Display panel, manufacturing method thereof and display device

Abstract

The invention is suitable for the technical field of display equipment, and provides a display panel and a manufacturing method thereof and a display device.The display panel comprises a substrate, a light-emitting layer, an isolation structure and a packaging layer, the light-emitting layer is arranged on the substrate and comprises a plurality of light-emitting units arranged at intervals, the isolation structure is arranged on the substrate, and the packaging layer is arranged on the substrate. The isolation structures are located between at least part of two adjacent light-emitting units, a first opening is defined between every two adjacent isolation structures, the packaging layer is arranged on the side, away from the substrate, of the light-emitting layer, the packaging layer comprises a first sub-packaging layer and a second sub-packaging layer which are arranged in a stacked mode, the first sub-packaging layer is configured to package the first opening, and the second sub-packaging layer is configured to package the second opening. The first sub-packaging layer extends to the surface of the side, away from the substrate, of the isolation structure along the side wall of the isolation structure, the second sub-packaging layer is arranged on the side, away from the light-emitting layer, of the first sub-packaging layer, and the density of the first sub-packaging layer is larger than that of the second sub-packaging layer. According to the display panel, water vapor can be prevented from invading the interior of the display panel.

Description

Technical Field

[0001] The present application belongs to the technical field of display devices, and in particular, relates to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] With the development of display technology, OLED (Organic Light Emitting Diode) display panels have been widely used due to their advantages such as lighter weight, higher brightness, lower power consumption, faster response and higher definition.

[0003] During the manufacturing process of display panels, an encapsulation layer is often used to isolate the internal structure of the display panel from the external environment. In the display panels in related technologies, the encapsulation layer has a poor encapsulation effect. External water vapor can easily invade the interior of the display panel through the encapsulation layer, causing encapsulation failure, forming dark spots, and affecting the display effect. Summary of the invention

[0004] In view of this, the embodiments of the present application provide a display panel and a manufacturing method thereof, and a display device to solve the problem that the current encapsulation layer has a poor encapsulation effect, and external water vapor can easily invade the interior of the display panel through the encapsulation layer, causing encapsulation failure, forming dark spots, and affecting the display effect.

[0005] A first aspect of an embodiment of the present application provides a display panel, comprising: a substrate, a light-emitting layer, an isolation structure and an encapsulation layer, wherein the light-emitting layer is disposed on the substrate, the light-emitting layer comprises a plurality of light-emitting units spaced apart from each other, the isolation structure is disposed on the substrate, the isolation structure is located between at least partially adjacent two of the light-emitting units, a first opening is defined between two adjacent isolation structures, the encapsulation layer is disposed on a side of the light-emitting layer away from the substrate, the encapsulation layer comprises a first sub-encapsulation layer and a second sub-encapsulation layer which are stacked, the first sub-encapsulation layer being configured to encapsulate the first opening, and the first sub-encapsulation layer extends along the side wall of the isolation structure to a surface of the isolation structure away from the substrate, the second sub-encapsulation layer is disposed on a side of the first sub-encapsulation layer away from the light-emitting layer, and the density of the first sub-encapsulation layer is greater than the density of the second sub-encapsulation layer.

[0006] The above-mentioned display panel is provided with an encapsulation layer including a first sub-encapsulation layer and a second sub-encapsulation layer which are stacked, wherein the density of the first sub-encapsulation layer is greater than the density of the second sub-encapsulation layer, so that the first sub-encapsulation layer encapsulates the first opening defined between two adjacent isolation structures, and extends along the side wall of the isolation structure to the surface of the isolation structure on the side away from the substrate. In this way, the first sub-encapsulation layer with relatively large density can have a better encapsulation effect on the first opening between the two adjacent isolation structures and the side wall of the isolation structure, thereby improving its ability to resist water vapor, and preventing water vapor from penetrating through the first sub-encapsulation layer into the interior of the display panel, thereby causing the problem of encapsulation failure, thereby avoiding the appearance of dark spots in the display panel, and improving the display effect of the display panel.

