Aerosol generating device and conductive element for aerosol generating device

Abstract

The invention provides an aerial fog generating device and a conductive element for the aerial fog generating device. Wherein the aerosol generating device comprises: a heating element for heating an aerosol generating article; a circuit board; the conductive element is used for connecting the heating element with the circuit board to form a heating loop; the conductive element is arranged to conduct heat with the heating element and is configured to be capable of achieving a predetermined temperature by receiving heat of the heating element to generate thermal deformation so as to disconnect the heating loop. According to the aerial fog generating device, the heat of the heating element is received through the thermally-deformable conductive element to form thermal deformation, so that power supply to the heating element is controlled, and the temperature of the heating element is kept lower than the preset maximum temperature.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of heat-not-burn aerosol generation, and in particular to an aerosol generating device and a conductive element for the aerosol generating device. Background Art

[0002] Smoking articles (eg, cigarettes, cigars, etc.) burn tobacco during use to produce tobacco smoke. People have attempted to replace these tobacco-burning articles by creating products that release compounds without combustion.

[0003] An example of such a product is a heating device that releases a compound by heating rather than burning a material. For example, the material may be tobacco or other non-tobacco products that may or may not contain nicotine. Known heating devices heat tobacco or other non-tobacco products with a heater and control the power supplied to the heater by monitoring the temperature of the heater, thereby maintaining the temperature of the heater at a preset temperature or preventing the temperature of the heater from exceeding a maximum temperature threshold. Summary of the invention

[0004] One embodiment of the present application provides a conductive element for an aerosol generating device, for guiding current on a heating element of the aerosol generating device, the conductive element comprising:

[0005] A first metal layer and a second metal layer closely connected to the first metal layer; the thermal expansion coefficient of the first metal layer is greater than the thermal expansion coefficient of the second metal layer, so that when the temperature of the conductive element reaches a predetermined temperature, thermal deformation can be generated to bend toward one side of the second metal layer.

[0006] In some embodiments, the thermal curvature of the conductive element measured according to the test standard of GB / T 4461-2020 is greater than 10.1×10 -6 / ℃; wherein, the initial temperature in the measurement according to the test standard of GB / T 4461-2020 is 20℃ and the final temperature is 130℃.

[0007] In some embodiments, the thermal curvature of the conductive element measured according to the test standard of GB / T 4461-2020 is between 13.1×10 -6 / ℃~39.1×10 -6 / ℃; wherein, the initial temperature measured in accordance with the test standard of GB / T4461-2020 is 20℃ and the final temperature is 130℃.

[0008] In some embodiments, the linear thermal expansion coefficient of the first metal layer is greater than or equal to 14×10 -6 / ℃.

[0009] In some embodiments, the linear thermal expansion coefficient of the second metal layer is less than or equal to 10×10 -6 / ℃.

[0010] In some embodiments, the coefficient of linear thermal expansion of the first metal layer is at least 5 times the coefficient of linear thermal expansion of the second metal layer.

[0011] In some embodiments, the first metal layer includes an alloy of at least two of nickel, manganese, copper and zinc;

[0012] And / or, the second metal layer includes an alloy containing nickel and iron.

[0013] In some embodiments, the first metal layer includes at least one of alloys having alloy grades of Mn72Ni10Cu18, Mn75Ni15Cu10, Ni22Cr3, Ni19Mn7, Ni20Mn6, Cu62Zn38, Ni19Cr11, Ni22Cr3, Mn15Ni10Cr10, and Ni16Cr11;

[0014] And / or, the second metal layer includes at least one of alloy grades Ni34, Ni36, Ni42, Ni50, Ni45Cr6, and Ni20Co26Cr8.

[0015] In some embodiments, the conductive element is configured in a sheet shape.

[0016] In some embodiments, the conductive element has a length of 5 mm to 30 mm, a width of 2 mm to 8 mm, and a thickness of 0.02 mm to 0.4 mm.

[0017] Another embodiment of the present application further provides an aerosol generating device, which is configured to heat an aerosol generating article to generate an aerosol; comprising:

[0018] a heating element for heating the aerosol generating article;

[0019] Circuit boards;

[0020] A conductive element is used to connect the heating element to the circuit board to form a heating loop; the conductive element is arranged to conduct heat with the heating element and is configured to receive heat from the heating element to reach a predetermined temperature to generate thermal deformation, thereby disconnecting the heating loop.

[0021] In some embodiments, the conductive element is configured in a sheet shape, and the thermal curvature measured according to the test standard of GB / T4461-2020 is greater than 10.1×10 -6 / ℃; wherein, the initial temperature in the measurement according to the test standard of GB / T 4461-2020 is 20℃ and the final temperature is 130℃.

[0022] In some embodiments, the conductive element comprises:

[0023] A first metal layer and a second metal layer closely connected to the first metal layer; the thermal expansion coefficient of the first metal layer is greater than the thermal expansion coefficient of the second metal layer, so that when the temperature of the conductive element reaches a predetermined temperature, thermal deformation can be generated to bend toward one side of the second metal layer.

[0024] In some embodiments, the heating element has electrodes for conducting an electric current across the heating element;

[0025] The conductive element is arranged to be electrically connected to the circuit board and abut against the electrode, thereby connecting the heating element to the circuit board to form a heating loop; the conductive element is configured to be separated from the electrode by thermal deformation, thereby disconnecting the heating loop.

[0026] In some embodiments, the heating element comprises at least one of a resistive heating element, an inductive heating element, or an infrared heating element.

