Electronic device including antenna

Abstract

According to an embodiment, an electronic device may include: a communication circuit; the shell comprises a first surface of the electronic device and a second surface of the electronic device, and the orientation direction of the second surface is different from that of the first surface; a display visible through the first surface; a first plate disposed at least between the display and the second surface and including a conductive material, where the first plate includes a first opening, and a portion of the first plate surrounding the first opening includes a first antenna; a support disposed at least between the first plate and the second surface and including a conductive portion; and a second antenna disposed within the housing and configured to transmit and / or receive a signal with respect to at least one direction different from a direction in which the first antenna transmits and / or receives a signal.

Description

Technical Field

[0001] The present disclosure relates to an electronic device including an antenna. Background Art

[0002] In recent years, the demand for low-cost short-range wireless communications has grown rapidly. For example, NFC technology has developed beyond the existing tap-to-pay level and is being developed to provide users with a smarter tag experience by combining with various applications. For example, an electronic device such as a smart phone may include a housing, a display, and an antenna radiator, wherein the housing includes a front surface and a rear surface; the display is located in the housing and visible through the front surface; the antenna radiator is located in the housing near the rear surface. The NFC recognition range may refer to a portion close to an external electronic device for smooth NFC between the electronic device and the external electronic device, and may be an area overlapping with the NFC antenna radiator in the rear surface. When the NFC recognition range of an electronic device faces the NFC recognition range of an external electronic device and approaches within a threshold distance (e.g., 100 mm, as the maximum recognition distance), the electronic device is able to exchange data with the external electronic device through the NFC antenna radiator.

[0003] When the electronic device is close to an external electronic device in order to use the NFC function, the user needs to pay attention to point the surface with the NFC recognition range to the external electronic device. When the electronic device is foldable, it may be troublesome for the user to try to find a surface with an NFC recognition range in an unfolded state or a folded state and point the surface to the external electronic device. For example, when the electronic device is implemented as an external folding structure in which the screen is folded outward, the surface with the NFC recognition range will not be exposed to the outside when the electronic device is folded. Therefore, there may be inconvenience in switching the electronic device from the folded state to the unfolded state.

[0004] The above information is presented as background information only to assist with an understanding of the present disclosure. No determination has been made, and no assertion is made, as to whether any of the above might be applicable as prior art with respect to the present disclosure. Summary of the invention

[0005] An embodiment of the present disclosure provides an electronic device including an antenna for satisfying usability (eg, user experience satisfaction) regarding NFC by providing an NFC recognition range on a screen.

[0006] According to an exemplary embodiment, an electronic device may include: a housing including a first surface and a second surface facing away from the first surface; a display at least partially accommodated in the housing and visible through the first surface; a conductive layer disposed between the display and the second surface and including a first opening; a supporting member disposed between the second surface and the conductive layer and including a conductive portion; and a wireless communication circuit electrically connected to the conductive layer and configured to send and / or receive signals through an antenna defined by at least a portion of the conductive layer surrounding the first opening.

[0007] According to an exemplary embodiment, a loop antenna radiator can be implemented that radiates energy to the screen by feeding power to an opening formed in a conductive layer provided on the display. Therefore, the NFC recognition range can be positioned on the screen, thereby eliminating and / or reducing the limitation of the NFC recognition range. In addition, as the range of available applications expands, the number of antennas included in electronic devices such as smart phones continues to increase while pursuing thinner form factors of electronic devices, a loop antenna radiator using a conductive layer provided on the display can help the electronic device become thinner. In various technologies that replace NFC, such as magnetic secure transmission (MST) that can send and / or receive magnetic signals, an antenna or antenna system implemented as a loop antenna radiator can be used using a conductive layer provided on the display. As a result, the range of user experience can be increased.

[0008] In addition, the effects obtained or expected by various exemplary embodiments may be disclosed directly or implicitly in the detailed description. For example, various effects expected according to various exemplary embodiments may be disclosed in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The above and other aspects, features and advantages of certain embodiments of the present disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0010] Figure 1 is a block diagram illustrating an exemplary electronic device in a network environment according to various embodiments;

[0011] Figure 2A is a front perspective view showing the front side of a mobile electronic device according to various embodiments;

[0012] Figure 2B is a diagram showing various embodiments Figure 2A A rear perspective view of a rear side of an electronic device;

[0013] Figure 3 According to various embodiments Figure 2A An exploded perspective view of an electronic device;

[0014] Figure 4is taken along line AA' according to various embodiments Figure 2A a cross-sectional view of an electronic device;

[0015] Figure 5 is a circuit diagram illustrating an exemplary antenna device according to various embodiments;

[0016] Figure 6 is a block diagram illustrating an exemplary electronic device according to various embodiments;

[0017] Figure 7 is a diagram showing various embodiments Figure 6 A flowchart of an exemplary operation of an electronic device;

[0018] Fig. 8A is a diagram showing various embodiments Figure 7 A diagram of an exemplary operation flow of

[0019] Figure 8B is a diagram showing various embodiments Figure 7 A diagram of an exemplary operation flow of

[0020] Fig. 9 is a block diagram illustrating an exemplary antenna device according to various embodiments;

[0021] Fig.10 is a block diagram illustrating an exemplary antenna device according to various embodiments;

[0022] Fig.11 is a diagram illustrating an exemplary electronic device in an unfolded state according to various embodiments;

[0023] Fig.12 is a diagram illustrating an exemplary electronic device in a folded state according to various embodiments;

[0024] Fig.13 According to various embodiments Fig.11 or Fig.12 An exploded perspective view of an electronic device;

[0025] Fig.14A FIG. 1 is a diagram showing an expanded state according to various embodiments. Fig.11 a cross-sectional view of an electronic device;

[0026] Fig. 14B FIG. 1 is a diagram showing a folded state according to various embodiments. Fig.12 a cross-sectional view of an electronic device;

[0027] Fig.15 is a diagram showing various embodiments Fig.14A or Fig. 14B A block diagram of an electronic device;

[0028] Fig.16 is a diagram showing various embodiments Fig.15 A flowchart of an exemplary operation of an electronic device;

[0029] Fig.17A is a diagram showing various embodiments Fig.16 A diagram of an exemplary operation flow of

[0030] Fig. 17B is a diagram showing various embodiments Fig.16 A diagram of an exemplary operation flow of

[0031] Fig.18A is a cross-sectional view showing an exemplary electronic device in an unfolded state having an external folding structure according to various embodiments;

[0032] Fig.18B FIG. 1 is a diagram showing a folded state according to various embodiments. Fig.18A a cross-sectional view of an electronic device;

[0033] Fig.19 is a cross-sectional view showing a foldable electronic device in an unfolded state according to various embodiments;

[0034] Fig. 20 FIG. 1 is a diagram showing a folded state according to various embodiments. Fig.19 a cross-sectional view of an electronic device;

[0035] Fig.21 FIG. 2 is a diagram showing an example of an electronic device being implemented in an external folding structure according to various embodiments. Fig.19 A block diagram of an electronic device;

[0036] Fig. 22 is a diagram showing various embodiments Fig.21 A flowchart of an exemplary operation of an electronic device;

[0037] Fig.23A is a diagram showing various embodiments Fig. 22 A diagram of an exemplary operation flow of

[0038] Fig. 23B is a diagram showing various embodiments Fig. 22 A diagram of an exemplary operation flow of

[0039] Fig.24 FIG. 1 is a diagram showing a folded state according to various embodiments. Fig.19 a cross-sectional view of an electronic device;

[0040] Fig.25 is a cross-sectional view showing an electronic device having an inner folding structure in an unfolded state according to various embodiments;

[0041] Fig.26 FIG. 1 is a diagram showing a folded state according to various embodiments. Fig.25 a cross-sectional view of an electronic device;

[0042] Fig. 27 According to various embodiments Fig.25 A block diagram of an electronic device;

[0043] Fig.28 is a diagram showing various embodiments Fig. 27 A flowchart of an exemplary operation of an electronic device;

[0044] Fig.29A is a diagram showing various embodiments Fig.28 A diagram of an exemplary operation flow of

[0045] Fig.29B is a diagram showing various embodiments Fig.28 A diagram of an exemplary operational flow of; and

[0046] Fig.30 is a diagram illustrating a wearable electronic device and exemplary operations thereof according to various embodiments. DETAILED DESCRIPTION

[0047] The following description is made with reference to the accompanying drawings and is provided to help understand the various embodiments of the present disclosure. It includes various specific details to help understanding, but these are considered to be examples only and are not intended to be limiting. Therefore, it will be appreciated by those of ordinary skill in the art that various changes and modifications may be made to the various exemplary embodiments described herein without departing from the scope and spirit of the present disclosure. In addition, for the sake of clarity and brevity, descriptions of well-known functions and structures may be omitted.

[0048] The terms and words used in the following description and claims are not limited to the written meanings, but are only used to enable a clear and consistent understanding of the present disclosure. Therefore, it should be clear to those skilled in the art that the following description of various exemplary embodiments of the present disclosure is provided for illustrative purposes only and not for limiting the present disclosure.

[0049] It should be understood that the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "a surface of a component" includes reference to one or more of such surfaces.

[0050] Figure 1 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments. Figure 1, the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input device 150, a sound output device 155, a display device 160, an audio module 170, a sensor module 176, an interface 177, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the components (e.g., the display device 160 or the camera module 180) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the components may be implemented as a single integrated circuit. For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illumination sensor) may be implemented to be embedded in the display device 160 (eg, a display).

[0051] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to an embodiment, as at least part of the data processing or calculation, the processor 120 may load a command or data received from another component (e.g., sensor module 176 or communication module 190) into the volatile memory 132, process the command or data stored in the volatile memory 132, and store the result data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) and an auxiliary processor 123 (e.g., a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is independent of or combined with the main processor 121 in operation. Additionally or alternatively, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be specifically used for a specified function. The auxiliary processor 123 may be implemented separately from the main processor 121 , or as part of the main processor 121 .

[0052] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 may control at least some of the functions or states related to at least one component (e.g., display device 160, sensor module 176, or communication module 190) among the components of the electronic device 101 (not the main processor 121), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component (e.g., display device 160, sensor module 176, or communication module 190) among the components of the electronic device 101 together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) that is functionally related to the auxiliary processor 123.

[0053] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134.

[0054] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0055] The input device 150 may receive commands or data to be used by other components (eg, the processor 120) of the electronic device 101 from outside the electronic device 101 (eg, a user). The input device 150 may include, for example, a microphone, a mouse, or a keyboard.

[0056] The sound output device 155 can output a sound signal to the outside of the electronic device 101. The sound output device 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records, and the receiver can be used for incoming calls. Depending on the embodiment, the receiver can be implemented as a separate part from the speaker, or as a part of the speaker.

[0057] The display device 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display device 160 may include a touch circuit adapted to detect a touch or a sensor circuit (e.g., a pressure sensor) adapted to measure the strength of a force caused by a touch.

[0058] The audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 may obtain sound via the input device 150, or output sound via the sound output device 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0059] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a user's state) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0060] The interface 177 may support one or more specific protocols that will be used to connect the electronic device 101 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0061] The connection end 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0062] The haptic module 179 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0063] The camera module 180 may capture still images or moving images. According to embodiments, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

[0064] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0065] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0066] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a cellular network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip), or these various types of communication modules can be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 192 can identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0067] The antenna module 197 may transmit or receive a signal or power to or from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include one or more antennas, and thus, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected by, for example, the communication module 190 (e.g., the wireless communication module 192). A signal or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna.

[0068] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0069] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 and the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type from the electronic device 101. According to an embodiment, all or some operations to be run on the electronic device 101 may be run on one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically perform a function or service or should perform a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to perform at least part of the function or service instead of running the function or service, or the electronic device 101 may request the one or more external electronic devices to perform at least part of the function or service in addition to running the function or service. The one or more external electronic devices that receive the request may perform the requested at least part of the function or service, or perform another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request with or without further processing the result. To this end, cloud computing technology, distributed computing technology or client-server computing technology may be used, for example.

[0070] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to those electronic devices described above.

[0071] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalents or alternative forms for the corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the nouns in the singular form corresponding to the term may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each phrase in the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include all possible combinations of items listed together with the corresponding one of the multiple phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the corresponding component from another component, and do not limit the component in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being "combined with another element (e.g., the second element)", "combined to another element (e.g., the second element)", "connected with another element (e.g., the second element)" or "connected to another element (e.g., the second element)" when the terms "operably" or "communicatively" are used or when the terms "operably" or "communicatively" are not used, it means that the element can be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0072] As used herein, the term "module" may include units implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or a minimum unit or portion of the single integrated component. For example, according to an embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0073] The various embodiments described herein may be implemented as software (e.g., program 140) including one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). For example, under the control of a processor, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) may call at least one of the one or more instructions stored in the storage medium and execute the at least one instruction with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be run by an interpreter. A machine-readable storage medium may be provided in the form of a non-transitory storage medium. Among them, the term "non-transitory" only means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but the term does not distinguish between data being semi-permanently stored in a storage medium and data being temporarily stored in a storage medium.

[0074] According to an embodiment, the method according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be released in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be downloaded via an application store (e.g., Play Store TM ) The computer program product may be published (e.g., downloaded or uploaded) online, or the computer program product may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smart phones). If published online, at least part of the computer program product may be temporarily generated, or at least part of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a memory of a manufacturer's server, an application store's server, or a forwarding server).

[0075] According to various embodiments, each component (e.g., module or program) in the above-mentioned components may include a single entity or multiple entities. According to various embodiments, one or more components in the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each component in the multiple components in the same or similar manner as a corresponding component in the multiple components before integration. According to various embodiments, the operations performed by a module, program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more operations in the operations may be run or omitted in different orders, or one or more other operations may be added.

[0076] Figure 2A is a front perspective view showing a front surface of a mobile electronic device 200 according to various embodiments.

[0077] Figure 2B is a diagram showing various embodiments Figure 2A A rear stereoscopic view of the rear surface of the electronic device 200.

[0078] Reference Figure 2A and Figure 2B According to an embodiment, the electronic device 200 may include a housing 210, which includes a first surface (or front surface) 210A, a second surface (or rear surface) 210B, and a lateral (or side) surface 210C surrounding the space between the first surface 210A and the second surface 210B. According to another embodiment, the housing 210 may refer to a structure forming at least a portion of the first surface 210A, the second surface 210B, and the lateral surface 210C. According to an embodiment, the first surface 210A may be formed by a front plate 202 (e.g., a glass plate or a polymer plate coated with various coatings), at least a portion of which is substantially transparent. The second surface 210B may be formed by a substantially opaque rear plate 211. The rear plate 211 may be formed by, for example, coated or colored glass, ceramics, polymers, metals (e.g., aluminum, stainless steel (STS) or magnesium), or any combination thereof. The lateral surface 210C may be formed by a lateral (or side) frame structure (or "lateral member") 218 ​​that is combined with the front plate 202 and the rear plate 211 and includes metal and / or polymer. In some embodiments, the rear plate 211 and the lateral frame structure 218 may be integrally formed and may be formed of the same material (e.g., a metal material such as aluminum).

[0079] According to an embodiment, the electronic device 200 may include at least one of the following: a display 201, audio modules 203, 207, and 214, a sensor module 204, camera modules 205, 212, and 213, a key input device 217, and connector holes 208 and 209. In various embodiments, the electronic device 200 may omit at least one of the above components (e.g., the key input device 217), or may further include other components (e.g., a fingerprint sensor or a light emitting device). In various embodiments, the electronic device 200 may include Figure 1 Electronic device 101.

[0080] For example, the display 201 may be exposed through a major portion of the front plate 202. In various embodiments, the outline (e.g., edges and corners) of the display 201 may have substantially the same shape as the outline of the front plate 202. In another embodiment (not shown), the interval between the outline of the display 201 and the outline of the front plate 202 may be substantially unchanged so as to expand the exposed area of ​​the display 201.

[0081] In another embodiment (not shown), a recess or opening may be formed in a portion of the display area of ​​the display 201 to accommodate or align at least one of the audio module (e.g., audio module 214), the sensor module 204, and the camera module 205. In another embodiment (not shown), at least one of the audio module (e.g., audio module 214), the sensor module 204, and the camera module 205 may be disposed on the back side of the display area of ​​the display 201. In another embodiment (not shown), the display 201 may be combined with or adjacent to a touch sensing circuit, a pressure sensor capable of measuring touch intensity (pressure), and / or a digitizer for detecting a stylus.

[0082] The audio modules 203, 207, and 214 may correspond to a microphone hole (e.g., audio module 203) and a speaker hole (e.g., audio modules 207 and 214). The microphone hole may include a microphone disposed therein for acquiring external sound, and in one case, a plurality of microphones are included to sense the direction of the sound. The speaker hole may be divided into an external speaker hole and a call receiver hole. In various embodiments, the microphone hole and the speaker hole may be implemented as a single hole, or a speaker (e.g., a piezoelectric speaker) may be provided without a speaker hole.

[0083] The sensor module 204 may generate an electrical signal or data corresponding to an internal operating state of the electronic device 200 or corresponding to an external environmental condition. The sensor module 204 may, for example, include a proximity sensor configured to generate a signal about the proximity of an external object based on light passing through a partial area of ​​the first surface 210A of the housing 210. According to various embodiments, the sensor module 204 may be various biosensors, for example, a fingerprint sensor for detecting information on a living body based on light passing through a partial area of ​​the first surface 210A. According to various embodiments, the fingerprint sensor may be located on the rear surface of the display 201. The electronic device 200 may also include at least one of a gesture sensor, a gyroscope sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illumination sensor (e.g., the sensor module 204).

[0084] The camera modules 205, 212 and 213 may include, for example, a first camera device 205, a second camera device 212 and / or a flash 213. The first camera device 205 may generate an image signal based on light passing through a partial area of ​​the first surface 210A of the housing 210. The second camera device 212 and the flash 213 may be located on the second surface 210B of the housing 210. The camera module 205 or the camera module 212 may include one or more lenses, an image sensor and / or an image signal processor. The flash 213 may include, for example, a light emitting diode or a xenon lamp. In various embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and an image sensor may be provided on one side of the electronic device 200.

[0085] The key input device 217 may be provided on the lateral surface 210C of the housing 210. In another embodiment, the electronic device 200 may not include some or all of the above-mentioned key input devices 217, and may not include the key input device 217 and may implement the key input device 217 in another form (such as a soft key on the display 201). In various embodiments, the key input device 217 may include a sensor module (not shown) provided on the second surface 210B of the housing 210.

[0086] For example, a light emitting device (not shown) may be provided on the first surface 210A of the housing 210. For example, the light emitting device may provide status information of the electronic device 200 in an optical form. In various embodiments, the light emitting device may provide a light source in association with the operation of the camera module 205. The light emitting device may include, for example, a light emitting diode (LED), an infrared (IR) LED, or a xenon lamp.

[0087] Connector holes 208 and 209 may include a first connector hole (e.g., connector hole 208) adapted for a connector (e.g., a universal serial bus (USB) connector) for sending power and / or data to and receiving power and / or data from an external electronic device, and / or a second connector hole (e.g., connector hole 209) adapted for a connector (e.g., a headphone jack) for sending audio signals to and receiving audio signals from an external electronic device.

[0088] Figure 3 According to various embodiments Figure 2A An exploded perspective view of an electronic device.

[0089] Reference Figure 3 According to an embodiment, the electronic device 200 may include a side frame structure 218, a first supporting member 311 (e.g., a bracket), a front panel 202, a display 201, a conductive layer 430, a first panel assembly 341, a second panel assembly 342, a battery 350, a second supporting member 361, a third supporting member 362, a third antenna structure 403 and / or a rear panel 211. In some embodiments, in the electronic device 200, at least one component (e.g., the second supporting member 361 or the third supporting member 362) may be omitted, or other components may be additionally included. At least one component of the electronic device 200 may be connected to the back panel 211. Figure 2A or Figure 2B At least one component of the electronic device 200 is the same or similar, and redundant description will be omitted below.

[0090] For example, the first support member 311 may be disposed in the electronic device 200 and connected to the side frame structure 218, or may be integrally formed with the side frame structure 218. The first support member 311 may be formed of, for example, a metal material and / or a non-metallic (eg, polymer) material.

[0091] The display 201 may be coupled to, for example, one surface of the first support member 311, and may be located between the first support member 311 and the front panel 202. The first panel assembly 341 and the second panel assembly 342 may be connected to, for example, another surface of the first support member 311, and may be located between the first support member 311 and the rear panel 211.

[0092] According to an embodiment, the first board assembly 341 may include a first printed circuit board (PCB) (not shown). The display 201 or the first camera device 205 may be electrically connected to the first printed circuit board through various electrical paths such as a flexible printed circuit board (FPCB). The first board assembly 341 may include various electronic components electrically connected to the first printed circuit board. The electronic components may be located on the first printed circuit board or may be electrically connected to the first printed circuit board through electrical paths such as wiring or FPCB. The electronic components may include, for example, Figure 1 At least some components of the electronic device 101.

[0093] According to various embodiments, the first board assembly 341 may include a master PCB, a slave PCB positioned to partially overlap the master PCB when viewed from above the rear plate 211 , and / or an interposer substrate between the master PCB and the slave PCB.

[0094] According to an embodiment, when viewed from above the front plate 202, the second board assembly 342 may be positioned to be spaced apart from the first board assembly 341 with the battery 350 interposed therebetween. The second board assembly 342 may include a second printed circuit board electrically connected to the first printed circuit board of the first board assembly 341. The second board assembly 342 may include various electronic components electrically connected to the second printed circuit board. The electronic components may be located on the second printed circuit board, or may be electrically connected to the second printed circuit board through an electrical path such as wiring or FPCB. The electronic components may include, for example, Figure 1 According to an embodiment, the electronic components may include a USB connector using the first connector hole 208, an earphone jack using the second connector hole 209, a microphone using the microphone hole 203, or a speaker using the speaker hole 207.

[0095] According to an embodiment, the battery 350 may be located between the first support member 311 and the rear plate 211, and may be coupled to the first support member 311. The battery 350 is a device for supplying power to at least one component of the electronic device 200, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery 350 may be located, for example, on a plane substantially the same as the first printed circuit board of the first board assembly 341 or the second printed circuit board of the second board assembly 342. The battery 350 may be integrally located within the electronic device 200, or may be detachably located on the electronic device 200.

[0096] According to an embodiment, the second support member 361 may be located between the first support member 311 and the rear plate 211, and may be connected to the first support member 311 by a fastening element such as a bolt. At least a portion of the first plate assembly 341 may be located between the first support member 311 and the second support member 361, and the second support member 361 may cover and protect the first plate assembly 341.

[0097] According to an embodiment, when viewed from above the front plate 202, the third support member 362 may be positioned to be spaced apart from the second support member 361 with the battery 350 interposed therebetween. The third support member 362 may be located between the first support member 311 and the rear plate 211, and may be connected to the first support member 311 by a fastening element such as a bolt. At least a portion of the second plate assembly 342 may be located between the first support member 311 and the third support member 362, and the third support member 362 may cover and protect the second plate assembly 342.

[0098] According to an embodiment, the second support member 361 and / or the third support member 362 may be formed of a metal material and / or a non-metal material (eg, polymer). According to various embodiments, the second support member 361 and / or the third support member 362 may be referred to as a rear case.

[0099] According to an embodiment, the third antenna structure 403 may be located between the second support member 361 and the back plate 211. The third antenna structure 403 may be implemented in the form of a film such as an FPCB. According to an embodiment, the third antenna structure 403 may include a plurality of conductive patterns 381 and 382 used as a loop antenna radiator. For example, the plurality of conductive patterns 381 and 382 may include a planar spiral conductive pattern (e.g., a planar coil or a pattern coil).

[0100] According to an embodiment, the display 201 may include an opening 2011 formed in at least a partial area corresponding to an optical sensor (e.g., the first camera device 205 or a biosensor) located inside the electronic device 200. The opening 2011 may be formed in the form of, for example, a notch. According to some embodiments, the opening 2011 may be implemented in the form of a through hole. The first supporting member 311 may include an opening 3111 corresponding to the opening 2011 in the display 201. The optical sensor may receive external light through the opening 2011 in the display 201, the opening 3111 in the first supporting member 311, and a partial area of ​​the front plate 202 aligned therewith. According to various embodiments (not shown), a substantially transparent area formed by a change in a pixel structure and / or a wiring structure may be implemented to replace the opening 2011 in the display 201.

[0101] According to an embodiment, the rear plate 211 may include an opening 2112 and a second camera device 212 (see Figure 2B ), and includes a flash lamp 213 in the first board assembly 341 (see Figure 2B ) is positioned to be exposed to the rear surface 210B through the opening 2112.

[0102] According to an embodiment, the first conductive pattern 381 of the third antenna structure 403 may extend from the first end 381a to the second end 381b to form a first coil portion (or a first winding portion) including a plurality of turns. According to an embodiment, the second conductive pattern 382 of the third antenna structure 403 may extend from the third end 382a to the fourth end 382b to form a second coil portion (or a second winding portion) including a plurality of turns. The third antenna structure 403 may include a connector 384 electrically connected to the first end 381a and the second end 381b of the first conductive pattern 381 and / or the third end 382a and the fourth end 382b of the second conductive pattern 382. The connector 384 may pass through, for example, an opening 3613 formed in the second support member 361, and may be electrically connected to a connector on the first printed circuit board of the first board assembly 341.

