Display panel, preparation method of display panel and display device

Abstract

The invention discloses a display panel, a preparation method of the display panel and a display device. The display panel comprises a substrate; the isolation structure is arranged on one side of the substrate and is enclosed to form a plurality of isolation openings; at least part of the structure of the light-emitting device is located in the isolation opening; the first packaging layer comprises packaging units with different densities and a packaging auxiliary structure, the packaging units are arranged on the side, away from the substrate, of the light-emitting device, and the auxiliary structure is arranged on the side, away from the substrate, of at least one packaging unit. The display panel provided by the embodiment of the invention has a relatively good packaging effect.

Description

Technical Field

[0001] The present application belongs to the field of display technology, and in particular, relates to a display panel, a method for preparing a display panel, and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) and flat panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream in display devices.

[0003] However, the process performance of current OLED display products needs to be improved. Summary of the invention

[0004] The embodiments of the present application provide a display panel, a method for manufacturing a display panel, and a display device, aiming to improve the packaging effect of the display panel.

[0005] An embodiment of the first aspect of the present application provides a display panel, comprising: a substrate; an isolation structure, which is arranged on one side of the substrate and encloses a plurality of isolation openings; a light-emitting device, at least part of the structure of the light-emitting device is located within the isolation opening; a first packaging layer, comprising packaging units with different densities and packaging auxiliary structures, the packaging units are arranged on a side of the light-emitting device away from the substrate, and the auxiliary structure is arranged on a side of at least one packaging unit away from the substrate.

[0006] According to an embodiment of the first aspect of the present application, the density of the auxiliary structure is lower than the density of the packaging unit.

[0007] According to any of the aforementioned implementations of the first aspect of the present application, the orthographic projection of the auxiliary structure on the substrate is located within the orthographic projection of the packaging unit on the substrate.

[0008] According to any of the aforementioned embodiments of the first aspect of the present application, the auxiliary structure and the packaging unit are provided with the same material.

[0009] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the packaging unit includes an inorganic material, and / or the material of the auxiliary structure includes an inorganic material.

[0010] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the packaging unit includes at least one of silicon oxide, silicon nitride and silicon oxynitride, and / or the material of the auxiliary structure includes at least one of silicon oxide, silicon nitride and silicon oxynitride.

[0011] According to any of the aforementioned embodiments of the first aspect of the present application, the packaging unit has a first thickness, the auxiliary structure has a second thickness, and the first thickness is different from the second thickness.

[0012] According to any of the aforementioned embodiments of the first aspect of the present application, the first thickness is the maximum thickness of the packaging unit, and the second thickness is the maximum thickness of the auxiliary structure, or the first thickness is the average thickness of the packaging unit, and the second thickness is the average thickness of the auxiliary structure.

[0013] According to any of the aforementioned embodiments of the first aspect of the present application, the first thickness is greater than the second thickness.

[0014] According to any of the aforementioned embodiments of the first aspect of the present application, the ratio of the second thickness to the first thickness is not less than 7 / 93, and / or the ratio of the second thickness to the first thickness is not greater than 13 / 87.

[0015] According to any of the aforementioned embodiments of the first aspect of the present application, the packaging units enclose a gap space, the gap space has a connecting opening on a side facing away from the substrate, and the auxiliary structure covers or fills the connecting opening of at least one packaging unit.

[0016] According to any of the aforementioned embodiments of the first aspect of the present application, the packaging unit includes a first packaging portion and a second packaging portion that are connected, the first packaging portion covers the side of the light-emitting device facing away from the substrate, and the second packaging portion covers the side of the isolation structure facing the isolation opening, and the first packaging portion and the second packaging portion enclose a gap space.

[0017] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure includes a first isolation portion and a second isolation portion located on a side of the first isolation portion away from the substrate, and the second isolation portion is arranged to protrude from the first isolation portion toward the isolation opening.

[0018] According to any of the aforementioned embodiments of the first aspect of the present application, the second packaging portion includes a first sub-portion covering the first isolation portion on a side facing the isolation opening and a second sub-portion covering the second isolation portion on a side facing the isolation opening, the first packaging portion is connected to the first sub-portion, and the first packaging portion and at least part of the second sub-portion are spaced apart to form a connecting opening.

[0019] According to any of the aforementioned embodiments of the first aspect of the present application, at least part of the auxiliary structure is located on a side of the first packaging portion away from the substrate, and / or at least part of the auxiliary structure is located on a side of the second packaging portion away from the isolation structure.

[0020] According to any of the aforementioned embodiments of the first aspect of the present application, the packaging unit further includes a third packaging portion located on a side of the isolation structure away from the substrate, and a portion of the auxiliary structure is located on a side of the third packaging portion away from the isolation structure.

[0021] According to any of the aforementioned implementations of the first aspect of the present application, the third packaging portion is spaced apart from the isolation structure.

[0022] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation opening includes a first opening and a second opening, the light-emitting device includes a first type of device arranged corresponding to the first opening and a second type of device arranged corresponding to the second opening, the light-emitting colors of the first type of device and the second type of device are different, the packaging unit includes a first unit arranged on the side of the first type of device away from the substrate and a second unit arranged on the side of the second type of device away from the substrate, and at least one auxiliary structure covers or fills the connecting opening of the first unit.

[0023] According to any of the aforementioned embodiments of the first aspect of the present application, the auxiliary structure is spaced apart from the second unit, or at least one auxiliary structure covers or fills the connecting opening of the second unit.

[0024] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation opening also includes a third opening, the light-emitting device also includes a third type of device arranged corresponding to the third opening, the light-emitting colors of the first type of device, the second type of device and the third type of device are different from each other, the packaging unit includes a third unit arranged on the side of the third type of device away from the substrate, the auxiliary structure is spaced apart from the third unit, or at least one auxiliary structure covers or fills the connecting opening of the third unit.

[0025] An embodiment of the first aspect of the present application also provides a display panel, comprising: a substrate; an isolation structure, which is arranged on one side of the substrate and encloses a plurality of isolation openings; a light-emitting device, at least part of the structure of the light-emitting device is located within the isolation opening; a first packaging layer, comprising a packaging unit and a packaging auxiliary structure, the packaging unit is arranged on a side of the light-emitting device facing away from the substrate, the auxiliary structure is arranged on a side of at least one packaging unit facing away from the substrate, the packaging unit has a first thickness, the auxiliary structure has a second thickness, and the first thickness is different from the second thickness.

[0026] According to an implementation of the first aspect of the present application, the first thickness is greater than the second thickness.

[0027] According to any of the aforementioned embodiments of the first aspect of the present application, the ratio of the second thickness to the first thickness is not less than 7 / 93, and / or the ratio of the second thickness to the first thickness is not greater than 13 / 87.

[0028] According to any of the aforementioned embodiments of the first aspect of the present application, the first thickness is the maximum thickness of the packaging unit, and the second thickness is the maximum thickness of the auxiliary structure, or the first thickness is the average thickness of the packaging unit, and the second thickness is the average thickness of the auxiliary structure.

[0029] According to any of the aforementioned embodiments of the first aspect of the present application, the packaging units enclose a gap space, the gap space has a connecting opening on a side facing away from the substrate, and the auxiliary structure covers or fills the connecting opening of at least one packaging unit.

[0030] According to any of the aforementioned embodiments of the first aspect of the present application, the packaging unit includes a first packaging portion and a second packaging portion that are connected, the first packaging portion covers the side of the light-emitting device facing away from the substrate, and the second packaging portion covers the side of the isolation structure facing the isolation opening, and the first packaging portion and the second packaging portion enclose a gap space.

[0031] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure includes a first isolation portion and a second isolation portion located on a side of the first isolation portion away from the substrate, and the second isolation portion is arranged to protrude from the first isolation portion toward the isolation opening.

[0032] According to any of the aforementioned embodiments of the first aspect of the present application, the second packaging portion includes a first sub-portion covering the first isolation portion on a side facing the isolation opening and a second sub-portion covering the second isolation portion on a side facing the isolation opening, the first packaging portion is connected to the first sub-portion, and the first packaging portion and at least part of the second sub-portion are spaced apart to form a connecting opening.

[0033] According to any of the aforementioned embodiments of the first aspect of the present application, at least part of the auxiliary structure is located on a side of the first packaging portion away from the substrate, and / or at least part of the auxiliary structure is located on a side of the second packaging portion away from the isolation structure.

[0034] According to any of the aforementioned embodiments of the first aspect of the present application, the packaging unit further includes a third packaging portion located on a side of the isolation structure away from the substrate, and a portion of the auxiliary structure is located on a side of the third packaging portion away from the isolation structure.

[0035] According to any of the aforementioned implementations of the first aspect of the present application, the third packaging portion is spaced apart from the isolation structure.

[0036] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation opening includes a first opening and a second opening, the light-emitting device includes a first type of device arranged corresponding to the first opening and a second type of device arranged corresponding to the second opening, the light-emitting colors of the first type of device and the second type of device are different, the packaging unit includes a first unit arranged on the side of the first type of device away from the substrate and a second unit arranged on the side of the second type of device away from the substrate, and at least one auxiliary structure covers or fills the connecting opening of the first unit.

[0037] According to any of the aforementioned embodiments of the first aspect of the present application, the auxiliary structure is spaced apart from the second unit, or at least one auxiliary structure covers or fills the connecting opening of the second unit.

[0038] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation opening also includes a third opening, the light-emitting device also includes a third type of device arranged corresponding to the third opening, the light-emitting colors of the first type of device, the second type of device and the third type of device are different from each other, the packaging unit includes a third unit arranged on the side of the third type of device away from the substrate, the auxiliary structure is spaced apart from the third unit, or at least one auxiliary structure covers or fills the connecting opening of the third unit.

[0039] An embodiment of a second aspect of the present application provides a method for preparing a display panel, including:

[0040] forming an isolation material layer on the substrate;

[0041] performing patterning on the isolation material layer to form a first opening;

[0042] sequentially preparing a first device material, a first packaging material and a first auxiliary material on the entire surface;

[0043] Part of the first auxiliary material, part of the first packaging material and part of the first device material outside the first opening are removed in sequence to form an auxiliary structure, a first unit and a first type of device in sequence, the first unit is arranged on a side of the first type of device away from the substrate, and the auxiliary structure is arranged on a side of the first unit away from the substrate, wherein the auxiliary structure has a different density from the first unit, and / or the first unit has a first sub-thickness, the auxiliary structure has a second thickness, and the first sub-thickness is different from the second thickness.

