Machining system and measuring system

Abstract

The processing system includes: a processing device capable of processing an object by irradiating the object with a processing beam; a measuring device capable of measuring the positions of the object and the processing device; and a control device capable of controlling the processing device. The processing apparatus includes: a first moving device capable of changing a position of a processing head that emits a processing beam; and a second moving device on which the first moving device is placed, the second moving device being movable together with the first moving device. The control device controls the movement by the second movement device on the basis of the measurement result of the measurement device and model information relating to the shape of the object.

Description

Technical Field

[0001] The present invention relates to the technical field of, for example, a processing system for processing an object and a measuring system for measuring an object. Background Art

[0002] As a processing system capable of processing an object, a processing system for processing the object by irradiating a processing light onto the surface of the object is described in Patent Document 1. In such a processing system, it is required to process the object appropriately. In addition, in a measuring system capable of measuring an object, it is also required to measure the object appropriately.

[0003] [Prior art literature]

[0004] [Patent Document]

[0005] Patent Document 1: International Publication No. 2000 / 054925 Pamphlet Summary of the invention

[0006] Through a first form, a processing system is provided for processing an object, the processing system comprising: a processing device capable of processing the object by irradiating the object with a processing beam; a measuring device capable of measuring the position of the object and the position of the processing device; and a control device capable of controlling the processing device, the processing device comprising: a first moving device capable of changing the position of a processing head that emits the processing beam; and a second moving device that carries the first moving device and can move together with the first moving device, the control device controlling the movement performed by the second moving device based on the measurement result of the measuring device and model information related to the shape of the object.

[0007] Through the second form, a processing system is provided for processing an object, the processing system comprising: a processing device capable of processing the object by irradiating the object with a processing beam; and a measuring device comprising a measuring head, the measuring head capable of measuring the object to be processed by the processing device or the object processed by the processing device, the processing device comprising: a first moving device capable of changing the position of the processing head that emits the processing beam; and a second moving device that carries the first moving device and can move together with the first moving device, the measuring device comprising: a third moving device capable of changing the position of the measuring head; and a fourth moving device that carries the third moving device and can move together with the third moving device.

[0008] According to a third aspect, a processing system is provided for processing an object, the processing system comprising: a processing device capable of processing the object by irradiating the object with a processing beam; a measuring device capable of measuring the position of the object; and a control device capable of controlling

[0009] The processing device includes: a first moving device capable of changing the position of a processing head that emits the processing beam; and a second moving device that carries the first moving device and can move on a first plane, and the control device controls the movement on the first plane performed by the second moving device based on the measurement results of the measuring device and the model information related to the shape of the object.

[0010] Through the fourth form, a processing system is provided for processing an object, the processing system comprising: a processing device capable of processing the object by irradiating the object with a processing beam; a camera device capable of photographing the object; and a control device capable of controlling the processing device, the processing device comprising: a first moving device capable of changing the position of a processing head that emits the processing beam; and a second moving device on which the first moving device is mounted and capable of moving on a first plane, the control device controlling the movement on the first plane performed by the second moving device based on the camera result of the camera device and model information related to the shape of the object.

[0011] Through the fifth form, a measuring system is provided, comprising: a measuring device including a measuring head capable of measuring the position or shape of an object; a measuring device capable of measuring the position of the object and the position of the measuring device; and a control device capable of controlling the measuring device, the measuring device comprising: a first moving device capable of changing the position of the measuring head; and a second moving device carrying the first moving device and capable of moving on a first plane, the control device controlling the movement on the first plane performed by the second moving device based on the measurement result of the measuring device and model information related to the shape of the object.

[0012] Through the sixth form, a measurement system is provided, comprising: a measuring device including a measuring head capable of measuring the position or shape of an object; a measuring device capable of measuring the position of the object; and a control device capable of controlling the measuring device, the measuring device comprising: a first moving device capable of changing the position of the measuring head; and a second moving device carrying the first moving device and capable of moving on a first plane, the control device controlling the movement on the first plane performed by the second moving device based on the measurement result of the measuring device and model information related to the shape of the object.

[0013] According to the seventh aspect, a measuring system is provided, comprising: a measuring device including a measuring head capable of measuring the position or shape of an object; a camera device capable of photographing the object; and a control device capable of controlling the measuring device, the measuring device comprising: a first moving device capable of changing the position of the measuring head; and a second moving device on which the first moving device is mounted and which can move on a first plane, the control device controlling the movement on the first plane performed by the second moving device based on the camera result of the camera device and model information related to the shape of the object.

[0014] According to an eighth aspect, there is provided a processing system for processing an object, the processing system comprising: a processing device capable of processing the object by irradiating the object with a processing beam

[0015] Processing; a measuring device capable of measuring the position of the object; and a control device capable of controlling the processing device, the processing device comprising: a first moving device capable of changing the position of a processing head that emits the processing beam; and a second moving device carrying the first moving device and capable of moving on a first plane. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram schematically showing an example of the overall configuration of the processing system in this embodiment.

[0017] Figure 2 It is a side view schematically showing the appearance of the processing device in this embodiment.

[0018] Figure 3 It is a block diagram showing the overall structure of the processing device in this embodiment.

[0019] Figure 4 It is a schematic diagram showing the structure of the self-propelled driving system and the arm driving system.

[0020] Figure 5 is a schematic diagram showing the structure of a micro-drive system.

[0021] Figure 6 It is a side view schematically showing the appearance of the measuring device in this embodiment.

[0022] Figure 7 It is a block diagram showing the overall structure of the measuring device in this embodiment.

[0023] Figure 8 It is a schematic diagram showing the structure of the self-propelled driving system and the arm driving system.

[0024] Fig. 9It is a front view showing the appearance of the position measuring device in this embodiment.

[0025] Fig.10 This is a block diagram showing the structure of the position measuring device in this embodiment.

[0026] Fig.11 This is a block diagram showing the structure of the control server 4 in this embodiment.

[0027] Fig.12 This shows the data structure of the processing information DB.

[0028] Fig.13 This shows the data structure of the measurement information DB.

[0029] Fig.14 This is a schematic diagram showing a specific example of a workpiece to be processed by the processing device and measured by the measuring device.

[0030] Fig.15 This is a flowchart showing the flow of processing operations.

[0031] Fig.16 It is a plan view showing the positional relationship between a position measuring device and an aircraft as an example of a workpiece.

[0032] Fig.17 It is a top view showing an airplane as an example of a workpiece.

[0033] Fig.18 It means in Fig.15 Flowchart of the process of the action of moving the machining head in step S112.

[0034] Fig.19 It is a top view showing an example of a fine adjustment area.

[0035] Fig. 20 This is a flowchart showing the flow of the measurement operation.

[0036] Fig.21 (a) to Fig.21 (c) are cross-sectional views respectively showing a processing device for processing a workpiece and a measuring device for measuring the workpiece.

[0037] Fig. 22 It is a cross-sectional view showing a workpiece including a substrate and a film.

[0038] Fig.23 This is a top view conceptually showing the non-machining area set in the workpiece.

[0039] Fig.24 It is a block diagram showing the configuration of a processing system in a first modification.

[0040] Fig.25 (a) to Fig.25 (b) schematically shows an example of the use of at least two processing devices 1 and the use of at least two measuring devices 2.

[0041] Fig.26 It is a block diagram showing the structure of a processing device in a second modification.

[0042] Fig. 27 This is a block diagram showing the structure of a control server in a third modification. DETAILED DESCRIPTION

[0043] Hereinafter, the embodiments of the processing system, the processing method, the measuring system and the measuring method will be described with reference to the accompanying drawings. Hereinafter, the embodiments of the processing system, the processing method, the measuring system and the measuring method will be described using the processing system SYS. However, the present invention is not limited to the embodiments described below.

[0044] In the following description, the positional relationship of various components constituting the machining system SYS is described using an XYZ orthogonal coordinate system defined by an X-axis, a Y-axis, and a Z-axis that are orthogonal to each other. In the following description, for convenience of description, the X-axis direction and the Y-axis direction are respectively horizontal directions (i.e., prescribed directions in the horizontal plane), and the Z-axis direction is a vertical direction (i.e., a direction orthogonal to the horizontal plane, substantially an up-and-down direction). In addition, the rotation directions (in other words, tilting directions) around the X-axis, the Y-axis, and the Z-axis are respectively referred to as the θX direction, the θY direction, and the θZ direction.

[0045] (1) Structure of the processing system SYS

[0046] First, the configuration of the processing system SYS in this embodiment will be described.

[0047] (1-1) Overall structure of the processing system SYS

[0048] First, refer to Figure 1 The overall configuration of the processing system SYS in this embodiment will be described. Figure 1 It is a block diagram showing the overall structure of the processing system SYS in this embodiment.

[0049] like Figure 1 As shown, the machining system SYS includes a machining device 1 , a measuring device 2 , a position measuring device 3 , and a control server 4 .

[0050] The processing device 1, the measuring device 2 and the position measuring device 3 can communicate with the control server 4 via the communication network, respectively. That is, the control server 4 can communicate with the processing device 1, the measuring device 2 and the position measuring device 3, respectively, via the communication network. The communication network typically may include a wireless communication network. As an example of a wireless communication network, a communication network that complies with the International Mobile Telecommunication (IMT) standard (for example, a communication network that complies with the fourth generation mobile communication technology (4th generation, 4G), the fifth generation mobile communication technology (5th generation, 5G) or the sixth generation mobile communication technology (6th generation, 6G)) can be listed. As another example of a wireless communication network, a wireless local area network (LAN) can be listed. As another example of a wireless communication network, a communication network capable of optical wireless communication can be listed.

[0051] The processing device 1 can process a workpiece W as an example of an object under the control of the control server 4. The workpiece W may be, for example, a metal, an alloy (e.g., duralumin), a semiconductor (e.g., silicon), a resin, a composite material such as carbon fiber reinforced plastic (CFRP), a coating (e.g., a coating layer applied to a substrate), glass, or an object including any other material.

[0052] The processing device 1 can perform additional processing on the workpiece W. That is, the processing device 1 can perform additional processing to shape a shape on the workpiece W. The processing device 1 can also perform removal processing on the workpiece W. That is, the processing device 1 can perform removal processing to remove a part of the workpiece W. The processing device 1 can also perform marking processing to form a desired mark on the surface of the workpiece W. The processing device 1 can also perform peening processing to change the surface characteristics of the workpiece W. The processing device 1 can also perform stripping processing to peel off the surface of the workpiece W. The processing device 1 can also perform welding processing to join one workpiece W to another workpiece W. The processing device 1 can also perform cutting processing to cut the workpiece W.

[0053] The processing device 1 can also form a desired structure on the surface of the workpiece W by processing the workpiece W. However, the processing device 1 can also perform processing different from the processing for forming the desired structure on the surface of the workpiece W.

[0054] As an example of a desired structure, a riblet structure can be cited. The riblet structure may also include a structure that can reduce the resistance of the surface of the workpiece W to the fluid (especially at least one of the friction resistance and the turbulent friction resistance). Therefore, a riblet structure can be formed on a workpiece W having a component disposed in (in other words, located in) a fluid. In addition, the so-called "fluid" mentioned here refers to a medium (for example, at least one of a gas and a liquid) that flows relative to the surface of the workpiece W. For example, when the surface of the workpiece W moves relative to the medium while the medium itself is stationary, the medium may also be referred to as a fluid. In addition, the stationary state of the medium may also refer to a state in which the medium does not move relative to a specified reference object (for example, the ground surface).

[0055] As an example of a workpiece W that can be formed with a rib structure, at least one of an airplane, a windmill, an engine turbine, and a power generation turbine can be cited. When such a rib structure is formed on the workpiece W, the workpiece W is easy to move relative to the fluid. Therefore, the resistance that hinders the movement of the workpiece W relative to the fluid is reduced, which helps to save energy. That is, an environmentally friendly workpiece W can be manufactured. For example, when the workpiece W is a component exposed to the fuselage surface of the aircraft (for example, at least a part of the aircraft), the resistance that hinders the movement of the aircraft is reduced, which helps to save fuel for the aircraft. For example, when the workpiece W is a windmill (for example, at least a part of the windmill), the resistance that hinders the movement (typically, rotation) of the windmill is reduced, which helps to improve the efficiency of the windmill. For example, when the workpiece W is an engine turbine (for example, at least a part of the engine turbine), the resistance that hinders the movement (typically, rotation) of the engine turbine is reduced, which helps to improve the efficiency or energy saving of the engine turbine. For example, when the workpiece W is a turbine for power generation (for example, at least a part of the turbine for power generation), the resistance that hinders the movement (typically, rotation) of the turbine for power generation is reduced, thereby contributing to the high efficiency of the turbine for power generation (i.e., the improvement of power generation efficiency). The processing device 1 may contribute to the goal of "13.2.2 Reduction of total greenhouse gas emissions per year" in Goal 13 of the Sustainable Development Goals (SDGs) led by the United Nations, "Take urgent action to combat climate change and its impact".

[0056] The measuring device 2 can measure the workpiece W under the control of the control server 4. For example, the measuring device 2 can measure the workpiece W that is scheduled to be processed by the processing device 1. For example, the measuring device 2 can also measure the workpiece W that has been processed by the processing device 1. The measuring device 2 can be capable of measuring the position of the workpiece W. That is, the measurement of the workpiece W by the measuring device 2 can include the measurement of the position of the workpiece W. The measuring device 2 can also be capable of measuring the shape of the workpiece W (for example, a three-dimensional shape). That is, the measurement of the workpiece W by the measuring device 2 can also include the measurement of the shape of the workpiece W.

[0057] Furthermore, since the machining system SYS can measure the workpiece W using the measuring device 2 , the machining system SYS can also be referred to as a measuring system.

[0058] The position measuring device 3 is capable of measuring the position of the measuring object. The action of measuring the position of the measuring object may refer to the action of obtaining information directly or indirectly indicating the position of the measuring object as a measurement result. The measuring object may include a workpiece W. The measuring object may also include a processing device 1. The measuring object may also include a measuring device 2. That is, the position measuring device 3 may be capable of measuring the position of at least one of the workpiece W, the processing device 1, and the measuring device 2.

[0059] The position measuring device 3 can measure the position of the measuring object in the measuring coordinate system determined based on the position measuring device 3. In the present embodiment, an example in which the measuring coordinate system of the position measuring device 3 is used as a reference coordinate system as a reference of the machining system SYS is described. The measuring coordinate system (i.e., the reference coordinate system) can be, for example, a coordinate system in which the X-axis direction and the Y-axis direction are horizontal directions, the Z-axis direction is a vertical direction, and the position of the origin is set based on the position where the position measuring device 3 is arranged. In the following description, unless otherwise specified, the X-axis, the Y-axis, and the Z-axis can refer to the X-axis, the Y-axis, and the Z-axis in the measuring coordinate system (i.e., the reference coordinate system), respectively. For example, the position measuring device 3 can measure the position of the workpiece W in at least one of the X-axis direction, the Y-axis direction, the Z-axis direction, the θX direction, the θY direction, and the θZ direction. For example, the position measuring device 3 can also measure the position of the machining device 1 in at least one of the X-axis direction, the Y-axis direction, the Z-axis direction, the θX direction, the θY direction, and the θZ direction. For example, the position measuring device 3 may measure the position of the measuring device 2 in at least one of the X-axis direction, the Y-axis direction, the Z-axis direction, the θX direction, the θY direction, and the θZ direction.

[0060] The position of the workpiece W measured by the position measuring device 3 (i.e., the position of the workpiece W indicated by the measurement result of the position measuring device 3) can be used as a reference position serving as a reference for the workpiece W. In the above case, it can also be regarded that the position measuring device 3 has measured the reference position of the workpiece W. Similarly, the position of the processing device 1 measured by the position measuring device 3 (i.e., the position of the processing device 1 indicated by the measurement result of the position measuring device 3) can also be used as a reference position serving as a reference for the processing device 1. In the above case, it can also be regarded that the position measuring device 3 has measured the reference position of the processing device 1. Similarly, the position of the measuring device 2 measured by the position measuring device 3 (i.e., the position of the measuring device 2 indicated by the measurement result of the position measuring device 3) can also be used as a reference position serving as a reference for the measuring device 2. In the above case, it can also be regarded that the position measuring device 3 has measured the reference position of the measuring device 2.

[0061] The control server 4 may be capable of controlling the processing device 1. For example, the control server 4 may control the processing device 1 so that the processing device 1 processes the workpiece W in a desired processing form. In order to control the processing device 1, the control server 4 may receive (i.e., obtain) position information from the position measurement device 3 via a communication network, and the position information represents the measurement result of the position of at least one of the workpiece W, the processing device 1, and the measuring device 2. The control server 4 may generate processing control information for controlling the processing device 1 based on the position information. The control server 4 may send (i.e., output) the generated processing control information to the processing device 1 via the communication network. The processing device 1 may control the workpiece W based on the processing control information sent from the control server 4.

[0062] The control server 4 can manage the progress of the processing of the workpiece W by the processing device 1. In this case, the control server 4 can receive (i.e., obtain) processing progress information related to the progress of the processing of the workpiece W by the processing device 1 from the processing device 1 via the communication network. The processing device 1 can send (i.e., output) the processing progress information to the control server 4 via the communication network.

[0063] The control server 4 may be capable of controlling the measuring device 2 in addition to or instead of being capable of controlling the processing device 1. For example, the control server 4 may control the measuring device 2 so that the measuring device 2 measures the workpiece W in a desired measurement form. In order to control the measuring device 2, the control server 4 may receive (i.e., obtain) position information from the measuring device 2 via a communication network, wherein the position information indicates a measurement result of the position of at least one of the workpiece W, the processing device 1, and the measuring device 2. The control server 4 may generate measurement control information for controlling the measuring device 2 based on the position information. The control server 4 may send (i.e., output) the generated measurement control information to the measuring device 2 via the communication network. The measuring device 2 may measure the workpiece W based on the measurement control information sent from the control server 4.

[0064] The control server 4 may obtain the measurement result of the workpiece W by the measuring device 2. In this case, the control server 4 may receive (i.e., obtain) the measurement result information related to the measurement result of the workpiece W by the measuring device 2 from the measuring device 2 via the communication network. The measuring device 2 may send (i.e., output) the measurement result information to the control server 4 via the communication network.

[0065] The control server 4 may control at least one of the processing device 1 and the measuring device 2 using the measurement result information obtained from the measuring device 2. For example, the control server 4 may generate processing control information based on the position information and the measurement result information. For example, the control server 4 may generate measurement control information based on the position information and the measurement result information.

[0066] In addition, the processing system SYS may include at least one of the processing device 1, the measuring device 2, and the position measuring device 3, and may not include at least one of the processing device 1, the measuring device 2, and the position measuring device 3. For example, the processing system SYS may include the processing device 1 and the measuring device 2, and may not include the position measuring device 3. For example, the processing system SYS may include the measuring device 2 and the position measuring device 3, and may not include the processing device 1. For example, the processing system SYS may include the processing device 1 and the position measuring device 3, and may not include the measuring device 2.

[0067] (1-2) Structure of Processing Device 1

[0068] Next, the structure of the processing device 1 in this embodiment is demonstrated.

[0069] (1-2-1) Overall Structure of Processing Device 1

[0070] First, refer to Figure 2 The overall structure of the processing device 1 in this embodiment will be described. Figure 2It is a side view schematically showing the appearance of the processing device 1 in this embodiment.

[0071] like Figure 2 As shown, the processing device 1 can process the workpiece W arranged on the support surface SS. Figure 2 In the example shown, the workpiece W can be arranged on the support surface SS via a support member SM that supports the workpiece W on the support surface SS. The support member SM can be movable on the support surface SS. In the case, the support member SM can function as a conveying device that conveys the workpiece W to the desired position. Alternatively, the support member SM may not be movable on the support surface SS. The support member SM may also be fixed to the support surface SS. Alternatively, the workpiece W may be directly arranged on the support surface SS. In addition, the workpiece W may also be placed on a self-moving drive system or a movable stage. In the case, the position of the workpiece W relative to the support surface SS can be changed.

[0072] In the present embodiment, the processing device 1 irradiates the workpiece W with processing light EL (i.e., an energy beam in the form of light) in order to process the workpiece W. That is, the processing device 1 processes the workpiece W by irradiating the processing light EL with the workpiece W. The processing light EL may be any type of light as long as it can process the workpiece W by irradiating it with the workpiece W. In the present embodiment, an example in which the processing light EL is laser light is used for explanation. However, the processing light EL may also be a light of a different type from the laser light. Furthermore, as for the wavelength of the processing light EL, as long as it can process the workpiece W by irradiating it with the workpiece W, it may be any wavelength. For example, the processing light EL may be visible light or invisible light (e.g., at least one of infrared light, ultraviolet light, and extreme ultraviolet light). The processing light EL may also include pulsed light (e.g., pulsed light having a light emission time of less than picoseconds). Alternatively, the processing light EL may not include pulsed light. In other words, the processing light EL may also be continuous light.

[0073] In order to process the workpiece W using the processing light EL, Figure 2 and a block diagram showing the overall structure of the processing device 1. Figure 3 As shown, the processing device 1 includes a processing light source 11 , a processing head 12 , a head driving system 13 , and a control device 14 .

[0074] The processing light source 11 can generate processing light EL. The processing light source 11 emits the generated processing light EL toward the processing head 12 via a light transmission member (not shown). As an example of the light transmission member, at least one of an optical fiber and a light pipe can be cited.

[0075] The machining head 12 irradiates the workpiece W with the machining light EL emitted from the machining light source 11. In order to irradiate the workpiece W with the machining light EL, the machining head 12 includes a machining optical system 121. The machining head 12 irradiates the workpiece W with the machining light EL via the machining optical system 121. That is, the machining optical system 121 is an optical system for irradiating the workpiece W with the machining light EL. Therefore, the machining optical system 121 may also be referred to as an irradiation optical system.

[0076] The processing optical system 121 may include a focusing optical element 1211. For example, the focusing optical element 1211 may be capable of changing the convergence position of the processing light EL. In particular, the focusing optical element 1211 may be capable of

[0077] Changing the convergence position of the processing light EL in the direction along the optical axis AX of the processing optical system 121. The optical axis AX of the processing light EL typically intersects the surface of the workpiece W, so the focusing optical element 1211 may be capable of changing the convergence position of the processing light EL in the direction intersecting the surface of the workpiece W.

[0078] The head drive system 13 moves the processing head 12. Therefore, the head drive system 13 can also be called a moving device. Specifically, the head drive system 13 moves the processing head 12 relative to the workpiece W. In order to move the processing head 12, the head drive system 13 includes a self-moving drive system 131, an arm drive system 132, and a micro-movement drive system 133. However, the head drive system 13 may not include at least one of the self-moving drive system 131, the arm drive system 132, and the micro-movement drive system 133.

[0079] For the structures of the self-propelled drive system 131, the arm drive system 132, and the micro-drive system 133, refer to Figures 4 to 5 It will be described in detail later. Here, the following briefly describes the outlines of the self-moving drive system 131, the arm drive system 132 and the micro-motion drive system 133. The self-moving drive system 131 is capable of moving on the support surface SS that supports or configures the workpiece W. In particular, the self-moving drive system 131 is capable of self-moving on the support surface SS that supports or configures the workpiece W. The self-moving drive system 131 moves the processing head 12 (i.e., changes the position of the processing head 12) by self-moving on the support surface SS. The arm drive system 132 is a drive system that can function as a robot arm that moves the processing head 12 (i.e., changes the position of the processing head 12). In addition, the micro-motion drive system 133 is also a drive system that moves the processing head 12 (i.e., changes the position of the processing head 12) in the same way as the arm drive system 132.

[0080] The self-moving drive system 131, the arm drive system 132 and the micro-motion drive system 133 respectively move the processing head 12 along at least one of the X-axis direction, the Y-axis direction, the Z-axis direction, the θX direction, the θY direction and the θZ direction. Among them, in the present embodiment, the self-moving drive system 131 moves on the support surface SS. The support surface SS is typically a surface along the XY plane. Therefore, in the following description, an example in which the self-moving drive system 131 can move the processing head 12 along the X-axis direction and the Y-axis direction is described. Furthermore, in the following description, an example in which the arm drive system 132 can move the processing head 12 along the X-axis direction, the Y-axis direction, the Z-axis direction, the θX direction, the θY direction and the θZ direction is described. In addition, the situation in which the processing head 12 is moved along at least one of the θX direction, the θY direction and the θZ direction can also be regarded as equivalent to the situation in which the posture of the processing head 12 around at least one of the X-axis, the Y-axis and the Z-axis is changed. Alternatively, the case where the machining head 12 is moved along at least one of the θX direction, the θY direction, and the θZ direction may be considered to be equivalent to the case where the machining head 12 is rotated and moved around at least one of the X axis, the Y axis, and the Z axis. In addition, the support surface SS may be a surface inclined relative to the XY plane, or may be a non-planar surface.

