Backlight module and display device

Abstract

The invention discloses a backlight module and a display device, the backlight module comprises a plate body structure, the plate body structure comprises a bottom plate and a side plate connected with the bottom plate, the bottom plate and the side plate enclose an accommodating space, the bottom plate or the side plate comprises a first plate body, and the first plate body is provided with a first slot; the optical film is arranged in the accommodating space; the light-emitting assembly comprises a circuit board and a plurality of light-emitting elements which are electrically connected, the light-emitting elements are at least partially arranged in the first open grooves, the light-emitting faces of the light-emitting elements face the optical film, and the circuit board is located on the side, away from the optical film, of the first plate body. According to the backlight module, the light-emitting element is arranged in the first open groove of the first plate body, so that the light-emitting element can utilize the space of the first open groove to realize staggered stacking of the light-emitting element and the first plate body, the overall boundary size of the backlight module is reduced, and the use performance of the backlight module is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of electronic products, and in particular relates to a backlight module and a display device. Background Art

[0002] The backlight module is one of the important components of the display device, which includes a display panel and a backlight module. The display panel itself cannot emit light, and the backlight module is required to provide a uniformly distributed surface light source so that the display panel can display images normally. However, due to the structural limitations of the existing backlight module, the performance of the backlight module cannot meet the requirements.

[0003] Therefore, a new backlight module and display device are urgently needed. Summary of the invention

[0004] An embodiment of the present invention provides a backlight module and a display device, which realizes staggered stacking of the light-emitting element and the first plate by arranging the light-emitting element in the first groove of the first plate body so that the light-emitting element can utilize the space of the first groove, thereby reducing the overall thickness of the backlight module when the bottom plate includes the first plate body, or reducing the side frame width of the backlight module when the side plate includes the first plate body, thereby improving the performance of the backlight module.

[0005] On the one hand, an embodiment of the present invention provides a backlight module, including: a plate structure, the plate structure includes a bottom plate and a side plate connected to the bottom plate, the bottom plate and the side plate enclose a receiving space, the bottom plate or the side plate includes a first plate body, the first plate body is provided with a first groove; an optical film is arranged in the receiving space; a light-emitting component, the light-emitting component includes an electrically connected circuit board and a plurality of light-emitting elements, the light-emitting elements are at least partially arranged in the first groove, and the light-emitting surface of the light-emitting element faces the optical film, and the circuit board is located on the side of the first plate body away from the optical film.

[0006] On the other hand, an embodiment of the present invention provides a display device, comprising: a display panel; and a backlight module disposed on the backlight side of the display panel, wherein the backlight module is the backlight module in any of the above embodiments.

[0007] Compared with the related art, the backlight module provided by the embodiment of the present invention includes a plate structure, an optical film and a light-emitting component. The plate structure includes a bottom plate and a side plate. The bottom plate or the side plate includes a first plate, which means that a part of the bottom plate or the side plate serves as the first plate. A first groove is provided to accommodate a light-emitting element, and the light-emitting element is exposed so that the light emitted by the light-emitting element can be directed toward the optical film. The circuit board is located on the side of the first plate away from the optical film for easy installation. By arranging the light-emitting element in the first groove of the first plate, the light-emitting element can utilize the space of the first groove, and the light-emitting element and the first plate can be staggered and stacked to reduce the overall boundary size of the backlight module. For example, the overall thickness of the backlight module can be reduced when the bottom plate includes the first plate, or the side frame width of the backlight module can be reduced when the side plate includes the first plate, thereby improving the performance of the backlight module. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments of the present invention are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0009] Figure 1 is a schematic structural diagram of a backlight module provided according to an embodiment of the present invention;

[0010] Figure 2 An embodiment of the present invention provides Figure 1 A partial enlarged view of the middle A;

[0011] Figure 3 is a schematic structural diagram of a light-emitting component provided according to an embodiment of the present invention;

[0012] Figure 4 Another embodiment of the present invention provides Figure 1 A partial enlarged view of the middle A;

[0013] Figure 5 Another embodiment of the present invention provides Figure 1 A partial enlarged view of the middle A;

[0014] Figure 6 is a structural schematic diagram of a backlight module provided in another embodiment of the present invention;

[0015] Figure 7 is a schematic structural diagram of a backlight module provided in yet another embodiment of the present invention;

[0016] Figure 8 is a schematic structural diagram of a base plate provided according to an embodiment of the present invention;

[0017] Fig. 9 Another embodiment of the present invention provides Figure 1 A partial enlarged view of the middle A;

[0018] Fig.10 Another embodiment of the present invention provides Figure 1 A partial enlarged view of the middle A;

[0019] Fig.11 is a schematic diagram of the structure of a circuit board provided according to an embodiment of the present invention;

[0020] Fig.12 is a partial schematic diagram of a circuit board provided according to an embodiment of the present invention;

[0021] Fig.13 is a schematic diagram of the structure of a circuit board provided according to another embodiment of the present invention;

[0022] Fig.14 is a schematic structural diagram of a circuit board provided according to yet another embodiment of the present invention;

[0023] Fig.15 is a schematic structural diagram of a light-emitting component provided according to another embodiment of the present invention;

