Photosensitive resin composition, and photosensitive resin layer and color filter manufactured using same

Abstract

The invention relates to a photosensitive resin composition, a photosensitive resin layer manufactured by using the same, and a color filter. Specifically, one embodiment provides a photosensitive resin composition comprising (A) a binder resin; (B) a photopolymerizable compound; (C) a colorant; (D) a photopolymerization initiator; and (E) a solvent, in which the weight ratio of the binder resin to the photopolymerizable compound (binder resin / photopolymerizable compound) is 60 / 40 or more, the weight average molecular weight of the binder resin is 4,000 g / mol to 9,000 g / mol, and the weight average molecular weight of the photopolymerizable compound is 9,000 g / mol to 9,000 g / mol. And the photopolymerizable compound is a single hexa-functional photopolymerizable compound or a mixture of a hexa-functional photopolymerizable compound and a bifunctional photopolymerizable compound.

Description

Technical Field

[0001] The present disclosure relates to a photosensitive resin composition, a photosensitive resin layer produced using the same, and a color filter. Background Art

[0002] A CMOS image sensor (CIS) is a non-memory semiconductor that converts an image received by a camera into a digital signal, and is a collection of pixels such as a color filter, a photodiode, an amplifier, and the like.

[0003] Recently, as CIS for mobile devices requires more pixels and more cameras, the demand for thinner and smaller image sensors is increasing. In order to meet this demand, the photosensitive resin composition (photoresist, PR) of the color filter for CIS needs to achieve smaller pixels while forming finer patterns.

[0004] However, since the color filters used in CIS are composed of smaller pixels, the signal-to-noise ratio (SNR) becomes an important issue. Since the working principle of CIS is to convert external light transmitted through the color filter into an electrical signal through the photodiode, smaller pixels mean less incident light per pixel. In addition, as the pixels become smaller, the distance between pixels becomes closer, so the light transmitted from adjacent pixels may act as noise.

[0005] Typically, in the red, green and blue photosensitive resin compositions forming the color filter of the CIS device, the green photosensitive resin composition is first applied to form a pattern, then a blue or red photosensitive resin composition is applied thereon, and finally other red or blue photosensitive resin compositions are applied thereon to form a pattern. In this article, because the red or blue photosensitive resin composition is applied between the concave-convex patterns formed by the green photosensitive resin composition below, it can be filled with different filling degrees between the patterns according to the rheological properties of the composition, so the red or blue composition pattern actually formed between the green composition patterns can have a large thickness difference. In this article, the thicker the thickness, the stronger the color, and the thinner the thickness, the lighter the color, which confirms that thickness is an important factor in forming the color signal displayed by the pattern, and the thickness uniformity of the pattern plays a key role in operating the CIS device.

[0006] In this regard, after manufacturing the CIS device, the SNR characteristics of the CIS device should be checked to confirm not only that the chips forming one pixel have a high SNR but also that the chips existing within the entire substrate have a uniform SNR distribution (spatial SNR (S.SNR)). Summary of the invention

[0007] [Technical issues]

[0008] One embodiment provides a photosensitive resin composition having a low step difference between a pattern and a resin layer when forming the photosensitive resin layer on a patterned substrate, for the purpose of improving a signal-to-noise ratio (S.SNR) distribution of a CIS.

[0009] Another embodiment provides a photosensitive resin layer manufactured using the photosensitive resin composition.

[0010] Another embodiment provides a color filter manufactured using a photosensitive resin layer.

[0011]

Technical solution

[0012] One embodiment provides a photosensitive resin composition, comprising: (A) a binder resin; (B) a photopolymerizable compound; (C) a photopolymerization initiator; (D) a colorant; and (E) a solvent; wherein the weight ratio of the binder resin to the photopolymerizable compound (binder resin / photopolymerizable compound) is greater than or equal to 60 / 40; the weight average molecular weight of the binder resin is 4,000 g / mol to 9,000 g / mol; and the photopolymerizable compound is a hexafunctional photopolymerizable compound alone or a mixture of a hexafunctional photopolymerizable compound and a difunctional photopolymerizable compound.

[0013] When a photosensitive resin layer is formed on a patterned substrate using the photosensitive resin composition, the step difference according to Equation 1 may be less than or equal to

[0014] [Equation 1]

[0015] (Step difference) = A + BC

[0016] In Formula 1, A is the pattern height of the patterned substrate, B is the maximum height of the photosensitive resin layer formed in the region where the pattern of the patterned substrate exists, and C is the minimum height of the photosensitive resin layer formed in the region where the pattern of the patterned substrate does not exist.

[0017] The colorant may include a blue pigment, a violet pigment, or a combination thereof.

[0018] The photosensitive resin layer may be blue, and the pattern of the substrate may be green.

[0019] The acid value of the binder resin may be 30 KOHmg / g to 100 KOHmg / g.

[0020] The binder resin may be a hydrophobic acrylic binder resin.

[0021] The hexafunctional photopolymerizable compound may have a viscosity of 5,500 to 8,000 cps at 25°C.

[0022] The bifunctional photopolymerizable compound may have a viscosity of 600 to 700 cps at 25°C.

[0023] The solvent may include propylene glycol monomethyl ether acetate (PGMEA), n-butyl acetate (n-BA), ethylene glycol dimethyl ether, or a combination thereof.

[0024] The photosensitive resin composition may include, based on the total amount of the photosensitive resin composition, 0.5 to 15 wt % of (A) a binder resin; 0.1 to 10 wt % of (B) a photopolymerizable compound; 0.1 to 10 wt % of (C) a photopolymerization initiator; 0.5 to 15 wt % of (D) a colorant; and the balance (E) a solvent.

[0025] The photosensitive resin composition may further include malonic acid, 3-amino-1,2-propanediol, a silane coupling agent containing a vinyl group or a (meth)acryloyloxy group, a leveling agent, a surfactant, a radical polymerization initiator, or a combination thereof.

[0026] Another embodiment provides a photosensitive resin layer manufactured using the photosensitive resin composition.

[0027] Another embodiment provides a color filter including a photosensitive resin layer.

[0028] Another embodiment is a CMOS image sensor including a color filter.

[0029] Other embodiments of the invention are included in the detailed description below.

