Display module, display device and manufacturing method

Abstract

The invention discloses a display module, a display device and a manufacturing method. The display module of one embodiment comprises: a substrate comprising a first surface and a second surface arranged opposite to the first surface; the display screen is located on the first surface and comprises a display area, a non-display area at least surrounding the display area and a binding area located on the boundary of one side of the non-display area; the binding part is bound with the binding area; the driving chip is located on the binding part, and the binding part is folded to the second surface after being bound; the display module further comprises a stress buffer layer located between the second surface and the portion, close to the second surface, of the binding part, and the shear strain rate of the stress buffer layer and the impact force acting on the stress buffer layer are in a nonlinear relation, so that the risk that the driving chip breaks is reduced, and the reliability of the display module is improved. Therefore, the reliability of the display module is protected.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and more specifically, to a display module, a display device, and a manufacturing method thereof. Background Art

[0002] Display products equipped with display screens have become extremely popular in daily life. Various unexpected events in life test the reliability of mobile phones. For example, heavy objects fall on the surface of display products, causing surface cracks and abnormal display functions. Summary of the invention

[0003] An object of the present invention is to provide a display module, a display device and a manufacturing method to solve at least one of the problems existing in the prior art.

[0004] In order to achieve the above object, the present invention adopts the following technical solutions:

[0005] A first aspect of the present invention provides a display module, the display module comprising:

[0006] A substrate, comprising a first surface and a second surface arranged opposite to the first surface;

[0007] a display screen located on the first surface, the display screen comprising a display area, a non-display area at least surrounding the display area, and a binding area located at a side boundary of the non-display area;

[0008] a binding portion bound to the binding area; and

[0009] A driving chip is located on the binding portion, and the binding portion is folded to the second surface after binding;

[0010] The display module also includes:

[0011] A stress buffer layer is located between the second surface and the binding portion close to the second surface, and a shear strain rate of the stress buffer layer is in a nonlinear relationship with a magnitude of an impact force acting on the stress buffer layer.

[0012] In an optional embodiment, the stress buffer layer includes a first buffer layer, and as the impact force acting on the first buffer layer increases, the shear strain rate of the first buffer layer increases nonlinearly.

[0013] In an optional embodiment, the orthographic projection of the first buffer layer on the substrate covers the orthographic projection of the driving chip on the substrate.

[0014] In an optional embodiment, the stress buffer layer also includes a second buffer layer arranged between the first buffer layer and the binding portion near the second surface, the orthographic projection of the second buffer layer on the substrate at least covers a portion of the orthographic projection of the first buffer layer on the substrate, and as the impact force acting on the second buffer layer increases, the value of the shear strain rate of the second buffer layer decreases nonlinearly.

[0015] In an optional embodiment, the orthographic projection of the second buffer layer on the substrate covers the orthographic projection of the driving chip on the substrate.

[0016] In an optional embodiment, the stress buffer layer further includes a second adhesive layer disposed between the first buffer layer and the binding portion close to the second surface, and the orthographic projection of the second buffer layer on the substrate at least covers a portion of the orthographic projection of the first buffer layer on the substrate.

[0017] The second adhesive layer and the surface of the second buffer layer close to the first buffer layer are located on the same horizontal surface,

[0018] The second adhesive layer and a surface of the second buffer layer away from the first buffer layer are located on the same horizontal surface.

[0019] In an optional embodiment, the second buffer layer includes a first side wall disposed vertically and a second side wall opposite to the first side wall.

[0020] The second adhesive layer comprises:

[0021] a first bonding portion located on the first side wall in a direction away from the second buffer layer, and

[0022] The second bonding portion is located on the second side wall in a direction away from the second buffer layer.

[0023] In an optional embodiment, the display module also includes a third buffer layer, which covers the surface of the driving chip of the folded display module away from the display screen. As the impact force acting on the third buffer layer increases, the value of the shear strain rate of the third buffer layer decreases nonlinearly.

[0024] In an optional embodiment, the third buffer layer includes:

[0025] a first covering portion, a second covering portion connected to the first covering portion, and a third covering portion connected to the second covering portion,

[0026] One end of the first covering portion is fixed to the binding portion, and at least a portion of the surface of the first covering portion close to the folded driving chip is attached and fixed to the binding portion.

