Display device

Abstract

The invention provides a display device. The display device comprises a first substrate, the first substrate is provided with a display area and a non-display area, the non-display area is located on the periphery of the display area and close to the edge of the first substrate, the non-display area is provided with a chip-on-film binding area, and a gap is formed between the chip-on-film binding area and the edge of the first substrate; the second substrate and the first substrate are oppositely arranged, the edge of the first substrate exceeds the edge of the second substrate, the chip-on-film comprises an attaching section and a bending section which are connected, the attaching section is attached to a binding area of the chip-on-film, and the bending section is bent in the direction away from the first substrate. According to the display device, the gap is formed between the chip on film binding area and the edge of the first substrate, so that the bent chip on film can be well shielded, the problems of outleakage and light leakage at the bent position of the chip on film are solved, and the display performance of the display device is further improved.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display device. Background Art

[0002] Over the past few decades, the development of the television industry has undergone earth-shaking changes, just like mobile phones. From bulky black-and-white TVs to color TVs, and then to today's large-screen smart TVs, the replacement of innovative technologies has never stopped. In addition, with the continuous development and update of OLED products VA liquid crystal (Vertical Alignment liquid crystal) with mini LED backlight products, the market share of mid-to-high-end TVs will also shrink. However, OLED and VA display products always have unavoidable shortcomings in the field of large-size (TV) and the market prices of the two are also prohibitive for price-sensitive consumers. With the continuous development of display device production technology, borderless display devices have greatly enhanced the visual effect of the screen due to their higher screen-to-body ratio. Four-sided borderless display devices (such as TVs, etc.) bring users a stronger sense of immersion, becoming a new design trend.

[0003] However, current display devices still need to be improved. Summary of the invention

[0004] The embodiments of the present disclosure provide a display device to solve or alleviate one or more technical problems in the related art.

[0005] As a first aspect of an embodiment of the present disclosure, an embodiment of the present disclosure provides a display device, which includes: a first substrate, the first substrate having a display area and a non-display area, the non-display area being located at the periphery of the display area and close to the edge of the first substrate, the non-display area having a chip-on-chip film binding area, and a gap being provided between the chip-on-chip film binding area and the edge of the first substrate; a second substrate, the second substrate and the first substrate being arranged opposite to each other, the edge of the first substrate exceeding the edge of the second substrate; a chip-on-chip film, the chip-on-chip film including a connected bonding section and a bending section, the bonding section being bonded to the chip-on-chip film binding area, and the bending section being bent in a direction away from the first substrate.

[0006] According to an example of the present disclosure, a binding terminal is provided in the chip-on-chip film binding area, and the binding terminal is located in the chip-on-chip film binding area closest to the gap; the second substrate has a first edge close to the step area, and a reserved band is provided between the binding terminal and the first edge; the ratio among the width of the gap, the width of the binding terminal, and the width of the reserved band is (1-2):(0.7-0.9):(0.4-0.6).

[0007] According to an example of the present disclosure, the width of the gap is 1000-2000 microns.

[0008] According to an example of the present disclosure, the width of the binding terminal is 700-900 microns, and the width of the reserved band is 400-600 microns.

[0009] According to an example of the present disclosure, the width of the step area is 2.1-3.5 mm.

[0010] According to an example of the present disclosure, the chip-on-chip film has a first surface and a second surface relative to each other, the first surface of the chip-on-chip film is bonded to a side of the first substrate facing the second substrate, and the first surface is bent reversely from the bending section to a surface of the second substrate away from the first substrate, and the chip-on-chip film includes a driving chip, and the driving chip is arranged on the side where the first surface is bent to the second substrate.

[0011] According to an example of the present disclosure, the color of the first surface of the COF includes at least one of yellow, green, and black.

[0012] According to an example of the present disclosure, the first surface and the first substrate are fixed with glue at the corners of the fitting section and the bending section.

[0013] According to an example of the present disclosure, the glue includes black UV glue.