[0081] When the machining head 12 moves, the positional relationship between the machining head 12 and the workpiece W changes. Furthermore, when the positional relationship between the workpiece W and the machining head 12 changes, the positional relationship between the workpiece W and the machining optical system 121 included in the machining head 12 changes. Furthermore, when the positional relationship between the workpiece W and the machining head 12 changes, the irradiation position of the machining light EL on the workpiece W changes. Therefore, moving the machining head 12 is equivalent to changing the irradiation position of the machining light EL on the workpiece W.

[0082] The control device 14 controls the operation of the processing device 1. For example, the control device 14 may control at least one of the processing light source 11, the processing head 12, and the head driving system 13 included in the processing device 1 based on the processing control information sent from the control server 4, so that the workpiece W is processed in a desired processing form. Furthermore, the control device 14 may monitor the progress of the processing of the workpiece W by the processing device 1, and generate processing progress information related to the progress of the processing. The control device 14 may send the generated processing progress information to the control server 4.

[0083] The control device 14 may include, for example, a computing device and a storage device. The computing device may include, for example, at least one of a central processing unit (CPU) and a graphics processing unit (GPU). The storage device may include, for example, a memory. The control device 14 functions as a device for controlling the action of the processing device 1 by executing a computer program through the computing device. The computer program is a computer program for causing the computing device to perform (i.e., execute) the later-described action that the control device 14 should perform. That is, the computer program is a computer program for causing the control device 14 to function so that the processing device 1 performs the later-described action. The computer program executed by the computing device may be recorded in a storage device (i.e., a recording medium) included in the control device 14, or in any storage medium (e.g., a hard disk or a semiconductor memory) built into the control device 14 or externally connected to the control device 14. Alternatively, the computing device may also download the computer program to be executed from a device outside the control device 14 via a network interface.

[0084] The control device 14 can control the emission form of the processing light EL based on the processing head 12. The emission form may include, for example, at least one of the intensity of the processing light EL and the emission timing of the processing light EL. In the case where the processing light EL includes a plurality of pulsed lights, the emission form may include, for example, at least one of the emission time of the pulsed light, the emission cycle of the pulsed light, and the ratio of the length of the emission time of the pulsed light to the emission cycle of the pulsed light (so-called duty cycle). Furthermore, the control device 14 can control the movement form of the processing head 12 by the head drive system 13. The movement form may include, for example, at least one of the movement amount, movement speed, movement direction, and movement timing (movement period).

[0085] The control device 14 may not be arranged inside the processing device 1. For example, the control device 14 may be arranged outside the processing device 1 as a server or the like. In the above case, the control device 14 and the processing device 1 may be connected via a wired and / or wireless network (or a data bus and / or a communication line). As a wired network, for example, a network using an interface in a serial bus manner represented by at least one of Institute of Electrical and Electronics Engineers (IEEE) 1394, RS-232x, RS-422, RS-423, RS-485, and Universal Serial Bus (USB) can be used. As a wired network, a network using an interface in a parallel bus manner can also be used. As a wired network, a network using an interface compliant with Ethernet (registered trademark) represented by at least one of 10BASE-T, 100BASE-TX, and 1000BASE-T can also be used. As a wireless network, a network using radio waves can also be used. As an example of a network using radio waves, a network compliant with IEEE802.1x (for example, a wireless LAN) can be listed.

[0086] and Bluetooth (registered trademark)). As a wireless network, a network using infrared rays may also be used. As a wireless network, a network using optical communication may also be used. In the above case, it may be configured such that the control device 14 and the processing device 1 can send and receive various information via the network. In addition, the control device 14 may be capable of sending information such as commands or control parameters to the processing device 1 via the network. The processing device 1 may include a receiving device, which receives information such as commands or control parameters from the control device 14 via the network. The processing device 1 may include a sending device (i.e., an output device that outputs information to the control device 14) that sends information such as commands or control parameters to the control device 14 via the network. Alternatively, it may be that a first control device that performs a part of the processing performed by the control device 14 is provided inside the processing device 1, and on the other hand, a second control device that performs another part of the processing performed by the control device 14 is provided outside the processing device 1. In addition, the control device 14 or the second control device provided outside the processing device 1 may also be provided at a location different from the facility (e.g., a hangar) where the processing device 1 is used.

[0087] In the control device 14, a computing model that can be constructed by machine learning can be installed by executing a computer program by a computing device. As an example of a computing model that can be constructed by machine learning, a computing model including a neural network (so-called artificial intelligence (AI)) can be cited. In the case, the learning of the computing model can include the learning of the parameters of the neural network (for example, at least one of the weights and biases). The control device 14 can use the computing model to control the action of the processing device 1. That is, the action of controlling the action of the processing device 1 can include the action of using the computing model to control the action of the processing device 1. In addition, in the control device 14, a computing model constructed by offline machine learning using teacher data can also be installed. In addition, the computing model installed in the control device 14 can be updated on the control device 14 through online machine learning. Alternatively, the control device 14 can also control the action of the processing device 1 using a computing model installed in a device outside the control device 14 (that is, a computing model installed in a device outside the processing device 1) on the basis of or instead of the computing model installed in the control device 14.

[0088] In addition, as a recording medium for the computer program executed by the recording control device 14, a read-only optical disc (Compact Disc-Read Only Memory, CD-ROM), a burnable optical disc (Compact Disc-Recordable, CD-R), a rewritable optical disc (Compact Disc-Rewritable, CD-RW) or a flexible disk (flexible disk), a magneto-optical disc (Magneto-Optical disc, MO), a read-only digital versatile disc (Digital Versatile Disc-ReadOnly Memory, DVD-ROM), a random access digital versatile disc (Digital Versatile Disc-RandomAccess Memory, DVD-RAM), a writable digital versatile disc (Digital Versatile Disc-Recordable, DVD-R), DVD+R, a rewritable digital versatile disc (Digital Versatile Disc-Rewritable, DVD-RW), DVD+RW and Blu-ray (Blu-ray (registered trademark)) and other optical discs, magnetic media such as magnetic tapes, optical magnetic discs, semiconductor memories such as USB memories, and at least one of other arbitrary media that can store programs can be used. The recording medium may also include a device capable of recording a computer program (for example, a general-purpose device or a dedicated device in which a computer program is installed in a state in which it can be executed in the form of at least one of software and firmware). Furthermore, each process or function included in the computer program may be implemented by a logic processing block implemented in the control device 14 by executing the computer program by the control device 14 (i.e., the computer), or by hardware such as a predetermined gate array (Field Programmable Gate Array (FPGA), Application Specific Integrated Circuit (ASIC)) included in the control device 14, or may be implemented in the form of a mixture of a logic processing block and a local hardware module that implements a part of the hardware.

[0089] In addition, the processing device 1 may include a power source. For example, the processing device 1 may include a power source configured on a trolley 1311 of a self-moving drive system 131. The processing device 1 may operate using power supplied from the power source. For example, the processing light source 11 may generate processing light EL using power supplied from the power source. For example, the head drive system 13 may move the processing head 12 using power supplied from the power source. The power source may be rechargeable. For example, the power source may be capable of contactless charging (wireless charging).

[0090] (1-2-2) Structure of the Head Driving System 13

[0091] Next, an example of the structure of the head drive system 13 is described. As described above, the head drive system 13 includes the self-movement drive system 131, the arm drive system 132, and the micro-motion drive system 133. Therefore, the self-movement drive system 131, the arm drive system 132, and the micro-motion drive system 133 are described in turn below.

[0092] (1-2-2-1) Structure of Self-propelled Driving System 131

[0093] First, refer to Figure 4 The self-propelled drive system 131 will be described. Figure 4 It is a cross-sectional view showing the structure of the self-propelled driving system 131.

[0094] like Figure 4 As shown, the self-propelled driving system 131 includes a trolley 1311 and a motor 1312. The trolley 1311 is a platform with wheels installed. The trolley 1311 is arranged on the support surface SS. The wheels of the trolley 1311 can rotate using the power of the motor 1312. As a result, the trolley 1311 can move on the support surface SS using the power of the motor 1312 driven under the control of the control device 14. That is, the trolley 1311 can self-move on the support surface SS using the power of the motor 1312.

[0095] In this way, the self-moving drive system 131 can move on the support surface SS. That is, as described above, since the support surface SS is a surface along the XY plane, the self-moving drive system 131 can move along at least one of the X-axis direction and the Y-axis direction. In addition, the "state of the self-moving drive system 131 moving on the support surface SS" mentioned here may also refer to the state of the self-moving drive system 131 moving relative to the support surface SS using the power generated by the self-moving drive system 131 itself.

[0096] The arm drive system 132 is mounted on the carriage 1311. Specifically, Figure 4 In the example shown, the arm drive system 132 is installed (i.e., fixed) on the upper surface of the carriage 1311. Therefore, when the carriage 1311 moves, the arm drive system 132 also moves. That is, the self-driving system 131 moves together with the arm drive system 132. Furthermore, the micro-motion drive system 133 is connected to the arm drive system 132. Specifically, the micro-motion drive system 133 is installed (i.e., fixed) on the arm drive system 132. Therefore, when the carriage 1311 moves, the micro-motion drive system 133

[0097] Also moves. That is, the self-moving drive system 131 moves together with the micro-motion drive system 133. Furthermore, the processing head 12 is connected to the micro-motion drive system 133. Specifically, the processing head 12 is mounted (that is, fixed) on the micro-motion drive system 133. Therefore, when the trolley 1311 moves, the processing head 12 also moves. That is, the self-moving drive system 131 moves together with the processing head 12. Therefore, the self-moving drive system 131 can function as a mobile device that moves the processing head 12 by self-movement. The self-moving drive system 131 can function as a mobile device that changes the position of the processing head 12.

[0098] (1-2-2-2) Structure of the Arm Driving System 132

[0099] Then, refer to Figure 4 The structure of the arm driving system 132 will be described. Figure 4 It is a cross-sectional view showing the structure of the arm driving system 132 .

[0100] like Figure 4 As shown, the arm drive system 132 includes a base 1320. The base 1320 is connected to the self-moving drive system 131 (specifically, the trolley 1311). That is, the base 1320 is installed (that is, fixed) on the trolley 1311. One end of the robot arm 1321 is installed on the base 1320. The base 1320 supports the robot arm 1321.

[0101] The robot arm 1321 includes a plurality of arm members 1322. The plurality of arm members 1322 are movably connected via at least one joint member 1323. The robot arm 1321 may be a manipulator having more than three axes of freedom. Therefore, the arm drive system 132 may function as a robot having a so-called vertical multi-joint structure. In addition, the arm drive system 132 is not limited to a robot having a vertical multi-joint structure. For example, the arm drive system 132 may also function as a polar coordinate robot, a cylindrical coordinate robot, a rectangular coordinate robot, or a parallel link robot having a horizontal multi-joint structure.

[0102] The joint member 1323 may connect at least two arm members 1322 so that the other arm member 1322 connected to the joint member 1323 can rotate around a driving axis (e.g., at least one of a rotation axis around the X-axis, a rotation axis around the Y-axis, and a rotation axis around the Z-axis) relative to one of the arm members 1322 connected to the joint member 1323. The joint member 1323 may also connect at least two arm members so that the other arm member 1322 connected to the joint member 1323 can move along a driving axis (e.g., at least one of a movement axis along the X-axis, a movement axis along the Y-axis, and a movement axis along the Z-axis) relative to one of the arm members 1322 connected to the joint member 1323.

[0103] The two arm members 1322 connected via the joint member 1323 are moved by the actuators 1324 corresponding to the respective joints. Figure 4 An example is shown in which the arm driving system 132 includes four actuators 1324 corresponding to the four joint members 1323. As a result, at least one arm member 1322 moves. Therefore, at least one arm member 1322 can move relative to the workpiece W. That is, at least one arm member 1322 can move so that the relative positional relationship between at least one arm member 1322 and the workpiece W changes.

[0104] The robot arm 1321 is connected to a micro-drive system 133. Specifically, one of the arm members 1322 located farthest from the base 1320 is connected to (i.e.,

[0105] The micro-drive system 133 is installed or fixed thereto. In the following, for the sake of convenience, an arm member 1322 on which the micro-drive system 133 is installed is referred to as a front arm member 1325. The micro-drive system 133 can be directly installed on the front arm member 1325, or can be indirectly installed on the front arm member 1325 via other members. The front arm member 1325 can also be referred to as a connecting member for connecting the micro-drive system 133.

[0106] When the front arm member 1325 is moved by the actuator 1324, the front arm member 1325 moves relative to the base 1320. That is, when the front arm member 1325 moves, the relative position of the base 1320 and the front arm member 1325 changes. As a result, the micro-drive system 133 installed on the front arm member 1325 also moves. Therefore, the arm drive system 132 can move the micro-drive system 133. Specifically, the arm drive system 132 can move the micro-drive system 133 relative to the workpiece W. The arm drive system 132 can move the micro-drive system 133 so that the relative position relationship between the micro-drive system 133 and the workpiece W changes. In addition, when the micro-drive system 133 moves, the processing head 12 installed on the micro-drive system 133 also moves. Therefore, the arm drive system 132 can function as a moving device that moves the processing head 12. The arm drive system 132 can function as a moving device that changes the position of the processing head 12. Here, the front end arm member 1325 of the robot arm 1321 may also be referred to as a movable portion.

[0107] (1-2-2-3) Structure of micro-drive system 133

[0108] Then, refer to Figure 5 The structure of the micro-drive system 133 will be described. Figure 5 It is a cross-sectional view showing the structure of the micro-drive system 133 .

[0109] like Figure 5 As shown, the micro-motion driving system 133 includes a supporting member 1331 , a supporting member 1332 , an air spring 1333 , a damper member 1334 , and a driving member 1335 .

[0110] The support member 1331 is connected to the arm driving system 132. Specifically, the support member 1331 is mounted (ie, fixed) to the front end arm member 1325 of the arm driving system 132. The support member 1332 is mounted on the machining head 12.

[0111] The support member 1331 and the support member 1332 are combined (in other words, linked or connected) via the air spring 1333, the damper member 1334, and the drive member 1335. That is, the air spring 1333, the damper member 1334, and the drive member 1335 are respectively installed on the support member 1331 and the support member 1332 in a manner that combines the support member 1331 with the support member 1332. Since the arm drive system 132 is installed on the support member 1331 and the processing head 12 is installed on the support member 1332, it can also be regarded that the air spring 1333, the damper member 1334, and the drive member 1335 are respectively installed on the support member 1331 and the support member 1332 in a manner that substantially combines the arm drive system 132 with the processing head 12.

[0112] The air spring 1333, under the control of the control device 14, applies elastic force due to the pressure of gas (for example, air) to at least one of the support members 1331 and 1332. The air spring 1333, under the control of the control device 14, applies elastic force due to the pressure of gas to at least one of the arm drive system 132 and the processing head 12 via at least one of the support members 1331 and 1332. In particular, the air spring 1333 can apply elastic force due to the pressure of gas to at least one of the arm drive system 132 and the processing head 12 along the direction in which the support members 1331 and 1332 are arranged (for example, the Z-axis direction).

[0113] At least one of them imparts elastic force caused by the pressure of the gas.

[0114] In order to impart elastic force due to the pressure of the gas, gas is supplied from the gas supply device 13361 to the air spring 1333 via the pipe 13362 and the valve 13363. The control device 14 controls at least one of the gas supply device 13361 and the valve 13363 based on the measurement result of the pressure gauge 1336 that measures the pressure of the gas in the air spring 1333.

[0115] The air spring 1333 may also support the weight of the processing head 12 by using elastic force under the control of the control device 14. In this case, the air spring 1333 may function as a deadweight eliminator for eliminating the deadweight of the processing head 12. The air spring 1333 may also reduce (in other words, attenuate) the vibration transmitted between the arm drive system 132 and the processing head 12 via the micro-drive system 133 by using elastic force under the control of the control device 14.

[0116] The damper member 1334 applies elastic force caused by a factor different from the pressure of air to at least one of the support member 1331 and the support member 1332. The damper member 1334 applies elastic force caused by a factor different from the pressure of air to at least one of the arm drive system 132 and the processing head 12 via at least one of the support member 1331 and the support member 1332. In particular, the damper member 1334 can apply elastic force to at least one of the arm drive system 132 and the processing head 12 along the direction in which the support member 1331 and the support member 1332 are arranged (for example, the Z-axis direction).

[0117] The damper member 1334 may also support the weight of the machining head 12 by using elastic force, similarly to the air spring 1333. The damper member 1334 may also reduce the vibration transmitted between the arm drive system 132 and the machining head 12 via the micro-drive system 133 by using elastic force, similarly to the air spring 1333.

[0118] The damper member 1334 may be any member as long as it can impart elastic force. For example, the damper member 1334 may include a compression spring coil. For example, the damper member 1334 may also include a leaf spring.

[0119] The driving member 1335 can generate a driving force under the control of the control device 14. The driving member 1335 can impart the generated driving force to at least one of the support member 1331 and the support member 1332. The driving member 1335 can impart the generated driving force to at least one of the arm driving system 132 and the processing head 12 via at least one of the support member 1331 and the support member 1332. The driving member 1335 can have any structure as long as it can generate a driving force. For example, the driving member 1335 can have a structure that can generate an electric driving force. For example, the driving member 1335 can also have a structure that can generate a magnetic driving force. As an example, Figure 5 An example is shown in which the driving member 1335 is a voice coil motor (VCM: Voice Coil Motor) capable of generating an electric driving force.

[0120] The driving member 1335 can move at least one of the support member 1331 and the support member 1332 by using a driving force under the control of the control device 14. The driving member 1335 can also move at least one of the arm driving system 132 and the processing head 12 by using a driving force to move at least one of the support member 1331 and the support member 1332 under the control of the control device 14. In this case, the driving member 1335 can change the relative position of the arm driving system 132 and the processing head 12 by using a driving force to move at least one of the arm driving system 132 and the processing head 12.

[0121] The driving member 1335 can also change the relative position of the arm driving system 132 and the processing head 12 based on the measurement result of the position measuring device 1337 included in the micro-drive system 133 under the control of the control device 14. The position measuring device 1337 measures the relative position of the arm driving system 132 and the processing head 12. For example, the position measuring device 1337 may be an encoder including a detection unit 13371 installed on the support member 1331 and a scale unit 13372 installed on the support member 1332. The measurement result of the position measuring device 1337 includes information related to the relative position of the support member 1331 and the support member 1332. Since the arm driving system 132 is installed on the support member 1331 and the processing head 12 is installed on the support member 1332, the information related to the relative position of the support member 1331 and the processing head 12 includes information related to the relative position of the arm driving system 132 and the processing head 12. Therefore, the control device 14 can appropriately determine the relative position between the arm driving system 132 and the machining head 12. As a result, the control device 14 can appropriately change the relative position between the arm driving system 132 and the machining head 12 based on the measurement result of the position measuring device 1337.

[0122] The driving member 1335 can also move the machining head 12 relative to the workpiece W by changing the relative position of the arm driving system 132 and the machining head 12 (typically, moving the machining head 12 relative to the arm driving system 132) under the control of the control device 14. The driving member 1335 can move the machining head 12 (i.e., drive the machining head 12) by changing the relative position relationship between the machining head 12 and the workpiece W.

[0123] Here, since the support member 1332 on which the processing head 12 is mounted is moved by the driving member 1335, the support member 1332 may also be referred to as a movable portion. In addition, since the micro-motion drive system 133 is moved by the arm drive system 132, at least a part of the components constituting the micro-motion drive system 133 may also be referred to as a movable portion.

[0124] The driving member 1335 can also reduce the vibration transmitted between the arm driving system 132 and the processing head 12 via the micro-drive system 133 by changing the relative position of the arm driving system 132 and the processing head 12 by using the driving force under the control of the control device 14. A device that actively reduces vibration using elastic members such as air springs 1333 and the driving member 1335 can also be called an active vibration isolation device. Therefore, the micro-drive system 133 can also be called an active vibration isolation device. An active vibration isolation device can also be called an active vibration isolation system (AVIS: Active Vibration Isolation System).

[0125] (1-2-2-4) Relationship between the Self-Moving Drive System 131, the Arm Drive System 132, and the Micro-Moving Drive System 133

[0126] The arm drive system 132 moves the processing head 12 with a smaller movement stroke than the self-moving drive system 131. In other words, the self-moving drive system 131 moves the processing head 12 with a larger movement stroke than the arm drive system 132. In addition, the movement stroke may also refer to the maximum movement amount in one direction. However, the arm drive system 132 may also move the processing head 12 with the same or larger movement stroke as the self-moving drive system 131.

[0127] On the other hand, the arm drive system 132 has a higher moving accuracy (in other words, moving resolution) for the machining head 12 than the self-moving drive system 131.

[0128] The movement accuracy of the processing head 12 by the drive system 131 is lower than the movement accuracy of the processing head 12 by the arm drive system 132. In addition, the movement accuracy (movement resolution) may also refer to the limit value of the fineness of the movement (for example, the minimum movement amount). However, the movement accuracy of the processing head 12 by the arm drive system 132 may be the same as the movement accuracy of the processing head 12 by the self-movement drive system 131, or may be lower than it.

[0129] The fine drive system 133 moves the processing head 12 with a smaller movement stroke than the arm drive system 132. In other words, the arm drive system 132 moves the processing head 12 with a larger movement stroke than the fine drive system 133. However, the fine drive system 133 may also move the processing head 12 with the same or larger movement stroke as the arm drive system 132.

[0130] On the other hand, the movement accuracy of the processing head 12 by the micro-drive system 133 is higher than the movement accuracy of the processing head 12 by the arm drive system 132. In other words, the movement accuracy of the processing head 12 by the arm drive system 132 is lower than the movement accuracy of the processing head 12 by the micro-drive system 133. However, the movement accuracy of the processing head 12 by the micro-drive system 133 may be the same as the movement accuracy of the processing head 12 by the arm drive system 132, or may be lower than the movement accuracy of the processing head 12 by the arm drive system 132.

[0131] In the above case, the processing system SYS may also use the self-moving drive system 131 to align the processing head 12 with respect to the workpiece W. In parallel with or after the alignment of the processing head 12 by the self-moving drive system 131, the processing system SYS may also use the arm drive system 132 to align the processing head 12 with respect to the workpiece W with a finer or higher accuracy than the self-moving drive system 131. In parallel with or after the alignment of the processing head 12 by the arm drive system 132, the processing system SYS may also use the micro-drive system 133 to align the processing head 12 with respect to the workpiece W with a finer or higher accuracy than the arm drive system 132. Alternatively, the processing system SYS may also use the micro-drive system 133 to align the processing head 12 with respect to the workpiece W in such a manner that the positional relationship between the workpiece W and the processing head 12 is maintained at a desired positional relationship (for example, the distance between the workpiece W and the processing head 12 is maintained constant).

[0132] Furthermore, since the machining head 12 is moved by the self-movement driving system 131 , the arm driving system 132 , and / or the micro-movement driving system 133 , the machining head 12 may also be referred to as a movable portion.

[0133] (1-3) Structure of the measuring device 2

[0134] Then, refer to Figure 6 The structure of the measuring device 2 in this embodiment will be described. Figure 6 It is a side view schematically showing the appearance of the measuring device 2 in this embodiment.

[0135] like Figure 6 As shown, the measuring device 2 can measure the workpiece W arranged on the support surface SS. In order to measure the workpiece W, as shown in FIG. Figure 6 and a block diagram showing the overall structure of the measuring device 2. Figure 7 As shown, the measuring device 2 includes a measuring head 22 , a head driving system 23 , and a control device 24 .

[0136] The measuring head 22 measures the workpiece W. For example, the measuring head 22 can measure the position of the workpiece W. For example, the measuring head 22 can also measure the shape of the workpiece W (for example, a three-dimensional shape).

[0137] The measuring head 22 may have any structure as long as it can measure the workpiece W. For example, the measuring head 22 may be a non-contact measuring head that can measure the workpiece W without contacting the workpiece W.

[0138] For example, the measuring head 22 may be a contact type measuring device that can measure the workpiece W by contacting the workpiece W. As an example of a non-contact type measuring device, an optical type measuring device that optically measures the workpiece W may be cited. As an example of a contact type measuring device, a probe type measuring device that measures the workpiece W by bringing a probe into contact with the workpiece W may be cited.

