Display panel, preparation method of display panel and display device

Abstract

The embodiment of the invention provides a display panel, a preparation method of the display panel and a display device, and relates to the technical field of display, and the display panel comprises a substrate, an isolation structure, a light-emitting unit and a packaging unit. The isolation structure is located on one side of the substrate, an isolation opening is defined by the isolation structure, a groove sunken towards the direction of the substrate is formed in the side, away from the substrate, of the isolation structure, the isolation structure comprises a first isolation part and a second isolation part which are arranged in a stacked mode in the direction away from the substrate, and the groove penetrates through the second isolation part and at least part of the first isolation part; the light-emitting unit is at least partially located in the isolation opening; the packaging unit is located on the side, away from the substrate, of the light-emitting unit, and at least part of the packaging unit extends to the side, away from the substrate, of the isolation structure from the side face, facing the isolation opening, of the isolation structure and extends to the side wall, facing the groove, of the isolation structure. The stability of the packaging unit can be greatly improved, so that the packaging effect of the packaging unit on the light-emitting unit can be improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular, to a display panel, a method for preparing a display panel, and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) and flat panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream in display panels.

[0003] However, there are still some problems with display panels that need to be solved urgently. Summary of the invention

[0004] In order to overcome the technical problems mentioned in the above technical background, an embodiment of the present application provides a display panel, wherein the display panel includes:

[0005] substrate;

[0006] an isolation structure, located on one side of the substrate, the isolation structure encloses an isolation opening, a groove recessed toward the substrate is provided on a side of the isolation structure away from the substrate, the isolation structure comprises a first isolation portion and a second isolation portion stacked in a direction away from the substrate, the groove penetrates the second isolation portion and penetrates at least a portion of the first isolation portion;

[0007] a light emitting unit, at least partly located in the isolation opening;

[0008] The packaging unit is located on a side of the light-emitting unit away from the substrate, and at least part of the packaging unit extends from the side of the isolation structure toward the isolation opening to the side of the isolation structure away from the substrate, and extends to the side wall of the isolation structure toward the groove.

[0009] In some possible implementations, an orthographic projection of a side of the first isolation portion away from the substrate on the substrate is located within an orthographic projection of the second isolation portion on the substrate, a contact portion between the first isolation portion and the second isolation portion has a recessed structure recessed in a direction away from the groove, and the packaging unit extends into the recessed structure;

[0010] Preferably, the orthographic projection of the groove on the substrate is outside the orthographic projection of the isolation opening on the substrate;

[0011] Preferably, the orthographic projection of the groove on the substrate is located between the orthographic projections of two adjacent isolation openings on the substrate;

[0012] Preferably, the orthographic projection of the groove on the substrate surrounds at least part of the orthographic projection of the isolation opening on the substrate;

[0013] Preferably, the material of the first isolation portion includes a conductive material;

[0014] Preferably, the material of the first isolation portion includes aluminum or copper;

[0015] Preferably, the material of the second isolation portion includes a conductive material;

[0016] Preferably, the material of the second isolation portion includes titanium or titanium nitride.

[0017] In some possible implementations, the isolation structure further includes a third isolation portion located on a side of the first isolation portion facing the substrate, and an orthographic projection of the groove on the substrate is located within an orthographic projection of the third isolation portion on the substrate;

[0018] Preferably, along the thickness direction of the substrate, the groove penetrates the first isolation portion;

[0019] Preferably, the bottom wall of the groove includes a portion of the surface of the third isolation portion on a side away from the substrate.

[0020] In some possible implementations, the light-emitting unit includes a first light-emitting unit and a second light-emitting unit, the encapsulation unit includes a first encapsulation unit and a second encapsulation unit, the first encapsulation unit is located on a side of the first light-emitting unit away from the substrate, and the second encapsulation unit is located on a side of the second light-emitting unit away from the substrate;

[0021] Preferably, the first packaging unit comprises a first suspended portion located in the groove, and a first gap is formed between a side of the first suspended portion facing the substrate and a side of the third isolation portion away from the substrate;

[0022] Preferably, the second packaging unit comprises a second suspended portion located in the groove, and a second gap is formed between a side of the second suspended portion facing the substrate and a side of the third isolation portion away from the substrate;

[0023] Preferably, the first suspended portion and the second suspended portion are arranged at an interval.

