Attaching head

Abstract

The invention relates to a laminating head. The laminating head comprises a shell, a power assembly, a sensor and a suction nozzle rod, the power assembly is arranged on the shell; one side of the sensor faces the power assembly; one end of the suction nozzle rod is connected to the side, away from the power assembly, of the sensor; the laminating head has a first state and a second state; in the first state, the suction nozzle rod does not adsorb materials, the power assembly abuts against the sensor, and first abutting force is generated between the power assembly and the sensor. In the second state, the suction nozzle rod adsorbs the materials, the power assembly abuts against the sensor, and second abutting force is generated between the power assembly and the sensor. According to the laminating head, precise force control of the laminating head on a chip from 0-5 g as an initial value can be achieved, and the laminating distance can be controlled in real time.

Description

Technical Field

[0001] The present application relates to the field of semiconductor packaging technology, and in particular to a bonding head. Background Art

[0002] The die bonder, also known as the die loading machine or chip pasting machine, is a packaging machine in which the bonding head of the die bonder equipment is driven by other modules of the die bonder to operate. It is driven by the linear motor and other driving structures of the die bonder drive module to achieve adsorption and pressing bonding. It has high requirements on the accuracy and control of the force when used for adsorption and bonding of chips.

[0003] In the related technology, the bonding head is mainly composed of a motor, a linear guide, a nozzle rod, a grating ruler, an encoder and various connecting parts, with a linear guide or a cross roller guide as a guide. Specifically, after the nozzle rod contacts the chip, the chip will move relative to the linear guide during the bonding process with other structures, driving the encoder to move relative to the grating ruler, so that the displacement of the encoder can be used to judge the adsorption and bonding strength of the chip.

[0004] However, when the surface of the chip or the material of the chip itself is soft, the chip itself will undergo plastic deformation when the bonding head adsorbs the chip and when the chip is bonded to other structures, thereby affecting the displacement of the encoder, making it impossible to accurately judge the force of chip adsorption and bonding, and the bonding head cannot accurately control the force on the chip. Summary of the invention

[0005] Based on this, it is necessary to provide a bonding head to solve the problem that the bonding head cannot accurately control the force on the chip during the process of chip adsorption and chip bonding.

[0006] A fitting head, comprising:

[0007] case;

[0008] A power assembly is arranged on the housing;

[0009] A sensor, one side of the sensor faces the power assembly;

[0010] A suction nozzle rod, one end of which is connected to the side of the sensor away from the power assembly, and the other end is used to absorb materials;

[0011] The fitting head includes a first state and a second state;

[0012] In the first state, the suction nozzle rod does not absorb the material, the power assembly and the sensor are in contact, and a first contact force is generated between the power assembly and the sensor;

[0013] In the second state, the nozzle rod absorbs the material, the power assembly and the sensor abut against each other, and a second abutting force is generated between the power assembly and the sensor.

[0014] In some embodiments, the power assembly includes a first motor and a transmission member, one end of the transmission member is connected to the power output end of the first motor, and the side of the sensor away from the nozzle rod faces the end of the transmission member away from the first motor;

[0015] The laminating head further includes a spring force control component, which is rotatably disposed on the housing and connected to the nozzle rod. The nozzle rod can move along a first direction relative to the spring force control component to drive the transmission member to move along the first direction.

[0016] The first direction is parallel to the axial direction of the nozzle rod.

[0017] In some embodiments, the spring force control assembly includes at least two diaphragm springs, the at least two diaphragm springs are arranged at intervals along a first direction, the at least two diaphragm springs are each provided with a through hole, the axes of the at least two diaphragm springs are collinear, and the nozzle rod is passed through the through hole.

[0018] In some embodiments, the fitting head further comprises:

[0019] A detection component, at least part of which is connected to the transmission member, and is used to detect the displacement of the transmission member along a first direction.

[0020] In some embodiments, the detection component includes:

[0021] A grating ruler is arranged on the housing;

[0022] The encoder is connected to the transmission member.

