Light-emitting panel, preparation method thereof and display device

Abstract

Provided is a light-emitting panel, comprising: a substrate; the light-emitting device is located on the substrate; the organic packaging layer is positioned on one side, far away from the substrate, of the light-emitting device; the packaging frame glue is arranged around the organic packaging layer; the packaging cover plate is positioned on one side, far away from the substrate, of the packaging adhesive layer and the organic packaging layer; wherein the packaging frame glue comprises a first frame glue, a second frame glue and a water absorption part, the first frame glue is arranged around the organic packaging layer, the water absorption part is arranged around the first frame glue layer, and the second frame glue is arranged around the water absorption part.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a light-emitting panel and a preparation method thereof, and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) as a new type of light-emitting device has shown great application potential in the field of display and lighting, and has therefore received strong attention from academia and industry. In the display field, OLED has the advantages of self-luminescence, fast response, wide viewing angle, high brightness, bright colors, and light weight compared to Liquid Crystal Display (LCD), and is considered to be the next generation of display technology. In the lighting field, in order to respond to the market demand for OLED light sources, lighting devices using passive matrix organic light-emitting diodes (PMOLED) as light sources are gradually being accepted by the market, but they have higher requirements for packaging reliability, especially lighting devices used in the automotive field, which need to maintain good performance in a continuous 2500 hours of high temperature and high humidity test. How to improve the packaging reliability of OLED devices is one of the topics that display product developers are concerned about.

[0003] The above information disclosed in this section is only for understanding the background of the inventive concept of the present disclosure and therefore the above information may contain information that does not constitute the prior art. Summary of the invention

[0004] In one aspect, there is provided a light emitting panel comprising:

[0005] substrate substrate;

[0006] A light emitting device is located on the substrate;

[0007] An organic encapsulation layer, located on a side of the light emitting device away from the substrate;

[0008] A packaging frame glue is arranged around the organic packaging layer;

[0009] A packaging cover plate, located on a side of the packaging glue layer and the organic packaging layer away from the base substrate;

[0010] The encapsulation frame glue comprises a first frame glue, a second frame glue and a water absorption part, the first frame glue is arranged around the organic encapsulation layer, the water absorption part is arranged around the first frame glue layer, and the second frame glue is arranged around the water absorption part.

[0011] According to some exemplary embodiments, the width of the first sealant is less than or equal to the width of the second sealant.

[0012] According to some exemplary embodiments, the light emitting panel further includes an inorganic encapsulation layer, the inorganic encapsulation layer is located between the light emitting device and the organic encapsulation layer, and an orthographic projection of the inorganic encapsulation layer on the base substrate covers an orthographic projection of the light emitting device on the base substrate.

[0013] According to some exemplary embodiments, the orthographic projection of the first sealant on the base substrate surrounds the orthographic projection of the inorganic encapsulation layer on the base substrate.

[0014] According to some exemplary embodiments, the orthographic projection of the first sealant on the base substrate is located within the orthographic projection of the inorganic encapsulation layer on the base substrate.

[0015] According to some exemplary embodiments, the orthographic projection of the second sealant on the base substrate surrounds the orthographic projection of the inorganic encapsulation layer on the base substrate.

[0016] According to some exemplary embodiments, an orthographic projection of the water absorbing portion on the base substrate surrounds an orthographic projection of the inorganic encapsulation layer on the base substrate.

[0017] According to some exemplary embodiments, an orthographic projection of the water absorbing portion on the base substrate is located within an orthographic projection of the inorganic encapsulation layer on the base substrate.

[0018] According to some exemplary embodiments, an orthographic projection of the water absorbing portion on the base substrate partially overlaps an orthographic projection of the inorganic encapsulation layer on the base substrate.

[0019] According to some exemplary embodiments, an orthographic projection of the second sealant on the base substrate partially overlaps with an orthographic projection of the inorganic encapsulation layer on the base substrate.

[0020] According to some exemplary embodiments, an orthographic projection of the first sealant on the base substrate partially overlaps with an orthographic projection of the inorganic encapsulation layer on the base substrate.

[0021] According to some exemplary embodiments, an orthographic projection of the first sealant on the base substrate is spaced apart from an orthographic projection of the light emitting device on the base substrate.

[0022] According to some exemplary embodiments, the water vapor permeability of the second sealant is less than or equal to the water vapor permeability of the first sealant.

[0023] According to some exemplary embodiments, a distance between the first frame glue and the second frame glue is less than or equal to a width of the second frame glue.

[0024] In yet another aspect, a display device is provided, comprising the light emitting panel as described in any one of the above items.

[0025] In another aspect, a method for preparing a light-emitting panel is provided, comprising the following steps:

[0026] forming a light emitting device on a base substrate;

[0027] An organic encapsulation layer and an encapsulation frame glue are formed on a side of the light-emitting device away from the base substrate, the encapsulation frame glue surrounds the organic encapsulation layer, the encapsulation frame glue includes a first frame glue, a second frame glue and a water absorption part, the first frame glue surrounds the organic encapsulation layer, the water absorption part surrounds the first frame glue layer, and the second frame glue surrounds the water absorption part, forming the encapsulation frame glue includes forming a first frame glue wet film layer, a water absorption part, and a second frame glue wet film layer, the viscosity of the first frame glue wet film layer is greater than the viscosity of the second frame glue wet film layer, and then the first frame glue wet film layer and the second frame glue wet film layer are cured to obtain the first frame glue and the second frame glue; and

[0028] A packaging cover plate is formed on a side of the organic packaging layer and the packaging frame adhesive away from the base substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Other objects and advantages of the present disclosure will be apparent from the following description of the present disclosure with reference to the accompanying drawings, and will help to have a comprehensive understanding of the present disclosure.

[0030] Figure 1 A plan view of a light emitting panel according to some embodiments of the present disclosure is schematically shown.

[0031] Figure 2 Schematically shows the Figure 1 Cross-sectional view taken along the midline AA'.

[0032] Figure 3 A plan view of a light emitting panel according to some embodiments of the present disclosure is schematically shown.

[0033] Figure 4 Schematically shows the Figure 3 A cross-sectional view taken along the midline BB'.

[0034] Figure 5 Schematically shows the Figure 3 Another cross-sectional view taken along the center line BB'.

[0035] Figure 6 Schematically shows a surface topography image of a light-emitting panel taken by a camera according to some embodiments of the present disclosure.

[0036] Figure 7A plan view of a light emitting panel according to some embodiments of the present disclosure is schematically shown.

[0037] Figure 8 Schematically shows the Figure 7 A cross-sectional view taken along the center line CC'.

[0038] Fig. 9 A cross-sectional view of a light emitting panel according to some embodiments of the present disclosure is schematically shown.

