Display device and manufacturing method of display device

Abstract

The invention relates to a display device and a manufacturing method of the display device. The display device includes: a display panel including a first non-folding area, a folding area, and a second non-folding area arranged in a first direction; a plurality of panel protection layers disposed under the first and second non-folding areas; and a filling portion disposed between the plurality of panel protection layers and overlapping the folded region. A height of a lower surface of the filling portion is greater than or equal to each of heights of lower surfaces of the plurality of panel protection layers.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and all benefits derived from Korean Patent Application No. 10-2023-0088539, filed on Jul. 7, 2023, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] Embodiments of the present disclosure described herein relate to a display device and a method of manufacturing the same. Background Art

[0004] Electronic devices that provide images to users, such as smart phones, digital cameras, notebook computers, car navigation units, smart TVs, etc., include display devices for displaying images. The display device generates images and provides the images to users through a display screen.

[0005] With the development of display device technology, various forms of display devices are being developed. For example, various display devices that can be bent, folded, or rolled are being developed. The display device can be easily carried and can improve user convenience.

[0006] The display device may include a display panel and a panel protection layer for protecting a lower portion of the display panel. When the display panel is folded, the panel protection layer attached to the display panel may be folded together with the display panel. Summary of the invention

[0007] Embodiments of the present disclosure provide a display device that can be folded more easily while improving the impact resistance (resistance to external impact) of a non-folding region.

[0008] In an embodiment, a display device includes: a display panel including a first non-folding area, a folding area, and a second non-folding area arranged in a first direction; a plurality of panel protection layers disposed below the first non-folding area and the second non-folding area; and a filling portion disposed between the plurality of panel protection layers and overlapping the folding area. A height of a lower surface of the filling portion is greater than or equal to each of the heights of the lower surfaces of the plurality of panel protection layers.

[0009] In an embodiment, a display device includes: a display panel including a first non-folding area, a folding area, and a second non-folding area arranged in a first direction; an adhesive layer disposed under the display panel; a plurality of panel protection layers disposed under the adhesive layer and spaced apart from each other in the folding area; and a filling portion disposed between the plurality of panel protection layers and overlapping the folding area. The thickness of the filling portion is less than or equal to the sum of the thickness of the plurality of panel protection layers and the thickness of the adhesive layer.

[0010] In an embodiment, a method for manufacturing a display device includes: providing an adhesive layer under a display panel, the display panel including a first non-folding area, a folding area, and a second non-folding area arranged in a first direction; providing an initial panel protection layer under the adhesive layer; forming a plurality of panel protection layers by removing a portion of the initial panel protection layer overlapping the folding area; and filling a filling portion in a space overlapping the folding area and defined between the panel protection layers. A height of a lower surface of the filling portion is greater than or equal to each of the heights of the lower surfaces of the plurality of panel protection layers. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The above and other embodiments, advantages and features of the present disclosure will become apparent by describing in detail embodiments of the present disclosure with reference to the attached drawings.

[0012] Figure 1 is a perspective view of an embodiment of an electronic device according to the present disclosure.

[0013] Figure 2A and Figure 2B It is shown Figure 1 A view of a folded state of an electronic device shown in FIG.

[0014] Figure 3 yes Figure 1 An exploded perspective view of the electronic device shown in FIG.

[0015] Figure 4 yes Figure 3 A block diagram of the electronic device shown in FIG.

[0016] Figure 5 yes Figure 3 A schematic cross-sectional view of a display module shown in FIG.

[0017] Figure 6 yes Figure 5 A cross-sectional view of a display panel shown in FIG.

[0018] Figure 7 yes Figure 3 A plan view of the display panel shown in FIG.

[0019] Figure 8 is shown with Figure 7 Any one pixel shown in the figure corresponds to a view of a section of the electronic panel.

[0020] Fig.9A It is along Figure 7 A cross-sectional view taken along line II' shown in FIG.

[0021] Fig. 9B It is shown Fig.9A A view of a bending state in which the bending area shown in FIG.

[0022] Fig. 10A It is used to explain Fig.9A View of the strain of the filling section shown in .

[0023] Fig. 10B is a view used to interpret the yield strain.

[0024] Fig. 10C It is used to explain Figure 5 Figure 2. Strain diagram of the thin film encapsulation layer shown in Figure 2.

[0025] Fig. 10D It is used to explain Fig.9A Figure 4. Illustration of the repulsive force of the window shown in FIG.

[0026] Fig.11 is a view showing an embodiment of a display device according to the present disclosure.

[0027] Fig.12 is a view showing an embodiment of a display device according to the present disclosure.

[0028] FIG. 13A to FIG. 13C is a view for explaining an embodiment of a display device according to the present disclosure.

[0029] FIG. 14A to FIG. 14C It is used to explain the manufacturing Fig.9A A view of a method of displaying a device is shown in FIG. DETAILED DESCRIPTION

[0030] From the following description of the embodiments given in conjunction with the accompanying drawings, the above and other features and advantages of the present disclosure will become apparent. However, the present disclosure is not limited to the embodiments disclosed herein and can be implemented in various different forms. In this article, embodiments are provided to provide a complete disclosure of the present disclosure and to provide a thorough understanding of the present disclosure to those skilled in the art to which the present disclosure belongs, and the scope of the present disclosure shall be limited only by the attached claims and their equivalents. The same reference numerals always represent the same elements.

[0031] When an element or layer is referred to as being "on" another element or layer, it can be directly on the other element or layer, or there can be intervening elements or layers. Conversely, when an element is referred to as being "directly on" another element or layer, there are no intervening elements or layers. As used herein, the term "and / or" includes each of the referenced items and all combinations of one or more of the items.

[0032] Spatially relative terms such as "below," "beneath," "below," "above," "upper," etc. may be used to easily describe the relationship of one element or component to another element or component as shown in the drawings. Spatially relative terms should be understood to include terms that include different orientations of the elements during use or operation in addition to the orientation shown in the drawings. Like reference numerals refer to like elements throughout.

[0033] Although the terms "first", "second", etc. are used herein to describe various elements, components and / or sections, these elements, components and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component or section from another element, component or section. Therefore, within the spirit and scope of the present disclosure, the first element, first component or first section mentioned below may be referred to as the second element, second component or second section.

[0034] The embodiments described herein will be described with reference to the plan views and cross-sectional views which are ideal schematic diagrams of the present disclosure. Therefore, the form of the illustrative drawings may change according to manufacturing techniques and / or allowed errors. The embodiments of the present disclosure are not limited to the specific forms described, but include changes in form produced according to the manufacturing process. The regions shown in the drawings are of a schematic nature, and the shapes of the regions shown in the drawings illustrate specific forms of the regions of the device and are not intended to limit the scope of the present disclosure.

[0035] In view of the measurements in question and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system), "about" or "approximately" as used herein are inclusive of the stated value and mean within an acceptable range of deviation of the particular value as determined by one of ordinary skill in the art. For example, a term such as "about" can mean within one or more standard deviations, or within ±30%, ±20%, ±10%, ±5% of the stated value.

[0036] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as those commonly understood by those skilled in the art to which the present disclosure belongs. It will be further understood that terms (such as those defined in commonly used dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology and the present disclosure, and will not be interpreted in an idealized or overly formal sense unless explicitly defined as such herein.

[0037] Hereinafter, embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings.

[0038] Figure 1 is a perspective view of an embodiment of an electronic device according to the present disclosure. Figure 2A and Figure 2B It is shown Figure 1A view of a folded state of an electronic device shown in FIG.

[0039] refer to Figure 1 , the electronic device ED in the embodiment of the present disclosure may have a quadrilateral shape in a plan view, for example, a rectangular shape having short sides extending in a first direction DR1 and long sides extending in a second direction DR2 intersecting the first direction DR1. However, not limited thereto, the electronic device ED may have various shapes, such as a circular shape, a polygonal shape, etc. The electronic device ED may be a flexible electronic device.

[0040] Hereinafter, a direction substantially perpendicularly crossing a plane defined by the first direction DR1 and the second direction DR2 is defined as a third direction DR3. In addition, the expression "when viewed from above a plane" used herein may mean that it is viewed in the third direction DR3.

[0041] The electronic device ED may include a folding area FA and a plurality of non-folding areas NFA1 and NFA2. The non-folding areas NFA1 and NFA2 may include a first non-folding area NFA1 and a second non-folding area NFA2. The folding area FA may be disposed between the first non-folding area NFA1 and the second non-folding area NFA2. The folding area FA, the first non-folding area NFA1, and the second non-folding area NFA2 may be disposed in a first direction DR1.

[0042] Although one folding area FA and two non-folding areas NFA1 and NFA2 are shown in the embodiment, the number of folding areas FA and the number of non-folding areas NFA1 and NFA2 are not limited thereto. In the embodiment, for example, the electronic device ED may include more than two non-folding areas and a plurality of folding areas, each of which is disposed between the non-folding areas.

[0043] An upper surface of the electronic device ED may be defined as a display surface DS, and the display surface DS may have a plane defined by a first direction DR1 and a second direction DR2. An image IM generated by the electronic device ED may be provided to a user through the display surface DS.

[0044] The display surface DS may include a display area DA and a non-display area NDA surrounding the display area DA. The display area DA may display an image IM, and the non-display area NDA may not display the image IM. The non-display area NDA may surround the display area DA and may define a boundary of the electronic device ED printed in a predetermined color.

[0045] refer to Figure 2A and Figure 2B, the electronic device ED may be a foldable electronic device ED that is folded or unfolded. In an embodiment, for example, the folding area FA may be bent around a folding axis FX parallel to the second direction DR2, and the electronic device ED may be folded accordingly. The folding axis FX may be defined as a long axis parallel to the long side of the electronic device ED. When the electronic device ED is folded, the first non-folding area NFA1 and the second non-folding area NFA2 may face each other, and the electronic device ED may be folded in an inward folding manner so that the display surface DS is not exposed to the outside. However, the present disclosure is not limited thereto. In an embodiment, for example, Figure 2B As shown in , the electronic device ED can be folded outward around the folding axis FX so that the display surface DS is exposed to the outside. In addition, although not shown, the electronic device ED can be simultaneously folded inwardly and outwardly. In an embodiment, the folding area FA can have a curvature radius R1 in a bent state.