[0007] In one embodiment, the second sub-encapsulation layer extends along the sidewall of the first sub-encapsulation layer to the surface of the first sub-encapsulation layer on the side away from the isolation structure. By extending the second sub-encapsulation layer along the sidewall of the first sub-encapsulation layer to the surface of the first sub-encapsulation layer on the side away from the isolation structure, the second sub-encapsulation layer completely covers the first sub-encapsulation layer, further improving the encapsulation effect of the encapsulation layer.

[0008] In one embodiment, along the direction perpendicular to the surface of the substrate, the thickness of the first sub-encapsulation layer is equal everywhere; along the direction perpendicular to the surface of the substrate, the thickness of the second sub-encapsulation layer is equal everywhere. By setting the thickness of the first sub-encapsulation layer to be equal everywhere along the direction perpendicular to the surface of the substrate, it is not only convenient to process and shape the first sub-encapsulation layer, but also can make the first sub-encapsulation layer relatively flat, which is convenient for the processing and production of subsequent film layers. Similarly, in the direction perpendicular to the surface of the substrate, the thickness of the second sub-encapsulation layer is set to be equal everywhere, which is not only convenient to process and shape the second sub-encapsulation layer, but also can make the second sub-encapsulation layer relatively flat, which is convenient for the processing and production of subsequent film layers.

[0009] In one embodiment, along the direction perpendicular to the surface of the substrate, the thickness of the first sub-encapsulation layer is less than the thickness of the second sub-encapsulation layer. By making the thickness of the first sub-encapsulation layer less than the thickness of the second sub-encapsulation layer along the direction perpendicular to the surface of the substrate, the thickness of the first sub-encapsulation layer with a relatively large density can be relatively small, so that the first sub-encapsulation layer can have a better encapsulation effect on the first opening between two adjacent isolation structures and the sidewall of the isolation structure, and improve its ability to resist water vapor, so that the thickness of the second sub-encapsulation layer with a relatively small density is relatively large, so that the second sub-encapsulation layer can fill and encapsulate the entire first opening, which is beneficial to subsequent processing and manufacturing.

[0010] In one embodiment, the encapsulation layer further includes a third sub-encapsulation layer, and the third sub-encapsulation layer is arranged on a side of the second sub-encapsulation layer away from the light-emitting layer. By arranging the third sub-encapsulation layer on a side of the second sub-encapsulation layer away from the light-emitting layer, the third sub-encapsulation layer can completely cover the second sub-encapsulation layer, further improving the encapsulation effect of the encapsulation layer.

[0011] In one embodiment, the density of the third sub-encapsulation layer is greater than the density of the second sub-encapsulation layer; and / or the density of the third sub-encapsulation layer is equal to the density of the first sub-encapsulation layer. In this way, the third sub-encapsulation layer with a relatively large density covers the second sub-encapsulation layer with a relatively small density, further improving the encapsulation effect of the encapsulation layer.

[0012] In one embodiment, the first sub-encapsulation layer and the third sub-encapsulation layer are both inorganic layers; the second sub-encapsulation layer is an organic layer. By setting the first sub-encapsulation layer and the third sub-encapsulation layer as inorganic layers, the inorganic layers have high density and can well isolate water and oxygen, and the second sub-encapsulation layer is set as an organic layer, which has a large thickness and has a planarization function.

[0013] In one embodiment, the isolation structure includes an isolation body and a blocking portion, wherein the blocking portion is located on a side of the isolation body away from the substrate, and the orthographic projection of the isolation body on the substrate is located within the orthographic projection of the blocking portion on the substrate; the first sub-encapsulation layer extends along the side wall of the isolation body to a portion of the surface of the blocking portion on a side away from the isolation body. By adopting the isolation structure designed as above and allowing the first sub-encapsulation layer to extend along the side wall of the isolation body to a portion of the surface of the blocking portion on a side away from the isolation body, water vapor can be better blocked, preventing water vapor from invading the light-emitting unit along the side wall of the isolation structure, thereby preventing damage to the light-emitting unit.