[0039] Fig.10 A cross-sectional view of a light emitting panel according to some embodiments of the present disclosure is schematically shown.

[0040] Fig.11 A cross-sectional view of a light emitting panel according to some embodiments of the present disclosure is schematically shown.

[0041] Fig.12 A cross-sectional view of a light emitting panel according to some embodiments of the present disclosure is schematically shown.

[0042] Fig.13 A cross-sectional view of a light emitting panel according to some embodiments of the present disclosure is schematically shown.

[0043] Fig.14 A cross-sectional view of a light emitting panel according to some embodiments of the present disclosure is schematically shown.

[0044] Fig.15 A flow chart schematically illustrates a method for preparing a light-emitting panel according to some embodiments of the present disclosure.

[0045] Figures 16A-16D The diagram schematically shows a preparation process diagram of a method for preparing a light-emitting panel according to some embodiments of the present disclosure.

[0046] It should be noted that, for the sake of clarity, in the drawings used to describe the embodiments of the present disclosure, the sizes of layers, structures or regions may be enlarged or reduced, that is, these drawings are not drawn according to the actual scale. DETAILED DESCRIPTION

[0047] In the following description, for the purpose of explanation, many specific details are set forth to provide a comprehensive understanding of various exemplary embodiments. However, it is apparent that various exemplary embodiments may be implemented without these specific details or with one or more equivalent arrangements. In other cases, well-known structures and devices are shown in block diagram form to avoid making various exemplary embodiments unnecessarily obscure. In addition, various exemplary embodiments may be different, but not necessarily exclusive. For example, the specific shape, configuration, and characteristics of an exemplary embodiment may be used or implemented in another exemplary embodiment without departing from the inventive concept.

[0048] In the accompanying drawings, the size and relative size of the elements may be exaggerated for the purpose of clarity and / or description. Thus, the size and relative size of the individual elements are not necessarily limited to the size and relative size shown in the drawings. When the exemplary embodiments may be implemented differently, the specific process sequence may be performed differently from the described sequence. For example, two processes described in succession may be performed substantially simultaneously or in an order opposite to the described sequence. In addition, the same reference numerals represent the same elements.

[0049] When an element is described as "on" another element, "connected to" another element or "coupled to" another element, the element may be directly on another element, directly connected to another element or directly coupled to another element, or there may be an intermediate element. However, when an element is described as "directly on" another element, "directly connected to" another element or "directly coupled to" another element, there is no intermediate element. Other terms and / or expressions used to describe the relationship between elements should be interpreted in a similar manner, for example, "between..." versus "directly between...", "adjacent" versus "directly adjacent" or "on..." versus "directly on...", etc. In addition, the term "connection" may refer to physical connection, electrical connection, communication connection and / or fluid connection. In addition, the X-axis, Y-axis and Z-axis are not limited to the three axes of the rectangular coordinate system, and can be interpreted in a broader sense. For example, the X-axis, Y-axis and Z-axis may be perpendicular to each other, or may represent different directions that are not perpendicular to each other. For the purpose of this disclosure, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" may be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z such as XYZ, XY, YZ, and XZ. As used herein, the term "and / or" includes any and all combinations of one or more of the listed associated items.

[0050] It should be understood that, although the terms first, second, etc. may be used herein to describe different elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, without departing from the scope of the exemplary embodiment, a first element may be named a second element, and similarly, a second element may be named a first element.

[0051] Figure 1 A plan view of a light emitting panel according to some embodiments of the present disclosure is schematically shown. Figure 2 Schematically shows the Figure 1 Cross-sectional view taken along the midline AA'.

[0052] Combined with reference Figure 1 and Figure 2The light-emitting panel includes a base substrate 100, a light-emitting device 200 located on the base substrate 100, an inorganic encapsulation layer 300 located on a side of the light-emitting device 200 away from the base substrate 100, an organic encapsulation layer 400 located on a side of the inorganic encapsulation layer 300 away from the base substrate 100, an encapsulation frame glue 500 arranged around the organic encapsulation layer 400, and an encapsulation cover plate 600 located on a side of the encapsulation frame glue 500 and the organic encapsulation layer 400 away from the base substrate 100.

[0053] In the light-emitting panel, the orthographic projection of the inorganic encapsulation layer 300 on the base substrate 100 completely covers the orthographic projection of the light-emitting device 200 on the base substrate 100, the orthographic projection of the organic encapsulation layer 400 on the base substrate 100 completely covers the orthographic projection of the inorganic encapsulation layer 300 on the base substrate 100, and the orthographic projection of the encapsulation frame glue 500 on the base substrate 100 surrounds the orthographic projection of the organic encapsulation layer 400 on the base substrate 100, that is, the inorganic encapsulation layer 300 completely covers the light-emitting device 200. The organic encapsulation layer 400 completely covers the inorganic encapsulation layer 300, and the encapsulation frame glue 500 is arranged in a continuous ring shape around the organic encapsulation layer 400. One side of the encapsulation frame glue 500 is in contact with the base substrate 100, and the other side is in contact with the encapsulation cover plate 600. The light-emitting device 200 covered with the inorganic encapsulation layer 300 and the organic encapsulation layer 400 is located in a space enclosed by the encapsulation frame glue 500, the base substrate 100 and the encapsulation cover plate 600, thereby realizing the encapsulation of the light-emitting device 200.

[0054] After testing, the light-emitting panel has a problem of reduced light-emitting performance when undergoing a reliability test in a high temperature and high humidity environment. The inventor has found that the reason for this problem is that the packaging structure of the light-emitting panel has a poor barrier effect on water vapor, and water vapor still invades from the packaging frame glue 500 and through the gap between the packaging frame glue 500 and the base substrate 100 or the packaging cover plate 600, and then invades the inside of the light-emitting device 200, thereby affecting the light-emitting performance of the light-emitting device 200. In order to solve this problem, the inventor has made further improvements to the packaging structure of the light-emitting panel, as described below.

[0055] Figure 3 A plan view of a light emitting panel according to some embodiments of the present disclosure is schematically shown. Figure 4 Schematically shows the Figure 3 A cross-sectional view taken along the midline BB'.

[0056] Combined with reference Figure 3 and Figure 4The light-emitting panel includes a base substrate 100, a light-emitting device 200 located on the base substrate 100, an inorganic encapsulation layer 300 located on a side of the light-emitting device 200 away from the base substrate 100, an organic encapsulation layer 400 located on a side of the inorganic encapsulation layer 300 away from the base substrate 100, an encapsulation frame 500 disposed around the organic encapsulation layer 400, and an encapsulation cover plate 600 located on a side of the encapsulation frame 500 and the organic encapsulation layer 400 away from the base substrate 100. The encapsulation frame 500 includes an encapsulation frame body 540 and a water absorption portion 520, the water absorption portion 520 is disposed around the organic encapsulation layer 400, and the encapsulation frame body 540 is disposed around the water absorption portion 520.