[0023] In some embodiments, the fitting head further comprises:

[0024] A second motor is disposed on the housing;

[0025] The transmission assembly is connected between the power output end of the second motor and the suction nozzle rod.

[0026] In some embodiments, the transmission assembly includes:

[0027] A first transmission wheel connected to a power output end of the second motor;

[0028] A second transmission wheel connected to the nozzle rod;

[0029] The transmission belt is connected to the first transmission wheel and the second transmission wheel.

[0030] In some embodiments, the nozzle stem includes a hollow cavity;

[0031] The laminating head also includes a vacuum connector connected to the cavity of the nozzle rod.

[0032] In some embodiments, the sensor is a pressure sensor.

[0033] In some embodiments, the first motor is a voice coil motor.

[0034] The above-mentioned laminating head includes a shell, a power assembly, a sensor and a nozzle rod. The power assembly is arranged on the shell; one side of the sensor faces the power assembly; one end of the nozzle rod is connected to the side of the sensor away from the power assembly, and the other end is used to adsorb materials; the laminating head includes a first state and a second state; in the first state, the nozzle rod does not adsorb materials, the power assembly and the sensor abut, and a first abutting force is generated between the power assembly and the sensor; in the second state, the nozzle rod adsorbs materials, the power assembly and the sensor abut, and a second abutting force is generated between the power assembly and the sensor. The laminating head of the present application, because the power assembly and the sensor switch between the first state and the second state, when the nozzle rod does not adsorb materials and when the nozzle rod adsorbs materials, different abutting forces are generated respectively, so that the force applied to the material when it is adsorbed can be accurately judged by the second abutting force relative to the first abutting force. Further, when the material and other structures are bonded, the power assembly and the sensor further abut, so that the force applied to the material when it is bonded can be accurately judged by the abutting force at this time relative to the first abutting force, and finally the laminating head can achieve precise force control of the material. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 It is a schematic diagram of the structure of a bonding head in one embodiment of the present application.

[0036] Figure 2 for Figure 1 Side view of the mid-fit head.

[0037] Figure 3 for Figure 2 Cross-sectional view of the bonding head along the AA direction.

[0038] Figure 4 Schematic diagram of the structure of a diaphragm spring in an embodiment of the present application.

[0039] Figure 5 for Figure 3 A local enlarged schematic diagram of point A in the middle.

[0040] Description of reference numerals:

[0041] 1. Fit the head;

[0042] 11. Shell; 12. Power assembly; 13. Sensor; 14. Suction nozzle rod; 15. Spring force control assembly; 16. Detection assembly; 17. Second motor; 18. Transmission assembly; 19. Vacuum joint;

[0043] 121. a first motor; 122. a transmission member;

[0044] 151, diaphragm spring;

[0045] 161, grating ruler; 162, encoder;

[0046] 181. First transmission wheel; 182. Second transmission wheel; 183. Transmission belt. DETAILED DESCRIPTION

[0047] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0048] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0049] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0050] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0051] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0052] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0053] It should be noted that the suction nozzle rod of the present application is used to absorb materials. At the same time, under the power drive of the power component, the suction nozzle rod can be driven to drive the materials to further fit with other structures. By way of example, the chips mentioned in the present application are all one type of the material. The present application uses the chip as the material for illustrative purposes. Moreover, for the convenience of explanation, in the process of further fitting the material with other structures, the present application uses the fitting of the chip and the wafer as an example for illustrative purposes. The bonding process of the chip and the wafer is the bonding process of the chip and the wafer. Of course, it can be understood that the materials in the present application are not restrictive, and the categories of the materials will not be repeated here.

[0054] In addition, it should be noted that the suction nozzle rod in the present application is used to absorb materials. For example, the suction nozzle rod is further used to absorb materials through the suction nozzle by installing a suction nozzle. Of course, the suction nozzle rod can also absorb materials in other ways, and the way in which the suction nozzle rod absorbs materials is not limited here, and the way in which the suction nozzle rod absorbs materials is not repeated here.