[0014] A second aspect of an embodiment of the present application provides a method for manufacturing a display panel, comprising: forming an isolation structure on a substrate, defining a first opening between two adjacent isolation structures; forming a light-emitting layer on the substrate, the light-emitting layer comprising a plurality of light-emitting units spaced apart from each other, the isolation structure being located between at least partially adjacent two of the light-emitting units; forming an encapsulation layer on the substrate, the encapsulation layer comprising a first sub-encapsulation layer and a second sub-encapsulation layer stacked in layers, the first sub-encapsulation layer being configured to encapsulate the first opening, and the first sub-encapsulation layer extending along the side wall of the isolation structure to a surface of the isolation structure facing away from the substrate, the second sub-encapsulation layer being disposed on a side of the first sub-encapsulation layer facing away from the light-emitting layer, and the density of the first sub-encapsulation layer being greater than the density of the second sub-encapsulation layer.

[0015] In the display panel manufactured by the above method, the first sub-packaging layer with relatively large density can have a better packaging effect on the first opening between the two adjacent isolation structures and the side walls of the isolation structure, thereby improving its ability to resist water vapor, and can prevent water vapor from penetrating through the first sub-packaging layer into the interior of the display panel and causing packaging failure. It can also avoid the appearance of dark spots in the display panel, thereby improving the display effect of the display panel.

[0016] A third aspect of the embodiments of the present application provides a display device, comprising the display panel as described in the first aspect.

[0017] It can be understood that the beneficial effects of the third aspect mentioned above can be found in the relevant descriptions of the first and second aspects mentioned above, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 is a structural cross-sectional view of a display panel in the related art;

[0020] Figure 2 is a structural cross-sectional view of a display panel provided by an embodiment of the present application;

[0021] Figure 3 is a structural cross-sectional view of a display panel provided by another embodiment of the present application;

[0022] Figure 4 is a flow chart of a method for manufacturing a display panel provided by an embodiment of the present application;

[0023] Figure 5 This is a schematic diagram of an intermediate state of a display panel in a manufacturing process of a display panel provided by an embodiment of the present application;

[0024] Figure 6 is a schematic diagram of an intermediate state of a display panel in a manufacturing process of a display panel provided by another embodiment of the present application;

[0025] Figure 7 It is a schematic diagram of the structure of a display device provided by an embodiment of the present application.

[0026] Figure Number:

[0027] 10. Display device;

[0028] 100. Display panel;

[0029] 110. Substrate;

[0030] 120, light-emitting layer, 121, light-emitting unit, 1211, first electrode, 1212, light-emitting functional part, 1213, second electrode;

[0031] 130. Isolation structure, 131. Isolation body, 132. Blocking portion, 133. First opening, 134. Base portion;

[0032] 140, encapsulation layer, 141, first sub-encapsulation layer, 142, second sub-encapsulation layer, 143, third sub-encapsulation layer;

[0033] 150. pixel defining layer, 151. pixel opening. DETAILED DESCRIPTION

[0034] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present application. However, it should be clear to those skilled in the art that the present application may also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present application.

[0035] It should also be understood that the term “and / or” used in the specification and appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0036] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0037] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0038] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0039] References to "one embodiment" or "some embodiments" etc. described in the specification of this application mean that one or more embodiments of the present application include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the statements "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways. "Multiple" means two or more.

[0040] like Figure 1 As shown, the display panel 1 in the related art includes a substrate 11, a pixel defining layer 12, a light-emitting layer 13, an isolation structure 14, a first encapsulation layer 15 and a second encapsulation layer 16, wherein the first encapsulation layer 15 covers the opening between two adjacent isolation structures 14 and covers part of the side wall of the isolation structure 14, and the second encapsulation layer 16 covers the surface of the first encapsulation layer 15 and covers part of the side wall of the isolation structure 14. In this display panel 1, the encapsulation effect of the first encapsulation layer 15 and the second encapsulation layer 16 is not good, and external water vapor can easily invade from the first encapsulation layer 15 and the second encapsulation layer 16 into the interior of the display panel 1, causing encapsulation failure, resulting in dark spots formed in the light-emitting layer 13, affecting the display effect of the display panel 1.

[0041] To at least partially address the above issues, see Figure 2 As shown, an embodiment of the present application provides a display panel 100 , which includes: a substrate 110 , a light emitting layer 120 , an isolation structure 130 and an encapsulation layer 140 .

