Display substrate, manufacturing method thereof and display device

Abstract

The invention discloses a display substrate, a manufacturing method thereof and a display device. The display substrate comprises a substrate body, a plurality of sub-pixels, a pixel limiting layer and a planarization layer. Each sub-pixel in the sub-pixels comprises a light-emitting element. The pixel defining layer comprises a main body part and a plurality of openings; the planarization layer is arranged between the substrate and the pixel limiting layer, the main body part comprises a first main body sub-part and a second main body sub-part, the second main body sub-part protrudes relative to the first main body sub-part to form a partition structure, and at least one of the multiple film layers is disconnected at the partition structure of the main body part. The orthographic projection of the light-emitting functional layer on the side, away from the substrate, of the first electrode located in the opening is at least partially overlapped with the orthographic projection of the light-emitting functional layer on the side, away from the substrate, of the main body portion on the substrate. The partition structure can break at least one film layer in the light-emitting functional layer, and crosstalk between adjacent sub-pixels can be reduced.

Description

Display substrate, manufacturing method thereof, and display device Technical Field

[0001] At least one embodiment of the present disclosure relates to a display substrate, a manufacturing method thereof, and a display device. Background Art

[0002] With the development of display technology, users have increasingly demanded higher performance from display devices. In some products, the high brightness and low power consumption requirements of display devices can be met to the greatest extent possible by isolating the light-emitting material layer between adjacent sub-pixels to reduce signal crosstalk and optimize display performance.

[0003] Summary of the Invention

[0004] Embodiments of the present disclosure provide a display substrate, a manufacturing method thereof, and a display device.

[0005] An embodiment of the present disclosure provides a display substrate, comprising: a base substrate, a plurality of sub-pixels, a pixel-defining layer, and a planarization layer. Each of the plurality of sub-pixels comprises a light-emitting element, the light-emitting element comprising a light-emitting functional layer and a first electrode and a second electrode located on either side of the light-emitting functional layer in a direction perpendicular to the base substrate, the first electrode being located between the light-emitting functional layer and the base substrate, the light-emitting functional layer comprising a plurality of film layers; the pixel-defining layer comprising a main portion and a plurality of openings, the openings being defined by the main portion and exposing at least a portion of the first electrode; and a planarization layer being disposed between the base substrate and the pixel-defining layer, wherein the main portion comprises a first main portion and a second main portion, the first main portion being located on a side of the second main portion close to the base substrate, the second main portion protruding relative to the first main portion to form a partition structure, at least one of the plurality of film layers being disconnected at the partition structure of the main portion, and the orthographic projection of the light-emitting functional layer located in the opening on a side of the first electrode away from the base substrate on the base substrate at least partially overlaps with the orthographic projection of the light-emitting functional layer located on a side of the main portion away from the base substrate on the base substrate.

[0006] For example, according to an embodiment of the present disclosure, for the same opening, the partition structure in the pixel defining layer is set as an open ring along the circumference of the opening, and the second electrodes of adjacent light-emitting elements are at least partially connected at the open ring, and the length of the gap of the open ring is 5-20 microns.

[0007] For example, according to an embodiment of the present disclosure, the minimum slope angle between at least part of the side surface of the second main body sub-portion and a plane parallel to the base substrate is 60 degrees to 90 degrees.

[0008] For example, according to an embodiment of the present disclosure, along the arrangement direction of adjacent sub-pixels, the minimum size of the opening is 1.2-1.5 times the maximum size of the first main body sub-portion.

[0009] For example, according to an embodiment of the present disclosure, along the arrangement direction of adjacent sub-pixels, the maximum dimension of the first main body sub-section is 0.4-0.8 times the maximum dimension of the second main body sub-section; along the direction perpendicular to the base substrate 01, the maximum dimension N1 of the first main body sub-section 10011 is 1-1.8 times the maximum dimension N2 of the second main body sub-section 10012.

[0010] For example, according to an embodiment of the present disclosure, the first electrode includes a crystallized conductive metal oxide.

[0011] For example, according to an embodiment of the present disclosure, the orthographic projection of the portion of the light-emitting functional layer located on the side of the second main body sub-part away from the base substrate on the base substrate at least partially overlaps with the orthographic projection of the portion of the light-emitting functional layer located in the opening on the base substrate.

[0012] For example, according to an embodiment of the present disclosure, the orthographic projection of the portion of the second electrode located on the side of the second main body sub-portion away from the substrate on the substrate at least partially overlaps with the orthographic projection of the portion of the second electrode located in the opening on the substrate.

[0013] For example, according to an embodiment of the present disclosure, the partition structure includes a groove, and the light-emitting functional layer extends into the groove; the display substrate also includes a residual portion, and the residual portion is located in the groove, and the orthographic projection of the residual portion on the base substrate falls into the orthographic projection of the partition structure on the base substrate.

[0014] An embodiment of the present disclosure further provides a display device, comprising any one of the display substrates described above.

[0015] An embodiment of the present disclosure also provides a method for manufacturing a display substrate, comprising: forming a planarization layer on a base substrate; forming a first conductive film on the planarization layer, and patterning the first conductive film to form a first electrode; forming a second conductive film on the first electrode, and patterning the second conductive film to form a sacrificial structure; forming a pixel-defining film on the sacrificial structure, and patterning the pixel-defining film to form a pixel-defining layer, wherein the pixel-defining layer comprises a main body portion and a plurality of openings, wherein the openings expose at least a portion of the first electrode; removing the sacrificial structure so that the main body portion comprises a first main body sub-portion and a second main body sub-portion, wherein the first main body sub-portion is located on a side of the second main body sub-portion close to the base substrate, and the second main body sub-portion protrudes relative to the first main body sub-portion to form a partition structure in the main body portion; sequentially forming a light-emitting functional layer and a second electrode on the pixel-defining layer, wherein the light-emitting functional layer comprises a plurality of film layers, at least one of the plurality of film layers is disconnected at the partition structure, and the partition structure comprises a groove, into which the light-emitting functional layer extends.

[0016] For example, according to an embodiment of the present disclosure, forming the first electrode includes: forming a first spacer area located between adjacent first electrodes; forming the sacrificial structure includes: forming a second spacer area located between adjacent sacrificial structures, along the arrangement direction of adjacent sub-pixels, so that the orthographic projection of the first spacer area on the substrate falls into the orthographic projection of the second spacer area on the substrate, and so that the minimum size of the second spacer area is greater than or equal to the minimum size of the first spacer area.

[0017] For example, according to an embodiment of the present disclosure, along the arrangement direction of adjacent sub-pixels, the minimum size of the opening is smaller than the minimum size of the sacrificial structure, and the orthographic projection of the opening on the base substrate falls within the orthographic projection of the sacrificial structure on the base substrate.

[0018] For example, according to an embodiment of the present disclosure, the manufacturing method also includes: forming a support structure located on the side of the pixel defining layer away from the base substrate, wherein the orthographic projection of the support structure on the base substrate at least partially overlaps with the orthographic projection of the second spacer area on the base substrate.

[0019] For example, according to an embodiment of the present disclosure, the thickness of the second conductive film is 1-3 times the thickness of the first conductive film; the thickness of the pixel defining film is 3-8 times the thickness of the second conductive film.

[0020] For example, according to an embodiment of the present disclosure, the material of the first conductive film includes a conductive metal oxide, and the material of the second conductive film includes a metal.

[0021] For example, according to an embodiment of the present disclosure, the conductive metal oxide includes indium tin oxide, and the metal includes any one of aluminum, silver, and a metal stack formed of titanium / aluminum / titanium.

[0022] For example, according to an embodiment of the present disclosure, after forming the sacrificial structure and before removing the sacrificial structure, the manufacturing method further includes: performing a heat treatment on the display substrate to crystallize the first electrode.

[0023] For example, according to an embodiment of the present disclosure, removing the sacrificial structure includes: etching and removing the sacrificial structure using a wet etching process.

[0024] For example, according to an embodiment of the present disclosure, the material of the second conductive film includes metal, and the etching and removing of the sacrificial structure using a wet etching process includes: etching the intermediate film layer made of the metal using an acidic etching solution. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings of the embodiments will be briefly introduced below. Obviously, the drawings in the following description only relate to some embodiments of the present disclosure, rather than limiting the present disclosure.

[0026] FIG1 is a schematic cross-sectional view of a display substrate.

[0027] FIG2 is a plan view of a display substrate provided according to an embodiment of the present disclosure.

[0028] FIG3 is a cross-sectional view of a display substrate provided by at least one embodiment of the present disclosure.

[0029] FIG4 is a cross-sectional view of another display substrate provided by at least one embodiment of the present disclosure.

[0030] FIG5 is a cross-sectional view of another display substrate provided by at least one embodiment of the present disclosure.

[0031] FIG6 is a cross-sectional view of another display substrate provided by at least one embodiment of the present disclosure.

[0032] FIG7 is a schematic diagram of a planar structure of a display substrate provided by at least one embodiment of the present disclosure.

[0033] FIG8 is a schematic diagram of a planar structure of another display substrate provided by at least one embodiment of the present disclosure.

[0034] FIG9 is a schematic diagram of a planar structure of yet another display substrate provided by at least one embodiment of the present disclosure.

[0035] FIG. 10A is a schematic diagram of a partition structure with a gap provided in the display substrate shown in FIG. 7 .

[0036] FIG. 10B is a schematic diagram of another partition structure with a gap provided in the display substrate shown in FIG. 7 .

[0037] FIG10C is a schematic diagram of yet another display substrate provided by at least one embodiment of the present disclosure.

[0038] FIG11 is a schematic diagram of a display device provided in accordance with an embodiment of the present disclosure.

[0039] 12 to 20 are schematic flow charts of a method for manufacturing a display substrate according to at least one embodiment of the present disclosure. DETAILED DESCRIPTION

[0040] To make the purpose, technical solutions, and advantages of the embodiments of the present disclosure more clear, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0041] Unless otherwise defined, technical or scientific terms used in this disclosure should have the ordinary meanings understood by people with ordinary skills in the field to which this disclosure belongs. The words "first", "second" and similar terms used in this disclosure do not indicate any order, quantity or importance, but are simply used to distinguish different components. The words "include" or "comprising" and similar terms mean that the elements or objects preceding the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0042] The features such as "perpendicular" and "same" used in the embodiments of the present disclosure include features such as "perpendicular" and "same" in the strict sense, as well as situations where "approximately perpendicular" and "approximately the same" include certain errors, taking into account the errors associated with the measurement of specific quantities (that is, the limitations of the measurement system), and represent within the acceptable deviation range for a specific value determined by ordinary technicians in this field. The "center" in the embodiments of the present disclosure can include a position that is strictly located at the geometric center and a position that is approximately centered within a small area around the geometric center. For example, "approximately" can mean within one or more standard deviations, or within 10% or 5% of the value.