[0055] See also Figure 1 , Figure 2 and Figure 3As shown. The laminating head 1 provided in one embodiment of the present application includes a shell 11, a power assembly 12, a sensor 13 and a nozzle rod 14. The power assembly 12 is arranged on the shell 11; one side of the sensor 13 faces the power assembly 12; one end of the nozzle rod 14 is connected to the side of the sensor 13 away from the power assembly 12, and the other end is used to adsorb materials; the laminating head 1 includes a first state and a second state; in the first state, the nozzle rod 14 does not adsorb materials, the power assembly 12 and the sensor 13 are in contact, and a first abutting force is generated between the power assembly 12 and the sensor 13; in the second state, the nozzle rod 14 adsorbs materials, the power assembly 12 and the sensor 13 are in contact, and a second abutting force is generated between the power assembly 12 and the sensor 13.

[0056] Specifically, the housing 11 serves as the frame structure of the bonding head 1, and is used to support and fix other components of the bonding head 1. The power assembly 12 serves as the power structure of the bonding head 1, and is used to drive the sensor 13 and the nozzle rod 14 to move relative to each other, thereby achieving precise force control of the chip. The sensor 13 serves as the detection structure of the bonding head 1, and is used to sense the force of the nozzle rod 14 during movement, adsorption of the chip, and bonding of the chip.

[0057] It should be noted that the bonding head 1 includes a first state and a second state, in which the power component 12 and the sensor 13 are both in abutment, and the bonding head 1 also includes a preset state, in which the power component 12 and the sensor 13 are not in abutment, and at this time, the nozzle rod 14 does not adsorb the chip.

[0058] Furthermore, in the preset state, the nozzle rod 14 does not adsorb the chip, the power assembly 12 and the sensor 13 do not abut, and the power assembly 12 does not work. By controlling the power assembly 12 to work, the power assembly 12 moves toward the direction close to the sensor 13 until the first state, the nozzle rod 14 does not adsorb the chip, and the power assembly 12 and the sensor 13 abut, so that the initial abutment force of the sensor 13 at this location, that is, the first abutment force, can be determined.

[0059] It should be further explained that the bonding head 1 is a partial structure of the die bonding machine, which is a packaging machine. The bonding head 1 will work under the drive of other driving mechanisms of the die bonding machine. That is, the nozzle rod 14 in the bonding head 1 can be moved by the drive of the power assembly 12, and can also be moved by the drive of the driving mechanism. It can be understood that when the nozzle rod 14 is driven by the power assembly 12 to move, the nozzle rod 14 and the power assembly 12 are in a state of relative motion, and when the nozzle rod 14 is driven by an external driving mechanism to move, the nozzle rod 14 and the power assembly 12 are in a relatively static state, until the nozzle rod 14 contacts the chip, the chip will apply a reverse force to the nozzle rod 14, so that the nozzle rod 14 applies a reverse force to the power assembly 12, and moves relative to the power assembly 12.

[0060] In the first state, the nozzle rod 14 does not absorb the chip, the power assembly 12 and the sensor 13 are in contact, and the external driving mechanism does not apply force to the bonding head 1. The external driving mechanism applies force to the bonding head 1, and the power assembly 12 and the sensor 13 switch to the second state, that is, the nozzle rod 14 absorbs the chip, and the power assembly 12 and the sensor 13 are in contact.

[0061] Since the nozzle rod 14 does not adsorb the chip in the preset state and the first state, and with the driving of the power assembly 12, the power assembly 12 and the sensor 13 switch from the non-contact state to the contact state, that is, in the first state, the first contact force generated when the power assembly 12 and the sensor 13 contact can be accurately judged. Furthermore, because the first contact force between the power assembly 12 and the sensor 13 does not change under the drive of the external driving mechanism, until the nozzle rod 14 contacts the chip, the chip applies a reverse force to the nozzle rod 14, thereby generating a second contact force between the sensor 13 and the power assembly 12, the sensor 13 can quickly sense the second contact force, and the change of the second contact force relative to the first contact force can accurately judge the contact state of the nozzle rod 14 and the chip, and realize the precise control of the bonding head 1 on the chip.

