Micro light emitting diode device package structure, package method, and display device

Abstract

The application provides a micro light emitting diode device packaging structure, a packaging method and a display device. The packaging structure comprises a packaging substrate, a micro light emitting diode device and a packaging shell. The micro light emitting diode device comprises a bonded micro light emitting diode chip and a driving chip. The packaging substrate comprises a bearing plate and a circuit board connected to each other. The bearing plate is arranged on and connected to one side of the driving chip away from the micro light emitting diode chip. The circuit board is electrically connected to the driving chip through an electrical connecting member. The packaging shell covers the micro light emitting diode device and part of the packaging substrate. The packaging shell comprises a hollow region and a light transmission region. The hollow region is arranged opposite to the electrical connecting member. The light transmission region is arranged opposite to the micro light emitting diode chip. Based on the above, the micro light emitting diode device packaging structure has better packaging integration, higher reliability and better aesthetics.

Description

Technical Field

[0001] This application relates to the field of semiconductor light-emitting technology, specifically to a micro light-emitting diode device packaging structure, packaging method, and display device. Background Technology

[0002] Micro-LED (Micro-Light Emitting Diode) display technology miniaturizes and arrays the traditional LED (Light Emitting Diode) structure, and uses CMOS (Complementary Metal Oxide Semiconductor) or TFT (Thin Film Transistor) to create the driving circuit, thereby achieving addressing control and individual driving of each pixel.

[0003] Micro-LEDs require encapsulation after fabrication, and their small overall size presents challenges for encapsulation. Therefore, the encapsulation methods for Micro-LEDs in related technologies need further improvement. Summary of the Invention

[0004] The purpose of this application is to provide a micro light-emitting diode (LED) device packaging structure, packaging method, and display device.

[0005] To address the aforementioned problems, in a first aspect, this application provides a miniature light-emitting diode (LED) device packaging structure, comprising:

[0006] A miniature light-emitting diode device, comprising a miniature light-emitting diode chip and a driver chip bonded together;

[0007] An encapsulation substrate includes a carrier plate and a circuit board connected to each other. The carrier plate is disposed on and connected to the side of the driver chip facing away from the micro LED chip. The circuit board is electrically connected to the driver chip via an electrical connector.

[0008] The encapsulation housing covers the micro LED device and part of the encapsulation substrate. The encapsulation housing includes a cutout area and a light-transmitting area. The cutout area is directly opposite the electrical connector, and the light-transmitting area is directly opposite the micro LED chip.

[0009] Optionally, the encapsulation housing further includes a bottom wall and a side wall that surrounds the bottom wall and protrudes from the bottom wall;

[0010] The encapsulation structure further includes a first encapsulating colloid and a second encapsulating colloid. The sidewall is connected to the encapsulation substrate through the first encapsulating colloid, and part of the bottom wall is connected to the driver chip through the second encapsulating colloid.

[0011] Optionally, both the first encapsulating colloid and the second encapsulating colloid have an annular structure.

[0012] Optionally, the packaging structure further includes:

[0013] A third encapsulating colloid is disposed within the encapsulation housing and encapsulates the electrical connector, and the third encapsulating colloid seals the hollow area.

[0014] Optionally, the packaging structure further includes:

[0015] A light-transmitting thin film structure is disposed on the side of the micro light-emitting diode chip facing away from the driving chip and opposite to the light-transmitting area.

[0016] Secondly, this application also provides a packaging method, including:

[0017] A miniature light-emitting diode device is provided, the miniature light-emitting diode device comprising a miniature light-emitting diode chip and a driver chip bonded together;

[0018] A packaging substrate is provided, the packaging substrate including a carrier plate and a circuit board connected together;

[0019] The carrier plate is disposed and connected to the side of the driver chip that is opposite to the micro light-emitting diode chip, and the circuit board is electrically connected to the driver chip through an electrical connector;

[0020] A packaging housing is provided, the packaging housing including a hollow area and a light-transmitting area;

[0021] The micro LED device and part of the packaging substrate are covered by the packaging shell, and the cutout area is aligned with the electrical connector and the light-transmitting area is aligned with the micro LED chip, thus obtaining the micro LED device packaging structure.

[0022] Optionally, the encapsulation housing includes a bottom wall and a side wall that surrounds the bottom wall and protrudes from the bottom wall;

[0023] The step of covering the micro LED device and part of the packaging substrate with the packaging housing includes:

[0024] The sidewall is connected to the packaging substrate via a first encapsulating colloid, and a portion of the bottom wall is connected to the driver chip via a second encapsulating colloid. The packaging shell covers the micro LED device and a portion of the packaging substrate. Both the first and second encapsulating colloids are annular structures.

[0025] Optionally, the encapsulation method further includes:

[0026] A third encapsulating colloid is filled into the encapsulation housing through the hollowed-out area, and the third encapsulating colloid wraps around the electrical connector and seals the hollowed-out area.

[0027] Optionally, the encapsulation method further includes:

[0028] A light-transmitting film structure is disposed on the side of the micro LED chip facing away from the driver chip, and the light-transmitting film structure is positioned directly opposite the light-transmitting area.

[0029] Thirdly, this application also provides a display device, including the micro light-emitting diode device packaging structure as described above; or, including the micro light-emitting diode device packaging structure prepared by the packaging method as described above.

[0030] Based on the above technical solution, the encapsulation shell of the micro-LED device packaging structure of this application covers the micro-LED device and part of the packaging substrate. The encapsulation shell protects the micro-LED device, reduces the adverse effects of moisture and other objects on the micro-LED device, and improves the reliability of the packaging structure. Furthermore, the encapsulation shell includes a hollow area facing the electrical connectors, which facilitates the filling of adhesive into the packaging structure and protects the electrical connectors connecting the circuit board and the driver chip, thus making subsequent manufacturing processes of the micro-LED device packaging structure more convenient. Simultaneously, the encapsulation shell also includes a light-transmitting area facing the micro-LED chip, which does not easily affect the light emission of the micro-LED chip. Moreover, the encapsulation shell of this application has a specific shape, which gives the micro-LED device packaging structure of this application superior packaging integration and aesthetics. Therefore, with the help of the encapsulation shell, the micro-LED device packaging structure of this application is easier to manufacture, and also has superior packaging integration, high reliability, and good aesthetics. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of this application. Those skilled in the art can obtain other drawings based on these drawings without any creative effort.

[0032] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0033] Figure 1 This is a schematic diagram of a first structure of the packaging structure of the miniature light-emitting diode device provided in the embodiments of this application;

[0034] Figure 2 This is a schematic diagram of the structure of a miniature light-emitting diode device provided in an embodiment of this application;

[0035] Figure 3 A schematic diagram illustrating the connection between a miniature light-emitting diode device and a packaging substrate, as provided in an embodiment of this application.

