Light-emitting plate, circuit board and display device

Abstract

The invention discloses a light-emitting plate, a circuit board and a display device. The light-emitting plate comprises a substrate base plate, a light-emitting unit located on the substrate base plate and a plurality of first electrode wires. The light-emitting unit comprises a light-emitting subunit, and the light-emitting subunit comprises a connecting circuit unit and a light-emitting diode chip connected with the connecting circuit unit. Each connecting line unit comprises at least two electric contact point pairs, each electric contact point pair comprises a first electrode contact point and a second electrode contact point, and only one electric contact point pair in each connecting line unit is connected with the light-emitting diode chip; at least two of the first electrode contacts electrically connected to each other are arranged adjacent to each other, and at least two of the first electrode contacts are arranged between at least two of the second electrode contacts electrically connected to each other. According to the light-emitting plate, the binding yield of the product can be improved by providing the standby electric contact point pair, and the power consumption of the cathode wiring can also be reduced.

Description

[0001] This application is a divisional of Chinese patent application No. 202080000063.0, whose invention name is “Light-emitting panel, circuit board and display device” and entered the Chinese national stage on January 22, 2020. Chinese patent application No. 202080000063.0 is a patent application for PCT application No. PCT / CN2020 / 073558 filed on January 21, 2020 and entered the Chinese national stage. Technical Field

[0002] At least one embodiment of the present disclosure relates to a light-emitting panel, a circuit board, and a display device. Background Art

[0003] At present, with the continuous advancement of display technology, users' requirements for product brightness, contrast and other performance are also constantly increasing. On the one hand, mini light emitting diodes (Mini LEDs) can be used as backlight sources. When Mini LEDs are combined with traditional liquid crystal display panels as backlight sources, by controlling the switching of Mini LEDs in the partitions, the liquid crystal display device can have a high contrast ratio comparable to that of an organic light emitting diode display device. On the other hand, Mini LEDs can also be directly made into large-size display products, which have good market prospects. Summary of the invention

[0004] Embodiments of the present disclosure provide a light-emitting panel, a circuit board, and a display device.

[0005] At least one embodiment of the present disclosure provides a light-emitting panel, comprising: a substrate; a plurality of light-emitting units arranged in an array along a first direction and a second direction on the substrate, each of the light-emitting units comprising at least one light-emitting sub-unit, the light-emitting sub-unit comprising a connecting line unit and a light-emitting diode chip connected to the connecting line unit, the light-emitting diode chip being located on a side of the connecting line unit away from the substrate; and a plurality of first electrode traces extending along the first direction. Each of the connecting circuit units includes at least two pairs of electrical contact points, each of the pairs of electrical contact points includes a first electrode contact point and a second electrode contact point. In at least one of the connecting circuit units, the first electrode contact points are electrically connected to each other, and the second electrode contact points are electrically connected to each other. The multiple first electrode wirings include multiple first-type first electrode wirings and multiple second-type first electrode wirings. At least one of the light-emitting sub-units includes multiple first light-emitting sub-units and multiple second light-emitting sub-units. The first light-emitting sub-unit is connected to the first-type first electrode wiring through the first electrode contact point, and the second light-emitting sub-unit is connected to the second-type first electrode wiring through the first electrode contact point. At least two first electrode contacts of the first electrode contacts electrically connected to each other are arranged adjacent to each other, and at least two first electrode contacts are arranged between at least two second electrode contacts of the second electrode contacts electrically connected to each other.

[0006] For example, the first-type first electrode wiring and the second-type first electrode wiring connected to a row of the light-emitting sub-units arranged along the first direction are respectively located on both sides of the row of the light-emitting sub-units.

[0007] For example, each of the first-type first electrode routings includes a first sub-electrode routing and a second sub-electrode routing extending along the same straight line and insulated from each other, a portion of the multiple first light-emitting sub-units close to the first sub-electrode routing is connected to the first sub-electrode routing, and a portion of the multiple first light-emitting sub-units close to the second sub-electrode routing is connected to the second sub-electrode routing; each of the second-type first electrode routing includes a third sub-electrode routing and a fourth sub-electrode routing extending along the same straight line and insulated from each other, a portion of the multiple second light-emitting sub-units close to the third sub-electrode routing is connected to the third sub-electrode routing, and a portion of the multiple second light-emitting sub-units close to the fourth sub-electrode routing is connected to the fourth sub-electrode routing.

[0008] For example, the light-emitting panel further includes: a plurality of second electrode traces extending along the second direction, the second electrode traces being located between the first electrode traces and the substrate. Each of the connection line units further includes a second electrode connection portion, the second electrode connection portion being arranged on the same layer as the first electrode trace, and the second electrode contact point in each of the connection line units being connected to the second electrode trace via the second electrode connection portion.

[0009] For example, the second electrode contact point and the second electrode connecting portion are an integral structure.

[0010] For example, in the first direction, the orthographic projection of each of the second electrode traces on the substrate overlaps with the orthographic projection of one of the electrical contact point pairs and a portion of the second electrode connecting portion on the substrate.

[0011] For example, each of the light-emitting units includes three light-emitting sub-units of different colors arranged along the second direction, the second electrode wiring includes a first type of second electrode wiring and a second type of second electrode wiring, and one of the light-emitting sub-units in the light-emitting unit is connected to the first type of second electrode wiring, and the other two light-emitting sub-units in the light-emitting unit are connected to the second type of second electrode wiring.

[0012] For example, each of the connection circuit units includes two pairs of electrical contact points, and each of the connection circuit units also includes two first electrode connection parts connected to each of the first electrode contact points, the first electrode connection parts are located on a side of the first electrode contact point away from the second electrode contact point, the first electrode contact point is connected to the first electrode routing through the first electrode connection parts, and the orthographic projection of at least part of the first electrode connection part on the substrate does not overlap with the orthographic projection of the second electrode routing on the substrate.

[0013] The embodiment of the present disclosure provides a circuit board, comprising: a substrate; a plurality of connection line units, arranged in an array along a first direction and a second direction on the substrate, and a plurality of first electrode traces, extending along the first direction. Each of the connection line units comprises at least two pairs of electrical contact points, each of the electrical contact point pairs comprises a first electrode contact point and a second electrode contact point, and in at least one of the connection line units, each of the first electrode contact points is electrically connected to each other, and each of the second electrode contact points is electrically connected to each other; the plurality of first electrode traces comprises a plurality of first-type first electrode traces and a plurality of second-type first electrode traces, and at least one connection line unit comprises a plurality of first connection line units and a plurality of second connection line units, the first electrode contact point of the first connection line unit is connected to the first-type first electrode trace, and the first electrode contact point of the second connection line unit is connected to the second-type first electrode trace; at least two first electrode contacts of the first electrode contacts electrically connected to each other are arranged adjacent to each other, and at least two first electrode contacts are arranged between at least two second electrode contacts of the second electrode contacts electrically connected to each other.

[0014] For example, the first-type first electrode wiring and the second-type first electrode wiring connected to a column of the connection line units arranged along the first direction are respectively located on both sides of the row of the connection line units.

[0015] For example, each of the first-type first electrode routings includes a first sub-electrode routing and a second sub-electrode routing extending along the same straight line and insulated from each other, a portion of the multiple first connection circuit units close to the first sub-electrode routing is connected to the first sub-electrode routing, and a portion of the multiple first connection circuit units close to the second sub-electrode routing is connected to the second sub-electrode routing; each of the second-type first electrode routing includes a third sub-electrode routing and a fourth sub-electrode routing extending along the same straight line and insulated from each other, a portion of the multiple second connection circuit units close to the third sub-electrode routing is connected to the third sub-electrode routing, and a portion of the multiple second connection circuit units close to the fourth sub-electrode routing is connected to the fourth sub-electrode routing.

