Display panel and display device

Abstract

A display panel and a display device relate to the technical field of display. The display panel includes: a light emitting substrate; the retaining wall is arranged on one side of the light-emitting substrate and located in the frame area; the first inorganic packaging layer is arranged on the side, away from the light-emitting substrate, of the retaining wall; the first stress release layer is arranged on one side, deviating from the light-emitting substrate, of the first inorganic packaging layer; the orthographic projection of the first stress release layer on the light-emitting substrate covers the orthographic projection of the retaining wall on the light-emitting substrate, and the first stress release layer is located in the orthographic projection range of the first inorganic packaging layer on the light-emitting substrate. The objective of the invention is to reduce stress accumulation of an inorganic encapsulation layer through a first stress release layer and prevent the inorganic encapsulation layer from generating cracks.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] With the development of display technology, organic light-emitting diode (OLED) display panels are widely used in various display devices such as smart phones, laptops, tablet computers, etc. due to their low power consumption, high response speed and flexible performance. Summary of the invention

[0003] The present disclosure provides a display panel, comprising a display area and a frame area surrounding the display area, the display panel comprising:

[0004] Light-emitting substrate;

[0005] A retaining wall is arranged on one side of the light-emitting substrate and is located in the frame area;

[0006] A first inorganic encapsulation layer is disposed on a side of the retaining wall away from the light-emitting substrate; and

[0007] A first stress release layer is arranged on a side of the first inorganic encapsulation layer away from the light-emitting substrate;

[0008] The orthographic projection of the first stress release layer on the light-emitting substrate covers the orthographic projection of the retaining wall on the light-emitting substrate and is located within the orthographic projection range of the first inorganic encapsulation layer on the light-emitting substrate.

[0009] In some embodiments, the display panel further includes:

[0010] A second inorganic encapsulation layer is disposed on a side of the first stress release layer away from the light-emitting substrate; and

[0011] A first organic encapsulation layer, disposed between the first inorganic encapsulation layer and the second inorganic encapsulation layer;

[0012] The second inorganic encapsulation layer covers the first stress release layer and the first organic encapsulation layer, the first stress release layer and the first organic encapsulation layer are separated from each other, and the first stress release layer is located on a side of the first organic encapsulation layer away from the display area.

[0013] In some embodiments, the surface of the first stress release layer facing away from the light-emitting substrate is uneven, and the thickness of the first stress release layer at different positions is substantially the same.

[0014] In some embodiments, the first stress release layer includes an organic material and an inorganic material, and a carbon content of the first stress release layer is greater than or equal to 20% and less than or equal to 60%.

[0015] In some embodiments, in the normal direction of the light-emitting substrate, the carbon content of the first stress release layer at different positions is substantially the same; or

[0016] The first stress release layer includes: a first sub-film layer, a second sub-film layer and a third sub-film layer stacked in the normal direction of the light-emitting substrate, the second sub-film layer is located between the first sub-film layer and the third sub-film layer, and the carbon content of the second sub-film layer is greater than the carbon content of the first sub-film layer and the carbon content of the third sub-film layer.

[0017] In some embodiments, a surface of the first stress release layer facing away from the light-emitting substrate is substantially a plane, and the thickness of the first stress release layer at at least two locations is different.

[0018] In some embodiments, a main material of the first stress release layer is an organic material.

[0019] In some embodiments, the slope angle of the first stress release layer is less than or equal to 40°.

[0020] In some embodiments, the thickness of the first stress release layer is greater than or equal to 0.1 micrometers and less than or equal to 3 micrometers.

[0021] In some embodiments, a minimum distance between an orthographic projection boundary of the first stress release layer on the light-emitting substrate and an orthographic projection boundary of the first organic encapsulation layer on the light-emitting substrate is greater than or equal to 20 micrometers and less than or equal to 70 micrometers; and / or

[0022] The minimum distance between the orthographic projection boundary of the first stress release layer on the light-emitting substrate and the orthographic projection boundary of the retaining wall on the light-emitting substrate is greater than or equal to the thickness of the first stress release layer and less than or equal to 5 micrometers.

[0023] In some embodiments, the display panel further includes:

[0024] a third inorganic encapsulation layer, disposed between the retaining wall and the first inorganic encapsulation layer;

[0025] The orthographic projection of the first stress release layer on the light-emitting substrate at least covers the blocking area, the retaining wall is located in the blocking area, and in the blocking area, the first inorganic encapsulation layer is in direct contact with the third inorganic encapsulation layer.

[0026] In some embodiments, the stress generated by the first stress release layer is in a direction opposite to the stress generated by the first inorganic encapsulation layer and the third inorganic encapsulation layer.