[0139] As an example of an optical measuring device, a measuring device that measures the workpiece W by photographing the workpiece W (for example, an imaging device such as a camera). As an example of an optical measuring device, a measuring device using a pattern projection method can be listed. A measuring device using a pattern projection method can measure the workpiece W by projecting slit light onto the surface of the workpiece W and measuring the shape of the projected slit light. As an example of an optical measuring device, a measuring device using a pattern projection method can be listed. A measuring device using a pattern projection method can also measure the workpiece W by projecting pattern light onto the surface of the workpiece W and measuring the shape of the projected pattern light. As an example of an optical measuring device, a measuring device using an interference method can be listed. A measuring device using an interference method can measure the workpiece W by measuring the interference pattern of the object light that has passed through the workpiece W and the reference light that has not passed through the workpiece W. As an example of an optical measuring device, a measuring device using a time of flight method can be listed. The measuring device using the time-of-flight method can measure the workpiece W by performing the following operations at multiple positions on the workpiece W, that is, projecting measurement light onto the surface of the workpiece W and measuring the distance from the measuring device to the workpiece W based on the time until the projected measurement light returns from the workpiece W to the measuring device. In addition, as an example of an optical measuring device, there can be cited a measuring device that uses at least one of a moire topography method (specifically, a grating irradiation method or a grating projection method), a holographic interferometry method, an autocollimation method, a stereo method, an astigmatism method, a critical angle method, and a knife edge method.

[0140] The head drive system 23 moves the measuring head 22. Therefore, the head drive system 23 may also be referred to as a moving device. Specifically, the head drive system 23 moves the measuring head 22 relative to the workpiece W. In order to move the measuring head 22, the head drive system 23 includes a self-moving drive system 231, an arm drive system 232, and a micro-movement drive system 233. However, the head drive system 23 may not include at least one of the self-moving drive system 231, the arm drive system 232, and the micro-movement drive system 233.

[0141] The structure of the self-moving drive system 231 included in the measuring device 2 may be the same as the structure of the self-moving drive system 131 included in the processing device 1. Specifically, the cross-sectional view showing the structure of the self-moving drive system 231 is Figure 8 As shown, the self-propelled drive system 231 includes a trolley 2311 and a motor 2312. The features of the trolley 2311 can be Figure 4 The features of the trolley 1311 shown are the same. The features of the motor 2312 may be the same as Figure 4 Therefore, the description of the self-propelled drive system 131 described above can be transferred to the description of the self-propelled drive system 231 by replacing the words of the carriage 1311, the motor 2312 and the processing head 12 with the words of the carriage 2311, the motor 2312 and the measuring head 22, respectively. Therefore, the detailed description of the self-propelled drive system 231 is omitted.

[0142] The structure of the arm drive system 232 included in the measuring device 2 can be similar to that included in the processing device 1.

[0143] The structure of the arm drive system 132 is the same. Specifically, the cross-sectional view showing the structure of the arm drive system 232 is Figure 8 As shown, the arm driving system 232 includes a base 2320 and a robot arm 2321 (specifically, a plurality of arm components 2322 including a front end arm component 2325, a plurality of joint components 2323, and a plurality of actuators 2324). The features of the base 2320 can be Figure 4 The features of the base 1320 shown are the same as those of the robot arm 2321. Figure 4 The features of the robot arm 1321 shown are the same. The features of the arm member 2322 can be the same as Figure 4 The features of the arm member 1322 shown are the same. The features of the joint member 2323 can be the same as Figure 4 The features of the joint member 1323 shown are the same. The features of the actuator 2324 can be the same as Figure 4 The features of the front end arm member 2325 may also be the same as those of the actuator 1324 shown. Figure 4Therefore, the description of the arm drive system 132 described above can be transferred to the description of the arm drive system 232 by replacing the words of the base 1320, the robot arm 1321, the arm member 1322, the joint member 1323, the actuator 1324, the front arm member 1325, the self-moving drive system 131, the micro-movement drive system 133 and the processing head 12 with the words of the base 2320, the robot arm 2321, the arm member 2322, the joint member 2323, the actuator 2324, the front arm member 2325, the self-moving drive system 231, the micro-movement drive system 233 and the measuring head 22, respectively. Therefore, the detailed description of the arm drive system 232 is omitted.

[0144] The structure of the micro-drive system 233 included in the measuring device 2 may be the same as the structure of the micro-drive system 133 included in the processing device 1. That is, the micro-drive system 233 may have a structure representing the structure of the micro-drive system 133. Figure 5 Therefore, the detailed description of the micro-drive system 233 is omitted.

[0145] The self-mobile drive system 231, the arm drive system 232 and the micro-motion drive system 233 respectively move the measuring head 22 along at least one of the X-axis direction, the Y-axis direction, the Z-axis direction, the θX direction, the θY direction and the θZ direction. Wherein, in the present embodiment, the self-mobile drive system 231 moves on the support surface SS. The support surface SS is typically a surface along the XY plane. Therefore, in the following description, the example in which the self-mobile drive system 231 can move the measuring head 22 along the X-axis direction and the Y-axis direction is described. Furthermore, in the following description, the example in which the arm drive system 232 can move the measuring head 22 along the X-axis direction, the Y-axis direction, the Z-axis direction, the θX direction, the θY direction and the θZ direction is described. In addition, the situation in which the measuring head 22 is moved along at least one of the θX direction, the θY direction and the θZ direction can also be regarded as equivalent to the situation in which the posture of the measuring head 22 around at least one of the X-axis, the Y-axis and the Z-axis is changed. Alternatively, moving the measuring head 22 in at least one of the θX, θY, and θZ directions may be considered equivalent to rotating the measuring head 22 around at least one of the X, Y, and Z axes.

[0146] When the measuring head 22 moves, the positional relationship between the measuring head 22 and the workpiece W changes. When the positional relationship between the workpiece W and the measuring head 22 changes, the measurement area of ​​the measuring head 22 moves on the workpiece W. Therefore, the case where the measuring head 22 is moved is equivalent to the case where the measurement area on the workpiece W is moved. In addition, since the measuring head 22 is moved by the self-moving drive system 231, the arm drive system 232 and / or the micro-drive system 233, the measuring head 22 can also be called a movable part.

[0147] The control device 24 controls the operation of the measuring device 2. For example, the control device 24 may control at least one of the measuring head 22 and the head driving system 23 included in the measuring device 2 based on the measurement control information sent from the control server 4, so that the workpiece W is measured in a desired measurement form. Furthermore, the control device 24 may send measurement result information related to the measurement result of the workpiece W by the measuring device 2 to the control server 4.

[0148] The control device 24 may include, for example, a computing device and a storage device. The computing device may include, for example, at least one of a CPU and a GPU. The storage device may include, for example, a memory. The control device 24 functions as a device for controlling the action of the measuring device 2 by executing a computer program through the computing device. The computer program is a computer program for causing the computing device to perform (i.e., execute) the later-described action that the control device 24 should perform. That is, the computer program is a computer program for causing the control device 24 to function so that the measuring device 2 performs the later-described action. The computer program executed by the computing device may be recorded in a storage device (i.e., a recording medium) included in the control device 24, or in any storage medium (e.g., a hard disk or a semiconductor memory) built into the control device 24 or externally connected to the control device 24. Alternatively, the computing device may also download the computer program to be executed from a device outside the control device 24 via a network interface.

[0149] The control device 24 may also control the measurement mode of the workpiece W by the measuring head 22. The measurement mode may include, for example, at least one of the measurement position and the measurement time. The control device 24 may also control the movement mode of the measuring head 22 by the head driving system 23. The movement mode may include, for example, at least one of the movement amount, movement speed, movement direction, and movement timing (movement period).

[0150] The control device 24 may not be arranged inside the measuring device 2. For example, the control device 24 may be arranged outside the measuring device 2 as a server or the like. In the above case, the control device 24 and the measuring device 2 may be connected via a wired and / or wireless network (or a data bus and / or a communication line). As a wired network, for example, a network using an interface of a serial bus method represented by at least one of IEEE1394, RS-232x, RS-422, RS-423, RS-485 and USB may be used. As a wired network, a network using an interface of a parallel bus method may also be used. As a wired network, a network using an interface compliant with Ethernet (registered trademark) represented by at least one of 10BASE-T, 100BASE-TX and 1000BASE-T may also be used. As a wireless network, a network using radio waves may also be used. As an example of a network using radio waves, a network compliant with IEEE802.1x (for example, at least one of a wireless LAN and Bluetooth (registered trademark)) may be cited. As a wireless network, a network using infrared rays may also be used. As a wireless network, a network using optical communication may also be used. In the case described above, it may be configured such that the control device 24 and the measuring device 2 are capable of sending and receiving various information via the network. In addition, the control device 24 may be capable of sending information such as commands or control parameters to the measuring device 2 via the network. The measuring device 2 may include a receiving device, which receives information such as commands or control parameters from the control device 24 via the network. The measuring device 2 may include a sending device (i.e., an output device that outputs information to the control device 24) that sends information such as commands or control parameters to the control device 24 via the network. Alternatively, it may be that: in the measuring device 24, the control device 24 and the measuring device 2 are connected to each other via the network.

[0151] A first control device that performs a part of the processing performed by the control device 24 is provided inside the measuring device 2 , while a second control device that performs another part of the processing performed by the control device 24 is provided outside the measuring device 2 .

[0152] In the control device 24, a computing model that can be constructed by machine learning can be installed by executing a computer program by a computing device. As an example of a computing model that can be constructed by machine learning, a computing model including a neural network (so-called artificial intelligence (AI)) can be cited. In the case, the learning of the computing model can include the learning of the parameters of the neural network (for example, at least one of the weights and biases). The control device 24 can use the computing model to control the action of the measuring device 2. That is, the action of controlling the action of the measuring device 2 can include the action of using the computing model to control the action of the measuring device 2. In addition, in the control device 24, a computing model constructed by offline machine learning using teacher data can also be installed. In addition, the computing model installed in the control device 24 can be updated on the control device 24 by online machine learning. Alternatively, the control device 24 can also control the action of the measuring device 2 using a computing model installed in a device outside the control device 24 (that is, a computing model installed in a device outside the measuring device 2) on the basis of or instead of the computing model installed in the control device 24.

[0153] In addition, as a recording medium for recording the computer program executed by the control device 24, at least one of CD-ROM, CD-R, CD-RW or flexible disk, MO, DVD-ROM, DVD-RAM, DVD-R, DVD+R, DVD-RW, DVD+RW and Blu-ray (registered trademark) optical disks, magnetic media such as magnetic tapes, optical magnetic disks, semiconductor memories such as USB memories, and other arbitrary media capable of storing programs can be used. The recording medium may also include a device capable of recording a computer program (for example, a general-purpose device or a dedicated device in which a computer program is installed in a state that can be executed in the form of at least one of software and firmware). Furthermore, each process or function included in the computer program may be implemented by a logic processing block implemented in the control device 24 by the control device 24 (i.e., computer) executing the computer program, or by hardware such as a predetermined gate array (FPGA, ASIC) included in the control device 24, or by a mixed existence of a logic processing block and a local hardware module that implements a part of the hardware.

[0154] In addition, the measuring device 2 may include a power source. For example, the measuring device 2 may include a power source configured on the trolley 2311 of the self-moving drive system 231. The measuring device 2 may operate using power supplied from the power source. For example, the measuring unit 221 may measure the workpiece W using power supplied from the power source. Processing light EL may also be generated. For example, the head drive system 23 may move the measuring head 22 using power supplied from the power source. The power source may be rechargeable. For example, the power source may be capable of contactless charging (wireless charging).

[0155] (1-4) Configuration of Position Measurement Device 3

[0156] Next, the structure of the position measuring device 3 will be described. As described above, the position measuring device 3 can measure the position of at least one of the workpiece W, the processing device 1, and the measuring device 2. The position measuring device 3 can measure the position of at least one of the workpiece W, the processing device 1, and the measuring device 2.

[0157] location, it can have any structure.

[0158] In the present embodiment, an example is described in which the position measuring device 3 uses the measuring light ML to measure the position of the measuring object including at least one of the workpiece W, the processing device 1, and the measuring device 2. In this case, the position measuring device 3 can measure the position of the measuring object by irradiating the measuring light ML to the measuring object and detecting the return light of the measuring light ML from the measuring object. The return light of the measuring light ML from the measuring object can include at least one of the reflected light of the measuring light ML generated by the measuring object and the scattered light of the measuring light ML generated by the measuring object.

[0159] In order to irradiate the measuring light ML to the measuring object, the position measuring device 3 may be arranged at a position separated from the measuring object. That is, the position measuring device 3 may be arranged at a position separated from at least one of the workpiece W, the processing device 1, and the measuring device 2. In this case, the position measuring device 3 may irradiate the measuring light ML to the measuring object at a position separated from the measuring object. The position measuring device 3 may also detect the return light of the measuring light ML from the measuring object at a position separated from the measuring object.

[0160] The position measuring device 3 may irradiate the measuring light ML toward the desired measuring target portion of the measuring target object and detect the measuring light ML from the desired measuring target portion of the measuring target object. When a reflector capable of reflecting (typically, capable of retro-reflecting) the measuring light ML is attached to the measuring target portion, the position measuring device 3 may irradiate the measuring light ML toward the reflector and detect the measuring light ML from the reflector. In either case, the position measuring device 3 can measure the position of the desired measuring target portion of the measuring target object.

[0161] The position measuring device 3 may irradiate the measuring light ML toward each of the plurality of measuring target portions of the measuring object and detect the measuring light ML from the plurality of measuring target portions of the measuring object. In this case, the position measuring device 3 can measure the positions of the plurality of measuring target portions of the measuring object.

[0162] As an example of the position measuring device 3 that uses the measuring light ML to measure the position of the measuring object, there can be cited a measuring device including a laser radar system described in the specification of U.S. Patent Application Publication No. 2012 / 188557 (for example, a measuring device using frequency modulated measuring light). Fig. 9 and Fig.10 , an example of a position measuring device 3 including a laser radar system described in the specification of U.S. Patent Application Publication No. 2012 / 188557 is described. Fig. 9 It is a front view showing the appearance of the position measuring device 3 . Fig.10 It is a block diagram showing the structure of the position measuring device 3.

[0163] like Fig. 9 As shown, the position measuring device 3 includes a base 310 and a housing 320. The base 310 is a table that supports the housing 320. The base 310 can be arranged on a support surface SS for arranging the workpiece W, the processing device 1, and the measuring device 2. The base 310 can be arranged on the support surface SS via a supporting member not shown in the figure, or can be arranged directly on the support surface SS. The housing 320 is a housing for accommodating the workpiece W, the processing device 1, and the measuring device 2. Fig.10 The housing 320 may be rotatable about a predetermined rotation axis. Fig. 9 In the example shown, the housing 320 is rotatable about an axis of rotation along the Y-axis and about an axis of rotation along the Z-axis.

[0164] like Fig.10 As shown, the optical assembly 330 includes a measuring light source 331, a pointing beam source 332, a beam splitter 333, a beam splitter 334, a beam splitter 335, a reflector 336, an optical circuit 337, and a detection

[0165] Device 338.

[0166] The measuring light source 331 generates measuring light ML. A part of the measuring light ML generated by the measuring light source 331 is emitted from an emission port 321 formed in the housing 320 via the beam splitter 334, the beam splitter 335, and the reflector 336. The measuring light ML emitted from the emission port 321 is incident on the measuring object. When the housing 320 rotates around the rotation axis as described above, the emission direction of the measuring light ML from the position measuring device 3 changes. Therefore, the position measuring device 3 can rotate the housing 320 so that the measuring light ML is incident on a desired measuring object portion of the measuring object. At least a part of the measuring light ML reflected by the measuring object (hereinafter referred to as "return light RL") is incident on the optical assembly 330 via the emission port 321. The return light RL incident on the optical assembly 330 is incident on the detector 338 via the reflector 336 and the beam splitter 335. On the other hand, another part of the measurement light ML generated by the measurement light source 331 is incident on the detector 338 via the beam splitter 334 and the optical circuit 337 described in the specification of U.S. Patent Application Publication No. 2012 / 188557 (or U.S. Patent No. 4,733,606, etc.). The position measurement device 3 transmits the detection result of the detector 338 to the control server 4 as position information indicating the measurement result of the position of at least one of the workpiece W, the processing device 1, and the measuring device 2.

[0167] The control server 4 calculates the position of the object to be measured based on the detection results of the measuring light ML and the return light RL by the detector 338. For example, the control server 4 calculates the position of the object to be measured based on the detection results of the measuring light ML and the return light RL by the detector 338 using optical heterodyne detection described in U.S. Patent Application Publication No. 2012 / 188557 (or U.S. Patent No. 4,733,606, etc.).

[0168] The directional beam source 332 generates a directional beam B. The directional beam B is used to identify the position on the measurement object toward which the measurement light ML is directed. The directional beam B may include visible light. The directional beam B generated by the directional beam source 332 is emitted from the emission port 321 formed on the housing 320 via the beam splitter 333, the beam splitter 334, the beam splitter 335, and the reflector 336. The directional beam B emitted from the emission port 321 is incident on the measurement object. However, the optical assembly 330 may not irradiate the measurement object with the directional beam B.

[0169] In addition, the position measuring device 3 is not limited to a measuring device including a laser radar system described in the specification of U.S. Patent Application Publication No. 2012 / 188557. For example, the position measuring device 3 may be a measuring device including a laser coordinate measuring device described in U.S. Patent No. 7,800,758 (for example, a measuring device using intensity-modulated measuring light). For example, the position measuring device 3 may be a measuring device including an absolute distance meter described in U.S. Patent No. 6,847,436 (for example, a measuring device using intensity-modulated measuring light).

[0170] (1-5) Structure of Control Server 4

[0171] Then, refer to Fig.11 The control server 4 in this embodiment will be described. Fig.11 This is a block diagram showing the structure of the control server 4 in this embodiment.

[0172] like Fig.11 As shown, the control server 4 may include a computing device 41, a storage device 42, a communication device 43, an input device 44, and an output device 45.

[0173] The communication device 43 , the input device 44 , and the output device 45 may be connected via a data bus 46 .

[0174] The computing device 41 includes, for example, at least one of a CPU and a GPU. The computing device 41 reads a computer program. For example, the computing device 41 can read a computer program stored in the storage device 42. For example, the computing device 41 can use a recording medium reading device not shown in the figure to read a computer program stored in a non-temporary recording medium that can be read by a computer. The computing device 41 can also obtain (i.e., download or read) a computer program from an unshown device configured outside the control server 4 via the communication device 43. The computing device 41 executes the read computer program. As a result, a logical function block for executing the action that the control server 4 should perform is implemented in the computing device 41. That is, the computing device 41 can function as a controller used to implement a logical function block for executing the action that the control server 4 should perform.

[0175] In the computing device 41, a computing model that can be constructed by machine learning can be installed by executing a computer program in the computing device 41. As an example of a computing model that can be constructed by machine learning, a computing model including a neural network (so-called artificial intelligence (AI)) can be cited. In the case, the learning of the computing model can include the learning of the parameters of the neural network (for example, at least one of the weights and biases). The computing device 41 can use the computing model to perform the action that the control server 4 should perform. In addition, in the computing device 41, a computing model constructed by offline machine learning using teacher data can also be installed. In addition, the computing model installed in the computing device 41 can be updated on the computing device 41 through online machine learning. Alternatively, the computing device 41 can also use a computing model installed in a device outside the computing device 41 (that is, a computing model installed in a device outside the control server 4) to perform the action that the control server 4 should perform, based on or instead of the computing model installed in the computing device 41.

[0176] Fig.11 An example of a logical function block implemented in the computing device 41 is shown in FIG. Fig.11 As shown, an information acquisition unit 411 and a control information generation unit 412 are implemented in the computing device 41. The information acquisition unit 411 can receive (i.e., acquire) processing progress information from the processing device 1 using the communication device 43. The information acquisition unit 411 can also receive (i.e., acquire) measurement result information from the measuring device 2 using the communication device 43. The information acquisition unit 411 can also receive (i.e., acquire) position information from the position measuring device 3 using the communication device 43. The control information generation unit 412 can generate processing control information and measurement control information based on the position information.

[0177] The storage device 42 can store desired data. For example, the storage device 42 can temporarily store a computer program to be executed by the computing device 41. The storage device 42 can also temporarily store data temporarily used by the computing device 41 when the computing device 41 executes the computer program. The storage device 42 can also store data that the control server 4 saves for a long time. In addition, the storage device 42 can include at least one of a random access memory (RAM), a read only memory (ROM), a hard disk device, a magneto-optical device, a solid state drive (SSD), and a disk array device. That is, the storage device 42 can include a non-temporary recording medium.

[0178] In this embodiment, the storage device 42 can store the processing information DB 421 and the measurement information DB

[0179] The processing information DB 421 is a database for storing information related to the processing device 1. The measurement information DB 422 is a database for storing information related to the measurement device 2.

[0180] An example of the data structure of the processing information DB 421 is shown in Fig.12 In. Fig.12 As shown, the processing information DB 421 includes a plurality of processing information records 4210. Each processing information record 4210 may include device identification information 4211, time information 4212, and processing device information 4213. The device identification information 4211 is information for inherently identifying the processing device 1. The time information 4212 is information indicating the time corresponding to the processing device information 4213. The processing device information 4213 is information related to the processing device 1. For example, the processing device information 4213 may include device position information indicating the position of the processing device 1 at the time indicated by the time information 4212. The processing device information 4213 may also include processing progress information acquired by the information acquisition unit 411. The processing progress information may include information related to the progress of the processing action at the time indicated by the time information 4212. That is, the processing progress information may include information related to the ratio (that is, the progress rate) of the process completed by the processing device 1 to the overall process of the processing action to be performed by the processing device 1. The processing progress information may also include information on a processing completed area of ​​the workpiece W where processing by the processing device 1 has been completed. The processing progress information may also include information on a processing uncompleted area of ​​the workpiece W where processing by the processing device 1 has not been completed. In the case where the processing device 1 includes a power supply, the processing device information 4213 may also include information on the time during which the processing device 1 can operate using the power stored in the power supply (i.e., the remaining amount of the power supply).

[0181] In addition to the processing progress information, the information acquisition unit 411 may also receive (ie, acquire) information required for constructing the processing information DB 421 (eg, at least one of the device identification information 4211 , the time information 4212 , and the processing device information 4213 ) from the processing device 1 .

[0182] An example of the data structure of the measurement information DB 422 is shown in Fig.13 In. Fig.13As shown, the measurement information DB 421 includes a plurality of measurement information records 4220. Each measurement information record 4220 may include device identification information 4221, time information 4222, and measurement device information 4223. The device identification information 4221 is information for inherently identifying the measurement device 2. The time information 4222 is information indicating the time corresponding to the measurement device information 4223. The measurement device information 4223 is information related to the measurement device 2. For example, the measurement device information 4223 may include measurement result information indicating the measurement result obtained by the measurement device 2 at the time indicated by the time information 4222 (i.e., the measurement result information acquired by the information acquisition unit 411). The measurement device information 4223 may also include measurement progress information. The measurement progress information may include information related to the progress of the measurement action at the time indicated by the time information 4222. That is, the measurement progress information may include information related to the ratio (i.e., the progress rate) of the process completed by the measurement device 2 to the overall process of the measurement action to be performed by the measurement device 2. The measurement progress information may also include information about a measurement completed area of ​​the workpiece W where measurement by the measuring device 2 has been completed. The measurement progress information may also include information about a measurement uncompleted area of ​​the workpiece W where measurement by the measuring device 2 has not been completed. When the measuring device 2 includes a power source, the measuring device information 4223 may also include information about the measurement of the workpiece W by the measuring device 2 using the power stored in the power source.

[0183] Information about the time during which the operation can be performed based on the power in the power source (i.e., the remaining amount of the power source).

[0184] In addition to the measurement result information, the information acquisition unit 411 may also receive (ie, acquire) information required for constructing the measurement information DB 422 (eg, at least one of the device identification information 4221 , the time information 4222 , and the measurement device information 4223 ) from the measurement device 2 .

[0185] The storage device 42 can store the processing information DB 421 having any data format (in other words, any file format). For example, the storage device 42 can store Fig.12 Similarly, the storage device 42 may store a measurement information DB 422 having an arbitrary data format (in other words, an arbitrary file format). For example, the storage device 42 may store a processing information DB 421 having a table format (file) as shown. Fig.13 The measurement information DB 422 is a table-formatted data (file).

[0186] Return again Fig.11 In the embodiment, the communication device 43 can communicate with the processing device 1 , the measuring device 2 , and the position measuring device 3 respectively via the communication network.