[0062] In addition, after the nozzle rod 14 absorbs the chip, when the chip and the wafer need to be bonded, the power component 12 is controlled to drive the nozzle rod 14 to drive the chip to move further. At this time, the nozzle rod 14 will further apply abutting force to the chip, and the force applied by the bonding head 1 to the chip can be accurately judged by the difference between the abutting force and the first abutting force, thereby achieving precise force control of the bonding head 1 on the chip.

[0063] It is understandable that in order to facilitate the precise control of the force of the bonding head 1 on the chip, in the first state, when the first abutment force is generated between the power component 12 and the sensor 13, the first abutment force can be set to 0, thereby making it easier for the bonding head 1 to precisely control the force of the chip.

[0064] At the same time, it should be noted that, in the process of precisely controlling the force of the chip, the present application can achieve precise force control of the chip only through the change of the second abutting force relative to the first abutting force, that is, the present application can precisely control the force through the relative change between the second abutting force and the first abutting force, that is, compared with the first abutting force, the force control process of the bonding head 1 on the chip in the present application can be understood as controlling the force from a state of zero force, thereby further improving the accuracy of the force control of the chip by the bonding head 1.

[0065] On the other hand, since film or other soft materials will be adhered to the surface of the chip, the surface material of the film is relatively soft. When the nozzle rod 14 abuts against the chip, even if the surface of the chip undergoes plastic deformation, the sensor 13 will still accurately judge the force generated when the nozzle rod 14 abuts against the chip, thereby enabling the bonding head 1 to accurately control the force of the chip through the force of the second abutting force relative to the first abutting force.

[0066] In addition, during the process of the bonding head 1 controlling the bonding of the chip and the wafer, the bonding head 1 drives the sensor 13 to drive the nozzle rod 14 to move through the power component 12, thereby controlling the bonding of the chip and the wafer, and the abutment force between the power component 12 and the sensor 13 is related to the current applied by the power component 12. During multiple bonding processes of the chip and the wafer, a curve graph of the current applied by the power component 12 and the second abutment force generated can be generated. Therefore, in the subsequent process of the bonding head 1 controlling the force of the chip, it is only necessary to control the current applied to the power component 12, so that the bonding head 1 can achieve precise force control of the chip, thereby facilitating the operation of the operator.

[0067] It should be noted that, in the first state, the nozzle rod 14 does not adsorb the chip, and the power component 12 and the sensor 13 are in contact. At this time, the external driving mechanism does not apply any force to the bonding head 1 until the nozzle rod 14 contacts the chip. The chip then applies a reverse force to the nozzle rod 14, thereby generating a second abutting force between the sensor 13 and the power component 12. The sensor 13 can quickly sense the second abutting force, and can accurately judge the contact state of the nozzle rod 14 and the chip through the change of the second abutting force relative to the first abutting force. Therefore, when the second abutting force is 0-5g, the sensor 13 can accurately sense the directional force applied by the chip to the nozzle rod 14, thereby realizing the precise force control of the bonding head 1 on the chip from 0-5g as the initial value.

[0068] Optionally, the first abutment force is smaller than the second abutment force. It should be noted that the first abutment force is the force applied by the power assembly 12 in the direction of the sensor 13, while the second abutment force is the force applied by the chip in the direction of the nozzle rod 14, that is, the force applied by the sensor 13 in the direction of the power assembly 12, that is, the directions of the first abutment force and the second abutment force are opposite. Since the first abutment force is smaller than the second abutment force, it is easier to calculate the relative force of the second abutment force relative to the first abutment force, thereby making it easier to accurately control the force of the bonding head 1 on the chip.