[0030]

Beneficial Effects

[0031] When a photosensitive resin layer is formed on a patterned substrate using the photosensitive resin composition according to one embodiment, the step difference between the formed pattern and the resin layer is small, so that the SNR distribution (S.SNR) of the CIS may be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a schematic diagram for explaining the step difference between the pattern and the resin layer. DETAILED DESCRIPTION

[0033] [Best Mode]

[0034] Hereinafter, embodiments of the present invention are described in detail. However, these embodiments are exemplary, and the present disclosure is not limited thereto.

[0035] As used herein, when no specific definition is otherwise provided, "substituted" means that at least one hydrogen of the compound is replaced by a halogen atom (F, Cl, Br or I), a hydroxyl group, a C1 to C20 alkoxy group, a nitro group, a cyano group, an amine group, an imino group, an azido group, a carboxamido group, a hydrazine group, a hydrazo group, a carbonyl group, a carbamoyl group, a thiol group, an ester group, an ether group, a carboxyl group or a salt thereof, a sulfonic acid group or a salt thereof, a phosphoric acid or a salt thereof, a C1 to C20 alkyl group, a C2 to C20 alkenyl group, a C2 to C20 alkynyl group, a C6 to C30 aryl group, a C3 to C20 cycloalkyl group, a C3 to C20 cycloalkenyl group, a C3 to C20 cycloalkynyl group, a C2 to C20 heterocycloalkyl group, a C2 to C20 heterocycloalkenyl group, a C2 to C20 heterocycloalkynyl group, or a combination thereof.

[0036] As used herein, when specific definition is not otherwise provided, "heterocycloalkyl", "heterocycloalkenyl", "heterocycloalkynyl" and "heterocycloalkylene" refer to the presence of at least one N, O, S or P in the cyclic compounds of cycloalkyl, cycloalkenyl, cycloalkynyl and cycloalkylene.

[0037] As used herein, when no specific definition is otherwise provided, "(meth)acrylate" means both "acrylate" and "methacrylate".

[0038] As used herein, when no definition is otherwise provided, the term "combination" refers to mixing or copolymerization. In addition, "copolymerization" refers to block copolymerization or random copolymerization, and "copolymer" refers to block copolymer or random copolymer.

[0039] In the chemical formulae in the present specification, unless a specific definition is otherwise provided, when a chemical bond is not drawn at a position where a chemical bond should be given, hydrogen is bonded to that position.

[0040] Furthermore, as used herein, when a specific definition is not otherwise provided, "*" refers to connection points having the same or different atoms or chemical formulas.

[0041] (Photosensitive resin composition)

[0042] One embodiment provides a photosensitive resin composition having a low step difference between a pattern and a resin layer when forming a photosensitive resin layer on a patterned substrate, for improving a signal-to-noise ratio (S.SNR) distribution of a CIS.

[0043] Specifically, Figure 1 This is a schematic diagram for explaining the step difference between the pattern and the resin layer. When a photosensitive resin layer is formed on a patterned substrate, a difference occurs between the height (A+B) corresponding to the sum of the substrate pattern height (A) and the maximum height (B) of the photosensitive resin layer formed in the substrate pattern-existing area and the minimum height (C) of the photosensitive resin layer formed in the substrate pattern-existing area.

[0044] The step difference of the pattern and the resin layer is affected by the type and ratio of transparent materials such as a binder resin, a photopolymerizable compound, and a solvent that contribute to pattern forming capability, but is not affected by a pigment that is directly related to color.

[0045] In this regard, one embodiment provides a photosensitive resin composition, including (A) a binder resin; (B) a photopolymerizable compound; (C) a photopolymerization initiator; (D) a colorant; and (E) a solvent; wherein the weight ratio of the binder resin to the photopolymerizable compound (binder resin / photopolymerizable compound) is greater than or equal to 60 / 40; the weight average molecular weight of the binder resin is 4,000 g / mol to 9,000 g / mol; and the photopolymerizable compound is a hexafunctional photopolymerizable compound alone or a mixture of a hexafunctional photopolymerizable compound and a difunctional photopolymerizable compound.

[0046] The photosensitive resin layer may be blue, and the pattern of the substrate may be green.

[0047] The colorant may include a blue pigment, a violet pigment, or a combination thereof, and a blue photosensitive resin layer may be manufactured using such a colorant.

[0048] When a photosensitive resin layer is formed on a patterned substrate using the photosensitive resin composition, the step difference according to Equation 1 is less than or equal to

[0049] [Equation 1]

[0050] (Step difference) = A + BC

[0051] In Equation 1, A is the pattern height of the patterned substrate, B is the maximum height of the photosensitive resin layer formed in the region where the pattern of the patterned substrate exists, and C is the minimum height of the photosensitive resin layer formed in the region where no pattern exists of the patterned substrate.

[0052] By experiment, after coating at a rpm capable of showing a predetermined thickness of each sample on a patterned substrate, SB was performed on a hot plate at 100°C to measure the thickness in the area where only PR was coated by using a TENCOR device. Subsequently, the surface profile of a pattern of about 1.4 um was measured by using an AFM (atomic force microscope) device manufactured by Park Systems. The line profile along a cross section through the pattern was measured using the surface profile data obtained by using the AFM device, which was used to obtain ΔY (nm) of the highest and lowest parts as the pattern / resin layer step difference.

[0053] ΔY (nm) is the same as the step difference according to Equation 1.

[0054] As described above, the thicker the thickness, the stronger the color, and the thinner the thickness, the lighter the color, and because thickness is an important factor for forming a color signal displayed by a pattern, thickness uniformity of a pattern plays a key role in operating a CMOS image sensor (CIS).

[0055] The photosensitive resin composition according to one embodiment may be controlled to have a value less than or equal to Specifically, less than or equal to Less than or equal to Less than or equal to Less than or equal to or less than or equal to The step difference is within the range according to Equation 1.

[0056] Specifically, since the binder resin / photopolymerizable compound has a higher weight ratio in the range of 60 / 40 or higher, since the binder resin has a weight average molecular weight closer to 4,000 g / mol in the range of 9,000 g / mol or lower, and further, since the difunctional photopolymerizable compound is controlled so as to be included in an amount ratio closer to 50 / 50 to the hexafunctional photopolymerizable compound that must be included, the step difference according to Equation 1 is reduced.