[0187] The input device 44 is a device that receives input of information to the control server 4 from outside the control server 4. For example, the input device 44 may include an operating device (for example, at least one of a keyboard, a mouse, and a touch screen) that can be operated by an operator (for example, a user of the processing system SYS). For example, the input device 44 may include a reading device that can read information recorded in the form of data in a recording medium that can be externally connected to the control server 4. For example, the input device 44 may also include a receiving device that can receive information sent to the control server 4 in the form of data by a device outside the control server 4 via a communication network.

[0188] The output device 45 is a device for outputting information to the outside of the control server 4. For example, the output device 45 can output information as an image. That is, the output device 45 can include a display device (so-called display) that can display an image representing the information to be output. For example, the output device 45 can also output information as sound. That is, the output device 45 can include an audio device (so-called speaker) that can output sound. For example, the output device 45 can also output information on paper. That is, the output device 45 can include a printing device (so-called printer) that can print the desired information on paper.

[0189] The output device 45 may output (eg, display) information stored in at least one of the processing information DB 421 and the measurement information DB 422. For example, the output device 45 may display a table (eg, Fig.12 For example, the output device 45 may also display a table representing information stored in the measurement information DB 422 (for example, Fig.13 shown in the table).

[0190] Alternatively, the control server 4 may analyze the information stored in at least one of the processing information DB 421 and the measurement information DB 422, and the output device 45 may output (e.g., display) the analysis result. For example, the output device 45 may display the analysis result in association with the workpiece W. For example, the output device 45 may display the analysis result in a display format in which the analysis result is associated with the workpiece W (e.g., a display format different from the display format using the table). As an example, the control server 4 may analyze the processing progress status contained in the processing information DB 421, and the output device 45 may display each part of the display object (object) in a manner that simulates the workpiece W (e.g., an airplane).

[0191] The workpiece W and the analysis result are displayed in a display format in which the progress rate of the machining of each part is associated with each other. That is, the output device 45 can display a heat map showing the progress rate of the machining in association with the workpiece W. As a result, the user of the machining system SYS can intuitively recognize the progress rate of the machining of each part of the workpiece W.

[0192] (2) Operation of the machining system SYS

[0193] Next, a machining operation performed by the machining system SYS to machine the workpiece W and a measuring operation performed by the machining system SYS to measure the workpiece W will be described.

[0194] (2-1) Specific Example of Workpiece W as Target of Machining Operation and Measuring Operation

[0195] First, refer to Fig.14 A specific example of a workpiece W that is a target of the machining operation and the measuring operation will be described.

[0196] like Fig.14 As shown, the processing device 1 can process a workpiece W that is larger than the processing device 1. Fig.14 In the example shown, the processing device 1 processes a workpiece W corresponding to at least a portion of an aircraft. For example, the processing device 1 can process at least a portion of an aircraft to form the rib structure in at least a portion of the fuselage, main wing, horizontal tail and / or vertical tail of the aircraft. However, the processing device 1 can also process a workpiece W that is smaller than the processing device 1. The processing device 1 can also process a workpiece W of the same size as the processing device 1.

[0197] like Fig.14 As shown, the measuring device 2 can measure a workpiece W that is larger than the measuring device 2. Fig.14 In the example shown, the measuring device 2 measures a workpiece W corresponding to at least a portion of an aircraft. For example, the measuring device 2 can measure at least a portion of the fuselage, main wing, horizontal tail and / or vertical tail of the aircraft. However, the measuring device 2 can also process a workpiece W that is smaller than the measuring device 2. The measuring device 2 can also process a workpiece W of the same size as the measuring device 2.

[0198] In the following description, machining and measuring operations are described when the workpiece W is at least a part of an aircraft. However, even when the workpiece W is not at least a part of an aircraft, the machining system SYS can perform the machining and measuring operations described below.

[0199] (2-2) Processing action

[0200] Next, the machining operation performed by the machining system SYS will be described.

[0201] (2-2-1) Overall process of processing

[0202] First, refer to Fig.15 The overall process of processing actions is explained. Fig.15 This is a flowchart showing the overall flow of processing operations.

[0203] like Fig.15 As shown, first, the control information generation unit 412 of the control server 4 obtains model data representing a three-dimensional model of the workpiece W to be processed by the processing device 1 (step S411). That is, the control information generation unit 412 obtains model data, and the model data represents a three-dimensional model having a designed three-dimensional shape of the workpiece W to be processed by the processing device 1 (step S411). As an example of model data, Computer Aided Design (CAD) data can be listed. As an example of the file format of CAD data, at least one of Design Web Format (DWF), Drawing Exchange Format (DXF), Drawing (Drawing, DWG), Standard for the Exchange of Product Data (STEP) and Stereolithography (STL) can be listed.

[0204] The model data may be stored in the storage device 42 of the control server 4. In this case, the control information generation unit 412 may obtain the model data from the storage device 42. The model data may also be stored in a storage device included in the control device 14 of the processing device 1. In this case, the control information generation unit 412 may obtain the model data from the processing device 1. The model data may also be stored in an external device different from the control server 4 and the processing device 1. In this case, the control information generation unit 412 may obtain the model data from the external device.

[0205] In parallel with or immediately after the operation of step S411, the position measuring device 3 measures the positions of the workpiece W, the processing device 1, and the measuring device 2 (step S311). However, the position measuring device 3 may not necessarily measure the position of the measuring device 2 during the processing operation.

[0206] The position measuring device 3 may also measure the positions of a plurality of measurement target portions of the workpiece W. The measurement target portion may include a characteristic portion of the workpiece W. For example, in the case where the workpiece W is an aircraft, the measurement target portion may include at least one of a characteristic portion of the main wing (e.g., the front end), a characteristic portion of the horizontal tail (e.g., the front end), a characteristic portion of the vertical tail (e.g., the front end), and a characteristic portion of the fuselage (e.g., the front end). However, the position measuring device 3 may also measure the position of a single measurement target portion of the workpiece W. Furthermore, in the case where the position of the workpiece W can be changed, the position measuring device 3 may also set at least a part of a mechanism for changing the position of the workpiece W as the measurement target portion, and measure the position of the mechanism.

[0207] The position measuring device 3 may also measure the positions of a plurality of measurement target parts of the processing device 1. The measurement target part may include a characteristic part of the processing device 1. For example, the measurement target part may include at least one of a characteristic part of the processing head 12, a characteristic part of the arm driving system 132, and a characteristic part of the self-moving driving system 131. However, the position measuring device 3 may also measure the position of a single measurement target part of the processing device 1.

[0208] The position measuring device 3 may also measure the positions of a plurality of measurement target parts of the measuring device 2. The measurement target part may include a characteristic part of the measuring device 2. For example, the measurement target part may include at least one of a characteristic part of the measuring head 22, a characteristic part of the arm driving system 232, and a characteristic part of the self-moving driving system 231. However, the position measuring device 3 may also measure the position of a single measurement target part of the measuring device 2.

[0209] When the workpiece W is a large object such as an airplane, a portion of the workpiece W may be out of the range that the position measuring device 3 can measure (for example, the measurement field of the position measuring device 3). As a result, the position measuring device 3 may not be able to properly measure the positions of the plurality of measurement target portions of the workpiece W. Therefore, as shown in FIG. Fig.16 As shown, the machining system SYS may also include a plurality of position measuring devices 3. In this case, the first position measuring device 3 of the plurality of position measuring devices 3 may be aligned relative to the workpiece W so as to be able to

[0210] The position of the first measurement target portion of the workpiece W can be measured. On the other hand, a second position measuring device 3 different from the first position measuring device 3 among the plurality of position measuring devices 3 can also be aligned with respect to the workpiece W so as to be able to measure the position of the second measurement target portion of the workpiece W different from the first measurement target portion. As a result, the machining system SYS can appropriately measure the positions of the plurality of measurement target portions of the workpiece W using the plurality of position measuring devices 3.

[0211] As described above, the position measuring device 3 can measure the position of the workpiece W by irradiating the measuring light ML toward the reflector installed on the workpiece W as the measuring object. In the above case, the reflector can be installed at a predetermined position of the workpiece W. In particular, when the workpiece W is an object as large as an airplane, a plurality of reflectors can be installed at at least three predetermined locations of the workpiece W. As an example, the first reflector can be installed near the cockpit of the airplane (for example, near the front end of the airplane), the second reflector can be installed near the front end of the left main wing of the airplane, and the third reflector can be installed near the front end of the right main wing of the airplane. Other reflectors can be installed at other locations of the airplane. In addition, the number of reflectors installed on the workpiece W can be more than three or less than three.

[0212] As described above, the position measuring device 3 can measure the position of the processing device 1 by irradiating the measuring light ML toward the reflector installed in the processing device 1 as the measurement object. In the above case, the reflector can be installed at a predetermined position of the processing device 1. For example, the reflector can be installed near the front end of the head driving system 13 included in the processing device 1 (for example, the position for installing the processing head 12). For example, the reflector can also be installed on the processing head 12. In the above case, the position measuring device 3 can appropriately measure the position of the processing head 12. For example, the reflector can also be installed on the self-moving driving system 131. In the above case, the position measuring device 3 can measure the approximate position of the processing head 12.

[0213] As described above, the position measuring device 3 can measure the position of the measuring device 2 by irradiating the measuring light ML toward the reflector installed in the measuring device 2 as the measuring object. In the above case, the reflector can be installed at a predetermined position of the measuring device 2. For example, the reflector can be installed near the front end of the head driving system 23 included in the measuring device 2 (for example, the position for installing the measuring head 22). For example, the reflector can also be installed on the measuring head 22. In the above case, the position measuring device 3 can appropriately measure the position of the measuring head 22. For example, the reflector can also be installed on the self-moving driving system 231. In the above case, the position measuring device 3 can measure the approximate position of the measuring head 22.

[0214] As described above, in the present embodiment, a measurement coordinate system determined with the position measuring device 3 as a reference is used as a reference coordinate system as a reference of the processing system SYS. In the case where the processing system SYS includes a plurality of position measuring devices 3, a first measurement coordinate system determined with the first position measuring device 3 among the plurality of position measuring devices 3 as a reference can be used as a reference coordinate system. On the other hand, a second position measuring device 3 among the plurality of position measuring devices 3 measures the respective positions of the workpiece W, the processing device 1, and the measuring device 2 in a second measurement coordinate system determined with the second position measuring device 3 as a reference. However, since the second measurement coordinate system is different from the reference coordinate system, the second position measuring device 3 cannot measure the respective positions of the workpiece W, the processing device 1, and the measuring device 2 in the reference coordinate system. Specifically, the following technical problem arises: the control server 4 determines the respective positions of the workpiece W, the processing device 1, and the measuring device 2 according to the representation

[0215] The measurement result obtained by the second position measuring device 3 (for example, the Fig.10 The position information of the detection result of the measuring light ML and the return light RL by the detector 338 shown may not be able to calculate the respective positions of the workpiece W, the processing device 1 and the measuring device 2 in the reference coordinate system.

[0216] In order to solve this technical problem, any one of the first position measuring device 3 and the second position measuring device 3 can measure the position of any other of the first position measuring device 3 and the second position measuring device 3. In this case, the control server 4 can obtain the measurement result of the position of any other of the first position measuring device 3 and the second position measuring device 3 by any one of the first position measuring device 3 and the second position measuring device 3 as at least a part of the position information. In this case, the control server 4 can calculate the relative position relationship between the first position measuring device 3 and the second position measuring device 3 based on the measurement result of the position of any other of the first position measuring device 3 and the second position measuring device 3 by any one of the first position measuring device 3 and the second position measuring device 3. As a result, the control server 4 can convert the position in the second measurement coordinate system into the position in the first measurement coordinate system (that is, the position in the reference coordinate system) based on the relative position relationship between the first position measuring device 3 and the second position measuring device 3. That is, the control server 4 can appropriately calculate the positions of the plurality of measurement target parts of the workpiece W in the reference coordinate system using the position information respectively obtained from the plurality of position measuring devices 3.

[0217] In addition, the processing system SYS may include a position measuring device 3 for measuring the position of the workpiece W, a position measuring device 3 for measuring the position of the processing device 1, and a position measuring device 3 for measuring the position of the measuring device 2 as a plurality of position measuring devices 3. That is, the processing system SYS may include a position measuring device 3 that measures the position of the workpiece W, but may not measure the positions of the processing device 1 and the measuring device 2. The processing system SYS may also include a position measuring device 3 that measures the position of the processing device 1, but may not measure the positions of the workpiece W and the measuring device 2. The processing system SYS may also include a position measuring device 3 that measures the position of the measuring device 2, but may not measure the positions of the workpiece W and the processing device 1. In the above case, the workpiece W can be moved in at least a part of the period during which the processing action is performed. That is, the position of the workpiece W in the reference coordinate system can be changed in at least a part of the period during which the processing action is performed.

[0218] Return again Fig.15 In step S311 , the information acquisition unit 411 of the control server 4 receives (ie, acquires) position information indicating the measurement results of the positions of the workpiece W, the processing device 1 , and the measuring device 2 from the position measurement device 3 using the communication device 43 (step S412 ).

[0219] Thereafter, the control information generating unit 412 of the control server 4 calculates the position of the workpiece W in the reference coordinate system based on the model data acquired in step S411 and the position information acquired in step S412 (particularly, the position information indicating the measurement result of the position of the workpiece W) (step S413). For example, the control information generating unit 412 may calculate the position of the workpiece W in at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction. For example, the control information generating unit 412 may also calculate the position of the workpiece W in at least one of the θX direction, the θY direction, and the θZ direction (i.e., the posture of the workpiece W).

[0220] Here, the position information indicating the measurement result of the position of the workpiece W shows the position of the workpiece W.

[0221] The position of the measurement target portion whose position is measured by the position measuring device 3 is not shown, while the position of the non-measurement target portion of the workpiece W whose position is not measured by the position measuring device 3 is not shown. Therefore, if the control information generating unit 412 refers only to the position information, it can only calculate the position of a portion of the workpiece W in the reference coordinate system. That is, the control information generating unit 412 cannot calculate the position of the remaining portion of the workpiece W in the reference coordinate system. Therefore, the control information generating unit 412 performs a fitting process of arranging the same measurement target portion of the three-dimensional model represented by the model data at the position of the measurement target portion of the workpiece W represented by the position information in the reference coordinate system. The fitting process may include at least one of a process of parallel translation of the three-dimensional model, a process of enlarging or reducing the three-dimensional model, and a process of rotating the three-dimensional model. In addition, the fitting process may also include a process of affine transformation of the three-dimensional model. The process of affine transformation of the three-dimensional model may include at least one of a process of parallel translation of the three-dimensional model, a process of enlarging or reducing the three-dimensional model, a process of rotating the three-dimensional model, and a process of skew deformation of the three-dimensional model. As a result, the three-dimensional model of the workpiece W is arranged at the same position as the position of the workpiece W in the reference coordinate system. The three-dimensional model of the workpiece W is arranged in the same posture as the posture of the workpiece W in the reference coordinate system. In the above case, the control information generation unit 412 uses the position of the three-dimensional model of the workpiece W in the reference coordinate system as the position of the workpiece W in the reference coordinate system. Specifically, the control information generation unit 412 calculates the position of the measurement target part of the three-dimensional model of the workpiece W as the position of the measurement target part of the workpiece W. Furthermore, the control information generation unit 412 calculates the position of the non-measurement target part of the three-dimensional model of the workpiece W as the position of the non-measurement target part of the workpiece W. As a result, the control information generation unit 412 can generate map information representing the workpiece W drawn in the reference coordinate system. That is, the control information generation unit 412 can generate map information representing the position of each part of the workpiece W in the reference coordinate system. In addition, since the map information is information representing the position of the object of the workpiece W, it can also be called workpiece position information or object position information.

[0222] Then, the control information generating unit 412 of the control server 4 allocates at least a part of the workpiece W as a target processing area to be processed by the processing device 1 to the processing device 1 (step S414). In this case, the processing device 1 processes the target processing area allocated in step S414.

[0223] In order to assign a target processing area to the processing device 1, the control information generating unit 412 may set the target processing area in the workpiece W based on the map information generated in step S413. For example, the control information generating unit 412 may set the position of the target processing area in the reference coordinate system. The control information generating unit 412 may set a single target processing area or may set multiple target processing areas. Thereafter, in the case where a single target processing area is set, the control information generating unit 412 may assign the set target processing area to the processing device 1. In the case where multiple target processing areas are set, the control information generating unit 412 may assign at least one of the multiple target processing areas to the processing device 1. That is, the control information generating unit 412 may assign multiple target processing areas to the processing device 1.

[0224] Thereafter, the control information generation unit 412 of the control server 4 generates the control information based on the control information generated in step S413.

[0225] The target moving path TR of the processing head 12 is calculated based on the map information and the target processing area assigned in step S414 (step S415). When multiple target processing areas are assigned to the processing device 1 in step S414, the control information generating unit 412 calculates the target moving path TR of the processing head 12 based on the map information and one target processing area that has not been processed among the multiple target processing areas (step S415). The target moving path TR in the processing action includes a moving path that moves the processing head 12 toward a position where the target processing area assigned in step S414 can be processed. In particular, the target moving path TR may include a moving path for the self-mobile drive system 131 to move. That is, the target moving path TR may include a moving path for the self-mobile drive system 131 to move the processing head 12.

[0226] Below, refer to Fig.17 An example of the operation of calculating the target movement route TR will be described. Fig.17 It is a top view showing the workpiece W.

[0227] like Fig.17As shown, the control information generating unit 412 can set (in other words, obtain) the moving start position MS corresponding to the starting point of the target moving path TR. That is, the control information generating unit 412 can set the moving start position MS at which the processing head 12 starts to move along the target moving path TR. For example, the control information generating unit 412 can set the moving start position MS based on the position information acquired in step S412. That is, the moving start position MS can be input based on the position information. As an example, the control information generating unit 412 can calculate the current position of the processing device 1 (for example, the current position of the processing head 12, the same below) based on the position information, and set the calculated current position of the processing device 1 as the moving start position MS. Alternatively, the control information generating unit 412 can also set a position different from the current position of the processing device 1 as the moving start position MS. For example, in the case where the processing device 1 includes a power supply as described above, the control information generating unit 412 can set the position of the charging station where the processing device 1 charges the power supply as the moving start position MS. Furthermore, as described above, the machining head 12 moves within a reference coordinate system defined by the X-axis, the Y-axis, and the Z-axis, so the movement start position MS may include at least one of the X-coordinate, the Y-coordinate, and the Z-coordinate.

[0228] like Fig.17 As shown, the control information generating unit 412 can set (in other words, obtain) a moving end position ME corresponding to the end point of the target moving path TR. That is, the control information generating unit 412 can set the moving start position MS at which the machining head 12 ends its movement along the target moving path TR. For example, the control information generating unit 412 can set the moving end position ME based on the position of the target processing area assigned in step S414. As an example, the control information generating unit 412 can set the position at which the machining head 12 can process the workpiece W even if the self-moving drive system 131 does not move the machining head 12 as the moving end position ME. In particular, the control information generating unit 412 can set the position at which the machining head 12 can process the target processing area even if the self-moving drive system 131 does not move the machining head 12 as the moving end position ME. As another example, the control information generating unit 412 can also set the position at which the distance between the workpiece W and the machining head 12 is less than the moving stroke of the machining head 12 by the arm driving system 132 as the moving end position ME. In particular, the control information generating unit 412 can control the distance between the target processing area and the processing head 12 to be lower than the movement of the processing head 12 by the arm driving system 132.

[0229] The position of the stroke is set as the movement end position ME. In any example, the movement end position ME can be set to a position separated by a certain distance from the workpiece W. In addition, the movement end position ME can include at least one of the X coordinate, the Y coordinate, and the Z coordinate.

[0230] Furthermore, since the target processing area is allocated based on the map information generated based on the model data, the action of setting the movement end position ME based on the target processing area can also be regarded as equivalent to the action of setting the movement end position ME based on the model data.

[0231] Alternatively, the control information generating unit 412 may set the movement end position ME based on the movement start position MS. For example, the control information generating unit 412 may set a position separated from the movement start position MS by a certain distance or more as the movement end position ME.

[0232] Thereafter, the control information generating unit 412 may calculate the moving path from the moving start position MS to the moving end position ME as the target moving path TR. The control information generating unit 412 may also calculate the moving path from the moving start position MS to the moving end position ME as the target moving path TR. In this case, the machining head 12 moves from the moving start position MS along the target moving path TR to the moving end position ME as the target position (i.e., the destination).

[0233] like Fig.17 As shown, the control information generation unit 412 may also calculate a target movement path TR that will not interfere with other objects different from the processing device 1. That is, the control information generation unit 412 may calculate a target movement path TR that will not pass through an area where other objects are located. Specifically, the control information generation unit 412 may determine an area where other objects are located based on the map information generated in step S413, and calculate a target movement path TR that will not pass through (i.e., avoid) the determined area. For example, the control information generation unit 412 may also calculate a target movement path TR that can ensure that the distance between other objects and the processing device 1 is greater than a specified distance and is the shortest.

[0234] As an example of other objects, a workpiece W can be cited. In the above case, Fig.17 As shown, the control information generation unit 412 can calculate the target movement path TR that will not interfere with the workpiece W. That is, the control information generation unit 412 can calculate the target movement path TR that will not pass through the area where the workpiece W is located. Specifically, the control information generation unit 412 can determine the area where the workpiece W is located based on the map information generated in step S413, and calculate the target movement path TR that will not pass through (that is, avoid) the determined area. For example, the control information generation unit 412 can calculate the shortest target movement path TR that can ensure that the distance between the workpiece W and the processing device 1 is greater than a specified distance.

[0235] As an example of other objects, a measuring device 2 can be cited. In the above case, Fig.17As shown, the control information generating unit 412 can calculate the target moving path TR that will not interfere with the measuring device 2. That is, the control information generating unit 412 can calculate the target moving path TR that will not pass through the area where the measuring device 2 is located. Specifically, the control information generating unit 412 can determine the area where the measuring device 2 is located based on the position information acquired in step S412 (particularly the position information indicating the measurement result of the position of the measuring device 2), and calculate the target moving path TR that will not pass through (that is, avoid) the determined area. For example, the control information generating unit 412 can calculate the shortest target moving path TR that can ensure that the distance between the measuring device 2 and the processing device 1 is greater than a specified distance.

[0236] As described later, the measuring device 2 may move. In the above case, the control information generating unit 412 can calculate the target moving path TR of the measuring device 2 that does not interfere with the moving measuring device 2. That is, the control information generating unit 412 can calculate the target moving path TR of the measuring device 2 and the processing device 1 that will not be located at the same position at the same time. The control information generating unit 412 can also calculate the target moving path TR of the measuring device 2 and the processing device 1 that will not collide. Specifically, the control information generating unit 412 can calculate the target moving path TR of the processing device 1 that does not interfere with the moving measuring device 2 based on the target moving path TR of the measuring device 2 calculated by the measuring action described later.

[0237] When the information about the obstacle that becomes the movement obstacle of the processing head 12 is known to the control server 4, the control information generation unit 412 may calculate the target movement path TR that will not interfere with the obstacle. That is, the control information generation unit 412 may calculate the target movement path TR that will not pass through the area where the obstacle is located. For example, the control information generation unit 412 may calculate the shortest target movement path TR that can ensure that the distance between the obstacle and the processing device 1 is greater than a predetermined distance.

[0238] Furthermore, the control information generating unit 412 may consider at least one of the posture of the arm driving system 132 in the machining device 1 and the movable range of the machining head 12 based on the self-moving driving system 131 in order to calculate the target movement path TR.

[0239] Typically, the control server 4 can obtain information about obstacles before performing the processing action. For example, before the processing action starts, an obstacle detection device that detects obstacles detects obstacles, and the control server 4 obtains the detection result obtained by the obstacle detection device as the information about the obstacle. Alternatively, the operator can input the information about the obstacle to the control server 4 using the input device 44. In addition, the control server 4 can also obtain information about obstacles during at least a part of the processing action. For example, the control server 4 can obtain information about obstacles before calculating the target movement path TR.

[0240] like Fig.17 As shown, the control information generating unit 412 can set (in other words, obtain) a processing start position PS, which is equivalent to the position of the processing head 12 at the time point when the processing head 12 actually starts processing the target processing area after the movement along the target moving path TR is completed. For example, the control information generating unit 412 can set the processing start position PS based on the position of the target processing area assigned in step S414. As an example, the control information generating unit 412 can set the desired position of the target processing area as the processing start position PS. In addition, since the target processing area is assigned based on the map information generated based on the model data, the action of setting the processing start position PS based on the target processing area can also be regarded as equivalent to the action of setting the processing start position PS based on the model data. In addition, the processing start position PS may include at least one of the X coordinate, the Y coordinate, and the Z coordinate.

