Display substrate, manufacturing method thereof and display device

Abstract

A display substrate, a manufacturing method thereof, and a display device. The display substrate includes a substrate, a plurality of sub-pixels, a pixel defining layer, and a planarization layer. Each of the plurality of sub-pixels includes a light emitting element. The pixel defining layer includes a main body portion and a plurality of openings. The planarization layer is disposed between the substrate and the pixel defining layer. The main body portion includes a first main body sub-portion and a second main body sub-portion. The second main body sub-portion protrudes relative to the first main body sub-portion to form a partition structure. At least one of the plurality of film layers is disconnected at the partition structure of the main body portion. A normal projection of a light emitting functional layer on the substrate, which is located on a side of a first electrode away from the substrate and located in the opening, at least partially overlaps a normal projection of the light emitting functional layer on the substrate, which is located on the side of the first electrode away from the substrate and located on the side of the main body portion away from the substrate. The partition structure can disconnect at least one of the film layers in the light emitting functional layer, which is conducive to reducing crosstalk between adjacent sub-pixels.

Description

Technical Field

[0001] At least one embodiment of this disclosure relates to a display substrate and a method for manufacturing the same, as well as a display device. Background Technology

[0002] With the development of display technology, users have increasingly higher performance requirements for display devices. In some products, the high brightness and low power consumption requirements of display devices can be met as much as possible by separating the light-emitting material layers between adjacent sub-pixels to reduce signal crosstalk, thereby optimizing display performance. Summary of the Invention

[0003] Embodiments of this disclosure provide a display substrate, a method for manufacturing the same, and a display device.

[0004] This disclosure provides a display substrate comprising: a substrate, a plurality of sub-pixels, a pixel defining layer, and a planarization layer. Each of the plurality of sub-pixels includes a light-emitting element, the light-emitting element including a light-emitting functional layer and a first electrode and a second electrode located on opposite sides of the light-emitting functional layer along a direction perpendicular to the substrate. The first electrode is located between the light-emitting functional layer and the substrate. The light-emitting functional layer includes a plurality of film layers. The pixel defining layer includes a main portion and a plurality of openings defined by the main portion. The openings expose at least a portion of the first electrode. The planarization layer is disposed between the substrate and the pixel defining layer. The main portion includes a first main sub-portion and a second main sub-portion. The first main sub-portion is located on the side of the second main sub-portion closer to the substrate. The second main sub-portion protrudes relative to the first main sub-portion to form a partition structure. At least one of the plurality of film layers is disconnected at the partition structure of the main portion. The orthographic projection of the light-emitting functional layer on the substrate of the side of the first electrode away from the substrate located in the opening at least partially overlaps with the orthographic projection of the light-emitting functional layer on the substrate of the side of the main portion away from the substrate located in the opening at the same location.

[0005] For example, according to an embodiment of this disclosure, for the same opening, the partition structure in the pixel defining layer is configured as an open ring along the circumference of the opening, and the second electrodes of adjacent light-emitting elements are at least partially connected at the open ring, the length of the notch in the open ring being 5-20 micrometers.

[0006] For example, according to an embodiment of this disclosure, at least a portion of the side surface of the second body sub-part has a minimum slope angle of 60-90 degrees with a plane parallel to the substrate.

[0007] For example, according to an embodiment of this disclosure, along the arrangement direction of adjacent sub-pixels, the minimum size of the opening is 1.2-1.5 times the maximum size of the first main body sub-part.

[0008] For example, according to an embodiment of the present disclosure, along the arrangement direction of adjacent sub-pixels, the maximum size of the first main body sub-part is 0.4-0.8 times the maximum size of the second main body sub-part; along the direction perpendicular to the substrate 01, the maximum size N1 of the first main body sub-part 10011 is 1-1.8 times the maximum size N2 of the second main body sub-part 10012.

[0009] For example, according to an embodiment of this disclosure, the first electrode comprises a crystallized conductive metal oxide.

[0010] For example, according to an embodiment of the present disclosure, the orthographic projection of the portion of the light-emitting functional layer located on the side of the second main body portion away from the substrate on the substrate at least partially overlaps with the orthographic projection of the portion of the light-emitting functional layer located in the opening on the substrate.

[0011] For example, according to an embodiment of the present disclosure, the orthographic projection of the portion of the second electrode located on the side of the second body sub-part away from the substrate on the substrate at least partially overlaps with the orthographic projection of the portion of the second electrode located in the opening on the substrate.

[0012] For example, according to an embodiment of the present disclosure, the partition structure includes a groove, and the light-emitting functional layer extends into the groove; the display substrate further includes a residual portion located in the groove, and the orthographic projection of the residual portion on the substrate falls into the orthographic projection of the partition structure on the substrate.

[0013] This disclosure also provides a display device, including the display substrate described in any of the above embodiments.

[0014] This disclosure also provides a method for manufacturing a display substrate, comprising: forming a planarization layer on a substrate; forming a first conductive film on the planarization layer and patterning the first conductive film to form a first electrode; forming a second conductive film on the first electrode and patterning the second conductive film to form a sacrificial structure; forming a pixel defining film on the sacrificial structure and patterning the pixel defining film to form a pixel defining layer, the pixel defining layer including a main body portion and a plurality of openings, the openings exposing at least a portion of the first electrode; removing the sacrificial structure such that the main body portion includes a first main body sub-portion and a second main body sub-portion, the first main body sub-portion being located on the side of the second main body sub-portion closer to the substrate, the second main body sub-portion protruding relative to the first main body sub-portion to form a partition structure in the main body portion; sequentially forming a light-emitting functional layer and a second electrode on the pixel defining layer, the light-emitting functional layer including a plurality of film layers, at least one of the plurality of film layers being disconnected at the partition structure, the partition structure including a groove, the light-emitting functional layer extending into the groove.

[0015] For example, according to an embodiment of the present disclosure, forming the first electrode includes: forming a first gap region located between adjacent first electrodes; forming the sacrificial structure includes: forming a second gap region located between adjacent sacrificial structures, along the arrangement direction of adjacent sub-pixels, such that the orthographic projection of the first gap region on the substrate falls into the orthographic projection of the second gap region on the substrate, and such that the minimum size of the second gap region is greater than or equal to the minimum size of the first gap region.

[0016] For example, according to an embodiment of the present disclosure, along the arrangement direction of adjacent sub-pixels, the minimum size of the opening is smaller than the minimum size of the sacrificial structure, and the orthographic projection of the opening on the substrate falls into the orthographic projection of the sacrificial structure on the substrate.

[0017] For example, according to an embodiment of the present disclosure, the manufacturing method further includes: forming a support structure located on the side of the pixel defining layer away from the substrate, wherein the orthographic projection of the support structure on the substrate at least partially overlaps with the orthographic projection of the second spacing region on the substrate.

[0018] For example, according to embodiments of this disclosure, the thickness of the second conductive film is 1-3 times the thickness of the first conductive film; and the thickness of the pixel defining film is 3-8 times the thickness of the second conductive film.

[0019] For example, according to embodiments of this disclosure, the material of the first conductive film includes a conductive metal oxide, and the material of the second conductive film includes a metal.

[0020] For example, according to embodiments of this disclosure, the conductive metal oxide includes indium tin oxide, and the metal includes any one of aluminum, silver, and a titanium / aluminum / titanium metal stack.

[0021] For example, according to an embodiment of this disclosure, after forming the sacrificial structure and before removing the sacrificial structure, the fabrication method further includes: heat-treating the display substrate to crystallize the first electrode.

[0022] For example, according to an embodiment of this disclosure, removing the sacrificial structure includes: etching the sacrificial structure using a wet etching process.

[0023] For example, according to an embodiment of this disclosure, the material of the second conductive film includes a metal, and the etching removal of the sacrificial structure using a wet etching process includes: etching an intermediate film layer made of the metal using an acidic etching solution. Attached Figure Description

[0024] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings of the embodiments will be briefly described below. Obviously, the drawings described below only relate to some embodiments of this disclosure and are not intended to limit this disclosure.

[0025] Figure 1 This is a schematic cross-sectional view of a display substrate.

[0026] Figure 2 This is a plan view of a display substrate provided according to an embodiment of the present disclosure.

[0027] Figure 3 A cross-sectional view of a display substrate provided for at least one embodiment of this disclosure.

[0028] Figure 4 A cross-sectional view of another display substrate provided for at least one embodiment of this disclosure.

[0029] Figure 5 This is a cross-sectional view of another display substrate provided in at least one embodiment of the present disclosure.

[0030] Figure 6 This is a cross-sectional view of another display substrate provided in at least one embodiment of the present disclosure.

[0031] Figure 7 This is a schematic diagram of the planar structure of a display substrate provided in at least one embodiment of the present disclosure.

[0032] Figure 8 This is a schematic diagram of a planar structure of another display substrate provided for at least one embodiment of the present disclosure.

[0033] Figure 9 This is a schematic diagram of another display substrate structure provided for at least one embodiment of the present disclosure.

[0034] Figure 10A for Figure 7 The diagram shows a partition structure with a notch in the display substrate.

[0035] Figure 10B for Figure 7 The diagram shows a schematic of another partition structure with a notch in the display substrate.

[0036] Figure 10C This is a schematic diagram of another display substrate provided for at least one embodiment of the present disclosure.

[0037] Figure 11 This is a schematic diagram of a display device provided according to an embodiment of the present disclosure.

[0038] Figures 12 to 20 This is a schematic diagram of a method for manufacturing a display substrate according to at least one embodiment of the present disclosure. Detailed Implementation

[0039] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. Based on the described embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0040] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as “comprising” or “including” mean that an element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects.

[0041] The features such as "parallel," "perpendicular," and "identical" used in the embodiments of this disclosure include features in the strict sense of "parallel," "perpendicular," and "identical," as well as cases where "approximately parallel," "approximately perpendicular," and "approximately identical" include a certain degree of error. Taking into account measurement and errors associated with the measurement of a specific quantity (e.g., limitations of the measurement system), they represent the acceptable deviation range for a specific value as determined by a person skilled in the art. For example, "approximately" can mean within one or more standard deviations, or within 10% or 5% of said value. Unless otherwise specified in the following embodiments of this disclosure, the quantity of a component is implied to mean that the component can be one or more, or can be understood as at least one. "At least one" means one or more, and "more" means at least two.

