Display panel, preparation method thereof and display device

Abstract

The invention discloses a display panel, a preparation method thereof and a display device. The display panel comprises a substrate and an isolation structure, the isolation structure is arranged on one side of the substrate, an isolation opening is defined by the isolation structure, the isolation structure comprises a first isolation part and a second isolation part which are sequentially arranged in a stacked mode in the direction away from the substrate, and the orthographic projection of the first isolation part on the substrate is located in the orthographic projection of the second isolation part on the substrate; the second isolation part comprises a protruding part which extends out of one side, far away from the substrate, of the first isolation part towards the isolation opening; the side, facing the substrate, of the protruding part is at least partially provided with a protection part. The reliability and the yield of the display panel are improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a method for preparing the same, and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) and flat panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream in display devices.

[0003] However, the reliability of current OLED display products needs to be improved. Summary of the invention

[0004] The embodiments of the present application provide a display panel and a method for manufacturing the same, and a display device, aiming to improve the reliability of OLED display products.

[0005] A first aspect of the present application provides a display panel, comprising a substrate and an isolation structure; the isolation structure is arranged on one side of the substrate, the isolation structure encloses an isolation opening, the isolation structure comprises a first isolation portion and a second isolation portion which are sequentially stacked in a direction away from the substrate, the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate, the second isolation portion comprises a protruding portion which is arranged on a side of the first isolation portion away from the substrate and extends toward the isolation opening; a protective portion is at least partially provided on a side of the protruding portion facing the substrate.

[0006] According to an embodiment of the first aspect of the present application, the protection portion extends to at least a portion between the first isolation portion and the second isolation portion.

[0007] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the protection portion includes metal oxide.

[0008] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the protection portion includes indium tin oxide.

[0009] According to any of the aforementioned embodiments of the first aspect of the present application, the protection portion includes a main body portion and an edge portion located on the side of the main body portion facing the isolation opening, the main body portion is located between the first isolation portion and the second isolation portion, and the edge portion is arranged on the side of the protrusion facing the substrate.

[0010] According to any of the aforementioned embodiments of the first aspect of the present application, the edge portion is arranged in contact with the side of the protruding portion facing the substrate.

[0011] According to any of the aforementioned embodiments of the first aspect of the present application, the thickness of the film layer at the edge portion is smaller than the thickness of the film layer at the main body portion.

[0012] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure is recessed toward the substrate to form a first groove, and the orthographic projection of the protection portion on the substrate covers the orthographic projection of the first groove on the substrate.

[0013] According to any of the aforementioned embodiments of the first aspect of the present application, the film thickness of the isolation structure at the first groove is smaller than the film thickness of at least a portion of the isolation structure located outside the first groove.

[0014] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel also includes a pixel definition layer, which is arranged between the isolation structure and the substrate, and the pixel definition layer encloses a pixel opening, and the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the isolation opening on the substrate, and the pixel definition layer is recessed toward the substrate to form a second groove, and the second groove is spaced apart from the pixel opening.

[0015] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the second groove on the substrate at least partially overlaps with the orthographic projection of the first groove on the substrate.

[0016] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel also includes a first conductive portion, a planarization layer and a first electrode layer; the first conductive portion is arranged between the substrate and the pixel definition layer; the planarization layer is arranged between the first conductive portion and the pixel definition layer, and the planarization layer is provided with a via hole, and the via hole exposes at least part of the first conductive portion; the first electrode layer includes a first electrode, the first electrode is arranged between the planarization layer and the pixel definition layer, and the first electrode is electrically connected to the first conductive portion through the via hole.

[0017] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the via on the substrate at least partially overlaps with the orthographic projection of the first groove on the substrate; and / or, the orthographic projection of the via on the substrate at least partially overlaps with the orthographic projection of the second groove on the substrate.

[0018] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the via hole on the substrate is at least partially located within the orthographic projection of the protection portion on the substrate.

[0019] According to any of the aforementioned embodiments of the first aspect of the present application, an orthographic projection of the first electrode on the substrate at least partially overlaps with an orthographic projection of the isolation opening on the substrate.

[0020] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel further includes a light-emitting functional layer, and the light-emitting functional layer is at least partially located in the pixel opening.

[0021] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel further includes a second electrode layer, the second electrode layer includes a second electrode, and the second electrode is arranged on a side of the light-emitting functional layer facing away from the substrate.

[0022] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the isolation structure includes a conductive material, and the second electrode is electrically connected to the isolation structure.

[0023] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the pixel definition layer includes an inorganic insulating material.

[0024] According to any of the aforementioned implementations of the first aspect of the present application, the display panel further includes a first encapsulation layer, and the first encapsulation layer includes an encapsulation portion located on a side of the second electrode away from the substrate.

[0025] According to any of the aforementioned embodiments of the first aspect of the present application, the first encapsulation layer includes a plurality of encapsulation parts that are spaced apart.

[0026] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the packaging portion on the substrate covers the orthographic projection of the corresponding isolation opening on the substrate.

[0027] According to any of the aforementioned implementations of the first aspect of the present application, the display panel further includes a second encapsulation layer disposed on a side of the first encapsulation layer facing away from the substrate.

[0028] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the first encapsulation layer includes an inorganic material, and / or the material of the second encapsulation layer includes an organic material.

[0029] According to any of the aforementioned implementations of the first aspect of the present application, the display panel further includes a third encapsulation layer disposed on a side of the second encapsulation layer facing away from the substrate.

[0030] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the third encapsulation layer includes an inorganic material.

[0031] According to any of the aforementioned embodiments of the first aspect of the present application, the first isolation portion has a first surface facing away from the substrate, and the orthographic projection of the first surface on the substrate is located within the orthographic projection of the protection portion on the substrate.

[0032] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the protection portion on the substrate.

[0033] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the second isolation portion on the substrate is located within the orthographic projection of the protection portion on the substrate; or, the orthographic projection of the second isolation portion on the substrate coincides with the orthographic projection of the protection portion on the substrate.

[0034] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure also includes a third isolation portion, which is arranged on the side of the first isolation portion facing the substrate, and the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the third isolation portion on the substrate.

[0035] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the first isolation portion includes a conductive material, and / or the material of the third isolation portion includes a conductive material.

[0036] The first aspect embodiment of the present application also provides a display panel, including a substrate and an isolation structure; the isolation structure is arranged on one side of the substrate, the isolation structure encloses an isolation opening, the isolation structure includes a first isolation part, a protection part, and a second isolation part which are stacked in sequence in a direction away from the substrate, and the orthographic projection of the first isolation part on the substrate is located within the orthographic projection of the second isolation part on the substrate; wherein the first isolation part has a first surface facing away from the substrate, and the orthographic projection of the protection part on the substrate is at least partially located outside the orthographic projection of the first surface on the substrate.

[0037] According to an embodiment of the first aspect of the present application, an orthographic projection of the first surface on the substrate is located within an orthographic projection of the protective portion on the substrate.

[0038] According to any of the aforementioned embodiments of the first aspect of the present application, the side of the second isolation portion facing the substrate includes a second surface and a third surface that are connected to each other, the orthographic projection of the second surface on the substrate coincides with the orthographic projection of the first surface on the substrate, the orthographic projection of the third surface on the substrate is located outside the orthographic projection of the first surface on the substrate, and the protective portion covers at least a portion of the third surface.

[0039] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the protection portion includes metal oxide.

[0040] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the protection portion includes indium tin oxide.

[0041] An embodiment of a second aspect of the present application provides a method for preparing a display panel, the method comprising:

[0042] forming a first isolation part material layer, a protection part material layer and a second isolation part material layer in sequence on one side of the substrate;

[0043] Performing patterning on the second isolation portion material layer to form a second isolation portion;

[0044] performing patterning on the protection portion material layer to form a protection portion;

[0045] Performing patterning on the first isolation portion material layer to form a first isolation portion;

[0046] The orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate, the first isolation portion has a first surface facing away from the substrate, the orthographic projection of the protection portion on the substrate is at least partially located outside the orthographic projection of the first surface on the substrate, and the first isolation portion, the protection portion and the second isolation portion together enclose an isolation opening.

[0047] According to an implementation of the second aspect of the present application, before the step of patterning the second isolation portion material layer, the preparation method further includes:

[0048] forming an etch stop layer on a side of the second isolation portion material layer facing away from the substrate;

[0049] The etch stop layer is patterned to form an etch opening.

[0050] According to any of the aforementioned embodiments of the second aspect of the present application, the material of the first isolation part material layer includes aluminum; and / or the material of the protection part material layer includes indium tin oxide; and / or the material of the second isolation part material layer includes titanium.

[0051] According to any of the aforementioned embodiments of the second aspect of the present application, the step of patterning the second isolation portion material layer includes:

[0052] dry etching the second isolation portion material layer by etching the opening;

[0053] The step of patterning the protective material layer includes:

[0054] Wet etching the protection portion material layer by etching the opening;

[0055] The step of patterning the first isolation portion material layer includes:

[0056] The first isolation part material layer is wet-etched through the etching opening.

[0057] According to any of the aforementioned embodiments of the second aspect of the present application, in the step of wet etching the first isolation portion material layer through etching openings, a developer is used for wet etching.