[0043] With the continuous development of display technology, the goal of achieving a new generation of low power consumption and high quality has put forward increasingly higher requirements for the development of display devices. As an emerging OLED display substrate structure, the Tandem structure replaces one of the light-emitting layers in the light-emitting element in the OLED display substrate with two light-emitting layers, and adds a charge generation layer (CGL) between the two light-emitting layers to form a double-stacked design, thereby realizing a series connection of dual light-emitting devices. Compared with the traditional OLED display substrate using a light-emitting element with a single light-emitting functional layer, the display substrate using the Tandem structure greatly reduces the light-emitting current of the light-emitting element at the same light-emitting intensity, and improves the life of the light-emitting element, which is conducive to the development and mass production of new technologies with high lifespan, such as automotive. Display devices with a Tandem structure have the advantages of long life, low power consumption, and high brightness.

[0044] Figure 1 is a schematic diagram of a display substrate. As shown in Figure 1, the display substrate includes a planarization layer PLN, a pixel defining layer PDL, an electrode E1, a light-emitting functional layer FL and an electrode E2. The light-emitting functional layer FL includes a charge generation layer (CGL), a hole transport layer HTL, a light-emitting layer and an electron transport layer ETL. Figure 1 shows the light-emitting element EM1 and the light-emitting element EM2 of adjacent sub-pixels. The light-emitting element EM1 is configured to emit red light, and the light-emitting element EM2 is configured to emit green light. That is, the light-emitting element EM1 corresponds to the light-emitting layer R' that emits red light, and the light-emitting element EM2 corresponds to the light-emitting layer G' that emits green light. As shown in Figure 1, the charge generation layer (CGL) of the light-emitting element EM1 and the light-emitting element EM2 can be an integrated structure and can be made using an open mask. It should be noted that, for the sake of clarity, Figure 1 only shows some of the film layers in the display substrate. For example, the display substrate also includes multiple other film layers, such as an encapsulation layer.

[0045] However, as product resolution continues to increase, the pixel-defining layer spacing between pixels in display substrates continues to shrink. At the same time, because the charge generation layer (CGL) in the light-emitting element has strong conductivity, when the charge generation layer (CGL) is set as a full-surface film layer, the charge generation layer (CGL) of two adjacent organic light-emitting elements is a continuous film layer, which can easily cause crosstalk between adjacent sub-pixels (for example, the position shown by the dotted box in Figure 1). For example, at low grayscale, a green sub-pixel may drive the adjacent red sub-pixel to emit light. Furthermore, in existing display substrates, the light-emitting area of ​​the light-emitting element is defined by the pixel-defining layer (PDL). When the area of ​​the light-emitting area is larger, the light-emitting intensity of the light-emitting element is higher, which is more conducive to improving the display performance of the display substrate.

[0046] At least one embodiment of the present disclosure provides a display substrate comprising: a base substrate, a plurality of sub-pixels, a pixel-defining layer, and a planarization layer. Each of the plurality of sub-pixels comprises a light-emitting element, the light-emitting element comprising a light-emitting functional layer and a first electrode and a second electrode located on either side of the light-emitting functional layer in a direction perpendicular to the base substrate, the first electrode being located between the light-emitting functional layer and the base substrate, and the light-emitting functional layer comprising a plurality of film layers; the pixel-defining layer comprising a main body portion and a plurality of openings, each opening being defined by the main body portion and exposing at least a portion of the first electrode; the planarization layer being disposed between the base substrate and the pixel-defining layer, wherein the main body portion comprises a first main body sub-portion and a second main body sub-portion, the first main body sub-portion being located on a side of the second main body sub-portion close to the base substrate, the second main body sub-portion protruding relative to the first main body sub-portion to form a partition structure, and at least one of the plurality of film layers being disconnected at the partition structure of the main body portion; and an orthographic projection of the light-emitting functional layer located on a side of the first electrode located in the opening away from the base substrate on the base substrate at least partially overlaps with an orthographic projection of the light-emitting functional layer located on a side of the main body portion away from the base substrate on the base substrate.

[0047] The embodiments of the present disclosure provide a partition structure between adjacent sub-pixels in a display substrate, so that at least one of the multiple film layers of the light-emitting functional layer can be disconnected at the partition structure, which is beneficial to reducing the probability of crosstalk between adjacent sub-pixels and meeting the arrangement requirements of high pixel density, thereby improving the display performance of the substrate.

[0048] The display substrate and the display device provided by the embodiments of the present disclosure are described below with reference to the accompanying drawings.

[0049] Figure 2 is a plan view of a display substrate provided according to an embodiment of the present disclosure. Figure 3 is a cross-sectional view of a display substrate provided according to at least one embodiment of the present disclosure.

[0050] 2 and 3 , the display substrate includes a base substrate 01, a plurality of sub-pixels 10, a pixel-defining layer 100, and a planarization layer 110. For example, the display substrate includes a display area A located on the base substrate 01. A plurality of sub-pixels 10 are disposed within the display area A, such as a plurality of first sub-pixels 010, a plurality of second sub-pixels 020, and a plurality of third sub-pixels 030. The plurality of sub-pixels 10 are arranged at intervals within the display area A to form a plurality of pixel rows and pixel columns.

[0051] For example, the planarization layer 110 may be an insulating layer, and the material of the insulating layer may include an organic material. For example, the planarization layer 110 may be a structure including at least one layer, for example, an insulating layer including two layers, but is not limited thereto.

[0052] 2 and 3 , each of the plurality of sub-pixels 10 includes a light-emitting element 234, which includes a light-emitting functional layer 130 and a first electrode 120 and a second electrode 140 located on either side of the light-emitting functional layer 130 in a direction perpendicular to the base substrate 01. The first electrode 120 is located between the light-emitting functional layer 130 and the base substrate 01. The light-emitting functional layer 130 includes multiple film layers, for example, the multiple film layers include a charge generation layer 133 as shown in FIG3 , and a first light-emitting layer 131 and a second light-emitting layer 132 located on either side of the charge generation layer 133. For example, the light-emitting element 234 is configured to drive the sub-pixel 234 to emit light.

[0053] As shown in FIG3 , the pixel defining layer 100 includes a main portion 1001 and a plurality of openings 1002. The openings 1002 are defined by the main portion 1001 and expose at least a portion of the first electrode 120. The planarization layer 110 is disposed between the base substrate 01 and the pixel defining layer 100. The main portion 1001 includes a first main portion 10011 and a second main portion 10012. The first main portion 10011 is located on a side of the second main portion 10012 closer to the base substrate 01. The second main portion 10012 includes a protrusion relative to the first main portion 10011 to form a partition structure 10013.

[0054] As shown in Figure 3, at least one of the multiple film layers in the light-emitting functional layer 130 is disconnected at the partition structure 10013 of the main body 1001, and the orthographic projection of the light-emitting functional layer 130 on the side of the first electrode 120 located in the opening 1002 away from the substrate substrate 01 on the substrate substrate 01 at least partially overlaps with the orthographic projection of the light-emitting functional layer 130 on the side of the main body 1001 away from the substrate substrate 01 on the substrate substrate 01.

[0055] As shown in FIG. 3 , the partition structure 10013 includes a groove 10014 , and the light-emitting functional layer 130 may extend into the groove 10014 .

[0056] In the embodiment of the present disclosure, by disconnecting at least one film layer in the light-emitting functional layer 130 at the partition structure 10013 located between adjacent sub-pixels 10, crosstalk between adjacent sub-pixels is reduced, thereby optimizing the display effect.

[0057] For example, as shown in FIG. 3 , the planarization layer 110 may be made of a light-transmitting insulating material to enhance the projection efficiency of the display substrate.

[0058] For example, as shown in FIG3 , the plurality of sub-pixels 10 may include two adjacent sub-pixels 10 arranged along the X direction. For example, the adjacent sub-pixels have an arrangement direction, which may be substantially the direction of an extension of a line connecting the centers of the light-emitting areas of the adjacent sub-pixels or a line connecting the closest distances, or the light-emitting areas of the adjacent sub-pixels are distributed along the X direction, i.e., the above-mentioned direction is the X direction.

[0059] For example, as shown in Figure 3, the light-emitting functional layer 130 may include a first light-emitting layer 131, a charge generation layer 133 and a second light-emitting layer 132, which are stacked. The charge generation layer 133 has strong conductivity, which can make the light-emitting functional layer have the advantages of long life, low power consumption and high brightness. For example, compared with a light-emitting functional layer without a charge generation layer, the sub-pixel 10 can increase the luminous brightness by nearly double by setting a charge generation layer 133 in the light-emitting functional layer 130. For example, in each sub-pixel 10, the light-emitting functional layer 130 may also include a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), a light coupling layer CPL, and an electron injection layer (EIL). For example, the above-mentioned film layers are all shared film layers of multiple sub-pixels 10 and can be called common layers.

[0060] For example, as shown in FIG3 , in the same sub-pixel 10, the first light-emitting layer 131 and the second light-emitting layer 132 may be light-emitting layers that emit the same color of light. For example, the first light-emitting layer 131 (or the second light-emitting layer 132) in the sub-pixel 10 that emits light of different colors emits light of different colors. Of course, the embodiments of the present disclosure are not limited thereto. For example, in the same sub-pixel 10, the first light-emitting layer 131 and the second light-emitting layer 132 may be light-emitting layers that emit light of different colors. By providing light-emitting layers that emit light of different colors in the same sub-pixel 10, the light emitted by the multiple light-emitting layers included in the sub-pixel 10 can be mixed into white light, and the color of the light emitted from each sub-pixel can be adjusted by providing a color filter layer.

[0061] For example, as shown in FIG3 , the first electrode 110 may be an anode, and the second electrode 120 may be a cathode. For example, the cathode may be formed of a material with high conductivity and low work function, such as a metal material. For example, the anode may be formed of a transparent conductive material with a high work function.