[0042] With the continuous development of display technology, the pursuit of low power consumption and high quality in next-generation display devices places increasingly higher demands on their development. Tandem structure, as an emerging OLED display substrate structure, replaces one light-emitting layer in the OLED substrate's light-emitting element with two light-emitting layers, adding a charge generation layer (CGL) between these two layers to form a double-layer design, achieving a series connection of two light-emitting devices. Compared to traditional OLED display substrates using a single light-emitting layer, tandem structure significantly reduces the light-emitting current of the light-emitting element at the same luminous intensity, thus extending the lifespan of the light-emitting element. This is beneficial for the development and mass production of new technologies with long lifespans, such as automotive applications. Tandem structure display devices offer advantages such as long lifespan, low power consumption, and high brightness.

[0043] Figure 1 This is a schematic diagram of a display substrate. (Example) Figure 1 As shown, the display substrate includes a planarization layer PLN, a pixel definition layer PDL, an electrode E1, a light-emitting functional layer FL, and an electrode E2. The light-emitting functional layer FL includes a charge generation layer (CGL), a hole transport layer HTL, a light-emitting layer, and an electron transport layer ETL. Figure 1 The diagram shows light-emitting elements EM1 and EM2 of adjacent sub-pixels. EM1 is configured to emit red light, and EM2 is configured to emit green light. That is, EM1 corresponds to the red-emitting layer R', and EM2 corresponds to the green-emitting layer G'. Figure 1 As shown, the charge generation layer (CGL) of light-emitting elements EM1 and EM2 can be a single structure, fabricated using an open-face mask. It should be noted that, for clarity of illustration, Figure 1 Only a portion of the film layers in the display substrate are shown. For example, the display substrate also includes multiple other film layers, such as encapsulation layers.

[0044] However, as product resolution continues to increase, the pixel-limiting layer spacing between pixels in the display substrate is constantly decreasing. Simultaneously, due to the strong conductivity of the charge generation layer (CGL) in the light-emitting element, when the charge generation layer (CGL) is set as a continuous film layer, the charge generation layers (CGL) of two adjacent organic light-emitting elements are continuous film layers, which easily leads to gaps between adjacent sub-pixels (e.g., in…). Figure 1 Crosstalk occurs at locations indicated by the dashed box in the middle. For example, at low grayscale levels, a green subpixel may cause a neighboring red subpixel to emit light. Furthermore, in existing display substrates, the light-emitting area of ​​the light-emitting element is defined by the pixel limiting layer (PDL). The larger the area of ​​the light-emitting area, the higher the luminous intensity of the light-emitting element, which is more beneficial to improving the display performance of the display substrate.

[0045] At least one embodiment of this disclosure provides a display substrate, including: a substrate, a plurality of sub-pixels, a pixel defining layer, and a planarization layer. Each of the plurality of sub-pixels includes a light-emitting element, the light-emitting element including a light-emitting functional layer and a first electrode and a second electrode located on both sides of the light-emitting functional layer along a direction perpendicular to the substrate. The first electrode is located between the light-emitting functional layer and the substrate. The light-emitting functional layer includes a plurality of film layers. The pixel defining layer includes a main portion and a plurality of openings, each opening being defined by the main portion. The openings expose at least a portion of the first electrode. The planarization layer is disposed between the substrate and the pixel defining layer. The main portion includes a first main sub-portion and a second main sub-portion. The first main sub-portion is located on the side of the second main sub-portion closer to the substrate. The second main sub-portion protrudes relative to the first main sub-portion to form a partition structure. At least one of the plurality of film layers is broken at the partition structure of the main portion. The orthographic projection of the light-emitting functional layer on the substrate away from the first electrode located in the opening at least partially overlaps with the orthographic projection of the light-emitting functional layer on the substrate away from the substrate located in the main portion.

[0046] The embodiments of this disclosure, by setting a partition structure between adjacent sub-pixels in the display substrate, can cause at least one layer of multiple film layers of the light-emitting functional layer to be disconnected at the partition structure, which helps to reduce the probability of crosstalk between adjacent sub-pixels, and helps to meet the arrangement requirements of high pixel density, thereby improving the display performance of the substrate.

[0047] The display substrate and display device provided in the embodiments of this disclosure are described below with reference to the accompanying drawings.

[0048] Figure 2 This is a plan view of a display substrate provided according to an embodiment of the present disclosure. Figure 3 A cross-sectional view of a display substrate provided for at least one embodiment of this disclosure.

[0049] refer to Figure 2 and Figure 3The display substrate includes a substrate 01, a plurality of sub-pixels 10, a pixel defining layer 100, and a planarization layer 110. For example, the display substrate includes a display area A located on the substrate 01, and a plurality of sub-pixels 10 are disposed in the display area A, such as a plurality of first sub-pixels 010, a plurality of second sub-pixels 020, and a plurality of third sub-pixels 030. The plurality of sub-pixels 10 are arranged at intervals in the display area A to form a plurality of pixel rows and pixel columns.

[0050] For example, the planarization layer 110 can be an insulating layer, and the material of the insulating layer can include organic materials. For example, the planarization layer 110 can be a structure comprising at least one layer, such as an insulating layer comprising two layers, but is not limited thereto.

[0051] Combination Figure 2 and Figure 3 Each of the multiple sub-pixels 10 includes a light-emitting element 234. The light-emitting element 234 includes a light-emitting functional layer 130 and a first electrode 120 and a second electrode 140 located on both sides of the light-emitting functional layer 130 along a direction perpendicular to the substrate 01. The first electrode 120 is located between the light-emitting functional layer 130 and the substrate 01. The light-emitting functional layer 130 includes multiple film layers, for example, the multiple film layers include... Figure 3 The diagram shows a charge generation layer 133, and a first light-emitting layer 131 and a second light-emitting layer 132 located on both sides of the charge generation layer 133. For example, the light-emitting element 234 is configured to drive the sub-pixel 234 to emit light.

[0052] like Figure 3 As shown, the pixel defining layer 100 includes a main body 1001 and a plurality of openings 1002, which are defined by the main body 1001 and expose at least a portion of the first electrode 120. A planarization layer 110 is disposed between the substrate 01 and the pixel defining layer 100. The main body 1001 includes a first main body sub-part 10011 and a second main body sub-part 10012. The first main body sub-part 10011 is located on the side of the second main body sub-part 10012 closer to the substrate 01. The second main body sub-part 10012 includes a protrusion relative to the first main body sub-part 10011 to form a partition structure 10013.

[0053] like Figure 3 As shown, at least one of the multiple film layers in the light-emitting functional layer 130 is disconnected at the partition structure 10013 of the main body 1001. The orthographic projection of the light-emitting functional layer 130 on the substrate 01 of the side of the first electrode 120 in the opening 1002 away from the substrate 01 at least partially overlaps with the orthographic projection of the light-emitting functional layer 130 on the substrate 01 of the side of the main body 1001 away from the substrate 01.

[0054] like Figure 3As shown, the partition structure 10013 includes a groove 10014, and the light-emitting functional layer 130 can extend into the groove 10014.

[0055] The embodiments of this disclosure improve the display effect by breaking at least one film layer in the light-emitting functional layer 130 at the partition structure 10013 located between adjacent sub-pixels 10, thereby reducing crosstalk between adjacent sub-pixels.

[0056] For example, such as Figure 3 As shown, the planarization layer 110 can be made of a light-transmitting insulating material to enhance the transmittance of the display substrate.

[0057] For example, such as Figure 3 As shown, the plurality of sub-pixels 10 may include two adjacent sub-pixels 10 arranged along the X direction. For example, the adjacent sub-pixels have an arrangement direction, which may be approximately the extension direction of the line connecting the centers of the light-emitting areas of the adjacent sub-pixels or the line connecting the closest distances, or the light-emitting areas of the adjacent sub-pixels may be distributed along the X direction, that is, the aforementioned direction is the X direction.

[0058] For example, such as Figure 3 As shown, the light-emitting functional layer 130 may include a first light-emitting layer 131, a charge-generating layer 133, and a second light-emitting layer 132 stacked together. The charge-generating layer 133 has strong conductivity, which enables the light-emitting functional layer to have advantages such as long lifespan, low power consumption, and high brightness. For example, compared to a light-emitting functional layer without a charge-generating layer, the sub-pixel 10 can nearly double its brightness by including a charge-generating layer 133 in the light-emitting functional layer 130. For example, in each sub-pixel 10, the light-emitting functional layer 130 may also include a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), an optical coupling layer (CPL), and an electron injection layer (EIL). For example, the above-mentioned film layers are all shared film layers for multiple sub-pixels 10 and can be called common layers.

[0059] For example, such as Figure 3 As shown, in the same sub-pixel 10, the first light-emitting layer 131 and the second light-emitting layer 132 can be light-emitting layers that emit the same color of light. For example, the first light-emitting layer 131 (or the second light-emitting layer 132) in a sub-pixel 10 that emits different colors of light emits different colors of light. Of course, the embodiments disclosed herein are not limited to this. For example, in the same sub-pixel 10, the first light-emitting layer 131 and the second light-emitting layer 132 can be light-emitting layers that emit different colors of light. By setting light-emitting layers that emit different colors of light in the same sub-pixel 10, the light emitted by the multiple light-emitting layers included in the sub-pixel 10 can be mixed into white light, and the color of the light emitted by each sub-pixel can be adjusted by setting a color filter layer.

[0060] For example, such as Figure 3As shown, the first electrode 110 can be an anode, and the second electrode 120 can be a cathode. For example, the cathode can be formed of a material with high conductivity and low work function; for example, the cathode can be made of a metallic material. For example, the anode can be formed of a transparent conductive material with a high work function.