[0014] According to an example of the present disclosure, the display device further includes: a printed circuit board, which is arranged at a side where the chip-on-chip film is reversely bent to the second substrate and is electrically connected to the chip-on-chip film.

[0015] According to an example of the present disclosure, the display device further includes: light-shielding ink, wherein the light-shielding ink covers the COF binding area.

[0016] According to an example of the present disclosure, the first substrate of the display device is a quadrilateral, the light-shielding ink covers four sides of the first substrate, and the area of ​​the first substrate covered by the light-shielding ink forms a frame of the display device.

[0017] According to an example of the present disclosure, the display device further includes: a protective shell, the protective shell having an outer frame and a bottom cover, a accommodating space is formed between the outer frame and the bottom cover, the first substrate and the second substrate are accommodated in the accommodating space, the outer frame and the side of the first substrate are fixed, and on the four edges of the first substrate, the orthographic projection of the outer frame on the plane where the first substrate is located does not exceed 1 mm.

[0018] According to an example of the present disclosure, the display device further includes: foam glue, the foam glue is located in the receiving space and one side is connected to the bottom cover plate, the foam glue is used to fix the first substrate and the second substrate BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments according to the present disclosure and should not be regarded as limiting the scope of the present disclosure.

[0020] Figure 1 is a schematic structural diagram of a display device according to an embodiment of the present disclosure;

[0021] Figure 2 is a schematic structural diagram of a first substrate according to an embodiment of the present disclosure;

[0022] Figure 3 It is a structural schematic diagram of a display device in the prior art;

[0023] Figure 4 is a partial structural schematic diagram of a display device according to an embodiment of the present disclosure;

[0024] Figure 5 is a schematic structural diagram of a display device according to another embodiment of the present disclosure;

[0025] Figure 6 is a schematic structural diagram of a display device according to another embodiment of the present disclosure;

[0026] Figure 7 It is a structural schematic diagram of a display device in the related art;

[0027] Figure 8 is a schematic structural diagram of a display device according to another embodiment of the present disclosure;

[0028] Fig. 9 FIG. 4 is a schematic structural diagram of a display device according to another embodiment of the present disclosure.

[0029] Description of reference numerals:

[0030] 1000: display device; 100: first substrate; 110: display area; 120: non-display area; 130: COF binding area; 140: step area; 10: binding terminal; 200: second substrate; 210: first edge; 300: COF; 310: pasting section; 320: first bending section; 330: second bending section; 20: first surface; 30: second surface; 40: driver chip; 50: glue; 400: printed circuit board; 500: light-shielding ink; 600: protective shell; 610: outer frame; 620: bottom cover; 630: accommodation space; 700: foam glue. DETAILED DESCRIPTION

[0031] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present disclosure, and different embodiments may be combined arbitrarily without conflict. Therefore, the drawings and descriptions are considered to be illustrative in nature and not restrictive.

[0032] In a first aspect of the present disclosure, the present disclosure provides a display device, referring to Figure 1 The display device 1000 includes: a first substrate 100, a second substrate 200 and a COF 300, wherein the reference Figure 2 The first substrate 100 has a display area 110 and a non-display area 120. The non-display area 120 is located outside the display area 110 and close to the edge of the first substrate 100. The non-display area 120 has a COF binding area 130. There is a gap between the COF binding area 130 and the edge of the first substrate 100. That is, Figure 1 and Figure 2 Specifically, the second substrate 200 and the first substrate 100 are arranged opposite to each other, the edge of the first substrate 100 exceeds the edge of the second substrate 200, and the area where the edge of the first substrate 100 exceeds the edge of the second substrate 200 is a step area (refer to Figure 1 The chip-on-chip film binding area 130 is located in the step area 140, and the chip-on-chip film includes a connected bonding section 310 and a bending section (a first bending section 320 and a second bending section 330 as shown in the figure). The bonding section 310 is bonded to the chip-on-chip film binding area, and the bending section is bent in a direction away from the first substrate. Therefore, by setting a gap between the chip-on-chip film binding area 130 and the edge of the first substrate 100, when the chip-on-chip film 300 is bound to the display device 1000, the gap can simply and well shield the bent chip-on-chip film 300 (especially the first bending section 320 of the chip-on-chip film 300), thereby improving the problem of leakage and light leakage at the bending part of the chip-on-chip film 300, and further improving the display performance of the display device 1000.