[0057] In the light-emitting panel, the orthographic projection of the inorganic encapsulation layer 300 on the base substrate 100 completely covers the orthographic projection of the light-emitting device 200 on the base substrate 100, the orthographic projection of the organic encapsulation layer 400 on the base substrate 100 completely covers the orthographic projection of the inorganic encapsulation layer 300 on the base substrate 100, and the orthographic projection of the encapsulation frame glue 500 on the base substrate 100 surrounds the orthographic projection of the organic encapsulation layer 400 on the base substrate 100, that is, the inorganic encapsulation layer 300 completely covers the light-emitting device 200. The organic encapsulation layer 400 completely covers the inorganic encapsulation layer 300, and the encapsulation frame glue 500 is arranged in a continuous ring shape around the organic encapsulation layer 400. One side of the encapsulation frame glue 500 is in contact with the base substrate 100, and the other side is in contact with the encapsulation cover plate 600. The light-emitting device 200 covered with the inorganic encapsulation layer 300 and the organic encapsulation layer 400 is located in a space enclosed by the encapsulation frame glue 500, the base substrate 100 and the encapsulation cover plate 600, thereby realizing the encapsulation of the light-emitting device 200.

[0058] In order to improve the packaging reliability of the packaging structure, the packaging frame glue 500 is further configured to include a packaging frame glue main body 540 and a water absorption part 520, that is, an annular water absorption part 520 is added between the packaging frame glue main body 540 and the organic packaging layer 400, and the water absorption part 520 continuously surrounds the organic packaging layer 400. The water absorption part 520 can effectively absorb water vapor that invades from the packaging frame glue 500 or through the gap between the packaging frame glue 500 and the base substrate 100 or the packaging cover plate 600, thereby preventing water vapor from further invading the light-emitting device 200.

[0059] According to some exemplary embodiments, the water absorption part 520 may include a desiccant and a water absorption part body, and the desiccant is uniformly mixed in the water absorption part body.

[0060] For example, the material of the desiccant includes at least one of an oxide desiccant and a chloride desiccant. For another example, the material of the oxide desiccant includes at least one of calcium oxide and aluminum oxide, and the material of the chloride desiccant includes at least one of zinc chloride, calcium chloride, tin chloride and antimony chloride.

[0061] For example, the material of the water absorbing part body includes a water absorbing resin material. For another example, the water absorbing resin material includes at least one of polyacrylates, polyvinyl alcohols, polyoxyalkylenes, polyurethane, general acrylates and casein.

[0062] Figure 5 Schematically shows the Figure 3 Another cross-sectional view taken along the center line BB'. Figure 6 Schematically shows a surface topography image of a light-emitting panel taken by a camera according to some embodiments of the present disclosure.

[0063] The inventor has found through research that in order to ensure the water absorption effect of the water absorption part 520, the water absorption part 520 is in a liquid state with a certain viscosity, that is, it has a certain fluidity, so that in the process of preparing the light-emitting panel, there is an interaction between the organic encapsulation layer 400 and the water absorption part 520, thereby affecting the shape of the water absorption part 520. For example, when too much glue is applied during the formation of the organic encapsulation layer 400, the organic encapsulation layer 400 will overflow and push the water absorption part 520 to flow to the side away from the organic encapsulation layer 400. For another example, when too little glue is applied during the formation of the organic encapsulation layer 400, the water absorption part 520 will flow to the side close to the organic encapsulation layer 400. Figure 6 , the water absorbing part 520 after flowing presents an irregular ring structure, with a wider width in one part and a narrower width in another part. Figure 5 Regardless of whether the water absorption part 520 flows toward or away from the organic encapsulation layer 400, a gap will appear between at least a portion of the water absorption part 520 and the base substrate 100 or the encapsulation cover plate 600. The water absorption part 520 cannot form a closed space with the base substrate 100 and the encapsulation cover plate 600, and water vapor can still penetrate into the light emitting device 200 through the gap between the water absorption part 520 and the base substrate 100 or the encapsulation cover plate 600, thereby causing encapsulation failure. In order to solve this problem, the inventors have made further improvements to the encapsulation structure of the light emitting panel, as described below.

[0064] Figure 7 A plan view of a light emitting panel according to some embodiments of the present disclosure is schematically shown. Figure 8 Schematically shows the Figure 7 A cross-sectional view taken along the center line CC'.

[0065] Combined with reference Figure 7 and Figure 8The light-emitting panel includes a base substrate 100, a light-emitting device 200 located on the base substrate 100, an inorganic encapsulation layer 300 located on a side of the light-emitting device 200 away from the base substrate 100, an organic encapsulation layer 400 located on a side of the inorganic encapsulation layer 300 away from the base substrate 100, an encapsulation frame 500 disposed around the organic encapsulation layer 400, and an encapsulation cover plate 600 located on a side of the encapsulation frame 500 and the organic encapsulation layer 400 away from the base substrate 100. The encapsulation frame 500 includes a first frame 510, a second frame 530, and a water absorption portion 520, wherein the first frame 510 is disposed around the organic encapsulation layer 400, the water absorption portion 520 is disposed around the first frame 510, and the second frame 530 is disposed around the water absorption portion 520.

[0066] In the light-emitting panel, the orthographic projection of the inorganic encapsulation layer 300 on the base substrate 100 completely covers the orthographic projection of the light-emitting device 200 on the base substrate 100, the orthographic projection of the organic encapsulation layer 400 on the base substrate 100 completely covers the orthographic projection of the inorganic encapsulation layer 300 on the base substrate 100, and the orthographic projection of the encapsulation frame glue 500 on the base substrate 100 surrounds the orthographic projection of the organic encapsulation layer 400 on the base substrate 100, that is, the inorganic encapsulation layer 300 completely covers the light-emitting device 200. The organic encapsulation layer 400 completely covers the inorganic encapsulation layer 300, and the encapsulation frame glue 500 is arranged in a continuous ring shape around the organic encapsulation layer 400. One side of the encapsulation frame glue 500 is in contact with the base substrate 100, and the other side is in contact with the encapsulation cover plate 600. The light-emitting device 200 covered with the inorganic encapsulation layer 300 and the organic encapsulation layer 400 is located in a space enclosed by the encapsulation frame glue 500, the base substrate 100 and the encapsulation cover plate 600, thereby realizing the encapsulation of the light-emitting device 200.