[0044] According to an implementation of the second aspect of the present application, the first unit encloses a gap space, a side of the gap space facing away from the substrate has a connecting opening, and the auxiliary structure covers or fills the connecting opening of the first unit.

[0045] According to any of the aforementioned embodiments of the second aspect of the present application, the preparation method further comprises:

[0046] performing patterning on the isolation material layer to form a second opening;

[0047] After the step of sequentially removing a portion of the first auxiliary material, a portion of the first packaging material, and a portion of the first device material outside the first opening, the step further includes:

[0048] sequentially preparing the second device material and the second packaging material on the entire surface;

[0049] Part of the second packaging material and part of the second device material outside the second opening are removed in sequence to form a second unit and a second type of device in sequence. The second unit is arranged on a side of the second type of device away from the substrate.

[0050] According to any of the aforementioned implementations of the second aspect of the present application, the step of sequentially preparing the second device material and the second packaging material on the entire surface further includes:

[0051] preparing a second auxiliary material on the entire surface of the second packaging material;

[0052] In the step of sequentially removing a portion of the second packaging material and a portion of the second device material outside the second opening:

[0053] Part of the second auxiliary material, part of the second packaging material and part of the second device material outside the second opening are removed in sequence to form an auxiliary structure, a second unit and a second type of device in sequence, the second unit is arranged on a side of the second type of device away from the substrate, and the auxiliary structure is arranged on a side of the second unit away from the substrate, wherein the auxiliary structure has a different density from the second unit, and / or the second unit has a second sub-thickness, the auxiliary structure has a second thickness, and the second sub-thickness is different from the second thickness.

[0054] According to any of the aforementioned embodiments of the second aspect of the present application, the second units enclose a gap space, the gap space has a connecting opening on a side facing away from the substrate, and the auxiliary structure covers or fills the connecting opening of the second unit.

[0055] According to any of the aforementioned embodiments of the second aspect of the present application, the preparation method further comprises:

[0056] performing patterning on the isolation material layer to form a third opening;

[0057] After the step of sequentially removing a portion of the second packaging material and a portion of the second device material outside the second opening, the step further includes:

[0058] sequentially preparing a third device material and a third packaging material on the entire surface;

[0059] Part of the third packaging material and part of the third device material outside the third opening are removed in sequence to form a third unit and a third type of device in sequence. The third unit is arranged on a side of the third type of device away from the substrate.

[0060] According to any of the aforementioned implementations of the second aspect of the present application, the step of sequentially preparing the third device material and the third packaging material on the entire surface further includes:

[0061] preparing a third auxiliary material on the entire surface of the third packaging material;

[0062] In the step of sequentially removing a portion of the third packaging material and a portion of the third device material outside the third opening:

[0063] Part of the third auxiliary material, part of the third packaging material and part of the third device material outside the third opening are removed in sequence to form an auxiliary structure, a third unit and a third type of device in sequence, the third unit is arranged on a side of the third type of device away from the substrate, and the auxiliary structure is arranged on a side of the third unit away from the substrate, wherein the auxiliary structure has a different density from the third unit, and / or the third unit has a third sub-thickness, the auxiliary structure has a second thickness, and the third sub-thickness is different from the second thickness.

[0064] According to any of the aforementioned embodiments of the second aspect of the present application, the third units enclose a gap space, the gap space has a connecting opening on a side facing away from the substrate, and the auxiliary structure covers or fills the connecting opening of the third unit.

[0065] An embodiment of the third aspect of the present application provides a display device, including a display panel according to any of the above embodiments, or a display panel prepared by a preparation method according to any of the above embodiments.

[0066] In a display panel provided in an embodiment of the present application, the display panel includes a substrate, an isolation structure, a light-emitting device, and a first encapsulation layer. The isolation structure is disposed on one side of the substrate and encloses a plurality of isolation openings, at least part of the structure of the light-emitting device is located in the isolation openings, and the isolation structure can be used to participate in dividing the sub-pixels of the display panel.

[0067] The first encapsulation layer includes an encapsulation unit disposed on a side of the light-emitting device away from the substrate, and the encapsulation unit can be used to encapsulate the light-emitting device. The first encapsulation layer also includes an auxiliary structure disposed on a side of at least one encapsulation unit away from the substrate, and the auxiliary structure can be used to protect the encapsulation unit to improve the structural reliability of the encapsulation unit. By setting the density of the encapsulation unit and the auxiliary structure to be different, the density of the encapsulation unit can be reasonably set to improve the encapsulation effect of the encapsulation unit, and the density of the auxiliary structure can be reasonably set to facilitate patterning of the auxiliary structure, thereby better improving the encapsulation effect and preparation efficiency of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0068] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0069] Figure 1 is a partial schematic diagram of an isolation structure provided in an embodiment of the present application;

[0070] Figure 2 is a partial cross-sectional view of a display panel provided in an embodiment of the present application;

[0071] Figure 3 is a partial cross-sectional view of a display panel provided by another embodiment of the present application;

[0072] Figure 4 is a partial cross-sectional view of a display panel provided in yet another embodiment of the present application;

[0073] Figure 5 is a partial cross-sectional view of a display panel provided by another embodiment of the present application;

[0074] Figure 6 It is a schematic flow chart of a method for preparing a display panel provided in an embodiment of the present application;

[0075] Figures 7 to 16 It is a schematic diagram of the preparation process of a method for preparing a display panel provided in an embodiment of the present application.

[0076] Description of reference numerals:

[0077] 10. display panel; 11. pixel definition material layer; 12. isolation material layer; 12a. first isolation material layer; 12b. second isolation material layer; 12c. third isolation material layer;

[0078] 100, substrate; 110, substrate; 120, first insulating layer; 130, second insulating layer; 140, third insulating layer; 150, driving circuit; 151, transistor; 151a, gate; 151b, source and drain; 152, storage capacitor; 152a, first plate; 152b, second plate;

[0079] 200, pixel definition layer; 210, pixel definition portion; 220, pixel opening

[0080] 300, isolation structure; 301, isolation opening; 301a, first opening; 301b, second opening; 301c, third opening; 310, first isolation part; 320, second isolation part; 330, conductive part;

[0081] 400, light emitting device; 401, first type device; 402, second type device; 403, third type device; 410, first electrode; 420, light emitting unit; 430, second electrode;

[0082] 500, first packaging layer; 510, packaging unit; 510a, gap space; 510b, communication opening; 501, first unit; 502, second unit; 503, third unit; 511, first packaging part; 512, second packaging part; 512a, first sub-part; 512b, second sub-part; 513, third packaging part; 520, auxiliary structure;

[0083] 600, second encapsulation layer;

[0084] 700, third encapsulation layer;

[0085] Q1, a first device material; Q11, a first type of light-emitting material; Q12, a first conductive material;

[0086] Q2, second device material; Q21, second type of light emitting material; Q22, second conductive material;

[0087] Q3, third device material; Q31, third type of light emitting material; Q32, third conductive material;

[0088] C1, first packaging material; C2, second packaging material; C3, third packaging material;

[0089] F1, first auxiliary material; F2, second auxiliary material; F3, third auxiliary material. DETAILED DESCRIPTION

[0090] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present application and are not configured to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.

[0091] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0092] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "on" or "over" another layer or another region, it may mean that it is directly on the other layer or another region, or that other layers or regions are included between it and the other layer or another region. Moreover, if the component is turned over, the layer or a region will be "below" or "beneath" another layer or another region.

[0093] Embodiments of the present application provide a display panel, a method for manufacturing a display panel, and a display device. Embodiments of the display panel, the method for manufacturing a display panel, and the display device will be described below in conjunction with the accompanying drawings.

[0094] Figure 1 is a partial schematic diagram of an isolation structure 300 provided in an embodiment of the present application, Figure 2 It is a partial cross-sectional view of a display panel 10 provided in an embodiment of the present application.

[0095] like Figure 1 and Figure 2 As shown, an embodiment of the first aspect of the present application provides a display panel 10, comprising: a substrate 100; an isolation structure 300, which is arranged on one side of the substrate 100 and encloses a plurality of isolation openings 301; a light-emitting device 400, wherein at least part of the structure of the light-emitting device 400 is located within the isolation opening 301; a first packaging layer 500, comprising packaging units 510 with different densities and packaging auxiliary structures 520, wherein the packaging units 510 are arranged on a side of the light-emitting device 400 away from the substrate 100, and the auxiliary structure 520 is arranged on a side of at least one packaging unit 510 away from the substrate 100.

[0096] In a display panel 10 provided in an embodiment of the present application, the display panel 10 includes a substrate 100, an isolation structure 300, a light emitting device 400, and a first encapsulation layer 500. The isolation structure 300 is disposed on one side of the substrate 100 and encloses a plurality of isolation openings 301, at least part of the structure of the light emitting device 400 is located in the isolation opening 301, and the isolation structure 300 can be used to participate in dividing the sub-pixels of the display panel 10.

[0097] Optionally, the isolation structure 300 may be in a mesh shape, and the hollowed-out area in the mesh isolation structure 300 may form an isolation opening 301. There may be multiple light-emitting devices 400, and each light-emitting device 400 may be arranged corresponding to a different isolation opening 301, that is, different light-emitting devices 400 may be located in different isolation openings 301.

[0098] The first encapsulation layer 500 includes an encapsulation unit 510 disposed on a side of the light-emitting device 400 away from the substrate 100 . The encapsulation unit 510 can be used to encapsulate the light-emitting device 400 .

[0099] There may be multiple packaging units 510 , and each packaging unit 510 may be provided corresponding to a different light emitting device 400 , that is, different packaging units 510 may be located on a side of different light emitting devices 400 away from the substrate 100 , so as to package different light emitting devices 400 .

[0100] Optionally, each packaging unit 510 may be spaced apart so that each packaging unit 510 can perform relatively independent packaging on each light-emitting device 400 .

