Resin composition for support plate packaging, laminated film, laminated film product and preparation method and application of laminated film product

Abstract

The invention discloses a resin composition for packaging a support plate, a laminated film, a laminated film product and a preparation method and application thereof, and the resin composition for packaging the support plate comprises the following raw materials in parts by mass: 40-80 parts of epoxy resin, 10-20 parts of organic silicon modified epoxy resin, 3-45 parts of a curing agent and 0.1-5 parts of a curing accelerator, 0.1-5 parts by mass of a silane coupling agent and 100-900 parts by mass of a heat-conducting filler; wherein the epoxy resin comprises liquid bisphenol A epoxy resin and novolac epoxy resin, and the dosage of the liquid bisphenol A epoxy resin is 20-40 parts by mass. The laminated film provided by the invention has more excellent working performance and higher reliability, and can meet the requirements of an FC-BGA package carrier.

Description

Technical Field

[0001] The present application relates to the technical field of FC-BGA high-level IC packaging, and specifically to a resin composition for substrate packaging, a laminated film, a laminated film product, and a preparation method and application thereof. Background Art

[0002] In recent years, with the rapid development of technologies such as 5G, AI, and big data, the market demand for high-performance CPUs, GPUs, ASICs and other devices has also increased. As an advanced packaging process, FC-BGA (flip chip ball grid array) packaging technology is used in the packaging of high-performance CPUs, GPUs, ASICs and other devices. However, as semiconductor equipment develops in the direction of high power and miniaturization, higher requirements are placed on the thermal management of the equipment. Therefore, higher requirements are also placed on the FC-BGA packaging substrate, requiring the laminate film to have better working performance and higher reliability. Summary of the invention

[0003] The purpose of the present application is to provide a resin composition for substrate packaging, a laminated film, a laminated film product, and a preparation method and application thereof. The resin composition, the laminated film, and the laminated film product have better working performance and higher reliability.

[0004] The first aspect of the present application provides a resin composition for substrate encapsulation, comprising the following raw materials in parts by weight: 40-80 parts by weight of epoxy resin, 10-20 parts by weight of organosilicon-modified epoxy resin, 3-45 parts by weight of curing agent, 0.1-5 parts by weight of curing accelerator, 0.1-5 parts by weight of silane coupling agent, and 100-900 parts by weight of thermal conductive filler; wherein the epoxy resin comprises liquid bisphenol A epoxy resin and novolac epoxy resin, and the amount of liquid bisphenol A epoxy resin is 20-40 parts by weight; and the organosilicon-modified epoxy resin is an organosilicon resin terminated by epoxy groups at both ends.

[0005] In some embodiments, the organosilicon-modified epoxy resin is selected from a first organosilicon-modified epoxy resin and / or a second organosilicon-modified epoxy resin; the chemical structural formulas of the first organosilicon-modified epoxy resin and the second organosilicon-modified epoxy resin are shown in Formula (I) and Formula (II), respectively: (I) Among them, R 1 ~R 8 and are independently an alkyl group having less than 10 carbon atoms or a phenyl group.

[0006] In some embodiments, the epoxy resin further includes dicyclopentadiene epoxy resin and / or tetramethylbiphenyl epoxy resin.

[0007] In some embodiments, a preferred embodiment of the resin composition for substrate encapsulation comprises the following raw materials in parts by weight: 40-80 parts by weight of epoxy resin, 10-20 parts by weight of organosilicon-modified epoxy resin, 3-45 parts by weight of curing agent, 0.1-5 parts by weight of curing accelerator, 0.1-5 parts by weight of silane coupling agent, and 100-900 parts by weight of thermal conductive filler; wherein the epoxy resin comprises liquid bisphenol A epoxy resin, novolac epoxy resin and tetramethyl biphenyl epoxy resin, the amount of liquid bisphenol A epoxy resin is 20-35 parts by weight, and the amount of tetramethyl biphenyl epoxy resin is 10-20 parts by weight; the organosilicon-modified epoxy resin is an organosilicon resin terminated by epoxy groups at both ends.