[0067] In order to improve the packaging reliability of the packaging structure in the light-emitting panel, the packaging frame glue 500 is further set to include a first frame glue 510, a second frame glue 530 and a water absorption part 520, that is, the first packaging frame glue 500 and the second packaging frame glue 500 are set around the organic packaging layer 400, and the water absorption part 520 is set between the first packaging frame glue 500 and the second packaging frame glue 500. The first packaging frame glue 500 can be used as a blocking structure between the organic packaging layer 400 and the water absorption part 520. In the preparation process of the light-emitting panel, the problem of the flow of the water absorption part 520 caused by the interaction between the organic packaging layer 400 and the water absorption part 520 can be effectively avoided. At the same time, due to the existence of the first packaging frame glue 500, the process window of the organic packaging layer 400 can be increased, that is, the difficulty of the preparation process of the organic packaging layer 400 is reduced, and the preparation process yield of the organic packaging layer 400 is improved. In addition, the first packaging frame glue 500 and the second packaging frame glue 500 are respectively located on both sides of the water absorption part 520, which can further limit the flow of the water absorption part 520.

[0068] According to some exemplary embodiments, in combination with reference Figure 7 and Figure 8 , the orthographic projection of the first seal 510 on the base substrate 100 is a continuous ring, the orthographic projection of the water absorbing portion 520 on the base substrate 100 is a continuous ring, and the orthographic projection of the second seal 530 on the base substrate 100 is a continuous ring, that is, the first seal 510 is continuously arranged around the organic encapsulation layer 400, the water absorbing portion 520 is continuously arranged around the first seal 510 layer, and the second seal 530 is continuously arranged around the water absorbing portion 520. At the same time, since the first seal 510 and the second seal 530 effectively restrict the flow of the water absorbing portion 520, the two sides of the water absorbing portion 520 are respectively in contact with the base substrate 100 and the encapsulation cover plate 600, and the water absorbing portion 520 can effectively absorb the invading water vapor to prevent the water vapor from further invading the light-emitting device 200.

[0069] It should be noted that in Figure 7 and Figure 8 In the illustrated structure, the organic encapsulation layer 400 is in contact with the first frame glue 510, the first frame glue 510 is in contact with the water absorption part 520, and the water absorption part 520 is in contact with the second frame glue 530. However, in actual products, due to the limitation of the manufacturing accuracy of each structure, there may be a certain gap between the organic encapsulation layer 400 and the first frame glue 510, there may be a certain gap between the first frame glue 510 and the water absorption part 520, and there may be a certain gap between the water absorption part 520 and the second frame glue 530, for example, the gap is less than or equal to 0.2 mm.

[0070] According to some exemplary embodiments, the width of the first frame glue 510 is W1, the width of the second frame glue 530 is W2, and W1 is less than or equal to W2. Since the first frame glue 510 mainly functions to prevent the water absorption part 520 from contacting the organic encapsulation layer 400, and the second frame glue 530 mainly functions to prevent water vapor in the environment from invading the light-emitting panel, the width of the second frame glue 530 can be set to be slightly wider, and the width of the first frame glue 510 can be set to be slightly narrower, so that the frame of the light-emitting panel can be narrowed on the basis of ensuring the reliability of the encapsulation.

[0071] It should be noted that the width of the first frame glue 510 should be understood as the width of the orthographic projection of the first frame glue 510 on the base substrate 100 along the direction perpendicular to the extension direction of the first frame glue 510. Similarly, the width of the second frame glue 530 should be understood as the width of the orthographic projection of the second frame glue 530 on the base substrate 100 along the direction perpendicular to the extension direction of the second frame glue 530.

[0072] In addition, due to the influence of factors such as the accuracy of the manufacturing process, there are certain differences in the width of the first frame glue 510 at different positions, and there are certain differences in the width of the second frame glue 530 at different positions. The width W1 of the first frame glue 510 is less than or equal to the width W2 of the second frame glue 530. It should be understood that the minimum width of the first frame glue 510 is less than or equal to the minimum width of the second frame glue 530, and / or the maximum width of the first frame glue 510 is less than or equal to the maximum width of the second frame glue 530.

[0073] According to some exemplary embodiments, the ratio of the width W2 of the second sealant 530 to the width W1 of the first sealant 510 is less than or equal to 3. The inventors have found through research that setting the ratio of W2 to W1 to less than or equal to 3 can ensure better packaging reliability. For example, the value range of the width W2 of the second sealant 530 is 1 mm-5 mm.

[0074] According to some exemplary embodiments, the distance between the first frame glue 510 and the second frame glue 530 is G1, and G1 is less than or equal to W2. By setting the distance between the first frame glue 510 and the second frame glue 530 to be smaller, the flow of the water absorption part 520 can be effectively displayed, so that both sides of the water absorption part 520 can contact the base substrate 100 and the package cover plate 600, and at the same time, it is also conducive to making the light-emitting panel have a narrower frame.

[0075] In addition, due to the influence of factors such as the accuracy of the manufacturing process, there is a certain difference in the distance between the first frame glue 510 and the second frame glue 530 at different positions. The distance G1 between the first frame glue 510 and the second frame glue 530 is less than or equal to the width W2 of the second frame glue 530. It should be understood that the minimum value of the distance between the first frame glue 510 and the second frame glue 530 is less than or equal to the minimum value of the width of the second frame glue 530, and / or the maximum value of the distance between the first frame glue 510 and the second frame glue 530 is less than or equal to the maximum value of the width of the second frame glue 530.

[0076] According to some exemplary embodiments, the water vapor permeability of the second frame glue 530 is less than or equal to the water vapor permeability of the first frame glue 510. The water vapor permeability of the second frame glue 530 plays a more critical role in the quality of the packaging reliability of the light-emitting panel. Therefore, the water vapor permeability of the second frame glue 530 can be set to be smaller, thereby ensuring better packaging reliability. The water vapor permeability of the first frame glue 510 and the second frame glue 530 depends on factors such as material and thickness. The stronger the material's ability to block water vapor and the thicker the thickness of the frame glue, the smaller the water vapor permeability. The materials of the first frame glue 510 and the second frame glue 530 can be the same or different. When the materials of the first frame glue 510 and the second frame glue 530 are different, the second frame glue 530 can use a material with stronger water vapor blocking ability.

[0077] It should be noted that the water vapor permeability of the first frame glue 510 should be understood as the weight of water vapor transmitted from the side of the first frame glue 510 away from the light-emitting device 200 to the side close to the light-emitting device 200 under certain time, temperature and humidity conditions. Similarly, the water vapor permeability of the second frame glue 530 should be understood as the weight of water vapor transmitted from the side of the second frame glue 530 away from the light-emitting device 200 to the side close to the light-emitting device 200 under certain time, temperature and humidity conditions.