[0016] For example, the circuit board further includes: a plurality of second electrode traces extending along the second direction, the second electrode traces being located on the side of the first electrode trace facing the substrate. Each of the connection line units further includes a second electrode connection portion, the second electrode connection portion being arranged on the same layer as the first electrode trace, and the second electrode contact point in each of the connection line units being connected to the second electrode trace via the second electrode connection portion.

[0017] For example, in the first direction, the orthographic projection of each of the second electrode traces on the substrate overlaps with the orthographic projection of one of the electrical contact point pairs and a portion of the second electrode connecting portion on the substrate.

[0018] For example, three adjacent connection line units arranged along the second direction form a connection line unit group, the second electrode routing includes a first type of second electrode routing and a second type of second electrode routing, one of the connection line units in the connection line unit group is connected to the first type of second electrode routing, and the other two connection line units in the connection line unit group are connected to the second type of second electrode routing.

[0019] For example, each of the connection circuit units includes two pairs of electrical contact points, and each of the connection circuit units also includes two first electrode connection parts connected to each of the first electrode contact points, the first electrode connection parts are located on a side of the first electrode contact point away from the second electrode contact point, the first electrode contact point is connected to the first electrode routing through the first electrode connection parts, and the orthographic projection of at least part of the first electrode connection part on the substrate does not overlap with the orthographic projection of the second electrode routing on the substrate.

[0020] An embodiment of the present disclosure provides a display device, comprising the above-mentioned light-emitting board. The light-emitting board is a display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings of the embodiments will be briefly introduced below. Obviously, the drawings in the following description only relate to some embodiments of the present disclosure, but are not intended to limit the present disclosure.

[0022] Figure 1A It is a schematic diagram of a partial planar structure of a light-emitting panel provided according to an embodiment of the present disclosure;

[0023] Figure 1B For along Figure 1A A schematic diagram of the cross-sectional structure taken along line AA shown;

[0024] Figure 2 for Figure 1A The circuit diagram of two light-emitting units included in the light-emitting panel shown;

[0025] Figure 3 A schematic diagram of a partial planar structure of a light-emitting panel provided in another embodiment of the present disclosure;

[0026] Figure 4 A schematic diagram of a partial planar structure of a circuit board provided in an embodiment of the present disclosure; and

[0027] Figure 5A schematic diagram of a partial planar structure of a circuit board provided in another embodiment of the present disclosure. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, rather than all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0029] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The words "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. The words "include" or "comprise" and similar words mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0030] The embodiments of the present disclosure provide a light-emitting panel, a circuit board and a display device. The light-emitting panel includes: a substrate and a plurality of light-emitting units located on the substrate. The plurality of light-emitting units are arranged in an array on the substrate along a first direction and a second direction, each light-emitting unit includes at least one light-emitting sub-unit, the light-emitting sub-unit includes a connection line unit and a light-emitting diode chip connected to the connection line unit, and the light-emitting diode chip is located on the side of the connection line unit away from the substrate. Each connection line unit includes at least two electrical contact point pairs, each electrical contact point pair includes a first electrode contact point and a second electrode contact point, in each connection line unit, each first electrode contact point is electrically connected to each other, each second electrode contact point is electrically connected to each other, and only one electrical contact point pair of at least two electrical contact point pairs is connected to the light-emitting diode chip. In the embodiments of the present disclosure, all the first electrode contact points in the at least two electrical contact point pairs provided in each connection line unit are electrically connected to each other, and all the second electrode contact points are electrically connected to each other. When a light-emitting diode chip connected to one electrical contact point pair in the connection line unit fails, a spare light-emitting diode chip can be connected to other spare electrical contact point pairs, thereby realizing the repair of the light-emitting sub-unit.

[0031] The light-emitting panel, circuit board and display device provided by the embodiments of the present disclosure are described below in conjunction with the accompanying drawings.

[0032] Figure 1A is a schematic diagram of a partial planar structure of a light-emitting panel provided according to an embodiment of the present disclosure, Figure 1B For along Figure 1A The schematic diagram of the cross-sectional structure cut by the AA line shown in FIG. Figure 2 for Figure 1A The circuit diagram of the two light-emitting units included in the light-emitting panel shown in FIG. Figure 1A As shown, the light-emitting panel in the embodiment of the present disclosure includes a base substrate 100 and a plurality of light-emitting units 200 located on the base substrate 100. The plurality of light-emitting units 200 are arranged in an array along a first direction and a second direction on the base substrate 100. Figure 1A The X direction is taken as the first direction and the Y direction is taken as the second direction for description. The first direction and the second direction intersect, for example, the first direction and the second direction are perpendicular, and the embodiments of the present disclosure include but are not limited to this. The embodiments of the present disclosure are described by taking the first direction as the column direction and the second direction as the row direction as an example. Here, the column direction and the row direction are relative. For example, the first direction and the second direction can also be interchanged, that is, the first direction can also refer to the row direction, and the second direction can also refer to the column direction.

[0033] like Figure 1A and Figure 1B As shown, each light-emitting unit 200 includes at least one light-emitting subunit 201, and the light-emitting subunit 201 includes a connection line unit 210 and a light-emitting diode chip 220 connected to the connection line unit 210, and the light-emitting diode chip 220 is located on the side of the connection line unit 210 away from the substrate 100. Each connection line unit 210 includes at least two electrical contact point pairs 211, and each electrical contact point pair 211 includes a positive contact point 2111 and a negative contact point 2112. In each connection line unit 210, each positive contact point 2111 is electrically connected to each other, each negative contact point 2112 is electrically connected to each other, and only one electrical contact point pair 211 of the at least two electrical contact point pairs 211 is connected to the light-emitting diode chip 220. That is, all positive contact points in each connection line unit are electrically connected, and all negative contact points are electrically connected. The above-mentioned positive contact point 2111 is connected to the positive electrode of the light-emitting diode chip 220, and the above-mentioned negative contact point 2112 is connected to the negative electrode of the light-emitting diode chip 220. In the embodiment of the present disclosure, each connection line unit includes at least two pairs of electrical contact points, one of the at least two pairs of electrical contact points is used to connect a light-emitting diode chip, and the other pairs of electrical contact points serve as spare pairs of electrical contact points. When a light-emitting diode chip connected to one of the pairs of electrical contact points fails, or the electrical contact point pair is disconnected, causing the light-emitting diode chip to be unable to emit light, the light-emitting subunit can be repaired by binding the light-emitting diode chip to any other spare pair of electrical contact points. The present disclosure is described by taking the second electrode contact point as the positive contact point and the first electrode contact point as the negative contact point as an example, but is not limited to this, and the two can be interchangeable.

[0034] For example, Figure 1AAs shown, the embodiment of the present disclosure is described by taking each connection line unit 210 including two electrical contact point pairs 211 as an example, one of the two electrical contact point pairs 211 is connected to the light emitting diode chip, and the other is used as a spare electrical contact point pair. However, the embodiment of the present disclosure is not limited thereto.

[0035] For example, the light-emitting diode chip in the embodiment of the present disclosure may be a Mini LED. For example, the maximum size of the mini LED in a direction parallel to the base substrate 100 is not greater than 500 microns. For example, the size of the mini LED may be 0.1 mm×0.17 mm. The embodiment of the present disclosure is not limited thereto, and the light-emitting diode chip may also be a micro light-emitting diode chip (microLED). Since the size of the light-emitting diode chip used in the embodiment of the present disclosure is relatively small, for example, the size of each light-emitting diode chip accounts for a very low proportion of the pixel area / light-emitting area where the light-emitting unit is located (for example, about 2%), so relative to other types of display panels, it has sufficient space for setting up spare electrical contact pairs.