[0101] The first encapsulation layer 500 further includes an auxiliary structure 520 disposed on a side of at least one encapsulation unit 510 away from the substrate 100, and the auxiliary structure 520 can be used to protect the encapsulation unit 510 to improve the structural reliability of the encapsulation unit 510. By setting the density of the encapsulation unit 510 and the auxiliary structure 520 to be different, the density of the encapsulation unit 510 can be reasonably set to improve the encapsulation effect of the encapsulation unit 510, and the density of the auxiliary structure 520 can be reasonably set to facilitate patterning of the auxiliary structure 520, thereby better improving the encapsulation effect and manufacturing efficiency of the display panel 10.

[0102] Optionally, the density of the film layer structure described in the embodiment of the present application may refer to the film forming density of the film layer structure. For example, the density of the encapsulation unit 510 is different from that of the auxiliary structure 520, which may refer to the film forming density of the encapsulation unit 510 and that of the auxiliary structure 520, that is, between the encapsulation unit 510 and the auxiliary structure 520, the film forming density of one is better than that of the other.

[0103] In some optional embodiments, the density of the auxiliary structure 520 may be less than the density of the encapsulation unit 510, so that the encapsulation unit 510 may have a larger density, so that water vapor is not easy to penetrate into the light-emitting device through the encapsulation unit 510, and the encapsulation effect of the encapsulation unit 510 can be improved. The auxiliary structure 520 may also have a smaller density, so that when preparing the first encapsulation layer 500, the etching material can easily etch and remove the material of the auxiliary structure 520 (for example, affected by the density relationship between the encapsulation unit 510 and the auxiliary structure 520, the etching rate of the etching material on the auxiliary structure 520 is likely to be greater than the etching rate of the etching material on the encapsulation unit 510), which can effectively reduce the action time of the etching material, thereby reducing the damage of the etching material to other film structures, and can effectively improve the structural reliability of the display panel 10. For example, when the thickness of the first encapsulation layer 500 is relatively thick due to the stacking of the auxiliary structure 520 and the encapsulation unit 510, the etching material can better etch and remove the auxiliary structure 520.

[0104] Optionally, when the density of the auxiliary structure 520 is smaller than the density of the packaging unit 510, affected by the etching material during the preparation of the display panel 10, the orthographic projection of the auxiliary structure 520 on the substrate 100 may be located within the orthographic projection of the packaging unit 510 on the substrate 100, that is, the size of the auxiliary structure 520 may be smaller than the size of the packaging unit 510, which is not specifically limited in the present application.

[0105] In some embodiments of the present application, there are various ways to configure the materials of the auxiliary structure 520 and the packaging unit 510 .

[0106] In some optional embodiments, the materials of the auxiliary structure 520 and the packaging unit 510 may be different, so that more appropriate materials can be selected according to the functions of the auxiliary structure 520 and the packaging unit 510 respectively, so as to enhance the protective function of the auxiliary structure 520 and the packaging function of the packaging unit 510.

[0107] In some other optional embodiments, the auxiliary structure 520 can be made of the same material as the encapsulation unit 510, so that the auxiliary structure 520 can be prepared using the same preparation equipment as the encapsulation unit 510, which can improve the preparation efficiency of the display panel 10. In addition, the auxiliary structure 520 can play a certain encapsulation role, thereby further improving the encapsulation effect of the first encapsulation layer 500.

[0108] For ease of description, the following embodiments are described by taking the auxiliary structure 520 and the packaging unit 510 as being made of the same material.

[0109] In some optional embodiments, the material of the packaging unit 510 includes an inorganic material, and / or the material of the auxiliary structure 520 includes an inorganic material.

[0110] Exemplarily, the encapsulation unit 510 and / or the auxiliary structure 520 may be prepared by a chemical vapor deposition (CVD) process. For example, the entire first encapsulation layer 500 may be prepared by a chemical vapor deposition process.

[0111] Optionally, the material of the encapsulation unit 510 includes at least one of silicon oxide, silicon nitride and silicon oxynitride, and / or the material of the auxiliary structure 520 includes at least one of silicon oxide, silicon nitride and silicon oxynitride.

[0112] In these optional embodiments, by setting the materials of the packaging unit 510 and the auxiliary structure 520 to include inorganic materials, the packaging unit 510 and the auxiliary structure 520 can better limit the invasion of water vapor into the light-emitting device, thereby better improving the packaging effect of the first packaging layer 500.

[0113] In some optional embodiments, the packaging unit 510 has a first thickness, the auxiliary structure 520 has a second thickness, and the first thickness is different from the second thickness.

[0114] Optionally, the first thickness is the maximum thickness of the packaging unit 510 , and the second thickness is the maximum thickness of the auxiliary structure 520 ; or, the first thickness is the average thickness of the packaging unit 510 , and the second thickness is the average thickness of the auxiliary structure 520 .

[0115] Optionally, the maximum thickness of the package unit 510 may refer to the maximum thickness of a single package unit 510, and the maximum thickness of the auxiliary structure 520 may refer to the maximum thickness of a single auxiliary structure 520. Optionally, the average thickness of the package unit 510 may refer to the average thickness of a single package unit 510, and the average thickness of the auxiliary structure 520 may refer to the average thickness of a single auxiliary structure 520.

[0116] In this optional embodiment, by setting the thickness of the packaging unit 510 and the auxiliary structure 520 to be different, the packaging effect of the packaging unit 510 can be improved by reasonably setting the thickness of the packaging unit 510, and the patterning of the auxiliary structure 520 can be facilitated by reasonably setting the thickness of the auxiliary structure 520, thereby better improving the packaging effect and preparation efficiency of the display panel 10.

[0117] In some optional embodiments, the first thickness may be greater than the second thickness, for example, the maximum thickness of the packaging unit 510 may be greater than the maximum thickness of the auxiliary structure 520, and / or the average thickness of the packaging unit 510 may be greater than the average thickness of the auxiliary structure 520.

[0118] Optionally, the ratio of the second thickness to the first thickness is not less than 7 / 93, and / or the ratio of the second thickness to the first thickness is not greater than 13 / 87.

[0119] For example, the ratio of the second thickness to the first thickness may be 7 / 93, 8 / 93, 9 / 93, 10 / 93, 11 / 93, 12 / 93, or 13 / 93.

[0120] In these optional embodiments, by setting the thickness of the encapsulation unit 510 to be greater than the thickness of the auxiliary structure 520, the encapsulation unit 510 can have a larger thickness, so that water vapor is not easy to penetrate into the light-emitting device through the encapsulation unit 510, which can better improve the encapsulation effect of the encapsulation unit 510. It also allows the auxiliary structure 520 to have a smaller thickness, so that when preparing the first encapsulation layer 500, the etching material can easily etch and remove the material of the auxiliary structure 520, which can better reduce the action time of the etching material, thereby reducing the damage of the etching material to other film structures, and can better improve the structural reliability of the display panel 10. For example, when the thickness of the first encapsulation layer 500 is thick due to the stacking of the auxiliary structure 520 and the encapsulation unit 510, the etching material can better etch and remove the auxiliary structure 520 with a thin thickness.

[0121] In some embodiments of the present application, there are multiple ways to set the substrate 100. The substrate 100 may include, for example, a substrate 110 and a driving circuit 150 disposed on the substrate 110. Optionally, the substrate 100 includes a first insulating layer 120, a second insulating layer 130, and a third insulating layer 140 that are stacked. Exemplarily, the driving circuit 150 may include a transistor 151, a storage capacitor 152, and a driving signal line for connecting various devices. The transistor 151 may include a semiconductor, a gate 151a, and a source and drain 151b. The storage capacitor 152 includes a first plate 152a and a second plate 152b.

[0122] As an example, the gate 151a and the first electrode 152a can be located on the side of the first insulating layer 120 facing the substrate 110, the second electrode 152b can be located between the first insulating layer 120 and the second insulating layer 130, and the source and drain 151b can be located between the second insulating layer 130 and the third insulating layer 140.

[0123] In some optional embodiments, in a direction away from the substrate 100 , the light emitting device 400 may include a first electrode 410 , a light emitting unit 420 , and a second electrode 430 stacked in sequence.

[0124] Optionally, the light-emitting unit 420 may include a hole injection layer (HIL), a hole transport layer (HTL), a light-emitting structure, an electron injection layer (EIL) and an electron transport layer (ETL).

[0125] Optionally, the first electrode 410 and the second electrode 430 may be used as pixel electrodes of the display panel 10, one of the first electrode 410 and the second electrode 430 may be used as an anode, and the other may be used as a cathode to drive the light-emitting unit 420 to emit light. In the embodiment of the present application, the first electrode 410 is used as the anode of the display panel 10, and the second electrode 430 is used as the cathode of the display panel 10 for illustration.

[0126] In some optional embodiments, the isolation opening 301 may include a first opening 301a and a second opening 301b, and the light emitting device 400 may include a first type device 401 disposed corresponding to the first opening 301a and a second type device 402 disposed corresponding to the second opening 301b.

[0127] Optionally, the first type device 401 disposed corresponding to the first opening 301a may mean that the first type device 401 may be at least partially located in the first opening 301a. Optionally, the second type device 402 disposed corresponding to the second opening 301b may mean that the second type device 402 may be at least partially located in the second opening 301b.

[0128] Optionally, the light emitting color of the first type device 401 may be different from that of the second type device 402 , so as to realize color light emitting display of the display panel 10 .

[0129] Optionally, the packaging unit 510 includes a first unit 501 disposed on the side of the first type device 401 away from the substrate 100 and a second unit 502 disposed on the side of the second type device 402 away from the substrate 100. The first unit 501 and the second unit 502 can be used to package the first type device 401 and the second type device 402 relatively independently.

[0130] Optionally, the isolation opening 301 also includes a third opening 301c, and the light-emitting device 400 also includes a third type of device 403 arranged corresponding to the third opening 301c, and the light-emitting colors of the first type of device 401, the second type of device 402 and the third type of device 403 are different from each other, that is, the light-emitting colors of the first type of device 401, the second type of device 402 and the third type of device 403 are all different, so as to facilitate the color display of the display panel 10.

[0131] Optionally, the third type device 403 disposed corresponding to the third opening 301c may mean that the third type device 403 may be at least partially located in the third opening 301c.

[0132] For example, the first type of device 401 is a light emitting device 400 that emits blue light, the second type of device 402 is a light emitting device 400 that emits green light, and the third type of device 403 is a light emitting device 400 that emits red light.

