Cold compress ice bag based on low-voltage refrigeration technology

By using low-voltage refrigeration technology and a circulating water pipe system in the cold compress ice pack, the problem of frequent refreezing of existing ice packs is solved, achieving long-term continuous cooling and convenient use of the ice pack.

CN119326583APending Publication Date: 2025-01-21GUANGZHOU JINYU INTELLIGENT TECH CO LTD
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Patent Information

Application Number
CN202411193211.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-08-28
Publication Date
2025-01-21

AI Technical Summary

Technical Problem

Existing cold compress bandage ice packs are prone to melt when used and need to be refrigerated frequently, which limits their use time.

Method used

A cold compress ice pack based on low-voltage refrigeration technology is used, including ice packs, circulating water pipes, micro pumps, semiconductor refrigeration chips, heat dissipation structures and variable frequency power supplies. The circulating water pipe is filled with liquid with low freezing point and low specific heat capacity. A micropump drives the liquid circulation. The semiconductor refrigeration chip is powered by a variable frequency power supply to achieve continuous refrigeration.

Benefits of technology

It enables long-term use of the ice pack without refreezing, provides continuous cold compress effect, and improves the convenience and flexibility of use.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to the technical field of ice bags, and discloses a cold compress ice bag based on a low-voltage refrigeration technology, which is characterized by comprising an ice bag, a circulating water pipe and a micro pump, the circulating water pipe is a snakelike coil pipe and is of an upper-lower double-layer structure, after the ice bag wraps the lower half portion of the circulating water pipe, a middle pipe body of the circulating water pipe penetrates through the top wall of the ice bag, the connecting position of the middle pipe body and the top wall is sealed, and the content of the circulating water pipe is low-freezing-point and low-specific-heat-capacity liquid. A water inlet and a water outlet of the micro pump are respectively connected with two ends of the circulating water pipe; a semiconductor chilling plate, a heat dissipation structure and a variable-frequency power supply; the refrigeration surface of the semiconductor refrigeration sheet is attached to the upper side of the circulating water pipe, and a heat dissipation structure is arranged on the heat dissipation surface; the micro pump and the semiconductor chilling plate are electrically connected with the variable-frequency power supply respectively; and the binding structure is used for binding and fixing the ice bag on a human body. Compared with the prior art, the refrigerating device has the advantages that the low-voltage semiconductor refrigerating chip is used and externally connected with power supply, so that the effects of being used at any time and capable of continuously refrigerating are achieved.
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Description

Technical Field

[0001] The invention relates to the technical field of ice packs, and in particular to a cold compress ice pack based on low-voltage refrigeration technology. Background Art

[0002] Cold compress is a common method used in treating traumatic injuries. The capillaries are stimulated by low temperature and contract, which can reduce the swelling of the wound after traumatic injuries. Hot compress can be used afterwards to promote wound healing. The most common cold compress method now is ice packs. The better ones will use more convenient bandage ice packs. However, the current cold compress bandages can only be stored in the refrigerator for a long time, and they are easy to melt when used, so they need to be put back in the refrigerator for freezing. There are certain limitations when using them. Summary of the invention

[0003] The technical problem to be solved by the present invention is to overcome the above technical difficulties and provide a cold compress ice pack based on low voltage refrigeration technology so as to meet the requirement that the ice pack can be used for a longer period of time without refreezing.

[0004] In order to solve the above technical problems, the technical solution provided by the present invention is:

[0005] Cold packs based on low voltage refrigeration technology include;

[0006] Ice bag, circulating water pipe and micro pump; the circulating water pipe is a serpentine coil and is arranged as an upper and lower double-layer structure. After the ice bag covers the lower half of the circulating water pipe, the middle pipe body of the circulating water pipe penetrates the top wall of the ice bag and the connection with the top wall is sealed. The content of the circulating water pipe is a liquid with a low freezing point and low specific heat capacity. The water inlet and outlet of the micro pump are respectively connected to the two ends of the circulating water pipe, and the ice bag is filled with a heat exchange filler;

[0007] A semiconductor refrigeration sheet, a heat dissipation structure and a variable frequency power supply; the cooling surface of the semiconductor refrigeration sheet is arranged on the upper side of the circulating water pipe, and the heat dissipation structure is arranged on the heat dissipation surface; the micro pump and the semiconductor refrigeration sheet are electrically connected to the variable frequency power supply respectively;

[0008] The binding structure is used to bind and fix the ice pack on the human body.