[0036] Figure 4 A schematic diagram of the connection of the first encapsulating colloid provided in the embodiments of this application;

[0037] Figure 5 This is a schematic diagram of a connection of the second encapsulating colloid provided in an embodiment of this application;

[0038] Figure 6 This is a schematic diagram of a second structure of the micro light-emitting diode device packaging structure provided in the embodiments of this application;

[0039] Figure 7 This is a schematic diagram of a third structure of the micro light-emitting diode device packaging structure provided in the embodiments of this application;

[0040] Figure 8 This is a schematic diagram of a fourth structure of the micro light-emitting diode device packaging structure provided in the embodiments of this application;

[0041] Figure 9 A top view schematic diagram of the packaging structure of the miniature light-emitting diode device provided in the embodiments of this application;

[0042] Figure 10 This is another top view schematic diagram of the micro light-emitting diode device packaging structure provided in the embodiments of this application;

[0043] Figure 11 This is a schematic diagram of a first embodiment of the encapsulation method provided in this application;

[0044] Figure 12This is a second flowchart illustrating the encapsulation method provided in the embodiments of this application;

[0045] Figure 13 This is a schematic diagram of a display device provided in an embodiment of this application.

[0046] The reference numerals in the attached figures are as follows:

[0047] 10. Miniature LED device packaging structure; 20. Display device; 100. Packaging substrate; 200. Miniature LED device; 300. Packaging shell; 400. First encapsulant; 500. Adhesive; 600. Second encapsulant; 700. Transparent film structure; 800. Third encapsulant; 900. Electrical connector; 101. Connection area; 110. Carrier plate; 120. Circuit board; 210. Miniature LED chip; 220. Driver chip; 310. Bottom wall; 320. Side wall; 330. Hollowed-out area; 340. Transparent area; 321. First side wall portion; 322. Second side wall portion. Detailed Implementation

[0048] The following will refer to the appendices in this application. Figure 1 To be continued Figure 13 The technical solutions in this application are clearly and completely described in conjunction with the embodiments. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0049] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0050] The following detailed description is based on specific embodiments. It should be noted that the embodiments of this application can be presented in various forms, and some examples will be described below.

[0051] Please refer to Figure 1 , Figure 1 This is a schematic diagram of a first structure of the micro-light-emitting diode (LED) device packaging structure 10 provided in an embodiment of this application. The micro-light-emitting diode (LED) device packaging structure 10 includes a packaging substrate 100, a micro-light-emitting diode (LED) device 200, and a packaging shell 300.

[0052] The encapsulation substrate 100 supports the micro-LED device 200 and the encapsulation housing 300. The micro-LED device 200 includes a micro-LED chip 210 and a driver chip 220 bonded together. The encapsulation substrate 100 includes a carrier plate 110 and a circuit board 120 connected together. The carrier plate 110 is disposed on and connected to the side of the driver chip 220 opposite to the micro-LED chip 210. The circuit board 120 is electrically connected to the driver chip 220 via an electrical connector 900. The encapsulation housing 300 covers the micro-LED device 200 and part of the encapsulation substrate 100. The encapsulation housing 300 includes a cutout area 330 and a light-transmitting area 340. The cutout area 330 is directly opposite the electrical connector 900, and the light-transmitting area 340 is directly opposite the micro-LED chip 210.

[0053] It is understandable that the miniature light-emitting diode device 200 has a single-chip integrated structure. For example... Figure 2 and Figure 3 As shown, Figure 2 This is a schematic diagram of a structure of the miniature light-emitting diode device 200 provided in an embodiment of this application. Figure 3 This is a schematic diagram illustrating a structure in which the miniature light-emitting diode (LED) device 200 provided in this application is connected to the packaging substrate 100. The miniature LED chip 210 and the driver chip 220 of the miniature LED device 200 are stacked on the packaging substrate 100. The driver chip 220 is located between the miniature LED chip 210 and the packaging substrate 100, with the miniature LED chip 210 located on the side of the driver chip 220 facing away from the packaging substrate 100. The driver chip 220 is bonded to the miniature LED chip 210, and the driver chip 220 provides an electrical signal to the miniature LED chip 210, causing the miniature LED chip 210 to emit light.

[0054] It is understood that the carrier plate 110 is used to support the miniature light-emitting diode device 200, and the driver chip 220 can be connected to the carrier plate 110 by, but is not limited to, adhesive 500. The circuit board 120 is disposed on the same side of the carrier plate 110 as the miniature light-emitting diode device 200, and the circuit board 120 is stacked and connected on the carrier plate 110. In some examples, part of the circuit board 120 is connected to the carrier plate 110, while another part of the circuit board 120 extends outside the carrier plate 110 and is used for electrical connection with external circuits to receive electrical signals and control signals provided by external circuits.

[0055] Understandably, in some examples, the carrier plate 110 is a heat dissipation substrate, which can increase the heat dissipation of the micro LED device package structure 10. In some examples, the circuit board 120 can be a flexible circuit board, for example, a flexible flat cable structure. Flexible circuit boards are lighter, more reliable, and easier to transport. The driver chip 220 can be electrically connected to the circuit board 120 via an electrical connector 900. The driver chip 220 can receive electrical signals and control signals transmitted from the circuit board 120, thereby controlling the micro LED chip 210 to emit light. The electrical connector 900 can be, but is not limited to, a conductive gold wire, conductive copper wire, conductive aluminum wire, etc.

[0056] It is understood that the encapsulation housing 300 can be placed over the micro LED device 200. The encapsulation housing 300 is a housing structure with a certain shape. The cutout area 330 of the encapsulation housing 300 is directly opposite the electrical connector 900. "Directly opposite" means that the orthogonal projection of the cutout area 330 onto the carrier plate 110 covers the orthogonal projection of the electrical connector 900 onto the carrier plate 110. The driver chip 220, electrical connector 900, circuit board 120, and encapsulation housing 300 can form a connection area 101. The electrical connector 900 is located within this connection area 101. The cutout area 330 of the encapsulation housing 300 is directly opposite this connection area 101. This cutout area 330 facilitates the micro LED device encapsulation structure 10 filling the connection area 101 with adhesive and protecting the electrical connector 900.

[0057] It is understandable that the light-transmitting area 340 of the encapsulation housing 300 is spaced apart from the cutout area 330. The light-transmitting area 340 is positioned directly opposite the micro LED chip 210, and the orthogonal projection of the light-transmitting area 340 onto the carrier plate 110 can cover the orthogonal projection of the micro LED chip 210 onto the carrier plate 110. In this case, the light-transmitting area 340 does not easily block the light emission of the micro LED chip 210.