[0241] Alternatively, the control information generating unit 412 may set the processing start position PS based on the movement start position MS. For example, the control information generating unit 412 may set a position separated from the movement start position MS by a certain distance or more as the processing start position PS.

[0242] When the processing start position PS is set, the processing head 12 moves from the movement start position MS along the target movement path TR to the movement end position ME as the first target position (i.e., the first destination) through the self-moving drive system 131. Thereafter, the processing head 12 moves from the movement end position ME to the processing start position PS as the second target position (i.e., the second destination) through the arm drive system 132. In the above case, it can also be considered that: on the movement path of the processing head 12 passing through the self-moving drive system 131 and the arm drive system 132, the movement end position ME is located between the movement start position MS and the processing start position PS. In the above case, typically, the length of the movement path from the movement start position MS to the movement end position ME may be longer than the length of the movement path from the movement end position ME to the processing start position PS. That is, the movement amount of the processing head 12 by the self-moving drive system 131 (i.e., the change amount of the position of the processing head 12, the same below) may be greater than the movement amount of the processing head 12 by the arm drive system 132.

[0243] When the processing start position PS is set, the control information generating unit 412 may also set the moving end position ME based on the processing start position PS. For example, the control information generating unit 412 may set a position separated from the processing start position PS by a certain distance in the direction of separation from the workpiece W as the moving end position ME. As a result, the possibility that the processing device 1 that has finished moving along the target moving path TR accidentally contacts the workpiece W is reduced. In the above case, the control information generating unit 412 may also set a position separated from the processing start position PS by a distance shorter than the moving stroke of the processing head 12 by the arm driving system 132 as the moving end position ME. As a result, the self-moving driving system 131 may not move the processing head 12 in order to move the processing head 12 from the moving end position ME to the processing start position PS.

[0244] like Fig.17As shown, the control information generating unit 412 may also set (in other words, obtain) a standby position WP where the machining head 12 temporarily waits after finishing moving along the target moving path TR. For example, the control information generating unit 412 may set a position separated from the machining start position PS by a certain distance in the direction of separation from the workpiece W and separated from the moving end position ME by a certain distance in the direction approaching the workpiece W as the standby position PS. In the above case, the distance between the machining start position PS and the standby position WP is shorter than the distance between the machining start position PS and the moving end position ME. As a result, the possibility that the machining device 1 that has finished moving along the target moving path TR accidentally contacts the workpiece W is reduced. Furthermore, compared with the case where the machining head 12 waits at the moving end position ME, the time required for the machining head 12 to move to the machining start position PS is shortened. Therefore, the machining head 12 can start machining quickly. In addition, the standby position WP may include at least one of the X coordinate, the Y coordinate, and the Z coordinate.

[0245] When the standby position WP is set, the machining head 12 moves from the movement start position MS along the target movement path TR to the movement end position ME as the first target position (i.e., the first destination) by the self-movement drive system 131. Thereafter, the machining head 12 moves from the movement end position ME to the standby position WP as the second target position (i.e., the second destination) by the arm drive system 132. Thereafter, the machining head 12 moves from the standby position WP to the movement end position ME by the arm drive system 132.

[0246] The processing start position PS is the third target position (i.e., the third destination). In the above case, it can also be considered that the movement end position ME is located between the movement start position MS and the standby position WP on the movement path of the processing head 12 through the self-moving drive system 131 and the arm drive system 132. It can also be considered that the standby position WP is located between the movement end position ME and the processing start position PS.

[0247] Return again Fig.15 , thereafter, the control information generating unit 412 generates processing control information (step S416). For example, the control information generating unit 412 may generate processing control information for controlling the head driving system 13 to move the processing head 12 along the target moving path TR calculated in step S415. For example, the control information generating unit 412 may also generate processing control information for controlling the processing device 1 to process the target processing area assigned in step S414.

[0248] Thereafter, the control information generating unit 412 transmits the processing control information to the processing device 1 using the communication device 43. As a result, the control device 14 of the processing device 1 receives the processing control information (step S111).

[0249] Thereafter, the control device 14 of the processing device 1 controls the head drive system 13 to move the processing head 12 based on the processing control information received in step S111 (step S112). Specifically, the self-moving drive system 131 moves the processing head 12 along the target moving path TR. That is, the self-moving drive system 131 moves the processing head 12 along the target moving path TR by self-moving on the support surface SS along the target moving path TR. When the standby position WP is set, the arm drive system 132 can further move the processing head 12 located at the moving end position ME to the standby position WP. When the processing start position PS is set, the arm drive system 132 can further move the processing head 12 located at the moving end position ME or the standby position WP to the processing start position PS.

[0250] Furthermore, the control device 14 controls the movement of the machining head 12 based on the machining control information generated by the control server 4. In this case, it can also be regarded that the control server 4 controls the movement of the machining head 12.

[0251] After the machining head 12 has finished moving along the target movement region TR (that is, after the machining head 12 has reached the movement end position ME), the machining device 1 machines the target machining region assigned in step S414 (step S113 ).

[0252] Thereafter, the machining system SYS repeats the same action until it is determined that the machining action is terminated (step S417: Yes). For example, in a case where another target machining area different from the target machining area processed in step S113 needs to be machined, the machining system SYS may determine that the machining action is not terminated (step S417: No). In a case where another target machining area different from the target machining area processed in step S113 does not need to be machined, the machining system SYS may determine that the machining action is terminated (step S417: Yes). In a case where another workpiece W different from the workpiece W processed in step S113 needs to be machined, the machining system SYS may determine that the machining action is not terminated (step S417: No). In a case where another workpiece W different from the workpiece W processed in step S113 does not need to be machined, the machining system SYS may determine that the machining action is terminated (step S417: Yes).

[0253] When it is determined that the processing action is not to be terminated (step S417: No), the processing system SYS may perform the actions from step S415 to step S113 again. That is, the control server 4 calculates a target moving path TR including the following moving path, that is, a moving path that moves the processing head 12 toward a position where the processing device 1 can process the next new target processing area to be processed (step S415). Thereafter, the control server 4 generates processing control information (step S416). Thereafter, the processing device 1 receives the processing control information from the control server 4 (step S111). Thereafter, based on the processing device 1 and the processing control information, the head drive system 13 is controlled to move the processing head 12 (step S112). Thereafter, the processing device 1 processes the next new target processing area to be processed by the processing device 1 (step S113).

[0254] In addition, when it is determined that the processing action is not to be terminated (step S417: No), the processing system SYS may perform the actions from step S311 to step S113 again. That is, when it is determined that the processing action is not to be terminated (step S417: No), the position measuring device 3 may measure the positions of the workpiece W, the processing device 1, and the measuring device 2 again (step S311). Furthermore, the control server 4 may calculate the position of the workpiece W in the reference coordinate system again (step S413). In the above case, even if at least one of the shape and position of the workpiece W changes as the workpiece W is processed, the control server 4 can accurately calculate the position of the workpiece W. As a result, even if at least one of the shape and position of the workpiece W changes as the workpiece W is processed, the control server 4 can appropriately calculate the target movement path TR.

[0255] In addition, when the processing device 1 includes a power supply as described above, the power supply may be charged after the processing operation is completed. For example, after the processing operation is completed, the processing device 1 may be moved to a charging station where the processing device 1 is charged to charge the power supply.

[0256] (2-2-2) Modification of the Operation of Moving the Machining Head 12

[0257] The processing system SYS is described in Fig.15 When the processing head 12 is moved in step S112, Fig.18 Action shown. Fig.18 It means in Fig.15 The process of moving the machining head 12 in step S112 is a flowchart of the process of moving the machining head 12 in step S112. Fig.18 Action shown.

[0258] like Fig.18 As shown, the control device 14 of the processing device 1 is based on Fig.15 The processing control information received in step S111 controls the head driving system 13 to move the processing head 12 (step S1121). As a result, the processing head 12 moves along the target movement path TR.

[0259] In particular, in step S1121, the control device 14 uses the self-moving drive system 131 to move the processing head 12. That is, the control device 14 controls the self-moving drive system 131 based on the processing control information to move the processing head 12. As a result, the self-moving drive system 131 moves along the target movement path TR together with the processing head 12. That is, the processing head 12 moves along the target movement path TR.

[0260] While the machining head 12 is moving along the target movement path TR, the control device 14 of the machining device 1 may determine whether the machining head 12 has entered the fine adjustment area AA (step S1122 ).

[0261] An example of the fine adjustment area AA is shown in Fig.19 (a) and Fig.19 (b). Fig.19 (a) and Fig.19 As shown in (b) of FIG. 1 , the fine adjustment area AA may be an area determined based on the workpiece W. For example, Fig.19 As shown in (a) of FIG. 1 , the fine adjustment area AA may be an area including the workpiece W. For example, Fig.19 As shown in (b), the fine adjustment area AA may be an area whose distance from the workpiece W is less than or equal to a predetermined first distance. However, the fine adjustment area AA may be an area determined independently of the workpiece W. In addition, information related to the fine adjustment area AA (for example, information related to the position of the fine adjustment area AA in the reference coordinate system) may be information known to the control device 14.

[0262] In order to determine whether the machining head 12 has entered the fine adjustment area AA, the control device 14 may obtain position information indicating the measurement result of the position of the machining device 1 from the position measurement device 3. Thereafter, the control device 14 may determine whether the machining head 12 has entered the fine adjustment area AA based on the acquired position information and the information related to the fine adjustment area AA. Specifically, the control device 14 may calculate the current position of the machining head 12 based on the position information, and determine whether the calculated current position of the machining head 12 is included in the fine adjustment area AA whose position is indicated by the information related to the fine adjustment area AA. In the case where it is determined that the current position of the machining head 12 is included in the fine adjustment area AA, the control device 14 may determine that the machining head 12 has entered the fine adjustment area AA.

[0263] In the case where the fine adjustment area AA is an area where the distance from the workpiece W is less than the predetermined first distance, in order to determine whether the machining head 12 has entered the fine adjustment area AA, the control device 14 may determine whether the machining head 12 has entered the fine adjustment area AA based on the first distance. Fig.15 The position of the workpiece W calculated in step S413, and Fig.15 The control device 14 calculates the distance between the machining head 12 and the workpiece W based on the position information obtained in step S412 (particularly, the position information indicating the measurement result of the position of the machining device 1). When the calculated distance is shorter than the first distance for determining the fine adjustment area AA, the control device 14 may determine that the machining head 12 has entered the fine adjustment area AA.

[0264] As described above, the moving end position ME at which the self-moving drive system 131 ends the movement of the processing head 12 is typically set to a position separated from the workpiece W by a certain distance. In the above case, the fine adjustment area AA determined based on the workpiece W can also be regarded as a zone determined based on the moving end position ME separated from the workpiece W by a certain distance. Specifically, the fine adjustment area AA can be a zone whose distance from the moving end position ME is less than a specified second distance. In the above case, the fine adjustment area AA can be set by the control server 4 that sets the moving end position ME. Furthermore, in the above case, in order to determine whether the processing head 12 has entered the fine adjustment area AA, the control device 14 can calculate the distance between the processing head 12 and the moving end position ME based on the position information of the measurement result indicating the position of the processing device 1. When the calculated distance is shorter than the second distance that determines the fine adjustment area AA, the control device 14 can determine that the processing head 12 has entered the fine adjustment area AA.

[0265] Furthermore, at least one of the first distance and the second distance may be set in consideration of the movable range of the machining head 12 based on the self-moving drive system 131 .

[0266] Return again Fig.18 In the case where the determination in step S1122 is performed and the result is that the machining head 12 has not entered the fine adjustment area AA (for example, the distance between the machining head 12 and the movement end position ME is not shorter than the second distance) (step S1122: No), the control device 14 uses

[0267] The self-moving drive system 131 causes the machining head 12 to continue moving along the target movement path TR (step S1121 ).

[0268] On the other hand, when the determination in step S1122 is performed and the result is that the machining head 12 has entered the fine adjustment area AA (for example, the distance between the machining head 12 and the movement end position ME is shorter than the second distance) (step S1122: Yes), the control device 14 also uses the self-moving drive system 131 to move the machining head 12 along the target movement path TR (step S1123). However, in step S1123, the control device 14 newly obtains position information representing the measurement result of the position of the machining device 1 by the position measuring device 3 from the position measuring device 3, and moves the machining head 12 along the target movement path TR based on the newly obtained position information and the machining control information. In the above case, the control device 14 can calculate the accurate current position of the machining device 1 (that is, the accurate current position of the machining head 12) based on the position information. Therefore, compared with the case where the position information is not used, the control device 14 can appropriately move the machining head 12 along the target movement path TR. Therefore, the machining device 1 can prevent the collision between the machining device 1 and the workpiece W caused by the failure of the control device 14 to accurately grasp the current position of the machining device 1.

[0269] However, before the processing head 12 enters the fine adjustment area AA, the control device 14 may move the processing head 12 along the target movement path TR based on the position information indicating the measurement result of the position of the processing device 1 by the position measuring device 3. For example, the position measuring device 3 may always continue to measure the position of the processing device 1 during the movement of the processing head 12. For example, the position measuring device 3 may continue to measure the position of the processing device 1 at a predetermined cycle during the movement of the processing head 12. In the above case, the control device 14 will not be unable to grasp the current position of the processing device 1. Therefore, the control device 14 can appropriately move the processing head 12 along the target movement path TR.

[0270] After the machining head 12 enters the fine adjustment area AA, the self-moving drive system 131 can move the machining head 12 with a higher movement accuracy than the movement accuracy of the machining head 12 before the machining head 12 enters the fine adjustment area AA. That is, before the machining head 12 enters the fine adjustment area AA, the self-moving drive system 131 moves the machining head 12 with a first movement accuracy, and after the machining head 12 enters the fine adjustment area AA, the self-moving drive system 131 moves the machining head 12 with a second movement accuracy that is higher than the first movement accuracy. As a result, the machining device 1 can prevent the machining device 1 from colliding with the workpiece W due to the low movement accuracy of the machining head 12 at a position close to the workpiece W.

[0271] Thereafter, until the machining head 12 reaches the movement end position ME (step S1124: No), the control device 14 uses the self-movement drive system 131 to continuously move the machining head 12 along the target movement path TR based on the position information (step S1123).

[0272] After that, after the machining head 12 reaches the movement end position ME (step S1124: Yes), the control device 14 can control the arm drive system 132 to move the machining head 12 that has reached the movement end position ME to the standby position WP or the machining start position PS (step S1125). In step S1125, the control device 14 can move the machining head 12 based on the position information indicating the measurement result of the position measurement device 3 on the position of the machining device 1. As a result, even if the movement end position is not set in advance, the machining head 12 can be moved.

[0273] In the case of a target movement path from the moving end position ME to the waiting position WP or the processing start position PS, the control device 14 can also appropriately move the processing head 12 from the moving end position ME to the waiting position WP or the processing start position PS based on the position information. Furthermore, the processing device 1 can prevent the processing device 1 from colliding with the workpiece W due to the control device 14 failing to accurately grasp the current position of the processing device 1.

[0274] In addition, the control device 14 may control the arm drive system 132 to move the processing head 12 during at least a portion of the period in which the self-mobile drive system 131 moves the processing head 12. In this case, compared with the case in which the arm drive system 132 moves the processing head 12 after the self-mobile drive system 131 finishes moving the processing head 12, the time required for the processing head 12 to move to the standby position WP or the processing start position PS is shortened.

[0275] (2-3) Measurement action

[0276] Next, the measuring operation performed by the machining system SYS will be described.

[0277] (2-3-1) Overall flow of measurement operations

[0278] First, refer to Fig. 20 The overall flow of measurement operation is described below. Fig. 20 This is a flowchart showing the overall flow of the measurement operation.

[0279] like Fig. 20 As shown, first, the control information generating unit 412 of the control server 4 obtains model data representing the three-dimensional model of the workpiece W to be measured by the measuring device 2 (step S421). The operation of step S421 can be similar to the above Fig.15 The action of step S411 is the same as that of step S411.

[0280] In parallel with or immediately after the operation of step S421, the position measuring device 3 measures the positions of the workpiece W, the processing device 1, and the measuring device 2 (step S321). The operation of step S321 can be performed in the same manner as described above. Fig.15 However, during the measurement operation, the position measuring device 3 may not necessarily measure the position of the processing device 1.

[0281] Thereafter, the information acquisition unit 411 of the control server 4 receives (ie, acquires) position information indicating the measurement results of the positions of the workpiece W, the processing device 1 , and the measuring device 2 in step S321 from the position measurement device 3 using the communication device 43 (step S422 ).

[0282] Thereafter, the control information generating unit 412 of the control server 4 calculates the position of the workpiece W in the reference coordinate system based on the model data acquired in step S421 and the position information acquired in step S412 (particularly the position information indicating the measurement result of the position of the workpiece W) (step S423). The operation of step S423 can be similar to the above-mentioned Fig.15 The action of step S413 is the same.

[0283] Thereafter, the control information generating unit 412 of the control server 4 allocates at least a portion of the workpiece W as a target measurement area to be measured by the measuring device 2 to the measuring device 2 (step S424). In this case, the measuring device 2 measures the target measurement area allocated in step S424. The operation of step S424 can be similar to the above operation. Fig.15 The operation of step S414 is the same as that of step S414. Fig.15 The description related to the action of step S414 can be transferred to the description related to the action of step S424 by replacing the words "processing device 1" and "target processing area" with the words "measuring device 2" and "target measurement area" respectively.

[0284] Thereafter, the control information generation unit 412 of the control server 4 calculates the target movement path TR of the measuring head 22 based on the map information generated in step S423 and the target measurement area assigned in step S424 (step S425). The target movement path TR in the measurement operation includes a movement path for moving the measuring head 22 toward a position where the target measurement area assigned in step S424 can be measured. In particular, the target movement path TR may include a movement path for the self-mobile drive system 231 to move. That is, the target movement path TR may include a movement path for the self-mobile drive system 231 to move the measuring head 22.

[0285] The action of step S425 can be combined with the Fig.15The operation of step S415 is the same as that of step S416. Fig.15 The description related to the action of step S415 can be transferred and used as the description related to the action of step S425 by replacing the words "processing device 1", "processing head 12", "self-moving drive system 131", "arm drive system 132", "measuring device 2", "processing action", "target processing area", "processing start position" and "processing" with the words "measuring device 2", "measuring head 22", "self-moving drive system 231", "arm drive system 232", "processing device 1", "measuring action", "target measurement area", "measurement start position" and "measurement" respectively.

[0286] Thereafter, the control information generating unit 412 generates measurement control information (step S426). For example, the control information generating unit 412 may generate measurement control information for controlling the head driving system 23 so that the measuring head 22 moves along the target moving path TR calculated in step S425. For example, the control information generating unit 412 may also generate measurement control information for controlling the measuring device 2 to measure the target measurement area assigned in step S424.

[0287] Thereafter, the control information generation unit 412 transmits the measurement control information to the measurement device 2 using the communication device 43. As a result, the control device 24 of the measurement device 2 receives the measurement control information (step S121).

[0288] Thereafter, the control device 24 of the measuring device 2 controls the head driving system 23 to move the measuring head 22 based on the measurement control information received in step S121 (step S122). The operation of step S122 can be similar to the above-mentioned Fig.15 The action of step S112 is the same. Specifically, the self-moving drive system 231 moves the measuring head 22 along the target moving path TR. That is, the self-moving drive system 231 moves the measuring head 22 along the target moving path TR by self-moving on the support surface SS along the target moving path TR. When the standby position WP is set, the arm drive system 232 can further move the measuring head 22 located at the moving end position ME to the standby position WP. When the processing start position PS is set, the arm drive system 232 can further move the measuring head 22 located at the moving end position ME or the standby position WP to the processing start position PS.

[0289] Furthermore, in step S122, the processing system SYS may also perform Fig.18 Specifically, the same as the action shown in Fig.18The description of the operation shown can be made by referring to "processing device 1", "processing head 12", "self-propelled driving system 131", "arm driving system 132", "control device 14", "processing control information", Fig.15 ” and “step S413” are replaced with “measuring device 2”, “measuring head 22”, “self-propelled driving system 231”, “arm driving system 232”,

[0290] "Control device 24", "Measurement control information", " Fig. 20 ” and “step S423” are used as descriptions of actions that can also be performed in step S122.

[0291] Furthermore, the control device 24 controls the movement of the measuring head 22 based on the measurement control information generated by the control server 4. In this case, it can also be regarded that the control server 4 controls the movement of the measuring head 22.

[0292] After the measuring head 22 has finished moving along the target movement region TR (that is, after the measuring head 22 has reached the movement end position ME), the measuring device 2 measures the target measurement region allocated in step S424 (step S123 ).

[0293] Thereafter, the machining system SYS repeats the same action until it is determined that the measurement action is terminated (step S427: Yes). For example, in a case where it is necessary to measure another target measurement area different from the target measurement area measured in step S123, the machining system SYS may determine that the measurement action is not terminated (step S427: No). In a case where it is not necessary to machine another target measurement area different from the target measurement area measured in step S123, the machining system SYS may determine that the measurement action is terminated (step S427: Yes). In a case where it is necessary to measure another workpiece W different from the workpiece W measured in step S123, the machining system SYS may determine that the measurement action is not terminated (step S427: No). In a case where it is not necessary to measure another workpiece W different from the workpiece W measured in step S123, the machining system SYS may determine that the measurement action is terminated (step S427: Yes).

[0294] (2-3-2) Specific example of measurement operation

[0295] Next, a specific example of the measurement operation will be described.

[0296] (2-3-2-1) Preliminary measurement

[0297] The measuring device 2 can measure the workpiece W before the processing device 1 processes the workpiece W. For example, Fig.21As shown in (a), the measuring device 2 may measure the first portion P1 of the workpiece W before the processing device 1 processes the first portion P1 by irradiating the processing light EL thereto. The processing device 1 may process the first portion P1 of the workpiece W by irradiating the processing light EL thereto after the measuring device 2 measures the first portion P1 of the workpiece W.

[0298] The control information generating unit 412 can generate processing control information for controlling the processing device 1 to process the first part P1 based on the measurement result of the first part P1 by the measuring device 2. For example, the control information generating unit 412 can generate processing control information including a processing route based on the measurement result of the first part P1 by the measuring device 2, and the processing route represents the irradiation position of the processing light EL used to process the first part P1. In such a case, the processing device 1 can process the first part P1 of the workpiece W based on the result of the measurement of the first part P1 of the workpiece W (i.e., the prior measurement performed before the first part P1 is processed). That is, the processing device 1 can process the workpiece W based on the result of the prior measurement of the workpiece W. Therefore, compared with the case where the result of the prior measurement of the first part P1 of the workpiece W is not used, the processing device 1 can more appropriately process the first part P1 of the workpiece W.

[0299] That is, the processing device 1 can process the workpiece W more appropriately than when the result of the previous measurement of the workpiece W is not used.

[0300] Fig.21 (a) can also be said to show an example in which the measuring device 2 measures the first part P1 of the workpiece W at a first moment, and the processing device 1 processes the first part P1 of the workpiece W at a second moment later than the first moment. In such a case, the measuring device 2 can also measure the second part P2 of the workpiece W that is different from the first part P1 at the second moment when the processing device 1 processes the first part P1 of the workpiece W. In such a case, since the processing device 1 processes the workpiece W and the measuring device 2 measures the workpiece W in parallel, the overall total throughput related to the processing and measurement of the workpiece W is improved.

[0301] (2-3-2-2) Post-measurement

[0302] The measuring device 2 can also measure the workpiece W after the processing device 1 processes the workpiece W. For example, Fig.21As shown in (b), the measuring device 2 can measure the third portion P3 of the workpiece W after the processing device 1 processes the third portion P3 of the workpiece W by irradiating the processing light EL thereto. The processing device 1 can process the third portion P3 of the workpiece W by irradiating the processing light EL thereto before the measuring device 2 measures the third portion P3 of the workpiece W.

[0303] In the above case, the control information generating unit 412 of the control server 4 can determine (in other words, evaluate) whether the processing of the workpiece W by the processing device 1 is appropriate based on the measurement result obtained by the measuring device 2. In particular, the control information generating unit 412 can determine (in other words, evaluate) whether the processing of the third part P3 of the workpiece W by the processing device 1 is appropriate based on the measurement result of the third part P3 by the measuring device 2. For example, the control information generating unit 412 can calculate the shape of the third part P3 based on the measurement result of the third part P3 by the measuring device 2, and determine whether the calculated shape of the third part P3 is a target shape (that is, the shape that the third part P3 should have after processing). If the shape of the third part P3 is the target shape, the control information generating unit 412 can determine that the processing of the third part P3 of the workpiece W by the processing device 1 is appropriate. On the other hand, if the shape of the third part P3 is not the target shape, the control information generating unit 412 can determine that the processing of the third part P3 of the workpiece W by the processing device 1 is inappropriate.

