A method for analyzing heat generation efficiency of circuit boards

Abstract

The present invention provides a heat generation efficiency analysis method for a circuit board, which belongs to the field of heat generation technology of circuit boards, and includes: step 1: obtaining relevant parameters of the circuit board and determining temperature data during the operation of the circuit board; step 2: determining the temperature distribution and power consumption of each area according to the temperature data; step 3: obtaining the heat generation of the circuit board based on a mathematical model; step 4: obtaining factors affecting the heat generation efficiency and potential thermal management problems of the circuit board according to the heat generation; step 5: determining multiple indicators of the circuit board according to the factors affecting the heat generation efficiency and potential thermal management problems of the circuit board, and determining the heat generation efficiency of the circuit board; step 6: evaluating the heat generation efficiency and optimizing the circuit board. The method solves the problem that the accurate heat generation efficiency cannot be obtained, the accurate judgment of the heat generation efficiency is reduced, and at the same time, the factors affecting the heat generation efficiency cannot be accurately obtained, resulting in inaccurate heat generation efficiency analysis and reduced circuit board performance.

Description

Technical Field

[0001] The present invention relates to the technical field of heat generation of circuit boards, and in particular to a method for analyzing heat generation efficiency of circuit boards. Background Art

[0002] In the electronics industry, the heat generation of circuit boards has always been a concern. High-intensity workloads and tight wiring designs cause circuit boards to generate a lot of heat.

[0003] However, the traditional heat generation efficiency analysis method of the circuit board has some limitations. It often ignores the complexity of the internal structure of the circuit board and the power consumption of each area inside the circuit board, and cannot obtain the accurate heat generation efficiency, thereby reducing the accurate judgment of the heat generation efficiency. At the same time, it is impossible to accurately obtain the factors affecting the heat generation efficiency, resulting in low heat generation efficiency, resulting in inaccurate final heat generation efficiency analysis results, reducing the stability and performance of the circuit board, and increasing the possibility of circuit board failure and damage.

[0004] Therefore, the present invention proposes a method for analyzing heat generation efficiency of a circuit board. Summary of the invention

[0005] The present invention provides a method for analyzing heat generation efficiency of a circuit board, so as to solve the problem that the complexity of the internal structure of the circuit board and the power consumption of each area inside the circuit board are often ignored in the prior art, and the accurate heat generation efficiency cannot be obtained, thereby reducing the accurate judgment of the heat generation efficiency. At the same time, the factors affecting the heat generation efficiency cannot be accurately obtained, resulting in low heat generation efficiency, resulting in inaccurate final heat generation efficiency analysis results, reducing the stability and performance of the circuit board, and increasing the possibility of failure and damage of the circuit board.

[0006] In one aspect, the present invention provides a method for analyzing heat generation efficiency of a circuit board, comprising:

[0007] Step 1: Acquire multiple relevant parameters of the circuit board, and determine temperature data of the circuit board during operation according to the relevant parameters;

[0008] Step 2: Determine the temperature distribution and power consumption of each area according to the temperature data;

[0009] Step 3: Obtaining heat generation of the circuit board under different conditions based on a mathematical model according to the temperature distribution of each area and the power consumption;

[0010] Step 4: Obtain factors affecting heat generation efficiency and potential thermal management problems of the circuit board based on the heat generation situation, the operating state of the circuit board and the setting of process parameters;

[0011] Step 5: determining multiple indicators of the circuit board based on thermodynamic formulas according to factors affecting heat generation efficiency and potential thermal management problems of the circuit board, and determining the heat generation efficiency of the circuit board according to the multiple indicators;

[0012] Step 6: Evaluate the heat generation efficiency and optimize the circuit board according to the evaluation result.

[0013] According to a method for analyzing heat generation efficiency of a circuit board provided by the present invention, a plurality of relevant parameters of the circuit board are obtained, and temperature data of the circuit board during operation is determined according to the relevant parameters, including:

[0014] Obtaining the purpose and working characteristics of the circuit board, and determining the component layout of the circuit board based on the environment according to the purpose and working characteristics;

[0015] Acquire the structure of the circuit board according to the component layout, and determine multiple relevant parameters of the circuit board based on the manual according to the structure;

[0016] Determine the corresponding monitoring device based on the value range of the relevant parameters to obtain the key measurement point position of the circuit board;

[0017] The monitoring device obtains temperature data of the circuit board after running for a preset time based on the position of the key measurement point.