[0009] As an improvement, the binding structure includes a wrapping bag and a Velcro bandage; one side of the wrapping bag is open and tightly wrapped around the ice bag, a pair of Velcro bandages are arranged along the wrapping bag in a mirror image, and the movable ends of the two Velcro bandages are connected by Velcro bonding.

[0010] As an improvement, the heat dissipation structure is a heat dissipation fan, which is electrically connected to the variable frequency power supply; the heat exchange filler is a mixture of sodium polyacrylate and water; and a power supply interface is provided on the variable frequency power supply.

[0011] The advantages of the present invention compared with the prior art are: the present invention utilizes low-voltage semiconductor refrigeration technology, coupled with a circulating water pipe system, to evenly distribute the refrigeration liquid in the ice bag, and externally connects a low-voltage power supply device to continuously achieve the effect of continuous refrigeration at any time through semiconductor refrigeration sheets. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 The structure of the present invention is schematically shown in FIG. Figure 1 .

[0013] Figure 2 The structure of the present invention is schematically shown in FIG. Figure 2 .

[0014] Figure 3 The structure of the present invention is schematically shown in FIG. Figure 3 .

[0015] As shown in the figure: 1. Ice bag; 2. Circulating water pipe; 3. Micro pump; 4. Semiconductor refrigeration chip; 5. Variable frequency power supply; 6. Power interface; 7. Velcro bandage; 8. Wrapping bag; 9. Cooling fan. DETAILED DESCRIPTION

[0016] In the description of the present invention, it should be understood that the terms "center", "lateral", "up", "down", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first" and "second" are used only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more. In addition, the term "including" and any variation thereof are intended to cover non-exclusive inclusions.

[0017] The present invention is further described in detail below in conjunction with the accompanying drawings.

[0018] Cold packs based on low voltage refrigeration technology include;

[0019] Ice bag 1, circulating water pipe 2 and micro pump 3; the circulating water pipe 2 is a serpentine coil and is arranged as an upper and lower double-layer structure. After the ice bag 1 covers the lower half of the circulating water pipe 2, the middle pipe body of the circulating water pipe 2 penetrates the top wall of the ice bag 1 and is sealed at the connection with the top wall. The content of the circulating water pipe 2 is a liquid with a low freezing point and low specific heat capacity. The water inlet and outlet of the micro pump 3 are respectively connected to the two ends of the circulating water pipe 2. The ice bag 1 is filled with a heat exchange filler; the heat exchange filler is a mixture of sodium polyacrylate and water; the variable frequency power supply 5 is provided with a power interface 6.

[0020] Semiconductor refrigeration sheet 4, heat dissipation structure and variable frequency power supply 5; the cooling surface of semiconductor refrigeration sheet 4 is arranged on the upper side of circulating water pipe 2, and the heat dissipation structure is arranged on the heat dissipation surface; micro pump 3 and semiconductor refrigeration sheet 4 are electrically connected to variable frequency power supply 5 respectively; the heat dissipation structure is heat dissipation fan 9, and heat dissipation fan 9 is electrically connected to variable frequency power supply 5.

[0021] The binding structure is used to bind and fix the ice pack 1 on the human body; the binding structure includes a wrapping bag 8 and a Velcro bandage 7; one side of the wrapping bag 8 is open and tightly wrapped on the ice pack 1, a pair of Velcro bandages 7 are arranged along the wrapping bag 8 in a mirror image, and the movable ends of the two Velcro bandages 7 are connected by Velcro bonding.

[0022] The variable frequency power supply 5, semiconductor cooling sheet 4, cooling fan 9, etc. used in the present invention are all prior arts well known to those skilled in the art, and their use and control methods are all prior arts.