[0008] In some embodiments, the curing agent is selected from an amine curing agent, an anhydride curing agent or a phenolic resin curing agent.

[0009] In some embodiments, the curing accelerator is selected from an organic phosphine accelerator, an imidazole accelerator, an organic urea accelerator or a tertiary amine accelerator.

[0010] A second aspect of the present application provides a laminated film, which is obtained by subjecting the above-mentioned resin composition to a film-forming treatment.

[0011] A third aspect of the present application provides a laminated film product, comprising a first release film, a second release film, and a laminated film bonded between the first release film and the second release film, wherein the laminated film is obtained by film-forming treatment of the above-mentioned resin composition.

[0012] A fourth aspect of the present application provides a method for preparing a laminated film product, comprising: (1) adding epoxy resin, silicone-modified epoxy resin, silane coupling agent and thermal conductive filler according to parts by mass into a solvent and mixing; (2) adding a curing agent and a curing accelerator according to parts by mass and mixing again to obtain a slurry; (3) The slurry is coated on a first release film, and after drying, a laminated film is formed on the first release film, and a second release film is laminated on the laminated film to obtain a laminated film product.

[0013] A fifth aspect of the present application provides application of the above-mentioned laminated film in FC-BGA carrier board packaging.

[0014] Compared with the prior art, this application has the following advantages and beneficial effects: 1. The resin matrix in the present application is composed of epoxy resin and silicone-modified epoxy resin, which can significantly reduce the rheological viscosity of the resin composition system. The lower rheological viscosity can improve the working performance of the laminated film; in addition, the cold and hot cycle performance of the resin composition system can be significantly improved, so that the laminated film has higher stability and reliability; 2. In the preferred embodiment, the addition of tetramethylbiphenyl epoxy resin can further improve the thermal conductivity, adhesion, stability and reliability of the laminated film. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the structure of the laminated film product in this application; Figure 2 A schematic diagram of the use of the laminated film product in this application; Description of the drawings: 1- laminating film, 2- first release film, 3- second release film, 4- chip, 5- carrier board, 6- support film. DETAILED DESCRIPTION

[0016] In order to make the purpose, technical solutions and beneficial effects of the present application more clear, the present application is further described in detail below in conjunction with specific implementation methods.

[0017] The resin composition for substrate packaging provided in the embodiment of the present application includes the following raw materials in parts by mass: 40-80 parts by mass of epoxy resin, 10-20 parts by mass of silicone-modified epoxy resin, 3-45 parts by mass of curing agent, 0.1-5 parts by mass of curing accelerator, 0.1-5 parts by mass of silane coupling agent, and 100-900 parts by mass of thermal conductive filler.

[0018] In the present application, epoxy resin and organosilicon modified epoxy resin constitute the resin matrix. In some embodiments, the epoxy resin is used in an amount of 42-71 parts by mass, 42-72 parts by mass, 42-79 parts by mass, 71-72 parts by mass, 71-79 parts by mass, 72-79 parts by mass. The epoxy resin includes liquid bisphenol A epoxy resin and novolac epoxy resin, wherein the liquid bisphenol A epoxy resin is used in an amount of 15-60 parts by mass, and in some embodiments, the liquid bisphenol A epoxy resin is used in an amount of 20-40 parts by mass, 20-35 parts by mass or 35-40 parts by mass.

[0019] Further, liquid bisphenol A epoxy resin preferably has an epoxy value of 0.35-0.55, and novolac epoxy resin preferably has an epoxy value of 0.35-0.55. In certain embodiments, novolac epoxy resin selects o-cresol novolac epoxy resin. In certain embodiments, epoxy resin also includes dicyclopentadiene epoxy resin and / or tetramethyl biphenyl epoxy resin, and the amount of dicyclopentadiene epoxy resin is 16 parts by mass, and the amount of tetramethyl biphenyl epoxy resin is 10-20 parts by mass.