[0024] Fig.16 is a schematic structural diagram of a light-emitting component provided according to yet another embodiment of the present invention;

[0025] Fig.17 is a schematic structural diagram of a light-emitting component provided according to yet another embodiment of the present invention;

[0026] Fig.18 is a schematic structural diagram of a backlight module provided in yet another embodiment of the present invention;

[0027] Fig.19 is a schematic structural diagram of a backlight module provided in yet another embodiment of the present invention;

[0028] Fig. 20 is a schematic structural diagram of a display device provided according to an embodiment of the present invention;

[0029] Fig.21 It is a schematic diagram of the structure of a display device provided according to an embodiment of the present invention. DETAILED DESCRIPTION

[0030] The features and exemplary embodiments of various aspects of the present invention will be described in detail below. In the detailed description below, many specific details are proposed to provide a comprehensive understanding of the present invention. However, it is obvious to those skilled in the art that the present invention can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present invention by illustrating examples of the present invention.

[0031] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0032] In the related art, the backlight module includes a light-emitting component as a light source. Usually, the light-emitting component is fixed in the board structure. This fixing method will cause the internal heat to be more concentrated. At the same time, considering the optical distance on the light incident side, the thickness of the circuit board, and the thickness of the board structure, the overall border size is limited, and further narrow frame requirements cannot be achieved, which affects the performance of the backlight module.

[0033] In order to solve the above problems, the embodiment of the present invention arranges the light-emitting element in the first groove of the first plate body so that the light-emitting element can utilize the space of the first groove, thereby realizing the staggered stacking of the light-emitting element and the first plate body, thereby reducing the overall boundary size of the backlight module and improving the performance of the backlight module.

[0034] In order to better understand the present invention, Figures 1 to 18 A backlight module and a display device according to an embodiment of the present invention are described in detail.

[0035] See also Figure 1 to Figure 2 , Figure 1 is a schematic structural diagram of a backlight module provided according to an embodiment of the present invention; Figure 2 An embodiment of the present invention provides Figure 1 A partial enlarged view of point A in the middle.

[0036] An embodiment of the present invention provides a backlight module, including: a plate structure 1, the plate structure 1 includes a bottom plate 11 and a side plate 12 connected to the bottom plate 11, the bottom plate 11 and the side plate 12 enclose a receiving space R, the bottom plate 11 or the side plate 12 includes a first plate body B1, and the first plate body B1 is provided with a first groove K1; an optical film 2, arranged in the receiving space R; a light-emitting component 3, the light-emitting component 3 includes an electrically connected circuit board 31 and a plurality of light-emitting elements 32, the light-emitting element 32 is at least partially arranged in the first groove K1, and the light-emitting surface of the light-emitting element 32 faces the optical film 2, and the circuit board 31 is located on the side of the first plate body B1 away from the optical film 2.

[0037] The backlight module provided by the embodiment of the present invention includes a plate structure 1, an optical film 2 and a light-emitting component 3. The plate structure 1 includes a bottom plate 11 and a side plate 12. The bottom plate 11 or the side plate 12 includes a first plate B1, which means that a part of the bottom plate 11 or the side plate 12 serves as the first plate B1. A first groove K1 is provided to accommodate a light-emitting element 32, and the light-emitting element 32 is exposed so that the light emitted by the light-emitting element 32 can be emitted toward the optical film 2. The circuit board 31 is located on the side of the first plate B1 away from the optical film 2, which is convenient for installation and setting. By arranging the light-emitting element 32 in the first groove K1 of the first plate B1, the light-emitting element 32 can utilize the space of the first groove K1, and the staggered stacking of the light-emitting element 32 and the first plate B1 is realized to reduce the overall boundary size of the backlight module. For example, the overall thickness of the backlight module can be reduced when the bottom plate 11 includes the first plate B1, or the side frame width of the backlight module can be reduced when the side plate 12 includes the first plate B1, thereby improving the performance of the backlight module.

[0038] Furthermore, in the embodiment of the present invention, a first slot K1 is formed in the first plate B1, ie, part of the material of the first plate B1 is removed, so as to reduce the overall weight of the backlight module, facilitate the installation and use of the backlight module, and facilitate the maintenance of the backlight module.

[0039] In the related art, the light-emitting component 3 is generally arranged inside the board structure 1. Due to the closed interior, the overall heat is easy to accumulate inside, and when the components such as the circuit board 31 in the light-emitting component 3 are damaged, it is necessary to start disassembling from the display panel P used by the backlight module, which has a high risk of scrapping and is difficult to rework. However, in the present application, the light-emitting element 32 is arranged in the first slot K1 of the first board B1, and the circuit board 31 is located on the side of the first board B1 away from the optical film 2, that is, located outside the board structure 1, so that the circuit board 31 can be maintained or replaced without disassembling the display panel P; at the same time, the heat dissipation effect can be further improved, and the damage rate of the light-emitting component 3 can be reduced.