[0057] In the following, the influence on the step difference is examined.

[0058] SNR can be improved by adjusting the transmission spectrum of the pigment or dye in the visible ray region. The overlapping area of ​​each transmission spectrum of red, green and blue constituting the color filter is called crosstalk, which may act as noise for other colors, so it is important to design the transmission spectrum to minimize noise. For red and green, crosstalk can be improved by mixing yellow pigments, and for blue, by mixing violet pigments.

[0059] In addition to the transmission spectrum, there are also ways to improve luminous efficiency through surface characteristics. When the photosensitive resin composition forms a fine pattern, the surface roughness affects the SNR reduction, and after coating on the silicon wafer, the thickness deviation between the edge and the center of the wafer, the presence or absence of bumps and stripes, etc. may affect the S.SNR. These can be improved by changing the type, ratio, content, etc. of the resin, transparent material that contributes to pattern formation, rather than pigments directly related to color, monomers, solvents, additives, etc.

[0060] Binder resin / photopolymerizable compound weight ratio

[0061] In one embodiment, since the binder resin / photopolymerizable compound has a higher weight ratio in the range of 60 / 40 or more, the step difference according to Equation 1 may be lower.

[0062] Specifically, the binder resin / photopolymerizable compound may have a weight ratio of greater than or equal to 60 / 40 or greater than or equal to 70 / 30 and less than 100 / 1.

[0063] (A) Binder resin

[0064] In one embodiment, since the binder resin has a smaller weight average molecular weight closer to 4,000 g / mol within the range of less than or equal to 9,000 g / mol, the step difference according to Equation 1 is lower.

[0065] Specifically, the binder resin may have a weight average molecular weight of greater than or equal to 4,000 g / mol and less than or equal to 9,000 g / mol, less than or equal to 8,000 g / mol, less than or equal to 7,000 g / mol, or less than or equal to 6,000 g / mol.

[0066] If the binder resin has a weight average molecular weight within this range, excellent close contact characteristics with a substrate, satisfactory physical and chemical properties, and appropriate viscosity may be obtained.

[0067] The binder resin may have an acid value of about 30 KOHmg / g to about 100 KOHmg / g. If the binder resin has an acid value within this range, excellent pixel resolution may be obtained.

[0068] The binder resin may be a hydrophobic acrylic binder resin.

[0069] The binder resin may be a copolymer of a first ethylenically unsaturated monomer and a second ethylenically unsaturated monomer copolymerizable therewith, and is a resin including at least one acryl-based repeating unit.

[0070] The first ethylenically unsaturated monomer may be an ethylenically unsaturated monomer including at least one carboxyl group, and examples of the monomer may include acrylic acid, methacrylic acid, maleic acid, itaconic acid, fumaric acid, and combinations thereof.

[0071] The first ethylenically unsaturated monomer may be included in an amount of 5 wt % to 50 wt %, for example 10 wt % to 40 wt %, based on the total amount of the alkali soluble resin.

[0072] The second ethylenically unsaturated monomer can be an aromatic vinyl compound such as styrene, α-methylstyrene, vinyltoluene, vinylbenzyl methyl ether, etc.; an unsaturated carboxylic acid ester compound such as methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, benzyl (meth)acrylate, cyclohexyl (meth)acrylate, phenyl (meth)acrylate, etc.; an unsaturated carboxylic acid aminoalkyl ester compound such as 2-aminoethyl (meth)acrylate, 2-dimethylaminoethyl (meth)acrylate, etc.; a carboxylic acid vinyl ester compound such as vinyl acetate, vinyl benzoate, etc.; an unsaturated carboxylic acid glycidyl ester compound such as glycidyl (meth)acrylate; a vinyl cyanide compound such as (meth)acrylonitrile, etc.; an unsaturated amide compound such as (meth)acrylamide, etc.; and they can be used alone or as a mixture of two or more.

[0073] Specific examples of the binder resin may be methacrylic acid / benzyl methacrylate copolymer, methacrylic acid / benzyl methacrylate / styrene copolymer, methacrylic acid / benzyl methacrylate / 2-hydroxyethyl methacrylate copolymer, methacrylic acid / benzyl methacrylate / styrene / 2-hydroxyethyl methacrylate copolymer, and the like, but are not limited thereto, and these may be used alone or as a mixture of two or more.

[0074] The binder resin may be included in an amount of 0.5 wt % to 15 wt %, for example, 1 wt % to 5 wt %, based on the total amount of the photosensitive resin composition. When the binder resin is included within the above range, developability is excellent during the color filter manufacturing process, and crosslinking performance is improved, thereby obtaining excellent surface smoothness.

[0075] (B) Photopolymerizable compound

[0076] In one embodiment, the photopolymerizable compound is a hexafunctional photopolymerizable compound alone or a mixture of a hexafunctional photopolymerizable compound (first photopolymerizable compound) and a dual-energy photopolymerizable compound (second photopolymerizable compound).

[0077] When the amount of the bifunctional photopolymerizable compound is controlled closer to 50 / 50, the step difference according to Equation 1 becomes lower.

[0078] Specifically, when the bifunctional photopolymerizable compound (second photopolymerizable compound) is added, a weight ratio of the first / second photopolymerizable compound may be greater than or equal to 50 / 50 and less than or equal to 75 / 25.

[0079] The functional group included in each of the hexafunctional photopolymerizable compound and the bifunctional photopolymerizable compound may be a (meth)acrylate group.

[0080] The hexafunctional photopolymerizable compound may be dipentaerythritol hexaacrylate (DPHA) represented by the following chemical formula and have a viscosity of 5,500 to 8,000 cps at 25°C.

[0081]

[0082] The bifunctional photopolymerizable compound may be BPA(EO)10DA bisphenol A(EO)10 diacrylate represented by the following chemical formula and have a viscosity of 600 cps to 700 cps at 25°C.

[0083]

[0084] In the chemical formula, m+n=10.

[0085] The photopolymerizable compound may be included in an amount of 0.1 wt % to 15 wt %, for example 0.5 wt % to 5 wt %, based on the total amount of the photosensitive resin composition. If the photopolymerizable compound is included within the above range, sufficient curing occurs during exposure during pattern formation, resulting in excellent reliability and excellent developability using an alkaline developing solution.