[0020] In the present application, the organosilicon-modified epoxy resin significantly improves the working performance and reliability of the resin composition by acting together with the epoxy resin. In the present application, the total amount of the organosilicon-modified epoxy resin and the liquid bisphenol A epoxy resin is 20-65 parts by mass, further 30-60 parts by mass; in some embodiments, the total amount of the organosilicon-modified epoxy resin and the liquid bisphenol A epoxy resin is 32-47 parts by mass, 32-55 parts by mass, 32-60 parts by mass, 47-55 parts by mass, 47-60 parts by mass or 55-60 parts by mass; and wherein the amount of the organosilicon-modified epoxy resin is 10-20 parts by mass, further 12-20 parts by mass in some embodiments.

[0021] The inventors have verified through experiments that when the total amount of silicone-modified epoxy resin and liquid bisphenol A epoxy resin is less than 20 parts by mass, the surface of the laminated film is dry and brittle, and it is not easy to form a film; when the total amount is higher than 65 parts by mass, the surface of the laminated film is too wet, easy to flow, and difficult to separate from the release film.

[0022] The organosilicon-modified epoxy resin is an organosilicon resin terminated by epoxy groups at both ends. In some embodiments, the organosilicon-modified epoxy resin is selected from a first organosilicon-modified epoxy resin and / or a second organosilicon-modified epoxy resin, and the chemical structural formulas of the first organosilicon-modified epoxy resin and the second organosilicon-modified epoxy resin are shown in the following formula (I) and formula (II), respectively.

[0023] (I) In formula (I), R 1 , R 2 , R 3 , R 4 The first organosilicon-modified epoxy resin has an increased rheological viscosity and a decreased compatibility with other epoxy resin components.

[0024] In formula (II), R 5 , R 6 , R 7 , R 8 The second organosilicon-modified epoxy resin has an increased rheological viscosity and a decreased compatibility with other epoxy resin components.

[0025] Furthermore, in some embodiments, the first organosilicon-modified epoxy resin is prepared by a hydrosilylation reaction of organosilicon resin tetramethyldisiloxane (see formula (III)) and allyl glycidyl ether (see formula (IV)), wherein R 1 -R 4 All are methane.

[0026] Furthermore, in some embodiments, the second organosilicon-modified epoxy resin is prepared by a hydrosilylation reaction of organosilicon resin tetramethyldisiloxane (see formula (III)) and 4-vinylcyclohexyl oxide (see formula (V)), wherein R 5 -R 8 All are methane. (III) (IV) (V) The above-mentioned hydrosilylation reaction is as follows: in a nitrogen atmosphere, 100 parts by mass of tetramethyldisiloxane and 100-300 parts by mass of allyl glycidyl ether or 4-vinyl cyclohexene oxide are taken, a reaction solvent, a catalyst and a polymerization inhibitor are added, and a hydrosilylation reaction is carried out at a temperature of 80°C-90°C for 2h-10h to obtain an organosilicon-modified epoxy resin. In some embodiments, the reaction solvent is toluene, the catalyst is chloroplatinic acid or chloroplatinic acid-isopropanol solution, and the polymerization inhibitor is 4-methoxyphenol or / and hydroquinone.

[0027] The curing agent is used to react with the epoxy resin under the catalytic action of the curing accelerator at a certain temperature to change the glue system from a liquid state to a solid state. The curing agent in this application can be selected from amine curing agents, acid anhydride curing agents or phenolic resin curing agents, and is added in a conventional amount; preferably dicyandiamide curing agents or linear phenolic resin curing agents.

