Display module, preparation method thereof and display device

Abstract

The invention provides a display module, a preparation method thereof and a display device, and relates to the field of display technologies. The display module comprises an integrated structure, a cover plate and a wiring structure, the integrated structure comprises a substrate, a driving chip and a light-emitting assembly, the light-emitting assembly is arranged on the first surface of the substrate, the surface, away from the substrate, of the light-emitting assembly is connected with the cover plate, and the driving chip is arranged on the second surface of the substrate; the wiring structure comprises a supporting piece and a connecting line, the supporting piece is arranged on the surface, facing the light-emitting assembly, of the cover plate, and the supporting piece and the substrate are arranged at an interval; the connecting line is arranged on the surface, facing the substrate, of the supporting piece, the first end of the connecting line is electrically connected with the driving chip, and the second end of the connecting line is electrically connected with the light-emitting assembly. The display module can reduce the possibility of disconnection and the like of the connecting line and improve the display effect of the display module.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module and a preparation method thereof, and a display device. Background Art

[0002] Light-Emitting Diode (LED) display modules have the characteristics of high brightness, low power consumption and simple driving method, and are widely used in display devices.

[0003] The display module includes a substrate, a light-emitting component and a driving chip. The light-emitting component is arranged on the first surface of the substrate, and the driving chip is arranged on the second surface of the substrate. The driving chip is electrically connected to the light-emitting component through a connecting wire to control the light-emitting process of the light-emitting component. However, the connecting wire of the display module is prone to disconnection, thereby affecting the display effect of the display module. Summary of the invention

[0004] The embodiments of the present application provide a display module and a method for manufacturing the same, and a display device, so as to solve the problem that the connection lines of the display module are prone to breaking, thereby affecting the display effect of the display module.

[0005] The embodiment of the present application provides a display module, including an integrated structure, a cover plate and a wiring structure;

[0006] The integrated structure comprises a substrate, a driving chip and a light-emitting component, wherein the light-emitting component is arranged on a first surface of the substrate, a surface of the light-emitting component facing away from the substrate is connected to the cover plate, and the driving chip is arranged on a second surface of the substrate, wherein the first surface and the second surface are two opposite surfaces in the thickness direction of the substrate;

[0007] The routing structure includes a support member and a connecting wire, wherein the support member is arranged on the surface of the cover plate facing the light-emitting component, and the support member is spaced apart from the substrate; the connecting wire is arranged on the surface of the support member facing the substrate, the first end of the connecting wire is electrically connected to the driving chip, and the second end of the connecting wire is electrically connected to the light-emitting component.

[0008] By adopting the above technical solution, a wiring structure is set up to realize the electrical connection between the driving chip and the light-emitting component, wherein the wiring structure includes a support member and a connecting wire, the support member is set on the cover plate, and the support member and the substrate are spaced apart; the connecting wire is set on the surface of the support member facing the substrate to reduce the possibility of contact between the connecting wire and the substrate, thereby reducing the possibility of the connecting wire being broken, etc., and improving the display effect of the display module.

[0009] In some possible implementations, the light emitting assembly includes a light emitting portion and a transition portion, the transition portion is electrically connected to one end of the light emitting portion close to the support member, and the transition portion is electrically connected to the second end of the connecting line;

[0010] Along the thickness direction of the substrate, the thickness of the light-emitting portion is greater than the thickness of the adapter portion, the surface of the light-emitting portion facing the cover plate is connected to the cover plate, the surface of the adapter portion facing the cover plate is spaced apart from the cover plate, and part of the support member is accommodated between the adapter portion and the cover plate.

[0011] In some possible implementations, the support member includes a main body and an extension portion, a first end of the extension portion is connected to the main body, a second end of the extension portion extends toward the light-emitting portion, and the extension portion faces away from a surface of the cover plate toward the adapter portion;

[0012] A gap is provided between the surface of the connecting line facing the substrate and the substrate, the connecting line comprises a first conductive part and a second conductive part, the first conductive part is provided on the main body, a first end of the first conductive part is electrically connected to the driving chip, and the first end of the first conductive part forms a first end of the connecting line;

[0013] The second conductive portion is arranged on a surface of the extension portion away from the cover plate, the second conductive portion is electrically connected to the second end of the first conductive portion, the second conductive portion is electrically connected to the transition portion, and an end of the second conductive portion away from the first conductive portion forms the second end of the connecting line.

