Object processing method, device, processing equipment and product assembly

Abstract

The present disclosure provides an object processing method, device, processing equipment and product components, the method comprising: generating an initial tool path based on a main model surface of a target object; the initial tool path comprises a plurality of tool path lines; obtaining a first group of tool path lines and a second group of tool path lines of the initial tool path; in the initial tool path, N tool path lines are included between the first group of tool path lines and the second group of tool path lines, N being a positive integer; generating N new tool path lines uniformly distributed between the first group of tool path lines and the second group of tool path lines according to a first tool path line closest to a second group of tool path lines in the first group of tool path lines and a second tool path line closest to the first group of tool path lines in the second group of tool path lines, as a third group of tool path lines; obtaining a target tool path according to the first group of tool path lines, the third group of tool path lines and the second group of tool path lines; processing the target object according to the target tool path.

Description

Technical Field

[0001] The embodiments of the present disclosure relate to the field of mechanical processing technology, and more specifically, to an object processing method, device, processing equipment and product assembly. Background Art

[0002] Today's electronic products are developing rapidly, and new products with more beautiful appearance and more powerful functions are emerging in an endless stream, especially smart headphones, smart wearable devices, etc., which have generally adopted mirror appearance, and the products look more dazzling. In order to meet the increasingly high requirements for product mirrors, the requirements for mold mirror processing are also getting higher and higher. The traditional programming processing method, because of the lifting of the tool and the change of the tool direction, leaves obvious tool connection marks on the mold processing surface. During polishing, these knife marks cannot be completely removed, and traces will be left on the surface of the workpiece. Therefore, it cannot meet the processing requirements of the mold's high-gloss mirror. Summary of the invention

[0003] An object of the embodiments of the present disclosure is to provide an object processing method, apparatus, processing equipment and storage medium.

[0004] According to a first aspect of an embodiment of the present disclosure, there is provided an object processing method, comprising:

[0005] Generate an initial tool path based on the main model surface of the target object; the initial tool path includes multiple tool path lines;

[0006] Acquire a first group of tool path lines and a second group of tool path lines of the initial tool path; the first group of tool path lines includes at least one continuous tool path line, the second group of tool path lines includes at least one continuous tool path line, and in the initial tool path, there are N tool path lines between the first group of tool path lines and the second group of tool path lines, where N is a positive integer;

[0007] According to the first tool path line in the first tool path line group that is closest to the second tool path line group, and the second tool path line in the second tool path line group that is closest to the first tool path line group, generating N new tool path lines evenly distributed between the first tool path line group and the second tool path line group as a third tool path line group;

[0008] Obtaining a target tool path according to the first group of tool path lines, the third group of tool path lines and the second group of tool path lines;

[0009] The target object is processed according to the target tool path.

[0010] Optionally, the step of obtaining a first set of tool path lines and a second set of tool path lines of the initial tool path includes:

[0011] Determine the first tool path line and the second tool path line in the initial tool path;

[0012] Determining the first group of tool path lines according to the first tool path line;

[0013] The second group of tool path lines is determined according to the second tool path line.

[0014] Optionally, the determining the first tool path line and the second tool path line in the initial tool path includes:

[0015] Determine a segmentation plane of the target object; the segmentation plane indicates that the initial tool path is sparse or shows a tendency of tool jumping or tool lifting;

[0016] Based on the dividing surface, M tool path lines are traced forward in the initial tool path to obtain the first tool path line;

[0017] Based on the split surface, trace back K tool paths in the initial tool path to obtain the second tool path;

[0018] Wherein, M and K are both non-zero integers.

[0019] Optionally, determining the segmentation plane of the target object includes:

[0020] Get the preset segmentation depth;

[0021] A plane where a tool path line whose depth in the initial tool path matches the segmentation depth is located is determined as the segmentation plane.

[0022] Optionally, determining the segmentation plane of the target object includes:

[0023] Get the preset segmentation angle;

[0024] Determine the plane where the tool path line in the initial tool path has a section angle that matches the segmentation angle as the segmentation plane. The section angle is the angle between the section of the main model surface at the tool path line and the plane where the tool path line is located.

[0025] Optionally, generating N new tool path lines evenly distributed between the first group of tool path lines and the second group of tool path lines as a third group of tool path lines according to the first tool path line closest to the second group of tool path lines in the first group of tool path lines and the second tool path line closest to the first group of tool path lines in the second group of tool path lines, comprises:

[0026] Based on the tool model, chamfering and transition processing are performed between the first tool path line and the second tool path line to obtain N uniform new tool path lines as the third group of tool path lines.