[0046] Figure 3 yes Figure 1 An exploded perspective view of the electronic device shown in FIG.

[0047] refer to Figure 3 , the electronic device ED may include a display device DD, an electronic module EM, a power module PSM, and a housing EDC. Although not shown, the electronic device ED may further include a mechanical structure (eg, a hinge) for controlling a folding operation of the display device DD.

[0048] The display device DD may generate an image and may sense an external input. The display device DD may include a window module WM and a display module DM. The window module WM may provide a front surface of the electronic device ED. The window module WM may be disposed on the display module DM and may protect the display module DM. The window module WM may allow light generated from the display module DM to pass through and may provide light to a user.

[0049] The display module DM may include a display panel DP. Figure 3 Only the display panel DP in the stacking structure of the display module DM is shown, but the display module DM may substantially further include a plurality of components disposed on and under the display panel DP. The detailed stacking structure of the display module DM will be described in detail below. The display panel DP may include a display area DA and a non-display area NDA corresponding to the display area DA and the non-display area NDA of the electronic device ED.

[0050] The display module DM may include a data driver DDV disposed on the non-display area NDA of the display panel DP. The data driver DDV may be manufactured in the form of an integrated circuit chip and may be disposed (e.g., mounted) on the non-display area NDA. However, not limited thereto, the data driver DDV may be disposed (e.g., mounted) on a flexible circuit board connected to the display panel DP.

[0051] The electronic module EM and the power module PSM may be disposed under the display device DD. Although not shown, the electronic module EM and the power module PSM may be connected to each other through a separate flexible circuit board. The electronic module EM may control the operation of the display device DD. The power module PSM may supply power to the electronic module EM.

[0052] The housing EDC may accommodate the display device DD, the electronic module EM and the power module PSM. To fold the display device DD, the housing EDC may include a first housing EDC1 and a second housing EDC2. The first housing EDC1 and the second housing EDC2 may extend in the second direction DR2 and may be arranged in the first direction DR1.

[0053] Although not shown, the electronic device ED may further include a hinge structure for connecting the first housing EDC1 and the second housing EDC2. The housing EDC may be coupled with the window module WM. The housing EDC may protect the display device DD, the electronic module EM, and the power supply module PSM.

[0054] Figure 4 yes Figure 3 A block diagram of the electronic device shown in FIG.

[0055] refer to Figure 4 , the electronic device ED may include an electronic module EM, a power module PSM and a display device DD. The electronic module EM may include a control module 10, a wireless communication module 20, an image input module 30, a sound input module 40, a sound output module 50, a memory 60 and an external interface module 70. The modules may be arranged (e.g., mounted) on a circuit board, or may be electrically connected via a flexible circuit board. The electronic module EM may be electrically connected to the power module PSM.

[0056] The control module 10 may control the overall operation of the electronic device ED. In an embodiment, for example, the control module 10 may activate or deactivate the display device DD in response to a user input. The control module 10 may control the image input module 30, the sound input module 40, and the sound output module 50 in response to a user input. The control module 10 may include at least one microprocessor.

[0057] The wireless communication module 20 can transmit / receive wireless signals with another terminal via Bluetooth or Wi-Fi. The wireless communication module 20 can transmit / receive sound signals using a general communication line. The wireless communication module 20 may include a transmitter circuit 22 and a receiver circuit 24, the transmitter circuit 22 modulates the signal to be transmitted and transmits the modulated signal, and the receiver circuit 24 demodulates the received signal.

[0058] The image input module 30 may process the image signal to convert the image signal into image data that may be displayed on the display device DD. The sound input module 40 may receive an external sound signal through a microphone in a voice recording mode or a voice recognition mode, and may convert the external sound signal into electrical voice data. The sound output module 50 may convert the sound data received from the wireless communication module 20 or the sound data stored in the memory 60, and may output the converted sound data to the outside.

[0059] The external interface module 70 may be used as an interface to an external charger, a wired / wireless data port, or a card (eg, a memory card or a subscriber identity module / user identity module (“SIM / UIM”) card) socket.

[0060] The power supply module PSM may provide the power required for the overall operation of the electronic device ED. The power supply module PSM may include a conventional battery device.

[0061] Figure 5 yes Figure 3 A schematic cross-sectional view of a display module shown in FIG.

[0062] refer to Figure 5 The display module DM may include a display panel DP, an input sensing unit ISP disposed on the display panel DP, an anti-reflection layer RPL disposed on the input sensing unit ISP, and a panel protection layer PPL disposed under the display panel DP. The display panel DP may be a flexible display panel. In an embodiment, for example, the display panel DP may include a flexible substrate and a plurality of elements disposed on the flexible substrate.

[0063] The display panel DP in the embodiments of the present disclosure may be an emissive display panel, but is not particularly limited. In an embodiment, for example, the display panel DP may be an organic light-emitting display panel or an inorganic light-emitting display panel. The emission layer of the organic light-emitting display panel may include an organic light-emitting material. The emission layer of the inorganic light-emitting display panel may include quantum dots, quantum rods, etc. In the following, the display panel DP will be exemplified as an organic light-emitting display panel.

[0064] The input sensing unit ISP may include a plurality of sensor units (not shown) for sensing an external input in a capacitive type. When manufacturing the display module DM, the input sensing unit ISP may be directly formed on the display panel DP.

[0065] The anti-reflection layer RPL may be provided on the input sensing unit ISP. When manufacturing the display module DM, the anti-reflection layer RPL may be directly formed on the input sensing unit ISP. The anti-reflection layer RPL may be defined as a film for preventing reflection of external light. The anti-reflection layer RPL may reduce the reflectivity of external light incident from above the display device DD toward the display panel DP.

[0066] In an embodiment, for example, the input sensing unit ISP may be directly formed on the display panel DP, and the anti-reflection layer RPL may be directly formed on the input sensing unit ISP. However, the present disclosure is not limited thereto. In an embodiment, for example, the input sensing unit ISP may be manufactured separately and may be attached to the display panel DP through an adhesive layer, and the anti-reflection layer RPL may be manufactured separately and may be attached to the input sensing unit ISP through an adhesive layer.

[0067] The display panel DP, the input sensing unit ISP, and the anti-reflection layer RPL may be defined as an electronic panel EP.

[0068] The panel protection layer PPL may be disposed under the display panel DP. The panel protection layer PPL may protect the lower portion of the display panel DP. The panel protection layer PPL may include a flexible plastic material. In an embodiment, for example, the panel protection layer PPL may include polyethylene terephthalate ("PET"). Figure 5 The panel protection layer PPL is shown as one integral layer, but the panel protection layer PPL may include two layers spaced apart from each other. Fig.9A A detailed description is given thereon.

[0069] Figure 6 yes Figure 5 A cross-sectional view of a display panel shown in FIG.

[0070] exist Figure 6 , a segment of the display panel DP viewed in the second direction DR2 is shown.

[0071] refer to Figure 6 The display panel DP may include a substrate SUB, a circuit element layer DP-CL disposed on the substrate SUB, a display element layer DP-OLED disposed on the circuit element layer DP-CL, and a thin film encapsulation layer TFE disposed on the display element layer DP-OLED.

[0072] The substrate SUB may include a display area DA and a non-display area NDA surrounding the display area DA. The substrate SUB may include a flexible plastic material such as glass or polyimide ("PI"). The display element layer DP-OLED may be disposed in the display area DA.

[0073] A plurality of pixels may be provided in the circuit element layer DP-CL and the display element layer DP-OLED. Each of the pixels may include a transistor provided in the circuit element layer DP-CL and a light emitting element provided in the display element layer DP-OLED and connected to the transistor. Figure 8 Describe the configuration of pixels in detail.

[0074] The thin film encapsulation layer TFE may be disposed on the circuit element layer DP-CL to cover the display element layer DP-OLED. The thin film encapsulation layer TFE may protect the pixels from moisture, oxygen, and external foreign matter.

[0075] Figure 7 yes Figure 3 A plan view of the display panel shown in FIG.

[0076] refer to Figure 7 , the display module DM may include a display panel DP, a scan driver SDV, a data driver DDV, and an emission driver EDV.

[0077] The display panel DP may include a first area AA1, a second area AA2, and a bending area BA between the first area AA1 and the second area AA2. The bending area BA may extend in the second direction DR2, and the first area AA1, the bending area BA, and the second area AA2 may be arranged in the first direction DR1.

[0078] The first area AA1 may include a display area DA and a non-display area NDA surrounding the display area DA. The non-display area NDA may surround the display area DA. The display area DA may be an area where an image is displayed, and the non-display area NDA may be an area where an image is not displayed. The second area AA2 and the bending area BA may be areas where an image is not displayed.

[0079] When viewed in the second direction DR2, the first area AA1 may include a first non-folding area NFA1, a second non-folding area NFA2, and a folding area FA between the first non-folding area NFA1 and the second non-folding area NFA2.

[0080] The display panel DP may include a plurality of pixels PX, a plurality of scan lines SL1 to SLm, a plurality of data lines DL1 to DLn, a plurality of emission lines EL1 to ELm, a first control line CSL1 and a second control line CSL2, a power line PL, a plurality of connection lines CNL, and a plurality of pads PD. Here, "m" and "n" are positive integers greater than 1. The pixels PX may be disposed in the display area DA and may be connected to the scan lines SL1 to SLm, the data lines DL1 to DLn, and the emission lines EL1 to ELm.

