Structural parts and electronic equipment

Abstract

The present application provides a structural component and an electronic device, which relates to the technical field of electronic products. The structural component is conducive to the thinning development of electronic devices and can ensure the performance of antennas. The structural component includes a substrate and a radiator. The substrate is a fiber composite material. In a direction perpendicular to the thickness direction of the substrate, the substrate includes a first part and a second part connected. The equivalent dielectric constant of the first part is less than the equivalent dielectric constant of the second part. At least part of the radiator is arranged in the first part.

Description

Technical Field

[0001] The present application relates to the technical field of electronic products, and in particular to a structural component and an electronic device. Background Art

[0002] At present, antennas are usually set on the middle frame and the motherboard bracket. However, with the development of thinner electronic devices, the demand for thinner electronic devices has become stronger, and the thickness of the middle frame and the motherboard bracket has become thinner and thinner. However, the middle frame and the motherboard bracket still need to meet certain structural strength.

[0003] In order to ensure that the motherboard bracket and the middle frame have a certain structural strength under the premise of being thin, the current motherboard bracket and the middle frame are usually made of metal or fiber composite materials. However, high metal content or high fiber content will affect the performance of the antenna. Therefore, it has become a difficult problem in the industry to ensure that the performance of the antenna is not affected while promoting the development of thin electronic equipment. Summary of the invention

[0004] The present application provides a structural component and an electronic device, wherein the structural component is conducive to the thinning development of the electronic device and can ensure the performance of the antenna.

[0005] To achieve the above objectives, the embodiments of the present application adopt the following technical solutions:

[0006] In a first aspect, a structural component is provided, the structural component comprising a substrate and a radiator, the substrate being a fiber composite material, the substrate comprising a first portion and a second portion connected in a preset direction, the preset direction being perpendicular to a thickness direction of the substrate; the equivalent dielectric constant of the first portion is smaller than the equivalent dielectric constant of the second portion, and / or the equivalent dielectric loss of the first portion is smaller than the equivalent dielectric loss of the second portion. At least a portion of the radiator is disposed in the first portion.

[0007] In this way, the substrate is provided with a first part and a second part with different equivalent dielectric constants. On the one hand, the first part with a lower equivalent dielectric constant has less influence on the antenna performance, and at least part of the radiator is provided in the first part, which reduces the influence of the substrate on the radiator receiving and transmitting signals, and reduces the loss of the radiator during the transmission process. Moreover, in the first part with a lower equivalent dielectric constant, the radiator can reach a size closer to the free space wavelength, and the size of the radiator can be designed to be larger, thereby improving the radiation performance and bandwidth of the radiator.

[0008] On the other hand, the second part of the substrate is allowed to have a higher equivalent dielectric constant, that is, the second part may not have any requirements on the equivalent dielectric constant, and the second part may adopt a fiber composite material with higher structural strength to meet the structural strength requirements of the substrate.

[0009] In summary, the structural parts can not only reduce the impact of the substrate on the radiation performance of the radiator, but also take into account the structural strength of the substrate. In other words, the structural parts can improve the structural strength and protection ability of the substrate without reducing the performance of the radiator, thereby improving the overall performance and user experience of the mobile phone.

[0010] In a possible implementation of the first aspect, the substrate includes a fiber composite layer and a matrix, the fiber composite layer is embedded in the matrix; the fiber composite layer includes a first fiber portion located in the first part, and a second fiber portion located in the second part; the mesh number of the first fiber portion is smaller than the mesh number of the second fiber portion.

[0011] The mesh number of the first fiber portion is smaller than that of the second fiber portion, that is, the number of fiber lines in the first fiber portion per unit area is smaller than that of the second fiber portion, and thus the dielectric constant of the first fiber portion is smaller than that of the second fiber portion.

[0012] In this way, the equivalent dielectric constant of the first part composed of the first fiber part and the matrix is ​​smaller than the equivalent dielectric constant of the second part composed of the second fiber part and the matrix. The radiator is arranged in the first part, and the first part has a lower influence on the radiation performance of the radiator, thereby improving the radiation performance of the radiator.

[0013] In a possible implementation of the first aspect, the mesh number of the first fiber portion is greater than or equal to 140 and less than or equal to 280. The mesh number of the first fiber portion has a lower limit of 140, which can ensure the structural strength of the first portion. The mesh number of the first fiber portion has an upper limit of 280, which is conducive to reducing the dielectric constant of the first fiber portion, thereby reducing the equivalent dielectric constant of the first portion, and is conducive to improving the radiation performance of the radiator.

[0014] In a possible implementation of the first aspect, the first fiber portion includes a plurality of first fiber warps, the second fiber portion includes a plurality of second fiber warps, the first fiber warps and the second fiber warps both extend in a first direction, and the plurality of first fiber warps and the plurality of second fiber warps are both spaced apart in a direction perpendicular to the first direction. In the direction perpendicular to the first direction, the distance between two adjacent first fiber warps is greater than the distance between two adjacent second fiber warps.

[0015] In this way, the first fiber portion can obtain a smaller mesh count by increasing the distance between adjacent first fiber warps, thereby reducing the dielectric constant of the first fiber portion, further reducing the equivalent dielectric constant of the first portion, and improving the radiation performance of the radiator. The second fiber portion can obtain a larger mesh count by reducing the distance between adjacent second fiber warps, thereby increasing the number of second fiber warps in the second portion, and further enhancing the structural strength of the second portion.

[0016] In a possible implementation of the first aspect, the first fiber portion further includes a plurality of first fiber wefts, the second fiber portion further includes a plurality of second fiber wefts, the first fiber wefts and the second fiber wefts both extend along a second direction, the second direction intersects the first direction, and the plurality of first fiber wefts and the plurality of second fiber wefts are both spaced apart in a direction perpendicular to the second direction. In the direction perpendicular to the second direction, the distance between two adjacent first fiber wefts is greater than the distance between two adjacent second fiber wefts.

[0017] In this way, the first fiber portion can obtain a smaller mesh count by increasing the distance between adjacent first fiber wefts, thereby reducing the dielectric constant of the first fiber portion, further reducing the equivalent dielectric constant of the first portion, and improving the radiation performance of the radiator. The second fiber portion can obtain a larger mesh count by reducing the distance between adjacent second fiber wefts, thereby increasing the number of second fiber wefts in the second portion, and further enhancing the structural strength of the second portion.

[0018] In a possible implementation manner of the first aspect, the fiber composite layer is formed by interweaving a plurality of fiber lines, and the plurality of fiber lines satisfy at least one of the following conditions:

[0019] The tension of the fiber line of the first fiber part is less than the tension of the fiber line of the second fiber part;

[0020] The twist of the fiber line of the first fiber part is less than the twist of the fiber line of the second fiber part;

[0021] The diameter of the fiber strands of the first fiber portion is greater than the diameter of the fiber strands of the second fiber portion.

[0022] In this way, the first fiber portion can obtain a smaller mesh number by reducing the tension, twist, and diameter of the first fiber line, thereby reducing the dielectric constant of the first fiber portion, and further reducing the equivalent dielectric constant of the first part to improve the radiation performance of the radiator. The second fiber portion can obtain a larger mesh number by increasing the tension, twist, and diameter of the second fiber line, thereby increasing the number of second fiber lines in the second part, and further enhancing the structural strength of the second part.

[0023] In a possible implementation manner of the first aspect, the fiber composite layer is a twill fabric. The twill fabric can obtain a fiber composite layer with a lower dielectric constant.

[0024] In a possible implementation of the first aspect, the substrate includes a fiber composite layer and a matrix, the fiber composite layer is embedded in the matrix; the fiber composite layer includes a first fiber portion located in the first part, and a second fiber portion located in the second part. The dielectric constant of the material of the first fiber portion is smaller than the dielectric constant of the material of the second fiber portion. And / or, the dielectric loss of the material of the first fiber portion is smaller than the dielectric loss of the material of the second fiber portion.

[0025] In this way, the equivalent dielectric constant of the first part is adjusted by adjusting the dielectric constant of the first fiber part, and the equivalent dielectric constant of the second part is adjusted by adjusting the dielectric constant of the second fiber part. The dielectric constant of the material itself is more stable and is not easily affected by environmental changes (such as temperature, humidity, etc.).

[0026] In a possible implementation of the first aspect, the fiber composite layer is formed by interweaving a plurality of fiber lines, and the dielectric constant of the material of at least one fiber line of the first fiber portion is smaller than the dielectric constant of the material of the fiber line of the second fiber portion. The dielectric loss of the material of at least one fiber line of the first fiber portion is smaller than the dielectric loss of the material of the fiber line of the second fiber portion.

[0027] By replacing part of the fiber lines in the fiber composite layer with fiber lines with low dielectric constant, a first fiber portion with low dielectric constant and a second fiber portion with high structural strength are obtained. The dielectric constant of the fiber composite material is adjusted in this way, the adjustment method is flexible, and the accuracy of adjusting the dielectric constant of different areas of the fiber composite material layer is high.

[0028] By adjusting the dielectric constant of the fiber composite layer in this way, the dielectric constant of the fiber line can be adjusted in the local area of ​​the fiber composite layer according to the use requirements of different areas on the substrate, thereby obtaining a first part with a lower equivalent dielectric constant and a second part with a higher equivalent dielectric constant. The radiator is arranged in the first part to reduce the influence of the first part on the radiation performance of the radiator. The second part can ensure the structural strength and improve the protection function of the structural parts.