[0133] Optionally, the packaging unit 510 includes a third unit 503 disposed on a side of the third type device 403 facing away from the substrate 100 , and the third unit 503 can be used to perform relatively independent packaging for the third type device 403 .

[0134] In some optional embodiments, the display panel 10 may further include a pixel definition layer 200 disposed on one side of the substrate 100, and the pixel definition layer 200 may include a pixel defining portion 210 and a pixel opening 220 formed by the pixel defining portion 210. The pixel opening 220 may be connected to the isolation opening 301, a portion of the structure of the light emitting device 400 may be located in the pixel opening 220, and another portion of the light emitting device 400 may be located in the isolation opening 301. The pixel definition layer 200 may also be used to participate in dividing the sub-pixels of the display panel 10.

[0135] In some embodiments of the present application, the number of the isolation openings 301 and the number of the pixel openings 220 may be plural, and a single isolation opening 301 may be connected to a single pixel opening 220 .

[0136] Optionally, the pixel definition layer 200 may also be in a mesh shape, and the hollow areas in the mesh pixel definition layer 200 may form pixel openings 220 .

[0137] Optionally, there are multiple ways to set the relative position between the pixel defining portion 210 and the isolation structure 300. For example, the isolation structure 300 can be set on the side of the pixel defining portion 210 away from the substrate 100, that is, the isolation structure 300 can be directly set on the pixel defining portion 210. Or for example, the pixel defining portion 210 can be provided with a receiving groove (not shown in the figure), and at least part of the isolation structure 300 can be located in the receiving groove, so that the isolation structure 300 is not easy to have an excessive height compared to the substrate 100, thereby being able to better reduce the thickness of the display panel 10. For the convenience of description, the following embodiments are described by taking the isolation structure 300 being set on the side of the pixel defining portion 210 away from the substrate 100 as an example.

[0138] In some optional embodiments, the isolation structure 300 may include a first isolation portion 310 and a second isolation portion 320 located on a side of the first isolation portion 310 facing away from the substrate 100 . The second isolation portion 320 may be disposed protruding from the first isolation portion 310 toward the isolation opening 301 .

[0139] By setting the second isolation portion 320 protruding from the first isolation portion 310 toward the isolation opening 301, when preparing the light-emitting device 400 of the display panel 10, part of the material of the light-emitting device 400 (for example, the material of the light-emitting unit 420 and the material of the second electrode 430) can be directly vapor-deposited on the entire surface, and the second isolation portion 320 can block at least part of the material used to prepare the light-emitting device 400 to separate the material of the light-emitting device 400 between adjacent sub-pixels, so as to form a plurality of light-emitting devices 400 that are spaced apart and located in different isolation openings 301, so that when preparing the light-emitting device 400 of the display panel 10, there is no need to set a mask with high precision, for example, when vapor-depositing part of the material of the light-emitting device 400, there is no need to set a high-precision metal mask (Fine Metal Mask, FMM), thereby effectively reducing the production and preparation cost of the display panel 10.

[0140] In some optional embodiments, the material of the isolation structure 300 may include a conductive material, and the second electrode 430 may be connected to the isolation structure 300 , so that the second electrodes 430 of adjacent light-emitting devices 400 can be electrically connected through the isolation structure 300 to facilitate control of the second electrodes 430 .

[0141] Optionally, the second electrode 430 may be connected to the first isolation portion 310 , so that the second electrodes 430 of adjacent sub-pixels may be electrically connected through the first isolation portion 310 .

[0142] In some optional embodiments, the isolation structure 300 further includes a conductive portion 330 disposed on a side of the first isolation portion 310 facing the substrate 100 . The conductive portion 330 may be disposed protruding from the first isolation portion 310 toward the isolation opening 301 .

[0143] Optionally, the second electrode 430 may be connected to the conductive part 330 .

[0144] In these optional embodiments, by arranging the conductive portion 330 to protrude from the first isolation portion 310 toward the isolation opening 301 , the conductive portion 330 can have a larger area and be convenient for connection with the second electrode 430 , thereby facilitating electrical connection between the second electrode 430 and the isolation structure 300 .

[0145] In some embodiments of the present application, the light emitting devices 400 of different colors can be prepared separately by utilizing the shielding and isolating effect of the isolation structure 300 on the light emitting device 400 .

[0146] In some optional embodiments, the isolation structure 300 can be used to prepare the first type device 401, the first unit 501 above the first type device 401, the second type device 402, the second unit 502 above the second type device 402, the third type device 403 and the third unit 503 above the third type device 403, respectively.

[0147] For example, the isolation structure 300 may be used to sequentially prepare the first unit 501 , the first type device 401 , the second unit 502 , the second type device 402 , the third unit 503 , and the third type device 403 .

[0148] Specifically, the first electrode 410 of each light-emitting device 400 may be prepared first. Then, the material of the light-emitting unit 420 and the second electrode 430 in the first type device 401 may be evaporated on the entire surface, and the isolation structure 300 may isolate the material of the light-emitting unit 420 and the second electrode 430 in part of the first type device 401, and then the material of the encapsulation unit 510 may be evaporated on the entire surface. Then, the material of the encapsulation unit 510 outside the first opening 301a is removed to form the first unit 501, and then the material of the second electrode 430 of the first type device 401 outside the first opening 301a and the material of the light-emitting unit 420 of the first type device 401 are removed in sequence to form the first type device 401 corresponding to the first opening 301a.

[0149] Then, the material of the light-emitting unit 420 and the second electrode 430 in the second type device 402 is evaporated on the whole surface, and the isolation structure 300 can isolate the material of the light-emitting unit 420 and the second electrode 430 in part of the second type device 402, and then the material of the packaging unit 510 is evaporated on the whole surface. Then, the material of the packaging unit 510 outside the second opening 301b is removed to form the second unit 502, and then the material of the second electrode 430 of the second type device 402 outside the second opening 301b and the material of the light-emitting unit 420 of the second type device 402 are removed in sequence to form the second type device 402 corresponding to the second opening 301b.

[0150] Then, the material of the light-emitting unit 420 and the second electrode 430 in the third type device 403 can be evaporated on the whole surface, and the isolation structure 300 can isolate the material of the light-emitting unit 420 and the second electrode 430 in part of the third type device 403, and then the material of the packaging unit 510 is evaporated on the whole surface. Then, the material of the packaging unit 510 outside the third opening 301c is removed to form the third unit 503, and then the material of the second electrode 430 of the third type device 403 outside the third opening 301c and the material of the light-emitting unit 420 of the third type device 403 are removed in sequence to form the third type device 403 corresponding to the third opening 301c.

[0151] In some embodiments of the present application, the auxiliary structure 520 can be used to protect the packaging unit 510, which may mean that during the preparation process of the display panel 10, the auxiliary structure 520 can be used to limit the accumulation of etching materials on the packaging unit 510, so that the etching material is not easy to cause excessive etching to the packaging unit 510, thereby better improving the structural stability of the packaging unit 510.

[0152] Illustratively, influenced by the shape of the undulating topography on the surface of the isolation structure 300 , the packaging unit 510 will also produce a corresponding undulating topography. The auxiliary structure 520 can be used to limit the aggregation of etching materials on the undulating topography on the surface of the packaging unit 510 , so that the etching material is not likely to cause over-etching of the packaging unit 510 .

[0153] In some optional embodiments, the packaging units 510 enclose a gap space 510 a , and a side of the gap space 510 a facing away from the substrate 100 has a communication opening 510 b . The auxiliary structure 520 covers or fills the communication opening 510 b of at least one packaging unit 510 .

[0154] Optionally, the packaging unit 510 includes a first packaging part 511 and a second packaging part 512 connected to each other, the first packaging part 511 covers the side of the light-emitting device 400 away from the substrate 100, and the second packaging part 512 covers the side of the isolation structure 300 facing the isolation opening 301, and the first packaging part 511 and the second packaging part 512 can enclose a gap space 510a. The first packaging part 511 can be used to better package the light-emitting device 400, and the second packaging part 512 can be used to extend the packaging path of the packaging unit 510, improve the invasion path of external water vapor, and thus can better improve the packaging effect of the display panel 10.

[0155] Optionally, the first encapsulation part 511 is connected to the second encapsulation part 512 , which may mean that an edge of the first encapsulation part 511 facing the isolation structure 300 may be connected to an edge of the second encapsulation part 512 facing the substrate 100 .

[0156] Optionally, the second packaging portion 512 includes a first sub-portion 512a covering the side of the first isolation portion 310 facing the isolation opening 301 and a second sub-portion 512b covering the side of the second isolation portion 320 facing the isolation opening 301, the first packaging portion 511 is connected to the first sub-portion 512a, and the first packaging portion 511 and at least part of the second sub-portion 512b are spaced apart to form a connecting opening 510b.

[0157] Optionally, the edge of the first packaging part 511 facing the isolation structure 300 may be connected to the edge of the first sub-part 512a facing the substrate 100, and the edge of the first sub-part 512a away from the substrate 100 may be connected to the second sub-part 512b. The gap space 510a may be formed by the first packaging part 511, the first sub-part 512a and the second sub-part 512b.

[0158] Optionally, the gap space 510a may be partially located on the side of the second isolation portion 320 facing the substrate 100 to further extend the packaging path of the packaging unit 510 and improve the invasion path of external water vapor.

[0159] Optionally, the packaging unit 510 further includes a third packaging portion 513 located on a side of the isolation structure 300 facing away from the substrate 100 .

[0160] Optionally, the third encapsulation portion 513 may be spaced apart from the isolation structure 300 .

[0161] In these optional embodiments, influenced by the shape of the undulating morphology of the surface of the isolation structure 300, for example, influenced by the shape of the morphology of the second isolation portion 320 protruding from the first isolation portion 310 toward the isolation opening 301, the packaging unit 510 is easy to enclose and form a gap space 510a. Among them, the gap space 510a is easy to generate a connecting opening 510b on the side away from the substrate 100. For example, when the thickness of the packaging unit 510 is relatively thin, the gap space 510a is easy to generate a connecting opening 510b on the side away from the substrate 100. Therefore, if the auxiliary structure 520 is not provided, it is easy for the etching material to accumulate in the gap space 510a through the connecting opening 510b during the preparation process of the display panel 10 (for example, when the material of the light-emitting device 400 and the packaging unit 510 is patterned), so that the etching material is easy to cause over-etching of the packaging unit 510, so that the packaging unit 510 is easy to be damaged, which greatly reduces the packaging effect of the packaging unit 510 on the light-emitting device 400.