[0081] The scan driver SDV and the emission driver EDV may be disposed in the non-display area NDA. The scan driver SDV and the emission driver EDV may be disposed in the non-display area NDA adjacent to opposite sides of the first area AA1 that are opposite to each other in the second direction DR2. The data driver DDV may be disposed in the second area AA2. The data driver DDV may be manufactured in the form of an integrated circuit chip and may be disposed (e.g., mounted) on the second area AA2.

[0082] The scan lines SL1 to SLm may extend in the second direction DR2 and may be connected to the scan driver SDV. The data lines DL1 to DLn may extend in the first direction DR1 and may be connected to the data driver DDV via the bending area BA. The emission lines EL1 to ELm may extend in the second direction DR2 and may be connected to the emission driver EDV.

[0083] The power line PL may extend in the first direction DR1 and may be disposed in the non-display area NDA. The power line PL may be disposed between the display area DA and the emission driver EDV. However, not limited thereto, the power line PL may be disposed between the display area DA and the scan driver SDV.

[0084] The power line PL may extend to the second area AA2 via the bending area BA. When viewed from above a plane, the power line PL may extend toward a lower end of the second area AA2. The power line PL may receive a driving voltage.

[0085] The connection line CNL may extend in the second direction DR2 and may be arranged in the first direction DR1. The connection line CNL may be connected to the power line PL and the pixel PX. A driving voltage may be applied to the pixel PX through the power line PL and the connection line CNL connected to each other.

[0086] The first control line CSL1 may be connected to the scan driver SDV and may extend toward the lower end of the second area AA2 via the bending area BA. The second control line CSL2 may be connected to the emission driver EDV and may extend toward the lower end of the second area AA2 via the bending area BA. The data driver DDV may be disposed between the first control line CSL1 and the second control line CSL2.

[0087] The pad PD may be disposed adjacent to a lower end of the second area AA2 when viewed from above a plane. The data driver DDV, the power line PL, the first control line CSL1, and the second control line CSL2 may be connected to the pad PD.

[0088] The data lines DL1 to DLn may be connected to corresponding pads PD through a data driver DDV. In an embodiment, for example, the data lines DL1 to DLn may be connected to the data driver DDV, and the data driver DDV may be connected to the pads PD corresponding to the data lines DL1 to DLn.

[0089] Although not shown, a printed circuit board may be connected to the pad PD, and a timing controller and a voltage generator may be provided on the printed circuit board. The timing controller may be manufactured in the form of an integrated circuit chip and may be provided (e.g., mounted) on the printed circuit board. The timing controller and the voltage generator may be connected to the pad PD through the printed circuit board.

[0090] The timing controller may control the operations of the scan driver SDV, the data driver DDV, and the emission driver EDV. The timing controller may generate a scan control signal, a data control signal, and an emission control signal in response to a control signal received from the outside. The voltage generator may generate a driving voltage.

[0091] The scan control signal may be provided to the scan driver SDV through the first control line CSL1. The emission control signal may be provided to the emission driver EDV through the second control line CSL2. The data control signal may be provided to the data driver DDV. The timing controller may receive an image signal from the outside, may convert the data format of the image signal according to the specification of the interface with the data driver DDV, and may provide the converted signal to the data driver DDV.

[0092] The scan driver SDV may generate a plurality of scan signals in response to the scan control signal. The scan signals may be applied to the pixels PX through the scan lines SL1 to SLm. The scan signals may be sequentially applied to the pixels PX.

[0093] The data driver DDV may generate a plurality of data voltages corresponding to the image signal in response to the data control signal. The data voltages may be applied to the pixels PX through the data lines DL1 to DLn. The emission driver EDV may generate a plurality of emission signals in response to the emission control signal. The emission signals may be applied to the pixels PX through the emission lines EL1 to ELm.

[0094] The pixel PX may receive a data voltage in response to a scan signal. The pixel PX may display an image by emitting light having brightness corresponding to the data voltage in response to an emission signal. The light emission time of the pixel PX may be controlled by the emission signal.

[0095] Figure 8 is shown with Figure 7 Any one pixel shown in the figure corresponds to a view of a section of the electronic panel.

[0096] refer to Figure 8 The pixel PX may include a transistor TR and a light emitting element OLED. The light emitting element OLED may include a first electrode AE ​​(or anode), a second electrode CE (or cathode), a hole control layer HCL, an electron control layer ECL and an emission layer EML.

[0097] The transistor TR and the light emitting element OLED may be disposed on the substrate SUB. Although one transistor TR is shown in the embodiment, the pixel PX may substantially include a plurality of transistors for driving the light emitting element OLED and at least one capacitor.

[0098] The display area DA may include an emission area PA corresponding to each of the pixels PX and a non-emission area NPA surrounding the emission area PA. The light emitting element OLED may be disposed in the emission area PA.

[0099] The buffer layer BFL may be disposed on the substrate SUB. The buffer layer BFL may be an inorganic layer. The semiconductor pattern may be disposed on the buffer layer BFL. The semiconductor pattern may include polysilicon, amorphous silicon, or metal oxide.

[0100] The semiconductor pattern may be doped with an N-type dopant or a P-type dopant. The semiconductor pattern may include a heavily doped region and a lightly doped region. The heavily doped region may have a higher conductivity than that of the lightly doped region and may substantially serve as a source electrode and a drain electrode of the transistor TR. The lightly doped region may substantially correspond to an active (or channel) region of the transistor TR.

[0101] The source S, active region A, and drain D of the transistor TR may be formed of a semiconductor pattern. A first insulating layer INS1 may be disposed on the semiconductor pattern. A gate G of the transistor TR may be disposed on the first insulating layer INS1. A second insulating layer INS2 may be disposed on the gate G. A third insulating layer INS3 may be disposed on the second insulating layer INS2.

[0102] To connect the transistor TR and the light emitting element OLED, the connection electrode CNE may include a first connection electrode CNE1 and a second connection electrode CNE2. The first connection electrode CNE1 may be disposed on the third insulating layer INS3 and may be connected to the drain electrode D through a first contact hole CH1 defined in the first to third insulating layers INS1 to INS3.

[0103] The fourth insulating layer INS4 may be disposed on the first connection electrode CNE1. The fifth insulating layer INS5 may be disposed on the fourth insulating layer INS4. The second connection electrode CNE2 may be disposed on the fifth insulating layer INS5. The second connection electrode CNE2 may be connected to the first connection electrode CNE1 through a second contact hole CH2 defined in the fourth insulating layer INS4 and the fifth insulating layer INS5.

[0104] The sixth insulating layer INS6 may be disposed on the second connection electrode CNE2. Layers from the buffer layer BFL to the sixth insulating layer INS6 may be defined as a circuit element layer DP-CL. The first to sixth insulating layers INS1 to INS6 may be inorganic layers or organic layers.

[0105] The first electrode AE ​​may be disposed on the sixth insulating layer INS6. The first electrode AE ​​may be connected to the second connection electrode CNE2 through a third contact hole CH3 defined in the sixth insulating layer INS6. A pixel defining layer PDL in which an opening PX_OP is defined to expose a predetermined portion of the first electrode AE ​​may be disposed on the first electrode AE ​​and the sixth insulating layer INS6.

[0106] The hole control layer HCL may be disposed on the first electrode AE ​​and the pixel defining layer PDL. The hole control layer HCL may include a hole transport layer and a hole injection layer.

[0107] The emission layer EML may be disposed on the hole control layer HCL. The emission layer EML may be disposed in a region corresponding to the opening PX_OP. The emission layer EML may include an organic material and / or an inorganic material. The emission layer EML may generate one of red light, green light, and blue light.

[0108] The electron control layer ECL may be disposed on the emission layer EML and the hole control layer HCL. The electron control layer ECL may include an electron transport layer and an electron injection layer. The hole control layer HCL and the electron control layer ECL may be commonly disposed in the emission area PA and the non-emission area NPA.

[0109] The second electrode CE may be disposed on the electronic control layer ECL. The second electrode CE may be commonly disposed in the pixel PX. The layer in which the light emitting element OLED is disposed may be defined as a display element layer DP-OLED.

[0110] The thin film encapsulation layer TFE may be disposed on the second electrode CE and may cover the pixel PX. The thin film encapsulation layer TFE may include a first encapsulation layer EN1 disposed on the second electrode CE, a second encapsulation layer EN2 disposed on the first encapsulation layer EN1, and a third encapsulation layer EN3 disposed on the second encapsulation layer EN2.

[0111] The first encapsulation layer EN1 and the third encapsulation layer EN3 may include an inorganic insulating layer and may protect the pixel PX from moisture / oxygen. The second encapsulation layer EN2 may include an organic insulating layer and may protect the pixel PX from foreign substances such as dust particles.

[0112] A first voltage may be applied to the first electrode AE ​​through the transistor TR, and a second voltage having a level lower than that of the first voltage may be applied to the second electrode CE. Holes and electrons injected into the emission layer EML may be recombined to form excitons, and when the excitons are transformed to a ground state, the light emitting element OLED may emit light.

[0113] The input sensing unit ISP may be disposed on the thin film encapsulation layer TFE. The input sensing unit ISP may be directly manufactured on the upper surface of the thin film encapsulation layer TFE.

[0114] The base layer BS may be disposed on the thin film encapsulation layer TFE. The base layer BS may include an inorganic insulating layer. At least one inorganic insulating layer may be disposed on the thin film encapsulation layer TFE as the base layer BS.

[0115] The input sensing unit ISP may include a first conductive pattern CTL1 and a second conductive pattern CTL2 disposed on the first conductive pattern CTL1. The first conductive pattern CTL1 may be disposed on the base layer BS. The insulating layer TINS ​​may be disposed on the base layer BS to cover the first conductive pattern CTL1. The insulating layer TINS ​​may include an inorganic insulating layer or an organic insulating layer. The second conductive pattern CTL2 may be disposed on the insulating layer TINS.