[0024] In some possible implementations, the light-emitting unit includes a first electrode, a light-emitting portion, and a second electrode which are sequentially stacked in a direction away from the substrate;

[0025] Preferably, along the thickness direction of the substrate, the height of the first gap is equal to the sum of the thickness of the light-emitting portion of the first light-emitting unit and the second electrode;

[0026] Preferably, along the thickness direction of the substrate, the height of the second gap is equal to the sum of the thicknesses of the light-emitting portion of the second light-emitting unit and the second electrode.

[0027] In some possible implementations, the material of the third isolation portion includes a conductive material, and the second electrode of the light-emitting unit extends to be electrically connected to the third isolation portion;

[0028] Preferably, the third isolating portion comprises a first isolating sub-portion and a second isolating sub-portion stacked in sequence in a direction away from the substrate, the first isolating sub-portion comprises a conductive material, and the second electrode of the light-emitting unit extends to be electrically connected to the first isolating sub-portion;

[0029] Preferably, the third isolating portion further comprises a third isolating sub-portion located on the side of the first isolating sub-portion facing the substrate, the third isolating sub-portion comprises a conductive material, and the second electrode of the light-emitting unit extends to be electrically connected to the first isolating sub-portion and the third isolating sub-portion;

[0030] Preferably, the corrosion resistance of the second isolating sub-portion is stronger than that of the first isolating sub-portion;

[0031] Preferably, the conductivity of the first isolating sub-portion is stronger than the conductivity of the second isolating sub-portion;

[0032] Preferably, the material of the first isolating sub-portion includes aluminum or copper;

[0033] Preferably, the material of the second isolating sub-portion includes a conductive material;

[0034] Preferably, the material of the second isolation sub-portion includes indium tin oxide, indium zinc oxide or indium gallium zinc oxide;

[0035] Preferably, the material of the third spacer portion includes at least one of molybdenum, titanium nitride, molybdenum nitride, titanium or indium tin oxide.

[0036] In some possible implementations, along a direction away from the substrate, a first filling layer and a second filling layer are sequentially provided between a side of the second isolation portion away from the substrate and the packaging unit;

[0037] Preferably, the light-emitting unit comprises a first electrode, a light-emitting portion and a second electrode which are sequentially stacked in a direction away from the substrate;

[0038] Preferably, the material of the first filling layer is the same as that of the light-emitting portion;

[0039] Preferably, the first filling layer is in the same layer as the light-emitting portion;

[0040] Preferably, the material of the second filling layer is the same as that of the second electrode;

[0041] Preferably, the second filling layer is in the same layer as the second electrode;

[0042] Preferably, the display panel further comprises a pixel defining layer located on a side of the first electrode away from the substrate, and the isolation structure is located on a side of the pixel defining layer away from the substrate; the pixel defining layer comprises a pixel opening exposing at least a portion of the first electrode;

[0043] Preferably, the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the isolation opening on the substrate.

[0044] In some possible implementations, the minimum distance between an edge of an orthographic projection of a side of the first isolation portion away from the substrate on the substrate and an orthographic projection of an edge of the second isolation portion facing the isolation opening on the substrate is a first extension distance, the minimum distance between an edge of an orthographic projection of a side of the first isolation portion away from the substrate on the substrate and an orthographic projection of an edge of the second isolation portion facing the groove on the substrate is a second extension distance, and the second extension distance is smaller than the first extension distance;

[0045] Preferably, the first extension distance is greater than or equal to 0.3 μm and less than or equal to 1 μm;

[0046] Preferably, the second extension distance is greater than or equal to 0.1 μm and less than or equal to 0.6 μm.

