A conductive connection test device and a semiconductor heating plate test method

Abstract

The present invention relates to the field of conductive connection testing technology, and discloses a conductive connection testing device and a semiconductor heating plate testing method, including a device body, a feed conveyor belt and a discharge conveyor belt, wherein the feed conveyor belt is installed on the front of the device body, the discharge conveyor belt is installed on one side of the device body, a test bin is provided on the top of the device body, and a feed track is fixedly installed inside the feed conveyor belt. During operation, the present invention has a flipping mechanism that can drive the semiconductor heating plate to move and flip the semiconductor heating plate at the same time, so that the conductive port of the semiconductor heating plate can be connected to the heating plate connecting seat, and when the connecting mechanism moves, it can be connected to the conductive port of the semiconductor heating plate and drive the semiconductor heating plate to move, and the semiconductor heating plate can be flipped in time after the detection is completed, so as to effectively prevent the conductive port of the semiconductor heating plate from being damaged during the movement and connection of the semiconductor heating plate.

Description

Technical Field

[0001] The invention relates to the technical field of conductive connection testing, in particular to conductive connection testing equipment and a semiconductor heating plate testing method. Background Art

[0002] Conductive connection test is a method for testing the electrical connection performance of electrical equipment. It is mainly used to detect the reliability and safety of electrical equipment after power is supplied. Conductive connection test usually includes multiple aspects.

[0003] Chinese patent CN104820116B discloses a connection device suitable for low-temperature electrical testing and a method of use, wherein a through hole is opened on a sample fixing plate, one end of a wire passes through the through hole and is connected to a solder joint arranged on the upper surface of the sample fixing plate, the other end of the wire is connected to a first conductive connection device, and a second conductive connection device is connected to an enameled wire connected to a signal access terminal of a test device, and the first conductive connection device and the second conductive connection device are detachably connected.

[0004] In the above patent and the prior art, when performing power-on detection on a semiconductor heating disk with a relatively special shape, the power connection port is difficult to match with the connection port of the semiconductor heating disk, and the connection port of the semiconductor heating disk is located below the semiconductor heating disk. When the semiconductor heating disk is moved and conductively connected, the conductive connection port of the semiconductor heating disk is easily damaged. Summary of the invention

[0005] In view of the deficiencies in the prior art, the present invention provides a conductive connection testing device and a semiconductor heating plate testing method.

[0006] A conductive connection test device and a semiconductor heating plate test method, comprising a device body, a feed conveyor belt and a discharge conveyor belt, wherein the feed conveyor belt is installed on the front of the device body, the discharge conveyor belt is installed on one side of the device body, a test bin is arranged on the top of the device body, a feed track is fixedly installed inside the feed conveyor belt, and a flip mechanism, a connection mechanism and a detection mechanism are installed inside the test bin;

[0007] The flip mechanism includes a connecting sleeve, a heating plate flipping platform and a flipping limiting ring. The heating plate flipping platform is rotatably mounted on the outside of the connecting sleeve. The heating plate flipping platform can rotate around the flipping limiting ring. When the heating plate flipping platform moves, it can drive the semiconductor heating plate to move synchronously.

[0008] The connecting mechanism includes a hydraulic telescopic rod, a heating plate connecting seat and a transmission connecting rod. The hydraulic telescopic rod is installed inside the test chamber. When the hydraulic telescopic rod is extended or shortened, it can drive the heating plate connecting seat to move up and down. When the hydraulic telescopic rod is extended or shortened, it can synchronously drive the transmission connecting rod to move.

[0009] The feed conveyor belt and the feed track can move the semiconductor heating plate to the inside of the heating plate turning table. When the connecting sleeve rotates, it can drive the heating plate turning table to rotate synchronously, and when the heating plate turning table rotates around the turning limit circle, it can turn over and drive the semiconductor heating plate to turn over. The heating plate connecting seat can be connected to the semiconductor heating plate on the heating plate turning table and energized. When the hydraulic telescopic rod is extended and retracted, it can drive the semiconductor heating plate to move to the inside of the detection mechanism through the heating plate connecting seat, and the performance of the semiconductor heating plate can be detected by the detection mechanism. Then the detection mechanism turns the semiconductor heating plate over and places it on the discharge conveyor belt.