[0028] The curing accelerator is used as a catalyst for the crosslinking reaction, mainly used to adjust the curing time, and can be added in conventional amounts. In the present application, the curing accelerator can be selected from organic phosphine accelerators, imidazole accelerators, organic urea accelerators or tertiary amine accelerators; preferably imidazole accelerators, such as 2-ethyl-4-methylimidazole, to ensure that the composition can undergo a crosslinking curing reaction within a suitable temperature and time range.

[0029] Thermally conductive fillers are used to adjust the thermal conductivity and thermal expansion of the system. Generally speaking, the addition of thermally conductive fillers can improve thermal conductivity and reduce thermal expansion. In the present application, thermally conductive fillers can be selected from one or more of aluminum oxide, magnesium oxide, zinc oxide, silicon nitride, boron nitride, and silicon carbide. The particle size of the thermally conductive filler is preferably 0.01um-30um, and it can also be composed of a combination of different particle size gradations. During specific implementation, the type and amount of thermally conductive filler can be selected according to the product's demand for thermal conductivity. For similar thermally conductive fillers, generally speaking, the more the amount is used, the higher the thermal conductivity. The amount of thermally conductive filler should generally be controlled to be 100-900 parts by mass. In some embodiments, the amount of thermally conductive filler is 350-400 parts by mass.

[0030] Silane coupling agent is used to enhance the compatibility between the resin matrix and the inorganic filler to further improve the stability of the product.

[0031] The laminated film provided in the embodiment of the present application is obtained by subjecting the above-mentioned resin composition to a film-forming treatment.

[0032] The structure of the laminated film product provided in the embodiment of the present application is shown in Figure 1 , including a first release film 2, a second release film 3, and a laminated film 1 attached between the first release film 2 and the second release film 3. In some embodiments, the first release film 2 and the second release film 3 are both PET films. In some embodiments, the laminated film product has a thickness of 10um-500um, and further 15um-300um.

[0033] The preparation method of the laminated film product provided in the embodiment of the present application is as follows: (1) adding epoxy resin, silicone-modified epoxy resin, silane coupling agent and thermal conductive filler according to parts by mass into a solvent and mixing; (2) adding a curing agent and a curing accelerator according to parts by mass and mixing again to obtain a slurry; (3) The slurry is coated on a release film, and after drying, a laminated film is formed on the release film, and another release film is laminated on the laminated film to obtain a laminated film product.

[0034] In some embodiments, the mixing in step (1) and step (2) is performed in a planetary mixer.

[0035] In some embodiments, the solvent in step (1) is selected from a mixture of one or more of propylene glycol methyl ether acetate, ethylene glycol butyl ether acetate, methyl isobutyl ketone, butyl acetate, and cyclohexanone.

[0036] In some embodiments, the mixing in step (1) is: mixing at a temperature of 100° C. to 150° C. for 0.5 h to 3 h.

[0037] In some embodiments, the mixing in step (2) is: mixing at a temperature of 20°C-60°C for 20 min-60 min.

[0038] The laminated film in this application can be applied to FC-BGA substrate packaging; see Figure 2 , which shows a schematic diagram of the use of the laminated film product, the chip 4 and the FC-BGA carrier 5 are placed on the support film 6, and the laminated film 1 is hot-pressed on the FC-BGA carrier 5, so that the laminated film 1 is fully infiltrated with the FC-BGA carrier 5 and fills around the chip 4, and the chip 4 is also embedded; after the hot pressing is completed, it is cured.

[0039] In some embodiments, the hot pressing temperature is 80°C-150°C, the pressure is 1Kg-5Kg, and the pressure is maintained for 1 minute to 10 minutes; the curing is divided into two stages: the first stage is cured at 80-120°C for 20-60 minutes, and the second stage is cured at 150-200°C for 60-120 minutes.