[0027] One end of the third covering portion is fixed to the binding portion, and at least a portion of the surface of the third covering portion on a side close to the folded driving chip is adhered and fixed to the binding portion.

[0028] In an optional embodiment, the display module further includes a heat dissipation layer and a first adhesive layer, wherein:

[0029] The heat dissipation layer is located between the second surface and a side surface of the first buffer layer close to the first surface;

[0030] The first adhesive layer is located between a surface of the heat dissipation layer away from the second surface and a surface of the first buffer layer close to the first surface.

[0031] A second aspect of the present invention provides a display device, comprising the light-emitting device described in the first aspect of the present invention.

[0032] A third aspect of the present invention provides a method for manufacturing the display module of the first aspect of the present invention, the manufacturing method comprising:

[0033] A display screen is formed on the first surface of the substrate, wherein the display screen includes a display area, a non-display area at least surrounding the display area, and a binding area located at a side boundary of the non-display area;

[0034] Binding the binding portion to the binding area;

[0035] forming a driving chip on the binding portion;

[0036] forming a stress buffer layer on a second surface of the substrate disposed opposite to the first surface;

[0037] The binding portion is folded to fix a surface of the binding portion away from the driving chip to a surface of the stress buffer layer away from the second surface, and the shear strain rate of the stress buffer layer is nonlinearly related to the magnitude of the impact force acting on the first buffer layer.

[0038] The beneficial effects of the present invention are as follows:

[0039] The embodiment of the present invention sets a stress buffer layer between the folded binding portion and the display screen, that is, sets a stress buffer layer between the driver chip of the folded display module and the display screen, and utilizes the nonlinear relationship between the shear strain rate and the impact force of the stress buffer layer to reduce the impact force from the entire surface of the display screen, thereby reducing the risk of the driver chip breaking, thereby protecting the reliability of the display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] The specific implementation modes of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0041] Figure 1 A schematic diagram showing a display module of the related art being impacted by a falling ball;

[0042] Figure 2 A schematic diagram showing the deformation of a driver chip of a display module in the related art;

[0043] Figure 3 A schematic diagram showing the structure of a display module according to an embodiment of the present invention;

[0044] Figure 4 Schematic diagram showing the curves of shear strain rate and shear stress for a shear thickening non-Newtonian fluid;

[0045] Figure 5 A schematic diagram showing the structure of a display module according to another embodiment of the present invention;

[0046] Figure 6 Schematic diagram showing the curves of shear strain rate and shear stress for a shear-thinning non-Newtonian fluid;

[0047] Figure 7 A schematic diagram showing the force of a display module of the related art;

[0048] Figure 8 A schematic diagram showing the structure of a display module according to another embodiment of the present invention;

[0049] Fig. 9 A schematic diagram showing the deformation of a driver chip in the related art;

[0050] Fig.10 A schematic diagram showing the deformation of a driver chip according to an embodiment of the present invention;

[0051] Fig.11 A schematic diagram showing the force acting on a driving chip of a display module in the related art. DETAILED DESCRIPTION

[0052] In order to more clearly illustrate the present invention, the present invention is further described below in conjunction with the embodiments and the accompanying drawings. Similar components in the accompanying drawings are represented by the same reference numerals. It should be understood by those skilled in the art that the content specifically described below is illustrative rather than restrictive, and the protection scope of the present invention should not be limited thereto.

[0053] Various unexpected events in life test the reliability of mobile phones. For example, heavy objects falling on the surface of display products may cause surface cracks and display function abnormalities.

[0054] Taking a mobile phone as an example, no matter a heavy object hits the front or back of the phone, the driver chip of the display product will be subjected to a great impact from the front or back. The OLED display module 1 is often subjected to a severe reliability test, such as Figure 1 and Figure 2 As shown in FIG. 1 , when the OLED display module 1 is impacted by a falling ball, and as the height of the falling ball gradually increases, the impact energy also increases. After the impact energy is transmitted to the driver chip 40, the driver chip 40 is Figure 2 As shown in the figure, deformation occurs, and the point where the driver chip 40 has the maximum strain is also the point where the driver chip 40 is subjected to the maximum stress. The damage of the driver chip 40 also occurs near this point. When the impact energy transmitted to the driver chip 40 also increases to the limit that the driver chip 40 can withstand, or when the strength of the driver chip 40 itself is insufficient or the protection is insufficient, the surface of the driver chip 40 and even the inner circuit will be damaged, resulting in the display product being unable to display.