[0061] For example, such as Figure 3 As shown, the pixel defining layer 100 is located on the side of the first electrode 120 of the light-emitting element 234 away from the substrate 01, and the pixel defining layer 100 includes a plurality of openings 1002 and a main body portion 1001 surrounding the plurality of openings 1002, and the plurality of light-emitting elements 234 are at least partially located in the plurality of openings 1002. Figure 3 The schematic diagram shows that a structural layer 011 is also provided on the side of the first electrode 120 of the light-emitting element 234 away from the second electrode 140. For example, the structural layer 011 may include a layer containing the active semiconductor pattern, a film layer containing the gate lines, a film layer containing the data lines, and multiple insulating layers. For example, the material of the pixel defining layer 100 may include polyimide, acrylic, or polyethylene terephthalate.

[0062] For example, such as Figure 3 As shown, the opening 1002 of the pixel defining layer 100 is configured to define the light-emitting area of ​​the light-emitting element 234. For example, the light-emitting elements 234 of a plurality of sub-pixels 10 may be provided in a one-to-one correspondence with a plurality of openings 1002. For example, the light-emitting element 234 may include a portion located in the opening 1002 and a portion overlapping the main body portion 1001 in a direction perpendicular to the substrate 01.

[0063] For example, such as Figure 3 As shown, the opening 1002 of the pixel defining layer 100 is configured to expose the first electrode 120 of the light-emitting element 234, and the exposed first electrode 120 is at least partially in contact with the light-emitting functional layer 130 in the light-emitting element 234. For example, when the light-emitting functional layer 130 is located in the opening 1002 of the pixel defining layer 100, the first electrode 120 and the second electrode 140 located on both sides of the light-emitting functional layer 130 can drive the light-emitting functional layer 234 in the opening 1002 of the pixel defining layer 100 to emit light. For example, the light-emitting area can refer to the area where the light-emitting element 234 effectively emits light, and the shape of the light-emitting area refers to a two-dimensional shape, for example, the shape of the light-emitting area can be the same as the shape of the opening 1002 of the pixel defining layer 100.

[0064] For example, such as Figure 3As shown, the main body 1001 of the pixel defining layer 100 includes a first main body sub-part 10011 and a second main body sub-part 10012, with the first main body sub-part 10011 located on the side of the second main body sub-part 10012 closer to the substrate 01. For example, the first main body sub-part 10011 and the second main body sub-part 10012 may be integrally formed, but this is not a limitation. For the same main body 1001, the second main body sub-part 10012 protrudes relative to the first main body sub-part 10011 along the X direction to form a partition structure 10013, thereby forming an undercut structure at the edge of the second main body sub-part 10012. For example, the main body 1001 after forming the undercut structure is approximately mushroom-shaped.

[0065] like Figure 3 As shown, at least one of the multiple film layers in the light-emitting functional layer 130 is disconnected at the partition structure 10013 of the main body portion 1001. For example, the disconnected film layer in the light-emitting functional layer 130 can be at least one of the aforementioned common layers. In this case, the spacing between at least one film layer (such as a charge generation layer) in the light-emitting functional layers of two adjacent sub-pixels can increase the resistance of the light-emitting functional layers between adjacent sub-pixels, thereby reducing the probability of crosstalk between the two adjacent sub-pixels. Furthermore, when the light emission colors of the adjacent sub-pixels are different, it is beneficial to improve the color mixing of the display substrate, reduce power consumption, and extend the lifespan of the display substrate.

[0066] like Figure 3 As shown, the light-emitting functional layer 130 includes a portion located within the opening 1002 and a portion disposed on the side of the main body 1001 away from the substrate 01. When the light-emitting functional layer 130 is separated at the partition structure 10013, for the portion of the light-emitting functional layer 130 located on the side of the first electrode 120 in the opening 1002 away from the substrate 01, the thickness of this portion of the light-emitting functional layer 130 located in the middle of the opening 1002 is the greatest, while the thickness of the portion located at the edge of the opening 1002 gradually decreases.

[0067] like Figure 3As shown, the partition structure 10013 includes a groove 10014, and the structures on both sides of the light-emitting functional layer 130 can extend into the groove 10014. The light-emitting functional layer 130 on the side of the first electrode 120 located in the opening 1002 away from the substrate 01 and the orthographic projection of the light-emitting functional layer 130 on the side of the main body 1001 away from the substrate 01 on the substrate 01 at least partially overlap. For example, for the light-emitting functional layer 130 on the side of the first electrode 120 located in the opening 1002 away from the substrate 01, the portion of the light-emitting functional layer 130 whose thickness gradually decreases on both sides of the opening 1002 at least partially overlaps with the orthographic projection of the light-emitting functional layer 130 on the side of the main body 1001 away from the substrate 01 on the substrate 01, but is not limited to this.

[0068] refer to Figure 3 For example, in direction X, within the same opening 1002, the maximum dimension of the portion of the light-emitting functional layer 130 extending into the groove 10014 is 1 / 5 to 1 / 3 of the maximum dimension of the light-emitting functional layer 130. For example, in direction X, the aforementioned dimension is 1 / 5 to 1 / 4. For example, in direction X, the aforementioned dimension is 1 / 4 to 1 / 3. For example, in direction X, the aforementioned dimension is 1 / 5 to 4 / 15.

[0069] For example, refer to Figure 3 When the light-emitting functional layer 130 is located in the groove 10014 of the partition structure 10013, this part of the light-emitting functional layer 130 can at least partially overlap with the side wall 10016 of the main body 10013. At this time, the second electrode 140 is disposed on the side of the light-emitting functional layer 130 away from the first electrode 120, and the second electrode 140 is spaced apart from the first electrode 120 through the light-emitting functional layer 130 to reduce the probability of short circuit.

[0070] For example, when the main body portion 1001 between two adjacent sub-pixels 10 forms a partition structure 10013, the maximum size of the main body portion 1001 in the X direction can be reduced, thereby increasing the maximum size of the opening 1002 in the X direction and increasing the aperture ratio of the pixel limiting layer 100. This allows the opening 1002 to expose a larger area of ​​the light-emitting region in the light-emitting element 130, while also reducing the pixel limiting layer spacing between pixels to achieve high resolution performance of the display substrate.

[0071] For example, such as Figure 3 As shown, at least a portion of the side surface of the second main body sub-part 10012 has a minimum slope angle β of 60-90 degrees with the plane L1 parallel to the substrate 01.

[0072] like Figure 3As shown, at least a portion of the side surface of the second main body sub-part 10012 has a slope angle with the plane L1 parallel to the substrate 01, and the slope angle between the side surface of the edge portion of the second main body sub-part 10012 and the plane L1 is the minimum slope angle β.

[0073] For example, the minimum slope angle β can be 60 degrees - 80 degrees. For example, the minimum slope angle β can be 75 degrees - 95 degrees. For example, the minimum slope angle β can be 70 degrees - 90 degrees. For example, the minimum slope angle β can be 60 degrees. For example, the minimum slope angle β can be 65 degrees - 75 degrees. For example, the minimum slope angle β can be 65 degrees - 85 degrees. For example, the minimum slope angle β can be 80 degrees - 95 degrees. For example, the minimum slope angle β can be 60 degrees - 70 degrees. For example, the minimum slope angle β can be 60 degrees.

[0074] For example, setting the minimum slope angle β between at least a portion of the side surface of the second main body sub-part 10012 and the plane L1 parallel to the substrate 01 to 60-90 degrees can facilitate the disconnection of at least one film layer in the light-emitting element 234 at the partition structure 10013 without affecting the normal display of the sub-pixel 10, thereby improving the display performance of the display substrate.

[0075] For example, such as Figure 3 As shown, along the arrangement direction of adjacent sub-pixels 10, i.e., the X direction, the minimum size M1 of the opening 1002 is 1.2-1.5 times the maximum size M2 of the first main body sub-part 10011. That is, the opening area of ​​the opening 1002 can be maximized, thereby increasing the light-emitting area of ​​the light-emitting element 234 to enhance the display effect.

[0076] For example, along the X direction, the minimum size M1 of the opening 1002 can be 1.2-1.5 times the maximum size M2 of the first main body sub-part 10011. For example, the minimum size M1 of the opening 1002 can be 1.2-1.4 times the maximum size M2 of the first main body sub-part 10011. For example, the minimum size M1 of the opening 1002 can be 1.2-1.3 times the maximum size M2 of the first main body sub-part 10011. For example, the minimum size M1 of the opening 1002 can be 1.2-1.25 times the maximum size M2 of the first main body sub-part 10011. For example, the minimum size M1 of the opening 1002 can be 1.2-1.35 times the maximum size M2 of the first main body sub-part 10011. For example, the minimum size M1 of the opening 1002 can be 1.2-1.45 times the maximum size M2 of the first main body sub-part 10011. For example, the minimum size M1 of the opening 1002 can be 1.3-1.5 times the maximum size M2 of the first main body sub-part 10011. For example, the minimum size M1 of the opening 1002 can be 1.4-1.5 times the maximum size M2 of the first main body sub-part 10011.

[0077] For example, such as Figure 3 As shown, along the arrangement direction of adjacent sub-pixels (e.g., the X direction), the maximum size M2 of the first main body sub-part 10011 is 0.4-0.8 times the maximum size M3 of the second main body sub-part 10012. Within this range, the protrusion of the second main body sub-part 10012 relative to the first main body sub-part 10011 can be more appropriate.

[0078] For example, such as Figure 3 As shown, along a direction perpendicular to the substrate 01 (e.g., the Z direction), the maximum size N1 of the first main body sub-part 10011 is 1 to 1.8 times the maximum size N2 of the second main body sub-part 10012. For example, when the maximum size N1 of the first main body sub-part 10011 is greater than the maximum size N2 of the second main body sub-part 10012, it is advantageous for at least one of the multiple film layers in the light-emitting functional layer 130 to be disconnected at the partition structure 10013 of the main body 1001.

[0079] For example, along the arrangement direction of adjacent sub-pixels, the maximum size M2 of the first main body sub-part 10011 can be 0.4-0.7 times the maximum size M3 of the second main body sub-part 10012. For example, the maximum size M2 of the first main body sub-part 10011 can be 0.5-0.6 times the maximum size M3 of the second main body sub-part 10012. For example, the maximum size M2 of the first main body sub-part 10011 can be 0.4-0.6 times the maximum size M3 of the second main body sub-part 10012. For example, the maximum size M2 of the first main body sub-part 10011 can be 0.5-0.7 times the maximum size M3 of the second main body sub-part 10012. For example, the maximum size M2 of the first main body sub-part 10011 can be 0.5-0.8 times the maximum size M3 of the second main body sub-part 10012. For example, the maximum size M2 of the first main body sub-part 10011 can be 0.4-0.8 times the maximum size M3 of the second main body sub-part 10012.