[0047] In some possible implementations, the display panel further includes a second encapsulation layer located on a side of the encapsulation unit away from the substrate;

[0048] Preferably, the display panel further comprises a third encapsulation layer located on a side of the second encapsulation layer away from the substrate;

[0049] Preferably, the materials of the encapsulation unit and the third encapsulation layer both include inorganic materials;

[0050] Preferably, the material of the second encapsulation layer includes organic material.

[0051] In some possible implementations, the present application further provides a display panel, comprising:

[0052] substrate;

[0053] an isolation structure, located at one side of the substrate, the isolation structure encloses an isolation opening, the isolation structure comprises a third isolation portion, a first isolation portion, and a second isolation portion which are sequentially stacked in a direction away from the substrate, the third isolation portion comprises a first isolation sub-portion and a second isolation sub-portion which are sequentially stacked in a direction away from the substrate, the first isolation sub-portion comprises a conductive material, and the corrosion resistance of the second isolation sub-portion is stronger than that of the first isolation sub-portion;

[0054] A light emitting unit is at least partially located in the isolation opening, and the light emitting unit includes a second electrode, and the second electrode is electrically connected to the first isolation sub-portion.

[0055] In some possible implementations, a groove recessed toward the substrate is provided on a side of the isolation structure away from the substrate, and the groove penetrates the second isolation portion and penetrates at least a portion of the first isolation portion;

[0056] Preferably, along the thickness direction of the substrate, the groove penetrates the first isolation portion;

[0057] Preferably, the orthographic projection of the groove on the substrate is located within the orthographic projection of the second isolating sub-portion on the substrate;

[0058] Preferably, the bottom wall of the groove includes a partial surface of the second isolating sub-portion away from the substrate;

[0059] Preferably, the orthographic projection of the groove on the substrate is outside the orthographic projection of the isolation opening on the substrate;

[0060] Preferably, the orthographic projection of the groove on the substrate is located between the orthographic projections of two adjacent isolation openings on the substrate;

[0061] Preferably, the orthographic projection of the groove on the substrate surrounds at least part of the orthographic projection of the isolation opening on the substrate;

[0062] Preferably, an orthographic projection of a side of the first isolation portion away from the substrate on the substrate is located within an orthographic projection of the second isolation portion on the substrate.

[0063] In some possible implementations, the minimum distance between an edge of an orthographic projection of a side of the first isolation portion away from the substrate on the substrate and an orthographic projection of an edge of the second isolation portion facing the isolation opening on the substrate is a first extension distance, the minimum distance between an edge of an orthographic projection of a side of the first isolation portion away from the substrate on the substrate and an orthographic projection of an edge of the second isolation portion facing the groove on the substrate is a second extension distance, and the second extension distance is smaller than the first extension distance;

[0064] Preferably, the first extension distance is greater than or equal to 0.3 μm and less than or equal to 1 μm;

[0065] Preferably, the second extension distance is greater than or equal to 0.1 μm and less than or equal to 0.6 μm.

[0066] In some possible implementations, the third isolating portion further includes a third isolating sub-portion located on a side of the first isolating sub-portion facing the substrate, the third isolating sub-portion includes a conductive material, and the second electrode of the light-emitting unit extends to be electrically connected to the first isolating sub-portion and the third isolating sub-portion;

[0067] Preferably, the conductivity of the first isolating sub-portion is stronger than the conductivity of the second isolating sub-portion;

[0068] Preferably, the material of the first isolating sub-portion includes aluminum or copper;

[0069] Preferably, the material of the second isolating sub-portion includes a conductive material;

[0070] Preferably, the material of the second isolation sub-portion includes indium tin oxide, indium zinc oxide or indium gallium zinc oxide;

[0071] Preferably, the material of the third isolating sub-portion includes at least one of molybdenum, titanium nitride, molybdenum nitride, titanium or indium tin oxide;

[0072] Preferably, the material of the first isolation portion includes a conductive material;

[0073] Preferably, the material of the first isolation portion includes aluminum or copper;

[0074] Preferably, the material of the second isolation portion includes a conductive material;

[0075] Preferably, the material of the second isolation portion includes titanium or titanium nitride.