[0027] In some embodiments, the thermal deformation of the conductive element is recoverable.

[0028] Another embodiment of the present application further provides an aerosol generating device, which is configured to heat an aerosol generating article to generate an aerosol; comprising:

[0029] Circuit boards;

[0030] a heating element for heating the aerosol generating article; the heating element is provided with a first electrode, a second electrode and a third electrode sequentially arranged at different positions along the longitudinal direction, thereby dividing the heating element into a first heating portion defined between the first electrode and the second electrode, and a second heating portion defined between the second electrode and the third electrode; the first electrode is electrically connected to the circuit board;

[0031] a conductive element arranged to be capable of receiving heat from the heating element to generate thermal deformation, thereby changing the configuration between a first connection state and a second connection state;

[0032] In a first connection state, the conductive element electrically connects the second electrode to the circuit board, thereby connecting the first heating part to the circuit board to form a loop to drive the first heating part to heat; in a second connection state, the conductive element electrically connects the third electrode to the circuit board, thereby connecting the first heating part and the second heating part to the circuit board to form a loop to drive the first heating part and the second heating part to heat simultaneously.

[0033] The above aerosol generating device receives heat from the heating element through the thermally deformable conductive element to form thermal deformation, so as to control the power supply to the heating element so that the temperature of the heating element is kept lower than the preset maximum temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0035] Figure 1 is a schematic diagram of an aerosol generating device provided by an embodiment;

[0036] Figure 2 yes Figure 1 Schematic diagram of the heating mechanism;

[0037] Figure 3 yes Figure 2 A schematic diagram of a conductive element in a state of thermal deformation formed by heating to a preset temperature;

[0038] Figure 4 is a cross-sectional schematic diagram of a conductive element of an embodiment from one viewing angle;

[0039] Figure 5 is another schematic diagram of a conductive element from a top-down perspective;

[0040] Figure 6 is a schematic diagram of a heating mechanism of yet another embodiment;

[0041] Figure 7 yes Figure 6 A schematic diagram of a thermal deformation state of a conductive element;

[0042] Figure 8 yes Figure 6 A schematic diagram of another thermal deformation state of the conductive element;

[0043] Fig. 9 is a schematic diagram of a heating mechanism of yet another embodiment;

[0044] Fig.10is a schematic diagram of a heating mechanism of yet another embodiment;

[0045] Fig.11 is a schematic diagram of a heating mechanism of yet another embodiment;

[0046] Fig.12 is a schematic diagram of a heating mechanism of yet another embodiment;

[0047] Fig.13 yes Fig.12 Schematic diagram of a thermal deformation state of a conductive component. DETAILED DESCRIPTION

[0048] In order to facilitate the understanding of the present application, the present application is described in more detail below in conjunction with the accompanying drawings and specific implementation methods.

[0049] One embodiment of the present application provides an aerosol generating device 100 that heats, rather than burns, an aerosol generating product 1000, such as a cigarette, so that at least one component of the aerosol generating product 1000 is volatilized or released to form an aerosol for inhalation, for example Figure 1 shown.

[0050] In an optional embodiment, the aerosol generating article 1000 may optionally use a tobacco-containing material that releases volatile compounds from the substrate when heated; or it may also be a non-tobacco material that is suitable for electric heating and smoking after heating. The aerosol generating article 1000 may optionally use a solid substrate, which may include one or more of powder, particles, fragments, strips, or flakes of one or more of herb leaves, tobacco leaves, homogenized tobacco, and expanded tobacco; or the solid substrate may contain additional tobacco or non-tobacco volatile flavor compounds to be released when the substrate is heated.

[0051] according to Figure 1 As shown, after the aerosol generating article 1000 is received in the aerosol generating device 100, a portion thereof is exposed outside the aerosol generating device 100, such as a filter tip, which is advantageous for a user to inhale.

[0052] The structure of the aerosol generating device 100 according to one embodiment of the present application can be seen in Figure 1 As shown, the overall appearance of the device is roughly constructed in the shape of a flat cylinder, and the external components of the aerosol generating device 100 include:

[0053] The housing 10 defines the shape and outer surface of the aerosol generating device 100; the housing 10 is hollow inside, thereby forming an assembly space for necessary functional components such as electronic devices and heating devices; the housing 10 has a proximal end 110 and a distal end 120 opposite to each other along the length direction. Figure 1 As shown, the aerosol generating device 100 further includes:

[0054] a receiving opening 111 located at the proximal end 110; in use, the aerosol generating article 1000 can be at least partially received in the housing 10 through the receiving opening 111, or removed from the housing 10 through the receiving opening 111;

[0055] A chamber for receiving at least a portion of the aerosol generating article 1000 extending into the housing 10 through the receiving port 111; the chamber may be defined by a tubular element in some embodiments to accommodate and hold the aerosol generating article 1000; Figure 1 In a specific embodiment, at least a portion of the chamber is surrounded or defined by the susceptor 50;

[0056] The air passage 150 is surrounded or defined by a wall 151 located between the chamber and the air inlet 121; the air passage 150 is located between the chamber and the air inlet 121, and thus in use, the air passage 150 provides a passage path from the air inlet 121 into the chamber / aerosol generating article 1000, such as Figure 1 As shown by the middle arrow R1; and during inhalation, air enters the aerosol generating product 1000 through the air channel 150, and carries the generated aerosol through the aerosol generating product 1000 and is inhaled by the user.