[0029] In a possible implementation manner of the first aspect, a dielectric constant of the first fiber portion is less than or equal to 4.8, and / or a dielectric loss of the first fiber portion is less than or equal to 0.02.

[0030] In a possible implementation of the first aspect, the dielectric constant of the matrix is ​​less than or equal to 3.5, and / or the dielectric loss of the matrix is ​​less than or equal to 0.01. In this way, the dielectric constant and dielectric loss of the first fiber portion are within the above ranges, which can ensure that the first fiber portion has a certain structural strength. The lower dielectric constant of the first fiber portion can reduce the loss of the electromagnetic wave of the radiator when it is transmitted therein, thereby improving the radiation performance of the radiator.

[0031] In a possible implementation of the first aspect, the fiber composite layer includes a third surface and a fourth surface that are opposite to each other along its thickness direction. The substrate includes a first substrate portion and a second substrate portion, the first substrate portion covers the third surface, and the second substrate portion covers the fourth surface. Along the thickness direction of the fiber composite layer, the average thickness of the first substrate portion is greater than the average thickness of the second substrate portion.

[0032] In this way, the substrate adjusts the dielectric constant of the substrate and the setting position of the radiator through the non-uniform distribution of the substrate. In detail, the larger the volume proportion of the substrate in the fiber composite material, the smaller the dielectric constant of the fiber composite material; the smaller the volume proportion of the substrate in the fiber composite material, the larger the dielectric constant of the fiber composite material. The radiator is arranged in the first substrate part, which is also conducive to reducing the influence of the fiber composite material on the radiation performance of the radiator, thereby improving the radiation performance of the radiator.

[0033] In a possible implementation of the first aspect, the radiator is embedded in the first substrate portion. In this way, the radiator does not occupy the internal space of the housing, which is conducive to improving the utilization rate of the internal space of the housing. In addition, the mutual interference between the radiator and other electronic components in the housing can be reduced. Furthermore, the substrate covers the radiator, and the substrate plays a good protective role on the radiator, preventing the radiator from being damaged by impact or scratching.

[0034] In a possible implementation of the first aspect, the radiator is disposed on the surface of the first base portion. In this way, there is no need to provide an avoidance hole for installing the electrical connection structure on the substrate, which is conducive to maintaining the integrity of the substrate and further improving the structural strength of the substrate.

[0035] In a possible implementation of the first aspect, the first substrate portion is located in the main radiation direction of the radiator. In this way, the fiber composite layer usually has a higher dielectric constant and loss factor, resulting in additional loss of the radiation signal when passing through the fiber composite layer. The radiator is arranged on the side away from the fiber composite layer, which can reduce the path of the radiation signal through the fiber composite layer, thereby reducing dielectric loss and improving radiation efficiency. The fiber composite layer will also cause scattering and pattern interference of electromagnetic waves, affecting the radiation pattern of the antenna. The radiator is away from the fiber composite layer, which can reduce such interference and maintain the directivity and gain of the radiator. Since the path of the radiation signal through the fiber layer is reduced to improve the radiation efficiency of the radiator, more energy can be effectively radiated instead of being absorbed or scattered by the fiber composite material.

[0036] In a possible implementation of the first aspect, the ratio of the volume of the fiber composite layer to the volume of the substrate is greater than or equal to 1.5 and less than or equal to 2.4. In this way, the ratio of the volume of the fiber composite layer to the volume of the substrate has a lower limit of 1.5, and the structural strength of the substrate is relatively high. The volume of the fiber composite layer has an upper limit of 2.4 to the volume of the substrate, thereby reducing the dielectric constant of the substrate. The radiator is arranged on the substrate, which is conducive to reducing the influence of the substrate on the radiation performance of the radiator, thereby improving the radiation performance of the radiator.

[0037] In a possible implementation manner of the first aspect, along the thickness direction of the substrate, a vertical projection of the radiator on the third surface is located in the region where the first portion is located, which is beneficial to improving the radiation performance of the radiator.

[0038] In a second aspect, the present application further provides a structural member, which includes a substrate and a radiator. The substrate includes a fiber composite layer and a matrix, the fiber composite layer is embedded in the matrix, and the ratio of the volume of the fiber composite layer to the volume of the matrix is ​​greater than or equal to 1.5 and less than or equal to 2.4. The radiator is arranged on the substrate.

[0039] In a third aspect, the present application further provides a structural member, which includes a substrate and a radiator. The fiber composite layer is embedded in the substrate, and the fiber composite layer includes a first surface and a second surface opposite to each other along its thickness direction; the substrate includes a first substrate part and a second substrate part, the first substrate part covers the first surface, and the second substrate part covers the second surface; along the thickness direction of the fiber composite layer, the average thickness of the first substrate part is greater than the average thickness of the second substrate part; the radiator is arranged in the first substrate part. And / or, the radiator is arranged on the surface of the first substrate part.

[0040] In a fourth aspect, the present application further provides an electronic device, which includes a structural member and a circuit board, wherein the structural member is the structural member in the above embodiment, and the structural member further includes a feeding part, and the feeding part is electrically connected to the radiator of the structural member. The circuit board has an antenna transceiver, and the radiator is electrically connected to the antenna transceiver through the feeding part.

[0041] In a possible implementation manner of the fourth aspect, the electronic device further includes a back cover, and the structural member forms the back cover.

[0042] In a possible implementation manner of the fourth aspect, the electronic device further includes a bracket, where the bracket is used to fix the circuit board, and the structural member forms the bracket.

[0043] Among them, the technical effects brought about by the design method of the fourth aspect can refer to the technical effects brought about by different design methods in the first aspect, the second aspect and the third aspect, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 A perspective view of an electronic device provided for some embodiments of the present application;

[0045] Figure 2 for Figure 1 an exploded view of the electronic device shown;

[0046] Figure 3 for Figure 2 Schematic diagram of the structure of the middle back cover and the second antenna observed from the perspective of Y1;

[0047] Figure 4 A schematic diagram of a structure of a structural member provided in some embodiments of the present application;

[0048] Figure 5 A schematic diagram of a structure of a structural member provided in some embodiments of the present application;

[0049] Figure 6 A schematic diagram of a structure of a structural member provided in some further embodiments of the present application;

[0050] Figure 7 A schematic diagram of a structure of a structural member provided in some further embodiments of the present application;

[0051] Figure 8 for Figure 4 a bottom view of the structural member shown;

[0052] Fig. 9 A bottom view of a structural member provided in some other embodiments of the present application;

[0053] Fig.10 A schematic diagram of a structure of a structural member provided in some embodiments of the present application;

[0054] Fig.11 for Fig.10 a bottom view of the structural member shown;

[0055] Fig.12 Schematic diagrams of structural members provided for some further embodiments of the present application;

[0056] Fig.13 A schematic diagram of a planar structure of a fiber composite layer provided in some embodiments of the present application;

[0057] Fig.14 A schematic diagram of a planar structure of a fiber composite layer provided in some other embodiments of the present application;

[0058] Fig.15 A schematic diagram of a planar structure of a fiber composite layer provided in some further embodiments of the present application;

[0059] Fig.16 A schematic diagram of a planar structure of a fiber composite layer provided in some further embodiments of the present application;

[0060] Fig.17 A schematic diagram of a planar structure of a fiber composite layer provided in some further embodiments of the present application;

[0061] Fig.18 A schematic diagram of a planar structure of a fiber composite layer provided in some further embodiments of the present application;

[0062] Fig.19 A schematic diagram of a planar structure of a fiber composite layer provided in some further embodiments of the present application;

[0063] Fig. 20 A schematic diagram of a planar structure of a fiber composite layer provided in some further embodiments of the present application;

[0064] Fig.21 A schematic diagram of a planar structure of a fiber composite layer provided in some further embodiments of the present application;

[0065] Fig. 22 A schematic diagram of a planar structure of a fiber composite layer provided in some further embodiments of the present application;

[0066] Fig.23 A schematic diagram of the structure of the second fiber portion provided in some embodiments of the present application;

[0067] Fig.24 A schematic diagram of the structure of the first fiber portion provided in some embodiments of the present application;

[0068] Fig.25 A schematic diagram of the structure of a substrate provided in some embodiments of the present application;

[0069] Fig.26 A schematic structural diagram of a substrate provided in some further embodiments of the present application.

[0070] Reference numerals:

[0071] 100. Electronic equipment;

[0072] 10. Screen; 11. Translucent cover; 12. Display screen;

[0073] 20. housing; 21. back cover; 211. third surface; 212. fourth surface; 213. exterior;

[0074] 22. frame; 23. middle plate; 30. circuit board assembly; 31. circuit board body; 32. bracket; 33. spring piece; 34. antenna transceiver; 40. antenna; 41. first antenna; 42. second antenna; 40a. radiator; 40b. feeder; 40c. electrical connection structure; 50. structural member; 51. substrate; 52. fiber composite layer; 521. first fiber portion; 521a. first fiber warp; 521b. first fiber weft; 52a. first surface; 52b. second surface; 522. second fiber portion; 522a. second fiber warp; 522b. second fiber weft; 53. base; 531. first base part; 532. second base part; 50a. first part; 50b. second part; 50a1. first area; 50b1. second area; 60. camera mounting hole; 61. camera decoration. DETAILED DESCRIPTION

[0075] In the embodiments of the present application, the terms "first", "second", "third", "fourth", and "fifth" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", "third", "fourth", and "fifth" may explicitly or implicitly include one or more of the features.