[0014] In some possible implementations, the light-emitting portion includes a circuit body, a bonding member, and a light-emitting unit, the circuit body is disposed on the first surface of the substrate, and the circuit body is electrically connected to the light-emitting unit through the bonding member;

[0015] A filling layer is further provided on the surface of the circuit body away from the substrate, the surface of the filling layer away from the circuit body is connected to the cover plate, and the filling layer accommodates the bonding component and the light-emitting unit;

[0016] Preferably, the circuit body and the filling layer are reused to form the transition portion.

[0017] In some possible implementations, along the thickness direction of the substrate, a surface of the support member facing away from the cover plate is arranged flush with the second surface of the substrate;

[0018] An extended wire is disposed on the second surface of the substrate, a first end of the extended wire is electrically connected to the driving chip, and a second end of the extended wire is electrically connected to the first end of the connecting wire.

[0019] In some possible implementations, a conductive member is further disposed on the second surface of the substrate, the conductive member is electrically connected to the extended trace, and an end of the conductive member facing away from the extended trace is electrically connected to the first end of the connecting line;

[0020] Preferably, the connecting wire is provided with an auxiliary conductive part, the auxiliary conductive part is arranged on the surface of the supporting member facing away from the cover plate, the auxiliary conductive part is electrically connected to the first end of the connecting wire, one end of the auxiliary conductive part facing away from the connecting wire faces away from the light-emitting component, and the auxiliary conductive part is electrically connected to the conductive member.

[0021] In some possible implementations, the number of the integrated structures and the number of the routing structures are both set to multiple, and each routing structure is correspondingly arranged in one integrated structure;

[0022] A plurality of the integrated structures and a plurality of the wiring structures are alternately arranged in sequence, and one end of the wiring structure away from the corresponding integrated structure is connected to another integrated structure;

[0023] Preferably, the number of the cover plates is set to one, and the cover plate connects the multiple integrated structures and the multiple routing structures that are alternately arranged in sequence.

[0024] The present application also provides a method for preparing a display module, including:

[0025] An integrated structure and a cover plate are provided; the integrated structure comprises a substrate, a driving chip and a light-emitting component, the light-emitting component is arranged on a first surface of the substrate, and the driving chip is arranged on a second surface of the substrate;

[0026] A wiring structure is formed on the surface of the cover plate; the wiring structure comprises a support member and a connecting line, the support member is arranged on the surface of the cover plate, and the connecting line is arranged on the support member;

[0027] The cover plate and the wiring structure are installed on the surface of the light-emitting component away from the substrate; the support member is spaced apart from the substrate, and the connecting wire is arranged on the surface of the support member facing the substrate, the first end of the connecting wire is electrically connected to the driving chip, and the second end of the connecting wire is electrically connected to the light-emitting component.

[0028] By adopting the above technical solution, a wiring structure is formed on the surface of the cover plate, and the cover plate and the wiring structure are installed on the surface of the light-emitting component away from the substrate, so that the electrical connection between the driving chip and the light-emitting component can be achieved through the wiring structure; wherein the wiring structure includes a support member and a connecting wire, the support member is arranged on the cover plate, and the support member and the substrate are arranged at a distance; the connecting wire is arranged on the surface of the support member facing the substrate, and a gap is arranged between the surface of the connecting wire facing the substrate and the substrate, so as to reduce the possibility of the connecting wire contacting the substrate, thereby reducing the possibility of the connecting wire being broken, etc., and improving the display effect of the display module.

[0029] In some possible implementations, an extended trace is disposed on the second surface of the substrate, and a first end of the extended trace is electrically connected to the driver chip; the preparation method further includes:

[0030] Providing conductive parts;

[0031] The conductive element is mounted on the second surface of the substrate; the conductive element is electrically connected to the extended trace, and one end of the conductive element away from the extended trace is electrically connected to the first end of the connecting line.

[0032] An embodiment of the present application provides a display device, comprising any of the display modules described above;

[0033] Since the display device includes any of the display modules described above, the advantages of the display device including any of the display modules described above can be specifically referred to the above related descriptions, which will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0035] Figure 1 A schematic diagram of the structure of a display module in the related art provided in an embodiment of the present application;

[0036] Figure 2 A schematic diagram of the structure of a display module including multiple light-emitting components in the related technology provided in an embodiment of the present application;

[0037] Figure 3 A schematic diagram of the structure of a display module provided in an embodiment of the present application;

[0038] Figure 4 A schematic diagram of the structure of a display module including multiple light-emitting components provided in an embodiment of the present application;

[0039] Figure 5 A schematic diagram of the structure of the integrated structure provided in the embodiment of the present application;

[0040] Figure 6 A schematic diagram of the structure of the cover plate and the wiring structure provided in the embodiment of the present application;

[0041] Figure 7 A schematic structural diagram of a cover plate and a wiring structure according to another embodiment of the present application;

[0042] Figure 8 A schematic diagram of a process for preparing a display module provided in an embodiment of the present application;

[0043] Fig. 9 A schematic diagram of the structure of the installation cover plate and the wiring structure on the light-emitting component provided in the embodiment of the present application.