[0040] The raw materials used in the embodiments and comparative examples are as follows: Liquid bisphenol A epoxy resin: CAS number: 25068-38-6; manufacturer: Nan Ya 128; o-Cresol novolac epoxy resin: Nan Ya NPCN-703; Dicyclopentadiene phenol epoxy resin: TaiLuck-TJ100, Changchun, Taiwan, China; Tetramethylbiphenyl epoxy resin: CAS No.: 85954-11-6; Manufacturer: Changchun YX-4000, Taiwan, China; Curing agent: dicyandiamide: CAS No. 461-58-5, Xinxi Metallurgical Chemical; linear phenolic resin: CAS No. 65733-76-8, Kelon KPH-F2004; Accelerator: Imidazole curing accelerator, manufacturer: BASF 2E4MI, CAS number: 931-36-2, ingredients: 2-ethyl-4-methylimidazole; Silane coupling agent: CAS No.: 2530-83-8; Manufacturer: Shin-Etsu KBM403; Alumina powder: D50 particle size 2um; Manufacturer: DENKA Corporation DAW-01.

[0041] The first organosilicon-modified epoxy resin, self-made, viscosity: 1000-5000mPa·S; epoxy value: 0.4-0.6; The second organosilicon-modified epoxy resin is self-made, with a viscosity of 1000-5000 mPa·S and an epoxy value of 0.35-0.55.

[0042] The first organosilicon-modified epoxy resin used in the following examples and comparative examples is prepared as follows: Under a nitrogen atmosphere, 100 parts by mass of tetramethyldisiloxane and 200 parts by mass of allyl glycidyl ether were added to a reaction container, and then 100 parts by mass of toluene, 0.001 parts by mass of chloroplatinic acid-isopropanol solution and 0.001 parts by mass of 4-methoxyphenol were added, and then the temperature was raised to 80°C and reacted for 2 hours; the reaction mixture was distilled under reduced pressure at 150°C and -0.096MPa to remove the solvent and residual low-boiling substances, thereby obtaining a first silicone-modified epoxy resin.

[0043] The second organosilicon-modified epoxy resin used in the following examples and comparative examples is prepared as follows: Under a nitrogen atmosphere, 100 parts by mass of tetramethyldisiloxane and 250 parts by mass of 4-vinylcyclohexene oxide were added to a reaction container, and then 100 parts by mass of toluene, 0.001 parts by mass of chloroplatinic acid-isopropanol solution, and 0.001 parts by mass of 4-methoxyphenol were added, followed by heating to 80°C and reacting for 2 hours; the reaction mixture was distilled under reduced pressure at 150°C and -0.096MPa to remove the solvent and residual low-boiling substances to obtain a second silicone-modified epoxy resin.

[0044] The raw materials and the amounts of the raw materials used in the examples and comparative examples of the present application are listed in Table 1, and the performance test data of the products of the examples and comparative examples are shown in Table 2.

[0045] The laminated film products in the above examples and comparative examples are prepared by the following method: (1) Add epoxy resin, silicone-modified epoxy resin, silane coupling agent and thermal conductive filler according to mass parts into propylene glycol monomethyl ether acetate solvent, and mix them in a planetary mixer at 120° C. for 2 h; (2) adding a curing agent and a curing accelerator according to parts by mass, and continuing to mix at a temperature of 40° C. for 40 minutes to obtain a slurry; (3) The slurry is coated on a release film, and after drying, a laminated film is formed on the release film, and another release film is laminated on the laminated film to obtain a laminated film product.

[0046] Table 1 Raw materials and dosage of Examples and Comparative Examples The performance of the laminated films in the laminated film products obtained in the examples and comparative examples was tested as follows: 1. Glass transition temperature: Reference standard: ASTM E2254-2018, first cure the laminated film: the first stage is cured at 100℃ for 0.5h, and the second stage is cured at 165℃ for 1.5h. Then prepare the sample, the sample size is 55mm*10mm*2mm. Measurement mode: double cantilever, vibration frequency: 1Hz, amplitude: 10μm, heating rate: 5℃ / min.