[0055] In view of this, the present invention provides a display module, a display device and a manufacturing method to solve the above problems.

[0056] The first embodiment of the present invention provides a display module 1, such as Figure 3 As shown, the display module 1 includes:

[0057] A substrate 10, comprising a first surface 11 and a second surface 12 arranged opposite to the first surface 11;

[0058] A display screen 20 located on the first surface 11, the display screen 20 comprising a display area AA, a non-display area NA at least surrounding the display area AA, and a binding area BD located at one side boundary of the non-display area NA;

[0059] a binding portion 30 bound to the binding area BD; and

[0060] A driving chip 40 is located on the binding portion 30 , and the binding portion 30 is folded to the second surface 12 after binding;

[0061] The display module 1 further includes:

[0062] The stress buffer layer 50 is located between the second surface 12 and the binding portion 30 close to the second surface 12 , and the shear strain rate of the stress buffer layer 50 is in a nonlinear relationship with the magnitude of the impact force acting on the stress buffer layer 50 .

[0063] The embodiment of the present invention sets a stress buffer layer 50 between the folded binding portion 30 and the display screen 20, that is, sets a stress buffer layer 50 between the driver chip 40 of the folded display module 1 and the display screen 20, and utilizes the nonlinear relationship between the shear strain rate and the impact force of the stress buffer layer 50 to reduce the impact force from the entire surface of the display screen 20, thereby reducing the risk of the driver chip 40 being broken, thereby protecting the reliability of the display module 1.

[0064] In an optional embodiment, the stress buffer layer 50 includes a first buffer layer 51, such as Figure 4 As shown, as the impact force acting on the first buffer layer 51 increases, the shear strain rate of the first buffer layer 51 increases nonlinearly.

[0065] In this embodiment, the first buffer layer 51 has a rheological property that the viscosity increases with the increase of the shear strain rate, and the fluidity of the first buffer layer 51 decreases with the increase of the impact force. Exemplarily, the material of the first buffer layer 51 is a shear-thickening non-Newtonian fluid. When the shear-thickening non-Newtonian fluid is subjected to a large impact, the shear strain rate will increase rapidly, and the shear stress ratio will be significantly larger than that of the Newtonian fluid, so that the first buffer layer 51 applied to the shear-thickening non-Newtonian fluid becomes harder and can better resist external impacts, thereby reducing the risk of the driver chip 40 being broken due to the impact force from the light-emitting surface of the display screen 20.

[0066] In an optional embodiment, the orthographic projection of the first buffer layer 51 on the substrate 10 covers the orthographic projection of the driving chip 40 on the substrate 10 .

[0067] That is, the projection area of ​​the first buffer layer 51 of this embodiment is larger than the projection area of ​​the driving chip 40 , and the first buffer layer 51 is disposed at a position corresponding to the driving chip 40 , so as to effectively protect the driving chip 40 by the first buffer layer 51 .

[0068] In an optional embodiment, if Figure 5 As shown, the stress buffer layer 50 also includes a second buffer layer 52 arranged between the first buffer layer 51 and the binding portion 30 near the second surface 12, and the orthographic projection of the second buffer layer 52 on the substrate 10 at least covers a portion of the orthographic projection of the first buffer layer 51 on the substrate 10. As the impact force acting on the second buffer layer 52 increases, the value of the shear strain rate of the second buffer layer 52 decreases nonlinearly.

[0069] In this embodiment, Figure 6 As shown, the second buffer layer 52 has a rheological property that the viscosity decreases with the increase of the shear strain rate, and the fluidity of the first buffer layer 51 increases with the increase of the impact force. Exemplarily, the material of the second buffer layer 52 is a shear-thinning non-Newtonian fluid. The shear-thinning non-Newtonian fluid is opposite to the shear-thickening non-Newtonian fluid. The shear-thinning non-Newtonian fluid will undergo a large deformation when subjected to a small impact, and the shear strain rate increases slowly, so that the second buffer layer 52 applied to the shear-thinning non-Newtonian fluid becomes softer and has better buffering performance.