[0018] According to a method for analyzing heat generation efficiency of a circuit board provided by the present invention, the temperature distribution and power consumption of each area are determined according to the temperature data, including:

[0019] Acquire the temperature value of each area at a specific time point according to the temperature data;

[0020] Draw a temperature distribution diagram of the circuit board according to the temperature value of each area at a specific time point, and determine the temperature distribution of each area according to the temperature distribution diagram;

[0021] Get the typical temperature of each area and compare it with the temperature distribution of each area to get the energy demand of each area;

[0022] The power consumption of each zone is determined based on the power consumption pattern of the circuit board according to the energy requirement of each zone.

[0023] According to a method for analyzing heat generation efficiency of a circuit board provided by the present invention, the heat generation of the circuit board under different conditions is obtained based on a mathematical model according to the temperature distribution of each area and the power consumption, including:

[0024] Build a mathematical model based on heat conduction according to multiple factors of the circuit board;

[0025] Setting parameters and boundary conditions for the mathematical model, and obtaining heat generation of the circuit board under different conditions based on the set mathematical model according to the temperature distribution and power consumption of each area;

[0026] The changes of key thermal parameters over time and space are obtained according to the heat generation situation, and the local and global behaviors of the heat are determined according to the changes.

[0027] According to a method for analyzing heat generation efficiency of a circuit board provided by the present invention, factors affecting heat generation efficiency and potential thermal management problems of the circuit board are obtained according to the heat generation situation based on the operating state of the circuit board and the setting of process parameters, including:

[0028] Acquire information related to the running state and process parameters of the circuit board, acquire the information type of the information, and determine the data acquisition device according to the information type;

[0029] Acquire data collected by a data acquisition device, analyze the data based on a machine learning algorithm, and acquire factors affecting heat generation efficiency under different working conditions based on the heat generation according to the analysis results;

[0030] The relevant factors causing overheating and uneven heating of the circuit board are obtained based on the factors affecting the heat generation efficiency, the thermal runaway risk points of the circuit board are determined based on the relevant factors, and the potential thermal management problems of the circuit board are obtained based on the thermal runaway risk points.

[0031] According to a method for analyzing heat generation efficiency of a circuit board provided by the present invention, multiple indicators of the circuit board are determined based on thermodynamic formulas according to factors affecting the heat generation efficiency and potential thermal management problems of the circuit board, and the heat generation efficiency of the circuit board is determined according to the multiple indicators, including:

[0032] The heat generation inside the circuit board is evaluated according to the heat conduction formula, the heat transfer in the air is evaluated according to the heat convection formula, and the heat radiation of the circuit board is evaluated according to the heat radiation formula;

[0033] According to the factors affecting the heat generation efficiency and the potential thermal management problems of the circuit board, based on the heat generation, heat transfer and heat radiation of the circuit board, a thermal simulation is performed on the circuit board to determine multiple indicators of the circuit board;

[0034] The coupling effect and heat conduction effect between the electronic components of the circuit board are obtained according to the indicators, and the heat generation efficiency of the circuit board is determined based on finite element analysis.

[0035] According to a heat generation efficiency analysis method for a circuit board provided by the present invention, the heat generation efficiency is evaluated, and the circuit board is optimized according to the evaluation result, including:

[0036] defining a heat generation efficiency index, and evaluating the heat generation efficiency of the circuit board according to the heat generation efficiency index;

[0037] According to the evaluation result, the thermal power is obtained based on the amount of heat generated per unit time;

[0038] A corresponding optimization strategy is determined according to the thermal power, the cause of low heat generation efficiency of the circuit board is obtained according to the optimization strategy, and the circuit board is optimized according to the cause.

[0039] According to a heat generation efficiency analysis method for a circuit board provided by the present invention, the heat generation efficiency of the circuit board is evaluated according to the heat generation efficiency index, including:

[0040] Construct a temperature estimation model based on genetic algorithm, detect the working condition data of the circuit board, and train the temperature estimation model according to the working condition data;

[0041] Determine the voltage heat generation characteristics of the circuit board at different discharge rates, and determine the heat generation efficiency fluctuation curve of the circuit board at different discharge rates over time through the trained temperature estimation model based on the voltage heat generation characteristics;

[0042] Determine the heat dissipation efficiency of the circuit board at different discharge rates according to the fluctuation curve of the heat generation efficiency of the circuit board at different discharge rates over time;

[0043] Determine the heat dissipation execution parameter values ​​of the circuit board at different discharge rates based on the heat dissipation demand efficiency and the heat dissipation execution parameter mapping table;

[0044] Determine the heat generation execution parameter response value of the circuit board at different discharge rates according to the heat dissipation execution parameter value;

[0045] Obtaining performance parameters and operating parameters of the circuit board corresponding to the response value of the heat generation execution parameter, and determining the overload state of the circuit board according to the performance parameters and the operating parameters;

[0046] Determine a corresponding variation coefficient of the heat generation efficiency index based on the overload state of the circuit board, and obtain an adjustment value of the heat generation efficiency index according to the corresponding variation coefficient;

[0047] The heat generation efficiency of the circuit board is evaluated according to the adjustment value of the heat generation efficiency index.