[0080] For example, along a direction perpendicular to the substrate 01, the maximum size N1 of the first main body sub-part 10011 can be 1-1.6 times the maximum size N2 of the second main body sub-part 10012. For example, the maximum size N1 of the first main body sub-part 10011 can be 1.2-1.6 times the maximum size N2 of the second main body sub-part 10012. For example, the maximum size N1 of the first main body sub-part 10011 can be 1.3-1.6 times the maximum size N2 of the second main body sub-part 10012. For example, the maximum size N1 of the first main body sub-part 10011 can be 1.2-1.4 times the maximum size N2 of the second main body sub-part 10012. For example, the maximum size N1 of the first main body sub-part 10011 can be 1.3-1.5 times the maximum size N2 of the second main body sub-part 10012. For example, the maximum size N1 of the first main body sub-part 10011 can be 1.1-1.4 times the maximum size N2 of the second main body sub-part 10012. For example, the maximum size N1 of the first main body sub-part 10011 can be 1.4-1.6 times the maximum size N2 of the second main body sub-part 10012. For example, the maximum size N1 of the first main body sub-part 10011 can be 1.4-1.5 times the maximum size N2 of the second main body sub-part 10012.

[0081] For example, such as Figure 3 As shown, the first electrode 120 comprises a crystallized conductive metal oxide.

[0082] For example, the process of forming the main body 1001 includes processes such as heat treatment. During the heat treatment process, the first electrode 120 can be crystallized to prevent the etching process on the main body 1001 from being affected. For example, after crystallization, the first electrode 120 can be less affected by the wet etching solution while wet etching is being performed on the main body 1001, thereby protecting the inherent properties of the first electrode 120 itself.

[0083] For example, such as Figure 3 As shown, the orthographic projection of the portion of the light-emitting functional layer 130 located on the side of the second main body sub-part 10012 away from the substrate 01 on the substrate 01 at least partially overlaps with the orthographic projection of the portion of the light-emitting functional layer 130 located in the opening 1002 on the substrate 01.

[0084] For example, such as Figure 4 As shown, the light-emitting functional layer 130 includes multiple film layers that are disconnected at the partition structure 10013, such that each film layer includes a portion disposed on the side of the second main body sub-part 10012 away from the substrate 01, and a portion located in the opening 1002. For example, the light-emitting functional layer 130 located in the opening 1002 may extend into the grooves 10014 on both sides of the opening 1002, depending on the disconnection position and circumstances. Thus, the orthographic projection of the portion of the light-emitting functional layer 130 located on the side of the second main body sub-part 10012 away from the substrate 01 on the substrate 01 can at least partially overlap with the orthographic projection of the portion of the light-emitting functional layer 130 located in the opening 1002 on the substrate 01.

[0085] For example, such as Figure 3 As shown, the orthographic projection of the portion of the second electrode 140 located on the side of the second main body sub-part 10012 away from the substrate 01 on the substrate 01 at least partially overlaps with the orthographic projection of the portion of the second electrode 140 located in the opening 1002 on the substrate 01.

[0086] For example, such as Figure 4 As shown, the second electrode 140 is located on the side of the light-emitting element 130 away from the substrate 01. At least a portion of the second electrode 140 is disconnected at the partition structure 10013, such that the second electrode 140 includes a portion disposed on the side of the second main body sub-part 10012 away from the substrate, and a portion located in the opening 1002. For example, depending on the disconnection position, the portion of the second electrode 140 located in the opening 1002 may extend into the grooves 10014 on both sides of the opening 1002, thereby causing the orthographic projection of this portion of the second electrode 140 on the substrate 01 to at least partially overlap with the orthographic projection of the portion of the light-emitting functional layer 130 located in the opening 1002 on the substrate 01.

[0087] Figure 5 A cross-sectional view of another display substrate provided for at least one embodiment of this disclosure.

[0088] For example, compared to Figure 5 The display substrate shown is in Figure 3 In the display substrate shown, the sum of the minimum thicknesses of the light-emitting functional layer 130 in the light-emitting element 11 and the portion of the second electrode 140 located in the groove 10014 increases, and the minimum dimension between two adjacent main body portions 1001 increases (for example, approximately equal to M1). As a result, the area of ​​the light-emitting region of the light-emitting element 234 exposed by the opening 1002 increases, thereby enhancing the display effect.

[0089] For example, the sum of the minimum thicknesses of the portions of the light-emitting functional layer 130 and the second electrode 140 extending into the groove 10014 can be 1 / 3 to 1 / 2 of the sum of the maximum thicknesses of the light-emitting functional layer 130 and the second electrode 140. Alternatively, the sum of the minimum thicknesses of the portions of the light-emitting functional layer 130 and the second electrode 140 extending into the groove 10014 can be 1 / 2 to 1 / 4 to 1 / 2 of the sum of the maximum thicknesses of the light-emitting functional layer 130 and the second electrode 140. Finally, the sum of the minimum thicknesses of the portions of the light-emitting functional layer 130 and the second electrode 140 extending into the groove 10014 can be 1 / 3 to 1 / 2 of the sum of the maximum thicknesses of the light-emitting functional layer 130 and the second electrode 140.

[0090] For example, in the X direction, the maximum size of the light-emitting area exposed by the opening 1002 can be 75%-100% of the minimum size M1 of the opening 1002. Alternatively, in the X direction, the maximum size of the light-emitting area exposed by the opening 1002 can be 75%-95% of the minimum size M1 of the opening 1002. Alternatively, in the X direction, the maximum size of the light-emitting area exposed by the opening 1002 can be 80%-100% of the minimum size M1 of the opening 1002. Alternatively, in the X direction, the maximum size of the light-emitting area exposed by the opening 1002 can be 85%-95% of the minimum size M1 of the opening 1002. Alternatively, in the X direction, the maximum size of the light-emitting area exposed by the opening 1002 can be 70%-90% of the minimum size M1 of the opening 1002. This arrangement maximizes the area of ​​the light-emitting area exposed by the opening 1002, thereby enhancing the display effect of the display substrate.

[0091] Figure 5 This is a cross-sectional view of another display substrate provided in at least one embodiment of the present disclosure.

[0092] For example, such as Figure 5 As shown, compared toFigure 5 The display substrate shown is in Figure 5 The difference in the display substrate shown is that the partition structure 10013 includes a groove 10014, into which the light-emitting functional layer 130 extends. The display substrate 01 also includes a residual portion 90 located in the groove 10014, and the orthographic projection of the residual portion 90 on the substrate 01 falls into the orthographic projection of the partition structure 10013 on the substrate 01.

[0093] For example, such as Figure 5 As shown, the residual portion 90 can be a film structure left during the formation of the main body portion 1001. For example, when forming the main body portion 1001, it is necessary to provide an additional film layer as a sacrificial structure, and the first main body sub-portion 10011 and the second main body sub-portion 10012 are formed by removing the sacrificial structure. In this process, if the sacrificial structure is not completely removed, a structure such as... Figure 5 The residual portion 90 is shown. (As shown) Figure 5 As shown, the dimension of the residual portion 90 in the Z direction is smaller than the dimension of the first main body sub-part 10011 in the Z direction, and the dimension of the residual portion 90 in the X direction is smaller than the dimension of the groove 10014 in the X direction. Therefore, the orthographic projection of the residual portion 90 on the substrate 01 can fall within the orthographic projection of the partition structure 10013 on the substrate 01. For example, the dimension of the residual portion 90 in the X direction can be determined based on factors such as the removal time and degree of removal of the sacrificial structure. Figure 6 This is for illustrative purposes only, but is not limited to this.

[0094] For example, such as Figure 6As shown, for any sub-pixel, the maximum size of the residual portion 90 in the X direction is not greater than the maximum size of the groove 10014 in the X direction, and the orthographic projection of the residual portion 90 on the substrate 01 falls within the orthographic projection of the groove 10014 of the partition structure 10013 on the substrate 01, so as to avoid affecting the light-emitting performance of the light-emitting element 234. For example, the maximum size of the residual portion 90 in the Z direction may be the same as or different from that of the groove 10014. For example, the shape of the residual portion 90 located in the groove 10014 of different sub-pixels may be different, depending on the removal time and removal degree of the sacrificial structure, and the embodiments of this disclosure do not limit this. For example, the maximum size of the residual portion 90 in the X direction is 1 / 6-1 of the maximum size of the groove 10014 in the X direction. For example, the maximum size of the residual portion 90 in the X direction is 1 / 4-1 / 3 of the maximum size of the groove 10014 in the X direction. For example, the maximum dimension of the residual portion 90 in the X direction is 1 / 4 to 2 / 3 of the maximum dimension of the groove 10014 in the X direction. For example, the maximum dimension of the residual portion 90 in the X direction is 1 / 3 to 1 / 2 of the maximum dimension of the groove 10014 in the X direction. For example, the maximum dimension of the residual portion 90 in the X direction is 1 / 3 to 2 / 3 of the maximum dimension of the groove 10014 in the X direction.

[0095] For example, when forming an isolation structure 10013 for multiple sub-pixels, the thickness of the sacrificial structure can be set to be uniform, and the removal time and degree of the sacrificial structure can also be set to be the same to simplify the process and improve the consistency of the sub-pixel structure. Of course, in actual operation, the design can be flexibly made according to the actual process conditions. For example, the sacrificial structure in some sub-pixels can be completely removed, while the sacrificial structure in some sub-pixels can be incompletely removed. The embodiments of this disclosure do not limit this.