[0062] For example, as shown in FIG3 , the pixel defining layer 100 is located on a side of the first electrode 120 of the light-emitting element 234 that is away from the base substrate 01 . The pixel defining layer 100 includes a plurality of openings 1002 and a main body 1001 surrounding the plurality of openings 1002 . The plurality of light-emitting elements 234 are at least partially located within the plurality of openings 1002 . FIG3 schematically illustrates that a structural layer 011 is also provided on a side of the first electrode 120 of the light-emitting element 234 that is away from the second electrode 140 . For example, the structural layer 011 may include a layer containing an active semiconductor pattern, a film layer containing gate lines, a film layer containing data lines, and a plurality of insulating layers. For example, the material of the pixel defining layer 100 may include polyimide, acrylic, or polyethylene terephthalate.

[0063] For example, as shown in FIG3 , the opening 1002 of the pixel defining layer 100 is configured to define a light-emitting area of ​​the light-emitting element 234. For example, the light-emitting elements 234 of the plurality of sub-pixels 10 may be disposed in a one-to-one correspondence with the plurality of openings 1002. For example, the light-emitting element 234 may include a portion located within the opening 1002 and a portion overlapping the main portion 1001 in a direction perpendicular to the base substrate 01.

[0064] For example, as shown in FIG3 , the opening 1002 of the pixel-defining layer 100 is configured to expose the first electrode 120 of the light-emitting element 234, and the exposed first electrode 120 is at least partially in contact with the light-emitting functional layer 130 in the light-emitting element 234. For example, when the light-emitting functional layer 130 is located in the opening 1002 of the pixel-defining layer 100, the first electrode 120 and the second electrode 140 located on both sides of the light-emitting functional layer 130 can drive the light-emitting functional layer 234 in the opening 1002 of the pixel-defining layer 100 to emit light. For example, the light-emitting region mentioned above can refer to the area of ​​the light-emitting element 234 that effectively emits light, and the shape of the light-emitting region refers to a two-dimensional shape. For example, the shape of the light-emitting region can be the same as the shape of the opening 1002 of the pixel-defining layer 100.

[0065] For example, as shown in FIG3 , the main body 1001 of the pixel defining layer 100 includes a first main body sub-portion 10011 and a second main body sub-portion 10012, wherein the first main body sub-portion 10011 is located on a side of the second main body sub-portion 10012 close to the base substrate 01. For example, the first main body sub-portion 10011 and the second main body sub-portion 10012 are formed integrally, but are not limited thereto. For the same main body 1001, the second main body sub-portion 10012 protrudes relative to the first main body sub-portion 10011 along the X direction to form a partition structure 10013, thereby forming an undercut structure at the edge of the second main body sub-portion 10012. For example, after the undercut structure is formed, the main body 1001 is approximately in the shape of a "mushroom".

[0066] As shown in FIG3 , at least one of the multiple film layers in the light-emitting functional layer 130 is disconnected at the partition structure 10013 of the main body 1001. For example, the at least one film layer disconnected in the light-emitting functional layer 130 can be at least one film layer in the common layer described above. In this case, the spacing of at least one film layer (such as the charge generation layer) in the light-emitting functional layer of two adjacent sub-pixels can increase the resistance of the light-emitting functional layer between the adjacent sub-pixels, thereby reducing the probability of crosstalk between the two adjacent sub-pixels. When the adjacent sub-pixels emit different luminous colors, this can help improve color mixing of the display substrate, reduce power consumption, and extend the life of the display substrate.

[0067] As shown in Figure 3, the light-emitting functional layer 130 includes a portion located within the opening 1002 and a portion located on the side of the main body 1001 away from the base substrate 01. When the light-emitting functional layer 130 is partitioned at the partition structure 10013, the light-emitting functional layer 130 located on the side of the first electrode 120 in the opening 1002 away from the base substrate 01 has the greatest thickness in the middle of the opening 1002, while the thickness of the portion located at the edge of the opening 1002 gradually decreases.

[0068] As shown in FIG3 , the partition structure 10013 includes a groove 10014, and the structures on both sides of the light-emitting functional layer 130 can extend into the groove 10014. The light-emitting functional layer 130 on the side of the first electrode 120 located in the opening 1002 away from the substrate 01 at least partially overlaps with the orthographic projection of the light-emitting functional layer 130 on the side of the main body 1001 away from the substrate 01 on the substrate 01. For example, for the light-emitting functional layer 130 on the side of the first electrode 120 located in the opening 1002 away from the substrate 01, the portions of the light-emitting functional layer 130 where the thickness gradually decreases on both sides of the opening 1002 at least partially overlap with the orthographic projection of the light-emitting functional layer 130 on the side of the main body 1001 away from the substrate 01 on the substrate 01, but the present invention is not limited thereto.

[0069] 3 , for example, in the direction X, in the same opening 1002, the maximum dimension of the portion of the light-emitting functional layer 130 extending into the groove 10014 is 1 / 5 to 1 / 3 of the maximum dimension of the light-emitting functional layer 130. For example, in the direction X, the above dimension is 1 / 5 to 1 / 4. For example, in the direction X, the above dimension is 1 / 4 to 1 / 3. For example, in the direction X, the above dimension is 1 / 5 to 4 / 15.

[0070] For example, referring to Figure 3, when the light-emitting functional layer 130 is located in the groove 10014 of the partition structure 10013, the portion of the light-emitting functional layer 130 may at least partially overlap with the side wall 10016 of the main body 10013. At this time, the second electrode 140 is arranged on the side of the light-emitting functional layer 130 away from the first electrode 120, and the second electrode 140 is spaced apart from the first electrode 120 through the light-emitting functional layer 130 to reduce the probability of a short circuit.

[0071] For example, when a partition structure 10013 is formed in the main body 1001 between two adjacent sub-pixels 10, the maximum size of the main body 1001 in the X direction can be reduced, thereby increasing the maximum size of the opening 1002 in the X direction, and the aperture ratio of the pixel defining layer 100 becomes larger, thereby enabling the opening 1002 to expose a larger area of ​​the light-emitting area in the light-emitting element 130, and at the same time reducing the pixel defining layer spacing between pixels to achieve high-resolution performance of the display substrate.

[0072] For example, as shown in FIG3 , the minimum slope angle β between at least part of the side surface of the second main body sub-portion 10012 and the plane L1 parallel to the base substrate 01 is 60 degrees to 90 degrees.

[0073] As shown in FIG3 , the angle between at least part of the side surface of the second main body sub-portion 10012 and the plane L1 parallel to the base substrate 01 is a slope angle, and the slope angle between the side surface at the edge of the second main body sub-portion 10012 and the plane L1 is the minimum slope angle β.

[0074] For example, the minimum slope angle β may be between 60 and 80 degrees. For example, the minimum slope angle β may be between 75 and 95 degrees. For example, the minimum slope angle β may be between 70 and 90 degrees. For example, the minimum slope angle β may be between 60 and 65 degrees. For example, the minimum slope angle β may be between 65 and 75 degrees. For example, the minimum slope angle β may be between 65 and 85 degrees. For example, the minimum slope angle β may be between 75 and 85 degrees. For example, the minimum slope angle β may be between 80 and 95 degrees. For example, the minimum slope angle β may be between 60 and 70 degrees. For example, the minimum slope angle β may be between 60 and 60 degrees.

[0075] For example, setting the minimum slope angle β of at least part of the side surface of the second main body sub-part 10012 and the plane L1 parallel to the base substrate 01 to 60 degrees-90 degrees can facilitate the disconnection of at least one film layer in the light-emitting element 234 at the partition structure 10013 without affecting the normal display of the sub-pixel 10, which is beneficial to improving the display performance of the display substrate.

[0076] For example, as shown in FIG3 , along the arrangement direction of adjacent sub-pixels 10, i.e., the X direction, the minimum dimension M1 of the opening 1002 is 1.2-1.5 times the maximum dimension M2 of the first main body sub-portion 10011. In other words, the opening area of ​​the opening 1002 can be maximized, thereby increasing the light-emitting area of ​​the light-emitting element 234 and enhancing the display effect.

[0077] For example, along the X-direction, the minimum dimension M1 of the opening 1002 may be 1.2-1.5 times the maximum dimension M2 of the first main body sub-section 10011. For example, the minimum dimension M1 of the opening 1002 may be 1.2-1.4 times the maximum dimension M2 of the first main body sub-section 10011. For example, the minimum dimension M1 of the opening 1002 may be 1.2-1.3 times the maximum dimension M2 of the first main body sub-section 10011. For example, the minimum dimension M1 of the opening 1002 may be 1.2-1.25 times the maximum dimension M2 of the first main body sub-section 10011. For example, the minimum dimension M1 of the opening 1002 may be 1.2-1.35 times the maximum dimension M2 of the first main body sub-section 10011. For example, the minimum dimension M1 of the opening 1002 may be 1.2-1.45 times the maximum dimension M2 of the first main body sub-section 10011. For example, the minimum dimension M1 of the opening 1002 may be 1.3-1.5 times the maximum dimension M2 of the first body sub-portion 10011 . For example, the minimum dimension M1 of the opening 1002 may be 1.4-1.5 times the maximum dimension M2 of the first body sub-portion 10011 .

[0078] For example, as shown in FIG3 , along the arrangement direction of adjacent sub-pixels (for example, the X direction), the maximum dimension M2 of the first main body sub-section 10011 is 0.4-0.8 times the maximum dimension M3 of the second main body sub-section 10012 . Within this range, the degree of protrusion of the second main body sub-section 10012 relative to the first main body sub-section 10011 can be made more appropriate.

[0079] For example, as shown in FIG3 , along a direction perpendicular to the base substrate 01 (e.g., the Z direction), the maximum dimension N1 of the first main body sub-section 10011 is 1-1.8 times the maximum dimension N2 of the second main body sub-section 10012. For example, when the maximum dimension N1 of the first main body sub-section 10011 is greater than the maximum dimension N2 of the second main body sub-section 10012, it can facilitate the disconnection of at least one of the multiple film layers in the light-emitting functional layer 130 at the partition structure 10013 of the main body 1001.