[0010] Preferably, the flipping mechanism includes a flipping shaft and a limiting sleeve, the flipping shaft is rotatably installed inside the test chamber, the limiting sleeve is fixedly installed inside the test chamber, the top of the flipping shaft is fixedly connected with the connecting sleeve, the bottom of the connecting sleeve is fixedly connected with a transmission block, a flip connecting rod is rotatably installed inside the connecting sleeve, one end of the flip connecting rod is fixedly connected to the heating plate flipping table, the other end of the flip connecting rod is fixedly connected to a block connecting seat, a flip block is fixedly installed outside the block connecting seat, a flip limiting ring is fixedly connected to the top of the limiting sleeve, a flip limiting block is fixedly connected to the outside of the limiting sleeve, and a flip limiting groove is provided on the outside of the flip limiting ring.

[0011] Preferably, the flip shaft is located at the center of the limiting sleeve, the connecting sleeve connected to the top of the flip shaft is located outside the limiting sleeve, and the flip shaft, the connecting sleeve and the limiting sleeve are on the same axis;

[0012] The bottoms of the flip shaft and the limiting sleeve are both connected to the device body, the top of the flip shaft passes through the center of the limiting sleeve and is fixedly connected to the connecting sleeve, the flip limiting ring is located between the limiting sleeve and the connecting sleeve, the transmission block at the bottom of the connecting sleeve does not contact the device body, and a plurality of annular transmission blocks equidistantly distributed are installed at the bottom of the connecting sleeve.

[0013] Preferably, a plurality of flip connecting rods are rotatably installed inside the connecting sleeve, and the plurality of flip connecting rods are equidistantly distributed in a ring shape inside the connecting sleeve, and both ends of the plurality of flip connecting rods are fixedly connected to a heating plate flipping platform and a clamping block connecting seat;

[0014] The card block connecting seat is an arc-shaped structure, and the outer sides of the arc-shaped structures of the card block connecting seats are fixedly connected to the flip connecting rod. The outer sides of the arc-shaped structures of the card block connecting seats are fixedly installed with two flip card blocks, and the two flip card blocks are located at the same horizontal height.

[0015] Preferably, two flip limit blocks are fixedly installed on the outside of the limit sleeve, and two flip limit grooves are provided on the outside of the flip limit ring, and the two flip rotation shafts and the two flip limit grooves are symmetrical along the center of the limit sleeve;

[0016] The card block connecting seat is located outside the flip limit ring, the flip card block inside the card block connecting seat is engaged with the flip limit groove inside the flip limit ring, the bottom of the flip limit ring is tangent to the top of the flip card block, the bottom of the flip limit card block is lower than the bottom of the flip limit ring, and the width of the flip limit groove is the same as the diameter of the flip card block.

[0017] Preferably, the connecting mechanism comprises a hydraulic telescopic rod, the fixed end of the hydraulic telescopic rod is fixedly connected to the inner side wall of the test chamber, the movable end of the hydraulic telescopic rod is fixedly connected to a telescopic clamping block, a telescopic housing is slidably installed on the outside of the telescopic clamping block, a heating plate connecting seat is slidably installed on the inside of the telescopic housing, a lifting limit block is fixedly connected to the bottom of the heating plate connecting seat, a connecting spring is installed inside the telescopic housing, a transmission rod mounting block is fixedly installed on the outside of the telescopic clamping block, a transmission rod sliding groove is provided inside the transmission rod mounting block, a transmission connecting rod is slidably installed inside the transmission rod sliding groove, a transmission connecting rod is fixedly connected to the bottom of the transmission connecting rod with a transmission rod limiting block, a transmission rod moving groove is provided on the outside of the telescopic housing, and a transmission rod limiting groove is provided inside the test chamber;

[0018] The exterior of the telescopic block is movably connected to the inner side wall of the telescopic housing via a connecting spring.

[0019] Preferably, the heating plate connecting seat is slidably installed inside the telescopic housing through a lifting limit block, the bottom of the lifting limit block is an inclined structure, and the bottom of the lifting limit block is in contact with the top of the telescopic block;

[0020] One side of the telescopic block is fitted with the hydraulic telescopic rod, the other side of the telescopic block is connected with a connecting spring and a transmission rod mounting block, and a groove is provided on the top of the telescopic block to fit with the bottom of the lifting limit block.

[0021] Preferably, one end of the transmission connecting rod is slidably mounted on the outside of the transmission rod sliding groove, the other end of the transmission connecting rod passes through the transmission rod moving groove and is engaged with the transmission clamping block at the bottom of the connecting sleeve, and the transmission rod limiting block at the bottom of the transmission connecting rod passes through the telescopic housing and is inserted into the inside of the transmission rod limiting groove;

[0022] The transmission rod mounting block and the transmission rod sliding groove provided inside are both inclined structures, and the transmission rod sliding groove and the transmission rod limiting groove jointly limit the position of the transmission connecting rod.