[0096] For example, refer to Figure 3 When the light-emitting functional layer 130 is located in the groove 10014 of the partition structure 10013, this portion of the light-emitting functional layer 130 can at least partially overlap with the residual portion 90 in the groove 10014. At this time, the second electrode 140 is disposed on the side of the light-emitting functional layer 130 away from the first electrode 120, and is spaced apart from the first electrode 120 through the light-emitting functional layer 130. Furthermore, the second electrode 140 does not overlap with the residual portion, thereby reducing the risk of circuit failure.

[0097] For example, when the main body 1001 is formed, during the development process, some of the developer may not be fully utilized or removed, and may remain partially in, for example, the groove 10014 of the main body 1001.

[0098] Therefore, the main body 1001 that forms the undercut structure also has the function of improving the structure of residual membrane, etc.

[0099] Figure 6 This is a schematic diagram of another display substrate provided for at least one embodiment of the present disclosure.

[0100] For example, such as Figure 6 As shown, the planarization layer 110 in the display substrate and its structure on the side away from the substrate 01 can be combined with... Figure 6 The display substrates are basically the same, and the relevant descriptions can be found in the descriptions of the foregoing embodiments, which will not be repeated here.

[0101] For example, such as Figure 6 As shown, along the direction perpendicular to the substrate 01, i.e., the Z direction, the display substrate includes a buffer layer 0114, an insulating layer 0113, an insulating layer 0112, an insulating layer 0111, and a planarization layer 110 sequentially disposed therefrom. For example, the insulating layers 0113, 0112, and 0111 can be made of inorganic materials, such as silicon nitride (SiNx) or silicon oxide (SiOx). For example, the buffer layer 0114 can be used to improve the resistance of the substrate 01 to water and oxygen.

[0102] For example, such as Figure 6 As shown, the display substrate also includes pixel circuitry configured to drive light-emitting elements to emit light. For example, the pixel circuitry can employ a 2T1C, 3T1C, or 7T1C design. For instance, the pixel circuitry can include multiple transistors and a storage capacitor. The multiple transistors can include a thin-film transistor 21, which includes a gate 211, an active layer 212, a source 210, and a drain 213. A first electrode 120 is connected to the drain 213. The source 210 and drain 213 of the thin-film transistor can be structurally identical and interchangeable in name.

[0103] For example, such as Figure 6 As shown, the pixel circuit may include a capacitor 31, which includes a first electrode plate 310 and a second electrode plate 320 disposed opposite to each other.

[0104] For example, such as Figure 6 As shown, the display substrate also includes a support structure 10016 disposed on the side of the main body 1001 away from the substrate, configured as a support layer to support the FMM (high-precision mask) during the vapor deposition process of the display substrate. For example, the support structure 10016 may be made of the same material as the main body 1001. For example, the support structure 10016 may be integrally formed with the main body 1001.

[0105] For example, Figure 7Encapsulation layer 41 is also shown. For example, encapsulation layer 41 includes a first encapsulation layer 411, a second encapsulation layer 412, and a third encapsulation layer 413. For example, the first encapsulation layer 411 and the third encapsulation layer 413 are inorganic layers and can be formed using a chemical vapor deposition (CVD) process. The second encapsulation layer 412 is an organic layer and can be formed using an inkjet printing process. Figure 8 As shown, the thickness of the second encapsulation layer 412 is greater than the thickness of the first encapsulation layer 411. Figure 9 As shown, the thickness of the second encapsulation layer 412 is greater than the thickness of the third encapsulation layer 413 to achieve a better encapsulation effect.

[0106] Figure 7 A schematic diagram of the planar structure of a display substrate provided in at least one embodiment of this disclosure; Figure 7 A schematic diagram of another display substrate planar structure provided for at least one embodiment of the present disclosure; Figure 7 This is a schematic diagram of another display substrate structure provided for at least one embodiment of the present disclosure.

[0107] For example, such as Figure 7 As shown, the plurality of sub-pixels 10 include a plurality of first color sub-pixels 101, a plurality of second color sub-pixels 102, and a plurality of third color sub-pixels 103. For example, one of the first color sub-pixels 101 and the third color sub-pixels 103 emits red light, and the other emits blue light; the second color sub-pixels 102 emit green light. Figure 8 The diagram schematically shows that the first color sub-pixel 101 emits red light and is a red sub-pixel; the third color sub-pixel 103 emits blue light and is a blue sub-pixel; and the second color sub-pixel 102 emits green light and is a green sub-pixel.

[0108] For example, such as Figure 9 As shown, a plurality of first color sub-pixels 101 and a plurality of third color sub-pixels 103 are alternately arranged along the X and Y directions parallel to the substrate 01 to form a plurality of first pixel rows 051 and a plurality of first pixel columns 052. A plurality of second color sub-pixels 101 are arrayed along the X and Y directions to form a plurality of second pixel rows 053 and a plurality of second pixel columns 054. The plurality of first pixel rows 051 and the plurality of second pixel rows 053 are alternately arranged along the Y direction and staggered relative to each other in the X direction. The plurality of first pixel columns 052 and the plurality of second pixel columns 054 are alternately arranged along the X direction and staggered relative to each other in the Y direction. For example, Figure 7 The arrangement of the multiple sub-pixels shown can be a Magic arrangement.

[0109] For example, the partition structure proposed in at least one embodiment of this disclosure can be applied to different pixel arrangement structures. Figure 8 and Figure 8 The arrangement of sub-pixels and the shape of the light-emitting area shown are...Figure 8 The sub-pixels shown are different.

[0110] For example, such as Figure 9 As shown, the multiple sub-pixels 10 include multiple third-color sub-pixels 104, multiple fourth-color sub-pixels 105, and multiple fifth-color sub-pixels 106. Figure 8 The diagram schematically shows a third color sub-pixel 104 emitting red light, designated as a red sub-pixel; a fourth color sub-pixel 105 emitting blue light, designated as a blue sub-pixel; and a fifth color sub-pixel 106 emitting green light, designated as a green sub-pixel. Multiple third color sub-pixels 104 and multiple fifth color sub-pixels 106 are alternately arranged along the Y direction parallel to the substrate 01 to form multiple third pixel columns 061. Multiple fourth color sub-pixels 105 are uniformly arranged between adjacent third pixel columns 061 to form multiple fourth pixel columns 062. The light-emitting areas of the third color sub-pixels 104, fourth color sub-pixels 105, and fifth color sub-pixels 106 are all rectangular in shape, and the light-emitting area of ​​the fourth color sub-pixel 105 is approximately square in shape. For example, Figure 8 The arrangement of the multiple sub-pixels shown can be an sRGB arrangement.

[0111] For example, such as Figures 7-9 As shown, the multiple sub-pixels 10 include multiple sixth color sub-pixels 107, multiple seventh color sub-pixels 108, multiple eighth color sub-pixels 109, and a ninth color sub-pixel 109. Figure 10A The diagram schematically illustrates that the sixth color sub-pixel 107 emits red light, making it a red sub-pixel; the seventh color sub-pixel 108 emits blue light, making it a blue sub-pixel; and the eighth and ninth color sub-pixels 109 emit the same green light, making them green sub-pixels. These sub-pixels are alternately arranged along the X and Y directions parallel to the substrate. The eighth and ninth color sub-pixels 109 can be arranged relative to each other, and their light-emitting areas are equal in size. Among the sub-pixels, the sixth color sub-pixel 107 has the largest light-emitting area. For example, Figure 7 The arrangement of the multiple sub-pixels shown can be a GGRB arrangement.

[0112] For example, in such Figure 10BIn the illustrated display substrate, each sub-pixel can be surrounded by an annular partition structure 10013. The partition structure 10013 can also be configured without a notch. In this case, at least one layer of the light-emitting layer between two adjacent sub-pixels is broken at the partition structure to reduce the risk of crosstalk. For example, to ensure the continuity of the second electrode, the second electrodes of different sub-pixels can be connected through a conductive optical coupling layer (CPL) to form a common electrode structure. For example, in some embodiments of this disclosure, the partition structure 10013 surrounding each sub-pixel can also be configured to include at least one notch to prevent the second electrode from breaking between adjacent sub-pixels.

[0113] Figure 7 for Figure 10C The diagram shows a partition structure with a notch in a display substrate. Figures 10A-10B for Figure 3 The diagram shows another partition structure with a notch in the display substrate. Figure 10A This is a schematic diagram of another display substrate provided for at least one embodiment of the present disclosure.

[0114] For example, in some embodiments of this disclosure, the spacing structure 10013 for different sub-pixels may be configured differently. For example, as... Figure 3 As shown, for the same opening 1002, the partition structure 10013 in the pixel limiting layer 100 can be configured as an open ring along the circumference of the opening 1002. The second electrodes 140 of adjacent light-emitting elements 234 are at least partially connected at the notch of the open ring to ensure the continuity of the second electrodes 140 between adjacent sub-pixels. The length H of the notch of the open ring can be 5-20 micrometers.

[0115] refer to Figure 10A and Figure 3 Each of the first color sub-pixel 101, the second color sub-pixel 102, and the third color sub-pixel 103 includes a non-closed annular partition structure 10013. The partition structure 10013 of each sub-pixel is arranged around the light-emitting area of ​​the sub-pixel, and the non-closed annular partition structure 10013 includes a notch. The second electrode 140 is disconnected at the partition structure 10013 of the sub-pixel and connected at the notch of the partition structure 10013 of adjacent sub-pixels to ensure continuity of the connection.

[0116] For example, in some embodiments of this disclosure, the non-enclosed annular partition structure 10013 may be C-shaped.

[0117] For example, refer to Figure 5 and Figure 10AThe length H of the notch in the non-closed annular partition structure 10013 can be 15-20 micrometers. For example, the aforementioned size can be 10-20 micrometers. For example, the aforementioned size can be 8-15 micrometers. For example, the aforementioned size can be 5-15 micrometers. For example, the aforementioned size can be 10-15 micrometers. For example, the aforementioned size can be 12-25 micrometers. For example, the aforementioned size can be 16-24 micrometers. For example, the aforementioned size can be 14-18 micrometers. For example, the aforementioned size can be 18-22 micrometers. However, this is not a limitation, and the embodiments of this disclosure do not limit this.