[0048] Compared with the prior art, the present invention has the following beneficial effects:

[0049] The temperature distribution and power consumption of each area are determined based on the temperature data during the operation of the circuit board, and the heat generation efficiency of the circuit board is determined based on the factors affecting the heat generation efficiency and the potential thermal management problems of the circuit board, so as to evaluate the heat generation efficiency. The complexity of the internal structure of the circuit board and the power consumption of each area inside the circuit board can be taken into account, and the accurate heat generation efficiency can be obtained, thereby improving the accurate judgment of the heat generation efficiency. At the same time, the factors affecting the heat generation efficiency can be accurately obtained to ensure the accuracy of the final heat generation efficiency analysis results, improve the stability and performance of the circuit board, and reduce the possibility of failure and damage of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0051] Figure 1 is a schematic flow chart of a method for analyzing heat generation efficiency of a circuit board provided in an embodiment of the present invention;

[0052] Figure 2 It is a flow chart of determining temperature data of a circuit board during operation according to relevant parameters of the circuit board provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0053] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0054] Embodiment 1:

[0055] The embodiment of the present invention provides a method for analyzing heat generation efficiency of a circuit board, such as Figure 1 As shown, the method mainly includes the following steps:

[0056] Step 1: Acquire multiple relevant parameters of the circuit board, and determine temperature data of the circuit board during operation according to the relevant parameters;

[0057] Step 2: Determine the temperature distribution and power consumption of each area according to the temperature data;

[0058] Step 3: Obtaining heat generation of the circuit board under different conditions based on a mathematical model according to the temperature distribution of each area and the power consumption;

[0059] Step 4: Obtain factors affecting heat generation efficiency and potential thermal management problems of the circuit board based on the heat generation situation, the operating state of the circuit board and the setting of process parameters;

[0060] Step 5: determining multiple indicators of the circuit board based on thermodynamic formulas according to factors affecting heat generation efficiency and potential thermal management problems of the circuit board, and determining the heat generation efficiency of the circuit board according to the multiple indicators;

[0061] Step 6: Evaluate the heat generation efficiency and optimize the circuit board according to the evaluation result.

[0062] In this embodiment, the multiple relevant parameters of the circuit board include: operating temperature, operating current, and material properties.

[0063] In this embodiment, the temperature data during the operation of the circuit board refers to the temperature that the surface of the circuit board may reach during the use of the circuit board, such as the lowest temperature and the highest temperature.

[0064] In this embodiment, the temperature distribution conditions of various regions of the circuit board refer to the temperature distribution conditions of different regions (such as the conductive layer, the insulating layer, etc.) on the circuit board.

[0065] In this embodiment, the mathematical model is constructed based on wire resistance, inductance effect, capacitance effect, and chip density.

[0066] In this embodiment, different conditions may include different temperatures, different layouts, and different materials.

[0067] In this embodiment, factors affecting heat generation efficiency include: local hot spots, heat diffusion, and thermal impedance.

[0068] In this embodiment, potential thermal management problems of the circuit board may be: excessively high or low temperature, expansion and contraction due to temperature changes causing thermal stress on the circuit board, and uneven heat transfer.

[0069] In this embodiment, the multiple indicators may be: average temperature, heat flux density.

[0070] In this embodiment, the optimization may include: adding heat dissipation equipment and changing the circuit layout.

[0071] The beneficial effects of the above technical solution are: determining the temperature distribution and power consumption of each area according to the temperature data of the circuit board during operation, and determining the heat generation efficiency of the circuit board based on the factors affecting the heat generation efficiency and the potential thermal management problems of the circuit board, so as to evaluate the heat generation efficiency. It can take into account the complexity of the internal structure of the circuit board and the power consumption of each area inside the circuit board, and can obtain accurate heat generation efficiency, thereby improving the accurate judgment of the heat generation efficiency. At the same time, it can accurately obtain the factors affecting the heat generation efficiency, ensure the accuracy of the final heat generation efficiency analysis results, improve the stability and performance of the circuit board, and reduce the possibility of failure and damage of the circuit board.