[0058] According to any of the aforementioned embodiments of the second aspect of the present application, the isolation structure further includes a third isolation portion, and before the step of forming a first isolation portion material layer on one side of the substrate, the preparation method further includes:

[0059] forming a third isolation material layer on one side of the substrate;

[0060] After the step of wet etching the first isolation portion by etching the opening, the preparation method further comprises:

[0061] The third isolation portion material layer is dry-etched through the etching opening to form a third isolation portion.

[0062] According to any of the aforementioned embodiments of the second aspect of the present application, the material of the third isolation portion material layer includes molybdenum.

[0063] According to any of the aforementioned embodiments of the second aspect of the present application, before the step of forming a first isolation portion material layer on one side of the substrate, the preparation method further includes:

[0064] A first electrode layer is prepared on one side of the substrate, and the first electrode layer is patterned to form a first electrode;

[0065] A pixel definition material layer is formed on a side of the first electrode layer facing away from the substrate.

[0066] According to any of the aforementioned embodiments of the second aspect of the present application, the material of the pixel definition material layer includes an inorganic insulating material.

[0067] According to any of the aforementioned embodiments of the second aspect of the present application, after the step of patterning the first isolation portion material layer to form the first isolation portion, the preparation method further includes:

[0068] The pixel definition material layer is patterned to form a pixel opening, wherein an orthographic projection of the pixel opening on the substrate is located within an orthographic projection of the isolation opening on the substrate.

[0069] According to any of the aforementioned embodiments of the second aspect of the present application, before the step of preparing the first electrode layer on one side of the substrate, the preparation method further includes:

[0070] forming a first conductive portion and a planarization material layer in sequence on one side of the substrate;

[0071] Performing patterning on the planarization material layer to form a via hole, wherein the via hole exposes at least a portion of the first conductive portion;

[0072] Preferably, the first electrode is electrically connected to the first conductive part through a via hole.

[0073] According to any of the aforementioned embodiments of the second aspect of the present application, after the step of patterning the first isolation portion material layer to form the first isolation portion, the preparation method further includes:

[0074] A light-emitting material layer, a second electrode material layer and a packaging material layer are sequentially formed on one side of the substrate, and the packaging material layer, the second electrode material layer and the light-emitting material layer are patterned to form a light-emitting functional layer at least partially located in the isolation opening, a second electrode, and a packaging portion located on a side of the second electrode away from the substrate.

[0075] According to any of the aforementioned embodiments of the second aspect of the present application, the step of patterning the encapsulation material layer, the second electrode material layer and the light-emitting material layer comprises:

[0076] Patterning the packaging material layer by dry etching; and / or,

[0077] Patterning the second electrode material layer by dry etching; and / or,

[0078] The light emitting material layer is patterned by dry etching.

[0079] An embodiment of a third aspect of the present application provides a display device, which includes a display panel according to any one of the implementations of the first aspect.

[0080] According to the display panel of the embodiment of the present application, the display panel includes a substrate and an isolation structure. The protection part is at least arranged on the side of the protruding part facing the substrate, so that at least part of the structure in the protection part can be arranged beyond the first isolation part in a direction parallel to the plane where the substrate is located, so that in the subsequent preparation process of the light-emitting functional layer and the packaging part, since the excess light-emitting material and packaging material need to be etched away, the protection part can protect the etching process from etching or even damaging the lower surface of the protruding part, that is, it can protect the exposed part of the second isolation part relative to the first isolation part. In the embodiment of the present application, the protection part can block the etching process from etching the first isolation part, thereby protecting the integrity of the isolation structure. When the packaging part corresponding to the position is prepared later, the adverse packaging effect caused by the damage of the first isolation part can be reduced, the packaging effect can be improved, and the reliability and yield of the display panel can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0081] Other features, objects and advantages of the present application will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals represent the same or similar features and the accompanying drawings are not drawn to scale.

[0082] Figure 1 is a schematic diagram of a partial top view of the structure of a display panel provided in one embodiment of the present application;

[0083] Figure 2 This is provided by an embodiment of the present application Figure 1 Schematic diagram of the cross-sectional structure at AA in the middle;

[0084] Figure 3 This is one of the partial cross-sectional structural schematic diagrams of a display panel provided in one embodiment of the present application;

[0085] Figure 4 This is a second schematic diagram of a partial cross-sectional structure of a display panel provided in an embodiment of the present application;

[0086] Figure 5 This is provided by an embodiment of the present application Figure 4A schematic structural diagram of the orthographic projection of the middle protection portion and the first isolation portion on the substrate;

[0087] Figure 6 This is a third schematic diagram of a partial cross-sectional structure of a display panel provided in an embodiment of the present application;

[0088] Figure 7 This is a fourth schematic diagram of a partial cross-sectional structure of a display panel provided in an embodiment of the present application;

[0089] Figure 8 This is a fifth schematic diagram of a partial cross-sectional structure of a display panel provided in an embodiment of the present application;

[0090] Fig. 9 This is the sixth schematic diagram of the partial cross-sectional structure of a display panel provided in one embodiment of the present application;

[0091] Fig.10 This is the seventh schematic diagram of a partial cross-sectional structure of a display panel provided in an embodiment of the present application;

[0092] Fig.11 This is an eighth schematic diagram of a partial cross-sectional structure of a display panel provided in an embodiment of the present application;

[0093] Fig.12 is a flow chart of a method for preparing a display panel provided in one embodiment of the present application;

[0094] Fig.13 is a flow chart of a method for preparing a display panel provided in another embodiment of the present application;

[0095] Fig.14 This is one of the structural flow diagrams of a display panel during preparation provided by an embodiment of the present application;

[0096] Fig.15 This is the second structural flow diagram of a display panel during preparation provided by an embodiment of the present application.

[0097] Description of reference numerals:

[0098] 1. substrate; 11. first conductive portion; 12. planarization layer; 121. via hole;

[0099] 2. pixel definition layer; 20. pixel opening; 21. second groove;

[0100] 3. Isolation structure; 30. Isolation opening; 300. First groove; 31. First isolation portion; 311. First surface; 312. Fourth surface; 32. Second isolation portion; 321. Protrusion; 322. Second surface; 323. Third surface; 33. Third isolation portion; 34. Protection portion; 341. Main body; 342. Edge portion;

[0101] 41. Light-emitting functional layer; 42. First electrode layer; 421. First electrode; 43. Second electrode layer; 431. Second electrode;

[0102] 5. First packaging layer; 50. Packaging part; 6. Second packaging layer; 7. Third packaging layer. DETAILED DESCRIPTION

[0103] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present application and are not configured to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.

[0104] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0105] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "on" or "over" another layer or another region, it may mean that it is directly on the other layer or another region, or that other layers or regions are included between it and the other layer or another region. Moreover, if the component is turned over, the layer or a region will be "below" or "beneath" another layer or another region.

[0106] In some display panels, due to the presence of the isolation structure, the precision mask plate can be eliminated when preparing the light-emitting functional layer, and the light-emitting material can be separated into the light-emitting functional layer by the isolation structure. When preparing light-emitting functional layers of different colors, it is first necessary to evaporate the first color light-emitting material and electrode material on the entire surface, so that the first color light-emitting material and electrode material fall into multiple isolation openings and are packaged, and then etch and remove part of the packaging material and the first color light-emitting material and electrode material in part of the isolation openings, retain the first color light-emitting material and electrode material in part of the isolation openings, and the packaging material covering the isolation openings to form a light-emitting functional layer with the first color and a second electrode, and then repeat the above operation to form a light-emitting functional layer with a second color and a light-emitting functional layer with a third color. However, when etching and removing part of the packaging material and etching and removing the first color light-emitting material and electrode material in part of the isolation openings, the etching material may cause etching to the isolation structure. When preparing other color light-emitting functional layers in the subsequent preparation, the etching step will further aggravate the etching of the isolation structure, and it is easy to damage the film layer under the isolation structure, causing damage to the circuit film layer and other structures below, thereby affecting the reliability of the display panel.

[0107] In order to solve the above problems, the embodiments of the present application provide a display panel, a method for manufacturing the same, and a display device. The embodiments of the display panel, a method for manufacturing the same, and a display device are described below in conjunction with the accompanying drawings.

[0108] Please also read Figures 1 to 4 In a first aspect, an embodiment of the present application provides a display panel, which includes a substrate 1 and an isolation structure 3; the isolation structure 3 is arranged on one side of the substrate 1, and the isolation structure 3 encloses an isolation opening 30, and the isolation structure 3 includes a first isolation portion 31 and a second isolation portion 32 which are stacked in sequence in a direction away from the substrate 1, and the orthographic projection of the first isolation portion 31 on the substrate 1 is located within the orthographic projection of the second isolation portion 32 on the substrate 1, and the second isolation portion 32 includes a protruding portion 321 which is arranged on a side of the first isolation portion 31 away from the substrate 1 and extends toward the isolation opening 30; a protective portion 34 is at least partially provided on the side of the protruding portion 321 facing the substrate 1.

[0109] Optionally, the side of the protrusion 321 facing the substrate 1 is at least partially provided with a protective portion 34, that is, the protective portion 34 is at least arranged on the side of the protrusion 321 facing the substrate 1, which can be understood as: the protective portion 34 covers part of the lower surface of the protrusion 321; or, the protective portion 34 covers the lower surface of the entire protrusion 321; or, the protective portion 34 can also cover the side of the protrusion 321, for example, the side facing the isolation opening 30; even, in some embodiments, the protective portion 34 can also cover the upper surface of the protrusion 321.