[0103] According to an embodiment, the plurality of conductive patterns 381 and 382 of the third antenna structure 403 may be electrically connected to a wireless communication circuit (eg, Figure 1 wireless communication module 192).

[0104] According to an embodiment, one of the first end 381a and the second end 381b of the first conductive pattern 381 may be electrically connected to the wireless communication circuit, and the other may be electrically connected to the ground. The ground may include, for example, a ground plane included in the first printed circuit board of the first board assembly 341. The wireless communication circuit may provide a radiation current to the first conductive pattern 381, and may send and / or receive a first signal of a selected or predetermined first frequency band through the first conductive pattern 381. For example, for near field communication (NFC), the first signal may have a frequency of, for example, about 13.56 MHz.

[0105] According to an embodiment, one of the third end 382a and the fourth end 382b of the second conductive pattern 382 may be electrically connected to a wireless communication circuit (eg, Figure 1The wireless communication circuit may provide a radiation current to the second conductive pattern 382, ​​and may send and / or receive a second signal of a selected or predetermined second frequency band through the second conductive pattern 382. The second frequency band may be different from the first frequency band using the first conductive pattern 381. For example, for magnetic secure transmission (MST), the second signal may have a frequency of, for example, about 300 kHz or less (e.g., about 70 kHz).

[0106] According to various embodiments, the second conductive pattern 382 may be electrically connected to a power transmission / reception circuit located on the first printed circuit board of the first board assembly 341. The power transmission / reception circuit may wirelessly receive power from an external electronic device through the second conductive pattern 382, ​​or may wirelessly transmit power to an external electronic device. Figure 1 The processor 120 in the embodiment can selectively connect the second conductive pattern 382 to the wireless communication circuit or the power transmission / reception circuit by controlling the switch according to the mode. The power transmission / reception circuit can have a Figure 1 The power management integrated circuit (PMIC) or the charger integrated circuit (IC) in the power management module 188 of the external electronic device may be connected to the power management integrated circuit (PMIC) or the charger integrated circuit (IC) in the power management module 188 of the external electronic device, and the battery 350 may be charged using the power received through the second conductive pattern 382. According to an embodiment, the power transmission / reception circuit may be an electromagnetic induction type power transmission / reception circuit. For example, when the magnetic field flowing through the antenna radiator (e.g., coil) of the external electronic device is applied to the second conductive pattern 382 included in the third antenna structure 403, the induced current may flow through the second conductive pattern 382. The power transmission / reception circuit may provide power to the load of the electronic device 200 using the induced current (e.g., battery charging). According to various embodiments, the power transmission / reception circuit may wirelessly transmit power to the external electronic device using electromagnetic induction between the antenna radiator of the external electronic device and the second conductive pattern 382 of the third antenna structure 403. According to various embodiments, the power transmission / reception circuit may be an electromagnetic resonance type power transmission / reception circuit. For example, the second conductive pattern 382 of the third antenna structure 403 may have a resonant frequency substantially the same as that of the power transmission / reception antenna (e.g., coil) of the external electronic device. Using a resonance phenomenon between the second conductive pattern 382 of the third antenna structure 403 and the power transmission / reception antenna of the external electronic device, the power transmission / reception circuit may wirelessly receive power from the external electronic device or may wirelessly transmit power to the external electronic device.

[0107] According to various embodiments (not shown), the third antenna structure 403 may further include a wire interconnecting a location between the third end 382a and the fourth end 382b of the second conductive pattern 382 with the connector 384. In a mode for transmitting and / or receiving power, the power transmission / reception circuit may utilize an electrical path between the third end 382a and the wire or an electrical path between the fourth end 382b and the wire.

[0108] According to various embodiments (not shown), the third antenna structure 403 may be implemented to include an additional conductive pattern electrically connected to the power transmission / reception circuit.

[0109] According to an embodiment, the conductive layer 430 may be located on the display 201 (or the rear surface of the display 201) between the display 201 and the first support member 311. The conductive layer 430 may be arranged at least partially along the display 201, and may include various conductive materials, such as copper (Cu). The conductive layer 430 may shield the electromagnetic interference (EMI) of the display 201. The conductive layer 430 may absorb or shield electromagnetic waves that may affect, for example, the display 201, and thus may ensure the performance of the display 201. The conductive layer 430 may prevent and / or reduce, for example, an operational error of the display 201 caused by electromagnetic interference, or may reduce the deterioration of the image quality of the display 201. In various embodiments, the conductive layer 430 may include aluminum (Al), stainless steel (SUS), or CLAD (for example, a laminated member in which SUS and Al are alternately arranged). In various embodiments, the conductive layer 430 may dissipate heat emitted from surrounding heat dissipation components (for example, a display drive circuit (for example, DDI)). In various embodiments, the conductive layer 430 may help to enhance the rigidity of the display 201. In various embodiments, the display 201 or the second layer 420 may include a conductive layer 430 .

[0110] According to an embodiment, the conductive layer 430 may include a first opening 431. The first opening 431 in the conductive layer 430 may be formed in the form of a notch. The display 201 is rectangular and may have long sides 301 and 302 that are parallel to each other and short sides 303 and 304 that are parallel to each other and perpendicular to the long sides 301 and 302. The first opening 431 in the conductive layer 430 may be implemented as a notch that extends in a direction (e.g., -x-axis direction) from one long side 302 of the display 201 to the other long side 301 when viewed from above the first surface 210A.

[0111] According to an embodiment, first opening 431 may be formed so that the EMI shielding performance of conductive layer 430 is not reduced below a critical performance. First opening 431 may not substantially affect the desired EMI shielding performance.

[0112] According to an embodiment, a wireless communication circuit (eg Figure 1 The wireless communication module 192 in the display 201 can be electrically connected to the conductive layer 430 located on the display 201, and a signal of a selected or predetermined frequency band can be sent and / or received through at least a portion of the conductive layer 430 surrounding the first opening 431. The wireless communication circuit can be electrically connected to a first connection point FP located near the first opening 431 or at an edge E of the first opening 431. The ground (for example, a ground plane located on the first printed circuit board of the first board assembly 341) can be electrically connected to a second connection point GP located near the first opening 431 or at an edge E of the first opening 431. The first connection point FP is a portion to which a radiation current is applied from the wireless communication circuit, and can be referred to as a feeding point. The second connection point GP is a portion electrically connected to the ground, and can be referred to as a grounding point.

[0113] According to an embodiment, the edge E may refer to, for example, a periphery. For example, the edge E of the first opening 431 may refer to, for example, a periphery of the first opening 431. The periphery may include a corner and a partial area around the corner.

[0114] According to an embodiment, the first flexible conductive member 391 and the second flexible conductive member 392 may be located on the first printed circuit board of the first board assembly 341. The first flexible conductive member 391 may be electrically connected to a wireless communication circuit (e.g., Figure 1 The first support member 311 may include a third opening 3113. The first flexible conductive member 391 may pass through the third opening 3113 and may be in physical contact with the first connection point FP of the conductive layer 430, whereby the first connection point FP may be electrically connected to the wireless communication circuit via the first flexible conductive member 391. The second flexible conductive member 392 may pass through the third opening 3113 and may be in physical contact with the second connection point GP of the conductive layer 430, whereby the second connection point GP may be electrically connected to the ground plane via the second flexible conductive member 392.

[0115] According to various embodiments, the first flexible conductive member 391 and / or the second flexible conductive member 392 may include a C-clip (eg, a C-spring), a spring pin, a spring, a conductive eyelet, a conductive rubber, a conductive ribbon, or a copper connector.

[0116] According to various embodiments, various other electrical paths, such as wiring, may be provided instead of the first flexible conductive member 391 or the second flexible conductive member 392 .

[0117] According to an embodiment, when viewed from above the first surface 210A, the first connection point FP and the second connection point GP may be located near one long side 302 of the display 201. According to various embodiments, when viewed from above the first surface 210A, the first opening 431 in the conductive layer 430 may include opposite narrower portions B in the y-axis direction near one long side 302 of the display 201. The first connection point FP and the second connection point GP may be located at opposite sides of the narrower portion B, respectively.

[0118] According to an embodiment, when a wireless communication circuit (e.g. Figure 1 When the wireless communication module 192 in the conductive layer 430 provides a radiation current to the first connection point FP, the radiation current can flow from the first connection point FP along the edge E of the first opening 431 to the second connection point GP in the conductive layer 430. To this end, the wireless communication circuit can send and / or receive radio waves by radiating energy in the direction (e.g., +z-axis direction) pointed to by the first surface 210A. A pattern of a moving path for the radiation current to flow is formed based on the first opening 431 in the conductive layer 430, and thus the energy can be radiated toward the first surface 210A. A radiation structure for sending and / or receiving radio waves via at least a portion of the conductive layer 430 surrounding the first opening 431 by feeding power to the first opening 431 in the conductive layer 430 can be referred to as a loop antenna radiator. In the following, the radiator based on the first opening 431 in the conductive layer 430 will be referred to as the first antenna structure 401. The first antenna structure 401 can refer to at least a portion of the conductive layer 430 that forms an electromagnetic field based on the first opening 431.

[0119] According to an embodiment, a wireless communication circuit (e.g., Figure 1 The wireless communication module 192 in the conductive layer 430 can send and / or receive a first signal for NFC having a frequency of, for example, approximately 13.56 MHz or a second signal for MST having a frequency of, for example, approximately 300 kHz or lower (e.g., approximately 70 kHz) through the first antenna structure 401 based on the first opening 431 in the conductive layer 430.

[0120] According to an embodiment, the first support member 311 may include a conductive portion 311a. According to various embodiments, the conductive portion 311a and the cross member 218 may be integrally formed and may include the same metal material. According to an embodiment, the conductive portion 311a may include a second opening 3112, which at least partially overlaps the first opening 431 in the conductive layer 430 when viewed from above the first surface 210A. The second opening 3112 reduces the electromagnetic influence of the conductive portion 311a on the first antenna structure 401 based on the first opening 431 in the conductive layer 430, thereby suppressing the degradation of the radiation performance.

[0121] According to an embodiment, the first support member 311 may include a non-conductive portion 311b coupled to the conductive portion 311a. A portion of the non-conductive portion 311b may be at least partially located in the second opening 3112 in the conductive portion 311a. According to various embodiments, the cross member 218 may include a plurality of conductive portions, and a portion of the non-conductive portion 311b may be located between the plurality of conductive portions. The non-conductive portion 311b may be located in various other openings formed in the conductive portion 311a. The non-conductive portion 311b may be formed in a form combined with the conductive portion 311a by, for example, insert injection molding.

[0122] According to various embodiments, the third opening 3113 may be implemented in a form in which the non-conductive portion 311 b is not located in the second opening 3112 , or may be provided in a manner in which a partition wall is interposed between the third opening 3113 and the second opening 3112 .

[0123] According to an embodiment, in a mode for transmitting / receiving a signal of a selected or predetermined frequency band (eg, a mode for NFC or MST), a wireless communication circuit (eg, Figure 1 The wireless communication module 192 in the embodiment can be selectively connected to the first antenna structure 401 or the third antenna structure 403.

[0124] According to an embodiment, when the electronic device 200 is arranged so that its first surface 210A is oriented in the direction of gravity, the wireless communication circuit (eg Figure 1 The wireless communication module 192 in the NFC or MST mode may be electrically connected to the first antenna structure 401. This may be an operation flow in which a user experience of bringing the electronic device 200 close to an external electronic device below the electronic device 200 in the NFC or MST mode is taken into consideration. Figure 2A and Figure 3 , when the wireless communication circuit is electrically connected to the first antenna structure 401, the first communication identification range 2001 may be located on the first surface 210A. The first communication identification range 2001 is a portion close to an external electronic device for smooth communication between the electronic device 200 and the external electronic device, and may correspond to a portion on the first surface 210A that overlaps with the first antenna structure 401. When the first communication identification range 2001 of the first surface 210A faces the communication identification range of the external electronic device and is close to a threshold distance (e.g., 100 mm, as a maximum identification distance), the electronic device 200 may exchange data with the external electronic device through the first antenna structure 401.

[0125] According to an embodiment, when the electronic device 200 is arranged so that its second surface 210B (see Figure 2B ) is oriented in the direction of gravity, the wireless communication circuit (e.g., Figure 1The wireless communication module 192 in the NFC module 192 may be electrically connected to the third antenna structure 403. This may be an operation flow in which a user experience of bringing the electronic device 200 close to an external electronic device below the electronic device 200 in the NFC or MST mode is taken into consideration. Figure 2B and Figure 3 , when the wireless communication circuit is electrically connected to the third antenna structure 403, the second communication identification range 2002 may be located on the second surface 210B. The second communication identification range 2002 is a portion close to the external electronic device for smooth communication between the electronic device 200 and the external electronic device, and may correspond to a portion on the second surface 210B that overlaps with the third antenna structure 403. When the second communication identification range 2002 of the second surface 210B faces the communication identification range of the external electronic device and is close to the threshold distance (e.g., 100 mm, as the maximum identification distance), the electronic device 200 may exchange data with the external electronic device through the third antenna structure 403.

[0126] In the embodiments, reference Figure 2A , Figure 2B and Figure 3 , when viewed from above the first surface 210A or the second surface 210B, the first communication identification range 2001 on the first surface 210A of the first antenna structure 401 may at least partially overlap with the second communication identification range 2002 on the second surface 210B of the third antenna structure 403. This can provide the same user experience in terms of interaction between the electronic device 200 and an external device when the electronic device 200 is carried in a state where the first surface 210A is oriented in the direction of gravity, and when the electronic device is carried in a state where the second surface 210B is oriented in the direction of gravity.

[0127] Figure 4 is taken along line A-A' according to various embodiments Figure 2A A cross-sectional view of an electronic device 200 is shown.

[0128] Reference Figure 4 In an embodiment, the electronic device 200 may include a front plate 202, a rear plate 211, a cross member 218, a first support member 311, a second support member 361, a display 201, a conductive layer 430, a first plate assembly 341, or a third antenna structure 403. According to various embodiments, Figure 4 At least one component of the electronic device 200 shown may be connected to Figure 3 At least one component of the present invention is the same or similar, and a redundant description will be omitted.

[0129] According to an embodiment, the periphery (not shown) of the front panel 202 may be connected to the cross member 218 by various adhesive members 202c such as double-sided tape. The periphery (not shown) of the rear panel 211 may be connected to the cross member 218 by various adhesive members 211c such as double-sided tape. The first support member 311, the second support member 361, the display 201, the first panel assembly 341, and the third antenna structure 403 may be located in a housing (e.g., Figure 2A In the internal space of the shell 210).

[0130] According to an embodiment, the display 201 may be located between the first supporting member 311 and the front plate 202, and may be coupled to the front plate 202. An optically transparent adhesive member 408, such as an optically clear adhesive (OCA), may be located between the front plate 202 and the display 201. According to an embodiment, the front plate 202 and the display 201 may be coupled without an air gap by the optically transparent adhesive member 408. The optically transparent adhesive member 408 may improve image quality. For example, when there is an air gap between the front plate 202 and the display 201, due to the difference in refractive index between different media (e.g., the front plate 202, the air gap, and the display 201), some light output from the display may be reflected and lost instead of directly reaching the front plate 202. The light loss caused by the air gap blurs the image output through the effective area capable of presenting the image on the screen (e.g., a device including the display 201 and the front plate 202), resulting in reduced quality. According to an embodiment, when the air gap between the front plate 202 and the display 201 is filled with the optically transparent adhesive member 408, the refractive index difference between the optically transparent adhesive member 408 and the medium layer in contact therewith can be minimized. When the refractive index difference between the optically transparent adhesive member 408 and the medium layer in contact therewith is minimized, the reflectivity of the interface between the optically transparent adhesive member 408 and the medium layer in contact therewith can be reduced. When the reflectivity of the interface between the optically transparent adhesive member 408 and the medium layer in contact therewith is reduced, the reflection at the interface and the light loss caused thereby can be reduced. Therefore, a clear image can be displayed on the screen.

[0131] According to an embodiment, the display 201 may include a first layer 410 and a second layer 420 bonded to the first layer 410. Various polymer bonding members (not shown) may be located between the first layer 410 and the second layer 420. An optically transparent bonding member 408 may be located between the front plate 202 and the first layer 410. The first layer 410 may be located between the optically transparent bonding member 408 and the second layer 420.

[0132] According to an embodiment, the first layer 410 may include a display panel 411. The display panel 411 may include, for example, a plurality of pixels implemented as light-emitting elements, such as organic light-emitting diodes (OLEDs) or micro LEDs. The region where the plurality of pixels are located may form a screen, which is an effective region capable of presenting an image. The display panel 411 may include at least one thin film transistor (TFT) for controlling the plurality of pixels. At least one TFT may control the current supplied to the light-emitting element to turn on or off the pixel or adjust the brightness of the pixel. At least one TFT may be implemented as, for example, an amorphous silicon (a-Si) TFT or a low temperature polycrystalline silicon (LTPS) TFT. The display panel 411 may include a storage capacitor, and the storage capacitor may maintain a voltage signal to the pixel, may maintain a voltage applied to the pixel within a frame, or may reduce a change in the gate voltage of the TFT caused by leakage during the light-emitting time. By a routine for controlling at least one TFT (e.g., initialization or data writing), the storage capacitor may maintain a voltage applied to the pixel at regular time intervals.

[0133] According to an embodiment, the display 201 may be a flexible display. The display panel 411 may include a light-emitting layer, a thin film transistor (TFT) film, and a base film. The light-emitting layer may include, for example, a plurality of pixels implemented by a light-emitting element such as an OLED or a micro-LED. The light-emitting layer may be disposed on the TFT film by evaporation of an organic material. The TFT film (or TFT substrate) may be located between the light-emitting layer and the base film. The TFT film may refer to a structure in which at least one TFT is disposed on a flexible substrate (e.g., a polyimide (PI) film) by a series of processes (e.g., deposition, patterning, and etching). The base film may be located between the TFT film and the second layer 420. The base film may include a flexible film formed of a material such as polyimide (PI) or polyester (PET). The base film may support and protect the display panel 411. According to some embodiments, the base film may be referred to as a protective film, a back film, or a back plate. The front plate 202 may be implemented in the form of a flexible thin film (e.g., a thin film layer). The front plate 202 may include, for example, a plastic film (e.g., a polyimide film) or a thin film glass (e.g., an ultra-thin glass (UTG)). The front plate 202 may have a form in which various coatings are provided on a plastic film or a thin film glass. For example, the front plate 202 may have a form in which at least one protective layer or coating including a polymer material (e.g., polyester (PET), polyimide (PI), or thermoplastic polyurethane (TPU)) is provided on the plastic film or the thin film glass.

[0134] According to another embodiment, the display 201 may be a rigid display. The display panel 411 may include a light emitting layer and a TFT substrate. The light emitting layer may include, for example, a plurality of pixels implemented by a light emitting element such as an OLED or a micro-LED. The light emitting layer may be disposed on the TFT substrate by evaporation of an organic material. The TFT substrate may be located between the light emitting layer and the second layer 420. The TFT substrate may refer to a structure in which at least one TFT is disposed on a rigid substrate (e.g., a glass substrate or a glass plate) by a series of processes (e.g., deposition, patterning, and etching).

[0135] According to an embodiment, the first layer 410 may include an optical layer 412 between the display panel 411 and the optically transparent adhesive member 408. An optically transparent adhesive member (not shown) such as an OCA may be located between the display panel 411 and the optical layer 412. The optical layer 412 may improve the image quality of the screen.

[0136] According to an embodiment, the optical layer 412 may include, for example, a polarizing layer (or polarizer) or a phase retarder (or phase retarder). The polarizing layer may be located, for example, between the phase retarder and the front plate 202. The optical layer 412 may selectively allow light generated from the light source of the display panel 411 to pass through and vibrate in a predetermined direction. When non-polarized light such as sunlight passes through the front plate 202 and the optically transparent adhesive member 408 and enters the display 201, the non-polarized light may pass through the polarizing layer and may be converted into linearly polarized light, and the linearly polarized light may pass through the phase retarder and may be converted into circularly polarized light. For example, when non-polarized light passes through a 90-degree polarizing layer, the non-polarized light may be converted into 90-degree linearly polarized light, and when the 90-degree linearly polarized light passes through a 45-degree phase retarder, the 90-degree linearly polarized light may be converted into circularly polarized light. The phase retarder may have a quarter-wavelength retarder (λ / 4 retarder) characteristic. For example, when sunlight passes through the front plate 202 and the optically transparent adhesive member 408 and enters the display 201, most of the sunlight is reflected from the metal (such as an electrode) included in the display panel 411, which makes it difficult for the user to recognize the screen. According to an embodiment, the polarization layer and the phase retardation layer can improve outdoor visibility by preventing and / or reducing the light entering from the outside from being reflected. For example, the circularly polarized light converted by the phase retardation layer having the characteristics of a quarter-wave retarder (λ / 4 retarder) is reflected from the display panel 411, and the reflected circularly polarized light is converted to 180 degrees of linear polarization perpendicular to the initial 90 degrees of polarization by undergoing a total λ / 2 phase delay while passing through the phase retardation layer again. 180 degrees of linear polarization light cannot be emitted to the outside through the 90 degree polarization layer. According to some embodiments, a single layer obtained by combining a polarization layer and a phase retardation layer may be provided, and such a layer may be defined as a "circular polarization layer". According to various embodiments, the polarization layer (or circular polarization layer) may be omitted, and in this case, a black pixel defining layer (PDL) and / or a color filter may be provided instead of the polarization layer.

[0137] According to an embodiment, the second layer 420 (e.g., the lower panel) may include a plurality of layers 420-1, ..., 420-n (n≥2) for various functions. Various polymer bonding members (not shown) may be located between the plurality of layers 420-1, ..., 420-n. Some of the plurality of layers 420-1, ..., 420-n included in the second layer 420 may include a buffer layer that can protect the display 201 from external impact or mitigate external impact when supporting the first layer 410. The buffer layer may include a flexible layer, such as a sponge layer, a cushioning layer, or a buffer layer. Some of the plurality of layers 420-1, ..., 420-n included in the second layer 420 may include a shading layer capable of shielding external light or light generated from the first layer 410. The shading layer may be, for example, a stamped layer including a black layer having, for example, an uneven pattern. Some of the multiple layers 420-1, ..., 420-n included in the second layer 420 may include a heat dissipation layer capable of diffusing, dispersing or dissipating heat generated from the display 201 or the electronic device 200. The heat dissipation layer may include, for example, a composite sheet. The heat dissipation layer may include, for example, graphite. In various embodiments, the heat dissipation layer may include a composite sheet. The composite sheet may be a sheet obtained by combining and processing layers or sheets having different properties. The composite sheet may include, for example, at least one of polyimide and graphite. The composite sheet may also be replaced by a single sheet including a material (e.g., polyimide or graphite). The shading layer may be located, for example, between the first layer 410 and the buffer layer. The buffer layer may be located, for example, between the shading layer and the heat dissipation layer. The heat dissipation layer (e.g., a composite sheet) may be located, for example, between the buffer layer and the conductive layer 430. The second layer 420 may include various layers that perform various other functions.

[0138] According to various embodiments (not shown), the display 201 may include a touch-sensitive circuit (e.g., a touch sensor). The touch-sensitive circuit may be implemented as a transparent conductive layer (or film) based on various conductive materials such as indium tin oxide (ITO). According to an embodiment, the touch-sensitive circuit may be located between the front plate 202 and the optical layer 412 (e.g., an attached type). According to another embodiment, the touch-sensitive circuit may be located between the optical layer 412 and the display panel 411 (e.g., an on-cell type). According to another embodiment, the display panel 411 may include a touch-sensitive circuit or a touch-sensitive function (e.g., an in-cell type).

[0139] According to various embodiments (not shown), the display panel 411 can be implemented based on an OLED and can include an encapsulation layer located between the light-emitting layer and the optical layer 412. The organic materials and electrodes that emit light in the OLED react very easily with oxygen and / or moisture and may lose their light-emitting properties. According to an embodiment, the encapsulation layer can seal the light-emitting layer so that oxygen and / or moisture do not penetrate into the OLED. The encapsulation layer can be used as a pixel protection layer for protecting multiple pixels of the light-emitting layer.

[0140] According to various embodiments, the display 201 may be implemented as a flexible display based on a substrate (e.g., a plastic substrate) formed of a flexible material such as polyimide (PI). The display panel 411 may be implemented based on an OLED, and the encapsulation layer may be implemented as, for example, a thin film encapsulation (TFE). According to various embodiments, the display 201 may include a conductive pattern such as a metal mesh (e.g., an aluminum metal mesh) between the encapsulation layer and the optical layer 412 as a touch-sensitive circuit located on the encapsulation layer. For example, in response to bending of the display 201, the metal mesh may have greater durability than a transparent conductive layer made of ITO.