[0040] In this embodiment, the plate structure 1 can be an integrated structure to facilitate molding, and the integrated structure has a higher structural strength. When the first slot K1 is provided on the first plate B1, it will not have a significant impact on the overall structure of the plate structure 1, thereby ensuring the reliability of the backlight module. For example, the plate structure 1 can be integrally formed by a die-casting process, that is, the bottom plate 11 and the side plate 12 are connected as a whole, or the plate structure 1 can also be prepared by a stamping process or the like.

[0041] The accommodation space R surrounded by the bottom plate 11 and the side plates 12 may be a semi-open accommodation space R, so that film layer components such as the optical film 2 can be arranged in the accommodation space R.

[0042] Optionally, the optical film 2 refers to a film layer that optically adjusts the light emitted by the light-emitting element 32. Depending on the actual structural function of the backlight module, the optical film 2 may include one layer, or multiple layers of film layers with different functions. For example, the optical film 2 may include at least one of film layers such as an anti-reflection layer and a light guide plate.

[0043] In some optional embodiments, the optical film 2 includes a light guide plate, and the light emitting element 32 is located between the light guide plate and the circuit board 31 .

[0044] Among them, the light guide plate (LGP) is made of optical-grade acrylic or PC plates, and light guide points are formed on the bottom of the plate through laser engraving, V-shaped cross grid engraving or UV screen printing technology. These light guide points can diffuse the light at all angles when it enters the plate, and make the light evenly emitted from the front of the light guide plate through reflection and refraction. The design of the light guide plate allows the light to be reflected and refracted multiple times inside the plate, ultimately achieving a uniform luminous effect.

[0045] In this embodiment, the light emitting element 32 is limited to be located between the light guide plate and the circuit board 31 so that the light emitted by the light emitting element 32 can directly enter the light guide plate, be reflected and refracted inside the light guide plate, and finally be emitted evenly.

[0046] Optionally, when the optical film 2 includes a light guide plate, the side panel 12 includes a first plate body B1, and the light-emitting element 32 is correspondingly arranged in the first groove K1 of the side panel 12. The light emitted by the light-emitting element 32 enters the side of the light guide plate and is emitted from the front side of the light guide plate intersecting with the side side. The extension direction of the front side of the light guide plate can be parallel to the extension direction of the bottom panel 11.

[0047] It should be noted that the light emitting element 32 can specifically be an LED (Light Emitting Diode), which can be a traditional LED with a size greater than 200 μm, or a smaller Micro LED (Micro Light Emitting Diode) or Mini LED to reduce costs and facilitate installation.

[0048] See also Figure 1 to Figure 2 In some optional embodiments, the side plate 12 includes a first plate body B1; the side plate 12 is disposed on one side of the optical film 2 along the first direction X, and the first direction X intersects with the thickness direction Y of the optical film 2.

[0049] It can be understood that, in this embodiment, the side plate 12 includes a first plate body B1, and the light emitting component 3 is also arranged on the side plate 12, and the light emitted by the light emitting component 3 is irradiated to the side of the optical film 2 along the first direction X, forming a side-emitting structure. Optionally, the first direction X can be perpendicular to the thickness direction Y of the optical film 2.

[0050] See also Figure 3 , Figure 3 : is a schematic diagram of the structure of the light-emitting assembly 3 provided according to an embodiment of the present invention; Optionally, the first slot K1 and the light-emitting element 32 are arranged in sequence along the second direction Z, and the second direction Z intersects with the first direction X and the thickness direction Y of the optical film 2. Optionally, the second direction Z is perpendicular to the first direction X, and the second direction Z is perpendicular to the thickness direction Y of the optical film 2.

[0051] It is understandable that, considering that the light irradiation range of a single light emitting element 32 is small and the brightness cannot meet the requirements, a plurality of light emitting elements 32 may be provided, and a plurality of first slots K1 arranged in sequence along the second direction Z may be provided correspondingly to accommodate the light emitting elements 32. In the present embodiment, the second direction Z may be the extension direction of the side plate 12 to facilitate the provision of the first slots K1.

[0052] See also Figure 3 Optionally, along the second direction Z, the first slots K1 are evenly spaced, that is, the intervals between the first slots K1 are equal, so as to ensure the uniformity of light emitted by the light-emitting element 32 .

[0053] Optionally, the light emitting elements 32 and the first slots K1 are arranged in a one-to-one correspondence.

[0054] Considering that when the backlight module is used in mobile devices such as vehicles, the optical film 2 needs to be sufficiently limited to avoid vibration and abrasion.

[0055] See also Figure 4 , Figure 4Another embodiment of the present invention provides Figure 1 A partial enlarged view of point A in the middle; in some optional embodiments, along the first direction X, the optical film 2 at least partially abuts against the first plate B1.

[0056] In this embodiment, the interaction force between the first plate B1 and the optical film 2 is used to fix the optical film 2 to prevent the optical film 2 from moving and causing abrasion of the optical film 2. In addition, in this embodiment, the first groove K1 is opened on the side plate 12, and the circuit board 31 is arranged on the side of the side plate 12 away from the optical film 2, that is, the optical film 2 will not directly abut the circuit board 31, thereby avoiding the problem of the circuit board 31 being damaged by the optical film 2.