[0110] Optionally, the above structure can be referred to in the orthographic projection direction of the substrate 1 Figure 2 The Z-axis direction in the figure, and the direction indicated by the Z-axis can also be the thickness direction of the display panel.

[0111] Optional, such as Figure 1 As shown, the isolation structure 3 may be in a grid shape, so as to facilitate the division of sub-pixels in the display panel by the isolation structure 3. The hollowed-out areas in the grid-shaped isolation structure 3 may be isolation openings 30.

[0112] The substrate 1 mainly plays a supporting and bearing role. A variety of film layer structures can be arranged in the substrate 1. The embodiment of the present application does not limit the specific film layer structure composition of the substrate 1.

[0113] In a display panel provided in an embodiment of the present application, the display panel includes a substrate 1 and an isolation structure 3. The isolation structure 3 is arranged on one side of the substrate 1 and encloses an isolation opening 30, and the isolation opening 30 can be used to accommodate a light-emitting functional layer 41. The isolation structure 3 can be used to divide the sub-pixels of the display panel. The isolation structure 3 is arranged on the substrate 1 and encloses a plurality of isolation openings 30, which can separate the light-emitting material layer to form a plurality of disconnected light-emitting functional layers 41, thereby reducing the crosstalk of carriers in the light-emitting functional layer 41, improving the display effect of the display panel, and the light-emitting functional layer 41 does not need to use a precision mask plate, which can reduce the development and use of precision masks and reduce the preparation cost.

[0114] When preparing the light-emitting functional layer 41, the light-emitting material layer has a large drop at the edge of the isolation opening 30, and because the second isolation part 32 has a protruding part 321 that is arranged to protrude from the first isolation part 31 toward the isolation opening 30, that is, the first isolation part 31 is arranged concave relative to the second isolation part 32, the light-emitting material layer is difficult to connect at the edge of the isolation opening 30, and thus breaks, so as to facilitate the preparation of mutually disconnected light-emitting functional layers 41. The protection part 34 is at least arranged on the side of the protruding part 321 facing the substrate 1, so that at least part of the structure in the protection part 34 can be arranged beyond the first isolation part 31 in a direction parallel to the plane where the substrate 1 is located, so that in the subsequent preparation process of the light-emitting functional layer 41 and the packaging part 50, since the excess light-emitting material and packaging material need to be etched away, the protection part 34 can protect the etching process from etching or even damaging the lower surface of the protruding part 321, that is, it can protect the exposed part of the second isolation part 32 relative to the first isolation part 31. In the embodiment of the present application, the protection part 34 can block the etching process from etching the first isolation part 31, thereby protecting the integrity of the isolation structure 3. When the packaging part 50 corresponding to this position is prepared later, the adverse effects of packaging caused by damage to the first isolation part 31 can be reduced, the packaging effect can be improved, and the reliability and yield of the display panel can be improved.

[0115] The composition, preparation, etc. of the isolation structure 3 (or partition structure or isolation column) are described in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, PCT / CN2024 / 099 072, CN117979755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, CN117500332A for reference.

[0116] like Figure 4 and Figure 6 As shown, the protection portion 34 may be a planar structure, and the orthographic projection of the protection portion 34 on the substrate 1 may overlap with the orthographic projection of the surface of the first isolation portion 31 facing away from the substrate 1 on the substrate 1, that is, the protection portion 34 is partially sandwiched between the first isolation portion 31 and the second isolation portion 32. Alternatively, as Figure 7 and Figure 8 As shown, the protection portion 34 may also be a ring-shaped structure, and its orthographic projection on the substrate 1 may be completely located outside the orthographic projection of the surface of the first isolation portion 31 facing away from the substrate 1 on the substrate 1. In this case, the first isolation portion 31 may be directly attached to the second isolation portion 32.

[0117] Reference Figures 2 to 6 In some optional embodiments, the protection portion 34 extends to at least a portion between the first isolation portion 31 and the second isolation portion 32 , that is, a portion of the protection portion 34 is located between the first isolation portion 31 and the second isolation portion 32 .

[0118] In these embodiments, in addition to protecting the lower surface of the protrusion 321 of the second isolation portion 32 from bottom to top, the protection portion 34 can also protect the upper surface of the first isolation portion 31 from top to bottom. Even after a portion of the second isolation portion 32 is etched away from top to bottom, the protection portion 34 can still protect the first isolation portion 31 to protect the integrity of the first isolation portion 31, thereby reducing the possibility of the isolation structure 3 being etched through as a whole in the thickness direction, and then protecting the film layer under the isolation structure 3, further improving the reliability of the display panel.

[0119] Optionally, the material of the protection part 34 includes metal oxide. The metal oxide has good anti-dry etching performance and has a better protection effect on the first isolation part 31 and the second isolation part 32. Optionally, the metal oxide may include at least one of ITO (indium tin oxide), IGZO (indium gallium zinc oxide), IAZO (indium aluminum zinc oxide), ITZO (indium tin zinc oxide), IATZO (indium aluminum tin zinc oxide) and IGO (indium gallium oxide).

[0120] Exemplarily, the material of the protection portion 34 includes indium tin oxide (ITO).

[0121] Combined with reference Figure 3 and Figure 4 In some optional embodiments, the protection portion 34 includes a main body portion 341 and an edge portion 342 located on the side of the main body portion 341 facing the isolation opening 30, the main body portion 341 is located between the first isolation portion 31 and the second isolation portion 32, and the edge portion 342 is arranged on the side of the protrusion 321 facing the substrate 1.

[0122] In these embodiments, the main body 341 can protect the upper surface of the first isolation portion 31 from top to bottom. Even after a portion of the second isolation portion 32 is etched away from top to bottom, the protection portion 34 can still protect the first isolation portion 31 to protect the integrity of the first isolation portion 31, thereby reducing the possibility of the isolation structure 3 being etched through as a whole in the thickness direction, thereby protecting the film layer under the isolation structure 3 and improving the reliability of the display panel; the edge portion 342 can protect the lower surface of the protrusion 321 of the second isolation portion 32 from bottom to top, reduce the adverse effects of packaging caused by damage to the first isolation portion 31, improve the packaging effect, and improve the reliability and yield of the display panel.

[0123] Optionally, the edge portion 342 is disposed in contact with a side of the protrusion 321 facing the substrate 1 .

[0124] In these embodiments, no other film layer is disposed between the edge portion 342 and the protruding portion 321, and the edge portion 342 is directly disposed in contact with the lower surface of the protruding portion 321. It should be noted that in some other embodiments, other film layers, such as other protective film layers, may be disposed between the edge portion 342 and the protruding portion 321 to further improve the protective effect of the first isolation portion 31.

[0125] Optionally, the film thickness of the edge portion 342 is less than the film thickness of the main body portion 341. When preparing the protection portion 34, the edge portion 342 and the main body portion 341 can be prepared at the same time, and the molding thickness is the same. After the display panel is prepared and molded, since the edge portion 342 has a directly exposed surface relative to the main body portion 341, the etching process will damage the surface of the partially exposed edge portion 342, so that the average film thickness of the edge portion 342 is less than the average film thickness of the main body portion 341.

[0126] Combined with reference Figure 4 and Figure 5 In some optional embodiments, the first isolation portion 31 has a first surface 311 facing away from the substrate 1 , and the orthographic projection of the first surface 311 on the substrate 1 is located within the orthographic projection of the protection portion 34 on the substrate 1 .

[0127] In these embodiments, the protection portion 34 is arranged between the first isolation portion 31 and the second isolation portion 32, and not only completely covers the first surface 311, but also has a portion that exceeds the first isolation portion 31 in a direction parallel to the plane of the substrate 1, thereby being able to simultaneously protect the first surface 311 and the lower surface of the second isolation portion 32, protect the integrity of the isolation structure 3 when preparing the light-emitting functional layer 41 and the packaging portion 50, and improve the reliability and yield of the display panel.

[0128] Optionally, the orthographic projection of the first isolation portion 31 on the substrate 1 is located within the orthographic projection of the protection portion 34 on the substrate 1 .

[0129] It should be noted that the first isolation portion 31 also includes a fourth surface 312 facing the substrate 1. The embodiment of the present application does not limit the size relationship between the first surface 311 and the fourth surface 312. Exemplarily, the orthographic projection of the first surface 311 on the substrate 1 is located within the orthographic projection of the fourth surface 312 on the substrate 1, that is, the longitudinal section of the first isolation portion 31 may be a regular trapezoidal structure.

[0130] The orthographic projection of the first isolation portion 31 on the substrate 1 is located within the orthographic projection of the protection portion 34 on the substrate 1, that is, the orthographic projections of the first surface 311 and the fourth surface 312 on the substrate 1 are both located within the orthographic projection of the protection portion 34 on the substrate 1. This design can ensure that the protection portion 34 can have a larger projection area on the substrate 1, thereby increasing the area of ​​the lower surface of the protruding portion 321 covered by the protection portion 34, improving the protection effect of the protection portion 34 on the protruding portion 321, and improving reliability.

[0131] At the same time, the orthographic projection of the protection part 34 on the substrate 1 is not a ring structure, but a planar structure. In this way, during the preparation process of the isolation structure 3, the first isolation part 31 material layer, the protection part 34 material layer and the second isolation part 32 material layer can be formed in sequence first, and then the first isolation part 31, the protection part 34 and the second isolation part 32 are formed by patterning. This preparation method is simple and efficient.