[0036] For example, the connection circuit unit may also include three or more pairs of electrical contact points. When the connection circuit unit includes more than three pairs of electrical contact points, one of the pairs of electrical contact points is connected to the light-emitting diode chip, and the other pairs of electrical contact points serve as spare pairs of electrical contact points. For example, a defective light-emitting diode chip may include a short circuit or open circuit between the positive and negative electrodes of the light-emitting diode chip. In this case, the light-emitting subunit can be repaired by cutting off the connection between the negative electrode of the defective light-emitting diode chip and the negative electrode wiring, and then connecting the spare light-emitting diode chip to the spare pair of electrical contact points. It should be noted that the spare light-emitting diode chip connected to the spare pair of electrical contact points and the defective light-emitting diode chip should be chips that emit light of the same color.

[0037] For example, Figure 1A As shown, the light-emitting panel further includes a plurality of cathode wirings 300 extending along the first direction (X direction). The cathode wirings 300 include a first cathode wiring 310 and a second cathode wiring 320. A column of light-emitting subunits 201 arranged along the first direction includes a first light-emitting subunit 2011 and a second light-emitting subunit 2012. The first light-emitting subunit 2011 is connected to the first cathode wiring 310 through a corresponding cathode contact point 2112, and the second light-emitting subunit 2012 is connected to the second cathode wiring 320 through a corresponding cathode contact point 2112. Thus, a column of light-emitting subunits is connected to the corresponding two cathode wirings.

[0038] Compared with the general situation of connecting a column of light-emitting sub-units (for example, a column of sub-pixels) to a negative electrode wiring, in the embodiment of the present disclosure, a part of the multiple light-emitting sub-units arranged along the first direction are connected to the first negative electrode wiring, and the other part is connected to the second negative electrode wiring. This can reduce the number of light-emitting sub-units connected to each negative electrode wiring, that is, reduce the number of light-emitting diode chips connected to each negative electrode wiring, and thus effectively reduce the current on each negative electrode wiring to reduce the power consumption of the negative electrode wiring.

[0039] For example, in an example of the embodiment of the present disclosure, the light-emitting panel can adopt bilateral driving, and the light-emitting panel can also include two drivers connected to the cathode wiring, and the two drivers are respectively located at the two side edges of the light-emitting panel along the first direction. The first cathode wiring can be connected to one driver, and the second cathode wiring can be connected to another driver. The first cathode wiring and the second cathode wiring connected to a column of light-emitting sub-units can be located on the same side of the column of light-emitting sub-units, and also on both sides of the column of light-emitting sub-units.

[0040] For example, Figure 1A Taking the positive direction of the X direction (the direction indicated by the arrow) as an example, multiple light-emitting sub-units located in the same column can be divided into two parts, the upper and lower parts, and the number of light-emitting sub-units in the two parts can be the same or different. Taking the interval between the two parts of light-emitting sub-units as the dividing line, the first negative electrode routing and the second negative electrode routing can be respectively located on both sides of the dividing line, thereby respectively connected to the light-emitting sub-units located on both sides of the dividing line. The embodiments of the present disclosure are not limited to this, and the first negative electrode routing and the second negative electrode routing can also both pass through the above-mentioned dividing line, as long as the first negative electrode routing and the second negative electrode routing are respectively connected to the light-emitting sub-units located on both sides of the dividing line.

[0041] For example, when the first cathode wiring and the second cathode wiring are located on both sides of the dividing line, the first cathode wiring and the second cathode wiring connected to a column of light-emitting sub-units can be located on the same side of the column of light-emitting sub-units or on both sides of the column of light-emitting sub-units, as long as the orthographic projections of the first cathode wiring and the second cathode wiring on the straight line extending along the first direction do not overlap. At this time, each cathode wiring can be set to have a wider line width to reduce power consumption.

[0042] For example, in another example of the embodiment of the present disclosure, the light-emitting board can be driven on one side, and the light-emitting board can also include a driver connected to each cathode wiring, and the driver is located at any side edge of the light-emitting board along the first direction. The first cathode wiring and the second cathode wiring are both connected to the driver. The first cathode wiring and the second cathode wiring connected to a column of light-emitting sub-units can be located on both sides of the column of light-emitting sub-units.

[0043] Figure 1AIn the illustrated embodiment, the first cathode wiring and the second cathode wiring are both continuous wirings. Figure 1A The illustrated embodiment takes the example that each negative electrode wiring has a signal input terminal, but the present invention is not limited thereto.

[0044] For example, Figure 1A As shown, the first negative electrode wiring 310 and the second negative electrode wiring 320 connected to a column of light-emitting sub-units 201 arranged along the first direction are respectively located on both sides of the column of light-emitting sub-units 201, so that when the negative electrode contact points in the row of light-emitting sub-units are connected to the corresponding negative electrode wiring, there will be no intersection with other negative electrode wirings, which is convenient for wiring design. Two negative electrode wirings 300 are arranged between two adjacent columns of light-emitting sub-units 201 arranged along the second direction, and the spacing between the two negative electrode wirings 300 is a safe distance to ensure that there is no short circuit between the two. For example, the spacing between the two negative electrode wirings 300 can be not less than 15 microns. For example, under the condition that the spacing between the two negative electrode wirings 300 located between two adjacent columns of light-emitting sub-units 201 meets the safe spacing, the line width of each negative electrode wiring 300 can be set as wide as possible, which can not only ensure the flatness of the negative electrode wiring, but also reduce the resistance of the negative electrode wiring.

[0045] For example, Figure 1A As shown, along the first direction, the first light-emitting subunit 2011 and the second light-emitting subunit 2012 can be arranged alternately to ensure the uniformity of the light emission of the light-emitting subunit. The embodiment of the present disclosure does not limit the arrangement and number of the first light-emitting subunit and the second light-emitting subunit, as long as the first light-emitting subunit is connected to the first cathode wiring and the second light-emitting subunit is connected to the second cathode wiring, thereby reducing the number of light-emitting subunits connected to each cathode wiring.

[0046] For example, the number of the first light-emitting subunits 2011 and the number of the second light-emitting subunits 2012 are the same, so as to ensure that the current flowing through each cathode wiring is roughly equal, thereby preventing the situation where individual cathode wiring consumes too much power.

[0047] For example, Figure 1A As shown, the light-emitting panel also includes a plurality of positive electrode wirings 400 extending along the second direction (i.e., the Y direction), and the positive electrode wirings 400 are located between the negative electrode wirings 300 and the base substrate 100. Each connection line unit 210 also includes a positive electrode connection portion 212, and the positive electrode connection portion 212 is arranged on the same layer as the negative electrode wiring 300, and the positive electrode contact point 2111 in each connection line unit 210 is connected to the positive electrode wiring 400 through the positive electrode connection portion 212. The present disclosure is described by taking the first electrode wiring as the negative electrode wiring and the second electrode wiring as the positive electrode wiring as an example. However, it is not limited to this, and the two can also be interchanged, that is, the first electrode wiring can be the positive electrode wiring, and the second electrode wiring can be the negative electrode wiring.

[0048] For example, Figure 1A As shown, the positive contact point 2111 and the negative contact point 2112 can be arranged in the same layer as the negative electrode wiring 300, and the material is the same. For example, the positive contact point 2111, the negative contact point 2112 and the negative electrode wiring 300 can be formed by using the same patterning process for the same material. For example, the material of the negative electrode wiring 300 can include copper.

[0049] For example, Figure 1A As shown, the positive electrode connection portion 212 and the negative electrode trace 300 may also be formed by using the same material and the same patterning process.