[0027] In some embodiments, a main material of the first stress release layer is an inorganic material.

[0028] In some embodiments, the thickness of the first stress release layer is greater than or equal to 0.03 micrometers and less than or equal to 0.1 micrometers.

[0029] In some embodiments, the stress generated by the first stress release layer is greater than or equal to 100 MPa and less than or equal to 300 MPa.

[0030] In some embodiments, the display panel further includes:

[0031] A second stress release layer is provided on a side of the second inorganic encapsulation layer away from the light-emitting substrate, and an orthographic projection of the second stress release layer on the light-emitting substrate at least covers an orthographic projection of the first stress release layer on the light-emitting substrate; and

[0032] The stress generated by the second stress release layer is in a direction opposite to the stress generated by the second inorganic encapsulation layer.

[0033] The present disclosure provides a display device, comprising:

[0034] The display panel as described in any one of the embodiments; and

[0035] The driving circuit is connected to the display panel and is used to drive the display panel to display.

[0036] The above description is only an overview of the technical solution of the present disclosure. In order to more clearly understand the technical means of the present disclosure, it can be implemented according to the contents of the specification. In order to make the above and other purposes, features and advantages of the present disclosure more obvious and easy to understand, the specific implementation methods of the present disclosure are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or related technologies, the following is a brief introduction to the drawings required for use in the embodiments or related technical descriptions. Obviously, the drawings described below are some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. It should be noted that the proportions in the drawings are only for illustration and do not represent the actual proportions.

[0038] Figure 1a The schematic diagram of the planar structure of a display panel in the related art is exemplarily shown;

[0039] Figure 1b The reliability test result diagram of the display panel in the related art is exemplarily shown;

[0040] Figure 2 The schematic diagram of the planar structure of the display panel provided by the present disclosure is exemplarily shown;

[0041] Figure 3 A schematic cross-sectional structure diagram of a display panel provided by the present disclosure is exemplarily shown;

[0042] Figure 4 A schematic diagram of a first stress release layer structure provided by the present disclosure is exemplarily shown;

[0043] Figure 5 A schematic cross-sectional structure diagram of another display panel provided by the present disclosure is exemplarily shown;

[0044] Figure 8 A schematic cross-sectional structure diagram of another display panel provided by the present disclosure is exemplarily shown;

[0045] Figure 6 A schematic cross-sectional structure diagram of another display panel provided by the present disclosure is exemplarily shown;

[0046] Figure 7 A schematic cross-sectional structure diagram of another display panel provided by the present disclosure is exemplarily shown;

[0047] Fig. 9 The cross-sectional view of the display panel provided by the present disclosure after completing the reliability test is exemplarily shown.

[0048] Reference numerals:

[0049] 101-display panel; 11-light-emitting substrate; 12-retaining wall; 13-first inorganic encapsulation layer; 14-first stress release layer; 15-second inorganic encapsulation layer; 16-first organic encapsulation layer; 21-third inorganic encapsulation layer; 22-second organic encapsulation layer; 31-second stress release layer; 141-first sub-film layer; 142-second sub-film layer; 143-third sub-film layer; 111-first substrate; 112-first barrier layer; 113-second substrate; 114-second barrier layer; 115-buffer layer; 116-dielectric layer; 117-crack retaining wall; 118-covering layer; 119-first source and drain metal layer; 120-second source and drain metal layer; 121-flat layer; 122-pixel definition layer; 123-cathode; 124-anode; AA-display area; BA-frame area; ZA-blocking area. DETAILED DESCRIPTION

[0050] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0051] Reference Figure 1a , Figure 1a A display panel in the related art is exemplarily shown. Figure 1a As shown, the display panel includes a display area AA and a frame area BA arranged around the display area AA, wherein the circuit binding area Pad and the retaining wall 12 are arranged in the frame area BA. Figure 1a When the display panel shown in the figure is subjected to a reliability test, for example, in a high temperature and high humidity or accelerated environment, the inorganic encapsulation layer above the retaining wall 12 is prone to cracks (such as Figure 1b As shown), resulting in package failure.

[0052] In order to solve the above problems, Figure 2 As shown, the display panel 101 provided by the present disclosure includes a display area AA and a frame area BA surrounding the display area AA.

[0053] like Figure 3-8 As shown in any one, the display panel 101 provided by the present disclosure includes: a light-emitting substrate 11; a retaining wall 12, which is arranged on one side of the light-emitting substrate 11 and located in the frame area BA; a first inorganic encapsulation layer 13, which is arranged on the side of the retaining wall 12 away from the light-emitting substrate 11; and a first stress release layer 14, which is arranged on the side of the first inorganic encapsulation layer 13 away from the light-emitting substrate 11. The orthographic projection of the first stress release layer 14 on the light-emitting substrate 11 covers the orthographic projection of the retaining wall 12 on the light-emitting substrate 11, and is located within the orthographic projection range of the first inorganic encapsulation layer 13 on the light-emitting substrate 11.