[0033] In some embodiments of the present application, the first substrate 100 may be an array substrate (TFT substrate), and the second substrate 200 may be a color film substrate (CF substrate).

[0034] In some examples of the present application, the chip-on-cover film 300 includes a bonding section 310, a first bending section 320, and a second bending section 330 connected in sequence, the bonding section 310 is bonded to the chip-on-cover film binding area 130, the first bending section 320 is bent in a direction away from the first substrate 100, and the second bending section 330 is bent in the opposite direction to the side of the second substrate 200 away from the first substrate 100.

[0035] For ease of understanding, the following first briefly describes the principle by which the display device can achieve the above beneficial effects:

[0036] In order to realize the display function of the display device, it is necessary to bind the chip on the chip-on-chip film and electrically connect it to the display panel, so as to realize the control of the driving circuit and pixel circuit of the actual panel. In some examples, the above-mentioned chip-on-chip film and control chip can be bound by means of "COF" (chip on film). Compared with binding the chip to a glass substrate (chip on glass, COG), the COF binding method is more conducive to reducing the border of the display device and meeting the demand for a high screen-to-body ratio. The typical structure of COF is to attach a flexible chip-on-chip film to the steps at the edges of the two substrates of the display device (such as a color film (CF) substrate and an array (TFT or array) substrate), and the chip-on-chip film is bent along the edge of the step toward the side of the display panel away from the light-emitting side, and fixed. In this structure, reference Figure 3 When the array substrate faces the light-emitting side (i.e., the TFT substrate faces upward), the outer side surface (SR surface) of the downwardly bent COF is close to the edge of the step. Therefore, after the whole machine is assembled, the outer side surface at the edge is easily observed by the user. Therefore, most manufacturers choose to use a COF with a black SR surface. In addition, in order to cover the area bound by the COF side, existing TV products usually have a wider frame below the display screen, making it difficult to achieve a screen design with no frame on all four sides.

[0037] The display device proposed in this application adopts a strategy of expanding the edge step area of ​​the two substrates (CF substrate and TFT substrate) to expand the width of the non-display area at the edge of the array substrate. Figure 1 , the expanded part forms a step area with a larger width (refer to Figure 1 The advantage of this design is that the gap between the chip-on-film binding area 130 and the edge of the array substrate (such as the step area 140 shown in FIG. 1 ) can be utilized. Figure 1d) Hiding the colored SR surface of the chip-on-chip film: On the light-emitting side of the display substrate, i.e., the side not bound to the chip-on-chip film 300, the side of the chip-on-chip film 300 can be shielded by means including but not limited to coating with frame glue, so there is no need to use a frame to shield the colored SR surface when assembling the whole machine. This can realize TV products with narrow bezels on four sides, and on the other hand, it also expands the types of chip-on-chip films that can be used in display devices: manufacturers can choose chip-on-chip films with colors other than black, which is conducive to reducing costs.

[0038] As mentioned above, reference Figure 3 In the related art, when the COF film 300 is attached to the first substrate 100, Figure 3 Observing from the direction indicated by the arrow, it can be seen that the flip chip film 300 is leaking out, and light is easily leaked there, affecting the display effect of the display device. Figure 4 as well as Figure 5 Through in-depth research, the inventor cleverly discovered that by simply extending the edge of the first substrate 100 outward by a certain distance, that is, setting a gap between the flip chip film binding area 130 and the edge of the first substrate 100, the bent flip chip film 300 can be simply and better shielded, thereby improving the leakage and light leakage problems at the bending part of the flip chip film 300, and further improving the display performance of the display device.