[0076] In the embodiments of the present application, the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0077] In the embodiments of the present application, unless otherwise specified, the description "parallel" means approximately parallel within a certain error range, and the error range may be a range of less than or equal to 5° relative to the absolute parallel deviation angle. The description "perpendicular" means approximately perpendicular within a certain error range, and the error range may be a range of less than or equal to 5° relative to the absolute perpendicular deviation angle.

[0078] In the embodiments of the present application, unless otherwise specified, the description of two objects "overlapping" includes four possible implementations: one object partially overlaps the other object as a whole, the other object partially overlaps the one object as a whole, the one object as a whole overlaps the other object as a whole, and the one object partially overlaps the other object as a part. The description of two objects "overlapping" means that the middle and edges of the two objects completely overlap.

[0079] The present application provides an electronic device with an antenna, which may be a user equipment (UE) or a terminal. For example, the electronic device may be a portable android device (PAD), a laptop computer, a personal digital assistant (PDA), a handheld device with wireless communication function, a computing device, a vehicle-mounted device, a wearable device, a virtual reality (VR) terminal device (such as VR glasses), an augmented reality (AR) terminal device (such as AR glasses), and other mobile terminals or fixed terminals. The form of the electronic device in the embodiments of the present application is not specifically limited.

[0080] See also Figure 1 , Figure 1 A three-dimensional diagram of an electronic device 100 provided in some embodiments of the present application. This embodiment and the following embodiments are exemplified by the electronic device 100 being a handheld device with a wireless communication function, which can be, for example, a mobile phone. The embodiments of the present application are described by taking a straight-bar mobile phone as an example. In some other embodiments, the mobile phone can also be a foldable mobile phone.

[0081] The electronic device 100 is generally in the shape of a rectangular plate. Based on this, in order to facilitate the description of each embodiment below, an XYZ coordinate system is established, specifically defining the width direction of the electronic device 100 as the X-axis direction, the length direction of the electronic device 100 as the Y-axis direction, and the thickness direction of the electronic device 100 as the Z-axis direction.

[0082] It is understandable that the coordinate system of the electronic device 100 can be flexibly set according to actual needs, and no specific limitation is made here. When the electronic device 100 is other products, the electronic device 100 can also be roughly in the shape of a square plate, a circular plate, etc., and no specific limitation is made here.

[0083] Please also read Figure 1 and Figure 2 , Figure 2 for Figure 1 An exploded view of the electronic device 100 is shown. The electronic device 100 includes a screen 10, a housing 20, a circuit board assembly 30 and an antenna 40.

[0084] Understandably, Figure 1 and Figure 2 The electronic device 100 includes some components, and the actual shape, size, position and structure of these components are not limited to the following. Figure 1 and Figure 2 In some other examples, the electronic device 100 may not include the screen 10.

[0085] The screen 10 is used to display images, videos, etc. The screen 10 includes a light-transmitting cover plate 11 and a display screen 12. The light-transmitting cover plate 11 and the display screen 12 are stacked. The light-transmitting cover plate 11 is mainly used to protect the display screen 12 and prevent dust.

[0086] The housing 20 is used to protect the internal electronic components of the electronic device 100, and the housing 20 may include a back cover 21 and a frame 22. The back cover 21 is located on the side of the display screen 12 away from the light-transmitting cover plate 11, and is spaced apart from the display screen 12. The frame 22 is located between the back cover 21 and the screen 10, and is arranged along the edge of the back cover 21 and the edge of the screen 10.

[0087] The frame 22 is fixed to the back cover 21. Exemplarily, the frame 22 can be fixed to the back cover 21 by adhesive. The frame 22 can also be an integrally formed structure with the back cover 21, that is, the frame 22 and the back cover 21 are an integral structure. The light-transmitting cover plate 11 is fixed to the frame 22, and the light-transmitting cover plate 11, the frame 22 and the back cover 21 form a receiving cavity.

[0088] In some embodiments, please refer to Figure 2 The housing 20 further includes a middle plate 23. The middle plate 23 is fixed to the inner surface of the frame 22. For example, the middle plate 23 can be fixed to the frame 22 by welding. The middle plate 23 can also be an integrally formed structure with the frame 22. The middle plate 23 is used as a structural "skeleton" of the electronic device 100, and is used to support and fix the electronic components in the electronic device 100.

[0089] The circuit board assembly 30 is accommodated in the accommodating cavity. In some embodiments, the circuit board assembly 30 is fixed to the middle plate 23. In other embodiments, when the electronic device 100 does not include the middle plate 23, the circuit board assembly 30 may also be fixed to the back cover 21 or the frame 22.

[0090] The circuit board assembly 30 includes a circuit board body 31 and a bracket 32. The circuit board body 31 is used to carry and connect some electronic components in the electronic device 100, such as a processor (CPU), memory (RAM), storage (ROM), power management chip, wireless communication module (such as baseband processor, Wi-Fi and Bluetooth module) and other sensors and interfaces to realize functions such as data processing, storage, power management and user interaction.

[0091] The bracket 32 ​​is also called a circuit board bracket 32 ​​or a mainboard bracket 32. The mainboard bracket 32 ​​is used to fix and support the circuit board body 31 to ensure that the circuit board body 31 remains stable in the housing 20 to prevent displacement or damage caused by vibration, impact or falling.

[0092] The antenna 40 is used to transmit and receive signals to realize the communication function of the electronic device 100. The antenna 40 includes but is not limited to a low frequency antenna 40, a medium and high frequency antenna 40, a wireless fidelity (WIFI) antenna 40, a Sub6G antenna 40, a millimeter wave antenna 40, etc. The antenna 40 includes a first antenna 41 and a second antenna 42, and the first antenna 41 is disposed on the bracket 32.

[0093] See also Figure 3 , Figure 3 for Figure 2A schematic diagram of the structure of the back cover 21 and the second antenna 42 observed from the perspective of Y1. The second antenna 42 is disposed on the back cover 21, and the first antenna 41 and the second antenna 42 are respectively electrically connected to the circuit board body 31 to achieve signal transmission between the antenna 40 and the circuit board. For example, the first antenna 41 and the second antenna 42 can be electrically connected to the circuit board by means of the spring 33.

[0094] As the electronic device 100 is becoming thinner and lighter, the thickness of the bracket 32 ​​and the thickness of the back cover 21 are getting thinner and thinner. In order to meet the structural strength of the bracket 32 ​​and the back cover 21, the bracket 32 ​​and the back cover 21 are usually made of materials with high structural strength. In some embodiments, the material of the bracket 32 ​​and the material of the back cover 21 can be a metal material, such as stainless steel, aluminum alloy, titanium alloy, etc. However, metal has a shielding effect on electromagnetic waves, which seriously affects the performance of the antenna 40.

[0095] In some other embodiments, the material of the bracket 32 ​​and the material of the back cover 21 can be a fiber composite material with high structural strength, such as a carbon fiber composite material, a glass fiber composite material, an aramid fiber composite material, a polyimide fiber composite material, etc.

[0096] However, the fiber composite material has a relatively high dielectric constant (DK) and a relatively high dielectric loss factor (DF). The relatively high dielectric constant and dielectric loss factor of the bracket 32 ​​and the back cover 21 may affect the performance of the antenna 40 .

[0097] To elaborate, the propagation speed of electromagnetic waves in materials with higher dielectric constants slows down, and materials with higher dielectric constants also increase the effective capacitance of antenna 40, and the resonant frequency of antenna 40 is inversely proportional to the effective capacitance, and the resonant frequency of antenna 40 decreases. The size of antenna 40 is proportional to the resonant frequency, so the size of antenna 40 decreases, which in turn reduces the radiation efficiency. Electromagnetic waves propagate in materials with higher dielectric loss factors, which will cause more energy loss and reduce the radiation efficiency of antenna 40, thereby affecting the communication distance and signal quality.

[0098] In summary, when the bracket 32 ​​and the back cover 21 are made of fiber composite materials with high structural strength, the performance of the antenna 40 cannot be taken into account. In order to solve the above problems, the present application also provides a structural member 50, which is intended to reduce the impact of the fiber composite material on the performance of the antenna 40, and improve the performance of the antenna 40 when it is set on the fiber composite material while ensuring the structural strength of the structural member 50.

[0099] See also Figure 4 , Figure 4The schematic diagram of the structure of the structural member 50 provided in some embodiments of the present application. The structural member 50 includes a substrate 51 and a radiator 40a. The substrate 51 can be a bracket 32, or a back cover 21. The embodiments of the present application are first described by taking the structural member 50 as the back cover 21 as an example.

[0100] The substrate 51 is a fiber composite material. The substrate 51 may be a flat plate structure, for example, a rectangular plate, a circular plate, or a special-shaped plate. The present application embodiment takes the substrate 51 as a rectangular flat plate as an example for explanation. The substrate 51 includes a fiber composite layer 52 and a matrix 53. The fiber composite layer 52 may be glass fiber, carbon fiber, aramid fiber, basalt fiber, etc. The fiber has properties such as high strength, high modulus, and light weight, so that the substrate 51 can be both light and thin and have structural strength.

[0101] In some embodiments, the number of the fiber composite layer 52 may be only one. In other embodiments, the number of the fiber composite layers 52 may be two, three, four, five, etc. The embodiment of the present application is described by taking the number of the fiber composite layers 52 as four as an example, but this is not a special limitation of the present application. The number of the fiber composite layers 52 can be set according to the structural strength requirement of the structural member 50. The higher the structural strength requirement of the structural member 50, the more the number of the fiber composite layers 52.