[0027] Optionally, processing the target object according to the target tool path includes:

[0028] Processing the target object according to the first group of tool path lines in the target tool path;

[0029] Control the height setting of the auxiliary body used for auxiliary processing;

[0030] Processing the target object according to the third set of tool path lines in the target tool path;

[0031] The target object is processed according to the second set of tool path lines in the target tool path.

[0032] According to a second aspect of the present disclosure, there is provided an object processing device, comprising:

[0033] A first trajectory generation module is used to generate an initial tool path based on a main model surface of a target object; the initial tool path includes a plurality of tool path lines;

[0034] A tool path line acquisition module, used for acquiring a first group of tool path lines and a second group of tool path lines of the initial tool path; the first group of tool path lines includes at least one continuous tool path line, the second group of tool path lines includes at least one continuous tool path line, and in the initial tool path, there are N tool path lines between the first group of tool path lines and the second group of tool path lines, where N is a positive integer;

[0035] A tool path line generation module, used for generating N new tool path lines evenly distributed between the first group of tool path lines and the second group of tool path lines as a third group of tool path lines according to the first tool path line closest to the second group of tool path lines in the first group of tool path lines and the second tool path line closest to the first group of tool path lines in the second group of tool path lines;

[0036] A second trajectory generating module, used for obtaining a target tool path according to the first group of tool path lines, the third group of tool path lines and the second group of tool path lines;

[0037] The target object processing module is used to process the target object according to the target tool path.

[0038] According to a third aspect of the present disclosure, a processing device is provided, comprising a processor and a memory, wherein the memory is used to store a computer program, and the processor is used to execute the method described in the first aspect of the present disclosure under the control of the computer program.

[0039] According to a fourth aspect of the present disclosure, a product component is provided, the surface of which is processed by the method described in the first aspect of the present disclosure.

[0040] According to a fifth aspect of the present disclosure, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the method described in the first aspect of the present disclosure is implemented.

[0041] Through the embodiments of the present disclosure, an initial tool path is generated based on the main model surface of the target object, a first group of tool path lines and a second group of tool path lines of the initial tool path are obtained, and according to the first tool path lines and the second tool path lines, N new tool path lines uniformly distributed are generated between the first group of tool path lines and the second group of tool path lines as the third group of tool path lines, and a target tool path is obtained according to the first group of tool path lines, the third group of tool path lines and the second group of tool path lines. Then, according to the target tool path, the target object is processed. This can solve the problems of indentations caused by repetitive advance and retreat, overlapping tool paths in the overall processing of the target object in the design, mold, processing and other processes, severe marks, substandard surface cleanliness, low product qualification rate caused by printing on the appearance surface of the product, etc. It can also reduce the situation of poor workpiece consistency, long process turnaround time, and delayed processing delivery due to enrichment of assembly errors in multi-process segmented processing, and can also save processing operations and reduce processing costs.

[0042] Further features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0044] Figure 1 is a block diagram showing a hardware configuration of a processing device that can implement an embodiment of the present disclosure;

[0045] Figure 2 is a flow chart of an object processing method according to an embodiment of the present disclosure;

[0046] Figure 3 is a schematic diagram of a target object according to an embodiment of the present disclosure;

[0047] Figure 4 is a block diagram of an object processing apparatus according to an embodiment of the present disclosure;

[0048] Figure 5 is a block diagram of a processing device according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0049] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless otherwise specifically stated.

[0050] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

[0051] For ease of description, spatial relative terms may be used herein to describe the relationship of one element or feature relative to another element or feature as shown in the figure, such as "inside", "outside", "inner side", "outer side", "below", "below", "above", "above", etc. Such spatial relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the figure. For example, if the device in the figure is turned over, then the elements described as "below other elements or features" or "below other elements or features" will subsequently be oriented as "above other elements or features" or "above other elements or features". Therefore, the example term "below..." can include both upper and lower orientations. The device can be oriented otherwise (rotated 90 degrees or in other directions) and the spatial relative descriptors used in the text are interpreted accordingly.

[0052] Technologies, methods and equipment known to persons of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods and equipment should be considered part of the specification.

[0053] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0054] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0055] <Hardware Configuration>

[0056] Figure 1 is a block diagram showing a hardware configuration of a processing apparatus 1000 that can implement an embodiment of the present disclosure.