[0042] Specifically, the light-emitting layer 120 is disposed on the substrate 110, wherein the substrate 110 is used to support and carry other film layers in the display panel 100. For example, the substrate 110 can be made of materials such as glass and polyimide (PI). In some embodiments, the substrate 110 can also include an array substrate, on which a driving circuit for driving the light-emitting units 121 in the display area of ​​the display panel 100 to emit light is disposed. Under the drive of the driving circuit, different light-emitting units 121 in the display area can be excited to emit light of different colors, so that the display panel 100 can achieve a colorful display effect.

[0043] The light-emitting layer 120 includes a plurality of light-emitting units 121 spaced apart from each other. Exemplarily, the light-emitting unit 121 may be a red light-emitting unit for emitting red light, a green light-emitting unit for emitting green light, a blue light-emitting unit for emitting blue light, or a white light-emitting unit for emitting white light. The number of different types of light-emitting units 121, the arrangement of the plurality of light-emitting units 121, the spacing between two adjacent light-emitting units 121, etc. may be flexibly set and are not limited here. The light-emitting unit 121 can emit light under the driving action of the driving circuit. Specifically, the light-emitting material in the light-emitting unit 121 can emit light under the action of the electric field. In some embodiments, the light-emitting unit 121 may include a first electrode 1211, a light-emitting functional part 1212 and a second electrode 1213. The first electrode 1211 and the second electrode 1213 are opposite to each other and arranged at intervals. The light-emitting functional part 1212 is arranged between the first electrode 1211 and the second electrode 1213. After the first electrode 1211 and the second electrode 1213 are respectively energized, an electric field can be generated between the first electrode 1211 and the second electrode 1213, so that the light-emitting functional part 1212 can emit light under the driving of the electric field.

[0044] The isolation structure 130 is disposed on the substrate 110. The isolation structure 130 is located between at least two adjacent light-emitting units 121. A first opening 133 is defined between two adjacent isolation structures 130. That is, among the plurality of light-emitting units 121, an isolation structure 130 is disposed between two adjacent light-emitting units 121, or an isolation structure 130 is disposed between every two adjacent light-emitting units 121. The light emitted by each light-emitting unit 121 will be shielded by the isolation structure 130 and will not interfere with the light emitted by the adjacent light-emitting unit 121, thereby avoiding signal crosstalk between adjacent light-emitting units 121. The specific structural form of the isolation structure 130 is not limited, as long as it can separate the two light-emitting units 121.

[0045] The encapsulation layer 140 is disposed on the side of the light emitting layer 120 away from the substrate 110. The encapsulation layer 140 can encapsulate and protect the display panel 100 as a whole. The encapsulation layer 140 can be a single-layer structure made of an inorganic material or an organic material, or a laminated structure made of at least one of an inorganic material or an organic material. In the embodiment of the present application, the encapsulation layer 140 includes a first sub-encapsulation layer 141 and a second sub-encapsulation layer 142 that are stacked. The first sub-encapsulation layer 141 is configured to encapsulate the first opening 133, and the first sub-encapsulation layer 141 is disposed along the isolation structure 130. The side wall extends to the surface of the isolation structure 130 on the side away from the substrate 110, and the second sub-packaging layer 142 is arranged on the side of the first sub-packaging layer 141 away from the light-emitting layer 120. The density of the first sub-packaging layer 141 is greater than the density of the second sub-packaging layer 142, that is, in the packaging layer 140, the density of the manufacturing material of the first sub-packaging layer 141 is relatively large, while the density of the manufacturing material of the second sub-packaging layer 142 is relatively small. The specific manufacturing materials and density values ​​of the first sub-packaging layer 141 and the second sub-packaging layer 142 can be flexibly adjusted and set according to actual conditions, and are not limited here.

[0046] The display panel 100 of the embodiment of the present application is provided with an encapsulation layer 140 including a first sub-encapsulation layer 141 and a second sub-encapsulation layer 142 which are stacked, wherein the density of the first sub-encapsulation layer 141 is greater than the density of the second sub-encapsulation layer 142, so that the first sub-encapsulation layer 141 encapsulates the first opening 133 defined between two adjacent isolation structures 130, and extends along the side wall of the isolation structure 130 to the surface of the isolation structure 130 on the side away from the substrate 110. In this way, the first sub-encapsulation layer 141 with a relatively large density can have a better encapsulation effect on the first opening 133 between the two adjacent isolation structures 130 and the side wall of the isolation structure 130, thereby improving its ability to resist water vapor, and preventing water vapor from penetrating through the first sub-encapsulation layer 141 into the interior of the display panel 100, thereby preventing the problem of encapsulation failure caused by dark spots in the display panel 100, thereby improving the display effect of the display panel 100.