[0086] (C) Photopolymerization initiator

[0087] The photopolymerization initiator may be an initiator commonly used in a photosensitive resin composition, such as an acetophenone compound, a benzophenone compound, a thioxanthone compound, a benzoin compound, a triazine compound, an oxime compound, or a combination thereof.

[0088] Examples of acetophenone compounds may include 2,2'-diethoxyacetophenone, 2,2'-dibutoxyacetophenone, 2-hydroxy-2-methylpropiophenone, p-tert-butyltrichloroacetophenone, p-tert-butyldichloroacetophenone, 4-chloroacetophenone, 2,2'-dichloro-4-phenoxyacetophenone, 2-methyl-1-(4-(methylthio)phenyl)-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, and the like.

[0089] Examples of benzophenone compounds may include benzophenone, benzoyl benzoate, benzoyl benzoate methyl ester, 4-phenylbenzophenone, hydroxybenzophenone, acrylated benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, 3,3'-dimethyl-2-methoxybenzophenone, and the like.

[0090] Examples of the thioxanthone compounds may include thioxanthone, 2-methylthioxanthone, isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, 2-chlorothioxanthone, and the like.

[0091] Examples of the benzoin-based compound may include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzyl dimethyl ketal, and the like.

[0092] Examples of the triazine compound may include 2,4,6-trichloro-s-triazine, 2-phenyl 4,6-bis(trichloromethyl)-s-triazine, 2-(3',4'-dimethoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, and 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine. -triazine, 2-biphenyl-4,6-bis(trichloromethyl)-s-triazine, bis(trichloromethyl)-6-phenylvinyl-s-triazine, 2-(naphthol-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphthol-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2,4-bis(trichloromethyl)-6-sunflower-s-triazine, 2,4-bis(trichloromethyl)-6-(4-methoxyphenylvinyl)-s-triazine, etc.

[0093] Examples of oxime compounds may be O-acyloxime compounds, 2-(O-benzoyloxime)-1-[4-(phenylthio)phenyl]-1,2-octanedione, 1-(O-acetyloxime)-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]ethanone, O-ethoxycarbonyl-α-oxyamino-1-phenylpropan-1-one, and the like. Specific examples of O-acyloxime compounds can be 1,2-octanedione, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one, 1-(4-phenylsulfanylphenyl)-butane-1,2-dione-2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octane-1,2-dione-2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octane-1,2-dione-2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octane-1-one oxime-O-acetate, 1-(4-phenylsulfanylphenyl)-butan-1-one oxime-O-acetate, and the like.

[0094] In addition to these compounds, the photopolymerization initiator may include carbazole compounds, diketone compounds, sulfonium borate compounds, diazo compounds, imidazole compounds, biimidazole compounds, fluorene compounds, and the like.

[0095] The photopolymerization initiator may be used together with a photosensitizer that can cause a chemical reaction by absorbing light and being excited and then transferring its energy.

[0096] Examples of the photosensitizer may be tetraethylene glycol bis-3-mercaptopropionate, pentaerythritol tetrakis-3-mercaptopropionate, dipentaerythritol tetrakis-3-mercaptopropionate, and the like.

[0097] The photopolymerization initiator may be included in an amount of 0.1 wt % to 5 wt %, for example, 1 wt % to 3 wt %, based on the total amount of the photosensitive resin composition. If the photopolymerization initiator is included within this range, sufficient photopolymerization occurs during exposure in a pattern forming process, excellent reliability may be achieved, heat resistance, light resistance and chemical resistance, resolution and close contact characteristics of the pattern may be improved, and a reduction in transmittance due to a non-reactive initiator may be prevented.

[0098] (D) Colorant

[0099] In one embodiment, the colorant may include a blue pigment, a violet pigment, or a combination thereof.

[0100] Examples of the blue pigment may include copper phthalocyanine pigments such as CI blue pigment 15:6, CI blue pigment 15, CI blue pigment 15:1, CI blue pigment 15:2, CI blue pigment 15:3, CI blue pigment 15:4, CI blue pigment 15:5, CI blue pigment 16, and the like.

[0101] Examples of the violet pigment may include CI violet pigment 1, CI violet pigment 19, CI violet pigment 23, CI violet pigment 27, CI violet pigment 28, CI violet pigment 29, CI violet pigment 30, CI violet pigment 32, CI violet pigment 37, CI violet pigment 40, CI violet pigment 42, CI violet pigment 50, or a combination thereof.

[0102] In addition, red pigment, green pigment, yellow pigment, black pigment, etc. may also be included.

[0103] Examples of the red pigment may include CI red pigment 254, CI red pigment 255, CI red pigment 264, CI red pigment 270, CI red pigment 272, CI red pigment 177, CI red pigment 89, and the like.

[0104] Examples of the green pigment include CI green pigment 7, CI green pigment 36, CI green pigment 58, CI green pigment 59, and the like.

[0105] Examples of the yellow pigment may include isoindoline pigments such as CI Yellow Pigment 139, quinophthalone pigments such as CI Yellow Pigment 138, and nickel complex pigments such as CI Yellow Pigment 150.

[0106] Examples of black pigments may include aniline black, perylene black, titanium black, carbon black, etc. The pigments may be used alone or in combination of two or more. For example, the pigment may be a yellow pigment, a green pigment, or a mixture thereof.

[0107] The pigment may be contained in the photosensitive resin composition for color filter in the form of a dispersion. Such a pigment dispersion may be composed of a pigment, a solvent, a dispersant, a dispersing resin, and the like.

[0108] The solvent may be ethylene glycol acetate, ethyl celulose, propylene glycol methyl ether acetate, ethyl lactate, polyethylene glycol, cyclohexanone, propylene glycol methyl ether, etc., and among them, propylene glycol methyl ether acetate may be preferably used.

[0109] The dispersant helps to evenly disperse the pigment in the dispersion, and any of nonionic, anionic or cationic dispersants can be used. Specifically, polyalkylene glycol or its ester, polyoxyalkylene, polyol ester alkylene oxide adduct, alcohol alkylene oxide adduct, sulfonic acid ester, sulfonate, carboxylate, carboxylate, alkylamide alkylene oxide adduct, alkylamine, etc. can be used, and can be used alone or in combination of two or more.