[0023] Preferably, the detection mechanism comprises a detection fixing frame and a driving motor, the detection fixing frame is fixedly installed inside the test chamber, the driving motor is fixedly installed inside the test chamber, a detection probe is fixedly installed inside the detection fixing frame, a detection shaft is rotatably installed inside the detection fixing frame, a detection platform is fixedly installed outside the detection shaft, a rotor roller is fixedly connected to one side of the detection shaft, a motor roller is fixedly connected to the power end of the driving motor, and a transmission belt is movably installed outside the motor roller;

[0024] The motor roller and the rotor roller are connected by a transmission belt, and the detection platform is rotatably installed inside the detection fixing frame by a detection shaft.

[0025] Compared with the prior art, the present invention provides a conductive connection test device and a semiconductor heating plate test method, which have the following beneficial effects:

[0026] 1. This kind of conductive connection test equipment, during operation, the flipping mechanism can drive the semiconductor heating disk to move and flip the semiconductor heating disk at the same time, so that the conductive port of the semiconductor heating disk can be connected to the heating disk connecting seat. When the connecting mechanism moves, it can connect with the conductive port of the semiconductor heating disk and drive the semiconductor heating disk to move. After the detection is completed, the semiconductor heating disk is flipped in time, thereby effectively preventing the conductive port of the semiconductor heating disk from being damaged during the movement and connection of the semiconductor heating disk.

[0027] 2. This type of conductive connection testing equipment can drive the heating plate connecting seat to move up and down and connect with the conductive port of the semiconductor heating plate when the hydraulic telescopic rod is extended and retracted. The semiconductor heating plate can also be placed on the test bench when the hydraulic telescopic rod moves, and the connecting sleeve can be driven to rotate and move the semiconductor heating plate inside the test mechanism, thereby preventing the semiconductor heating plate from being damaged due to inadequate movement and coordination between the components.

[0028] 3. This type of conductive connection test equipment keeps the semiconductor heating disk in an inverted state when it moves to ensure the stability of the semiconductor heating disk during movement. After the semiconductor heating disk is powered on, the heating upper surface is always kept facing upward, and it no longer contacts the upper surface of the semiconductor heating disk during movement, thereby ensuring the accuracy of the test results. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of the three-dimensional structure of a conductive connection testing device of the present invention;

[0030] Figure 2 The internal structure of a conductive connection test device of the present invention is schematically shown. Figure 1 ;

[0031] Figure 3 The internal structure of a conductive connection test device of the present invention is schematically shown. Figure 2 ;

[0032] Figure 4 It is a three-dimensional structural schematic diagram of a flip mechanism of a conductive connection testing device of the present invention;

[0033] Figure 5 It is a schematic diagram of the internal structure of a flip mechanism of a conductive connection testing device of the present invention;

[0034] Figure 6 It is a schematic diagram of the three-dimensional structure of a flip limit groove of a conductive connection testing device of the present invention;

[0035] Figure 7 It is a three-dimensional structural schematic diagram of a connection mechanism of a conductive connection test device of the present invention;

[0036] Figure 8 It is a schematic diagram of the internal structure of a connection mechanism of a conductive connection test device of the present invention;

[0037] Fig. 9 It is a three-dimensional structural schematic diagram of a transmission rod slide slot of a conductive connection testing device of the present invention;

[0038] Fig.10 The present invention is a schematic diagram of the internal structure of a detection mechanism of a conductive connection testing device.

[0039] In the figure: 1. Device body; 2. Test chamber; 3. Feed conveyor belt; 4. Feed track; 5. Turnover mechanism; 51. Turnover shaft; 52. Connecting sleeve; 53. Transmission card block; 54. Turnover connecting rod; 55. Heating plate turning table; 56. Card block connecting seat; 57. Turnover card block; 58. Limit sleeve; 59. Turnover limit ring; 510. Turnover limit card block; 511. Turnover limit groove; 6. Connecting mechanism; 61. Hydraulic telescopic rod; 62. Telescopic card block; 63. Telescopic shell ; 64. Heating plate connecting seat; 65. Lifting limit block; 66. Connecting spring; 67. Transmission rod mounting block; 68. Transmission rod slide groove; 69. Transmission connecting rod; 610. Transmission rod limit block; 611. Transmission rod moving groove; 612. Transmission rod limit groove; 7. Detection mechanism; 71. Detection fixing frame; 72. Detection probe; 73. Detection shaft; 74. Detection table; 75. Rotor roller; 76. Driving motor; 77. Motor roller; 78. Transmission belt; 8. Discharging conveyor belt. DETAILED DESCRIPTION

[0040] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] As introduced in the background technology, there are deficiencies in the prior art. In order to solve the above technical problems, the present application proposes a conductive connection testing device and a semiconductor heating plate testing method.