[0057] like Figure 1As shown, the processing equipment 1000 may include a processor 1100, a memory 1200, an interface device 1300, a communication device 1400, a display device 1500, an input device 1600, a speaker 1700, a microphone 1800, etc. Among them, the processor 1100 may be a processor CPU, a microprocessor MCU, etc. The memory 1200 includes, for example, a ROM (read-only memory), a RAM (random access memory), a non-volatile memory such as a hard disk, etc. The interface device 1300 includes, for example, a USB interface, a headphone interface, etc. The communication device 1400 is capable of wired or wireless communication, and specifically may include Wifi communication, Bluetooth communication, 2G / 3G / 4G / 5G communication, etc. The display device 1500 is, for example, a liquid crystal display screen, a touch display screen, etc. The input device 1600 may include, for example, a touch screen, a keyboard, a somatosensory input, etc. The user may input / output voice information through the speaker 1700 and the microphone 1800.

[0058] Figure 1 The processing equipment shown is merely illustrative and does not in any way limit the present disclosure, its application or use. In the embodiments of the present disclosure, the memory 1200 of the processing equipment 1000 is used to store instructions, and the instructions are used to control the processor 1100 to operate to perform any one of the methods provided in the embodiments of the present disclosure. It should be understood by those skilled in the art that although Figure 1 In the figure, a plurality of devices are shown for the processing device 1000, but the present disclosure may only involve some of the devices, for example, the processing device 1000 only involves the processor 1100 and the memory 1200. A technician can design instructions according to the scheme disclosed in the present disclosure. How instructions control the processor to operate is well known in the art, so it will not be described in detail here.

[0059] <Method Example>

[0060] The present disclosure provides an object processing method, which can be implemented by a processing device. For example, the processing device can be the processing device 1000 described in the above embodiment.

[0061] Figure 2 The figure is a flow chart of an object processing method according to an embodiment of the present disclosure.

[0062] like Figure 2 As shown, the method includes steps S2100 to S2500 as shown below:

[0063] Step S2100: generating an initial tool path based on the main model surface of the target object.

[0064] The initial tool path includes multiple tool path lines.

[0065] In one example, at least two adjacent tool path lines in the initial tool path may be connected by a translation tool path.

[0066] In another embodiment, at least two adjacent tool path lines are disconnected, that is, they are not connected by the translation tool path.

[0067] The target object of this embodiment may be a product component, such as a housing of an earphone.

[0068] In this embodiment, based on the structure of the main model surface of the target object, programming software is used to perform computer-aided calculations on the main model surface features to generate an initial tool path composed of multiple tool path lines that are objectively and visually mapped around the model, wherein the plane where each tool path line is located is parallel to the set plane, and multiple tool path lines are arranged in a direction perpendicular to the set plane.

[0069] In an example, a tool path line may be a curve, and the curve may be a closed curve or a non-closed curve, which is not limited here.

[0070] Step S2200, obtaining a first group of tool path lines and a second group of tool path lines of an initial tool path. The first group of tool path lines includes at least one continuous tool path line, and the second group of tool path lines includes at least one continuous tool path line. In the initial tool path, there are N tool path lines between the first group of tool path lines and the second group of tool path lines, where N is a positive integer.

[0071] In this embodiment, the tool path lines included in the first group of tool path lines and the second group of tool path lines do not overlap, and N tool path lines are spaced between the first group of tool path lines and the second group of tool path lines.

[0072] In one example, the target object 30 may be Figure 3 As shown, the first set of tool path lines may be tool path lines surrounding a first surface 31 of the target object, and the second set of tool path lines may be tool path lines surrounding a second surface 32 of the target object.

[0073] In one embodiment of the present disclosure, obtaining a first set of tool trajectory lines and a second set of tool trajectory lines in an initial tool trajectory includes: determining the first tool trajectory line and the second tool trajectory line in the initial tool trajectory; determining the first set of tool trajectory lines according to the first tool trajectory line; and determining the second set of tool trajectory lines according to the second tool trajectory line.

[0074] The first tool trajectory line is the tool trajectory line in the first group of tool trajectory lines that is closest to the tool trajectory lines in the second group, and the second tool trajectory line is the tool trajectory line in the second group of tool trajectory lines that is closest to the first group of tool trajectory lines.

[0075] That is to say, when the first set of tool path lines is a tool path line above the second set of tool path lines, the first tool path line is the lowest tool path line in the first set of tool path lines, and the second tool path line is the highest tool path line in the second set of tool path lines. The upper and lower in this embodiment are relative directions relative to the processing direction of the target object.