[0050] For example, when a safe distance is maintained between the positive electrode connection portion 212 and the negative electrode traces 300 located on both sides thereof, the line width of the positive electrode connection portion 212 can be as wide as possible to reduce the resistance of the positive electrode connection portion 212 and thus reduce power consumption.

[0051] For example, Figure 1A As shown, the positive electrode contact point 2111 can be an integrated structure with the positive electrode connecting portion 212 to facilitate manufacturing.

[0052] For example, Figure 1A As shown, when the connection line unit 210 includes two electrical contact point pairs 211, along the first direction, the two positive contact points 2111 are respectively located at the two side edges of the positive connection part 212, and the two negative contact points 2112 are located on the side of the corresponding positive contact point 2111 away from the positive connection part 212, and are separated from the positive contact point 2111.

[0053] For example, Figure 1A As shown, an insulating layer (not shown) is provided between the positive electrode connection portion 212 and the positive electrode wiring 400, and the positive electrode connection portion 212 can be electrically connected to the positive electrode wiring 400 through a via 500 penetrating the insulating layer. For example, each positive electrode connection portion 212 can be electrically connected to the positive electrode wiring 400 through a plurality of vias 500 to ensure the effect of electrical connection.

[0054] For example, Figure 1A As shown, in each circuit unit 210 , the distance between the two positive electrode electrical contact points 2111 is greater than 20 micrometers, so that the positive electrode connection portion 212 and the via 500 are arranged between the two positive electrode contact points 2111 .

[0055] For example, Figure 1A As shown, in the first direction, the orthographic projection of each positive electrode line 400 on the base substrate 100 overlaps with the orthographic projection of an electrical contact point pair 211 and a portion of the positive electrode connection portion 212 on the base substrate 100. In the embodiment of the present disclosure, the line width of the positive electrode line is set wider to reduce the power consumption of the line.

[0056] For example, Figure 1A As shown, each connection line unit 210 also includes two negative electrode connection parts 213 connected to each negative electrode contact point 2112, and the negative electrode connection part 213 is located on the side of the negative electrode contact point 2112 away from the positive electrode contact point 2111, and the negative electrode contact point 2112 is connected to the negative electrode wiring 300 through the negative electrode connection part 213, and the positive projection of at least part of the negative electrode connection part 213 on the base substrate 100 does not overlap with the positive electrode wiring 400 on the base substrate 100. In the embodiment of the present disclosure, by providing a negative electrode connection part that at least partially does not overlap with the positive wiring and the negative wiring, when a defect occurs in the light-emitting diode chip, the negative electrode connection part can be cut by means such as laser cutting to disconnect the connection between the negative electrode contact point and the negative wiring, so as to achieve the repair of the light-emitting sub-unit. By providing a negative electrode connection part, it is possible to avoid the cutting process affecting the positive wiring and the negative wiring.

[0057] For example, Figure 1A As shown, the negative electrode connection portion 213 can be integrally provided with the negative electrode contact point 2112. For example, the negative electrode connection portion 213 can include a first portion extending along a first direction and a second portion extending along a second direction, the first portion being used to connect to the negative electrode wiring 300, and the second portion being used to connect to the negative electrode contact point. The present disclosure is described by taking the first electrode connection portion as the negative electrode connection portion and the second electrode connection portion as the positive electrode connection portion as an example. However, it is not limited thereto, the first electrode connection portion can also be the positive electrode connection portion, and the second electrode connection portion can also be the negative electrode connection portion.

[0058] For example, Figure 1A As shown, each light-emitting unit 200 may include three light-emitting sub-units 201 of different colors arranged along the second direction, the positive electrode wiring 400 includes a first positive electrode wiring 410 and a second positive electrode wiring 420, and one light-emitting sub-unit 201 in the light-emitting unit 200 is connected to the first positive electrode wiring 410, and the other two light-emitting sub-units 201 in the light-emitting unit 200 are connected to the second positive electrode wiring 420. In the embodiment of the present disclosure, each light-emitting unit is connected to two positive electrode wirings, so that the light-emitting sub-units of one color can be independently controlled.

[0059] For example, the light-emitting unit may include a red light-emitting subunit, a green light-emitting subunit, and a blue light-emitting subunit. 2The working voltage when the two electrodes are connected is similar, while the start-up voltage of the red light emitting sub-unit is quite different from the start-up voltages of the above two. The red light emitting sub-unit is connected to the first positive wiring alone, while the green light emitting sub-unit and the blue light emitting sub-unit are connected to the second positive wiring. This ensures that the corresponding start-up voltage is applied to each light emitting sub-unit, which can save electric energy and prevent overload voltage from being applied to a certain color light emitting sub-unit.

[0060] For example, Figure 1A As described above, along the first direction, the first positive electrode line 410 and the second positive electrode line 420 both have a minimum width. Taking the first positive electrode line as an example, assuming that M light-emitting units are arranged along the second direction, the voltage drop value IRdrop of the first positive electrode line is IRdrop=I t *R,I t is the total current of the M light-emitting units arranged along the second direction, R is the resistance of the first positive electrode wiring in the light-emitting unit, and satisfies R=Rs*P / Wr. Rs is the square resistance of the first positive electrode wiring, Wr is the width of the first positive electrode wiring, and P is the period of the light-emitting unit along the second direction. Combining the above two formulas, we can get: Wr=(I t *Rs*P) / (IRdrop). To ensure uniform display brightness, the voltage drop (IR drop) of the first positive electrode line must be less than a certain value K. When IRdrop=K, Wr has a minimum width Wrm. Similarly, the second positive electrode line 420 also has a minimum width.

[0061] For example, along the first direction, the width of the first positive electrode line 410 may be smaller than the width of the second positive electrode line 420. However, the present invention is not limited thereto, and the width relationship of the two positive electrode lines should be determined according to the size relationship of the current flowing therethrough.

[0062] For example, Figure 1B As shown, the base substrate 100 may be a glass substrate. In the embodiment of the present disclosure, a glass substrate provided with a circuit connection unit is used to replace a commonly used substrate, such as a printed circuit board (PCB board) for electrically connecting a light-emitting diode chip in a backlight source or a display panel, to overcome the problem of poor heat dissipation performance of a general PCB substrate.

[0063] For example, Figure 1A and Figure 1B As shown, the material of the first cathode wiring 310, the second cathode wiring 320 and the anode wiring 400 can be, for example, a conductive material such as copper. Taking the material of the above wiring as copper as an example, the two copper layers can be deposited on the substrate by sputtering, or can be formed on the substrate by electroplating. For example, the greater the thickness of the first cathode wiring, the second cathode wiring and the anode wiring, the lower the power consumption, and when the light-emitting board is used as a display panel, the better the display effect.

[0064] For example, Figure 1A and Figure 1B As shown, a first buffer layer 103 is provided between the positive electrode wiring 400 and the base substrate 100, and the material of the first buffer layer 103 may include silicon nitride. A second buffer layer 104, a flat layer 105, and a passivation layer 106 are sequentially provided between the positive electrode wiring 400 and the first negative electrode wiring 310. The material of the flat layer 105 may be resin, and the greater the thickness of the flat layer 105, the smaller the coupling capacitance between the wiring layers on both sides thereof. The materials of the second buffer layer 104 and the passivation layer 106 may both be silicon nitride, which is used to avoid the problem of poor adhesion caused by direct contact between the flat layer 105 and the metal layers on both sides.

[0065] For example, Figure 1A and Figure 1B As shown, vias 500 are provided in the second buffer layer 104 , the planar layer 105 and the passivation layer 106 , so that the positive electrode connection portion 212 can be electrically connected to the positive electrode wiring 400 .