[0042] Example 1: Please refer to Figure 1 - Fig.10 A conductive connection test device comprises a device body 1, a feed conveyor belt 3 and a discharge conveyor belt 8, wherein the feed conveyor belt 3 is installed on the front of the device body 1, and the discharge conveyor belt 8 is installed on one side of the device body 1. A test chamber 2 is arranged on the top of the device body 1, a feed track 4 is fixedly installed inside the feed conveyor belt 3, and a turning mechanism 5, a connection mechanism 6 and a detection mechanism 7 are installed inside the test chamber 2;

[0043] The turning mechanism 5 includes a connecting sleeve 52, a heating plate turning platform 55 and a turning limit ring 59. The heating plate turning platform 55 is rotatably mounted on the outside of the connecting sleeve 52. The heating plate turning platform 55 can turn around the turning limit ring 59. When the heating plate turning platform 55 moves, it can drive the semiconductor heating plate to move synchronously.

[0044] The connecting mechanism 6 includes a hydraulic telescopic rod 61, a heating plate connecting seat 64 and a transmission connecting rod 69. The hydraulic telescopic rod 61 is installed inside the test chamber 2. When the hydraulic telescopic rod 61 is extended or shortened, it can drive the heating plate connecting seat 64 to move up and down. When the hydraulic telescopic rod 61 is extended or shortened, it can synchronously drive the transmission connecting rod 69 to move.

[0045] The feeding conveyor belt 3 and the feeding track 4 can move the semiconductor heating disk to the inside of the heating disk turning table 55. When the connecting sleeve 52 rotates, it can drive the heating disk turning table 55 to rotate synchronously, and when the heating disk turning table 55 rotates around the turning limit ring 59, it can turn over and drive the semiconductor heating disk to turn over. The heating disk connecting seat 64 can be connected to the semiconductor heating disk on the heating disk turning table 55 and energized. When the hydraulic telescopic rod 61 is extended and retracted, it can drive the semiconductor heating disk to move to the inside of the detection mechanism 7 through the heating disk connecting seat 64, and detect the performance of the semiconductor heating disk through the detection mechanism 7. Then the detection mechanism 7 turns the semiconductor heating disk over and places it on the discharge conveyor belt 8.

[0046] During operation, the semiconductor heating disk is first placed upside down on the surface of the feed conveyor belt 3, so that the conductive connection port of the semiconductor heating disk faces upward, and then the semiconductor heating disk is moved to the feed track 4 through the feed conveyor belt 3, and the semiconductor heating disk enters the interior of the heating disk turning table 55 along the feed track 4. When the connecting sleeve 52 rotates, the semiconductor heating disk can be driven to move synchronously through the heating disk turning table 55, and during the movement of the heating disk turning table 55, the semiconductor heating disk can be driven to turn, so that the conductive connection port of the semiconductor heating disk faces downward, and then the heating disk connecting seat 64 is driven to rise and connect with the semiconductor heating disk by extending the hydraulic telescopic rod 61, and the heating disk connecting seat 64 is driven to move by contracting the hydraulic telescopic rod 61, thereby driving the semiconductor heating disk to move into the detection mechanism 7, and during the contraction of the hydraulic telescopic rod 61, the connecting sleeve 52 can be driven to rotate through the transmission connecting rod 69, and during the operation, the turning mechanism 5 can drive the semiconductor heating disk to turn so that the conductive port of the semiconductor heating disk is connected to the heating disk connecting seat 64, and the semiconductor heating disk is turned over in time after the detection is completed, thereby effectively preventing the conductive port of the semiconductor heating disk from being damaged during the movement and connection of the semiconductor heating disk.

[0047] Embodiment 2: The difference from the above embodiment is that, please refer to Figure 3 - Figure 7 The flipping mechanism 5 also includes a flipping shaft 51 and a limiting sleeve 58. The flipping shaft 51 is rotatably installed inside the test chamber 2, and the limiting sleeve 58 is fixedly installed inside the test chamber 2. The top of the flipping shaft 51 is fixedly connected with a connecting sleeve 52, and the bottom of the connecting sleeve 52 is fixedly connected with a transmission block 53. A flip connecting rod 54 is rotatably installed inside the connecting sleeve 52. One end of the flip connecting rod 54 is fixedly connected with a heating plate flipping table 55, and the other end of the flip connecting rod 54 is fixedly connected with a block connecting seat 56. A flip block 57 is fixedly installed outside the block connecting seat 56. A flip limiting ring 59 is fixedly connected to the top of the limiting sleeve 58, and a flip limiting block 510 is fixedly connected to the outside of the limiting sleeve 58. A flip limiting groove 511 is provided on the outside of the flip limiting ring 59.