[0047] The second sub-encapsulation layer 142 is disposed on a side of the first sub-encapsulation layer 141 away from the light-emitting layer 120. The coverage of the second sub-encapsulation layer 142 can be larger or smaller than the coverage of the first sub-encapsulation layer 141. Figure 2 As shown, in some embodiments, optionally, the second sub-encapsulation layer 142 extends along the sidewall of the first sub-encapsulation layer 141 to the surface of the first sub-encapsulation layer 141 on the side away from the isolation structure 130. By extending the second sub-encapsulation layer 142 along the sidewall of the first sub-encapsulation layer 141 to the surface of the first sub-encapsulation layer 141 on the side away from the isolation structure 130, the second sub-encapsulation layer 142 completely covers the first sub-encapsulation layer 141, thereby further improving the encapsulation effect of the encapsulation layer 140.

[0048] In the encapsulation layer 140, the density of the material of the first sub-encapsulation layer 141 is relatively large, while the density of the material of the second sub-encapsulation layer 142 is relatively small. Figure 2 In some embodiments, optionally, along a direction perpendicular to the surface of the substrate 110 , the thickness of the first sub-encapsulation layer 141 is uniform everywhere; along a direction perpendicular to the surface of the substrate 110 , the thickness of the second sub-encapsulation layer 142 is uniform everywhere.

[0049] By setting the thickness of the first sub-encapsulation layer 141 to be equal everywhere along the direction perpendicular to the surface of the substrate 110, not only the processing and forming of the first sub-encapsulation layer 141 is facilitated, but also the first sub-encapsulation layer 141 can be made relatively flat, which is convenient for the processing and production of subsequent film layers. Similarly, in the direction perpendicular to the surface of the substrate 110, setting the thickness of the second sub-encapsulation layer 142 to be equal everywhere, not only the processing and forming of the second sub-encapsulation layer 142 is facilitated, but also the second sub-encapsulation layer 142 can be made relatively flat, which is convenient for the processing and production of subsequent film layers.

[0050] On the basis of the above embodiment, optionally, along a direction perpendicular to the surface of the substrate 110 , the thickness of the first sub-encapsulation layer 141 is less than the thickness of the second sub-encapsulation layer 142 .

[0051] Exemplarily, along the direction perpendicular to the surface of the substrate 110, the thickness of the first sub-packaging layer 141 may be 1-5 μm, and the thickness of the second sub-packaging layer 142 may be 5-10 μm. By making the thickness of the first sub-packaging layer 141 smaller than the thickness of the second sub-packaging layer 142 along the direction perpendicular to the surface of the substrate 110, the thickness of the first sub-packaging layer 141 with a relatively large density can be made relatively small, so that the first sub-packaging layer 141 can have a better packaging effect on the first opening 133 between two adjacent isolation structures 130 and the side wall of the isolation structure 130, thereby improving its ability to resist water vapor, so that the thickness of the second sub-packaging layer 142 with a relatively small density is relatively large, so that the second sub-packaging layer 142 with a relatively small density can fill and encapsulate the entire first opening 133, which is beneficial to subsequent processing and manufacturing.

[0052] See also Figure 3 In some embodiments, optionally, the encapsulation layer 140 further includes a third sub-encapsulation layer 143 , and the third sub-encapsulation layer 143 is disposed on a side of the second sub-encapsulation layer 142 away from the light-emitting layer 120 .

[0053] That is, in this embodiment, the encapsulation layer 140 includes a first sub-encapsulation layer 141, a second sub-encapsulation layer 142 and a third sub-encapsulation layer 143 which are stacked in sequence, adopting a three-layer encapsulation structure. By arranging the third sub-encapsulation layer 143 on the side of the second sub-encapsulation layer 142 away from the light-emitting layer 120, the third sub-encapsulation layer 143 can completely cover the second sub-encapsulation layer 142, thereby further improving the encapsulation effect of the encapsulation layer 140.