[0072] Embodiment 2:

[0073] Based on Example 1, the embodiment of the present invention obtains multiple relevant parameters of the circuit board, and determines the temperature data of the circuit board during operation according to the relevant parameters, such as Figure 2 As shown, including:

[0074] S01: obtaining the purpose and working characteristics of the circuit board, and determining the component layout of the circuit board based on the purpose and working characteristics and the environment;

[0075] S02: acquiring a structure of the circuit board according to the component layout, and determining a plurality of relevant parameters of the circuit board according to the structure based on the manual;

[0076] S03: Determine the corresponding monitoring device based on the value range of the relevant parameters, and obtain the key measurement point position of the circuit board;

[0077] S04: Acquiring temperature data of the circuit board after the circuit board has been running for a preset time based on the key measurement point positions according to the monitoring device.

[0078] In this embodiment, the circuit board is an electronic component that can be used to connect components and circuits in various electronic devices.

[0079] In this embodiment, the operating characteristics of the circuit board include: electrical conductivity, heat resistance, and dimensional stability.

[0080] In this embodiment, the component layout of the circuit board refers to the process of arranging all electronic components on the circuit board on a plane according to a predetermined design.

[0081] In this embodiment, the multiple relevant parameters of the circuit board may be: operating temperature, operating current, and material properties.

[0082] In this embodiment, the monitoring equipment includes: an infrared thermometer, an oscilloscope, and a multimeter.

[0083] In this embodiment, the key measurement point locations may be: power module, processor chip.

[0084] In this embodiment, the preset running time may be 10 minutes.

[0085] In this embodiment, the temperature data of the circuit board refers to the temperature that the surface of the circuit board may reach during use.

[0086] The beneficial effects of the above technical solution are: determining multiple relevant parameters of the circuit board according to the structure of the circuit board, thereby obtaining the corresponding monitoring equipment, and obtaining the temperature data of the circuit board after a preset running time based on the position of the key measurement point, so as to promptly detect abnormal temperature fluctuations or continuous excessively high or low temperatures, which may cause the heat generation efficiency of the circuit board to become unstable and reduce the heat generation performance of the circuit board.

[0087] Embodiment 3:

[0088] Based on Example 2, the embodiment of the present invention determines the temperature distribution and power consumption of each area according to the temperature data, including:

[0089] Acquire the temperature value of each area at a specific time point according to the temperature data;

[0090] Draw a temperature distribution diagram of the circuit board according to the temperature value of each area at a specific time point, and determine the temperature distribution of each area according to the temperature distribution diagram;

[0091] Get the typical temperature of each area and compare it with the temperature distribution of each area to get the energy demand of each area;

[0092] The power consumption of each zone is determined based on the power consumption pattern of the circuit board according to the energy requirement of each zone.

[0093] In this embodiment, the temperature distribution diagram of the circuit board is a diagram describing the temperature distribution conditions of different parts of the circuit board.

[0094] In this embodiment, the typical temperature of each region refers to the general situation of temperature distribution in different parts of the circuit board.

[0095] In this embodiment, the energy requirement of each area of ​​the circuit board refers to determining the required current, voltage and power for each component (such as transistors, capacitors, etc.).

[0096] In this embodiment, power consumption refers to the electrical energy consumed by the circuit board during operation.

[0097] In this embodiment, the power consumption mode of the circuit board refers to the power consumed by the circuit board in normal operation and standby state under given conditions.

[0098] The beneficial effect of the above technical solution is: a temperature distribution diagram of the circuit board is drawn according to the temperature value of each area at a specific time point, and compared with the typical temperature of each area, the energy demand of each area is obtained, and thus the power consumption of each area is determined, which can effectively prevent overheating of the circuit board and improve the stability of the circuit board.

[0099] Embodiment 4:

[0100] Based on Example 3, the embodiment of the present invention obtains the heat generation of the circuit board under different conditions based on the temperature distribution of each area and the power consumption based on the mathematical model, including:

[0101] Build a mathematical model based on heat conduction according to multiple factors of the circuit board;

[0102] Setting parameters and boundary conditions for the mathematical model, and obtaining heat generation of the circuit board under different conditions based on the set mathematical model according to the temperature distribution and power consumption of each area;

[0103] The changes of key thermal parameters over time and space are obtained according to the heat generation situation, and the local and global behaviors of the heat are determined according to the changes.

[0104] In this embodiment, multiple factors of the circuit board include: physical properties (such as material, size and shape), working environment and operating conditions, and thermocouple effect.

[0105] In this embodiment, the parameters are unknowns in the model, and the boundary conditions are known boundaries in the model.

[0106] In this embodiment, power consumption refers to the electrical energy consumed by the circuit board during operation.

[0107] In this embodiment, key thermal parameters include: heat distribution, heat flux, and heat flow.

[0108] In this embodiment, the local behavior of heat refers to the behavior of heat distribution and transmission in a local area caused by the interaction between microscopic particles inside the circuit board.

[0109] In this embodiment, the global behavior of heat refers to the heat distribution and transfer rules of the entire system, including the combined influence of factors such as the thermal motion and interaction of all microscopic particles.