[0057] according to Figure 1 As shown, the aerosol generating device 100 further includes:

[0058] A battery cell 130 for supplying power; optionally, the battery cell 130 is a rechargeable DC battery cell 130 and can be charged by connecting to an external power source;

[0059] The circuit board 140 is provided with a circuit.

[0060] See also Figure 1 and Figure 2 As shown, the aerosol generating device 100 further includes:

[0061] A heating mechanism is provided for heating the aerosol generating article 1000. Figure 1 and Figure 2 In the illustrated embodiment, the heating mechanism includes a susceptor 50 and an induction heating element 40 surrounding the susceptor 50 .

[0062] The susceptor 50 is configured to be a tubular shape surrounding or defining a chamber, so as to heat the aerosol generating article 1000 by surrounding the aerosol generating article 1000 and transferring heat at the periphery of the aerosol generating article 1000; in this embodiment, the susceptor 50 is an electromagnetic induction heating element that generates heat by being penetrated by a changing magnetic field. In this embodiment, the chamber for receiving the aerosol generating article 1000 is formed by surrounding and defining the susceptor 50.

[0063] Or in some other variant embodiments, the susceptor 50 can be configured to be inserted into the aerosol generating article 1000 for heating. Accordingly, the susceptor 50 is configured to be in the shape of a pin, a needle, a sheet, etc., which is at least partially arranged along the longitudinal extension of the chamber, and is convenient for being inserted into the aerosol generating article 1000 for heating.

[0064] In some embodiments, the susceptor 50 is made of a sensitive metal or alloy material, which may include a ferromagnetic material such as ferromagnetic iron, ferromagnetic steel, or 420 grade or 430 grade stainless steel, or a carbon-containing alloy.

[0065] exist Figure 1 and Figure 2 In the embodiment, the induction heating element 40 is an induction coil arranged around the bracket 30, so as to generate a magnetic field and heat the susceptor 50; and the induction heating element 40 of the heating mechanism at least partially surrounds the susceptor 50, so as to generate a changing magnetic field to induce the susceptor 50 to be penetrated by the magnetic field and generate heat; and the induction heating element 40 is wound or arranged outside the coil bracket 30, and is supported and fixed by the coil bracket 30. The coil bracket 30 is made of a non-sensitive rigid heat-resistant material such as PEEK, ceramic, etc. The material of the induction heating element 40 is made of a relatively low resistivity excellent conductor metal material, such as gold, silver, copper or alloys containing them. Of course, in some embodiments, the surface of the induction heating element 40 is insulated by spraying an insulating layer or enameled wire.

[0066] In some embodiments, the frequency of the alternating current supplied from the circuit board 140 to the induction heating element 40 is between 80KHz and 800KHz; more specifically, the frequency may be in the range of about 200KHz to 500KHz. In a most common embodiment, the circuit board 140 generally includes a capacitor, and forms an LC resonant circuit with the induction heating element 40 through the capacitor; and the circuit board 140 drives the LC resonant circuit to oscillate according to the above predetermined frequency to form an alternating current flowing through the induction heating element 32.

[0067] In one embodiment, the DC supply voltage provided by the battery cell 130 is in a range of about 2.5V to about 9.0V, and the ampere of the DC current provided by the battery cell 130 is in a range of about 2.5A to about 20A.

[0068] exist Figure 1 In the illustrated embodiment, the aerosol generating device 100 further comprises:

[0069] The support element 70 is used for the coil support 30 and / or the susceptor 50 to abut against, so as to at least partially support them. In addition, in the embodiment, the support element 70 itself is held or fixed on the wall 151. See further Figure 1 As shown, the susceptor 50 has a second end 520 close to the distal end 120 , and the second end 520 is against the support element 70 .

[0070] In some embodiments, the susceptor 50 is tubular in shape; the susceptor 50 has a wall thickness of about 0.05-0.5 mm; and the susceptor 50 has a length of about 20-50 mm; and the susceptor 50 has an inner diameter of about 5.0-10.0 mm. The length of the aerosol-generating article 1000 surrounded or enclosed by the susceptor 50 is greater than 30 mm.

[0071] In some other embodiments, the induction heating element 40 has a length approximately equal to that of the susceptor 50; and the length of the induction heating element 40 may be slightly less than that of the susceptor 50. Figure 1 to Figure 2 In the embodiment, both ends of the length direction of the receptor 50 protrude or extend outside the induction heating element 40, so that the magnetic field generated by the induction heating element 40 can be completely located within the length range of the receptor 50, which is beneficial for reducing leakage magnetic field.

[0072] In an embodiment, the induction heating element 40 is a solenoid coil; in some other embodiments, the length of the induction heating element 40 is 20 to 50 mm in length. And in some embodiments, the induction heating element 40 has about 6 to 30 turns.

[0073] according to Figure 1 and Figure 2 In the illustrated embodiment, the induction heating element 40 includes a first electrode 41 located at a first end and a second electrode 42 located at a second end. Figure 1 and Figure 2 In some embodiments, the first electrode 41 and the second electrode 42 are in the form of electrical connectors or electrical taps; in some embodiments, the first electrode 41 and the second electrode 42 are defined by a wire that is spirally wound to form the induction heating element 40. Alternatively, in some other embodiments, the first electrode 41 and the second electrode 42 may also be in the form of an electrode cap, an electrode ring, an electrode contact sheet, an electrode coating, etc. In use, the first electrode 41 and the second electrode 42 guide the alternating current to flow through the induction heating element 40, thereby causing the induction heating element 40 to generate a changing magnetic field.