[0066] For example, Figure 1B As shown, an insulating layer 107 is provided on the side of the circuit connection unit 210 away from the base substrate 100, and the insulating layer 107 includes two vias to expose the positive contact point 2111 and the negative contact point 2112 respectively. The light-emitting diode chip 220 is located on the side of the insulating layer 107 away from the circuit connection unit 210, and the positive and negative electrodes included in the light-emitting diode chip 220 are electrically connected to the positive contact point 2111 and the negative contact point 2112 respectively through the vias in the insulating layer 107.

[0067] For example, Figure 1B As shown, the positive contact point 2111 and the positive connection portion 212 are an integrated structure, and the positive connection portion 212 is connected to the positive wiring 400 through a plurality of vias 500 , so that the positive wiring 400 is electrically connected to the positive electrode of the light-emitting diode chip 220 .

[0068] For example, Figure 1B As shown, the positive electrode contact point 2111 and the negative electrode contact point 2112 are arranged in the same layer and are spaced apart from each other.

[0069] For example, the surface of the positive electrode contact point 2111 and the negative electrode contact point 2112 away from the base substrate 100 can be located in the same plane as the surface of the positive electrode connection portion 212 away from the base substrate 100, but the embodiments of the present disclosure are not limited thereto. For example, the positive electrode contact point 2111 and the negative electrode contact point 2112 include two protrusions that extend into two vias of the insulating layer 107 respectively, and the positive electrode and the negative electrode included in the light-emitting diode chip 220 are electrically connected to the protrusions of the electrical contact point pair through the above-mentioned vias. The above-mentioned protrusions can be made using the same film-forming process as the film layer where the positive electrode connection portion 212 is located, and are formed in a sequential patterning process by a half-tone mask process.

[0070] For example, Figure 1A and Figure 2 As shown, each light-emitting unit 200 may include two binding areas (light-emitting diode chip connection areas), namely a first binding area 2201 and a second binding area 2202. Each connection line unit 210 includes two pairs of electrical contact points 211 located in the first binding area 2201 and the second binding area 2202, respectively, and the positive electrode connection portion 212 may be located between the two binding areas to achieve electrical connection with the positive electrode wiring 400.

[0071] For example, Figure 1A and Figure 2 As shown, the multiple light-emitting sub-units 201 in the light-emitting unit 200 can all be bound to the first binding area 2201 to achieve centralized setting of the light-emitting positions of the three light-emitting sub-units for uniform display. When a light-emitting diode chip in any light-emitting sub-unit bound in the first binding area 2201 fails, a light-emitting diode chip of the same color can be bound to a pair of spare electrical contacts in the second binding area 2202, and the pair of spare electrical contacts and the pair of electrical contacts connected to the defective light-emitting diode chip can be located in a straight line. Of course, the embodiments of the present disclosure are not limited to this, and the multiple light-emitting sub-units in the light-emitting unit can also all be bound to the second binding area, and the pairs of electrical contacts in the first binding area are all used as spare electrical contacts.

[0072] For example, the light-emitting unit 200 includes three light-emitting sub-units 201 arranged along the second direction. The light-emitting sub-units 201 located on both sides can be bound in the same binding area, and the light-emitting sub-unit 201 located in the middle is bound in another binding area. The lines connecting the binding positions of the three light-emitting sub-units 201 form a triangle, which is more conducive to achieving uniformity of light emission.

[0073] Figure 1AThe light-emitting panel shown can be a display panel, for example, a passive matrix (PM) display panel, the light-emitting unit is a pixel unit, and the light-emitting sub-unit included in the light-emitting unit is a sub-pixel. The display panel provided by the embodiment of the present disclosure can improve the binding yield of the product by providing a spare electrical contact point pair, and can also reduce the power consumption of the negative electrode wiring.

[0074] Of course, the light-emitting panel provided in the embodiment of the present disclosure can also be used as a backlight source to be combined with a liquid crystal display panel, and the embodiment of the present disclosure does not limit this.

[0075] Figure 3 FIG. 1 is a schematic diagram of a partial planar structure of a light-emitting panel provided in another embodiment of the present disclosure. Figure 3 As shown, Figure 1A Compared to the embodiment shown, Figure 3 The difference of the embodiment shown is that the first negative electrode routing 310 is not a continuous routing, but is disconnected in the middle to form a first sub-negative electrode routing 311 and a second sub-negative electrode routing 312, and the two ends of the first sub-negative electrode routing 311 and the second sub-negative electrode routing 312 that are far away from each other are two signal input terminals 301 and 302; the second negative electrode routing 320 is not a continuous routing, but is disconnected in the middle to form a third sub-negative electrode routing 321 and a fourth sub-negative electrode routing 322, and the two ends of the third sub-negative electrode routing 321 and the fourth sub-negative electrode routing 322 that are far away from each other are configured as two signal input terminals 303 and 304. The present disclosure is described by taking the first sub-electrode routing as the first sub-negative electrode routing, the second sub-electrode routing as the second sub-negative electrode routing, the third sub-electrode routing as the third sub-negative electrode routing, and the fourth sub-electrode routing as the fourth sub-negative electrode routing as an example.

[0076] For example, each first negative electrode trace 310 includes a first sub-negative electrode trace 311 and a second sub-negative electrode trace 312 extending along the same straight line and insulated from each other, and the interval between the first sub-negative electrode trace 311 and the second sub-negative electrode trace 312 is not greater than the interval between two adjacent light-emitting sub-units; each second negative electrode trace 320 includes a third sub-negative electrode trace 321 and a fourth sub-negative electrode trace 322 extending along the same straight line and insulated from each other, and the interval between the third sub-negative electrode trace 321 and the fourth sub-negative electrode trace 322 is not greater than the interval between two adjacent light-emitting sub-units.

[0077] like Figure 3 As shown, the light-emitting panel provided in this embodiment can adopt bilateral driving, and the first negative electrode wiring 310 includes a first sub-negative electrode wiring 311 and a second sub-negative electrode wiring 312 which are respectively connected to the two drivers, and the second negative electrode wiring 320 includes a third sub-negative electrode wiring 321 and a fourth sub-negative electrode wiring 322 which are respectively connected to the above-mentioned two drivers, and the two drivers can be respectively located at the two side edges of the light-emitting panel along the first direction.

[0078] For example, Figure 3 As shown, the signal input terminal 301 of the first sub-negative electrode routing 311 and the signal input terminal 303 of the third sub-negative electrode routing 321 can be connected to the same driver, and the signal input terminal 302 of the second sub-negative electrode routing 312 and the signal input terminal 304 of the fourth sub-negative electrode routing 322 can be connected to the same driver.

[0079] For example, Figure 3 As shown, the first negative electrode sub-line 311 and the second negative electrode sub-line 312 may be located on the same straight line, and the third negative electrode sub-line 321 and the fourth negative electrode sub-line 322 may be located on the same straight line.

[0080] For example, Figure 3 As shown, the portion of the multiple first light-emitting sub-units 2011 close to the first sub-negative electrode wiring 311 is connected to the first sub-negative electrode wiring 311, and the portion of the multiple first light-emitting sub-units 2011 close to the second sub-negative electrode wiring 312 is connected to the second sub-negative electrode wiring 312. The portion of the multiple second light-emitting sub-units 2012 close to the third sub-negative electrode wiring 321 is connected to the third sub-negative electrode wiring 321, and the portion of the multiple second light-emitting sub-units 2012 close to the fourth sub-negative electrode wiring 322 is connected to the fourth sub-negative electrode wiring 322.