[0054] The display panel provided in the present disclosure releases the stress accumulated in the first inorganic encapsulation layer 13 by disposing a first stress release layer 14 on the side of the first inorganic encapsulation layer 13 away from the light-emitting substrate 11 , thereby preventing the first inorganic encapsulation layer 13 from generating cracks.

[0055] In addition, since the area corresponding to the retaining wall 12 in the first inorganic encapsulation layer 13 has greater stress than other areas and is more prone to cracks, the first stress release layer 14 is arranged above the area corresponding to the retaining wall 12 in the first inorganic encapsulation layer 13. That is to say, the orthographic projection of the first stress release layer 14 on the light-emitting substrate 11 covers the orthographic projection of the retaining wall 12 on the light-emitting substrate 11, and is located within the range of the orthographic projection of the first inorganic encapsulation layer 13 on the light-emitting substrate 11, which can significantly improve the reliability and yield of the display panel.

[0056] In some embodiments, the display panel 101 provided by the present disclosure may include a retaining wall 12, or may include multiple retaining walls 12, such as 2, 3, etc., and 2 retaining walls 12 are used as an example below (eg, Figure 3-8 Any one of the above is shown) for explanation.

[0057] It can be understood that the examples are only for better illustrating the technical solutions of the present disclosure and do not constitute the sole limitation of the present disclosure.

[0058] In a specific implementation, the specific structure and setting of the first stress release layer 14 can be implemented in a variety of ways, and the following implementations are used as examples for description.

[0059] In the first to second implementations, Figures 3 to 5 As shown in any one of the figures, the display panel 101 further includes: a second inorganic encapsulation layer 15, which is arranged on a side of the first stress release layer 14 away from the light-emitting substrate 11; and a first organic encapsulation layer 16, which is arranged between the first inorganic encapsulation layer 13 and the second inorganic encapsulation layer 15. The second inorganic encapsulation layer 15 covers the first stress release layer 14 and the first organic encapsulation layer 16, the first stress release layer 14 and the first organic encapsulation layer 16 are arranged separately from each other, and the first stress release layer 14 is located on a side of the first organic encapsulation layer 16 away from the display area AA.

[0060] Among them, the first inorganic encapsulation layer 13, the first organic encapsulation layer 16 and the second inorganic encapsulation layer 15 together constitute the encapsulation layer of the display panel 101. The orthographic projection of the retaining wall 12 on the light-emitting substrate 11 is separated from the first organic encapsulation layer 16, that is, there is no first organic encapsulation layer 16 between the first inorganic encapsulation layer 13 and the second inorganic encapsulation layer 15 above the retaining wall 12. If the first inorganic encapsulation layer 13 and the second inorganic encapsulation layer 15 are in direct contact, stress accumulation is likely to occur, resulting in cracks. By separating the first inorganic encapsulation layer 13 and the second inorganic encapsulation layer 15 through the first stress release layer 14, the stress accumulation between the first inorganic encapsulation layer 13 and the second inorganic encapsulation layer 15 can be alleviated, cracks can be prevented, and the reliability of the encapsulation frame can be improved.

[0061] In order to avoid poor coating of the second inorganic encapsulation layer 15, illustratively, in the first and second implementations, the slope angle of the first stress release layer 14 is less than or equal to 40°. The slope angle of the first stress release layer 14 refers to the angle between the side surface of the first stress release layer 14 and the plane where the light-emitting substrate 11 is located (e.g. Figure 5 Angle a) shown.

[0062] For example, Figure 3 or Figure 5 As shown, the minimum distance d1 between the orthographic projection boundary of the first stress release layer 14 on the light-emitting substrate 11 and the orthographic projection boundary of the first organic encapsulation layer 16 on the light-emitting substrate 11 is greater than or equal to 20 microns and less than or equal to 70 microns. Preferably, the minimum distance d1 is greater than or equal to 40 microns and less than or equal to 70 microns.

[0063] like Figure 3 or Figure 5 As shown, a certain distance d1 is reserved between the orthographic projection boundary of the first stress release layer 14 on the light-emitting substrate 11 and the orthographic projection boundary of the first organic encapsulation layer 16 on the light-emitting substrate 11, so as to ensure that the first stress release layer 14 is not contacted during the process of inkjet printing and leveling the first organic encapsulation layer 16, and prevent water and oxygen from invading the first organic encapsulation layer 16 through the first stress release layer 14.