[0110] The beneficial effects of the above technical solution are: according to the temperature distribution of each area and the power consumption based on the set mathematical model, the heat generation of the circuit board under different conditions is obtained, and the local and global behavior of heat is determined according to the changes of key thermal parameters over time and space, which helps to discover local hotspots and the effectiveness of global thermal management, and can better understand the transmission and distribution of heat on the circuit board, ensuring the accuracy of information related to heat generation.

[0111] Embodiment 5:

[0112] Based on Example 4, the embodiment of the present invention obtains factors affecting heat generation efficiency and potential thermal management problems of the circuit board according to the heat generation situation based on the operating state of the circuit board and the setting of process parameters, including:

[0113] Acquire information related to the running state and process parameters of the circuit board, acquire the information type of the information, and determine the data acquisition device according to the information type;

[0114] Acquire data collected by a data acquisition device, analyze the data based on a machine learning algorithm, and acquire factors affecting heat generation efficiency under different working conditions based on the heat generation according to the analysis results;

[0115] The relevant factors causing overheating and uneven heating of the circuit board are obtained based on the factors affecting the heat generation efficiency, the thermal runaway risk points of the circuit board are determined based on the relevant factors, and the potential thermal management problems of the circuit board are obtained based on the thermal runaway risk points.

[0116] In this embodiment, the information related to the operating status of the circuit board includes: load type, current density, and voltage.

[0117] In this embodiment, the information related to the circuit board process parameters includes: PCB layout, component layout, substrate material, conductor material, and insulation material.

[0118] In this embodiment, the data acquisition device is a device used to collect various physical quantity data of the circuit board.

[0119] In this embodiment, factors affecting heat generation efficiency include: local hot spots, heat diffusion, and thermal impedance.

[0120] In this embodiment, factors related to overheating and uneven heating of the circuit board include: poor heat dissipation, component quality problems, and power management problems.

[0121] In this embodiment, the thermal runaway risk point of the circuit board refers to the risk factors that may occur during the use of the circuit board, which may cause the circuit board to overheat, be damaged or fail. It may cause the circuit board to have abnormally high temperature, and then cause thermal runaway, posing a threat to the normal operation and safety of the circuit board.

[0122] In this embodiment, potential thermal management problems of the circuit board may be: excessively high or low temperature, expansion and contraction due to temperature changes causing thermal stress on the circuit board, and uneven heat transfer.

[0123] The beneficial effect of the above technical solution is: by analyzing the data collected by the data acquisition device according to the machine learning algorithm, the factors affecting the heat generation efficiency under different working conditions are obtained, so as to determine the thermal runaway risk points of the circuit board and the potential thermal management problems of the circuit board, and targeted measures can be taken to reduce the thermal runaway risk of the circuit board and ensure the stability of the heat generation efficiency.

[0124] Embodiment 6:

[0125] Based on Example 5, the embodiment of the present invention determines multiple indicators of the circuit board based on thermodynamic formulas according to factors affecting the heat generation efficiency and potential thermal management problems of the circuit board, and determines the heat generation efficiency of the circuit board according to the multiple indicators, including:

[0126] The heat generation inside the circuit board is evaluated according to the heat conduction formula, the heat transfer in the air is evaluated according to the heat convection formula, and the heat radiation of the circuit board is evaluated according to the heat radiation formula;

[0127] According to the factors affecting the heat generation efficiency and the potential thermal management problems of the circuit board, based on the heat generation, heat transfer and heat radiation of the circuit board, a thermal simulation is performed on the circuit board to determine multiple indicators of the circuit board;

[0128] The coupling effect and heat conduction effect between the electronic components of the circuit board are obtained according to the indicators, and the heat generation efficiency of the circuit board is determined based on finite element analysis.

[0129] In this embodiment, the heat conduction formula represents the heat generated per unit area by the flow of current, and can be calculated by measuring the current magnitude, the resistance value, and the area of ​​the circuit board.

[0130] In this embodiment, the heat convection formula describes the process of heat transfer through convection of a fluid, including factors such as air flow velocity, fluid density, and thermal conductivity.

[0131] In this embodiment, the thermal radiation formula describes the amount of thermal radiation energy emitted by an object due to its own temperature.

[0132] In this embodiment, factors affecting the heat generation efficiency may be: local hot spots, heat diffusion, and thermal impedance.

[0133] In this embodiment, potential thermal management problems of the circuit board may be: excessively high or low temperature, expansion and contraction due to temperature changes causing thermal stress on the circuit board, and uneven heat transfer.

[0134] In this embodiment, the multiple indicators of the circuit board include: average temperature, heat flux density, heat dissipation conditions, and workload.