[0132] The orthographic projection of the second isolation portion 32 on the substrate 1 can be located within the orthographic projection of the second isolation portion 32 on the substrate 1, the orthographic projection of the second isolation portion 32 on the substrate 1 can completely overlap with the orthographic projection of the protection portion 34 on the substrate 1, or the orthographic projection of the protection portion 34 on the substrate 1 can also be partially located outside the orthographic projection of the second isolation portion 32 on the substrate 1.

[0133] In some optional embodiments, the orthographic projection of the second isolation portion 32 on the substrate 1 is located within the orthographic projection of the protection portion 34 on the substrate 1 ; or, the orthographic projection of the second isolation portion 32 on the substrate 1 coincides with the orthographic projection of the protection portion 34 on the substrate 1 .

[0134] This design can further increase the orthographic projection area of ​​the protection portion 34 on the substrate 1, thereby further increasing the area of ​​the lower surface of the protrusion 321 covered by the protection portion 34, improving the protection effect of the protection portion 34 on the protrusion 321, and improving reliability. Optionally, in a direction parallel to the plane where the substrate 1 is located, the protection portion 34 is at least partially arranged beyond the second isolation portion 32, that is, the orthographic projection portion of the protection portion 34 on the substrate 1 is located outside the orthographic projection of the second isolation portion 32 on the substrate 1.

[0135] Reference Figure 2 and Figure 3 In some optional embodiments, the isolation structure 3 is recessed toward the substrate 1 to form a first groove 300 , and the orthographic projection of the protection portion 34 on the substrate 1 covers the orthographic projection of the first groove 300 on the substrate 1 .

[0136] Optionally, the film thickness of the isolation structure 3 at the first groove 300 is smaller than the film thickness of at least a portion of the isolation structure 3 located outside the first groove 300 .

[0137] The first groove 300 may be formed when the isolation structure 3 is formed on the entire surface of the substrate 1, and a relatively concave area exists in the film layer below. When the isolation structure 3 is prepared, the isolation structure 3 will also form a first groove 300 similar to the concave area. The first groove 300 may also be formed when the isolation structure 3 itself has a weak position due to the preparation process when the isolation structure 3 is prepared.

[0138] In these embodiments, due to the presence of the step difference, the overall film thickness of the isolation structure 3 at the first groove 300 is relatively thinner than the overall film thickness at the flat part, so the protection ability at this position is weak and is easily etched through, and the orthographic projection of the protection part 34 on the substrate 1 covers the orthographic projection of the first groove 300 on the substrate 1. The main body 341 in the protection part 34 can provide protection for the first isolation part 31 located at the first groove 300, and can increase the overall strength of the isolation structure 3 at the first groove 300, improve its anti-etching ability, thereby protecting the weak area of ​​the isolation structure 3, and in the subsequent process of preparing the light-emitting functional layer 41, the weak area of ​​the isolation structure 3 is not easy to be etched through, so that the isolation structure 3 can protect the circuit film layer and other structures below, and it is not easy to have poor display problems, thereby improving the reliability and yield of the display panel.

[0139] Optionally, the display panel includes a light-emitting functional layer 41 , and the light-emitting functional layer 41 is used to realize light-emitting display of the display panel. A light-emitting functional layer 41 can be disposed corresponding to an isolation opening 30 .

[0140] Reference Figure 2 In some optional embodiments, the display panel further includes a first electrode layer 42 , the first electrode layer 42 includes a first electrode 421 , and the first electrode 421 is disposed between the substrate 1 and the light-emitting functional layer 41 .

[0141] Optionally, the display panel further includes a second electrode layer 43, and the second electrode layer 43 includes a second electrode 431 disposed on a side of the light-emitting functional layer 41 away from the substrate 1. One of the first electrode 421 and the second electrode 431 can be used as an anode, and the other can be used as a cathode to drive the light-emitting functional layer 41 to emit light. In the embodiment of the present application, the first electrode 421 is used as the anode of the display panel, and the second electrode 431 is used as the cathode of the display panel for illustration.

[0142] Optionally, the orthographic projection of the first electrode 421 on the substrate 1 at least partially overlaps the orthographic projection of the isolation opening 30 on the substrate 1. By preparing the light-emitting functional layer 41 and the second electrode 431 in the isolation opening 30, the light-emitting functional layer 41 can be driven to emit light by the first electrode 421 and the second electrode 431.

[0143] Optionally, the light-emitting functional layer 41 may include a hole injection layer (HIL), a hole transport layer (HTL), a light-emitting structure, an electron injection layer (EIL) and an electron transport layer (ETL).

[0144] In some optional embodiments, the material of the isolation structure 3 includes a conductive material, and the second electrode 431 is electrically connected to the isolation structure 3. The isolation structure 3 separates the second electrode layer 43 to form mutually spaced second electrodes 431, and the mutually spaced second electrodes 431 are electrically connected through the isolation structure 3 to form a whole-surface electrode, thereby ensuring normal light emission of the light-emitting functional layer 41.

[0145] Optionally, the material of the first isolation portion 31 may include a conductive material, and the second electrode 431 may be connected to the first isolation portion 31 , so that the second electrodes 431 of adjacent sub-pixels may be electrically connected through the first isolation portion 31 .

[0146] Optionally, when vapor-depositing the light-emitting functional layer 41 and the second electrode layer 43 of the display panel, the second isolation portion 32 is capable of shielding at least a portion of the material used to prepare the light-emitting functional layer 41 and the second electrode layer 43 to separate the light-emitting functional layer 41 and the second electrode layer 43 between adjacent sub-pixels, and facilitates the formation of multiple light-emitting functional layers 41 that are spaced apart and located within the isolation opening 30, and facilitates the formation of multiple second electrodes 431 that are spaced apart and located within the isolation opening 30, thereby making it unnecessary to set a mask with high precision when vapor-depositing the light-emitting functional layer 41 and the second electrode layer 43 of the display panel, for example, making it unnecessary to set a high-precision metal mask (Fine Metal Mask, FMM) when vapor-depositing the light-emitting functional layer 41 and the second electrode layer 43, thereby effectively reducing the production and preparation cost of the display panel.

[0147] Reference Figure 2 and Figure 3 In some optional embodiments, the display panel further includes a pixel definition layer 2, which is disposed between the isolation structure 3 and the substrate 1, and the pixel definition layer 2 encloses a pixel opening 20, the orthographic projection of the pixel opening 20 on the substrate 1 is located within the orthographic projection of the isolation opening 30 on the substrate 1, and the pixel opening 20 can be connected to the isolation opening 30, and the pixel definition layer 2 is recessed toward the substrate 1 to form a second groove 21, and the second groove 21 is spaced apart from the pixel opening 20. The formation of the second groove 21 can refer to the first groove 300, and will not be repeated here.

[0148] Optionally, the light-emitting functional layer 41 is at least partially located in the pixel opening 20. The pixel opening 20 is used to expose at least a portion of the first electrode 421, so that the light-emitting functional layer 41 formed in the pixel opening 20 is electrically connected to the first electrode 421. There are many ways to set the relative position relationship between the isolation structure 3 and the pixel definition layer 2. For example, the isolation structure 3 can be set on the side of the pixel definition layer 2 away from the substrate 1, or a clearance opening is opened on the pixel definition layer 2, and the isolation structure 3 can be located in the clearance opening.

[0149] Optionally, the pixel definition layer 2 is located between the isolation structure 3 and the first electrode 421. Optionally, the material of the pixel definition layer 2 includes an inorganic insulating material, such as silicon nitride, or silicon nitride and silicon oxide, etc. The pixel definition layer 2 separates the first electrode 421 from the isolation structure 3, and can avoid the first electrode 421 and the second electrode 431 from being short-circuited.

[0150] Optionally, an orthographic projection of the second groove 21 on the substrate 1 at least partially overlaps with an orthographic projection of the first groove 300 on the substrate 1 .

[0151] In these embodiments, the second groove 21 and the first groove 300 may be formed because there is a depression in the film layer below, so corresponding grooves are formed above the depressions. Therefore, the orthographic projection of the second groove 21 on the substrate 1 and the orthographic projection of the first groove 300 on the substrate 1 will overlap.

[0152] In some optional embodiments, the display panel also includes a first conductive portion 11, a planarization layer 12 and a first electrode layer 42; the first conductive portion 11 is arranged between the substrate 1 and the pixel definition layer 2; the planarization layer 12 is arranged between the first conductive portion 11 and the pixel definition layer 2, and the planarization layer 12 is provided with a via 121, and the via 121 exposes at least a portion of the first conductive portion 11; the first electrode layer 42 includes a first electrode 421, the first electrode 421 is arranged between the planarization layer 12 and the pixel definition layer 2, and the first electrode 421 is electrically connected to the first conductive portion 11 through the via 121.

[0153] Optionally, the orthographic projection of the via hole 121 on the substrate 1 at least partially overlaps with the orthographic projection of the first groove 300 on the substrate 1 ; and / or, the orthographic projection of the via hole 121 on the substrate 1 at least partially overlaps with the orthographic projection of the second groove 21 on the substrate 1 .

[0154] The orthographic projection of the via 121 on the substrate 1 at least partially overlaps with the orthographic projection of the first groove 300 on the substrate 1, which can be understood as: the orthographic projection of the via 121 is located within the orthographic projection of the first groove 300, or the orthographic projection of the via 121 is located within the orthographic projection of the first groove 300, or the orthographic projection of the via 121 and the orthographic projection of the first groove 300 coincide with or there is a non-overlapping portion.

