Housing and electronic device including same

Abstract

An electronic device is provided. The electronic device includes a housing and a processor disposed in the housing. The case may include: a glass portion including a first glass surface visually exposed to an exterior of the case and a concave-convex pattern formed on the first glass surface; and a reflective layer including a first surface, which is a reflective layer disposed on the concave-convex pattern and is formed to correspond to a shape of the concave-convex pattern and cover at least a portion of the concave-convex pattern, and a second surface, which faces an outside of the case and is separated from the first surface by a specified distance.

Description

Technical Field

[0001] The present disclosure relates to a housing and an electronic device including the housing. Background Art

[0002] With the development of information communication technology and semiconductor technology, various functions are packaged in a portable electronic device. For example, the electronic device can realize not only communication functions, but also entertainment functions such as playing games, multimedia functions such as playing music and videos, communication and security functions for mobile banking, and scheduling and electronic wallet functions. These electronic devices have been reduced in size to facilitate users to carry.

[0003] With the recent trend emphasizing making portable electronic devices small, slim, and portable, research efforts are continuing to give electronic devices a more aesthetic appearance. Summary of the invention

[0004] Technical issues

[0005] There is a growing design demand for improving the aesthetics of electronic devices. For example, an electronic device may include a housing having a pearl effect or a glitter effect, which is achieved using a pearl pigment applied to a surface of the housing. However, the surface of the housing coated with the pearl pigment may have an increased surface roughness due to the pearl pigment, thereby reducing user convenience. When a pearl pigment having a relatively small particle size is used to reduce the surface roughness, the glitter effect may be reduced.

[0006] As another example, the electronic device may include a case that uses a polymer film coated or printed with a coating to achieve a pearl effect or a glitter effect. However, due to the polymer film, the production cost of the case may increase, and the thickness of the case may increase.

[0007] According to various embodiments of the present disclosure, an electronic device that implements a flashing light effect using an irregular pattern and a reflective layer on the irregular pattern may be provided.

[0008] The present disclosure is not limited to the foregoing embodiments, but various modifications or changes may be made thereto without departing from the spirit and scope of the present disclosure.

[0009] Technical Solution

[0010] According to various embodiments of the present disclosure, an electronic device may include a housing and a processor disposed in the housing. The housing may include glass and a reflective layer, the glass including a first glass surface visually exposed to the outside of the housing and an irregular pattern formed on the first glass surface, the reflective layer being disposed on the irregular pattern and formed into a shape corresponding to the irregular pattern, the reflective layer including a first surface covering at least a portion of the irregular pattern and a second surface facing the outside of the housing and spaced apart from the first surface by a specified distance.

[0011] According to various embodiments of the present disclosure, a shell may include glass and a reflective layer, the glass including a first glass surface visually exposed to the outside of the shell and an irregular pattern formed on the first glass surface, the reflective layer is disposed on the irregular pattern and formed into a shape corresponding to the irregular pattern, the reflective layer including a first surface covering at least a portion of the irregular pattern and a second surface facing the outside of the shell and spaced a specified distance from the first surface.

[0012] According to various embodiments of the present disclosure, a method for manufacturing a housing may include preparing glass including an irregular pattern, depositing a reflective layer on the irregular pattern of the glass, and polishing the housing.

[0013] Beneficial Effects

[0014] According to various embodiments of the present disclosure, an electronic device may include a housing including an irregular pattern and a reflective layer disposed on the irregular pattern. Due to the irregular pattern and the reflective layer, the housing may provide a flashing effect.

[0015] Other various effects may be provided directly or indirectly in the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a block diagram illustrating an electronic device in a network environment according to various embodiments of the present disclosure;

[0017] Figure 2 is a front perspective view showing an electronic device according to various embodiments of the present disclosure;

[0018] Figure 3 is a rear perspective view showing an electronic device according to various embodiments of the present disclosure;

[0019] Figure 4 is an exploded perspective view showing an electronic device according to various embodiments of the present disclosure; and

[0020] Figure 5a and Figure 5b is a view showing a rear plate according to various embodiments;

[0021] Figure 6 According to various embodiments of the present disclosure, Figure 5a A cross-sectional view taken along line AA';

[0022] Figure 7 is a flow chart showing a process of manufacturing a housing according to various embodiments of the present disclosure;

[0023] Figure 8a is an enlarged view of a housing before a polishing process according to an embodiment of the present disclosure, Figure 8b is Figure 8a An enlarged view of the shell after the polishing process of the shell;

[0024] Figure 9a is an enlarged view of a housing before a polishing process according to another embodiment of the present disclosure, Figure 9b is Figure 9a An enlarged view of the shell after the polishing process of the shell;

[0025] Fig.10 is a view showing a housing including a plurality of reflective layers according to an embodiment;

[0026] Fig.11 is a view showing a housing including a plurality of reflective layers according to another embodiment of the present disclosure;

[0027] Fig.12a , Figure 12b and Fig.12c is a view showing a process of manufacturing a housing including a plurality of reflective layers;

[0028] Fig.13a , Fig.13b and Fig.13c is a view showing a housing including a rear irregular pattern according to various embodiments of the present disclosure;

[0029] Fig.14 is a view showing an electronic device including a polymer film and a color layer according to various embodiments;

[0030] Fig.15 is a view showing an electronic device including a deposition layer according to various embodiments of the present disclosure; and

[0031] Fig.16a and Fig.16b is a view illustrating an electronic device including a rear irregular pattern according to various embodiments of the present disclosure. Specific embodiments

[0032] Figure 1 is a block diagram illustrating electronic devices in a network environment according to various embodiments of the present disclosure.

[0033] Reference Figure 1, the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In an embodiment, at least one of the components (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. According to an embodiment, some of the components (eg, the sensor module 176, the camera module 180, or the antenna module 197) may be integrated into a single component (eg, the display module 160).

[0034] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to an embodiment, as at least part of the data processing or calculation, the processor 120 may store a command or data received from another component (e.g., sensor module 176 or communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resultant data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operationally independent or combined with the main processor 121. For example, when the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be configured to use less power than the main processor 121 or to be dedicated to a specified function. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of the main processor 121.

[0035] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 (rather than the main processor 121) may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., a camera module 180 or a communication module 190) that is functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model may be generated via machine learning. For example, such learning may be performed by the electronic device 101 where the artificial intelligence is executed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q network, or a combination of two or more thereof, but is not limited thereto. Additionally or alternatively, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0036] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

[0037] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0038] The input module 150 may receive commands or data to be used by other components (e.g., the processor 120) of the electronic device 101 from outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0039] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. Depending on the embodiment, the receiver can be implemented as a separate part from the speaker, or as part of the speaker.

[0040] The display module 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display 160 may include a touch sensor configured to detect a touch or a pressure sensor configured to measure the strength of a force generated by a touch.