[0074] according to Figures 1 to 3 As shown, the heating mechanism also includes:

[0075] The thermally deformable conductive element 80 can be operably abutted against or contacted with the first electrode 41 to form a conductive connection; the conductive element 80 is further connected to the circuit board 140 by welding the conductive lead 411, so that the first electrode 41 of the induction heating element 40 is indirectly electrically connected to the circuit board 140 through the conductive element 80; and the second electrode 42 of the induction heating element 40 is directly welded to the circuit board 140 by welding the conductive lead 421, so that the induction heating element 40 and the circuit board 140 form a conductive loop, and the circuit board 140 can provide an alternating current to the induction heating element 40 to drive the induction heating element 40 to generate a changing magnetic field.

[0076] exist Figures 1 to 3 In the embodiment, the conductive element 80 is capable of receiving heat from the susceptor 50 or is heat-conducting with the susceptor 50 , so that the conductive element 80 can receive heat from the susceptor 50 .

[0077] For example, in some embodiments, a portion of the conductive element 80 is in contact with the susceptor 50 to form thermal conductivity. Or in some other embodiments, the conductive element 80 is not in contact with the susceptor 50, but heat is transferred between them through a thermal conductive medium; for example, the conductive element 80 and the susceptor 50 are transferred between them through a thermal conductive medium with a thermal conductivity greater than 40 W / mk or preferably greater than 80 W / mk; and in some embodiments, the thermal conductive medium between the conductive element 80 and the susceptor 50 may include graphite sheets, graphite strips, high thermal conductivity titanium / aluminum / silver alloys, etc. Or in some other embodiments, the conductive element 80 is not in contact with the susceptor 50, but a low distance is maintained to form thermal conductivity between them; for example, the distance between the conductive element 80 and the susceptor 50 is less than 5 mm.

[0078] exist Figure 3 In the embodiment of the present invention, the conductive element 80 is configured to be able to produce thermal deformation when heated to a preset temperature. Figure 3 As shown by the arrow P1 in the middle, the conductive element 80 is separated from or disconnected from the first electrode 41 by thermal deformation, thereby disconnecting their conductive connection to stop supplying power to the induction heating element 40. In the embodiment, the conductive element 80 that can be thermally deformed is arranged in the heating loop of the circuit, and the temperature of the conductive element 80 is associated with the temperature of the susceptor 50 by means of heat conduction, etc. When the temperature of the conductive element 80 reaches a preset temperature, thermal deformation can occur to disconnect the heating loop.

[0079] according to Figure 4 and Figure 5 As shown, the conductive element 80 is constructed to be in a thin sheet-like shape; "thin" can be characterized as the thickness of the conductive element 80 being substantially smaller than its length and width, so that they are basically constructed to be sheets.

[0080] In some embodiments, the conductive element 80 may have a length of approximately 5 to 30 mm, a width of 2 to 8 mm, and a thickness of 0.02 to 0.4 mm.

[0081] exist Figure 3 and Figure 4 In the illustrated embodiment, the conductive element 80 comprises at least:

[0082] The first metal layer 81 and the second metal layer 82 closely connected to the first metal layer 81. The thermal expansion coefficient of the first metal layer 81 is greater than the thermal expansion coefficient of the second metal layer 82, so that after being heated to a predetermined temperature, the deformation caused by the larger thermal expansion coefficient of the first metal layer 81 is larger, so that the conductive element 80 is passively bent toward one side of the second metal layer 82 as a whole, thereby generating Figure 3 In use, by selecting the material of the conductive element 80, the predetermined temperature at which the conductive element 80 generates thermal deformation is maintained at 350-500°C.

[0083] In the embodiment, the first metal layer 81 with a larger thermal expansion coefficient is referred to as an active layer, and the second metal layer 82 with a smaller thermal expansion coefficient can be referred to as a passive layer. In this type of conductive element 80 having two metal layers, the first metal layer 81 as the active layer has a large linear thermal expansion coefficient, good weldability when combined with the second metal layer 82 of the passive layer, and an elastic modulus value close to that of the second metal layer 82 of the passive layer.

[0084] The first metal layer 81 and the second metal layer 82 are firmly bonded on their entire contact surface; specifically, the first metal layer 81 and the second metal layer 82 can be firmly bonded by welding on their contact surface, or firmly bonded by lamination.

[0085] In some embodiments, in the sheet-shaped conductive element 80, the linear thermal expansion coefficient of the first metal layer 81 is ≥ 14×10 -6 / °C, and the linear thermal expansion coefficient of the second metal layer 82 is ≤10×10 -6 / °C. In some more preferred embodiments, the linear thermal expansion coefficient of the first metal layer 81 is ≥18×10 -6 / ℃; and the linear thermal expansion coefficient of the second metal layer 82 is ≤6×10 -6 / ℃. The physical quantity term linear expansion coefficient is also called linear expansion coefficient, which refers to the elongation per unit length of a solid material when its temperature rises by 1℃, with the unit of 1 / ℃ and the symbol αl. In some preferred embodiments, the linear thermal expansion coefficient of the first metal layer 81 is at least 5 times the linear thermal expansion coefficient of the second metal layer 82.

[0086] In an embodiment, the thermal deformation capability of the conductive element 80 can be characterized by a physical quantity “thermal curvature F”. The “thermal curvature F” of the conductive element 80 is the change in curvature of the longitudinal center line of the conductive element 80 per unit thickness per unit temperature change. The calculation formula or expression of the thermal curvature F is: F = δ·(1 / R2-1 / R1) / (t2-t1).