[0116] The first and second conductive patterns CTL1 and CTL2 may overlap the non-emission area NPA. Although not shown, the first and second conductive patterns CTL1 and CTL2 may be disposed in the non-emission area NPA between the emission areas PA and may have a mesh shape.

[0117] The first conductive pattern CTL1 and the second conductive pattern CTL2 may form the above-mentioned sensor of the input sensing unit ISP. In an embodiment, for example, the first conductive pattern CTL1 and the second conductive pattern CTL2 having a mesh shape may be separated from each other in a predetermined area to form a sensor. A portion of the second conductive pattern CTL2 may be connected to the first conductive pattern CTL1.

[0118] The anti-reflection layer RPL may be disposed on the second conductive pattern CTL2. The anti-reflection layer RPL may include a black matrix BM and a plurality of color filters CF. The black matrix BM may overlap the non-emission area NPA, and the color filters CF may overlap the emission areas PA, respectively.

[0119] The black matrix BM may be disposed on the insulating layer TINS ​​to cover the second conductive pattern CTL2. An opening B_OP overlapping the emission area PA and the opening PX_OP may be defined in the black matrix BM. The black matrix BM may absorb and block light. The width of the opening B_OP may be greater than the width of the opening PX_OP.

[0120] The color filters CF may be disposed on the insulating layer TINS ​​and the black matrix BM. The color filters CF may be disposed in the openings B_OP, respectively. The planarization insulating layer PINS may be disposed on the color filters CF. The planarization insulating layer PINS may provide a flat upper surface.

[0121] As in a mirror, when external light traveling toward the display panel DP is reflected from the display panel DP and provided back to the user, the user may visually recognize the external light. To prevent this phenomenon, for example, the anti-reflection layer RPL may include a plurality of color filters CF that display the same color as the color of the pixel PX of the display panel DP. The color filter CF may filter the external light having the same color as the pixel PX. In this case, the external light may not be visible to the user.

[0122] However, the present disclosure is not limited thereto, and the anti-reflection layer RPL may include a polarizing film to reduce the reflectivity of external light. The polarizing film may be manufactured separately and may be attached to the input sensing unit ISP through an adhesive layer. The polarizing film may include a phase retarder and / or a polarizer.

[0123] Fig.9A It is along Figure 7 A cross-sectional view taken along line II' shown in FIG. Fig. 9B It is shown Fig.9A A view of a bending state in which the bending area shown in FIG. Fig. 10A It is used to explain Fig.9A View of the strain of the filling section shown in . Fig. 10B is a view used to interpret the yield strain. Fig. 10C It is used to explain Figure 5 Figure 2. Strain diagram of the thin film encapsulation layer shown in Figure 2. Fig. 10D It is used to explain Fig.9A Illustration of the repulsive force of the window shown in .

[0124] In an embodiment, for example, Fig.9A : is a view showing a part of the display part DSP, a part of the support panel PLT, and a part of the window module WM.

[0125] refer to Fig.9A , the display device DD may include a display portion DSP, a window module WM disposed on the display portion DSP, and a support plate PLT disposed under the display portion DSP. The support plate PLT may support the display module DM. The window module WM may include a window WIN, a window protection layer WP, a hard coating layer HC, and a first adhesive layer AL1 and a second adhesive layer AL2.

[0126] The display portion DSP may include an electronic panel EP, an impact absorbing layer ISL, a panel protection layer PPL, a filling portion FCHa, a barrier layer BRL, and third to sixth adhesive layers AL3 to AL6. The impact absorbing layer ISL, the electronic panel EP, and the third adhesive layer AL3 may be defined as a display module DM. In another embodiment, the fourth adhesive layer AL4a may also be defined as a display module DM. Figure 5 The configuration of the electronic panel EP is described in detail, and thus description thereon will be omitted.

[0127] The impact absorbing layer ISL may be disposed on the electronic panel EP. The impact absorbing layer ISL may protect the electronic panel EP by absorbing external impact applied toward the electronic panel EP from above the display device DD. The impact absorbing layer ISL may be manufactured in the form of a stretchable film.

[0128] The impact absorbing layer ISL may include a flexible plastic material. The flexible plastic material may be defined as a synthetic resin film. In an embodiment, for example, the impact absorbing layer ISL may include a flexible plastic material such as PI or PET.

[0129] The window WIN may be disposed on the impact absorbing layer ISL. The window WIN may protect the electronic panel EP from external scratches. The window WIN may have an optically transparent property. The window WIN may include glass. However, not limited thereto, the window WIN may include a synthetic resin film.

[0130] The window WIN may have a multi-layer structure or a single-layer structure. In an embodiment, for example, the window WIN may include a plurality of synthetic resin films coupled by an adhesive, or may include a glass substrate and a synthetic resin film coupled by an adhesive.

[0131] The window protection layer WP may be disposed on the window WIN. The window protection layer WP may include a flexible plastic material such as PI or PET. The hard coating layer HC may be disposed on an upper surface of the window protection layer WP.

[0132] The printed layer PIT may be disposed on the lower surface of the window protection layer WP. The printed layer PIT may be black. However, the color of the printed layer PIT is not limited thereto. The printed layer PIT may be adjacent to the periphery of the window protection layer WP.

[0133] The panel protection layer PPL may be disposed under the electronic panel EP. The panel protection layer PPL may protect a lower portion of the electronic panel EP.

[0134] In an embodiment, for example, the panel protection layer PPL may have a thickness of about 75 micrometers (μm). However, not limited thereto, the panel protection layer PPL may have a thickness of about 55 μm to about 95 μm.

[0135] The panel protection layer PPL may include a flexible plastic material. In an embodiment, for example, the panel protection layer PPL may include PET.

[0136] The panel protection layer PPL may include a first panel protection layer PPL1 and a second panel protection layer PPL2. The first panel protection layer PPL1 may overlap the first non-folding area NFA1. The second panel protection layer PPL2 may overlap the second non-folding area NFA2.

[0137] The first and second panel protection layers PPL1 and PPL2 may be spaced apart from each other in the first direction DR1. The first and second panel protection layers PPL1 and PPL2 may be spaced apart from each other in the first direction DR1 by the length of the folding area FA. The first and second panel protection layers PPL1 and PPL2 may not overlap the folding area FA.

[0138] The fourth adhesive layer AL4a described below may be disposed between the panel protection layer PPL and the electronic panel EP. In an embodiment, for example, the fourth adhesive layer AL4a may have a thickness of about 13 μm. In an embodiment, the fourth adhesive layer AL4a may have an elastic modulus of about 105 kilopascals (kPa). For example, a detailed description of the fourth adhesive layer AL4a will be given below.

[0139] The filling portion FCHa may be disposed under the electronic panel EP. The filling portion FCHa may be disposed between the first panel protection layer PPL1 and the second panel protection layer PPL2. The filling portion FCHa may overlap the folding area FA.

[0140] In an embodiment, for example, the thickness of the filling portion FCHa in the third direction DR3 may be less than the thickness of the first panel protection layer PPL1 and the second panel protection layer PPL2 in the third direction DR3. The lower surface of the filling portion FCHa may have a height greater than the height of the lower surfaces of the first panel protection layer PPL1 and the second panel protection layer PPL2. However, this is illustrative, and the height of the lower surface of the filling portion FCHa may be equal to the height of the lower surfaces of the first panel protection layer PPL1 and the second panel protection layer PPL2. Fig.11 A detailed description is given thereon.

[0141] refer to Fig.9A , Fig. 10A and Fig. 10B , 1-1 graph A1 and 1-2 graph A2 are graphs depicting strain when the panel protection layer PPL overlapping the folding area FA is folded in the case where the panel protection layer PPL extends from the first non-folding area NFA1 to the second non-folding area NFA2 via the folding area FA. The implementation method representing the results of 1-1 graph A1 and 1-2 graph A2 may be an implementation method in the prior art.

[0142] 2-1 Graph B1 is a graph depicting the strain when the filling portion FCHa having an elastic modulus of about 1 megapascal (Mpa) is folded. 3-1 Graph C1 is a graph depicting the strain when the filling portion FCHa having an elastic modulus of about 10 MPa is folded. 4-1 Graph D1 is a graph depicting the strain when the filling portion FCHa having an elastic modulus of about 100 MPa is folded. 5-1 Graph E1 is a graph depicting the strain when the filling portion FCHa having an elastic modulus of about 500 MPa is folded. 6-1 Graph F1 is a graph depicting the strain when the filling portion FCHa having an elastic modulus of about 1 gigapascal (Gpa) is folded.

[0143] Fig. 10B The elastic region in can be defined as the section where the object returns to its original state when the force applied to the object is removed. Fig. 10B The plastic region in can be defined as the section where the object is permanently deformed. In the elastic region, the stress can be proportional to the strain. In the elastic region, the elastic modulus can be Fig. 10B The slope of the graph shown in .

[0144] The strain can be defined as the ratio of the change in the length of the filling portion FCHa to the initial length of the filling portion FCHa. The magnitude of the stress applied when the filling portion FCHa begins to deform permanently and does not maintain elasticity can be defined as the yield stress. In other words, the yield stress can be defined as the stress at the boundary between the elastic region and the plastic region.

[0145] Yield strain can be defined as the strain of an object when a yield stress is applied to the object. For ease of description, for example, the yield strain is Fig. 10B In the embodiment,

[0146] For example, Fig. 10B Yes means Fig. 10A 1-1 Graph A1 and 1-2 Graph A2 show strain-stress curves of embodiments of the results.

[0147] In the case of the embodiment showing the results of 1-1 graph A1 and 1-2 graph A2, the strain of the panel protection layer PPL when overlapping the folding area FA is folded can be in the range of about 2.72% to about 5.5%. Therefore, when the filling part FCHa is arranged in the area overlapping the folding part, the strain of the filling part FCHa can also be as high as about 5.5%. In order to allow the filling part FCHa to be repeatedly folded or unfolded while maintaining elasticity, the strain of the filling part FCHa can be in the range of about 2.72% to about 5.5%. Fig. 10B within the elastic region.

