A waterproof busbar duct and its preparation process

Abstract

The present invention relates to the field of bus ducts, and specifically to a waterproof bus duct and a preparation process thereof. The present invention places a bus copper bar in a mold; after mixing an organosilicon-modified epoxy resin, an inorganic filler, and a curing agent, the mixture is cast, cured, and demoulded to obtain a waterproof bus duct; the preparation method of the organosilicon-modified epoxy resin is as follows: (1) isocyanoethyl methacrylate and 1,1,3,3-tetramethyldisiloxane are reacted to prepare an organosilicon-modified diisocyanate; (2) 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide and 3-allyloxy-1,2-propylene glycol are reacted to synthesize a dihydroxyphosphaphenanthrene compound; (3) an organosilicon-modified diisocyanate and a dihydroxyphosphaphenanthrene compound are polymerized to obtain an isocyanate-terminated silicon-containing polymer; and the isocyanate-terminated silicon-containing polymer is mixed with an epoxy resin. The waterproof bus duct prepared by the present invention has high safety and meets the needs of practical applications.

Description

Technical Field

[0001] The invention relates to the technical field of bus ducts, and in particular to a waterproof bus duct and a preparation process thereof. Background Art

[0002] Modern life cannot do without electricity. Industrial production workshops, urban shopping malls, office buildings, etc. all consume a lot of electricity. In the face of such a huge workload, safe and reliable conduction equipment must be selected. The bus duct system is a power distribution device that efficiently transmits current and can meet the increasingly high wiring needs of shopping malls, office buildings and large-scale factories.

[0003] The bus duct directly casts the composite resin on the copper busbar to seal it, thus forming a polymer insulation material on the busbar surface. In actual use, moisture in the environment will affect its insulation performance, and long-term operation will cause insulation damage. When the bus duct passes current, it will cause heat, causing major safety accidents such as fire and failure, causing serious safety hazards to personnel and huge property losses. Therefore, it is very important to waterproof the bus duct. In addition, it is equally important to improve the thermal stability and fire resistance of the bus duct. Summary of the invention

[0004] The object of the present invention is to provide a waterproof busbar duct and a preparation process thereof to solve the problems raised in the above background technology.

[0005] In order to solve the above technical problems, the present invention provides the following technical solutions: a waterproof busbar duct and a preparation process thereof, comprising the following steps:

[0006] Step 1:

[0007] Disperse isocyanoethyl methacrylate in tetrahydrofuran, heat to 50-60°C, use chloroplatinic acid isopropanol solution as catalyst, argon as protective gas, add 1,1,3,3-tetramethyldisiloxane, react at 60-70°C for 5-8h, remove the solvent tetrahydrofuran by reduced pressure distillation, and vacuum dry to obtain organosilicon-modified diisocyanate;

[0008] Step 2:

[0009] 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide is mixed with tetrahydrofuran solution, and in an ice water bath, the internal temperature is controlled at 5-10°C, and 3-allyloxy-1,2-propylene glycol is added with stirring for 0.5-1h. After the addition is complete, the mixture is stirred and reacted for 3-5h. After the reaction is completed, the mixture is transferred to warm water, the reaction temperature is controlled at 40-50°C, and the mixture is rotary evaporated for 2-3h. After the reaction is completed, the mixture is dried at a constant temperature of 110-120°C for 6-8h to obtain a dihydroxyphosphaphenanthrene compound; wherein 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide and 3-allyloxy-1,2-propylene glycol are reacted in a molar ratio of 1:1;

[0010] Step 3:

[0011] The organosilicon-modified diisocyanate and the dihydroxyphosphophananthrene compound are vacuum dried at 110-120° C. for 2-3 hours respectively, and after cooling, the organosilicon-modified diisocyanate and the dihydroxyphosphophananthrene compound are mixed in a molar ratio of 1.5-2 under a nitrogen environment, and dibutyltin dilaurate is used as a catalyst, and the mixture is stirred at 50-60° C. for 15-30 minutes, and the mixture is heated to 70-80° C. and kept for reaction for 1-3 hours to obtain an isocyanate-terminated silicon-containing polymer;

[0012] Step 4:

[0013] The epoxy resin and the isocyanate-terminated silicon-containing polymer are mixed, the temperature is raised to 90-100°C under nitrogen protection, and butyltin dilaurate is used as a catalyst to stir and react for 1-2 hours to obtain an organosilicon-modified epoxy resin;