[0162] Therefore, by setting the auxiliary structure 520 to cover or fill the connecting opening 510b of at least one packaging unit 510, during the preparation process of the display panel 10, the auxiliary structure 520 can better limit the etching material from flowing into the gap space 510a, thereby better reducing the risk of etching material aggregation, better improving the structural reliability of the packaging unit 510, and further better improving the packaging effect of the packaging unit 510 on the display panel 10.

[0163] In some embodiments of the present application, by setting the density of the auxiliary structure 520 to be lower than the density of the packaging unit 510, that is, by setting the auxiliary structure 520 with a lower density, the auxiliary structure 520 can better cover or fill the connecting opening 510b.

[0164] In some optional embodiments, at least part of the auxiliary structure 520 is located on a side of the first packaging portion 511 away from the substrate 100 , and / or at least part of the auxiliary structure 520 is located on a side of the second packaging portion 512 away from the isolation structure 300 .

[0165] Optionally, a portion of the auxiliary structure 520 is located on a side of the third packaging portion 513 facing away from the isolation structure 300 .

[0166] In these optional embodiments, by reasonably setting the position of the auxiliary structure 520, the auxiliary structure 520 can play a better flattening role, which can facilitate the preparation of subsequent film layer structures, and the auxiliary structure 520 can also play a better packaging role for the light-emitting device 400.

[0167] In some embodiments of the present application, the auxiliary structure 520 may be disposed according to the preparation order of the light-emitting devices 400 and the packaging units 510 .

[0168] like Figure 2 As shown, in some optional embodiments, at least one auxiliary structure 520 is provided to cover or fill the communication opening 510 b of the first unit 501 .

[0169] Optionally, the step of preparing the auxiliary structure 520 for covering or filling the connecting opening 510b of the first unit 501 may be located before the step of full-surface evaporation of the material of the light-emitting unit 420 and the second electrode 430 in the second type device 402 and the step of full-surface evaporation of the material of the second unit 502.

[0170] In these optional embodiments, by setting at least one auxiliary structure 520 to cover or fill the connecting opening 510b of the first unit 501, in the process of removing the material of the packaging unit 510 outside the second opening 301b, the material of the second electrode 430 of the second type device 402 and the material of the light-emitting unit 420 of the second type device 402 to form the second unit 502 and the second type device 402, and in the process of removing the material of the packaging unit 510 outside the third opening 301c, the material of the second electrode 430 of the third type device 403 and the material of the light-emitting unit 420 of the third type device 403 to form the third unit 503 and the third type device 403, the auxiliary structure 520 set to cover or fill the connecting opening 510b of the first unit 501 can better limit the etching material from entering the gap space 510a of the first unit 501, so that the etching material is not easy to gather in the gap space 510a of the first unit 501, thereby better improving the structural reliability of the first unit 501 and the packaging effect of the first unit 501 on the first type device 401.

[0171] like Figure 2 As shown, in some optional embodiments, the auxiliary structure 520 may be spaced apart from the second unit 502, that is, the connecting opening 510b of the second unit 502 may not be covered or filled with the auxiliary structure 520, thereby being able to better reduce the preparation steps of the display panel 10 and improve the preparation efficiency of the display panel 10.

[0172] Figure 3 It is a partial cross-sectional view of a display panel 10 provided in another embodiment of the present application.

[0173] like Figure 3 As shown, in some other optional embodiments, at least one auxiliary structure 520 may also be arranged to cover or fill the communication opening 510 b of the second unit 502 .

[0174] Optionally, the preparation step of the auxiliary structure 520 for covering or filling the connecting opening 510b of the second unit 502 may be located before the step of full-surface evaporation of the material of the light-emitting unit 420 and the second electrode 430 in the third type device 403 and the step of full-surface evaporation of the material of the third unit 503, and after the step of preparing the first type device 401 and the first unit 501.

[0175] In these optional embodiments, by setting at least one auxiliary structure 520 to cover or fill the connecting opening 510b of the second unit 502, in the process of removing the material of the packaging unit 510 outside the third opening 301c, the material of the second electrode 430 of the third type device 403 and the material of the light-emitting unit 420 of the third type device 403 to form the third unit 503 and the third type device 403, the auxiliary structure 520 set to cover or fill the connecting opening 510b of the second unit 502 can better limit the etching material from entering the gap space 510a of the second unit 502, so that the etching material is not easy to gather in the gap space 510a of the second unit 502, thereby better improving the structural reliability of the second unit 502 and the packaging effect of the second unit 502 on the second type device 402.

[0176] like Figure 2 and Figure 3 As shown, in some optional embodiments, the auxiliary structure 520 may be spaced apart from the third unit 503, that is, the connecting opening 510b of the third unit 503 may not be covered or filled with the auxiliary structure 520, thereby being able to better reduce the preparation steps of the display panel 10 and improve the preparation efficiency of the display panel 10.

[0177] Figure 4 It is a partial cross-sectional view of a display panel 10 provided in yet another embodiment of the present application.

[0178] like Figure 4 As shown, in some other optional embodiments, at least one auxiliary structure 520 is provided to cover or fill the communication opening 510 b of the third unit 503 .

[0179] Optionally, the step of preparing the auxiliary structure 520 that covers or fills the communication opening 510 b of the third unit 503 may be located after the step of preparing the third type device 403 and the third unit 503 .

[0180] In these optional embodiments, by setting at least one auxiliary structure 520 to cover or fill the communication opening 510b of the third unit 503, the auxiliary structure 520 that covers or fills the communication opening 510b of the third unit 503 can better limit the etching material from entering the gap space 510a of the third unit 503, so that the etching material is not easy to gather in the gap space 510a of the third unit 503, thereby better improving the structural reliability of the third unit 503 and the packaging effect of the third unit 503 on the third type device 403. In addition, the auxiliary structure 520 above the third unit 503 can play a better flattening role, so as to facilitate the preparation of subsequent film layers.

[0181] Figure 5 It is a partial cross-sectional view of a display panel 10 provided in yet another embodiment of the present application.

[0182] like Figure 5 As shown, in some optional embodiments, the display panel 10 further includes a second encapsulation layer 600 disposed on a side of the first encapsulation layer 500 away from the substrate 100 , so as to better improve the encapsulation effect of the display panel 10 .

[0183] Optionally, the material of the second encapsulation layer 600 may include an organic material, so that during the preparation process of the display panel 10, the second encapsulation layer 600 may have good fluidity, so that the surface of the second encapsulation layer 600 facing away from the substrate 100 may have good flatness, which can facilitate the formation of subsequent film layers. Exemplarily, the second encapsulation layer 600 may be prepared by inkjet printing technology (Inkjet Printing, IJP).

[0184] Optionally, the encapsulation layer may further include a third encapsulation layer 700 located on the side of the second encapsulation layer 600 away from the substrate 100, so as to better improve the encapsulation effect of the display panel 10. Optionally, the material of the third encapsulation layer 700 may include an inorganic material, so that the third encapsulation layer 700 can better reduce the influence of water vapor on the operation of the light-emitting device 400. Exemplarily, the third encapsulation layer 700 can be prepared by a chemical vapor deposition process.

[0185] The embodiment of the first aspect of the present application also provides a display panel 10, including: a substrate 100; an isolation structure 300, which is arranged on one side of the substrate 100 and encloses a plurality of isolation openings 301; a light-emitting device 400, wherein at least part of the structure of the light-emitting device 400 is located within the isolation opening 301; a first packaging layer 500, including a packaging unit 510 and a packaging auxiliary structure 520, wherein the packaging unit 510 is arranged on a side of the light-emitting device 400 that is away from the substrate 100, and the auxiliary structure 520 is arranged on a side of at least one packaging unit 510 that is away from the substrate 100, the packaging unit 510 has a first thickness, the auxiliary structure 520 has a second thickness, and the first thickness is different from the second thickness.

[0186] In a display panel 10 provided in an embodiment of the present application, the display panel 10 includes a substrate 100, an isolation structure 300, a light emitting device 400, and a first encapsulation layer 500. The isolation structure 300 is disposed on one side of the substrate 100 and encloses a plurality of isolation openings 301, at least part of the structure of the light emitting device 400 is located in the isolation opening 301, and the isolation structure 300 can be used to participate in dividing the sub-pixels of the display panel 10.

[0187] The first encapsulation layer 500 includes an encapsulation unit 510 disposed on the side of the light-emitting device 400 away from the substrate 100, and the encapsulation unit 510 can be used to encapsulate the light-emitting device 400. The first encapsulation layer 500 also includes an auxiliary structure 520 disposed on the side of at least one encapsulation unit 510 away from the substrate 100, and the auxiliary structure 520 can be used to protect the encapsulation unit 510 to improve the structural reliability of the encapsulation unit 510. The encapsulation unit 510 has a first thickness, and the auxiliary structure 520 has a second thickness. By setting the first thickness different from the second thickness, that is, by setting the thickness of the encapsulation unit 510 and the auxiliary structure 520 different, the thickness of the encapsulation unit 510 can be reasonably set to improve the encapsulation effect of the encapsulation unit 510, and the thickness of the auxiliary structure 520 can also be reasonably set to facilitate the patterning of the auxiliary structure 520, thereby better improving the encapsulation effect and preparation efficiency of the display panel 10.

[0188] Optionally, a display panel 10 provided in an embodiment of the first aspect of the present application may be the display panel 10 in any of the aforementioned embodiments. Therefore, a display panel 10 provided in an embodiment of the present application may have the structure and beneficial effects of the display panel 10 in any of the aforementioned embodiments, and the present application will not elaborate on it.