[0110] As the dispersing resin, an acrylic resin including a carboxyl group may be used, which can improve the stability of the pigment dispersion and the patterning ability of the pixel.

[0111] The colorant may further include an organic solvent-soluble dye.

[0112] Examples of organic solvent-soluble dyes may include triarylmethane compounds, anthraquinone compounds, benzylene compounds, xanthene compounds, phthalocyanine compounds, azaporphyrin compounds, indigo compounds, and the like.

[0113] When the dye and the pigment are mixed and used, they can be mixed and used in a weight ratio of 1: 9 to 9: 1, specifically, in a weight ratio of 3: 7 to 7: 3. When mixed within the above weight ratio range, chemical resistance, durability, and maximum absorption wavelength can be controlled within appropriate ranges, and high brightness and contrast can be expressed at desired color coordinates.

[0114] The photosensitive resin composition of the embodiment may include the colorant in an amount of 0.5 wt % to 15 wt %, for example, 1 wt % to 10 wt %, based on the total amount. When the colorant is included within the above range, color reproducibility is excellent, and hardening and close contact characteristics of the pattern are excellent.

[0115] (E) Solvent

[0116] The solvent may be a material that is compatible with but does not react with the colorant, the binder resin, the photopolymerizable compound, and the photopolymerization initiator.

[0117] Examples of the solvent may include alcohols such as methanol, ethanol, etc.; ethers such as dichloroethyl ether, n-butyl ether, diisoamyl ether, methyl phenyl ether, tetrahydrofuran, etc.; glycol ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, etc.; ceylulose acetates such as methyl ceylulose acetate, ethyl ceylulose acetate, diethyl ceylulose acetate, etc.; carbitols such as methyl ethyl carbitol, diethyl carbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol diethyl ether, etc.; propylene glycol alkyl ether acetates such as propylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, etc. methyl ether acetate, propylene glycol propyl ether acetate, etc.; aromatic hydrocarbons, such as toluene, xylene, etc.; ketones, such as methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, methyl-n-acetone, methyl-n-butyl ketone, methyl-n-pentanone, 2-heptanone, etc.; saturated aliphatic monocarboxylic acid alkyl esters, such as ethyl acetate, n-butyl acetate, isobutyl acetate, etc.; lactic acid esters, such as methyl lactate, ethyl lactate, etc.; oxyacetic acid alkyl esters, such as methyl oxyacetate, ethyl oxyacetate, butyl oxyacetate, etc.; alkoxyacetic acid alkyl esters, such as methoxyacetic acid methyl, methoxyethyl 3-Oxypropionic acid alkyl esters such as 3-Oxypropionic acid methyl ester, 3-Oxypropionic acid ethyl ester, etc.; 3-alkoxy propionic acid alkyl esters such as 3-methoxypropionic acid methyl ester, 3-methoxypropionic acid ethyl ester, 3-ethoxypropionic acid ethyl ester, 3-ethoxypropionic acid methyl ester, etc.; 2-Oxypropionic acid alkyl esters such as 2-Oxypropionic acid methyl ester, 2-Oxypropionic acid ethyl ester, 2-Oxypropionic acid propyl ester, etc.; 2-alkoxy propionic acid alkyl esters such as 2-methoxypropionic acid methyl ester, 2-methoxypropionic acid ethyl ester, 2-ethoxypropionic acid methyl ester, etc. ethyl 2-oxypropionate, methyl 2-ethoxypropionate, etc.; 2-oxy-2-methylpropionic acid esters such as methyl 2-oxy-2-methylpropionate, ethyl 2-oxy-2-methylpropionate, etc.; monooxymonocarboxylic acid alkyl esters of 2-alkoxy-2-methylpropionic acid alkyl esters such as methyl 2-methoxy-2-methylpropionate, ethyl 2-ethoxy-2-methylpropionate, etc.; esters such as 2-hydroxyethyl propionate, ethyl 2-hydroxy-2-methyl propionate, hydroxyethyl acetate, methyl 2-hydroxy-3-methyl butyrate, etc.; keto acid esters such as ethyl pyruvate, etc. In addition, high boiling point solvents such as N-methylformamide, N,N-dimethylformamide, N-methylformanilide, N-methylacetamide, N,N-dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, benzyl ethyl ether, dihexyl ether, acetylacetone, isophorone, caprylic acid, caprylic acid, 1-octanol, 1-nonanol, benzyl alcohol, benzyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, γ-butyrolactone, ethylene carbonate, propylene carbonate, phenyl celulose acetate, etc. can also be used.

[0118] Considering compatibility and reactivity, the solvent may be propylene glycol monomethyl ether acetate (PGMEA), n-butyl acetate (n-BA), ethylene glycol dimethyl ether, or a combination thereof.

[0119] The solvent may be included in a balance, for example, 70 wt % to 90 wt %, for example, 80 wt % to 90 wt % based on the total amount of the photosensitive resin composition. If the solvent is included within the above range, a coating film having excellent coatability of the photosensitive resin composition and excellent flatness may be obtained.

[0120] (F) Other additives

[0121] The photosensitive resin composition may further include at least one additive selected from malonic acid, 3-amino-1,2-propanediol, a coupling agent containing a vinyl or (meth)acryloyloxy group, a leveling agent, a surfactant, and a free radical polymerization initiator to prevent stains or spots during coating, adjust leveling, or prevent pattern residue due to non-development.

[0122] The additives can be easily adjusted depending on the desired physical properties.

[0123] The coupling agent may be a silane-based coupling agent, and examples of the silane-based coupling agent may include trimethoxysilylbenzoic acid, γ-methacryloxypropyltrimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane, γ-isocyanatepropyltriethoxysilane, γ-glycidyloxypropyltrimethoxysilane, β-epoxycyclohexyl)ethyltrimethoxysilane, which may be used alone or in a mixture of two or more types.

[0124] The silane-based coupling agent may be specifically used in an amount of 0.01 parts by weight to 1 parts by weight based on 100 parts by weight of the photosensitive resin composition.