[0078] According to some exemplary embodiments, the orthographic projection of the first frame glue 510 on the base substrate 100 is spaced apart from the orthographic projection of the light-emitting device 200 on the base substrate 100 , and the orthographic projection of the first frame glue 510 on the base substrate 100 surrounds the outside of the light-emitting device 200 , thereby preventing the first frame glue 510 from blocking the light emitted by the light-emitting device 200 .

[0079] According to some exemplary embodiments, the substrate 100 may be a rigid substrate, which may include, for example, a glass substrate, an ultra-thin glass (UTG), a polymethyl methacrylate (PMMA) substrate, or a silicon substrate. In this case, the material of the package cover plate 600 may be consistent with the material of the substrate 100, that is, the package cover plate 600 may be a rigid cover plate, so that the light-emitting panel may be a rigid light-emitting panel. For example, when applied to a car taillight, the substrate 100 may be a glass substrate, and the package cover plate 600 may be a glass cover plate.

[0080] According to some exemplary embodiments, the substrate substrate 100 may also be a flexible substrate, which may include, for example, a polyethylene terephthalate (PET) substrate, a polyethylene naphthalene-2,6-dicarboxylate (PEN) substrate, or a colorless polyimide (CPI) substrate. In this case, the material of the package cover plate 600 may be consistent with the material of the substrate substrate 100, that is, the package cover plate 600 may be a flexible cover plate, so that the light-emitting panel may be a flexible light-emitting panel. For example, the substrate substrate 100 may be a colorless polyimide substrate, and the package cover plate 600 may be a colorless polyimide cover plate.

[0081] According to some exemplary embodiments, the material of the inorganic encapsulation layer 300 may include at least one of silicon nitride or silicon oxide, and the material of the organic encapsulation layer 400 may include a transparent organic resin material.

[0082] According to some exemplary embodiments, one or more light emitting devices 200 may be disposed on the base substrate 100 , and the actual size, shape, and arrangement of the light emitting devices 200 may be set according to the application scenario of the light emitting panel.

[0083] According to some exemplary embodiments, the light-emitting panel is applied to the lighting device, and only one light-emitting device 200 may be provided, and the area of ​​the light-emitting device 200 is set according to the required light-emitting area. When the light-emitting device 200 is in the on state, the entire light-emitting panel is lit, and when the light-emitting device 200 is in the off state, the entire light-emitting panel is extinguished. For another example, a plurality of light-emitting devices 200 distributed at intervals may also be provided on the substrate 100, and the switches of each light-emitting device 200 are independent of each other. When in use, different light-emitting devices 200 may be configured to be independently lit up to achieve some special lighting effects, for example, the light-emitting panel may be controlled to display a preset pattern. The light-emitting colors of the above-mentioned plurality of light-emitting devices 200 may be the same, and the light-emitting colors may be set according to the lighting scene of the actual application. For example, when applied to the taillights of a car, each light-emitting device 200 may emit red light. Of course, in some lighting scenes, the light-emitting colors of each light-emitting device 200 may also be different, for example, some light-emitting devices 200 emit red light, and some light-emitting devices 200 emit white light, which is not limited in the embodiments of the present disclosure.

[0084] According to some exemplary embodiments, the light-emitting panel may include a plurality of light-emitting areas, and the shape, size, arrangement, number of light-emitting devices 200 included in each light-emitting area, and the light-emitting color of the light-emitting device 200 may be set according to the needs of the actual application scenario. For example, the shape of the light-emitting area may be a triangle, a prism, a rectangle, a circle, an ellipse, a regular pentagon, or a regular hexagon, etc., which is not limited in the embodiments of the present disclosure.

[0085] According to some exemplary embodiments, the light-emitting panel is applied to a display device, and a plurality of light-emitting devices 200 distributed at intervals may be arranged on the substrate 100. At this time, the light-emitting panel includes a plurality of pixels distributed in an array, each pixel includes a plurality of sub-pixels, and each sub-pixel can display a single color, such as a red sub-pixel displays red, a green sub-pixel displays green, and a blue sub-pixel displays blue. The brightness (grayscale) of sub-pixels of different colors in each pixel can be adjusted, and a plurality of colors can be displayed by color combination and superposition, so that full-color display of the light-emitting panel can be achieved by line-by-line scanning. For example, a red sub-pixel may include a light-emitting device 200 for emitting red light, a green sub-pixel may include a light-emitting device 200 for emitting green light, and a blue sub-pixel may include a light-emitting device 200 for emitting red light.

[0086] According to some exemplary embodiments, the light emitting device 200 may be an OLED or a QLED (Quantum Dot Light Emitting Diodes), etc., which is not limited in the embodiments of the present disclosure.

[0087] According to some exemplary embodiments, the light emitting device 200 may include a first electrode located on the base substrate 100, a light emitting functional layer located on a side of the first electrode away from the base substrate 100, and a second electrode located on a side of the light emitting functional layer away from the base substrate 100. For example, taking the light emitting device 200 as an OLED, the first electrode may be used as an anode, the second electrode may be used as a cathode, the light emitting functional layer may include an organic light emitting material layer, and at least one of a hole injection layer, a hole transport layer, and an electron blocking layer disposed between the first electrode and the organic light emitting material layer, and at least one of an electron injection layer, an electron transport layer, and a hole blocking layer disposed between the second electrode and the organic light emitting material layer, which may be specifically disposed according to actual needs, and the embodiments of the present disclosure are not limited thereto.

[0088] According to some exemplary embodiments, the first electrode may be a reflective electrode, and the second electrode may be a transparent electrode. For example, the second electrode may be a transparent conductive oxide film, and the first electrode may be a metal film or a composite film structure composed of transparent conductive oxide film / metal film / transparent conductive oxide film stacked in sequence.

[0089] According to some exemplary embodiments, referring to Figure 8 The orthographic projection of the first frame glue 510 on the base substrate 100 surrounds the orthographic projection of the inorganic encapsulation layer 300 on the base substrate 100, the orthographic projection of the water absorption part 520 on the base substrate 100 surrounds the orthographic projection of the first frame glue 510 on the base substrate 100, and the orthographic projection of the second frame glue 530 on the base substrate 100 surrounds the orthographic projection of the water absorption part 520 on the base substrate 100. The two sides of the first frame glue 510, the water absorption part 520 and the second frame glue 530 are respectively in contact with the base substrate 100 and the encapsulation cover plate 600 and have high adhesion, which can effectively prevent water vapor in the environment from invading the light-emitting panel.

[0090] Fig. 9 A cross-sectional view of a light emitting panel according to some embodiments of the present disclosure is schematically shown.