[0135] In this embodiment, the coupling effect between electronic components of the circuit board refers to the influence caused by the interaction of electromagnetic fields between different electronic components in the circuit board, such as electromagnetic radiation, electromagnetic leakage, and electromagnetic induction.

[0136] In this embodiment, the heat conduction effect between electronic components of the circuit board refers to the effect caused by the diffusion of heat between different electronic components in the circuit board.

[0137] In this embodiment, the heat generation efficiency of the circuit board refers to the proportion of heat generated by the circuit board during operation that can be effectively utilized.

[0138] The beneficial effect of the above technical solution is: according to the factors affecting the heat generation efficiency and the potential thermal management problems of the circuit board, based on the heat generation, heat transfer and heat radiation of the circuit board, thermal simulation of the circuit board is performed to determine multiple indicators of the circuit board, and the heat generation efficiency of the circuit board is determined. It can better consider the influence of various complex factors, such as the thermal conductivity characteristics of the material and the complexity of the internal structure, and provide a more accurate estimate of the heat generation efficiency.

[0139] Embodiment 7:

[0140] Based on Example 6, the embodiment of the present invention evaluates the heat generation efficiency and optimizes the circuit board according to the evaluation result, including:

[0141] defining a heat generation efficiency index, and evaluating the heat generation efficiency of the circuit board according to the heat generation efficiency index;

[0142] According to the evaluation result, the thermal power is obtained based on the amount of heat generated per unit time;

[0143] A corresponding optimization strategy is determined according to the thermal power, the cause of low heat generation efficiency of the circuit board is obtained according to the optimization strategy, and the circuit board is optimized according to the cause.

[0144] In this embodiment, the heat generation efficiency index includes: heat generated per unit time and energy loss.

[0145] In this embodiment, the amount of heat generated per unit time is used to describe the amount of heat generated by the circuit board per unit time.

[0146] In this embodiment, the reasons for the low heat generation efficiency of the circuit board include:

[0147] The poor thermal conductivity of circuit board materials makes it difficult for heat to be dissipated quickly.

[0148] The unreasonable layout of the circuit board affects the flow and conversion of thermal energy.

[0149] The ambient temperature of the circuit board is too high or too low, which affects the thermal energy conversion efficiency.

[0150] There are problems with the manufacturing process of the circuit board, which affects the flow and conversion of thermal energy.

[0151] In this embodiment, optimizing the circuit board includes:

[0152] Replace materials with better thermal conductivity, such as copper, aluminum, etc., to increase the conduction rate of heat energy.

[0153] Redesign the layout of the board to allow heat to flow more efficiently from high-heat areas to low-heat areas while avoiding overcrowding of hot areas.

[0154] Improve the ambient temperature range to ensure that the circuit board can work normally at the appropriate temperature and achieve the best thermal energy conversion efficiency.

[0155] Improve the manufacturing process of circuit boards to reduce energy losses during heat flow and conversion.

[0156] The beneficial effects of the above technical solution are: the heat generation efficiency of the circuit board is evaluated according to the heat generation efficiency index, and the thermal power is obtained. The circuit board is optimized according to the corresponding optimization strategy, which can improve the stability and working performance of the circuit board, effectively control the heat generation efficiency of the circuit board, and avoid equipment damage caused by overheating of the circuit board.

[0157] Embodiment 8:

[0158] Based on Example 7, the embodiment of the present invention evaluates the heat generation efficiency of the circuit board according to the heat generation efficiency index, including:

[0159] Construct a temperature estimation model based on genetic algorithm, detect the working condition data of the circuit board, and train the temperature estimation model according to the working condition data;

[0160] Determine the voltage heat generation characteristics of the circuit board at different discharge rates, and determine the heat generation efficiency fluctuation curve of the circuit board at different discharge rates over time through the trained temperature estimation model based on the voltage heat generation characteristics;

[0161] Determine the heat dissipation efficiency of the circuit board at different discharge rates according to the fluctuation curve of the heat generation efficiency of the circuit board at different discharge rates over time;

[0162] Determine the heat dissipation execution parameter values ​​of the circuit board at different discharge rates based on the heat dissipation demand efficiency and the heat dissipation execution parameter mapping table;

[0163] Determine the heat generation execution parameter response value of the circuit board at different discharge rates according to the heat dissipation execution parameter value;

[0164] Obtaining performance parameters and operating parameters of the circuit board corresponding to the response value of the heat generation execution parameter, and determining the overload state of the circuit board according to the performance parameters and the operating parameters;

[0165] Determine a corresponding variation coefficient of the heat generation efficiency index based on the overload state of the circuit board, and obtain an adjustment value of the heat generation efficiency index according to the corresponding variation coefficient;

[0166] The heat generation efficiency of the circuit board is evaluated according to the adjustment value of the heat generation efficiency index.

