other and electrically connected to the display panel and the printed circuit board, respectively, wherein at least a portion of the at least one circuit film is bent toward the back side of the display panel, The supporting member includes at least one extending portion protruding from a side surface of the display panel and overlapping with the circuit film on a rear surface of the circuit film.

2. The display device according to claim 1, further comprising: A driving chip is arranged on the back of the display panel. Wherein, the driving chip is arranged on the back side of the circuit film.

3. The display device according to claim 1, wherein: The extension portion is bent from one side of the support member toward a rear surface of the display panel.

4. The display device according to claim 1, wherein: The at least one extension of the support member further includes at least one opening.

5. The display device according to claim 1, wherein: The at least one extension of the support member includes a plurality of extensions spaced apart from each other.

6. The display device according to claim 1, wherein: The number of the at least one extending portion of the supporting member is equal to the number of the at least one circuit film.

7. The display device according to claim 1, wherein: A material of the support member and a material of the circuit film are different from each other.

8. The display device according to claim 1, wherein: A thickness of the support member and a thickness of the circuit film are different from each other.

9. The display device according to claim 8, wherein: The thickness of the supporting member is greater than the thickness of the circuit film.

10. The display device according to claim 1, wherein: The extending portion of the supporting member further includes a non-contact portion that does not contact the circuit film.

11. The display device according to claim 4, wherein: The at least one opening of the extension portion of the support member has a linear shape.

12. The display device according to claim 4, wherein: The at least one opening of the extension portion of the support member has a circular shape.

13. The display device according to claim 1, wherein: The circuit film includes polyimide.

14. The display device according to claim 11 or 12, wherein: At least one of the shapes of the opening is bent in the direction in which the extending portion is bent.

15. The display device according to claim 1, wherein: The support member includes polyethylene terephthalate.

16. A display device comprising: Supporting members; A display panel is arranged on the supporting member; a printed circuit board electrically connected to one side of the display panel; as well as at least one circuit film electrically connected to the printed circuit board, wherein a portion of the at least one circuit film is bent, The support member overlaps at least a portion of the circuit film in a protruding region of the circuit film and includes at least one opening.

17. The display device according to claim 16, wherein: The support member includes at least one extending portion protruding from a side of the display panel.

18. The display device according to claim 16, wherein: The supporting member includes a non-contact portion that does not contact the circuit film.

19. The display device according to claim 16, wherein: The supporting member includes a bent portion supporting a rear surface of the circuit film.

20. The display device according to claim 16, wherein: A pad is provided in the non-display area of ​​the display panel, Wherein, the pad is electrically connected to the circuit film through a conductive adhesive layer.

21. A display device, comprising: Supporting members; A display panel is arranged on the supporting member; A printed circuit board is arranged under the display panel; as well as a circuit film having one side electrically connected to one side of the display panel and another side electrically connected to the printed circuit board, wherein the support member comprises an extension portion, the extension portion being bent from one side of the support member to the printed circuit board, and At least a portion of the circuit film extends along the extending portion of the supporting member and is supported by the extending portion.

22. The display device according to claim 21, wherein: The extending portion includes a bent portion, a contact portion, and a non-contact portion that does not contact the circuit film.

23. The display device according to claim 22, wherein: The bending portion and the contact portion contact the circuit film and support the circuit film.

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