[0057] Optionally, along the thickness direction of the optical film 2, part of the optical film 2 located on the side of the light emitting element 32 facing the bottom plate 11 protrudes toward the side plate 12 to abut against the side plate 12, while ensuring the stability of the abutment without affecting the light output of the light emitting element 32.

[0058] See also Figure 1 Optionally, a limit block 9 is provided on the side of the optical film 2 away from the light emitting element 32 , and the limit block 9 is located between the optical film 2 and the side plate 12 to limit and fix the optical film 2 in a direction perpendicular to the thickness direction of the optical film 2 .

[0059] See also Figure 5 , Figure 5 Another embodiment of the present invention provides Figure 1 A local enlarged view of point A in the middle; Optionally, the optical film 2 includes an extending portion 21 extending into the first groove K1, so that the optical film 2 is closer to the light-emitting element 32, so that the light output from the light-emitting element 32 enters the optical film 2 as evenly as possible, avoiding the light output from irradiating the film layer outside the optical film 2, thereby improving the utilization rate of the light output.

[0060] See also Figures 6 to 8 , Figure 6 is a structural schematic diagram of a backlight module provided in another embodiment of the present invention; Figure 7 is a schematic structural diagram of a backlight module provided in yet another embodiment of the present invention; Figure 8 1 is a schematic diagram of the structure of a base plate 11 provided according to an embodiment of the present invention; in some optional embodiments, the base plate 11 includes a first plate body B1; along the thickness direction Y of the optical film 2, the base plate 11 is arranged on one side of the optical film 2.

[0061] In this embodiment, the light emitting element 32 is correspondingly disposed in the first slot K1 of the bottom plate 11 , and the circuit board 31 is fixed to the side of the bottom plate 11 away from the optical film 2 , that is, the backlight module adopts a bottom-emitting structure.

[0062] Considering that after the bottom plate 11 is partially hollowed out to form the first slot K1 , the change in the structural strength of the bottom plate 11 may affect the supporting effect of the plate structure 1 on the optical film 2 , resulting in the risk of the optical film 2 collapsing.

[0063] See also Figure 7 In order to avoid the above problems, in some optional embodiments, the backlight module further includes a supporting structure, the supporting mechanism 5 is disposed on a surface of the bottom plate 11 facing the optical film 2 , and the supporting mechanism 5 abuts against the optical film 2 .

[0064] In this embodiment, one end of the support structure is connected to the surface of the bottom plate 11 facing the optical film 2 to fix the support structure, and the other end is abutted against the optical film 2 to provide additional support for the optical film 2, thereby preventing the optical film 2 from collapsing in the direction of the bottom plate 11 and improving the stability of the optical film 2.

[0065] Optionally, the support structure can adopt a support block, a cylindrical support column or other structural forms, and the support structure and the base plate 11 can be a split structure, the support structure can be connected to the base plate 11 by means of an adhesive layer or the like, or the support structure and the base plate 11 can also be an integrated structure, that is, the support structure and the base plate 11 are molded together to improve the stability of the connection between the support structure and the base plate 11.

[0066] See also Fig.19 , Fig.19 It is a schematic structural diagram of a backlight module provided according to another embodiment of the present invention; in some optional embodiments, the first plate body B1 includes a first surface F1 forming a first groove K1, and a reflective layer 6 is provided on the first surface F1.

[0067] It can be understood that since the light-emitting element 32 is arranged in the first groove K1, part of the light emitted by the light-emitting element 32 will be irradiated to the first surface F1. By setting a reflective layer 6 on the first surface F1, this embodiment can reflect the light irradiated by the light-emitting element 32 to the reflective layer 6, and the reflected light can be directed to the optical film 2, thereby preventing the light emitted by the light-emitting element 32 on the first surface F1 from being absorbed by the first surface F1, thereby improving the utilization efficiency of the light emitted by the light-emitting element 32.

[0068] Optionally, the reflective layer 6 includes white ink. It is understandable that white ink has a weak ability to absorb light and a high reflectivity, so it can reflect the light source and adjust the light type. At the same time, it can prevent the heat generated by the light emitting element 32 from accumulating on the first surface F1, indirectly reducing the heat of the light emitting element 32 and increasing the service life of the light emitting element 32.

[0069] See also Figure 2 , Figure 6 or Figure 7 In some optional embodiments, along the direction of the optical film 2 pointing to the light emitting element 32 , the cross-sectional shape of the first slot K1 is at least partially tapered.

[0070] It should be noted that the cross-sectional shape of the first groove K1 is at least partially tapered, which means that the cross-sectional shape of the first groove K1 can be tapered, that is, the opening of the first groove K1 gradually decreases, or, in the light emitting direction of the light emitting element 32, the opening of the first groove K1 gradually increases to expand the light emitting range, or, along the direction of the optical film 2 pointing to the light emitting element 32, the cross-sectional shape of the first groove K1 can be partially tapered, and the other part can keep the size unchanged to form a horn-like shape.

[0071] In the prior art, due to the structural limitation of the backlight module, the light-emitting angle of the light-emitting element 32 cannot be controlled, and some large-angle light sources are directly emitted to other film end surfaces other than the optical film 2, and cannot all enter the optical film 2, resulting in a waste of light source and also causing bright lines on the edges of the display screen.