[0141] According to various embodiments (not shown), the display 201 may further include a pressure sensor capable of measuring touch intensity (pressure).

[0142] According to various embodiments, the plurality of layers included in the first layer 410 and / or the second layer 420 and their stacking structures or stacking orders may vary. According to various embodiments, the display 201 may also include various components according to the type it is provided. Although it is impossible to list all of these components because the components are modified very differently according to the convergence tendency of the display 201, the display 201 may also include components equivalent to the above-mentioned components. According to various embodiments, in the display 201, specific components may be omitted from the above-mentioned components, or specific components may be replaced by other components according to the type of the display 201 provided.

[0143] According to an embodiment, the conductive layer 430 may be located on the display 201 and between the display 201 and the first support member 311. Various polymer adhesive members (not shown) may be located between the second layer 420 of the display 201 and the conductive layer 430.

[0144] According to an embodiment, the conductive layer 430 may include a first opening 431. The conductive layer 430 may include a third surface 430a bonded to the second layer 420 and a fourth surface 430b opposite to and substantially parallel to the third surface 430a. The first opening 431 may include a first edge E1 formed on the third surface 430a, a second edge E2 formed on the fourth surface 430b, and an inner side surface (or inner lateral surface) (not shown) connecting the first edge E1 and the second edge E2. According to an embodiment, the conductive layer 430 may be formed as a thin film having a thickness of, for example, about 0.03 mm or less (e.g., about 0.012 mm), and the edge E of the first opening 431 may be defined as the first edge E1 or the second edge E2.

[0145] Figure 5 is a circuit diagram illustrating an exemplary antenna device 500 according to various embodiments.

[0146] In the embodiments, reference Figure 4 and Figure 5 , the antenna device (or antenna system) 500 may include a first antenna structure 401, a wireless communication circuit 510, a line G, a first electrical path 520 or a second electrical path 530, wherein the first antenna structure 401 includes a first conductive layer 430 located on the display 201 and having a first opening 431. The wireless communication circuit 510 (e.g., Figure 1 The wireless communication module 192 in the embodiment of the present invention can be electrically connected to a first connection point (e.g., a power feeding point) FP located near the first opening 431 via a first electrical path 520. The ground G can be electrically connected to a second connection point (e.g., a grounding point) GP located near the first opening 431 via a second electrical path 530. The ground G may include a Figure 4 The first electrical path 520 may include, for example, a ground plane on the first printed circuit board 440 of the first board assembly 341. Figure 3 The second electrical path 530 may include, for example, Figure 3 The second flexible conductive member 392. Figure 5 When the wireless communication circuit 510 in the conductive layer 430 provides a radiation current to the first connection point FP, the radiation current can flow from the first connection point FP to the second connection point GP in the conductive layer 430 along the edge E of the first opening 431. To this end, the wireless communication circuit 510 can send and / or receive radio waves by radiating energy in a direction oriented by the first surface 210A (e.g., the +z-axis direction) via the first antenna structure 401. The wireless communication circuit 510 can send and / or receive a signal of a selected or predetermined frequency band through the first antenna structure 401. For example, the signal can be a first signal for NFC having a frequency of, for example, about 13.56 MHz, or a second signal for MST having a frequency of, for example, about 300 kHz or less (e.g., about 70 kHz).

[0147] According to an embodiment, the first opening 431 may be arranged to form a resonance of a selected or predetermined frequency. When a radiation current is provided to the first connection point FP, the radiation current may flow from the first connection point FP to the second connection point GP along the edge E of the first opening 431. The length D of the edge E extending from the first connection point FP to the second connection point GP may have a value capable of forming a resonance of a selected or predetermined frequency. According to an embodiment, the periphery of at least a portion of the conductive layer 430 used as an antenna around the first opening 431 may have a length capable of forming a resonance of a selected or predetermined frequency. For example, when the selected or predetermined frequency is, for example, about 13.56 MHz for NFC, the length D may be determined to form, for example, an inductance of about 0.2 to 2 microhenries (μH), and the inductance and impedance values ​​required for the corresponding IC may be different. According to various embodiments, the length D of the edge E may be, for example, 100 mm to 200 mm.

[0148] According to various embodiments, when the selected or predetermined frequency is, for example, about 300 kHz or less (eg, about 70 kHz) for MST, the length D of the edge E may be determined to form an inductance of, for example, about 8 to 12 microhenries (μH).

[0149] According to various embodiments (not shown), considering the length D, the first opening 431 is not limited to Figure 3 or Figure 5 The illustrated embodiment has a rectangular shape, and may be formed into various other shapes (eg, a circular shape, a polygonal shape, or a groove shape).

[0150] Reference Figure 4 and Figure 5 In an embodiment, when energy is radiated in a direction toward first surface 210A through first antenna structure 401, first layer 410 and second layer 420 of display 201 may not substantially affect radiation performance of first antenna structure 401. For example, at least one medium included in first layer 410 or second layer 420 of display 201 may have a dielectric constant or conductivity that does not reduce radiation performance of first antenna structure 401 below a threshold.

[0151] According to an embodiment, the first support member 311 may be located between the display 201 and the first board assembly 341. The first support member 311 may include a conductive portion 311a. The conductive portion 311a may include a second opening 3112, which at least partially overlaps the first opening 431 in the conductive layer 430 when viewed from above the first surface 210A.

[0152] Reference Figure 4 and Figure 5In an embodiment, when viewed from above the first surface 210A, the second opening 3112 in the first support member 311 may overlap the entire first opening 431 in the conductive layer 430. According to various embodiments (not shown), when viewed from above the first surface 210A, the second opening 3112 may be formed at least partially along the edge E in the first opening 431. The second opening 3112 may suppress the degradation of the radiation performance of the first antenna structure 401 by being arranged so that at least a portion of the conductive portion 311a of the first support member 311 does not overlap the first opening 431 when viewed from above the first surface 210A. When the radiation current is provided to the first antenna structure 401, the electromagnetic force generated from the first antenna structure 401 may pass through the first opening 431 and the second opening 3112 aligned therewith. The second opening 3112 prevents and / or reduces the magnetic flux reduced by the conductive portion 311a, thereby ensuring the radiation performance of the first antenna structure 401. When the magnetic flux is not reduced, the electromagnetic wave energy increases due to the increase in the inductance value, thereby improving the radiation performance. According to various embodiments, the second opening 3112 may be implemented in various shapes so that when viewed from above the first surface 210A, the conductive portion 311a of the first support member 311 does not overlap the first opening 431. For example, the second opening 3112 may be formed in the form of a through hole or a notch.

[0153] According to various embodiments, the second opening 3112 may be formed in a circular shape, a polygonal shape, or a groove shape.

[0154] According to some embodiments, when the radiation performance of the first antenna structure 401 is ensured to be equal to or higher than the threshold level even without forming the second opening 3112, the second opening 3112 may be omitted. In this case, the conductive portion 311a may be expanded to the position of the second opening 3112, so that the rigidity of the first support member 311 may be ensured.

[0155] According to various embodiments, the first support member 311 may include a non-conductive portion 311b at least partially located in the second opening 3112. The non-conductive portion 311b located in the second opening 3112 may be combined with the conductive portion 311a to ensure the rigidity of the first support member 311. According to some embodiments, when the rigidity of the first support member 311 is ensured to be equal to or higher than a threshold level even when the non-conductive portion 311b is not located in the second opening 3112, the non-conductive portion 311b located in the second opening 3112 may be omitted.

[0156] According to an embodiment, the first board assembly 341 may include a first printed circuit board 440 or a first shielding member 441. The first printed circuit board 440 may include one surface 440a facing the front plate 202 and another surface 440b opposite to the one surface 440a and facing the rear plate 211. The first shielding member 441 may be located on one surface 440a of the first printed circuit board 440. When viewed from above the first surface 210A, the first shielding member 441 at least partially overlaps with the first opening 431 in the conductive layer 430 or the second opening 3112 in the first supporting member 311. The first shielding member 441 may cover a plurality of elements 444 located on one surface 440a of the first printed circuit board 440. The first shielding member 441 may reduce the amount of light from the first surface 440a. Figure 5 The electromagnetic field formed by the first antenna structure 401 has an electromagnetic effect on the plurality of components 444 located on the first printed circuit board 440. The first shielding member 441 may include a conductive member such as a shielding case.

[0157] According to an embodiment, the second support member 361 may be located between the first support member 311 and the rear plate 211, and may be connected to the first support member 311 by a fastening element such as a bolt. At least a portion of the first plate assembly 341 may be located between the first support member 311 and the second support member 361, and the second support member 361 may cover and protect the first plate assembly 341.

[0158] According to an embodiment, the third antenna structure 403 may be located between the second support member 361 and the rear plate 211. The third antenna structure 403 may be implemented in the form of a film such as an FPCB. At least one coil (e.g., Figure 3 The first conductive pattern 381 or the second conductive pattern 382 in the embodiment may be electrically connected to a wireless communication circuit (eg, Figure 1 The wireless communication module 192 in the second surface 210B is capable of sending and / or receiving radio waves by radiating energy through the third antenna structure 403 in a direction (eg, −z-axis direction) oriented by the second surface 210B.

[0159] According to an embodiment, third antenna structure 403 may at least partially overlap first opening 431 in conductive layer 430 when viewed from above second surface 210B.

[0160] According to an embodiment, the first board assembly 341 may include a second shielding member 442. The second shielding member 442 may be located on the other surface 440b of the first printed circuit board 440. When viewed from above the second surface 210B, the second shielding member 442 may at least partially overlap the third antenna structure 403. The second shielding member 442 may cover the plurality of elements 445 located on the other surface 440b of the first printed circuit board 440. The first shielding member 441 may reduce the effect of the electromagnetic field formed by the third antenna structure 403 on the plurality of elements 445 located on the first printed circuit board 440. The second shielding member 442 may include a conductive member, such as a shielding cover.

[0161] Reference Figure 4 and Figure 5 In various embodiments, when a radiation current is provided to the first connection point FP of the first antenna structure 401, some of the energy radiated from the first antenna structure 401 may be induced to the conductive portion 311a of the first support member 311 adjacent to the first antenna structure 401. For example, such induction may be caused by an electromagnetic influence (e.g., electromagnetic coupling) between the first antenna structure 401 and the conductive portion 311a. To this end, the radiation current may flow along the periphery (or edge) of the second opening 3112 in the conductive portion 311a, thereby radiating energy in a direction (e.g., -z axis direction) oriented by the second surface 210B. For example, the radio waves radiated from the first antenna structure 401 may meet the second antenna structure 402, thereby exciting a surface current and causing it to flow. The flow of the surface current may form energy in a direction oriented by the second surface 210B. The conductive portion 311a of the first support member 311 may be located near the first antenna structure 401, and a portion of the conductive portion 311a including the second opening 3112 may be electromagnetically coupled to the first antenna structure 401, thereby acting as an additional antenna radiator (e.g., a loop antenna radiator). A radiating structure for transmitting and / or receiving radio waves via at least a portion of the conductive portion 311a surrounding the second opening 3112 by feeding power to the second opening 3112 in the conductive portion 311a may be referred to as a loop antenna radiator. Hereinafter, a radiator based on the second opening 3112 in the conductive portion 311a will be referred to as a second antenna structure 402. The second antenna structure 402 may indicate a portion of the conductive portion 311a that forms an electromagnetic field based on the second opening 3112.

[0162] According to various embodiments, when a radiation current is provided to the first connection point FP of the first antenna structure 401, a large amount of radiation current may be substantially induced from the first connection point FP (e.g., a power feeding portion) (which is a point where the radiation current is the largest) to the second antenna structure 402. According to various embodiments (not shown), when viewed from above the second surface 210B, a portion of the second antenna structure 402 may be positioned to overlap with the first connection point FP of the first antenna structure 401. According to various embodiments (not shown), in order to induce the radiation current, when viewed from above the second surface 210B, the second antenna structure 402 may be positioned to overlap with various other portions of the first antenna structure 401. According to various embodiments, in order to induce the radiation current, at least a portion of the first antenna structure 401 and at least a portion of the second antenna structure 402 may be located at a distance at which the portions can be electromagnetically coupled.

[0163] According to various embodiments, a structure in which a radiation current flows directly from the first antenna structure 401 to the second antenna structure 402 may be implemented. For example, a conductive material (e.g., a conductive adhesive) 409 may be located at least in a portion between the conductive layer 430 and the conductive portion 311a of the first support member 311. The conductive material 409 may electrically connect the conductive layer 430 and the conductive portion 311a, and the radiation current may flow from the first antenna structure 401 to the second antenna structure 402. When utilizing the second antenna structure 402 capable of radiating energy to the second surface 210B, at least one element between the second antenna structure 402 and the second surface 210B that electromagnetically affects the radiation performance of the second antenna structure 402 may be omitted or may be implemented at a changed position. For example, the first board assembly 341 may not extend between the second antenna structure 402 and the second surface 210B. For example, the second support member 361 may not extend between the second antenna structure 402 and the second surface 210B, may be omitted, or may be formed of a non-conductive material (e.g., a polymer).

[0164] According to various embodiments, when utilizing the second antenna structure 402 capable of radiating energy toward the second surface 210B, the first antenna structure 401 and the second antenna structure 402 may be coupled to each other in the same manner as described above. Figure 3 or Figure 4 The second antenna structure 402 is implemented at a different position from the position in the embodiment, so that the second antenna structure 402 is not electromagnetically affected. For example, when viewed from above the first surface 210A, the first antenna structure 401 and the second antenna structure 402 can be positioned to at least partially overlap. Figure 3 The batteries 350 overlap.

[0165] According to various embodiments, when using second antenna structure 402 capable of radiating energy to second surface 210B, third antenna structure 403 may be omitted. According to some embodiments, third antenna structure 403 may be positioned so that third antenna structure 403 does not overlap second antenna structure 402 when viewed from above second surface 210B.

[0166] Reference Figure 5 In various embodiments, the second antenna structure 402 may be expanded as shown by reference numeral 501 to have an additional loop 5011 through which the radiation current flows.

[0167] According to various embodiments, the second antenna structure 402 may move the resonant frequency of the first antenna structure 401 to a predetermined frequency, or may move the resonant frequency of the first antenna structure 401 by a predetermined amount. The second antenna structure 402 may operate as a frequency adjustment circuit (or matching circuit) to match impedance, move the resonant frequency to a predetermined frequency, or move the resonant frequency by a predetermined amount. For example, when a radiation current is provided to the first connection point FP of the first antenna structure 401, the first antenna structure 401 may be electromagnetically coupled with the second antenna structure 402 in at least a portion of its region, and a change in frequency characteristics due to the electromagnetic coupling with the second antenna structure 402 may substantially occur at the first connection point FP (e.g., a power feeding portion), which is a point where the radiation current is the largest.

[0168] According to various embodiments, when the second antenna structure 402 is not implemented, the first antenna structure 401 and the conductive portion 311a of the first support member 311 may be implemented to be electromagnetically isolated. For example, the first antenna structure 401 and the conductive portion 311a of the first support member 311 may be positioned to have a predetermined degree of electromagnetic isolation.

[0169] According to various embodiments, the conductive layer 430 and the first antenna structure 401 implemented by the conductive layer 430 may be omitted, and the wireless communication circuit 510 may be electrically connected to the conductive portion 311a of the first support member 311 and the second antenna structure 402 implemented by the conductive portion 311a. The wireless communication circuit 510 may transmit and / or receive radio waves by radiating energy to the front surface 210A or the rear surface 210B via the second antenna structure 402.

[0170] According to various embodiments, the wireless communication circuit 510 may be electrically connected to the conductive portion 311a of the first support member 311 and the second antenna structure 402 implemented by the conductive portion 311a. The conductive layer 430 located on the display 201 is not electrically connected to the wireless communication circuit 510, and the first opening 431 in the conductive layer 430 may be used to suppress the reduction of the radiation performance of the second antenna structure 402. When the radiation current is provided to the second antenna structure 402, some radiation current may be induced to the conductive layer 430 adjacent to the second antenna structure 402. Thus, the radiation current may flow along the edge E of the first opening 431 in the conductive layer 430, and the first antenna structure 401 may be implemented as an additional antenna radiator that radiates energy to the first surface 210A.

[0171] According to various embodiments, the display panel 411 included in the first layer 410 of the display 201 may include a semiconductor element (e.g., an active layer of a TFT) used as a switch for controlling a pixel. When external light such as sunlight enters the display 201, a photoelectric effect occurs, in which the semiconductor element absorbs light to generate photons, which may cause leakage current from the semiconductor element. The leakage current may cause a voltage drop in the pixel, thereby reducing the brightness of the display 201. Sunlight or external light may be reflected from at least one medium included in the display 201 and may enter the semiconductor element, and the reflected light may also cause leakage current in the semiconductor element, thereby reducing the brightness of the display 201. The display 201 may include a first display area A1 in which the conductive layer 430 is located and a second display area A2 in which the conductive layer 430 is not located. Due to the first opening 431, the first display area A1 and the second display area A2 have different dielectric layer structures, so the brightness reduction caused by external light such as sunlight may be different between the first display area A1 and the second display area A2. For example, in the second display area A2, external light such as sunlight may be reflected from the air gap and / or the non-conductive portion 311b (which is the lower medium below the second layer 420) and may be absorbed by the semiconductor element. As a result, under the same conditions, the brightness in the second display area A2 may be lower than the brightness in the first display area A1. Due to the brightness difference between the first display area A1 and the second display area A2, it is difficult to have a substantially uniform brightness across the entire screen, which may result in a reduction in image quality. According to an embodiment, a medium of various materials may be located in the first opening 431. Therefore, due to the film effect of the reflected light, the brightness change in the first display area A1 and the brightness change in the second display area A2 may be substantially constant, and the image quality may be improved. The reflectivity of the interface between the two media may depend on the refractive index of the two media, and taking this into account, the medium located in the first opening 431 may be determined. According to various embodiments, an anti-reflection layer capable of suppressing light reflection may be located in the first opening 431.

[0172] Figure 6 is a block diagram illustrating an exemplary electronic device 600 in accordance with various embodiments.

[0173] Reference Figure 6 In an embodiment, the electronic device 600 may include a first loop antenna radiator 611, a second loop antenna radiator 612, a wireless communication circuit 620, a processor (eg, including a processing circuit) 630, a memory 640, a sensor 650, and / or a switch 660. The electronic device 600 may be, for example, Figure 1 Electronic equipment 101 or Figure 2A or Figure 3 An electronic device 200.

[0174] According to an embodiment, the first loop antenna radiator 611 may include Figure 5 The first antenna structure 401. The first loop antenna radiator 611 may include Figure 5 The first antenna structure 401 and the second antenna structure 402. The second loop antenna radiator 612 may include Figure 3 The first loop antenna radiator 611 may include, for example, one end (eg, Figure 5 The first connection point FP in the embodiment of the present invention extends to the other end (for example, Figure 5 The second loop antenna radiator 612 may include, for example, a loop from one end (eg, Figure 3 The first end 381a or the third end 382a in the embodiment of the present invention extends to the other end (eg, Figure 3 The ground G may include, for example, a loop located at the second end 381b or the fourth end 382b of the circuit. Figure 3 or Figure 4 The ground plane on the first board component 341.

[0175] According to an embodiment, the wireless communication circuit 620 (e.g., Figure 1 The wireless communication module 192 in the embodiment may be implemented to send and / or receive a selected or predetermined frequency band through the first loop antenna radiator 611 or the second loop antenna radiator 612. According to an embodiment, the signal may be a first signal having a frequency of, for example, about 13.56 MHz for NFC, or a second signal having a frequency of, for example, about 300 kHz or less (e.g., about 70 kHz) for MST. The structure including the first loop antenna radiator 611, the second loop antenna radiator 612, the wireless communication circuit 620, the ground G, and the electrical paths therebetween may be referred to as an antenna device (or antenna system).

[0176] According to an embodiment, the switch (or switch circuit) 660 may include a first terminal 661, a second terminal 662, and / or a third terminal 663. The first terminal 661 may be electrically connected to the wireless communication circuit 620. The second terminal 662 may be electrically connected to the first loop antenna radiator 611. The third terminal 663 may be electrically connected to the second loop antenna radiator 612. Under the control of the processor 630, the switch 660 may electrically connect the first terminal 661 to the second terminal 662 or the third terminal 663.

[0177] According to various embodiments, the switch 660 may be included in the wireless communication circuit 620 or the processor 630 .

[0178] According to an embodiment, the electronic device 600 may be implemented such that the first loop type antenna radiator 611 or the second loop type antenna radiator 612 is selectively electrically connected to the wireless communication circuit 620 based on the movement or orientation of the electronic device 600 .

[0179] According to an embodiment, the memory 640 (eg Figure 1 The memory 130 in the processor 630 (eg Figure 1 120) in the processor (e.g. Figure 1 The program 140 in the embodiment may be used to control the antenna device including the first loop antenna radiator 611 and the second loop antenna radiator 612. According to an embodiment, the memory 640 may store a direction detection instruction 641 and / or a switch control instruction 642.

[0180] According to an embodiment, the direction detection instructions 641 may include a routine that allows the processor 630 to use the sensor 650 to identify the first surface (eg, Figure 2A The first surface 210A) or the second surface (eg Figure 2A According to various embodiments, the sensor 650 may include Figure 1 At least a portion of the sensor module 176. According to an embodiment, according to the direction detection instruction 641, the processor 630 may be configured to identify a first situation in which the electronic device 600 is positioned so that the first surface is oriented in the direction of gravity or to identify a second situation in which the electronic device 600 is positioned so that the second surface is oriented in the direction of gravity.

[0181] According to an embodiment, the switch control instructions 642 may include a routine that allows the processor 630 to control the switch 660 based on the orientation of the electronic device 600 .

[0182] Figure 7 is a diagram showing various embodiments Figure 6 A flowchart of exemplary operations of an electronic device. Fig. 8AYes Description Figure 7 The operation flow diagram is as follows: Figure 8B Yes Description Figure 7 A diagram of an exemplary operational flow of FIG.

[0183] According to the embodiment, reference Figure 7 , Fig. 8A and Figure 8B In operation 701, the processor 630 may identify the first surface 610A (eg Figure 2A In the first case where the first surface 210A in FIG. 1 is oriented in the direction of gravity, or a second surface 610B (eg, Figure 2B The second situation in which the second surface 210B) is facing the direction of gravity.

[0184] According to the embodiment, reference Figure 6 , Figure 7 and Fig. 8A When the first surface 610A is identified as facing the first situation of gravity, in operation 703, the processor 630 may electrically connect the wireless communication circuit 620 and the first loop antenna radiator 611 (eg, Figure 3 When the electronic device 600 (e.g. Figure 2A The electronic device 200 in the embodiment of the present invention is arranged so that when the first surface 610A is oriented in the direction of gravity, the first terminal 661 and the second terminal 662 of the switch 660 can be electrically connected, and the wireless communication circuit 620 can be electrically connected to the first loop antenna radiator 611. This can be an operation flow in which the user experience of bringing the electronic device 600 close to the external electronic device 800 below the electronic device 600 in the NFC or MST mode is taken into consideration. When the wireless communication circuit 620 is electrically connected to the first loop antenna radiator 611, the first communication identification range 6001 (e.g. Figure 2A The first communication identification range 2001 in the first surface 610A can be located on the first surface 610A. When the first communication identification range 6001 of the first surface 610A faces the communication identification range 8001 of the external electronic device 800 and is close to the threshold distance (for example, 100mm, as the maximum identification distance), the electronic device 600 can exchange data with the external electronic device 800 through the first loop antenna radiator 611.

[0185] According to the embodiment, reference Figure 6 , Figure 7 and Figure 8B In operation 705, when the second situation that the second surface 610B faces the direction of gravity is identified, the processor 630 may electrically connect the wireless communication circuit 620 and the second loop antenna radiator 612 (eg, Figure 3 When the electronic device 600 (e.g. Figure 2AThe electronic device 200 in the embodiment of the present invention is arranged so that when the second surface 610B is oriented in the direction of gravity, the first terminal 661 and the third terminal 663 of the switch 660 can be electrically connected. The first terminal 661 and the third terminal 663 of the switch 660 can be electrically connected, and the wireless communication circuit 620 can be electrically connected to the second loop antenna radiator 612. This can be an operation flow in which the user experience of bringing the electronic device 600 close to the external electronic device 800 below the electronic device 600 in NFC or MST mode is taken into account. When the wireless communication circuit 620 is electrically connected to the second loop antenna radiator 612, the second communication identification range 6002 (for example Figure 2B The second communication identification range 2002 of the second surface 610B can be located on the second surface 610B. When the second communication identification range 6002 of the second surface 610B faces the communication identification range 8001 of the external electronic device 800 and is close to the threshold distance (for example, 100 mm, as the maximum identification distance), the electronic device 600 can exchange data with the external electronic device 800 through the second loop antenna radiator 612.