[0069] In some embodiments, see Figure 3As shown, the power assembly 12 includes a first motor 121 and a transmission member 122, one end of the transmission member 122 is connected to the power output end of the first motor 121, and the side of the sensor 13 away from the nozzle rod 14 is toward the end of the transmission member 122 away from the first motor 121; the bonding head 1 also includes a spring force control assembly 15, the spring force control assembly 15 is rotatably disposed on the shell 11 and connected to the nozzle rod 14, the nozzle rod 14 can move along the first direction relative to the spring force control assembly 15 to drive the transmission member 122 to move along the first direction.

[0070] It should be noted that the first direction is parallel to the axial direction of the nozzle rod 14, that is, Figure 3 The X direction in .

[0071] Among them, since one end of the transmission member 122 is connected to the power output end of the first motor 121, the side of the sensor 13 away from the nozzle rod 14 faces the end of the transmission member 122 away from the first motor 121. That is, in the first state, the nozzle rod 14 does not adsorb the chip, the transmission member 122 and the sensor 13 abut, and a first abutting force is generated between the transmission member 122 and the sensor 13; in the second state, the nozzle rod 14 adsorbs the chip, the transmission member 122 and the sensor 13 abut, and a second abutting force is generated between the transmission member 122 and the sensor 13.

[0072] Since the spring force control component 15 is rotatably disposed on the housing 11 and connected to the nozzle rod 14. On the one hand, the spring force control component 15 can be driven by external power to rotate relative to the housing 11, thereby driving the nozzle rod 14 to rotate relative to the housing 11, so that the position and angle of the nozzle rod 14 relative to the chip, and the position and angle of the chip relative to the wafer can be adjusted, so that it is more convenient for the bonding head 1 to adsorb the chip and the bonding between the chip and the wafer, thereby facilitating the operation of the operator. On the other hand, since the nozzle rod 14 can move along the first direction relative to the spring force control component 15 to drive the transmission member 122 to move along the first direction, during the movement of the nozzle rod 14 relative to the spring force control component 15, the spring force control component 15 can provide a guiding effect on the nozzle rod 14, and the spring force control component 15 can remove the friction effect on the nozzle rod 14, thereby eliminating the influence of friction on the force control accuracy of the bonding head 1, and can improve the accuracy and reliability of the chip control force of the bonding head 1.

[0073] In some embodiments, see Figure 3 and Figure 4 As shown, the spring force control assembly 15 includes at least two diaphragm springs 151, at least two diaphragm springs 151 are arranged at intervals along the first direction, at least two diaphragm springs 151 are each provided with a through hole, the axes of at least two diaphragm springs 151 are colinear, and the nozzle rod 14 is passed through the through hole.

[0074] In this way, the different parts of the nozzle rod 14 can be guided by at least two diaphragm springs 151 arranged at intervals, so that the nozzle rod 14 can be ensured to always extend along the first direction by applying forces to different parts of the nozzle rod 14, thereby avoiding the nozzle rod 14 from tilting. On the one hand, it can ensure that the nozzle rod 14 always moves normally during the movement; on the other hand, it can ensure that there is no friction between the nozzle rod 14 and the diaphragm spring 151 in the first direction, thereby eliminating the influence of friction on the force control accuracy of the bonding head 1, and can improve the accuracy and reliability of the bonding head 1 to control the chip force.

[0075] In some embodiments, see Figure 3 As shown, the laminating head 1 further comprises a detection assembly 16. At least a portion of the detection assembly 16 is connected to the transmission member 122, and is used to detect the displacement of the transmission member 122 along the first direction.

[0076] In this way, the present application can precisely control the force of the chip through the current of the power component 12 and the force sensed by the sensor 13, and can also precisely control the force of the chip through the detection component 16 in cooperation with the spring force control component 15, thereby further improving the accuracy of the precise force control of the chip by the bonding head 1.