[0044] Description of reference numerals:

[0045] 100. Integrated structure;

[0046] 110, substrate; 111, conductive member; 120, light-emitting component; 121, light-emitting part; 1211, circuit body; 1212, bonding member; 1213, light-emitting unit; 122, adapter; 1221, connector; 123, filling layer; 130, driver chip; 131, extended wiring;

[0047] 200, wiring structure;

[0048] 210, support member; 211, main body; 212, extension portion; 220, connecting line; 221, first conductive portion; 222, second conductive portion; 223, auxiliary conductive portion;

[0049] 300. Cover plate.

[0050] The above drawings have shown clear embodiments of the present application, which will be described in more detail later. These drawings and text descriptions are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0051] As described in the background art, Figure 1The display module includes a substrate 110, a light-emitting component 120 and a driving chip 130, wherein the light-emitting component 120 is disposed on a first surface of the substrate 110, the driving chip 130 is disposed on a second surface of the substrate 110, and the driving chip 130 is electrically connected to the light-emitting component 120 through a connecting wire 220 to control the light-emitting process of the light-emitting component 120. At least part of the connecting wire 220 is disposed at the edge of the substrate 110, for example, the connecting wire 220 can be formed at the edge of the substrate 110 by silver paste pad printing or physical vapor deposition (PVD), so that the first end of the connecting wire 220 is electrically connected to the driving chip 130, and the second end of the connecting wire 220 is electrically connected to the light-emitting component 120; however, the connection strength between the connecting wire 220 and the substrate 110 is low, and the connecting wire 220 is easily separated from the edge of the substrate 110 or even broken, so that the connecting wire 220 is easily broken, etc., which affects the display effect of the display module;

[0052] And, refer to Figure 2 When multiple light-emitting components 120 are spliced ​​together to increase the display area of ​​the display module, the connecting wire 220 is easy to contact with other substrates 110, making the connecting wire 220 easy to be damaged, and thus making the connecting wire 220 easy to be broken, further affecting the display effect of the display module.

[0053] In order to solve the above technical problems, the embodiments of the present application provide a display module and a preparation method thereof, and a display device. The display module is provided with a wiring structure to realize the electrical connection between the driving chip and the light-emitting component through the wiring structure; wherein the wiring structure includes a support member and a connecting wire, the support member is arranged on the surface of the cover plate facing the light-emitting component, and the support member is spaced apart from the substrate; the connecting wire is arranged on the surface of the support member facing the substrate to reduce the possibility of contact between the connecting wire and the substrate, thereby reducing the possibility of the connecting wire being broken, etc., and improving the display effect of the display module.

[0054] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0055] The technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems are described in detail below with specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0056] Reference Figure 3-Figure 6 The embodiment of the present application provides a display module, including an integrated structure 100, a cover plate 300 and a wiring structure 200; the integrated structure 100 includes a substrate 110, a driving chip 130 and a light-emitting component 120, the light-emitting component 120 is arranged on a first surface of the substrate 110, the surface of the light-emitting component 120 away from the substrate 110 is connected to the cover plate 300, and the light-emitting component 120 can emit light in a direction away from the substrate 110, the driving chip 130 is arranged on the second surface of the substrate 110, and the driving chip 130 is electrically connected to the light-emitting component 120 through the wiring structure 200 to control the light-emitting process of the light-emitting component 120.

[0057] For example, continue to refer to Figure 3-Figure 6 The wiring structure 200 includes a support member 210 and a connecting wire 220. The support member 210 is disposed on the surface of the cover plate 300 facing the light emitting component 120. The support member 210 and the substrate 110 are connected along a first direction (ie Figure 3 The connecting wire 220 is arranged at intervals on the surface of the support member 210 facing the substrate 110, the first end of the connecting wire 220 is electrically connected to the driving chip 130, and the second end of the connecting wire 220 is electrically connected to the light-emitting component 120, so that the light-emitting component 120 is electrically connected to the driving chip 130 through the connecting wire 220, and a gap can be arranged between the surface of the connecting wire 220 facing the substrate 110 and the substrate 110, so as to reduce the possibility of the connecting wire 220 contacting with the substrate 110 and improve the stability of the connection between the connecting wire 220 and the support member 210.