[0148] In an embodiment, for example, when the filling portion FCHa has Fig. 10B When the yield strain of about 7% is shown in , the filling portion FCHa can be repeatedly folded or unfolded without permanent deformation even if a stress causing a strain of up to about 5.5% is applied. Although the yield strain has been described as about 7%, the yield strain of the filling portion FCHa can be in the range of about 5.5% to about 7%.

[0149] refer to Figure 6 , Fig.9A , Fig. 10A and Fig. 10C , 1 1-3 graph A3 is a graph depicting strain when the thin film encapsulation layer TFE disposed on the panel protection layer PPL is folded, in the case where the panel protection layer PPL extends from the first non-folding area NFA1 to the second non-folding area NFA2 via the folding area FA. The embodiment representing the result of 1-3 graph A3 may be an embodiment in the prior art. In the embodiment representing the result of 1-3 graph A3, the thin film encapsulation layer TFE may not be permanently deformed or damaged even if it is repeatedly folded or unfolded.

[0150] Because the thin film encapsulation layer TFE is placed on Fig.9AThe thin film encapsulation layer TFE is formed on the panel protection layer PPL in the folded film, so the thin film encapsulation layer TFE can be compressed when folded. Therefore, the length of the thin film encapsulation layer TFE deformed after compression can be shorter than the initial length of the thin film encapsulation layer TFE. Therefore, the strain of the thin film encapsulation layer TFE can have a negative value.

[0151] 2-2 Graph B2 is a graph depicting the strain when the thin film encapsulation layer TFE is folded in the case where a filling portion FCHa having an elastic modulus of approximately 1 MPa is provided. 3-2 Graph C2 is a graph depicting the strain when the thin film encapsulation layer TFE is folded in the case where a filling portion FCHa having an elastic modulus of approximately 10 MPa is provided. 4-2 Graph D2 is a graph depicting the strain when the thin film encapsulation layer TFE is folded in the case where a filling portion FCHa having an elastic modulus of approximately 100 MPa is provided. 5-2 Graph E2 is a graph depicting the strain when the thin film encapsulation layer TFE is folded in the case where a filling portion FCHa having an elastic modulus of approximately 500 MPa is provided. 6-2 Graph F2 is a graph depicting the strain when the thin film encapsulation layer TFE is folded in the case where a filling portion FCHa having an elastic modulus of approximately 1 GPa is provided.

[0152] like Fig. 10A As shown in , when the strain of the filling portion FCHa is in the range of about 5.5% to about 7%, the thickness of the filling portion FCHa may be in the range of about 80 μm to about 125 μm. Fig. 10C As shown in , when the filling portion FCHa has a thickness greater than about 110 μm, the strain of the thin film encapsulation layer TFE may be greater than the strain in the embodiment representing the result of line A3 of 1-3. In this case, the thin film encapsulation layer TFE may be broken. When the filling portion FCHa has a thickness of about 80 μm to about 110 μm, the strain of the thin film encapsulation layer TFE in the embodiment representing the results of lines B2 of 2-2 to lines F2 of 6-2 may be less than or equal to the strain of the thin film encapsulation layer TFE in the embodiment representing the result of line A3 of 1-3.

[0153] Therefore, in order to prevent the thin film encapsulation layer TFE from being broken, the filling part FCHa may have a thickness of about 80 μm to about 110 μm. Even if the filling part FCHa having a thickness of about 80 μm to about 110 μm overlaps the folding area FA and is disposed in the area between the first panel protection layer PPL1 and the second panel protection layer PPL2, the thin film encapsulation layer TFE may not be permanently deformed or damaged due to the folding operation or the unfolding operation.

[0154] refer to Fig.9A , Fig. 10A and Fig. 10D, when viewed in the second direction DR2, the window WIN may also be folded when the display device DD is folded. Specifically, the portion of the window WIN overlapping the first non-folding area NFA1 may be rotated in a clockwise direction on a plane defined by the first direction DR1 and the third direction DR3. The portion of the window WIN overlapping the second non-folding area NFA2 may be rotated in a counterclockwise direction on a plane defined by the first direction DR1 and the third direction DR3. In this case, the window WIN may have a repulsive force that resists the rotation.

[0155] 1-4 graph A4 is a graph depicting the repulsive force of the window WIN when the window WIN is folded in the case where the panel protection layer PPL extends from the first non-folding area NFA1 to the second non-folding area NFA2 via the folding area FA. The embodiment representing the result of 1-4 graph A4 may be an embodiment in the prior art. In the embodiment representing the result of 1-4 graph A4, the window WIN may not be damaged even if it is repeatedly folded or unfolded.

[0156] 2-3 Graph B3 is a graph depicting the repulsive force of the window WIN when a filling portion FCHa having an elastic modulus of approximately 1 MPa is provided. 3-3 Graph C3 is a graph depicting the repulsive force of the window WIN when a filling portion FCHa having an elastic modulus of approximately 10 MPa is provided. 4-3 Graph D3 is a graph depicting the repulsive force of the window WIN when a filling portion FCHa having an elastic modulus of approximately 100 MPa is provided. 5-3 Graph E3 is a graph depicting the repulsive force of the window WIN when a filling portion FCHa having an elastic modulus of approximately 500 MPa is provided. 6-3 Graph F3 is a graph depicting the repulsive force of the window WIN when a filling portion FCHa having an elastic modulus of approximately 1 GPa is provided.

[0157] The thickness of the filling portion FCHa can be set according to the size of the elastic modulus of the filling portion FCHa. When the filling portion FCHa has a thickness of about 110 μm, the repulsive force of the window WIN in the embodiment representing the result of the 5-3 graph E3 can be equal to the repulsive force of the window WIN in the embodiment representing the result of the 1-4 graph A4. However, when the filling portion FCHa has a thickness of about 88 μm, the repulsive force of the window WIN in the embodiment representing the result of the 6-3 graph F3 can be equal to the repulsive force of the window WIN in the embodiment representing the result of the 1-4 graph A4.

[0158] [Table 1]

[0159]

[0160] Table 1 contains information on the methods for identifying the folding region FA (see Fig.9A). The impact resistance test may be performed by a nail press test. The nail press test may be a test in which an object with a relatively small contact area (such as a fingernail or a fingernail) is pressed against the display surface DS of the display device DD (see Figure 1 ) on the .

[0161] Referring to Table 1, in an embodiment in which the panel protection layer PPL extends from the first non-folding area NFA1 to the second non-folding area NFA2 via the folding area FA and is not divided in the folding area FA, when a force of about 15 kilograms (kgf) is applied to the display surface DS (refer to Figure 1 ) can be displayed on the display surface DS (reference Figure 1 ) When a force of about 15kgf is applied to the window WIN, the window WIN may break.

[0162] In an embodiment where the filling portion FCHa is arranged to overlap the folding area FA, the magnitude of the force at which the bright spot on the display surface DS and the crack in the window WIN begin to appear may vary according to the elastic modulus of the filling portion FCHa. As the elastic modulus of the filling portion FCHa increases, the magnitude of the force causing the bright spot on the display surface DS and the crack in the window WIN may increase.

[0163] As can be seen from Table 1, when the filling portion FCHa has an elastic modulus of about 400 MPa or more and a force of about 10.6 kgf is applied, a bright spot may appear. When the filling portion FCHa has an elastic modulus of about 400 MPa or more and a force of about 16.3 kgf is applied, the window WIN may break. When the filling portion FCHa has an elastic modulus of about 400 MPa, the result may be similar to the experimental result value in the embodiment in which the panel protection layer PPL overlaps the folding area FA. Therefore, the elastic modulus of the filling portion FCHa may be in the range of about 400 MPa to about 1 Gpa.

[0164] As reference FIG. 10A to FIG. 10D As described in Table 1, the yield strain of the filling portion FCHa may be in the range of about 5.5% to about 7%. The thickness of the filling portion FCHa may be in the range of about 80 μm to about 110 μm. The elastic modulus of the filling portion FCHa may be in the range of about 400 MPa to about 1 GPa.

[0165] In an embodiment where the panel protection layer PPL overlaps the first non-folding area NFA1, the folding area FA, and the second non-folding area NFA2, the panel protection layer PPL disposed in the first non-folding area NFA1, the second non-folding area NFA2, and the folding area FA may include the same material as each other. The panel protection layer PPL disposed in the first non-folding area NFA1, the second non-folding area NFA2, and the folding area FA may be integral.

[0166] In order to improve the impact resistance of the first non-folding area NFA1 and the second non-folding area NFA2, the thickness of the panel protection layer PPL may be increased from about 50 μm to about 75 μm. The thickness of the panel protection layer PPL overlapping the folding area FA may also be increased. In this case, when the electronic device ED (reference Figure 1 ) When folded, the electronic device ED may not be easily folded due to the increase in thickness of the panel protection layer PPL overlapping the folding area FA.

[0167] However, according to the present disclosure, the panel protection layer PPL overlapping the first non-folding area NFA1 and the second non-folding area NFA2 and the filling portion FCHa overlapping the folding area FA may include materials different from each other. The panel protection layer PPL overlapping the first non-folding area NFA1 and the second non-folding area NFA2 and the filling portion FCHa overlapping the folding area FA may not be integral.

[0168] Accordingly, the filling portion FCHa may have an elastic modulus and a yield strain different from those of the panel protection layer PPL. In addition, the thickness of the filling portion FCHa may be adjusted to be different from that of the panel protection layer PPL. Figure 1 ) can be easily folded while maintaining the improved impact resistance of the first non-folding area NFA1 and the second non-folding area NFA2.

[0169] The barrier layer BRL may be disposed under the panel protection layer PPL. The barrier layer BRL may increase resistance to compression force caused by external pressure. Therefore, the barrier layer BRL may be used to prevent deformation of the electronic panel EP. The barrier layer BRL may include a flexible plastic material such as PI or PET.