[0047] 2. Rheological viscosity: The sample was prepared from an uncured laminate film with a thickness of 1.2 mm, and the sample was in the form of a disc with a diameter of 20 mm. The rheological viscosity of the sample was tested using a rheometer, with a heating rate of 5°C / min and a rheological viscosity value at 100°C.

[0048] 3. Thermal conductivity: First, the laminated film was cured: the first section was cured at 100°C for 0.5h, and the second section was cured at 165°C for 1.5h. Then, the sample was prepared, and the sample size was 3.5cm*4.5cm*3.5mm. The thermal conductivity of the sample was tested using a hot wire method thermal conductivity meter, and the test voltage was 1.5V.

[0049] 4. Copper bonding strength: Take an uncured laminate film sample with a size of 2mm*2mm to overlap two copper sheets, and then cure it: the first section is cured at 100℃ for 0.5h, and the second section is cured at 165℃ for 1.5h; then use the tensile mode of an electronic universal material testing machine to test the bonding strength of the sample.

[0050] 5. Number of hot and cold cycles: Take an uncured laminated film sample with a size of 1cm*5cm and bond it to a copper sheet, then cure it: the first section is cured at 100℃ for 0.5h, and the second section is cured at 165℃ for 1.5h. Then, the sample bonded to the copper sheet is subjected to a hot and cold cycle test: in the temperature range of -65℃~150℃, hot and cold cycles are performed at a heating / cooling rate of 5℃ / min; the sample is ultrasonically scanned every 100 cycles; if delamination occurs between the laminated film and the copper sheet, the hot and cold cycle is terminated and the corresponding number of hot and cold cycles is recorded; if delamination does not occur, the hot and cold cycle is continued until 1000 times.

[0051] The test data of the performance of the above-mentioned embodiments and comparative examples are shown in Table 2 below: Table 2 Performance test data of the products of the embodiments and comparative examples As can be seen from Table 2, the amount of thermal conductive filler affects the thermal conductivity of the laminated film. When the amount of thermal conductive filler reaches 400 parts by mass, the thermal conductivity can exceed 1.55 W / m·k -1 When the amount of thermal conductive filler is the same, adding tetramethyl biphenyl epoxy resin can further improve the thermal conductivity.

[0052] The addition of silicone-modified epoxy resin in this application helps to reduce the rheological viscosity of the system. Lower rheological viscosity is conducive to the wetting of the laminated film, the adhesion to the FC-BGA carrier, and the sufficient filling around the chip. The inventor analyzed that the mechanism of silicone-modified epoxy resin to reduce rheological viscosity may be: first, the rheological viscosity of the silicone-modified epoxy resin itself is relatively low; second, the polarity of the silicone-modified epoxy resin is relatively low, and the interaction with other epoxy resins is weak. Due to the poor compatibility of silicone-modified epoxy resin with other epoxy resins, if the amount of silicone-modified epoxy resin is not appropriate, phase separation is likely to occur during the curing process, thereby affecting the overall performance of the laminated film. Therefore, only when the silicone-modified epoxy resin is used in a specific amount can it not affect the overall performance of the laminated film and achieve the effect of reducing the rheological viscosity.

[0053] In addition, the Si-O bond in the silicone-modified epoxy resin is highly flexible, so adding silicone-modified epoxy resin can also help reduce the internal stress during the curing process of the system, improve adhesion, stability and reliability, so the laminated film with silicone-modified epoxy resin has significantly better cold and hot cycle performance. Furthermore, the addition of tetramethylbiphenyl epoxy resin can further improve adhesion, stability and reliability.

[0054] In this application, in order for the product to form a film smoothly, the total amount of the silicone-modified epoxy resin and the liquid bisphenol A epoxy resin should be controlled to be 20-65 parts by mass. When the total amount is less than 20 parts by mass, the surface of the laminated film is dry and brittle, and it is not easy to form a film, that is, the product of Comparative Example 4; when the total amount is higher than 65 parts by mass, the surface of the laminated film is too wet, easy to flow, and difficult to separate from the release film, that is, the product of Comparative Example 5. Therefore, the performance test of the products of Comparative Examples 4-5 was not continued in the future.