[0070] The embodiment of the present invention provides a double buffer layer structure of a first buffer layer 51 and a second buffer layer 52. The first buffer layer 51 is provided on the light emitting surface side close to the display screen 20, and the second buffer layer 52 is provided on the side of the first buffer layer 51 close to the driving chip 40. Moreover, with respect to the changing relationship between the shear strain rate and the impact force, the changing relationship of the first buffer layer 51 is opposite to the changing relationship of the second buffer layer 52.

[0071] like Figure 7 As shown, through the structural setting of the double-layer buffer layer, the first buffer layer 51 has a better hardness characteristic when impacted, so as to better resist the impact force of the point impact from the light-emitting surface of the display screen 20. The first buffer layer 51 converts the impact force of the point impact into a dispersed and weakened surface impact force after its own buffering, and transmits the dispersed surface impact force to the second buffer layer 52.

[0072] like Figure 7 As shown, when the second buffer layer 52 is subjected to the impact force of the surface impact transmitted from the first buffer layer 51, it will become softer and become a buffer material with better buffering performance. The second buffer layer 52 will further weaken the surface impact force after its own buffering, and transmit the further weakened surface impact force to the driver chip 40, thereby weakening the intensity of the surface impact force to protect the position of the driver chip 40, thereby reducing the risk of the driver chip 40 being broken due to the impact force from the light-emitting surface of the display screen 20.

[0073] In an optional embodiment, if Figure 5 As shown, the orthographic projection of the second buffer layer 52 on the substrate 10 covers the orthographic projection of the driver chip 40 on the substrate 10. That is, in this embodiment, the projection area of ​​the second buffer layer 52 is larger than the projection area of ​​the driver chip 40, and the second buffer layer 52 is arranged at a position corresponding to the driver chip 40, and at least the second buffer layer 52 is used to cover the driver chip 40, so that the first buffer layer 51 and the second buffer layer 52 are used to simultaneously effectively protect the driver chip 40.

[0074] In an optional embodiment, if Figure 8 As shown, the stress buffer layer 50 further includes a second adhesive layer 60 disposed between the first buffer layer 51 and the binding portion 30 near the second surface 12, and the orthographic projection of the second buffer layer 52 on the substrate 10 at least covers a portion of the orthographic projection of the first buffer layer 51 on the substrate 10. In this embodiment, the first buffer layer 51 and the binding portion 30 are fixed by the second adhesive layer 60, thereby improving the fixing effect between the first buffer layer 51 and the second buffer layer 52.

[0075] In this embodiment, the second adhesive layer 60 and the surface of the second buffer layer 52 close to the first buffer layer 51 are located on the same horizontal surface, and the second adhesive layer 60 and the surface of the second buffer layer 52 away from the first buffer layer 51 are located on the same horizontal surface.

[0076] The tops of the second adhesive layer 60 and the second buffer layer 52 of this embodiment are both located at the same horizontal plane, and the bottoms of the second adhesive layer 60 and the second buffer layer 52 of this embodiment are both located at the same horizontal plane, that is, the thicknesses of the second adhesive layer 60 and the second buffer layer 52 are the same, ensuring that the driving chip 40 is in a horizontal position after the binding portion 30 is folded and fixed, thereby ensuring the electrical conductivity of the circuit.

[0077] In an optional embodiment, if Figure 8 As shown, the second buffer layer 52 includes a first side wall arranged vertically and a second side wall opposite to the first side wall.

[0078] The second adhesive layer 60 includes:

[0079] a first bonding portion 61 located on the first side wall in a direction away from the second buffer layer 52, and

[0080] The second bonding portion 62 is located on the second side wall in a direction away from the second buffer layer 52 .