[0058] Reference Figure 3 and Figure 5 In some possible embodiments, the light-emitting component 120 includes a light-emitting portion 121 and a adapter portion 122, the adapter portion 122 is electrically connected to one end of the light-emitting portion 121 close to the support member 210, and the adapter portion 122 is electrically connected to the second end of the connecting wire 220, so that the light-emitting portion 121 is electrically connected to the driving chip 130 through the adapter portion 122 and the connecting wire 220.

[0059] Exemplarily, the light emitting portion 121 includes a circuit body 1211, a bonding piece 1212 and a light emitting unit 1213. The circuit body 1211 is disposed on the first surface of the substrate 110, and the surface of the circuit body 1211 away from the substrate 110 is electrically connected to the light emitting unit 1213 through the bonding piece 1212.

[0060] The light-emitting unit 1213 can be set as a light-emitting diode type light-emitting unit 1213, the number of the light-emitting unit 1213 can be set to multiple, the multiple light-emitting units 1213 are arranged in multiple rows and columns, the number of the bonding parts 1212 is set to multiple, the multiple bonding parts 1212 are arranged one by one with the multiple light-emitting units 1213, and each light-emitting unit 1213 is electrically connected to the circuit body 1211 through a bonding part 1212.

[0061] A filling layer 123 is also provided on the surface of the circuit body 1211 facing away from the substrate 110. The surface of the filling layer 123 facing away from the circuit body 1211 is connected to the cover plate 300. The filling layer 123 accommodates multiple bonding parts 1212 and multiple light-emitting units 1213. The filling layer 123 can be set as a black matrix (Black Matrix, abbreviated as BM) to separate the multiple light-emitting units 1213 through the filling layer 123, thereby reducing the possibility of mutual interference between the multiple light-emitting units 1213.

[0062] Exemplarily, the circuit body 1211 and the filling layer 123 can also be reused to form the transition part 122, so that the formation process of the light-emitting part 121 and the transition part 122 is more convenient; for example, the circuit body 1211 includes a first part and a second part connected to each other, the first part of the circuit body 1211 is used to form the light-emitting part 121, and the second part of the circuit body 1211 is used to form the transition part 122, at least one connector 1221 is arranged above the second part of the circuit body 1211, and one end of the at least one connector 1221 away from the second part of the circuit body 1211 is used to be electrically connected to the second end of the connecting line 220;

[0063] The filling layer 123 covers the first part and the second part of the circuit body 1211, and the filling layer 123 covering the second part of the circuit body 1211 accommodates the connecting piece 1221, so that the second part of the circuit body 1211, the filling layer 123 covering the second part of the circuit body 1211 and the connecting piece 1221 form a transition part 122.

[0064] Along the thickness direction of the substrate 110, the thickness of the light-emitting portion 121 can be greater than the thickness of the adapter portion 122. For example, the height of the connector 1221 is less than the distance between the circuit body 1211 and the cover plate 300. The height of the connector 1221 can be greater than or equal to the thickness of the filling layer 123 covering the second part of the circuit body 1211. For example, the height of the connector 1221 is greater than the thickness of the filling layer 123 covering the second part of the circuit body 1211, so that the connection between the connector 1221 and the connecting line 220 is more stable.

[0065] The thickness of the filling layer 123 covering the second part of the circuit body 1211 is smaller than the thickness of the filling layer 123 covering the first part of the circuit body 121, and the surface of the light-emitting portion 121 facing the cover plate 300 is connected to the cover plate 300, and the surface of the adapter portion 122 facing the cover plate 300 is spaced apart from the cover plate 300, and a part of the support member 210 is accommodated between the adapter portion 122 and the cover plate 300.

[0066] It is easy to understand that the end of the circuit body 1211 facing the connecting line 220 can be flush with the edge of the substrate 110 to reduce the possibility of contact between the circuit body 1211 and the connecting line 220, thereby reducing the possibility of a short circuit between the circuit body 1211 and the connecting line 220, and reducing the possibility of damage to the connecting line 220.

[0067] Reference Figure 3 , Figure 5-Figure 7 In some possible implementations, the support member 210 is disposed on the surface of the cover plate 300 facing the light-emitting component 120, and the connecting wire 220 is disposed on the surface of the support member 210 facing the substrate 110; when forming a display module, the support member 210 can be formed on the surface of the cover plate 300, and then the connecting wire 220 can be formed on the surface of the support member 210, and then the cover plate 300 is installed on the surface of the light-emitting component 120 away from the substrate 110, thereby realizing the formation process of the display module, making the connection between the routing structure 200 and the light-emitting component 120 more convenient, and reducing the possibility of the connecting wire 220 contacting the substrate 110.