[0039] In some embodiments of the present application, reference Figure 4 The COF binding area 130 has a binding terminal 10. Specifically, the COF binding area 130 may have a plurality of binding terminals 10, and the binding terminal 10 is located closest to the gap in the COF binding area 130. Specifically, the binding terminal 10 can be used to bind with the COF 300 ( Figure 4 ), and is electrically connected to the printed circuit board through the chip-on-film, thereby realizing power supply and driving of the display panel 1000 (such as the array substrate).

[0040] In some embodiments of the present application, reference Figure 4 The second substrate 200 has a first edge 210 close to the step area 140 , and a reserved zone may be provided between the binding terminal 10 and the first edge 210 .

[0041] In some embodiments of the present application, reference Figure 4 , the width of the gap (i.e. Figure 4 The width d shown in FIG. 1 ), the width of the binding terminal 10 (ie Figure 4 The width h shown in the figure), the width of the reserved band (i.e. Figure 4The ratio of the width m) shown in the figure can be (1-2): (0.7-0.9): (0.4-0.6), for example, it can be 1:0.85:0.45, it can be 1.5:0.8:0.5, it can be 1.75:0.85:0.45, etc. Therefore, when the ratio of the width of the gap, the width of the binding terminal 10, and the width of the reserved belt is within the above range, the gap can better shield the bent flip chip film ( Figure 4 The problem of light leakage and leakage at the bending part of the flip chip film is improved without significantly increasing the area of ​​the non-display region, thereby further improving the display performance of the display device 1000.

[0042] In some embodiments of the present application, reference Figure 1 The width of the gap d can be 1000-2000 microns, for example, 1200 microns, 1400 microns, 1500 microns, 1600 microns, 1750 microns, 1800 microns, 1900 microns, etc. Therefore, when the width of the gap d is within the above range, it can better shield the bent flip chip film ( Figure 1 The display performance of the display panel 1000 is further improved by improving the leakage and light leakage problems at the bending part of the flip chip film without significantly increasing the area of ​​the non-display area.

[0043] Specifically, the width of the binding terminal 10 (ie Figure 4 The width h) shown in the figure can be 700-900 microns, for example, 710 microns, 720 microns, 730 microns, 750 microns, 780 microns, 800 microns, 820 microns, 850 microns, 860 microns, 880 microns, 900 microns, etc. Specifically, the width of the binding terminal 10 can be selected as a conventional width, so that it can be more widely adapted to the existing flip chip film without additionally improving the process of forming the terminal, thereby reducing the production cost.

[0044] In some embodiments of the present application, reference Figure 4 There may be a reserved zone (ie, a zone) with a width of 400-600 microns between the binding terminal 10 and the first edge 210 of the second substrate 200. Figure 4The width m shown in the figure, specifically, the width of the reserved band can be 420 microns, 450 microns, 480 microns, 500 microns, 520 microns, 550 microns, 580 microns, 600 microns, etc. Therefore, the display device 1000 proposed in the present disclosure can simply extend the edge of the first substrate 100 by a certain distance without changing the width of the binding terminal 10 in the existing production process and the width of the reserved band between the binding terminal 10 and the first edge 210, that is, a gap is set between the flip chip film binding area 130 and the edge of the first substrate 100, so that the bent flip chip film can be simply and better shielded, thereby improving the leakage and light leakage problems at the bending of the flip chip film, and further improving the display performance of the display device 1000. Specifically, in the production process of the first substrate 100 (for example, an array substrate), when the entire large array substrate motherboard is cut into the first substrate 100 required for the product, the edge of the first substrate 100 can be extended a certain distance before cutting, so that a gap can be easily formed between the flip chip film binding area 130 and the edge of the first substrate 100.