[0170] The barrier layer BRL may have a color that absorbs light. In an embodiment, for example, the barrier layer BRL may be black. In this case, when the display module DM is observed from above the display module DM, components disposed under the barrier layer BRL may not be visible.

[0171] The first adhesive layer AL1 may be disposed between the window protection layer WP and the window WIN. The window protection layer WP and the window WIN may be bonded to each other through the first adhesive layer AL1. The first adhesive layer AL1 may cover the print layer PIT.

[0172] The second adhesive layer AL2 may be disposed between the window WIN and the shock absorbing layer ISL. The window WIN and the shock absorbing layer ISL may be bonded to each other by the second adhesive layer AL2.

[0173] The third adhesive layer AL3 may be disposed between the impact absorbing layer ISL and the electronic panel EP. The impact absorbing layer ISL and the electronic panel EP may be bonded to each other through the third adhesive layer AL3.

[0174] The fourth adhesive layer AL4a may be disposed between the electronic panel EP and the panel protection layer PPL. The fourth adhesive layer AL4a may be disposed between the electronic panel EP and the filling part FCHa. The electronic panel EP and the panel protection layer PPL may be bonded to each other through the fourth adhesive layer AL4a. The electronic panel EP and the filling part FCHa may be bonded to each other through the fourth adhesive layer AL4a.

[0175] The fifth adhesive layer AL5 may be disposed between the panel protection layer PPL and the barrier layer BRL. The fifth adhesive layer AL5 may be disposed between the filling portion FCHa and the barrier layer BRL. The panel protection layer PPL and the barrier layer BRL may be bonded to each other through the fifth adhesive layer AL5. In an embodiment, for example, the filling portion FCHa may be spaced apart from the fifth adhesive layer AL5 in the third direction DR3. However, not limited thereto, the filling portion FCHa may be in contact with the upper surface of the fifth adhesive layer AL5. Fig.11 A detailed description is given thereon.

[0176] The sixth adhesive layer AL6 may be disposed between the barrier layer BRL and the support plate PLT. Specifically, the support plate PLT may be disposed under the barrier layer BRL, and the sixth adhesive layer AL6 may be disposed between the barrier layer BRL and the support plate PLT. The barrier layer BRL and the support plate PLT may be bonded to each other through the sixth adhesive layer AL6.

[0177] The sixth adhesive layer AL6 may overlap the first non-folding area NFA1 and the second non-folding area NFA2, and may not overlap the folding area FA. That is, the sixth adhesive layer AL6 may not be disposed in the folding area FA.

[0178] The first to sixth adhesive layers AL1 to AL6 may include a transparent adhesive such as a pressure sensitive adhesive (“PSA”) or an optically clear adhesive (“OCA”), but are not limited thereto.

[0179] The thickness of the panel protection layer PPL may be less than the thickness of the window protection layer WP, and the thickness of the barrier layer BRL may be less than the thickness of the panel protection layer PPL. The thickness of the electronic panel EP may be less than the thickness of the barrier layer BRL and may be equal to the thickness of the window WIN. The thickness of the impact absorbing layer ISL may be less than the thickness of the electronic panel EP.

[0180] The thickness of the first adhesive layer AL1 may be equal to that of the barrier layer BRL, and the thickness of the second adhesive layer AL2 and the thickness of the third adhesive layer AL3 may be equal to that of the panel protection layer PPL. The thickness of the fourth adhesive layer AL4a may be equal to that of the fifth adhesive layer AL5.

[0181] The thickness of the fourth adhesive layer AL4a and the thickness of the fifth adhesive layer AL5 may be less than the thickness of the electronic panel EP, and may be greater than the thickness of the impact absorbing layer ISL. The thickness of the sixth adhesive layer AL6 may be less than the thickness of the impact absorbing layer ISL. The thickness of the hard coating layer HC may be less than the thickness of the sixth adhesive layer AL6.

[0182] The electronic panel EP, the impact absorbing layer ISL, the panel protection layer PPL, and the third adhesive layer AL3 and the fourth adhesive layer AL4a may have the same width. The window protection layer WP and the first adhesive layer AL1 may have the same width. The barrier layer BRL and the fifth adhesive layer AL5 and the sixth adhesive layer AL6 may have the same width.

[0183] The width of the electronic panel EP, the impact absorbing layer ISL, the panel protective layer PPL, and the third adhesive layer AL3 and the fourth adhesive layer AL4a may be greater than the width of the window protective layer WP and the first adhesive layer AL1. The periphery of the electronic panel EP, the impact absorbing layer ISL, the panel protective layer PPL, and the third adhesive layer AL3 and the fourth adhesive layer AL4a may be arranged outside the periphery of the window protective layer WP and the first adhesive layer AL1.

[0184] The width of the window WIN and the second adhesive layer AL2 may be smaller than the width of the window protection layer WP and the first adhesive layer AL1. The width of the second adhesive layer AL2 may be smaller than the width of the window WIN. The periphery of the window WIN may be disposed inside the peripheries of the window protection layer WP and the first adhesive layer AL1. The periphery of the second adhesive layer AL2 may be disposed inside the periphery of the window WIN.

[0185] The width of the barrier layer BRL and the fifth and sixth adhesive layers AL5 and AL6 may be smaller than the width of the window protection layer WP and the first adhesive layer AL1. The periphery of the barrier layer BRL and the fifth and sixth adhesive layers AL5 and AL6 may be disposed inside the periphery of the window protection layer WP and the first adhesive layer AL1.

[0186] The support plate PLT may be disposed under the display part DSP and may support the display part DSP. The support plate PLT may be disposed under the electronic panel EP and may support the electronic panel EP. The width of the support plate PLT may be substantially the same as the width of the electronic panel EP. The support plate PLT may have a higher rigidity than that of the display part DSP.

[0187] The support plate PLT may include a non-metal material. In an embodiment, for example, the support plate PLT may include a fiber-reinforced composite material. The fiber-reinforced composite material may be a carbon fiber reinforced plastic ("CFRP") or a glass fiber reinforced plastic ("GFRP").

[0188] The support plate PLT including the fiber reinforced composite material may be light.The support plate PLT including the fiber reinforced composite material may be lighter than a metal support plate including or consisting of a metal material, and may have a modulus and stiffness similar to those of a metal support plate.

[0189] Furthermore, the support plate PLT including the fiber reinforced composite material may be more easily shaped than a metal support plate. In an embodiment, for example, the support plate PLT including the fiber reinforced composite material may be more easily shaped by a laser process or a micro-blast process.

[0190] The support plate PLT may include a first non-folding portion PLT1, a folding portion PLF, and a second non-folding portion PLT2. The first non-folding portion PLT1 may overlap with the first non-folding area NFA1. The folding portion PLF may overlap with the folding area FA. The second non-folding portion PLT2 may overlap with the second non-folding area NFA2. In an embodiment, a hole area HA1 corresponding to a hole in the second non-folding portion PLT2 may be defined in the second non-folding area NFA2.

[0191] A plurality of openings OP may be defined in the folded portion PLF. The opening OP may be defined by a portion in the third direction DR3 through the support plate PLT. When viewed in the second direction DR2, the openings OP may be defined in the first direction DR1 to be spaced apart from each other. The openings OP may be defined by the above-mentioned laser process or micro-sandblasting process. The width of the portion in which the openings OP are defined may be smaller than the width of the opening of the sixth adhesive layer AL6.

[0192] Since the opening OP is defined in the portion of the support plate PLT overlapping the folding area FA, the flexibility of the portion of the support plate PLT overlapping the folding area FA can be increased. Therefore, the support plate PLT can be folded around the folding area FA.

[0193] The folded portion PLF may include branch portions BR. Each of the branch portions BR may be disposed between the openings OP adjacent to each other in the first direction DR1.

[0194] Although not shown, the display device DD may further include a digitizer, a shielding layer, and a heat dissipation layer disposed under the support plate PLT.

[0195] refer to Fig. 9B , the panel protection layer PPL and the fourth adhesive layer AL4a may not be disposed under the bending area BA. The panel protection layer PPL and the fourth adhesive layer AL4a may be disposed under the second area AA2 of the electronic panel EP. The data driver DDV may be disposed under the second area AA2 of the electronic panel EP.

[0196] The printed circuit board PCB may be connected to the second area AA2 of the electronic panel EP. The printed circuit board PCB may be connected to one side of the second area AA2. When the bending area BA is bent, the second area AA2 may be disposed under the first area AA1. Therefore, the data driver DDV and the printed circuit board PCB may be disposed under the first area AA1.

[0197] Fig.11 is a view showing an embodiment of a display device.

[0198] In an embodiment, for example, Fig.11 is a cross-sectional view of the display device DD viewed in the second direction DR2.

[0199] Fig.11 The window module WM, the display module DM, the fourth adhesive layer AL4a, the fifth adhesive layer AL5 and the sixth adhesive layer AL6, the barrier layer BRL and the support plate PLT are Fig.9A The window module WM, the display module DM, the fourth adhesive layer AL4a, the fifth adhesive layer AL5 and the sixth adhesive layer AL6, the barrier layer BRL and the support plate PLT are the same and thus will be omitted from the description or will be briefly described.

[0200] refer to Fig.11 The filling part FCHb may be disposed between the first panel protection layer PPL1 and the second panel protection layer PPL2 which are spaced apart from each other in the first direction DR1. The filling part FCHb may overlap the folding area FA.

[0201] The filling part FCHb may have a thickness equal to that of the first and second panel protection layers PPL1 and PPL2 in the third direction DR3 .

[0202] A lower surface of the filling part FCHb may be in contact with an upper surface of the fifth adhesive layer AL5. The filling part FCHb and the barrier layer BRL may be bonded to each other through the fifth adhesive layer AL5.