[0068] The material of the support member 210 can be set to organic materials such as black matrix and planarization material, and the connecting line 220 can be formed on the surface of the support member 210 by silver paste pad printing or physical vapor deposition (PVD) to realize the formation process of the wiring structure 200.

[0069] Exemplarily, the support member 210 includes a main body 211 and an extension 212, wherein a first end of the extension 212 is connected to the main body 211, a second end of the extension 212 extends toward the light emitting portion 121, and the extension 212 is disposed between the adapter 122 and the cover 300, and a surface of the extension 212 facing away from the cover 300 faces the adapter 122;

[0070] Reference Figure 3 and Figure 6The connecting wire 220 includes a first conductive portion 221 and a second conductive portion 222 connected to each other, and the first conductive portion 221 and the second conductive portion 222 can be integrally formed on the surface of the support member 210; wherein the first conductive portion 221 can be disposed on the main body 211, and a first end of the first conductive portion 221 is electrically connected to the driving chip 130, and the first end of the first conductive portion 221 forms a first end of the connecting wire 220;

[0071] The second conductive portion 222 is disposed on the surface of the extension portion 212 away from the cover plate 300, the second conductive portion 222 is electrically connected to the second end of the first conductive portion 221, the second conductive portion 222 is electrically connected to the adapter portion 122, and one end of the second conductive portion 222 away from the first conductive portion 221 forms the second end of the connecting line 220, so that the adapter portion 122 of the light-emitting component 120 is electrically connected to the driving chip 130 through the second conductive portion 222 and the first conductive portion 221 in sequence.

[0072] Exemplarily, along the thickness direction of the substrate 110, the main body 211 of the support member 210 is arranged flush with the second surface of the substrate 110, and an extension trace 131 is provided on the second surface of the substrate 110, and the first end of the extension trace 131 is electrically connected to the driving chip 130, and the second end of the extension trace 131 is electrically connected to the first end of the connecting line 220, so that the driving chip 130 is electrically connected to the first end of the connecting line 220 through the extension trace 131, so that the position of the driving chip 130 on the first surface of the substrate 110 is more flexible.

[0073] A conductive member 111 is further disposed on the second surface of the substrate 110. The conductive member 111 is electrically connected to the extended trace 131. One end of the conductive member 111 away from the extended trace 131 is electrically connected to the first end of the connecting wire 220, so that the connecting wire 220 is electrically connected to the extended trace 131 through the conductive member 111.

[0074] Reference Figure 6 and Figure 7 The connecting wire 220 may also be provided with an auxiliary conductive part 223, the auxiliary conductive part 223 is arranged on the surface of the main body 211 of the support member 210 away from the cover plate 300, the auxiliary conductive part 223 is electrically connected to the first end of the connecting wire 220, the end of the auxiliary conductive part 223 away from the connecting wire 220 is away from the light-emitting component 120, and the auxiliary conductive part 223 is electrically connected to the conductive member 111.

[0075] It should be noted that, by providing an auxiliary conductive portion 223 at the first end of the connecting wire 220, the auxiliary conductive portion 223 is provided on the surface of the main body 211 of the support member 210, so that the first end of the connecting wire 220 is electrically connected to the conductive member 111 through the auxiliary conductive portion 223, thereby making the connection between the first end of the connecting wire 220 and the conductive member 111 more stable, and reducing the possibility of disconnection between the first end of the connecting wire 220 and the conductive member 111.

[0076] Exemplarily, the conductive member 111 can be configured as a bonding conductive member 111, wherein the first end of the bonding conductive member 111 is bonded to the second end of the extended trace 131, and the second end of the bonding conductive member 111 is bonded to the auxiliary conductive portion 223, so as to make the installation of the bonding conductive member 111 more stable and reduce the possibility of a short circuit between the auxiliary conductive portion 223 and the extended trace 131.

[0077] Reference Figure 3 and Figure 4 In some possible implementations, the number of integrated structures 100 and the number of routing structures 200 are both set to multiple, and each routing structure 200 is correspondingly arranged in one integrated structure 100; multiple integrated structures 100 and multiple routing structures 200 are alternately arranged in sequence along the first direction, and one end of the routing structure 200 away from the corresponding integrated structure 100 is connected to another integrated structure 100 to reduce the possibility of the connection line 220 contacting other integrated structures 100;

[0078] It should be noted that when the number of integrated structures 100 is set to multiple and multiple integrated structures 100 are spliced ​​together, a routing structure 200 is set between two adjacent integrated structures 100 so that the connecting line 220 in the routing structure 200 is connected to the corresponding integrated structure 100, and the support member 210 in the routing structure 200 is connected to another integrated structure 100 with the surface facing away from the connecting line 220, thereby reducing the possibility of the connecting line 220 being broken.