[0076] In this embodiment, the first group of tool trajectory lines is determined according to the first tool trajectory line, and the first tool trajectory line and the tool trajectory line located above the first tool trajectory line are used as the first group of tool trajectory lines; the second group of tool trajectory lines is determined according to the second tool trajectory line, and the second tool trajectory line and the tool trajectory line located below the second tool trajectory line are used as the second group of tool trajectory lines.

[0077] In one embodiment of the present disclosure, determining a first tool trajectory line and a second tool trajectory line in an initial tool path includes: determining a segmentation plane of a target object; the segmentation plane indicates that the initial tool path appears sparse or shows a tendency of tool jumping or tool lifting; tracing back M tool trajectory lines in the initial tool path based on the segmentation plane to obtain a first tool trajectory line; tracing back K tool trajectory lines in the initial tool path based on the segmentation plane to obtain a second tool trajectory line; wherein M and K are both non-zero integers.

[0078] The dividing plane of this embodiment may be parallel to the tool path line, and specifically may be a plane where a tool path line in the initial tool path is located, or may be a plane between planes where two adjacent tool paths in the initial tool path are located.

[0079] In this embodiment, M and K may be pre-set according to application scenarios or specific requirements. For example, M may be 0, 1, or 2, and K may be 2 or 3.

[0080] Further, the number N of tool path lines included between the first group of tool path lines and the second group of tool path lines can be determined according to M and K. When the dividing surface is a plane where a tool path line in the initial tool path is located, N=M+K+1; when the dividing surface is a plane between planes where two adjacent tool path lines in the initial tool path are located, N=M+K.

[0081] In this embodiment, the initial tool path is truncated based on the first tool path line and the second tool path line, and the complete nodes without tool jumping or lifting tendency before the first tool path line are retained to form a first group of tool path lines, and the complete nodes without tool jumping or lifting tendency after the second tool path line are retained to form a second group of tool path lines.

[0082] In one embodiment of the present disclosure, determining the segmentation plane of the target object may include: obtaining a preset segmentation depth; and determining a plane where a tool path line whose depth matches the segmentation depth in the initial tool path is located as the segmentation plane.

[0083] In this embodiment, the segmentation depth may be pre-set according to the actual shape of the target object. For example, the segmentation depth may be 4 / 5 of the processing depth of the target object.

[0084] In this embodiment, the tool path line whose depth matches the segmentation depth in the initial tool path may be the tool path line whose distance to the segmentation depth is the smallest.

[0085] In another embodiment of the present disclosure, determining the segmentation plane of the target object may include: acquiring a preset segmentation depth; and determining a plane matching the segmentation depth as the segmentation plane.

[0086] In this embodiment, the depth corresponding to the segmentation plane is the same as the preset segmentation depth.

[0087] In another embodiment of the present disclosure, determining the segmentation plane of the target object may include: obtaining a preset segmentation angle; determining the plane where the tool path line in the initial tool path is located and whose section angle matches the segmentation angle as the segmentation plane, wherein the section angle is the angle between the section of the main model surface at the tool path line and the plane where the tool path line is located.

[0088] In this embodiment, the segmentation angle may be pre-set according to the actual shape of the target object, for example, the segmentation angle may be 50 degrees.

[0089] In this embodiment, the tool path line in which the included angle of the cutting surface matches the segmentation angle in the initial tool path may be the tool path line in which the difference between the included angle of the cutting surface and the segmentation angle is the smallest.

[0090] In another embodiment of the present disclosure, determining the segmentation plane of the target object may include: acquiring a preset segmentation angle; and determining a plane whose section angle matches the segmentation angle as the segmentation plane.

[0091] In this embodiment, the section angle corresponding to the dividing surface is the same as the preset dividing angle.

[0092] Through this embodiment, a first group of tool path lines and a second group of tool path lines without tool jumping and tool lifting tendency states can be obtained.

[0093] Step S2300: generating N new tool path lines evenly distributed between the first group of tool path lines and the second group of tool path lines according to the first tool path lines and the second tool path lines as a third group of tool path lines.

[0094] In one embodiment of the present disclosure, based on the first tool trajectory line and the second tool trajectory line, N new tool trajectory lines that are evenly distributed are generated between the first group of tool trajectory lines and the second group of tool trajectory lines as the third group of tool trajectory lines, including: chamfering and transition processing are performed between the first tool trajectory line and the second tool trajectory line based on the tool model to obtain N uniform new tool trajectory lines as the third group of tool trajectory lines.