[0041] The audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 may obtain sound via the input module 150, or output sound via the sound output module 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0042] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0043] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0044] The connection end 178 may include a connector via which the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102). According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0045] The haptic module 179 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0046] The camera module 180 may capture still images or moving images. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0047] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0048] The battery 189 may supply power to at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0049] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules may communicate via a first network 198 (e.g., a short-range communication network such as Bluetooth TM The wireless communication module 192 may communicate with an external electronic device through a wireless communication network 198 (e.g., a wireless fidelity (Wi-Fi) direct connection, or an infrared data association (IrDA)) or a second network 199 (e.g., a long-distance communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a local area network (LAN) or a wide area network (WAN))). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 192 may use user information (e.g., an international mobile subscriber identity (IMSI)) stored in the user identification module 196 to identify or authenticate the electronic device 101 in a communication network (such as a first network 198 or a second network 199).

[0050] The wireless communication module 192 can support 5G networks after 4G networks and next-generation communication technologies (e.g., new radio (NR) access technology). NR access technology can support enhanced mobile broadband (eMBB), massive machine type communication (mMTC), or ultra-reliable low-latency communication (URLLC). The wireless communication module 192 can support high-frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 192 can support various technologies for ensuring performance on high-frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 can support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., a second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane delay for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip).

[0051] The antenna module 197 may send a signal or power to the outside (e.g., an external electronic device) or receive a signal or power from the outside (e.g., an external electronic device). According to an embodiment, the antenna module may include an antenna including a radiator formed by a conductor or a conductive pattern formed on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., an antenna array). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas by, for example, the communication module 190. A signal or power may then be sent or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another portion (e.g., a radio frequency integrated circuit (RFIC)) other than the radiator may be further formed as a portion of the antenna module 197.

[0052] According to various embodiments, the antenna module 197 may form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module may include a printed circuit board, an RFIC, and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., bottom surface) of the printed circuit board, or is adjacent to the first surface and is capable of supporting a specified high frequency band (e.g., millimeter wave band), and the plurality of antennas are disposed on a second surface (e.g., top surface or side surface) of the printed circuit board, or is adjacent to the second surface and is capable of transmitting or receiving signals of the specified high frequency band.

[0053] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, general purpose input output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0054] According to an embodiment, instructions or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the external electronic devices 102 or 104 may be a device of the same or different type as the electronic device 101. According to an embodiment, all or some operations to be executed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108. For example, if the electronic device 101 should automatically perform a function or service or should perform a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to perform at least part of the function or service instead of running the function or service, or the electronic device 101 may request the one or more external electronic devices to perform at least part of the function or service in addition to running the function or service. The one or more external electronic devices that receive the request may perform the requested at least part of the function or service, or perform another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request when the result is further processed or when the result is not further processed. To this end, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology or client-server computing technology, for example, may be used. The electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars or health care) based on 5G communication technology or IoT-related technologies.

[0055] The electronic device according to various embodiments of the present disclosure may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to those electronic devices described above.

[0056] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalents or alternative forms for corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the noun in the singular form corresponding to the item may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each phrase in the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include all possible combinations of the items listed together with the corresponding phrases in the phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the corresponding component from another component, and do not limit the component in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “combined with another element (e.g., the second element)”, “combined to another element (e.g., the second element)”, “connected with another element (e.g., the second element)”, or “connected to another element (e.g., the second element)” when the terms “operably” or “communicatively” are used or when the terms “operably” or “communicatively” are not used, it means that the element may be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0057] As used herein, the term "module" may include units implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or a minimum unit or portion of the single integrated component. For example, according to an embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0058] According to various embodiments, each of the above-mentioned components (e.g., a module or a program) may include a single entity or multiple entities. Some of the multiple entities may be arranged in different components separately. According to various embodiments, one or more of the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., a module or a program) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as a corresponding one of the multiple components before integration. According to various embodiments, the operations performed by a module, a program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more of the operations may be run or omitted in different orders, or one or more other operations may be added.

[0059] Figure 2 is a front perspective view showing an electronic device according to various embodiments of the present disclosure. Figure 3 is a rear perspective view illustrating an electronic device according to various embodiments of the present disclosure.

[0060] Reference Figure 2 and Figure 3 According to an embodiment, the electronic device 200 may include a housing 210 having a front surface 210A, a rear surface 210B, and a side surface 210C surrounding a space between the front surface 210A and the rear surface 210B. According to another embodiment (not shown), the housing 210 may represent a Figure 2 The structure of the front surface 210A, the rear surface 210B and the part of the side surface 210C of the housing 210. For example, the housing 210 may include a front plate 202 and a rear plate 211. According to an embodiment, at least a portion of the front surface 210A may have a substantially transparent front plate 202 (e.g., a glass plate or a polymer plate including various coatings). The rear surface 210B may be formed by the rear plate 211. The rear plate 211 may be formed by, for example, glass, ceramic, polymer, metal (e.g., titanium (Ti), stainless steel (STS), aluminum (Al) or magnesium (Mg)) or a combination of at least two thereof. The side surface 210C may be formed by a side frame structure (or "side member") 218, which is coupled to the front plate 202 and the rear plate 211 and includes metal and / or polymer. According to an embodiment, the rear plate 211 and the side frame plate 218 may be formed integrally together and include the same material (e.g., glass, a metal such as aluminum, or ceramic). According to another embodiment, the front surface 210A and / or the front plate 202 may be interpreted as a part of the display 220 .

[0061] According to an embodiment, the electronic device 200 may include a display 220, audio modules 203, 207, and 214 (eg, Figure 1 audio module 170), sensor module (e.g., Figure 1 sensor module 176), camera modules 205 and 206 (e.g., Figure 1 camera module 180), key input device 217 (eg, Figure 1 input module 150) and connector holes 208 and 209 (e.g., Figure 1 According to an embodiment, the electronic device 200 may not include at least one of the components (e.g., the connector hole 209), or other components may be added. According to an embodiment, the display 220 may be visually exposed through, for example, a majority of the front plate 202.

[0062] According to an embodiment, the surface of the housing 210 (or the front plate 202) may include a screen display area formed as the display 220 is visually exposed. For example, the screen display area may include the front surface 210A.

[0063] According to an embodiment, the electronic device 200 may include a recess or an opening formed in a portion of the screen display area (e.g., the front surface 210A) of the display 220, and may include at least one or more of the audio module 214, the sensor module (not shown), the light emitting device (not shown), and the camera module 205 aligned with the recess or the opening. According to another embodiment (not shown), at least one or more of the audio module 214, the sensor module (not shown), the camera module 205, the fingerprint sensor (not shown), and the light emitting device (not shown) may be included on the rear surface of the screen display area of ​​the display 220.

[0064] According to an embodiment, the display 220 may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer for detecting a magnetic field type stylus.