[0081] For example, a plurality of light-emitting sub-units in the same column can be divided into two parts along the first direction, and the number of light-emitting sub-units in the two parts can be the same or different. The interval between the two parts of light-emitting sub-units is used as a dividing line, the first sub-negative electrode routing and the second sub-negative electrode routing are respectively located on both sides of the dividing line, and the light-emitting sub-units located on both sides of the dividing line are connected, and the third sub-negative electrode routing and the fourth sub-negative electrode routing are respectively located on both sides of the dividing line, and the light-emitting sub-units located on both sides of the dividing line are connected.

[0082] Compared with the general situation of connecting a column of light-emitting sub-units (for example, a column of sub-pixels) to a negative electrode wiring, in the embodiment of the present disclosure, a column of light-emitting sub-units arranged along the first direction includes four parts of light-emitting sub-units, the first part of the light-emitting sub-units is connected to the first sub-negative electrode wiring, the second part of the light-emitting sub-units is connected to the second sub-negative electrode wiring, the third part of the light-emitting sub-units is connected to the third sub-negative electrode wiring, and the fourth part of the light-emitting sub-units is connected to the fourth sub-negative electrode wiring, that is, a column of light-emitting sub-units is connected to four negative electrode wirings, which can further reduce the number of light-emitting sub-units connected to each negative electrode wiring, that is, reduce the number of light-emitting diode chips connected to each negative electrode wiring, thereby effectively reducing the current on each negative electrode wiring to reduce the power consumption of the negative electrode wiring.

[0083] The characteristics of the positive electrode wiring in the embodiment of the present disclosure, the number and arrangement of the light-emitting sub-units included in the light-emitting unit, and the characteristics of the light-emitting sub-units including the connecting line unit are all the same as those in the embodiment of the present disclosure. Figure 1A and Figure 2 The embodiments shown are the same and will not be described again.

[0084] Figure 3 The light-emitting board shown can be a display panel, the light-emitting unit is a pixel unit, and the light-emitting subunit included in the light-emitting unit is a sub-pixel. The display panel provided by the embodiment of the present disclosure can improve the binding yield of the product by providing a spare electrical contact point pair, and can also reduce the power consumption of the negative electrode wiring.

[0085] Of course, the light-emitting panel provided in the embodiment of the present disclosure can also be used as a backlight source in combination with a liquid crystal display panel, and the embodiment of the present disclosure does not limit this.

[0086] Another embodiment of the present disclosure provides a display device, including any of the above display panels. The display device provided by the embodiment of the present disclosure can improve the binding yield of the product by providing a spare electrical contact point pair, and can also reduce the power consumption of the negative electrode wiring.

[0087] Figure 4 This is a schematic diagram of a partial planar structure of a circuit board provided in one embodiment of the present disclosure. Figure 4 As shown, the circuit board includes a base substrate 100 and a plurality of connection line units 210 located on the base substrate 100. The plurality of connection line units 210 are arranged in an array along a first direction and a second direction on the base substrate 100. Figure 4 The description is made by taking the X direction as the first direction and the Y direction as the second direction as an example.

[0088] like Figure 4 As shown, each connection line unit 210 includes at least two electrical contact point pairs 211, each electrical contact point pair 211 includes a positive contact point 2111 and a negative contact point 2112, and in each connection line unit 210, each positive contact point 2111 is electrically connected to each other, and each negative contact point 2112 is electrically connected to each other. The positive contact point 2111 and the negative contact point 2112 of only one of the at least two electrical contact point pairs 211 are configured to be connected to the positive and negative poles of a light-emitting diode chip, respectively. In the embodiment of the present disclosure, each connection line unit includes at least two electrical contact point pairs, one of the at least two electrical contact point pairs is used to connect the light-emitting diode chip, and the other electrical contact point pairs are used as spare electrical contact point pairs. When the light-emitting diode chip connected to one of the electrical contact point pairs is defective, the light-emitting sub-unit can be repaired by binding the light-emitting diode chip to any other spare electrical contact point pairs.

[0089] For example, Figure 4As shown, the embodiment of the present disclosure is described by taking each connection line unit 210 including two electrical contact point pairs 211 as an example, one of the two electrical contact point pairs 211 is configured to be connected to the light-emitting diode chip, and the other is used as a spare electrical contact point pair. However, the embodiment of the present disclosure is not limited thereto, and the connection line unit may also include three or more electrical contact point pairs. When the connection line unit includes more than three electrical contact point pairs, one of the electrical contact point pairs is configured to be connected to the light-emitting diode chip, and the other electrical contact point pairs are used as spare electrical contact point pairs.

[0090] For example, Figure 4 As shown, the circuit board further includes a plurality of negative electrode wirings 300 extending along the first direction (X direction). The negative electrode wirings 300 include a first negative electrode wiring 310 and a second negative electrode wiring 320. A column of connection line units 210 arranged along the first direction includes a plurality of first connection line units 2101 and a plurality of second connection line units 2102. The negative electrode contact points 2112 of the first connection line units 2101 are connected to the first negative electrode wirings 310, and the negative electrode contact points 2112 of the second connection line units 2102 are connected to the second negative electrode wirings 320. For example, taking a column of connection line units arranged along the first direction as a column of connection line units as an example, a column of connection line units is connected to two corresponding negative electrode wirings.

[0091] Compared to the general situation of connecting a column of connection line units (for example, a column of connection line units is configured to be connected to a column of sub-pixels) to a negative electrode wiring, in the embodiment of the present disclosure, the connection line units arranged along the first direction are connected to two negative electrode wirings, which can reduce the number of connection line units connected to each negative electrode wiring, that is, reduce the number of light-emitting diode chips connected to each negative electrode wiring, and thus effectively reduce the current on each negative electrode wiring to reduce the power consumption of the negative electrode wiring.

[0092] For example, Figure 4As shown, the first negative electrode wiring 310 and the second negative electrode wiring 320 connected to a column of connection line units 210 arranged along the first direction are respectively located on both sides of the column of connection line units 210, so that when the negative electrode contact points in the row of photon units are connected to the corresponding negative electrode wiring, there will be no intersection with other negative electrode wirings, which is convenient for wiring design. Taking a column of photon units arranged along the first direction as a column of photon units as an example, two negative electrode wirings 300 are set between two adjacent columns of connection line units 210 arranged along the second direction, and the spacing between the two negative electrode wirings 300 is a safe distance to ensure that there is no short circuit between the two. For example, the spacing between the two negative electrode wirings 300 can be not less than 15 microns. For example, under the condition that the spacing between the two negative electrode wirings 300 located between two adjacent columns of connection line units 210 meets the safe spacing, the line width of each negative electrode wiring 300 can be set as wide as possible (for example, it can be 30 microns), and the resistance of the negative electrode wiring can also be reduced.

[0093] For example, Figure 4 As shown, along the first direction, the first connection line unit 2101 and the second connection line unit 2102 can be arranged alternately. The embodiment of the present disclosure is not limited thereto, as long as the first connection line unit is connected to the first negative electrode wiring, and the second connection line unit is connected to the second negative electrode wiring, so as to reduce the number of connection line units connected to each negative electrode wiring.

[0094] For example, the number of the first connecting line units 2101 and the number of the second connecting line units 2102 are the same.

[0095] For example, Figure 4 As shown, the circuit board further includes a plurality of positive electrode traces 400 extending along the second direction (i.e., the Y direction), and the positive electrode traces 400 are located between the negative electrode traces 300 and the base substrate 100. Each connection line unit 210 further includes a positive electrode connection portion 212, and the positive electrode connection portion 212 is arranged on the same layer as the negative electrode trace 300, and the positive electrode contact point 2111 in each connection line unit 210 is connected to the positive electrode trace 400 through the positive electrode connection portion 212.

[0096] For example, Figure 4 As shown, the positive electrode contact point 2111 can be an integrated structure with the positive electrode connecting portion 212 to facilitate manufacturing.