[0023] In the specific implementation of this embodiment:

[0024] The cooling fan 9 is composed of a radiator and an axial flow fan, and the radiator is a heat sink structure, and thermal conductive silicone grease is coated between the cooling fan 9 and the semiconductor refrigeration sheet 4; the power interface 6 can adopt the common Type-C interface, and the external power supply can use a common power bank, etc., to increase the practicality of the present invention; when in use, put the pre-frozen ice bag 1 into the wrapping bag 8, with the fan facing outward, and fix it to the part of the body that needs cold compress through the Velcro bandage 7. If necessary, a bandage with multiple wrapping bags 8 can be selected, and multiple refrigeration equipment can be placed on the bandage to improve applicability; the circulating water pipe 2 can be filled with high-concentration alcohol, which has a small specific heat capacity and a low freezing point, so the temperature rises and falls quickly, and it will not freeze. Ice can meet the use requirements. The micro pump 3 drives the liquid inside the circulating water pipe 2 to circulate unidirectionally, and the circulating liquid cooled on the cooling surface of the semiconductor refrigeration plate 4 is transported to the inside of the ice bag 1 to keep the ice bag 1 at a lower temperature. The circulating liquid loss inside the circulating water pipe 2 can be added through the water inlet; the semiconductor refrigeration plate 4 is powered by the variable frequency power supply 5, and the cooling power is controlled by the variable frequency power supply 5. The variable frequency power supply 5 also powers the cooling fan 9 at the same time. The cooling fan 9 takes away the heat generated on the cooling surface of the semiconductor refrigeration plate 4 through air flow, thereby improving the working efficiency of the overall structure; a layer of heat dissipation silicone grease is coated between the heat dissipation fan 9 and the heat dissipation surface, and its thermal conductivity is very good, thereby increasing the heat dissipation efficiency.

[0025] The present invention and its embodiments are described above, and such description is not restrictive. The drawings show only one embodiment of the present invention, and the actual structure is not limited thereto. In short, if ordinary technicians in the field are inspired by it, without departing from the purpose of the invention, they can design a structure and embodiment similar to the technical solution without creativity, which should belong to the protection scope of the present invention.

Claims

1. A cold compress ice pack based on low voltage refrigeration technology, characterized in that: include: An ice bag (1), a circulating water pipe (2) and a micro pump (3); the circulating water pipe (2) is a serpentine coil and is arranged as an upper and lower double-layer structure. After the ice bag (1) covers the lower half of the circulating water pipe (2), the middle pipe body of the circulating water pipe (2) penetrates the top wall of the ice bag (1) and the connection with the top wall is sealed. The content of the circulating water pipe (2) is a liquid with a low freezing point and low specific heat capacity. The water inlet and the water outlet of the micro pump (3) are respectively connected to the two ends of the circulating water pipe (2). The ice bag (1) is filled with a heat exchange filler. A semiconductor refrigeration sheet (4), a heat dissipation structure and a variable frequency power supply (5); the refrigeration surface of the semiconductor refrigeration sheet (4) is arranged on the upper side of the circulating water pipe (2), and the heat dissipation structure is arranged on the heat dissipation surface; the micro pump (3) and the semiconductor refrigeration sheet (4) are electrically connected to the variable frequency power supply (5) respectively; The binding structure is used to bind and fix the ice pack (1) on the human body.

2. The cold compress ice pack based on low voltage refrigeration technology according to claim 1, characterized in that: The heat dissipation structure is a heat dissipation fan (9), and the heat dissipation fan (9) is electrically connected to the variable frequency power supply (5).

3. The cold compress ice pack based on low voltage refrigeration technology according to claim 1, characterized in that: The variable frequency power supply (5) is provided with a power supply interface (6).

4. The cold compress ice pack based on low voltage refrigeration technology according to claim 1, characterized in that: The heat exchange filler is a mixture of sodium polyacrylate and water.

5. The cold compress ice pack based on low voltage refrigeration technology according to claim 1, characterized in that: The binding structure comprises a wrapping bag (8) and a Velcro bandage (7); one side of the wrapping bag (8) is open and tightly wrapped around the ice bag (1); a pair of Velcro bandages (7) are arranged in a mirror image along the wrapping bag (8), and the movable ends of the two Velcro bandages (7) are connected by Velcro bonding.