[0167] In this embodiment, the genetic algorithm is a heuristic search algorithm based on biological evolution theory, which simulates the evolution process of species in nature and searches for the optimal solution through adaptability evaluation and genetic operation.

[0168] In this embodiment, the temperature estimation model refers to a model that uses mathematical or computer simulation methods to predict or estimate the temperature in an environment.

[0169] In this embodiment, the working condition data of the circuit board refers to data recording various parameters of the circuit board during use, such as temperature, humidity, vibration, and electromagnetic interference.

[0170] In this embodiment, the discharge rate refers to the maximum current value flowing through the circuit board in unit time.

[0171] In this embodiment, the voltage heat generation characteristic of the circuit board refers to the rule that the heat generated by the circuit board changes over time under a given voltage.

[0172] In this embodiment, the required heat dissipation efficiency of the circuit board refers to the heat dissipation problem that needs to be considered when designing the circuit board.

[0173] In this embodiment, the heat dissipation execution parameter mapping table of the circuit board describes the mapping relationship between the heat dissipation behavior and performance of the circuit board under different load and working environment conditions, which can be used to understand the thermal stability and thermal performance of the circuit board under different load conditions.

[0174] In this embodiment, the heat dissipation execution parameter value of the circuit board refers to various parameter values ​​exhibited by the circuit board during actual operation in a specific heat dissipation environment, including: temperature, heat, and power density.

[0175] In this embodiment, the heat generation execution parameter response value refers to the relationship between the heat generated by the circuit board or its related components and the current under specific working conditions.

[0176] In this embodiment, the performance parameters of the circuit board refer to important performance indicators that describe the circuit board during normal use, such as dielectric constant.

[0177] In this embodiment, the operating parameters of the circuit board include: resistance, capacitance, thermal resistance, and thermal capacity.

[0178] In this embodiment, the overload state of the circuit board refers to the working state of the circuit board when the current or voltage exceeds the limit value that the circuit board can withstand.

[0179] The beneficial effect of the above technical solution is: the corresponding variation coefficient of the heat generation efficiency index is determined according to the overload state of the circuit board, so as to obtain the adjustment value of the heat generation efficiency index to evaluate the heat generation efficiency of the circuit board, which can better evaluate the performance of the circuit board, timely discover and solve problems, and ensure that the circuit board can operate stably and reliably during use.

[0180] Through the description of the above implementation methods, those skilled in the art can clearly understand that each implementation method can be implemented by means of software plus a necessary general hardware platform, and of course, can also be implemented by hardware. Based on this understanding, the above technical solution is essentially or the part that contributes to the prior art can be embodied in the form of a software product, and the computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, a disk, an optical disk, etc., including a number of instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in each embodiment or some parts of the embodiments.

[0181] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for analyzing heat generation efficiency of a circuit board, characterized in that: include: Step 1: Acquire multiple relevant parameters of the circuit board, and determine temperature data of the circuit board during operation according to the relevant parameters; Step 2: Determine the temperature distribution and power consumption of each area according to the temperature data; Step 3: Obtaining heat generation of the circuit board under different conditions based on a mathematical model according to the temperature distribution of each area and the power consumption; Step 4: Obtaining factors affecting heat generation efficiency and potential thermal management problems of the circuit board based on the heat generation situation, the operating state of the circuit board and the setting of process parameters; Step 5: determining multiple indicators of the circuit board based on thermodynamic formulas according to factors affecting heat generation efficiency and potential thermal management problems of the circuit board, and determining the heat generation efficiency of the circuit board according to the multiple indicators; Step 6: Evaluate the heat generation efficiency and optimize the circuit board according to the evaluation result; Among them, according to the factors affecting the heat generation efficiency and the potential thermal management problems of the circuit board, multiple indicators of the circuit board are determined based on thermodynamic formulas, and the heat generation efficiency of the circuit board is determined according to the multiple indicators, including: The heat generation inside the circuit board is evaluated according to the heat conduction formula, the heat transfer in the air is evaluated according to the heat convection formula, and the heat radiation of the circuit board is evaluated according to the heat radiation formula; According to the factors affecting the heat generation efficiency and the potential thermal management problems of the circuit board, based on the heat generation, heat transfer and heat radiation of the circuit board, a thermal simulation is performed on the circuit board to determine multiple indicators of the circuit board, wherein the multiple indicators of the circuit board include: average temperature, heat flux density, heat dissipation conditions, and workload; The coupling effect and heat conduction effect between the electronic components of the circuit board are obtained according to the indicators, and the heat generation efficiency of the circuit board is determined based on finite element analysis.