[0091] According to some exemplary embodiments, referring to Fig. 9, the orthographic projection of the first seal 510 on the base substrate 100 partially overlaps with the orthographic projection of the inorganic encapsulation layer 300 on the base substrate 100, the orthographic projection of the water absorbing portion 520 on the base substrate 100 surrounds the orthographic projection of the first seal 510 on the base substrate 100 and is spaced from the orthographic projection of the inorganic encapsulation layer 300 on the base substrate 100, and the orthographic projection of the second seal 530 on the base substrate 100 surrounds the orthographic projection of the water absorbing portion 520 on the base substrate 100. One side of the first seal 510 contacts the encapsulation cover plate 600, and the other side contacts the base substrate 100, the side where the inorganic encapsulation layer 300 and the base substrate 100 intersect, and the side of the inorganic encapsulation layer 300 away from the base substrate 100, one side of the water absorbing portion 520 contacts the base substrate 100 and the other side contacts the encapsulation cover plate 600, and one side of the second seal 530 contacts the base substrate 100 and the other side contacts the encapsulation cover plate 600.

[0092] This arrangement is conducive to further narrowing the frame of the light-emitting panel. In addition, since a portion of the first frame glue 510 is located between the base substrate 100 and the packaging cover plate 600, and the other portion is located between the inorganic packaging layer 300 and the packaging cover plate 600, one side of the first frame glue 510 is in contact with the surface of the base substrate 100 and the surface of the inorganic packaging layer 300 at the same time, and the contact area is large, which can increase the length of the water vapor invasion path from the side of the first frame glue 510 away from the light-emitting device 200 to the side close to the light-emitting device 200.

[0093] Fig.10 A cross-sectional view of a light emitting panel according to some embodiments of the present disclosure is schematically shown.

[0094] According to some exemplary embodiments, referring to Fig.10 , the orthographic projection of the first sealant 510 on the base substrate 100 is located within the orthographic projection of the inorganic encapsulation layer 300 on the base substrate 100, the orthographic projection of the water absorbing portion 520 on the base substrate 100 surrounds the orthographic projection of the inorganic encapsulation layer 300 on the base substrate 100, and the orthographic projection of the second sealant 530 on the base substrate 100 surrounds the orthographic projection of the water absorbing portion 520 on the base substrate 100. One side of the first sealant 510 contacts the encapsulation cover plate 600 and the other side contacts the inorganic encapsulation layer 300, one side of the water absorbing portion 520 contacts the base substrate 100 and the other side contacts the encapsulation cover plate 600, and one side of the second sealant 530 contacts the base substrate 100 and the other side contacts the encapsulation cover plate 600. According to this arrangement, it is beneficial to further narrow the frame of the light-emitting panel.

[0095] Fig.11 A cross-sectional view of a light emitting panel according to some embodiments of the present disclosure is schematically shown.

[0096] According to some exemplary embodiments, referring to Fig.11, the orthographic projection of the first sealant 510 on the base substrate 100 is located within the orthographic projection of the inorganic encapsulation layer 300 on the base substrate 100, the orthographic projection of the water absorbing portion 520 on the base substrate 100 partially overlaps with the orthographic projection of the inorganic encapsulation layer 300 on the base substrate 100, and the orthographic projection of the second sealant 530 on the base substrate 100 surrounds the orthographic projection of the water absorbing portion 520 on the base substrate 100 and is spaced from the orthographic projection of the inorganic encapsulation layer 300 on the base substrate 100. One side of the first sealant 510 contacts the inorganic encapsulation layer 300 and the other side contacts the encapsulation cover plate 600, one side of the second sealant 530 contacts the base substrate 100 and the other side contacts the encapsulation cover plate 600, one side of the water absorbing portion 520 contacts the encapsulation cover plate 600, and the other side contacts the base substrate 100, the side where the inorganic encapsulation layer 300 intersects with the base substrate 100, and the side of the inorganic encapsulation layer 300 away from the base substrate 100.

[0097] In the light-emitting panel, the orthographic projection of the first frame glue 510 on the base substrate 100 is spaced apart from the light-emitting device 200, and the orthographic projection of the first frame glue 510 on the base substrate 100 is located within the orthographic projection of the inorganic encapsulation layer 300 on the base substrate 100, and the orthographic projection of the water absorption portion 520 on the base substrate 100 partially overlaps with the orthographic projection of the inorganic encapsulation layer 300 on the base substrate 100, which is equivalent to increasing the width W3 of the inorganic encapsulation layer 300 located outside the light-emitting device 200 (the width of the non-overlapping portion of the projection of the inorganic encapsulation layer 300 and the light-emitting device 200), which is beneficial to further improve the packaging reliability of the light-emitting panel without increasing the frame of the light-emitting panel.

[0098] Fig.12 A cross-sectional view of a light emitting panel according to some embodiments of the present disclosure is schematically shown.

[0099] According to some exemplary embodiments, referring to Fig.12 , the orthographic projection of the first sealant 510 on the base substrate 100 is located within the orthographic projection of the inorganic encapsulation layer 300 on the base substrate 100, the orthographic projection of the water absorption part 520 on the base substrate 100 is located within the orthographic projection of the inorganic encapsulation layer 300 on the base substrate 100, and the orthographic projection of the second sealant 530 on the base substrate 100 surrounds the orthographic projection of the inorganic encapsulation layer 300 on the base substrate 100. One side of the first sealant 510 contacts the inorganic encapsulation layer 300 and the other side contacts the encapsulation cover plate 600, one side of the water absorption part 520 contacts the inorganic encapsulation layer 300 and the other side contacts the encapsulation cover plate 600, and one side of the second sealant 530 contacts the base substrate 100 and the other side contacts the encapsulation cover plate 600.

[0100] In the light-emitting panel, the water absorption portion 520 is located between the inorganic encapsulation layer 300 and the encapsulation cover plate 600, and the water absorption portion 520 is perpendicular to the height of the light-emitting surface of the light-emitting device 200 (i.e., along the Fig.12 The schematic vertical dimension) is shorter, which can further reduce the fluidity of the water absorption part 520. In addition, the width of the inorganic encapsulation layer 300 located on the outer side of the light-emitting device 200 can be further increased, which is beneficial to further improve the packaging reliability of the light-emitting panel without increasing the frame of the light-emitting panel.

[0101] Fig.13 A cross-sectional view of a light emitting panel according to some embodiments of the present disclosure is schematically shown.