[0045] Thus, the width of the "step" distance between the two substrates is widened by the gap d. Another advantage of this design is that the current substrate preparation process does not need to be changed, and the step can be widened by expanding the edge with the terminal when the large glass mother plate is cut to form a small substrate (i.e., the first substrate 100). In other words, the step can be widened by changing the cutting position in the cutting process. This can minimize changes to the process for producing the display device, which is beneficial to further reduce production costs. In some embodiments of the present application, reference is made to Figure 5 The COF 300 may have a first surface 20 and a second surface 30 opposite to each other, wherein the first surface 20 of the COF 300 may be attached to a side of the first substrate 100 facing the second substrate 200, and the first surface 20 is reversely bent from the bending section 320 to the surface of the second substrate 200 away from the first substrate 100. Specifically, the COF 300 may include a driver chip 40, and the driver chip 40 may be disposed on the side where the first surface 20 is bent to the second substrate 200. Specifically, the driver chip 40 may be located in the second bending section 330.

[0046] In some embodiments of the present application, the color of the first surface 20 of the chip-on-film 300 may include at least one of yellow, green, and black. Specifically, as mentioned above, in the related art, when the chip-on-film 300 is attached to the first substrate 100, the bend of the chip-on-film 300 leaks and there is a risk of light leakage. When the color of the first surface 20 of the chip-on-film 300 is black, the visual light leakage can be reduced to a certain extent. According to the display device of the embodiment of the present application, by setting a gap between the chip-on-film binding area 130 and the edge of the first substrate 100, the bent chip-on-film 300 can be simply and well shielded, and the problem of leakage and light leakage at the bend of the chip-on-film 300 can be improved. Therefore, the color of the first surface 20 of the chip-on-film 300 is not particularly limited, and can be black, yellow, green, etc.

[0047] In some embodiments of the present application, reference Figure 6 Since the corners of the laminating section 310 and the second bending section 320 are still at a certain distance from the edge of the first substrate 100, glue 50 can be provided between the first surface 20 and the first substrate 100 at the corners of the laminating section 310 and the bending section 320 for bonding and fixing. Therefore, after the glue 50 is bonded and fixed, the bonding between the COF 300 and the first substrate 100 is tighter and more firmly, and the glue 50 can protect the COF 300 from external forces during the bending process, avoiding the image quality problems caused by the damage of the COF 300, and further improving the display performance of the display device 1000.

[0048] In some embodiments of the present application, the material of the glue 50 is not particularly limited, as long as it can be adhered and light-shielded. Specifically, the glue can include black UV glue. Thus, the first substrate 100 and the chip-on-chip film 300 can be easily glued and fixed at the corners of the bonding section 310 and the second bending section 320, avoiding the image quality problem caused by the damage of the chip-on-chip film 300, and further improving the display performance of the display device 1000.

[0049] Specifically, refer to Figure 7 In the related art, when the second substrate 200 is facing the user side, the COF 300 is bent along the side of the first substrate 100, and the first substrate 100 has a certain supporting effect on the COF 300. Therefore, during the bending process, the COF 300 is not easily deformed or fallen off due to the bending and tearing effect, and the driving chip 40 is also arranged on the side of the COF facing the first substrate. In some embodiments of the present application, reference Figure 6In order to achieve a narrow frame appearance, the first substrate 100 is arranged on the side facing the user, and the second bending section 320 of the COF 300 is bent toward the side away from the first substrate 100. Therefore, during the bending process, a part of the second bending section 320 of the COF 300 is suspended, which is easy to be deformed or fall off due to the tearing force during bending. In the present application, the edge of the first substrate 100 is extended outward by a certain distance, that is, between the COF binding area 130 and the edge of the first substrate 100. A gap is set, which can not only block the bent chip-on-chip film 300 and improve the leakage and light leakage problems at the bending part of the chip-on-chip film 300, but also use glue 50 to further stick and fix the corners of the bonding section 310 and the second bending section 320 of the chip-on-chip film 300 at the gap. Therefore, the glue 50 can protect the chip-on-chip film 300 from external forces during the bending process, avoid the image quality problems caused by the damage of the chip-on-chip film 300, and further improve the display performance of the display device 1000.