[0054] The material of the third sub-encapsulation layer 143 may be the same as the material of the first sub-encapsulation layer 141, the same as the material of the second sub-encapsulation layer 142, or different from the materials of the first sub-encapsulation layer 141 and the second sub-encapsulation layer 142. In some embodiments, optionally, the density of the third sub-encapsulation layer 143 is greater than the density of the second sub-encapsulation layer 142; and / or the density of the third sub-encapsulation layer 143 is equal to the density of the first sub-encapsulation layer 141. In this way, the third sub-encapsulation layer 143 with a relatively large density covers the second sub-encapsulation layer 142 with a relatively small density, further improving the encapsulation effect of the encapsulation layer 140.

[0055] As described above, the first sub-encapsulation layer 141, the second sub-encapsulation layer 142 and the third sub-encapsulation layer 143 can be made of inorganic materials or organic materials respectively. In some embodiments, optionally, the first sub-encapsulation layer 141 and the third sub-encapsulation layer 143 are both inorganic layers; the second sub-encapsulation layer 142 is an organic layer. By setting the first sub-encapsulation layer 141 and the third sub-encapsulation layer 143 as inorganic layers, the inorganic layers have high density and can well isolate water and oxygen, and setting the second sub-encapsulation layer 142 as an organic layer, the organic layer has a large thickness and has a planarization function.

[0056] In order to further avoid signal crosstalk between adjacent light-emitting units 121, in some embodiments, the display panel 100 may optionally further include a pixel defining layer 150, which is disposed on the substrate 110 and defines a plurality of pixel openings 151 spaced apart from each other, and each light-emitting unit 121 is disposed corresponding to each pixel opening 151; and an isolation structure 130 is disposed on a side of the pixel defining layer 150 away from the substrate 110, and the isolation structure 130 is located between at least partially adjacent two pixel openings 151. By disposing the pixel defining layer 150 and the pixel openings 151 defined by the pixel defining layer 150, the light-emitting units 121 are disposed corresponding to each pixel opening 151, and the isolation structure 130 is disposed on the pixel defining layer 150, so that the light-emitting units 121 and the isolation structure 130 are easily disposed and formed.

[0057] The specific structural form of the isolation structure 130 is not limited, and it can be an integrated structure or a split structure including multiple different parts. Figure 2 and Figure 3 In some embodiments, optionally, the isolation structure 130 includes an isolation body 131 and a blocking portion 132, the blocking portion 132 is located on the side of the isolation body 131 facing away from the substrate 110, and the orthographic projection of the isolation body 131 on the substrate 110 is located within the orthographic projection of the blocking portion 132 on the substrate 110; the first sub-encapsulation layer 141 extends along the side wall of the isolation body 131 to a portion of the surface of the blocking portion 132 on the side facing away from the isolation body 131.

[0058] That is to say, the isolation structure 130 includes a relatively independent isolation body 131 and a blocking portion 132, wherein the isolation body 131 is located on the substrate 110 or the pixel defining layer 150, and the blocking portion 132 is located on the side of the isolation body 131 away from the substrate 110, and the area covered by the orthographic projection of the blocking portion 132 on the substrate 110 is relatively large, while the area covered by the orthographic projection of the isolation body 131 on the substrate 110 is relatively small, so that the orthographic projection of the blocking portion 132 on the substrate 110 can cover the orthographic projection of the isolation body 131 on the substrate 110. The cross-sectional shapes of the isolation body 131 and the blocking portion 132 can be regular shapes, such as rectangles, triangles, etc., or irregular shapes. Figure 2 and Figure 3 In the embodiment shown, the cross-sectional shapes of the isolating body 131 and the blocking portion 132 are both rectangular. By adopting the isolation structure 130 designed as above and extending the first sub-encapsulation layer 141 along the side wall of the isolating body 131 to the surface of the blocking portion 132 on the side away from the isolating body 131, water vapor can be well blocked, and water vapor is prevented from invading the light-emitting unit 121 along the side wall of the isolation structure 130, thereby preventing the light-emitting unit 121 from being damaged.