[0189] For example, the manufacturing method of the display panel 10 is set with reference to any of the foregoing embodiments. For example, the substrate 100 may be the substrate 100 in any of the foregoing embodiments. For example, the light-emitting device 400 may be the light-emitting device 400 in any of the foregoing embodiments, and the light-emitting device 400 may include the first electrode 410, the light-emitting unit 420 and the second electrode 430 in any of the foregoing embodiments. Exemplarily, the light-emitting device 400 may include the first type device 401, the second type device 402 and the third type device 403 in any of the foregoing embodiments. For example, the isolation structure 300 may be the isolation structure 300 in any of the foregoing embodiments, the isolation structure 300 may enclose and form the isolation opening 301 in any of the foregoing embodiments, and the isolation structure 300 may include the first isolation portion 310, the second isolation portion 320 and the conductive portion 330 in any of the foregoing embodiments. For example, the encapsulation unit 510 may be the encapsulation unit 510 in any of the foregoing embodiments, and the encapsulation unit 510 may include the encapsulation unit 510 in any of the foregoing embodiments. Exemplarily, the encapsulation unit 510 may include the first unit 501, the second unit 502 and the third unit 503 in any of the foregoing embodiments. For example, the auxiliary structure 520 may be the auxiliary structure 520 in any of the aforementioned embodiments, and the setting position and preparation steps of the auxiliary structure 520 may be set with reference to any of the aforementioned embodiments.

[0190] Figure 6 is a schematic flow chart of a method for preparing a display panel 10 provided in an embodiment of the present application. Figures 7 to 16 It is a schematic diagram of a preparation process of a method for preparing a display panel 10 provided in an embodiment of the present application.

[0191] The second aspect of the present application provides a method for preparing a display panel 10. The display panel 10 prepared by the preparation method may be the display panel 10 provided by any of the first aspect embodiments described above. Figure 6 Combined with Figures 1 to 5 as well as Figures 7 to 16 , the preparation method comprises:

[0192] Step S10: Figures 7 to 9 As shown, an isolation material layer 12 is formed on a substrate 100 .

[0193] Optionally, the isolation material layer 12 may be used to form the isolation structure 300 in any of the aforementioned embodiments.

[0194] Optionally, in the direction away from the substrate 100, the isolation material layer 12 may include a first isolation material layer 12a, a second isolation material layer 12b and a third isolation material layer 12c stacked in sequence, wherein the first isolation material layer 12a, the second isolation material layer 12b and the third isolation material layer 12c may be used to form the conductive part 330, the first isolation part 310 and the second isolation part 320 in any of the aforementioned embodiments, respectively.

[0195] Step S20: Fig.10 As shown, the isolation material layer 12 is patterned to form a first opening 301 a.

[0196] Step S30: Fig.11 As shown, the first device material Q1, the first packaging material C1 and the first auxiliary material F1 are prepared in sequence on the entire surface.

[0197] Optionally, the first device material Q1 may include a first type of light-emitting material Q11 and a first conductive material Q12 located on a side of the first type of light-emitting material Q11 away from the substrate 100. The first type of light-emitting material Q11, the first conductive material Q12, the first packaging material C1 and the first auxiliary material F1 may be used to participate in forming the light-emitting unit 420 of the first type of device 401, the second electrode 430 of the first type of device 401, the first unit 501 and the auxiliary structure 520 above the first unit 501 in any of the aforementioned embodiments.

[0198] Step S40: Fig.12 As shown, part of the first auxiliary material F1, part of the first packaging material C1 and part of the first device material Q1 outside the first opening 301a are removed in sequence to form an auxiliary structure 520, a first unit 501 and a first type of device 401 in sequence, the first unit 501 is arranged on the side of the first type of device 401 away from the substrate 100, and the auxiliary structure 520 is arranged on the side of the first unit 501 away from the substrate 100, wherein the auxiliary structure 520 has a different density from the first unit 501, and / or the first unit 501 has a first sub-thickness, the auxiliary structure 520 has a second thickness, and the first sub-thickness is different from the second thickness.

[0199] Optionally, the first auxiliary material F1 and the first packaging material C1 have different densities, so as to form the auxiliary structure 520 and the first unit 501 with different densities.

[0200] Optionally, the first packaging material C1 has a first material thickness, the first auxiliary material F1 has a second material thickness, and the first material thickness is different from the second material thickness, so as to form a first unit 501 and an auxiliary structure 520 above the first unit 501 with different thicknesses.

[0201] In the preparation method provided in the embodiment of the present application, by setting the auxiliary structure 520 on the first unit 501, in the subsequent preparation process, the auxiliary structure 520 on the first unit 501 can be used to protect the first unit 501 and improve the structural reliability of the first unit 501. When the density of the first unit 501 and the auxiliary structure 520 on the first unit 501 are different, the density of the first unit 501 can be reasonably set to improve the packaging effect of the first unit 501, and the density of the auxiliary structure 520 on the first unit 501 can also be reasonably set to facilitate the patterning of the auxiliary structure 520 on the first unit 501 (for example, affected by the density relationship between the first unit 501 and the auxiliary structure 520 above the first unit 501, in step S40, the etching rate of the etching material on the auxiliary structure 520 above the first unit 501 is likely to be greater than the etching rate of the etching material on the first unit 501), thereby better improving the packaging effect and preparation efficiency of the display panel 10.

[0202] When the thickness of the first unit 501 and the auxiliary structure 520 on the first unit 501 are different, the packaging effect of the first unit 501 can be improved by reasonably setting the thickness of the first unit 501, and the patterning of the auxiliary structure 520 on the first unit 501 can be facilitated by reasonably setting the thickness of the auxiliary structure 520 on the first unit 501, thereby better improving the packaging effect and preparation efficiency of the display panel 10.

[0203] In some optional embodiments, before step S10, the following may be included:

[0204] like Figure 7 As shown, a plurality of first electrodes 410 spaced apart are formed on the substrate 100;

[0205] like Figure 8 As shown, a pixel definition material layer 11 is formed on a substrate 100 .

[0206] In this optional embodiment, the pixel definition material layer 11 may be used to participate in forming the pixel definition layer 200 described in any of the aforementioned embodiments.

[0207] Optionally, step S20 may include: patterning the pixel definition material layer 11 to form a pixel opening 220 communicating with the first opening 301 a .

[0208] In some optional embodiments, the first unit 501 may enclose a gap space 510 a , and a side of the gap space 510 a facing away from the substrate 100 has a communication opening 510 b , and the auxiliary structure 520 is arranged to cover or fill the communication opening 510 b of the first unit 501 .

[0209] In this optional embodiment, by setting the auxiliary structure 520 to cover or fill the connecting opening 510b of the first unit 501, during the preparation process of the display panel 10, the auxiliary structure 520 above the first unit 501 can better limit the etching material from flowing into the gap space 510a of the first unit 501, thereby better reducing the risk of etching material aggregation, better improving the structural reliability of the first unit 501, and further better improving the packaging effect of the first unit 501 on the display panel 10.

[0210] In some optional embodiments, the preparation method further includes: patterning the isolation material layer 12 to form a second opening 301 b.

[0211] Optionally, the step of patterning the isolation material layer 12 to form the second opening 301b may be located in the step of patterning the isolation material layer 12 to form the first opening 301a, that is, the step of patterning the isolation material layer 12 to form the second opening 301b may be located in step S20, so as to better improve the preparation efficiency of the display panel 10.

[0212] Optionally, step S20 may include: patterning the pixel definition material layer 11 to form a pixel opening 220 communicating with the second opening 301 b .

[0213] In some optional embodiments, after step S40, the following steps may be further included:

[0214] Step S50: Fig.13 As shown, the second device material Q2 and the second packaging material C2 are prepared sequentially on the entire surface.

[0215] Optionally, the second device material Q2 may include a second type of light-emitting material Q21 and a second conductive material Q22 located on a side of the second type of light-emitting material Q21 away from the substrate 100. The second type of light-emitting material Q21, the second conductive material Q22, and the second packaging material C2 may be used to participate in forming the light-emitting unit 420, the second electrode 430, and the second unit 502 of the second type of device 402 in any of the aforementioned embodiments.

[0216] Step S60: Fig.14 As shown, part of the second packaging material C2 and part of the second device material Q2 outside the second opening 301 b are removed in sequence to form a second unit 502 and a second type device 402 in sequence. The second unit 502 is disposed on a side of the second type device 402 facing away from the substrate 100 .

[0217] In some embodiments of the present application, the auxiliary structure 520 disposed above the first unit 501 can be used to protect the first unit 501 in step S60. The auxiliary structure 520 above the first unit 501 can better limit the etching material from flowing into the gap space 510a of the first unit 501, thereby better reducing the risk of etching material aggregation, better improving the structural reliability of the first unit 501, and further better improving the packaging effect of the first unit 501 on the display panel 10.

[0218] In some optional embodiments, step S50 further includes: preparing a second auxiliary material F2 on the entire surface of the second packaging material C2.

[0219] Optionally, the second auxiliary material F2 may be used to form an auxiliary structure 520 above the second unit 502 in any of the aforementioned embodiments.

[0220] In step S60: part of the second auxiliary material F2, part of the second packaging material C2 and part of the second device material Q2 outside the second opening 301b are removed in sequence to form an auxiliary structure 520, a second unit 502 and a second type of device 402 in sequence, the second unit 502 is arranged on the side of the second type of device 402 away from the substrate 100, and the auxiliary structure 520 is arranged on the side of the second unit 502 away from the substrate 100, wherein the auxiliary structure 520 has a different density from the second unit 502, and / or the second unit 502 has a second sub-thickness, the auxiliary structure 520 has a second thickness, and the second sub-thickness is different from the second thickness.

[0221] Optionally, the second auxiliary material F2 and the second packaging material C2 have different densities, so as to form the auxiliary structure 520 and the second unit 502 with different densities.

[0222] Optionally, the second packaging material C2 has a third material thickness, the second auxiliary material F2 has a fourth material thickness, and the third material thickness is different from the fourth material thickness, so as to form a second unit 502 with different thicknesses and an auxiliary structure 520 above the second unit 502 .