[0186] According to various embodiments, the processor 630 may be implemented to store direction detection instructions 641 and / or switch control instructions 642. According to various embodiments, the processor 630 may be implemented to include a first controller configured to execute the direction detection instructions 641 and / or a second controller configured to execute the switch control instructions 642.

[0187] Reference Figure 6 According to various embodiments, the electronic device 600 may further include a frequency adjustment circuit (or a matching circuit (not shown)) electrically connected to an electrical path between the wireless communication circuit 620 and the first loop antenna radiator 611 and / or an electrical path between the wireless communication circuit 620 and the second loop antenna radiator 612. The frequency adjustment circuit (e.g., a tuner or a passive element) may match impedance, may move the resonant frequency of the antenna device to a predetermined frequency, or may move the resonant frequency by a predetermined amount.

[0188] Fig. 9 is a block diagram illustrating an exemplary antenna device 900 in accordance with various embodiments.

[0189] Reference Fig. 9 In an embodiment, the antenna device 900 may include an antenna structure 910, a wireless communication circuit 920, a ground G and / or a switch (or a switch circuit) 960.

[0190] According to an embodiment, the antenna structure 910 is formed by placing the antenna structure 910 at a position located at a display (e.g., Figure 3 or Figure 4 201 in the display) on the conductive layer 930 (eg, Figure 3 or Figure 4 A first opening 931 (eg, Figure 3 or Figure 4 The loop antenna radiator is realized by the first opening 431 in the Figure 3 , Figure 4 or Figure 5 The antenna structure 910 may include a first feed point FP1 and a second feed point FP2 electrically connected to the switch 960 and a ground point GP electrically connected to the ground G (eg, Figure 5 The second connection point GP in the ground G may include, for example, a Figure 3 The ground plane on the first board component 341.

[0191] According to an embodiment, the wireless communication circuit 920 (eg Figure 1 The wireless communication module 192 in the embodiment may include a first wireless communication circuit 921 and a second wireless communication circuit 922. The first wireless communication circuit 921 may be implemented to send and / or receive a first signal in a first frequency band. The second wireless communication circuit 922 may be implemented to send and / or receive a second signal in a second frequency band different from the first frequency band.

[0192] According to an embodiment, the switch 960 may include a first terminal 961, a second terminal 962, a third terminal 963, or a fourth terminal 964. The first terminal 961 may be electrically connected to the first wireless communication circuit 921. The second terminal 962 may be electrically connected to the second wireless communication circuit 922. The third terminal 963 may be electrically connected to a first feeding point FP1 (e.g., Figure 5 The fourth terminal 964 may be electrically connected to a second feed point FP2 located in the antenna structure 910. The second feed point FP2 may be located to be spaced apart from the first feed point FP1 and close to the first opening 931 or at an edge (not shown) of the first opening 931.

[0193] According to various embodiments, the electrical path 971 between the first feeding point FP1 and the third terminal 963 or the electrical path 972 between the second feeding point FP2 and the fourth terminal 964 may include a flexible conductive member (e.g., Figure 3 The electrical path 973 between the ground point GP and the ground G may include a flexible conductive member (eg, Figure 3 a second flexible conductive member 392).

[0194] According to an embodiment, in a mode for transmitting and / or receiving a first signal of a first frequency band, the switch 960 may be configured to receive a first signal from a processor (eg, Figure 1 The first terminal 961 and the third terminal 963 are electrically connected by a control signal 965 of the processor 120 in the first opening 931. When the first terminal 961 and the third terminal 963 are electrically connected, the first wireless communication circuit 921 can be electrically connected to the antenna structure 910 via the first feeding point FP1. When the first wireless communication circuit 921 provides a radiation current to the first feeding point FP1, the radiation current can flow from the first feeding point FP1 to the ground point GP along the edge E of the first opening 931. Therefore, the antenna structure 910 can resonate at a first frequency related to the first signal.

[0195] According to an embodiment, in a mode for transmitting and / or receiving a second signal of a second frequency band, the switch 960 may be configured to receive a second signal from a processor (eg, Figure 1 The second terminal 962 and the fourth terminal 964 are electrically connected by a control signal 965 of the processor 120 in the first opening 931. When the second terminal 962 and the fourth terminal 964 are electrically connected, the second wireless communication circuit 922 can be electrically connected to the antenna structure 910 via the second feeding point FP2. When the second wireless communication circuit 922 provides a radiation current to the second feeding point FP2, the radiation current can flow from the second feeding point FP2 to the ground point GP along the edge E of the first opening 931. Therefore, the antenna structure 910 can resonate at a second frequency related to the second signal.

[0196] According to various embodiments, the first signal of the first frequency band or the second signal of the second frequency band may be related to NFC or MST.

[0197] Fig.10 is a block diagram illustrating an exemplary antenna device 1000 according to various embodiments.

[0198] refer to Fig.10 In an embodiment, the antenna device 1000 may include an antenna structure 1010, a wireless communication circuit 1020 and / or a ground G.

[0199] According to an embodiment, the antenna structure 1010 may include a first radiator 1001 and a second radiator 1002. The first radiator 1001 may be a first radiator 1002 disposed at a position located at a display (eg, Figure 3 or Figure 4 The conductive layer 1030 (eg, Figure 3 or Figure 4 A first opening 1031 (eg, Figure 3 or Figure 4The second radiator 1002 may be a loop antenna radiator formed by forming a second opening 1032 (eg, Figure 3 or Figure 4 The first radiator 1001 or the second radiator 1002 may be formed with at least Figure 3 , Figure 4 or Figure 5 The first radiator 1001 may include a first feeding point FP1 (eg, Figure 5 A first connection point FP in the circuit) and a first grounding point GP1 electrically connected to the ground G (eg Figure 5 The second radiator 1002 may include a second feeding point FP2 (eg, Figure 5 A first connection point FP in the circuit) and a second grounding point GP2 electrically connected to the ground G (eg Figure 5 The second connection point GP in the ground G may include, for example, a Figure 3 or Figure 4 The ground plane on the first board component 341.

[0200] According to an embodiment, the wireless communication circuit 1020 (eg Figure 1 The wireless communication module 192 in the embodiment may include a first wireless communication circuit 1021 and a second wireless communication circuit 1022. The first wireless communication circuit 1021 may be implemented to send and / or receive a first signal in a first frequency band. The second wireless communication circuit 1022 may be implemented to send and / or receive a second signal in a second frequency band different from the first frequency band.

[0201] According to an embodiment, in a mode for transmitting and / or receiving a first signal in a first frequency band, the first wireless communication circuit 1021 may be electrically connected to the first radiator 1001 via the first feeding point FP1. When the first wireless communication circuit 1021 provides a radiation current to the first feeding point FP1, the radiation current may flow from the first feeding point FP1 to the first ground point GP1 along the edge E1 of the first opening 1031. Therefore, the first radiator 1001 may resonate at a first frequency associated with the first signal.

[0202] According to an embodiment, in a mode for transmitting and / or receiving a second signal in a second frequency band, the second wireless communication circuit 1022 may be electrically connected to the second radiator 1002 via the second feeding point FP2. When the second wireless communication circuit 1022 provides a radiation current to the second feeding point FP2, the radiation current may flow from the second feeding point FP2 to the second ground point GP2 along an edge E2 of the second opening 1032. Therefore, the second radiator 1002 may resonate at a second frequency associated with the second signal.

[0203] According to various embodiments, the first signal of the first frequency band or the second signal of the second frequency band may be related to NFC or MST.

[0204] According to various embodiments, in order to reduce electromagnetic influence between the first radiator 1001 and the second radiator 1002 , the first radiator 1001 and the second radiator 1002 may be positioned to be spaced apart from each other so as to have a predetermined degree of electromagnetic isolation therebetween.

[0205] According to various embodiments, the first radiator 1001 and the second radiator 1002 may be electromagnetically coupled to each other. Thus, the resonant frequency formed by the first radiator 1001 or the resonant frequency formed by the second radiator 1002 may be difficult to have a predetermined value. According to an embodiment, the antenna device 1000 may further include a frequency adjustment circuit (e.g., a matching circuit); and the frequency adjustment circuit may match impedance, may move the resonant frequency to a predetermined frequency, or may move the resonant frequency by a predetermined amount.

[0206] According to various embodiments, the present disclosure may be applied to a foldable electronic device.

[0207] Fig.11 is a diagram illustrating a flat state or an unfolded state of an exemplary electronic device according to various embodiments. Fig.12 is a diagram showing various embodiments Fig.11 A view of a folded state of an electronic device.

[0208] Reference Fig.11 and Fig.12 In an embodiment, the electronic device 11 (eg Figure 1 The electronic device 101 in the embodiment may include a foldable housing 1100, a hinge cover 1130 configured to cover a foldable portion of the foldable housing 1100, and a flexible or foldable display (hereinafter referred to as a “display”) 1200 (e.g., Figure 1According to an embodiment, the foldable housing 1100 may include a front surface 1100a on which the display 1200 is exposed, a rear surface 1100b facing away from the front surface 1100a, and side surfaces 1100c and 1100d surrounding a space between the front surface 1100a and the rear surface 1100b.

[0209] According to an embodiment, the foldable housing 1100 may include a first housing structure 1110 and a second housing structure 1120, which are connected to each other through a hinge structure (not shown). For example, the first housing structure 1110 may be rotatably connected to the second housing structure 1120 through a hinge structure.

[0210] According to an embodiment, the foldable housing 1100 may be formed in an integral form including a first housing structure 1110 and a second housing structure 1120 which are connected to each other through a hinge structure.

[0211] According to an embodiment, the first housing structure 1110 may include a first surface 1101 oriented in a first direction ①, a second surface 1102 oriented in a second direction ② opposite to the first direction ①, and a first side surface 1100c at least partially surrounding a space between the first surface 1101 and the second surface 1102. The second housing structure 1120 may include a third surface 1103 oriented in a third direction ③, a fourth surface 1104 oriented in a fourth direction ④ opposite to the third direction ③, and a second side surface 1100d at least partially surrounding a space between the third surface 1103 and the fourth surface 1104. The front surface 1100a of the electronic device 11 may include the first surface 1101 and the third surface 1103, and the rear surface 1100b of the electronic device 11 may include the second surface 1102 and the fourth surface 1104. In various embodiments (not shown), the first housing structure 1110 may refer to a structure forming some of the first surface 1101, the second surface 1102, and the first side surface 1100c. In various embodiments (not shown), the second case structure 1120 may refer to a structure forming some of the third surface 1103 , the fourth surface 1104 , and the second side surface 1100 d .

[0212] According to an embodiment, the foldable housing 1100 may include a transparent plate (not shown) (e.g., a polymer plate including various coatings) forming the first surface 1101 and the third surface 1103. The display 1200 may be positioned along the transparent plate and may be exposed through the first surface 1101 and the third surface 1103. The transparent plate may be flexible so that the electronic device 11 can be folded. According to an embodiment, the display 1200 may be implemented to include a transparent plate, and the transparent plate may be omitted from the foldable housing 1100.

[0213] According to an embodiment, the first housing structure 1110 may include a first rear cover 1180, which is located on one side of the folding axis A and forms at least a portion of the second surface 1102. For example, the first rear cover 1180 may have a substantially rectangular perimeter 1181, which may be surrounded by the first side member 1111. According to various embodiments, the first side member 1111 and the first rear cover 1180 may be integrally formed and may include the same material.

[0214] According to an embodiment, the second housing structure 1120 may include a second rear cover 1190, which is located on the other side of the folding axis A and forms at least a portion of the fourth surface 1104. For example, the second rear cover 1190 may have a substantially rectangular perimeter 1191, which may be surrounded by the second side member 1121. According to various embodiments, the second side member 1121 and the second rear cover 1190 may be integrally formed and may include the same material.

[0215] According to various embodiments, the first back cover 1180 and / or the second back cover 1190 may be formed of, for example, coated or colored glass, ceramic, polymer, or metal (eg, aluminum, stainless steel (STS) or magnesium), or a combination of two or more of these materials.

[0216] According to an embodiment, the first rear cover 1180 and the second rear cover 1190 may have shapes substantially symmetrical about the folding axis A. However, the first rear cover 1180 and the second rear cover 1190 do not necessarily have mutually symmetrical shapes, and in another embodiment, the first rear cover 1180 and / or the second rear cover 1190 having various shapes may be provided.

[0217] According to an embodiment, the first housing structure 1110 may include a first side member (or a first side frame structure) 1111 forming a first side surface 1100c, and the second housing structure 1120 may include a second side member (or a second side frame structure) 1121 forming a second side surface 1100d. The first side member 1111 and / or the second side member 1121 may include metal or a polymer.

[0218] According to various embodiments, the first side member 1111 and the second side member 1121 may extend to form a peripheral area of ​​the front surface 1100a. For example, the front surface 1100a of the electronic device 11 may include a display 1200 and a partial area of ​​the first side member 1111 adjacent to the display 1200 and a partial area of ​​the second side member 1121 adjacent to the display 1200.

[0219] According to various embodiments, a partial area (not shown) of the first side member 1111 adjacent to the perimeter 1181 of the first back cover 1180 and / or a partial area (not shown) of the second side member 1121 adjacent to the perimeter 1191 of the second back cover 1190 may form a portion of the rear surface 1100b. For example, the rear surface 1100b of the electronic device 11 may include the first back cover 1180, a partial area of ​​the first side member 1111 adjacent to the first back cover 1180, the second back cover 1190, and a partial area of ​​the second side member 1121 adjacent to the second back cover 1190.

[0220] According to an embodiment, the first side member 1111 and the second side member 1121 may be located on opposite sides around the folding axis A and may have a substantially symmetrical shape around the folding axis A.

[0221] According to an embodiment, the first housing structure 1110 may further include a component mounting area 1114 extending from or coupled to the first side member 1111 to form the first surface 1101 together with the display 1200. In the first housing structure 1110, the area other than the component mounting area 1114 may have a shape symmetrical to the second housing structure 1120. In the component mounting area 1114, at least one component utilizing the first surface 1101 may be positioned. According to an embodiment, the component mounting area 1114 may be arranged to have a predetermined area adjacent to one corner of the first side member 1111. According to various embodiments, the position, shape and size of the component mounting area 1114 are not limited to those in the illustrated examples. For example, in another embodiment, the component mounting area 1114 may be arranged at another corner of the first housing structure 1110, or in any area between the upper end corner and the lower end corner. In an embodiment, elements embedded in the electronic device 11 to perform various functions may be exposed to the first surface 1101 through the component mounting area 1114 or one or more openings (not shown) provided in the component mounting area 1114. According to an embodiment of the present disclosure, the component 1146 located in the component mounting area 1114 may include at least one of various sensors, such as a proximity sensor, a front camera, a light emitting element, or a receiver. For example, the light emitting element may provide, for example, status information about the electronic device 11 in an optical form. In another embodiment, the light emitting element may provide a light source, which is associated with the operation of the front camera, for example. The light emitting element may include, for example, an LED, an IRLED, and a xenon lamp.

[0222] According to an embodiment, the electronic device 11 may include at least one of the audio modules 1141 and 1142 or the connector hole 1144 .

[0223] According to an embodiment, the audio modules 1141 and 1142 may include a microphone hole 1141 and a speaker hole 1142. The microphone hole 1141 may include a microphone located therein to acquire external sounds, and in some embodiments, may include multiple microphones located therein to sense the direction of the sound. The speaker hole 1142 may include an external speaker hole and a call receiver hole. In some embodiments, the speaker hole 1142 and the microphone hole 1141 may be implemented as a single hole, or may include a speaker without including the speaker hole 1142 (e.g., a piezoelectric speaker). According to an embodiment, the connector hole 1144 may include a first connector hole capable of accommodating a connector for sending / receiving power and / or data to / from an external electronic device (e.g., a USB connector) and / or a second connector hole capable of accommodating a connector for sending / receiving audio signals to / from an external electronic device (e.g., a headphone jack). The position and number of connector holes may vary, without limitation. Fig.11 or Fig.12 The embodiment shown.

[0224] In various embodiments (not shown), at least one of an audio module (e.g., a call receiver), a sensor module (e.g., a proximity sensor or a fingerprint sensor), a camera module (e.g., a front camera), and a light emitting element may be included in the rear surface of the screen display area of ​​the display 1200. In another embodiment (not shown), the display 1200 may be coupled to a touch-sensitive circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer configured to detect an electromagnetic field type stylus, or be positioned near them.

[0225] In an embodiment, the first housing structure 1110 and the second housing structure 1120 may form a recess, which is a space where the display 1200 is located. In the illustrated embodiment, due to the component mounting area 1114, the recess may have two or more different widths in a direction perpendicular to the folding axis A.

[0226] For example, the recess may include a first width w1 in the x-axis direction between a first portion 1121a in the second side member 1121 parallel to the folding axis A and a first portion 1111a in the first side member 1111 formed at an edge of the component mounting area 1114. The recess may include a second width w2 in the x-axis direction between a second portion 1121b in the second side member 1121 and a second portion 1111b in the first side member 1111 that does not correspond to the component mounting area 1114 and is parallel to the folding axis A. The second width w2 may be longer than the first width w1. According to an embodiment, the first portion 1111a of the first housing structure 1110 and the first portion 1121a of the second housing structure 1120 having an asymmetric shape may form the first width w1 of the recess, and the second portion 1111b of the first housing structure 1110 and the second portion 1121b of the second housing structure 1120 having a symmetric shape may form the second width w2 of the recess. According to an embodiment, the first portion 1121a and the second portion 1121b of the second housing structure 1120 may have respective different distances from the folding axis A. The width of the recess is not limited to the example shown. According to various embodiments, the recess may have multiple widths due to the shape of the component mounting area 1114 or due to the asymmetric shape of the first housing structure 1110 and the second housing structure 1120.

[0227] According to various embodiments, one or more components may be positioned or visually exposed on the rear surface 1100 b of the electronic device 11 .

[0228] For example, the sub display 1193 may be visually exposed through the second rear cover 1190. According to an embodiment, the sub display 1193 may be visible through the entire area of ​​the second rear cover 1190. According to some embodiments, the sub display may be positioned to be visually exposed through a portion of the entire area of ​​the second rear cover 1190 (e.g., the second rear area 1192).

[0229] For example, one or more components 1145 may be visibly exposed through the first rear region 1182 of the first rear cover 1180. In various embodiments, the one or more components 1145 may include sensors (eg, proximity sensors and heart rate sensors) and / or a rear camera.

[0230] Reference Fig.12, the hinge cover 1130 may be disposed between the first housing structure 1110 and the second housing structure 1120 to cover internal components (e.g., the hinge structure). According to some embodiments, the hinge structure may be referred to as an element including the hinge cover 1130. In an embodiment, the hinge cover 1130 may be covered by a portion of the first housing structure 1110 and the second housing structure 1120 or exposed to the outside, depending on whether the electronic device 11 is in an unfolded state or a folded state.

[0231] For example, Fig.11 As shown, when the electronic device 11 is in the unfolded state, the hinge cover 1130 may be covered by the first housing structure 1110 and the second housing structure 1120 so as not to be exposed. Fig.12 As shown, when the electronic device 11 is in a folded state (e.g., a fully folded state), the hinge cover 1130 may be exposed to the outside between the first housing structure 1110 and the second housing structure 1120. For example, when the electronic device 11 is in an intermediate state where the first housing structure 1110 and the second housing structure 1120 form a predetermined angle (e.g., a state between the unfolded state and the folded state) between the first housing structure 1110 and the second housing structure 1120, the hinge cover 1130 may be partially exposed to the outside between the first housing structure 1110 and the second housing structure 1120. The exposed area of ​​the hinge cover 1130 in the intermediate state may be smaller than the exposed area of ​​the hinge cover 1130 in the fully folded state. In an embodiment, the hinge cover 1130 may include a curved surface, and the curved surface may form one side surface of the electronic device 11 in the folded state.

[0232] According to various embodiments, the display 1200 may refer to a display at least a portion of which can be deformed into a flat surface or a curved surface. Fig.11 , the display 1200 may include a folding portion 1203, a first portion 1201 disposed on one side of the folding portion 1203 (e.g., the right side of the folding portion 1203), and a second portion 1202 disposed on the other side of the folding portion 1203 (e.g., the left side of the folding portion 1203). The folding portion 1203 may be a portion that bends when the electronic device 11 switches from the unfolded state to the folded state.

[0233] According to various embodiments, Fig.11 The area division of the display 1200 shown is illustrative, and the display 1200 may be divided into a plurality of areas (eg, four or more or two areas) according to its structure or function. Fig.11In the illustrated embodiment, the area of ​​the display 1200 may be divided by the folding portion 1203 or the folding axis A extending parallel to the y-axis. However, in another embodiment, the area of ​​the display 1200 may be divided based on another folding portion (e.g., a folding portion parallel to the x-axis) or another folding axis (e.g., a folding axis parallel to the x-axis).

[0234] According to an embodiment, the first portion 1201 and the second portion 1202 of the display 1200 may have substantially symmetrical shapes with respect to the folding portion 1203. According to an embodiment, unlike the second portion 1202, the first portion 1201 may include a notch cut out due to the presence of the component mounting area 1114, but may have a symmetrical shape with the second portion 1202 around the folding portion 1203 in an area other than the component mounting area 1114. For example, the first portion 1201 and the second portion 1202 may include mutually symmetrical portions around the folding portion 1203 and mutually asymmetrical portions.

[0235] According to an embodiment, the angle or distance formed by the first housing structure 1110 and the second housing structure 1120 may vary depending on whether the foldable housing 1100 is in an unfolded state, a folded state, or an intermediate state. Hereinafter, the operation of the first housing structure 1110, the second housing structure 1120, and the corresponding areas of the display 1200 according to the unfolded state or the folded state of the electronic device 11 will be described.

[0236] According to an embodiment, when the electronic device 11 is in the unfolded state (see Fig.11 ), the first direction ① in which the first surface 1101 of the first shell structure 1110 is oriented and the third direction ③ in which the third surface 1103 of the second shell structure 1120 is oriented may be the same. For example, in the unfolded state, the first surface 1101 of the first shell structure 1110 and the third surface 1103 of the second shell structure 1120 may be positioned to form, for example, an angle of approximately 180 degrees between them, and be oriented in the same direction (e.g., the direction in which the front surface 1100a of the electronic device 11 is oriented). In the unfolded state of the electronic device 11, the surface of the first part 1201 and the surface of the second part 1202 of the display 1200 may form approximately 180 degrees between them, and may be oriented in the same direction (e.g., the direction in which the front surface 1100a of the electronic device 11 is oriented). In the unfolded state, the folded portion 1203 of the display 1200 may form the same plane as the first part 1201 and the second part 1202.

[0237] In the embodiment, when the electronic device 11 is in the folded state (see Fig.12), the first housing structure 1110 and the second housing structure 1120 may be positioned to face each other. For example, in the folded state, the first surface 1101 of the first housing structure 1110 and the third surface 1103 of the second housing structure 1120 may face each other. In the folded state, the surface of the first portion 1201 of the display 1200 and the surface of the second portion 1202 of the display 1200 may face each other while forming a narrow angle (e.g., an angle between 0 degrees and 10 degrees) therebetween. In the folded state, at least a portion of the folded portion 1203 may form a curved surface having a predetermined curvature.

[0238] In an embodiment, when the electronic device 11 is in an intermediate state between the unfolded state and the folded state (not shown), the first housing structure 1110 and the second housing structure 1120 may be arranged to form a predetermined angle relative to each other. In the intermediate state, the first surface 1101 of the first housing structure 1110 and the third surface 1103 of the second housing structure 1120 or the surface of the first portion 1201 of the display 1200 and the surface of the second portion 1202 of the display 1200 may form an angle therebetween, which is greater than the angle in the folded state and less than the angle in the unfolded state. In the intermediate state, at least a portion of the folded portion 1203 may form a curved surface having a predetermined curvature, and the curvature at this time may be less than the curvature in the folded state.

[0239] Fig.13 is a diagram showing various embodiments Fig.11 or Fig.12 An exploded perspective view of an electronic device 11.

[0240] Reference Fig.13 In an embodiment, the electronic device 11 may include at least one of a display unit (e.g., including a display) 12, a support member assembly (e.g., a bracket or a bracket assembly) 13, a substrate unit 1350, a first housing structure 1110, a second housing structure 1120, a first back cover 1180, and a second back cover 1190. In the present disclosure, the display unit 12 may also be referred to as a display module or a display assembly.

[0241] The display unit 12 may include, for example, a display 1200 and at least one board or layer 1240 on which the display 1200 is mounted. In an embodiment, the board 1240 may be disposed between the display 1200 and the support member assembly 13. The display 1200 may be disposed on one surface (e.g., Fig.13 The plate 1240 may have a shape corresponding to the display 1200. For example, a portion of the plate 1240 may have a shape corresponding to the cutout portion 1204 of the display 1200.

[0242] In various embodiments (not shown), the display unit 12 may further include a digitizer for detecting an electronic pen (eg, a stylus pen). The digitizer may be disposed near the display 1200 or coupled to a rear surface of the display 1200.