[0079] Exemplarily, the number of cover plates 300 can be set to one, and the cover plate 300 connects multiple integrated structures 100 and multiple wiring structures 200 that are alternately arranged in sequence, so that multiple integrated structures 100 and multiple wiring structures 200 are simultaneously covered by one cover plate 300, thereby improving the integrity of the display module and reducing the possibility of multiple integrated structures 100 detaching from each other.

[0080] In summary, by setting the routing structure 200, the electrical connection between the driving chip 130 and the light-emitting component 120 is realized through the routing structure 200; wherein the routing structure 200 includes a support member 210 and a connecting wire 220, the support member 210 is arranged on the surface of the cover plate 300 facing the light-emitting component 120, and the support member 210 and the substrate 110 are spaced apart; the connecting wire 220 is arranged on the surface of the support member 210 facing the substrate 110, and a gap is arranged between the surface of the connecting wire 220 facing the substrate 110 and the substrate 110, so as to reduce the possibility of the connecting wire 220 contacting the substrate 110, thereby reducing the possibility of the connecting wire 220 being broken, etc., and improving the display effect of the display module.

[0081] Reference Figure 3 and Figure 8 The present application also provides a method for preparing a display module, including:

[0082] S100, providing integrated structure and cover;

[0083] Reference Figure 5 and Figure 6 In some possible embodiments, the integrated structure 100 includes a substrate 110, a driver chip 130 and a light-emitting component 120, the light-emitting component 120 is arranged on the first surface of the substrate 110, and the driver chip 130 is arranged on the second surface of the substrate 110; the second surface of the substrate 110 may also be provided with an extended trace 131, and the first end of the extended trace 131 is electrically connected to the driver chip 130.

[0084] Exemplarily, the light-emitting component 120 includes a light-emitting portion 121 and a transition portion 122, the transition portion 122 is electrically connected to one end of the light-emitting portion 121, along the thickness direction of the substrate 110, the thickness of the light-emitting portion 121 may be greater than the thickness of the transition portion 122, and the surface of the light-emitting portion 121 facing away from the substrate 110 is used to connect to the cover plate 300, when the cover plate 300 covers the surface of the light-emitting portion 121 facing away from the substrate 110, the cover plate 300 and the conversion portion are spaced apart.

[0085] S200, forming a wiring structure on the surface of the cover plate;

[0086] Reference Figure 6 The wiring structure 200 includes a support member 210 and a connecting line 220, wherein the support member 210 is disposed on the surface of the cover plate 300, and the connecting line 220 is disposed on the support member 210; the wiring structure 200 is formed on the cover plate 300, including:

[0087] A support member 210 is formed on the surface of the cover plate 300; the support member 210 can be formed on the surface of the cover plate 300 by deposition or the like, the material of the support member 210 can be set to organic materials such as black matrix and planarization material, the support member 210 includes a main body 211 and an extension portion 212, a first end of the extension portion 212 is connected to the main body 211, and a second end of the extension portion 212 extends in a direction away from the main body 211; the thickness of the main body 211 is equal to the sum of the thicknesses of the light-emitting component 120 and the substrate 110, the thickness of the main body 211 is greater than the thickness of the extension portion 212, and the extension portion 212 is used to fill between the cover plate 300 and the conversion portion.

[0088] A connecting line 220 is formed on the surface of the support member 210; the connecting line 220 can be formed on the surface of the support member 210 by silver paste pad printing or physical vapor deposition, and the connecting line 220 includes a first conductive portion 221 and a second conductive portion 222 connected to each other, and the first conductive portion 221 and the second conductive portion 222 can be integrally formed on the surface of the support member 210; wherein the first conductive portion 221 can be formed on the surface of the main body 211, and the second conductive portion 222 is formed on the surface of the extension portion 212 away from the cover plate 300;

[0089] Reference Figure 6 and Figure 7 The connecting line 220 may also be provided with an auxiliary conductive part 223, which may be integrally formed with the first conductive part 221 and the second conductive part 222, the auxiliary conductive part 223 being connected to the first end of the connecting line 220, and the auxiliary conductive part 223 being formed on the surface of the main body 211 away from the cover plate 300.