[0076] In some possible implementations, the present application further provides a method for preparing a display panel, the method comprising:

[0077] providing a substrate;

[0078] An isolation structure is formed on one side of the substrate, the isolation structure encloses an isolation opening, a groove recessed toward the substrate is provided on a side of the isolation structure away from the substrate, the isolation structure comprises a first isolation portion and a second isolation portion stacked in a direction away from the substrate, the groove penetrates the second isolation portion and penetrates at least a portion of the first isolation portion;

[0079] A light-emitting unit at least partially located in the isolation opening and a packaging unit located on a side of the light-emitting unit away from the substrate are prepared, wherein at least part of the packaging unit extends from the side of the isolation structure toward the isolation opening to the side of the isolation structure away from the substrate, and extends to the side wall of the isolation structure toward the groove.

[0080] In some possible implementations, the step of forming an isolation structure on one side of the substrate includes:

[0081] forming a first electrode layer on one side of the substrate, wherein the first electrode layer includes a plurality of first electrodes arranged at intervals;

[0082] forming a pixel defining material layer and an isolation material layer in sequence on a side of the first electrode layer away from the substrate;

[0083] Patterning the isolation material layer to form an isolation structure;

[0084] The pixel definition material layer is patterned to form a pixel definition layer, wherein the pixel definition layer includes a pixel opening, and the pixel opening is connected to the isolation opening.

[0085] In some possible implementations, the isolation material layer includes a first isolation material layer, a second isolation material layer, a third isolation material layer, a fourth isolation material layer, and a fifth isolation material layer stacked in sequence in a direction away from the substrate, and the step of patterning the isolation material layer to form an isolation structure includes:

[0086] forming a patterned first photoresist layer on a side of the fifth isolation material layer away from the substrate;

[0087] removing the fifth isolation material layer and the fourth isolation material layer not covered by the first photoresist layer by dry etching, and exposing a portion of the third isolation material layer away from the substrate;

[0088] Removing the third isolation material layer, the second isolation material layer and the first isolation material layer not covered by the first photoresist layer by wet etching, and exposing the pixel defining material layer to form the isolation opening;

[0089] removing the first photoresist layer;

[0090] forming a patterned second photoresist layer on a side of the fifth isolation material layer away from the substrate and a side of the exposed pixel definition material layer away from the substrate;

[0091] The fifth isolation material layer and the fourth isolation material layer not covered by the second photoresist layer are removed, and the second photoresist layer is removed to form an isolation structure including a groove.

[0092] In some possible implementations, the isolation opening includes a first isolation opening and a second isolation opening, and the step of preparing a light-emitting unit at least partially located in the isolation opening and a packaging unit located on a side of the light-emitting unit away from the substrate includes:

[0093] forming a light-emitting material layer of a first light-emitting unit in the first isolation opening, wherein the light-emitting material layer of the first light-emitting unit extends to a side of the isolation structure away from the substrate and extends into the groove;

[0094] forming a second electrode material layer on a side of the light-emitting material layer of the first light-emitting unit away from the substrate;

[0095] forming a first packaging material layer of the first light-emitting unit on a side of the second electrode material layer of the first light-emitting unit away from the substrate;

[0096] A first etching protection layer is formed in the first isolation opening and is located on a side of the first packaging material layer of the first light-emitting unit away from the substrate, wherein the orthographic projection of the first etching protection layer on the substrate covers the orthographic projection of the first isolation opening on the substrate and covers a portion of the orthographic projection of the groove on the substrate;

[0097] The first packaging material layer, the second electrode material layer and the light-emitting material layer of the first light-emitting unit that are not covered by the first etching protection layer are removed, and the first etching protection layer is removed to form a light-emitting portion and a second electrode of the first light-emitting unit in the first isolation opening, and to form a first packaging unit located on the side of the second electrode away from the substrate.