[0055] The above embodiments are only for the purpose of clearly illustrating the embodiments, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above descriptions. It is not necessary and impossible to list all the implementation methods here, so the obvious changes or modifications derived are still within the protection scope of the invention.

Claims

1. A resin composition for substrate encapsulation, characterized in that: The invention comprises the following raw materials in parts by weight: 40-80 parts by mass of epoxy resin, 10-20 parts by mass of organosilicon-modified epoxy resin, 3-45 parts by mass of curing agent, 0.1-5 parts by mass of curing accelerator, 0.1-5 parts by mass of silane coupling agent, and 100-900 parts by mass of thermal conductive filler; The epoxy resin includes liquid bisphenol A epoxy resin and novolac epoxy resin, wherein the amount of liquid bisphenol A epoxy resin is 20-40 parts by weight; The organosilicon-modified epoxy resin is an organosilicon resin with epoxy groups capped at both ends.

2. The resin composition for substrate encapsulation according to claim 1, wherein: The organosilicon-modified epoxy resin is selected from the first organosilicon-modified epoxy resin and / or the second organosilicon-modified epoxy resin; the chemical structural formulas of the first organosilicon-modified epoxy resin and the second organosilicon-modified epoxy resin are shown in Formula (I) and Formula (II), respectively: （Ⅰ） Wherein, R1 to R8 are independently an alkyl group having less than 10 carbon atoms or a phenyl group.

3. The resin composition for substrate encapsulation according to claim 1, wherein: The epoxy resin further comprises dicyclopentadiene epoxy resin and / or tetramethylbiphenyl epoxy resin.

4. The resin composition for substrate encapsulation according to claim 1, wherein: The invention comprises the following raw materials in parts by weight: 40-80 parts by mass of epoxy resin, 10-20 parts by mass of organosilicon-modified epoxy resin, 3-45 parts by mass of curing agent, 0.1-5 parts by mass of curing accelerator, 0.1-5 parts by mass of silane coupling agent, and 100-900 parts by mass of thermal conductive filler; The epoxy resin includes liquid bisphenol A epoxy resin, novolac epoxy resin and tetramethyl biphenyl epoxy resin, wherein the amount of liquid bisphenol A epoxy resin is 20-35 parts by mass, and the amount of tetramethyl biphenyl epoxy resin is 10-20 parts by mass; The organosilicon-modified epoxy resin is an organosilicon resin with epoxy groups capped at both ends.

5. The resin composition for substrate encapsulation according to claim 1, wherein: The curing agent is selected from amine curing agent, acid anhydride curing agent or phenolic resin curing agent.

6. The resin composition for substrate encapsulation according to claim 1, wherein: The curing accelerator is selected from organic phosphine accelerators, imidazole accelerators, organic urea accelerators or tertiary amine accelerators.

7. A laminated film, characterized in that: The resin composition according to any one of claims 1 to 6 is obtained by subjecting the resin composition to film-forming treatment.

8. A laminated film product, characterized in that: The invention comprises a first release film, a second release film and a laminated film attached between the first release film and the second release film, wherein the laminated film is obtained by subjecting the resin composition according to any one of claims 1 to 6 to a film-forming treatment.

9. A method for preparing a laminated film product, characterized in that: include: (1) adding epoxy resin, silicone-modified epoxy resin, silane coupling agent and thermal conductive filler according to parts by mass into a solvent and mixing; (2) adding a curing agent and a curing accelerator according to parts by mass and mixing again to obtain a slurry; (3) The slurry is coated on a first release film, and after drying, a laminated film is formed on the first release film, and a second release film is laminated on the laminated film to obtain a laminated film product.

10. Use of the laminated film according to claim 7 in FC-BGA substrate packaging.

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