[0064] For example, Figure 3 or Figure 5 As shown, the minimum distance d2 between the orthographic projection boundary of the first stress release layer 14 on the light-emitting substrate 11 and the orthographic projection boundary of the retaining wall 12 on the light-emitting substrate 11 is greater than or equal to the thickness of the first stress release layer 14 and less than or equal to 5 microns.

[0065] like Figure 3 or Figure 5 As shown, the orthographic projection boundary of the first stress release layer 14 on the light-emitting substrate 11 is located outside the orthographic projection boundary of the retaining wall 12 on the light-emitting substrate 11, and a certain distance d2 is left between the orthographic projection boundary of the first stress release layer 14 on the light-emitting substrate 11 and the orthographic projection boundary of the retaining wall 12 on the light-emitting substrate 11. A section of the first stress release layer 14 is still arranged in the horizontal direction outside the retaining wall 12 to prevent the film layer from expanding too much and causing cracks due to the high temperature and high humidity environment, and to prevent water and oxygen from invading the light-emitting substrate 11 through the first stress release layer 14.

[0066] For example, Figure 3 or Figure 5 As shown, the thickness of the first stress release layer 14 is greater than or equal to 0.1 micrometers and less than or equal to 3 micrometers.

[0067] For example, Figure 3 or Figure 5 As shown, there is a certain distance between the orthographic projection boundary of the first stress release layer 14 on the light-emitting substrate 11 and the orthographic projection boundary of the second inorganic encapsulation layer 15 on the light-emitting substrate 11, that is, the edge of the first stress release layer 14 is indented relative to the edge of the second inorganic encapsulation layer 15, thereby preventing water and oxygen from invading the first stress release layer 14.

[0068] For example, Figure 3 or Figure 5 As shown, there is a certain distance between the orthographic projection boundary of the first stress release layer 14 on the light-emitting substrate 11 and the orthographic projection boundary of the first inorganic encapsulation layer 13 on the light-emitting substrate 11, that is, the edge of the first stress release layer 14 is indented relative to the edge of the first inorganic encapsulation layer 13, thereby preventing water and oxygen from invading the light-emitting substrate 11 through the first stress release layer 14.

[0069] In the first implementation, Figure 3 As shown, the surface of the first stress release layer 14 facing away from the light-emitting substrate 11 is uneven. In this implementation, the first stress release layer 14 grows along the topography of the retaining wall 12 and is in an uneven shape.

[0070] For example, Figure 3 As shown, the thickness of the first stress release layer 14 at different positions is substantially the same. Figure 3 The thickness of the first stress release layer 14 at the position A, the position B and the position C shown is substantially the same.

[0071] Exemplarily, the thickness of the first stress release layer 14 is greater than or equal to 0.1 micrometers and less than or equal to 2 micrometers.

[0072] Exemplarily, the first stress release layer 14 includes an organic material and an inorganic material, and the carbon content of the first stress release layer 14 is greater than or equal to 20% and less than or equal to 60%.

[0073] Exemplarily, the first stress release layer 14 is an inorganic-organic hybrid film layer, and the material may include SiCN, SiOC, etc.

[0074] Exemplarily, the carbon content of the first stress release layer 14 at different positions is substantially the same in the normal direction of the light-emitting substrate 11. For example, when the material of the first stress release layer 14 is SiCN, a first stress release layer 14 having a uniform carbon content at different positions is formed in the normal direction of the light-emitting substrate 11.

[0075] For example, Figure 4As shown, the first stress release layer 14 includes: a first sub-film layer 141, a second sub-film layer 142 and a third sub-film layer 143 stacked in the normal direction of the light-emitting substrate 11, the second sub-film layer 142 is located between the first sub-film layer 141 and the third sub-film layer 143, and the carbon content of the second sub-film layer 142 is greater than the carbon content of the first sub-film layer 141 and the carbon content of the third sub-film layer 143.

[0076] For example, when the material of the first stress release layer 14 is SiOC, the carbon content of the first stress release layer 14 gradually changes in the normal direction of the light-emitting substrate 11. Specifically, in the direction from the first inorganic encapsulation layer 13 to the second inorganic encapsulation layer 15, the first stress release layer 14 includes the first sub-film layer 141, the second sub-film layer 142 and the third sub-film layer 143 in sequence, wherein the carbon content of the second sub-film layer 142 is greater than that of the first sub-film layer 141 and the third sub-film layer 143. In other words, in the direction from the first inorganic encapsulation layer 13 to the second inorganic encapsulation layer 15, the carbon content of the first stress release layer 14 gradually increases and then gradually decreases, and the carbon content is the smallest near the interface between the first inorganic encapsulation layer 13 and the second inorganic encapsulation layer 15.