[0072] See also Fig. 9 , Fig. 9 Another embodiment of the present invention provides Figure 1 A local enlarged view of point A in the middle; in order to avoid the above-mentioned problems, optionally, the first plate body B1 includes a first surface F1 forming a first groove K1, and along the first direction X, the first surface F1 includes a first part F11, a second part F12 and a third part F13 connected to each other, and the first part F11 and the third part F13 have the same extension direction, and the second part F12 is inclined relative to the first part F11 in a direction away from the light-emitting element 32; the light-emitting element 32 is located in the portion of the first groove K1 formed by the first part F11.

[0073] It can be understood that, in the present embodiment, the second portion F12 is tilted relative to the first portion F11 in a direction away from the light emitting element 32, so that the light emitted by the light emitting element 32 is reflected in the second portion F12, thereby achieving the effect of expanding the light emission range, and the first portion F11 and the third portion F13 have the same extension direction, and the first portion F11 and the third portion F13 can be used to limit the light emission of the light emitting element 32, so as to achieve the limitation of the light emission angle of the light emitting element 32, so that the light emitted by the light emitting element 32 can be irradiated to the optical film 2 as much as possible, so as to improve the light emission efficiency and avoid the problem of bright lines on the edges of the display device.

[0074] Optionally, the extension directions of the first portion F11 and the third portion F13 may intersect with the thickness direction Y of the optical film 2 . For example, the extension directions of the first portion F11 and the third portion F13 may be perpendicular to the thickness direction Y of the optical film 2 .

[0075] In this embodiment, the second portion F12 is tilted relative to the first portion F11 away from the light emitting element 32, and the tilt angle of the second portion F12 relative to the first portion F11 away from the light emitting element 32 directly affects the final emission position of the light emitting element 32 on the first surface F1.

[0076] Through research and experiments by the inventors, it was found that the angle α between the extension direction of the second part F12 and the extension direction of the third part F13 can be greater than or equal to 120° and less than 180°, and the angle α between the extension direction of the second part F12 and the extension direction of the third part F13 should not be too small, otherwise the light output range of the light-emitting element 32 will be too small and cannot meet the demand, and the angle α between the extension direction of the second part F12 and the extension direction of the third part F13 should not be too large, otherwise the light output of the light-emitting element 32 may be irradiated to other film layers outside the optical film 2, causing light loss. Optionally, the angle α between the extension direction of the second part F12 and the extension direction of the third part F13 can be greater than or equal to any one of 120°, 130°, 140°, 150°, 160°, 170°, and 180°.

[0077] See also Figures 10 to 14 , Fig.10 Another embodiment of the present invention provides Figure 1 A partial enlarged view of the middle A; Fig.11 is a schematic diagram of the structure of a circuit board 31 provided according to an embodiment of the present invention; Fig.12 is a partial schematic diagram of a circuit board 31 provided according to an embodiment of the present invention; Fig.13 is a schematic structural diagram of a circuit board 31 provided according to another embodiment of the present invention; Fig.14 is a schematic structural diagram of a circuit board 31 provided according to another embodiment of the present invention;

[0078] In some optional embodiments, the circuit board 31 includes a printed circuit board or a flexible circuit board, that is, the circuit board 31 can be a FPC (Flexible Printed Circuit Board) or a PCB (Printed Circuit Board).

[0079] Compared with printed circuit boards, flexible circuit boards have better bendability and are more convenient to connect.

[0080] Optionally, the circuit board 31 may be made of FR-4 epoxy resin board to reduce the cost.

[0081] See also Figures 10 to 14 , Fig.10 Another embodiment of the present invention provides Figure 1 A partial enlarged view of the middle A; Fig.11 is a schematic diagram of the structure of a circuit board provided according to an embodiment of the present invention; Fig.12 is a partial schematic diagram of a circuit board provided according to an embodiment of the present invention; Fig.13 is a schematic diagram of the structure of a circuit board provided according to another embodiment of the present invention; Fig.14 is a schematic diagram of the structure of a circuit board provided according to yet another embodiment of the present invention.

[0082] Optionally, the backlight module also includes a driving board Q, which is arranged on the side of the base plate 11 away from the optical film layer; the circuit board 31 includes a printed circuit board, which is electrically connected to the driving board Q in sequence through a first connector D1, a flexible circuit board L1, a second connector D2, and the first connector D1 is arranged on the printed circuit board, and the second connector D2 is arranged on the driving board Q.

[0083] It can be understood that due to the poor bendability of the printed circuit board, it cannot be directly electrically connected to the driving board Q by bending itself. Therefore, it is necessary to set a first connector D1, a flexible circuit board L1, and a second connector D2 to electrically connect the printed circuit board and the driving board Q. Specifically, the printed circuit board is electrically connected to the flexible circuit board L1 through the first connector D1, and the flexible circuit board L1 is electrically connected to the driving board Q through the second connector D2.

[0084] The driving board Q may include a driving circuit to drive the light emitting element.