[0081] The second buffer layer 52 of the present embodiment does not cover the entire first buffer layer 51. The orthographic projection of the second buffer layer 52 on the substrate 10 falls within a portion of the orthographic projection of the first buffer layer 51 on the substrate 10, and covers the orthographic projection of the driver chip 40. That is, the projection areas of the orthographic projections are as follows from small to large: the projection area of ​​the driver chip 40 is smaller than the projection area of ​​the second buffer layer 52, which is smaller than the projection area of ​​the first buffer layer 51. That is, both the first buffer layer 51 and the second buffer layer 52 ensure that the orthographic projections cover the driver chip 40 to protect the driver chip 40.

[0082] In this embodiment, the surface of the first buffer layer 51 away from the substrate 10 is not completely in contact with the surface of the second buffer layer 52 close to the substrate 10 , that is, a certain area of ​​the surface of the first buffer layer 51 away from the substrate 10 is still fixed to the second adhesive layer 60 .

[0083] like Fig. 9As shown, the second adhesive layer 60 and the second buffer layer 52 of the present embodiment form a segmented structure of "first adhesive portion 61, second buffer layer 52, second buffer portion", and the first adhesive portion 61 and the second adhesive portion 62 are located on the outside of the side walls on both sides of the second buffer layer 52. In the horizontal direction, the second buffer layer 52 is arranged between the first adhesive layer and the second adhesive layer 60, so that the second buffer layer 52 can be tightly fitted and fixed between the binding portion 30 and the first buffer layer 51 in the layer structure direction.

[0084] In an optional embodiment, if Figure 8 As shown, the stress buffer layer 50 further includes a third buffer layer 53 , and the third buffer layer 53 covers the surface of the driver chip 40 of the folded display module 1 away from the display screen 20 .

[0085] Fig. 9 FIG. 4 is a schematic diagram showing a deformation simulation of the fourth surface of the driving chip 40 located at the top without any object attached thereto. Fig.10 The figure shows a simulation diagram of the deformation amount of the fourth surface of the driver chip 40 located at the top after the buffer material is attached. When there is a harder and more difficult to deform object on the fourth surface of the driver chip 40, the driver chip 40 can be better prevented from deformation. Compared with the deformation amount of the driver chip 40 without the buffer material, which is 0.449 mm, the deformation amount of the fourth surface of the driver chip 40 with the buffer material is 0.439 mm. It can be seen that when the driver chip 40 is subjected to the same impact force, the buffer material can reduce the deformation amount of the driver chip 40.

[0086] Therefore, in this embodiment, the third buffer layer 53 is disposed on the fourth surface of the driving chip 40 , and the third buffer layer 53 is used to reduce the impact force on the driving chip 40 , thereby reducing the risk of the driving chip 40 being broken.

[0087] In the embodiment of the present invention, as the impact force acting on the third buffer layer 53 increases, the value of the shear strain rate of the third buffer layer 53 decreases nonlinearly. Exemplarily, the third buffer layer 53 may be a shear thickening non-Newtonian fluid.

[0088] like Fig.11 As shown, when the driver chip 40 is deformed by the impact force transmitted from the second buffer layer 52, the driver chip 40 will transmit external force to the third buffer layer 53. At this time, the shear thickening non-Newtonian fluid material in the third buffer layer 53 will have a clustering effect, and the viscosity of the shear thickening non-Newtonian fluid material will rise sharply, thereby obtaining a strong resistance to prevent the driver chip 40 from deforming, thereby reducing the risk of the driver chip 40 breaking.

[0089] In an optional embodiment, if Figure 8 As shown, the third buffer layer 53 includes:

[0090] a first covering portion 531 , a second covering portion 532 connected to the first covering portion 531 , and a third covering portion 533 connected to the second covering portion 532 ,

[0091] One end of the first covering portion 531 is fixed to the binding portion 30 , and at least a portion of the surface of the first covering portion 531 close to the folded driving chip 40 is attached and fixed to the binding portion 30 .

[0092] One end of the third covering portion 533 is fixed to the binding portion 30 , and at least a portion of the surface of the third covering portion 533 close to the folded driving chip 40 is attached and fixed to the binding portion 30 .

[0093] In this example, the third buffer layer 53 not only covers the fourth surface of the driver chip 40, but both ends of the third buffer layer 53 are fixed on the binding portion 30. On the one hand, the third buffer layer 53 can be tightly fixed on the driver chip 40, and on the other hand, the first covering portion 531 and the second covering portion 532 at the two side ends of the third buffer layer 53 can be used to protect the side walls of the driver chip 40.