[0203] Because the filling portion FCHb having an elastic modulus and yield strain different from those of the first panel protective layer PPL1 and the second panel protective layer PPL2 is disposed to overlap the folding area FA, the impact resistance of the first non-folding area NFA1 and the second non-folding area NFA2 can be improved, and the display device DD can be easily folded.

[0204] Fig.12 is a view showing an embodiment of a display device according to the present disclosure.

[0205] In an embodiment, for example, Fig.12 is a cross-sectional view of the display device DD viewed in the second direction DR2.

[0206] Fig.12 The window module WM, the display module DM, the fourth adhesive layer AL4a, the fifth adhesive layer AL5 and the sixth adhesive layer AL6, the barrier layer BRL and the support plate PLT are Fig.9A The window module WM, the display module DM, the fourth adhesive layer AL4a, the fifth adhesive layer AL5 and the sixth adhesive layer AL6, the barrier layer BRL and the support plate PLT are the same and thus will be omitted from the description or will be briefly described.

[0207] refer to Fig.12 The filling part FCHc may be disposed between the first panel protection layer PPL1 and the second panel protection layer PPL2 which are spaced apart from each other in the first direction DR1. The filling part FCHc may overlap the folding area FA.

[0208] In an embodiment, for example, the thickness of the filling portion FCHc in the third direction DR3 may be equal to the thickness of the first panel protection layer PPL1 and the second panel protection layer PPL2 in the third direction DR3. The height of the lower surface of the filling portion FCHc may be equal to the height of the lower surface of the first panel protection layer PPL1 and the second panel protection layer PPL2. However, not limited to this, the thickness of the filling portion FCHc may be less than the thickness of the panel protection layer PPL. In this case, the height of the lower surface of the filling portion FCHc may be greater than the height of the lower surface of the panel protection layer PPL.

[0209] The filling part FCHc may include a first filling part FCHc1 and a second filling part FCHc2. The first filling part FCHc1 may be disposed under the electronic panel EP. The first filling part FCHc1 may be disposed on a lower surface of the fourth adhesive layer AL4a. The first filling part FCHc1 and the electronic panel EP may be bonded to each other through the fourth adhesive layer AL4a.

[0210] The second filling part FCHc2 may be disposed under the first filling part FCHc1. The second filling part FCHc2 may be disposed between the first filling part FCHc1 and the fifth adhesive layer AL5. The second filling part FCHc2 may be disposed on a lower surface of the first filling part FCHc1.

[0211] In an embodiment, for example, the thickness of the second filling part FCHc2 may be equal to the thickness of the first filling part FCHc1. However, not limited thereto, the thickness of the second filling part FCHc2 may be different from the thickness of the first filling part FCHc1.

[0212] In an embodiment, for example, the sum of the thickness of the first filling part FCHc1 and the thickness of the second filling part FCHc2 may be equal to the thickness of the panel protection layer PPL. The height of the lower surface of the second filling part FCHc2 may be equal to the height of the lower surface of the panel protection layer PPL.

[0213] However, not limited thereto, the sum of the thickness of the first filling part FCHc1 and the thickness of the second filling part FCHc2 may be less than the thickness of the panel protection layer PPL. In this case, the height of the lower surface of the second filling part FCHc2 may be greater than the height of the lower surface of the panel protection layer PPL.

[0214] Because the filling portion FCHc having an elastic modulus, yield strain and thickness different from those of the panel protective layer PPL is set to overlap the folding area FA, the impact resistance of the first non-folding area NFA1 and the second non-folding area NFA2 can be improved, and the display device DD can be easily folded.

[0215] Although the filling part FCHc including two layers is illustrated in the embodiment, the filling part FCHc is not limited thereto and may include three or more layers.

[0216] FIG. 13A to FIG. 13C It is a view for explaining an embodiment of a display device.

[0217] In an embodiment, for example, FIG. 13A to FIG. 13C is a cross-sectional view of the display device DD viewed in the second direction DR2.

[0218] FIG. 13A to FIG. 13CThe window module WM, the display module DM, the fifth adhesive layer AL5 and the sixth adhesive layer AL6 and the support plate PLT are Fig.9A The window module WM, the display module DM, the fifth and sixth adhesive layers AL5 and AL6, and the support plate PLT are the same and thus will be omitted from the description or will be briefly described.

[0219] refer to FIG. 13A to FIG. 13C , the fourth adhesive layer AL4b may include a first portion AL4-1 and a second portion AL4-2. The first portion AL4-1 and the second portion AL4-2 may be spaced apart from each other in the first direction DR1 and may be disposed on the lower surface of the electronic panel EP.

[0220] The first portion AL4-1 may overlap the first non-folding area NFA1. The first portion AL4-1 may overlap the first panel protection layer PPL1. The first panel protection layer PPL1 and the electronic panel EP may be combined with each other through the first portion AL4-1.

[0221] The second portion AL4-2 may overlap the second non-folding area NFA2. The second portion AL4-2 may overlap the second panel protection layer PPL2. The second panel protection layer PPL2 and the electronic panel EP may be combined with each other through the second portion AL4-2. The first portion AL4-1 and the second portion AL4-2 may not overlap the folding area FA.

[0222] In an embodiment, for example, the first portion AL4-1 and the second portion AL4-2 may have an elastic modulus of about 105 kPa. In an embodiment, for example, the first portion AL4-1 and the second portion AL4-2 may have a thickness of about 13 μm.

[0223] refer to Fig.13A The filling part FCHd may be disposed between the first portion AL4-1 and the second portion AL4-2 spaced apart from each other in the first direction DR1. The filling part FCHd may be disposed between the first panel protection layer PPL1 and the second panel protection layer PPL2 spaced apart from each other in the first direction DR1.

[0224] The filling part FCHd may be disposed on the lower surface of the electronic panel EP. The filling part FCHd may include an adhesive material. Therefore, the filling part FCHd may be directly disposed on the lower surface of the electronic panel EP and may be bonded to the lower surface of the electronic panel EP.

[0225] The thickness of the filling part FCHd may be equal to the sum of the thickness of the fourth adhesive layer AL4b and the thickness of the panel protection layer PPL. In this case, the height of the lower surface of the filling part FCHd may be equal to the height of the lower surface of the panel protection layer PPL.

[0226] refer to Fig. 13B The filling part FCHe may be disposed between the first portion AL4-1 and the second portion AL4-2 spaced apart from each other in the first direction DR1. The filling part FCHe may be disposed between the first panel protection layer PPL1 and the second panel protection layer PPL2 spaced apart from each other in the first direction DR1.

[0227] The filling part FCHe may be disposed on the lower surface of the electronic panel EP. The filling part FCHe may include an adhesive material. Therefore, the filling part FCHe may be directly disposed on the lower surface of the electronic panel EP.

[0228] The thickness of the filling part FCHe may be less than the sum of the thickness of the fourth adhesive layer AL4b and the thickness of the panel protection layer PPL. In this case, the height of the lower surface of the filling part FCHe may be greater than the height of the lower surface of the panel protection layer PPL.

[0229] refer to Fig. 13C The filling part FCHf may be disposed between the first portion AL4-1 and the second portion AL4-2 spaced apart from each other in the first direction DR1. The filling part FCHf may be disposed between the first panel protection layer PPL1 and the second panel protection layer PPL2 spaced apart from each other in the first direction DR1.

[0230] The filling part FCHf may include a third filling part FCHf1 and a fourth filling part FCHf2. The third filling part FCHf1 and the fourth filling part FCHf2 may include an adhesive material. The third filling part FCHf1 may be disposed under the electronic panel EP. The third filling part FCHf1 may be disposed directly on the lower surface of the electronic panel EP.

[0231] The fourth filling part FCHf2 may be disposed below the third filling part FCHf1. The fourth filling part FCHf2 may be disposed directly on a lower surface of the third filling part FCHf1.

[0232] The third filling part FCHf1 and the fourth filling part FCHf2 are shown to have the same thickness. However, not limited thereto, the third filling part FCHf1 and the fourth filling part FCHf2 may have different thicknesses.

[0233] In an embodiment, for example, the sum of the thickness of the third filling part FCHf1 and the thickness of the fourth filling part FCHf2 may be equal to the sum of the thickness of the fourth adhesive layer AL4b and the thickness of the panel protection layer PPL. In this case, the height of the lower surface of the fourth filling part FCHf2 may be equal to the height of the lower surface of the panel protection layer PPL.

[0234] This is illustrative, and although not shown, the sum of the thickness of the third filling part FCHf1 and the thickness of the fourth filling part FCHf2 may be less than the sum of the thickness of the fourth adhesive layer AL4b and the thickness of the panel protection layer PPL. In this case, the height of the lower surface of the fourth adhesive layer AL4b may be greater than the height of the lower surface of the panel protection layer PPL.

[0235] Although the filling part FCHf including two layers is illustrated in the embodiment, the filling part FCHf is not limited thereto and may include three or more layers.

[0236] In an embodiment in which the fourth adhesive layer AL4b and the panel protection layer PPL overlap with the folding area FA, each of the fourth adhesive layer AL4b and the panel protection layer PPL may not be separated in the area overlapping with the folding area FA. The fourth adhesive layer AL4b may extend from the first non-folding area NFA1 to the second non-folding area NFA2 via the folding area FA. The panel protection layer PPL may extend from the first non-folding area NFA1 to the second non-folding area NFA2 via the folding area FA. That is, the fourth adhesive layer AL4b disposed in the first non-folding area NFA1, the folding area FA, and the second non-folding area NFA2 may be integral. The panel protection layer PPL disposed in the first non-folding area NFA1, the folding area FA, and the second non-folding area NFA2 may be integral.

[0237] When the thickness and elastic modulus of the fourth adhesive layer AL4b and the panel protection layer PPL are increased to improve the impact resistance of the first non-folding area NFA1 and the second non-folding area NFA2, the thickness and elastic modulus of the fourth adhesive layer AL4b and the panel protection layer PPL overlapping the folding area FA may also be increased. Figure 1 )When folded, the electronic device ED may not be able to be folded easily.