[0223] In these optional embodiments, by setting the auxiliary structure 520 on the second unit 502, in the subsequent preparation process, the auxiliary structure 520 on the second unit 502 can be used to protect the second unit 502 and improve the structural reliability of the second unit 502. When the density of the second unit 502 and the auxiliary structure 520 on the second unit 502 are different, the density of the second unit 502 can be reasonably set to improve the packaging effect of the second unit 502, and the density of the auxiliary structure 520 on the second unit 502 can also be reasonably set to facilitate the patterning of the auxiliary structure 520 on the second unit 502 (for example, affected by the density relationship between the second unit 502 and the auxiliary structure 520 above the second unit 502, in step S60, the etching rate of the etching material on the auxiliary structure 520 above the second unit 502 is likely to be greater than the etching rate of the etching material on the second unit 502), thereby better improving the packaging effect and preparation efficiency of the display panel 10.

[0224] When the thickness of the second unit 502 and the auxiliary structure 520 on the second unit 502 are different, the packaging effect of the second unit 502 can be improved by reasonably setting the thickness of the second unit 502, and the patterning of the auxiliary structure 520 on the second unit 502 can be facilitated by reasonably setting the thickness of the auxiliary structure 520 on the second unit 502, thereby better improving the packaging effect and preparation efficiency of the display panel 10.

[0225] In some optional embodiments, the second unit 502 may enclose a gap space 510 a , and a side of the gap space 510 a facing away from the substrate 100 has a communication opening 510 b , and the auxiliary structure 520 is arranged to cover or fill the communication opening 510 b of the second unit 502 .

[0226] In this optional embodiment, by setting the auxiliary structure 520 to cover or fill the connecting opening 510b of the second unit 502, during the preparation process of the display panel 10, the auxiliary structure 520 above the second unit 502 can better limit the etching material from flowing into the gap space 510a of the second unit 502, thereby better reducing the risk of etching material aggregation, better improving the structural reliability of the second unit 502, and further better improving the packaging effect of the second unit 502 on the display panel 10.

[0227] In some optional embodiments, the preparation method further includes: patterning the isolation material layer 12 to form a third opening 301c.

[0228] Optional, such as Fig.10As shown, the step of patterning the isolation material layer 12 to form the third opening 301c may be located in the step of patterning the isolation material layer 12 to form the first opening 301a and / or the second opening 301b. For example, the step of patterning the isolation material layer 12 to form the third opening 301c may be located in step S20, so as to better improve the preparation efficiency of the display panel 10.

[0229] Alternatively, the step of patterning the isolation material layer 12 to form the third opening 301c may be located after the step of patterning the isolation material layer 12 to form the first opening 301a and / or the second opening 301b. For example, the step of patterning the isolation material layer 12 to form the third opening 301c may be located after step S60.

[0230] For the convenience of description, the following embodiments are described by taking the step of patterning the isolation material layer 12 to form the third opening 301 c as an example which can be located in step S20 .

[0231] Optionally, step S20 may include: patterning the pixel definition material layer 11 to form a pixel opening 220 communicating with the third opening 301 c .

[0232] In some optional embodiments, after step S60, the following steps are further included:

[0233] Step S70: Fig.15 As shown, the third device material Q3 and the third packaging material C3 are prepared sequentially on the entire surface.

[0234] Optionally, the third device material Q3 may include a third type of light-emitting material Q31 and a third conductive material Q32 located on a side of the third type of light-emitting material Q31 away from the substrate 100. The third type of light-emitting material Q31, the third conductive material Q32, and the third packaging material C3 may be used to participate in forming the light-emitting unit 420 of the third type of device 403, the second electrode 430 of the third type of device 403, and the third unit 503 in any of the aforementioned embodiments.

[0235] Step S80: Fig.16 As shown, part of the third packaging material C3 and part of the third device material Q3 outside the third opening 301 c are removed in sequence to form a third unit 503 and a third type device 403 in sequence. The third unit 503 is arranged on a side of the third type device 403 away from the substrate 100 .

[0236] In some embodiments of the present application, the auxiliary structure 520 disposed above the first unit 501 can be used to protect the first unit 501 in step S80, and the auxiliary structure 520 disposed above the second unit 502 can be used to protect the second unit 502 in step S80. The auxiliary structure 520 above the first unit 501 and the second unit 502 can better limit the etching material from flowing into the gap space 510a between the first unit 501 and the second unit 502, thereby better reducing the risk of etching material aggregation, better improving the structural reliability of the first unit 501 and the second unit 502, and further better improving the packaging effect of the first unit 501 and the second unit 502 on the display panel 10.

[0237] In some optional embodiments, step S70 further includes: preparing a third auxiliary material F3 entirely on the third packaging material C3.

[0238] Optionally, the third auxiliary material F3 may be used to form an auxiliary structure 520 above the third unit 503 in any of the aforementioned embodiments.

[0239] In step S80: part of the third auxiliary material F3, part of the third packaging material C3 and part of the third device material Q3 outside the third opening 301c are removed in sequence to form an auxiliary structure 520, a third unit 503 and a third type of device 403 in sequence, the third unit 503 is arranged on the side of the third type of device 403 away from the substrate 100, and the auxiliary structure 520 is arranged on the side of the third unit 503 away from the substrate 100, wherein the auxiliary structure 520 has a different density from the third unit 503, and / or the third unit 503 has a third sub-thickness, the auxiliary structure 520 has a second thickness, and the third sub-thickness is different from the second thickness.

[0240] Optionally, the third auxiliary material F3 and the third packaging material C3 have different densities, so as to form the auxiliary structure 520 and the third unit 503 with different densities.

[0241] Optionally, the third packaging material C3 has a fifth material thickness, the third auxiliary material F3 has a sixth material thickness, and the fifth material thickness is different from the sixth material thickness, so as to form a third unit 503 with different thicknesses and an auxiliary structure 520 above the third unit 503 .

[0242] In these optional embodiments, by providing the auxiliary structure 520 on the third unit 503, the auxiliary structure 520 on the third unit 503 can be used to protect the third unit 503 in the subsequent preparation process, thereby improving the structural reliability of the third unit 503. In addition, the auxiliary structure 520 above the third unit 503 can also play a better flattening role, so as to facilitate the preparation of subsequent film layers.

[0243] Among them, when the density of the third unit 503 and the auxiliary structure 520 on the third unit 503 are different, the density of the third unit 503 can be reasonably set to improve the packaging effect of the third unit 503, and the density of the auxiliary structure 520 on the third unit 503 can also be reasonably set to facilitate the patterning of the auxiliary structure 520 on the third unit 503 (for example, affected by the density relationship between the third unit 503 and the auxiliary structure 520 above the third unit 503, in step S80, the etching rate of the etching material on the auxiliary structure 520 above the third unit 503 is likely to be greater than the etching rate of the etching material on the third unit 503), thereby better improving the packaging effect and preparation efficiency of the display panel 10.

[0244] When the thickness of the third unit 503 and the auxiliary structure 520 on the third unit 503 are different, the packaging effect of the third unit 503 can be improved by reasonably setting the thickness of the third unit 503, and the patterning of the auxiliary structure 520 on the third unit 503 can also be facilitated by reasonably setting the thickness of the auxiliary structure 520 on the third unit 503, thereby better improving the packaging effect and preparation efficiency of the display panel 10.

[0245] In some optional embodiments, the third unit 503 may enclose a gap space 510 a , and a side of the gap space 510 a facing away from the substrate 100 has a communication opening 510 b , and the auxiliary structure 520 is arranged to cover or fill the communication opening 510 b of the third unit 503 .

[0246] In this optional embodiment, by setting the auxiliary structure 520 to cover or fill the communication opening 510b of the third unit 503, during the preparation of the display panel 10, the auxiliary structure 520 above the third unit 503 can better limit the etching material from flowing into the gap space 510a of the third unit 503, thereby better reducing the risk of etching material aggregation, better improving the structural reliability of the third unit 503, and further better improving the packaging effect of the third unit 503 on the display panel 10. In addition, the auxiliary structure 520 above the third unit 503 can also play a better flattening role, so as to facilitate the preparation of subsequent film layers.

[0247] The embodiment of the third aspect of the present application provides a display device, which includes the display panel 10 of any of the above-mentioned embodiments, or includes the display panel 10 prepared by the preparation method of any of the above-mentioned embodiments. Since the display device provided by the embodiment of the third aspect of the present application includes the display panel 10 of any of the above-mentioned first aspect, or includes the display panel 10 prepared by the preparation method of any of the above-mentioned second aspect. Therefore, the display device provided by the embodiment of the third aspect of the present application has the beneficial effects of the display panel 10 of any of the above-mentioned first aspect or the display panel 10 prepared by the preparation method of any of the above-mentioned second aspect, which will not be repeated here.

[0248] The display device in the embodiments of the present application includes but is not limited to mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, consoles, and other devices with display functions.

[0249] Patent applications PCT / CN2023 / 134518, 202310759370.2, 202310740412.8, 202310707209.0, and 202311346196.5 record relevant technical solutions for isolation structures, and their contents are incorporated into this application by reference for reference.

[0250] According to the embodiments of the present application as above, these embodiments do not describe all the details in detail, nor do they limit the invention to specific embodiments. Obviously, many modifications and changes can be made based on the above description. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present application, so that those skilled in the art can make good use of the present application and the modifications based on the present application. The present application is only limited by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized in that: include: substrate; An isolation structure is disposed on one side of the substrate and encloses a plurality of isolation openings; a light emitting device, at least a portion of the structure of the light emitting device being located in the isolation opening; The first packaging layer includes packaging units with different densities and packaging auxiliary structures. The packaging units are arranged on a side of the light-emitting device away from the substrate, and the auxiliary structure is arranged on a side of at least one of the packaging units away from the substrate.

2. The display panel according to claim 1, characterized in that: The density of the auxiliary structure is less than the density of the packaging unit; Preferably, the orthographic projection of the auxiliary structure on the substrate is located within the orthographic projection of the packaging unit on the substrate; Preferably, the auxiliary structure and the packaging unit are made of the same material; Preferably, the material of the packaging unit includes an inorganic material, and / or the material of the auxiliary structure includes an inorganic material; Preferably, the material of the packaging unit includes at least one of silicon oxide, silicon nitride and silicon oxynitride, and / or the material of the auxiliary structure includes at least one of silicon oxide, silicon nitride and silicon oxynitride.

3. The display panel according to claim 1, characterized in that: The packaging unit has a first thickness, the auxiliary structure has a second thickness, and the first thickness is different from the second thickness; Preferably, the first thickness is the maximum thickness of the packaging unit, and the second thickness is the maximum thickness of the auxiliary structure, or the first thickness is the average thickness of the packaging unit, and the second thickness is the average thickness of the auxiliary structure.