2. The heat generation efficiency analysis method for a circuit board according to claim 1, characterized in that: Acquiring multiple relevant parameters of the circuit board and determining temperature data of the circuit board during operation according to the relevant parameters include: Obtaining the purpose and working characteristics of the circuit board, and determining the component layout of the circuit board based on the environment according to the purpose and working characteristics; Acquire the structure of the circuit board according to the component layout, and determine multiple relevant parameters of the circuit board based on the manual according to the structure; Determine the corresponding monitoring device based on the value range of the relevant parameters to obtain the key measurement point position of the circuit board; The monitoring device obtains temperature data of the circuit board after running for a preset time based on the position of the key measurement point.

3. The heat generation efficiency analysis method for a circuit board according to claim 1, characterized in that: Determining the temperature distribution and power consumption of each area according to the temperature data includes: Acquire the temperature value of each area at a specific time point according to the temperature data; Draw a temperature distribution diagram of the circuit board according to the temperature value of each area at a specific time point, and determine the temperature distribution of each area according to the temperature distribution diagram; Get the typical temperature of each area and compare it with the temperature distribution of each area to get the energy demand of each area; The power consumption of each zone is determined based on the power consumption pattern of the circuit board according to the energy requirement of each zone.

4. The heat generation efficiency analysis method for a circuit board according to claim 1, characterized in that: According to the temperature distribution of each area and the power consumption, the heat generation of the circuit board under different conditions is obtained based on a mathematical model, including: Build a mathematical model based on heat conduction according to multiple factors of the circuit board; Setting parameters and boundary conditions for the mathematical model, and obtaining heat generation of the circuit board under different conditions based on the set mathematical model according to the temperature distribution and power consumption of each area; The changes of key thermal parameters over time and space are obtained according to the heat generation situation, and the local and global behaviors of the heat are determined according to the changes.

5. The heat generation efficiency analysis method for a circuit board according to claim 1, characterized in that: According to the heat generation situation, based on the operating state of the circuit board and the setting of process parameters, factors affecting the heat generation efficiency and potential thermal management problems of the circuit board are obtained, including: Acquire information related to the running state and process parameters of the circuit board, acquire the information type of the information, and determine the data acquisition device according to the information type; Acquire data collected by a data acquisition device, analyze the data based on a machine learning algorithm, and acquire factors affecting heat generation efficiency under different working conditions based on the heat generation according to the analysis results; The relevant factors causing overheating and uneven heating of the circuit board are obtained based on the factors affecting the heat generation efficiency, the thermal runaway risk points of the circuit board are determined based on the relevant factors, and the potential thermal management problems of the circuit board are obtained based on the thermal runaway risk points.

6. The heat generation efficiency analysis method for a circuit board according to claim 1, characterized in that: The heat generation efficiency is evaluated, and the circuit board is optimized according to the evaluation result, including: defining a heat generation efficiency index, and evaluating the heat generation efficiency of the circuit board according to the heat generation efficiency index; According to the evaluation result, the thermal power is obtained based on the amount of heat generated per unit time; A corresponding optimization strategy is determined according to the thermal power, the cause of low heat generation efficiency of the circuit board is obtained according to the optimization strategy, and the circuit board is optimized according to the cause.

7. The heat generation efficiency analysis method for a circuit board according to claim 6, characterized in that: The heat generation efficiency of the circuit board is evaluated according to the heat generation efficiency index, including: Construct a temperature estimation model based on genetic algorithm, detect the working condition data of the circuit board, and train the temperature estimation model according to the working condition data; Determine the voltage heat generation characteristics of the circuit board at different discharge rates, and determine the heat generation efficiency fluctuation curve of the circuit board at different discharge rates over time through the trained temperature estimation model based on the voltage heat generation characteristics; Determine the heat dissipation efficiency of the circuit board at different discharge rates according to the fluctuation curve of the heat generation efficiency of the circuit board at different discharge rates over time; Determine the heat dissipation execution parameter values ​​of the circuit board at different discharge rates based on the heat dissipation demand efficiency and the heat dissipation execution parameter mapping table; Determine the heat generation execution parameter response value of the circuit board at different discharge rates according to the heat dissipation execution parameter value; Obtaining performance parameters and operating parameters of the circuit board corresponding to the response value of the heat generation execution parameter, and determining the overload state of the circuit board according to the performance parameters and the operating parameters; Determine a corresponding variation coefficient of the heat generation efficiency index based on the overload state of the circuit board, and obtain an adjustment value of the heat generation efficiency index according to the corresponding variation coefficient; The heat generation efficiency of the circuit board is evaluated according to the adjustment value of the heat generation efficiency index.

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