[0304] When it is determined that the processing of the third part P3 of the workpiece W by the processing device 1 is inappropriate, the control information generating unit 412 may control the processing device 1 to further process the third part P3. For example, the control information generating unit 412 may generate processing control information for controlling the processing device 1 to process the third part P3 so that the shape of the third part P3 becomes the target shape. In the case, the processing device 1 may process the third part P3 of the workpiece W based on the result of the measurement of the third part P3 of the workpiece W (i.e., the post-measurement performed after the third part P3 is processed). That is, the processing device 1 may process the workpiece W based on the result of the post-measurement of the workpiece W. Therefore, compared with the case where the result of the post-measurement of the third part P3 of the workpiece W is not used, the processing device 1 can process the third part P3 of the workpiece W more appropriately. That is, compared with the case where the post-measurement of the third part P3 of the workpiece W is not used, the processing device 1 can process the third part P3 of the workpiece W more appropriately.

[0305] The processing device 1 can process the workpiece W more appropriately compared with the result of the post-measurement.

[0306] When it is determined that the machining of the workpiece W by the machining device 1 is inappropriate, the control information generating unit 412 may store information related to the machining defective area determined to be inappropriately machined in the workpiece W in the machining information DB 421 (particularly machining progress information) or the measurement information DB 422 (particularly measurement progress information). The information related to the machining defective area stored in the machining information DB 421 or the measurement information DB 422 may be presented to an operator (for example, a user of the machining system SYS) as described in detail later in the third modification.

[0307] Fig.21 (b) can also be said to show an example in which the processing device 1 processes the third part P3 of the workpiece W at a third moment, and the measuring device 2 measures the third part P3 of the workpiece W at a fourth moment later than the third moment. In the above case, the processing device 1 may also process the fourth part P4 of the workpiece W that is different from the third part P3 at the fourth moment when the measuring device 2 measures the third part P3 of the workpiece W. In the above case, since the processing device 1 processes the workpiece W and the measuring device 2 measures the workpiece W in parallel, the overall total throughput related to the processing and measurement of the workpiece W is improved.

[0308] (2-3-2-3) Simultaneous measurement

[0309] The measuring device 2 may also measure the workpiece W during at least a portion of the period during which the processing device 1 processes the workpiece W. For example, Fig.21 As shown in (c), the measuring device 2 can measure the fifth portion P5 of the workpiece W during at least a portion of the period during which the processing device 1 processes the fifth portion P5 by irradiating the processing light EL thereto. The processing device 1 can process the fifth portion P5 of the workpiece W by irradiating the processing light EL thereto during at least a portion of the period during which the measuring device 2 measures the fifth portion P5 of the workpiece W. In the above case, since the processing of the workpiece W by the processing device 1 and the measurement of the workpiece W by the measuring device 2 are performed in parallel, the overall total throughput related to the processing and measurement of the workpiece W is improved.

[0310] In this case, the control information generating unit 412 of the control server 4 may generate processing control information for controlling the processing device 1 to process the fifth part P5 based on the measurement result of the fifth part P5 by the measuring device 2. The control information generating unit 412 may also determine (in other words, evaluate) whether the processing of the workpiece W (particularly the fifth part P5 thereof) by the processing device 1 is appropriate based on the measurement result of the fifth part P5 by the measuring device 2. If it is determined that the processing of the fifth part P5 of the workpiece W by the processing device 1 is inappropriate, the control information generating unit 412 may control the processing device 1 to process the fifth part P5 appropriately.

[0311] (2-3-2-4) Film thickness measurement

[0312] As an example of the above-mentioned preliminary measurement, the processing system SYS can perform the film thickness measurement described below. The film thickness measurement will be described below.

[0313] like Fig. 22 As shown, the workpiece W may include a base material BM and a film CF formed on the surface of the base material BM. The film CF may include a coating film, for example. As an example, when the workpiece W is an airplane,

[0314] The substrate BM may include a fuselage of an aircraft, and the film CF may include a finishing film coated on the fuselage of the aircraft.

[0315] In such a case, the processing device 1 may perform a removal process to remove a portion of the film CF. For example, the processing device 1 may perform a removal process to form a rib structure on the film CF by removing a portion of the film CF. In such a case, the processing device 1 may perform a removal process to remove a portion of the film CF without exposing the base material BM from the film CF. For example, the processing device 1 may perform a removal process to form the rib structure on the film CF (coating film) without exposing the base material BM corresponding to the base of the aircraft fuselage from the film CF corresponding to the coating film.

[0316] In the case, the control information generating unit 412 can calculate the thickness of the film CF based on the measurement result of the workpiece W by the measuring device 2. Specifically, the control information generating unit 412 can calculate a film thickness parameter that directly or indirectly indicates the thickness of the film CF based on the measurement result of the workpiece W by the measuring device 2. For example, the measurement result of the workpiece W by the measuring device 2 includes information related to the shape (for example, a three-dimensional shape) of the workpiece W. In the case, the control information generating unit 412 can calculate the height difference (that is, the height of the peak) between the uppermost part (that is, the peak) of the film CF in a certain local area of ​​the workpiece W and the lowermost part (that is, the valley) of the film CF as a film thickness parameter that directly or indirectly indicates the thickness of the film CF in the local area. In the case, the smaller the film thickness parameter, the thinner the thickness of the film CF. The reason is that the smaller the film thickness parameter, the lower the peak of the film CF corresponding to the thickness portion of the film CF.

[0317] like Fig.23 As shown, the control information generating unit 412 can set a non-processing area that the processing device 1 should not process on the surface of the workpiece W based on the thickness of the film CF (i.e., the film thickness parameter). For example, the control information generating unit 412 can set an area in the workpiece W where the thickness of the film CF is thinner than a predetermined thickness threshold as a non-processing area. For example, the control information generating unit 412 can set an area where the film thickness parameter is smaller than a predetermined thickness threshold as a non-processing area.

[0318] In this case, the thin non-processing area of ​​the film CF is not processed by the processing device 1, so the possibility of the film CF being removed in the non-processing area and the base material BM being exposed to the outside is reduced. Therefore, the processing device 1 can selectively process the film CF without exposing the base material BM from the film CF. For example, the processing device 1 can selectively process the rib structure on the film CF without exposing the base material BM corresponding to the base of the aircraft fuselage from the film CF corresponding to the coating film.

[0319] If this technical effect is taken into consideration, the specified thickness threshold for setting the non-processing area can be set to the following value: the value is a desired value that can distinguish between the thickness of the membrane CF that will cause the substrate BM to be exposed from the membrane CF when the processing device 1 processes the membrane CF, and the thickness of the membrane CF that will not expose the substrate BM from the membrane CF even if the processing device 1 processes the membrane CF.

[0320] Alternatively, the processing device 1 may process the non-processing area with a processing amount less than the usual processing amount. That is, the processing device 1 may process the non-processing area in a manner that the processing amount in the non-processing area is less than the processing amount in an area on the workpiece W that is different from the non-processing area. For example, the processing device 1 may control the focusing optical element 1211 so that the defocus amount of the processing light EL used to process the non-processing area is greater than the defocus amount of the processing light EL used to process the area different from the non-processing area, thereby processing the non-processing area with a processing amount less than the usual processing amount. As a result, even in the non-processing area, the processing device 1 can selectively process the film CF without exposing the substrate BM from the film CF.

[0321] In addition, the film CF may be formed again in the non-processed area where the thickness of the film CF is thin. For example, the non-processed area where the thickness of the film CF is thin may be re-coated as a finishing film for the film CF. In the above case, in order to form the film CF again (for example, to re-coat the finishing film), information on the thickness distribution of the film CF may be output from the control information generating unit 412 to the device that performs the re-formation of the film CF via the output device 45.

[0322] Furthermore, the control information generating unit 412 may also set the non-processing area regardless of the thickness of the film CF based on the measurement result of the workpiece W by the measuring device 2. Alternatively, when the workpiece W does not include the base material BM and the film CF, the control information generating unit 412 may also set the non-processing area based on the measurement result of the workpiece W by the measuring device 2.

[0323] As an example, the control information generating unit 412 may determine whether a defect has occurred in the workpiece W based on the measurement result of the workpiece W by the measuring device 2. The defect may include a defect that makes it difficult for the processing device 1 to perform appropriate processing. In the case where it is determined that a defect has occurred in the workpiece W, the control information generating unit 412 may set the defective area in the workpiece W where the defect has been determined to have occurred as a non-processing area that the processing device 1 should not process.

[0324] As another example, the control information generating unit 412 may also determine whether there is a structure in the workpiece W that should not be processed by the processing device 1 based on the measurement result of the workpiece W by the measuring device 2. For example, when the workpiece W is an airplane, as an example of a structure that should not be processed by the processing device 1, at least one of a rivet (especially its head) and a bolt (especially its head) can be listed. In the case where it is determined that there is a structure in the workpiece W that should not be processed by the processing device 1, the control information generating unit 412 may set the area in the workpiece W where the structure that should not be processed by the processing device 1 exists as a non-processing area that should not be processed by the processing device 1.

[0325] When the non-processing area is set, the control information generating unit 412 may store information related to the non-processing area in the processing information DB 421 related to the processing device 1. The information related to the non-processing area stored in the processing information DB 421 may be presented to the operator (for example, the user of the processing system SYS) as described in detail later in the third modification.

[0326] (3) Technical effects of the processing system SYS

[0327] As described above, the processing system SYS of this embodiment includes a movable processing device 1 and a measuring device 2 that can move independently of the processing device 1. Therefore, compared with the processing system of the comparative example in which the processing device 1 and the measuring device 2 are integrated (that is, the processing device 1 and the measuring device 2 cannot be moved separately), the possibility that the processing position of the processing performed by the processing device 1 is restricted by the measurement position measured by the measuring device 2 becomes less likely. Similarly, the measurement position measured by the measuring device 2 is less likely to be restricted by the processing position of the processing performed by the processing device 1. Therefore,

[0328] The machining system SYS can efficiently perform machining and measurement on the workpiece W by separately using the machining device 1 and the measuring device 2 .

[0329] Furthermore, in the present embodiment, the machining system SYS can calculate the target movement path TR of each of the machining head 12 and the measuring head 22 based on the model data representing the three-dimensional model of the workpiece W and the position information representing the measurement result of the position of the workpiece W by the position measuring device 3. Therefore, the machining system SYS can generate the target movement path TR with high accuracy compared to the case where the model data and the position information representing the measurement result of the position of the workpiece W by the position measuring device 3 dedicated to measuring the position of the measurement object are not used.

[0330] Furthermore, in the present embodiment, the machining system SYS can move the machining head 12 or the measuring head 22 based on the position information indicating the measurement result of the position of the machining device 1 or the measuring device 2 by the position measuring device 3 after the machining head 12 or the measuring head 22 enters the fine adjustment area AA. Therefore, the machining system SYS can move the machining head 12 or the measuring head 22 to a more accurate position near the workpiece W. Furthermore, since the machining system SYS can recognize the accurate position of the machining head 12 or the measuring head 22, it is possible to move the machining head 12 or the measuring head 22 while preventing the machining device 1 or the measuring device 2 from colliding with the workpiece W.

[0331] (4) Modification

[0332] Next, a modification of the machining system SYS will be described.

[0333] (4-1) First Modification

[0334] First, refer to Fig.24 A first modified example of the machining system SYS will be described. Fig.24 1 is a block diagram showing a configuration of a first modification of the machining system SYS. In the following description, the first modification of the machining system SYS is referred to as a "machining system SYSa".

[0335] like Fig.24 As shown, the processing system SYSa in the first modification is different from the processing system SYS described above in that it may include a plurality of processing devices 1 and a plurality of measuring devices 2. However, the processing system SYSa may include a plurality of processing devices 1 and a single measuring device 2. The processing system SYSa may include a single processing device 1 and a plurality of measuring devices 2. Other features of the processing system SYSa may be the same as those of the processing system SYS.

[0336] The number of processing devices 1 may be the same as the number of measuring devices 2. Alternatively, the number of processing devices 1 may be different from the number of measuring devices 2. For example, the number of processing devices 1 may be greater than the number of measuring devices 2. For example, the number of measuring devices 2 may be greater than the number of processing devices 1.

[0337] The control server 4 may be capable of controlling a plurality of processing devices 1. When the plurality of processing devices 1 are arranged at the same location, the control server 4 may function as an edge server arranged at the location where the plurality of processing devices 1 are arranged. The control server 4 may also function as a cloud server arranged on the network from the perspective of the plurality of processing devices 1. When at least two of the plurality of processing devices 1 are arranged at different locations, the control server 4 may function as a cloud server arranged on the network from the perspective of the plurality of processing devices 1.

[0338] The control server 4 may be capable of controlling a plurality of measuring devices 2.

[0339] In the case of the same location, the control server 4 can function as an edge server configured at the location where the multiple measuring devices 2 are configured. The control server 4 can also function as a cloud server configured on the network from the perspective of the multiple measuring devices 2. In the case where at least two of the multiple measuring devices 2 are configured at different locations, the control server 4 can function as a cloud server configured on the network from the perspective of the multiple measuring devices 2.

[0340] The processing system SYSa can use at least two of the plurality of processing devices 1 for different purposes. The processing system SYSa can use at least two of the plurality of measuring devices 2 for different purposes. Fig.25 (a) to Fig.25 (c) of the present invention describes an example of the use of at least two processing devices 1 and the use of at least two measuring devices 2.

[0341] like Fig.25 As shown in (a), the processing system SYSa may be: the first measuring device 2 (2#1) is used for the purpose of the pre-measurement, and the second measuring device 2 (2#2) different from the first measuring device 2#1 is used for the purpose of the post-measurement. In the case, Fig.25 As shown in (a), the first measuring device 2#1 can perform a preliminary measurement for measuring the first part P11 of the workpiece W. Thereafter, the control server 4 can generate processing control information for controlling the processing device 1 to process the first part P11 based on the result of the preliminary measurement performed by the first measuring device 2#1. Thereafter, the processing device 1 can process the first part P11 based on the processing control information. Thereafter, the second measuring device 2#2 can perform a post-measurement for measuring the first part P11 of the workpiece W processed by the processing device 1.

[0342] like Fig.25 As shown in (b), the processing system SYSa may be: the first processing device 1 (1#1) is used to process the workpiece W with a first processing accuracy, and the second processing device 1 (1#2) different from the first processing device 1#1 is used to process the workpiece W with a second processing accuracy higher than the first processing accuracy. In the case, the processing performed by the first processing device 1#1 may also be called rough processing, and the processing performed by the second processing device 1#2 may also be called finishing or fine processing. Furthermore, the processing system SYSa may be: the third measuring device 2 (2#3) is used for the purpose of performing preliminary measurement in order to generate processing control information for the first processing device 1#1, and the fourth measuring device 2 (2#4) different from the third measuring device 2#3 is used for the purpose of performing preliminary measurement in order to generate processing control information for the second processing device 1#2. In the case, Fig.25As shown in (b), the third measuring device 2#3 can perform preliminary measurement for measuring the second part P12 of the workpiece W. Thereafter, the control server 4 can generate first processing control information for controlling the first processing device 1#1 to process the second part P12 based on the result of the preliminary measurement performed by the third measuring device 2#3. Thereafter, the first processing device 1#1 can process the second part P12 based on the first processing control information. Thereafter, the fourth measuring device 2#4 can perform preliminary measurement for measuring the second part P12 of the workpiece W processed by the first processing device 1#1. Thereafter, the control server 4 can generate second processing control information for controlling the second processing device 1#2 to process the second part P12 based on the result of the preliminary measurement performed by the fourth measuring device 2#4. Thereafter, the second processing device 1#2 can process the second part P12 based on the second processing control information.

[0344] The difference between the first processing device 1#1 and the second processing device 1#2 may be that the characteristics of the processing light EL used by the first processing device 1#1 are different from the characteristics of the processing light EL used by the second processing device 1#2. For example, in order to process the workpiece W with the first processing accuracy, the first processing device 1#1 may use pulse light with a pulse width of nanoseconds (for example, pulse light generated by a CO2 laser). In this case, the processing performed by the first processing device 1#1 may be thermal processing. For example, in order to process the workpiece W with the second processing accuracy, the second processing device 1#2 may use pulse light with a pulse width of picoseconds or femtoseconds. In this case, the processing performed by the second processing device 1#2 may be non-thermal processing (for example, ablation processing).

[0345] like Fig.25As shown in (c), the processing system SYSa may be used to process the workpiece W in such a way that the flatness of the surface of the workpiece W becomes smaller than that before processing (that is, the surface of the workpiece W is close to a plane), and the fourth processing device 1 (1#4) different from the third processing device 1#3 is used to process the workpiece W in such a way that the rib structure is formed on the surface of the workpiece W. Alternatively, the processing system SYSa may also use the third processing device 1 (1#3) to reduce or eliminate fine concave and convex on the surface of the workpiece W (specifically, fine concave and convex distributed at a pitch shorter than the pitch of the corrugations on the entire surface of the workpiece W). In the above case, the processing performed by the third processing device 1#3 may also be called plane processing, and the processing performed by the fourth processing device 1#4 may also be called rib processing. Furthermore, the processing system SYSa may use the fifth measuring device 2 (2#5) for the purpose of pre-measurement for generating processing control information of the third processing device 1#3, and use the sixth measuring device 2 (2#6) different from the fifth measuring device 2#5 for the purpose of pre-measurement for generating processing control information of the fourth processing device 1#4. Fig.25 As shown in (c), the fifth measuring device 2#5 can perform preliminary measurement for measuring the third part P13 of the workpiece W. Thereafter, the control server 4 can generate third processing control information for controlling the third processing device 1#3 to process the third part P13 based on the result of the preliminary measurement performed by the fifth measuring device 2#5. Thereafter, the third processing device 1#3 can process the third part P13 based on the third processing control information. Thereafter, the sixth measuring device 2#6 can perform preliminary measurement for measuring the third part P13 of the workpiece W processed by the third processing device 1#3. Thereafter, the control server 4 can generate fourth processing control information for controlling the fourth processing device 1#4 to process the third part P13 based on the result of the preliminary measurement performed by the sixth measuring device 2#6. Thereafter, the fourth processing device 1#4 can process the third part P13 based on the fourth processing control information.

[0346] However, in Fig. 22 When the workpiece W includes a substrate BM and a film CF and the surface of the substrate BM is a curved surface as shown, the processing system SYS can also use the third processing device 1 (1#3) for a purpose different from the purpose of reducing the workpiece W compared to before processing. Specifically, the processing system SYS can use the third processing device 1 (1#3) for a purpose of making the shape of the surface of the workpiece W (in this case, the surface of the film CF) similar to the surface of the substrate BM curved compared to before processing. That is,

[0347] The third processing device 1 (1#3) can process the film CF so that the shape of the surface of the film CF is the same as the surface of the substrate BM. As an example, the third processing device 1 (1#3) can determine the shape of the surface of the substrate BM based on a three-dimensional model representing the three-dimensional shape of the substrate BM, and process the film CF based on the determined shape of the surface of the substrate BM so that the shape of the surface of the film CF formed on the curved surface area in the substrate BM is the same as the surface of the curved surface area of ​​the substrate BM. In the case, the third processing device 1 (1#3) can process the film CF so that the curvature of the surface of the film CF is less than a specified ratio. The third processing device 1 (1#3) can also process the film CF so that the fine concave-convex (specifically, the fine concave-convex distributed at a pitch shorter than the pitch of the corrugations on the surface of the film CF as a whole) on the surface of the film CF is reduced or disappears.

[0348] (4-2) Second Modification

[0349] Next, a second modification of the processing system SYS will be described. In the following description, the second modification of the processing system SYS will be referred to as "processing system SYSb". The processing system SYSb in the second modification is different from the processing system SYS or the processing system SYSa described above in that it includes a processing device 1b instead of the processing device 1. Other features of the processing system SYSb may be the same as those of the processing system SYS or the processing system SYSa. Therefore, the following reference is made to Fig.26 The structure of the processing device 1b in the second modification example will be described. Fig.26 It is a block diagram showing the structure of a processing device 1b in a second modification.

[0350] like Fig.26 As shown, the processing device 1b in the second modification is different from the processing device 1 described above in that it further includes a peripheral monitoring device 15b. The other features of the processing device 1b may be the same as those of the processing device 1.

[0351] The surrounding monitoring device 15b is a device capable of monitoring the surrounding conditions of the processing device 1. For example, the surrounding monitoring device 15b may include an object detection device capable of detecting objects existing around the processing device 1. As an example of an object existing around a processing device 1, at least one of a workpiece W, other processing devices 1, a measuring device 2, and other obstacles can be listed. As an example of such a surrounding monitoring device 15b, at least one of a three-dimensional (3D) scanner, a camera device, a radar, and a light detection and ranging (LiDAR) can be listed.

[0352] When the processing device 1 moves along the target movement path TR, it can use the monitoring results obtained by the surrounding monitoring device 15b to perform simultaneous localization and mapping (SLAM) movement. Specifically, the processing device 1 can infer the position of the processing device 1 itself based on the monitoring results obtained by the surrounding monitoring device 15b. Furthermore, the processing device 1 can reflect the monitoring results obtained by the surrounding monitoring device 15b in the map information generated by the control server 4. For example, the processing device 1 can update the map information so that information related to the objects detected by the surrounding monitoring device 15b as objects existing in the vicinity of the processing device 1 is included in the map information generated by the control server 4. Therefore, when performing SLAM movement, the processing device 1 can obtain map information from the control server 4 and update the obtained map information. Thereafter, the processing device 1 can update the map information based on the position of the processing device 1 itself.

[0353] The inference result and the updated map information are used to move along the target movement path TR. In the above case, even if the position measuring device 3 does not measure the position of the processing device 1 during the movement of the processing device 1 along the target movement path TR, the processing device 1 can move with relatively good accuracy. Alternatively, even if the processing device 1 deviates from the measurement field of view of the position measuring device 3 during the movement of the processing device 1 along the target movement path TR, the processing device 1 can move with relatively good accuracy. Alternatively, even if the processing device 1 is in the blind spot of the measurement field of view of the position measuring device 3 during the movement of the processing device 1 along the target movement path TR, the processing device 1 can move with relatively good accuracy.

[0354] The processing device 1 may send information related to the monitoring result obtained by the surrounding monitoring device 15b to the control server 4. The control server 4 may reflect the monitoring result obtained by the surrounding monitoring device 15b in the map information. For example, the control server 4 may update the map information so that information related to the object detected by the surrounding monitoring device 15b as an object existing in the surrounding of the processing device 1 is included in the map information. Thereafter, the control server 4 may calculate the target movement path TR based on the updated map information. That is, the control server 4 may generate the processing control information (and the measurement control information) including the target movement path TR based on the updated map information.

[0355] In the case where the processing device 1 includes a plurality of different types of surrounding monitoring devices 15b, the processing device 1 can select at least one monitoring result with high reliability from a plurality of monitoring results obtained by the plurality of different types of surrounding monitoring devices 15b, and perform SLAM movement based on the selected at least one monitoring result. The control server 4 can select at least one monitoring result with high reliability from a plurality of monitoring results obtained by the plurality of different types of surrounding monitoring devices 15b, and update the map information (i.e., calculate the target movement path TR) based on the selected at least one monitoring result. As an example, in the case where the processing device 1 includes a 3D scanner, a camera device, and LiDAR as a plurality of different types of surrounding monitoring devices 15b, the reliability of the monitoring result obtained by LiDAR is the highest, the reliability of the monitoring result obtained by the camera device is the second highest, and the reliability of the monitoring result obtained by the 3D scanner is the third highest. In the above case, the processing device 1 can use the monitoring result obtained by LiDAR to perform SLAM movement in principle. In the case where the monitoring result obtained by LiDAR cannot be used, the processing device 1 can use the monitoring result obtained by the camera device to perform SLAM movement. In the case where the monitoring results obtained by the camera device cannot be used, the processing device 1 can use the monitoring results obtained by the 3D scanner to perform SLAM movement. In principle, the control server 4 can use the monitoring results obtained by LiDAR to update the map information. In the case where the monitoring results obtained by LiDAR cannot be used, the control server 4 can use the monitoring results obtained by the camera device to update the map information. In the case where the monitoring results obtained by the camera device cannot be used, the control server 4 can use the monitoring results obtained by the 3D scanner to update the map information.

[0356] In the above description, the processing device 1b includes the peripheral monitoring device 15b, but the measuring device 2 may include the peripheral monitoring device 15b. In this case, the peripheral monitoring device 15b of the measuring device 2 can monitor the conditions around the measuring device 2.