[0077] Specifically, when the nozzle rod 14 moves relative to the spring force control component 15 in the first direction, the sensor 13 will be driven to move, and then the transmission member 122 will be driven to move. Since at least part of the detection component 16 is connected to the transmission member 122, the detection component 16 can move synchronously with the movement of the nozzle rod 14. Since the spring force control component 15 has a stable stiffness K, the chip can be precisely controlled by F=KX. Among them, F is the force of the bonding head 1 to adsorb the chip or the bonding between the chip and the wafer, K is the stiffness of the spring force control component 15, and X is the displacement of the detection component 16 along the first direction.

[0078] Since F=KX, the spring force control component 15 has a stable stiffness K, and the detection component 16 can accurately detect the displacement of the transmission member 122 along the first direction, so as to provide high-precision control force, and the control force accuracy can be within ±2g, and will not be affected by the friction force of the linear guide / cross ball guide.

[0079] In some embodiments, see Figure 3 As shown, the detection assembly 16 includes a grating ruler 161 and an encoder 162. The grating ruler 161 is arranged on the housing 11; the encoder 162 is connected to the transmission member 122.

[0080] In this way, the displacement of the transmission member 122 along the first direction can be detected more accurately through the movement of the encoder 162 relative to the grating ruler 161, thereby further improving the accuracy of the precise control of the chip by the bonding head 1.

[0081] Furthermore, when the nozzle rod 14 contacts the chip, the chip applies a reverse force to the nozzle rod 14, thereby generating a second abutting force between the sensor 13 and the power assembly 12, and the bonding head 1 switches from the first state to the second state. At this time, the nozzle rod 14 abuts against the chip, and the encoder 162 moves relative to the grating ruler 161, so that the displacement between the nozzle rod 14 and the chip can be accurately controlled by the displacement of the encoder 162 relative to the grating ruler 161, thereby achieving accurate control of the displacement of the chip by the bonding head 1. Based on this, it can be understood that the bonding head 1 of the present application can achieve both accurate force control and accurate displacement control of the chip.

[0082] In some embodiments, see Figure 3 As shown, the laminating head 1 further includes a second motor 17 and a transmission assembly 18. The second motor 17 is disposed on the housing 11; the transmission assembly 18 is connected between the power output end of the second motor 17 and the nozzle rod 14.

[0083] In this way, under the drive of the second motor 17, the transmission assembly 18 can be driven to drive the nozzle rod 14 to rotate relative to the housing 11, so that the position and angle of the nozzle rod 14 relative to the chip, and the position and angle of the chip relative to the wafer can be adjusted, so that it is more convenient for the bonding head 1 to adsorb the chip and the bonding between the chip and the wafer, thereby facilitating the operation of the operator. At the same time, since the second motor 17 is independent of the first motor 121 and the external driving mechanism, interference in the movement and rotation of the nozzle rod 14 can be avoided, thereby ensuring the normal movement of the nozzle rod 14.

[0084] In some embodiments, see Figure 3 As shown, the transmission assembly 18 includes a first transmission wheel 181, a second transmission wheel 182 and a transmission belt 183. The first transmission wheel 181 is connected to the power output end of the second motor 17; the second transmission wheel 182 is connected to the nozzle rod 14; and the transmission belt 183 is connected to the first transmission wheel 181 and the second transmission wheel 182.

[0085] In this way, the position of the second motor 17 relative to the nozzle rod 14 can be changed through the connection between the first transmission wheel 181, the second transmission wheel 182 and the transmission belt 183, so that the space inside the fitting head 1 can be reasonably designed and planned according to design requirements, thereby improving the space utilization inside the fitting head 1.

[0086] In some embodiments, see Figure 5 As shown, the nozzle rod 14 includes a hollow cavity; the laminating head 1 also includes a vacuum connector 19 connected to the cavity of the nozzle rod 14.

[0087] In this way, when the nozzle rod 14 contacts the chip, an external vacuum device can be connected through the vacuum joint 19 to evacuate the cavity of the nozzle rod 14, so that the nozzle rod 14 can adsorb the chip, thereby facilitating the operation of the operator.

[0088] In some embodiments, the sensor 13 is a pressure sensor 13 .