[0048] The flip shaft 51 is located at the center of the limiting sleeve 58, and the connecting sleeve 52 connected to the top of the flip shaft 51 is located outside the limiting sleeve 58. The flip shaft 51, the connecting sleeve 52 and the limiting sleeve 58 have the same axis.

[0049] The bottom of the flip shaft 51 and the limiting sleeve 58 are both connected to the device body 1, the top of the flip shaft 51 passes through the center of the limiting sleeve 58 and is fixedly connected to the connecting sleeve 52, the flip limiting ring 59 is located between the limiting sleeve 58 and the connecting sleeve 52, the transmission block 53 at the bottom of the connecting sleeve 52 does not contact the device body 1, and a plurality of annular transmission blocks 53 equidistantly distributed are installed at the bottom of the connecting sleeve 52.

[0050] A plurality of flip connecting rods 54 are rotatably mounted inside the connecting sleeve 52. The plurality of flip connecting rods 54 are evenly distributed in a ring shape inside the connecting sleeve 52. Both ends of the plurality of flip connecting rods 54 are fixedly connected to a heating plate flipping platform 55 and a block connecting seat 56.

[0051] The block connection seat 56 is an arc-shaped structure, and the outer sides of the arc-shaped structures of the multiple block connection seats 56 are fixedly connected to the flip connection rod 54. Two flip blocks 57 are fixedly installed on the outer sides of the arc-shaped structures of the multiple block connection seats 56, and the two flip blocks 57 are located at the same horizontal height.

[0052] Two flip limit blocks 510 are fixedly installed on the outside of the limit sleeve 58, and two flip limit grooves 511 are opened on the outside of the flip limit ring 59. The two flip shafts 51 and the two flip limit grooves 511 are symmetrical along the center of the limit sleeve 58;

[0053] The block connecting seat 56 is located outside the flip limit ring 59, and the flip block 57 inside the block connecting seat 56 is engaged with the flip limit groove 511 inside the flip limit ring 59. The bottom of the flip limit ring 59 is tangent to the top of the flip block 57, the bottom of the flip limit block 510 is lower than the bottom of the flip limit ring 59, and the width of the flip limit groove 511 is the same as the diameter of the flip block 57.

[0054] When working, the heating plate turning platform 55 can drive the semiconductor heating plate to move. When the connecting sleeve 52 rotates around the limiting sleeve 58, it can drive the turning connecting rod 54 and the block connecting seat 56 to move synchronously. When the block connecting seat 56 rotates around the limiting sleeve 58, the turning block 57 inside the block connecting seat 56 is engaged with the turning limiting groove 511. One of the turning blocks 57 rises along the turning limiting block 510 to drive the turning connecting rod 54 to rotate, and the position of the other turning block 57 is lowered, so that the two turning blocks 57 pass through the upper and lower parts of the turning limiting block 510 respectively, and drive the turning connecting rod 54 to rotate 180° when passing through, so as to realize the turning of the semiconductor heating plate. After the connecting mechanism 6 removes the semiconductor heating plate, the turning block 57 passes through another turning limiting block 510 and turns over again, so that the semiconductor heating plate can be turned over without contacting the conductive port of the semiconductor heating plate, so as to facilitate the power-on detection of the conductive port of the semiconductor heating plate.

[0055] Embodiment 3: The difference from the above embodiment is that, please refer to Figure 7 and Fig. 9The connecting mechanism 6 includes a hydraulic telescopic rod 61, a fixed end of the hydraulic telescopic rod 61 is fixedly connected to the inner wall of the test chamber 2, a movable end of the hydraulic telescopic rod 61 is fixedly connected to a telescopic block 62, a telescopic housing 63 is slidably installed on the outside of the telescopic block 62, a heating plate connecting seat 64 is slidably installed inside the telescopic housing 63, a lifting limit block 65 is fixedly connected to the bottom of the heating plate connecting seat 64, a connecting spring 66 is installed inside the telescopic housing 63, a transmission rod mounting block 67 is fixedly installed on the outside of the telescopic block 62, a transmission rod slide 68 is provided inside the transmission rod mounting block 67, a transmission connecting rod 69 is slidably installed inside the transmission connecting rod slide 68, a transmission connecting rod 69 is fixedly connected to the bottom of the transmission connecting rod 69 with a transmission rod limit block 610, a transmission rod moving groove 611 is provided on the outside of the telescopic housing 63, and a transmission rod limit groove 612 is provided inside the test chamber 2;

[0056] The exterior of the telescopic block 62 is movably connected to the inner wall of the telescopic housing 63 via a connecting spring 66 .