[0095] In this embodiment, the distance between any two adjacent new tool path lines is equal, which is D, and the distance between the first new tool path line and the first tool path line is also D, and the distance between the Nth new tool path line and the second tool path line is also D.

[0096] In such Figure 3 In the example shown, the N new tool path lines may be tool path lines surrounding the third surface 33 of the target object.

[0097] Step S2400, obtaining a target tool path according to the first set of tool path lines, the third set of tool path lines and the second set of tool path lines.

[0098] In this embodiment, the first group of tool path lines, the third group of tool path lines and the second group of tool path lines may be combined to obtain a target tool path.

[0099] In one example, any two adjacent tool path lines in the target tool path may be connected by a translation tool path.

[0100] Furthermore, in this embodiment, a plurality of translational tool paths are connected on the same straight line, and the straight line may be the central axis of the target object.

[0101] Step S2500, processing the target object according to the target tool path.

[0102] In this embodiment, the target tool path may be introduced into a numerically controlled machine tool, and the numerically controlled machine tool is used to perform cutting processing on the target object according to the target tool path.

[0103] In an embodiment, a ball end milling cutter may be used to perform cutting processing on the target object.

[0104] In one embodiment of the present disclosure, processing the target object according to the target tool trajectory may include: processing the target object according to a first set of tool trajectory lines in the target tool trajectory; processing the target object according to a third set of tool trajectory lines in the target tool trajectory; processing the target object according to a second set of tool trajectory lines in the target tool trajectory.

[0105] In one embodiment, the target object may be subjected to a one-time cutting process according to the target tool path, wherein the one-time cutting process only includes one tool lowering process and one tool lifting process to end the process.

[0106] In this embodiment, after the cutting process of the target object is completed according to a set of tool path lines, it is possible to continue cutting the target object according to the next set of tool path lines without lifting the tool.

[0107] This embodiment controls the CNC machine tool to perform tool movement according to the target tool path without performing the tool lifting and tool lowering actions. Finally, after the target object is cut according to the target tool path, the tool lifting action is completed, thereby reducing the tool marks on the surface of the target object and improving the surface quality of the target object to meet the processing requirements of the target object with a high-gloss mirror surface.

[0108] In another embodiment, the target object may be cut once according to each set of tool path lines of the target tool path.

[0109] In this embodiment, after the cutting process of the target object is completed according to a set of tool path lines, the tool can be raised and then lowered to cut the target object according to the next set of tool path lines.

[0110] In one embodiment of the present disclosure, after the target object is processed according to the first set of tool path lines in the target tool path, the auxiliary body used for auxiliary processing is controlled to be raised to a set height.

[0111] In this embodiment, the set height may be set in advance according to the application scenario or specific requirements. For example, the set height may be 0.01-0.05.

[0112] Through this embodiment, the auxiliary body is raised to a set height, so that the first surface of the target object that has been processed according to the first set of tool path lines can be protected from the biased surface, thereby preventing the subsequent tool paths from accidentally damaging the processed first surface of the target object during the processing process.

[0113] Through the embodiments of the present disclosure, an initial tool path is generated based on the main model surface of the target object, a first group of tool path lines and a second group of tool path lines of the initial tool path are obtained, and according to the first tool path lines and the second tool path lines, N new tool path lines uniformly distributed are generated between the first group of tool path lines and the second group of tool path lines as the third group of tool path lines, and a target tool path is obtained according to the first group of tool path lines, the third group of tool path lines and the second group of tool path lines. Then, according to the target tool path, the target object is processed. This can solve the problems of indentations caused by repetitive advance and retreat, overlapping tool paths in the overall processing of the target object in the design, mold, processing and other processes, severe marks, substandard surface cleanliness, low product qualification rate caused by printing on the appearance surface of the product, etc. It can also reduce the situation of poor workpiece consistency, long process turnaround time, and delayed processing delivery due to enrichment of assembly errors in multi-process segmented processing, and can also save processing operations and reduce processing costs.

[0114] <Device Example>

[0115] This embodiment provides an object processing device, such as Figure 4As shown, the object processing device 4000 may include a first trajectory generating module 4100 , a tool trajectory line acquiring module 4200 , a tool trajectory line generating module 4300 , a second trajectory generating module 4400 and a target object processing module 4500 .

[0116] The first trajectory generation module 4100 is used to generate an initial tool path trajectory based on the main model surface of the target object; the initial tool path trajectory includes multiple tool path lines.