[0014] Step 5:

[0015] S1: Place the busbar copper row into the mold and fix it;

[0016] S2: Mix 60-75 parts of silicone-modified epoxy resin and 5-8 parts of inorganic filler, stir for 30-60 minutes, add 30-37 parts of curing agent, continue stirring for 15-30 minutes, and inject into the mold in S1;

[0017] S3: The mold after casting is heated and cured. The curing method is to keep the temperature at 100-120°C for 2-3 hours, heat it to 130-140°C for 2-3 hours, continue to heat it to 140-150°C for 1-2 hours, cool it naturally and remove the mold to obtain a waterproof busbar duct;

[0018] Further, in step 1, the concentration of chloroplatinic acid in the chloroplatinic acid isopropanol solution is 0.01-0.05 g / mL.

[0019] Furthermore, in step 1, isocyanoethyl methacrylate and 1,1,3,3-tetramethyldisiloxane are reacted at a molar ratio of 2:1.

[0020] Furthermore, in step 2, 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide and 3-allyloxy-1,2-propanediol are reacted in a molar ratio of 1:1.

[0021] Furthermore, in step 3, the organosilicon-modified diisocyanate and the dihydroxyphosphinophenanthrene compound are mixed in a molar ratio of (1.5-2):1.

[0022] Furthermore, in step 4, the contents of the components in the organosilicon-modified epoxy resin are, by weight percentage, 81-87% epoxy resin and 13-19% isocyanate-terminated silicon-containing polymer.

[0023] Furthermore, in S2, the amounts of the components are, by weight, 60 to 75 parts of silicone-modified epoxy resin, 5 to 8 parts of inorganic filler, and 30 to 37 parts of curing agent.

[0024] Furthermore, in S2, the inorganic filler is any one or more of quartz powder, kaolinite powder, and talc powder.

[0025] Furthermore, in S3, the curing method is to keep the temperature at 100-120°C for 2-3 hours, increase the temperature to 130-140°C for 2-3 hours, and continue to increase the temperature to 140-150°C for 1-2 hours.

[0026] Compared with the prior art, the beneficial effects achieved by the present invention are as follows: the present invention prepares a waterproof bus duct, which is mainly improved for the casting glue in the bus duct. The present invention selects epoxy resin as the main casting glue, and the epoxy resin has good waterproof performance and meets the requirements of the bus duct for waterproof ability. The present invention uses isocyanoethyl methacrylate and 1,1,3,3-tetramethyldisiloxane as raw materials, and obtains organic silicon modified diisocyanate through carbon-carbon double bond and silicon-hydrogen bond addition reaction; selects a new flame retardant intermediate 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, and uses its highly reactive PH bond to react with 3-allyloxy-1,2-propylene glycol to obtain a dihydroxyphosphaphenanthrene compound; uses the dihydroxyphosphaphenanthrene compound and organic silicon modified diisocyanate as raw materials, uses dibutyltin dilaurate as a catalyst, and synthesizes an isocyanate-terminated silicon-containing polymer with flame retardant properties through the reaction of hydroxyl and isocyanate groups.

[0027] When isocyanate-terminated silicon-containing polymer is mixed with epoxy resin, isocyanate can react with the hydroxyl group of the side chain of epoxy resin, and is introduced into the side chain of epoxy resin molecule through chemical reaction, thereby improving the fire retardant performance. Isocyanate-terminated silicon-containing polymer is a long linear polymer, in which the silicone molecular chain is relatively flexible, plays a toughening role, and can increase the impact strength. Although silicone itself is not flame retardant, it can improve the heat resistance of the material, can withstand higher temperatures in a short time, and improve the safety performance of the material. In addition, ordinary epoxy resin contains a large number of hydrophilic groups such as hydroxyl groups and ether bonds after curing, and after being modified by the present invention, silicon elements will migrate to the surface of epoxy resin, the surface hydrophobicity is enhanced, and the water vapor in the air is effectively resisted, which further ensures that the busbar operates in a dry environment and improves the operating stability and safety of the electrical appliance.