[0080] For example, along the arrangement direction of adjacent sub-pixels, the maximum dimension M2 of the first main body sub-section 10011 may be 0.4-0.7 times the maximum dimension M3 of the second main body sub-section 10012. For example, the maximum dimension M2 of the first main body sub-section 10011 may be 0.5-0.6 times the maximum dimension M3 of the second main body sub-section 10012. For example, the maximum dimension M2 of the first main body sub-section 10011 may be 0.4-0.6 times the maximum dimension M3 of the second main body sub-section 10012. For example, the maximum dimension M2 of the first main body sub-section 10011 may be 0.5-0.7 times the maximum dimension M3 of the second main body sub-section 10012. For example, the maximum dimension M2 of the first main body sub-section 10011 may be 0.5-0.8 times the maximum dimension M3 of the second main body sub-section 10012. For example, the maximum dimension M2 of the first main body sub-section 10011 may be 0.4-0.8 times the maximum dimension M3 of the second main body sub-section 10012.

[0081] For example, along a direction perpendicular to the base substrate 01, the maximum dimension N1 of the first body sub-section 10011 may be 1-1.6 times the maximum dimension N2 of the second body sub-section 10012. For example, the maximum dimension N1 of the first body sub-section 10011 may be 1.2-1.6 times the maximum dimension N2 of the second body sub-section 10012. For example, the maximum dimension N1 of the first body sub-section 10011 may be 1.3-1.6 times the maximum dimension N2 of the second body sub-section 10012. For example, the maximum dimension N1 of the first body sub-section 10011 may be 1.2-1.4 times the maximum dimension N2 of the second body sub-section 10012. For example, the maximum dimension N1 of the first body sub-section 10011 may be 1.3-1.5 times the maximum dimension N2 of the second body sub-section 10012. For example, the maximum dimension N1 of the first body sub-section 10011 may be 1.1-1.4 times the maximum dimension N2 of the second body sub-section 10012. For example, the maximum dimension N1 of the first body sub-section 10011 may be 1.4-1.6 times the maximum dimension N2 of the second body sub-section 10012. For example, the maximum dimension N1 of the first body sub-section 10011 may be 1.4-1.5 times the maximum dimension N2 of the second body sub-section 10012.

[0082] For example, as shown in FIG. 3 , the first electrode 120 includes a crystallized conductive metal oxide.

[0083] For example, the process of forming the main body 1001 includes a heat treatment process. During the heat treatment process, the first electrode 120 can be crystallized to prevent the etching process in the main body 1001 from being affected. For example, the crystallized first electrode 120 can reduce the impact of the wet etching solution during the wet etching of the main body 1001, thereby protecting the inherent characteristics of the first electrode 120.

[0084] For example, as shown in Figure 3, the orthographic projection of the portion of the light-emitting functional layer 130 located on the side of the second main body sub-portion 10012 away from the base substrate 01 on the base substrate 01 at least partially overlaps with the orthographic projection of the portion of the light-emitting functional layer 130 located in the opening 1002 on the base substrate 01.

[0085] For example, as shown in FIG3 , the light-emitting functional layer 130 includes multiple film layers, and the multiple film layers are disconnected at the partition structure 10013, so that the multiple film layers include a portion disposed on the side of the second main body sub-portion 10012 away from the base substrate 01, and a portion located within the opening 1002. For example, the light-emitting functional layer 130 located within the opening 1002 can extend into the grooves 10014 on both sides of the opening 1002, depending on the location and situation of the disconnection. As a result, the orthographic projection of the portion of the light-emitting functional layer 130 located on the side of the second main body sub-portion 10012 away from the base substrate 01 on the base substrate 01 can at least partially overlap with the orthographic projection of the portion of the light-emitting functional layer 130 located within the opening 1002 on the base substrate 01.

[0086] For example, as shown in Figure 3, the orthographic projection of the portion of the second electrode 140 located on the side of the second main body sub-portion 10012 away from the base substrate 01 on the base substrate 01 at least partially overlaps with the orthographic projection of the portion of the second electrode 140 located in the opening 1002 on the base substrate 01.

[0087] For example, as shown in FIG3 , the second electrode 140 is located on a side of the light-emitting element 130 away from the base substrate 01, and at least a portion of the second electrode 140 is disconnected at the partition structure 10013, so that the second electrode 140 includes a portion disposed on a side of the second main body sub-portion 10012 away from the base substrate, and a portion located in the opening 1002. For example, depending on the disconnection position, the portion of the second electrode 140 located in the opening 1002 may extend into the grooves 10014 on both sides of the opening 1002, thereby causing the orthographic projection of this portion of the second electrode 140 on the base substrate 01 to at least partially overlap with the orthographic projection of the portion of the light-emitting functional layer 130 located in the opening 1002 on the base substrate 01.

[0088] FIG4 is a cross-sectional view of another display substrate provided by at least one embodiment of the present disclosure.

[0089] For example, compared with the display substrate shown in Figure 3, in the display substrate shown in Figure 4, the sum of the minimum thicknesses of the light-emitting functional layer 130 in the light-emitting element 11 and the portion of the second electrode 140 located in the groove 10014 is increased, and the minimum size between two adjacent main body portions 1001 is increased (for example, approximately equal to M1). As a result, the light-emitting area of ​​the light-emitting element 234 exposed by the opening 1002 is increased, thereby enhancing the display effect.

[0090] For example, the sum of the minimum thicknesses of the portions of the light-emitting functional layer 130 and the second electrode 140 extending into the groove 10014 may be 1 / 3 to 1 / 2 of the sum of the maximum thicknesses of the light-emitting functional layer 130 and the second electrode 140. For example, the sum of the minimum thicknesses of the portions of the light-emitting functional layer 130 and the second electrode 140 extending into the groove 10014 may be 1 / 2 to 1 / 2 of the sum of the maximum thicknesses of the light-emitting functional layer 130 and the second electrode 140. The sum of the minimum thicknesses of the portions of the light-emitting functional layer 130 and the second electrode 140 extending into the groove 10014 may be 1 / 4 to 1 / 2 of the sum of the maximum thicknesses of the light-emitting functional layer 130 and the second electrode 140. The sum of the minimum thicknesses of the portions of the light-emitting functional layer 130 and the second electrode 140 extending into the groove 10014 may be 1 / 3 to 1 / 2 of the sum of the maximum thicknesses of the light-emitting functional layer 130 and the second electrode 140.

[0091] For example, in the X direction, the maximum size of the light-emitting area exposed by the opening 1002 may be 75%-100% of the minimum size M1 of the opening 1002. For example, in the X direction, the maximum size of the light-emitting area exposed by the opening 1002 may be 75%-95% of the minimum size M1 of the opening 1002. For example, in the X direction, the maximum size of the light-emitting area exposed by the opening 1002 may be 80%-100% of the minimum size M1 of the opening 1002. For example, in the X direction, the maximum size of the light-emitting area exposed by the opening 1002 may be 85%-95% of the minimum size M1 of the opening 1002. For example, in the X direction, the maximum size of the light-emitting area exposed by the opening 1002 may be 70%-90% of the minimum size M1 of the opening 1002. This configuration can maximize the area of ​​the light-emitting area exposed by the opening 1002, thereby enhancing the display effect of the display substrate.

[0092] FIG5 is a cross-sectional view of another display substrate provided by at least one embodiment of the present disclosure.

[0093] For example, as shown in FIG5 , compared to the display substrate shown in FIG3 , the display substrate shown in FIG5 is different in that the partition structure 10013 includes a groove 10014, and the light-emitting functional layer 130 extends into the groove 10014. The display substrate 01 also includes a residual portion 90, which is located in the groove 10014, and the orthographic projection of the residual portion 90 on the base substrate 01 falls within the orthographic projection of the partition structure 10013 on the base substrate 01.

[0094] For example, as shown in FIG5 , the residual portion 90 may be a film structure left behind during the formation of the main body 1001. For example, during the formation of the main body 1001, an additional film layer may be provided as a sacrificial structure, which is then removed to form the first main body sub-section 10011 and the second main body sub-section 10012. If the sacrificial structure is not completely removed during this process, the residual portion 90 shown in FIG5 may be formed. As shown in FIG5 , the Z-direction dimension of the residual portion 90 is smaller than the Z-direction dimension of the first main body sub-section 10011, and the X-direction dimension of the residual portion 90 is smaller than the X-direction dimension of the recess 10014. Consequently, the orthographic projection of the residual portion 90 on the base substrate 01 can fall within the orthographic projection of the partition structure 10013 on the base substrate 01. For example, the X-direction dimension of the residual portion 90 may be determined by factors such as the time and extent of sacrificial structure removal. FIG5 is provided for illustrative purposes only and is not intended to be limiting.

[0095] For example, as shown in FIG5 , for any sub-pixel, the maximum dimension of the residual portion 90 in the X direction is no greater than the maximum dimension of the recess 10014 in the X direction, and the orthographic projection of the residual portion 90 on the base substrate 01 falls within the orthographic projection of the recess 10014 of the partition structure 10013 on the base substrate 01, thereby avoiding affecting the luminous performance of the light-emitting element 234. For example, the maximum dimension of the residual portion 90 in the Z direction may be the same as or different from that of the recess 10014. For example, the morphology of the residual portion 90 within the recess 10014 of different sub-pixels may vary, depending on the time and extent of removal of the sacrificial structure, which is not limited in the embodiments of the present disclosure. For example, the maximum dimension of the residual portion 90 in the X direction is 1 / 6 to 1 / 2 of the maximum dimension of the recess 10014 in the X direction. For example, the maximum dimension of the residual portion 90 in the X direction is 1 / 4 to 1 / 3 of the maximum dimension of the recess 10014 in the X direction. For example, the maximum dimension of the residual portion 90 in the X direction is 1 / 4-2 / 3 of the maximum dimension of the groove 10014 in the direction X. For example, the maximum dimension of the residual portion 90 in the X direction is 1 / 3-1 / 2 of the maximum dimension of the groove 10014 in the direction X. For example, the maximum dimension of the residual portion 90 in the X direction is 1 / 3-2 / 3 of the maximum dimension of the groove 10014 in the direction X.