[0117] The tool trajectory acquisition module 4200 is used to acquire the first group of tool trajectory lines and the second group of tool trajectory lines of the initial tool path; the first group of tool trajectory lines includes at least one continuous tool trajectory line, the second group of tool trajectory lines includes at least one continuous tool trajectory line, and in the initial tool path, there are N tool trajectory lines between the first group of tool trajectory lines and the second group of tool trajectory lines, where N is a positive integer.

[0118] The tool trajectory generation module 4300 is used to generate N new tool trajectory lines evenly distributed between the first group of tool trajectory lines and the second group of tool trajectory lines as the third group of tool trajectory lines based on the first tool trajectory line that is closest to the second group of tool trajectory lines in the first group of tool trajectory lines and the second tool trajectory line that is closest to the first group of tool trajectory lines in the second group of tool trajectory lines.

[0119] The second trajectory generating module 4400 is used to obtain a target tool path trajectory according to the first group of tool path lines, the third group of tool path lines and the second group of tool path lines.

[0120] The target object processing module 4500 is used to process the target object according to the target tool path.

[0121] In one embodiment of the present disclosure, the tool path line acquisition module 4200 is used to:

[0122] Determine the first tool path line and the second tool path line in the initial tool path;

[0123] Determining the first group of tool path lines according to the first tool path line;

[0124] The second group of tool path lines is determined according to the second tool path line.

[0125] In one embodiment of the present disclosure, the determining the first tool path line and the second tool path line in the initial tool path includes:

[0126] Determine a segmentation plane of the target object; the segmentation plane indicates that the initial tool path is sparse or shows a tendency of tool jumping or tool lifting;

[0127] Based on the dividing surface, M tool path lines are traced forward in the initial tool path to obtain the first tool path line;

[0128] Based on the split surface, trace back K tool paths in the initial tool path to obtain the second tool path;

[0129] Wherein, M and K are both non-zero integers.

[0130] In one embodiment of the present disclosure, determining the segmentation plane of the target object includes:

[0131] Get the preset segmentation depth;

[0132] A plane where a tool path line whose depth in the initial tool path matches the segmentation depth is located is determined as the segmentation plane.

[0133] In one embodiment of the present disclosure, determining the segmentation plane of the target object includes:

[0134] Get the preset segmentation angle;

[0135] Determine the plane where the tool path line in the initial tool path has a section angle that matches the segmentation angle as the segmentation plane. The section angle is the angle between the section of the main model surface at the tool path line and the plane where the tool path line is located.

[0136] In one embodiment of the present disclosure, the tool path line generation module 4300 is used to:

[0137] Based on the tool model, chamfering and transition processing are performed between the first tool path line and the second tool path line to obtain N uniform new tool path lines as the third group of tool path lines.

[0138] In one embodiment of the present disclosure, the target object processing module 4500 is used to:

[0139] Processing the target object according to the first group of tool path lines in the target tool path;

[0140] Control the height setting of the auxiliary body used for auxiliary processing;

[0141] Processing the target object according to the third set of tool path lines in the target tool path;

[0142] The target object is processed according to the second set of tool path lines in the target tool path.

[0143] <Equipment Embodiment>

[0144] This embodiment provides a processing device. In one aspect, the processing device may include the aforementioned object processing apparatus 4000 .

[0145] On the other hand, Figure 5As shown, the processing equipment 5000 may include a processor 5100 and a memory 5200, wherein the memory 5200 is used to store a computer program, and the processor 5100 is used to control the processing equipment to execute the method of any embodiment of the present disclosure under the control of the computer program.

[0146] In one example, the processing equipment may include a host computer and a CNC machine tool.

[0147] <Product Component Embodiment>

[0148] This embodiment provides a product component, the surface of which is processed by the method described in any embodiment of the present disclosure.

[0149] In one example, the product component may be a housing for headphones or the like.

[0150] <Readable Storage Medium Embodiment>

[0151] This embodiment provides a computer-readable storage medium, in which a computer program is stored. When the computer program is executed by a processor, the method described in any method embodiment of the present disclosure is executed.

[0152] The present invention may be a system, a method and / or a computer program product. The computer program product may include a computer-readable storage medium carrying computer-readable program instructions for causing a processor to implement various aspects of the present invention.