[0094] In an optional embodiment, if Figure 3 , Figure 5 and Figure 8 As shown, the display module 1 further includes a heat dissipation layer 70 and a first adhesive layer 80, wherein:

[0095] The heat dissipation layer 70 is located between the second surface 12 and the surface of the first buffer layer 51 close to the first surface 11. The heat dissipation layer 70 is used to dissipate the heat generated by the display module 1, thereby improving the overall reliability of the display module 1.

[0096] The first adhesive layer 80 is located between a surface of the heat dissipation layer 70 away from the second surface 12 and a surface of the first buffer layer 51 close to the first surface 11 , and fixes the first buffer layer 51 and the heat dissipation layer 70 .

[0097] based on Figure 8 The layer structure of the display module 1 is shown as Figure 8As shown, the orthographic projection of the heat dissipation layer 70 on the substrate 10 is greater than the orthographic projection of the first adhesive layer 80 on the substrate 10, the orthographic projection of the first buffer layer 51 on the substrate 10 is greater than or equal to the orthographic projection of the second buffer layer 52 on the substrate 10, the orthographic projection of the second buffer layer 52 on the substrate 10 is greater than or equal to the orthographic projection of the driving chip 40 on the substrate 10, and the orthographic projection of the third buffer layer 53 on the substrate 10 is less than or equal to the orthographic projection of the second buffer layer 52 on the substrate 10. Through the orthographic projection arrangement of the above-mentioned film layers, the boundaries of multiple film layers in each film layer are preferably arranged flush to avoid wrinkles of each film layer after the binding portion 30 is folded.

[0098] Based on the display module of the above embodiment, the embodiment of the present invention sets a stress buffer layer 50, such as a first buffer layer 51 and a second buffer layer 52, between the folded binding portion 30 and the display screen 20, and sets a third buffer layer 53 on the folded driving chip 40, and utilizes the nonlinear relationship between the shear strain rate and the impact force of the stress buffer layer 50 to reduce the impact force from the entire surface of the display screen 20, thereby reducing the risk of the driving chip 40 breaking, thereby protecting the reliability of the display module.

[0099] Another embodiment of the present invention provides a display device, which further includes the display module described in the above embodiment of the present invention. The display device can be any product or component with a display function, such as electronic paper, mobile phone, tablet computer, television, monitor, notebook computer, digital photo frame, navigator, etc., which is not limited in this embodiment.

[0100] Another embodiment of the present invention provides a method for manufacturing the display module of the above embodiment, the manufacturing method comprising:

[0101] A display screen 20 is formed on the first surface 11 of the substrate 10, wherein the display screen 20 includes a display area AA, a non-display area NA at least surrounding the display area AA, and a binding area BD located at one side boundary of the non-display area NA;

[0102] Binding the binding portion 30 to the binding area BD;

[0103] A driving chip 40 is formed on the binding portion 30;

[0104] forming a stress buffer layer 50 on a second surface 12 of the substrate 10 opposite to the first surface 11;

[0105] The binding portion 30 is folded to fix a surface of the binding portion 30 away from the driving chip 40 to a surface of the stress buffer layer 50 away from the second surface 12 , and the shear strain rate of the stress buffer layer 50 is nonlinearly related to the magnitude of the impact force acting on the first buffer layer 51 .

[0106] Based on the above method, the embodiment of the present invention forms a stress buffer layer 50 at a position corresponding to the driver chip 40 before the folding binding portion 30, and utilizes the nonlinear relationship between the shear strain rate and the impact force of the stress buffer layer 50 to reduce the impact force from the entire surface of the display screen 20, thereby reducing the risk of cracking of the driver chip 40 and protecting the reliability of the display module.

[0107] It is worth noting that the specific embodiment of the method for manufacturing the display module of the embodiment of the present invention can refer to the display module of the aforementioned embodiment, which will not be described in detail here.

[0108] In the description of the present invention, relational terms such as first and second, etc. are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0109] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not limitations on the embodiments of the present invention. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is impossible to list all the embodiments here. All obvious changes or modifications derived from the technical solution of the present invention are still within the scope of protection of the present invention.