[0087] Where F is the temperature curvature, unit is per degree Celsius (℃ -1 );

[0088] δ is the thickness of the conductive element 80, in millimeters (mm);

[0089] t1 is the initial temperature of the conductive element 80 , such as room temperature or the initial test temperature set according to the test standard of GB / T 4461-2020, in degrees Celsius (° C.);

[0090] t2 is the final temperature of the conductive element 80 when deformed or the final test temperature set in the test standard of GB / T 4461-2020, in degrees Celsius (°C);

[0091] R1 is the radius of curvature of the longitudinal center line of the conductive element 80 at the initial temperature, in millimeters (mm); R2 is the radius of curvature of the longitudinal center line of the conductive element 80 at the final temperature, in millimeters (mm).

[0092] In some embodiments, the thermal curvature F of the conductive element 80 tested at an initial temperature of 20° C. and an end temperature of 130° C. in accordance with the test standard of GB / T 4461-2020 is greater than 10.1×10 -6 (℃ -1 ); For example, the temperature curvature F of the conductive element 80 may be between 13.1×10 -6 ~39.1×10 -6 (℃ -1 More preferably, the temperature curvature F of the conductive element 80 may be between 25.9×10 -6 ~38.3×10 -6 (℃ -1 ).

[0093] In some embodiments, the first metal layer 81 as an active layer includes an alloy of at least two of nickel, manganese, copper, and zinc, and the second metal layer 82 as a passive layer includes an alloy containing nickel and iron, such as Ni36 alloy, Ni42 alloy, Ni34 alloy, Ni50 alloy, etc.

[0094] The following table shows the results of the thermal curvature F of the conductive element 80 using the first metal layer 81 and the second metal layer 82 of the above alloy material in some specific embodiments measured under the test standard of GB / T 4461-2020; wherein, the initial temperature in the test is 20°C and the final temperature is 130°C.

[0095]

[0096]

[0097] And the following table shows the composition of the alloy materials of the relevant alloy grades:

[0098]

[0099] The following table shows the linear thermal expansion coefficient and resistivity parameters of the relevant alloy grades:

[0100]

[0101] It can be seen from the above table that in the embodiment, the conductive element 80 has a relatively low resistivity. In the heating loop formed by the connected circuit, the conductive element 80 basically only provides the function of a conductor and generates less heat itself.

[0102] according to Figure 4 and Figure 5 As shown, the conductive element 80 having the first metal layer 81 and the second metal layer 82 of different alloy grades is used, and the first electrical contact 831 and the second electrical contact 832 are arranged on the surface thereof; in some embodiments, the first electrical contact 831 and / or the second electrical contact 832 are low-resistivity electrical contacts formed by printing, deposition or patch, for example, gold, silver, copper or their alloys. In use, the first electrical contact 831 is used to abut against and contact the first electrode 41 of the induction heating element 40, and the second electrical contact 832 is connected to the circuit board 140 after welding the conductive lead 411. And when the conductive element 80 is thermally deformed, the first electrical contact 831 is released from abutting against and contacting the first electrode 41, and then when the temperature of the susceptor 50 reaches the preset temperature, the thermal deformation of the conductive element 80 causes the heating circuit to be disconnected to prevent the susceptor 50 from continuing to provide power, thereby keeping the temperature of the susceptor 50 below the preset temperature.

[0103] or Figures 6 to 8 A schematic diagram of a heating mechanism of yet another embodiment is shown, in which the heating mechanism comprises:

[0104] The induction heating element 40a is mounted on the coil support 30a to generate a changing magnetic field so as to induce the susceptor 50 to heat the aerosol generating article 1000; wherein the induction heating element 40a includes a plurality of electrodes arranged in sequence in the longitudinal direction, thereby dividing the entire solenoid coil into a plurality of parts. Figures 6 to 8 In the embodiment of the present invention, the induction heating element 40a comprises:

[0105] A first electrode 41a, a second electrode 42a, a third electrode 43a and a fourth electrode 44a are arranged in sequence along the longitudinal direction; the first electrode 41a, the second electrode 42a, the third electrode 43a and the fourth electrode 44a are in the form of electrical connectors or electrical taps;

[0106] A first portion 410a is defined between the first electrode 41a and the second electrode 42a;

[0107] The second portion 420a is defined between the second electrode 42a and the third electrode 43a;

[0108] The third portion 430a is defined between the third electrode 43a and the fourth electrode 44a.

[0109] exist Figures 6 to 8 In the electrical connection of the heating mechanism, the heating mechanism also includes:

[0110] The conductive lead 411a is connected to the circuit board 140 by welding with the first electrode 41a;

[0111] The thermally deformable conductive element 80a is connected to the circuit board 140 by welding the conductive lead 421a; the conductive element 80a can receive the heat of the sensor 50 to produce thermal deformation, and can have different degrees of thermal deformation at different temperatures, thereby selectively connecting the entire coil of the induction heating element 40a or only part of it to the circuit.

[0112] Specifically, for example Figure 6 In the state, the conductive element 80a abuts against and contacts the second electrode 42a before thermal deformation, thereby connecting the first portion 410a and the circuit board 140 to form a closed loop; and in this state, the alternating current is guided only on the first portion 410a to induce heating of only the first section of the susceptor 50 surrounded by the first portion 410a.