[0057] The heating plate connection seat 64 is slidably installed inside the telescopic housing 63 through the lifting limit block 65. The bottom of the lifting limit block 65 is an inclined structure, and the bottom of the lifting limit block 65 is in contact with the top of the telescopic block 62.

[0058] One side of the telescopic block 62 is in contact with the hydraulic telescopic rod 61 , and the other side of the telescopic block 62 is connected to a connecting spring 66 and a transmission rod mounting block 67 . A groove is provided on the top of the telescopic block 62 to be in contact with the bottom of the lifting limit block 65 .

[0059] One end of the transmission connecting rod 69 is slidably mounted on the outside of the transmission rod sliding groove 68, and the other end of the transmission connecting rod 69 passes through the transmission rod moving groove 611 and is engaged with the transmission clamping block 53 at the bottom of the connecting sleeve 52. The transmission rod limiting block 610 at the bottom of the transmission connecting rod 69 passes through the telescopic housing 63 and is inserted into the inside of the transmission rod limiting groove 612.

[0060] The transmission rod mounting block 67 and the transmission rod sliding groove 68 provided inside are both inclined structures. The transmission rod sliding groove 68 and the transmission rod limiting groove 612 jointly limit the position of the transmission connecting rod 69.

[0061] When the hydraulic telescopic rod 61 is extended, the telescopic housing 63 can be driven to move in the direction of the flip mechanism 5. After the telescopic housing 63 contacts the connecting sleeve 52, the telescopic housing 63 cannot move further, while the telescopic block 62 continues to move and compresses the connecting spring 66. During the continued movement of the telescopic block 62, the heating plate connecting seat 64 can be driven to rise through the lifting limit block 65. When the heating plate connecting seat 64 rises, it can be connected to the conductive port of the semiconductor heating plate on the heating plate flip table 55, and the semiconductor heating plate can be energized. In the movement of the telescopic block 62, the transmission connecting rod 69 can be driven to move along the transmission rod limit groove 612 and be engaged with the transmission block 53. Then, the hydraulic telescopic rod 61 contracts and drives the transmission connecting rod 69 to move through the telescopic block 62. It can be offset along the transmission rod moving groove 611 and the transmission rod limiting groove 612, thereby driving the connecting sleeve 52 to rotate a certain angle. During the contraction of the hydraulic telescopic rod 61, the semiconductor heating plate can be removed from the heating plate turning table 55 and moved to the inside of the detection mechanism 7, and then the transmission connecting rod 69 is separated from the connecting sleeve 52, and the connecting spring 66 rebounds to drive the telescopic block 62 to slide inside the telescopic shell 63, so that the position of the heating plate connecting seat 64 is lowered and separated from the semiconductor heating plate. During the extension and retraction of the hydraulic telescopic rod 61, it can not only drive the heating plate connecting seat 64 to connect with the semiconductor heating plate, but also drive the connecting sleeve 52 to rotate and move the semiconductor heating plate to the inside of the detection mechanism 7, thereby preventing the semiconductor heating plate from being damaged due to the inadequate movement and coordination between the components.

[0062] Embodiment 4: The difference from the above embodiment is that, please refer to Figure 3 and Fig.10 The detection mechanism 7 includes a detection fixing frame 71 and a driving motor 76. The detection fixing frame 71 is fixedly installed inside the test chamber 2. The driving motor 76 is fixedly installed inside the test chamber 2. A detection probe 72 is fixedly installed inside the detection fixing frame 71. A detection shaft 73 is rotatably installed inside the detection fixing frame 71. A detection table 74 is fixedly installed outside the detection shaft 73. A rotor roller 75 is fixedly connected to one side of the detection shaft 73. A motor roller 77 is fixedly connected to the power end of the driving motor 76. A transmission belt 78 is movably installed outside the motor roller 77.

[0063] The motor roller 77 and the rotor roller 75 are connected to each other through a transmission belt 78 , and the detection platform 74 is rotatably mounted inside the detection fixing frame 71 through the detection shaft 73 .