[0085] See also Figure 13 to Figure 14 Optionally, the circuit board 31 includes a first edge Y1, the first connector D1 is disposed in the middle of the first edge Y1, the driving board Q includes a second edge Y2, and the second connector D2 is disposed in the middle of the second edge Y2.

[0086] The shape and cutting layout rate of the circuit board in the prior art are limited, and generally, L-shaped or straight-line circuit boards are considered, and the output terminals are generally arranged on both sides of the circuit board 31. In this embodiment, the circuit board 31 adopts a printed circuit board, which is connected to the driver board Q in conjunction with the first connector D1, the flexible circuit board L1, and the second connector. The positions of the first connector D1 and the second connector D2, that is, the connection positions of the flexible circuit board L1, the printed circuit board, and the driver board Q can be flexibly set according to actual needs, so as to flexibly adapt to the routing design of the circuit board 31.

[0087] It should be noted that the middle of the first edge Y1 or the middle of the second edge Y2 in this embodiment does not specifically refer to the center position of the first edge Y1 or the center position of the second edge Y2, but can also be the area close to the center of the first edge Y1 or the area close to the center of the second edge Y2.

[0088] Considering that the circuit board 31 in this embodiment is arranged outside the first board body B1, the space available for its arrangement is larger, so the backlight driving circuit and components on some driving board Q can be transferred to the back of the circuit board 31 to reduce the mounting space requirement of the driving board Q.

[0089] See also Fig.10 In some optional embodiments, a first adhesive layer J is provided between the circuit board 31 and the first board body B1, that is, the circuit board 31 and the first board body B1 are connected by utilizing the viscosity of the first adhesive layer J to fix the circuit board 31 on the first board body B1.

[0090] Optionally, the first adhesive layer J includes a thermally conductive adhesive, which can perform heat conduction and heat dissipation functions while achieving fixation.

[0091] Alternatively, the circuit board 31 and the first plate body B1 may be connected in other ways, for example, the circuit board 31 and the first plate body B1 are connected by bolts, which improves the stability of the fixation, reduces the risk of warping of the circuit board 31, and improves the ESD resistance and reworkability of the circuit board 31. It is only necessary to unscrew the bolts from the outside without affecting the fitting of the display panel P. It should be noted that any fixing method that can fix the circuit board 31 to the first plate body B1 and does not affect the thickness of the backlight module or the frame width can be applied to the present application without special limitation.

[0092] See also Figures 2 to 5 , Figures 9 and 10 In some optional embodiments, the first plate body B1 further includes a second groove K2 connected to the first groove K1, and the circuit board 31 is at least partially located in the second groove K2, that is, the circuit board 31 may also occupy the space of the original first plate body B1 to avoid increasing the frame width, by hollowing out part of the first plate body B1 to form the second groove K2 to accommodate the circuit board 31.

[0093] Optionally, in a direction perpendicular to the thickness of the first plate body B1 , the depth of the second slot K2 is greater than or equal to the thickness of the circuit board 31 , so that the entire circuit board 31 can be disposed in the second slot K2 , thereby improving space utilization.

[0094] Optionally, the side plate 12 includes the first plate body B1 having the second slot K2.

[0095] See also Fig.15 , Fig.15It is a structural schematic diagram of a light-emitting component 3 provided according to another embodiment of the present invention; in some optional embodiments, the light-emitting component 3 also includes a control element 33, and the control element 33 includes a first control element 331 arranged on the same side of the circuit board 31 as the light-emitting element 32.

[0096] In this embodiment, the first control element 331 can specifically adopt elements such as IC chips to realize the control of the light-emitting element 32. In this embodiment, the light-emitting element 32 and the first control element 331 can improve the space utilization rate on this side of the circuit board 31. Since the first control element 331 is not set on the other side surface of the circuit board 31, the other side surface of the circuit board 31 has space for setting other film layers such as the heat dissipation layer 4, thereby improving the heat dissipation efficiency of the circuit board 31.

[0097] See also Fig.16 , Fig.16 It is a structural schematic diagram of a light-emitting component 3 provided according to another embodiment of the present invention; in another embodiment, the control element 33 includes a second control element 332 which is arranged on a different side of the circuit board 31 from the light-emitting element 32. It can be understood that when the circuit board 31 is arranged in the second groove K2, the second control element 332 arranged on the surface of the circuit board 31 away from the light-emitting element can also be correspondingly arranged in the second groove K2 to further reduce the frame width.

[0098] It should be noted that, the first control element 331 and the second control element 332 may be provided with only one of them, or the first control element 331 and the second control element 332 may be provided at the same time. Fig.17 As shown, Fig.17 This is a schematic diagram of the structure of a light emitting component 3 provided in yet another embodiment of the present invention. The specific configuration can be selected according to actual needs without any special limitation.

[0099] See also Fig.15 and Fig.16 In some optional embodiments, the light emitting component 3 includes at least two circuit boards 31 , and at least one circuit board 31 is provided with a first control element 331 , and at least one circuit board 31 is provided with a second control element 332 .