[0050] In some embodiments of the present application, reference Figure 6 The first substrate 100 and the second substrate 200 form a step region at the bonding chip-on-film 300, and the width of the step region (ie Figure 6 The step area width n) shown in the figure can be 2.1-3.5mm, for example, 2.3mm, 2.5mm, 2.7mm, 2.9mm, 3mm, 3.2mm, 3.4mm, etc. Specifically, the step area can include the aforementioned COF binding area 130, the reserved band between the binding terminal and the first edge, and the gap area between the COF binding area 130 and the edge of the first substrate 100. The COF 300 can be attached to the first substrate 100 in the step area and bent to the side of the second substrate 200 away from the first substrate 100.

[0051] In some embodiments of the present application, the display device may further include light-shielding ink, specifically, refer to Figure 8 , the light-shielding ink 500 can cover the COF binding area. It should be noted that in some embodiments of the present application, the first substrate 100 is usually transparent, so the light-shielding ink can easily shield the binding terminals, leads and other structures in the COF binding area, further improving the display effect of the display device 1000. In addition, in the present application, the first substrate is set on the side facing the user, and the binding areas such as the binding terminals and leads are set inside the first substrate. Therefore, the light-shielding ink can easily shield the binding terminals, leads and other structures in the COF binding area, without setting a special outer frame (such as a metal outer frame, etc.) to shield the binding area in the display device, further improving the narrow frame effect and aesthetic appearance of the display device.

[0052] In some embodiments of the present application, reference Figure 8 , the first substrate 100 may be a quadrilateral, and the light-shielding ink may also cover the four sides of the first substrate 100, and the area of ​​the first substrate 100 covered by the light-shielding ink 500 forms the frame of the display device 1000. Thus, the four sides of the first substrate 100 covered by the light-shielding ink can serve as the frame of the display device 1000, and the metal fixing frame structure installed on the outside of the first substrate 100 can be omitted, further improving the appearance performance and display effect of the display device 1000.

[0053] In some embodiments of the present application, reference Fig. 9 The display device 2000 may further include: a printed circuit board 400, which may be disposed at the side where the COF 300 is reversely bent to the second substrate 200 and electrically connected to the COF 300. Thus, the first substrate 100 may be electrically connected to the printed circuit board 400 of the display device 2000 through the COF 300, and then the first substrate 100 performs display under the drive of the printed circuit board 400.

[0054] In some embodiments of the present application, reference Fig. 9 The display device 1000 may further include: a protective shell 600, the protective shell 600 has an outer frame 610 and a bottom cover plate 620, a receiving space 630 is formed between the outer frame 610 and the bottom cover plate 620, the first substrate 100 and the second substrate 200 are accommodated in the receiving space 630, the outer frame 610 is fixed to the side of the first substrate 100, and on the four edges of the first substrate 100, the orthographic projection of the outer frame 610 on the plane where the first substrate 100 is located does not exceed 1 mm. Therefore, as described above, in the embodiment of the present application, the first substrate is arranged on the side facing the user, and the binding terminals, the chip-on-cover film and other structures are arranged inside the first substrate. Therefore, the binding terminals, the chip-on-cover film and other structures in the binding area of ​​the chip-on-cover film can be easily shielded by light-shielding ink, and there is no need to set a special outer frame (such as a metal outer frame, etc.) to shield the binding area in the display device. Even if a special outer frame 610 is set for shielding and protection, the width of the outer frame 610 is also very narrow. For example, the orthographic projection of the outer frame 610 on the plane where the first substrate 100 is located does not exceed 1 mm, for example, it can be 0.8 mm, 0.6 mm, 0.5 mm, 0.3 mm, etc. Therefore, the display device 1000 has an extremely narrow frame structure, which further improves the appearance effect and display performance of the display device 1000.