[0102] In the thickness direction of the substrate 51, the plurality of fiber composite layers 52 are stacked one on another. For example, the adjacent fiber composite layers 52 may be stacked and contacted. For another example, the adjacent fiber composite layers 52 may be stacked and spaced apart. For another example, some of the adjacent fiber composite layers 52 may be stacked and contacted, and another portion of the adjacent fiber composite layers 52 may be stacked and spaced apart.

[0103] The fiber composite layer 52 is embedded in the matrix 53, and the matrix 53 is used to fix and protect the fiber composite layer 52. The matrix 53 can be a resin material, and the resin material can be a thermoplastic material, such as polyphenylene ether, polyimide, etc. The resin material can also be a thermosetting resin, such as epoxy resin, bismaleimide, benzoxazine, etc.

[0104] The substrate 51 includes a first portion 50a and a second portion 50b connected along a preset direction, wherein the preset direction is perpendicular to the thickness direction of the substrate. Figure 4 The equivalent dielectric constant of the first portion 50a is smaller than the equivalent dielectric constant of the second portion 50b. The equivalent dielectric constant is used to describe the overall dielectric properties of the composite material or layered structure.

[0105] In some embodiments, the equivalent dielectric loss of the first portion 50a is less than the equivalent dielectric loss of the second portion 50b. The equivalent dielectric loss is a parameter used to describe the overall energy loss characteristics of a complex dielectric system or a composite dielectric material under an electric field.

[0106] The radiator 40a is a part of the antenna 40 for receiving and transmitting signals, and the radiator 40a is disposed on the substrate 51. Further, at least a part of the radiator 40a is disposed on the first part 50a. Specifically, the substrate 51 includes a third surface 211 and a fourth surface 212 that are opposite to each other along its thickness direction, wherein the third surface 211 is a side surface of the back cover 21 that is opposite to the display screen 12. Along the thickness direction of the substrate 51, the vertical projection of the radiator 40a on the third surface 211 overlaps with the area where the first part 50a is located.

[0107] In this way, the substrate 51 is provided with a first part 50a and a second part 50b with different equivalent dielectric constants. On the one hand, the first part 50a with a lower equivalent dielectric constant has less influence on the performance of the antenna 40. At least part of the radiator 40a is provided in the first part 50a, which reduces the influence of the substrate 51 on the reception and transmission of signals by the radiator 40a and reduces the loss of the radiator 40a during the transmission process. Moreover, in the first part 50a with a lower equivalent dielectric constant, the radiator 40a can reach a size closer to the free space wavelength, and the size of the radiator 40a can be designed to be larger, thereby improving the radiation performance and bandwidth of the radiator 40a.

[0108] On the other hand, the second part 50 b of the substrate 51 is allowed to have a higher equivalent dielectric constant, that is, the second part 50 b may not have any requirements for the equivalent dielectric constant, and the second part 50 b may adopt a fiber composite material with higher structural strength to meet the structural strength requirements of the substrate 51 .

[0109] In summary, the structural member 50 can not only reduce the influence of the substrate 51 on the radiation performance of the radiator 40a, but also take into account the structural strength of the substrate 51. In other words, the structural member 50 can improve the structural strength and protection capability of the substrate 51 without reducing the performance of the radiator 40a, thereby improving the overall performance and user experience of the mobile phone.

[0110] The position where the radiator 40 a is disposed on the substrate 51 and the relative position relationship between the radiator 40 a and the first portion 50 a are described in detail below.

[0111] Please continue reading Figure 4The radiator 40a can be disposed on the fourth surface 212 of the substrate 51, that is, the surface of the substrate 51 facing the inside of the electronic device 100. The structural member 50 further includes a feeding portion 40b. The radiator 40a and the feeding portion 40b constitute the antenna 40 of the electronic device 100. The feeding portion 40b is electrically connected to the radiator 40a.

[0112] The feeding portion 40b can be electrically connected to the antenna transceiver 34 on the circuit board through the spring 33. Specifically, after the back cover 21 is installed on the middle frame, the spring 33 is squeezed between the antenna 40 and the antenna transceiver 34. In this way, the antenna 40 is directly connected to the antenna transceiver 34 through the spring 33, which can ensure the stability of the connection between the antenna 40 and the antenna transceiver 34 and the high efficiency of the energy transmission of the antenna 40.

[0113] See also Figure 5 , Figure 5 Schematic diagram of the structure of the structural member 50 provided in some other embodiments of the present application. In other embodiments, the radiator 40a can be arranged on the third surface 211 of the substrate 51, and the third surface 211 is the surface of the substrate 51 on the side facing away from the display screen 12. In this way, the radiator 40a will not occupy the internal space of the housing 20, which is conducive to improving the utilization rate of the internal space of the housing 20. In addition, the influence of the substrate 51 on the radiation signal of the radiator 40a can be reduced, thereby improving the radiation performance of the radiator 40a.

[0114] The structural member 50 may further include a feeding portion 40b and an electrical connection structure 40c, and the radiator 40a, the feeding portion 40b and the electrical connection structure 40c constitute the antenna 40 of the electronic device 100. The substrate 51 has an escape hole connecting the radiator 40a and the feeding portion 40b, and the escape hole is a through hole penetrating the third surface 211 and the fourth surface 212.

[0115] The electrical connection structure 40c is disposed in the avoidance hole, one end of the electrical connection structure 40c is electrically connected to the radiator 40a, and the other end of the electrical connection structure 40c is electrically connected to the feeder 40b. In other words, the radiator 40a and the feeder 40b are electrically connected by means of the electrical connection structure 40c, so as to transmit the radio frequency signal of the antenna transceiver 34 to the radiator 40a.

[0116] Based on this embodiment, the structural member 50 may further include an appearance portion 213 , which may be leather. The appearance portion 213 is stacked on the third surface 211 to cover the radiator 40 a , thereby improving the aesthetics of the electronic device 100 .

[0117] See also Figure 6 , Figure 6Schematic diagram of the structure of the structural member 50 provided in some embodiments of the present application. In some embodiments, the radiator 40a can be embedded in the substrate 51, and specifically, the radiator 40a can be embedded in the first part 50a.

[0118] In this way, the radiator 40a will not occupy the internal space of the housing 20, which is conducive to improving the utilization rate of the internal space of the housing 20. In addition, the mutual interference between the radiator 40a and other electronic components in the housing 20 can be reduced. Furthermore, the substrate 51 covers the radiator 40a, and the substrate 51 plays a good protective role on the radiator 40a, preventing the radiator 40a from being damaged by impact or scratching.

[0119] Similarly, the structural member 50 may further include a feeding portion 40b and an electrical connection structure 40c, and the radiator 40a, the feeding portion 40b and the electrical connection structure 40c constitute the antenna 40 of the electronic device 100. Different from the above-mentioned embodiment, the avoidance hole in this embodiment is a blind hole, and the avoidance hole passes through the fourth surface 212 to the inside of the substrate 51.

[0120] See also Figure 7 , Figure 7 Schematic diagram of the structure of the structural member 50 provided in some embodiments of the present application. In other embodiments, the antenna 40 can be electrically connected to the antenna transceiver 34 by coupling feeding. In other words, the radiator 40a can be connected to the antenna transceiver 34 without being connected to the antenna transceiver 34 through the electrical connection structure 40c, and the radiator 40a and the antenna transceiver 34 transmit electromagnetic waves through near-field coupling (such as magnetic coupling or electrical coupling).

[0121] In this way, there is no need to provide an avoidance hole for installing the electrical connection structure 40 c on the substrate 51 , which is beneficial to maintaining the integrity of the substrate 51 and further improving the structural strength of the substrate 51 .

[0122] See also Figure 8 , Figure 8 for Figure 4 In some embodiments, the fourth surface 212 includes a first region 50a1 and a second region 50b1 connected to each other, along the thickness direction of the substrate 51, that is, Figure 8 In the Z-axis direction, the portion covered by the first region 50a1 is the first portion 50a of the substrate 51 , and the portion covered by the second region 50b1 is the second portion 50b of the substrate 51 .

[0123] For example, the first area 50a1 is rectangular, circular, or irregular, and the present application embodiment is described by taking the first area 50a1 as a rectangle as an example. The second area 50b1 is arranged around the first area 50a1, and the second area 50b1 is connected to the first area 50a1.

[0124] See also Fig. 9 , Fig. 9 The bottom view of the structural member 50 provided in some other embodiments of the present application. In some other embodiments, the second area 50b1 can also be arranged on both sides of the first area 50a1. In some other embodiments, the second area 50b1 can also be located on one side of the first area 50a1.

[0125] At least part of the radiator 40a is disposed in the first portion 50a. That is, along the thickness direction of the substrate 51, the vertical projection of the radiator 40a on the fourth surface 212 overlaps with the region (first region 50a1) where the first portion 50a is located. "Overlap" includes the following two aspects: first, the vertical projection of the radiator 40a on the third surface 211 is entirely located in the region where the first portion 50a is located.

[0126] Second, see Fig.10 and Fig.11 , Fig.10 A schematic diagram of the structure of a structural member 50 provided in some other embodiments of the present application; Fig.11 for Fig.10 The bottom view of the structure 50 is shown. The vertical projection of the first radiator 40a on the fourth surface 212 partially overlaps with the area (first area 50a1) where the first portion 50a is located, and partially does not overlap.