[0028] It should be noted that during the experiment, it was found that with the increase in the amount of isocyanate-terminated silicon-containing polymer, the impact resistance of the modified epoxy resin showed a trend of first increasing and then decreasing. This is mainly because when the amount of isocyanate-terminated silicon-containing polymer is low, the compatibility of the two is better. The introduction of isocyanate-terminated silicon-containing polymer is conducive to the cross-linking of the side chains of the epoxy resin molecules, and the density of the resin material after curing is improved. To a certain extent, it makes up for the defects caused by the curing of a single epoxy resin, and improves the overall strength and waterproof effect of the material. With the increase in the amount of isocyanate-terminated silicon-containing polymer, on the one hand, the compatibility of the two decreases, and separation occurs on a macro scale; on the other hand, the increase in the amount of isocyanate-terminated silicon-containing polymer will also lead to more reaction sites, and the degree of cross-linking of the side chains between the epoxy resin molecular chains will increase, which in turn limits the epoxy curing cross-linking reaction between the main chains, resulting in reduced performance of the cured material. Taking into account the flame retardancy, impact resistance and heat resistance of the material, the mass dosage of isocyanate-terminated silicon-containing polymer is controlled to account for 13-19% of the total amount of silicone-modified epoxy resin, and the prepared waterproof bus duct has the best performance. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] Materials and sources used in the present invention: the inorganic filler is talcum powder, which comes from Laizhou Shengkai Talc Co., Ltd., with a particle size of 3000 mesh; the epoxy resin is epoxy resin E51, which comes from Hebei Linyuan Fine Chemical Co., Ltd.; the curing agent is diaminodiphenylmethane, which comes from Zhangjiagang Yarui Chemical Co., Ltd.

[0031] Embodiment 1: A waterproof busbar trunking and a preparation process thereof, comprising the following steps:

[0032] Step 1:

[0033] Disperse isocyanoethyl methacrylate in tetrahydrofuran, heat to 50°C, use chloroplatinic acid isopropanol solution as a catalyst (chloroplatinic acid concentration is 0.02 g / mL), argon as a protective gas, add 1,1,3,3-tetramethyldisiloxane, react at 60°C for 8 hours, remove the solvent tetrahydrofuran by reduced pressure distillation, and vacuum dry to obtain an organosilicon-modified diisocyanate, wherein isocyanoethyl methacrylate reacts with 1,1,3,3-tetramethyldisiloxane in a molar ratio of 2:1;

[0034] Step 2:

[0035] 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide is mixed with tetrahydrofuran solution, and in an ice-water bath, the internal temperature is controlled at 5°C, and 3-allyloxy-1,2-propylene glycol is added with stirring for 0.5 h. After the addition is complete, the mixture is stirred and reacted for 3 h. After the reaction is completed, the mixture is transferred to warm water, the reaction temperature is controlled at 40°C, and the mixture is rotary evaporated for 3 h. After the reaction is completed, the mixture is dried at a constant temperature of 110°C for 8 h to obtain a dihydroxyphosphaphenanthrene compound; wherein 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide and 3-allyloxy-1,2-propylene glycol are reacted in a molar ratio of 1:1;

[0036] Step 3:

[0037] The organosilicon-modified diisocyanate and the dihydroxyphosphophananthrene compound were vacuum dried at 110° C. for 3 h, respectively. After cooling, the organosilicon-modified diisocyanate and the dihydroxyphosphophananthrene compound were mixed in a molar ratio of 1.8:1 under a nitrogen environment, and dibutyltin dilaurate was used as a catalyst. The mixture was stirred at 50° C. for 30 min, and the temperature was raised to 70° C. and the mixture was kept warm for reaction for 3 h to obtain an isocyanate-terminated silicon-containing polymer.

[0038] Step 4:

[0039] 87% epoxy resin and 13% isocyanate-terminated silicon-containing polymer were mixed by weight, heated to 90°C under nitrogen protection, and stirred for 2 hours with butyltin dilaurate as a catalyst to obtain an organosilicon-modified epoxy resin;

[0040] Step 5:

[0041] S1: Place the busbar copper row into the mold and fix it;

[0042] S2: Mix 70g of silicone-modified epoxy resin and 8g of inorganic filler, stir for 30min, add 35g of curing agent, continue stirring for 15min, and inject into the mold in S1;

[0043] S3: The mold after casting is heated and cured. The curing method is to keep the temperature at 100°C for 3 hours, heat it to 130°C for 3 hours, continue to heat it to 140°C for 3 hours, cool it naturally and remove the mold to obtain a waterproof bus duct.