[0055] In some embodiments of the present application, reference Fig. 9The display device 1000 may further include: foam glue 700, which is located in the accommodating space 230 and connected to the bottom cover 620 on one side. Therefore, the foam glue 700 can be used to fix the first substrate 100 and the second substrate 200, further improving the stability and performance of the display device 1000.

[0056] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present disclosure, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0057] In the present disclosure, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to specific circumstances.

[0058] In the present disclosure, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being “above”, “above”, and “above” a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0059] The disclosure above provides many different embodiments or examples to implement different structures of the present disclosure. In order to simplify the present disclosure, the components and settings of specific examples are described above. Of course, they are only examples, and the purpose is not to limit the present disclosure. In addition, the present disclosure can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed.

[0060] The above are only specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any technician familiar with the technical field can easily think of various changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A display device, characterized in that: include: A first substrate, the first substrate having a display area and a non-display area, the non-display area is located at the periphery of the display area and close to the edge of the first substrate, the non-display area has a COF binding area, and a gap is formed between the COF binding area and the edge of the first substrate; a second substrate, the second substrate being arranged opposite to the first substrate, and an edge of the first substrate extending beyond an edge of the second substrate; The chip-on-film comprises a bonding section and a bending section connected to each other, the bonding section is bonded to the chip-on-film binding area, and the bending section is bent in a direction away from the first substrate.

2. The display device according to claim 1, characterized in that The COF binding area has a binding terminal, and the binding terminal is located in the COF binding area closest to the gap; The second substrate has a first edge close to the step area, and a reserved zone is provided between the binding terminal and the first edge; The ratios of the width of the gap, the width of the binding terminal, and the width of the reserved band are (1-2): (0.7-0.9): (0.4-0.6).

3. The display device according to claim 2, characterized in that The width of the gap is 1000-2000 microns.

4. The display device according to claim 2, characterized in that: The width of the binding terminal is 700-900 microns, and the width of the reserved band is 400-600 microns.

5. The display device according to claim 2, characterized in that: The width of the step area is 2.1-3.5 mm.

6. The display device according to claim 1, characterized in that: The chip-on-film has a first surface and a second surface relative to each other. The first surface of the chip-on-film is bonded to a side of the first substrate facing the second substrate, and the first surface is bent reversely from the bending section to a surface of the second substrate away from the first substrate. The chip-on-film includes a driving chip, and the driving chip is arranged on the side where the first surface is bent to the second substrate.

7. The display device according to claim 6, characterized in that: The color of the first surface of the chip-on-film includes at least one of yellow, green, and black.

8. The display device according to claim 6, characterized in that: The first surface and the first substrate are fixed with glue at the corners of the bonding section and the bending section.

9. The display device according to claim 8, characterized in that: The glue includes black UV glue.

10. The display device according to claim 1, characterized in that Further including: A printed circuit board is arranged at a side where the chip-on-film is reversely bent to the second substrate, and is electrically connected to the chip-on-film.

11. The display device according to claim 1, characterized in that: Further including: Light-shielding ink, wherein the light-shielding ink covers the COF binding area.

12. The display device according to claim 11, characterized in that: The first substrate is a quadrilateral, the light-shielding ink covers four sides of the first substrate, and the area of ​​the first substrate covered by the light-shielding ink forms a frame of the display device.

13. The display device according to claim 1, characterized in that Further including: A protective shell, wherein the protective shell has an outer frame and a bottom cover, a storage space is formed between the outer frame and the bottom cover, the first substrate and the second substrate are accommodated in the storage space, the outer frame and the side of the first substrate are fixed, and on the four edges of the first substrate, the orthographic projection of the outer frame on the plane where the first substrate is located does not exceed 1 mm.

14. The display device according to claim 13, characterized in that: Further including: Foam glue, the foam glue is located in the accommodating space and one side of the foam glue is connected to the bottom cover plate, and the foam glue is used to fix the first substrate and the second substrate.

Images