[0125] Furthermore, if necessary, the photosensitive resin composition for a color filter may further include a surfactant such as a fluorine-based surfactant.

[0126] Examples of the fluorine-based surfactant may include F-482, F-484, and F-478 from DIC Co., Ltd., but are not limited thereto.

[0127] The surfactant may be desirably included in an amount of 0.01 wt % to 5 wt % and more desirably 0.01 wt % to 2 wt % based on the total amount of the photosensitive resin composition. If the above range is exceeded, the problem of foreign matter generation after development may be undesirably caused.

[0128] Furthermore, a certain amount of other additives such as antioxidants, stabilizers, etc. may be added to the photosensitive resin composition within a range that does not impair physical properties.

[0129] (Photosensitive resin layer)

[0130] According to another embodiment, provided is a photosensitive resin layer manufactured using the photosensitive resin composition according to one embodiment.

[0131] The method for producing the photosensitive resin layer is as follows.

[0132] The above-mentioned photosensitive resin composition is coated on a glass substrate to a thickness of, for example, 0.5 μm to 10 μm using an appropriate method such as spin coating, roll coating, or spray coating to form a photosensitive resin composition layer.

[0133] The photosensitive resin composition layer is converted into a photosensitive resin layer by baking at 80 to 100° C. for 170 to 190 seconds using a hot plate, exposing at a power of 450 to 470 mJ using an exposer, and further baking on a hot plate at 210 to 250° C. for 3 to 10 minutes.

[0134] The photosensitive resin layer may have a transmittance greater than or equal to 85%, and specifically greater than or equal to 97%, for example, greater than or equal to 90% in a wavelength range of 480nm to 620nm. In addition, in each wavelength range of less than 480nm and greater than 620nm, the photosensitive resin layer may have a transmittance less than or equal to 15%, specifically less than or equal to 13%, for example, less than or equal to 10%.

[0135] The photosensitive resin layer can have a thin thickness while achieving the above-mentioned spectral targets. Specifically, the photosensitive resin layer can have a thickness less than or equal to 0.5um, specifically less than or equal to 0.45um, and more specifically less than or equal to 0.4um, for example, less than or equal to 0.35um.

[0136] (Color Filter)

[0137] According to another embodiment, a color filter manufactured using the photosensitive resin composition is provided.

[0138] The method for manufacturing the above-mentioned color filter is as follows.

[0139] The photosensitive resin composition is coated on a glass substrate by a suitable method such as spin coating, roller coating, spray coating, etc. to form a photosensitive resin composition layer with a thickness of 0.5 μm to 10 μm.

[0140] Subsequently, a substrate with a photosensitive resin composition layer is irradiated with light to form a pattern required for a color filter. It can be irradiated by using UV, electron beams or X-rays as a light source, and UV can be radiated in a region of, for example, 190nm to 450nm and, for example, 200nm to 400nm. It can be irradiated by further using a photoresist mask. After the radiation process is performed in this way, the photosensitive resin composition layer exposed to the light source is treated with a developer. In this article, the unexposed area in the photosensitive resin composition layer is dissolved and a pattern for a color filter is formed. This process can be repeated many times according to the number of desired colors, thereby obtaining a color filter with a desired pattern. In addition, if the image pattern obtained by developing in the above process is cured by repeated heating or radiating actinic rays thereto, crack resistance, solvent resistance, etc. can be improved.

[0141] According to another embodiment, a CMOS image sensor including the above-mentioned color filter is provided.

[0142] [Invention Mode]

[0143] Hereinafter, the present invention will be described in more detail with reference to Examples. However, the following Examples are merely preferred examples of the present invention, and the present invention is not limited to the following Examples.

[0144] (Reference Example)

[0145] Preparation of photosensitive resin composition

[0146] Each photosensitive resin composition according to Reference Examples 1 to 15 was prepared according to the composition shown in Tables 1 to 3.

[0147] Specifically, a photopolymerization initiator was dissolved in a solvent and then stirred at room temperature for 30 minutes, and a binder resin, a photopolymerizable compound and an additive were added thereto and then stirred at room temperature for 60 minutes. Subsequently, a pigment dispersion as a colorant was added to the obtained reactant and then stirred at room temperature for 30 minutes. Then, the product obtained therefrom was filtered twice to remove impurities to prepare each photosensitive resin composition (solid content: 11.4wt%).

[0148] (Table 1)

[0149] (Unit: wt%)

[0150]

[0151]

[0152] (Table 2)

[0153] (Unit: wt%)

[0154]

[0155]

[0156] (Table 3)

[0157] (Unit: wt%)

[0158]

[0159] The materials described in Tables 1 to 3 are as follows.

[0160] (A) Binder resin

[0161] (A-1) Hydrophobic acrylic binder resin 1 (acid value: 34 KOHmg / g, molecular weight: 9,000 g / mol, double bond equivalent: 340 g / mol, product name: RY-92-M10, manufacturer: Showadenko)

[0162] (A-2) Hydrophobic acrylic binder resin 2 (acid value: 38 KOHmg / g, molecular weight: 4,000 g / mol, double bond equivalent: 360 g / mol, product name: RY-92-M4, manufacturer: Showadenko)

[0163] (A-3) Hydrophobic acrylic binder resin 3 (acid value: 90 KOHmg / g, molecular weight: 6,000 g / mol, double bond equivalent: 500 g / mol, product name: RY-99, manufacturer: Showadenko)

[0164] (A-4) Hydrophobic acrylic binder resin 4 (acid value: 35 KOHmg / g, molecular weight: 13,000 g / mol, double bond equivalent: 330 g / mol, product name: RY-92-M15, manufacturer: Showadenko)

[0165] (B) Photopolymerizable compound

[0166] (B-1) Hexafunctional photopolymerizable compound 1 represented by the following chemical formula (viscosity: 5,500 to 8,000 cps at 25° C., material name: dipentaerythritol hexaacrylate (DPHA), manufacturer: Nippon Kayaku Co. Ltd.)

[0167]

[0168] (B-2) Bifunctional photopolymerizable compound 1 represented by the following chemical formula (viscosity: 600 to 700 cps at 25° C., material name: BPA (EO) 10DA bisphenol A (EO) 10 diacrylate, product name: M2100, manufacturer: Miwon Commercial Co., Ltd.)