[0044] Embodiment 2: A waterproof busbar trunking and a preparation process thereof, comprising the following steps:

[0045] Step 1:

[0046] Disperse isocyanoethyl methacrylate in tetrahydrofuran, heat to 55°C, use chloroplatinic acid isopropanol solution as a catalyst (chloroplatinic acid concentration is 0.02 g / mL), argon as a protective gas, add 1,1,3,3-tetramethyldisiloxane, react at 65°C for 7 hours, remove the solvent tetrahydrofuran by reduced pressure distillation, and vacuum dry to obtain an organosilicon-modified diisocyanate, wherein isocyanoethyl methacrylate reacts with 1,1,3,3-tetramethyldisiloxane in a molar ratio of 2:1;

[0047] Step 2:

[0048] 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide is mixed with tetrahydrofuran solution, and in an ice-water bath, the internal temperature is controlled at 8°C, and 3-allyloxy-1,2-propylene glycol is added with stirring for 0.75h. After the addition is complete, the mixture is stirred and reacted for 4h. After the reaction is completed, the mixture is transferred to warm water, the reaction temperature is controlled at 45°C, and the mixture is rotary evaporated for 2.5h. After the reaction is completed, the mixture is dried at a constant temperature of 115°C for 7h to obtain a dihydroxyphosphaphenanthrene compound; wherein 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide and 3-allyloxy-1,2-propylene glycol are reacted in a molar ratio of 1:1;

[0049] Step 3:

[0050] The organosilicon-modified diisocyanate and the dihydroxyphosphophanate compound were vacuum dried at 115° C. for 2.5 h, respectively. After cooling, the organosilicon-modified diisocyanate and the dihydroxyphosphophanate compound were mixed in a molar ratio of 1.8:1 under a nitrogen environment, and dibutyltin dilaurate was used as a catalyst. The mixture was stirred at 55° C. for 20 min, and the temperature was raised to 75° C. and the mixture was kept warm for reaction for 2 h to obtain an isocyanate-terminated silicon-containing polymer.

[0051] Step 4:

[0052] By weight percentage, 85% epoxy resin and 15% isocyanate-terminated silicon-containing polymer were mixed, the temperature was raised to 95° C. under nitrogen protection, and butyltin dilaurate was used as a catalyst for stirring and reacting for 1.5 hours to obtain an organosilicon-modified epoxy resin;

[0053] Step 5:

[0054] S1: Place the busbar copper row into the mold and fix it;

[0055] S2: 70g of silicone-modified epoxy resin and 8g of inorganic filler were mixed, and 35g of curing agent was added after stirring for 40min. After stirring for 20min, the mixture was injected into the mold in S1;

[0056] S3: The mold after casting is heated and cured. The curing method is to keep the temperature at 115°C for 2.5 hours, heat it to 135°C and keep it for 2.5 hours, continue to heat it to 145°C for 1.5 hours, cool it naturally and remove the mold to obtain a waterproof bus duct.

[0057] Embodiment 3: A waterproof busbar duct and a preparation process thereof, comprising the following steps:

[0058] Step 1:

[0059] Disperse isocyanoethyl methacrylate in tetrahydrofuran, heat to 60°C, use chloroplatinic acid isopropanol solution as a catalyst (chloroplatinic acid concentration is 0.02 g / mL), argon as a protective gas, add 1,1,3,3-tetramethyldisiloxane, react at 70°C for 5 hours, remove the solvent tetrahydrofuran by reduced pressure distillation, and vacuum dry to obtain an organosilicon-modified diisocyanate, wherein isocyanoethyl methacrylate reacts with 1,1,3,3-tetramethyldisiloxane in a molar ratio of 2:1;

[0060] Step 2:

[0061] 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide is mixed with tetrahydrofuran solution, and in an ice-water bath, the internal temperature is controlled at 10°C, and 3-allyloxy-1,2-propylene glycol is added with stirring for 0.5 h. After the addition is complete, the mixture is stirred and reacted for 3 h. After the reaction is completed, the mixture is transferred to warm water, the reaction temperature is controlled at 50°C, and the mixture is rotary evaporated for 2 h. After the reaction is completed, the mixture is dried at a constant temperature of 120°C for 6 h to obtain a dihydroxyphosphaphenanthrene compound; wherein 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide and 3-allyloxy-1,2-propylene glycol are reacted in a molar ratio of 1:1;