[0127] The embodiment of the present application is described by taking the vertical projection of the radiator 40a on the third surface 211 as an example in which all of the vertical projections of the radiator 40a are located in the area where the first portion 50a is located, but this does not represent a special limitation to the present application.

[0128] In some embodiments, see Fig.12 , Fig.12 Schematic diagram of a structural member 50 provided in some embodiments of the present application. When the substrate 51 is used as the back cover 21, the substrate 51 has a mounting hole 60 for mounting a camera. In order to improve the aesthetics of the back cover 21, a camera decoration 61 is arranged in the mounting hole 60. The camera decoration 61 has a high structural strength. Therefore, the radiator 40a can be arranged in the substrate 51 area around the camera decoration 61.

[0129] In this way, the portion of the substrate 51 used to set the radiator 40a has the risk of reduced structural strength. The radiator 40a is set in the peripheral area of ​​the camera decoration 61 with higher structural strength. The camera decoration 61 can provide support for the radiator 40a, which can compensate for the loss of structural strength of the substrate 51 caused by the setting of the radiator 40a and maintain the overall mechanical stability of the substrate 51.

[0130] Moreover, the camera decoration 61 can disperse the local stress caused by the setting of the radiator 40a, reducing the risk of damage to the back cover 21 when it is impacted. The camera decoration 61 can also protect the radiator 40a, reducing the damage to the radiator 40a caused by collision or extrusion.

[0131] Fig.12 In the embodiment shown, there are multiple radiators 40a, and for example, there are three radiators 40a. In some other embodiments, there may be one radiator 40a. The dotted line portion is the area where the first portion 50a is located (i.e., the first area 50a1), and all of the multiple radiators 40a are disposed in the first portion 50a.

[0132] The equivalent dielectric constant of the substrate 51 is affected by many factors, such as the weaving mesh of the fiber composite material, the dielectric properties of the fiber material, the dielectric properties of the matrix 53 material, the weaving method of the fiber, the ratio of the volume of the fiber composite material to the volume of the matrix 53, etc. The factors affecting the equivalent dielectric constant of the substrate 51 are described below.

[0133] See also Fig.13 , Fig.13 Schematic diagram of the planar structure of the fiber composite layer 52 provided in some embodiments of the present application. The area surrounded by the dotted line is the first part 50a, and the part outside the dotted line is the second part 50b. The fiber composite layer 52 is woven from a plurality of fiber threads, and for example, the plurality of fiber threads include a plurality of fiber warps and a plurality of fiber wefts, and the fiber warps and fiber wefts are woven to form a fiber composite material.

[0134] The fiber composite layer 52 includes a first fiber portion 521 located in the first portion 50a and a second fiber portion 522 located in the second portion 50b, and the mesh number of the first fiber portion 521 is smaller than the mesh number of the second fiber portion 522. The mesh number of the fiber composite material refers to the number of fiber lines in the fiber composite material per unit area. The greater the mesh number of the fiber composite material, the greater the number of fiber lines per unit area, which means that the dielectric constant of the fiber composite material is greater.

[0135] The mesh number of the first fiber portion 521 is smaller than that of the second fiber portion 522 , that is, the number of fiber lines of the first fiber portion 521 per unit area is smaller than that of the second fiber portion 522 , and thus the dielectric constant of the first fiber portion 521 is smaller than that of the second fiber portion 522 .

[0136] As a result, the equivalent dielectric constant of the first portion 50a composed of the first fiber portion 521 and the matrix 53 is smaller than the equivalent dielectric constant of the second portion 50b composed of the second fiber portion 522 and the matrix 53. The radiator 40a is disposed in the first portion 50a, and the first portion 50a has a relatively low influence on the radiation performance of the radiator 40a, thereby improving the radiation performance of the radiator 40a.

[0137] In some embodiments, the mesh number of the first fiber portion 521 is greater than or equal to 140 and less than or equal to 280. That is, in each square inch, the number of fiber lines of the first fiber portion 521 is greater than or equal to 140 and less than or equal to 280. For example, the mesh number of the first fiber portion 521 is 140, 150, 160, 170, 180, 190, 200, 210, 220, 230, 240, 250, 260, 270, 280, and the like.

[0138] The mesh number of the first fiber portion 521 has a lower limit of 140, which can ensure the structural strength of the first portion 50a. The mesh number of the first fiber portion 521 has an upper limit of 280, which is conducive to reducing the dielectric constant of the first fiber portion 521, thereby reducing the equivalent dielectric constant of the first portion 50a, and is conducive to improving the radiation performance of the radiator 40a.

[0139] Please continue reading Fig.13 The first fiber part 521 is woven from a plurality of first fiber lines, and the second fiber part 522 is woven from a plurality of second fiber lines. The first fiber part 521 can adjust its mesh count by adjusting parameters such as the tension, twist, diameter, and density of the first fiber lines. Similarly, the second fiber part 522 can also adjust its mesh count by adjusting parameters such as the tension, twist, diameter, and density of the second fiber lines.

[0140] Please continue reading Fig.13 The first fiber portion 521 includes a plurality of first fiber warps 521a and a plurality of first fiber wefts 521b. The plurality of first fiber warps 521a extend along a first direction (Y-axis direction), and in a direction perpendicular to the first direction, that is, in the X-axis direction, adjacent first fiber warps 521a are arranged at intervals. The plurality of second fiber wefts 522b extend along a second direction (X-axis direction), and in a direction perpendicular to the second direction, that is, in the Y-axis direction, adjacent second fiber wefts 522b are arranged at intervals. The plurality of first fiber warps 521a and the plurality of first fiber wefts 521b are interwoven to form the first fiber portion 521.

[0141] Please continue reading Fig.13Similarly, the second fiber portion 522 includes a plurality of second fiber warps 522a and a plurality of second fiber wefts 522b. The plurality of second fiber warps 522a extend along the first direction (Y-axis direction), and in a direction perpendicular to the first direction, that is, in the X-axis direction, adjacent second fiber warps 522a are arranged at intervals. The plurality of second fiber wefts 522b extend along the second direction (X-axis direction), and in a direction perpendicular to the second direction, that is, in the Y-axis direction, adjacent second fiber wefts 522b are arranged at intervals. The plurality of second fiber warps 522a and the plurality of second fiber wefts 522b are interwoven to form the second fiber portion 522.

[0142] See also Fig.14 , Fig.14 A schematic diagram of the planar structure of a fiber composite layer 52 provided for some other embodiments of the present application. In some embodiments, the density of the first fiber portion 521 is greater than the density of the second fiber portion 522. For example, in a direction perpendicular to the first direction, the distance L1 between two adjacent first fiber warps 521a is greater than the distance L2 between two adjacent second fiber warps 522a. In a fiber composite material, the greater the distance between adjacent fiber lines, the fewer the number of fiber lines in the fiber composite material per unit area, that is, the smaller the mesh count of the fiber composite material. The smaller the distance between adjacent fiber lines, the more the number of fiber lines in the fiber composite material per unit area, that is, the larger the mesh count of the fiber composite material.

[0143] From another perspective, the larger the distance L1 between adjacent first fiber warps 521a, the smaller the volume of the first fiber portion 521 in the first portion 50a, thereby reducing the equivalent dielectric constant of the first portion 50a. The larger the distance L2 between adjacent second fiber warps 522a, the larger the volume of the second fiber portion 522 in the second portion 50b, thereby improving the structural strength of the second portion 50b.

[0144] In this way, the first fiber portion 521 can obtain a smaller mesh count by increasing the distance L1 between adjacent first fiber warps 521a, thereby reducing the dielectric constant of the first fiber portion 521, and further reducing the equivalent dielectric constant of the first portion 50a, so as to improve the radiation performance of the radiator 40a. The second fiber portion 522 can obtain a larger mesh count by reducing the distance L2 between adjacent second fiber warps 522a, thereby increasing the number of second fiber warps 522a in the second portion 50b, and further enhancing the structural strength of the second portion 50b.

[0145] See also Fig.15 , Fig.15The schematic plan view of the fiber composite layer 52 provided in some embodiments of the present application is as follows: For example, in a direction perpendicular to the second direction, the distance L3 between two adjacent first fiber wefts 521b is greater than the distance L4 between two adjacent second fiber wefts 522b.

[0146] In this way, the first fiber portion 521 can obtain a smaller mesh count by increasing the distance L3 between adjacent first fiber wefts 521b, thereby reducing the dielectric constant of the first fiber portion 521, and further reducing the equivalent dielectric constant of the first portion 50a, so as to improve the radiation performance of the radiator 40a. The second fiber portion 522 can obtain a larger mesh count by reducing the distance L4 between adjacent second fiber wefts 522b, thereby increasing the number of second fiber wefts 522b in the second portion 50b, and further enhancing the structural strength of the second portion 50b.

[0147] See also Fig.16 , Fig.16 Schematic diagram of the planar structure of the fiber composite layer 52 provided in some other embodiments of the present application. For another example, the fiber composite layer 52 can simultaneously increase the distance L1 between adjacent first fiber warps 521a and the distance L3 between adjacent first fiber wefts 521b to reduce the dielectric constant of the first fiber, thereby reducing the equivalent dielectric constant of the first portion 50a.

[0148] See also Fig.17 , Fig.17 Schematic diagram of the planar structure of the fiber composite layer 52 provided in some other embodiments of the present application. In some embodiments, the portion of the fiber composite layer 52 opposite to the first fiber portion 521 is not provided with the first fiber warp 521a, but only with the first fiber weft 521b, so as to reduce the dielectric constant of the first fiber portion 521.