[0243] The supporting member assembly 13 may include a first supporting member (e.g., a first bracket) 1310, a second supporting member (e.g., a second bracket) 1320, a hinge structure (e.g., including a hinge) 1301 disposed between the first supporting member 1310 and the second supporting member 1320, a hinge cover 1130 covering the hinge structure 1301, and a wiring member 1330 (e.g., a flexible printed circuit (FPC)) intersecting the first supporting member 1310 and the second supporting member 1320.

[0244] In an embodiment, the support member assembly 13 may be disposed between the plate 1240 and the substrate unit 1350. For example, the first support member 1310 may be disposed between the first portion 1201 of the display 1200 and the first substrate 1351 (e.g., the first PCB). The second support member 1320 may be disposed between the second portion 1202 of the display 1200 and the second substrate 1352 (e.g., the second PCB).

[0245] In an embodiment, the wiring member 1330 and the hinge structure 1301 may be at least partially disposed in the support member assembly 13. The wiring member 1330 may be disposed in a direction (e.g., an x-axis direction) intersecting the first and second support members 1310 and 1320. The wiring member 1330 may be disposed in a direction (e.g., an x-axis direction) intersecting the first and second support members 1310 and 1320. Fig.11 In a direction perpendicular to the y-axis or folding axis A).

[0246] In an embodiment, the substrate unit 1350 may include a first substrate 1351 disposed corresponding to the first support member 1310 and a second substrate 1352 disposed corresponding to the second support member 1320. The first and second substrates 1351 and 1352 may be disposed in a space formed by all or substantially all of the support member assembly 13, the first housing structure 1110, the second housing structure 1120, the first back cover 1180, and the second back cover 1190. On the first substrate 1351 and the second substrate 1352, electronic components for realizing various functions of the electronic device 11 may be mounted.

[0247] In an embodiment, in a state where the display unit 12 is combined with the support member assembly 13, the first housing structure 1110 and the second housing structure 1120 may be assembled to be combined with both sides of the support member assembly 13. In various embodiments, the first housing structure 1110 and the second housing structure 1120 may be combined with the support member assembly 13 by sliding on both sides of the support member assembly 13.

[0248] In an embodiment, the first housing structure 1110 may have a first rotation bearing surface 1112, and the second housing structure 1120 may have a second rotation bearing surface 1122 corresponding to the first rotation bearing surface 1112. Each of the first and second rotation bearing surfaces 1112 and 1122 may have a curved surface corresponding to the curved surface included in the hinge cover 1130.

[0249] In an embodiment, when the electronic device 11 is in a flat state (eg, Fig.11 ), the first rotation support surface 1112 and the second rotation support surface 1122 cover the hinge cover 1130, so that the hinge cover 1130 may not be exposed to the rear surface of the electronic device 11 or may be exposed to a relatively small amount of the rear surface of the electronic device 11. On the other hand, when the electronic device 11 is in a folded state (e.g., Fig.12 ), the hinge cover 1130 can be exposed to a relatively large extent on the rear surface of the electronic device 11.

[0250] Fig.14A FIG. 1 is a diagram showing an expanded state according to various embodiments. Fig.11 A cross-sectional view of an electronic device. Fig. 14B FIG. 1 is a diagram showing a folded state according to various embodiments. Fig.12 A cross-sectional view of an electronic device.

[0251] refer to Fig.14A and Fig. 14B In an embodiment, the electronic device 11 may include a first housing structure 1110, a second housing structure 1120, a hinge structure 1301, a display 1200, a sub-display 1193, a first loop antenna radiator 1401, a second loop antenna radiator 1402, a third loop antenna radiator 1403, and a fourth loop antenna radiator 1404, wherein the first housing structure 1110 includes a first surface 1101 and a second surface 1102, and the second housing structure 1120 includes a third surface 1103 and a fourth surface 1104. The structures of the first housing structure 1110 and the various elements therein may be similar to Figure 4 The structure of the second housing structure 1120 and the various components located therein may be similar to or substantially the same as the structure of Figure 4 The structures in are similar or substantially the same or similar.

[0252] According to an embodiment, the first loop antenna radiator 1401 is formed by a conductive layer (eg, Figure 3 or Figure 4 An opening (eg, Figure 3 or Figure 4 The first opening 431 in the loop antenna radiator is realized by Figure 3 , Figure 4 or Figure 5 The first antenna structure 401 in FIG.

[0253] According to an embodiment, the third loop antenna radiator 1403 is formed by a conductive layer (eg, Figure 3 or Figure 4 An opening (eg, Figure 3 or Figure 4 The first opening 431 in the loop antenna radiator is realized by Figure 3 , Figure 4 or Figure 5 The first antenna structure 401 in FIG.

[0254] According to an embodiment, the fourth loop antenna radiator 1404 is formed by a conductive layer (eg, Figure 3 or Figure 4 An opening (eg, Figure 3 or Figure 4 The first opening 431 in the loop antenna radiator is realized by Figure 3 , Figure 4 or Figure 5 The first antenna structure 401 in FIG.

[0255] According to an embodiment, the second loop antenna radiator 1402 may be located near the second surface 1102 within the first housing structure 1110 and may include Figure 3 or Figure 4 at least a portion of the third antenna structure 403.

[0256] Reference Fig. 14B In an embodiment, when the electronic device 11 is in a folded state, the first surface 1101 and the third surface 1103 may face each other, and the first loop antenna radiator 1401 and the third loop antenna radiator 1403 may be located between the second loop antenna radiator 1402 and the fourth loop antenna radiator 1404.

[0257] Fig.15 is a diagram showing various embodiments Fig.14A or Fig. 14B A block diagram of an electronic device 11 is shown.

[0258] Reference Fig.15 In an embodiment, the electronic device 11 may include a first loop antenna radiator 1401, a second loop antenna radiator 1402, a third loop antenna radiator 1403, a fourth loop antenna radiator 1404, a wireless communication circuit 1520, a processor (e.g., including a processing circuit) 1530, a memory 1540, a sensor 1550 and / or a switch (or a switching circuit) 1560.

[0259] Reference Fig.14A and Fig.15 In an embodiment, the first loop antenna radiator 1401, the third loop antenna radiator 1403, or the fourth loop antenna radiator 1404 may include, for example, one end electrically connected to the switch 1560 (eg, Figure 5 The first connection point FP in the embodiment of the present invention extends to the other end (for example, Figure 5 The second antenna radiator 1402 may include, for example, a loop from one end (eg, Figure 3 The first end 381a or the third end 382a in the embodiment extends to the other end (eg, Figure 3 For example, the ground plane is located at the second end 381b or the fourth end 382b of the loop (e.g., coil). Fig.13 on a board assembly (ie, substrate unit) 1350.

[0260] According to an embodiment, the wireless communication circuit 1520 (eg Figure 1 The wireless communication module 192 in the embodiment may be implemented to send and / or receive a selected or predetermined frequency band through the first loop antenna radiator 1401, the second loop antenna radiator 1402, the third loop antenna radiator 1403, or the fourth loop antenna radiator 1404. According to an embodiment, the signal may be a first signal having a frequency of, for example, about 13.56 MHz for NFC, or a second signal having a frequency of, for example, about 300 kHz or less (e.g., about 70 kHz) for MST. The structure including the first loop antenna radiator 1401, the second loop antenna radiator 1402, the third loop antenna radiator 1403, the fourth loop antenna radiator 1404, the wireless communication circuit 1520, the ground G, and the electrical paths therebetween may be referred to as an antenna device (or antenna system).

[0261] According to an embodiment, the switch (or switch circuit) 1560 may include a first terminal 1561, a second terminal 1562, a third terminal 1563, a fourth terminal 1564, or a fifth terminal 1565. The first terminal 1561 may be electrically connected to the wireless communication circuit 1520. The second terminal 1562 may be electrically connected to the first loop antenna radiator 1401. The third terminal 1563 may be electrically connected to the second loop antenna radiator 1402. The fourth terminal 1564 may be electrically connected to the third loop antenna radiator 1403. The fifth terminal 1565 may be electrically connected to the fourth loop antenna radiator 1404. Under the control of the processor 1530, the switch 1560 may electrically connect the first terminal 1561 to one of the second terminal 1562, the third terminal 1563, the fourth terminal 1564, and the fifth terminal 1565.

[0262] According to various embodiments, the switch 1560 may be included in the wireless communication circuit 1520 or the processor 1530 .

[0263] According to an embodiment, the electronic device 11 may be implemented such that the first loop antenna radiator 1401 , the second loop antenna radiator 1402 , the third loop antenna radiator 1403 , or the fourth loop antenna radiator 1404 is selectively electrically connected to the wireless communication circuit 1520 based on the movement or orientation of the electronic device 11 .

[0264] According to an embodiment, the memory 1540 (eg, Figure 1 The memory 130 in the embodiment may store information for the processor 1530 (eg, Figure 1 120) in the processor (e.g. Figure 1 140 in the program 140) to control the antenna device including the first loop antenna radiator 1401, the second loop antenna radiator 1402, the third loop antenna radiator 1403 and the fourth loop antenna radiator 1404.

[0265] According to an embodiment, the memory 1540 may store an unfolding / folding state detection instruction 1541 , a direction detection instruction 1542 , and / or a switch control instruction 1543 .

[0266] According to an embodiment, the unfolded / folded state detection instruction 1541 may include allowing the processor 1530 to use the sensor 1550 to identify the unfolded state of the electronic device 11 (for example, see Fig.11 ) or folded state (see, for example, Fig.12 ) routine.

[0267] According to an embodiment, the sensor 1550 may include a proximity sensor. Fig.11, the proximity sensor can be located in the component mounting area 1114 in the first housing structure 1110. When the electronic device 11 is in the folded state (see, for example, Fig.12 ), the proximity sensor located in the first shell structure 1110 can output an electrical signal related to the proximity of the second shell structure 1120 to the processor 1530.

[0268] According to another embodiment, the sensor 1550 may include a Hall integrated circuit (IC). Fig.11 , the first housing structure 1110 may include a Hall IC, and the second housing structure 1120 may include a magnet. When the electronic device 11 is in a folded state (see, for example, Fig.12 ), the Hall IC located in the first shell structure 1110 and the magnet located in the second shell structure 1120 can be aligned, and the Hall IC can recognize the magnet and can output an electrical signal to the processor 1530.

[0269] According to an embodiment, the sensor 1550 may include an image sensor. Fig.11 , the image sensor may be included in the front camera located in the component mounting area 1114 in the first housing structure 1110. When the electronic device 11 is in the folded state (see, for example, Fig.12 ), the image sensor located in the first shell structure 1110 can obtain image data related to the second shell structure 1120, and the processor 1530 can determine that the electronic device 11 is in a folded state based on the image data.

[0270] According to various embodiments, various other sensors may be used to detect the unfolded state or folded state of the electronic device 11 .

[0271] In some embodiments, reference Fig.11 , the first housing structure 1110 may include a first contact, and the second housing structure 1120 may include a second contact. When the electronic device 11 is in a folded state (see, for example, Fig.12 ), a first contact located in the first shell structure 1110 and a second contact located in the second shell structure can be in physical contact with each other so as to be stimulated, and the processor 1530 can identify the folding state based on such stimulation.

[0272] According to an embodiment, the direction detection instructions 1542 may include a routine that allows the processor 1530 to detect the direction of the electronic device 11 when the electronic device 11 is in the unfolded state (eg, see Fig.14A) state to use sensor 1550 based on the gravity direction to identify the direction in which first surface 1101 or third surface 1103 or second surface 1102 or fourth surface 1104 is oriented. Direction detection instructions 1542 may include routines that allow processor 1530 to detect the orientation of first surface 1101 or third surface 1103 or second surface 1102 or fourth surface 1104 when electronic device 11 is in a folded state (e.g., see Fig. 14B ) state, the direction in which the second surface 1102 or the fourth surface 1104 is oriented is identified using sensor 1550 based on the direction of gravity.

[0273] According to an embodiment, the switch control instructions 1543 may include a routine that allows the processor 1530 to control the switch 1560 based on the orientation of the electronic device 11.

[0274] Fig.16 is a diagram showing various embodiments Fig.15 Flowchart of example operations 1600 of an electronic device. Fig.17A is a diagram showing various embodiments Fig.16 The operation diagram, Fig. 17B is a diagram showing various embodiments Fig.16 Graph of the operation.

[0275] According to the embodiment, reference Fig.15 and Fig.16 In operation 1601, the processor 1530 may use the sensor 1550 to identify whether the electronic device 11 is in an unfolded state or a folded state.

[0276] According to an embodiment, when it is recognized that the electronic device 11 is in the unfolded state (for example, see Fig.14A ), the processor 1530 may perform operation 1603. In operation 1603, the processor 1530 may use the sensor 1550 to identify a first situation that the first surface 1101 (or the third surface 1103) is oriented in the direction of gravity or identify a second situation that the second surface 1102 (or the fourth surface 1104) is oriented in the direction of gravity.

[0277] According to the embodiment, reference Fig.14A and Fig.15, when a first situation in which the first surface 1101 (or the third surface 1103) is oriented in the direction of gravity is identified, in operation 1605, the processor 1530 may electrically connect the first loop antenna radiator 1401 or the third loop antenna radiator 1403 to the wireless communication circuit 1520. When the electronic device 11 is arranged so that the first surface 1101 is oriented in the direction of gravity, the first terminal 1561 and the second terminal 1562 of the switch 1560 may be electrically connected, or the first terminal 1561 and the fourth terminal 1564 of the switch 1560 may be electrically connected. This may be an operation flow in which a user experience of bringing the unfolded electronic device 11 close to an external electronic device below the electronic device 11 in NFC or MST mode is taken into account. In various embodiments, referring to Fig.14A In the first case, the first terminal 1561 can be electrically connected to the second terminal 1562 or the fourth terminal 1564 according to the landscape view or the portrait view of the screen. The landscape view refers to the case where the first part 1201 and the second part 1202 of the display 1200 are arranged horizontally, and the portrait view refers to the case where the first part 1201 and the second part 1202 of the display 1200 are arranged vertically.

[0278] According to the embodiment, reference Fig.14A and Fig.15 , when a second situation in which the second surface 1102 (or the fourth surface 1104) is oriented in the direction of gravity is identified, in operation 1607, the processor 1530 may electrically connect the second loop antenna radiator 1402 or the fourth loop antenna radiator 1404 to the wireless communication circuit 1520. When the electronic device 11 is arranged so that the second surface 1102 is oriented in the direction of gravity, the first terminal 1561 and the third terminal 1563 of the switch 1560 may be electrically connected, or the first terminal 1561 and the fifth terminal 1565 of the switch 1560 may be electrically connected. This may be an operation flow in which a user experience of bringing the unfolded electronic device 11 close to an external electronic device below the electronic device 11 in NFC or MST mode is taken into account. In various embodiments, with reference to Fig.14A In the second case, the first terminal 1561 can be electrically connected to the third terminal 1563 or the fifth terminal 1565 according to the landscape view or the portrait view of the screen.

[0279] According to an embodiment, when it is recognized that the electronic device 11 is in a folded state (for example, see Fig. 14B ), the processor 1530 may perform operation 1609. In operation 1609, the processor 1530 may use the sensor 1550 to identify a third case where the second surface 1102 is oriented in the gravity direction or identify a fourth case where the fourth surface 1104 is oriented in the gravity direction.

[0280] According to the embodiment, reference Fig.15 and Fig.17A , when identifying the third situation that the electronic device 11 is in a folded state so that the second surface 1102 faces the direction of gravity, the processor 1530 can electrically connect the wireless communication circuit 1520 and the second loop antenna radiator 1402 in operation 1611. When the electronic device 11 is arranged so that the second surface 1102 is oriented in the direction of gravity, the first terminal 1561 and the third terminal 1563 of the switch 1560 can be electrically connected. This can be such an operation flow in which the user experience of bringing the electronic device 11 close to the external electronic device 1700 below the electronic device 11 in the NFC or MST mode is taken into account. When the wireless communication circuit 1520 is electrically connected to the second loop antenna radiator 1402, the communication identification range 11001 can be located on the second surface 1102. When the communication identification range 11001 of the second surface 1102 faces the communication identification range 17001 of the external electronic device 1700 and is close to the threshold distance (for example, 100 mm, as the maximum identification distance), the electronic device 11 can exchange data with the external electronic device 1700 through the second loop antenna radiator 1402.

[0281] According to the embodiment, reference Fig.15 and Fig. 17B , when it is identified that the electronic device 11 is in a folded state so that the fourth surface 1104 faces the direction of gravity, in operation 1613, the processor 1530 can electrically connect the wireless communication circuit 1520 and the fourth loop antenna radiator 1404. When the electronic device 11 is arranged so that the fourth surface 1104 is oriented in the direction of gravity, the first terminal 1561 and the fifth terminal 1565 of the switch 1560 can be electrically connected. This can be such an operation flow, in which the user experience of bringing the electronic device 11 close to the external electronic device 1700 below the electronic device 11 in the NFC or MST mode is taken into account. When the wireless communication circuit 1520 is electrically connected to the fourth loop antenna radiator 1404, the communication identification range 11002 can be located on the fourth surface 1104. When the communication identification range 11002 of the fourth surface 1104 faces the communication identification range 17001 of the external electronic device 1700 and is close to the threshold distance (for example, 100 mm, as the maximum identification distance), the electronic device 11 can exchange data with the external electronic device 1700 through the fourth loop antenna radiator 1404.

[0282] According to various embodiments, the processor 1530 may be implemented to store an unfolding / folding state detection instruction 1541, a direction detection instruction 1542, and / or a switch control instruction 1543. According to various embodiments, the processor 1530 may be implemented to include a first controller configured to execute the unfolding / folding state detection instruction 1541, a second controller configured to execute the direction detection instruction 1542, and / or a third controller configured to execute the switch control instruction 1543.

[0283] Reference Fig.15 According to various embodiments, the electronic device 11 may include a frequency adjustment circuit (or matching circuit (not shown)) connected to an electrical path between the wireless communication circuit 1520 and the first loop antenna radiator 1401, an electrical path between the wireless communication circuit 1520 and the second loop antenna radiator 1402, an electrical path between the wireless communication circuit 1520 and the third loop antenna radiator 1403, and / or an electrical path between the wireless communication circuit 1520 and the fourth loop antenna radiator 1404. In the unfolded or folded state, the frequency adjustment circuit (e.g., a tuner or a passive element) may match the impedance of the antenna device consisting of the wireless communication circuit 1520 and the antenna radiator electrically connected thereto, may move the resonant frequency of the antenna device to a predetermined frequency, or may move the resonant frequency by a predetermined amount.

[0284] According to various embodiments, the present disclosure may be applied to an electronic device having an external folding structure in which a screen is folded outward.

[0285] Fig.18A is a cross-sectional view illustrating an exemplary electronic device 18 having an outer folder structure in an unfolded state according to various embodiments. Fig.18B FIG. 1 is a diagram showing a folded state according to various embodiments. Fig.18A A cross-sectional view of an electronic device.

[0286] refer to Fig.18A and Fig.18B In an embodiment, the electronic device 18 may include a first shell structure 1810, a second shell structure 1820, a hinge structure 1830, a flexible display 1840, a first loop antenna radiator 1851, a second loop antenna 1852, a third loop antenna radiator 1853 or a fourth loop antenna radiator 1854, wherein the first shell structure 1810 includes a first surface 1801 and a second surface 1802, and the second shell structure 1820 includes a third surface 1803 and a fourth surface 1804.

[0287] According to an embodiment, the flexible display 1840 may extend from the first surface 1801 to the third surface 1803. When the first housing structure 1810 and the second housing structure 1820 are folded by the hinge structure 1830 (eg, see Fig.18B ), the second surface 1802 and the fourth surface 1804 can be positioned close to each other to face each other, and the flexible display 1840 extending from the first surface 1801 to the third surface 1803 can be visually exposed.

[0288] According to various embodiments, the structure of the first housing structure 1810 and the various elements located therein may be similar to Figure 4 The second housing structure 1820 and the structures of the various components therein may be similar to or substantially the same as those in FIG. Figure 4 Those in are similar or substantially the same or similar.

[0289] According to an embodiment, the first loop antenna radiator 1851 is formed by a conductive layer (eg, Figure 3 or Figure 4 An opening (eg, Figure 3 or Figure 4 The first opening 431 in the loop antenna radiator is realized by Figure 3 , Figure 4 or Figure 5 According to various embodiments, the first loop antenna radiator 1851 may be referred to as a first antenna.

[0290] According to an embodiment, the third loop antenna radiator 1853 is formed by a conductive layer (eg, Figure 3 or Figure 4 An opening (eg, Figure 3 or Figure 4 The first opening 431 in the loop antenna radiator is realized by Figure 3 , Figure 4 or Figure 5 According to various embodiments, the third loop antenna radiator 1853 may be referred to as a third antenna.

[0291] According to an embodiment, the second loop antenna radiator 1852 may be located near the second surface 1802 within the first housing structure 1810 and may include Figure 3 or Figure 4 At least a portion of the third antenna structure 403. According to various embodiments, the second loop antenna radiator 1852 may be referred to as a second antenna.

[0292] According to an embodiment, the fourth loop antenna radiator 1854 may be located near the fourth surface 1804 within the second housing structure 1820 and may include Figure 3 or Figure 4 At least a portion of the third antenna structure 403. According to various embodiments, the fourth loop antenna radiator 1854 may be referred to as a fourth antenna.

[0293] Reference Fig.18B In an embodiment, when the electronic device 18 is in a folded state, the second surface 1802 and the fourth surface 1804 may face each other, and the second loop antenna radiator 1852 and the fourth loop antenna radiator 1854 may be located between the first loop antenna radiator 1851 and the third loop antenna radiator 1853.

[0294] According to various embodiments, with respect to the loop antenna radiators 1851, 1852, 1853, and 1854, the same Fig.15 The electronic device 18 is implemented with components similar to or the same as the components of the electronic device 11 shown. Depending on whether the electronic device 18 is in an unfolded state or a folded state, the electronic device 18 can perform an operation of selectively electrically connecting a loop antenna radiator corresponding to a surface oriented in the direction of gravity to a wireless communication circuit. This can be an operation flow in which a user experience of placing the electronic device 18 with an outer folding structure having an outward folding screen close to an external electronic device below the electronic device 18 is taken into consideration.

[0295] Fig.19 is a cross-sectional view showing a foldable electronic device 19 in an unfolded state according to various embodiments.

[0296] Reference Fig.19 In an embodiment, the electronic device 19 may include a foldable housing 1900 , a flexible display 1940 , a first conductive layer 1950 , a second conductive layer 1960 , a first conductive supporting member 1970 and / or a second conductive supporting member 1980 .

[0297] According to an embodiment, the foldable housing 1900 may include a folding portion 1930, a first portion 1910, and a second portion 1920, wherein the first portion 1910 and the second portion 1920 are positioned so that the folding portion 1930 is located therebetween. The folding portion 1930 may be a portion that bends when the electronic device 19 switches from an unfolded state to a folded state.

[0298] According to various embodiments, the first portion 1910 may be referred to as a "first housing portion", and various other terms may be used. The second portion 1920 may be referred to as a "second housing portion", and various other terms may be used. The folding portion 1930 is a portion between the first portion 1910 and the second portion 1920 having flexibility capable of achieving a folded state, and various other terms may be used.

[0299] According to an embodiment, the folding portion 1930 may be implemented as a structure in which a plurality of rods (or tracks) extending in the y-axis direction are arranged from the first portion 1910 to the second portion 1920 (e.g., a hinge track or a hinge track structure). According to various embodiments, the folding portion 1930 may be implemented as various different structures that can be bent while connecting the first portion 1910 and the second portion 1920. In a state in which the electronic device 19 is folded, at least a portion of the folding portion 1930 may form a curved shape having a curvature.

[0300] According to various embodiments, the first portion 1910 and / or the second portion 1920 may refer to a portion having less flexibility than the folded portion 1930 .

[0301] According to various embodiments, the folded portion 1930 may be formed of a material different from that of the first portion 1910 and / or the second portion 1920 .

[0302] According to various embodiments, the foldable housing 1900 may be implemented as Fig.11 and Fig.13 The foldable housing 1100 of the electronic device 11 shown is substantially the same or similar. For example, the first portion 1910 of the foldable housing 1900 may include Fig.11 The first housing structure 1100. The second portion 1920 of the foldable housing 1900 may include Fig.11 The folding portion 1930 of the foldable housing 1900 may include Fig.13 Hinge cover 1130 and hinge structure 1301.

[0303] According to an embodiment, the first part 1910 of the foldable housing 1900 may include a first surface 1901 oriented along a first direction ① and a second surface 1902 oriented along a second direction ② opposite to the first direction ①. The second part 1920 of the foldable housing 1900 may include a third surface 1903 oriented along a third direction ③ and a fourth surface 1904 oriented along a fourth direction ④ opposite to the third direction ③.

[0304] According to an embodiment, the unfolded state of the electronic device 19 may indicate, for example, a fully unfolded state. In the unfolded state, for example, Fig.19As shown, the first surface 1901 of the first portion 1910 and the third surface 1903 of the second portion 1920 may form an angle of approximately 180 degrees.