[0062] Step 3:

[0063] The organosilicon-modified diisocyanate and the dihydroxyphosphophananthrene compound were vacuum dried at 120° C. for 2 h, respectively. After cooling, the organosilicon-modified diisocyanate and the dihydroxyphosphophananthrene compound were mixed in a molar ratio of 1.8:1 under a nitrogen environment, and dibutyltin dilaurate was used as a catalyst. The mixture was stirred at 60° C. for 15 min, and the temperature was raised to 80° C. and the mixture was kept warm for reaction for 1 h to obtain an isocyanate-terminated silicon-containing polymer.

[0064] Step 4:

[0065] 81% epoxy resin and 19% isocyanate-terminated silicon-containing polymer were mixed by weight, heated to 100°C under nitrogen protection, and stirred for 1 hour with butyltin dilaurate as a catalyst to obtain organosilicon-modified epoxy resin;

[0066] Step 5:

[0067] S1: Place the busbar copper row into the mold and fix it;

[0068] S2: 70g of silicone-modified epoxy resin and 8g of inorganic filler were mixed, and 35g of curing agent was added after stirring for 60min. After stirring for 30min, the mixture was injected into the mold in S1;

[0069] S3: The mold after casting is heated and cured. The curing method is to keep the temperature at 120°C for 2 hours, heat it to 140°C and keep it for 2 hours, continue to heat it to 150°C for 1 hour, cool it naturally and remove the mold to obtain a waterproof bus duct.

[0070] Comparative Example 1: The epoxy resin was not modified, and the other parameters were the same as those in Example 1.

[0071] S1: Place the busbar copper row into the mold and fix it;

[0072] S2: Mix 70g of epoxy resin and 8g of inorganic filler, stir for 30min, add 35g of curing agent, continue stirring for 15min, and inject into the mold in S1;

[0073] S3: The mold after casting is heated and cured. The curing method is to keep the temperature at 100°C for 3 hours, heat it to 130°C for 3 hours, continue to heat it to 140°C for 3 hours, cool it naturally and remove the mold to obtain a waterproof bus duct.

[0074] Comparative Example 2: Only the organosilicon-modified diisocyanate and the epoxy resin were mixed to prepare the organosilicon-modified epoxy resin, and the other parameters were the same as those in Example 2.

[0075] Step 1:

[0076] Disperse isocyanoethyl methacrylate in tetrahydrofuran, heat to 55°C, use chloroplatinic acid isopropanol solution as a catalyst (chloroplatinic acid concentration is 0.02 g / mL), argon as a protective gas, add 1,1,3,3-tetramethyldisiloxane, react at 65°C for 7 hours, remove the solvent tetrahydrofuran by reduced pressure distillation, and vacuum dry to obtain an organosilicon-modified diisocyanate, wherein isocyanoethyl methacrylate reacts with 1,1,3,3-tetramethyldisiloxane in a molar ratio of 2:1;

[0077] Step 2:

[0078] 85% epoxy resin and 15% organosilicon-modified diisocyanate were mixed by weight, heated to 95°C under nitrogen protection, and stirred for 1.5 hours with butyltin dilaurate as a catalyst to obtain organosilicon-modified epoxy resin;

[0079] Step 3:

[0080] S1: Place the busbar copper row into the mold and fix it;

[0081] S2: 70g of silicone-modified epoxy resin and 8g of inorganic filler were mixed, and 35g of curing agent was added after stirring for 40min. After stirring for 20min, the mixture was injected into the mold in S1;

[0082] S3: The mold after casting is heated and cured. The curing method is to keep the temperature at 115°C for 2.5 hours, heat it to 135°C and keep it for 2.5 hours, continue to heat it to 145°C for 1.5 hours, cool it naturally and remove the mold to obtain a waterproof bus duct.

[0083] Comparative Example 3: The amount of the isocyanate-terminated silicon-containing polymer in the organosilicon-modified epoxy resin was increased, and the other parameters were the same as those in Example 3.