[0113] exist Figure 7 When the conductive element 80a receives heat and reaches a first predetermined temperature, a first thermal deformation occurs. Figure 7As shown by the middle arrow P11, the conductive element 80a deforms to abut against or contact the third electrode 43a to form conduction, thereby connecting the first portion 410a and the second portion 420a of the induction heating element 40a to the circuit; in use, the alternating current can be guided only on the first portion 410a and the second portion 420a of the induction heating element 40a, thereby inducing the first section of the susceptor 50 surrounded by the first portion 410a and the second section surrounded by the second portion 420a to heat up.

[0114] exist Figure 8 When the conductive element 80a receives heat and reaches a second predetermined temperature, a second thermal deformation occurs. Figure 8 As shown by the middle arrow P12, the conductive element 80a is deformed to abut against or contact the fourth electrode 44a to form conduction, thereby connecting the entire coil of the induction heating element 40a to the circuit; thereby, the first section of the induced receptor 50 surrounded by the first part 410a, the second section surrounded by the second part 420a, and the third section surrounded by the third part 430a are all heated at the same time.

[0115] In the above embodiments, the conductive element 80a has different degrees of thermal deformation to operably connect one or more portions of the inductive heating element 40a to the circuit, thereby selectively inducing heating of only one section or multiple sections of the susceptor 50.

[0116] Fig. 9 A schematic diagram of a heating mechanism of another variant embodiment is shown, in which the heating mechanism comprises:

[0117] The substrate 30b is configured to be a tubular shape surrounding or defining the chamber; the substrate 30b is used to accommodate and heat the aerosol generating article 1000; in this embodiment, the substrate 30b is thermally conductive, or the substrate 30b is made of a material with a high thermal conductivity, such as a high thermal conductive aluminum alloy, stainless steel, etc.;

[0118] The resistive heating element 40b is arranged around the substrate 30b; the resistive heating element 40b can generate heat by resistive Joule heat; the substrate 30b can generate heat by receiving heat from the resistive heating element 40b, and in turn heat the aerosol generating article 1000; and the resistive heating element 40b is electrically insulated from the substrate 30b, for example, the surface of the substrate 30b is oxidized to form an oxidized insulating layer;

[0119] The first end of the resistance heating element 40b is provided with a first electrode 41b, and the second end is provided with a second electrode 42b; the first electrode 41b and the second electrode 42b are in the form of electrical connectors or electrical taps; the second electrode 42b is connected to the circuit board 140 by welding a wire lead 421b;

[0120] The conductive element 80b is connected to the circuit board 140 by welding the conductive lead 411b; before thermal deformation, the conductive element 80b abuts against and contacts the first electrode 41b, thereby connecting the resistance heating element 40b and the circuit board 140 to form a closed loop; and in this state, current can be guided on the resistance heating element 40b to only heat the resistance heating element 40b. When the conductive element 80b receives the heat of the resistance heating element 40b and / or the substrate 30b and reaches a predetermined temperature to generate thermal deformation, the conductive element 80b can be separated or disconnected from the first electrode 41b to prevent the resistance heating element 40b from continuing to be powered.

[0121] or Fig.10 A schematic diagram of a heating mechanism of another variant embodiment is shown, in which the heating mechanism comprises:

[0122] The substrate 30c is configured to be a tubular shape surrounding or defining a chamber; the substrate 30c is used to contain and heat the aerosol generating article 1000;

[0123] The resistive heating element 40c is arranged around the substrate 30c; the resistive heating element 40c can generate heat through resistive Joule heat; the substrate 30c can generate heat by receiving the heat of the resistive heating element 40c, and in turn heat the aerosol generating article 1000; the resistive heating element 40c includes a plurality of electrodes arranged in sequence along the longitudinal direction, so that the entire resistive heating element 40c is divided into a plurality of heating portions located between adjacent electrodes. For example, Fig.10 In the embodiment, the resistance heating element 40c includes: a first electrode 41c, a second electrode 42c, a third electrode 43c and a fourth electrode 44c arranged in sequence along the longitudinal direction; and the first electrode 41c, the second electrode 42c, the third electrode 43c and the fourth electrode 44c are in the form of electrical connectors or electrical taps;

[0124] A first portion 410c is defined between the first electrode 41c and the second electrode 42c;

[0125] The second portion 420c is defined between the second electrode 42c and the third electrode 43c;

[0126] The third portion 430c is defined between the third electrode 43c and the fourth electrode 44c.

[0127] exist Fig.10 The heating mechanism also includes:

[0128] The conductive lead 411c is connected to the circuit board 140 by welding with the first electrode 41c;

[0129] The thermally deformable conductive element 80c is connected to the circuit board 140 by welding the conductive lead 421c; the conductive element 80c can receive the heat of the resistance heating element 40c and / or the substrate 30c to produce thermal deformation, and can have different degrees of thermal deformation at different temperatures, for example Fig.10 As shown by the arrow P21, the entire coil of the resistance heating element 40c or only a portion thereof can be selectively connected to the circuit. Fig.10 In the embodiment, the conductive element 80a abuts against and contacts the second electrode 42c before thermal deformation, thereby connecting the first portion 410c with the circuit board 140 to form a closed loop, and in this state, heat is generated only on the first portion 410c through resistance Joule heat, thereby causing the substrate 30c to be heated by the first portion 410c. Alternatively, when the conductive element 80c reaches different predetermined temperatures by receiving heat, different thermal deformations are generated to selectively deform and contact or abut against the third electrode 43c or the fourth electrode 44c, thereby selectively connecting different portions of the resistance heating element 40c to the circuit, so as to selectively heat the entire substrate 30c or only a partial section of the substrate 30c.