[0097] For example, Figure 4 As shown, when the connection line unit 210 includes two electrical contact point pairs 211, along the first direction, the two positive contact points 2111 are respectively located at the two side edges of the positive connection part 212, and the two negative contact points 2112 are located on the side of the corresponding positive contact point 2111 away from the positive connection part 212, and are separated from the positive contact point 2111.

[0098] For example, Figure 4 As shown, an insulating layer (not shown) is provided between the positive electrode connection portion 212 and the positive electrode wiring 400 , and the positive electrode connection portion 212 can be electrically connected to the positive electrode wiring 400 through a plurality of vias 500 penetrating the insulating layer.

[0099] For example, Figure 4 As shown, in the first direction, the orthographic projection of each positive electrode line 400 on the base substrate 100 overlaps with the orthographic projection of an electrical contact point pair 211 and a portion of the positive electrode connection portion 212 on the base substrate 100. In the embodiment of the present disclosure, the line width of the positive electrode line is set wider to reduce the power consumption of the line.

[0100] For example, Figure 4 As shown, each connection line unit 210 also includes two negative electrode connection parts 213 connected to each negative electrode contact point 2112, and the negative electrode connection part 213 is located on the side of the negative electrode contact point 2112 away from the positive electrode contact point 2111, and the negative electrode contact point 2112 is connected to the negative electrode wiring 300 through the negative electrode connection part 213, and the positive projection of at least part of the negative electrode connection part 213 on the base substrate 100 does not overlap with the positive electrode wiring 400 on the base substrate 100. In the embodiment of the present disclosure, by providing a negative electrode connection part that at least partially does not overlap with the positive wiring and the negative wiring, when a defect occurs in the light-emitting diode chip, the negative electrode connection part can be cut by means such as laser cutting to disconnect the connection between the negative electrode contact point and the negative wiring, so as to achieve the repair of the light-emitting sub-unit. By providing a negative electrode connection part, it is possible to avoid the cutting process affecting the positive wiring and the negative wiring.

[0101] For example, Figure 4 As shown, three adjacent connection line units 210 arranged along the second direction form a connection line unit group 2100, the positive electrode wiring 400 includes a first positive electrode wiring 410 and a second positive electrode wiring 420, one connection line unit 210 in the connection line unit group 2100 is connected to the first positive electrode wiring 410, and the other two connection line units 210 in the connection line unit group 2100 are connected to the second positive electrode wiring 420, and along the first direction, the width of the first positive electrode wiring 410 is less than the width of the second positive electrode wiring 420. In the embodiment of the present disclosure, each connection line unit group is connected to two positive electrode wirings, so that one connection line unit can be independently controlled.

[0102] For example, the three connection circuit units are connected to the red light emitting diode chip, the green light emitting diode chip and the blue light emitting diode chip respectively. For example, the connection circuit unit connected to the red light emitting diode chip can be connected to the first positive electrode wiring, and the connection circuit unit connected to the green light emitting diode chip and the blue light emitting diode chip can be connected to the second positive electrode wiring, so as to ensure that each light emitting sub-unit is applied with a corresponding lighting voltage, which can save electric energy and prevent the light emitting sub-unit of a certain color from being overloaded with voltage.

[0103] Figure 4 The circuit board shown is Figure 1A The structure of the light-emitting board shown in the figure, except for the light-emitting diode chip, the specific features of the circuit board are also the same Figure 1A The same circuit board as shown. Figure 4 The features of the circuit board in the embodiments can be referred to Figure 1A Corresponding embodiments. The circuit board can be applied to a display panel or a backlight source. The circuit board provided by the embodiment of the present disclosure can improve the binding yield of the product by providing a pair of spare electrical contact points, and can also reduce the power consumption of the negative electrode wiring.

[0104] Figure 5 FIG. 1 is a schematic diagram of a partial planar structure of a circuit board provided in another embodiment of the present disclosure. Figure 5 As shown, Figure 4 Compared to the embodiment shown, Figure 5 The difference between the illustrated embodiments is that the first negative electrode trace 310 is not a continuous trace, but is disconnected in the middle to form a first sub-negative electrode trace 311 and a second sub-negative electrode trace 312; the second negative electrode trace 320 is not a continuous trace, but is disconnected in the middle to form a third sub-negative electrode trace 321 and a fourth sub-negative electrode trace 322.

[0105] like Figure 5 As shown, the circuit board provided in this embodiment can be used for bilateral driving, the first negative electrode wiring 310 includes a first sub-negative electrode wiring 311 and a second sub-negative electrode wiring 312 which are respectively connected to the two drivers, and the second negative electrode wiring 320 includes a third sub-negative electrode wiring 321 and a fourth sub-negative electrode wiring 322 which are respectively connected to the above-mentioned two drivers, and the two drivers can be respectively located on the two side edges of the circuit board along the first direction.

[0106] For example, Figure 5 As shown, the first negative electrode sub-line 311 and the second negative electrode sub-line 312 may be located on the same straight line, and the third negative electrode sub-line 321 and the fourth negative electrode sub-line 322 may be located on the same straight line.

[0107] For example, Figure 5As shown, the portion of the plurality of first connection line units 2101 close to the first sub-negative electrode routing 311 is connected to the first sub-negative electrode routing 311, and the portion of the plurality of first connection line units 2101 close to the second sub-negative electrode routing 312 is connected to the second sub-negative electrode routing 312. The portion of the plurality of second connection line units 2102 close to the third sub-negative electrode routing 321 is connected to the third sub-negative electrode routing 321, and the portion of the plurality of second connection line units 2102 close to the fourth sub-negative electrode routing 322 is connected to the fourth sub-negative electrode routing 322.

[0108] For example, a plurality of connection line units located in the same column can be divided into two parts along the first direction, and the number of connection line units in the two parts can be the same or different. The interval between the two parts of the connection line units is used as a dividing line, the first sub-negative electrode routing line and the second sub-negative electrode routing line are respectively located on both sides of the dividing line to be connected to the connection line units located on both sides of the dividing line, and the third sub-negative electrode routing line and the fourth sub-negative electrode routing line are respectively located on both sides of the dividing line to be connected to the connection line units located on both sides of the dividing line.

[0109] Compared to the general situation of connecting a column of connection line units (for example, a column of connection line units is configured to be connected to a column of sub-pixels) to a negative electrode wiring, in the embodiment of the present disclosure, a column of connection line units is connected to four negative electrode wirings, which can reduce the number of connection line units connected to each negative electrode wiring, that is, reduce the number of light-emitting diode chips connected to each negative electrode wiring, and thus effectively reduce the current on each negative electrode wiring to reduce the power consumption of the negative electrode wiring.

[0110] The characteristics of the positive electrode routing, the number and arrangement of the connection line units in the embodiment of the present disclosure are similar to Figure 4 The embodiments shown are the same and will not be described again.

[0111] Figure 5 The circuit board shown is Figure 3 The structure of the light-emitting board shown in the figure, except for the light-emitting diode chip, the specific features of the circuit board are also the same Figure 3 The same circuit board as shown. Figure 5 The features of the circuit board in the embodiments can be referred to Figure 3 Corresponding embodiments. The circuit board can be applied to a display panel or a backlight source. The circuit board provided by the embodiment of the present disclosure can improve the binding yield of the product by providing a pair of spare electrical contact points, and can also reduce the power consumption of the negative electrode wiring.

[0112] There are a few points to note:

[0113] (1) In the drawings of the embodiments of the present disclosure, only the structures related to the embodiments of the present disclosure are involved, and other structures can refer to the general design.

[0114] (2) In the absence of conflict, features in the same embodiment or in different embodiments of the present disclosure may be combined with each other.