[0065] According to an embodiment, the audio modules 203, 207, and 214 may include, for example, a microphone hole 203 and speaker holes 207 and 214. A microphone for acquiring external sound may be provided in the microphone hole 203. In some embodiments, a plurality of microphones may be provided to detect the direction of the sound. The speaker holes 207 and 214 may include an external speaker hole 207 and a phone receiver hole 214. In an embodiment, the speaker holes 207 and 214 and the microphone hole 203 may be implemented as a single hole, or a speaker may be included without the speaker holes 207 and 214 (e.g., a piezoelectric speaker).

[0066] According to an embodiment, the sensor module (not shown) may generate an electrical signal or data value corresponding to an internal operating state or an external environmental state of the electronic device 200. The sensor module (not shown) may include, for example, a first sensor module (not shown) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on the front surface 210A of the housing 210. The sensor module (not shown) may include a third sensor module (not shown) (e.g., an HRM sensor) and / or a fourth sensor module (not shown) (e.g., a fingerprint sensor) disposed on the rear surface 210B of the housing 210. In an embodiment (not shown), the fingerprint sensor may be disposed on the rear surface 210B of the housing 210 and on the front surface 210A (e.g., the display 220). The electronic device 200 may further include a sensor module not shown, for example, at least one of a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor (not shown).

[0067] According to an embodiment, the camera modules 205 and 206 may include a front camera module 205 disposed on a first surface 210A of the electronic device 200 and a rear camera module 206 and / or a flash 204 disposed on a rear surface 210B. The camera modules 205 and 206 may include one or more lenses, an image sensor, and / or an image signal processor. The flash 204 may include, for example, a light emitting diode (LED) or a xenon lamp. According to an embodiment, two or more lenses (an infrared (IR) camera, a wide-angle lens, and a telephoto lens) and an image sensor may be disposed on one surface of the electronic device 200.

[0068] According to an embodiment, the key input device 217 may be provided on the side surface 210C of the housing 210. According to an embodiment, the electronic device 200 may not include all or some of the above-mentioned key input devices 217, and the key input device 217 not included may be implemented in other forms (e.g., as a soft key) on the display 220. According to an embodiment, at least a portion of the key input device 217 may be provided on the side frame structure 218.

[0069] According to an embodiment, a light emitting device may be provided, for example, on the front surface 210A of the housing 210. The light emitting device (not shown) may provide, for example, information about the state of the electronic device 200 in the form of light. According to another embodiment, the light emitting device (not shown) may provide a light source that interacts with, for example, the front camera module 205. The light emitting device (not shown) may include, for example, a light emitting diode (LED), an infrared (IR) LED, and / or a xenon lamp.

[0070] According to an embodiment, the connector holes 208 and 209 may include: a first connector hole 208 for accommodating a connector (e.g., a headphone jack) for transmitting / receiving an audio signal to / from an external electronic device or a connector (e.g., a USB connector) for transmitting / receiving power and / or data to / from an external electronic device; and / or a second connector hole 209 for accommodating a storage device (e.g., a user identification module (SIM) card). According to an embodiment, the first connector hole 208 and / or the second connector hole 209 may be omitted.

[0071] Figure 4 is an exploded perspective view illustrating an electronic device according to various embodiments of the present disclosure.

[0072] Reference Figure 4 , the electronic device 200 (eg, Figure 2 and Figure 3 The electronic device 200 may include a front panel 222 (eg, Figure 2 202), a display 220 (e.g., Figure 2 , a display 220), a bracket 232 (e.g., a front support member), a printed circuit board 240, a battery 250, a rear case 260 (e.g., a rear support member), an antenna 270, and a rear plate 280 (e.g., Figure 3 According to an embodiment, the electronic device 200 may omit at least one of the components (eg, the rear case 260) or may add other components. At least one component of the electronic device 200 may be connected to the rear panel 211 of the electronic device 200. Figure 2 or Figure 3 At least one component of the electronic device 200 is the same or similar and will not be described repeatedly below.

[0073] According to an embodiment, the bracket 232 may be disposed inside the electronic device 200 to be connected to or integrated with the side frame structure 231. The bracket 232 may be formed of, for example, a metal and / or a non-metal material (e.g., a polymer). The bracket 232 may accommodate the display 220 on one surface and the printed circuit board 240 on another surface. The processor (e.g., Figure 1 processor 120), memory (e.g., Figure 1 Memory 130) and / or interfaces (e.g., Figure 1 The interface 177) can be mounted on the printed circuit board 240.

[0074] According to an embodiment, the battery 250 may be a device for supplying power to at least one component (e.g., the camera module 212) of the electronic device 200. The battery 250 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery 250 may be disposed on substantially the same plane as the printed circuit board 240. The battery 250 may be integrally or detachably disposed inside the electronic device 200.

[0075] According to an embodiment, the rear case 260 may be disposed between the printed circuit board 240 and the antenna 270. For example, the rear case 260 may include one surface to which at least one of the printed circuit board 240 and the battery 250 is coupled and another surface to which the antenna 270 is coupled.

[0076] According to an embodiment, the antenna 270 may be disposed between the back plate 280 and the battery 250. The antenna 270 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna 270 may perform short-range communication with, for example, an external device, or may wirelessly send or receive power required for charging. For example, the antenna 270 may include a coil for wireless charging. According to an embodiment, the antenna structure may be formed by a portion or combination of the side frame structure 231 and / or the bracket 232.

[0077] According to various embodiments, the electronic device 200 may include a second housing (eg, Figure 2 According to an embodiment, the camera module 212 may be disposed on the bracket 232 and may be a rear camera module (eg, Figure 3 According to an embodiment, at least a portion of the camera module 212 may be exposed to the outside of the electronic device 200 through the opening 282 formed in the rear plate 280.

[0078] Figures 2 to 4 The electronic device 200 disclosed in the embodiment has a bar-shaped or plate-shaped appearance, but the present disclosure is not limited thereto. For example, the electronic device shown may be a rollable electronic device or a foldable electronic device. A “rollable electronic device” may refer to an electronic device at least a portion of which may be rolled or curled or accommodated in a housing (e.g., Figure 2 210), because the display (eg, Figure 4 The display 220 of the rollable electronic device can be bent and deformed. As the display is extended or exposed to the outside with a larger area according to the needs of the user, the rollable electronic device can use the expanded second display area.

[0079] Figure 5a and Figure 5bis a perspective view illustrating a rear plate according to various embodiments of the present disclosure. Figure 6 According to various embodiments of the present disclosure Figure 5a sectional view of .

[0080] Reference Figure 5a , Figure 5b and Figure 6 , the housing 300 may include glass 310 and a reflective layer 320 . Figure 5a , Figure 5b and / or Figure 6 The configuration of the housing 300 may be wholly or partially related to Figure 4 The configuration of the rear plate 280 is the same.