[0155] In these optional embodiments, the first groove 300 of the isolation structure 3 and the second groove 21 of the pixel definition layer 2 are both formed by being arranged on the via hole 121. In order to realize the connection between the first electrode 421 and the first conductive part 11, it is necessary to firstly etch the planarization layer 12 to form the via hole 121 to expose part of the first conductive part 11, and then prepare the first electrode layer 42 so as to facilitate the electrical connection between the first electrode 421 and the first conductive part 11, and then provide an electrical signal to the light-emitting functional layer 41. When the pixel definition layer 2 and the isolation structure 3 are then prepared on the first electrode layer 42, the pixel definition layer 2 will be recessed toward the via hole 121 at the position of the via hole 121 to form the second groove 21, and the isolation structure 3 will be recessed toward the via hole 121 at the position of the via hole 121 to form the first groove 300. Therefore, the orthographic projection of the first groove 300 on the substrate 1 at least partially overlaps with the orthographic projection of the via hole 121 on the substrate 1, and the orthographic projection of the second groove 21 on the substrate 1 at least partially overlaps with the orthographic projection of the via hole 121 on the substrate 1.

[0156] Optionally, the planarization layer 12 includes an organic insulating material. The planarization layer 12 includes an organic insulating material so that it has good leveling and insulating effects.

[0157] Optionally, the isolation structure 3 is insulated from the first conductive portion 11. The isolation structure 3 is insulated from the first conductive portion 11 to prevent the anode and the cathode from being short-circuited.

[0158] Optionally, an array layer may be included between the substrate 1 and the light-emitting functional layer 41, and the array layer may include a pixel circuit. The first conductive portion 11 may be a conductive layer in the pixel circuit that is directly electrically connected to the first electrode 421. For example, the array layer may also include a second conductive layer and a third conductive layer that are sequentially stacked with the first conductive portion 11 in a direction close to the substrate 1. An insulating layer is provided between adjacent conductive layers. Exemplarily, the pixel circuit provided in the array layer includes a transistor and a storage capacitor. The transistor includes a semiconductor, a gate, a source and a drain. The storage capacitor includes a first plate and a second plate.

[0159] Optionally, the orthographic projection of the via hole 121 on the substrate 1 is located within the orthographic projection of the protection portion 34 on the substrate 1 .

[0160] The orthographic projection of the via hole 121 on the substrate 1 is located within the orthographic projection of the protection portion 34 on the substrate 1 . It can be understood that the protection portion 34 completely covers the area directly above the via hole 121 , and the coverage area of ​​the protection portion 34 is larger than the area of ​​the orthographic projection of the via hole 121 on the substrate 1 .

[0161] In these embodiments, by providing a protection portion 34 between the first isolation portion 31 and the second isolation portion 32 of the isolation structure 3, and making the orthographic projection of the via 121 on the substrate 1 located within the orthographic projection of the protection portion 34 on the substrate 1, the weak area of ​​the isolation structure 3 formed by the via 121 can be protected. In the subsequent process of preparing the light-emitting functional layer 41, the protection portion 34 can block the damage to the isolation structure 3 by the etching process, thereby protecting the integrity of the isolation structure 3, making it difficult for the weak area of ​​the isolation structure 3 to be etched through, especially the first isolation portion 31, so that the isolation structure 3 can protect the circuit film layer and other structures below, and it is not easy to have poor display problems, thereby improving the yield and performance of the display panel. Among them, the circuit film layer and the like can refer to the first electrode 421, the first conductive portion 11, and the like.

[0162] In some optional embodiments, the display panel further includes a first encapsulation layer 5, and the first encapsulation layer 5 includes an encapsulation portion 50 located on a side of the light-emitting functional layer 41 away from the substrate 1. The encapsulation portion 50 is used to encapsulate the light-emitting functional layer 41. There are multiple light-emitting functional layers 41, and multiple encapsulation portions 50 can be arranged in a one-to-one correspondence with multiple light-emitting functional layers 41. Optionally, multiple encapsulation portions 50 are arranged at intervals from each other. Optionally, the material of the first encapsulation layer 5 can be an inorganic material, which has good compactness and water vapor resistance, and has a good encapsulation effect even if it is thin. The first encapsulation layer 5 can be prepared by a chemical vapor deposition process (Chemical Vapor Deposition, CVD).

[0163] Optionally, the second electrode 431 is located between the light-emitting functional layer 41 and the encapsulation part 50 .

[0164] Optionally, the orthographic projection of the encapsulation portion 50 on the substrate 1 covers the orthographic projection of the corresponding isolation opening 30 on the substrate 1. Optionally, the encapsulation portion 50 extends through the isolation structure 3 toward the sidewall of the isolation opening 30 to a side of the isolation structure 3 away from the substrate 1.

[0165] In these embodiments, the encapsulation part 50 completely covers and encapsulates the isolation opening 30. The encapsulation part 50 is located on the side of the light-emitting functional layer 41 away from the substrate 1 and covers the side wall of the isolation structure 3 facing the isolation opening 30, and extends to the side of the isolation structure 3 away from the substrate 1, and can completely and continuously encapsulate the inside and the periphery of the isolation opening 30, thereby improving the encapsulation effect of the display panel.

[0166] Reference Fig. 9 and Fig.10In some optional embodiments, the isolation structure 3 further includes a third isolation portion 33, which is disposed on the side of the first isolation portion 31 facing the substrate 1, and the orthographic projection of the first isolation portion 31 on the substrate 1 is located within the orthographic projection of the third isolation portion 33 on the substrate 1. For example, the third isolation portion 33 is disposed protruding from the first isolation portion 31 toward the isolation opening 30. Optionally, the material of the third isolation portion 33 may include a conductive material, and the second electrode 431 may be connected to the third isolation portion 33, so that the second electrodes 431 of adjacent sub-pixels can be electrically connected through the third isolation portion 33. By arranging the third isolation portion 33 to protrude from the first isolation portion 31 toward the isolation opening 30, the third isolation portion 33 may have a larger size to facilitate connection with the second electrode 431.

[0167] Optionally, the material of the second isolation part 32 is titanium (Ti) or molybdenum (Mo), the material of the first isolation part 31 is aluminum (Al), silver (Ag) or copper (Cu), and the material of the third isolation part 33 is titanium (Ti) or molybdenum (Mo). For example, the isolation structure 3 is a three-layer metal composite material of Ti / Al / Ti (titanium / aluminum / titanium) or Ti / Al / Mo (titanium / aluminum / molybdenum).

[0168] Reference Fig.11 Optionally, the display panel further includes a second encapsulation layer 6 disposed on the side of the first encapsulation layer 5 facing away from the substrate 1. Optionally, the display panel further includes a third encapsulation layer 7 disposed on the side of the second encapsulation layer 6 facing away from the substrate 1. The material of the second encapsulation layer 6 may include an organic material, so that the second encapsulation layer 6 may have good fluidity, so that the surface of the second encapsulation layer 6 facing away from the substrate 1 is relatively flat. The material of the third encapsulation layer 7 may include an inorganic material to further enhance the encapsulation effect of the display panel. Optionally, the second encapsulation layer 6 may be prepared by inkjet printing (IJP); the third encapsulation layer 7 may be prepared by chemical vapor deposition.

[0169] Optionally, the display panel further includes a touch layer, a polarizing layer and a cover plate disposed on the third encapsulation layer 7. The touch layer can be used to realize the touch operation of the display panel, the polarizing layer can be used to filter light to improve the display effect of the display panel, and the cover plate can be used to protect the underlying film layer to improve the strength of the display panel.

[0170] In some optional embodiments, the display panel further includes a light emitting device, at least part of which is located in the isolation opening 30, and the light emitting device includes a first electrode 421, a light emitting functional layer 41, and a second electrode 431 which are sequentially stacked in a direction away from the substrate 1; the orthographic projection of the via hole 121 on the substrate 1 is located outside the orthographic projection of the isolation opening 30 on the substrate 1; and the first electrode 421 is electrically connected to the first conductive portion 11 through the via hole 121. The light emitting device and the isolation opening 30 may be arranged in a one-to-one correspondence.

[0171] Optionally, the display panel includes a plurality of light emitting devices with different light emitting colors, and the light emitting devices with different light emitting colors are located in different isolation openings 30. Exemplarily, the light emitting devices may have three colors, namely red, green, and blue. The types of isolation openings 30 correspond to the colors of the light emitting devices, and may also be three categories.

[0172] Please also read Figures 1 to 11 The first aspect embodiment of the present application also provides a display panel, including a substrate 1 and an isolation structure 3; the isolation structure 3 is arranged on one side of the substrate 1, and the isolation structure 3 encloses an isolation opening 30, and the isolation structure 3 includes a first isolation part 31, a protection part 34 and a second isolation part 32 which are stacked in sequence in a direction away from the substrate 1, and the orthographic projection of the first isolation part 31 on the substrate 1 is located within the orthographic projection of the second isolation part 32 on the substrate 1; wherein the first isolation part 31 has a first surface 311 facing away from the substrate 1, and the orthographic projection of the protection part 34 on the substrate 1 is at least partially located outside the orthographic projection of the first surface 311 on the substrate 1.