[0058] It is understood that the encapsulation shell 300 of this application differs from the adhesive structure formed after the adhesive solidifies in related technologies. Related technologies often involve filling the surfaces of the micro-LED device and the encapsulation substrate with adhesive, thus encapsulating the micro-LED device and the connection area between the micro-LED device and the encapsulation substrate. However, this encapsulation method in related technologies requires high precision in the encapsulation process, leading to difficulties in manufacturing the encapsulation structure. Furthermore, this encapsulation method results in an excessively wide bezel of the micro-LED device, increasing the product's structural size and hindering miniaturization design of the encapsulation structure, as well as its compatibility and assembly with optomechanical systems. Moreover, adhesive encapsulation in related technologies often requires multiple dispensing processes, making it difficult to guarantee the aesthetic appearance of the solidified adhesive. Additionally, the adhesive encapsulation method offers low protection for the micro-LED device, allowing air and moisture to easily enter the adhesive and affect the micro-LED device, resulting in lower product reliability.

[0059] The micro LED device packaging structure 10 of this application has a packaging shell 300 covering the micro LED device 200 and part of the packaging substrate 100. The packaging shell 300 can protect the micro LED device 200, reduce the adverse effects of moisture and other objects on the micro LED device 200, and improve the reliability of the micro LED device packaging structure 10. Furthermore, the packaging shell 300 includes a cutout area 330 opposite to the electrical connector 900, which facilitates the micro LED device packaging structure 10. The encapsulation housing 300 is filled with adhesive and protects the electrical connector 900, thereby facilitating subsequent manufacturing processes of the micro-LED device packaging structure 10. Simultaneously, the packaging housing 300 includes a light-transmitting area 340 directly opposite the micro-LED chip 210, which does not easily affect the light emission of the micro-LED chip 210. Furthermore, the packaging housing 300 of this application has a specific shape, which gives the micro-LED device packaging structure 10 superior packaging integrity and aesthetics. Based on this, with the help of the packaging housing 300, the micro-LED device packaging structure 10 is easier to manufacture in subsequent processes, and also possesses superior packaging integrity, higher reliability, and better aesthetics.

[0060] In some embodiments, the encapsulation housing 300 further includes a bottom wall 310 and a side wall 320 that surrounds the periphery of the bottom wall 310 and protrudes from the bottom wall 310. The side wall 320 can be connected to the encapsulation substrate 100 through the first encapsulating adhesive 400. The bottom wall 310 is located above the micro light-emitting diode device 200 away from the encapsulation substrate 100. The micro light-emitting diode device 200 is located inside the enclosed area formed by the side wall 320 and the bottom wall 310 of the encapsulation housing 300. The encapsulation housing 300 can encapsulate the micro light-emitting diode device 200.

[0061] It is understandable that, such as Figure 4 As shown, Figure 4 This is a schematic diagram illustrating a connection of the first encapsulating colloid 400 provided in an embodiment of this application. The first encapsulating colloid 400 can be pre-deposited on the encapsulation substrate 100, and then the encapsulation substrate 100 is connected to the encapsulation housing 300 through the first encapsulating colloid 400. The first encapsulating colloid 400 can be annular, and the annular structure of the first encapsulating colloid 400 can be adapted to the sidewall 320 of the encapsulation housing 300. The first encapsulating colloid 400 can better seal the gap between the sidewall 320 of the encapsulation housing 300 and the encapsulation substrate 100, thereby improving the encapsulation reliability of the micro-LED device encapsulation structure 10.

[0062] The sidewall 320 of the encapsulation shell 300 of the micro LED device encapsulation structure 10 of this application is connected to the encapsulation substrate 100 through the first encapsulating adhesive 400. The bottom wall 310 of the encapsulation shell 300 is disposed on the side of the micro LED device 200 away from the encapsulation substrate 100. The encapsulation shell 300 can cover the micro LED device 200 and place the micro LED device 200 within the accommodating space formed by the bottom wall 310 and the sidewall 320 of the encapsulation shell 300. The encapsulation shell 300 can protect the micro LED device 200 and reduce the interference of the micro LED device 200 from external objects. At the same time, the encapsulation shell 300 can also play a blocking and sealing role, which can reduce the influence of moisture on the micro LED device 200 and improve the reliability of the encapsulation structure.

[0063] Please continue to refer to the following: Figures 1 to 4In some examples, a portion of the sidewall of the encapsulation housing 300 is connected to the circuit board 120 of the encapsulation substrate 100 via a first encapsulating adhesive 400, and another portion of the sidewall of the encapsulation housing 300 is connected to the carrier plate 110 of the encapsulation substrate 100 via the first encapsulating adhesive 400. The first encapsulating adhesive 400 can be simultaneously disposed on both the circuit board 120 and the carrier plate 110. Considering that the circuit board 120 is disposed on the carrier plate 110, there is a height difference between the connection surface of the circuit board 120 and the first encapsulating adhesive 400 and the connection surface of the carrier plate 110 and the first encapsulating adhesive 400. In this embodiment, the sidewall 320 of the encapsulation housing 300 includes a first sidewall portion 321 and a second sidewall portion 322. The maximum distance between the second sidewall portion 322 and the bottom wall 310 is greater than the maximum distance between the first sidewall portion 321 and the bottom wall 310, and the second sidewall portion 322 is higher than the first sidewall portion 321. The first sidewall portion 321 is connected to the circuit board 120 via the first encapsulating adhesive 400, and the second sidewall portion 322 is connected to the carrier plate 110 via the first encapsulating adhesive 400.

[0064] It is understood that the first encapsulating colloid 400 in this embodiment can be a ring structure with a certain height difference to adapt to the circuit board 120 and the carrier plate 110 with a height difference. Under the action of the first sidewall portion 321 and the second sidewall portion 322, the thickness of different regions of the first encapsulating colloid 400 can be the same or substantially the same, and the first encapsulating colloid 400 can be a colloid structure with relatively uniform thickness.

[0065] The encapsulation housing 300 of this application embodiment is provided with a first sidewall portion 321 and a second sidewall portion 322 with different heights. The two sidewall portions with height difference can be adapted to the circuit board 120 and the carrier plate 110 with height difference. The height difference between the second sidewall portion 322 and the first sidewall portion 321 can compensate for the height difference between the circuit board 120 and the carrier plate 110. As a result, the connection stability between the encapsulation housing 300 and the circuit board 120 and the carrier plate 110 is better. At the same time, this application does not require a first encapsulating adhesive 400 to compensate for the height difference between the circuit board 120 and the carrier plate 110, which can reduce the amount of adhesive used in the first encapsulating adhesive 400. The first encapsulating adhesive 400 can be an adhesive structure with a relatively uniform thickness, and the sealing performance of the first encapsulating adhesive 400 is better.