[0096] For example, when forming the isolation structure 10013 of multiple sub-pixels, the thickness of the sacrificial structure can be set to be uniform, and the removal time and degree of the sacrificial structure can also be set to be the same, so as to simplify the process flow and improve the consistency of the sub-pixel structure. Of course, in the actual operation process, it is also possible to flexibly design according to the actual process conditions. For example, the sacrificial structure in some sub-pixels can be completely removed, while the sacrificial structure in some sub-pixels may not be completely removed. The embodiments of the present disclosure are not limited to this.

[0097] For example, referring to FIG5 , when the light-emitting functional layer 130 is located in the groove 10014 of the partition structure 10013, the portion of the light-emitting functional layer 130 may at least partially overlap with the residual portion 90 in the groove 10014. In this case, the second electrode 140 is disposed on a side of the light-emitting functional layer 130 away from the first electrode 120 and is spaced apart from the first electrode 120 by the light-emitting functional layer 130. Furthermore, the second electrode 140 does not overlap with the residual portion, thereby reducing the risk of circuit failure.

[0098] For example, when forming the main body 1001 , during a development step, part of the developer may not be completely utilized or removed and may partially remain in, for example, the groove 10014 of the main body 1001 .

[0099] Therefore, the main body 1001 having the undercut structure also has the function of improving the residual film structure.

[0100] FIG6 is a schematic diagram of another display substrate provided by at least one embodiment of the present disclosure.

[0101] For example, as shown in FIG6 , the planarization layer 110 in the display substrate and the structure thereof on the side away from the base substrate 01 may be substantially the same as the display substrate in FIG3 . For related descriptions, reference may be made to the description of the aforementioned embodiment and will not be repeated here.

[0102] For example, as shown in FIG6 , along a direction perpendicular to the base substrate 01, i.e., the Z direction, the display substrate includes a buffer layer 0114, an insulating layer 0113, an insulating layer 0112, an insulating layer 0111, and a planarization layer 110, arranged in this order. For example, the insulating layers 0113, 0112, and 0111 can be made of inorganic materials, such as silicon nitride (SiNx) or silicon oxide (SiOx). For example, the buffer layer 0114 can be used to improve the water and oxygen resistance of the base substrate 01.

[0103] For example, as shown in FIG6 , the display substrate further includes a pixel circuit configured to drive the light-emitting element to emit light. For example, the pixel circuit may adopt a 2T1C, 3T1C, or 7T1C design. For example, the pixel circuit may include multiple transistors and a storage capacitor. For example, the multiple transistors may include a thin film transistor 21, and the thin film transistor 21 includes a gate 211, an active layer 212, a source 210, and a drain 213. The first electrode 120 is connected to the drain 213. The source 210 and the drain 213 of the thin film transistor may be identical in structure and may be interchangeably referred to.

[0104] For example, as shown in FIG6 , the pixel circuit may include a capacitor 31 , and the capacitor 31 includes a first plate 310 and a second plate 320 that are oppositely disposed.

[0105] For example, as shown in FIG6 , the display substrate further includes a support structure 10016 disposed on a side of the main body 1001 away from the base substrate, and configured to serve as a support layer and to support the FMM (high-precision mask) during the evaporation process of the display substrate. For example, the support structure 10016 can be made of the same material as the main body 1001. For example, the support structure 10016 can be formed integrally with the main body 1001.

[0106] For example, FIG6 also shows an encapsulation layer 41. For example, the encapsulation layer 41 includes a first encapsulation layer 411, a second encapsulation layer 412, and a third encapsulation layer 413. For example, the first encapsulation layer 411 and the third encapsulation layer 413 are inorganic layers and can be formed using a chemical vapor deposition (CVD) process. The second encapsulation layer 412 is an organic layer and can be formed using an inkjet printing process. As shown in FIG6, the thickness of the second encapsulation layer 412 is greater than the thickness of the first encapsulation layer 411. As shown in FIG6, the thickness of the second encapsulation layer 412 is greater than the thickness of the third encapsulation layer 413 to achieve a better encapsulation effect.

[0107] Figure 7 is a schematic diagram of the planar structure of a display substrate provided in at least one embodiment of the present disclosure; Figure 8 is a schematic diagram of the planar structure of another display substrate provided in at least one embodiment of the present disclosure; and Figure 9 is a schematic diagram of the planar structure of yet another display substrate provided in at least one embodiment of the present disclosure.

[0108] For example, as shown in FIG7 , the plurality of sub-pixels 10 include a plurality of first-color sub-pixels 101, a plurality of second-color sub-pixels 102, and a plurality of third-color sub-pixels 103. For example, one of the first-color sub-pixel 101 and the third-color sub-pixel 103 emits red light, while the other emits blue light; and the second-color sub-pixel 102 emits green light. FIG7 schematically illustrates that the first-color sub-pixel 101 emits red light, serving as a red sub-pixel; the third-color sub-pixel 103 emits blue light, serving as a blue sub-pixel; and the second-color sub-pixel 102 emits green light, serving as a green sub-pixel.

[0109] For example, as shown in FIG7 , a plurality of first color sub-pixels 101 and a plurality of third color sub-pixels 103 are alternately arranged along the X and Y directions parallel to the base substrate 01 to form a plurality of first pixel rows 051 and a plurality of first pixel columns 052. A plurality of second color sub-pixels 101 are arrayed along the X and Y directions to form a plurality of second pixel rows 053 and a plurality of second pixel columns 054. The plurality of first pixel rows 051 and the plurality of second pixel rows 053 are alternately arranged along the Y direction and staggered in the X direction. The plurality of first pixel columns 052 and the plurality of second pixel columns 054 are alternately arranged along the X direction and staggered in the Y direction. For example, the arrangement of the plurality of sub-pixels shown in FIG7 may be a Magic arrangement.

[0110] For example, the partition structure proposed in at least one embodiment of the present disclosure can be applied to different pixel arrangement structures. The arrangement of sub-pixels and the shape of the light-emitting areas shown in Figures 8 and 9 are different from those of the sub-pixels shown in Figure 7.

[0111] For example, as shown in FIG8 , the plurality of sub-pixels 10 include a plurality of third-color sub-pixels 104, a plurality of fourth-color sub-pixels 105, and a plurality of fifth-color sub-pixels 106. FIG8 schematically illustrates that the third-color sub-pixel 104 emits red light, serving as a red sub-pixel; the fourth-color sub-pixel 105 emits blue light, serving as a blue sub-pixel; and the fifth-color sub-pixel 106 emits green light, serving as a green sub-pixel. The plurality of third-color sub-pixels 104 and the plurality of fifth-color sub-pixels 106 are alternately arranged along the Y direction parallel to the substrate 01 to form a plurality of third pixel columns 061. The plurality of fourth-color sub-pixels 105 are evenly arranged between adjacent third pixel columns 061 to form a plurality of fourth pixel columns 062. The light-emitting areas of the third-color sub-pixels 104, the fourth-color sub-pixels 105, and the fifth-color sub-pixels 106 are all rectangular in shape, while the light-emitting area of ​​the fourth-color sub-pixel 105 is approximately square in shape. For example, the arrangement of the plurality of sub-pixels shown in FIG8 may be an SRGB arrangement.

[0112] For example, as shown in FIG9 , the plurality of sub-pixels 10 include a plurality of sixth-color sub-pixels 107, a plurality of seventh-color sub-pixels 108, a plurality of eighth-color sub-pixels 109, and a ninth-color sub-pixel 109. FIG8 schematically illustrates that the sixth-color sub-pixel 107 is a red sub-pixel emitting red light, a red sub-pixel; the seventh-color sub-pixel 108 is a blue sub-pixel emitting blue light, a blue sub-pixel; and the eighth-color sub-pixel 109 and the ninth-color sub-pixel 109 emit the same green light, a green sub-pixel. The plurality of sub-pixels are arranged alternately along the X and Y directions parallel to the substrate. The eighth-color sub-pixel 109 and the ninth-color sub-pixel 109 can be arranged opposite each other, and their light-emitting areas can be equal in area. Among the plurality of sub-pixels, the light-emitting area of ​​the sixth-color sub-pixel 107 is the largest. For example, the arrangement of the plurality of sub-pixels shown in FIG8 can be a GGRB arrangement.

[0113] For example, in the display substrate shown in Figures 7 to 9, each sub-pixel can be surrounded by a ring-shaped partition structure 10013, and the partition structure 10013 can also be set to a form without a gap. In this case, at least one film layer of the light-emitting layer between two adjacent sub-pixels is disconnected at the partition structure to reduce the risk of crosstalk. For example, in order to ensure the continuity of the second electrode, the second electrodes of different sub-pixels can be connected through a conductive optical coupling layer CPL to form a common electrode structure. For example, in some embodiments of the present disclosure, the partition structure 10013 surrounding each sub-pixel can also be set to include at least one gap to facilitate the second electrode not to be broken between adjacent sub-pixels.

[0114] Figure 10A is a schematic diagram of a partition structure with a notch provided in the display substrate shown in Figure 7; Figure 10B is a schematic diagram of another partition structure with a notch provided in the display substrate shown in Figure 7; Figure 10C is a schematic diagram of yet another display substrate provided in at least one embodiment of the present disclosure.

[0115] For example, in some embodiments of the present disclosure, the partition structure 10013 of different sub-pixels may be configured differently. For example, as shown in Figures 10A and 10B, for the same opening 1002, the partition structure 10013 in the pixel-defining layer 100 may be configured as an open ring along the circumference of the opening 1002. The second electrodes 140 of adjacent light-emitting elements 234 are at least partially connected at the gap in the open ring to ensure continuity of the second electrodes 140 between adjacent sub-pixels. The length H of the open ring gap may be 5-20 microns.

[0116] 3 and 10A , the first color sub-pixel 101, the second color sub-pixel 102, and the third color sub-pixel 103 each include a partition structure 10013 arranged in an open ring shape. Each sub-pixel's partition structure 10013 surrounds the sub-pixel's light-emitting region and includes a notch. The second electrode 140 is disconnected at the partition structure 10013 of the sub-pixel and connected at the notch in the partition structure 10013 of the adjacent sub-pixel to ensure continuity.

[0117] For example, in some embodiments of the present disclosure, the non-closed ring-shaped partition structure 10013 may be C-shaped.

[0118] For example, referring to FIG3 and FIG10A , the length H of the gap of the non-closed annular partition structure 10013 can be 15-20 microns. For example, the above size can be 10-20 microns. For example, the above size can be 8-15 microns. For example, the above size can be 5-15 microns. For example, the above size can be 10-15 microns. For example, the above size can be 12-25 microns. For example, the above size can be 16-24 microns. For example, the above size can be 14-18 microns. For example, the above size can be 18-22 microns. However, this is not limiting and the embodiments of the present disclosure are not limited thereto.