[0059] In other embodiments, the isolation structure 130 also includes a base portion 134 disposed on the substrate 110 or the pixel defining layer 150 , the insulator 131 is located on the side of the base portion 134 away from the substrate 110 , and the blocking portion 132 is located on the side of the insulator 131 away from the base portion 134 .

[0060] Please combine Figure 3 Also see Figures 4 to 6 The embodiment of the present application further provides a method for manufacturing a display panel 100, the method comprising the following steps:

[0061] S102 , forming an isolation structure 130 on the substrate 110 , and defining a first opening 133 between two adjacent isolation structures 130 .

[0062] like Figure 5 As shown, a first opening 133 is defined between two adjacent isolation structures 130 .

[0063] S104 , forming a light-emitting layer 120 on the substrate 110 , wherein the light-emitting layer 120 includes a plurality of light-emitting units 121 spaced apart from each other, and the isolation structure 130 is located between at least partially adjacent two light-emitting units 121 .

[0064] S106. Form a packaging layer 140 on the substrate 110, the packaging layer 140 includes a first sub-packaging layer 141 and a second sub-packaging layer 142 which are stacked, the first sub-packaging layer 141 is configured to encapsulate the first opening 133, and the first sub-packaging layer 141 extends along the side wall of the isolation structure 130 to the surface of the isolation structure 130 away from the substrate 110, the second sub-packaging layer 142 is arranged on the side of the first sub-packaging layer 141 away from the light-emitting layer 120, and the density of the first sub-packaging layer 141 is greater than the density of the second sub-packaging layer 142.

[0065] like Figure 6 As shown in FIG. 1 , the light emitting layer 120 and the encapsulation layer 140 include not only a portion located between two adjacent isolation structures 130, but also a portion located on the side of the isolation structure 130 away from the substrate 110. After the light emitting layer 120 and the encapsulation layer 140 are patterned, the following structure can be formed: Figure 3 The structure of the display panel 100 is shown.

[0066] In the display panel 100 manufactured by the above method, the first sub-packaging layer 141 with relatively large density can have a better packaging effect on the first opening 133 between two adjacent isolation structures 130 and the side wall of the isolation structure 130, thereby improving its ability to resist water vapor, and can prevent water vapor from penetrating through the first sub-packaging layer 141 and invading the interior of the display panel 100, thereby causing packaging failure. It can also avoid the appearance of dark spots in the display panel 100, thereby improving the display effect of the display panel 100.

[0067] See also Figure 7 The embodiment of the present application further provides a display device 10, which includes a display panel 100 as in any one of the above embodiments.

[0068] The display panel 100 disclosed in the embodiment of the present application is applied to a display device 10 to provide a picture display function. The display device 10 can be any product or component with a display function, including but not limited to mobile phones, tablet computers, laptop computers, e-readers, wearable devices, remote controls, televisions, desktop computers, vehicle-mounted devices, etc. Since the display panel 100 in any of the above embodiments is adopted, an encapsulation layer 140 including a first sub-encapsulation layer 141 and a second sub-encapsulation layer 142 which are stacked is provided, wherein the density of the first sub-encapsulation layer 141 is greater than the density of the second sub-encapsulation layer 142, so that the first sub-encapsulation layer 141 encapsulates the first opening 133 defined between two adjacent isolation structures 130, and extends along the side wall of the isolation structure 130 to the surface of the isolation structure 130 on the side away from the substrate 110. In this way, the first sub-encapsulation layer 141 with a relatively large density can have a better encapsulation effect on the first opening 133 between the two adjacent isolation structures 130 and the side wall of the isolation structure 130, thereby improving its ability to resist water vapor, and preventing water vapor from penetrating through the first sub-encapsulation layer 141 into the interior of the display panel 100, thereby preventing the problem of encapsulation failure caused by dark spots in the display panel 100, thereby improving the display effect of the display panel 100.

[0069] The isolation structure 130 is further described in patents PCT / CN2023 / 134518, 202310759370.2, 202310740412.8, 202310707209.0, 202311346196.5, and 202310909421.5 for reference.