[0173] In a display panel provided in an embodiment of the present application, the display panel includes a substrate 1 and an isolation structure 3, a protection portion 34 is located on the side of the second isolation portion 32 facing the substrate 1, and the protection portion 34 is at least partially located outside the orthographic projection of the first surface 311 on the substrate 1, so that at least part of the structure in the protection portion 34 can be arranged beyond the first isolation portion 31 in a direction parallel to the plane where the substrate 1 is located, so that in the subsequent preparation process of the light-emitting functional layer 41 and the packaging portion 50, since the excess light-emitting material and packaging material need to be etched away, the protection portion 34 can protect the etching process from etching or even damaging the lower surface of the second isolation portion 32 exposed relative to the first isolation portion 31. In the embodiment of the present application, the protection portion 34 can block the etching process from etching the first isolation portion 31, thereby protecting the integrity of the isolation structure 3, and when the packaging portion 50 corresponding to the position is prepared later, the adverse packaging effects caused by the damage of the first isolation portion 31 can be reduced, the packaging effect can be improved, and the reliability and yield of the display panel can be improved.

[0174] In some embodiments, an orthographic projection of the first surface 311 on the substrate 1 is located within an orthographic projection of the protection portion 34 on the substrate 1 .

[0175] In these embodiments, the protection portion 34 is arranged between the first isolation portion 31 and the second isolation portion 32, and can completely cover the first surface 311, so that the protection portion 34 can protect the first surface 311 from top to bottom, even after a portion of the second isolation portion 32 is etched away from top to bottom, the protection portion 34 can still protect the first isolation portion 31 and protect the integrity of the first isolation portion 31, thereby reducing the possibility of the isolation structure 3 being etched through as a whole in the thickness direction, and then protecting the film layer under the isolation structure 3, further improving the reliability of the display panel.

[0176] The orthographic projection of the protection part 34 on the substrate 1 is a planar structure. In this way, during the preparation process of the isolation structure 3, the first isolation part 31 material layer, the protection part 34 material layer and the second isolation part 32 material layer are first formed in sequence, and then the first isolation part 31, the protection part 34 and the second isolation part 32 are formed by patterning. This preparation method is simple and efficient.

[0177] In some optional embodiments, the side of the second isolation portion 32 facing the substrate 1 includes a second surface 322 and a third surface 323 that are interconnected, the orthographic projection of the second surface 322 on the substrate 1 coincides with the orthographic projection of the first surface 311 on the substrate 1, the orthographic projection of the third surface 323 on the substrate 1 is located outside the orthographic projection of the first surface 311 on the substrate 1, and the protective portion 34 covers at least a portion of the third surface 323.

[0178] In these optional embodiments, the second surface 322 is the portion of the lower surface of the second isolation portion 32 whose area is equal to that of the first surface 311 and whose orthographic projections overlap, and the third surface 323 is the portion of the lower surface of the second isolation portion 32 that protrudes relative to the first isolation portion 31. By providing a protective portion 34 to cover at least a portion of the third surface 323, the protective portion 34 can effectively protect the third surface 323 and block the etching process from etching the first isolation portion 31, thereby protecting the integrity of the isolation structure 3 and improving the reliability and yield of the display panel.

[0179] Optionally, the material of the protection part 34 includes metal oxide. The metal oxide has good anti-dry etching performance and has a better protection effect on the first isolation part 31 and the second isolation part 32. Optionally, the metal oxide may include at least one of ITO (indium tin oxide), IGZO (indium gallium zinc oxide), IAZO (indium aluminum zinc oxide), ITZO (indium tin zinc oxide), IATZO (indium aluminum tin zinc oxide) and IGO (indium gallium oxide).

[0180] Exemplarily, the material of the protection portion 34 includes indium tin oxide (ITO).

[0181] Optionally, a display panel provided in an embodiment of the first aspect of the present application may be the display panel in any of the aforementioned embodiments. Therefore, a display panel provided in an embodiment of the present application may have the beneficial effects of the display panel in any of the aforementioned embodiments, and the present application will not elaborate on it. For example, the substrate 1 may be the substrate 1 in any of the aforementioned embodiments. For example, the protective portion 34 may be the protective portion 34 in any of the aforementioned embodiments. For example, the display panel may also include the first electrode layer 42 and the second electrode layer 43 in any of the aforementioned embodiments. Exemplarily, the first electrode 421 and the second electrode 431 may serve as the anode and cathode of the display panel, respectively. For example, the isolation structure 3 may be the isolation structure 3 in any of the aforementioned embodiments, and the isolation structure 3 may include the first isolation portion 31 and the second isolation portion 32 in any of the aforementioned embodiments, so that the isolation structure 3 can be used to isolate the materials of the light-emitting functional layer 41 and the second electrode layer 43 when preparing the light-emitting functional layer 41 and the second electrode layer 43.

[0182] Fig.12 It is a flow chart of a method for preparing a display panel provided in one embodiment of the present application.

[0183] Reference Fig.12 The embodiment of the second aspect of the present application provides a method for preparing a display panel. The method for preparing a display panel can be used to prepare the display panel in the above embodiment. The isolation structure includes a first isolation portion, a protection portion, and a second isolation portion. The preparation method includes:

[0184] S10, forming a first isolation part material layer, a protection part material layer and a second isolation part material layer in sequence on one side of the substrate.

[0185] S20, patterning the second isolation portion material layer to form a second isolation portion.

[0186] S30, patterning the protection portion material layer to form a protection portion.

[0187] S40, patterning the first isolation portion material layer to form a first isolation portion.

[0188] The orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate, the first isolation portion has a first surface facing away from the substrate, the orthographic projection of the protection portion on the substrate is at least partially located outside the orthographic projection of the first surface on the substrate, and the first isolation portion, the protection portion and the second isolation portion together enclose an isolation opening.

[0189] The isolation opening is used to accommodate the light-emitting functional layer to be prepared later, and the isolation structure can be used to divide the sub-pixels of the display panel. The isolation structure is arranged on the substrate and encloses a plurality of isolation openings, which can separate the light-emitting material layer to form a disconnected light-emitting functional layer, thereby reducing the crosstalk of carriers in the light-emitting functional layer and improving the display effect of the display panel. In addition, the light-emitting functional layer does not need to use a precision mask plate, which can reduce the development and use of precision masks and reduce the preparation cost.

[0190] In a method for preparing a display panel provided in an embodiment of the present application, a first isolation part material layer, a protection part material layer and a second isolation part material layer are formed in sequence, and the preparation process can be simplified by etching from top to bottom, thereby improving the preparation efficiency. The orthographic projection of the formed protection part on the substrate is at least partially located outside the orthographic projection of the first surface on the substrate, so that at least part of the structure in the protection part can be arranged beyond the first isolation part in a direction parallel to the plane where the substrate is located, so that in the subsequent preparation process of the light-emitting functional layer and the packaging part, since the excess light-emitting material and packaging material need to be etched away, the protection part can protect the etching process from etching or even damaging the lower surface of the second isolation part exposed relative to the first isolation part. In the embodiment of the present application, the protection part can block the etching process from etching the first isolation part, thereby protecting the integrity of the isolation structure. When the packaging part corresponding to the position is prepared later, the adverse effects of packaging caused by damage to the first isolation part can be reduced, the packaging effect can be improved, and the reliability and yield of the display panel can be improved.

[0191] Fig.13 This is a process of a method for preparing a display panel provided in another embodiment of the present application; Fig.14 This is one of the structural flow diagrams of a display panel during preparation provided by an embodiment of the present application; Fig.15 This is a second schematic diagram of a structure flow of a display panel during preparation provided by an embodiment of the present application. Fig.14 and Fig.15 Steps a to h are prepared in sequence, the pixel definition material layer 20' is used to form a pixel definition layer, the first isolation part material layer 31' is used to form a first isolation part 31, the second isolation part material layer 32' is used to form a second isolation part 32, the third isolation part material layer 33' is used to form a third isolation part 33, the protection part material layer 34' is used to form a protection part 34, the etching stop layer 4' can protect the film layer structure below, and the etching opening 40' can expose the film layer structure below for etching.

[0192] Reference Figures 13 to 15 In some optional embodiments, before step S20, the preparation method further includes:

[0193] S15, forming an etching stop layer on a side of the second isolation portion material layer facing away from the substrate.

[0194] S16, patterning the etch stop layer to form an etch opening.

[0195] In these embodiments, the etch stop layer can protect the covered structure so that the structure below it is not etched by the subsequent etching process, so that the portion exposed from the etching opening can be accurately etched, thereby simplifying the patterning process and improving efficiency. Optionally, the etch stop layer can be a photoresist, and the patterning process of the etch stop layer can include exposure and development processes.

[0196] Optionally, step S20 includes:

[0197] The second isolation portion material layer is dry-etched through the etching opening.

[0198] Optionally, the material of the second isolation portion may be titanium (Ti) or molybdenum (Mo), and illustratively, it may be titanium. The second isolation portion material layer may be effectively etched through the etching opening by dry etching, thereby forming the second isolation portion.

[0199] Step S30 includes:

[0200] The protection portion material layer is wet-etched by etching the opening.

[0201] Optionally, the material of the protection part material layer may be metal oxide, exemplarily ITO, which has good anti-dry etching capability, and the protection part material layer may be effectively etched through the etching opening using a wet etching process, thereby forming a protection part.

[0202] Step S40 includes:

[0203] The first isolation part material layer is wet-etched through the etching opening.