[0169]

[0170] In the above chemical formula, m+n=10.

[0171] (B-3) Hexafunctional photopolymerizable compound 2 represented by the following chemical formula (viscosity: 6950 cps at 25° C., material name: polydipentaerythritol acrylate, product name: A-9550, manufacturer: Shin-Nakamura)

[0172]

[0173] In the above chemical formula, R is a hydrogen atom or *-(C=O)CH=CH2.

[0174] (B-4) Hexafunctional photopolymerizable compound 3 represented by the following chemical formula (viscosity: 900 to 2000 cps at 25° C., product name: DPCA60, manufacturer: Nippon Kayaku Co. Ltd.)

[0175]

[0176] (B-5) Hexafunctional photopolymerizable compound 4 (viscosity: 390 cps at 25° C., product name: A-DPH-6E, manufacturer: Shin-Nakamura)

[0177]

[0178] In the above chemical formula, a+b+c+d+e+f=6.

[0179] (B-6) Bifunctional photopolymerizable compound 2 (viscosity: 600 to 700 cps at 25° C., material name: ethoxylated bisphenol A diaryl ester, product name: ABPE-20, manufacturer: Shin-Nakamura)

[0180]

[0181] In the above chemical formula, m+n=2.

[0182] (B-7) Tetrafunctional photopolymerizable compound (viscosity: 230 cps at 25° C., material name: ethoxylated diglycerol tetraacrylate, product name: DGE4A, manufacturer: Gongyoung Company)

[0183]

[0184] In the above chemical formula, a+b+c+d=4.

[0185] (C) Photopolymerization initiator

[0186] (C-1) Oxime initiator (OXE-01 series, product name: SPI03, manufacturer: Samyang Corporation)

[0187] (D) Colorant

[0188] (D-1) Blue pigment B15:6 / violet pigment V23 = pigment dispersion mixed at a ratio of 77 / 23 (product name: BA1442, manufacturer: Sanyo)

[0189] (E) Solvent

[0190] (E-1) Propylene glycol monomethyl ether acetate (PGMEA, manufacturer: DAICEL)

[0191] (E-2) n-butyl acetate (n-BA, manufacturer: ENF)

[0192] (E-3) Ethylene glycol dimethyl ether (Product name: EDM-S, Manufacturer: Toho Chemical)

[0193] (F) Additives

[0194] (F-1) Antioxidant 4-methoxyphenol (MHQ, manufacturer: Weifang TongRun Chem)

[0195] (F-2) Fluorine surfactant (F-556, manufacturer: DIC)

[0196] (F-3) Silane coupling agent (KBM-503, manufacturer: ShinEtsu)

[0197] (Evaluation method)

[0198] A photosensitive resin layer was formed on a patterned substrate using each of the photosensitive resin compositions according to Reference Examples 1 to 15, and then the step difference between the pattern and the resin layer and the S.SNR were evaluated. The specific evaluation method is as follows.

[0199] (1) Evaluation method of the step difference between the pattern and the resin layer: By using a coating machine manufactured by MIKASA Co., Ltd., on an 8-inch silicon wafer substrate surface-treated with an APL solution, green PR was coated to a thickness of 4500A, soft-baked (SB) on a hot plate at 100°C, and exposed under the conditions of dose: 600ms / focus: -0.2um by using an i-line stepper. During the exposure process, the pattern thickness was measured by using a TENCOR device, and then the pattern substrate was developed to display the pattern. Here, a TMAH solution was used as a developing solution, and the time (seconds) (BP) taken for the pattern to appear was measured. Here, BP is about 5 seconds or less. After the development and washing process, the pattern thickness was measured again, and then the pattern substrate was hard-baked (HB) on a hot plate at 230°C for 5 minutes to complete the pattern formation.

[0200] Blue PR was coated on a substrate on which a green pattern was formed at a rpm capable of obtaining a predetermined thickness for each sample, and then after SB was performed on a 100°C hot plate, the thickness of the area coated with only blue PR was measured by using a TENCOR device. Subsequently, the surface profile of a pattern of about 1.4 um was measured by using an AFM (atomic force microscope) device manufactured by Park Systems. The line profile along a cross section through the green pattern was measured using the surface profile data obtained by the AFM device, wherein ΔY (nm) of the highest and lowest portions was obtained as the step difference between the green pattern and the blue resin layer.

[0201] According to Equation 1, ΔY (nm) is equal to the step difference.

[0202] Evaluation 1: Influence of the weight ratio of binder resin / photopolymerizable compound

[0203] First, the influence of the weight ratio of the binder resin / photopolymerizable compound was evaluated by examining Reference Examples 1 to 5.

[0204] (Table 4)

[0205]

[0206] (Table 5)

[0207]

[0208]

[0209] Referring to Tables 4 and 5, it is confirmed that the pattern / resin layer step difference changes according to the weight ratio of the binder resin / photopolymerizable compound. Specifically, when other conditions such as the type of the binder resin, the type of the photopolymerizable compound, etc. are the same, the higher the weight ratio of the binder resin / photopolymerizable compound, the lower the pattern / resin layer step difference.

[0210] Evaluation 2: Influence of the weight average molecular weight of the binder resin

[0211] The influence of the weight average molecular weight of the binder resin was evaluated by examining Reference Examples 3 and 6 to 8.

[0212] (Table 6)

[0213]

[0214] (Table 7)

[0215]

[0216] Referring to Tables 6 and 7, it is confirmed that the pattern / resin layer step difference varies according to the weight average molecular weight of the binder resin. Specifically, when other conditions such as the weight ratio of the binder resin / photopolymerizable compound, the type of the photopolymerizable compound, etc. are the same, the higher the molecular weight of the binder, the lower the pattern / resin layer step difference.

[0217] Evaluation 3: Effect of adding a bifunctional photopolymerizable compound or a tetrafunctional photopolymerizable compound

[0218] The effect of adding a bifunctional photopolymerizable compound or a tetrafunctional photopolymerizable compound was evaluated by examining Reference Examples 9 to 12.