[0084] Step 1:

[0085] Disperse isocyanoethyl methacrylate in tetrahydrofuran, heat to 60°C, use chloroplatinic acid isopropanol solution as a catalyst (chloroplatinic acid concentration is 0.02 g / mL), argon as a protective gas, add 1,1,3,3-tetramethyldisiloxane, react at 70°C for 5 hours, remove the solvent tetrahydrofuran by reduced pressure distillation, and vacuum dry to obtain an organosilicon-modified diisocyanate, wherein isocyanoethyl methacrylate reacts with 1,1,3,3-tetramethyldisiloxane in a molar ratio of 2:1;

[0086] Step 2:

[0087] 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide is mixed with tetrahydrofuran solution, and in an ice-water bath, the internal temperature is controlled at 10°C, and 3-allyloxy-1,2-propylene glycol is added with stirring for 0.5 h. After the addition is complete, the mixture is stirred and reacted for 3 h. After the reaction is completed, the mixture is transferred to warm water, the reaction temperature is controlled at 50°C, and the mixture is rotary evaporated for 2 h. After the reaction is completed, the mixture is dried at a constant temperature of 120°C for 6 h to obtain a dihydroxyphosphaphenanthrene compound; wherein 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide and 3-allyloxy-1,2-propylene glycol are reacted in a molar ratio of 1:1;

[0088] Step 3:

[0089] The organosilicon-modified diisocyanate and the dihydroxyphosphophananthrene compound were vacuum dried at 120° C. for 2 h, respectively. After cooling, the organosilicon-modified diisocyanate and the dihydroxyphosphophananthrene compound were mixed in a molar ratio of 1.8:1 under a nitrogen environment, and dibutyltin dilaurate was used as a catalyst. The mixture was stirred at 60° C. for 15 min, and the temperature was raised to 80° C. and the mixture was kept warm for reaction for 1 h to obtain an isocyanate-terminated silicon-containing polymer.

[0090] Step 4:

[0091] 70% epoxy resin and 30% isocyanate-terminated silicon-containing polymer were mixed by weight, heated to 100°C under nitrogen protection, and stirred for 1 hour with butyltin dilaurate as a catalyst to obtain organosilicon-modified epoxy resin;

[0092] Step 5:

[0093] S1: Place the busbar copper row into the mold and fix it;

[0094] S2: 70g of silicone-modified epoxy resin and 8g of inorganic filler were mixed, and 35g of curing agent was added after stirring for 60min. After stirring for 30min, the mixture was injected into the mold in S1;

[0095] S3: The mold after casting is heated and cured. The curing method is to keep the temperature at 120°C for 2 hours, heat it to 140°C and keep it for 2 hours, continue to heat it to 150°C for 1 hour, cool it naturally and remove the mold to obtain a waterproof bus duct.

[0096] Experiment: The performance of the waterproof bus duct prepared in Examples 1 to 3 and Comparative Examples 1 to 3 was tested, wherein the water impermeability test was based on the standard GB / T23445 (0.5 MPa, 30 min); the flame retardant performance test was based on the standard GB / T 2406, and the limiting oxygen index was used for expression; the water contact angle was tested using a contact angle tester; the heat resistance was tested using a thermogravimetric analyzer, and the test method was as follows: in a nitrogen atmosphere, the thermal decomposition of the test sample was tested at 30 to 800 ° C, the heating rate was set to 10 ° C / min, and the temperature at which the thermal weight loss was 5% was recorded, which was recorded as Td 5% ; The impact resistance of the samples was tested using an impact testing machine, and the experimental results are shown in the following table.

[0097]

[0098] Conclusion: The present invention adopts epoxy resin as the main casting material, and obtains a waterproof bus duct with good performance through modification. The data of Example 1 and Comparative Example 1 show that the epoxy resin itself has good waterproof performance and can pass the watertight performance test specified by the standard. The data in Example 1 show that after modification, the flame retardant performance, hydrophobic performance, heat resistance and impact strength of the epoxy resin are all improved. The data of Example 2 and Comparative Example 2 show that compared with the isocyanate-terminated silicon-containing polymer added in Example 2, only silicone-modified diisocyanate is added in Comparative Example 2. In contrast, although the silicone-modified diisocyanate can improve the heat resistance of the material, it does not have flame retardant properties. Therefore, the modified bus duct is still a flammable material, and because the molecular chain segment of the silicone-modified diisocyanate is shorter, the modification effect in terms of impact resistance is not good. The data of Example 3 and Comparative Example 3 show that the excessive amount of isocyanate-terminated silicon-containing polymer will lead to poor compatibility with epoxy resin, thereby affecting the impact strength of the material.