[0081] According to various embodiments, the glass 310 may form an electronic device (eg, Figure 2 At least a portion of the exterior of the electronic device 200 of the housing 300). For example, the glass 310 may include a first glass surface 310a facing the exterior of the electronic device 200. According to an embodiment, the first glass surface 310a may be exposed to the exterior of the electronic device 200. According to an embodiment, the housing 300 may include an anti-fingerprint coating 305 disposed on the first glass surface 310a. The anti-fingerprint coating 305 may have a material for reducing the attachment of contaminants to the housing 300. According to an embodiment, the glass 310 may be replaced with a plate formed of ceramics. For example, the glass 310 may include aluminum oxide, zirconium oxide, or silicon.

[0082] According to various embodiments, the glass 310 may include an irregular pattern 311. According to an embodiment, the irregular pattern 311 may be referred to as a plurality of grooves or depressions formed in the first glass surface 310a of the glass 310. According to an embodiment, at least a portion of light passing through the glass 310 may be scattered due to the irregular pattern 311. For example, the irregular pattern 311 may increase a haze level. According to an embodiment, the irregular pattern 311 may be formed irregularly.

[0083] According to an embodiment, the glass 310 may include a third glass surface 310c extending from the first glass surface 310a and forming an irregular pattern 311. The reflective layer 320 may cover at least a portion of the third glass surface 310c.

[0084] According to various embodiments, the reflective layer 320 may provide a glitter and / or pearl effect. According to an embodiment, the reflective layer 320 may optically cause an expected interference effect within a specific wavelength range. According to an embodiment, at least a portion of the light transmitted to the reflective layer 320 may be reflected to provide a visual effect to the user. For example, at least a portion of the light transmitted to the reflective layer 320 may be reflected, and thus at least a portion of the reflective layer 320 may be visible. According to an embodiment, at least a portion of the light transmitted to the reflective layer 320 may be reflected so that the color and / or pattern of the portion where the reflective layer 320 is positioned may be different from the color and / or pattern of the portion where the reflective layer 320 is not positioned. According to an embodiment, the reflective layer 320 may be referred to as a color layer or a deposition layer.

[0085] According to an embodiment, the color of the housing 300 can be realized by reflecting light in a wavelength band determined by the spectrum of the light. The degree to which the light is refracted is different based on the length of the wavelength, and as the light is dispersed due to the difference in the optical path (e.g., refraction of the light), the color of the housing 300 can be realized. According to an embodiment, the color of the housing 300 can be realized by dispersing at least a portion of the light due to the reflective layer 320 formed to correspond to the shape of the irregular pattern 311.

[0086] According to various embodiments, the reflective layer 320 may be disposed on the glass 310. For example, the reflective layer 320 may be disposed on the irregular pattern 311 of the glass 310.

[0087] According to various embodiments, the reflective layer 320 may be formed in a shape corresponding to the irregular pattern 311. According to an embodiment, the reflective layer 320 may include a first surface 320a disposed on the irregular pattern 311 of the glass 310 and a second surface 320b spaced apart from the first surface 320a by a specified distance d. The specified distance d between the first surface 320a and the second surface 320b may be referred to as a thickness of the reflective layer 320. According to an embodiment, the reflective layer 320 may have a substantially "V" shape or a "U" shape.

[0088] According to an embodiment, the color of the light incident on the reflective layer 320 can be changed based on the distance d between the first surface 320a and the second surface 320b. For example, the color of the light reflected from the housing 300 can be changed based on the thickness of the reflective layer 320 deposition. According to an embodiment, the specified distance d between the first surface 320a and the second surface 320b may be 100nm to 2000nm. According to an embodiment, the specified distance d between the first surface 320a and the second surface 320b may be 140nm to 300nm. According to an embodiment, the reflective layer 320 may include a curved portion. For example, the second surface 320b of the reflective layer 320 may have a curved surface formed using a polishing process.

[0089] According to various embodiments, the reflective layer 320 may include materials having different refractive indices. For example, the reflective layer 320 may include an oxide (eg, SiO 2 ), nitrides (e.g., Si 3 n 4 and / or SiN x ), metal (e.g., Sn, In) and / or non-metal (Si). According to an embodiment, the reflective layer 320 may have a plurality of stacked structures according to the desired color. The reflective layer 320 may include stacked oxides, nitrides, metals and / or non-metals. According to an embodiment, the reflective layer 320 may include nitrides. According to an embodiment, the reflective layer 320 may include repeatedly stacked nitrides and oxides. According to an embodiment, the reflective layer 320 may include nitrides, oxides, and metals and / or non-metals located between nitrides and oxides. According to an embodiment, the transmittance of the reflective layer 320 including metals and / or non-metals located between nitrides and oxides may be relatively reduced. For example, as the proportion of the metal and / or non-metal included in the reflective layer 320 increases, the brightness of the reflective layer 320 may decrease. According to an embodiment, the color of the housing 300 may change based on the material of the reflective layer 320. However, Figure 5a and Figure 5b The color of the housing 300 shown is selective, and the housing 300 may have a color not shown depending on the material of the reflective layer 320 .

[0090] According to an embodiment, the reflective layer 320 may include silicon dioxide (SiO 2 ) and / or silicon nitride (Si 3 N 4 ). According to an embodiment, silicon dioxide and silicon nitride may be formed by reacting with plasma gas. According to an embodiment, the specified distance d may be variously changed according to the design. For example, the thickness of the reflective layer 320 may be changed based on the power, flow rate and / or pressure of the sputtering process. For example, the thickness of the reflective layer 320 may be changed based on the material, power, flow rate and / or pressure of the reflective layer 320 as shown in Table 1 below. According to an embodiment, the thickness of the reflective layer 320 may be variously changed according to the design of the housing 300. According to an embodiment, the reflective layer 320 may include a high hardness material. For example, the reflective layer 320 may include silicon nitride Si 3 N 4 .

[0091] [Table 1]

[0092]

[0093] According to various embodiments, the housing 300 may include an adhesive layer 330 disposed on the glass 310 (e.g., in the +Z direction). For example, the adhesive layer 330 may be connected to or bonded to the second glass surface 310b. According to an embodiment, the adhesive layer 330 may be substantially transparent. For example, the adhesive layer 330 may include at least one of an optically clear resin (OCR) or an optically clear adhesive (OCA). For example, the material of the adhesive layer 330 may be changed in consideration of transmittance and / or strength. According to various embodiments, the housing 300 may include a polymer film 340 supporting the adhesive layer 330. For example, the adhesive layer 330 may be disposed between the glass 310 and the polymer film 340. According to an embodiment, the polymer film 340 may include polyethylene terephthalate (PET). According to an embodiment, the polymer film 340 may be disposed between the shielding layer 350 and the adhesive layer 330.

[0094] According to various embodiments, the housing 300 may include a shielding layer 350. According to an embodiment, the shielding layer 350 may prevent an electronic device (eg, Figure 4 Components inside the electronic device 200 are visually exposed to the outside of the electronic device 200.