[0064] When the connecting mechanism 6 moves the semiconductor heating disk to the bottom of the detection probe 72, the detection probe 72 can detect the temperature on the semiconductor heating disk. After the detection is completed, the connecting mechanism 6 is separated from the semiconductor heating disk, and the semiconductor heating disk is placed on the detection table 74. The detection shaft 73 is then driven by the driving motor 76 to rotate, thereby driving the detection table 74 to flip and place the semiconductor heating disk on the discharge conveyor belt 8. After the semiconductor heating disk is powered on, the moving semiconductor heating disk no longer contacts the upper surface of the semiconductor heating disk, thereby ensuring the accuracy of the detection result.

[0065] Embodiment 5: A conductive connection test device and a semiconductor heating plate test method, using a conductive connection test device as described in Embodiment 1, comprising the following steps:

[0066] When working, first place the semiconductor heating plate on the feeding conveyor belt 3;

[0067] Then the semiconductor heating plate enters the interior of the heating plate turning table 55 through the feeding conveyor belt 3 and the feeding track 4;

[0068] When the connecting sleeve 52 rotates, it can drive the semiconductor heating plate to move and flip;

[0069] Then the connecting mechanism 6 is connected to the semiconductor heating disk and drives the semiconductor heating disk to move into the detection mechanism 7;

[0070] The detection mechanism 7 detects the temperature of the semiconductor heating disk and turns the semiconductor heating disk over and places it on the discharge conveyor belt 8 .

[0071] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A conductive connection test device, comprising a device body, a feed conveyor belt and a discharge conveyor belt, wherein the feed conveyor belt is installed on the front of the device body, and the discharge conveyor belt is installed on one side of the device body, characterized in that: A test bin is provided on the top of the device body, a feeding track is fixedly installed inside the feeding conveyor belt, and a turning mechanism, a connecting mechanism and a detection mechanism are installed inside the test bin; The flip mechanism includes a connecting sleeve, a heating plate flipping platform and a flipping limiting ring. The heating plate flipping platform is rotatably mounted on the outside of the connecting sleeve. The heating plate flipping platform can rotate around the flipping limiting ring. When the heating plate flipping platform moves, it can drive the semiconductor heating plate to move synchronously. The connecting mechanism includes a hydraulic telescopic rod, a heating plate connecting seat and a transmission connecting rod, and the hydraulic telescopic rod is installed inside the test chamber; The movable end of the hydraulic telescopic rod is fixedly connected with a telescopic block, a telescopic housing is slidably installed on the outside of the telescopic block, a heating plate connecting seat is slidably installed on the inside of the telescopic housing, a lifting limit block is fixedly connected to the bottom of the heating plate connecting seat, a connecting spring is installed inside the telescopic housing, a transmission rod mounting block is fixedly installed on the outside of the telescopic block, a transmission rod sliding groove is provided inside the transmission rod sliding groove, and a transmission connecting rod is slidably installed inside the transmission rod; During the retraction process of the hydraulic telescopic rod, the connecting sleeve can be driven to rotate through the transmission connecting rod; The feeding conveyor belt and the feeding track can move the semiconductor heating plate to the inside of the heating plate turning platform. When the connecting sleeve rotates, the heating plate turning platform can be driven to rotate synchronously. When the heating plate turning platform rotates around the turning limit ring, it can turn over and drive the semiconductor heating plate to turn over. When the hydraulic telescopic rod is extended, it drives the heating plate connecting seat to rise and connect with the conductive port of the semiconductor heating plate. During the contraction of the hydraulic telescopic rod, the semiconductor heating plate is removed from the heating plate turning table and moved into the inside of the detection mechanism, and the heating plate connecting seat is driven to descend and separate from the semiconductor heating plate. The performance of the semiconductor heating plate is tested by the detection mechanism, and then the detection mechanism turns the semiconductor heating plate over and places it on the discharge conveyor belt.

2. A conductive connection test device according to claim 1, characterized in that: The flipping mechanism also includes a flipping shaft and a limiting sleeve, the flipping shaft is rotatably installed inside the test bin, the limiting sleeve is fixedly installed inside the test bin, the top of the flipping shaft is fixedly connected with the connecting sleeve, the bottom of the connecting sleeve is fixedly connected with a transmission block, a flip connecting rod is rotatably installed inside the connecting sleeve, one end of the flip connecting rod is fixedly connected with a heating plate flipping table, the other end of the flip connecting rod is fixedly connected with a block connecting seat, a flip block is fixedly installed outside the block connecting seat, a flip limiting ring is fixedly connected to the top of the limiting sleeve, a flip limiting block is fixedly connected to the outside of the limiting sleeve, and a flip limiting groove is provided on the outside of the flip limiting ring.