Claims

1. A display module, characterized in that: The display module comprises: A substrate, comprising a first surface and a second surface arranged opposite to the first surface; A display screen located on the first surface, the display screen comprising a display area, a non-display area at least surrounding the display area, and a binding area bound to a side boundary of the non-display area; a binding portion bound to the binding region; and A driving chip is located on the binding portion, and the binding portion is folded to the second surface after binding; The display module also includes: A stress buffer layer is located between the second surface and the binding portion close to the second surface, and a shear strain rate of the stress buffer layer is in a nonlinear relationship with a magnitude of an impact force acting on the stress buffer layer.

2. The display module according to claim 1, characterized in that: The stress buffer layer includes a first buffer layer. As the impact force acting on the first buffer layer increases, the shear strain rate of the first buffer layer increases nonlinearly.

3. The display module according to claim 2, characterized in that: The orthographic projection of the first buffer layer on the substrate covers the orthographic projection of the driving chip on the substrate.

4. The display module according to claim 2, characterized in that: The stress buffer layer also includes a second buffer layer arranged between the first buffer layer and the binding portion near the second surface, the orthographic projection of the second buffer layer on the substrate at least covers a portion of the orthographic projection of the first buffer layer on the substrate, and as the impact force acting on the second buffer layer increases, the value of the shear strain rate of the second buffer layer decreases nonlinearly.

5. The display module according to claim 4, characterized in that: The orthographic projection of the second buffer layer on the substrate covers the orthographic projection of the driving chip on the substrate.

6. The display module according to claim 4, characterized in that: The stress buffer layer further includes a second adhesive layer disposed between the first buffer layer and the binding portion close to the second surface, wherein the orthographic projection of the second buffer layer on the substrate at least covers a portion of the orthographic projection of the first buffer layer on the substrate. The second adhesive layer and the surface of the second buffer layer close to the first buffer layer are located on the same horizontal surface, The second adhesive layer and a surface of the second buffer layer away from the first buffer layer are located on the same horizontal surface.

7. The display module according to claim 6, characterized in that: The second buffer layer includes a first sidewall disposed vertically and a second sidewall opposite to the first sidewall. The second adhesive layer comprises: a first bonding portion located on the first side wall in a direction away from the second buffer layer, and The second bonding portion is located on the second side wall in a direction away from the second buffer layer.

8. The display module according to claim 6, characterized in that: The display module also includes a third buffer layer, which covers the surface of the driver chip of the folded display module away from the display screen. As the impact force acting on the third buffer layer increases, the shear strain rate of the third buffer layer decreases nonlinearly.

9. The display module according to claim 8, characterized in that: The third buffer layer comprises: a first covering portion, a second covering portion connected to the first covering portion, and a third covering portion connected to the second covering portion, One end of the first covering portion is fixed to the binding portion, and at least a portion of the surface of the first covering portion close to the folded driving chip is attached and fixed to the binding portion. One end of the third covering portion is fixed to the binding portion, and at least a portion of the surface of the third covering portion on a side close to the folded driving chip is adhered and fixed to the binding portion.

10. The display module according to claim 1, characterized in that: The display module further includes a heat dissipation layer and a first adhesive layer, wherein: The heat dissipation layer is located between the second surface and a side surface of the first buffer layer close to the first surface; The first adhesive layer is located between a surface of the heat dissipation layer away from the second surface and a surface of the first buffer layer close to the first surface.

11. A display device, characterized in that: The display device further comprises the display module according to any one of claims 1 to 10.

12. A method for manufacturing the display module according to any one of claims 1 to 10, characterized in that: The production method comprises: A display screen is formed on the first surface of the substrate, wherein the display screen includes a display area, a non-display area at least surrounding the display area, and a binding area located at a side boundary of the non-display area; Binding the binding portion to the binding area; forming a driving chip on the binding portion; forming a stress buffer layer on a second surface of the substrate disposed opposite to the first surface; The binding portion is folded to fix a surface of the binding portion away from the driving chip to a surface of the stress buffer layer away from the second surface, and the shear strain rate of the stress buffer layer is nonlinearly related to the magnitude of the impact force acting on the first buffer layer.

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