[0149] In this way, the first fiber portion 521 only includes the first fiber weft 521b, the proportion of the first fiber portion 521 in the first part 50a is reduced, and the proportion of the matrix 53 is increased. Since the dielectric constant of the matrix 53 is much lower than that of the first fiber portion 521, the equivalent dielectric constant of the first part 50a is reduced by reducing the ratio of the first fiber portion 521 to the matrix 53, thereby improving the radiation performance of the radiator 40a.

[0150] See also Fig.18 , Fig.18 Schematic diagram of the planar structure of the fiber composite layer 52 provided in some other embodiments of the present application. In some other embodiments, the portion of the fiber composite layer 52 opposite to the first fiber portion 521 is not provided with the first fiber weft 521b, but only with the first fiber warp 521a, so as to reduce the dielectric constant of the first fiber portion 521.

[0151] In this way, the first fiber portion 521 only includes the first fiber warp 521a, the proportion of the first fiber portion 521 in the first part 50a is reduced, and the proportion of the matrix 53 is increased. By reducing the ratio of the first fiber portion 521 to the matrix 53, the equivalent dielectric constant of the first part 50a is reduced, thereby improving the radiation performance of the radiator 40a.

[0152] See also Fig.19 , Fig.19 FIG. 5 is a schematic diagram of a planar structure of a fiber composite layer 52 provided in some other embodiments of the present application. Fig.17 The embodiment shown and Fig.18 In combination with the illustrated embodiment, the portion of the fiber composite layer 52 opposite to the first fiber portion 521 is provided with neither the first fiber warp threads 521 a nor the first fiber weft threads 521 b .

[0153] In this way, the portion of the fiber composite layer 52 opposite to the first fiber portion 521 is not provided with fiber lines, that is, the first portion 50a only includes the matrix 53, and does not include the fiber composite material. Therefore, the equivalent dielectric constant of the first portion 50a is equal to the dielectric constant of the matrix 53, and the dielectric constant of the matrix 53 is relatively low, thereby greatly improving the radiation performance of the radiator 40a.

[0154] In the above embodiment, the fiber composite layer 52 adjusts the density of the first fiber portion 521 and the density of the second fiber portion 522, adjusts the mesh count of the first fiber portion 521 and the second fiber portion 522, and then adjusts the dielectric constant of the first fiber portion 521 and the second fiber portion 522, and further adjusts the equivalent dielectric constant of the first part 50a and the second part 50b.

[0155] The fiber composite layer 52 can also adjust the mesh count of the first fiber portion 521 and the second fiber portion 522 by adjusting the performance of the fiber line, thereby adjusting the equivalent dielectric constant of the first portion 50a and the second portion 50b, which is described in detail below.

[0156] The first fiber warp 521a and the first fiber weft 521b may be collectively referred to as first fiber lines, and the second fiber warp 522a and the second fiber weft 522b may be collectively referred to as second fiber lines. In some embodiments, the tension of the first fiber line is less than the tension of the second fiber line. The fiber line tension refers to the force applied to the fiber line during the weaving or laying process of the fiber composite material, which ensures that the fiber line maintains a certain degree of compactness and arrangement in the matrix 53 material. The greater the tension of the fiber line, the higher the mesh count of the fiber composite material; the smaller the tension of the fiber line, the smaller the mesh count of the fiber composite material.

[0157] The tension of at least some of the plurality of first fiber lines is less than the tension of the plurality of second fiber lines, and in an exemplary embodiment, the tension of all the first fiber lines is less than the tension of the second fiber lines. In another exemplary embodiment, the tension of some of the first fiber lines is less than the tension of the second fiber lines.

[0158] In this way, the first fiber portion 521 can obtain a smaller mesh number by reducing the tension of the first fiber line, thereby reducing the dielectric constant of the first fiber portion 521, further reducing the equivalent dielectric constant of the first portion 50a, and improving the radiation performance of the radiator 40a. The second fiber portion 522 can obtain a larger mesh number by increasing the tension of the second fiber line, thereby increasing the number of second fiber lines in the second portion 50b, and further enhancing the structural strength of the second portion 50b.

[0159] In some embodiments, the twist of the first fiber line is less than the twist of the second fiber line. The twist of a fiber line refers to the degree to which a fiber line rotates around its own axis during the manufacturing process. The tighter the fiber line is wound, the higher the twist, and the looser the fiber line is wound, the lower the twist.

[0160] The twist of at least some of the plurality of first fiber lines is less than the twist of the plurality of second fiber lines, and in an exemplary embodiment, the twist of all the first fiber lines is less than the twist of the second fiber lines. In another exemplary embodiment, the twist of some of the first fiber lines is less than the twist of the second fiber lines.

[0161] In this way, the twist of the first fiber line is reduced, the degree of entanglement between the first fiber lines is reduced, and the first fiber line is looser, which is beneficial to reducing the mesh count of the first fiber portion 521, thereby reducing the dielectric constant of the first fiber portion 521, and further reducing the equivalent dielectric constant of the first part 50a, so as to improve the radiation performance of the radiator 40a.

[0162] The second fiber lines have a higher twist, the second fiber lines are more entangled, and the first fiber lines are tighter, which is beneficial to increase the mesh count of the second fiber portion 522, thereby increasing the number of second fiber lines in the second part 50b, and further enhancing the structural strength of the second part 50b.

[0163] In some embodiments, the diameter of the first fiber line is greater than the diameter of the second fiber line. The larger the diameter of the fiber line in the fiber composite material, the higher the mesh number of the fiber composite material; the smaller the diameter of the fiber line in the fiber composite material, the smaller the mesh number of the fiber composite material.

[0164] At least some of the first fiber lines have diameters smaller than those of the second fiber lines, and in one example, all of the first fiber lines have diameters smaller than those of the second fiber lines. In another example, some of the first fiber lines have diameters smaller than those of the second fiber lines.

[0165] In this way, the first fiber portion 521 can obtain a smaller mesh number by increasing the diameter of the first fiber line, thereby reducing the dielectric constant of the first fiber portion 521, further reducing the equivalent dielectric constant of the first portion 50a, and improving the radiation performance of the radiator 40a. The second fiber portion 522 can obtain a larger mesh number by increasing the diameter of the second fiber line, thereby increasing the number of second fiber lines in the second portion 50b, and further enhancing the structural strength of the second portion 50b.

[0166] In some embodiments, the fiber composite layer 52 can also reduce its overall dielectric constant through different weaving methods. For example, the fiber composite layer 52 is a twill fabric. Twill fabric means that each time the fiber weft passes through the fiber warp during the weaving process, it jumps over one or more warp threads, forming a distinct diagonal pattern. Twill fabric can obtain a fiber composite layer 52 with a lower dielectric constant.

[0167] In some other embodiments, the fiber composite layer 52 may also be woven in a plain weave manner. Plain weave means that each fiber weft thread alternately passes through each fiber warp thread to form a regular cross pattern.

[0168] The above embodiments adjust the dielectric constant of the first part 50a and the second part 50b by adjusting the diameter of the fiber wire in the fiber composite material, and the tension, twist, weaving pattern and other weaving methods during the weaving process of the fiber wire. The fiber composite material has high flexibility in adjusting the dielectric constant by weaving, and different weaving methods can provide different mechanical properties and dielectric constants.

[0169] In other embodiments, the fiber composite material can also adjust the equivalent dielectric constant of the fiber composite material by adjusting the dielectric constant of the fiber itself and the dielectric constant of the matrix 53. The first part 50a is composed of the first fiber part 521 and the matrix 53, and the second part 50b is composed of the second fiber part 522 and the matrix 53. Since the matrix 53 is a resin material, the matrix 53 has a lower dielectric constant. Therefore, the dielectric constant of the first fiber part 521 is the main factor affecting the dielectric constant of the first part 50a, and similarly, the dielectric constant of the second fiber part 522 is the main factor affecting the dielectric constant of the second part 50b.

[0170] In some embodiments, the dielectric constant of the first fiber portion 521 is smaller than the dielectric constant of the second fiber portion 522. In this way, the equivalent dielectric constant of the first portion 50a is adjusted by adjusting the dielectric constant of the first fiber portion 521, and the equivalent dielectric constant of the second portion 50b is adjusted by adjusting the dielectric constant of the second fiber portion 522. The dielectric constant of the material itself is more stable and is not easily affected by environmental changes (such as temperature, humidity, etc.).

[0171] For example, the first fiber portion 521 may be woven with fiber threads having a lower dielectric constant, and the second fiber portion 522 may be woven with fiber threads having a higher dielectric constant, and the dielectric constant of at least one fiber thread of the first fiber portion 521 is smaller than the dielectric constant of the fiber thread of the second fiber portion 522 .

[0172] See also Fig. 20 , Fig. 20 A schematic diagram of a planar structure of a fiber composite layer 52 provided in some embodiments of the present application. In some embodiments, at least part of the first fiber warp threads 521a in the first fiber portion 521 are replaced with fiber threads with a lower dielectric constant, and the dielectric constant of the first fiber warp threads 521a is less than the dielectric constant of the fiber threads in the second fiber portion 522. The first fiber weft threads 521b in the first fiber portion 521 and the fiber threads in the second fiber portion 522 may have the same dielectric constant.