[0066] In some embodiments, the encapsulation structure further includes a second encapsulating colloid 600. (Please refer to...) Figures 1 to 4 Please refer to Figure 5 and Figure 6 , Figure 5 This is a schematic diagram of a connection of the second encapsulating colloid 600 provided in an embodiment of this application. Figure 6This is a schematic diagram of a second structure of the micro LED device packaging structure 10 provided in the embodiments of this application. Part of the bottom wall 310 is connected to the micro LED device 200 through the second encapsulant 600.

[0067] It is understood that the size of the micro-LED chip 210 in the micro-LED device 200 is often smaller than the size of the driver chip 220. This application may provide a second encapsulating colloid 600 in an area of ​​the driver chip 220 not covered or obstructed by the micro-LED chip 210. In this case, the second encapsulating colloid 600 is less likely to affect the light emission of the micro-LED chip 210, and the second encapsulating colloid 600 is less likely to add an additional "black border area" to the micro-LED device 200.

[0068] It is understandable that the second encapsulating colloid 600 can be a ring structure, and the ring-shaped second encapsulating colloid 600 can surround the micro-LED device 200, with the micro-LED device 200 located within the area enclosed by the second encapsulating colloid 600. In this case, the second encapsulating colloid 600 located around the micro-LED device 200 can reduce the entry of moisture into the micro-LED device 200, thus reducing its impact on the performance of the micro-LED device 200. The ring-shaped second encapsulating colloid 600 can further improve the encapsulation reliability of the micro-LED device encapsulation structure 10.

[0069] It is understood that the material of the second encapsulating colloid 600 is the same as that of the first encapsulating colloid 400, or the material of the second encapsulating colloid 600 is different from that of the first encapsulating colloid 400. At least one of the first encapsulating colloid 400 and the second encapsulating colloid 600 may be, but is not limited to, silicone potting compound, epoxy resin potting compound, or other colloids.

[0070] It is understandable that the thickness of both the first encapsulating colloid 400 and the second encapsulating colloid 600 is greater than 0 and less than or equal to 50 micrometers (μm). For example, the thickness of the first encapsulating colloid 400 or the second encapsulating colloid 600 is approximately 10μm, 20μm, 30μm, 40μm, or 50μm. In this case, the first encapsulating colloid 400 and the second encapsulating colloid 600 are less likely to make the overall thickness of the micro-LED device packaging structure 10 too thick, which would be detrimental to the thin and light design of the micro-LED device packaging structure 10.

[0071] In the micro LED device packaging structure 10 of this application embodiment, the sidewall 320 of the packaging shell 300 is connected to the packaging substrate 100 through a first encapsulating colloid 400, and the bottom wall 310 of the packaging shell 300 is connected to the micro LED device 200 through a second encapsulating colloid 600. On the one hand, the connection between the packaging shell 300, the packaging substrate 100, and the micro LED device 200 is more secure, and the structure of the micro LED device packaging structure 10 is more stable. On the other hand, the packaging shell 300 can protect the micro LED device 200, and the first encapsulating colloid 400 and the second encapsulating colloid 600 can further improve the sealing and waterproof performance of the packaging structure, and the reliability of the micro LED device packaging structure 10 is better.

[0072] Please refer to the following: Figure 7 , Figure 7 This is a schematic diagram of a third structure of the micro-LED device packaging structure 10 provided in this application embodiment. The micro-LED device packaging structure 10 also includes a light-transmitting film structure 700. The light-transmitting film structure 700 is disposed on the side of the micro-LED chip 210 facing away from the driver chip 220, and the light-transmitting film structure 700 is disposed opposite to the light-transmitting area 340. The light-transmitting film structure 700 can protect the micro-LED chip 210.

[0073] It is understandable that the light-transmitting film structure 700 can be, but is not limited to, pasted on the side of the micro LED chip 210 away from the driver chip 220, so that the light-transmitting film structure 700 can better fit with the micro LED chip 210.

[0074] It is understood that the light-transmitting film structure 700 can be, but is not limited to, a glass film structure, an adhesive film structure, etc. The light emitted by the micro light-emitting diode device 200 can pass through the light-transmitting film structure 700 and be emitted outward, and the light-transmitting film structure 700 does not easily block or affect the light emitted by the micro light-emitting diode device 200.

[0075] It is understood that the thickness of the light-transmitting film structure 700 is much smaller than the thickness of the bottom wall 310 of the packaging shell 300. For example, the thickness of the light-transmitting film structure 700 is greater than 0 and less than or equal to 50 μm. Further, the thickness of the light-transmitting film structure 700 is approximately 10 μm, 20 μm, 30 μm, 40 μm, or 50 μm. The thinner light-transmitting film structure 700 in this application can reduce the optical loss when light passes through the light-transmitting film structure 700, thereby ensuring the light-emitting performance of the micro LED chip 210.

[0076] In this embodiment, a light-transmitting film structure 700 is provided on the side of the micro light-emitting diode chip 210 that is away from the driver chip 220. The light-transmitting film structure 700 is not likely to affect the light emission of the micro light-emitting diode device 200 and can also protect the micro light-emitting diode chip 210.

[0077] In some embodiments, the light-transmitting area 340 provided on the bottom wall 310 of the encapsulation housing 300 can be a through hole extending through the thickness direction of the bottom wall 310. In this case, in terms of manufacturing process, the light-transmitting film structure 700 can be bonded to the side of the micro LED chip 210 facing away from the driver chip 220 from the light-transmitting area 340, making the assembly of the light-transmitting film structure 700 more convenient. Furthermore, a sealing operation can be performed on the area adjacent to the light-transmitting film structure 700 and the encapsulation housing 300, for example, but not limited to filling with sealant, to achieve a seal between the encapsulation housing 300 and the micro LED chip 210.

[0078] In some embodiments, the light-transmitting area 340 of the encapsulation housing 300 can be a non-through-hole structure, meaning the light-transmitting area 340 does not penetrate the bottom wall 310 along its thickness direction. In this case, in the manufacturing process, the light-transmitting film structure 700 can be first disposed on the side of the micro-LED chip 210 facing away from the driver chip 220 to achieve assembly of the light-transmitting film structure 700 and the micro-LED device 200; then the assembled structure is assembled with the encapsulation substrate 100, and subsequently with the encapsulation housing 300. Alternatively, the micro-LED device 200 can be first connected to the encapsulation substrate 100, then the light-transmitting film structure 700 is assembled with the micro-LED device 200, and finally assembled with the encapsulation housing 300.