[0130] Fig.11 A schematic diagram of a heating mechanism of another variant embodiment is shown, in which the heating mechanism comprises:

[0131] A substrate 30d surrounds or defines the chamber; in this embodiment, the substrate 30d is infrared-transparent, for example, the substrate 30d is made of infrared-transparent quartz or ceramic material;

[0132] The infrared heating element 40d is formed outside the substrate 30d by spraying, deposition or printing, etc. The infrared heating element 40d is used to radiate infrared rays to the aerosol generating product 1000 in the substrate 30d, thereby heating the aerosol generating product 1000; the infrared heating element 40d is an electrically induced infrared emitting layer, and the infrared heating element 40d can be driven by voltage to radiate infrared rays by directly providing a DC voltage to the infrared heating element 40d. In some implementations, the infrared heating element 40d can be a coating made of a ceramic material such as zirconium, or Fe-Mn-Cu system, tungsten system, or transition metals and their oxides. In some embodiments, the infrared heating element 40d is composed of oxides of at least one metal element such as Mg, Al, Ti, Zr, Mn, Fe, Co, Ni, Cu, Cr, and Zn. These metal oxides can radiate far-infrared rays with heating effect when heated to an appropriate temperature; the thickness of the infrared heating element 40d can preferably be controlled to be 30μm to 50μm; the method of forming the infrared heating element 40d on the surface of the tubular substrate 30d is to spray the oxides of the above metal elements on the outer surface of the tubular substrate 30d by atmospheric plasma spraying and then solidify them.

[0133] exist Fig.11 In the embodiment shown, the heating mechanism comprises:

[0134] A first electrode 41d is arranged near a first end of the infrared heating element 40d and is electrically conductive with the infrared heating element 40d;

[0135] The second electrode 42d is arranged near the second end of the infrared heating element 40d and is electrically conductive with the infrared heating element 40d; the second electrode 42d is connected to the circuit board 140 by welding the conductive lead 421d;

[0136] The first electrode 41d and / or the second electrode 42d are in an annular shape surrounding the infrared heating element 40d, so that in use, current is guided in the longitudinal direction of the infrared heating element 40d through the first electrode 41d and the second electrode 42d; the first electrode 41d and / or the second electrode 42d are an electrode ring, an electrode cap or an electrode coating, etc. surrounding the infrared heating element 40d;

[0137] The thermally deformable conductive element 80d is connected to the circuit board 140 by welding the conductive lead 411d; the conductive element 80d is arranged to abut against or contact the first electrode 41d, thereby electrically connecting the first electrode 41d to the circuit board 140, thereby forming a closed heating loop to supply power to the infrared heating element 40d; and the conductive element 80d can also receive heat from the infrared heating element 40d and form thermal deformation when the temperature reaches a predetermined temperature, so as to release the electrical connection with the first electrode 41d, thereby disconnecting the heating loop to prevent the infrared heating element 40d from continuing to be supplied with power.

[0138] or Fig.12 and Fig.13 A schematic diagram of a heating mechanism of another variant embodiment is shown, wherein the heating mechanism of this embodiment comprises:

[0139] an infrared-transmissive tubular substrate 30e surrounding or defining the chamber;

[0140] an infrared heating element 40e formed or combined with a surface of a substrate 30e, so as to heat the aerosol generating article 1000 received in the chamber by radiating infrared rays; the infrared heating element 40e has a first electrode 41e, a second electrode 42e and a third electrode 43e arranged in sequence along the longitudinal direction; the first electrode 41e, the second electrode 42e and the third electrode 43e are in an annular shape surrounding the substrate 30e, thereby dividing the infrared heating element 40e into a first part 410e located between the first electrode 41e and the second electrode 42e, and a second part 410e located between the second electrode 42e and the third electrode 43e;

[0141] The first electrode 41e is connected to the circuit board 140 by welding the conductive lead 411e;

[0142] The heat-deformable conductive element 80e is connected to the circuit board 140 by welding the conductive lead 421e; and the conductive element 80e can receive the heat of the infrared heating element 40e to form a thermal deformation such as Fig.13 As shown by the middle arrow R31, it is selectively connected to one of the second electrode 42e or the third electrode 43e by contact or abutment; thereby, through the selective configuration of the conductive element 80e, only the first part 410e of the infrared heating element 40e is selectively connected to the circuit to form a heating loop for separate heating, or the first part 410e and the second part 420e of the infrared heating element 40e are simultaneously connected to the circuit to form a heating loop for simultaneous heating.

[0143] In the above embodiments, the thermal deformation of the conductive element 80 / 80a / 80b / 80c / 80d / 80e is recoverable. When the power supply to the heating mechanism is stopped, the heat received by the conductive element 80 / 80a / 80b / 80c / 80d / 80e is reduced, and the temperature is lowered. Accordingly, the thermal deformation is also restored as the temperature drops. In the embodiments, the conductive element 80 / 80a / 80b / 80c / 80d / 80e is selectively configured between the initial state and the deformed state, or the conductive element 80 / 80a / 80b / 80c / 80d / 80e is configured between different degrees of thermal deformation to adjust the heating section or heating position. Alternatively, the power provided to the heating element is selectively controlled by the thermal deformation of the conductive element 80 / 80a / 80b / 80c / 80d / 80e so that the temperature of the heating element or part thereof remains below the preset maximum temperature.