[0090] S300, installing a cover plate and a wiring structure on a surface of the light-emitting component away from the substrate;

[0091] Reference Figure 5 , Figure 6 and Fig. 9 , illustratively, when the cover plate 300 and the wiring structure 200 are mounted on the surface of the light emitting component 120 away from the substrate 110, the support member 210 is spaced apart from the substrate 110, the connecting wire 220 is disposed on the surface of the support member 210 facing the substrate 110, the first end of the connecting wire 220 is electrically connected to the driving chip 130, the second end of the connecting wire 220 is electrically connected to the light emitting component 120, and a gap is disposed between the surface of the connecting wire 220 facing the substrate 110 and the substrate 110 to reduce the possibility of the connecting wire 220 contacting the substrate 110;

[0092] In some possible implementations, the second surface of the substrate 110 may also be provided with an extended trace 131, and a first end of the extended trace 131 is electrically connected to the driver chip 130. The preparation method further includes:

[0093] A conductive member 111 is provided; illustratively, the conductive member 111 may be configured as a bonding conductive member 111 to make the installation of the conductive member 111 more stable.

[0094] The conductive member 111 is installed on the second surface of the substrate 110; illustratively, the conductive member 111 is electrically connected to the extended trace 131, and one end of the conductive member 111 facing away from the extended trace 131 is electrically connected to the first end of the connecting line 220, the first end of the bonded conductive member 111 is bonded to the second end of the extended trace 131, and the second end of the bonded conductive member 111 is bonded to the auxiliary conductive portion 223, so that the installation of the bonded conductive member 111 is more stable and the possibility of a short circuit between the auxiliary conductive portion 223 and the extended trace 131 is reduced.

[0095] In some possible embodiments, the number of cover plates 300 can be set to one, and the number of integrated structures 100 and the number of routing structures 200 can both be set to multiple. Then, multiple routing structures 200 can be formed on the surface of the cover plate 300, and then the multiple integrated structures 100 are respectively connected to the corresponding routing structures 200, so that the multiple integrated structures 100 and the multiple routing structures 200 are alternately arranged in sequence, and the end of the routing structure 200 that is away from the corresponding integrated structure 100 is connected to another integrated structure 100 to reduce the possibility of the connecting line 220 contacting other integrated structures 100.

[0096] In summary, by forming a routing structure 200 on the surface of the cover plate 300, and installing the cover plate 300 and the routing structure 200 on the surface of the light-emitting component 120 away from the substrate 110, the electrical connection between the driving chip 130 and the light-emitting component 120 can be achieved through the routing structure 200; wherein the routing structure 200 includes a support member 210 and a connecting wire 220, the support member 210 is arranged on the cover plate 300, and the support member 210 and the substrate 110 are spaced apart; the connecting wire 220 is arranged on the surface of the support member 210 facing the substrate 110, and a gap is arranged between the surface of the connecting wire 220 facing the substrate 110 and the substrate 110, so as to reduce the possibility of the connecting wire 220 contacting the substrate 110, thereby reducing the possibility of the connecting wire 220 being broken, etc., and improving the display effect of the display module.

[0097] An embodiment of the present application further provides a display device. Since the display device includes the display module described in any of the above embodiments, the display device includes the advantages of the display module described in any of the above embodiments. For details, please refer to the relevant description above and will not be repeated here.

[0098] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0099] In the description of the present invention, it should be understood that the terms "including" and "having" and any variations thereof used herein are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus comprising a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to these processes, methods, products or apparatuses.

[0100] Unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed", etc. should be understood in a broad sense, for example, it can be fixedly connected, detachably connected, or integrated; it can be directly connected, or indirectly connected through an intermediate medium, and it can make the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. In addition, the terms "first", "second", etc. are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated.

[0101] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A display module, characterized in that: Including integrated structure, cover plate and wiring structure; The integrated structure comprises a substrate, a driving chip and a light-emitting component, wherein the light-emitting component is arranged on a first surface of the substrate, a surface of the light-emitting component facing away from the substrate is connected to the cover plate, and the driving chip is arranged on a second surface of the substrate, wherein the first surface and the second surface are two opposite surfaces in the thickness direction of the substrate; The routing structure includes a support member and a connecting wire, wherein the support member is arranged on the surface of the cover plate facing the light-emitting component, and the support member is spaced apart from the substrate; the connecting wire is arranged on the surface of the support member facing the substrate, the first end of the connecting wire is electrically connected to the driving chip, and the second end of the connecting wire is electrically connected to the light-emitting component.