[0079] The encapsulation housing 300 of this application embodiment is provided with a light-transmitting area 340. On the one hand, the light-transmitting area 340 is less likely to affect the light emission of the micro light-emitting diode device 200; on the other hand, the light-transmitting area 340 is part of the encapsulation housing 300, and the structural strength of the encapsulation housing 300 is high; at the same time, the encapsulation housing 300 has a better sealing effect on the micro light-emitting diode device 200, and moisture is less likely to enter the interior of the encapsulation housing 300 and affect the performance of the micro light-emitting diode device 200, so the reliability of the micro light-emitting diode device encapsulation structure 10 is better.

[0080] It should be noted that the entire packaging shell 300 in this embodiment can be a light-transmitting structure, meaning that the portion of the packaging shell 300 other than the light-transmitting area 340 can also transmit light. In this case, the appearance consistency of the packaging shell 300 is better.

[0081] Please refer to the following: Figures 8 to 10 , Figure 8This is a schematic diagram of the fourth structure of the micro light-emitting diode device packaging structure 10 provided in the embodiments of this application. Figure 9 This is a top view schematic diagram of the micro light-emitting diode device packaging structure 10 provided in the embodiments of this application. Figure 10 This is another top view schematic diagram of the micro LED device packaging structure 10 provided in the embodiments of this application. The micro LED device packaging structure 10 also includes a third encapsulant 800, which is disposed within the connection area 101 formed by the packaging housing 300, the packaging substrate 100, and the micro LED device 200. The third encapsulant 800 encapsulates the electrical connector 900 that is electrically connected to the driver chip 220 and the circuit board 120.

[0082] It is understood that the third encapsulating colloid 800 is a non-conductive (insulating) colloid structure. At least two of the third encapsulating colloid 800, the first encapsulating colloid 400, and the second encapsulating colloid 600 are made of the same material, or all three colloids are made of different materials.

[0083] The miniature light-emitting diode device packaging structure 10 of this application embodiment is provided with a third encapsulating colloid 800. The third encapsulating colloid 800 can seal and protect the electrical connector 900, and prevent the connection between the electrical connector 900 and the driver chip 220 and the circuit board 120 from being corroded by moisture. The third encapsulating colloid 800 can further improve the reliability of the miniature light-emitting diode device packaging structure 10.

[0084] In some examples, the third encapsulating colloid 800 can fill the connection area 101 through the hollow area 330 on the bottom wall 310 of the encapsulation housing 300, and at the same time, the third encapsulating colloid 800 can seal the hollow area 330.

[0085] It is understood that the hollowed-out area 330 can penetrate the bottom wall 310 along its thickness direction, and the size of the hollowed-out area 330 can be determined according to the actual situation. For example, the size of the hollowed-out area 330 can be equivalent to the cross-sectional area of ​​the enclosed area.

[0086] Understandably, the filling height of the third encapsulating colloid 800 does not exceed the outer surface of the bottom wall 310 of the encapsulation housing 300. Furthermore, the third encapsulating colloid 800 can be flush with the outer surface of the bottom wall 310 of the encapsulation housing 300, and the third encapsulating colloid 800 and the encapsulation housing 300 are connected as a whole, so that the appearance of the encapsulation housing 300 is consistent.

[0087] The third encapsulating colloid 800 of this application embodiment fills the connecting area 101 through the hollow area 330, and the manufacturing process of the third encapsulating colloid 800 is simpler.

[0088] Based on the above description, the encapsulation shell 300 of the micro LED device encapsulation structure 10 provided in this application embodiment is connected to the encapsulation substrate 100 through the first encapsulating adhesive 400, and the encapsulation shell 300 can protect the micro LED device 200. At the same time, the encapsulation shell 300 is provided with a first sidewall portion 321 and a second sidewall portion 322 with different heights, which can compensate for the height difference between the circuit board 120 and the carrier plate 110. This not only makes the connection stability between the encapsulation shell 300 and the circuit board 120 and the carrier plate 110 better, but also reduces the amount of adhesive used in the first encapsulating adhesive 400 and improves the sealing performance of the first encapsulating adhesive 400. Furthermore, a portion of the bottom wall 310 of the encapsulation housing 300 is connected to the micro-LED device 200 via the second encapsulating colloid 600, which further increases the connection strength between the encapsulation housing 300 and the encapsulation substrate 100 and the micro-LED device 200. Additionally, the electrical connector 900, which electrically connects the driver chip 220 and the circuit board 120, is wrapped by the third encapsulating colloid 800, which provides sealing protection for the electrical connector 900. Simultaneously, a light-transmitting film structure 700 is provided on the side of the micro-LED chip 210 facing away from the driver chip 220, which protects the micro-LED chip 210. Based on these features, the micro-LED device encapsulation structure 10 of this application exhibits superior encapsulation integration, higher reliability, and better aesthetics.

[0089] Based on the description of the micro LED device packaging structure 10 above, this application also provides a packaging method. Please refer to... Figure 11 , Figure 11 This is a schematic diagram of the first process of the encapsulation method provided in the embodiments of this application.

[0090] In S101, a miniature light-emitting diode device 200 is provided, which includes a miniature light-emitting diode chip 210 and a driver chip 220 bonded together.

[0091] like Figure 2 and Figure 3 As shown, the micro LED device 200 has a single-chip bonding structure, and the driver chip 220 of the micro LED device 200 is bonded to the micro LED chip 210.

[0092] In S102, a packaging substrate 100 is provided, which includes a carrier plate 110 and a circuit board 120 connected to each other.

[0093] In S103, the carrier plate 110 is set and connected to the side of the driver chip 220 that is away from the micro light-emitting diode chip 210, and the circuit board 120 is electrically connected to the driver chip 220 through the electrical connector 900.

[0094] The carrier plate 110 supports the miniature light-emitting diode (LED) device 200. The driver chip 220 and the miniature LED chip 210 are stacked on the carrier plate 110, with the driver chip 220 located between the miniature LED chip 210 and the carrier plate 110. The circuit board 120 is disposed on the carrier plate 110 and spaced apart from the driver chip 220. The circuit board 120 is used for electrical connection to external circuits. The driver chip 220 is electrically connected to the circuit board 120 via an electrical connector 900. The driver chip 220 can receive electrical signals and control signals transmitted from the circuit board 120, thereby controlling the miniature LED chip 210 to emit light.

[0095] In S104, a package housing 300 is provided, which includes a cutout area 330 and a light-transmitting area 340.