[0119] For example, referring to Figures 3, 5, and 10A, when the partition structure 10013 in a sub-pixel includes a residual portion 90, the residual portion 90 is located in the groove 10014 of the partition structure 10013. For the light-emitting element 234 of the same sub-pixel, the pattern enclosed by the residual portion 90 may also be a non-closed ring. For example, the shape of the residual portion 90 at different locations along the circumference of the same light-emitting element 234 may be different. For example, the non-closed ring-shaped residual portion 90 may also include multiple gaps. For example, the size of the non-closed ring-shaped residual portion 90 may also be non-uniform, which is not limited in the embodiments of the present disclosure. For example, the length of the gap of the non-closed ring-shaped residual portion 90 may be 1 / 4-1 / 3 of the length of the gap of the non-closed ring-shaped partition structure 10013. For example, the above size may be 1 / 4-1 / 3. For example, the above size may be 1 / 4-1 / 2. For example, the above size may be 1 / 3-1 / 2. For example, the above size may be 1 / 3-2 / 3. For example, the above-mentioned size can be 1 / 2-2 / 3. For example, the above-mentioned size can be 2 / 3-3 / 4.

[0120] For example, referring to Figures 3 and 10B, for the same opening 1002, the partition structure 10013 in the pixel defining layer 100 may include multiple sub-portions, and the multiple sub-portions may be arranged in a ring shape along the circumference of the opening 1002 to surround the light-emitting area of ​​the light-emitting element 234. For example, the partition structure 10013 surrounding the opening 1002 may include at least one notch, that is, the partition structure 10013 does not form a complete circle around the light-emitting area of ​​the sub-pixel. In this case, the second electrodes 140 in the light-emitting elements 234 of adjacent sub-pixels 10 can be connected to each other at the notch to facilitate the application of the same signal. For example, as shown in Figure 10B, for adjacent sub-pixels 101 and 102, the second electrodes 140 of the two can be connected through the area where the partition structure 10013 is not formed. For example, the second electrodes 140 can be connected through the first area 100-1 and the second area 100-2, but the present invention is not limited thereto. For example, the second electrode 140 may connect any portion of the pixel defining layer 100 in the sub-pixel 101 where the partition structure 10013 is not formed and any portion of the pixel defining layer 100 in the sub-pixel 102 where the partition structure 10013 is not formed.

[0121] For example, in some embodiments of the present disclosure, in order to reduce the risk of disconnection of the second electrode 140, a secondary mask can be used at the partition structure to add an auxiliary connecting electrode to connect the second electrodes 140 of different sub-pixels. Alternatively, other film layers in the light-emitting element 234 can be made conductive, such as the light coupling layer CPL in the light-emitting element. In other words, the second electrodes 140 of different sub-pixels can be connected through the conductive light coupling layer CPL, but the present invention is not limited thereto.

[0122] For example, referring to Figures 3, 10A, and 10B, for a given sub-pixel, at least a portion of the boundary of the partition structure 10013 is substantially identical to the boundary outline of the light-emitting area of ​​the immediately adjacent sub-pixel. For example, the boundary outline of the light-emitting area of ​​the sub-pixel may include multiple straight edges and / or curved edges connecting adjacent straight lines. The boundary outline of the partition structure 10013 surrounding the light-emitting area may include straight edge outlines corresponding to the straight edges of the light-emitting area and / or curved edge outlines corresponding to the curved edges. For example, referring to Figures 3 and 10 , for the same sub-pixel, since the second main body sub-portion 10012 protrudes relative to the first main body sub-portion 10011 in the X-direction to form the groove 10014 when the main body portion 1001 is provided, when the pixel defining layer 100 between the two adjacent sub-pixels is provided in the form of a partition structure 10013, the minimum distance between the orthographic projection of the partition structure 10013 on the substrate and the orthographic projection of the center of the light-emitting area of ​​each sub-pixel on the substrate in the X-direction will increase. In other words, the orthographic projection of the partition structure 10013 on the substrate will be further away from the orthographic projection of the center of the light-emitting area of ​​each sub-pixel on the substrate. Thus, for two adjacent sub-pixels, the orthographic projection area of ​​the pixel defining layer provided in the form of the partition structure 10013 on the substrate is smaller than the orthographic projection area of ​​the pixel defining layer provided in the form of the partition structure 10013 on the substrate. Therefore, the embodiment of the present disclosure can reduce the crosstalk between adjacent sub-pixels by providing a partition structure, while also increasing the light-emitting area of ​​the light-emitting element to enhance the display effect.

[0123] For example, referring to FIG3 , FIG10A , and FIG10B , depending on the emission color, for example, sub-pixel 101 may be a first-color sub-pixel 101, and sub-pixel 102 may be a second-color sub-pixel 102. The plurality of sub-pixels 10 further includes a sub-pixel 103, and the emission color of sub-pixel 103 is different from that of sub-pixel 101 and sub-pixel 102, namely, a third-color sub-pixel 103. For example, partition structure 10013 may be located between adjacent first-color sub-pixels 101 and third-color sub-pixels 103, and / or partition structure 10013 may be located between adjacent second-color sub-pixels 102 and third-color sub-pixels 103, and / or partition structure 10013 may be located between adjacent first-color sub-pixels 101 and second-color sub-pixels 102.

[0124] For example, referring to Figures 3, 10A and 10B, the number of partition structures 10013 surrounding the light-emitting area of ​​a sub-pixel may include four. For example, the four partition structures 10013 may be respectively located at the four corners of the light-emitting area. For example, the four partition structures 10013 may be respectively parallel to the four sides of the light-emitting area. For example, the number of partition structures 10013 surrounding a sub-pixel may include three. For example, the partition structure 10013 of the same sub-pixel may be located at the corners of the light-emitting area or may be located parallel to the sides of the light-emitting area. The setting position and number of the partition structures 10013 can be determined according to the design requirements of the actual layout, and the embodiments of the present disclosure are not limited to this.

[0125] For example, as shown in FIG. 10C , compared with the display substrate shown in FIG. 3 , the display substrate shown in FIG. 10C is different in that the second electrode 140 is not disconnected at the partition structure 10013 .

[0126] For example, compared with the display substrate shown in FIG. 3 , the maximum size of the groove 10014 of the main body 1001 in the display substrate shown in FIG. 10C in the Z direction may be relatively reduced, but the present invention is not limited thereto.

[0127] As shown in FIG10C , the light-emitting functional layer 130 is disconnected at the partition structure 10013, and the second electrode 140 is disposed on the side of the light-emitting functional layer 130 away from the base substrate 01. The second electrode 140 is disposed continuously at the partition structure 10013. The portion of the second electrode 140 located on the side of the main body 1001 away from the base substrate 01 is integrally connected to the portion of the second electrode 140 located within the opening 1002, forming a bend region 1401 located on both sides of the opening 1002. For example, within the same opening 1002, the thickness of the portion of the second electrode 140 located in the bend region 1401 is less than the thickness of the portion of the second electrode 140 located in the middle of the opening 1002.

[0128] For example, the thickness of the portion of the second electrode 140 located in the bend region 1401 is less than the thickness of the portion of the second electrode 140 located on the side of the main body 1001 away from the base substrate 01, but this is not limited to this. For example, the thickness of the portion of the second electrode 140 located in the bend region 1401 is 1 / 4-3 / 4 of the thickness of the portion of the second electrode 140 located on the side of the main body 1001 away from the base substrate 01. For example, the above dimension can be 1 / 3-3 / 4. For example, the above dimension can be 1 / 2-3 / 4. For example, the above dimension can be 1 / 4-2 / 3. For example, the above dimension can be 1 / 3-2 / 3.

[0129] Therefore, in the display substrate shown in Figure 10C, the setting of the partition structure 10013 can only disconnect at least one film layer in the light-emitting functional layer 130 without destroying the continuity of the second electrode 140, thereby better ensuring the normal connection of the second electrodes 140 between adjacent sub-pixels.

[0130] It should be noted that the continuous state of the second electrode 140 shown in Figure 10C is only schematic. In some embodiments of the present disclosure, the shape (for example, thickness) of the second electrode 140 may change depending on the process conditions and design requirements, and there is no limitation on this.

[0131] FIG11 is a schematic diagram of a display device provided in accordance with an embodiment of the present disclosure.

[0132] An embodiment of the present disclosure further provides a display device comprising any of the above-mentioned display substrates.

[0133] As shown in FIG11 , the display device 600 includes a display substrate 500 . The display substrate 500 is any of the display substrates described above. The display substrate mentioned in the embodiments of the present disclosure may also be referred to as a display panel. For example, the display substrate may be a flexible display substrate, but is not limited thereto.

[0134] On the one hand, the display substrate (display panel) prevents crosstalk between adjacent sub-pixels caused by the highly conductive film layer (e.g., the charge generation layer) by providing a partition structure between adjacent sub-pixels and disconnecting at least one film layer in the light-emitting functional layer, such as the charge generation layer, at the location of the partition structure. Therefore, a display device including this display substrate can also avoid crosstalk between adjacent sub-pixels, thereby having a higher product yield and higher display quality. At the same time, by providing a partition structure in the display substrate (display panel), the light-emitting area of ​​the light-emitting element can also be increased to enhance the display effect.

[0135] On the other hand, since the display substrate can adopt a tandem structure to improve pixel density, a display device including the display substrate has advantages such as long life, low power consumption, high brightness, and high resolution.

[0136] For example, the display device can be a display device such as an organic light-emitting diode display device, as well as any product or component with a display function, such as a television, digital camera, mobile phone, watch, tablet computer, laptop computer, navigator, etc. that includes the display device. The embodiments of the present disclosure include but are not limited to the above.

[0137] 12 to 20 are schematic flow charts of a method for manufacturing a display substrate according to at least one embodiment of the present disclosure.