[0077] Exemplarily, the first stress release layer 14 can be prepared by chemical vapor deposition process. By using chemical vapor deposition process, the first stress release layer 14 with a small slope angle can be prepared.

[0078] In the second implementation, Figure 5 As shown, the surface of the first stress release layer 14 facing away from the light-emitting substrate 11 is substantially a plane, that is, the surface of the first stress release layer 14 facing away from the light-emitting substrate 11 is a flat surface.

[0079] For example, Figure 5 As shown, the thickness of the first stress release layer 14 at at least two locations in the first stress release layer 14 is different. Figure 5 The thicknesses of the first stress release layer 14 at position D, position E and position F are all different.

[0080] Exemplarily, the thickness of the first stress release layer 14 is greater than or equal to 1 micron and less than or equal to 3 microns. In this way, the surface of the retaining wall 12 can be flattened, while a large height difference caused by excessive thickness can be avoided, which in turn leads to stress concentration in the second inorganic encapsulation layer 15.

[0081] Exemplarily, the main material of the first stress release layer 14 is an organic material.

[0082] Exemplarily, the main material of the first stress release layer 14 is an organic material that can be cured by heat or UV, including: polyimide, methyl methacrylate, epoxy resin, polyethylene, etc. In the case of heat curing, the heat curing temperature is lower than 100° C. and the time is lower than 2 hours. In the case of UV curing, the UV curing band is greater than 395nm.

[0083] Exemplarily, the first stress release layer 14 can be prepared by using a photolithography process.

[0084] In the third implementation, Figure 6 and Figure 7 As shown, based on the first implementation method and the second implementation method, the display panel may also include: a second stress release layer 31, which is arranged on the side of the second inorganic encapsulation layer 15 away from the light-emitting substrate 11, and the orthographic projection of the second stress release layer 31 on the light-emitting substrate 11 at least covers the orthographic projection of the first stress release layer 14 on the light-emitting substrate 11; and the stress generated by the second stress release layer 31 is opposite to the stress generated by the second inorganic encapsulation layer 15.

[0085] The opposite directions of stresses mean that one of the two stresses is tensile stress and the other is compressive stress; or one is compressive stress and the other is tensile stress.

[0086] Since the stress generated by the second stress release layer 31 is in opposite direction to the stress generated by the second inorganic encapsulation layer 15, the stress generated by the second inorganic encapsulation layer 15 can be offset by reasonably setting the thickness of the second stress release layer 31. That is, the second stress release layer 31 acts as a reverse stress layer to neutralize the stress generated by the inorganic encapsulation layer, thereby further preventing the inorganic encapsulation layer from cracking and, if cracks have already occurred, preventing the cracks from spreading.

[0087] For example, the orthographic projection of the second stress release layer 31 on the light-emitting substrate 11 may partially cover the orthographic projection of the first stress release layer 14 on the light-emitting substrate 11, or may completely cover the orthographic projection of the first stress release layer 14 on the light-emitting substrate 11 (e.g. Figure 6 and Figure 7 As shown), the light-emitting substrate 11 may also be entirely covered.

[0088] Exemplarily, the main material of the second stress release layer 31 is an inorganic material.

[0089] Exemplarily, the thickness of the second stress release layer 31 is greater than or equal to 0.03 micrometers and less than or equal to 0.1 micrometers.

[0090] Exemplarily, the stress generated by the second stress release layer 31 is greater than or equal to 100 MPa and less than or equal to 300 MPa.

[0091] Exemplarily, the second stress release layer 31 may be prepared by using an atomic layer deposition (ALD) process.

[0092] In the fourth implementation, if Figure 8 As shown, the display panel 101 may further include: a third inorganic encapsulation layer 21, which is disposed between the retaining wall 12 and the first inorganic encapsulation layer 13. The orthographic projection of the first stress release layer 14 on the light-emitting substrate 11 at least covers the blocking area ZA, the retaining wall 12 is located in the blocking area ZA, and in the blocking area ZA, the first inorganic encapsulation layer 13 is in direct contact with the third inorganic encapsulation layer 21.

[0093] For example, the orthographic projection of the first stress release layer 14 on the light-emitting substrate 11 may partially cover the blocking area ZA, or may completely cover the blocking area ZA (eg, Figure 8 As shown), the light emitting substrate 11 may also be entirely covered, which is not limited here.

[0094] In the direction from the display area AA to the frame area BA, the blocking area ZA may include a barrier wall 12, or a plurality of barrier walls 12 separated from each other (eg, Figure 8 The retaining wall 12 is used to block the organic solution in the display area AA to prevent it from overflowing.