[0095] Figure 7 is a flow chart illustrating a process of manufacturing a housing according to various embodiments of the present disclosure. Figure 8a is an enlarged view of a housing before a polishing process according to an embodiment of the present disclosure. Figure 8b is Figure 8a An enlarged view of the shell after the polishing process of the shell. Figure 9a is an enlarged view of a housing before a polishing process according to another embodiment of the present disclosure. Figure 9b is Figure 9a An enlarged view of the shell after the polishing process of the shell.

[0096] Reference Figure 7 , the manufacturing process 1000 of the housing may include preparing a housing including an irregular pattern (e.g., Figure 6 The irregular pattern 311) of glass (for example, Figure 6 Operation 1010 of glass 310, placing a reflective layer (e.g., Figure 6 Operation 1020 of depositing a reflective layer 320 of the glass 310, and polishing the housing (e.g., Figure 6 According to an embodiment, the manufacturing process 1000 of the housing may be explained as an operation 1030 of an electronic device (eg, Figure 2 Part of the manufacturing process of the electronic device 200).

[0097] According to various embodiments, in operation 1010 of preparing the glass 310 including the irregular pattern 311, the irregular pattern 311 may be randomly formed on the glass 310 using a cutting process. According to an embodiment, the irregular pattern 311 may be formed using a wet etching process. For example, the irregular pattern 311 may be formed on the first glass surface 310a of the glass 310 using a solution using hydrofluoric acid or ammonium fluoride. According to an embodiment, the irregular pattern 311 may be formed using a dry sandblasting process. According to an embodiment, at least a portion of the glass 310 (e.g., the first glass surface 310a) may be formed to be substantially flat using a polishing process.

[0098] According to various embodiments, in operation 1020 of depositing the reflective layer 320 on the glass 310, the reflective layer 320 may be disposed on the irregular pattern 311 of the glass 310 using a deposition process. According to an embodiment, through the deposition process 1020, the housing 300 may have a surface 319 at which the surface of the glass 310 before polishing and / or the reflective layer 320 is exposed. The surface 319 may be referred to as a surface of the housing 300 after etching and / or before polishing. According to an embodiment, Figure 8a and Figure 9a The housing 300 may be the housing 300 in which the reflective layer 320 is deposited on the glass 310, and may be the housing 300 in which the deposition process 1020 is performed.

[0099] According to various embodiments, the reflective layer 320 may be disposed on the irregular pattern 311 of the glass 310 by a deposition process. For example, the reflective layer 320 may be deposited on the irregular pattern 311 using a vacuum deposition method (e.g., a sputtering process). According to an embodiment, the sputtering process may be a high-frequency inductively coupled plasma (ICP) process. The high-frequency inductively coupled plasma process may be a process in which a material deposited (e.g., sputtered) on positive ions (e.g., argon (Ar) ions) is deposited on the glass 310 and then reacts with a plasma gas in a plasma light source to be formed of an oxide or a nitride. An inert gas may be used as the positive ions.

[0100] According to various embodiments, the operation 1030 of polishing the housing 300 may be an operation of polishing the glass 310 and the reflective layer 320. For example, a brush or slurry may be used to polish the glass 310 and the reflective layer 320. According to embodiments, the depth to which the housing 300 is polished may be variously changed according to the design of the housing 300. For example, the depth to which the housing 300 is polished may be changed based on the material of the brush, the pressure delivered to the housing 300, the time of the polishing operation, and / or the type of slurry. According to embodiments, the brush may include nylon or pig hair. According to embodiments, the slurry may include cerium oxide (CeO 2According to an embodiment, the polishing operation 1030 may be performed using annular polishing, inline polishing, and / or belt polishing. Figure 8b and Figure 9b The housing 300 may be a housing in which the polishing operation 1030 is performed.

[0101] Fig.10 is a view illustrating a housing including a plurality of reflective layers according to an embodiment. Fig.11 is a view illustrating a housing including a plurality of reflective layers according to another embodiment of the present disclosure. Fig.12a , Figure 12b and Fig.12c is a view showing a process of manufacturing a housing including a plurality of reflective layers.

[0102] Reference Fig.10 , Fig.11 , Fig.12a , Figure 12b and Fig.12c , the housing 300 may include a glass 310 and a reflective layer 320 disposed on the irregular pattern 311 of the glass 310. The reflective layer 320 may include a plurality of reflective layers (eg, a first reflective layer 321 and a second reflective layer 322). Fig.10 , Fig.11 , Fig.12a , Figure 12b and Fig.12c The configuration of the glass 310 and the reflective layer 320 may be wholly or partially Figure 6 The configurations of the glass 310 and the reflective layer 320 are the same.

[0103] According to various embodiments, the reflective layer 320 may include a plurality of reflective layers 321 and 322. For example, the reflective layer 320 may include a first reflective layer 321 disposed on the glass 310 and a second reflective layer 322 disposed on the first reflective layer 321. According to an embodiment, the first reflective layer 321 may be deposited on the glass 310, and the second reflective layer 322 may be deposited on the first reflective layer 321. According to an embodiment, at least a portion of the first reflective layer 321 may be disposed in the irregular pattern 311 of the glass 310. For example, the first reflective layer 321 may include a 1-1st surface 321a disposed on the glass 310 and a 1-2nd surface 321b opposite to the 1-1st surface 321a. The second reflective layer 322 may be disposed on the 1-2nd surface 321b of the first reflective layer 321. For example, the second reflective layer 322 may include a 2-1st surface 322a facing the first reflective layer 321 and a 2-2nd surface 322b opposite to the 2-1st surface 322a. In the present disclosure, the first reflective layer 321 and the second reflective layer 322 have been described as different structures formed using separate processes, but are not limited thereto. For example, the first reflective layer 321 and the second reflective layer 322 may be interpreted as one reflective layer 320. For example, one reflective layer 320 may include regions or portions having different thicknesses, shapes, surface roughnesses, and / or materials, and some of the regions or portions having different thicknesses, shapes, surface roughnesses, and / or materials may be referred to as the first reflective layer 321 or the second reflective layer 322, and the other regions or portions may be referred to as the first reflective layer 321 and the second reflective layer.

[0104] According to various embodiments, the housing 300 may have a different refractive index for each portion. For example, the glass 310 may include a first region 313 where the first reflective layer 321 is located and a second region 314 where the first reflective layer 321 and the second reflective layer 322 are located.

[0105] According to various embodiments, a refractive index of the first region 313 and a refractive index of the second region 314 may be different.