[0138] As shown in Figures 12 to 20, at least one embodiment of the present disclosure further provides a method for manufacturing a display substrate, comprising: forming a planarization layer 110 on a base substrate 01; forming a first conductive film 012 on the planarization layer 110, and patterning the first conductive film 012 to form a first electrode 120; forming a second conductive film 013 on the first electrode 120, and patterning the second conductive film 013 to form a sacrificial structure 150; forming a pixel definition film 014 on the sacrificial structure 150, and patterning the pixel definition film 014 to form a pixel definition layer 100, the pixel definition layer including a main body 1001 and a plurality of openings 1002, each of which can expose the first electrode 120. at least a portion of the pixel defining layer; removing the sacrificial structure 150 so that the main body 1001 includes a first main body sub-section 10011 and a second main body sub-section 10012, the first main body sub-section 10011 is located on the side of the second main body sub-section 10012 close to the base substrate 01, and the second main body sub-section 10012 protrudes relative to the first main body sub-section 10011 to form a partition structure 10013 in the main body 1001; a light-emitting functional layer 130 and a second electrode 140 are sequentially formed on the pixel defining layer, the light-emitting functional layer 130 includes a plurality of film layers, at least one of the plurality of film layers is disconnected at the partition structure 10013, the partition structure 10013 includes a groove 1004, and the light-emitting functional layer 130 extends into the groove 1004.

[0139] For example, as shown in Figures 12 to 20, before forming the planarization layer 110 on the base substrate 01, the method for manufacturing the display substrate may include preparing the base substrate 01 on a glass carrier. For example, the base substrate 01 may be a flexible base substrate. For example, forming the base substrate 01 may include sequentially forming a first flexible material layer, a first inorganic material layer, a semiconductor layer, a second flexible material layer, and a second inorganic material layer stacked on a glass carrier. The materials of the first flexible material layer and the second flexible material layer are polyimide (PI), polyethylene terephthalate (PET), or a surface-treated polymer soft film. For example, the materials of the first inorganic material layer and the second inorganic material layer are silicon nitride (SiNx) or silicon oxide (SiOx), etc., which are used to improve the water and oxygen resistance of the base substrate. The first inorganic material layer and the second inorganic material layer are also referred to as barrier layers. The material of the semiconductor layer is amorphous silicon (a-si). For example, taking the stacked structure PI1 / Barrier1 / a-si / PI2 / Barrier2 as an example, its preparation process includes: first coating a layer of polyimide on a glass carrier, and forming a first flexible (PI1) layer after solidification; then depositing a barrier film on the first flexible layer to form a first barrier (Barrier1) layer covering the first flexible layer; then depositing a layer of amorphous silicon film on the first barrier layer to form an amorphous silicon (a-si) layer covering the first barrier layer; then coating the amorphous silicon layer with another layer of polyimide, and forming a second flexible (PI2) layer after solidification; then depositing a barrier film on the second flexible layer to form a second barrier (Barrier2) layer covering the second flexible layer, and finally completing the preparation of the substrate 01.

[0140] For example, as shown in Figures 12 to 20, before forming a planarization layer 110 on a base substrate 01, the method for manufacturing a display substrate may include forming other film layers 011 on the base substrate 01. Referring to the base substrate shown in Figure 6, the other film layers 011 may include a driving structure layer, which includes a plurality of pixel circuits 21 described above. For example, forming the driving structure layer may include sequentially depositing a first insulating film and an active layer film on the base substrate 01, patterning the active layer film through a patterning process to form a buffer layer 0114 covering the entire base substrate 01, and an active layer pattern disposed on the buffer layer 0114, the active layer pattern including at least an active layer 212. Sequentially depositing a second insulating film and a first metal film, patterning the first metal film through a patterning process to form a second insulating layer 0113 covering the active layer 212, and a first gate metal layer pattern disposed on the second insulating layer 0113, the first gate metal layer pattern including at least a gate electrode 211 and a first electrode plate 310. A third insulating film and a second metal film are sequentially deposited, and the second metal film is patterned through a patterning process to form a third insulating layer 0112 covering the gate electrode 211, and a second gate metal layer pattern disposed on the third insulating layer 0112. The second gate metal layer pattern includes at least a second electrode plate 320, and the position of the second electrode plate 320 corresponds to the position of the first electrode plate 310. Subsequently, a fourth insulating film is deposited and patterned through a patterning process to form a fourth insulating layer 0111 covering the second electrode plate 320. At least two first via holes N1 are defined in the fourth insulating layer 0111. The fourth insulating layer 0111, the third insulating layer 0112, and the second insulating layer 0113 within the two first via holes N1 are etched away, exposing the surface of the active layer 212 with the active layer pattern. Subsequently, a third metal film is deposited and patterned through a patterning process to form a source / drain metal layer pattern on the fourth insulating layer 0111. The source / drain metal layer pattern includes at least the source electrode 210 and the drain electrode 213 located in the display area. The source electrode 210 and the drain electrode 213 may be connected to the active layer 212 in the active layer pattern through the first via holes N1 , respectively.

[0141] For example, referring to Figures 6 and 12 to 20, the buffer layer 0114, the second insulating layer 0113, the third insulating layer 0112, and the fourth insulating layer 0111 are made of any one or more of silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON), and can be a single layer, a multilayer, or a composite layer. For example, the first metal film, the second metal film, and the third metal film are made of metal materials, such as any one or more of silver (Ag), copper (Cu), aluminum (Al), titanium (Ti), and molybdenum (Mo), or alloys of the above metals, such as aluminum neodymium alloy (AlNd) or molybdenum niobium alloy (MoNb), and can be a single layer structure or a multilayer composite structure, such as Ti / Al / Ti. The active layer pattern uses one or more materials such as amorphous indium gallium zinc oxide (a-IGZO), zinc oxynitride (ZnON), indium zinc tin oxide (IZTO), amorphous silicon (a-Si), polycrystalline silicon (p-Si), sexithiophene, polythiophene, etc., that is, the present disclosure is applicable to transistors manufactured based on oxide technology, silicon technology and organic technology.

[0142] For example, referring to Figures 6 and 12 to 14, forming a planarization layer 110 on the base substrate 01 includes: coating a flat thin film of organic material on the base substrate 01 having the aforementioned pattern to form a planarization (PLN) layer 110 covering the entire base substrate 01; and forming a plurality of second via holes N2 in the planarization layer 100 in the display area through masking, exposure, and development processes. For example, the planarization layer 200 within the plurality of second via holes N2 is developed away, exposing the surfaces of the drain electrodes 213 of the transistors 21 of the pixel circuits of the plurality of sub-pixels.

[0143] For example, referring to Figures 6 and 12 to 14, a first conductive film 012 is deposited on the planarization layer 110 and patterned to form a first electrode 120. For example, the first electrode 120 is connected to the drain 213 of the transistor 21 through a second via hole N2 in the planarization layer 110.

[0144] For example, referring to FIG. 12 to FIG. 16 , a second conductive film 013 is formed on the first electrode 120 , and the second conductive film 013 is patterned to form a sacrificial structure 150 .

[0145] For example, the material of the first conductive film includes a conductive metal oxide, and the material of the second conductive film includes a metal material. For example, the conductive metal oxide includes indium tin oxide, and the metal includes aluminum or silver. For example, the first conductive film or the second conductive film can be a single-layer structure or a multi-layer composite structure.

[0146] For example, the sacrificial structure 150 may be made of any one of aluminum (Al), silver (Ag), and a metal stack formed of titanium (Ti) / aluminum (Al) / titanium (Ti).

[0147] 12 to 16 , when forming the first electrodes 120, a patterning process is further included to form first spacers 1210 between adjacent first electrodes 120. For example, the first spacers 1210 can separate the first electrodes 120 of adjacent sub-pixels.

[0148] For example, referring to Figures 6 and 12 to 16, when forming the first electrode 150, it also includes forming a second spacer 1510 located between adjacent sacrificial structures 150 through a composition process. Along the X direction, the orthographic projection of the first spacer 1210 on the base substrate 01 falls into the orthographic projection of the second spacer 1510 on the base substrate, and the minimum size of the second spacer 1510 is greater than or equal to the minimum size of the first spacer. Thus, the minimum size of the first main body sub-section 10011 in the X direction can be made greater than the size of the first spacer 1210, so that the structure of the main body 1001 is more stable.

[0149] For example, referring to Figures 6 and 12 to 16 , after patterning the pixel-defining film 014, the resulting pixel-defining layer 100 includes a plurality of openings 1002. Along the arrangement direction of adjacent sub-pixels (i.e., along the X-direction), the minimum dimension of the openings 1002 is smaller than the minimum dimension of the sacrificial structure 150, and the orthographic projection of the openings 1002 on the base substrate 01 falls within the orthographic projection of the sacrificial structure 150 on the base substrate 01. This allows an undercut structure to be formed in the main portion 1001 after the sacrificial structure 150 is subsequently removed. In the X-direction, for example, the minimum dimension of the openings 1002 can be 50%-95% of the minimum dimension of the sacrificial structure 150. For example, the minimum dimension of the openings 1002 can be 60%-85% of the minimum dimension of the sacrificial structure 150. For example, the minimum dimension of the openings 1002 can be 70%-80% of the minimum dimension of the sacrificial structure 150.

[0150] For example, referring to Figures 6 and 12 to 18, when forming the pixel defining layer 100, a support structure 10016 is also formed on a side of the pixel defining layer 100 away from the base substrate, wherein the orthographic projection of the support structure 10016 on the base substrate 01 at least partially overlaps with the orthographic projection of the second spacer 1510 on the base substrate 01. For example, the support structure 10016 can be formed integrally with the main body 1001 and made of the same material, and is configured to support the FMM (high-precision mask) during the evaporation process of the display substrate.

[0151] For example, referring to Figures 6 and 12 to 19 , the thickness of the second conductive film 013 is 1-3 times the thickness of the first conductive film 012; and the thickness of the pixel defining film 014 is 3-8 times the thickness of the second conductive film 013. In other words, the thickness of the first main body sub-portion 10011 can be approximately 1-3 times the thickness of the first electrode 120, and the thickness of the main body 1001 can be 3-8 times the thickness of the sacrificial structure 150. Thus, according to actual layout design requirements, an effective partition structure 10013 can be formed in the main body to disconnect at least one film layer in the light-emitting functional layer.