[0173] See also Fig.21 , Fig.21 Schematic diagram of the planar structure of the fiber composite layer 52 provided in some other embodiments of the present application. In other embodiments, at least part of the first fiber wefts 521b in the first fiber portion 521 are replaced with fiber lines with a lower dielectric constant, and the dielectric constant of the first fiber wefts 521b is less than the dielectric constant of the fiber lines in the second fiber portion 522. The first fiber warp lines 521a in the first fiber portion 521 and the fiber lines in the second fiber portion 522 may have the same dielectric constant.

[0174] See also Fig. 22 , Fig. 22 Schematic diagram of the planar structure of the fiber composite layer 52 provided in some other embodiments of the present application. In some other embodiments, at least part of the first fiber warp threads 521a and the first fiber weft threads 521b in the first fiber portion 521 are replaced with fiber threads with a lower dielectric constant, and the dielectric constant of the first fiber warp threads 521a and the first fiber weft threads 521b is less than the dielectric constant of the fiber threads in the second fiber portion 522.

[0175] In the above embodiments, part of the fiber lines in the fiber composite layer 52 is replaced with fiber lines with low dielectric constant to obtain the first fiber portion 521 with low dielectric constant and the second fiber portion 522 with high structural strength. The dielectric constant of the fiber composite material is adjusted in this way, the adjustment method is flexible, and the accuracy of adjusting the dielectric constant of different regions of the fiber composite material layer is high.

[0176] By adjusting the dielectric constant of the fiber composite layer 52 in this way, the dielectric constant of the fiber line can be adjusted for the local area of ​​the fiber composite layer 52 according to the use requirements of different areas of the substrate 51, thereby obtaining the first part 50a with a lower equivalent dielectric constant and the second part 50b with a higher equivalent dielectric constant. The radiator 40a is arranged in the first part 50a to reduce the influence of the first part 50a on the radiation performance of the radiator 40a. The second part 50b can ensure the structural strength and improve the protection function of the structural member 50.

[0177] In some embodiments, the dielectric constant of the first fiber portion 521 is less than or equal to 4.8, and the dielectric loss of the first fiber portion 521 is less than or equal to 0.02. In this way, the dielectric constant and dielectric loss of the first fiber portion 521 are within the above ranges, which can ensure that the first fiber portion 521 has a certain structural strength. The lower dielectric constant of the first fiber portion 521 can reduce the loss of the electromagnetic wave of the radiator 40a when it is transmitted therein, thereby improving the radiation performance of the radiator 40a.

[0178] In some embodiments, the dielectric constant of the matrix 53 is less than or equal to 3.5, and the dielectric loss of the matrix 53 is less than or equal to 0.01. The first fiber portion 521 is embedded in the matrix 53 to form the first portion 50a, and the second fiber portion 522 is embedded in the matrix 53 to form the second portion 50b. The dielectric constant and dielectric loss of the matrix 53 are within the above range, further reducing the equivalent dielectric constant of the first portion 50a. The radiator 40a is disposed in the first portion 50a, thereby reducing the influence of the first portion 50a on the radiation performance of the radiator 40a, and improving the radiation performance of the radiator 40a.

[0179] The above embodiment is described by a plan view of the fiber composite layer 52 , and the following embodiment is described by a cross-sectional view of the fiber composite layer 52 .

[0180] Please also read Fig.23 and Fig.24 , Fig.23 A schematic diagram of the structure of the second fiber portion 522 provided in some embodiments of the present application; Fig.24 This is a schematic structural diagram of the first fiber portion 521 provided in some embodiments of the present application.

[0181] In the thickness direction of the substrate 51, that is, Fig.23 and Fig.24In the Z-axis direction, compared with the second fiber portion 522, the first fiber portion 521 reduces the number of layers of the first fiber warp 521a and the number of the first fiber warp 521a, thereby reducing the mesh count of the first fiber portion 521. In some other embodiments, the mesh count of the first fiber portion 521 can also be reduced by reducing the number of layers of the first fiber weft 521b and the number of the first fiber weft 521b.

[0182] In this way, the mesh count of the first fiber portion 521 is reduced, the dielectric constant of the first fiber portion 521 is reduced, and the equivalent dielectric constant of the first part 50a composed of the first fiber portion 521 and the matrix 53 is also reduced, which is beneficial to improving the radiation performance of the radiator 40a.

[0183] When considering the equivalent dielectric constant of the substrate 51, two different models can be used to understand its influencing factors: one is a model based on a stacked mixed arrangement, and the other is a model based on the Maxwell-Garnett theory.

[0184] First, about the stacked mixed arrangement model

[0185] The projection area of ​​the substrate 51 is the first area A, and the thickness of the substrate 51 is the total thickness d. Along the thickness direction of the substrate 51, the substrate 51 includes at least two different dielectric layers stacked together. For example, the substrate 51 includes a first fiber composite layer 52 and a second fiber composite layer 52. The dielectric constant of the first fiber composite layer 52 is the first dielectric constant ϵ1, the volume of the first fiber composite layer 52 is the first volume V1, and the thickness of the first fiber composite layer 52 is the first thickness d1.

[0186] The dielectric constant of the second fiber composite layer 52 is a second dielectric constant ϵ2, the volume of the second fiber composite layer 52 is a second volume V2, and the thickness of the second fiber composite layer 52 is a second thickness d2.

[0187] The equivalent dielectric constant ϵeff of the substrate 51 can be calculated by the following formula 1 and formula 2:

[0188] ;

[0189] Formula 1

[0190] ;

[0191] Formula 2

[0192] It can be known from the model that the equivalent dielectric constant of the substrate 51 is related to the dielectric constant of the fiber composite material, the volume of the fiber composite material and the thickness of the substrate 51 .

[0193] Second, about the Maxwell-Garnett theoretical model

[0194] In this model, the matrix 53 is used as the matrix and the fiber composite material is used as the embedded phase. The dielectric constant of the matrix 53 is the matrix dielectric constant ϵm, the dielectric constant of the fiber composite material is the embedded phase dielectric constant ϵi, and the volume of the fiber composite material is the embedded phase volume f. The equivalent dielectric constant ϵeff of the substrate 51 can be calculated by the following formula 3:

[0195] ;

[0196] Formula 3

[0197] It can be seen from the model that the smaller the volume fraction f of the embedded phase material, the smaller the equivalent dielectric constant of the substrate 51. The larger the difference between the dielectric constant of the matrix and the dielectric constant of the embedded phase, the more obvious the change in the equivalent dielectric constant.

[0198] In summary, the larger the volume of the low dielectric material in the fiber composite material, the smaller the equivalent dielectric constant of the substrate 51. Under the same volume, the larger the difference in dielectric constants in the fiber composite material, the smaller the equivalent dielectric constant of the substrate 51. Therefore, according to the above two theories, the embodiment of the present application can also adjust the dielectric constant of the substrate 51 by adjusting the ratio of the volume of the fiber composite layer 52 to the volume of the matrix 53 in the substrate 51.

[0199] See also Fig.25 , Fig.25 A schematic structural diagram of a substrate 51 provided in some embodiments of the present application. Fig.25 The illustrated embodiment is first described by taking the example that the structural member 50 includes only one fiber composite layer 52. In some embodiments, the fiber composite layer 52 includes a first surface 52a and a second surface 52b that are opposite to each other along its thickness direction. The substrate 53 includes a first substrate portion 531 and a second substrate portion 532, wherein the first substrate portion 531 covers the first surface 52a, and the second substrate portion 532 covers the second surface 52b. Along the thickness direction of the fiber composite layer 52, the average thickness d1 of the first substrate portion 531 is greater than the average thickness d2 of the second substrate portion 532, and the radiator 40a is disposed on the first substrate portion 531. For example, the thickness ratio of the first substrate portion, the fiber composite layer 52, and the second substrate portion 532 is 2:3:1.

[0200] In this way, the substrate 51 adjusts the dielectric constant of the substrate 51 and the setting position of the radiator 40a through the non-uniform distribution of the matrix 53. In detail, the larger the volume of the matrix 53 in the fiber composite material, the smaller the dielectric constant of the fiber composite material; the smaller the volume of the matrix 53 in the fiber composite material, the larger the dielectric constant of the fiber composite material. The radiator 40a is arranged in the first matrix part 531, which is also conducive to reducing the influence of the fiber composite material on the radiation performance of the radiator 40a, thereby improving the radiation performance of the radiator 40a.

[0201] In some embodiments, the thickness ratio of the fiber composite layer 52 to the first base portion 531 is greater than or equal to 0.2 and less than or equal to 5. In this way, the substrate 51 has a base portion 53 with a larger thickness where the radiator 40a is disposed, and the radiator 40a is disposed in the base portion 53, which can improve the radiation performance of the radiator 40a.

[0202] In some embodiments, the radiator 40a can be embedded in the first substrate portion 531. In this way, the dielectric constant of the substrate 53 is lower than the dielectric constant of the fiber composite layer 52. Embedding the radiator 40a in the substrate 53 can achieve better dielectric constant matching and reduce the discontinuity of the dielectric constant, thereby reducing the reflection between the radiator 40a and the substrate 53 and improving the radiation efficiency. In addition, the substrate 53 provides a uniform electromagnetic environment, which helps to reduce electromagnetic wave scattering and mode interference caused by the inhomogeneity of the fiber composite layer 52, thereby improving the directivity and gain of the radiator 40a.

[0203] In other embodiments, the radiator 40a is disposed on the surface of the first base portion 531. This helps to reduce the difficulty of manufacturing the substrate 51 without destroying the structural continuity of the substrate 51 itself, thereby ensuring the structural strength of the substrate 51.