[0106] According to an embodiment, the material of the first reflective layer 321 may be different from the material of the second reflective layer 322. According to an embodiment, the hardness of the second reflective layer 322 may be higher than the hardness of the first reflective layer 321. For example, the second reflective layer 320 may include silicon nitride (Si 3 N 4 ), the first reflective layer 321 may include silicon dioxide (SiO 2). According to an embodiment, the thickness of the reflective layer located in the first area 313 may be different from the thickness of the reflective layer located in the second area 314. For example, one reflective layer (e.g., the first reflective layer 321) may be located in the first area 313, and a plurality of reflective layers (e.g., the first reflective layer 321 and the second reflective layer 322) may be located in the second area 314. According to an embodiment, as the plurality of reflective layers 321 and 322 are deposited in the second area 314, the second thickness d2 of the plurality of reflective layers 321 and 322 located in the second area 314 may be greater than the first thickness d1 of the reflective layer (e.g., the first reflective layer 321) located in the first area 313. According to an embodiment, the first reflective layer 321 may be visually exposed to the outside of the housing 300 in the first area 313 of the glass 310, and the second reflective layer 322 may be visually exposed to the outside of the housing 300 in the second area 314 of the glass 310. According to an embodiment, due to the difference in refractive index, the color and / or glitter effect displayed in the first area 313 may be different from the color and / or glitter effect displayed in the second area 314 .

[0107] According to an embodiment, the thickness of the reflective layer 320 may be different for each portion. Figure 7 In the process 1030 of the embodiment of the present invention, a first region of the reflective layer 320 may be polished to a first length, and a second region different from the first region may be polished to a second length different from the first length. For example, the second region may have a greater polishing amount than the first region, so that the thickness of the second region may be less than the thickness of the first region. According to an embodiment, the second region may be interpreted as a portion of the reflective layer 320, where the first reflective layer 321 or the second reflective layer 322 is located, and the first region thicker than the second region may be interpreted as a portion of the reflective layer 320, where the first reflective layer 321 and the second reflective layer 322 are located.

[0108] According to an embodiment, the shape of the reflective layer 320 may be different for each portion. For example, the reflective layer 320 may have a shape corresponding to the shape of the irregular pattern 311. According to an embodiment, the shape of the reflective layer 320 located in the first region 313 may be different from the shape of the reflective layer 320 located in the second region 314. The shape of the irregular pattern 311 may be different for each portion. For example, the shape of the irregular pattern 311 located in the first region 313 may be different from the shape of the irregular pattern 311 located in the second region 314. According to an embodiment, for each portion, the casting used to form the irregular pattern 311 may have different shapes (e.g., "U" shape and / or "V" shape).

[0109] According to an embodiment, the surface roughness of the reflective layer 320 (e.g., the arithmetic mean roughness Ra of the irregular pattern 311) may be different for each portion. For example, the surface roughness of the reflective layer 320 may correspond to the surface roughness of the irregular pattern 311. According to an embodiment, the surface roughness of the reflective layer 320 located in the first area 313 and the surface roughness of the reflective layer 320 located in the second area 314 may be different. The surface roughness of the irregular pattern 311 may be different for each portion. For example, the surface roughness of the irregular pattern 311 located in the first area 313 and the surface roughness of the irregular pattern 311 located in the second area 314 may be different. According to an embodiment, the casting used to form the irregular pattern 311 may have a different surface roughness for each portion. According to various embodiments, the second reflective layer 322 may be formed by deposition on the glass 310 where the first reflective layer 321 is provided. Referring to Fig.12a and Figure 12b , the second reflective layer 322 may be deposited on the first reflective layer 321. For example, in the housing 300 where the mask 1100 is disposed, the second reflective layer 322 may be disposed in an area where the mask is not positioned. According to an embodiment, the mask 1100 may include a plurality of protrusions 1101 corresponding to the shape of the irregular pattern 311. According to an embodiment, a portion of the glass 310 covered by the mask 1100 so that the second reflective layer 322 is not deposited may be referred to as a first area (e.g., Fig.10 The portion of the glass 310 that is not covered by the mask 1100 so that the second reflective layer 322 is deposited may be referred to as a second region (eg, Fig.10 The second area 314). Fig.11 and Figure 12b , at least a portion of the second reflective layer 322 (e.g., the upper surface portion 322c) may not be polished. According to an embodiment, the second reflective layer 322 may include an upper surface portion 322c disposed on the first glass surface 310a and a side surface portion 322d disposed on the first reflective layer 321. According to an embodiment, as the transmittance of light changes through the upper surface portion 322c, the visual effect provided by the housing 300 may change. Referring to Fig.10 and Fig.12c , the second reflective layer 322 may be polished. For example, a polishing process may be used to polish the upper surface portion 322c of the second reflective layer 322. The first glass surface 310a of the glass 310 may be visually exposed to the outside of the housing 300.

[0110] Fig.13a , Fig.13b and Fig.13c is a view illustrating a case including a rear irregular pattern according to various embodiments of the present disclosure.

[0111] Reference Fig.13a , Fig.13b and / or Fig.13c , the housing 300 may include a glass 310 , a reflective layer 320 , a shielding layer 350 and / or a deposition layer 360 . Fig.13a , Fig.13b and / or Fig.13c The configuration of the glass 310, the reflective layer 320 and the shielding layer 350 can be entirely or partially Figure 6 The configurations of the glass 310, the reflective layer 320 and the shielding layer 350 are the same.

[0112] According to various embodiments, the glass 310 may include a rear irregular pattern 312. For example, the glass 310 may include a first glass surface 310a facing the outside of the housing 300 and a second glass surface 310b opposite to the first glass surface 310a. The glass 310 may include an irregular pattern 311 formed on the first glass surface 310a and a rear irregular pattern 312 formed on the second glass surface 310b. The rear irregular pattern 312 may be referred to as a plurality of grooves or depressions formed in the second glass surface 310b of the glass 310. According to an embodiment, at least a portion of the light passing through the glass 310 may be scattered due to the rear irregular pattern 312. For example, the rear irregular pattern 312 may increase the haze value. According to an embodiment, the rear irregular pattern 312 may enhance the glitter and / or pearl effect. For example, at least a portion of the light transmitted to the housing 300 may be scattered by the irregular pattern 311, the rear irregular pattern 312, and the reflective layer 320. According to an embodiment, the glass 310 may include a fourth glass surface 310 d extending from the second glass surface 310 b and forming a rear irregular pattern 312 .

[0113] Reference Fig.13a and Fig.13b , at least a portion of the shielding layer 350 may be accommodated in the rear irregular pattern 312. For example, the shielding layer 350 may include a plurality of first protruding patterns 351 accommodated in the rear irregular pattern 312. According to an embodiment, the first protruding patterns 351 may be surrounded by the fourth glass surface 310d. According to an embodiment, the deposition layer 360 may be located between the glass 310 and the shielding layer 350. According to an embodiment (for example, Fig.13b ), the deposition layer 360 may include a first deposition layer 361 and a second deposition layer 362. The first deposition layer 361 may be located on the glass 310 (e.g., in the +Z direction), and the second deposition layer 362 may be located between the first deposition layer 361 and the shielding layer 350. The configuration of the deposition layer 360 may be partially the same as that of the reflective layer 320. For example, the description of the first reflective layer 321 and the second reflective layer 321 may be applied to the first deposition layer 361 and the second deposition layer 362.