[0152] For example, the thickness of the second conductive film 013 is 1.5-3 times the thickness of the first conductive film 012; the thickness of the pixel defining film 014 is 5-8 times the thickness of the second conductive film 013. For example, the thickness of the second conductive film 013 is 1.5-2.5 times the thickness of the first conductive film 012; the thickness of the pixel defining film 014 is 4-7 times the thickness of the second conductive film 013. For example, the thickness of the second conductive film 013 is 1.8-2.5 times the thickness of the first conductive film 012; the thickness of the pixel defining film 014 is 4.5-6.5 times the thickness of the second conductive film 013. For example, the thickness of the second conductive film 013 is 2-2.5 times the thickness of the first conductive film 012; the thickness of the pixel defining film 014 is 4.5-6.5 times the thickness of the second conductive film 013. For example, the thickness of the second conductive film 013 is 2.5-3 times the thickness of the first conductive film 012 ; and the thickness of the pixel definition film 014 is 5.5-7.5 times the thickness of the second conductive film 013 .

[0153] For example, referring to FIG. 6 and FIG. 12 to FIG. 19 , after forming the sacrificial structure 150 and before removing the sacrificial structure 150 , the manufacturing method further includes: performing a heat treatment on the display substrate 01 to crystallize the first electrode 120 .

[0154] For example, referring to FIG. 6 and FIG. 12 to FIG. 19 , the sacrificial structure 150 may be removed by etching the sacrificial structure 150 using a wet etching process.

[0155] For example, referring to Figures 6 and 12 to 19, during the heat treatment of the display substrate 01, the first electrode 120 (for example, a first electrode made of indium tin oxide) will be crystallized at a high temperature, thereby reducing the risk of being etched away by the etching solution during the subsequent removal of the sacrificial structure 150.

[0156] For example, referring to Figures 6 and 12 to 19, when the second conductive film 013 is made of a metal such as aluminum or silver, an acidic etchant can be used to etch the metal intermediate film layer (i.e., the sacrificial structure 150) when a wet etching process is used to etch and remove the sacrificial structure 150. For example, the acidic etchant can include, but is not limited to, HNO3 (nitric acid) and other materials. The embodiments of the present disclosure are not limited thereto.

[0157] For example, referring to Figures 6 and 12 to 19, when removing the sacrificial structure 150, the removal time and extent of the sacrificial structure 150 can be controlled according to actual process requirements. For example, the removal time and extent can be set relatively conservatively, so that the sacrificial structure 150 is not completely removed, but rather has a certain residual portion 90 (as shown in Figure 5). The residual portion 90 can be located in the groove 10014 without affecting the light-emitting performance of the display substrate.

[0158] For example, referring to Figures 6 and 12 to 19, when forming the light-emitting functional layer 130, at least one of the multiple film layers of the light-emitting functional layer 130 is disconnected at the partition structure 10013. A portion of the light-emitting functional layer 130 is disposed on a side of the main body 1001 away from the base substrate 01, and a portion of the light-emitting functional layer 130 is located in the opening 1002 and extends into the groove 10014. For example, the second electrode 140 is disposed on a side of the light-emitting functional layer 130 away from the base substrate, and the second electrode 140 may not be disconnected at the partition structure 10013 to ensure continuity between adjacent sub-pixels 10.

[0159] For example, referring to Figures 6 and 12 to 19, the method for manufacturing a display substrate also includes forming an encapsulation layer 41, that is, forming a first encapsulation layer 411, a second encapsulation layer 412, and a third encapsulation layer 413 in sequence on the side of the second electrode 140 away from the base substrate 01, so that the display substrate has a good encapsulation effect and prevents the intrusion of water vapor or impurities.

[0160] There are a few points to note:

[0161] (1) The drawings of the embodiments of the present disclosure only involve structures related to the embodiments of the present disclosure, and other structures can refer to general designs.

[0162] (2) Unless there is any conflict, the features of the same embodiment or different embodiments of the present disclosure may be combined with each other.

[0163] The foregoing description is merely an exemplary embodiment of the present disclosure and is not intended to limit the scope of protection of the present disclosure. The scope of protection of the present disclosure is determined by the appended claims.

Claims

1. A display substrate, comprising: substrate; a plurality of sub-pixels, each of the plurality of sub-pixels comprising a light-emitting element, the light-emitting element comprising a light-emitting functional layer and a first electrode and a second electrode located on both sides of the light-emitting functional layer in a direction perpendicular to the base substrate, the first electrode being located between the light-emitting functional layer and the base substrate, and the light-emitting functional layer comprising a plurality of film layers; a pixel defining layer comprising a main body and a plurality of openings, wherein the openings are defined by the main body and expose at least a portion of the first electrode; as well as A planarization layer is provided between the base substrate and the pixel defining layer, The main body portion includes a first main body sub-portion and a second main body sub-portion, wherein the first main body sub-portion is located on a side of the second main body sub-portion close to the base substrate. The second main body sub-part protrudes relative to the first main body sub-part to form a partition structure, and at least one layer of the plurality of film layers is disconnected at the partition structure of the main body part. The orthographic projection of the light-emitting functional layer of the first electrode located in the opening on the side away from the base substrate on the base substrate at least partially overlaps with the orthographic projection of the light-emitting functional layer of the main body on the side away from the base substrate on the base substrate.

2. The display substrate according to claim 1, wherein For the same opening, the partition structure in the pixel defining layer is arranged in an open ring along the circumference of the opening, and the second electrodes of adjacent light-emitting elements are at least partially connected at the gap of the open ring. The length of the non-closed annular gap is 5-20 microns.

3. The display substrate according to any one of claims 1 to 2, wherein: The minimum slope angle between at least part of the side surface of the second main body sub-part and a plane parallel to the base substrate is 60 degrees to 90 degrees.

4. The display substrate according to any one of claims 1 to 3, wherein: Along the arrangement direction of adjacent sub-pixels, the minimum size of the opening is 1.2-1.5 times the maximum size of the first main body sub-portion.

5. The display substrate according to any one of claims 1 to 4, wherein: Along the arrangement direction of adjacent sub-pixels, the maximum size of the first main body sub-portion is 0.4-0.8 times the maximum size of the second main body sub-portion; Along a direction perpendicular to the base substrate 01 , a maximum dimension N1 of the first main body sub-portion 10011 is 1-1.8 times a maximum dimension N2 of the second main body sub-portion 10012 .

6. The display substrate according to any one of claims 1 to 5, wherein: The first electrode includes a crystallized conductive metal oxide.

7. The display substrate according to any one of claims 1 to 6, wherein: An orthographic projection of a portion of the light-emitting functional layer located on a side of the second main body sub-portion away from the base substrate on the base substrate at least partially overlaps with an orthographic projection of a portion of the light-emitting functional layer located in the opening on the base substrate.

8. The display substrate according to any one of claims 1 to 7, wherein: An orthographic projection of a portion of the second electrode located on a side of the second main body sub-portion away from the base substrate on the base substrate at least partially overlaps with an orthographic projection of a portion of the second electrode located in the opening on the base substrate on the base substrate.

9. The display substrate according to any one of claims 1 to 7, wherein: The partition structure includes a groove, and the light-emitting functional layer extends into the groove; The display substrate further includes a residual portion, the residual portion is located in the groove, and an orthographic projection of the residual portion on the base substrate falls within an orthographic projection of the partition structure on the base substrate.

10. A display device comprising the display substrate according to any one of claims 1 to 9.

11. A method for manufacturing a display substrate, comprising: forming a planarization layer on the base substrate; forming a first conductive film on the planarization layer, and patterning the first conductive film to form a first electrode; forming a second conductive film on the first electrode, and patterning the second conductive film to form a sacrificial structure; forming a pixel defining film on the sacrificial structure, and patterning the pixel defining film to form a pixel defining layer, wherein the pixel defining layer includes a main body and a plurality of openings, wherein the openings expose at least a portion of the first electrode; Removing the sacrificial structure so that the main body includes a first main body sub-section and a second main body sub-section, wherein the first main body sub-section is located on a side of the second main body sub-section close to the substrate, and the second main body sub-section protrudes relative to the first main body sub-section to form a partition structure in the main body; A light-emitting functional layer and a second electrode are sequentially formed on the pixel defining layer, wherein the light-emitting functional layer includes a plurality of film layers, and at least one of the plurality of film layers is disconnected at the partition structure. The partition structure includes a groove, and the light-emitting functional layer extends into the groove.

12. The production method according to claim 11, wherein: Forming the first electrodes includes: forming a first spacing region between adjacent first electrodes; Forming the sacrificial structure includes: forming a second spacer area located between adjacent sacrificial structures, along the arrangement direction of adjacent sub-pixels, so that the orthographic projection of the first spacer area on the substrate falls into the orthographic projection of the second spacer area on the substrate, and so that the minimum size of the second spacer area is greater than or equal to the minimum size of the first spacer area.

13. The production method according to any one of claims 11 to 12, wherein: Along the arrangement direction of adjacent sub-pixels, the minimum size of the opening is smaller than the minimum size of the sacrificial structure, and the orthographic projection of the opening on the base substrate falls within the orthographic projection of the sacrificial structure on the base substrate.

14. The production method according to any one of claims 11 to 13, further comprising: A support structure is formed on a side of the pixel defining layer away from the base substrate, wherein an orthographic projection of the support structure on the base substrate at least partially overlaps with an orthographic projection of the second spacer on the base substrate.

15. The production method according to any one of claims 11 to 13, wherein: The thickness of the second conductive film is 1-3 times the thickness of the first conductive film; The thickness of the pixel definition film is 3-8 times the thickness of the second conductive film.

16. The production method according to any one of claims 11 to 15, wherein: The material of the first conductive film includes a conductive metal oxide, and the material of the second conductive film includes a metal.

17. The production method according to claim 16, wherein: The conductive metal oxide includes indium tin oxide; The metal includes any one of aluminum, silver, and a metal stack formed of titanium / aluminum / titanium.

18. The manufacturing method according to any one of claims 16 to 17, further comprising: after forming the sacrificial structure and before removing the sacrificial structure; The display substrate is subjected to a heat treatment to crystallize the first electrode.

19. The production method according to claim 18, wherein: Removing the sacrificial structure includes: The sacrificial structure is etched and removed by adopting a wet etching process.

20. The production method according to claim 19, wherein: The material of the second conductive film includes metal, and the etching and removing of the sacrificial structure using a wet etching process includes: etching the intermediate film layer made of the metal using an acidic etching solution.

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