[0095] In this implementation, the display panel 101 further includes: a second organic encapsulation layer 22, located between the first inorganic encapsulation layer 13 and the third inorganic encapsulation layer 21, and the orthographic projection of the second organic encapsulation layer 22 on the light-emitting substrate 11 does not overlap with the blocking area ZA. The first inorganic encapsulation layer 13, the second organic encapsulation layer 22 and the third inorganic encapsulation layer 21 constitute an encapsulation layer, and the first stress release layer 14 is disposed on the side of the first inorganic encapsulation layer 13 away from the light-emitting substrate 11.

[0096] Exemplarily, the first stress release layer 14 can be prepared by using an atomic layer deposition (ALD) process.

[0097] Exemplarily, the stress generated by the first stress release layer 14 is in the opposite direction to the stress generated by the first inorganic encapsulation layer 13 and the third inorganic encapsulation layer 21 .

[0098] For example, if the stress generated by the first inorganic encapsulation layer 13 and the third inorganic encapsulation layer 21 is compressive stress, the stress generated by the first stress release layer 14 is tensile stress; or if the stress generated by the first inorganic encapsulation layer 13 and the third inorganic encapsulation layer 21 is tensile stress, the stress generated by the first stress release layer 14 is compressive stress.

[0099] The reverse stress of the first stress release layer 14 acts on the position above the retaining wall 12 and where the first inorganic encapsulation layer 13 and the third inorganic encapsulation layer 21 are in direct interface contact. In this way, the stress generated by the first inorganic encapsulation layer 13 and the third inorganic encapsulation layer 21 is neutralized to prevent cracks from occurring in the inorganic encapsulation layer. In addition, if cracks have already occurred, crack propagation can be suppressed.

[0100] For example, the main material of the first stress release layer 14 is an inorganic material, such as Al 2 O 3 , SiO x , etc.

[0101] For example, the first stress release layer 14 has a thickness in the range of greater than or equal to 0.03 micrometers and less than or equal to 0.1 micrometers.

[0102] For example, the stress generated by the first stress release layer 14 is greater than or equal to 100 MPa and less than or equal to 300 MPa. In this way, the stress generated by the first stress release layer 14 matches the stress generated by the inorganic encapsulation layer (that is, the first inorganic encapsulation layer 13 and the third inorganic encapsulation layer 21) in the encapsulation layer, playing a role in neutralizing the stress of the inorganic encapsulation layer.

[0103] In some embodiments, the encapsulation layer of the display panel 101 provided by the present disclosure may also include more than three inorganic encapsulation layers and / or more than two organic encapsulation layers, and the arrangement of the inorganic encapsulation layer and the organic encapsulation layer follows the principle of alternating stacking in sequence, and the organic encapsulation layer is located between the two inorganic encapsulation layers, that is, the total number of inorganic encapsulation layers is always greater than the total number of organic encapsulation layers. For example, in the direction from the light-emitting substrate 11 to the encapsulation layer, an inorganic encapsulation layer, an organic encapsulation layer, an inorganic encapsulation layer, an organic encapsulation layer, ..., an inorganic encapsulation layer may be stacked in sequence.

[0104] Exemplarily, the light-emitting substrate 11 provided in the present disclosure may include a light-emitting device, which may be, for example, an organic light-emitting diode (OLED), a quantum dot light-emitting diode (QLED), a sub-millimeter light-emitting diode (Mini LED), or a micro light-emitting diode (Micro LED), etc.

[0105] like Figure 7 As shown, after 800 hours of reliability testing at high temperature and high humidity, the inorganic encapsulation layers of the display panel provided by the present disclosure were intact without any cracks.

[0106] In some embodiments, Figures 3 to 8As shown in any one of the figures, the light emitting substrate 11 further includes: a first substrate 111, a first barrier layer 112, a second substrate 113 and a second barrier layer 114. The first barrier layer 112 is located on the side of the first substrate 111 away from the back plate, the second substrate 113 is located on the side of the first barrier layer 112 away from the first substrate 111, and the second barrier layer 114 is located on the side of the second substrate 113 away from the first barrier layer 112.

[0107] In some embodiments, Figures 3 to 8 As shown in any one of the figures, the light emitting substrate 11 further includes: a buffer layer 115 , which is located on a side of the second barrier layer 114 away from the second substrate 113 .