[0114] Reference Fig.13c , the deposition layer 360 may be deposited on the second glass surface 310b of the glass 310 (e.g., in the +Z direction). For example, the deposition layer 360 may be disposed below the glass 310 (e.g., in the +Z direction) using direct deposition, mirror ink including aluminum paste, and / or painting. According to an embodiment, the deposition layer 360 may be disposed between the glass 310 and the shielding layer 350. At least a portion of the deposition layer 360 may be accommodated in the rear irregular pattern 312. For example, the deposition layer 360 may include a plurality of second protruding patterns 363 surrounded by the fourth glass surface 310d. According to an embodiment, the deposition layer 360 may reflect at least a portion of the light transmitted to the housing 300. For example, the deposition layer 360 may have various colors. The deposition layer 360 may be referred to as a color layer or a rear reflective layer. According to an embodiment, the configuration of the deposition layer 360 may be partially the same as that of the reflective layer 320. For example, the deposition layer 360 may be referred to as a color layer or a rear reflective layer, and may be formed using deposition or evaporation using an electron beam. According to an embodiment, deposition layer 360 may include a deposition material (eg, hafnium oxide (HfO 2 ), titanium dioxide (TiO 2 ), niobate (Nb 2 O 5 ), zirconium oxide (ZrO 2 ) and / or aluminum oxide (Al 2 O 3 )).

[0115] Fig.14 is a view illustrating an electronic device including a polymer film and a color layer according to various embodiments. Fig.15 is a view illustrating an electronic device including a deposition layer according to various embodiments of the present disclosure.

[0116] Reference Fig.14 and Fig.15 , the housing 400 may include a glass 410 including an irregular pattern 411, and the housing 400 may not include a reflective layer (eg, Figure 6 reflective layer 320). Fig.14 and Fig.15 The configuration of the housing 400, the glass 410, the irregular pattern 411 and the shielding layer 440 may be entirely or partially Figure 6 The configurations of the housing 300, the glass 310, the irregular pattern 311 and the shielding layer 350 are the same.

[0117] Reference Fig.14, the housing 400 may include a glass 410, a polymer film 420 disposed below the glass 410 (in the +Z direction), a color layer 430 disposed below the polymer film 420, and a shielding layer 440 disposed below the color layer 430. According to an embodiment, the color layer 430 may be a deposition layer deposited on the polymer film 420 or a mirror ink printed on the polymer film 420. According to an embodiment, the color layer 430 may be referred to as a reflective layer.

[0118] According to various embodiments, the housing 400 may provide a glitter effect or a pearl effect without the reflective layer 320 disposed in the irregular pattern 411. For example, at least a portion of the light reflected from the color layer 430 of the housing 400 may be scattered in the irregular pattern 411 of the glass 410, thereby enhancing the pearl effect and / or the glitter effect.

[0119] Reference Fig.15 , the housing 400 may include a glass 410, a deposition layer 450 disposed below the glass 410 (in the +Z direction), and a shielding layer 440 disposed below the deposition layer 450. According to an embodiment, the deposition layer 450 may be a layer of physical vapor deposition (PVD) on the second glass surface 410b. According to an embodiment, the deposition layer 450 may reflect at least a portion of light incident on the housing 400 through the glass 410.

[0120] According to various embodiments, the housing 400 may provide a sparkle effect or a pearl effect without the reflective layer 320 disposed in the irregular pattern 411. For example, at least a portion of the light reflected from the deposition layer 450 of the housing 400 may be scattered in the irregular pattern 411 of the glass 410, thereby enhancing the pearl effect and / or the sparkle effect.

[0121] Fig.16a and Fig.16b is a view illustrating an electronic device including a rear irregular pattern according to various embodiments of the present disclosure.

[0122] Reference Fig.16a and Fig.16b , the housing 500 may include a glass 510 , a color layer 520 and a shielding layer 530 . Fig.16a and Fig.16b The configuration of the housing 500, glass 510 and shielding layer 530 may be wholly or partially Figure 6 The configurations of the housing 300, the glass 310 and the shielding layer 350 are the same.

[0123] According to various embodiments, the glass 510 may include a first glass surface 510a facing the outside of the housing 500 and a second glass surface 510b opposite to the first glass surface 510a. According to an embodiment, the glass 510 may not include an irregular pattern (e.g., Figure 6 The irregular pattern 311) may include a rear irregular pattern 512 formed on the second glass surface 510b. Fig.16a and Fig.16b The configuration of the rear irregular pattern 512 may be wholly or partially related to Figures 13a to 13c The configuration of the rear irregular pattern 312 is the same.

[0124] According to various embodiments, the housing 500 may include a color layer 520 for displaying colors. According to an embodiment, the color layer 520 may include silicon dioxide (SiO 2 ), silicon nitride (Si 3 N 4 ) and / or titanium oxide (Ti 3 O 5 ).

[0125] Reference Fig.16a , the color layer 520 may include a color layer 520 disposed on the front surface (e.g., the first glass surface 510a) of the glass 510. For example, the color layer 520 may be a layer physically vapor deposited on the first glass surface 510a. According to an embodiment, the glass 510 may be disposed between the color layer 520 and the shielding layer 530. According to an embodiment, at least a portion of the light transmitted to the housing 500 may be reflected from the protruding pattern 531 of the shielding layer 530 accommodated in the rear irregular pattern 512, so that the pattern and / or color displayed by the housing 500 may be changed. Referring to Fig.16b , the color layer 520 may include a color layer 520 disposed on the rear surface (e.g., the second glass surface 510b) of the glass 510. For example, the color layer 520 may be a layer physically vapor deposited on the second glass surface 510b. According to an embodiment, the color layer 520 may reflect at least a portion of light incident on the housing 500 through the glass 510. According to an embodiment, the housing 500 may be provided in a reflective layer (e.g., Figure 6 In the case of the reflective layer 320 of the housing 500, a glitter effect or a pearl effect can be provided. For example, at least a portion of the light reflected from the color layer 520 of the housing 500 can be scattered in the rear irregular pattern 512 of the glass 510, thereby enhancing the pearl effect and / or the glitter effect.

[0126] According to various embodiments of the present disclosure, an electronic device (eg, Figure 2 The electronic device 200 may include a housing (eg, Figure 2 electronic device 210) and a processor disposed in the housing (eg, Figure 1 The housing may include glass (e.g., Figure 6 of glass 310) and a reflective layer (e.g., Figure 6 The glass includes a first glass surface (eg, Figure 6 The first glass surface 310a) and the irregular pattern (eg, Figure 6 The reflective layer is disposed on the irregular pattern and formed into a shape corresponding to the irregular pattern, and the reflective layer includes a first surface (eg, Figure 6 and a second surface (eg, a first surface 320a) facing the exterior of the housing and spaced apart from the first surface by a specified distance. Figure 6 a second surface 320b).