3. A conductive connection test device according to claim 2, characterized in that: The flip shaft is located at the center of the limiting sleeve, the connecting sleeve connected to the top of the flip shaft is located outside the limiting sleeve, and the flip shaft, the connecting sleeve and the limiting sleeve are on the same axis; The bottoms of the flip shaft and the limiting sleeve are both connected to the device body, the top of the flip shaft passes through the center of the limiting sleeve and is fixedly connected to the connecting sleeve, the flip limiting ring is located between the limiting sleeve and the connecting sleeve, the transmission block at the bottom of the connecting sleeve does not contact the device body, and a plurality of annular transmission blocks equidistantly distributed are installed at the bottom of the connecting sleeve.

4. A conductive connection test device according to claim 3, characterized in that: A plurality of flip connecting rods are rotatably installed inside the connecting sleeve, and the plurality of flip connecting rods are equidistantly distributed in a ring shape inside the connecting sleeve, and both ends of the plurality of flip connecting rods are fixedly connected to a heating plate flipping table and a clamping block connecting seat; The card block connecting seat is an arc-shaped structure, and the outer sides of the arc-shaped structures of the card block connecting seats are fixedly connected to the flip connecting rod. The outer sides of the arc-shaped structures of the card block connecting seats are fixedly installed with two flip card blocks, and the two flip card blocks are located at the same horizontal height.

5. A conductive connection test device according to claim 4, characterized in that: Two flip limit blocks are fixedly installed on the outside of the limit sleeve, and two flip limit grooves are arranged on the outside of the flip limit ring. The two flip shafts and the two flip limit grooves are symmetrical along the center of the limit sleeve. The card block connecting seat is located outside the flip limit ring, the flip card block inside the card block connecting seat is engaged with the flip limit groove inside the flip limit ring, the bottom of the flip limit ring is tangent to the top of the flip card block, the bottom of the flip limit card block is lower than the bottom of the flip limit ring, and the width of the flip limit groove is the same as the diameter of the flip card block.

6. A conductive connection testing device according to claim 1, characterized in that: The connecting mechanism comprises a hydraulic telescopic rod, the fixed end of the hydraulic telescopic rod is fixedly connected to the inner wall of the test chamber, the bottom of the transmission connecting rod is fixedly connected to a transmission rod limit block, the outside of the telescopic housing is provided with a transmission rod moving groove, and the inside of the test chamber is provided with a transmission rod limit groove; The exterior of the telescopic block is movably connected to the inner side wall of the telescopic housing via a connecting spring.

7. A conductive connection testing device according to claim 6, characterized in that: The heating plate connection seat is slidably installed inside the telescopic housing through a lifting limit block, the bottom of the lifting limit block is an inclined structure, and the bottom of the lifting limit block is in contact with the top of the telescopic clamping block; One side of the telescopic block is fitted with the hydraulic telescopic rod, the other side of the telescopic block is connected with a connecting spring and a transmission rod mounting block, and a groove is provided on the top of the telescopic block to fit with the bottom of the lifting limit block.

8. A conductive connection testing device according to claim 7, characterized in that: One end of the transmission connecting rod is slidably mounted on the outside of the transmission rod sliding groove, the other end of the transmission connecting rod passes through the transmission rod moving groove and is engaged with the transmission clamping block at the bottom of the connecting sleeve, and the transmission rod limiting block at the bottom of the transmission connecting rod passes through the telescopic housing and is inserted into the inside of the transmission rod limiting groove; The transmission rod mounting block and the transmission rod sliding groove provided inside are both inclined structures, and the transmission rod sliding groove and the transmission rod limiting groove jointly limit the position of the transmission connecting rod.

9. A conductive connection testing device according to claim 8, characterized in that: The detection mechanism comprises a detection fixing frame and a driving motor, wherein the detection fixing frame is fixedly installed inside the test chamber, the driving motor is fixedly installed inside the test chamber, a detection probe is fixedly installed inside the detection fixing frame, a detection shaft is rotatably installed inside the detection fixing frame, a detection platform is fixedly installed outside the detection shaft, a rotor roller is fixedly connected to one side of the detection shaft, a motor roller is fixedly connected to the power end of the driving motor, and a transmission belt is movably installed outside the motor roller; The motor roller and the rotor roller are connected by a transmission belt, and the detection platform is rotatably mounted inside the detection fixing frame by a detection shaft.

10. A method for testing a semiconductor heating plate, using a conductive connection testing device as claimed in any one of claims 1 to 9.

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