[0102] According to some exemplary embodiments, referring to Fig.13 , the orthographic projection of the first sealant 510 on the base substrate 100 is located within the orthographic projection of the inorganic encapsulation layer 300 on the base substrate 100, the orthographic projection of the water absorption part 520 on the base substrate 100 is located within the orthographic projection of the inorganic encapsulation layer 300 on the base substrate 100, and the orthographic projection of the second sealant 530 on the base substrate 100 partially overlaps with the orthographic projection of the inorganic encapsulation layer 300 on the base substrate 100. One side of the first sealant 510 contacts the inorganic encapsulation layer 300 and the other side contacts the encapsulation cover plate 600, one side of the water absorption part 520 contacts the inorganic encapsulation layer 300 and the other side contacts the encapsulation cover plate 600, one side of the second sealant 530 contacts the encapsulation cover plate 600, and the other side contacts the base substrate 100, the side where the inorganic encapsulation layer 300 intersects with the base substrate 100, and the side of the inorganic encapsulation layer 300 away from the base substrate 100.

[0103] In the light-emitting panel, the water absorption part 520 is located between the inorganic packaging layer 300 and the packaging cover plate 600. The height of the water absorption part 520 perpendicular to the light-emitting surface of the light-emitting device 200 is relatively short, which can further reduce the fluidity of the water absorption part 520. Secondly, the width of the inorganic packaging layer 300 located on the outer side of the light-emitting device 200 can be further increased. Without increasing the frame of the light-emitting panel, it is beneficial to further improve the packaging reliability of the light-emitting panel. In addition, since a part of the second frame glue 530 is located between the base substrate 100 and the packaging cover plate 600, and the other part is located between the inorganic packaging layer 300 and the packaging cover plate 600, one side of the second frame glue 530 is in contact with the surface of the base substrate 100 and the surface of the inorganic packaging layer 300 at the same time, and the contact area is large, which can increase the length of the invasion path of water vapor from the side of the second frame glue 530 away from the light-emitting device 200 to the side close to the light-emitting device 200.

[0104] Fig.14 A cross-sectional view of a light emitting panel according to some embodiments of the present disclosure is schematically shown.

[0105] According to some exemplary embodiments, referring to Fig.14 , the orthographic projection of the first sealant 510 on the base substrate 100 is located within the orthographic projection of the inorganic encapsulation layer 300 on the base substrate 100, the orthographic projection of the water absorption part 520 on the base substrate 100 is located within the orthographic projection of the inorganic encapsulation layer 300 on the base substrate 100, and the orthographic projection of the second sealant 530 on the base substrate 100 is located within the orthographic projection of the inorganic encapsulation layer 300 on the base substrate 100. One side of the first sealant 510 contacts the inorganic encapsulation layer 300 and the other side contacts the encapsulation cover plate 600, one side of the water absorption part 520 contacts the inorganic encapsulation layer 300 and the other side contacts the encapsulation cover plate 600, and one side of the second sealant 530 contacts the inorganic encapsulation layer 300 and the other side contacts the encapsulation cover plate 600.

[0106] In the light-emitting panel, the water absorption part 520 is located between the inorganic packaging layer 300 and the packaging cover plate 600. The height of the water absorption part 520 perpendicular to the light-emitting surface of the light-emitting device 200 is relatively short, which can further reduce the fluidity of the water absorption part 520. In addition, the width of the inorganic packaging layer 300 located on the outer side of the light-emitting device 200 can be further increased, which is beneficial to further improve the packaging reliability of the light-emitting panel without increasing the frame of the light-emitting panel.

[0107] Fig.15 A flow chart schematically illustrates a method for preparing a light-emitting panel according to some embodiments of the present disclosure.

[0108] The present disclosure also provides a method for preparing a light-emitting panel. Fig.15 , comprising the following steps.

[0109] In step S10, a light emitting device is formed on a base substrate.

[0110] In step S20, an organic encapsulation layer and an encapsulation frame glue are formed on a side of the light-emitting device away from the substrate, the encapsulation frame glue surrounds the organic encapsulation layer, the encapsulation frame glue includes a first frame glue, a second frame glue and a water absorption portion, the first frame glue surrounds the organic encapsulation layer, the water absorption portion surrounds the first frame glue layer, and the second frame glue surrounds the water absorption portion. Forming the encapsulation frame glue includes forming a first frame glue wet film layer, a water absorption portion, and a second frame glue wet film layer. The viscosity of the first frame glue wet film layer is greater than the viscosity of the second frame glue wet film layer. Then, the first frame glue wet film layer and the second frame glue wet film layer are cured to obtain the first frame glue and the second frame glue.

[0111] In step S30 , a packaging cover plate is formed on a side of the organic packaging layer and the packaging frame adhesive away from the base substrate.

[0112] Figures 16A-16D The diagram schematically shows a preparation process diagram of a method for preparing a light-emitting panel according to some embodiments of the present disclosure.

[0113] Reference Fig.16A , a light emitting device 200 is formed on a base substrate 100 .

[0114] Reference Fig. 16B An inorganic encapsulation layer 300 is formed on the side of the light-emitting device 200 away from the base substrate 100 , and the orthographic projection of the inorganic encapsulation layer 300 on the base substrate 100 covers the orthographic projection of the light-emitting device 200 on the base substrate 100 , that is, the inorganic encapsulation layer 300 completely covers the light-emitting device 200 .

[0115] Reference Fig. 16C An organic encapsulation layer wet film layer 400a is formed on the side of the inorganic encapsulation layer 300 away from the base substrate 100, a first frame glue wet film layer 510a is formed around the organic encapsulation layer 400, a water absorption portion 520 is formed around the first frame glue wet film layer 510a, and a second frame glue wet film layer 530a is formed around the water absorption portion 520.

[0116] For example, the orthographic projection of the organic encapsulation layer wet film layer 400a on the base substrate 100 covers the orthographic projection of the inorganic encapsulation layer 300 on the base substrate 100, the orthographic projection of the first frame glue wet film layer 510a on the base substrate 100 surrounds the orthographic projection of the organic encapsulation layer wet film layer on the base substrate 100, the orthographic projection of the water absorption part 520 on the base substrate 100 surrounds the orthographic projection of the first frame glue wet film layer 510a on the base substrate 100, and the orthographic projection of the second frame glue wet film layer 530a on the base substrate 100 surrounds the orthographic projection of the water absorption part 520 on the base substrate 100.

[0117] Combined with reference Fig. 16C and Fig.16D , the encapsulation cover plate 600 is covered on the side of the organic encapsulation layer wet film layer 400a, the first frame glue wet film layer 510a, the water absorption part 520 and the second frame glue wet film layer 530a away from the base substrate 100, and a curing process is performed on the organic encapsulation layer wet film layer 400a, the first frame glue wet film layer 510a and the second frame glue wet film layer 530a, so that the organic encapsulation layer wet film layer 400a is cured into the organic encapsulation layer 400, the first frame glue wet film layer 510a is cured into the first frame glue 510, and the second frame glue wet film layer 530a is cured into the second frame glue 530.