[0153] A computer-readable storage medium may be a tangible device that can hold and store instructions used by an instruction execution device. A computer-readable storage medium may be, for example, but not limited to, an electrical storage device, a magnetic storage device, an optical storage device, an electromagnetic storage device, a semiconductor storage device, or any suitable combination of the above. More specific examples (a non-exhaustive list) of computer-readable storage media include: a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), a static random access memory (SRAM), a portable compact disk read-only memory (CD-ROM), a digital versatile disk (DVD), a memory stick, a floppy disk, a mechanical encoding device, such as a punch card or a raised structure in a groove on which instructions are stored, and any suitable combination of the above. The computer-readable storage medium used herein is not to be interpreted as a transient signal itself, such as a radio wave or other freely propagating electromagnetic wave, an electromagnetic wave propagating through a waveguide or other transmission medium (e.g., a light pulse through a fiber optic cable), or an electrical signal transmitted through a wire.

[0154] The computer-readable program instructions described herein can be downloaded from a computer-readable storage medium to each computing / processing device, or downloaded to an external computer or external storage device via a network, such as the Internet, a local area network, a wide area network, and / or a wireless network. The network can include copper transmission cables, optical fiber transmissions, wireless transmissions, routers, firewalls, switches, gateway computers, and / or edge servers. The network adapter card or network interface in each computing / processing device receives the computer-readable program instructions from the network and forwards the computer-readable program instructions for storage in the computer-readable storage medium in each computing / processing device.

[0155] The computer program instructions for performing the operation of the present invention may be assembly instructions, instruction set architecture (ISA) instructions, machine instructions, machine-dependent instructions, microcode, firmware instructions, state setting data, or source code or object code written in any combination of one or more programming languages, including object-oriented programming languages, such as Smalltalk, C++, etc., and conventional procedural programming languages, such as "C" language or similar programming languages. The computer-readable program instructions may be executed entirely on the user's computer, partially on the user's computer, as a separate software package, partially on the user's computer, partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., using an Internet service provider to connect through the Internet). In some embodiments, by using the state information of the computer-readable program instructions to personalize an electronic circuit, such as a programmable logic circuit, a field programmable gate array (FPGA), or a programmable logic array (PLA), the electronic circuit may execute the computer-readable program instructions, thereby implementing various aspects of the present invention.

[0156] Various aspects of the present invention are described herein with reference to the flowcharts and / or block diagrams of the methods, devices (systems) and computer program products according to embodiments of the present invention. It should be understood that each box of the flowchart and / or block diagram and the combination of the boxes in the flowchart and / or block diagram can be implemented by computer-readable program instructions.

[0157] These computer-readable program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, thereby producing a machine, so that when these instructions are executed by the processor of the computer or other programmable data processing device, a device that implements the functions / actions specified in one or more boxes in the flowchart and / or block diagram is generated. These computer-readable program instructions can also be stored in a computer-readable storage medium, and these instructions cause the computer, programmable data processing device, and / or other equipment to work in a specific manner, so that the computer-readable medium storing the instructions includes a manufactured product, which includes instructions for implementing various aspects of the functions / actions specified in one or more boxes in the flowchart and / or block diagram.

[0158] Computer-readable program instructions may also be loaded onto a computer, other programmable data processing apparatus, or other device so that a series of operating steps are performed on the computer, other programmable data processing apparatus, or other device to produce a computer-implemented process, thereby causing the instructions executed on the computer, other programmable data processing apparatus, or other device to implement the functions / actions specified in one or more boxes in the flowchart and / or block diagram.

[0159] The flow charts and block diagrams in the accompanying drawings show the possible architecture, functions and operations of the systems, methods and computer program products according to multiple embodiments of the present invention. In this regard, each box in the flow chart or block diagram can represent a part of a module, a program segment or an instruction, and a part of the module, a program segment or an instruction contains one or more executable instructions for realizing the specified logical function. In some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two consecutive boxes can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flow chart, and the combination of the boxes in the block diagram and / or flow chart can be implemented by a dedicated hardware-based system that performs the specified function or action, or can be implemented by a combination of dedicated hardware and computer instructions. It is well known to those skilled in the art that it is equivalent to implement it by hardware, implement it by software, and implement it by combining software and hardware.

[0160] Embodiments of the present invention have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of terms used herein is intended to best explain the principles of the embodiments, practical applications, or technical improvements in the marketplace, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein. The scope of the present invention is defined by the appended claims.