[0100] It should be noted that different circuit boards 31 can be used to drive light-emitting elements 32 located at different positions and different areas. The specific number of circuit boards 31 needs to be selected according to the specific number of light-emitting elements 32 to be set, and there is no special limitation. And in different circuit boards 31, control elements 33 with different setting positions can be used to achieve different effects. For example, the light-emitting component 3 includes two circuit boards 31 arranged along the second direction Z, which respectively correspond to the light-emitting elements 32 arranged along the second direction Z and located at different positions. One circuit board 31 can be provided with a first control element 331, that is, the first control element 331 and the circuit board 31 are located on the same side of the circuit board 31, and the other circuit board 31 can be provided with a second control element 332, that is, the second control element 332 and the circuit board 31 are located on different sides of the circuit board 31.

[0101] It should be noted that since the circuit board 31 in this embodiment is arranged on the side of the light-emitting element 32 away from the first board body B1, that is, the circuit board 31 is exposed, the circuit board 31 can directly contact the air outside the board structure 1. Compared with the method of arranging the circuit board 31 in the board structure 1 in the prior art, this embodiment reduces the heat transfer path, reduces the total thermal impedance of the heat transfer model, and improves the heat dissipation efficiency.

[0102] See also Fig.18 , Fig.18 It is a structural schematic diagram of a backlight module provided according to another embodiment of the present invention; considering that in actual circumstances, there is no forced convection of external air (generally no active heat dissipation), heat will still accumulate on the circuit board 31. In order to further improve the heat transfer capability, in some optional embodiments, the backlight module also includes a heat dissipation layer 4 arranged on the side of the circuit board 31 away from the light-emitting element 32.

[0103] It is understandable that the thermal conductivity of the material used for the heat dissipation layer 4 is higher than that of the circuit board 31, so that the heat dissipation layer 4 can dissipate the heat of the circuit board 31 into the air faster, avoiding heat accumulation at the circuit board 31, and ensuring the service life and stability of the circuit board 31.

[0104] Optionally, the heat dissipation layer 4 may be in the form of a heat dissipation tape, which is convenient for bonding to the surface of the circuit board 31 on the side away from the light emitting element 32 . The heat dissipation tape may be made of adhesive materials such as acrylic pressure-sensitive adhesive.

[0105] See also Fig.18 In some optional embodiments, along the thickness direction Y of the optical film 2 , the surface of the plate structure 1 on the side away from the optical film 2 includes a central area ZA, and the heat dissipation layer 4 extends to the central area ZA.

[0106] It should be noted that, in the present embodiment, when the side panel 12 includes the first plate body B1, the heat dissipation layer 4 can extend to the bottom plate 11 along the side of the side panel 12 away from the optical film 2. Along the thickness direction Y of the optical film 2, the surface of the plate structure 1 on the side away from the optical film 2, that is, the lower surface of the bottom plate 11, the heat dissipation layer 4 extends to the central area ZA of the lower surface of the bottom plate 11, and transfers the heat to the external central position of the backlight module, thereby increasing the heat dissipation area and thus improving the heat dissipation efficiency.

[0107] Optionally, the circuit board 31 includes an aluminum substrate. The circuit board 31 is prepared by using an aluminum material with better thermal conductivity to further improve the heat dissipation efficiency of the circuit board 31 and avoid heat accumulation.

[0108] See also Fig. 20 or Fig.21 An embodiment of the present invention further provides a display device, comprising: a display panel P; a backlight module, arranged on the backlight side of the display panel P, and the backlight module is the backlight module in any of the above embodiments.

[0109] Optionally, the display device further includes a shading layer 8 located on the side of the optical film 2 away from the bottom plate 11, and the shading layer 8 is used to shield the edge of the optical film 2 to avoid the problem of edge bright lines. The shading layer 8 can be connected to the side plate 12. Optionally, the width of the shading layer 8 along the first direction X can be 3mm to 4mm, for example, 3mm, and the thickness of the shading layer 8 is 0.1 to 0.3mm, for example, the thickness of the shading layer 8 can be 0.2mm, and the material of the shading layer 8 can be PET (Polyethyleneterephthalate) and other materials.

[0110] Optionally, the display panel P is located on the side of the light shielding layer 8 facing away from the bottom plate 11 .

[0111] Optionally, a cover plate 7 is provided on the opening cover of the accommodating space R of the frame structure, and the cover plate 7 is supported and fixed by the side plates 12 .

[0112] The display device provided by the embodiment of the present invention has the technical effect of the technical solution of the backlight module in any of the above embodiments, and the explanation of the structures and terms that are the same as or corresponding to the above embodiments will not be repeated here.

[0113] The backlight module in this embodiment is used to provide light for the display panel P, so that the display panel P can achieve light display. The display panel P may be an LCD (Liquid Crystal Display) panel.

[0114] The display device provided in the embodiment of the present invention can be applied to a mobile phone, or any electronic product with a display function, including but not limited to the following categories: televisions, laptops, desktop displays, tablet computers, digital cameras, smart bracelets, smart glasses, car displays, medical equipment, industrial control equipment, touch interactive terminals, etc. The embodiment of the present invention does not make any special limitations on this.