[0127] According to various embodiments, the reflective layer may include a first reflective layer (eg, first reflective layer 321 of FIG. 9 ) deposited on the glass and a second reflective layer (eg, second reflective layer 322 of FIG. 9 ) deposited on at least a portion of the first reflective layer.

[0128] According to various embodiments, the glass may include a first region (e.g., first region 313 of FIG. 9 ) where the first reflective layer is positioned and a second region (e.g., second region 314 of FIG. 9 ) where the first reflective layer and the second reflective layer are positioned. The refractive index of the first region may be different from the refractive index of the second region.

[0129] According to various embodiments, the second reflective layer may include an upper surface portion (eg, Fig.10 The upper surface portion 322c) and the side surface portion disposed on the first reflective layer (eg, Fig.10 upper surface portion 322d).

[0130] According to various embodiments, a material of the first reflective layer may be different from a material of the second reflective layer.

[0131] According to various embodiments, the reflective layer may include silicon oxide.

[0132] According to various embodiments, a specified distance (e.g., Figure 6 The specified distance d) can be 100 nm to 2000 nm.

[0133] According to various embodiments, the glass may include a second glass surface opposite to the first glass surface (eg, Fig.13aThe second glass surface 310b) and the rear irregular pattern formed on the second glass surface (eg, Fig.13a The rear irregular pattern 312).

[0134] According to various embodiments, the housing may include a shielding layer (eg, Fig.13a Shielding layer 350).

[0135] According to various embodiments, the housing may include a Fig.13a +Z direction) and disposed below the rear irregular pattern (e.g., Fig.13c A deposition layer 360) and a shielding layer (eg, Fig.13c Shielding layer 350).

[0136] According to various embodiments, the housing may include an adhesive layer (eg, Figure 6 Adhesive layer 330), a polymer film (eg, Figure 6 ), and a shielding layer (eg, Figure 6 Shielding layer 350).

[0137] According to various embodiments, the second surface of the reflective layer may have a curved surface formed using a polishing process.

[0138] According to various embodiments, the housing may include an anti-fingerprint coating disposed on the glass (e.g., Figure 6 Anti-fingerprint coating 305).

[0139] According to various embodiments, the glass may include a third glass surface extending from the first glass surface and forming an irregular pattern (eg, Figure 6 The reflective layer may cover at least a portion of the third glass surface 310c.

[0140] According to various embodiments, the housing may include a front plate (eg, Figure 2 202) and a rear plate (e.g., Figure 4 The glass may be located on the rear panel.

[0141] According to various embodiments of the present disclosure, a housing (eg, Figure 6 The housing 300 may include glass (eg, Figure 6 of glass 310) and a reflective layer (e.g., Figure 6 The glass includes a first glass surface that is visually exposed (e.g., Figure 6 The first glass surface 310a) and the irregular pattern (eg, Figure 6 The reflective layer is disposed on the irregular pattern and formed into a shape corresponding to the irregular pattern, and the reflective layer includes a first surface (eg, Figure 6 The first surface 320a) faces the outside of the housing and is spaced apart from the first surface by a specified distance (e.g., Figure 6 A second surface (e.g., Figure 6 a second surface 320b).

[0142] According to various embodiments of the present disclosure, a method for manufacturing a housing (eg, a housing manufacturing method 1000 of FIG. 8 ) may include preparing a housing including an irregular pattern (eg, Figure 6 The irregular pattern 311) of glass (for example, Figure 6 Glass 310) (e.g., Figure 7 Operation 1010), a reflective layer (eg, Figure 6 The reflective layer 320 is deposited on the irregular pattern of the glass (e.g., Figure 7 operation 1020), and polishing the housing (e.g., Figure 7 Operation 1030).

[0143] It is obvious to those skilled in the art that the housing according to the present disclosure and the electronic device including the housing as described above are not limited to the above embodiments and those shown in the accompanying drawings, and various changes, modifications or alterations may be made thereto without departing from the scope of the present disclosure.

Claims

1. An electronic device, comprising: case; as well as A processor disposed in the housing, wherein the housing comprises: glass, comprising a first glass surface visually exposed to the outside of the housing and an irregular pattern formed on the first glass surface; and A reflective layer is disposed on the irregular pattern and formed into a shape corresponding to the irregular pattern, the reflective layer including a first surface covering at least a portion of the irregular pattern and a second surface facing the outside of the housing and spaced apart from the first surface by a specified distance.

2. The electronic device according to claim 1, wherein: The reflective layer includes a first reflective layer deposited on the glass and a second reflective layer deposited on at least a portion of the first reflective layer.

3. The electronic device according to claim 2, wherein: The glass includes a first region and a second region, the first reflective layer is located in the first region, the first reflective layer and the second reflective layer are located in the second region, and The refractive index of the first region is different from the refractive index of the second region.

4. The electronic device according to claim 2, wherein: The second reflective layer includes an upper surface portion disposed on the first glass surface and a side surface portion disposed on the first reflective layer.

5. The electronic device according to claim 2, wherein: A material of the first reflective layer is different from a material of the second reflective layer.

6. The electronic device according to claim 1, wherein: The reflective layer includes silicon oxide.

7. The electronic device according to claim 1, wherein: The specified distance between the first surface and the second surface is 100 nm to 2000 nm.

8. The electronic device according to claim 1, wherein: The glass includes a second glass surface opposite to the first glass surface and a rear irregular pattern formed on the second glass surface.

9. The electronic device according to claim 8, wherein: The housing includes a shielding layer disposed below the rear irregular pattern.

10. The electronic device according to claim 8, wherein: The housing includes a deposition layer disposed below the glass and below the rear irregular pattern, and a shielding layer disposed below the deposition layer.

11. The electronic device according to claim 1, wherein: The housing comprises: an adhesive layer disposed below the glass; a polymer film disposed below the adhesive layer; and A shielding layer is disposed beneath the polymer film.

12. The electronic device according to claim 1, wherein: The second surface of the reflective layer has a curved surface formed using a polishing process.

13. The electronic device of claim 1, wherein the housing comprises an anti-fingerprint coating disposed on the glass.

14. The electronic device according to claim 1, wherein: The glass includes a third glass surface extending from the first glass surface and forming the irregular pattern, Wherein, the reflective layer covers at least a portion of the third glass surface.

15. The electronic device according to claim 1, wherein: The housing is manufactured by a manufacturing method, the manufacturing method comprising: preparing the glass including the irregular pattern; depositing the reflective layer on the irregular pattern of the glass; and The housing is polished.

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