[0096] like Figure 1 As shown, the sidewall 320 and bottom wall 310 of the encapsulation housing 300 cooperate to make the encapsulation housing 300 a housing structure with a certain accommodating space and a certain shape. This housing structure is different from the glue structure formed after the glue has solidified. Among them, the hollow area 330 and the light-transmitting area 340 are formed on the bottom wall 310, and the hollow area 330 and the light-transmitting area 340 are arranged alternately.

[0097] In S105, the package housing 300 covers the micro LED device 200 and part of the package substrate 100, and the cutout area 330 is positioned opposite the electrical connector 900, and the light-transmitting area 340 is positioned opposite the micro LED chip 210, thus obtaining the micro LED device package structure 10.

[0098] It is understandable that the orthographic projection of the hollow area 330 onto the carrier plate 110 can cover the orthographic projection of the electrical connector 900 onto the carrier plate 110, and the orthographic projection of the light-transmitting area 340 onto the carrier plate 110 can cover the orthographic projection of the micro LED chip 210 onto the carrier plate 110.

[0099] The packaging method of this application prepares a micro-LED device packaging structure 10 with a packaging shell 300 covering the micro-LED device 200 and part of the packaging substrate 100. The packaging shell 300 protects the micro-LED device 200, reduces the influence of moisture and other objects on the micro-LED device 200, and improves the reliability of the micro-LED device packaging structure 10. Furthermore, the packaging shell 300 includes a cutout area 330 facing the electrical connector 900 and a light-transmitting area 340 facing the micro-LED chip 210. The 300 area facilitates the filling of adhesive into the micro-LED device packaging structure 10 and protects the connecting electrical connectors 900, thereby improving the sealing safety of the micro-LED device packaging structure 10. The light-transmitting area 340 does not easily affect the light emission of the micro-LED chip 210, and the packaging shell 300 better balances the light emission performance and sealing safety performance of the micro-LED device packaging structure 10. Furthermore, the packaging shell 300 of this application is a shell structure with a specific shape, which gives the micro-LED device packaging structure 10 of this application superior packaging integration. Based on this, under the action of the packaging shell 300, the micro-LED device packaging structure 10 of this application has superior packaging integration, higher reliability, and better aesthetics.

[0100] In some embodiments, the encapsulation housing 300 includes a bottom wall 310 and a side wall 320 that surrounds the periphery of the bottom wall 310 and protrudes from the bottom wall 310. Step 105, the step of covering the micro-LED device 200 and part of the encapsulation substrate 100 with the encapsulation housing 300, includes: connecting the side wall 320 to the encapsulation substrate 100 via a first encapsulating adhesive 400, connecting part of the bottom wall 310 to the micro-LED device 200 via a second encapsulating adhesive 600, and covering the micro-LED device 200 and part of the encapsulation substrate 100 with the encapsulation housing 300.

[0101] It is understandable that, such as Figures 1 to 4 As shown, the first encapsulating agent 400 can be disposed on the encapsulation substrate 100. The sidewall 320 of the encapsulation housing 300 is connected to the encapsulation substrate 100 through the first encapsulating agent 400. Figures 5 to 8 As shown, a second encapsulating colloid 600 is provided in the area of ​​the driver chip 220 that is not covered or blocked by the micro LED chip 210, and part of the bottom wall 310 can be connected to the micro LED device 200 through the second encapsulating colloid 600. At this time, the second encapsulating colloid 600 does not easily affect the light emission of the micro LED chip 210, and the second encapsulating colloid 600 does not easily add an extra "black edge area" to the micro LED device 200.

[0102] Understandably, in some examples, the first encapsulant 400 can be a ring structure, and the second encapsulant 600 can also be a ring structure. The ring-shaped first encapsulant 400 can be adapted to the sidewall 320 of the encapsulation housing 300, and the ring-shaped second encapsulant 600 can be adapted to the bottom wall 310 of the encapsulation housing 300. Thus, the ring-shaped first encapsulant 400 can improve the encapsulation reliability of the micro LED device encapsulation structure 10.

[0103] In the encapsulation method of this application, the sidewall 320 of the encapsulation housing 300 is connected to the encapsulation substrate 100 through a first encapsulating agent 400, and the bottom wall 310 of the encapsulation housing 300 is disposed on the side of the micro-light-emitting diode device 200 away from the encapsulation substrate 100 and is connected to the area of ​​the driver chip 220 not covered or blocked by the micro-light-emitting diode chip 210 through a second encapsulating agent 600. The encapsulation housing 300 can cover the micro-light-emitting diode device 200 and place the micro-light-emitting diode device 200 inside the encapsulation housing 300. On the one hand, the encapsulation housing 300 can protect the micro-light-emitting diode device 200 and reduce the interference of the micro-light-emitting diode device 200 from external objects; on the other hand, the encapsulation housing 300 can act as a barrier, reducing the impact of moisture on the micro-light-emitting diode device 200 and improving the reliability of the encapsulation structure. Based on this, the micro-light-emitting diode device encapsulation structure 10 prepared by the encapsulation method of this application has superior encapsulation integrity, reliability, and aesthetics.

[0104] In some examples, the packaging method further includes: setting a light-transmitting film structure 700 on the side of the micro LED chip 210 facing away from the driver chip 220, and positioning the light-transmitting film structure 700 directly opposite the light-transmitting area 340. In this case, the light-transmitting film structure 700 is less likely to affect the light emission of the micro LED device 200, and can also protect the micro LED chip 210.

[0105] In some examples, the encapsulation method further includes filling the connection area 101 with a third encapsulating colloid 800 through the cutout area 330, and encapsulating the electrical connector 900 with the third encapsulating colloid 800, thus sealing the cutout area 330. In this case, the third encapsulating colloid 800 seals and protects the electrical connector 900, preventing corrosion from moisture at the connection points between the electrical connector 900 and the driver chip 220 and the circuit board 120. This third encapsulating colloid 800 further improves the reliability of the micro-LED device encapsulation structure 10.

[0106] In some examples, the sidewall 320 of the encapsulation housing 300 includes a first sidewall portion 321 and a second sidewall portion 322, and the maximum distance between the second sidewall portion 322 and the bottom wall 310 is greater than the maximum distance between the first sidewall portion 321 and the bottom wall 310. The encapsulation method further includes connecting the first sidewall portion 321 to the circuit board 120 via a first encapsulating adhesive 400, and connecting the second sidewall portion 322 to the carrier plate 110 via the first encapsulating adhesive 400. In this case, the height difference between the second sidewall portion 322 and the first sidewall portion 321 can compensate for the height difference between the circuit board 120 and the carrier plate 110. This application eliminates the need for the first encapsulating adhesive 400 to compensate for the height difference between the circuit board 120 and the carrier plate 110, thus reducing the amount of adhesive used in the first encapsulating adhesive 400.