[0238] However, in an embodiment of the present disclosure, the filling portion FCHd, FCHe or FCHf may be disposed between the first portion AL4-1 and the second portion AL4-2 separated from each other and between the first panel protective layer PPL1 and the second panel protective layer PPL2 separated from each other, and may overlap with the folding area FA. That is, the filling portion FCHd, FCHe or FCHf may be separated from the fourth adhesive layer AL4b and the panel protective layer PPL. Therefore, the filling portion FCHd, FCHe or FCHf having a thickness, elastic modulus and yield strain different from those of the fourth adhesive layer AL4b and the panel protective layer PPL may be disposed in the folding area FA. Therefore, the impact resistance of the first non-folding area NFA1 and the second non-folding area NFA2 may be improved, and the electronic device ED (reference Figure 1 ) can be easily folded.

[0239] FIG. 14A to FIG. 14C It is used to explain the manufacturing Fig.9A A view of a method of displaying a device is shown in FIG.

[0240] In an embodiment, for example, FIG. 14A to FIG. 14C is a cross-sectional view of the display device DD viewed in the second direction DR2.

[0241] exist Fig.9A Among the components shown in FIG. 1 , the remaining components except the window module WM, the display module DM, the fourth adhesive layer AL4a and the panel protection layer PPL are FIG. 14A to FIG. 14C is omitted.

[0242] For the convenience of description, the window module WM and the display module DM are FIG. 14A to FIG. 14C is briefly shown as one layer.

[0243] FIG. 14A to FIG. 14C The window module WM, the display module DM and the fourth adhesive layer AL4a are Fig.9A The window module WM, the display module DM, and the fourth adhesive layer AL4a are the same and thus will be omitted from the description or will be briefly described.

[0244] refer to Fig.14A , the window module WM may be disposed on the display module DM. A step of disposing a fourth adhesive layer AL4a on the lower surface of the display module DM may be performed. The fourth adhesive layer AL4a may contact the first non-folding area NFA1, the folding area FA, and the second non-folding area NFA2.

[0245] After the fourth adhesive layer AL4a is disposed on the lower surface of the display module DM, an initial panel protection layer PPLP may be disposed under the fourth adhesive layer AL4a. The initial panel protection layer PPLP may overlap the first non-folding area NFA1, the folding area FA, and the second non-folding area NFA2. The initial panel protection layer PPLP and the display module DM may be bonded to each other through the fourth adhesive layer AL4a.

[0246] After the initial panel protection layer PPLP is set, a process of etching the initial panel protection layer PPLP overlapping the folding area FA may be performed. In an embodiment, for example, the portion of the initial panel protection layer PPLP overlapping the folding area FA may be removed by ultraviolet light. However, not limited thereto, the portion of the initial panel protection layer PPLP may be removed by another process.

[0247] In an embodiment, for example, Fig. 14BIn the above description, it has been described that a portion of the initial panel protection layer PPLP is removed. However, it is not limited thereto, and a portion of the fourth adhesive layer AL4a overlapping the folding area FA may be removed.

[0248] When a portion of the initial panel protection layer PPLP is removed, the panel protection layer PPL may be divided in the first direction DR1. The first panel protection layer PPL1 and the second panel protection layer PPL2 may be formed in the first direction DR1.

[0249] refer to Fig. 14C , a filling portion FCHa may be provided between the first panel protection layer PPL1 and the second panel protection layer PPL2. The filling portion FCHa may be provided on the lower surface of the fourth adhesive layer AL4a. In an embodiment, for example, the filling portion FCHa may be filled by an inkjet method. However, not limited thereto, the filling portion FCHa may be filled by another method.

[0250] Although not shown, when the fourth adhesive layer AL4a overlapping the folding area FA is removed, as shown in FIG. Fig.13A As shown in FIG. 8 , the filling part FCHa may be directly disposed on the lower surface of the display module DM.

[0251] In an embodiment, for example, the filling part FCHa disposed between the first and second panel protection layers PPL1 and PPL2 may have a thickness less than that of the panel protection layer PPL. The height of the lower surface of the filling part FCHa may be greater than that of the panel protection layer PPL.

[0252] However, not limited thereto, the height of the lower surface of the filling part FCHa may be equal to the height of the lower surface of the panel protection layer PPL. Fig.11 The description has been made, and thus the description will be omitted.

[0253] Since the first panel protection layer PPL1 and the second panel protection layer PPL2 are separated from the filling part FCHa, the filling part FCHa having a thickness, elastic modulus, and yield strain different from those of the fourth adhesive layer AL4a and the panel protection layer PPL can be disposed in the folding area FA. Therefore, the impact resistance of the first non-folding area NFA1 and the second non-folding area NFA2 can be improved, and the electronic device ED (reference Figure 1 ) can be easily folded.

[0254] According to an embodiment of the present disclosure, a filling portion disposed in an area overlapping with a folding area may be disposed between panel protection layers overlapping with a non-folding area. The filling portion and the panel protection layer may include different materials and may have different elastic moduli. Therefore, the impact resistance of the non-folding area may be improved, and the folding area may be easily folded.

[0255] While the present disclosure has been described with reference to the embodiments thereof, it will be apparent to those skilled in the art that various changes and modifications can be made thereto without departing from the spirit and scope of the present disclosure as set forth in the appended claims.

Claims

1. Display equipment, including: The display panel includes a first non-folding area, a folding area, and a second non-folding area arranged in a first direction; A plurality of panel protection layers, disposed below the first non-folding area and the second non-folding area; as well as a filling portion, disposed between the plurality of panel protection layers and overlapping the folding area, Wherein, a height of a lower surface of the filling portion is greater than or equal to each of heights of lower surfaces of the plurality of panel protection layers.

2. The display device according to claim 1, further comprising: An adhesive layer is disposed between the plurality of panel protection layers and the display panel and between the filling part and the display panel.

3. The display device according to claim 2, wherein: The filling portion has an elastic modulus higher than an elastic modulus of the adhesive layer.

4. The display device according to claim 2, wherein: The filling portion comprises: A first filling portion disposed on a lower surface of the adhesive layer; and The second filling part is arranged on the lower surface of the first filling part.

5. The display device according to claim 4, wherein: A height of a lower surface of the second filling part is greater than or equal to each of the heights of the lower surfaces of the plurality of panel protection layers.

6. The display device according to claim 1, further comprising: an adhesive layer disposed between the plurality of panel protection layers and the display panel, The adhesive layer does not overlap the folding area, and the filling portion is directly disposed on the lower surface of the display panel.

7. The display device according to claim 6, wherein: The filling portion comprises: A third filling portion is directly disposed on the lower surface of the display panel; and The fourth filling part is directly arranged on the lower surface of the third filling part.

8. The display device according to claim 7, wherein: A height of a lower surface of the fourth filling part is greater than or equal to each of the heights of the lower surfaces of the plurality of panel protection layers.

9. The display device according to claim 1, wherein: The filling portion has an elastic modulus of 400 MPa to 1 Gpa.

10. The display device according to claim 9, wherein: The filling portion has a thickness of 80 micrometers to 110 micrometers.

11. The display device according to claim 10, wherein: The filling portion has a yield strain of 5.5% to 7%.

12. Display equipment, including: The display panel includes a first non-folding area, a folding area, and a second non-folding area arranged in a first direction; An adhesive layer, disposed under the display panel; a plurality of panel protection layers disposed below the adhesive layer and spaced apart from one another in the folding region; as well as a filling portion, disposed between the plurality of panel protection layers and overlapping the folding area, Wherein, the thickness of the filling portion is less than or equal to the sum of the thickness of the plurality of panel protection layers and the thickness of the adhesive layer.

13. The display device according to claim 12, wherein: A height of a lower surface of the filling part is greater than or equal to each of heights of lower surfaces of the plurality of panel protection layers.

14. The display device according to claim 13, wherein: the adhesive layer extends from the first non-folding area via the folding area to the second non-folding area, and Wherein, the filling part is arranged on the lower surface of the adhesive layer.

15. The display device according to claim 14, wherein: The filling portion comprises: a first filling portion disposed on the lower surface of the adhesive layer; and A second filling portion is disposed on a lower surface of the first filling portion, and Wherein, a height of a lower surface of the second filling portion is greater than or equal to each of the heights of the lower surfaces of the plurality of panel protection layers.

16. The display device according to claim 13, wherein: The adhesive layer comprises: a first portion overlapping the first unfolded region; and a second portion overlapping the second non-folding region, and The adhesive layer does not overlap the folding area, and the filling portion is directly disposed on the lower surface of the display panel.

17. The display device according to claim 16, wherein: The filling portion comprises: A third filling portion is directly disposed on the lower surface of the display panel; and a fourth filling portion, disposed on a lower surface of the third filling portion, and Wherein, a height of a lower surface of the fourth filling portion is greater than or equal to each of the heights of the lower surfaces of the plurality of panel protection layers.

18. The display device according to claim 12, wherein: The filling portion has an elastic modulus of 400 MPa to 1 Gpa, a thickness of 80 μm to 110 μm, and a yield strain of 5.5% to 7%.

19. A method for manufacturing a display device, the method comprising: disposing an adhesive layer under a display panel, the display panel comprising a first non-folding area, a folding area, and a second non-folding area arranged in a first direction; disposing an initial panel protection layer below the adhesive layer; forming a plurality of panel protection layers by removing a portion of the initial panel protection layer overlapping the folding region; as well as filling a filling portion in a space overlapping the folding area and defined between the panel protection layers, Wherein, a height of a lower surface of the filling portion is greater than or equal to each of heights of lower surfaces of the plurality of panel protection layers.

20. The method according to claim 19, wherein: removing the portion of the initial panel protection layer includes removing a portion of the adhesive layer disposed between the initial panel protection layer and the display panel and overlapping the folding area, and Wherein, the filling portion is directly arranged on the lower surface of the display panel.

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