[0115] The above is only a specific implementation of the present invention. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working process of the system, module and unit described above can refer to the location process in the aforementioned method embodiment, and will not be repeated here. It should be understood that the protection scope of the present invention is not limited to this. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be covered within the protection scope of the present invention.

[0116] It should also be noted that the exemplary embodiments mentioned in the present invention describe some methods or systems based on a series of steps or devices. However, the present invention is not limited to the order of the above steps, that is, the steps can be performed in the order mentioned in the embodiments, or in a different order from the embodiments, or several steps can be performed simultaneously.

Claims

1. A backlight module, characterized in that: include: A plate structure, the plate structure comprising a bottom plate and a side plate connected to the bottom plate, the bottom plate and the side plate enclose a receiving space, the bottom plate or the side plate comprises a first plate body, and the first plate body is provided with a first slot; An optical film is arranged in the accommodation space; A light-emitting component, comprising an electrically connected circuit board and a plurality of light-emitting elements, wherein the light-emitting element is at least partially disposed in the first slot, and the light-emitting surface of the light-emitting element faces the optical film, and the circuit board is located on the side of the first plate body away from the optical film.

2. The backlight module according to claim 1, characterized in that: The side panel includes the first panel body; The side plate is arranged on one side of the optical film along a first direction, and the first direction intersects with a thickness direction of the optical film.

3. The backlight module according to claim 2, characterized in that: The first slots and the light emitting elements are arranged in sequence along a second direction, and the second direction intersects with the first direction and the thickness direction of the optical film.

4. The backlight module according to claim 2, characterized in that: Along the first direction, the optical film at least partially abuts against the first plate.

5. The backlight module according to claim 1, characterized in that: The bottom plate includes the first plate body; Along the thickness direction of the optical film, the bottom plate is arranged on one side of the optical film.

6. The backlight module according to claim 5, characterized in that: The backlight module further comprises a supporting structure, wherein the supporting structure is arranged on a surface of the bottom plate facing the optical film, and the supporting structure abuts against the optical film.

7. The backlight module according to claim 2, characterized in that: Along the direction from the optical film to the light emitting element, the cross-sectional shape of the first slot is at least partially tapered.

8. The backlight module according to claim 7, characterized in that: The first plate body includes a first surface forming the first groove, and along the first direction, the first surface includes a first portion, a second portion, and a third portion connected to each other, the first portion and the third portion extend in the same direction, and the second portion is inclined relative to the first portion in a direction away from the light emitting element; The light emitting element is located in a portion of the first groove formed by the first portion.

9. The backlight module according to claim 8, characterized in that: An angle between an extension direction of the second portion and an extension direction of the third portion is greater than or equal to 120° and less than 180°.

10. The backlight module according to claim 1, characterized in that: The circuit board includes a printed circuit board or a flexible circuit board.

11. The backlight module according to claim 10, characterized in that: The backlight module further comprises a driving board, and the driving board is arranged on a side of the bottom plate away from the optical film layer; The circuit board includes a printed circuit board, which is electrically connected to the driving board through a first connector, a first flexible circuit board, a second connector, and the driving board in sequence. The first connector is arranged on the printed circuit board, and the second connector is arranged on the driving board.

12. The backlight module according to claim 11, characterized in that: The circuit board includes a first edge, the first connector is arranged in the middle of the first edge, the driving board includes a second edge, and the second connector is arranged in the middle of the second edge.

13. The backlight module according to claim 1, characterized in that: The light emitting assembly further comprises a control element, wherein the control element comprises a first control element disposed on the same side of the circuit board as the light emitting element; And / or, the control element includes a second control element disposed on a different side of the circuit board from the light emitting element.

14. The backlight module according to claim 13, characterized in that: The light-emitting component includes at least two circuit boards, and at least one of the circuit boards is provided with the first control element, and at least one of the circuit boards is provided with the second control element.

15. The backlight module according to claim 1, characterized in that: The backlight module further comprises a heat dissipation layer arranged on a side of the circuit board away from the light emitting element.

16. The backlight module according to claim 15, characterized in that: Along the thickness direction of the optical film, the surface of the plate structure on one side away from the optical film includes a central area, and the heat dissipation layer extends to the central area.

17. The backlight module according to claim 1 or 15, characterized in that: The circuit board includes an aluminum substrate.

18. The backlight module according to claim 1, characterized in that: The first plate body further includes a second slot communicating with the first slot, and the circuit board is at least partially located in the second slot.

19. The backlight module according to claim 1, characterized in that: The first plate body includes a first surface on which the first groove is formed, and a reflective layer is disposed on the first surface.

20. The backlight module according to claim 19, characterized in that: The reflective layer includes white ink.

21. The backlight module according to claim 1, characterized in that: The optical film comprises a light guide plate, and the light emitting element is located between the light guide plate and the circuit board.

22. The backlight module according to claim 1, characterized in that: A first adhesive layer is provided between the circuit board and the first board body; or, The circuit board and the first plate body are connected by bolts.

23. A display device, characterized in that: include: Display panel; A backlight module is arranged on the backlight side of the display panel, and the backlight module is the backlight module according to any one of claims 1 to 22.

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