[0204] For example, the first base portion 531 is located on one side of the second base portion 532 along the main radiation direction of the radiator 40a, that is, along the main radiation direction of the radiator 40a, the first base portion 531 is located on one side of the fiber composite layer 52. The radiator 40a is arranged on the surface of the first base portion 531 away from the second base portion 532. The "main radiation direction" refers to the direction in which the radiator 40a radiates the strongest electromagnetic waves in space, which is shown as the direction of the peak or main lobe in the radiation pattern of the antenna 40.

[0205] As a result, the fiber composite layer 52 generally has a higher dielectric constant and loss factor, resulting in additional loss of the radiation signal when passing through the fiber composite layer 52. The radiator 40a is arranged on the side away from the fiber composite layer 52, which can reduce the path of the radiation signal passing through the fiber composite layer 52, thereby reducing dielectric loss and improving radiation efficiency. The fiber composite layer 52 will also cause scattering and pattern interference of electromagnetic waves, affecting the radiation pattern of the antenna 40. The radiator 40a is away from the fiber composite layer 52, which can reduce such interference and maintain the directivity and gain of the radiator 40a. Since the path of the radiation signal passing through the fiber layer is reduced to improve the radiation efficiency of the radiator 40a, more energy can be effectively radiated instead of being absorbed or scattered by the fiber composite material.

[0206] The above embodiment is described with the fiber composite layer 52 being one. Fig.26 , Fig.26 The schematic diagram of the structure of the substrate 51 provided in some other embodiments of the present application. In some other embodiments, there are multiple fiber composite layers 52, and the multiple fiber composite layers 52 can be stacked and contacted.

[0207] In this way, the matrix 53 can be concentrated on one side of the fiber composite layer 52 to increase the thickness of the matrix 53 on one side of the fiber composite layer 52, that is, to increase the thickness of the first matrix part 531, so as to facilitate the radiator 40a to be set in the first matrix part 531, thereby improving the radiation performance of the radiator 40a.

[0208] The above embodiment reduces the influence of the substrate 51 on the radiation performance of the radiator 40a by adjusting the distribution mode of the matrix 53 in the substrate 51 and the setting position of the radiator 40a, thereby improving the radiation performance of the radiator 40a. In some other embodiments, the dielectric constant of the substrate 51 can be adjusted by adjusting the ratio of the matrix 53 to the fiber composite layer 52 in the substrate 51. For example, the ratio of the volume of the fiber composite layer 52 to the volume of the matrix 53 is greater than or equal to 1.5 and less than or equal to 2.4.

[0209] In this way, the ratio of the volume of the fiber composite layer 52 to the volume of the matrix 53 has a lower limit of 1.5, and the structural strength of the substrate 51 is relatively high. The volume of the fiber composite layer 52 and the volume of the matrix 53 have an upper limit of 2.4, thereby reducing the dielectric constant of the substrate 51. The radiator 40a is disposed on the substrate 51, which is conducive to reducing the influence of the substrate 51 on the radiation performance of the radiator 40a, thereby improving the radiation performance of the radiator 40a.

[0210] The above embodiment is described by taking the structural member 50 as the back cover 21 as an example. In some other embodiments, the structural member 50 may also be the bracket 32 ​​.

[0211] In some other embodiments, the structural member 50 may also be a fiberglass camera decorative member.

[0212] The method for the substrate 51 of the embodiment of the present application mainly includes the following steps. First, the raw silk is processed into a continuous fiber band or woven cloth through a yarn spreading or weaving process. This step lays the foundation for the subsequent prepreg process. In the prepreg stage, the fiber material is impregnated into the matrix 53 to ensure that the matrix 53 is uniformly penetrated between the fibers to form a prepreg with good processability.

[0213] Next, the cutting process cuts the prepreg into the required shape and size in preparation for lamination. During the lamination process, the cut prepreg is stacked layer by layer according to the design requirements, and the fiber direction and order of each layer are set to meet specific needs. The laminated material then enters the hot pressing stage. In the hot press, under a certain temperature and pressure, the matrix 53 undergoes a curing reaction, and the multiple layers of prepreg are bonded into a whole.

[0214] In order to obtain the precise shape of the final product, the hot-pressed composite material is laser cut to form the required shape and holes. Subsequently, the in-mold forming step places the cut material into a mold and forms it into a complex three-dimensional shape through heat and pressure. The finishing stage drills and taps the formed composite material to meet the requirements of assembly and use.

[0215] During the polishing stage, the composite surface is carefully processed to remove excess matrix 53 and defects, and improve the smoothness and aesthetics of the surface. The spraying process applies a protective or decorative layer to the surface to enhance the corrosion resistance and appearance of the material. Finally, the assembly step combines the processed composite parts with other parts to form a complete final product.

[0216] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0217] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A structural member, characterized in that: include: The substrate is a fiber composite material, the substrate comprises a fiber composite layer and a matrix, the fiber composite layer is embedded in the matrix; the substrate comprises a first part and a second part connected in a preset direction, the preset direction is perpendicular to the thickness direction of the substrate; the equivalent dielectric constant of the first part is smaller than the equivalent dielectric constant of the second part, and / or the equivalent dielectric loss of the first part is smaller than the equivalent dielectric loss of the second part; a radiator, at least a portion of which is disposed on the first portion; The fiber composite layer includes a first fiber portion located in the first portion and a second fiber portion located in the second portion, and the first fiber portion and the second fiber portion satisfy at least one of the following conditions: The mesh number of the first fiber portion is smaller than the mesh number of the second fiber portion; The fiber composite layer is formed by interweaving a plurality of fiber lines, and the dielectric constant of the material of at least one fiber line of the first fiber part is smaller than the dielectric constant of the material of the fiber line of the second fiber part; The dielectric loss of the material of at least one fiber line of the first fiber portion is smaller than the dielectric loss of the material of the fiber lines of the second fiber portion.

2. The structural member according to claim 1, characterized in that: The mesh number of the first fiber portion is greater than or equal to 140 and less than or equal to 280.

3. The structural member according to claim 1 or 2, characterized in that: The first fiber portion includes a plurality of first fiber warps, and the second fiber portion includes a plurality of second fiber warps, the first fiber warps and the second fiber warps both extend along a first direction, and the plurality of first fiber warps and the plurality of second fiber warps are both spaced apart in a direction perpendicular to the first direction; In a direction perpendicular to the first direction, a distance between two adjacent first fiber warps is greater than a distance between two adjacent second fiber warps.

4. The structural member according to claim 3, characterized in that: The first fiber portion further includes a plurality of first fiber wefts, and the second fiber portion further includes a plurality of second fiber wefts, the first fiber wefts and the second fiber wefts both extend along a second direction, the second direction intersects the first direction, and the plurality of first fiber wefts and the plurality of second fiber wefts are both spaced apart in a direction perpendicular to the second direction; In a direction perpendicular to the second direction, a distance between two adjacent first fiber weft threads is greater than a distance between two adjacent second fiber weft threads.

5. The structural member according to claim 1 or 2, characterized in that: The fiber composite layer is formed by interweaving a plurality of fiber lines, and the plurality of fiber lines satisfy at least one of the following conditions: The tension of the fiber lines of the first fiber part is smaller than the tension of the fiber lines of the second fiber part; The twist of the fiber line of the first fiber part is less than the twist of the fiber line of the second fiber part; The diameter of the fiber strands of the first fiber portion is greater than the diameter of the fiber strands of the second fiber portion.

6. The structural member according to claim 1 or 2, characterized in that: The fiber composite layer is a twill fabric.

7. The structural member according to claim 1 or 2, characterized in that: The dielectric constant of the first fiber portion is less than or equal to 4.8, and / or the dielectric loss of the first fiber portion is less than or equal to 0.

02.

8. The structural member according to claim 1 or 2, characterized in that: The dielectric constant of the substrate is less than or equal to 3.5, and / or the dielectric loss of the substrate is less than or equal to 0.

01.

9. The structural member according to claim 1 or 2, characterized in that: The fiber composite layer comprises a third surface and a fourth surface which are opposite to each other along the thickness direction thereof; The substrate comprises a first substrate portion and a second substrate portion, the first substrate portion covers the third surface, and the second substrate portion covers the fourth surface; Along the thickness direction of the fiber composite layer, an average thickness of the first base portion is greater than an average thickness of the second base portion.

10. The structural member according to claim 9, characterized in that The radiator is embedded in the first base portion.

11. The structural member according to claim 9, characterized in that: The radiator is disposed on a surface of the first base portion.

12. The structural member according to claim 11, characterized in that: The first base portion is located in a main radiation direction of the radiator.

13. The structural member according to claim 1 or 2, characterized in that: A ratio of the volume of the fiber composite layer to the volume of the matrix is ​​greater than or equal to 1.5 and less than or equal to 2.

4.

14. The structural member according to claim 9, characterized in that A vertical projection of the radiator on the third surface along the thickness direction of the substrate is located in the region where the first portion is located.

15. An electronic device, characterized in that: include: A structural member, as claimed in any one of claims 1 to 14, further comprising a feeding portion, wherein the feeding portion is electrically connected to a radiator of the structural member; A circuit board is provided with an antenna transceiver, and the radiator is electrically connected to the antenna transceiver through the feeding part.

16. The electronic device according to claim 15, characterized in that: The electronic device further comprises a back cover, and the structural member forms the back cover.

17. The electronic device according to claim 16, characterized in that: The electronic device further comprises a bracket, wherein the bracket is used to fix the circuit board, and the structural member forms the bracket.

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