[0204] Optionally, the material of the first isolation portion can be aluminum (Al), silver (Ag) or copper (Cu). Exemplarily, it can be aluminum. The aluminum exposed from the etching opening can be effectively removed by wet etching, and by controlling the wet etching time, the aluminum layer can be concave relative to the titanium layer to form a partition structure.

[0205] Optionally, in the step of wet etching the first isolation portion material layer through etching the opening, a developer is used for wet etching. The developer can effectively etch aluminum, but has a weaker etching effect on ITO, thereby reducing damage to ITO during wet etching of the aluminum layer, improving the integrity of the protection portion and subsequent anti-etching ability.

[0206] Optionally, the isolation structure further includes a third isolation portion, and before step S10, the preparation method further includes:

[0207] A third spacer material layer is formed on one side of the substrate.

[0208] After the step of wet etching the first isolation portion by etching the opening, the preparation method further comprises:

[0209] The third isolation portion material layer is dry-etched through the etching opening to form a third isolation portion.

[0210] Optionally, the material of the third isolation portion is titanium (Ti) or molybdenum (Mo). Exemplarily, the material of the third isolation portion material layer is molybdenum.

[0211] The third isolation part material layer can be effectively etched through the etching opening by dry etching to form the third isolation part, so that the first isolation part, the second isolation part, the third isolation part and the protection part are surrounded to form an isolation opening.

[0212] In some optional embodiments, before step S10, and also before the step of forming a third isolation portion material layer on one side of the substrate, the preparation method further includes:

[0213] A first electrode layer is prepared on one side of the substrate, and the first electrode layer is patterned to form a first electrode.

[0214] A pixel definition material layer is formed on a side of the first electrode layer facing away from the substrate.

[0215] Optionally, the material of the pixel definition material layer includes an inorganic insulating material.

[0216] In these optional embodiments, the first electrode can serve as an anode of the light-emitting functional layer, the pixel definition material layer is used to form a pixel definition layer, the pixel definition layer has a pixel opening to accommodate the light-emitting functional layer, and the pixel definition material layer is an insulating material that can isolate the first electrode layer and the isolation structure to avoid electrical connection between the two.

[0217] Optionally, after step S40, if the display panel is prepared with a third isolation portion, this step is also located after the etching process of the material layer of the third isolation portion, and the preparation method further includes:

[0218] The pixel definition material layer is patterned to form a pixel opening, wherein the pixel opening is connected to the isolation opening.

[0219] By preparing the light-emitting functional layer in the isolation opening, the light-emitting functional layer will fall into the pixel opening and overlap with the first electrode exposed in the pixel opening.

[0220] Optionally, before the step of preparing the first electrode layer on one side of the substrate, the preparation method further includes:

[0221] A first conductive portion and a planarization material layer are sequentially formed on one side of the substrate.

[0222] The planarization material layer is patterned to form a via hole, wherein the via hole exposes at least a portion of the first conductive portion.

[0223] In these embodiments, the first conductive portion may be formed by providing a first conductive material as a whole layer on the substrate, and then partially etching the first conductive material, and the portion that is protected and not etched forms the first conductive portion. The first conductive portion may be used to provide an electrical signal to the first electrode. In order to achieve the connection between the first electrode and the first conductive portion, it is necessary to first etch the planarization layer to form a via to expose part of the first conductive portion, and then prepare the first electrode layer to facilitate the electrical connection between the first electrode and the first conductive portion, and then provide an electrical signal to the light-emitting functional layer. When the pixel definition layer and the isolation structure are then prepared on the first electrode layer, the pixel definition layer will be recessed toward the via at the via position to form a second groove, and the isolation structure will be recessed toward the via at the via position to form a first groove.

[0224] Optionally, the first electrode is electrically connected to the first conductive portion through a via hole.

[0225] In some optional embodiments, after the step of patterning the first isolation portion material layer to form the first isolation portion, the preparation method further includes:

[0226] A light-emitting material layer, a second electrode material layer and a packaging material layer are sequentially formed on one side of the substrate, and the packaging material layer, the second electrode material layer and the light-emitting material layer are patterned to form a light-emitting functional layer at least partially located in the isolation opening, a second electrode, and a packaging portion located on a side of the second electrode away from the substrate.

[0227] Optionally, the step of patterning the encapsulation material layer, the second electrode material layer and the light-emitting material layer includes:

[0228] Patterning the packaging material layer by dry etching; and / or,

[0229] Patterning the second electrode material layer by dry etching; and / or,

[0230] The light emitting material layer is patterned by dry etching.

[0231] In these optional embodiments, the process of patterning the packaging material layer, the second electrode material layer and the light-emitting material layer can all be dry etching processes. For example, when patterning the packaging material layer, the second electrode material layer and the light-emitting material layer, there are two dry etching processes. The first dry etching process removes the excess packaging material and part of the excess second electrode material, and the second dry etching process removes the remaining part of the excess second electrode material and the excess light-emitting material. Using dry etching processes can effectively prevent damage to the isolation structure caused by wet etching, so that the protection part with good anti-dry etching ability can more effectively protect the integrity of the isolation structure.

[0232] Exemplarily, the isolation openings may include first-type isolation openings and second-type isolation openings. After step S40, the preparation method further includes:

[0233] A first preparation material layer is formed and patterned to form a light-emitting functional layer of the first light-emitting device located in the first type of isolation opening, a second electrode, and a packaging portion located on a side of the first light-emitting device away from the substrate.

[0234] A second preparation material layer is formed and patterned to form a light-emitting functional layer of a second light-emitting device located in the second type of isolation opening, a second electrode, and a packaging portion located on a side of the second light-emitting device away from the substrate.

[0235] In these embodiments, a first preparation material layer is prepared on the substrate in an entire layer, and then the excess first preparation material layer is etched away, leaving the first preparation material layer at the first type of isolation opening, thereby forming a light-emitting functional layer of the first light-emitting device located in the first isolation opening, a second electrode, and a packaging portion located on the side of the first light-emitting device away from the substrate. When etching the excess first preparation material layer, the etching process may cause over-etching damage to the isolation structure at the second type of isolation opening, and the protective portion can protect the lower surface of the second isolation portion, thereby improving the integrity of the isolation structure at the second type of isolation opening. When the packaging portion corresponding to the second type of isolation opening is prepared later, the adverse effects of packaging caused by damage to the first isolation portion can be reduced, the packaging effect can be improved, and the reliability and yield of the display panel can be improved.

[0236] Optionally, the isolation opening further includes a third type of isolation opening, forming a second preparation material layer, and patterning the second preparation material layer to form a light-emitting functional layer of a second light-emitting device located in the second type of isolation opening, a second electrode, and an encapsulation portion located on a side of the second light-emitting device away from the substrate, the preparation method further includes:

[0237] A third preparation material layer is formed and patterned to form a light-emitting functional layer of a third light-emitting device located in the third type of isolation opening, a second electrode, and a packaging portion located on a side of the third light-emitting device away from the substrate.

[0238] The prepared material layer may include a material for forming a light-emitting functional layer, a material for forming a second electrode, and a material for forming an encapsulation part.

[0239] In these embodiments, the isolation structure at the third type of isolation opening is the same as the isolation structure at the second type of isolation opening. When the excess first preparation material layer is etched away, the protection portion can protect the lower surface of the second isolation portion at the second type of isolation opening and the third type of isolation opening, thereby improving the integrity of the isolation structure at the second type of isolation opening and the third type of isolation opening. When the excess second preparation material layer is etched away, the protection portion can protect the lower surface of the second isolation portion at the third type of isolation opening, thereby improving the integrity of the isolation structure at the third type of isolation opening.

[0240] Optionally, the first light emitting device, the second light emitting device and the third light emitting device emit different colors. Exemplarily, the light emitting device may have three colors, namely red, green and blue.

[0241] Optionally, the process of patterning the first preparation material layer includes a dry etching process; and / or, the process of patterning the second preparation material layer includes a dry etching process; and / or, the process of patterning the third preparation material layer includes a dry etching process.

[0242] The embodiment of the third aspect of the present application provides a display device, which includes the display panel of any embodiment of the first aspect or the display panel prepared according to any embodiment of the second aspect. Since the display device provided by the embodiment of the third aspect of the present application includes the display panel provided by any embodiment of the first aspect or the display panel prepared according to any embodiment of the second aspect, the display device provided by the embodiment of the third aspect of the present application has the beneficial effects of the display panel of any embodiment of the first aspect or the display panel prepared according to any embodiment of the second aspect, which will not be repeated here.

[0243] The display device in the embodiments of the present application includes but is not limited to mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, consoles, and other devices with display functions.

[0244] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0245] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

[0246] According to the embodiments described above, these embodiments do not describe all the details in detail, nor do they limit the invention to the specific embodiments described. Obviously, many modifications and changes can be made based on the above description. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present application, so that those skilled in the art can make good use of the present application and the modifications based on the present application. The present application is limited only by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized in that: include: substrate; an isolation structure, arranged on one side of the substrate, the isolation structure enclosing an isolation opening, the isolation structure comprising a first isolation portion and a second isolation portion sequentially stacked in a direction away from the substrate, the orthographic projection of the first isolation portion on the substrate being located within the orthographic projection of the second isolation portion on the substrate, and the second isolation portion comprising a protruding portion extending toward the isolation opening and arranged on a side of the first isolation portion away from the substrate; A protection portion is at least partially provided on a side of the protruding portion facing the substrate.