[0219] (Table 8)

[0220]

[0221] (Table 9)

[0222]

[0223] Referring to Tables 8 and 9, it was confirmed that the pattern / resin layer step difference changed according to the addition of the bifunctional photopolymerizable compound or the tetrafunctional photopolymerizable compound. Specifically, when other conditions such as the weight ratio of the binder resin / photopolymerizable compound, the type of the binder resin, the type of the hexafunctional photopolymerizable compound, etc. were the same, it was confirmed that the pattern / resin layer step difference decreased due to the addition of the bifunctional photopolymerizable compound or the tetrafunctional photopolymerizable compound. In addition, when the bifunctional photopolymerizable compound was added instead of the tetrafunctional photopolymerizable compound, the pattern / resin layer step difference was as low as less than 1.5×10 Å.

[0224] Evaluation 4: Effect of changing the type of hexafunctional photopolymerizable compound

[0225] The effect of the type of hexafunctional photopolymerizable compound was evaluated by examining Reference Examples 13 to 15.

[0226] (Table 10)

[0227]

[0228] (Table 11)

[0229]

[0230] With reference to Tables 10 and 11, it is confirmed that the pattern / resin layer step difference varies depending on the type of the hexafunctional photopolymerizable compound. Specifically, when other conditions such as the weight ratio of the binder resin / photopolymerizable compound, the type of the binder resin, the type and addition amount of the bifunctional photopolymerizable compound, etc. are the same, it is confirmed that the pattern / resin layer step difference varies depending on the type of the hexafunctional photopolymerizable compound.

[0231] (Example)

[0232] Preparation of photosensitive resin composition

[0233] Each photosensitive resin composition according to Examples 1 to 4 was prepared to have the composition shown in Table 12.

[0234] Specifically, a photopolymerization initiator is dissolved in a solvent, and then stirred at room temperature for 30 minutes, and a binder resin, a photopolymerizable compound and an additive are added thereto, and then stirred at room temperature for 60 minutes. Subsequently, a pigment dispersion as a colorant is added to the reactant, and then stirred at room temperature for 30 minutes. Then, the product obtained therefrom is filtered twice to remove impurities to prepare a photosensitive resin composition.

[0235] (Table 12)

[0236] (Unit: wt%)

[0237]

[0238] The materials used in Table 12 are the same as those described above.

[0239] Evaluation 5: Influence of Various Factors Examples 1 to 4 were evaluated in the same manner as described above.

[0240] (Table 13)

[0241]

[0242]

[0243] (Table 14)

[0244]

[0245] Referring to Tables 13 and 14, considering multiple factors, it is confirmed that Examples 1 to 4 significantly reduce the step difference between the pattern and the resin layer to Specifically, since the binder resin / photopolymerizable compound is controlled to have a higher weight ratio in the range of 60 / 40 or more, since the binder resin is controlled to have a smaller weight average molecular weight (which is closer to 4,000 g / mol in the range of 9,000 g / mol or less), and since the bifunctional photopolymerizable compound is controlled to have an amount ratio closer to 50 / 50 with the hexafunctional photopolymerizable compound that must be contained, the pattern / resin layer step difference is significantly reduced to 100%. or smaller.

[0246] While the invention has been described in connection with what are presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but on the contrary, the invention is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

Claims

1. A photosensitive resin composition comprising: (A) a binder resin; (B) a photopolymerizable compound; (C) a photopolymerization initiator; (D) colorants; and (E) Solvent in, A weight ratio of the binder resin to the photopolymerizable compound (binder resin / photopolymerizable compound) is greater than or equal to 60 / 40; The binder resin has a weight average molecular weight of 4,000 g / mol to 9,000 g / mol; and The photopolymerizable compound is a hexafunctional photopolymerizable compound alone or a mixture of a hexafunctional photopolymerizable compound and a bifunctional photopolymerizable compound.

2. The photosensitive resin composition according to claim 1, wherein When a photosensitive resin layer is formed on a patterned substrate using the photosensitive resin composition, the step difference according to Equation 1 is less than or equal to [Equation 1] (Step difference) = A + BC Where, in equation 1, A is the pattern height of the patterned substrate, B is the maximum height of the photosensitive resin layer formed in the region where the pattern of the patterned substrate exists, and C is the lowest height of the photosensitive resin layer formed in a region of the patterned substrate where no pattern exists.

3. The photosensitive resin composition according to claim 2, wherein The colorant includes a blue pigment, a violet pigment, or a combination thereof.

4. The photosensitive resin composition according to claim 2, wherein The photosensitive resin layer is blue, and the pattern of the substrate is green.

5. The photosensitive resin composition according to claim 1, wherein The binder resin has an acid value of 30 to 100 KOHmg / g.

6. The photosensitive resin composition according to claim 1, wherein The binder resin is a hydrophobic acrylic binder resin.

7. The photosensitive resin composition according to claim 1, wherein The hexafunctional photopolymerizable compound has a viscosity of 5,500 cps to 8,000 cps at 25°C.

8. The photosensitive resin composition according to claim 1, wherein The bifunctional photopolymerizable compound has a viscosity of 600 to 700 cps at 25°C.

9. The photosensitive resin composition according to claim 1, wherein The solvent includes propylene glycol monomethyl ether acetate (PGMEA), n-butyl acetate (n-BA), ethylene glycol dimethyl ether, or a combination thereof.

10. The photosensitive resin composition according to claim 1, wherein Based on the total amount of the photosensitive resin composition, the photosensitive resin composition comprises: 0.5wt% to 15wt% of the (A) binder resin; 0.1 wt % to 10 wt % of the (B) photopolymerizable compound; 0.1 wt % to 10 wt % of the (C) photopolymerization initiator; 0.5 wt % to 15 wt % of the (D) colorant; and The balance is the (E) solvent.

11. The photosensitive resin composition according to claim 1, wherein The photosensitive resin composition further comprises malonic acid, 3-amino-1,2-propanediol, a silane coupling agent containing a vinyl group or a (meth)acryloyloxy group, a leveling agent, a surfactant, a free radical polymerization initiator or a combination thereof. 12 . A photosensitive resin layer produced using the photosensitive resin composition according to claim 1 . 13 . A color filter comprising the photosensitive resin layer according to claim 12 .

14. A CMOS image sensor comprising the color filter according to claim 13.

Images