[0115] The above description is merely an exemplary embodiment of the present disclosure and is not intended to limit the protection scope of the present disclosure. The protection scope of the present disclosure is determined by the appended claims.

Claims

1. A light-emitting panel, comprising: substrate substrate; A plurality of light-emitting units are arranged in an array on the substrate along a first direction and a second direction, each of the light-emitting units includes at least one light-emitting sub-unit, and the light-emitting sub-unit includes a connecting line unit and a light-emitting diode chip connected to the connecting line unit, and the light-emitting diode chip is located on a side of the connecting line unit away from the substrate; A plurality of first electrode traces extending along the first direction, Each of the connection line units comprises at least two pairs of electrical contact points, each pair of electrical contact points comprises a first electrode contact point and a second electrode contact point, and in at least one of the connection line units, each of the first electrode contact points is electrically connected to each other, and each of the second electrode contact points is electrically connected to each other; The plurality of first electrode traces include a plurality of first-type first electrode traces and a plurality of second-type first electrode traces, at least one of the light-emitting sub-units includes a plurality of first light-emitting sub-units and a plurality of second light-emitting sub-units, the first light-emitting sub-unit is connected to the first-type first electrode trace through the first electrode contact point, and the second light-emitting sub-unit is connected to the second-type first electrode trace through the first electrode contact point; At least two first electrode contacts of the first electrode contacts electrically connected to each other are disposed adjacent to each other, and at least two first electrode contacts are disposed between at least two second electrode contacts of the second electrode contacts electrically connected to each other.

2. The light-emitting panel according to claim 1, wherein The first-type first electrode wiring and the second-type first electrode wiring connected to a row of the light-emitting sub-units arranged along the first direction are respectively located on two sides of the row of the light-emitting sub-units.

3. The light-emitting panel according to claim 1, wherein: Each of the first-type first electrode routings includes a first sub-electrode routing and a second sub-electrode routing extending along the same straight line and insulated from each other, a portion of the plurality of first light-emitting sub-units close to the first sub-electrode routing is connected to the first sub-electrode routing, and a portion of the plurality of first light-emitting sub-units close to the second sub-electrode routing is connected to the second sub-electrode routing; Each of the second-type first electrode routings includes a third sub-electrode routing and a fourth sub-electrode routing extending along the same straight line and insulated from each other, a portion of the multiple second light-emitting sub-units close to the third sub-electrode routing is connected to the third sub-electrode routing, and a portion of the multiple second light-emitting sub-units close to the fourth sub-electrode routing is connected to the fourth sub-electrode routing.

4. The light-emitting panel according to claim 1, further comprising: A plurality of second electrode lines extending along the second direction, wherein the second electrode lines are located between the first electrode lines and the substrate. Each of the connection line units further includes a second electrode connection portion, the second electrode connection portion is arranged in the same layer as the first electrode wiring, and the second electrode contact point in each of the connection line units is connected to the second electrode wiring through the second electrode connection portion.

5. The light-emitting panel according to claim 4, wherein: The second electrode contact point and the second electrode connecting portion are an integrated structure.

6. The light-emitting panel according to claim 4, wherein: In the first direction, an orthographic projection of each of the second electrode traces on the substrate overlaps with an orthographic projection of one of the electrical contact point pairs and a portion of the second electrode connecting portion on the substrate.

7. The light-emitting panel according to claim 4, wherein: Each of the light-emitting units includes three light-emitting sub-units of different colors arranged along the second direction, the second electrode wiring includes a first type of second electrode wiring and a second type of second electrode wiring, and one of the light-emitting sub-units in the light-emitting unit is connected to the first type of second electrode wiring, and the other two light-emitting sub-units in the light-emitting unit are connected to the second type of second electrode wiring.

8. The light-emitting panel according to claim 4, wherein: Each of the connection circuit units includes two pairs of electrical contact points, and each of the connection circuit units also includes two first electrode connection parts connected to the first electrode contact points, the first electrode connection parts are located on a side of the first electrode contact point away from the second electrode contact point, the first electrode contact point is connected to the first electrode routing through the first electrode connection parts, and the orthographic projection of at least part of the first electrode connection parts on the substrate does not overlap with the orthographic projection of the second electrode routing on the substrate.

9. A circuit board comprising: substrate substrate; A plurality of connection line units are arranged in an array on the substrate along a first direction and a second direction, A plurality of first electrode traces extending along the first direction, Each of the connection line units comprises at least two pairs of electrical contact points, each pair of electrical contact points comprises a first electrode contact point and a second electrode contact point, and in at least one of the connection line units, each of the first electrode contact points is electrically connected to each other, and each of the second electrode contact points is electrically connected to each other; The plurality of first electrode traces include a plurality of first-type first electrode traces and a plurality of second-type first electrode traces, at least one connection line unit includes a plurality of first connection line units and a plurality of second connection line units, the first electrode contact point of the first connection line unit is connected to the first-type first electrode trace, and the first electrode contact point of the second connection line unit is connected to the second-type first electrode trace; At least two first electrode contacts of the first electrode contacts electrically connected to each other are disposed adjacent to each other, and at least two first electrode contacts are disposed between at least two second electrode contacts of the second electrode contacts electrically connected to each other.

10. The circuit board according to claim 9, wherein: The first-type first electrode wirings and the second-type first electrode wirings connected to a column of the connection line units arranged along the first direction are respectively located on two sides of the row of the connection line units.

11. The circuit board according to claim 10, wherein: Each of the first-type first electrode routings includes a first sub-electrode routing and a second sub-electrode routing extending along the same straight line and insulated from each other, a portion of the plurality of first connection line units close to the first sub-electrode routing is connected to the first sub-electrode routing, and a portion of the plurality of first connection line units close to the second sub-electrode routing is connected to the second sub-electrode routing; Each of the second-type first electrode routings includes a third sub-electrode routing and a fourth sub-electrode routing extending along the same straight line and insulated from each other. The portion of the multiple second connection line units close to the third sub-electrode routing is connected to the third sub-electrode routing, and the portion of the multiple second connection line units close to the fourth sub-electrode routing is connected to the fourth sub-electrode routing.

12. The circuit board according to claim 9, further comprising: A plurality of second electrode traces extending along the second direction, wherein the second electrode traces are located on a side of the first electrode traces facing the substrate. Each of the connection line units further includes a second electrode connection portion, the second electrode connection portion is arranged in the same layer as the first electrode wiring, and the second electrode contact point in each of the connection line units is connected to the second electrode wiring through the second electrode connection portion.

13. The circuit board according to claim 12, wherein: In the first direction, an orthographic projection of each of the second electrode traces on the substrate overlaps with an orthographic projection of one of the electrical contact point pairs and a portion of the second electrode connecting portion on the substrate.

14. The circuit board according to claim 12, wherein: Three adjacent connection line units arranged along the second direction form a connection line unit group, the second electrode routing includes a first type of second electrode routing and a second type of second electrode routing, one of the connection line units in the connection line unit group is connected to the first type of second electrode routing, and the other two connection line units in the connection line unit group are connected to the second type of second electrode routing.

15. The circuit board according to claim 12, wherein: Each of the connection circuit units includes two pairs of electrical contact points, and each of the connection circuit units also includes two first electrode connection parts connected to the first electrode contact points, the first electrode connection parts are located on a side of the first electrode contact point away from the second electrode contact point, the first electrode contact point is connected to the first electrode routing through the first electrode connection parts, and the orthographic projection of at least part of the first electrode connection parts on the substrate does not overlap with the orthographic projection of the second electrode routing on the substrate.

16. A display device comprising the light-emitting panel according to any one of claims 1 to 8, wherein: The light emitting panel is a display panel.

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