[0099] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A process for preparing a waterproof busbar trunking, characterized in that: The following steps are involved: S1: Place the busbar copper row into the mold and fix it; S2: Mix the silicone-modified epoxy resin and the inorganic filler, stir for 30 to 60 minutes, add the curing agent, continue stirring for 15 to 30 minutes, and then inject into the mold in S1; The preparation method of organosilicon-modified epoxy resin comprises the following steps: Step 1: Disperse isocyanoethyl methacrylate in tetrahydrofuran, heat to 50-60°C, use chloroplatinic acid isopropanol solution as catalyst, argon as protective gas, add 1,1,3,3-tetramethyldisiloxane, react at 60-70°C for 5-8h, remove the solvent tetrahydrofuran by reduced pressure distillation, and vacuum dry to obtain organosilicon-modified diisocyanate; Step 2: Mix 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide with tetrahydrofuran solution, add 3-allyloxy-1,2-propanediol in an ice-water bath while controlling the internal temperature at 5-10°C, and stir for 0.5-1h. After the addition is complete, continue stirring to react for 3-5h. After the reaction is completed, transfer to warm water and control the reaction temperature at 40-50°C. Rotary evaporation is performed for 2-3h. After the reaction is completed, dry at a constant temperature of 110-120°C for 6-8h to obtain a bishydroxyphosphaphenanthrene compound. Step 3: The organosilicon-modified diisocyanate and the dihydroxyphosphophananthrene compound are vacuum dried at 110-120° C. for 2-3 hours respectively, and after cooling, the organosilicon-modified diisocyanate and the dihydroxyphosphophananthrene compound are mixed in a nitrogen environment, and dibutyltin dilaurate is used as a catalyst, and the mixture is stirred at 50-60° C. for 15-30 minutes, and the mixture is heated to 70-80° C. and kept for reaction for 1-3 hours to obtain an isocyanate-terminated silicon-containing polymer; Step 4: The epoxy resin and the isocyanate-terminated silicon-containing polymer are mixed, the temperature is raised to 90-100°C under nitrogen protection, and butyltin dilaurate is used as a catalyst to stir and react for 1-2 hours to obtain an organosilicon-modified epoxy resin; S3: The mold after casting is heated and cured, and then naturally cooled and removed from the mold to obtain a waterproof busbar duct.

2. The process for preparing a waterproof busbar duct according to claim 1, characterized in that: In S2, the amount of each component is calculated by weight, 60-75 parts of silicone-modified epoxy resin, 5-8 parts of inorganic filler, and 30-37 parts of curing agent; wherein the inorganic filler is any one or more of quartz powder, kaolinite powder, and talc powder.

3. The process for preparing a waterproof busbar trunking according to claim 1, characterized in that: In step 1, in the chloroplatinic acid isopropanol solution, the concentration of chloroplatinic acid is 0.01-0.05 g / mL.

4. The process for preparing a waterproof busbar duct according to claim 1, characterized in that: In step 1, isocyanoethyl methacrylate and 1,1,3,3-tetramethyldisiloxane are reacted at a molar ratio of 2:

1.

5. The process for preparing a waterproof busbar trunking according to claim 1, characterized in that: In step 2, 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide and 3-allyloxy-1,2-propanediol are reacted at a molar ratio of 1:

1.

6. The process for preparing a waterproof busbar trunking according to claim 1, characterized in that: In step 3, the organosilicon-modified diisocyanate and the dihydroxyphosphinophenanthrene compound are mixed in a molar ratio of (1.5-2):

1.

7. The process for preparing a waterproof busbar duct according to claim 1, characterized in that: In step 4, the contents of the components in the organosilicon-modified epoxy resin are, by weight percentage, 81-87% epoxy resin and 13-19% isocyanate-terminated silicon-containing polymer.

8. The process for preparing a waterproof busbar duct according to claim 1, characterized in that: In S3, the curing method is to keep the temperature at 100-120°C for 2-3 hours, increase the temperature to 130-140°C for 2-3 hours, and continue to increase the temperature to 140-150°C for 1-2 hours.

9. The waterproof busbar duct prepared by the preparation process according to any one of claims 1 to 8.

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