[0118] According to some exemplary embodiments, the components of the first frame glue wet film layer 510a and the second frame glue wet film layer 530a can be set so that the viscosity of the first frame glue wet film layer 510a is greater than the viscosity of the second frame glue wet film layer 530a, that is, the first frame glue wet film layer 510a has a higher viscosity, so that during the preparation process of the light-emitting panel, the first frame glue wet film layer 510a can more effectively block the interaction between the water absorption part 520 and the organic encapsulation layer wet film layer 400a, and try to avoid the flow of the water absorption part 520 during the preparation process, so that the prepared light-emitting panel has higher packaging reliability.

[0119] Some embodiments of the present disclosure also provide a lighting device, which may include the light-emitting panel described above. The specific structure and technical effects of the light-emitting panel have been described in detail above and will not be repeated here. Therefore, the lighting device has a technical effect corresponding to the beneficial technical effect of the light-emitting panel, that is, it has a relatively high packaging reliability.

[0120] Some embodiments of the present disclosure also provide a car, which includes the lighting device as described above. For example, the lighting device can be a car light, such as a car tail light.

[0121] Some embodiments of the present disclosure also provide a display device, which includes the light-emitting panel as described above. The display device may include any device or product with a display function. For example, the display device may be a smart phone, a mobile phone, an e-book reader, a desktop computer (PC), a laptop PC, a netbook PC, a personal digital assistant (PDA), a portable multimedia player (PMP), a digital audio player, a mobile medical device, a camera, a wearable device (such as a head-mounted device, an electronic clothing, an electronic bracelet, an electronic necklace, an electronic accessory, an electronic tattoo, or a smart watch), a television, etc.

[0122] As used herein, the terms "substantially," "approximately," "approximately," and other similar terms are used as terms of approximation rather than as terms of degree, and they are intended to account for the inherent deviations in measured or calculated values ​​that would be recognized by one of ordinary skill in the art. Taking into account factors such as process fluctuations, measurement problems, and errors associated with the measurement of a particular quantity (i.e., limitations of the measurement system), "approximately" or "approximately" as used herein include the stated value and mean that the particular value is within an acceptable range of deviation as determined by one of ordinary skill in the art. For example, "approximately" can mean within one or more standard deviations, or within ±10% or ±5% of the stated value.

[0123] Although some embodiments according to the general inventive concept of the present disclosure have been illustrated and described, it will be appreciated by those skilled in the art that changes may be made to these embodiments without departing from the principles and spirit of the general inventive concept of the present disclosure, the scope of which is defined by the claims and their equivalents.

Claims

1. A light-emitting panel, wherein: The light emitting panel comprises: substrate substrate; A light emitting device is located on the substrate; An organic encapsulation layer, located on a side of the light emitting device away from the substrate; A packaging frame glue is arranged around the organic packaging layer; A packaging cover plate, located on a side of the packaging glue layer and the organic packaging layer away from the base substrate; The encapsulation frame glue comprises a first frame glue, a second frame glue and a water absorption part, the first frame glue is arranged around the organic encapsulation layer, the water absorption part is arranged around the first frame glue layer, and the second frame glue is arranged around the water absorption part.

2. The light emitting panel according to claim 1, wherein: The width of the first sealant is smaller than or equal to the width of the second sealant.

3. The light emitting panel according to claim 1 or 2, wherein: The light emitting panel further includes an inorganic encapsulation layer, which is located between the light emitting device and the organic encapsulation layer, and an orthographic projection of the inorganic encapsulation layer on the base substrate covers an orthographic projection of the light emitting device on the base substrate.

4. The light emitting panel according to claim 3, wherein: The orthographic projection of the first sealant on the base substrate surrounds the orthographic projection of the inorganic encapsulation layer on the base substrate.

5. The light emitting panel according to claim 3, wherein: The orthographic projection of the first sealant on the base substrate is located within the orthographic projection of the inorganic packaging layer on the base substrate.

6. The light emitting panel according to claim 5, wherein: The orthographic projection of the second sealant on the base substrate surrounds the orthographic projection of the inorganic encapsulation layer on the base substrate.

7. The light emitting panel according to claim 6, wherein: The orthographic projection of the water absorbing portion on the base substrate surrounds the orthographic projection of the inorganic encapsulation layer on the base substrate.

8. The light emitting panel according to claim 6, wherein: The orthographic projection of the water absorbing portion on the base substrate is located within the orthographic projection of the inorganic encapsulation layer on the base substrate.

9. The light emitting panel according to claim 6, wherein: An orthographic projection of the water absorbing portion on the base substrate partially overlaps with an orthographic projection of the inorganic encapsulation layer on the base substrate.

10. The light emitting panel according to claim 5, wherein: The orthographic projection of the second sealant on the base substrate partially overlaps with the orthographic projection of the inorganic encapsulation layer on the base substrate.

11. The light emitting panel according to claim 3, wherein: The orthographic projection of the first sealant on the base substrate partially overlaps with the orthographic projection of the inorganic encapsulation layer on the base substrate.

12. The light emitting panel according to any one of claims 1 to 11, wherein: The orthographic projection of the first sealant on the base substrate is spaced apart from the orthographic projection of the light emitting device on the base substrate.

13. The light emitting panel according to any one of claims 1 to 11, wherein: The water vapor permeability of the second sealant is less than or equal to the water vapor permeability of the first sealant.

14. The light emitting panel according to any one of claims 1 to 11, wherein: The distance between the first sealant and the second sealant is less than or equal to the width of the second sealant.

15. A display device, wherein: The display device comprises a light emitting panel according to any one of claims 1-14.

16. A method for preparing a light-emitting panel, wherein: The preparation method comprises the following steps: forming a light emitting device on a substrate; An organic encapsulation layer and an encapsulation frame glue are formed on a side of the light-emitting device away from the base substrate, the encapsulation frame glue surrounds the organic encapsulation layer, the encapsulation frame glue includes a first frame glue, a second frame glue and a water absorption part, the first frame glue surrounds the organic encapsulation layer, the water absorption part surrounds the first frame glue layer, and the second frame glue surrounds the water absorption part, forming the encapsulation frame glue includes forming a first frame glue wet film layer, a water absorption part, and a second frame glue wet film layer, the viscosity of the first frame glue wet film layer is greater than the viscosity of the second frame glue wet film layer, and then the first frame glue wet film layer and the second frame glue wet film layer are cured to obtain the first frame glue and the second frame glue; as well as A packaging cover plate is formed on a side of the organic packaging layer and the packaging frame adhesive away from the base substrate.

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