[0144] It should be noted that the preferred embodiments of the present application are given in the specification and drawings of the present application, but are not limited to the embodiments described in the specification. Furthermore, it is possible for a person of ordinary skill in the art to make improvements or changes based on the above description, and all such improvements and changes should fall within the scope of protection of the claims attached to the present application.

Claims

1. An aerosol generating device, configured to heat an aerosol generating article to generate an aerosol; characterized in that: include: a heating element for heating the aerosol generating article; Circuit boards; A conductive element, used to connect the heating element to the circuit board to form a heating loop; The conductive element is arranged to conduct heat with the heating element, and is configured to receive heat from the heating element to reach a predetermined temperature to generate thermal deformation, thereby disconnecting the heating circuit.

2. The aerosol generating device according to claim 1, characterized in that The conductive element is configured in a sheet shape, and the thermal curvature measured according to the test standard of GB / T 4461-2020 is greater than 10.1×10 -6 / ℃; wherein, the initial temperature measured in accordance with the test standard of GB / T4461-2020 is 20℃ and the final temperature is 130℃.

3. The aerosol generating device according to claim 2, characterized in that: The thermal curvature of the conductive element measured according to the test standard of GB / T 4461-2020 is between 13.1×10 -6 / ℃~39.1×10 -6 / ℃; wherein, the initial temperature in the measurement according to the test standard of GB / T 4461-2020 is 20℃ and the final temperature is 130℃.

4. The aerosol generating device according to any one of claims 1 to 3, characterized in that: An electrode is arranged on the heating element for conducting an electric current on the heating element; The conductive element is arranged to be electrically connected to the circuit board and abut against the electrode, thereby connecting the heating element to the circuit board to form a heating loop; The conductive element is configured to be separated from the electrode by thermal deformation, thereby disconnecting the heating circuit.

5. The aerosol generating device according to any one of claims 1 to 3, characterized in that: The heating element includes at least one of a resistive heating element, an inductive heating element or an infrared heating element.

6. The aerosol generating device according to any one of claims 1 to 3, characterized in that: The thermal deformation of the conductive element is recoverable.

7. The aerosol generating device according to any one of claims 1 to 3, characterized in that: The conductive element comprises: A first metal layer and a second metal layer closely connected to the first metal layer; the thermal expansion coefficient of the first metal layer is greater than the thermal expansion coefficient of the second metal layer, so that when the temperature of the conductive element reaches a predetermined temperature, thermal deformation can be generated to bend toward one side of the second metal layer.

8. The aerosol generating device according to claim 7, characterized in that The linear thermal expansion coefficient of the first metal layer is greater than or equal to 14×10 -6 / ℃.

9. The aerosol generating device according to claim 7, characterized in that: The linear thermal expansion coefficient of the second metal layer is less than or equal to 10×10 -6 / ℃.

10. The aerosol generating device according to claim 7, characterized in that The linear thermal expansion coefficient of the first metal layer is at least 5 times the linear thermal expansion coefficient of the second metal layer.

11. The aerosol generating device according to claim 7, characterized in that: The first metal layer includes an alloy of at least two of nickel, manganese, copper and zinc; And / or, the second metal layer includes an alloy containing nickel and iron.

12. The aerosol generating device according to claim 7, characterized in that The first metal layer includes at least one of the alloys with alloy grades of Mn72Ni10Cu18, Mn75Ni15Cu10, Ni22Cr3, Ni19Mn7, Ni20Mn6, Cu62Zn38, Ni19Cr11, Ni22Cr3, Mn15Ni10Cr10, and Ni16Cr11; And / or, the second metal layer includes at least one of alloy grades Ni34, Ni36, Ni42, Ni50, Ni45Cr6, and Ni20Co26Cr8.

13. The aerosol generating device according to any one of claims 1 to 3, characterized in that: The conductive element is configured in a sheet shape.

14. The aerosol generating device according to claim 13, characterized in that The conductive element has a length of 5 mm to 30 mm, a width of 2 mm to 8 mm, and a thickness of 0.02 mm to 0.4 mm.

15. An aerosol generating device, configured to heat an aerosol generating article to generate an aerosol; characterized in that: include: Circuit boards; a heating element for heating the aerosol generating article; The heating element is provided with a first electrode, a second electrode and a third electrode sequentially arranged at different positions along the longitudinal direction, thereby dividing the heating element into a first heating portion defined between the first electrode and the second electrode, and a second heating portion defined between the second electrode and the third electrode; the first electrode is electrically connected to the circuit board; a conductive element arranged to be capable of receiving heat from the heating element to generate thermal deformation, thereby changing the configuration between a first connection state and a second connection state; In a first connection state, the conductive element electrically connects the second electrode to the circuit board, thereby connecting the first heating part to the circuit board to form a loop to drive the first heating part to heat; in a second connection state, the conductive element electrically connects the third electrode to the circuit board, thereby connecting the first heating part and the second heating part to the circuit board to form a loop to drive the first heating part and the second heating part to heat simultaneously.

16. A conductive element for an aerosol generating device, for conducting an electric current on a heating element of the aerosol generating device, characterized in that: The conductive element comprises: A first metal layer and a second metal layer closely connected to the first metal layer; the thermal expansion coefficient of the first metal layer is greater than the thermal expansion coefficient of the second metal layer, so that when the temperature of the conductive element reaches a predetermined temperature, thermal deformation can be generated to bend toward one side of the second metal layer.

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