[0108] In some embodiments, Figures 3 to 8 As shown in any one of the figures, the light-emitting substrate 11 also includes: a dielectric layer 116, which is located on the side of the buffer layer 115 away from the second barrier layer 114; and a crack dam 117 arranged on the same layer as the dielectric layer 116; and a covering layer 118 which is located on the side of the crack dam 117 away from the dielectric layer 116, and the orthographic projection of the covering layer 118 on the first substrate 111 at least covers the orthographic projection of the spacing area between the crack dam 117 and the dielectric layer 116 on the first substrate 111.

[0109] In some embodiments, Figures 3 to 8 As shown in any one of the figures, the light-emitting substrate 11 also includes: a first source-drain metal layer 119 and a second source-drain metal layer 120, the orthographic projections of which on the first substrate 111 are separated from each other; and a flat layer 121, which is located on the side of the dielectric layer 116 away from the buffer layer 115, and the orthographic projection of the flat layer 121 on the first substrate 111 completely covers the orthographic projection of the first source-drain metal layer 119 on the first substrate 111.

[0110] In some embodiments, Figures 3 to 7 As shown in any one of the figures, the light emitting substrate 11 further includes: a pixel definition layer 122 , a cathode 123 and an anode 124 .

[0111] The present disclosure further provides a display device, which includes: a display panel 101 as provided in any embodiment; and a driving circuit connected to the display panel, for driving the display panel to display.

[0112] Those skilled in the art can understand that the display device provided by the present disclosure has the advantages of the above-mentioned display panel.

[0113] The display device provided by the present disclosure can be: a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a car display device, a smart watch, a fitness wristband, a personal digital assistant, or any other product or component with a display function.

[0114] In the present disclosure, “plurality” means two or more, and “at least one” means one or more, unless otherwise clearly and specifically defined.

[0115] In the present disclosure, the orientation or positional relationship indicated by the terms "upper" and "lower" are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing the present disclosure and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present disclosure.

[0116] As used herein, the terms "comprises," "includes," or any other variation thereof are intended to encompass non-exclusive inclusion, such that a process, method, commodity, or device that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, product, or device. In the absence of further limitations, an element defined by the phrase "includes a ..." does not exclude the presence of additional identical elements in the process, method, commodity, or device that includes the element.

[0117] References herein to "one embodiment," "some embodiments," "exemplary embodiments," "one or more embodiments," "example," "an example," "some examples," etc., are intended to indicate that a particular feature, structure, material, or characteristic associated with the embodiment or example is included in at least one embodiment or example of the present disclosure. Schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0118] In this document, relational terms such as first and second, etc. are used merely to distinguish one entity or operation from another entity or operation, but do not necessarily require or imply any such actual relationship or order between these entities or operations.

[0119] When describing some embodiments, the expressions "coupled" and "connected" may be used. For example, when describing some embodiments, the term "connected" may be used to indicate that two or more components are in direct physical or electrical contact with each other. As another example, when describing some embodiments, the term "coupled" may be used to indicate that two or more components are in direct physical or electrical contact. However, the term "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0120] “At least one of A, B, and C” has the same meaning as “at least one of A, B, or C” and both include the following combinations of A, B, and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B, and C.

[0121] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0122] As used herein, the term "if" is optionally interpreted to mean "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrases "if it is determined that" or "if [a stated condition or event] is detected" are optionally interpreted to mean "upon determining that" or "in response to determining that" or "upon detecting [a stated condition or event]" or "in response to detecting [a stated condition or event]," depending on the context.

[0123] The use of "for" or "configured to" herein is meant to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0124] The use of "based on" or "according to" herein is meant to be open and inclusive. A process, step, calculation or other action based on one or more of the conditions or values ​​may, in practice, be based on other conditions or exceed the values ​​described. A process, step, calculation or other action based on one or more of the conditions or values ​​may, in practice, be based on other conditions or exceed the values ​​described.

[0125] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of variation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0126] As used herein, "parallel", "perpendicular", "equal", and "flush" include the situations described and situations similar to the situations described, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range for approximate parallelism may be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range for approximate perpendicularity may also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range for approximate equality may be, for example, that the difference between the two being equal is less than or equal to 5% of either one. "Flush" includes absolute flushness and approximate flushness, wherein the acceptable deviation range for approximate flushness may be, for example, that the distance between the two being flush is less than or equal to 5% of the size of either one.

[0127] It will be understood that when a layer or an element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present between the layer or element and the other layer or substrate.

[0128] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and regions is exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are conceivable. Therefore, the exemplary embodiments should not be interpreted as being limited to the shapes of the regions shown herein, but include shape deviations due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of the regions of the device, and are not intended to limit the scope of the exemplary embodiments. Unless otherwise specified, the thickness of a film layer refers to the size of the film layer in the direction of its normal.