[0118] For example, refer to Figure 3 , Figure 10B and Figure 10B When the partition structure 10013 in a sub-pixel includes a residual portion 90, the residual portion 90 is located in the groove 10014 of the partition structure 10013. For the light-emitting element 234 of the same sub-pixel, the pattern enclosed by the residual portion 90 can also be a non-closed ring. For example, the shape of the residual portion 90 at different positions in the circumference of the same light-emitting element 234 can be different. For example, the non-closed ring residual portion 90 can also include multiple notches. For example, the size of the non-closed ring residual portion 90 can also be non-uniform, and the embodiments of this disclosure do not limit this. For example, the length of the notch of the non-closed ring residual portion 90 can be 1 / 4 to 1 / 3 of the length of the notch of the non-closed ring partition structure 10013. For example, the above size can be 1 / 4 to 1 / 3. For example, the above size can be 1 / 4 to 1 / 2. For example, the above size can be 1 / 3 to 1 / 2. For example, the above size can be 1 / 3 to 2 / 3. For example, the above size can be 1 / 2 to 2 / 3. For example, the above dimensions can be 2 / 3 to 3 / 4.

[0119] For example, refer to Figure 3 and Figure 10A For the same opening 1002, the partition structure 10013 in the pixel defining layer 100 may include multiple sub-parts, and the multiple sub-parts are arranged in a ring around the circumference of the opening 1002 to surround the light-emitting area of ​​the light-emitting element 234. For example, the partition structure 10013 surrounding the opening 1002 may include at least one notch, that is, the partition structure 10013 does not form a complete ring around the light-emitting area of ​​the sub-pixel. In this case, the second electrodes 140 in the light-emitting elements 234 of adjacent sub-pixels 10 can be connected to each other at the notch to facilitate the application of the same signal. For example, as Figure 10BAs shown, for adjacent sub-pixels 101 and 102, their second electrodes 140 can be connected through regions where the partition structure 10013 is not formed. For example, the connection of the second electrodes 140 can be achieved through the first region 100-1 and the second region 100-2, but it is not limited to this. For example, the second electrode 140 can be connected to any part of the pixel limiting layer 100 in sub-pixel 101 where the partition structure 10013 is not formed, and to any part of the pixel limiting layer 100 in sub-pixel 102 where the partition structure 10013 is not formed.

[0120] For example, in some embodiments of this disclosure, to reduce the risk of wire breakage in the second electrode 140, an auxiliary connection electrode can be added at the partition structure using a secondary mask to connect the second electrodes 140 of different sub-pixels. Alternatively, other film layers in the light-emitting element 234 can be made conductive, such as the optical coupling layer CPL in the light-emitting element. That is, the second electrodes 140 of different sub-pixels can be connected through the conductive optical coupling layer CPL, but this is not the only possibility.

[0121] For example, refer to Figure 3 , Figure 3 and Figure 10A For the same sub-pixel, at least a portion of the boundary of the partition structure 10013 and the boundary contour of the light-emitting area of ​​its adjacent sub-pixel are substantially the same. For example, the boundary contour of the light-emitting area of ​​the sub-pixel may include multiple straight edges, and / or, curved edges connecting adjacent straight lines. The boundary contour of the partition structure 10013 surrounding the light-emitting area may include straight edge contours corresponding to the straight edges of the light-emitting area, and / or, curved edge contours corresponding to the curved edges. For example, see reference. Figure 10B As shown in Figure 10, for the same sub-pixel, since the second main body sub-part 10012 protrudes in the X direction relative to the first main body sub-part 10011 to form a groove 10014 when the main body part 1001 is provided, for two adjacent sub-pixels, when the pixel limiting layer 100 between them is provided in the form of a partition structure 10013, the minimum distance in the X direction between the orthographic projection of the partition structure 10013 on the substrate and the orthographic projection of the center of the light-emitting area of ​​each sub-pixel on the substrate will increase. That is, the orthographic projection of the partition structure 10013 on the substrate will be further away from the orthographic projection of the center of the light-emitting area of ​​each sub-pixel on the substrate. Therefore, for two adjacent sub-pixels, the orthographic projection area of ​​the pixel limiting layer provided in the form of a partition structure 10013 on the substrate is smaller than the orthographic projection area of ​​the pixel limiting layer not provided in the form of a partition structure 10013 on the substrate. Therefore, by setting a partition structure, the embodiments of this disclosure can reduce crosstalk between adjacent sub-pixels while increasing the light-emitting area of ​​the light-emitting element to enhance the display effect.

[0122] For example, refer to Figure 3 , Figure 10A and Figure 10B Depending on the emitted color, for example, sub-pixel 101 can be a first-color sub-pixel 101, and sub-pixel 102 can be a second-color sub-pixel 102. The plurality of sub-pixels 10 also includes sub-pixel 103, and the emitted color of sub-pixel 103 is different from that of sub-pixels 101 and 102, being a third-color sub-pixel 103. For example, the partition structure 10013 can be located between adjacent first-color sub-pixels 101 and third-color sub-pixels 103, and / or, the partition structure 10013 can be located between adjacent second-color sub-pixels 102 and third-color sub-pixels 103, and / or, the partition structure 10013 can be located between adjacent first-color sub-pixels 101 and second-color sub-pixels 102.

[0123] For example, refer to Figure 10C , Figure 3 and Figure 10C The number of partition structures 10013 surrounding a sub-pixel's light-emitting area can include four. For example, the four partition structures 10013 can be located at the four corners of the light-emitting area. For example, the four partition structures 10013 can be parallel to the four edges of the light-emitting area. For example, the number of partition structures 10013 surrounding a sub-pixel can include three. For example, the partition structure 10013 of the same sub-pixel can be located at a corner of the light-emitting area or parallel to the edge of the light-emitting area. The location and number of partition structures 10013 can be determined according to the design requirements of the actual layout, and the embodiments of this disclosure do not limit this.

[0124] For example, such as Figure 3 As shown, with Figure 10C Compared to the display substrate shown, Figure 10C The difference in the display substrate shown is that the second electrode 140 is not interrupted at the partition structure 10013.

[0125] For example, with Figure 10C Compared to the display substrate shown, Figure 10C The maximum dimension of the recess 10014 in the Z direction of the main body portion 1001 in the display substrate shown can be relatively reduced, but is not limited thereto.

[0126] like Figure 11As shown, the light-emitting functional layer 130 is disconnected at the partition structure 10013, and the second electrode 140 is disposed on the side of the light-emitting functional layer 130 away from the substrate 01. The second electrode 140 is continuously disposed at the partition structure 10013. The portion of the second electrode 140 located on the side of the main body 1001 away from the substrate 01 is connected to the portion of the second electrode 140 located within the opening 1002, forming bending regions 1401 on both sides of the opening 1002. For example, in the same opening 1002, the thickness of the portion of the second electrode 140 located in the bending region 1401 is less than the thickness of the portion of the second electrode 140 located in the middle of the opening 1002.

[0127] For example, the thickness of the portion of the second electrode 140 located in the bending region 1401 is less than the thickness of the portion of the second electrode 140 located on the side of the main body 1001 away from the substrate 01, but is not limited to this. For example, the thickness of the portion of the second electrode 140 located in the bending region 1401 is 1 / 4 to 3 / 4 of the thickness of the portion of the second electrode 140 located on the side of the main body 1001 away from the substrate 01. For example, the above dimension can be 1 / 3 to 3 / 4. For example, the above dimension can be 1 / 2 to 3 / 4. For example, the above dimension can be 1 / 4 to 2 / 3. For example, the above dimension can be 1 / 3 to 2 / 3.

[0128] Therefore, in Figure 11 In the display substrate shown, the partition structure 10013 can only disconnect at least one film layer in the light-emitting functional layer 130 without disrupting the continuity of the second electrode 140, thereby ensuring a better connection between the second electrodes 140 of adjacent sub-pixels.

[0129] It should be noted that, Figures 12 to 20 The continuous state of the second electrode 140 shown is merely illustrative. In some embodiments of this disclosure, the shape (e.g., thickness) of the second electrode 140 may vary depending on the process conditions and design requirements, and this is not limited.

[0130] Figures 12 to 20 This is a schematic diagram of a display device provided according to an embodiment of the present disclosure.

[0131] Embodiments of this disclosure also provide a display device including any of the above-described display substrates.

[0132] like Figures 12 to 20 As shown, the display device 600 includes a display substrate 500. The display substrate 500 is any of the display substrates described above. The display substrate mentioned in the embodiments of this disclosure may also be referred to as a display panel. For example, the display substrate may be a flexible display substrate, but is not limited thereto.

[0133] On the one hand, this display substrate (display panel) avoids crosstalk between adjacent sub-pixels caused by highly conductive film layers (e.g., charge generation layers) by setting a partition structure between adjacent sub-pixels and disconnecting at least one film layer in the light-emitting functional layer at the location of the partition structure. Therefore, display devices including this display substrate can also avoid crosstalk between adjacent sub-pixels, resulting in higher product yield and higher display quality. Simultaneously, by setting the partition structure in the display substrate (display panel), the light-emitting area of ​​the light-emitting element can be increased to enhance the display effect.

[0134] On the other hand, since the display substrate can employ a tandem structure to increase pixel density, display devices including this display substrate have advantages such as long lifespan, low power consumption, high brightness, and high resolution.

[0135] For example, the display device can be an organic light-emitting diode display device or other display device, as well as any product or component with display function, such as a television, digital camera, mobile phone, watch, tablet computer, laptop computer, or navigator that includes the display device. The embodiments disclosed herein include, but are not limited to, these.

[0136] Figures 12 to 20 This is a schematic diagram of a method for manufacturing a display substrate according to at least one embodiment of the present disclosure.