4. The display panel according to claim 3, characterized in that: The first thickness is greater than the second thickness; Preferably, the ratio of the second thickness to the first thickness is not less than 7 / 93, and / or the ratio of the second thickness to the first thickness is not greater than 13 / 87.

5. The display panel according to any one of claims 1 to 4, characterized in that: The packaging units are enclosed to form a gap space, and a side of the gap space facing away from the substrate has a communication opening, and the auxiliary structure covers or fills the communication opening of at least one of the packaging units.

6. The display panel according to claim 5, characterized in that: The packaging unit comprises a first packaging part and a second packaging part connected to each other, the first packaging part covers a side of the light-emitting device away from the substrate, the second packaging part covers a side of the isolation structure facing the isolation opening, and the first packaging part and the second packaging part enclose the gap space; Preferably, the isolation structure comprises a first isolation portion and a second isolation portion located on a side of the first isolation portion away from the substrate, and the second isolation portion is arranged to protrude from the first isolation portion toward the isolation opening; Preferably, the second packaging part includes a first sub-part covering the first isolation part on the side facing the isolation opening and a second sub-part covering the second isolation part on the side facing the isolation opening, the first packaging part is connected to the first sub-part, and the first packaging part is spaced apart from at least part of the second sub-part to form the connecting opening.

7. The display panel according to claim 6, characterized in that: At least part of the auxiliary structure is located on a side of the first packaging portion away from the substrate, and / or at least part of the auxiliary structure is located on a side of the second packaging portion away from the isolation structure; Preferably, the packaging unit further comprises a third packaging portion located on a side of the isolation structure away from the substrate, and a part of the auxiliary structure is located on a side of the third packaging portion away from the isolation structure; Preferably, the third packaging portion is spaced apart from the isolation structure.

8. The display panel according to claim 5, characterized in that: The isolation opening includes a first opening and a second opening, the light emitting device includes a first type of device corresponding to the first opening and a second type of device corresponding to the second opening, the light emitting colors of the first type of device and the second type of device are different, the packaging unit includes a first unit arranged on a side of the first type of device away from the substrate and a second unit arranged on a side of the second type of device away from the substrate, and at least one of the auxiliary structures covers or fills the connecting opening of the first unit; Preferably, the auxiliary structure is spaced apart from the second unit, or at least one of the auxiliary structures covers or fills the communicating opening of the second unit.

9. The display panel according to claim 8, characterized in that: The isolation opening also includes a third opening, the light-emitting device also includes a third type of device arranged corresponding to the third opening, the light-emitting colors of the first type of device, the second type of device and the third type of device are different from each other, the packaging unit includes a third unit arranged on the side of the third type of device away from the substrate, the auxiliary structure is spaced apart from the third unit, or at least one of the auxiliary structures covers or fills the connecting opening of the third unit.

10. A display panel, characterized in that: include: substrate; An isolation structure is disposed on one side of the substrate and encloses a plurality of isolation openings; a light emitting device, at least a portion of the structure of the light emitting device being located in the isolation opening; The first packaging layer includes a packaging unit and a packaging auxiliary structure, wherein the packaging unit is arranged on a side of the light-emitting device away from the substrate, and the auxiliary structure is arranged on a side of at least one of the packaging units away from the substrate, the packaging unit has a first thickness, and the auxiliary structure has a second thickness, and the first thickness is different from the second thickness.

11. The display panel according to claim 10, characterized in that: The first thickness is greater than the second thickness; Preferably, the ratio of the second thickness to the first thickness is not less than 7 / 93, and / or the ratio of the second thickness to the first thickness is not greater than 13 / 87; Preferably, the first thickness is the maximum thickness of the packaging unit, and the second thickness is the maximum thickness of the auxiliary structure, or the first thickness is the average thickness of the packaging unit, and the second thickness is the average thickness of the auxiliary structure.

12. The display panel according to any one of claims 10 or 11, characterized in that: The packaging units are enclosed to form a gap space, and a side of the gap space facing away from the substrate has a communication opening, and the auxiliary structure covers or fills the communication opening of at least one of the packaging units.

13. The display panel according to claim 12, characterized in that: The packaging unit comprises a first packaging part and a second packaging part connected to each other, the first packaging part covers a side of the light-emitting device away from the substrate, the second packaging part covers a side of the isolation structure facing the isolation opening, and the first packaging part and the second packaging part enclose the gap space; Preferably, the isolation structure comprises a first isolation portion and a second isolation portion located on a side of the first isolation portion away from the substrate, and the second isolation portion is arranged to protrude from the first isolation portion toward the isolation opening; Preferably, the second packaging part includes a first sub-part covering the first isolation part on the side facing the isolation opening and a second sub-part covering the second isolation part on the side facing the isolation opening, the first packaging part is connected to the first sub-part, and the first packaging part is spaced apart from at least part of the second sub-part to form the connecting opening.

14. The display panel according to claim 13, characterized in that: At least part of the auxiliary structure is located on a side of the first packaging portion away from the substrate, and / or at least part of the auxiliary structure is located on a side of the second packaging portion away from the isolation structure; Preferably, the packaging unit further comprises a third packaging portion located on a side of the isolation structure away from the substrate, and a part of the auxiliary structure is located on a side of the third packaging portion away from the isolation structure; Preferably, the third packaging portion is spaced apart from the isolation structure.

15. The display panel according to claim 12, characterized in that: The isolation opening includes a first opening and a second opening, the light emitting device includes a first type of device corresponding to the first opening and a second type of device corresponding to the second opening, the light emitting colors of the first type of device and the second type of device are different, the packaging unit includes a first unit arranged on a side of the first type of device away from the substrate and a second unit arranged on a side of the second type of device away from the substrate, and at least one of the auxiliary structures covers or fills the connecting opening of the first unit; Preferably, the auxiliary structure is spaced apart from the second unit, or at least one of the auxiliary structures covers or fills the communicating opening of the second unit.

16. The display panel according to claim 15, characterized in that: The isolation opening also includes a third opening, the light-emitting device also includes a third type of device arranged corresponding to the third opening, the light-emitting colors of the first type of device, the second type of device and the third type of device are different from each other, the packaging unit includes a third unit arranged on the side of the third type of device away from the substrate, the auxiliary structure is spaced apart from the third unit, or at least one of the auxiliary structures covers or fills the connecting opening of the third unit.

17. A method for preparing a display panel, characterized in that: include: forming an isolation material layer on the substrate; performing patterning on the isolation material layer to form a first opening; sequentially preparing a first device material, a first packaging material and a first auxiliary material on the entire surface; A portion of the first auxiliary material, a portion of the first packaging material, and a portion of the first device material outside the first opening are removed in sequence to form an auxiliary structure, a first unit, and a first type of device in sequence, wherein the first unit is disposed on a side of the first type of device away from the substrate, and the auxiliary structure is disposed on a side of the first unit away from the substrate. The auxiliary structure has a different density from that of the first unit, and / or the first unit has a first sub-thickness, the auxiliary structure has a second thickness, and the first sub-thickness is different from the second thickness.

18. The preparation method according to claim 17, characterized in that: The first units are enclosed to form a gap space, and a side of the gap space facing away from the substrate has a communication opening, and the auxiliary structure covers or fills the communication opening of the first unit.

19. The preparation method according to claim 17, characterized in that: The preparation method further comprises: performing patterning on the isolation material layer to form a second opening; After the step of sequentially removing part of the first auxiliary material, part of the first packaging material, and part of the first device material outside the first opening, the step further includes: sequentially preparing the second device material and the second packaging material on the entire surface; removing a portion of the second packaging material and a portion of the second device material outside the second opening in sequence to sequentially form a second unit and a second type of device, wherein the second unit is disposed on a side of the second type of device away from the substrate; Preferably, the step of sequentially preparing the second device material and the second packaging material on the entire surface further includes: preparing a second auxiliary material on the entire surface of the second packaging material; In the step of sequentially removing a portion of the second packaging material and a portion of the second device material outside the second opening: removing a portion of the second auxiliary material, a portion of the second packaging material, and a portion of the second device material outside the second opening in sequence to form an auxiliary structure, a second unit, and a second type of device in sequence, wherein the second unit is disposed on a side of the second type of device away from the substrate, and the auxiliary structure is disposed on a side of the second unit away from the substrate, The auxiliary structure has a different density from the second unit, and / or the second unit has a second sub-thickness, the auxiliary structure has a second thickness, and the second sub-thickness is different from the second thickness; Preferably, the second units are enclosed to form a gap space, and a side of the gap space facing away from the substrate has a communication opening, and the auxiliary structure is arranged to cover or fill the communication opening of the second unit.

20. The preparation method according to claim 19, characterized in that: The preparation method further comprises: performing patterning on the isolation material layer to form a third opening; After the step of sequentially removing a portion of the second packaging material and a portion of the second device material outside the second opening, the step further includes: sequentially preparing a third device material and a third packaging material on the entire surface; Sequentially removing a portion of the third packaging material and a portion of the third device material outside the third opening to sequentially form a third unit and a third type of device, wherein the third unit is disposed on a side of the third type of device away from the substrate; Preferably, the step of sequentially preparing the third device material and the third packaging material on the entire surface further includes: Preparing a third auxiliary material on the entire surface of the third packaging material; In the step of sequentially removing a portion of the third packaging material and a portion of the third device material outside the third opening: Part of the third auxiliary material, part of the third packaging material and part of the third device material outside the third opening are removed in sequence to form an auxiliary structure, a third unit and a third type of device in sequence, wherein the third unit is arranged on a side of the third type of device away from the substrate, and the auxiliary structure is arranged on a side of the third unit away from the substrate. The auxiliary structure has a different density from the third unit, and / or the third unit has a third sub-thickness, the auxiliary structure has a second thickness, and the third sub-thickness is different from the second thickness; Preferably, the third units are enclosed to form a gap space, and a side of the gap space facing away from the substrate has a communication opening, and the auxiliary structure is arranged to cover or fill the communication opening of the third unit.

21. A display device, characterized in that: A display panel comprising any one of claims 1 to 16, or a display panel prepared by the preparation method according to any one of claims 17 to 20.

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