Claims

1. An object processing method, characterized in that: include: Generate an initial tool path based on the main model surface of the target object; the initial tool path includes multiple tool path lines; Acquire a first group of tool path lines and a second group of tool path lines of the initial tool path; the first group of tool path lines includes at least one continuous tool path line, the second group of tool path lines includes at least one continuous tool path line, and in the initial tool path, there are N tool path lines between the first group of tool path lines and the second group of tool path lines, where N is a positive integer; According to the first tool path line in the first tool path line group that is closest to the second tool path line group, and the second tool path line in the second tool path line group that is closest to the first tool path line group, generating N new tool path lines evenly distributed between the first tool path line group and the second tool path line group as a third tool path line group; Obtaining a target tool path according to the first group of tool path lines, the third group of tool path lines and the second group of tool path lines; Processing the target object according to the target tool path; The step of obtaining the first set of tool path lines and the second set of tool path lines of the initial tool path comprises: Determine a segmentation plane of the target object; the segmentation plane indicates that the initial tool path is sparse or shows a tendency of tool jumping or tool lifting; Based on the dividing surface, M tool path lines are traced forward in the initial tool path to obtain the first tool path line; Based on the split surface, trace back K tool paths in the initial tool path to obtain the second tool path; Determining the first group of tool path lines according to the first tool path line; Determining the second group of tool path lines according to the second tool path line; Wherein, M and K are both non-zero integers; The determining of the segmentation plane of the target object comprises: Obtaining a preset segmentation depth; determining a plane where a tool path line whose depth in the initial tool path matches the segmentation depth is located as the segmentation plane; or, Obtain a preset segmentation angle; determine the plane where the tool path line in the initial tool path has a section angle that matches the segmentation angle as the segmentation plane, and the section angle is the angle between the section of the main model surface at the tool path line and the plane where the tool path line is located.

2. The method according to claim 1, characterized in that The method further comprises: generating N new tool path lines evenly distributed between the first group of tool path lines and the second group of tool path lines according to the first tool path line closest to the second group of tool path lines and the second tool path line closest to the first group of tool path lines in the second group of tool path lines, as a third group of tool path lines, including: Based on the tool model, chamfering and transition processing are performed between the first tool path line and the second tool path line to obtain N uniform new tool path lines as the third group of tool path lines.

3. The method according to claim 1, characterized in that The processing of the target object according to the target tool path includes: Processing the target object according to the first group of tool path lines in the target tool path; Control the height setting of the auxiliary body used for auxiliary processing; Processing the target object according to the third set of tool path lines in the target tool path; The target object is processed according to the second set of tool path lines in the target tool path.

4. An object processing device, characterized in that: include: A first trajectory generation module, used to generate an initial tool path based on a main model surface of a target object; The initial tool path includes a plurality of tool path lines; A tool path line acquisition module, used for acquiring a first group of tool path lines and a second group of tool path lines of the initial tool path; the first group of tool path lines includes at least one continuous tool path line, the second group of tool path lines includes at least one continuous tool path line, and in the initial tool path, there are N tool path lines between the first group of tool path lines and the second group of tool path lines, where N is a positive integer; A tool path line generation module, used for generating N new tool path lines evenly distributed between the first group of tool path lines and the second group of tool path lines as a third group of tool path lines according to the first tool path line closest to the second group of tool path lines in the first group of tool path lines and the second tool path line closest to the first group of tool path lines in the second group of tool path lines; A second trajectory generating module, used for obtaining a target tool path according to the first group of tool path lines, the third group of tool path lines and the second group of tool path lines; A target object processing module, used for processing the target object according to the target tool path; The tool path acquisition module is used to: Determine a segmentation plane of the target object; the segmentation plane indicates that the initial tool path is sparse or shows a tendency of tool jumping or tool lifting; Based on the dividing surface, M tool path lines are traced forward in the initial tool path to obtain the first tool path line; Based on the split surface, trace back K tool paths in the initial tool path to obtain the second tool path; Determining the first group of tool path lines according to the first tool path line; Determining the second group of tool path lines according to the second tool path line; Wherein, M and K are both non-zero integers; The determining of the segmentation plane of the target object comprises: Obtaining a preset segmentation depth; determining a plane where a tool path line whose depth in the initial tool path matches the segmentation depth is located as the segmentation plane; or, Obtain a preset segmentation angle; determine the plane where the tool path line in the initial tool path has a section angle that matches the segmentation angle as the segmentation plane, and the section angle is the angle between the section of the main model surface at the tool path line and the plane where the tool path line is located.

5. A processing equipment, characterized in that: The method comprises a processor and a memory, wherein the memory is used to store a computer program, and the processor is used to execute the method according to any one of claims 1 to 3 under the control of the computer program.

6. A product component, characterized in that: The surface of the product component is processed by the method according to any one of claims 1 to 3.

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