[0357] When the measuring device 2 moves along the target movement path TR, the monitoring result obtained by the surrounding monitoring device 15b can be used to perform SLAM movement. The control server 4 can update the map information so that information about objects detected by the surrounding monitoring device 15b as objects existing around the measuring device 2 is included in the map information.

[0358] In addition, when the processing device 1b (or the measuring device 2) includes a camera as the surrounding monitoring device 15b, the image generated by the camera (i.e., the image result obtained by the camera) can be used in the maintenance work performed by the operator (e.g., the user of the processing system SYS) in addition to or instead of being used for the SLAM movement. For example, when the workpiece W is an aircraft, the image generated by the camera can be used in the maintenance work performed by the operator on the aircraft.

[0359] Alternatively, in addition to or instead of the processing device 1b (or the measuring device 2) including a camera as the surrounding monitoring device 15b, the processing system SYSb may also include a camera. For example, the processing system SYSb may include a camera that captures the workpiece W from a position where the workpiece W can be overlooked. In such a case, the image generated by the camera can also be used in the maintenance work performed by the operator (for example, the user of the processing system SYSb).

[0360] In the case where the processing system SYSb includes an imaging device, the imaging device can also be used as a position measuring device 3 capable of measuring the position of the workpiece W (and the respective positions of the processing device 1 and the measuring device 2). That is, the processing system SYSb can include an imaging device capable of functioning as the position measuring device 3. For example, the processing system SYSb can include a monocular camera or a stereo camera as the imaging device capable of functioning as the position measuring device 3. In the above case, the control server 4 can also calculate the position of the measurement object (that is, at least one of the workpiece W, the processing device 1 and the measuring device 2) based on the image generated by the imaging device. Therefore, the processing system SYSb can appropriately perform the processing action and the measuring action described above.

[0361] (4-3) Third Modification

[0362] Next, a third variation of the processing system SYS will be described. In the following description, the third variation of the processing system SYS will be referred to as "processing system SYSc". The processing system SYSc in the third variation is different from the processing system SYS, the processing system SYSa, or the processing system SYSb described above in that it includes a control server 4c instead of the control server 4. Other features of the processing system SYSc may be the same as those of the processing system SYS, the processing system SYSa, or the processing system SYSb. Therefore, the following reference is made to Fig. 27 The configuration of the control server 4 c in the third modification example will be described. Fig. 27 It is a block diagram showing the structure of the control server 4c in the third modification.

[0363] like Fig. 27As shown, the control server 4c in the third modification is different from the control server 4 described above in that a user interface (UI) display control unit 413c is implemented in the computing device 41. Other features of the control server 4c may be the same as those of the control server 4.

[0364] The UI display control unit 413c controls a display device as an example of the output device 45 to display

[0365] A path setting UI that can be operated by an operator (e.g., a user of the machining system SYSc) to set the target movement path TR. In this case, the operator can set the target movement path TR by operating the path setting UI using the input device 44. That is, in the third modification, the target movement path TR can be automatically calculated by the control information generating unit 412 or can be manually set by the operator.

[0366] For example, the operator can use the path setting UI to set the movement start position MS (see Fig.17 That is, the operator can use the route setting UI to input information related to the movement start position MS to the control server 4. For example, the operator can also use the route setting UI to set the movement end position ME (refer to Fig.17 That is, the operator may also use the path setting UI to input information related to the movement end position ME to the control server 4. For example, the operator may also use the path setting UI to set the processing start position PS (refer to Fig.17 That is, the operator can use the path setting UI to input information related to the processing start position PS to the control server 4. For example, the operator can also use the path setting UI to set the waiting position WP (see Fig.17 ). That is, the operator can input information related to the waiting position WP to the control server 4 using the route setting UI.

[0367] The control information generation unit 412 of the control server 4 can calculate the target movement path TR based on the information set by the operator. For example, the control information generation unit 412 can calculate the target movement path TR with the movement start position MS set by the operator as the starting point. For example, the control information generation unit 412 can also calculate the target movement path TR with the movement end position ME set by the operator as the end point. As a result, the control information generation unit 412 can calculate the target movement path that reflects the operator's wishes.

[0368] The control information generation unit 412 may also calculate a plurality of different moving paths as candidates for the target moving path TR. In the above case, the UI display control unit 413c may control a display device as an example of the output device 45 to display a path setting UI including a screen for the operator to select one of the plurality of different moving paths as the target moving path TR. The operator may select one of the plurality of different moving paths as the target moving path TR. The control information generation unit 412 may generate processing control information or measurement control information including the target moving path TR selected by the operator. As a result, the control information generation unit 412 may calculate the target moving path TR reflecting the operator's wishes.

[0369] The UI display control unit 413c can control a display device as an example of the output device 45 to display a path setting UI including a screen that displays the calculated target movement path TR. For example, the UI display control unit 413c can control a display device as an example of the output device 45 to display a path setting UI including a screen that displays (i.e., stereoscopically displays) the target movement path TR in a three-dimensional space equivalent to the reference coordinate system. For example, the UI display control unit 413c can control a display device as an example of the output device 45 to display a path setting UI including a screen that displays the target movement path TR in a two-dimensional plane obtained by projecting the three-dimensional space equivalent to the reference coordinate system onto a prescribed plane (e.g., an XY plane). As a result, the operator can intuitively recognize the target movement path TR.

[0370] The UI display control unit 413c may also control a display device as an example of the output device 45 to display a path setting UI including a screen for the operator to set a prohibited entry zone that the processing device 1 or the measuring device 2 is prohibited from entering. The operator may use the path setting UI to set the prohibited entry zone. The control information generation unit 412 may calculate a target movement path TR that does not pass through (i.e., avoid) the prohibited entry zone set by the operator. As a result, the control information generation unit 412 may calculate a target movement path TR that reflects the operator's wishes.

[0371] The UI display control unit 413c may also control a display device as an example of the output device 45 so as to display information related to the processing device 1 in addition to or instead of displaying the path setting GUI. For example, the UI display control unit 413c may display information related to the current position of the processing device 1. For example, the UI display control unit 413c may also display information related to the time required for the processing device 1 to move on the target movement path TR. For example, the UI display control unit 413c may also display information stored in the processing information DB 421. As a result, the operator can appropriately recognize the state of the processing device 1.

[0372] The UI display control unit 413c may also control a display device as an example of the output device 45 so as to display information related to the measuring device 2 in addition to or instead of displaying the path setting GUI. For example, the UI display control unit 413c may display information related to the current position of the measuring device 2. For example, the UI display control unit 413c may also display information related to the time required for the measuring device 2 to move on the target movement path TR. For example, the UI display control unit 413c may also display information stored in the measurement information DB 422. As a result, the operator (for example, the user of the processing system SYS) can appropriately recognize the state of the measuring device 2.

[0373] When the machining system SYS includes an imaging device capable of photographing the workpiece W as described in the second modification, the UI display control unit 413c may control a display device as an example of the output device 45 to display an image of the workpiece W generated by the imaging device. In such a case, the UI display control unit 413c may superimpose information related to the workpiece W on the image of the workpiece W. For example, the UI display control unit 413c may superimpose information related to the workpiece W stored in at least one of the machining information DB 421 and the measurement information DB 422 on the image of the workpiece W. As an example of the information related to the workpiece W stored in at least one of the processing information DB 421 and the measurement information DB 422, at least one of information related to a processing completed area of ​​the workpiece W where processing by the processing device 1 has been completed, information related to an unprocessed area of ​​the workpiece W where processing by the processing device 1 has not been completed, information related to a measurement completed area of ​​the workpiece W where measurement by the measuring device 2 has been completed, information related to an unprocessed area of ​​the workpiece W where measurement by the measuring device 2 has not been completed, information related to a non-processed area of ​​the workpiece W that should not be processed by the processing device 1, and information related to a poorly processed area of ​​the workpiece W that is determined to be improperly processed by the post-measurement. As a result, the operator can appropriately recognize the state of the workpiece W.

[0374] (4-4) Other Modifications

[0375] In the above description, the head drive system 13 of the processing device 1 includes a self-moving drive system 131 capable of self-moving on the support surface SS. However, the head drive system 13 may include a flight drive system such as a drone capable of moving in a three-dimensional space on the basis of or in place of the self-moving drive system 131. The flight drive system is a drive system capable of flying. The flight drive system is a drive system that moves the arm drive system 132, the micro-motion drive system 133, and the processing head 12 by flying together with the arm drive system 132, the micro-motion drive system 133, and the processing head 12. In addition, the head drive system 23 of the measuring device 2 may also include a flight drive system that moves the arm drive system 232, the micro-motion drive system 233, and the measuring head 22 by flying together with the arm drive system 232, the micro-motion drive system 233, and the measuring head 22 on the basis of or in place of the self-moving drive system 231. In addition, the head drive system 13 may include a three-dimensional drive mechanism that moves the arm drive system 132, the micro-drive system 133, and the processing head 12 (the arm drive system 232, the micro-drive system 233, and the measuring head 22) in three-dimensional space, based on or in place of the flight drive system that can move in three-dimensional space. The head drive system 23 may include a three-dimensional drive mechanism that moves the arm drive system 232, the micro-drive system 233, and the measuring head 22 in three-dimensional space, based on or in place of the flight drive system that can move in three-dimensional space. As an example of such a three-dimensional drive mechanism, for example, a gantry stage can be cited.

[0376] In the above description, the processing device 1 processes the workpiece W, and the measuring device 2 measures the workpiece W. However, the processing device 1 may also be configured to: process the workpiece W, and measure the workpiece W. For example, the processing device 1 may process the workpiece W by irradiating the workpiece W with the processing light EL via the processing optical system 121, and measure the workpiece W by irradiating the workpiece W with the measuring light ML via the same processing optical system 121. Similarly, the processing device 1 may also be configured to: measure the workpiece W, and process the workpiece W. For example, the measuring device 2 may measure the workpiece W by irradiating the workpiece W with the measuring light ML via the measuring optical system (not shown) included in the measuring unit 221, and process the workpiece W by irradiating the workpiece W with the processing light EL via the same measuring optical system.

[0377] In the above case, the machining system SYS may include a machining device 1 capable of machining and measuring the workpiece W, and a measuring device 2 capable of machining and measuring the workpiece W. The machining system SYS may also include a machining device 1 capable of machining and measuring the workpiece W, and a measuring device 2 capable of not machining the workpiece W but measuring the workpiece W. The machining system SYS may also include a machining device 1 capable of machining the workpiece W but not measuring the workpiece W, and a measuring device 2 capable of machining and measuring the workpiece W.

[0378] In the above description, the control server 4 calculates the target movement path TR of each of the machining head 12 and the measuring head 22. However, the target movement path TR of at least one of the machining head 12 and the measuring head 22 may be calculated by a device different from the control server 4. For example, the target movement path TR of at least one of the machining head 12 and the measuring head 22 may be calculated by the control device 14 of the machining device 1.

[0379] For example, the control device 24 of the measuring device 2 may calculate the target movement path TR of at least one of the machining head 12 and the measuring head 22 .

[0380] The processing system SYS may include a drawing device for drawing line marks representing the target movement path TR on the support surface SS. For example, the processing system SYS may include a projection device for projecting the line marks representing the target movement path TR onto the support surface SS as a drawing device. The processing system SYS may also include a laser irradiation device for drawing the line marks representing the target movement path TR on the support surface SS with laser light as a drawing device. The processing device 1 and the measuring device 2 may move along the line marks projected on the support surface SS (that is, along the target movement path TR). For example, the processing device 1 may include a camera for photographing the line marks projected on the support surface SS, and move based on the image generated by the camera so that the self-moving drive system 131 moves along the line marks. For example, the measuring device 2 may include a camera for photographing the line marks projected on the support surface SS, and move based on the image generated by the camera so that the self-moving drive system 231 moves along the line marks. In the case, the control server 4 may not send information related to the target movement path TR to each of the processing device 1 and the measuring device 2.

[0381] The processing system SYS may also include a movement restriction device that restricts the movement of each of the processing device 1 and the measuring device 2. For example, the processing system SYS may include an infrared transceiver as the movement restriction device, and the infrared transceiver can use infrared rays to set a prohibited entry zone that prohibits the processing device 1 and the measuring device 2 from entering. In this case, the processing system SYS can appropriately prevent the processing device 1 and the measuring device 2 from entering the prohibited entry zone. In addition, the control server 4 can also switch the state of the infrared transceiver between an on state in which the prohibited entry zone is set and an off state in which the prohibited entry zone is not set.

[0382] In the above description, the machining system SYS may also include a holding device including an end effector capable of holding the workpiece W. The holding device may be a device different from the machining device 1 in that it includes an end effector instead of the machining head 12. The holding device may also be a device different from the measuring device 2 in that it includes an end effector instead of the measuring head 22. The end effector may include a robot hand capable of gripping the workpiece W. The end effector may also include an adsorption mechanism capable of adsorbing the workpiece W.

[0383] In the above description, the processing device 1 processes the workpiece W by irradiating the processing light EL onto the workpiece W. However, the processing device 1 may also process the workpiece W by irradiating an arbitrary energy beam different from light (the energy beam may also be referred to as a "processing beam") onto the workpiece W. In the above case, the processing device 1 may include a beam source capable of generating an arbitrary energy beam in addition to or in place of the processing light source 11. As an example of an arbitrary energy beam, a charged particle beam such as an electron beam and an ion beam may be cited. As another example of an arbitrary energy beam, an electromagnetic wave may be cited.

[0384] The processing device 1 can process the workpiece W by irradiating a single processing beam (for example, a single processing light EL) to the workpiece W. Alternatively, the processing device 1 can also process the workpiece W by irradiating a plurality of processing beams (for example, a plurality of processing lights EL) to the workpiece W at the same time.

[0385] When irradiating a plurality of machining beams at the same time, the machining device 1 can form a plurality of grooves for forming the rib structure using the plurality of machining beams, respectively.

[0386] When a plurality of machining beams are used to form the rib structure, the control server 4 can calculate the pitch of the grooves to be formed on the surface of the workpiece W by performing a fluid analysis for analyzing the flow of the fluid on the surface of the workpiece W. The machining device 1 can form the rib structure by irradiating the plurality of machining beams to different positions on the surface of the workpiece W based on the pitch calculated by the control server 4. Even when the pitch of the grooves changes depending on the position on the surface of the workpiece W, the numerical aperture of the machining optical system 121 included in the machining device 1 can be constant.

[0387] Alternatively, the processing device 1 may also form the rib structure using interference light obtained by interfering at least two of the plurality of processing beams. For example, the processing device 1 may form interference fringes on the surface of the workpiece W using the interference light, and remove the portion of the workpiece W that is illuminated by the bright portion of the interference fringes. As a result, a rib structure having a pitch corresponding to the interference fringes is formed.

[0388] (5) Notes

[0389] The following additional notes are further described with respect to the above-described embodiment.

[0390] [Note 1]

[0391] A processing system for processing an object.

[0392] The processing system comprises:

[0393] a processing device capable of processing the object by irradiating the object with a processing beam;

[0394] a measuring device capable of measuring the position of the object and the position of the processing device; and

[0395] a control device capable of controlling the processing device,

[0396] The processing device comprises:

[0397] A first moving device capable of changing the position of a machining head that emits the machining beam; and

[0398] a second mobile device, which carries the first mobile device and can move together with the first mobile device;

[0399] The control device controls movement by the second moving device based on the measurement result of the measuring device and model information related to the shape of the object.

[0400] [Note 2]

[0401] The processing system according to Supplement 1, wherein:

[0402] The control device calculates a target movement path, which is a movement path between a movement start position from which the second movement device starts to move and a first target position, based on the measurement result and the model information.

[0403] The second moving device is capable of moving along the target moving path.

[0404] [Note 3]

[0405] The processing system according to Supplement 2, wherein:

[0406] The second moving device moves the processing head along the target moving path until the processing head is

[0407] the distance between the machining head and the first target position becomes shorter than a specified distance,

[0408] At least one of the first moving device and the second moving device moves the machining head to the first target position based on the measurement result of the measuring device after the distance between the machining head and the first target position becomes shorter than the predetermined distance.

[0409] [Note 4]

[0410] A processing system according to any one of Notes 1 to 3, wherein:

[0411] The second moving device moves the processing device with a first moving accuracy until the distance between the processing device and a position where the movement performed by the second moving device ends, i.e., a movement end position, becomes shorter than a specified distance, and after the distance between the processing device and the movement end position becomes shorter than the specified distance, the processing device is moved with a second moving accuracy that is higher than the first moving accuracy.

[0412] [Note 5]

[0413] A processing system according to any one of Supplementary Notes 1 to 4, wherein:

[0414] The processing device further includes a monitoring device capable of monitoring the surrounding conditions of the processing device.

[0415] The control device calculates a target movement path, which is a movement path between a movement start position from which the second movement device starts movement and a first target position, based on the measurement result, the model information, and a monitoring result obtained by the monitoring device.

[0416] [Note 6]

[0417] A processing system according to any one of Notes 1 to 5, wherein:

[0418] The control device at least obtains position information related to the position of the first part of the object as the measurement result, and performs fitting processing on the first part of the three-dimensional model of the object having the shape represented by the model information at the position of the first part of the object in the coordinate system of the position information, thereby generating object position information representing the position of the first part of the object in the coordinate system and the position of the second part of the object different from the first part, and based on the object position information, calculates a moving path between the moving start position where the movement starts by the second moving device to the first target position, i.e., a target moving path.

[0419] [Note 7]

[0420] A processing system according to Appendix 2 or 3, wherein:

[0421] The movement start position is input based on the measurement result of the measurement device.

[0422] [Note 8]

[0423] A processing system according to Appendix 2, 3 or 7, wherein:

[0424] The movement start position is input by an operator.

[0425] [Note 9]

[0426] The processing system according to Appendix 2, 3, 7 or 8, wherein:

[0427] The first moving device is capable of moving the position of the processing head from the first target position

[0428] To the second target location,

[0429] The distance between a processing start position where processing is started by the processing device and the second target position is shorter than the distance between the processing start position and the first target position, or the processing start position is the second target position.

[0430] [Note 10]

[0431] A processing system according to Supplementary Note 9, wherein:

[0432] At least one of the movement start position and the processing start position is input by an operator.

[0433] [Note 11]

[0434] A processing system according to Supplement 9 or 10, wherein:

[0435] At least one of the first target position and the second target position is input by an operator.

[0436] [Note 12]

[0437] A processing system according to any one of Notes 9 to 11, wherein:

[0438] The control device

[0439] acquiring the first target position based on at least one of the movement start position, the processing start position and the model information, and

[0440] The second target position is acquired based on at least one of the movement start position, the processing start position, and the model information.

[0441] [Note 13]

[0442] A processing system according to any one of Notes 9 to 12, wherein:

[0443] The second target position is the processing start position,

[0444] The first target position is located between the movement start position and the processing start position.

[0445] [Note 14]

[0446] A processing system according to any one of Notes 1 to 13, wherein:

[0447] The first moving device is capable of moving the position of the processing head from a first target position to a second target position.

[0448] The distance between a processing start position where processing is started by the processing device and the second target position is shorter than the distance between the processing start position and the first target position, or the processing start position is the second target position.

[0449] [Note 15]

[0450] A processing system according to any one of Notes 1 to 14, wherein:

[0451] The measuring device is capable of measuring the position of the object at a position separated from the object and the processing device,

[0452] The control device acquires the position information of the object from the measuring device as the measurement result.

[0453] [Note 16]

[0454] A processing system according to any one of Notes 1 to 15, wherein:

[0455] The measuring device is capable of measuring the positions of each of the plurality of parts of the object.

[0456] [Note 17]

[0457] A processing system according to any one of Notes 1 to 16, wherein:

[0458] The processing system includes a plurality of the measuring devices,

[0459] A first measuring device among the plurality of measuring devices is capable of measuring a position of a second measuring device among the plurality of measuring devices.

[0460] [Note 18]

[0461] A processing system according to any one of Notes 1 to 17, wherein:

[0462] The amount of change in the position of the machining head caused by the second moving device is greater than the amount of change in the position of the machining head caused by the first moving device.

[0463] [Note 19]

[0464] A processing system according to any one of Notes 1 to 18, wherein:

[0465] The object that can be processed by the processing device includes at least one of an airplane, a windmill, an engine turbine, and a power generation turbine.

[0466] [Note 20]

[0467] A processing system according to any one of Notes 1 to 19, wherein:

[0468] The second moving device can move the processing head in a first axis direction and a second axis direction intersecting the gravity direction.

[0469] The first moving device can move the machining head in the first axis direction, the second axis direction, and a third axis direction intersecting the first axis direction and the second axis direction.

[0470] [Note 21]

[0471] A processing system according to Supplementary Note 20, wherein:

[0472] The first moving device can move the machining head in a first rotation direction about a rotation axis along the first axis direction, a second rotation direction about a rotation axis along the second axis direction, and a third rotation direction about a rotation axis along the third axis direction.

[0473] [Note 22]

[0474] A processing system for processing an object.

[0475] The processing system comprises:

[0476] a processing device capable of processing the object by irradiating the object with a processing beam; and

[0477] The measuring device comprises a measuring head, wherein the measuring head can measure the object to be processed by the processing device or the object processed by the processing device.

[0478] The processing device comprises:

[0479] A first moving device capable of changing the position of a machining head that emits the machining beam; and

[0480] a second mobile device, which carries the first mobile device and can move together with the first mobile device;

[0481] The measuring device comprises:

[0482] A third moving device capable of changing the position of the measuring head; and

[0483] The fourth moving device carries the third moving device and can move together with the third moving device.

[0484] [Note 23]

[0485] A processing system according to Supplementary Note 22, wherein:

[0486] The measuring device measures a first portion of the object,

[0487] The processing device processes the first portion by irradiating the first portion with the processing beam after the measuring device measures the first portion.

[0488] [Note 24]

[0489] A processing system according to Supplement 22 or 23, wherein:

[0490] The processing device processes the second portion of the object by irradiating the second portion with the processing beam.

[0491] The measuring device measures the second part after the processing device processes the second part.

[0492] [Note 25]

[0493] A processing system according to any one of Notes 22 to 24, wherein:

[0494] The processing device processes the third portion of the object by irradiating the third portion with the processing beam.

[0495] The measuring device measures the third portion during at least a portion of a period in which the processing device processes the third portion.

[0496] [Note 26]

[0497] A processing system according to Supplementary Note 22, wherein:

[0498] The measuring device measures a first part of the object at a first moment, and measures a second part of the object at a second moment later than the first moment,

[0499] At the second moment, the processing device processes the first part using the measurement result of the first part obtained by the measuring device.

[0500] [Note 27]

[0501] A processing system according to Supplementary Note 22, wherein:

[0502] The processing device processes a first portion of the object at a first moment, and processes a second portion of the object at a second moment later than the first moment,

[0503] The measuring device measures the first portion processed by the processing device at the second moment.

[0504] [Note 28]

[0505] A processing system according to any one of Notes 22 to 27, wherein:

[0506] The processing system includes a plurality of the processing devices.

[0507] [Note 29]

[0508] A processing system according to Supplementary Note 28, wherein:

[0509] a first processing device among the plurality of processing devices processes a fourth portion of the object by irradiating the fourth portion with the processing beam,

[0510] A second processing apparatus different from the first processing apparatus among the plurality of processing apparatuses processes the fourth portion by irradiating the fourth portion with the processing beam after the first processing apparatus processes the fourth portion.

[0511] [Note 30]

[0512] A processing system according to Supplementary Note 29, wherein:

[0513] The first processing device processes the fourth portion with a first processing accuracy,

[0514] The second processing device processes the fourth portion with a second processing accuracy higher than the first processing accuracy.

[0515] [Note 31]

[0516] A processing system according to Supplementary Note 29, wherein:

[0517] The first processing device processes the fourth portion so that the flatness of the surface of the fourth portion becomes smaller than that before the processing.

[0518] The second processing device processes the fourth portion so as to form a desired structure on the fourth portion.

[0519] [Note 32]

[0520] A processing system according to any one of Notes 22 to 31, wherein:

[0521] The processing system includes a plurality of the measuring devices.

[0522] [Note 33]

[0523] A processing system according to Supplement 32, wherein:

[0524] a first measuring device among the plurality of measuring devices measures a fifth portion of the object,

[0525] A second measuring device different from the first measuring device among the plurality of measuring devices measures the fifth portion after the first measuring device measures the fifth portion.

[0526] [Note 34]

[0527] A processing system according to any one of Notes 22 to 33, wherein:

[0528] The processing system further includes a control device for controlling at least one of the processing device and the measuring device.