[0305] According to an embodiment, the electronic device 19 may be implemented as an inner folding structure in which the screen is folded inward. In this case, when the electronic device 19 is in the folded state, the first surface 1901 of the first part 1910 and the third surface 1903 of the second part 1920 may face each other. According to various embodiments, when the electronic device 19 is in the folded state, the first surface 1901 and the third surface 1903 may face each other while forming a narrow angle (e.g., between about 0 and 10 degrees) therebetween.

[0306] According to an embodiment, the electronic device 19 may be implemented as an outer folding structure in which the screen is folded outward. In this case, when the electronic device 19 is in the folded state, the second surface 1902 of the first part 1910 and the fourth surface 1904 of the second part 1920 may face each other. According to various embodiments, when the electronic device 19 is in the folded state, the second surface 1902 and the fourth surface 1904 may face each other while forming a narrow angle (e.g., between about 0 and 10 degrees) therebetween.

[0307] According to various embodiments, the electronic device 19 may be in an intermediate state between the unfolded state and the folded state. According to some embodiments, the intermediate state of the electronic device 19 may be a state included in the unfolded state or the folded state.

[0308] According to an embodiment, the first portion 1910 may extend a first length D1 from the folding portion 1930. The second portion 1920 may extend a second length D2 from the folding portion 1930. According to some embodiments, the first length D1 and the second length D2 may be substantially equal to each other. In this case, when the electronic device 19 is in the folded state, the side surface 190c (e.g., Fig.11 The first side surface 1100c in the embodiment and the side surface 190d of the second portion 1920 (eg, Fig.11 The second side surfaces 1100d in the embodiment may be aligned with each other to form a height greater than that of the electronic device 19 in the unfolded state (see, for example, Fig.19 ) at the height of the side surface.

[0309] According to various embodiments (not shown), the first length D1 may be formed to be greater than the second length D2. In this case, when the electronic device 19 is in the folded state, the first portion 1910 may protrude relative to the second portion 1920. According to some embodiments, the second length D2 may be formed to be greater than the first length D1. In this case, when the electronic device 19 is in the folded state, the second portion 1920 may protrude relative to the first portion 1910.

[0310] According to various embodiments, when the electronic device 19 is implemented as an inner folding structure in which the screen folds inward, when the electronic device 19 is in a folded state, the first part 1910 can extend to cover the side surface 190d of the second part 1920 (see the double dotted line indicated by the figure mark 1910a).

[0311] According to various embodiments, when the electronic device 19 is implemented as an external folding structure in which the screen is folded outward, when the electronic device 19 is in a folded state, the first part 1910 can extend to cover the side surface 190d of the second part 1920 (see the double dotted line indicated by the figure mark 1910b).

[0312] According to an embodiment, the flexible display 1940 may extend from the first surface 1901 to the third surface 1903. The flexible display 1940 may include a third portion 1941 (eg, Fig.11 The flexible display 1940 may include a fourth portion 1942 (eg, Fig.11 The flexible display 1940 may include a fifth portion 1943 (eg, a fifth portion 1943) visibly exposed through a fifth surface 1905 between the first surface 1901 and the second surface 1902. Fig.11 The folded portion 1203 in FIG.

[0313] According to various embodiments, the structure of the first portion 1910 of the foldable housing 1900 and the various elements located therein may be similar to Figure 4 The structures in are similar or substantially the same or similar.

[0314] According to an embodiment, the first conductive layer 1950 (eg, Figure 3 , Figure 4 or Figure 5 The first conductive layer 1950 may be located in the first portion 1910 of the foldable housing 1900. The first conductive layer 1950 may be located, for example, between the flexible display 1940 and the first conductive support member 1970. According to an embodiment, the first conductive layer 1950 may be located on the flexible display 1940.

[0315] According to an embodiment, first conductive layer 1950 may include first opening 1952 (eg, Figure 3 , Figure 4 or Figure 5 The first conductive layer 1950 may be electrically connected to a wireless communication circuit (eg, Figure 5 When the first conductive layer 1950 is electrically connected to the wireless communication circuit, at least a portion of the first conductive layer 1950 surrounding the first opening 1952 may function as a first antenna 1951. According to various embodiments, the first antenna 1951 is based on Figure 3 , Figure 4 or Figure 5 The first opening 431 in the conductive layer 430 realizes the loop antenna radiator, and can be connected with Figure 3 , Figure 4 or Figure 5 The first antenna structure 401 is implemented in substantially the same or similar manner.

[0316] According to an embodiment, the first conductive support member 1970 may be at least partially located between the first conductive layer 1950 and the second surface 1902. According to various embodiments, the first conductive support member 1970 may include Figure 3 or Figure 4 The conductive portion 311 a included in the first support member 311 .

[0317] According to various embodiments, the first conductive support member 1970 may include a third opening 1972 (eg, Figure 3 , Figure 4 or Figure 5 When viewed from above the first surface 1901, the third opening 1972 at least partially overlaps with the first opening 1952 in the first conductive layer 1950. The third opening 1972 can reduce the electromagnetic influence of the first conductive support member 1970 on the first antenna 1951 caused by the first opening 1952 in the first conductive layer 1950, thereby suppressing the degradation of radiation performance.

[0318] According to various embodiments, the electronic device 19 may further include a non-conductive portion (eg, Figure 3 A portion of the non-conductive portion may be at least partially located in the third opening 1972 in the first conductive support member 1970. The non-conductive portion may be coupled to the first conductive support member 1970 to promote rigidity as a support member. According to various embodiments, the structure including the first conductive support member 1970 and the non-conductive portion may be Figure 3 The first supporting member 311 is provided.

[0319] According to an embodiment, when viewed from above the first surface 1901, the third opening 1972 in the first conductive support member 1970 may overlap the entire first opening 1952 in the first conductive layer 1950. According to various embodiments, when viewed from above the first surface 1901, the third opening 1972 may be formed at least partially along an edge (not shown) of the first opening 1952. The third opening 1972 may suppress degradation of the radiation performance of the first antenna 1951 by being arranged so that at least a portion of the first conductive support member 1970 does not overlap the first opening 1952 in the first conductive layer 1950 when viewed from above the first surface 1901. When a radiation current is provided to the first antenna 1951, an electromagnetic force generated from the first antenna 1951 may pass through the first opening 1952 and the third opening 1972 aligned therewith. The third opening 1972 prevents and / or reduces the reduction of magnetic flux through the first conductive support member 1970, thereby ensuring the radiation performance of the first antenna 1951. When the magnetic flux is not reduced, the electromagnetic wave energy increases due to the increase in the inductance value, so that the radiation performance can be improved. According to various embodiments, the third opening 1972 can be implemented in various shapes so that when viewed from above the first surface 1901, the first conductive support member 1970 does not overlap with the first opening 1952. For example, the third opening 1972 can be formed in the form of a through hole or a recess.

[0320] According to some embodiments, when the radiation performance of the first antenna 1951 is ensured to be equal to or higher than the threshold level even if the third opening 1972 is not formed, the third opening 1972 may be omitted. In this case, the first conductive support member 1970 may be expanded to the position of the third opening 1972, and thus, the rigidity of the first conductive support member 1970 as a support member may be increased.

[0321] According to various embodiments, the structure of the second portion 1920 of the foldable housing 1900 and the various elements located therein may be similar to Figure 4 The structures in are similar or substantially the same or similar.

[0322] According to an embodiment, the second conductive layer 1960 (eg, Figure 3 , Figure 4 or Figure 5 The second conductive layer 1960 may be located in the second portion 1920 of the foldable housing 1900. The second conductive layer 1960 may be located, for example, between the flexible display 1940 and the second conductive support member 1980. According to an embodiment, the second conductive layer 1960 may be located on the flexible display 1940.

[0323] According to an embodiment, second conductive layer 1960 may include second opening 1962 (eg, Figure 3 , Figure 4 or Figure 5 The second conductive layer 1960 may be electrically connected to a wireless communication circuit (eg, Figure 5 When the second conductive layer 1960 is electrically connected to the wireless communication circuit, at least a portion of the second conductive layer 1960 surrounding the second opening 1962 may function as a second antenna 1961. According to various embodiments, the second antenna 1961 may include, for example, a Figure 3 , Figure 4 or Figure 5 The first opening 431 in the conductive layer 430 realizes the loop antenna radiator, and can be connected with Figure 3 , Figure 4 or Figure 5 The first antenna structure 401 is implemented in substantially the same manner.

[0324] According to an embodiment, the second conductive support member 1980 may be at least partially located between the second conductive layer 1960 and the fourth surface 1904. According to various embodiments, the second conductive support member 1980 may include Figure 3 or Figure 4 The conductive portion 311 a included in the first supporting member 311 .

[0325] According to various embodiments, the second conductive support member 1980 may include a fourth opening 1982 (eg, Figure 3 , Figure 4 or Figure 5 When viewed from above the third surface 1903, the fourth opening 1982 at least partially overlaps with the second opening 1962 in the second conductive layer 1960. The fourth opening 1982 can reduce the electromagnetic influence of the second conductive support member 1980 on the second antenna 1961 caused by the second opening 1962 in the second conductive layer 1960, thereby suppressing the degradation of radiation performance.

[0326] According to various embodiments, the electronic device 19 may further include a non-conductive portion (eg, Figure 3 The non-conductive portion 311b in the second conductive support member 1980 may be at least partially located in the fourth opening 1982 in the second conductive support member 1980. The non-conductive portion may be coupled to the second conductive support member 1980 to promote rigidity as a support member. According to various embodiments, the structure including the second conductive support member 1980 and the non-conductive portion may be Figure 3 The first supporting member 311 is provided.

[0327] According to an embodiment, when viewed from above the third surface 1903, the fourth opening 1982 in the second conductive support member 1980 may overlap the entire second opening 1962 in the second conductive layer 1960. According to various embodiments, when viewed from above the third surface 1903, the fourth opening 1982 may be formed at least partially along an edge (not shown) of the second opening 1962. The fourth opening 1982 may suppress degradation of radiation performance of the second antenna 1961 by being arranged so that at least a portion of the second conductive support member 1980 does not overlap the second opening 1962 in the second conductive layer 1960 when viewed from above the third surface 1903. When a radiation current is provided to the second antenna 1961, an electromagnetic force generated from the second antenna 1961 may pass through the second opening 1962 and the fourth opening 1982 aligned therewith. The fourth opening 1982 prevents and / or reduces a reduction in magnetic flux due to the second conductive support member 1980, thereby ensuring radiation performance of the second antenna 1961. When the magnetic flux is not reduced, the electromagnetic wave energy increases due to the increase in the inductance value, thereby improving the radiation performance. According to various embodiments, the fourth opening 1982 may be implemented in various shapes so that when viewed from above the third surface 1903, the second conductive support member 1980 does not overlap with the second opening 1962. For example, the fourth opening 1982 may be formed in the form of a through hole or a notch.

[0328] According to some embodiments, when the radiation performance of the second antenna 1961 is ensured to be equal to or higher than the threshold level even if the fourth opening 1982 is not formed, the fourth opening 1982 may be omitted. In this case, the second conductive support member 1980 may be expanded to the position of the fourth opening 1982, and thus, the rigidity of the second conductive support member 1980 as a support member may be increased.

[0329] Fig. 20 FIG. 1 is a diagram showing a folded state according to various embodiments. Fig.19 A cross-sectional view of an electronic device 19 is shown.

[0330] Reference Fig. 20 In an embodiment, the electronic device 19 may be implemented as an external folding structure in which the screen is folded outward. When the electronic device 19 is in a folded state, the second surface 1902 and the fourth surface 1904 may be positioned close to each other to face each other, and the flexible display 1940 extending from the first surface 1901 to the third surface 1903 may be visually exposed.

[0331] According to various embodiments, the electronic device 19 may selectively electrically connect the first antenna 1951 or the second antenna 1961 corresponding to the surface facing the direction of gravity when the electronic device 19 is in the folded state to the wireless communication circuit. This may be an operation flow in which the user experience of placing the electronic device 19 with an external folding structure having an outward folding screen close to an external electronic device below the electronic device 19 is taken into consideration.

[0332] Fig.21 FIG. 1 is a diagram showing the electronic device 19 being implemented in an external folding structure according to various embodiments. Fig.19 Block diagram of electronic device 19.

[0333] Reference Fig.21 According to an embodiment, the electronic device 19 may include a first antenna 1951, a second antenna 1961, a wireless communication circuit 2120, a processor (e.g., including a processing circuit) 2130, a memory 2140, a sensor 2150 and / or a switch (or a switching circuit) 2160.

[0334] According to an embodiment, the first antenna 1951 and / or the second antenna 1961 may include, for example, one end (eg, Figure 5 The first connection point FP in the embodiment of the present invention extends to the other end (for example, Figure 5 The ground G may include, for example, a ring located at a second connection point GP in the Fig.13 The ground plane on the board assembly 1350.

[0335] According to an embodiment, the wireless communication circuit 2120 (eg Figure 1 The wireless communication module 192 in the embodiment may be implemented to send and / or receive a signal of a selected or predetermined frequency band through the first antenna 1951 or the second antenna 1961. According to an embodiment, the signal may be a first signal having a frequency of, for example, about 13.56 MHz for NFC, or a second signal having a frequency of, for example, about 300 kHz or lower (e.g., about 70 kHz) for MST. The structure including the first antenna 1951, the second antenna 1961, the wireless communication circuit 2120, the ground G, and the electrical paths therebetween may be referred to as an antenna device (or antenna system).

[0336] According to an embodiment, the switch (or switch circuit) 2160 may include a first terminal 2161, a second terminal 2162, and / or a third terminal 2163. The first terminal 2161 may be electrically connected to the wireless communication circuit 2120. The second terminal 2162 may be electrically connected to the first antenna 1951. The third terminal 2163 may be electrically connected to the second antenna 1961. Under the control of the processor 2130, the switch 2160 may electrically connect the first terminal 2161 to the second terminal 2162 or the third terminal 2163.

[0337] According to various embodiments, the switch 2160 may be included in the wireless communication circuit 2120 or the processor 2130 .

[0338] According to an embodiment, the electronic device 19 may be implemented such that the first antenna 1951 or the second antenna 1961 is selectively electrically connected to the wireless communication circuit 2120 based on the movement or orientation of the electronic device 19 .

[0339] According to various embodiments, the wireless communication circuit 2120 may include a first wireless communication circuit 2121 and a second wireless communication circuit 2122. According to an embodiment, the first wireless communication circuit 2121 may be located at Fig.19 The second wireless communication circuit 2122 may be located in the first portion 1910 of the foldable housing 1900. Fig.19 The foldable housing 1900 is shown in the second part 1920. When the switch 2160 electrically connects the first terminal 2161 to the second terminal 2162, the first wireless communication circuit 2121 can be electrically connected to the first antenna 1951. When the switch 2160 electrically connects the first terminal 2161 to the third terminal 2163, the second wireless communication circuit 2122 can be electrically connected to the second antenna 1961.

[0340] According to various embodiments, the wireless communication circuit 2120 may be located at Fig.19 The first part 1910 or the second part 1920 of the foldable housing 1900 shown in FIG. For example, the wireless communication circuit 2120 may be located in the first part 1910 where the processor 2130 or the memory 2140 is located. In this case, the second wireless communication circuit 2122 may be omitted, and the first wireless communication circuit 2121 may be electrically connected to the first antenna 1951 or the second antenna 1961 through the switch 2160.

[0341] According to an embodiment, the memory 2140 (eg Figure 1 The memory 130 in the processor 2130 (eg Figure 1 120) in the processor (e.g. Figure 1 140 in the program to control the antenna device including the first antenna 1951 and the second antenna 1961.

[0342] According to an embodiment, the memory 2140 may store an unfolding / folding state detection instruction 2141 , a direction detection instruction 2142 , and / or a switch control instruction 2143 .

[0343] According to an embodiment, the unfolded / folded state detection instruction 2141 may include allowing the processor 2130 to use the sensor 2150 to identify the unfolded state of the electronic device 19 (see, for example, Fig.19 ) or folded state (see for example Fig. 20 According to various embodiments, the expand / collapse state detection instruction 2141 may be substantially the same as Fig.15 The expansion / collapse state detection instruction 1541 is implemented identically or similarly, and the description of the method of detecting the expansion state or the collapse state will be omitted.

[0344] According to the embodiment, reference Fig.19 and Fig.21 , the direction detection instructions 2142 may include allowing the processor 2130 to detect the orientation of the electronic device 19 when the electronic device 19 is in the unfolded state (see, for example, Fig.19 ) in a state of using the sensor 2150 to identify the direction in which the first surface 1901 or the third surface 1903 or the second surface 1902 or the fourth surface 1904 is oriented based on the gravity direction. Fig. 20 and Fig.21 , the direction detection instructions 2142 may include allowing the processor 2130 to detect the orientation of the electronic device 19 when the electronic device 19 is in a folded state (see, for example, Fig. 20 ) in a state where the first surface 1901 or the third surface 1903 is oriented based on the direction of gravity using the sensor 2150.

[0345] According to an embodiment, the switch control instructions 2143 may include a routine that allows the processor 2130 to control the switch 2160 based on the orientation of the electronic device 19.

[0346] Fig. 22 is a diagram showing various embodiments Fig.21 Flowchart of exemplary operations 2200 of an electronic device. Fig.23A It is shown Fig. 22 The operation flow diagram, Fig. 23B is a diagram showing various embodiments Fig. 22 Flowchart of the operation.

[0347] According to the embodiment, reference Fig.21 and Fig. 22 In operation 2201, the processor 2130 may use the sensor 2150 to identify whether the electronic device 19 is in an unfolded state or a folded state.

[0348] According to the embodiment, reference Fig. 20 , Fig.21 and Fig. 22 When the electronic device 19 is recognized to be in the folded state, the processor 2130 may perform operation 2203. In operation 2203, the processor 2130 may use the sensor 2150 to recognize a first situation in which the first surface 1901 is oriented in the gravity direction or a second situation in which the third surface 1903 is oriented in the gravity direction.

[0349] According to the embodiment, reference Fig.21 and Fig.23A , when it is recognized that the electronic device 19 is in a folded state so that the first surface 1901 faces the first situation of gravity, in operation 2205, the processor 2130 can electrically connect the wireless communication circuit 2120 and the first antenna 1951. When the electronic device 19 is arranged so that the first surface 1901 is oriented in the direction of gravity, the first terminal 2161 and the second terminal 2162 of the switch 2160 can be electrically connected. This can be such an operation flow, in which the user experience of bringing the electronic device 19 close to the external electronic device 2300 below the electronic device 19 in the NFC or MST mode is taken into account. When the wireless communication circuit 2120 is electrically connected to the first antenna 1951, the communication identification range 19001 can be located on the first surface 1901. When the communication identification range 19001 of the first surface 1901 faces the communication identification range 2301 of the external electronic device 2300 and is close to the threshold distance (for example, 100mm, as the maximum identification distance), the electronic device 19 can exchange data with the external electronic device 2300 through the first antenna 1951.

[0350] According to the embodiment, reference Fig.21 and Fig. 23B, when it is identified that the electronic device 19 is in a folded state so that the third surface 1903 faces the second situation of gravity, in operation 2207, the processor 2130 can electrically connect the wireless communication circuit 2120 and the second antenna 1961. When the electronic device 19 is arranged so that the third surface 1903 is oriented in the direction of gravity, the first terminal 2161 and the third terminal 2163 of the switch 2160 can be electrically connected. This can be such an operation flow, in which the user experience of bringing the electronic device 19 close to the external electronic device 2300 below the electronic device 19 in the NFC or MST mode is taken into account. When the wireless communication circuit 2120 is electrically connected to the second antenna 1961, the communication identification range 19003 can be located on the third surface 1903. When the communication identification range 19003 of the third surface 1903 faces the communication identification range 2301 of the external electronic device 2300 and is close to the threshold distance (for example, 100mm, as the maximum identification distance), the electronic device 19 can exchange data with the external electronic device 2300 through the second antenna 1961.

[0351] According to various embodiments, reference Fig.19 , Fig.21 and Fig. 22 , when it is recognized that the electronic device 19 is in the unfolded state, the processor 2130 may perform operation 2209. In operation 2209, the processor 2130 may electrically connect the first antenna 1951 or the second antenna 1961 to the wireless communication circuit 2120. In various embodiments, the first terminal 2161 may be electrically connected to the second terminal 2162 or the third terminal 2163 according to whether the screen is in a landscape view or a portrait view. Fig.19 , the landscape view refers to a case where the third portion 1941 and the fourth portion 1942 of the flexible display 1940 are arranged horizontally, and the portrait view refers to a case where the third portion 1941 and the fourth portion 1942 of the flexible display 1940 are arranged vertically. According to some embodiments, in operation 2209, the processor 2130 may control the switch 2160 to electrically connect both the first antenna 1951 and the second antenna 1961 to the wireless communication circuit 2120.

[0352] Reference Fig.21 In various embodiments, the memory 2140 may be implemented to store an unfolding / folding state detection instruction 2141, a direction detection instruction 2142, and / or a switch control instruction 2143. According to various embodiments, the processor 2130 may be implemented to include a first controller configured to execute the unfolding / folding state detection instruction 2141, a second controller configured to execute the direction detection instruction 2142, and / or a third controller configured to execute the switch control instruction 2143.

[0353] Reference Fig.21According to various embodiments, the electronic device 19 may further include a frequency adjustment circuit (or matching circuit) (not shown), which is electrically connected to the electrical path between the wireless communication circuit 2120 and the first antenna 1951 and / or the electrical path between the wireless communication circuit 2120 and the second antenna 1961. In the unfolded or folded state, the frequency adjustment circuit (e.g., a tuner or a passive element) may match the impedance of the antenna device consisting of the wireless communication circuit 2120 and the antenna electrically connected thereto, may move the resonant frequency of the antenna device to a predetermined frequency, or may move the resonant frequency by a predetermined amount.

[0354] Fig.24 FIG. 1 is a diagram showing a folded state according to various embodiments. Fig.19 A cross-sectional view of an electronic device 19 is shown.

[0355] Reference Fig.24 In an embodiment, the electronic device 19 may be implemented as an inner folding structure in which the screen is folded inward. When the electronic device 19 is in a folded state, the first surface 1901 and the third surface 1903 may be close to each other to face each other, and the flexible display 1940 may not be visually exposed.

[0356] According to various embodiments, the electronic device 19 may further include a third antenna 2401 located in the first portion 1910 of the foldable housing 1900 and / or a fourth antenna 2402 located in the second portion 1920 of the foldable housing 1900. According to various embodiments, the structure of the first portion 1910 of the foldable housing 1900 and the various elements located therein may be different from the first portion 1910 of the foldable housing 1900. Figure 4 The structure of the second portion 1920 of the foldable housing 1900 and the various elements located therein may be similar to or substantially the same as the structure of Figure 4 The structures in are similar or substantially the same or similar.

[0357] According to an embodiment, the third antenna 2401 may be located in the first portion 1910 near the second surface 1902. For example, the third antenna 2401 may include Figure 3 or Figure 4 at least a portion of the third antenna structure 403.

[0358] According to an embodiment, the electronic device 19 may further include a second display 2420 (eg, Fig.14A The second display 2420 may be visibly exposed through the fourth surface 1904.

[0359] According to an embodiment, the electronic device 19 may include a third conductive layer 2430 (eg, Figure 3, Figure 4 or Figure 5 The third conductive layer 2430 may be located between the flexible display 1940 and the second conductive support member 1980. According to an embodiment, the third conductive layer 2430 may be located on the second display 2420.

[0360] According to an embodiment, the fourth antenna 2402 may be implemented based on the third conductive layer 2430. For example, the third conductive layer 2430 may include a fifth opening 2432 (eg, Figure 3 , Figure 4 or Figure 5 The third conductive layer 2430 may be electrically connected to a wireless communication circuit (eg, Figure 5 When the third conductive layer 2430 is electrically connected to the wireless communication circuit, at least a portion of the third conductive layer 2430 surrounding the fifth opening 2432 can function as the fourth antenna 2402. According to various embodiments, the fourth antenna 2402 is based on Figure 3 , Figure 4 or Figure 5 The first opening 431 in the conductive layer 430 realizes the loop antenna radiator, and can be connected with Figure 3 , Figure 4 or Figure 5 The first antenna structure 401 is implemented in substantially the same manner.

[0361] According to an embodiment, the fourth opening 1982 in the second conductive support member 1980 may at least partially overlap with the fifth opening 2432 in the third conductive layer 2430. The fourth opening 1982 may reduce the electromagnetic influence of the second conductive support member 1980 on the fourth antenna 2402 caused by the fifth opening 2432 in the third conductive layer 2430, thereby suppressing the degradation of radiation performance.