[0129] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. A display panel, comprising a display area and a frame area surrounding the display area, the display panel comprising: Light-emitting substrate; A retaining wall is arranged on one side of the light-emitting substrate and is located in the frame area; A first inorganic encapsulation layer is arranged on a side of the retaining wall away from the light-emitting substrate; as well as A first stress release layer is arranged on a side of the first inorganic encapsulation layer away from the light-emitting substrate; The orthographic projection of the first stress release layer on the light-emitting substrate covers the orthographic projection of the retaining wall on the light-emitting substrate and is located within the orthographic projection range of the first inorganic encapsulation layer on the light-emitting substrate.

2. The display panel according to claim 1, wherein: The display panel further includes: A second inorganic encapsulation layer is disposed on a side of the first stress release layer away from the light-emitting substrate; and a first organic encapsulation layer, disposed between the first inorganic encapsulation layer and the second inorganic encapsulation layer; The second inorganic encapsulation layer covers the first stress release layer and the first organic encapsulation layer, the first stress release layer and the first organic encapsulation layer are separated from each other, and the first stress release layer is located on a side of the first organic encapsulation layer away from the display area.

3. The display panel according to claim 2, wherein: The surface of the first stress release layer facing away from the light-emitting substrate is uneven, and the thickness of the first stress release layer at different positions is substantially the same.

4. The display panel according to claim 3, wherein: The first stress release layer includes an organic material and an inorganic material, and the carbon content of the first stress release layer is greater than or equal to 20% and less than or equal to 60%.

5. The display panel according to claim 4, wherein: In the normal direction of the light-emitting substrate, the carbon contents of the first stress release layers at different positions are substantially the same; or The first stress release layer includes: a first sub-film layer, a second sub-film layer and a third sub-film layer stacked in the normal direction of the light-emitting substrate, the second sub-film layer is located between the first sub-film layer and the third sub-film layer, and the carbon content of the second sub-film layer is greater than the carbon content of the first sub-film layer and the carbon content of the third sub-film layer.

6. The display panel according to claim 2, wherein: The surface of the first stress release layer facing away from the light-emitting substrate is substantially a plane, and the thickness of the first stress release layer at at least two locations is different.

7. The display panel according to claim 6, wherein: The main material of the first stress release layer is an organic material.

8. The display panel according to claim 2, wherein: The slope angle of the first stress release layer is less than or equal to 40°.

9. The display panel according to claim 2, wherein: The thickness of the first stress release layer is greater than or equal to 0.1 micrometers and less than or equal to 3 micrometers.

10. The display panel according to claim 2, wherein: A minimum distance between an orthographic projection boundary of the first stress release layer on the light-emitting substrate and an orthographic projection boundary of the first organic encapsulation layer on the light-emitting substrate is greater than or equal to 20 micrometers and less than or equal to 70 micrometers; and / or The minimum distance between the orthographic projection boundary of the first stress release layer on the light-emitting substrate and the orthographic projection boundary of the retaining wall on the light-emitting substrate is greater than or equal to the thickness of the first stress release layer and less than or equal to 5 micrometers.

11. The display panel according to claim 1, wherein: The display panel further includes: a third inorganic encapsulation layer, disposed between the retaining wall and the first inorganic encapsulation layer; The orthographic projection of the first stress release layer on the light-emitting substrate at least covers the blocking area, the retaining wall is located in the blocking area, and in the blocking area, the first inorganic encapsulation layer is in direct contact with the third inorganic encapsulation layer.

12. The display panel according to claim 11, wherein: The stress generated by the first stress release layer is in a direction opposite to the stress generated by the first inorganic encapsulation layer and the third inorganic encapsulation layer.

13. The display panel according to claim 11, wherein: The main material of the first stress release layer is an inorganic material.

14. The display panel according to claim 11, wherein: The thickness of the first stress release layer is greater than or equal to 0.03 micrometers and less than or equal to 0.1 micrometers.

15. The display panel according to any one of claims 11 to 14, wherein: The stress generated by the first stress release layer is greater than or equal to 100 MPa and less than or equal to 300 MPa.

16. The display panel according to any one of claims 2 to 10, wherein: The display panel further includes: A second stress release layer is provided on a side of the second inorganic encapsulation layer away from the light-emitting substrate, and an orthographic projection of the second stress release layer on the light-emitting substrate at least covers an orthographic projection of the first stress release layer on the light-emitting substrate; and The stress generated by the second stress release layer is in a direction opposite to the stress generated by the second inorganic encapsulation layer.

17. A display device, comprising: The display panel according to any one of claims 1 to 16; as well as The driving circuit is connected to the display panel and is used to drive the display panel to display.

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