[0107] Based on the above explanation, please refer to Figure 12 , Figure 12 This is a second flowchart illustrating the encapsulation method provided in an embodiment of this application.

[0108] In S201, a miniature light-emitting diode device 200 and a packaging substrate 100 are provided; the miniature light-emitting diode device 200 is disposed and connected to the packaging substrate 100.

[0109] like Figures 1 to 3 As shown, the miniature light-emitting diode device 200 has a single-chip bonding structure, comprising a miniature light-emitting diode chip 210 and a driver chip 220, which are bonded together. The packaging substrate 100 includes a carrier plate 110 and a circuit board 120. The circuit board 120 is used for electrical connection to external circuits. The driver chip 220 is electrically connected to the circuit board 120 via an electrical connector 900. The driver chip 220 can receive electrical signals and control signals transmitted from the circuit board 120, thereby controlling the miniature light-emitting diode chip 210 to emit light.

[0110] In S202, a package housing 300 is provided. The package housing 300 includes a bottom wall 310, a side wall 320 that surrounds the periphery of the bottom wall 310 and protrudes from the bottom wall 310, a cutout area 330 formed on the bottom wall 310, and a light-transmitting area 340.

[0111] like Figure 1 As shown, the sidewall 320 and bottom wall 310 of the encapsulation housing 300 cooperate to make the encapsulation housing 300 a housing structure with a certain accommodating space and a certain shape. This housing structure is different from the glue structure formed after the glue has solidified.

[0112] In S203, a first encapsulating colloid 400 is disposed on the encapsulation substrate 100, and a second encapsulating colloid 600 is disposed on the micro light-emitting diode device 200.

[0113] The first encapsulant 400 can be disposed on the circuit board 120 and the carrier plate 110 of the encapsulation substrate 100. The first encapsulant 400 can be a ring structure, and further, the first encapsulant 400 can be a ring structure with a certain height difference to adapt to the circuit board 120 and the carrier plate 110 with a height difference.

[0114] The second encapsulating colloid 600 can be disposed in an area of ​​the driver chip 220 that is not covered or obstructed by the micro-LED chip 210. The second encapsulating colloid 600 can be a ring structure. The material of the second encapsulating colloid 600 may be the same as or different from that of the first encapsulating colloid 400.

[0115] In S204, the sidewall 320 of the encapsulation housing 300 is connected to the encapsulation substrate 100 through the first encapsulation colloid 400, and the bottom wall 310 of the encapsulation housing 300 is covered on the side of the micro light-emitting diode device 200 away from the encapsulation substrate 100, and a portion of the bottom wall 310 of the encapsulation housing 300 is connected to the micro light-emitting diode device 200 through the second encapsulation colloid 600.

[0116] In this step, the first sidewall portion 321 of the encapsulation housing 300 is connected to the circuit board 120 through the first encapsulation adhesive 400, and the second sidewall portion 322 of the encapsulation housing 300 is connected to the carrier plate 110 through the first encapsulation adhesive 400, so as to realize the connection between the encapsulation housing 300 and the encapsulation substrate 100.

[0117] In S205, the third encapsulant 800 is filled into the accommodating space through the hollow area 330 of the encapsulation housing 300, and the third encapsulant 800 wraps the electrical connector 900.

[0118] In this step, the dispensing machine fills the accommodating space with the third encapsulating adhesive 800 through the cutout area 330. In some examples, the filling height of the third encapsulating adhesive 800 does not exceed the outer surface of the bottom wall 310 of the encapsulation housing 300. Furthermore, the third encapsulating adhesive 800 can be flush with the outer surface of the bottom wall 310 of the encapsulation housing 300.

[0119] It is understood that the third encapsulating colloid 800 is an insulating colloid structure. At least one of the third encapsulating colloid 800, the first encapsulating colloid 400, and the second encapsulating colloid 600 may be made of the same material, or all three colloids may be made of different materials.

[0120] In S206, a light-transmitting film structure 700 is provided on the side of the micro light-emitting diode chip 210 that is away from the driver chip 220, and the light-transmitting film structure 700 is positioned opposite to the light-transmitting area 340, thus obtaining the micro light-emitting diode device packaging structure 10.

[0121] The light-transmitting film structure 700 can be, but is not limited to, adhered to the side of the micro LED chip 210 facing away from the driver chip 220. The light-transmitting film structure 700 can be, but is not limited to, a glass film structure, an adhesive film structure, etc.

[0122] It is understood that in some embodiments, the light-transmitting region 340 can be a through-hole penetrating the thickness direction of the bottom wall 310 of the encapsulation housing 300. In this case, during the manufacturing process, the light-transmitting film structure 700 can be attached to the side of the micro-LED chip 210 facing away from the driver chip 220 from the light-transmitting region 340, making the assembly of the light-transmitting film structure 700 more convenient. In other embodiments, the light-transmitting region 340 can be a non-through-hole type structure. In this case, during the manufacturing process, the light-transmitting film structure 700 can be first disposed on the side of the micro-LED chip 210 facing away from the driver chip 220 to achieve the assembly of the light-transmitting film structure 700 and the micro-LED device 200; then the assembled structure is assembled with the encapsulation substrate 100, and subsequently with the encapsulation housing 300. Alternatively, this step can also be to first connect the micro-LED device 200 to the encapsulation substrate 100, then assemble the light-transmitting film structure 700 with the micro-LED device 200, and finally assemble it with the encapsulation housing 300.

[0123] It should be noted that, provided there is no conflict, the order of the above steps in the encapsulation method of this application can be adjusted according to actual needs, either by placing them before or after the steps.

[0124] In the encapsulation method of this application embodiment, the encapsulation housing 300 is connected to the encapsulation substrate 100 through a first encapsulating adhesive 400, and the encapsulation housing 300 can protect the miniature light-emitting diode device 200. Furthermore, the encapsulation housing 300 has a first sidewall portion 321 and a second sidewall portion 322 with different heights, which can compensate for the height difference between the circuit board 120 and the carrier plate 110. This not only improves the connection stability between the encapsulation housing 300 and the circuit board 120 and the carrier plate 110, but also reduces the amount of adhesive used in the first encapsulating adhesive 400 and improves the sealing performance of the first encapsulating adhesive 400. Furthermore, a portion of the bottom wall 310 of the encapsulation housing 300 is connected to the micro-LED device 200 via the second encapsulating colloid 600, which further increases the connection strength between the encapsulation housing 300 and the encapsulation substrate 100 and the micro-LED device 200. Additionally, the electrical connector 900, which electrically connects the driver chip 220 and the circuit board 120, is wrapped by the third encapsulating colloid 800, which provides sealing protection for the electrical connector 900. Moreover, a light-transmitting film structure 700 is provided on the side of the micro-LED chip 210 facing away from the driver chip 220, which protects the micro-LED chip 210. Based on these features, the micro-LED device encapsulation structure 10 prepared by the encapsulation method of this application has superior encapsulation integration, high reliability, and good aesthetics.