2. The display module according to claim 1, characterized in that: The light-emitting assembly includes a light-emitting portion and a transition portion, wherein the transition portion is located on a side of the light-emitting portion close to the support member and is electrically connected to the light-emitting portion, and the transition portion is electrically connected to the second end of the connecting line; Along the thickness direction of the substrate, the thickness of the light-emitting portion is greater than the thickness of the adapter portion, the surface of the light-emitting portion facing the cover plate is connected to the cover plate, the surface of the adapter portion facing the cover plate is spaced apart from the cover plate, and part of the support member is accommodated between the adapter portion and the cover plate.

3. The display module according to claim 2, characterized in that: The support member includes a main body and an extension portion, wherein a first end of the extension portion is connected to the main body, a second end of the extension portion extends toward the light-emitting portion, and a surface of the extension portion facing away from the cover plate faces toward the adapter portion; A gap is provided between the surface of the connecting line facing the substrate and the substrate, the connecting line comprises a first conductive part and a second conductive part, the first conductive part is provided on the main body, a first end of the first conductive part is electrically connected to the driving chip, and the first end of the first conductive part forms a first end of the connecting line; The second conductive portion is arranged on a surface of the extension portion away from the cover plate, the second conductive portion is electrically connected to the second end of the first conductive portion, the second conductive portion is electrically connected to the transition portion, and an end of the second conductive portion away from the first conductive portion forms the second end of the connecting line.

4. The display module according to claim 2, characterized in that: The light-emitting part includes a circuit body, a bonding piece and a light-emitting unit, wherein the circuit body is arranged on the first surface of the substrate, and the circuit body is electrically connected to the light-emitting unit through the bonding piece; A filling layer is further provided on the surface of the circuit body away from the substrate, the surface of the filling layer away from the circuit body is connected to the cover plate, and the filling layer accommodates the bonding component and the light-emitting unit; Preferably, the circuit body and the filling layer are reused to form the transition portion.

5. The display module according to claim 1, characterized in that: Along the thickness direction of the substrate, the surface of the support member facing away from the cover plate is arranged flush with the second surface of the substrate; An extended wire is disposed on the second surface of the substrate, a first end of the extended wire is electrically connected to the driving chip, and a second end of the extended wire is electrically connected to the first end of the connecting wire.

6. The display module according to claim 5, characterized in that: A conductive member is further disposed on the second surface of the substrate, the conductive member is electrically connected to the extended trace, and an end of the conductive member facing away from the extended trace is electrically connected to the first end of the connecting line; Preferably, the connecting wire is provided with an auxiliary conductive part, the auxiliary conductive part is arranged on the surface of the supporting member facing away from the cover plate, the auxiliary conductive part is electrically connected to the first end of the connecting wire, one end of the auxiliary conductive part facing away from the connecting wire faces away from the light-emitting component, and the auxiliary conductive part is electrically connected to the conductive member.

7. The display module according to any one of claims 1 to 6, characterized in that: The number of the integrated structures and the number of the routing structures are both set to be multiple, and each routing structure is correspondingly arranged in one integrated structure; A plurality of the integrated structures and a plurality of the wiring structures are alternately arranged in sequence, and one end of the wiring structure away from the corresponding integrated structure is connected to another integrated structure; Preferably, the number of the cover plates is set to one, and the cover plate connects the multiple integrated structures and the multiple routing structures that are alternately arranged in sequence.

8. A method for preparing a display module, characterized in that: include: An integrated structure and a cover plate are provided; the integrated structure comprises a substrate, a driving chip and a light-emitting component, the light-emitting component is arranged on a first surface of the substrate, and the driving chip is arranged on a second surface of the substrate; A wiring structure is formed on the surface of the cover plate; the wiring structure comprises a support member and a connecting line, the support member is arranged on the surface of the cover plate, and the connecting line is arranged on the support member; The cover plate and the wiring structure are installed on the surface of the light-emitting component away from the substrate; the support member is spaced apart from the substrate, and the connecting wire is arranged on the surface of the support member facing the substrate, the first end of the connecting wire is electrically connected to the driving chip, and the second end of the connecting wire is electrically connected to the light-emitting component.

9. The method for preparing a display module according to claim 8, characterized in that: An extended wiring is disposed on the second surface of the substrate, and a first end of the extended wiring is electrically connected to the driving chip; The preparation method also includes: Providing conductive parts; The conductive element is mounted on the second surface of the substrate; the conductive element is electrically connected to the extended trace, and one end of the conductive element away from the extended trace is electrically connected to the first end of the connecting line.

10. A display device, characterized in that: Comprising a display module as described in any one of claims 1-7.

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