[0070] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0071] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A display panel, characterized in that: include: A substrate (110), a light-emitting layer (120), an isolation structure (130), and an encapsulation layer (140), wherein the light-emitting layer (120) is disposed on the substrate (110), the light-emitting layer (120) comprises a plurality of light-emitting units (121) spaced apart from each other, the isolation structure (130) is disposed on the substrate (110), the isolation structure (130) is located between at least partially adjacent two of the light-emitting units (121), a first opening (133) is defined between the two adjacent isolation structures (130), and the encapsulation layer (140) is disposed on the side of the light-emitting layer (120) facing away from the substrate (110). On one side, the encapsulation layer (140) includes a first sub-encapsulation layer (141) and a second sub-encapsulation layer (142) which are stacked, the first sub-encapsulation layer (141) being configured to encapsulate the first opening (133), and the first sub-encapsulation layer (141) extending along the side wall of the isolation structure (130) to the surface of the isolation structure (130) which is away from the substrate (110), the second sub-encapsulation layer (142) being arranged on the side of the first sub-encapsulation layer (141) which is away from the light-emitting layer (120), and the density of the first sub-encapsulation layer (141) being greater than the density of the second sub-encapsulation layer (142).

2. The display panel according to claim 1, wherein: The second sub-packaging layer (142) extends along the side wall of the first sub-packaging layer (141) to the surface of the first sub-packaging layer (141) which is away from the isolation structure (130).

3. The display panel according to claim 1, wherein: Along a direction perpendicular to the surface of the substrate (110), the thickness of the first sub-encapsulation layer (141) is uniform everywhere; Along a direction perpendicular to the surface of the substrate (110), the thickness of the second sub-encapsulation layer (142) is uniform everywhere.

4. The display panel according to claim 3, wherein: Along a direction perpendicular to the surface of the substrate (110), the thickness of the first sub-encapsulation layer (141) is smaller than the thickness of the second sub-encapsulation layer (142).

5. The display panel according to claim 1, wherein: The encapsulation layer (140) further comprises a third sub-encapsulation layer (143), wherein the third sub-encapsulation layer (143) is arranged on a side of the second sub-encapsulation layer (142) away from the light-emitting layer (120).

6. The display panel according to claim 5, wherein: The density of the third sub-encapsulation layer (143) is greater than the density of the second sub-encapsulation layer (142); and / or The density of the third sub-encapsulation layer (143) is equal to the density of the first sub-encapsulation layer (141).

7. The display panel according to claim 5, wherein: The first sub-encapsulation layer (141) and the third sub-encapsulation layer (143) are both inorganic layers; The second sub-encapsulation layer (142) is an organic layer.

8. The display panel according to any one of claims 1 to 7, characterized in that: The isolation structure (130) comprises an isolation body (131) and a blocking portion (132), wherein the blocking portion (132) is located on a side of the isolation body (131) facing away from the substrate (110), and an orthographic projection of the isolation body (131) on the substrate (110) is located within an orthographic projection of the blocking portion (132) on the substrate (110); The first sub-encapsulation layer (141) extends along the side wall of the isolation body (131) to a portion of the surface of the blocking portion (132) that is away from the isolation body (131).

9. A method for manufacturing a display panel, characterized in that: include: An isolation structure (130) is formed on the substrate (110), wherein a first opening (133) is defined between two adjacent isolation structures (130); A light-emitting layer (120) is formed on the substrate (110), wherein the light-emitting layer (120) comprises a plurality of light-emitting units (121) arranged at intervals from each other, and the isolation structure (130) is located between at least partially adjacent two of the light-emitting units (121); A packaging layer (140) is formed on the substrate (110), and the packaging layer (140) includes a first sub-packaging layer (141) and a second sub-packaging layer (142) which are stacked, the first sub-packaging layer (141) being configured to package the first opening (133), and the first sub-packaging layer (141) extends along the side wall of the isolation structure (130) to the surface of the isolation structure (130) which is away from the substrate (110), the second sub-packaging layer (142) is arranged on the side of the first sub-packaging layer (141) which is away from the light-emitting layer (120), and the density of the first sub-packaging layer (141) is greater than the density of the second sub-packaging layer (142).

10. A display device, characterized in that: include: The display panel (100) according to any one of claims 1 to 8.

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