[0089] Thus, the pressure sensor 13 is a device or apparatus that can sense pressure signals and convert pressure signals into usable output electrical signals according to certain rules. The pressure sensor 13 is usually composed of a pressure sensitive element and a signal processing unit. On the one hand, due to the high accuracy of the pressure sensor 13, the precise force control of the bonding head 1 on the chip can be achieved; on the other hand, the pressure sensor 13 has a large measurement range, good durability, and long service life, thereby improving the reliability of the precise force control of the bonding head 1 on the chip. In addition, the pressure sensor 13 has good stability, thereby ensuring that the bonding head 1 can still stably and accurately control the force on the chip during long-term use.

[0090] In some embodiments, the first motor 121 is a voice coil motor.

[0091] Thus, the voice coil motor is a special form of direct drive motor. It has the characteristics of simple structure, small size, high speed, high acceleration and fast response. Its working principle is that when a powered coil (conductor) is placed in a magnetic field, a force will be generated, and the magnitude of the force is proportional to the current applied to the coil. The voice coil motor manufactured based on this principle can move in a straight line or in a circular arc. On the one hand, the voice coil motor can achieve an accuracy of up to several microns, which can further improve the precise control of the bonding head 1 on the chip; on the other hand, the voice coil motor has an extremely fast response speed and can complete the movement within a few milliseconds, thereby improving the efficiency of the bonding head 1 on the chip control process. In addition, the voice coil motor is noiseless when working, which can improve the operator's experience when using it.

[0092] The technical features of the above embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0093] The above embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A fitting head, characterized in that: include: case; A power assembly is arranged on the housing; A sensor, one side of the sensor faces the power assembly; A suction nozzle rod, one end of which is connected to a side of the sensor away from the power assembly, and the other end of which is used for adsorbing materials; The laminating head includes a first state and a second state; In the first state, the suction nozzle does not absorb the material, the power component abuts against the sensor, and a first abutting force is generated between the power component and the sensor; In the second state, the suction nozzle absorbs the material, the power component abuts against the sensor, and a second abutting force is generated between the power component and the sensor.

2. The laminating head according to claim 1, characterized in that: The power assembly includes a first motor and a transmission member, one end of the transmission member is connected to the power output end of the first motor, and the side of the sensor away from the nozzle rod faces the end of the transmission member away from the first motor; The laminating head further comprises a spring force control component, which is rotatably disposed on the housing and connected to the nozzle rod, and the nozzle rod can move along a first direction relative to the spring force control component to drive the transmission member to move along the first direction; Wherein, the first direction is parallel to the axial direction of the nozzle rod.

3. The laminating head according to claim 2, characterized in that: The spring force control component includes at least two diaphragm springs, which are arranged at intervals along the first direction. The at least two diaphragm springs are both provided with through holes, the axes of the at least two diaphragm springs are collinear, and the nozzle rod is passed through the through holes.

4. The laminating head according to claim 2, characterized in that: The fitting head also includes: A detection component, at least a portion of which is connected to the transmission member, and is used to detect the displacement of the transmission member along the first direction.

5. The laminating head according to claim 4, characterized in that: The detection component comprises: A grating ruler is arranged on the housing; An encoder is connected to the transmission member.

6. The laminating head according to claim 1, characterized in that: The fitting head also includes: A second motor is disposed on the housing; The transmission assembly is connected between the power output end of the second motor and the nozzle rod.

7. The laminating head according to claim 6, characterized in that: The transmission assembly comprises: A first transmission wheel connected to a power output end of the second motor; A second transmission wheel connected to the nozzle rod; A transmission belt is connected to the first transmission wheel and the second transmission wheel.

8. The laminating head according to claim 1, characterized in that: The nozzle rod includes a hollow cavity; The laminating head also includes a vacuum joint connected to the cavity of the nozzle rod.

9. The laminating head according to any one of claims 1 to 8, characterized in that: The sensor is a pressure sensor.

10. The laminating head according to any one of claims 2 to 5, characterized in that: The first motor is a voice coil motor.

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