[0137] like Figure 6As shown, at least one embodiment of this disclosure also provides a method for manufacturing a display substrate, comprising: forming a planarization layer 110 on a substrate 01; forming a first conductive film 012 on the planarization layer 110 and patterning the first conductive film 012 to form a first electrode 120; forming a second conductive film 013 on the first electrode 120 and patterning the second conductive film 013 to form a sacrificial structure 150; forming a pixel defining film 014 on the sacrificial structure 150 and patterning the pixel defining film 014 to form a pixel defining layer 100, the pixel defining layer including a main body 1001 and a plurality of openings 1002, each opening 1002 exposing at least one of the first electrodes 120. Partially; the sacrificial structure 150 is removed so that the main body portion 1001 includes a first main body sub-portion 10011 and a second main body sub-portion 10012, the first main body sub-portion 10011 being located on the side of the second main body sub-portion 10012 closer to the substrate 01, and the second main body sub-portion 10012 protruding relative to the first main body sub-portion 10011 to form a partition structure 10013 in the main body portion 1001; a light-emitting functional layer 130 and a second electrode 140 are sequentially formed on the pixel defining layer, the light-emitting functional layer 130 including a plurality of film layers, at least one of the plurality of film layers being broken at the partition structure 10013, the partition structure 10013 including a groove 1004, the light-emitting functional layer 130 extending into the groove 1004.

[0138] For example, such as Figure 6As shown, before forming the planarization layer 110 on the substrate 01, the method for fabricating the display substrate may include preparing the substrate 01 on a glass carrier. For example, the substrate 01 may be a flexible substrate. For example, forming the substrate 01 may include sequentially forming a first flexible material layer, a first inorganic material layer, a semiconductor layer, a second flexible material layer, and a second inorganic material layer on the glass carrier. The materials of the first flexible material layer and the second flexible material layer are polyimide (PI), polyethylene terephthalate (PET), or surface-treated polymer soft film, etc. For example, the materials of the first inorganic material layer and the second inorganic material layer are silicon nitride (SiNx) or silicon oxide (SiOx), etc., to improve the substrate's resistance to water and oxygen; the first inorganic material layer and the second inorganic material layer are also referred to as barrier layers. The material of the semiconductor layer is amorphous silicon (a-Si). For example, taking the stacked structure PI1 / Barrier1 / a-si / PI2 / Barrier2 as an example, its preparation process includes: firstly, coating a layer of polyimide on a glass substrate, curing it into a film to form a first flexible (PI1) layer; then depositing a barrier film on the first flexible layer to form a first barrier (Barrier1) layer covering the first flexible layer; then depositing an amorphous silicon film on the first barrier layer to form an amorphous silicon (a-si) layer covering the first barrier layer; then coating another layer of polyimide on the amorphous silicon layer, curing it into a film to form a second flexible (PI2) layer; then depositing a barrier film on the second flexible layer to form a second barrier (Barrier2) layer covering the second flexible layer, and finally completing the preparation of the substrate 01.

[0139] For example, such as Figures 12 to 20 As shown, before forming the planarization layer 110 on the substrate 01, the method for fabricating the display substrate may include preparing other film layers 011 on the substrate 01. (Reference) Figure 6The substrate shown may include other film layers 011, which may include a driving structure layer comprising multiple pixel circuits 21 as described above. For example, forming the driving structure layer may include sequentially depositing a first insulating film and an active layer film on the substrate 01, patterning the active layer film using a patterning process to form a buffer layer 0114 covering the entire substrate 01, and an active layer pattern disposed on the buffer layer 0114, the active layer pattern including at least an active layer 212. A second insulating film and a first metal film may be sequentially deposited, and the first metal film may be patterned using a patterning process to form a second insulating layer 0113 covering the active layer 212, and a first gate metal layer pattern disposed on the second insulating layer 0113, the first gate metal layer pattern including at least a gate 211 and a first electrode 310. A third insulating film and a second metal film are deposited sequentially. The second metal film is patterned using a patterning process to form a third insulating layer 0112 covering the gate 211, and a second gate metal layer pattern disposed on the third insulating layer 0112. The second gate metal layer pattern includes at least a second electrode 320, the position of which corresponds to the position of the first electrode 310. Subsequently, a fourth insulating film is deposited. The fourth insulating film is patterned using a patterning process to form a fourth insulating layer 0111 covering the second electrode 320. At least two first vias N1 are formed on the fourth insulating layer 0111. The fourth insulating layer 0111, the third insulating layer 0112, and the second insulating layer 0113 within the two first vias N1 are etched away, exposing the surface of the active layer 212 with the active layer pattern. Subsequently, a third metal film is deposited. The third metal film is patterned using a patterning process to form a source / drain metal layer pattern on the fourth insulating layer 0111. The source / drain metal layer pattern includes at least a source 210 and a drain 213 located in the display area. The source 210 and drain 213 can be connected to the active layer 212 in the active layer pattern through the first via N1, respectively.

[0140] For example, refer to Figures 12 to 14 , Figure 6The buffer layer 0114, the second insulating layer 0113, the third insulating layer 0112, and the fourth insulating layer 0111 are made of any one or more of silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON), and can be single-layer, multi-layer, or composite layers. For example, the first metal film, the second metal film, and the third metal film are made of any one or more of metallic materials, such as silver (Ag), copper (Cu), aluminum (Al), titanium (Ti), and molybdenum (Mo), or alloys of the above metals, such as aluminum-neodymium alloy (AlNd) or molybdenum-niobium alloy (MoNb), and can be single-layer structures or multi-layer composite structures, such as Ti / Al / Ti, etc. The active layer pattern uses one or more materials such as amorphous indium gallium zinc oxide (a-IGZO), zinc oxynitride (ZnON), indium zinc tin oxide (IZTO), amorphous silicon (a-Si), polycrystalline silicon (p-Si), hexathiophene, and polythiophene. In other words, this disclosure is applicable to transistors manufactured based on oxide technology, silicon technology, and organic technology.

[0141] For example, refer to Figures 12 to 14 , Figures 12 to 16 Forming a planarization layer 110 on a substrate 01 includes: coating an organic material onto a planarization film on the substrate 01 with the aforementioned pattern; forming a planarization (PLN) layer 110 covering the entire substrate 01; and forming a plurality of second vias N2 on the planarization layer 100 in the display area through a masking, exposure, and development process. For example, the planarization layer 200 within the plurality of second vias N2 is developed away, exposing the surfaces of the drains 213 of the transistors 21 of the pixel circuits of the plurality of sub-pixels.

[0142] For example, refer to Figures 12 to 16 , Figure 6 A first conductive thin film 012 is deposited on the planarization layer 110, and the first conductive thin film 012 is patterned to form a first electrode 120. For example, the first electrode 120 is connected to the drain 213 of the transistor 21 through a second via N2 in the planarization layer 110.

[0143] For example, refer to Figures 12 to 16 A second conductive thin film 013 is formed on the first electrode 120, and the second conductive thin film 013 is patterned to form a sacrificial structure 150.

[0144] For example, the material of the first conductive film includes a conductive metal oxide, and the material of the second conductive film includes a metallic material. For example, the conductive metal oxide includes indium tin oxide, and the metal includes aluminum or silver. For example, the first conductive film or the second conductive film can be a single-layer structure or a multi-layer composite structure.

[0145] For example, the sacrificial structure 150 can be any of aluminum (Al), silver (Ag), and titanium (Ti) / aluminum (Al) / titanium (Ti) metal stacks.

[0146] For example, refer to Figure 6 In forming the first electrode 120, a first spacing region 1210 located between adjacent first electrodes 120 is also formed through a patterning process. For example, the first spacing region 1210 can separate the first electrodes 120 of adjacent sub-pixels.

[0147] For example, refer to Figures 12 to 16 , Figure 6 When forming the first electrode 150, a second spacing region 1510 located between adjacent sacrificial structures 150 is formed by a patterning process. Along the X direction, the orthographic projection of the first spacing region 1210 on the substrate 01 falls into the orthographic projection of the second spacing region 1510 on the substrate, and the minimum size of the second spacing region 1510 is greater than or equal to the minimum size of the first spacing region. As a result, the minimum size of the first main body sub-part 10011 in the X direction is greater than the size of the first spacing region 1210, so that the structure of the main body sub-part 1001 is more stable.

[0148] For example, refer to Figures 12 to 18 , Figure 6 After patterning the pixel-defining film 014, the formed pixel-defining layer 100 includes a plurality of openings 1002. Along the arrangement direction of adjacent sub-pixels (i.e., along the X direction), the minimum size of the opening 1002 is smaller than the minimum size of the sacrificial structure 150, and the orthographic projection of the opening 1002 onto the substrate 01 falls within the orthographic projection of the sacrificial structure 150 onto the substrate 01. This allows an undercut structure to be formed in the main body 1001 after the sacrificial structure 150 is subsequently removed. In the X direction, for example, the minimum size of the opening 1002 can be 50%-95% of the minimum size of the sacrificial structure 150. For example, the minimum size of the opening 1002 can be 60%-85% of the minimum size of the sacrificial structure 150. For example, the minimum size of the opening 1002 can be 70%-80% of the minimum size of the sacrificial structure 150.

[0149] For example, refer to Figures 12 to 19 , Figure 6 When forming the pixel defining layer 100, a support structure 10016 is also formed on the side of the pixel defining layer 100 away from the substrate. The orthographic projection of the support structure 10016 on the substrate 01 at least partially overlaps with the orthographic projection of the second spacing region 1510 on the substrate 01. For example, the support structure 10016 may be integrally formed with the main body 1001, use the same material, and be configured to support the FMM (high-precision mask) during the vapor deposition process of the display substrate.

[0150] For example, refer to Figures 12 to 19 , Figure 6 The thickness of the second conductive film 013 is 1-3 times the thickness of the first conductive film 012; the thickness of the pixel defining film 014 is 3-8 times the thickness of the second conductive film 013. That is, the thickness of the first main body 10011 can be approximately 1-3 times the thickness of the first electrode 120, and the thickness of the main body 1001 can be 3-8 times the thickness of the sacrificial structure 150. Therefore, according to actual layout design requirements, the main body can form an effective partition structure 10013 to disconnect at least one film layer in the light-emitting functional layer.