2. The display panel according to claim 1, characterized in that: The protection portion extends to at least a portion between the first isolation portion and the second isolation portion; Preferably, the material of the protection portion includes metal oxide; Preferably, the material of the protection portion includes indium tin oxide.

3. The display panel according to claim 2, characterized in that: The protection portion includes a main body portion and an edge portion located on a side of the main body portion facing the isolation opening, the main body portion is located between the first isolation portion and the second isolation portion, and the edge portion is arranged on a side of the protruding portion facing the substrate; Preferably, the edge portion is arranged in contact with the protruding portion on a side facing the substrate; Preferably, the film thickness of the edge portion is smaller than the film thickness of the main body portion.

4. The display panel according to claim 2, characterized in that: The isolation structure is recessed toward the substrate to form a first groove, and the orthographic projection of the protection portion on the substrate covers the orthographic projection of the first groove on the substrate; Preferably, the film thickness of the isolation structure at the first groove is smaller than the film thickness of at least a portion of the isolation structure located outside the first groove.

5. The display panel according to claim 4, characterized in that: Also includes: A pixel definition layer is disposed between the isolation structure and the substrate, the pixel definition layer encloses a pixel opening, the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the isolation opening on the substrate, the pixel definition layer is recessed toward the substrate to form a second groove, and the second groove is spaced apart from the pixel opening; Preferably, an orthographic projection of the second groove on the substrate at least partially overlaps with an orthographic projection of the first groove on the substrate.

6. The display panel according to claim 5, characterized in that: Also includes: A first conductive portion, disposed between the substrate and the pixel definition layer; a planarization layer, disposed between the first conductive portion and the pixel definition layer, the planarization layer being provided with a via hole, the via hole exposing at least a portion of the first conductive portion; A first electrode layer, comprising a first electrode, wherein the first electrode is disposed between the planarization layer and the pixel definition layer, and the first electrode is electrically connected to the first conductive portion through the via hole; Preferably, an orthographic projection of the via hole on the substrate at least partially overlaps with an orthographic projection of the first groove on the substrate; And / or, an orthographic projection of the via hole on the substrate at least partially overlaps with an orthographic projection of the second groove on the substrate; Preferably, the orthographic projection of the via hole on the substrate is at least partially located within the orthographic projection of the protection portion on the substrate; Preferably, an orthographic projection of the first electrode on the substrate at least partially overlaps with an orthographic projection of the isolation opening on the substrate.

7. The display panel according to claim 5, characterized in that: Also includes: a light-emitting functional layer, wherein at least a portion of the light-emitting functional layer is located within the pixel opening; Preferably, the display panel further comprises a second electrode layer, the second electrode layer comprises a second electrode, and the second electrode is arranged on a side of the light-emitting functional layer away from the substrate; Preferably, the material of the isolation structure includes a conductive material, and the second electrode is electrically connected to the isolation structure; Preferably, the material of the pixel definition layer includes an inorganic insulating material.

8. The display panel according to claim 7, characterized in that: The display panel further includes a first encapsulation layer, wherein the first encapsulation layer includes an encapsulation portion located on a side of the second electrode away from the substrate; Preferably, the first encapsulation layer comprises a plurality of the encapsulation parts arranged at intervals; Preferably, the orthographic projection of the packaging portion on the substrate covers the orthographic projection of the corresponding isolation opening on the substrate; Preferably, the display panel further comprises a second encapsulation layer arranged on a side of the first encapsulation layer away from the substrate; Preferably, the material of the first encapsulation layer includes an inorganic material, and / or the material of the second encapsulation layer includes an organic material; Preferably, the display panel further comprises a third encapsulation layer disposed on a side of the second encapsulation layer away from the substrate; Preferably, the material of the third encapsulation layer includes inorganic material.

9. The display panel according to claim 1, characterized in that: The first isolation portion has a first surface facing away from the substrate, and an orthographic projection of the first surface on the substrate is located within an orthographic projection of the protection portion on the substrate; Preferably, the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the protection portion on the substrate; Preferably, the orthographic projection of the second isolation portion on the substrate is located within the orthographic projection of the protection portion on the substrate; Alternatively, the orthographic projection of the second isolation portion on the substrate coincides with the orthographic projection of the protection portion on the substrate.

10. The display panel according to claim 1, characterized in that: The isolation structure further includes a third isolation portion, the third isolation portion is arranged on a side of the first isolation portion facing the substrate, and the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the third isolation portion on the substrate; Preferably, the material of the first isolation portion includes a conductive material, and / or the material of the third isolation portion includes a conductive material.

11. A display panel, characterized in that: include: substrate; an isolation structure, arranged on one side of the substrate, the isolation structure enclosing an isolation opening, the isolation structure comprising a first isolation portion, a protection portion, and a second isolation portion stacked in sequence in a direction away from the substrate, the orthographic projection of the first isolation portion on the substrate being within the orthographic projection of the second isolation portion on the substrate; The first isolation portion has a first surface facing away from the substrate, and the orthographic projection of the protection portion on the substrate is at least partially located outside the orthographic projection of the first surface on the substrate.

12. The display panel according to claim 11, characterized in that: The orthographic projection of the first surface on the substrate is located within the orthographic projection of the protection portion on the substrate; Preferably, the second isolation portion includes a second surface and a third surface connected to each other on a side facing the substrate, the orthographic projection of the second surface on the substrate coincides with the orthographic projection of the first surface on the substrate, the orthographic projection of the third surface on the substrate is located outside the orthographic projection of the first surface on the substrate, and the protection portion covers at least a portion of the third surface; Preferably, the material of the protection portion includes metal oxide; Preferably, the material of the protection portion includes indium tin oxide.

13. A method for preparing a display panel, characterized in that: The preparation method comprises: forming a first isolation part material layer, a protection part material layer and a second isolation part material layer in sequence on one side of the substrate; performing patterning on the second isolation portion material layer to form a second isolation portion; Performing patterning on the protection portion material layer to form a protection portion; Performing patterning on the first isolation portion material layer to form a first isolation portion; The orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate, the first isolation portion has a first surface facing away from the substrate, the orthographic projection of the protection portion on the substrate is at least partially located outside the orthographic projection of the first surface on the substrate, and the first isolation portion, the protection portion and the second isolation portion together enclose an isolation opening.

14. The method for preparing a display panel according to claim 13, characterized in that: Before the step of patterning the second isolation portion material layer, the preparation method further includes: forming an etching stop layer on a side of the second isolation portion material layer facing away from the substrate; Performing patterning on the etch stop layer to form an etch opening; Preferably, the material of the first isolation part material layer includes aluminum; and / or, the material of the protection part material layer includes indium tin oxide; and / or, the material of the second isolation part material layer includes titanium.

15. The method for preparing a display panel according to claim 14, characterized in that: The step of patterning the second isolation portion material layer comprises: dry etching the second isolation portion material layer through the etching opening; The step of patterning the protective material layer comprises: wet-etching the protection portion material layer through the etching opening; The step of patterning the first isolation portion material layer comprises: wet-etching the first isolation portion material layer through the etching opening; Preferably, in the step of wet etching the first isolation portion material layer through the etching opening, a developer is used to perform the wet etching.

16. The method for preparing a display panel according to claim 15, characterized in that: Before the step of forming a first isolation portion material layer on one side of the substrate, the preparation method further includes: forming a third isolation material layer on one side of the substrate; After the step of wet etching the first isolation portion through the etching opening, the preparation method further includes: dry-etching the third isolation portion material layer through the etching opening to form a third isolation portion; Preferably, the material of the third isolation part material layer includes molybdenum.

17. The method for preparing a display panel according to claim 13, characterized in that: Before the step of forming a first isolation portion material layer on one side of the substrate, the preparation method further includes: Preparing a first electrode layer on one side of the substrate, and patterning the first electrode layer to form a first electrode; forming a pixel definition material layer on a side of the first electrode layer facing away from the substrate; Preferably, the material of the pixel definition material layer includes an inorganic insulating material; Preferably, after the step of patterning the first isolation portion material layer to form the first isolation portion, the preparation method further comprises: The pixel definition material layer is patterned to form a pixel opening, wherein an orthographic projection of the pixel opening on the substrate is located within an orthographic projection of the isolation opening on the substrate.

18. The method for preparing a display panel according to claim 17, characterized in that: Before the step of preparing the first electrode layer on one side of the substrate, the preparation method further comprises: forming a first conductive portion and a planarization material layer in sequence on one side of the substrate; Performing patterning on the planarization material layer to form a via hole, wherein the via hole exposes at least a portion of the first conductive portion; Preferably, the first electrode is electrically connected to the first conductive part through the via hole.

19. The method for preparing a display panel according to claim 13, characterized in that: After the step of patterning the first isolation portion material layer to form the first isolation portion, the preparation method further includes: A light-emitting material layer, a second electrode material layer and a packaging material layer are sequentially formed on one side of the substrate, and the packaging material layer, the second electrode material layer and the light-emitting material layer are patterned to form a light-emitting functional layer at least partially located in the isolation opening, a second electrode, and a packaging portion located on a side of the second electrode away from the substrate; Preferably, the step of patterning the packaging material layer, the second electrode material layer and the light-emitting material layer comprises: Patterning the packaging material layer by dry etching; and / or, Performing patterning on the second electrode material layer by dry etching; and / or, The light emitting material layer is patterned by dry etching.

20. A display device, characterized in that: The invention comprises the display panel as claimed in any one of claims 1 to 12.

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