[0529] [Note 35]

[0530] A processing system according to Supplement 34, wherein:

[0531] The control device controls the processing device to process the object based on the measurement result of the object by the measuring device.

[0532] [Note 36]

[0533] A processing system according to Appendix 34 or 35, wherein:

[0534] The control device determines whether the processing performed by the processing device is appropriate based on the measurement result of the object by the measuring device.

[0535] [Note 37]

[0536] A processing system according to Supplementary Note 36, wherein:

[0537] The control device controls the processing device to process the object when it is determined that the processing performed by the processing device is inappropriate.

[0538] [Note 38]

[0539] A processing system according to any one of Notes 34 to 37, wherein:

[0540] The processing system further includes a measuring device capable of measuring a position of the object and a position of the processing device.

[0541] The control device calculates a first target movement path, that is, a movement path from a first movement start position to a first target position where the second movement device starts moving, based on the measurement result of the measurement device.

[0542] The second moving device is capable of moving along the first target moving path.

[0543] [Note 39]

[0544] A processing system according to Supplement 38, wherein:

[0545] The determination device is further able to determine the position of the measuring device,

[0546] The control device calculates a second target movement path, which is a movement path between a second movement start position and a second target position where movement is started by the fourth movement device, based on the measurement result.

[0547] The fourth moving device is capable of moving along the second target moving path.

[0548] [Note 40]

[0549] A processing system according to any one of Notes 22 to 39, wherein:

[0550] The amount of change in the position of the machining head caused by the second moving device is greater than the amount of change in the position of the machining head caused by the first moving device.

[0551] The amount of change in the position of the measuring head caused by the fourth moving device is greater than the amount of change in the position of the measuring head caused by the third moving device.

[0552] [Note 41]

[0553] A processing system according to any one of Notes 34 to 39, wherein:

[0554] The object comprises a substrate and a film formed on the substrate.

[0555] The control device calculates the thickness of the film based on the measurement result of the object by the measuring device, and controls the processing device based on the calculated thickness of the film.

[0556] [Note 42]

[0557] A processing system according to Supplement 41, wherein:

[0558] The control device determines the thickness of the film in the object based on the calculated thickness of the film.

[0559] The processing device should not process the non-processing portion, and controls the processing device so as not to process the non-processing portion.

[0560] [Note 43]

[0561] A processing system according to Appendix 41 or 42, wherein:

[0562] The processing device includes an optical element capable of changing a convergence position of the processing beam in a direction intersecting the surface of the object,

[0563] The control device controls the optical element based on the calculated film thickness.

[0564] [Note 44]

[0565] A processing system according to any one of Notes 22 to 43, wherein:

[0566] The object that can be processed by the processing device includes at least one of an airplane, a windmill, and a turbine for power generation.

[0567] [Note 45]

[0568] A processing system according to any one of Notes 22 to 44, wherein:

[0569] The second moving device can move the processing head in a first axis direction and a second axis direction intersecting the gravity direction.

[0570] The first moving device is capable of moving the machining head in the first axis direction, the second axis direction, and a third axis direction intersecting the first axis direction and the second axis direction.

[0571] The fourth moving device can move the measuring head in the first axis direction and the second axis direction.

[0572] The third moving device can move the measuring head in the first axis direction, the second axis direction, and the third axis direction.

[0573] [Note 46]

[0574] A processing system according to Supplement 45, wherein:

[0575] The first moving device is capable of moving the machining head in a first rotation direction around a rotation axis along the first axis direction, a second rotation direction around a rotation axis along the second axis direction, and a third rotation direction around a rotation axis along the third axis direction.

[0576] The third movement device can move the measuring head in the first rotational direction, the second rotational direction and the third rotational direction.

[0577] [Note 47]

[0578] A processing system for processing an object.

[0579] The processing system comprises:

[0580] a processing device capable of processing the object by irradiating the object with a processing beam;

[0581] a measuring device capable of measuring the position of the object; and

[0582] a control device capable of controlling the processing device,

[0583] The processing device comprises:

[0584] A first moving device capable of changing the position of a machining head that emits the machining beam; and

[0585] a second moving device, which carries the first moving device and is movable on a first plane,

[0586] The control device controls the movement on the first plane by the second movement device based on the measurement result of the measurement device and the model information related to the shape of the object.

[0587] [Note 48]

[0588] A processing system for processing an object.

[0589] The processing system comprises:

[0590] a processing device capable of processing the object by irradiating the object with a processing beam;

[0591] A camera device capable of photographing the object; and

[0592] a control device capable of controlling the processing device,

[0593] The processing device comprises:

[0594] A first moving device capable of changing the position of a machining head that emits the machining beam; and

[0595] a second moving device, which carries the first moving device and is movable on a first plane,

[0596] The control device controls the movement on the first plane by the second movement device based on the image pickup result of the image pickup device and the model information related to the shape of the object.

[0597] [Note 49]

[0598] A measurement system comprising:

[0599] Measuring devices, including measuring heads capable of measuring the position or shape of an object;

[0600] a determination device capable of determining the position of the object and capable of determining the position of the measuring device; and

[0601] a control device capable of controlling the measuring device,

[0602] The measuring device comprises:

[0603] A first moving device capable of changing the position of the measuring head; and

[0604] a second moving device, which carries the first moving device and is movable on a first plane,

[0605] The control device controls the movement on the first plane by the second movement device based on the measurement result of the measurement device and the model information related to the shape of the object.

[0606] [Note 50]

[0607] A measurement system comprising:

[0608] Measuring devices, including measuring heads capable of measuring the position or shape of an object;

[0609] a measuring device capable of measuring the position of the object; and

[0610] a control device capable of controlling the measuring device,

[0611] The measuring device comprises:

[0612] A first moving device capable of changing the position of the measuring head; and

[0613] a second moving device, which carries the first moving device and is movable on a first plane,

[0614] The control device controls the movement on the first plane by the second movement device based on the measurement result of the measurement device and the model information related to the shape of the object.

[0615] [Note 51]

[0616] A measurement system comprising:

[0617] Measuring devices, including measuring heads capable of measuring the position or shape of an object;

[0618] A camera device capable of photographing the object; and

[0619] a control device capable of controlling the measuring device,

[0620] The measuring device comprises:

[0621] A first moving device capable of changing the position of the measuring head; and

[0622] a second moving device, which carries the first moving device and is movable on a first plane,

[0623] The control device controls the movement on the first plane by the second movement device based on the image pickup result of the image pickup device and the model information related to the shape of the object.

[0624] [Note 52]

[0625] A processing system for processing an object.

[0626] The processing system comprises:

[0627] a processing device capable of processing the object by irradiating the object with a processing beam;

[0628] a measuring device capable of measuring the position of the object; and

[0629] a control device capable of controlling the processing device,

[0630] The processing device comprises:

[0631] A first moving device capable of changing the position of a machining head that emits the machining beam; and

[0632] The second moving device carries the first moving device and is movable on a first plane.

[0633] [Note 53]

[0634] A processing method uses a processing device to process an object, wherein the processing device includes: a first moving device capable of changing the position of a processing head that emits a processing beam; and a second moving device that carries the first moving device and can move together with the first moving device.

[0635] The processing method comprises:

[0636] Processing the object by irradiating the object with the processing beam from the processing head;

[0637] Determining the position of the object and the position of the processing device using a determination device; and

[0638] The movement by the second moving device is controlled based on the measurement result of the measuring device and the model information related to the shape of the object.

[0639] [Note 54]

[0640] A processing method for processing an object.

[0641] The processing method comprises:

[0642] Processing the object by irradiating the object with a processing beam from a processing device; and

[0643] Using a measuring head included in the measuring device, measuring the object to be processed by the processing device or the object processed by the processing device,

[0644] The processing device comprises:

[0645] A first moving device capable of changing the position of a machining head that emits the machining beam; and

[0646] a second mobile device, which carries the first mobile device and can move together with the first mobile device;

[0647] The measuring device comprises:

[0648] A third moving device capable of changing the position of the measuring head; and

[0649] The fourth moving device carries the third moving device and can move together with the third moving device.

[0650] [Note 55]

[0651] A processing method uses a processing device to process an object, wherein the processing device includes: a first moving device capable of changing the position of a processing head that emits a processing beam; and a second moving device that carries the first moving device and is capable of moving on a first plane.

[0652] The processing method comprises:

[0653] Processing the object by irradiating the object with the processing beam from the processing head;

[0654] determining a reference position serving as a reference for the object using a determination device; and

[0655] The movement on the first plane by the second movement device is controlled based on the measurement result of the measurement device and the model information related to the shape of the object.

[0656] [Note 56]

[0657] A processing method uses a processing device to process an object, wherein the processing device includes: a first moving device capable of changing the position of a processing head that emits a processing beam; and a second moving device that carries the first moving device and is capable of moving on a first plane.

[0658] The processing method comprises:

[0659] Processing the object by irradiating the object with the processing beam from the processing head;

[0660] photographing the object using a camera; and

[0661] Based on the imaging result of the imaging device and the model information related to the shape of the object, the movement on the first plane by the second movement device is controlled.

[0662] [Note 57]

[0663] A measuring method uses a measuring device to measure an object, wherein the measuring device comprises: a first moving device capable of changing the position of a measuring head; and a second moving device carrying the first moving device and capable of moving on a first plane.

[0664] The measuring method comprises:

[0665] Measuring the position or shape of the object using the measuring head;

[0666] determining the position of the object and the position of the measuring device using a determining device; and

[0667] The movement on the first plane by the second movement device is controlled based on the measurement result of the measurement device and the model information related to the shape of the object.

[0668] [Note 58]

[0669] A measuring method uses a measuring device to measure an object, wherein the measuring device comprises: a first moving device capable of changing the position of a measuring head; and a second moving device carrying the first moving device and capable of moving on a first plane.

[0670] The measuring method comprises:

[0671] Measuring the position or shape of the object using the measuring head;

[0672] determining the position of the object using a determining device; and

[0673] The movement on the first plane by the second movement device is controlled based on the measurement result of the measurement device and the model information related to the shape of the object.

[0674] [Note 59]

[0675] A measuring method uses a measuring device to measure an object, wherein the measuring device comprises: a first moving device capable of changing the position of a measuring head; and a second moving device carrying the first moving device and capable of moving on a first plane.

[0676] The measuring method comprises:

[0677] Measuring the position or shape of the object using the measuring head;

[0678] photographing the object using a camera; and

[0679] Based on the imaging result of the imaging device and the model information related to the shape of the object, the movement on the first plane by the second movement device is controlled.

[0680] The elements of the above-mentioned embodiments may be combined appropriately. Some of the elements of the above-mentioned embodiments may not be used. The elements of the above-mentioned embodiments may be replaced with elements of other embodiments appropriately. In addition, within the scope permitted by law, all public gazettes and U.S. patents related to the device, etc. cited in the above-mentioned embodiments are cited as part of the disclosure of this document.

[0681] In addition, the present invention can be appropriately modified within the scope that does not deviate from the gist or idea of ​​the invention that can be read from the claims and the entire specification, and the processing system, measurement system, processing method and measurement method accompanied by such changes are also included in the technical idea of ​​the present invention.

[0682] [Explanation of Symbols]

[0683] 1: Processing equipment

[0684] 12: Processing head

[0685] 13: Head drive system

[0686] 131: Self-propelled drive system

[0687] 132: Arm drive system

[0688] 14: Control device

[0689] 2: Measuring device

[0690] 22: Measuring head

[0691] 23: Head drive system

[0692] 231: Self-propelled drive system

[0693] 232: Arm drive system

[0694] 24: Control Device

[0695] 3: Position measurement device

[0696] 4: Control Server

[0697] EL: Processing Light

[0698] W: Workpiece

[0699] SYS: Processing system

Claims

1. A processing system for processing an object. The processing system comprises: a processing device capable of processing the object by irradiating the object with a processing beam; a measuring device capable of measuring the position of the object and the position of the processing device; as well as a control device capable of controlling the processing device, The processing device comprises: a first moving device capable of changing the position of a machining head emitting the machining beam; as well as a second mobile device, which carries the first mobile device and can move together with the first mobile device; The control device controls movement by the second moving device based on the measurement result of the measuring device and model information related to the shape of the object.

2. The processing system according to claim 1, wherein: The control device calculates a target movement path, which is a movement path between a movement start position from which the second movement device starts to move and a first target position, based on the measurement result and the model information. The second moving device is capable of moving along the target moving path.

3. The processing system according to claim 2, wherein: The second moving device moves the processing head along the target moving path until the distance between the processing head and the first target position becomes shorter than a predetermined distance. At least one of the first moving device and the second moving device moves the machining head to the first target position based on the measurement result of the measuring device after the distance between the machining head and the first target position becomes shorter than the predetermined distance.

4. The processing system according to any one of claims 1 to 3, wherein: The second moving device moves the processing device with a first moving accuracy until the distance between the processing device and a position where the movement performed by the second moving device ends, i.e., a movement end position, becomes shorter than a specified distance, and after the distance between the processing device and the movement end position becomes shorter than the specified distance, the processing device is moved with a second moving accuracy that is higher than the first moving accuracy.

5. The processing system according to any one of claims 1 to 4, wherein: The processing device further includes a monitoring device capable of monitoring the surrounding conditions of the processing device. The control device calculates a target movement path, which is a movement path between a movement start position from which the second movement device starts movement and a first target position, based on the measurement result, the model information, and a monitoring result obtained by the monitoring device.

6. The processing system according to any one of claims 1 to 5, wherein: The control device at least obtains position information related to the position of the first part of the object as the measurement result, and performs fitting processing on the first part of the three-dimensional model of the object having the shape represented by the model information at the position of the first part of the object in the coordinate system of the position information, thereby generating object position information representing the position of the first part of the object in the coordinate system and the position of the second part of the object different from the first part, and based on the object position information, calculates a moving path between the moving start position where the movement starts by the second moving device to the first target position, i.e., a target moving path.

7. The processing system according to claim 2 or 3, wherein: The movement start position is input based on the measurement result of the measurement device.

8. The processing system according to claim 2, 3 or 7, wherein: The movement start position is input by an operator.

9. A processing system according to claim 2, 3, 7 or 8, wherein: The first moving device is capable of moving the position of the processing head from the first target position to the second target position. The distance between a processing start position where processing is started by the processing device and the second target position is shorter than the distance between the processing start position and the first target position, or the processing start position is the second target position.

10. The processing system according to claim 9, wherein: At least one of the movement start position and the processing start position is input by an operator.

11. The processing system according to claim 9 or 10, wherein: At least one of the first target position and the second target position is input by an operator.

12. The processing system according to any one of claims 9 to 11, wherein: The control device acquiring the first target position based on at least one of the movement start position, the processing start position and the model information, and The second target position is acquired based on at least one of the movement start position, the processing start position, and the model information.

13. The processing system according to any one of claims 9 to 12, wherein: The second target position is the processing start position, The first target position is located between the movement start position and the processing start position.

14. The processing system according to any one of claims 1 to 13, wherein: The first moving device is capable of moving the position of the processing head from a first target position to a second target position. The distance between a processing start position where processing is started by the processing device and the second target position is shorter than the distance between the processing start position and the first target position, or the processing start position is the second target position.

15. The processing system according to any one of claims 1 to 14, wherein: The measuring device is capable of measuring the position of the object at a position separated from the object and the processing device, The control device acquires the position information of the object from the measuring device as the measurement result.

16. The processing system according to any one of claims 1 to 15, wherein: The measuring device is capable of measuring the positions of each of the plurality of parts of the object.

17. The processing system according to any one of claims 1 to 16, wherein: The processing system includes a plurality of the measuring devices, A first measuring device among the plurality of measuring devices is capable of measuring a position of a second measuring device among the plurality of measuring devices.

18. The processing system according to any one of claims 1 to 17, wherein: The amount of change in the position of the machining head caused by the second moving device is greater than the amount of change in the position of the machining head caused by the first moving device.

19. The processing system according to any one of claims 1 to 18, wherein: The object that can be processed by the processing device includes at least one of an airplane, a windmill, an engine turbine, and a power generation turbine.

20. The processing system according to any one of claims 1 to 19, wherein: The second moving device can move the processing head in a first axis direction and a second axis direction intersecting the gravity direction. The first moving device can move the machining head in the first axis direction, the second axis direction, and a third axis direction intersecting the first axis direction and the second axis direction.

21. The processing system according to claim 20, wherein: The first moving device can move the machining head in a first rotation direction around a rotation axis along the first axis direction, a second rotation direction around a rotation axis along the second axis direction, and a third rotation direction around a rotation axis along the third axis direction.

22. A processing system for processing an object. The processing system comprises: a processing device capable of processing the object by irradiating the object with a processing beam; The measuring device comprises a measuring head, wherein the measuring head can measure the object to be processed by the processing device or the object processed by the processing device. The processing device comprises: A first moving device capable of changing the position of a machining head that emits the machining beam; and a second mobile device, which carries the first mobile device and can move together with the first mobile device; The measuring device comprises: A third moving device capable of changing the position of the measuring head; and The fourth moving device carries the third moving device and can move together with the third moving device.

23. The processing system according to claim 22, wherein: The measuring device measures a first portion of the object, The processing device processes the first portion by irradiating the first portion with the processing beam after the measuring device measures the first portion.

24. The processing system according to claim 22 or 23, wherein: The processing device processes the second portion of the object by irradiating the second portion with the processing beam. The measuring device measures the second part after the processing device processes the second part.

25. A processing system according to any one of claims 22 to 24, wherein: The processing device processes the third portion of the object by irradiating the third portion with the processing beam. The measuring device measures the third portion during at least a portion of a period in which the processing device processes the third portion.

26. The processing system according to claim 22, wherein: The measuring device measures a first part of the object at a first moment, and measures a second part of the object at a second moment later than the first moment, At the second moment, the processing device processes the first part using the measurement result of the first part obtained by the measuring device.

27. The processing system of claim 22, wherein: The processing device processes a first portion of the object at a first moment, and processes a second portion of the object at a second moment later than the first moment, The measuring device measures the first portion processed by the processing device at the second moment.

28. A processing system according to any one of claims 22 to 27, wherein: The processing system includes a plurality of the processing devices.

29. The processing system according to claim 28, wherein: a first processing device among the plurality of processing devices processes a fourth portion of the object by irradiating the fourth portion with the processing beam, A second processing apparatus different from the first processing apparatus among the plurality of processing apparatuses processes the fourth portion by irradiating the fourth portion with the processing beam after the first processing apparatus processes the fourth portion.

30. The processing system according to claim 29, wherein: The first processing device processes the fourth portion with a first processing accuracy, The second processing device processes the fourth portion with a second processing accuracy higher than the first processing accuracy.

31. The processing system of claim 29, wherein: The first processing device processes the fourth portion so that the flatness of the surface of the fourth portion becomes smaller than that before the processing. The second processing device processes the fourth portion so as to form a desired structure on the fourth portion.

32. A processing system according to any one of claims 22 to 31, wherein: The processing system includes a plurality of the measuring devices.

33. The processing system according to claim 32, wherein: a first measuring device among the plurality of measuring devices measures a fifth portion of the object, A second measuring device different from the first measuring device among the plurality of measuring devices measures the fifth portion after the first measuring device measures the fifth portion.

34. A processing system according to any one of claims 22 to 33, wherein: The processing system further includes a control device for controlling at least one of the processing device and the measuring device.

35. The processing system of claim 34, wherein: The control device controls the processing device to process the object based on the measurement result of the object by the measuring device.

36. A processing system according to claim 34 or 35, wherein: The control device determines whether the processing performed by the processing device is appropriate based on the measurement result of the object by the measuring device.

37. The processing system of claim 36, wherein: The control device controls the processing device to process the object when it is determined that the processing performed by the processing device is inappropriate.

38. A processing system according to any one of claims 34 to 37, wherein: The processing system further includes a measuring device capable of measuring a position of the object and a position of the processing device. The control device calculates a first target movement path, that is, a movement path from a first movement start position to a first target position where the second movement device starts moving, based on the measurement result of the measurement device. The second moving device is capable of moving along the first target moving path.

39. The processing system of claim 38, wherein: The determination device is further able to determine the position of the measuring device, The control device calculates a second target movement path, which is a movement path between a second movement start position and a second target position where movement is started by the fourth movement device, based on the measurement result. The fourth moving device is capable of moving along the second target moving path.

40. A processing system according to any one of claims 22 to 39, wherein: The amount of change in the position of the machining head caused by the second moving device is greater than the amount of change in the position of the machining head caused by the first moving device. The amount of change in the position of the measuring head caused by the fourth moving device is greater than the amount of change in the position of the measuring head caused by the third moving device.

41. A processing system according to any one of claims 34 to 39, wherein: The object comprises a substrate and a film formed on the substrate. The control device calculates the thickness of the film based on the measurement result of the object by the measuring device, and controls the processing device based on the calculated thickness of the film.

42. The processing system according to claim 41, wherein: The control device determines a non-processing portion of the object that should not be processed by the processing device based on the calculated film thickness, and controls the processing device not to process the non-processing portion.

43. A processing system according to claim 41 or 42, wherein: The processing device includes an optical element capable of changing a convergence position of the processing beam in a direction intersecting the surface of the object, The control device controls the optical element based on the calculated film thickness.

44. A processing system according to any one of claims 22 to 43, wherein: The object that can be processed by the processing device includes at least one of an airplane, a windmill, and a turbine for power generation.

45. A processing system according to any one of claims 22 to 44, wherein: The second moving device can move the processing head in a first axis direction and a second axis direction intersecting the gravity direction. The first moving device is capable of moving the machining head in the first axis direction, the second axis direction, and a third axis direction intersecting the first axis direction and the second axis direction. The fourth moving device can move the measuring head in the first axis direction and the second axis direction. The third moving device can move the measuring head in the first axis direction, the second axis direction, and the third axis direction.

46. ​​The processing system of claim 45, wherein: The first moving device is capable of moving the machining head in a first rotation direction around a rotation axis along the first axis direction, a second rotation direction around a rotation axis along the second axis direction, and a third rotation direction around a rotation axis along the third axis direction. The third movement device can move the measuring head in the first rotational direction, the second rotational direction and the third rotational direction.

47. A processing system for processing an object. The processing system comprises: a processing device capable of processing the object by irradiating the object with a processing beam; a measuring device capable of measuring the position of the object; as well as a control device capable of controlling the processing device, The processing device comprises: a first moving device capable of changing the position of a machining head emitting the machining beam; as well as a second moving device, which carries the first moving device and is movable on a first plane, The control device controls the movement on the first plane by the second movement device based on the measurement result of the measurement device and the model information related to the shape of the object.

48. A processing system for processing an object. The processing system comprises: a processing device capable of processing the object by irradiating the object with a processing beam; A camera device capable of photographing the object; as well as a control device capable of controlling the processing device, The processing device comprises: a first moving device capable of changing the position of a machining head emitting the machining beam; as well as a second moving device, which carries the first moving device and is movable on a first plane, The control device controls the movement on the first plane by the second movement device based on the image pickup result of the image pickup device and the model information related to the shape of the object.

49. A measurement system comprising: Measuring devices, including measuring heads capable of measuring the position or shape of an object; a determination device capable of determining the position of the object and the position of the measuring device; as well as a control device capable of controlling the measuring device, The measuring device comprises: a first moving device capable of changing the position of the measuring head; as well as a second moving device, which carries the first moving device and is movable on a first plane, The control device controls the movement on the first plane by the second movement device based on the measurement result of the measurement device and the model information related to the shape of the object.

50. A measurement system comprising: Measuring devices, including measuring heads capable of measuring the position or shape of an object; a measuring device capable of measuring the position of the object; as well as a control device capable of controlling the measuring device, The measuring device comprises: a first moving device capable of changing the position of the measuring head; as well as a second moving device, which carries the first moving device and is movable on a first plane, The control device controls the movement on the first plane by the second movement device based on the measurement result of the measurement device and the model information related to the shape of the object.

51. A measurement system comprising: Measuring devices, including measuring heads capable of measuring the position or shape of an object; A camera device capable of photographing the object; as well as a control device capable of controlling the measuring device, The measuring device comprises: a first moving device capable of changing the position of the measuring head; as well as a second moving device, which carries the first moving device and is movable on a first plane, The control device controls the movement on the first plane by the second movement device based on the image pickup result of the image pickup device and the model information related to the shape of the object.

52. A processing system for processing an object. The processing system comprises: a processing device capable of processing the object by irradiating the object with a processing beam; a measuring device capable of measuring the position of the object; as well as a control device capable of controlling the processing device, The processing device comprises: a first moving device capable of changing the position of a machining head emitting the machining beam; as well as The second moving device carries the first moving device and is movable on a first plane.

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