[0362] According to various embodiments, when viewed from above the fourth surface 1904, the fourth opening 1982 in the second conductive support member 1980 may overlap the entire fifth opening 2432 in the third conductive layer 2430. The fourth opening 1982 may suppress degradation of radiation performance of the fourth antenna 2402 by being arranged so that at least a portion of the second conductive support member 1980 does not overlap the fifth opening 2432 in the third conductive layer 2430 when viewed from above the fourth surface 1904. When a radiation current is provided to the fourth antenna 2402, an electromagnetic force generated from the fourth antenna 2402 may pass through the fifth opening 2432 and the fourth opening 1982 aligned therewith. The fourth opening 1982 prevents and / or reduces a reduction in magnetic flux caused by the second conductive support member 1980, thereby ensuring radiation performance of the fourth antenna 2402. When the magnetic flux is not reduced, electromagnetic wave energy increases due to an increase in inductance value, thereby improving radiation performance. According to various embodiments, the fourth opening 1982 may be implemented in various shapes such that the second conductive support member 1980 does not overlap with the fifth opening 2432 when viewed from above the fourth surface 1904 .

[0363] According to some embodiments, when the radiation performance of the fourth antenna 2402 is ensured to be equal to or higher than the threshold level even if the fourth opening 1982 is not formed, the fourth opening 1982 may be omitted. In this case, the second conductive support member 1980 may be expanded to the position of the fourth opening 1982, and thus, the rigidity of the second conductive support member 1980 as a support member may be increased.

[0364] According to some embodiments, the electronic device 19 may be implemented in a state where the second display 2420 is omitted. In this case, the fourth antenna 2402 may be located near the fourth surface 1904 within the second portion 1920 of the foldable housing 1900 and may be implemented as a Figure 3 or Figure 4 at least a portion of the third antenna structure 403.

[0365] According to some embodiments, the electronic device 19 may be implemented in a state where the first antenna 1951 and / or the second antenna 1961 is omitted.

[0366] According to various embodiments, with respect to the first antenna 1951, the second antenna 1961, the third antenna 2401, or the fourth antenna 2402, the Fig.14A , Fig. 14B and Fig.15 The components of the electronic device 11 shown in the figure are similar or the same as the components of the electronic device 19. For example, the first antenna 1951 can be Fig.14A , Fig. 14B and Fig.15The first loop antenna radiator 1401. For example, the second antenna 1961 can be Fig.14A , Fig. 14B and Fig.15 For example, the third antenna 2401 may be Fig.14A , Fig. 14B and Fig.15 The second loop antenna radiator 1402. For example, the fourth antenna 2402 may be Fig.14A , Fig. 14B and Fig.15 The fourth loop antenna radiator 1404. Depending on whether the electronic device 19 is in the unfolded state or the folded state, the electronic device 19 can perform an operation of selectively electrically connecting the antenna corresponding to the surface oriented in the gravity direction to the wireless communication circuit (for example, see Fig.16 , Fig.17A and Fig. 17B ).

[0367] For example, the electronic device 19 may selectively electrically connect the third antenna 2401 or the fourth antenna 2402 corresponding to the surface facing the direction of gravity when the electronic device 19 is in the folded state to the wireless communication circuit. This may be an operation flow in which the user experience of placing the electronic device 19 with an inner folding structure having an inward folding screen close to an external electronic device below the electronic device 19 is taken into consideration.

[0368] Fig.25 is a cross-sectional view showing an electronic device 25 having an inner folding structure in an unfolded state according to various embodiments.

[0369] Reference Fig.25 In an embodiment, the electronic device 25 may include a foldable housing 2500 , a first display 2540 , a second display 2550 , a first antenna 2560 , a conductive layer 2570 and / or a conductive support member 2580 .

[0370] According to an embodiment, the foldable housing 2500 may include a folding portion 2530, a first portion 2510, and a second portion 2520, wherein the first portion 2510 and the second portion 2520 are positioned such that the folding portion 2530 is located therebetween. Fig.19 The foldable housing 1900 is the same or similar. For example, the foldable portion 2530 may be Fig.19 The folded portion 1930. For example, the first portion 2510 may be Fig.19 The first part 1910. For example, the second part 2520 may be Fig.19For example, the first portion 2510 may include a first surface 2501 oriented along a first direction ① (eg, Fig.19 and a second surface 2502 oriented in a second direction ② opposite to the first direction ① (e.g., Fig.19 The second portion 2520 may include a third surface 2503 oriented along a third direction ③ (e.g., Fig.19 ) and a fourth surface 2504 oriented in a fourth direction ④ opposite to the third direction ③ (e.g., Fig.19 The fourth surface 1904 in FIG.

[0371] According to an embodiment, the first display 2540 may extend from the first surface 2501 to the third surface 2503. The first display 2540 may be, for example, Fig.19 Flexible display 1940.

[0372] According to an embodiment, the second display 2550 may be located within the second portion 2520 of the foldable housing 2500 and may be visibly exposed through the fourth surface 2504. The second display 2550 may be, for example, Fig.14A or Fig. 14B Sub-display 1193 or Fig.24 The second display 2420 is provided.

[0373] According to an embodiment, the first antenna 2560 may be located in the first portion 2510 of the foldable housing 2500. The first antenna 2560 may be located near the second surface 2502 in the first portion 2510. For example, the first antenna 2560 may include Figure 3 or Figure 4 According to various embodiments, the first antenna 2560 may be Fig.24 The third antenna 2401.

[0374] According to various embodiments, the structure of the second portion 2520 of the foldable housing 2500 and the various elements located therein may be similar to Figure 4 The structures in are similar or substantially the same or similar.

[0375] According to an embodiment, the conductive layer 2570 (eg, Figure 3 , Figure 4 or Figure 5 The conductive layer 430 in the embodiment may be located in the second portion 2520 of the foldable housing 2500. The conductive layer 2570 may be located, for example, between the second display 2550 and the conductive support member 2580. According to an embodiment, the conductive layer 2570 may be located on the second display 2550.

[0376] According to an embodiment, conductive layer 2570 may include first opening 2572 (eg, Figure 3 , Figure 4 or Figure 5 The conductive layer 2570 may be electrically connected to a wireless communication circuit (eg, Figure 5 When the conductive layer 2570 is electrically connected to the wireless communication circuit, at least a portion of the conductive layer 2570 surrounding the first opening 2572 can function as a second antenna 2571. According to various embodiments, the second antenna 2571 is based on Figure 3 , Figure 4 or Figure 5 The first opening 431 in the conductive layer 430 realizes the loop antenna radiator, and can be connected with Figure 3 , Figure 4 or Figure 5 The first antenna structure 401 is implemented in a substantially similar manner. According to various embodiments, the second antenna 2571 may be Fig.14A or the fourth loop antenna radiator 1404 of 14B or Fig.24 The fourth antenna 2402.

[0377] According to an embodiment, the conductive support member 2580 may be at least partially located between the conductive layer 2570 and the first display 2540. According to various embodiments, the conductive support member 2580 may include Figure 3 or Figure 4 The conductive portion 311 a included in the first supporting member 311 .

[0378] According to various embodiments, the conductive support member 2580 may include a second opening 2582 (eg, Figure 3 , Figure 4 or Figure 5 When viewed from above the fourth surface 2504, the second opening 2582 at least partially overlaps with the first opening 2572 in the conductive layer 2570. The second opening 2582 can reduce the electromagnetic influence of the conductive support member 2580 on the second antenna 2571 caused by the first opening 2572 in the conductive layer 2570, thereby suppressing the degradation of radiation performance.

[0379] According to various embodiments, the electronic device 25 may further include a non-conductive portion (eg, Figure 3 The non-conductive portion 311b in the conductive support member 2580 may be at least partially located in the second opening 2582 in the conductive support member 2580. The non-conductive portion may be coupled to the conductive support member 2580 to promote rigidity as a support member. According to various embodiments, the structure including the conductive support member 2580 and the non-conductive portion may be Figure 3 The first supporting member 311 is provided.

[0380] According to an embodiment, when viewed from above the fourth surface 2504, the second opening 2582 in the conductive support member 2580 may overlap the entire first opening 2572 in the conductive layer 2570. The second opening 2582 may suppress degradation of radiation performance of the second antenna 2571 by being arranged so that at least a portion of the conductive support member 2580 does not overlap the first opening 2572 in the conductive layer 2570 when viewed from above the fourth surface 2504. When a radiation current is provided to the second antenna 2571, an electromagnetic force generated from the second antenna 2571 may pass through the first opening 2572 and the second opening 2582 aligned therewith. The second opening 2582 prevents and / or reduces a reduction in magnetic flux caused by the conductive support member 2580, thereby ensuring radiation performance of the second antenna 2571. When the magnetic flux is not reduced, electromagnetic wave energy increases due to an increase in inductance value, thereby improving radiation performance. According to various embodiments, the second opening 2582 may be implemented in various shapes such that the conductive support member 2580 does not overlap the first opening 2572 when viewed from above the fourth surface 2504. For example, the second opening 2582 may be formed in the form of a through hole or a recess.

[0381] According to some embodiments, when the radiation performance of the second antenna 2571 is ensured to be equal to or higher than the threshold level even if the second opening 2582 is not formed, the second opening 2582 may be omitted. In this case, the conductive support member 2580 may be expanded to the position of the second opening 2582, and thus, the rigidity of the conductive support member 2580 as a support member may be increased.

[0382] Fig.26 FIG. 1 is a diagram showing a folded state according to various embodiments. Fig.25 A cross-sectional view of an electronic device 25 is shown.

[0383] Reference Fig.26 In an embodiment, when the electronic device 25 is in a folded state, the first surface 2501 and the third surface 2503 may be close to each other to face each other, and the first display 2540 extending from the first surface 2501 to the third surface 2503 may not be visually exposed.

[0384] According to various embodiments, the electronic device 25 may perform an operation of selectively electrically connecting the first antenna 2560 or the second antenna 2571 corresponding to the surface facing the direction of gravity when the electronic device 25 is in the folded state to the wireless communication circuit. This may be an operation flow in which the user experience of placing the electronic device 25 having an inner folding structure with an inwardly folded screen close to an external electronic device below the electronic device 25 is taken into consideration.

[0385] Fig. 27 is a diagram showing various embodiments Fig.25 A block diagram of an electronic device 25 is shown.

[0386] Reference Fig. 27 According to an embodiment, the electronic device 25 may include a first antenna 2560, a second antenna 2571, a wireless communication circuit 2720, a processor (e.g., including a processing circuit) 2730, a memory 2740, a sensor 2750 and / or a switch (or a switching circuit) 2760.

[0387] According to an embodiment, the second antenna 2571 may include, for example, one end (eg, Figure 5 The first connection point FP in the embodiment of the present invention extends to the other end (for example, Figure 5 The ground G may include, for example, a ring located at a second connection point GP in the Fig.13 The ground plane on the board assembly 1350.

[0388] According to an embodiment, the wireless communication circuit 2720 (eg Figure 1 The wireless communication module 192 in the embodiment may be implemented to send and / or receive a signal having a selected or predetermined frequency band through the first antenna 2560 or the second antenna 2571. According to an embodiment, the signal may be a first signal having a frequency of, for example, about 13.56 MHz for NFC, or a second signal having a frequency of, for example, about 300 kHz or less (e.g., about 70 kHz) for MST. The structure including the first antenna 2560, the second antenna 2571, the wireless communication circuit 2720, the ground G, and the electrical paths therebetween may be referred to as an antenna device (or antenna system).

[0389] According to an embodiment, the switch (or switch circuit) 2760 may include a first terminal 2761, a second terminal 2762, and / or a third terminal 2763. The first terminal 2761 may be electrically connected to the wireless communication circuit 2720. The second terminal 2762 may be electrically connected to the first antenna 2560. The third terminal 2763 may be electrically connected to the second antenna 2571. Under the control of the processor 2730, the switch 2760 may electrically connect the first terminal 2761 to the second terminal 2762 or the third terminal 2763.

[0390] According to various embodiments, the switch 2760 may be included in the wireless communication circuit 2720 or the processor 2730 .

[0391] According to an embodiment, the electronic device 25 may be implemented such that the first antenna 2560 or the second antenna 2571 is selectively electrically connected to the wireless communication circuit 2720 based on the movement or orientation of the electronic device 25 .

[0392] According to various embodiments (not shown), the wireless communication circuit 2720 may include a first wireless communication circuit and a second wireless communication circuit. The first wireless communication circuit may be located at Fig.25 The second wireless communication circuit may be located within the first portion 2510 of the foldable housing 2500. Fig.25 The foldable housing 2500 is shown in the second part 2520. When the switch 2760 electrically connects the first terminal 2761 to the second terminal 2762, the first wireless communication circuit can be electrically connected to the first antenna 2560. When the switch 2760 electrically connects the first terminal 2761 to the third terminal 2763, the second wireless communication circuit can be electrically connected to the second antenna 2571.

[0393] According to an embodiment, the memory 2740 (eg Figure 1 The memory 130 in the processor 2730 (eg Figure 1 120) in the processor (e.g. Figure 1 140 in the program) to control an antenna device including a first antenna 2560 and a second antenna 2571.

[0394] According to an embodiment, the memory 2740 may store an unfolding / folding state detection instruction 2741 , a direction detection instruction 2742 , and / or a switch control instruction 2743 .

[0395] According to an embodiment, the unfolded / folded state detection instruction 2741 may include allowing the processor 2730 to use the sensor 2750 to identify the unfolded state of the electronic device 25 (eg, see Fig.25 ) or folded state (see, for example, Fig.26 According to various embodiments, the expand / collapse state detection instruction 2741 may be substantially the same as Fig.15 The expanded / collapsed state detection instruction 1541 is the same or similar, and the description of the method of detecting the expanded state or the collapsed state will be omitted.

[0396] According to the embodiment, reference Fig.26 and Fig. 27 , the direction detection instructions 2742 may include a routine allowing the processor 2730 to use the sensor 2750 to identify the direction in which the second surface 2502 or the fourth surface 2504 is oriented based on the direction of gravity when the electronic device 25 is in a folded state.

[0397] According to an embodiment, the switch control instructions 2743 may include a routine that allows the processor 2730 to control the switch 2760 based on the orientation of the electronic device 25.

[0398] Fig.28 is a diagram showing various embodiments Fig. 27 Flowchart of exemplary operation 2800 of electronic device 25. Fig.29A Yes Description Fig.28 A diagram of the operation flow; Fig.29B According to various embodiments Fig.28 Flowchart of the operation.

[0399] According to the embodiment, reference Fig. 27 and Fig.28 In operation 2801, the processor 2730 may use the sensor 2750 to identify whether the electronic device 25 is in an unfolded state or a folded state.

[0400] According to the embodiment, reference Fig.26 , Fig. 27 and Fig.28 When the electronic device 25 is recognized to be in the folded state, the processor 2730 may perform operation 2803. In operation 2803, the processor 2730 may use the sensor 2750 to recognize a first case where the second surface 2502 is oriented in the gravity direction or a second case where the fourth surface 2504 is oriented in the gravity direction.

[0401] According to the embodiment, reference Fig. 27 , Fig.28 and Fig.29A , when the first situation that the electronic device 25 is in a folded state so that the second surface 2502 faces the direction of gravity is identified, the processor 2730 can electrically connect the wireless communication circuit 2720 and the first antenna 2560 in operation 2805. When the electronic device 25 is arranged so that the second surface 2502 is oriented in the direction of gravity, the first terminal 2761 and the second terminal 2762 of the switch 2760 can be electrically connected. This can be such an operation flow, in which the user experience of bringing the electronic device 25 close to the external electronic device 2900 below the electronic device 25 in the NFC or MST mode is taken into account. When the wireless communication circuit 2720 is electrically connected to the first antenna 2560, the communication identification range 25001 can be located on the second surface 2502. When the communication identification range 25001 of the second surface 2502 faces the communication identification range 2901 of the external electronic device 2900 and is close to the threshold distance (e.g., 100mm, as the maximum identification distance), the electronic device 25 can exchange data with the external electronic device 2900 through the first antenna 2560.

[0402] According to the embodiment, reference Fig. 27 , Fig.28 and Fig.29A, when it is identified that the electronic device 25 is in a folded state so that the fourth surface 2504 is oriented in the direction of gravity, the processor 2730 can electrically connect the wireless communication circuit 2720 and the second antenna 2571 in operation 2807. When the electronic device 25 is arranged so that the fourth surface 2504 is oriented in the direction of gravity, the first terminal 2761 and the third terminal 2763 of the switch 2760 can be electrically connected. This can be such an operation flow, in which the user experience of bringing the electronic device 25 close to the external electronic device 2900 below the electronic device 25 in the NFC or MST mode is taken into account. When the wireless communication circuit 2720 is electrically connected to the second antenna 2571, the communication identification range 25002 can be located on the fourth surface 2504. When the communication identification range 25002 of the fourth surface 2504 faces the communication identification range 2901 of the external electronic device 2900 and is close to the threshold distance (e.g., 100mm, as the maximum identification distance), the electronic device 25 can exchange data with the external electronic device 2900 through the second antenna 2571.

[0403] According to various embodiments, reference Fig.25 , Fig. 27 and Fig.28 , when it is recognized that the electronic device 25 is in the unfolded state, the processor 2730 may perform operation 2809. In operation 2809, the processor 2730 may electrically connect the first antenna 2560 or the second antenna 2571 to the wireless communication circuit 2720. In various embodiments, the first terminal 2761 may be electrically connected to the second terminal 2762 or the third terminal 2763 according to whether the screen is in a landscape view or a portrait view. Fig.25 , the landscape view refers to the case where the first surface 2501 and the third surface 2503 are arranged horizontally, and the portrait view refers to the case where the first surface 2501 and the third surface 2503 are arranged vertically. According to some embodiments, in operation 2809, the processor 2730 may control the switch 2760 to electrically connect both the first antenna 2560 and the second antenna 2571 to the wireless communication circuit 2720.

[0404] Reference Fig. 27 In various embodiments, the processor 2730 may be implemented to store an unfolding / folding state detection instruction 2741, a direction detection instruction 2742, and / or a switch control instruction 2743. According to various embodiments, the processor 2730 may be implemented to include a first controller configured to execute the unfolding / folding state detection instruction 2741, a second controller configured to execute the direction detection instruction 2742, and / or a third controller configured to execute the switch control instruction 2743.

[0405] Reference Fig. 27According to various embodiments, the electronic device 25 may further include a frequency adjustment circuit (or matching circuit) (not shown), which is electrically connected to the electrical path between the wireless communication circuit 2720 and the first antenna 2560 and / or the electrical path between the wireless communication circuit 2720 and the second antenna 2571. In the unfolded or folded state, the frequency adjustment circuit (e.g., a tuner or a passive element) may match the impedance of the antenna device consisting of the wireless communication circuit 2720 and the antenna electrically connected thereto, may move the resonant frequency of the antenna device to a predetermined frequency, or may move the resonant frequency by a predetermined amount.

[0406] According to various embodiments, the present disclosure may be applied to an electronic device including a plurality of housing structures, the housing structure including an inward folding structure and / or an outward folding structure. Depending on whether the electronic device is in an unfolded state or a folded state, the electronic device may selectively electrically connect a loop antenna radiator corresponding to a surface oriented in the direction of gravity to a wireless communication circuit.

[0407] Fig.30 is a diagram illustrating an exemplary wearable electronic device 3000 according to various embodiments.

[0408] Reference Fig.30 The wearable electronic device 3000 may be, for example, a watch-type electronic device. According to an embodiment, the wearable electronic device 3000 has Figure 3 or Figure 4 The electronic device 200 has a different shape from that of the electronic device 200, but may include at least one component having substantially the same function as that of the components included in the electronic device 200.

[0409] For example, the wearable electronic device 3000 may include a housing structure (eg, Figure 2A The housing 210 in the embodiment includes a front plate (eg, Figure 3 or Figure 4 The front plate 202 in the figure), the rear plate (e.g., Figure 3 or Figure 4 The rear panel 211 in the embodiment of the present invention) and / or the side frame structure (for example, Figure 3 or Figure 4 The housing structure may include a first surface 3010A (eg, Figure 3 or Figure 4 a first surface 210A in the middle), a second surface 3010B facing away from the first surface 3010A (e.g., Figure 4 210B in the middle), or a side surface 3010C surrounding at least a portion of the space between the first surface 3010A and the second surface 3010B (e.g., Figure 2AThe wearable electronic device 3000 may include a display (e.g., a display device 3000a) disposed between the front panel and the rear panel. Figure 3 or Figure 4 The wearable electronic device 3000 may include a support member (e.g., Figure 3 or Figure 4 The wearable electronic device 3000 may include a printed circuit board (eg, Figure 4 The first printed circuit board 440 in the embodiment of the present invention is located between the support member and the back plate and has a wireless communication circuit (e.g., Figure 5 The wireless communication circuit 510 in the embodiment of the present invention) and the ground (for example, Figure 5 The wearable electronic device 3000 may include a battery (eg, Figure 3 The wearable electronic device 3000 may also include various other elements. The wearable electronic device 3000 may include a first band (or first strap) 3020 and a second band (or second strap) 3030 connected to the side frame structure. The first band 3020 and the second band 3030 are parts that surround the user's wrist when the wearable electronic device 3000 is worn on the user's wrist, and may be connected to opposite sides of the side frame structure, respectively.

[0410] According to an embodiment, the wearable electronic device 3000 may include a display (eg, Figure 4 201) and a rear panel (eg, Figure 4 The conductive layer (eg, Figure 3 or Figure 4 The conductive layer 430 in the support member (e.g., Figure 3 The first support member 311 in the embodiment of the present invention may be positioned between the conductive layer and the rear plate. According to an embodiment, the conductive layer may include a first opening (eg, Figure 3 or Figure 4 The wireless communication circuit (eg, Figure 5 The wireless communication circuit 510 in the support member is electrically connected to the conductive layer and can be configured to send and / or receive a signal of a selected or predetermined frequency band through at least a portion of the conductive layer surrounding the first opening. According to an embodiment, the support member may include a second opening (e.g., Figure 3 or Figure 4The second opening 3112 in the conductive layer can be used to reduce the impact of the support member on the antenna structure (eg, Figure 3 or Figure 4 The electromagnetic influence of the first antenna structure 401 in the embodiment is used to suppress the degradation of radiation performance. The signal of the selected or predetermined frequency band may have, for example, a frequency for NFC or a frequency for MST. According to an embodiment, the wearable electronic device 3000 may include Figure 5 Antenna device 500, Fig. 9 Antenna device 900 or Fig.10 Antenna device 1000.

[0411] According to an embodiment, the wearable electronic device 3000 may include a loop antenna radiator 3011. The loop antenna radiator 3011 may include, for example Figure 5 The first antenna structure 401. The loop antenna radiator 3011 may include Figure 5 The first antenna structure 401 and the second antenna structure 402. The loop antenna radiator 3011 may include a first antenna structure 401 and a ... Figure 5 The wireless communication circuit 510 in the embodiment of the present invention extends to the other end and is electrically connected to the ground (for example, Figure 5 When the loop antenna radiator 3011 is electrically connected to the wireless communication circuit, the communication identification range 3001 (for example Figure 2A The first communication identification range 2001 in the wearable electronic device 3000 may be located on the first surface 3010A. When the communication identification range 3001 of the first surface 3010A faces the communication identification range 3101 of the external electronic device 3100 and is close to the threshold distance (e.g., 100 mm, as the maximum identification distance), the wearable electronic device 3000 may exchange data with the external electronic device 3100 through the loop antenna radiator 3011.

[0412] According to various embodiments, Fig.30 The wearable electronic device 3000 may be implemented as various other types of wearable electronic devices.

[0413] According to an exemplary embodiment, an electronic device (eg Figure 4 The electronic device 200 in the embodiment may include a housing (eg Figure 2A The housing 210 in the embodiment includes a first surface (e.g. Figure 4 The first surface 210A in the figure) and the second surface facing away from the first surface (eg Figure 4 The electronic device may include a display (eg, Figure 3 or Figure 4The electronic device may include a conductive layer (e.g., a display 201 in the housing) that is at least partially contained in the housing and can be seen through the first surface. Figure 3 or Figure 4 The conductive layer 430 is disposed between the display and the second surface and includes a first opening (eg, Figure 3 or Figure 4 The electronic device may include a support member (eg, Figure 3 or Figure 4 The first support member 311 in the embodiment of the present invention is disposed between the second surface and the conductive layer and includes a conductive portion (e.g., Figure 3 or Figure 4 The electronic device may include wireless communication circuitry (e.g., Figure 5 The wireless communication circuit 510 in the embodiment of the present invention is electrically connected to the conductive layer and is configured to communicate with the conductive layer through an antenna (e.g., Figure 3 or Figure 5 The first antenna structure 401 in the embodiment sends and / or receives signals, and the antenna includes at least a portion of the conductive layer surrounding the first opening.

[0414] According to an exemplary embodiment of the present disclosure, the signal of the selected or predetermined frequency band may have a frequency of, for example, about 13.56 MHz or less than 300 kHz.

[0415] According to an exemplary embodiment, the conductive layer (eg, Figure 3 or Figure 4 The conductive layer 430 in the embodiment may be relatively close to the first opening (eg, Figure 3 or Figure 4 The first position of the first opening 431) (eg, Figure 5 The first connection point FP in the embodiment is electrically connected to the wireless communication circuit (for example, Figure 5 The conductive layer may be located at a second position relatively close to the first opening (eg, Figure 5 The second connection point GP in the embodiment is electrically connected to the ground (eg, Figure 5 The conductive layer extends from the first position to at least a portion of the second position (eg, Figure 5 The edge E in may have such a length (e.g., Figure 5 The length D) in the middle can form a resonance of the frequency of the signal of the selected and / or predetermined frequency band.