[0151] For example, the thickness of the second conductive film 013 is 1.5-3 times the thickness of the first conductive film 012; the thickness of the pixel defining film 014 is 5-8 times the thickness of the second conductive film 013. For example, the thickness of the second conductive film 013 is 1.5-2.5 times the thickness of the first conductive film 012; the thickness of the pixel defining film 014 is 4-7 times the thickness of the second conductive film 013. For example, the thickness of the second conductive film 013 is 1.8-2.5 times the thickness of the first conductive film 012; the thickness of the pixel defining film 014 is 4.5-6.5 times the thickness of the second conductive film 013. For example, the thickness of the second conductive film 013 is 2-2.5 times the thickness of the first conductive film 012; the thickness of the pixel defining film 014 is 4.5-6.5 times the thickness of the second conductive film 013. For example, the thickness of the second conductive film 013 is 2.5-3 times the thickness of the first conductive film 012; the thickness of the pixel defining film 014 is 5.5-7.5 times the thickness of the second conductive film 013.

[0152] For example, refer to Figures 12 to 19 , Figure 6 After forming the sacrificial structure 150 and before removing the sacrificial structure 150, the manufacturing method further includes: heat-treating the display substrate 01 to crystallize the first electrode 120.

[0153] For example, refer to Figures 12 to 19 , Figure 6 The sacrificial structure 150 can be removed by wet etching.

[0154] For example, refer to Figures 12 to 19 , Figure 6 During the heat treatment of the display substrate 01, the first electrode 120 (e.g., the first electrode using indium tin oxide) will be crystallized at high temperature, thereby reducing the risk of being etched away by the etching solution during the subsequent removal of the sacrificial structure 150.

[0155] For example, refer to Figures 12 to 19 , Figure 5 When the material of the second conductive thin film 013 is a metal such as aluminum or silver, an acidic etching solution can be used to etch the intermediate film layer (i.e., the sacrificial structure 150) made of metal when the sacrificial structure 150 is etched away using a wet etching process. For example, the acidic etching solution may include materials such as HNO3 (nitric acid), but is not limited thereto, and the embodiments disclosed herein do not limit this.

[0156] For example, refer to Figure 6 , Figures 12 to 19 When removing the sacrificial structure 150, the removal time and degree of removal can be controlled according to actual process requirements. For example, the removal time and degree of removal can be set with relative retention, so that the sacrificial structure 150 is not completely removed, but has a certain residual portion 90 (e.g., Figure 6 As shown, the residual portion 90 can be located in the groove 10014 without affecting the light-emitting performance of the display substrate.

[0157] For example, refer to Figures 12 to 19 , ​ When forming the light-emitting functional layer 130, at least one of the plurality of film layers of the light-emitting functional layer 130 is disconnected at the partition structure 10013. A portion of the light-emitting functional layer 130 is disposed on the side of the main body 1001 away from the substrate 01, and a portion of the light-emitting functional layer 130 is located in the opening 1002 and extends into the groove 10014. For example, the second electrode 140 is disposed on the side of the light-emitting functional layer 130 away from the substrate, and the second electrode 140 may not be disconnected at the partition structure 10013 to ensure continuity between adjacent sub-pixels 10.

[0158] For example, refer to ​ , ​ The method for manufacturing the display substrate also includes forming an encapsulation layer 41, namely, forming a first encapsulation layer 411, a second encapsulation layer 412, and a third encapsulation layer 413 sequentially on the side of the second electrode 140 away from the substrate 01, so that the display substrate has a good encapsulation effect and prevents moisture or impurities from entering.

[0159] The following points need to be explained:

[0160] (1) The accompanying drawings of the embodiments of this disclosure only involve the structures involved in the embodiments of this disclosure, and other structures can be referred to the general design.

[0161] (2) Where there is no conflict, features of the same embodiment and different embodiments of this disclosure may be combined with each other.

[0162] The above description is merely an exemplary embodiment of this disclosure and is not intended to limit the scope of protection of this disclosure, which is determined by the appended claims.

Claims

1. A display substrate, comprising: Substrate; Multiple sub-pixels, each of the multiple sub-pixels including a light-emitting element, the light-emitting element including a light-emitting functional layer and a first electrode and a second electrode located on both sides of the light-emitting functional layer along a direction perpendicular to the substrate, the first electrode being located between the light-emitting functional layer and the substrate, the light-emitting functional layer including multiple film layers; A pixel defining layer includes a main body and a plurality of openings defined by the main body, the openings exposing at least a portion of the first electrode; as well as A planarization layer is disposed between the substrate and the pixel defining layer. The main body includes a first main body sub-part and a second main body sub-part, wherein the first main body sub-part is located on the side of the second main body sub-part closer to the substrate. The second main body sub-part protrudes relative to the first main body sub-part to form a partition structure, and at least one of the plurality of membrane layers is broken at the partition structure of the main body sub-part. The orthographic projection of the light-emitting functional layer on the substrate of the first electrode located in the opening, on the side away from the substrate, overlaps at least partially with the orthographic projection of the light-emitting functional layer on the substrate of the main body located on the side away from the substrate. Along the arrangement direction of adjacent sub-pixels, the maximum size of the first main body sub-part is 0.4-0.8 times the maximum size of the second main body sub-part, and Along a direction perpendicular to the substrate, the maximum size of the first main body sub-part is 1 to 1.8 times the maximum size of the second main body sub-part.

2. The display substrate according to claim 1, wherein, For the same opening, the partition structure in the pixel defining layer is configured as an open ring along the circumference of the opening, and the second electrodes of adjacent light-emitting elements are at least partially connected at the gaps in the open ring. The length of the unclosed annular notch is 5-20 micrometers.

3. The display substrate according to claim 1, wherein, The minimum slope angle between at least a portion of the side surface of the second main body and the plane parallel to the substrate is 60-90 degrees.

4. The display substrate according to claim 1, wherein, Along the arrangement direction of adjacent sub-pixels, the minimum size of the opening is 1.2-1.5 times the maximum size of the first main body sub-part.

5. The display substrate according to claim 1, wherein, The first electrode comprises a crystallized conductive metal oxide.

6. The display substrate according to any one of claims 1-5, wherein, The orthographic projection of the portion of the light-emitting functional layer located on the side of the second main body away from the substrate on the substrate at least partially overlaps with the orthographic projection of the portion of the light-emitting functional layer located in the opening on the substrate.

7. The display substrate according to any one of claims 1-5, wherein, The orthographic projection of the portion of the second electrode located on the side of the second main body away from the substrate on the substrate at least partially overlaps with the orthographic projection of the portion of the second electrode located in the opening on the substrate.

8. The display substrate according to any one of claims 1-5, wherein, The partition structure includes a groove, and the light-emitting functional layer extends into the groove.

9. The display substrate according to claim 8, wherein, The display substrate also includes a residual portion located in the groove, and the orthographic projection of the residual portion on the substrate falls into the orthographic projection of the partition structure on the substrate.

10. A display device comprising the display substrate according to any one of claims 1-9.

11. A method for manufacturing a display substrate, comprising: A planarization layer is formed on the substrate. A first conductive film is formed on the planarization layer, and the first conductive film is patterned to form a first electrode; A second conductive film is formed on the first electrode, and the second conductive film is patterned to form a sacrificial structure; A pixel-defining film is formed on the sacrificial structure, and the pixel-defining film is patterned to form a pixel-defining layer, the pixel-defining layer including a main body and a plurality of openings, the openings exposing at least a portion of the first electrode; The sacrificial structure is removed so that the main body includes a first main body sub-part and a second main body sub-part, the first main body sub-part being located on the side of the second main body sub-part closer to the substrate, and the second main body sub-part protruding relative to the first main body sub-part to form a partition structure in the main body; A light-emitting functional layer and a second electrode are sequentially formed on the pixel defining layer. The light-emitting functional layer includes multiple film layers, and at least one of the multiple film layers is disconnected at the partition structure. The partition structure includes a groove, and the light-emitting functional layer extends into the groove. Wherein, the orthographic projection of the light-emitting functional layer on the substrate of the first electrode located in the opening on the side away from the substrate overlaps at least partially with the orthographic projection of the light-emitting functional layer on the substrate of the main body located on the side away from the substrate. Along the arrangement direction of adjacent sub-pixels, the maximum size of the first main body sub-part is 0.4-0.8 times the maximum size of the second main body sub-part, and Along a direction perpendicular to the substrate, the maximum size of the first main body sub-part is 1 to 1.8 times the maximum size of the second main body sub-part.

12. The manufacturing method according to claim 11, wherein, Forming the first electrode includes: forming a first gap region located between adjacent first electrodes; Forming the sacrificial structure includes: forming a second gap region located between adjacent sacrificial structures, along the arrangement direction of adjacent sub-pixels, such that the orthographic projection of the first gap region on the substrate falls into the orthographic projection of the second gap region on the substrate, and such that the minimum size of the second gap region is greater than or equal to the minimum size of the first gap region.

13. The manufacturing method according to claim 11, wherein, Along the arrangement direction of adjacent sub-pixels, the minimum size of the opening is smaller than the minimum size of the sacrificial structure, and the orthographic projection of the opening on the substrate falls into the orthographic projection of the sacrificial structure on the substrate.

14. The manufacturing method according to claim 12, further comprising: A support structure is formed on the side of the pixel defining layer away from the substrate, wherein the orthographic projection of the support structure on the substrate at least partially overlaps with the orthographic projection of the second spacing region on the substrate.

15. The manufacturing method according to any one of claims 11-14, wherein, The thickness of the second conductive film is 1-3 times the thickness of the first conductive film; The thickness of the pixel-defining film is 3-8 times the thickness of the second conductive film.

16. The manufacturing method according to any one of claims 11-14, wherein, The first conductive film is made of a conductive metal oxide, and the second conductive film is made of a metal.

17. The manufacturing method according to claim 16, wherein, The conductive metal oxide includes indium tin oxide; The metal includes any one of aluminum, silver, and a titanium / aluminum / titanium metal stack.

18. The manufacturing method according to claim 16, wherein after forming the sacrificial structure and before removing the sacrificial structure, the manufacturing method further comprises: The display substrate is subjected to heat treatment to crystallize the first electrode.

19. The manufacturing method according to claim 18, wherein, Removing the sacrificial structure includes: The sacrificial structure was removed by etching using a wet etching process.

20. The manufacturing method according to claim 19, wherein, The material of the second conductive film includes metal, and the etching process for removing the sacrificial structure includes etching the intermediate film layer made of the metal using an acidic etching solution.

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