[0125] Based on the above description, this application also provides a display device 20, please refer to... Figure 13 , Figure 13 This is a schematic diagram of a display device 20 provided in an embodiment of this application. The display device 20 can be applied to electronic devices to realize extended reality (XR) technologies such as augmented reality (AR), virtual reality (VR), and mixed reality (MR). In implementation, the display device 20 can be the projection part of an electronic device, such as a projector or head-up display (HUD); or, for example, the display device 20 can be the display part of an electronic device, such as a smartphone, smartwatch, laptop, tablet, dashcam, navigator, head-mounted device, or any device with a display screen; or, for example, the display device 20 can be the lighting part of an electronic device, such as a vehicle or streetlight, or any device with lighting components.

[0126] It is understood that the display device 20 of this application embodiment includes the micro light-emitting diode device package structure 10 of any of the foregoing embodiments, or includes the micro light-emitting diode device package structure 10 prepared by the packaging method of any of the foregoing embodiments. Therefore, the display device 20 of this application has superior package integration, high reliability, and better aesthetics.

[0127] It should be noted that the micro light-emitting diode device packaging structure 10, packaging method, and display device 20 of the embodiments of this application are different subjects under the same inventive concept, and features not described in detail in each embodiment can be referred to the descriptions in other embodiments.

[0128] It should be noted that the term "multiple" in this application generally refers to two or more. Furthermore, the directional terms used in the embodiments of this application, such as "up," "down," "front," "back," "left," "right," "inner," "outer," and "side," are only for reference to the accompanying drawings. Therefore, the directional terms used are for illustrating and understanding the embodiments of this application, and not for limiting the embodiments of this application. In the various drawings, structurally similar units are represented by the same reference numerals. For clarity, the various parts in the drawings are not drawn to scale. Additionally, some related parts may not be shown in the drawings.

[0129] It should be understood that in the description of this application, terms such as "first" and "second" are used only to distinguish similar objects and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated.

[0130] It is understood that those skilled in the art, guided by the above embodiments, can combine various implementation methods in the above embodiments to obtain technical solutions with multiple implementation methods. The above descriptions are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

[0131] The foregoing has provided a detailed description of the micro LED device packaging structure, packaging method, and display device provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application; the descriptions of the embodiments above are merely for the purpose of aiding understanding this application. Furthermore, those skilled in the art will recognize that, based on the ideas of this application, there may be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A packaging structure for a miniature light-emitting diode device, characterized in that, include: A miniature light-emitting diode device, comprising a miniature light-emitting diode chip and a driver chip bonded together; The packaging substrate includes a carrier plate and a circuit board connected to each other. The carrier plate is disposed on and connected to the side of the driver chip facing away from the micro light-emitting diode chip. The circuit board is electrically connected to the driver chip through an electrical connector. and The encapsulation housing covers the micro LED device and part of the encapsulation substrate. The encapsulation housing includes a cutout area and a light-transmitting area. The cutout area is directly opposite the electrical connector, and the light-transmitting area is directly opposite the micro LED chip.

2. The micro light-emitting diode device packaging structure according to claim 1, characterized in that, The encapsulation housing also includes a bottom wall and a side wall that surrounds the bottom wall and protrudes from the bottom wall; The encapsulation structure further includes a first encapsulating colloid and a second encapsulating colloid. The sidewall is connected to the encapsulation substrate through the first encapsulating colloid, and part of the bottom wall is connected to the driver chip through the second encapsulating colloid.

3. The micro light-emitting diode device packaging structure according to claim 2, characterized in that, Both the first encapsulating colloid and the second encapsulating colloid have a ring structure.

4. The micro light-emitting diode device packaging structure according to any one of claims 1 to 3, characterized in that, The packaging structure further includes: A third encapsulating colloid is disposed within the encapsulation housing and encapsulates the electrical connector, and the third encapsulating colloid seals the hollow area.

5. The micro light-emitting diode device packaging structure according to any one of claims 1 to 3, characterized in that, The packaging structure further includes: A light-transmitting thin film structure is disposed on the side of the micro light-emitting diode chip facing away from the driving chip and opposite to the light-transmitting area.

6. A packaging method, characterized in that, include: A miniature light-emitting diode device is provided, the miniature light-emitting diode device comprising a miniature light-emitting diode chip and a driver chip bonded together; A packaging substrate is provided, the packaging substrate including a carrier plate and a circuit board connected together; The carrier plate is disposed and connected to the side of the driver chip that is opposite to the micro light-emitting diode chip, and the circuit board is electrically connected to the driver chip through an electrical connector; A packaging housing is provided, the packaging housing including a hollow area and a light-transmitting area; The micro LED device and part of the packaging substrate are covered by the packaging shell, and the cutout area is aligned with the electrical connector and the light-transmitting area is aligned with the micro LED chip, thus obtaining the micro LED device packaging structure.

7. The packaging method according to claim 6, characterized in that, The encapsulation housing includes a bottom wall and a side wall that surrounds the bottom wall and protrudes from the bottom wall; The step of covering the micro LED device and part of the packaging substrate with the packaging housing includes: The sidewall is connected to the packaging substrate via a first encapsulating colloid, and a portion of the bottom wall is connected to the driver chip via a second encapsulating colloid. The packaging shell covers the micro LED device and a portion of the packaging substrate. Both the first and second encapsulating colloids are annular structures.

8. The packaging method according to claim 6 or 7, characterized in that, The encapsulation method further includes: A third encapsulating colloid is filled into the encapsulation housing through the hollowed-out area, and the third encapsulating colloid wraps around the electrical connector and seals the hollowed-out area.

9. The packaging method according to claim 6 or 7, characterized in that, The encapsulation method further includes: A light-transmitting film structure is disposed on the side of the micro LED chip facing away from the driver chip, and the light-transmitting film structure is positioned directly opposite the light-transmitting area.

10. A display device, characterized in that, It includes the micro light-emitting diode device packaging structure as described in any one of claims 1 to 5; or, it includes the micro light-emitting diode device packaging structure prepared by the packaging method as described in any one of claims 6 to 9.

Images