[0416] According to an exemplary embodiment, an electronic device (eg, Figure 3 or Figure 4The electronic device 200) may further include a printed circuit board (eg, a first printed circuit board 440) disposed on a support member (eg, Figure 3 or Figure 4 The first support member 311 in the embodiment of the present invention and the second surface (eg, Figure 4 between the second surface 210B in the embodiment of the present invention, and the wireless communication circuit (e.g., Figure 5 The wireless communication circuit 510 in the embodiment of the present invention) and the ground (for example, Figure 5 The ground G) is located on the printed circuit board.

[0417] According to an exemplary embodiment, an electronic device (eg, Figure 3 or Figure 4 The electronic device 200 in the embodiment may further include a flexible conductive member, the flexible conductive member including a conductive member disposed on a support member (eg, Figure 3 or Figure 4 The first support member 311 in the embodiment of the present invention and the printed circuit board (eg, Figure 4 The conductive material (eg, Figure 3 The first flexible conductive member 391 and the second flexible conductive member 392 in the embodiment of the present invention are electrically connected to the wireless communication circuit (for example, Figure 5 The wireless communication circuit 510 in the embodiment of the present invention) and the conductive layer (eg, Figure 3 or Figure 4 The conductive layer 430 in the first position (eg, Figure 5 The first connection point FP in the circuit) or the electrical connection ground (for example, Figure 5 G in the conductive layer) and a second location of the conductive layer (eg, Figure 5 The second connection point GP in the circuit).

[0418] According to an exemplary embodiment, the conductive portion (eg, Figure 3 or Figure 4 The conductive portion 311a in the embodiment may include at least partially connected to the first opening (eg, Figure 3 or Figure 4 The first opening 431 in the embodiment overlaps the second opening (eg, Figure 3 or Figure 4 The second opening 3112 in the housing).

[0419] According to an exemplary embodiment, an electronic device (eg, Figure 3 The electronic device 200 in the embodiment may also include a battery (eg, Figure 3 The battery can be disposed in the first opening (e.g., Figure 3 or Figure 4 The first opening 431 in the embodiment of the present invention) and the second opening (eg, Figure 3 or Figure 4The area overlapping the second opening 3112 in the second surface (eg, Figure 4 between the second surface 210B).

[0420] According to an exemplary embodiment, an electronic device (eg, Figure 3 or Figure 4 The electronic device 200) may further include a device at least partially disposed in the second opening (eg, Figure 3 or Figure 4 The non-conductive material (eg, Figure 3 or Figure 4 The non-conductive portion 311b in.

[0421] According to an exemplary embodiment, an electronic device (eg, Figure 4 The electronic device 200 in the embodiment may further include a conductive layer (eg, Figure 4 The conductive layer 430 in the embodiment of the present invention) and the conductive portion (eg, Figure 4 The conductive adhesive (eg, Figure 4 The conductive material 409 in the embodiment of the present invention.

[0422] According to an exemplary embodiment, an electronic device (eg, Figure 3 or Figure 4 The electronic device 200) may further include at least one coil (eg, Figure 3 or Figure 4 The third antenna structure 403 in the embodiment is disposed on a support member (eg, Figure 3 The first support member 311 in the embodiment of the present invention and the second surface (eg, Figure 4 between the second surface 210B in the embodiment of the present invention, and is configured to be electrically connected to a wireless communication circuit (e.g., Figure 5 Wireless communication circuitry 510 in the wireless communication module 510) is used to send and / or receive signals having a selected and / or predetermined frequency.

[0423] According to an exemplary embodiment, an electronic device (eg, Figure 6 The electronic device 600 in the embodiment may also include a sensor (e.g., Figure 6 Sensor 650 in), switch (e.g., Figure 6 , a switch 660 in the Figure 6 640) and a processor (e.g., Figure 6 The switch may include a processor 630 electrically connected to the wireless communication circuit (e.g., Figure 6 A first terminal (eg, Figure 6 The first terminal 661 in the embodiment is electrically connected to the conductive layer (eg, Figure 3 or Figure 4The second terminal (eg, Figure 6 , and electrically connected to at least one coil (eg, Figure 6 The third terminal (eg, Figure 6 The memory may store instructions that, when executed, cause the processor to: based on identifying the first surface (eg, Figure 4 The switch is controlled to electrically connect the first terminal and the second terminal based on the first surface 210A in the image (eg, the first surface 210A in the image) facing the direction of gravity, and the second surface (eg, the second surface 210A in the image) is recognized by the sensor. Figure 4 The second surface 210B in the embodiment faces the direction of gravity to electrically connect the first terminal and the third terminal.

[0424] According to an exemplary embodiment, an electronic device (eg, Fig.19 The electronic device 19 in the embodiment may include a foldable housing (e.g., Fig.19 The foldable housing 1900 in FIG. 1 ). The foldable housing may include a first housing portion (eg, Fig.19 The first housing portion 1910 includes a first housing portion along a first direction (eg, Fig.19 A first surface (eg, Fig.19 a first surface 1901 in the middle) and a second direction opposite to the first direction (e.g., Fig.19 A second surface oriented in a second direction ②) (e.g., Fig.19 The foldable housing may include a second housing portion (e.g., Fig.19 The second housing portion 1920 includes a second housing portion along a third direction (eg, Fig.19 A third surface oriented in the third direction ③) (e.g., Fig.19 1903) and along a fourth direction opposite to the third direction (e.g., Fig.19 A fourth surface oriented in a fourth direction ④) (e.g., Fig.19 The electronic device may include a flexible display extending from the first surface to the third surface (eg, Fig.19 The electronic device may include a first housing portion including a first opening (eg, Fig.19 A first conductive layer (eg, a first opening 1952 in the Fig.19 The electronic device may include a second housing portion including a second opening (eg, Fig.19 A second conductive layer (eg, Fig.19The electronic device may include a first conductive support member (eg, Fig.19 The electronic device may include a second conductive support member (eg, Fig.19 The electronic device may include at least one wireless communication circuit (e.g., Fig.21 The wireless communication circuit 2120 in the embodiment of the present invention). The wireless communication circuit can be configured as a first antenna (eg, a first antenna) that is electrically connected to the first conductive layer and includes at least a portion of the first conductive layer surrounding the first opening. Fig.19 or Fig.21 The wireless communication circuit can be configured to transmit and / or receive signals based on the second antenna 1951 in the first conductive layer and the second conductive layer including at least a portion of the second conductive layer surrounding the second opening (for example, Fig.19 or Fig.21 The second antenna 1961) sends and / or receives signals.

[0425] According to an exemplary embodiment, the first conductive support (eg, Fig.19 The first conductive support member 1970 in the embodiment may include at least partially connected to the first opening (eg, Fig.19 The first opening 1952 in the embodiment of the present invention overlaps the third opening (eg, Fig.19 The third opening 1972 in the drawing).

[0426] According to an exemplary embodiment, the second conductive support (eg, Fig.19 The second conductive support member 1980 in the embodiment may include at least partially connected to the second opening (eg, Fig.19 The fourth opening (eg, Fig.19 The fourth opening in 1982).

[0427] According to an exemplary embodiment, at least one wireless communication circuit (e.g., Fig.21 The wireless communication circuit 2120 in the embodiment may include a first housing portion (eg, Fig.19 The first portion 1910 in the embodiment is configured to pass through a first antenna (eg, Fig.19 or Fig.21 A first wireless communication circuit (eg, a first antenna 1951 in the embodiment) that sends and / or receives signals Fig.21 At least one wireless communication circuit may include a first wireless communication circuit 2121 disposed in the second housing portion (e.g., Fig.191920) and is configured to pass through a second antenna (e.g., Fig.19 or Fig.21 A second wireless communication circuit (eg, a second antenna 1961 in the embodiment) that sends and / or receives signals Fig.21 The second wireless communication circuit 2122 in the wireless communication circuit 2122).

[0428] According to an exemplary embodiment, based on a foldable housing (e.g., Fig.24 The foldable housing 1900 in the embodiment is in a folded state, and the first surface (eg, Fig.19 The first surface 1901 in the embodiment may face the third surface (eg, Fig.19 The third surface 1903 in the figure).

[0429] According to an exemplary embodiment, an electronic device (eg, Fig.24 The electronic device 19) may also include a third antenna (eg, Fig.24 The third antenna 2401 in the first housing portion (eg, Fig.24 The first portion 1910 in the first conductive support member (eg, Fig.24 The first conductive support member 1970 and the second surface (eg, Fig.24 The electronic device may further include a fourth antenna (eg, Fig.24 The fourth antenna 2402 in the second housing portion (eg, Fig.24 The second portion 1920 in the second conductive support member (eg, Fig.24 The second conductive support member 1980) and the fourth surface (eg, Fig.24 Based on the foldable housing being in the folded state, at least one wireless communication circuit (eg, Fig.15 The wireless communication circuit 1520 in the embodiment may be electrically connected to the third antenna or the fourth antenna to send and / or receive signals.

[0430] According to an exemplary embodiment, based on a foldable housing (e.g., Fig. 20 The foldable housing 19 in the embodiment is in a folded state, and the second surface (eg, Fig. 20 The second surface 1902 in the embodiment may face the fourth surface (eg, Fig. 20 The fourth surface 1904 in FIG.

[0431] According to an exemplary embodiment, based on the foldable housing being in the folded state, at least one wireless communication circuit (eg Fig.21 The wireless communication circuit 2120 in the embodiment may be electrically connected to the first conductive layer (eg Fig.21 The first conductive layer 1950) or the second conductive layer (eg Fig.21 The second conductive layer 1960 in the embodiment of the present invention.

[0432] According to an exemplary embodiment, an electronic device (eg, Fig.25 The electronic device 25 in the embodiment may include a foldable housing (e.g., Fig.25 The foldable housing 2500 in FIG. 2 may include a first housing portion (eg, Fig.25 The first housing portion 2510 includes a first housing portion along a first direction (eg, Fig.25 A first surface (eg, Fig.25 a first surface 2501 in the middle) and a second direction opposite to the first direction (e.g., Fig.25 A second surface oriented in a second direction ②) (e.g., Fig.25 The foldable housing may include a second housing portion (e.g., Fig.25 The second housing portion 2520 includes a second housing portion along a third direction (eg, Fig.25 A third surface oriented in the third direction ③) (e.g., Fig.25 and along a fourth direction opposite to the third direction (e.g., Fig.25 A fourth surface oriented in a fourth direction ④) (e.g., Fig.25 The electronic device may include a flexible display extending from the first surface to the third surface (eg, Fig.25 The electronic device may include a conductive layer (eg, Fig.25 The conductive layer 2570 in the second housing portion is disposed within the second housing portion and includes a first opening (e.g., Fig.25 The electronic device may include a conductive support member (eg, Fig.25 The electronic device may include a first antenna (eg, a first antenna configured to be electrically connected to the conductive layer and to pass through at least a portion of the conductive layer surrounding the first opening) based on the conductive connection to the conductive layer. Fig.25 A wireless communication circuit (e.g., a second antenna structure 2571 in the embodiment of the present invention) that sends and / or receives signals. Fig. 27 Wireless communication circuit 2720 in.

[0433] According to an exemplary embodiment, a conductive support member (eg, Fig.25 The conductive support member 2580 in the embodiment may include at least partially connected to the first opening (eg, Fig.25 The first opening 2572 in the embodiment overlaps the second opening (eg, Fig.25 The second opening 2582 in the embodiment of the present invention.

[0434] According to an exemplary embodiment, an electronic device (eg, Fig.25 The electronic device 25) may further include a second display (eg, Fig.25 The second display 2550 in the second housing portion (eg, Fig.25 The second portion 252 in the embodiment of the present invention can be formed by a fourth surface (e.g., Fig.25 The fourth surface 2504 in FIG. 2 is seen. The conductive layer (eg, Fig.25 The conductive layer 2570 in may be at least partially disposed between the conductive support and the second display.

[0435] According to an exemplary embodiment, an electronic device (eg, Fig.25 The electronic device 25 in the embodiment may also include a first housing portion (eg, Fig.25 The second antenna (eg, Fig.25 The first antenna 2560 in the wireless communication circuit (e.g., Fig. 27 The wireless communication circuit 2720 in the embodiment may be based on a foldable housing (e.g., Fig.25 The foldable housing 2500 in FIG. 2 is in a folded state and electrically connected to the first antenna (eg, Fig.26 The second antenna 2571 in (see, e.g. Fig.26 ).

[0436] According to an exemplary embodiment, an electronic device may include a display, a back cover, and a conductive layer, wherein the back cover is disposed on a side opposite to the display, the conductive layer is configured to provide electromagnetic interference (EMI) shielding to the display, and the conductive layer is disposed between the display and the back cover and includes an opening. The electronic device may include a communication circuit configured to transmit / receive a signal through the display to / from the outside through an antenna, and the antenna includes at least a portion of the conductive layer surrounding the opening.

[0437] According to an exemplary embodiment, the electronic device may further include a support member disposed between the conductive layer and the back cover and including a conductive portion. The conductive portion may include another opening at least partially overlapping the opening.

[0438] According to an exemplary embodiment, the electronic device may further include a non-conductive material disposed in another opening.

[0439] According to an exemplary embodiment, the electronic device may further include a conductive adhesive disposed between the conductive layer and the conductive portion.

[0440] According to an exemplary embodiment, the electronic device may further include a battery disposed between the support and the back cover. The opening in the conductive layer and another opening in the support may at least partially overlap with the battery.

[0441] According to an exemplary embodiment, the electronic device may further include another antenna disposed between the conductive layer and the back cover. The other antenna may be configured to transmit and / or receive a signal through the back cover to the outside based on an electrical connection with the communication circuit.

[0442] According to an exemplary embodiment, an opening-based antenna or another antenna may be selectively electrically connected to a communication circuit based on a movement or orientation of an electronic device.

[0443] According to an exemplary embodiment, the signal may have a frequency of, for example, approximately 13.56 MHz.

[0444] According to an exemplary embodiment, an electronic device may include a display and a first antenna and a second antenna, the first antenna and the second antenna being configured to transmit and / or receive a signal through the display to or from the outside, the first antenna and the second antenna being arranged to be spaced apart from each other, wherein a folded portion of the display is inserted between the first antenna and the second antenna. The electronic device may include a communication circuit, the communication circuit being configured to be electrically connected to the first antenna or the second antenna in a state where the electronic device is folded so that the display is folded outward.

[0445] According to an exemplary embodiment, the first antenna or the second antenna may be selectively electrically connected to the communication circuit based on the movement or orientation of the electronic device in the folded state.

[0446] According to an exemplary embodiment, the first antenna or the second antenna may be based on an opening included in a conductive layer at least partially disposed on a rear surface of the display and at least a portion of the conductive layer surrounding the opening.

[0447] According to an exemplary embodiment, the electronic device may further include a support member disposed to be spaced apart from the display with the conductive layer interposed therebetween, the support member including a conductive portion. The conductive portion may include another opening at least partially overlapping the opening.

[0448] According to an exemplary embodiment, the electronic device may further include a non-conductive material disposed in another opening.

[0449] According to an exemplary embodiment, the electronic device may further include a conductive adhesive disposed between the conductive layer and the conductive portion.

[0450] According to an exemplary embodiment, the electronic device may further include a battery disposed to be spaced apart from the display with the support interposed therebetween. The opening in the conductive layer and the other opening in the support may at least partially overlap with the battery.

[0451] According to an exemplary embodiment, the electronic device may further include a switch circuit configured to selectively electrically connect the first antenna or the second antenna to the communication circuit.

[0452] According to an exemplary embodiment, the communication circuit may include a switching circuit.

[0453] According to an exemplary embodiment, the signal may have a frequency of, for example, approximately 13.56 MHz.

[0454] According to an exemplary embodiment, an electronic device may include a communication circuit, a housing, a display, and a board, wherein the housing includes a first surface of the electronic device and a second surface oriented in a direction different from the direction in which the first surface is oriented, the display is visible through the first surface, and the board is disposed between the display and the second surface and includes a conductive material. The board may include an opening therein, and a portion of the board surrounding the opening may include at least a portion of the first antenna. The electronic device may include a second antenna, which is configured to be able to transmit and / or receive signals in a direction at least partially different from the first antenna. The first antenna and / or the second antenna may be configured to be selectively electrically connected to the communication circuit based at least in part on a folded state of the electronic device.

[0455] According to an exemplary embodiment, the electronic device may further include a support member disposed between the board and the second surface and including a conductive portion. The conductive portion may have another opening formed therein. When viewed from a direction substantially perpendicular to the first surface, the opening and the other opening may at least partially overlap each other.

[0456] According to an exemplary embodiment, a portable communication device may include a display, a communication circuit, and a plurality of antennas including a first antenna and a second antenna. At least one of the first antenna or the second antenna may be configured to send a signal to the outside of the portable communication device through the display and / or receive a signal from the outside of the portable communication device. The first antenna or the second antenna may be configured to be electrically connected to the communication circuit based at least in part on a folded state of the portable communication device.

[0457] According to an exemplary embodiment, an electronic device may include a housing including a first surface of a portable communication device and a second surface oriented in a direction different from the direction in which the first surface is oriented. The display may be visible through the first surface. The electronic device may include a plate disposed between the first surface and the second surface and including a conductive material. The plate may include an opening, and a portion of the plate surrounding the opening may include a first antenna.

[0458] According to an exemplary embodiment, the electronic device may further include a support member disposed between the board and the second surface and including a conductive material. The support member may have another opening formed therein. When viewed from a direction substantially perpendicular to the first surface, the opening and the other opening may at least partially overlap each other.

[0459] According to an exemplary embodiment, the second antenna may be disposed between the support and the second surface.

[0460] According to various exemplary embodiments, the electronic device may include a housing including a first surface of the portable communication device and a second surface oriented in a direction different from the direction in which the first surface is oriented. The display may be visible through the first surface. The first antenna may be configured to send a signal to the outside through the first surface and / or receive at least a portion of the signal from the outside. The second antenna may be configured to send a signal to the outside through the second surface and / or receive at least a portion of the signal from the outside.

[0461] According to an exemplary embodiment, the first antenna and the second antenna may be configured to transmit a signal to the outside through the display and / or receive a signal from the outside.

[0462] According to an exemplary embodiment, the communication circuit is configured to be based on the portable communication device being at least partially folded outward so that a first area of ​​the display is oriented in a first direction and a second area of ​​the display is oriented in a second direction different from the first direction, so as to: use the first antenna to send at least a portion of the signal to the outside and / or receive at least a portion of the signal from the outside through the first area; and use the second antenna to send at least a portion of the signal to the outside and / or receive at least a portion of the signal from the outside through the second area.

[0463] According to an exemplary embodiment, the first antenna or the second antenna may be configured to be selectively electrically connected to the communication circuit further based on the movement or orientation of the portable communication device.

[0464] According to various exemplary embodiments, the electronic device may include a housing including a first surface of the portable communication device and a second surface different from the first surface. The display may be visible through the first surface. The first antenna and the second antenna may be configured to use the first antenna to send signals to the outside and / or receive signals from the outside through the display based on the portable communication device being in a first folded state. The communication circuit may be configured to use the second antenna to send signals to the outside and / or receive at least a portion of signals from the outside through the second surface based on the portable communication device being in a second folded state.

[0465] According to an exemplary embodiment, a portable communication device may include a housing, a display, and a board, wherein the housing includes a first surface of the electronic device and a second surface oriented in a direction different from the direction oriented by the first surface, the display is visible through the first surface, and the board is disposed between the display and the second surface and includes a conductive material. The board may include a first opening, and a portion of the board surrounding the first opening may constitute at least a portion of the antenna. The electronic device may include a support disposed between the board and the second surface and including a conductive portion. The conductive portion may include a second opening. When viewed from a direction substantially perpendicular to the first surface, the first opening and the second opening may at least partially overlap each other.

[0466] According to an exemplary embodiment, the electronic device may further include another antenna between the support and the second surface.

[0467] According to an exemplary embodiment, the antenna or another antenna may be configured to be selectively electrically connected to the communication circuit based at least in part on a folded state of the portable communication device.

[0468] According to example embodiments, a non-conductive material may be disposed in at least a portion of the second opening.

[0469] Although the present disclosure has been illustrated and described with reference to various exemplary embodiments, it should be understood that the various exemplary embodiments are intended to be illustrative rather than restrictive. It will be further understood by those skilled in the art that various changes may be made in form and detail without departing from the true spirit and full scope of the present disclosure (including the appended claims and their equivalents).

Claims

1. Electronic equipment, including: Communication circuits; a housing, comprising a first surface of the electronic device and a second surface of the electronic device, wherein an orientation direction of the second surface is different from an orientation direction of the first surface; a display, viewable through said first surface; a first plate disposed at least between the display and the second surface and comprising a conductive material, wherein the first plate comprises a first opening, and a portion of the first plate surrounding the first opening comprises a first antenna; a support member disposed at least between the first plate and the second surface and including a conductive portion; as well as a second antenna disposed in the housing and configured to transmit and / or receive signals with respect to at least one direction different from the direction in which the first antenna transmits and / or receives signals, wherein the first antenna or the second antenna is configured to be selectively electrically connected to the communication circuit based at least in part on a folded state of the electronic device, wherein when the first antenna is electrically connected to the communication circuit, the first antenna is configured to form a resonant inductance value for a selected or predetermined frequency, and Wherein, the conductive portion of the support member is configured to include a second opening, and when viewed in a direction perpendicular to the first surface, the second opening at least partially overlaps with the first opening of the first plate, so that the second opening passes the electromagnetic field generated by the first antenna to form the inductance value of the first antenna.

2. The electronic device according to claim 1, in, The first plate is configured to provide electromagnetic interference shielding for the display.

3. The electronic device according to claim 1, further comprising: A non-conductive material is disposed in at least a portion of the second opening.

4. The electronic device according to claim 1, further comprising: A conductive adhesive is provided at least between the first plate and the support member.

5. The electronic device according to claim 1, wherein: The second antenna is disposed at least between the support and the second surface.

6. The electronic device according to claim 1, in, the first antenna being configured to transmit at least a portion of the signal to the outside of the electronic device and / or receive at least a portion of the signal from the outside of the electronic device through the first surface based on being electrically connected to the communication circuit, and Wherein, the second antenna is configured to transmit at least a portion of the signal to the outside of the electronic device and / or receive at least a portion of the signal from the outside of the electronic device through the second surface based on being electrically connected to the communication circuit.

7. The electronic device according to claim 1, further comprising: a second plate disposed at least between the first surface and the second surface and comprising a conductive material, wherein the display includes a first area and a second area disposed on opposite sides about a folding axis of the electronic device, wherein the first plate is disposed at least between the first region and the second surface, and The second plate is at least disposed between the second region and the second surface and includes a third opening, and a portion of the third opening surrounding the second plate includes at least a portion of the second antenna.

8. The electronic device according to claim 1, in, The display includes a first area and a second area disposed on opposite sides about a folding axis of the electronic device, and Wherein, the communication circuit is configured to, at least based on the electronic device being at least partially folded inward so that the first area and the second area face each other: use the second antenna to send at least a portion of the signal to the outside of the electronic device and / or receive at least a portion of the signal from the outside of the electronic device through a portion of the second surface corresponding to the first area.

9. The electronic device according to claim 1, in, The display includes a first area and a second area disposed on opposite sides about a folding axis of the electronic device, and Wherein, the communication circuit is configured to: use the first antenna to send at least a part of the signal to the outside of the electronic device and / or receive at least a part of the signal from the outside of the electronic device through the first area; and use the second antenna to send at least a part of the signal to the outside of the electronic device and / or receive at least a part of the signal from the outside of the electronic device through the second area, at least based on the electronic device being folded outward so that the first area is oriented in a first direction and the second area is oriented in a second direction different from the first direction.

10. The electronic device according to claim 1, further comprising: in, The communication circuit is configured to transmit at least a portion of the signal to the outside and / or receive at least a portion of the signal from the outside through the display using the first antenna based on the electronic device being in the first folded state, and Wherein, the communication circuit is configured to use the second antenna to send at least a part of the signal to the outside and / or receive at least a part of the signal from the outside through the second surface based on the electronic device being in the second folded state.

11. The electronic device according to claim 1, wherein: The first antenna and / or the second antenna are configured to be selectively electrically connected to the communication circuit further based on the movement or orientation of the electronic device.

12. The electronic device according to claim 1, further comprising: A processor is configured to control the first antenna and / or the second antenna to be selectively electrically connected to the communication circuit.

13. The electronic device according to claim 1, further comprising: A switch circuit is configured to selectively electrically connect the first antenna and / or the second antenna to the communication circuit.

14. The electronic device according to claim 13, wherein: The communication circuit includes the switch circuit.

15. The electronic device according to claim 1, wherein: The signal has a near field communication of a selected or predetermined frequency.

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