[0098] In some possible implementations, after the step of removing the first encapsulation material layer, the second electrode material layer, and the light-emitting material layer of the first light-emitting unit that are not covered by the first etching protection layer, and removing the first etching protection layer, the step further includes:

[0099] forming a light-emitting material layer of a second light-emitting unit in the second isolation opening, wherein the light-emitting material layer of the second light-emitting unit extends to a side of the first packaging unit away from the substrate;

[0100] Sequentially forming a second electrode material layer and a first packaging material layer of the second light-emitting unit on a side of the light-emitting material layer of the second light-emitting unit away from the substrate;

[0101] A second etching protection layer is formed in the second isolation opening and is located on a side of the first packaging material layer of the second light-emitting unit away from the substrate, wherein the orthographic projection of the second etching protection layer on the substrate covers the orthographic projection of the second isolation opening on the substrate and covers a portion of the orthographic projection of the groove on the substrate;

[0102] The first packaging material layer, the second electrode material layer and the light-emitting material layer of the second light-emitting unit that are not covered by the second etching protection layer are removed, and the second etching protection layer is removed to form a light-emitting portion and a second electrode of the second light-emitting unit in the second isolation opening, and to form a second packaging unit located on the side of the second electrode away from the substrate.

[0103] In some possible implementations, the present application further provides a display device, which includes the display panel described in the present application, or includes a display panel prepared by the method for preparing the display panel described in the present application.

[0104] Compared with the prior art, this application has the following beneficial effects:

[0105] The present application provides a display panel, a method for preparing a display panel, and a display device. By providing a groove penetrating the second isolation portion and at least a portion of the first isolation portion on a side of the isolation structure away from the substrate, and extending the packaging unit into the groove, the stability of the packaging unit can be greatly improved, so that the packaging unit located on the side of the isolation structure away from the substrate is not easily damaged, thereby improving the packaging effect of the packaging unit on the light-emitting unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0106] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0107] Figure 1 A schematic cross-sectional view of a display panel in the related art provided by an embodiment of the present application;

[0108] Figure 2 A partial top view schematic diagram of a display panel provided in an embodiment of the present application;

[0109] Figure 3 Provided in the embodiments of this application Figure 2 One of the cross-sectional views at AA in the middle;

[0110] Figure 4 Provided in the embodiments of this application Figure 2The second cross-sectional view at AA in the middle;

[0111] Figure 5 Provided in the embodiments of this application Figure 2 The third cross-sectional view at AA in the middle;

[0112] Figure 6 Provided in the embodiments of this application Figure 2 The fourth cross-sectional view at AA in the middle;

[0113] Figure 7a A cross-sectional schematic diagram of a display panel provided in an embodiment of the present application including a second encapsulation layer and a third encapsulation layer;

[0114] Figure 7b The isolation structure of the display panel provided in the embodiment of the present application includes a cross-sectional schematic diagram of a first isolation portion, a second isolation portion and a third isolation portion;

[0115] Figure 7c A schematic cross-sectional view of a third isolation portion of a display panel provided in an embodiment of the present application including a first isolation sub-portion, a second isolation sub-portion and a third isolation sub-portion;

[0116] Figure 7d A schematic cross-sectional view of a display panel isolation structure provided in an embodiment of the present application, in which a groove is provided on a side away from a substrate;

[0117] Figure 8 A schematic diagram of a process for preparing a display panel provided in an embodiment of the present application;

[0118] Fig. 9 A cross-sectional schematic diagram of forming a first electrode layer on one side of a substrate provided in an embodiment of the present application;

[0119] Fig.10 A cross-sectional schematic diagram of sequentially forming a pixel defining material layer and an isolation material layer on a side of a first electrode layer away from a substrate provided in an embodiment of the present application;

[0120] Fig.11 A schematic cross-sectional view of a first photoresist layer patterned on a side of a fifth isolation material layer away from a substrate provided in an embodiment of the present application;

[0121] Fig.12 A schematic cross-sectional view of the embodiment of the present application after removing the fifth isolation material layer and the fourth isolation material layer not covered by the first photoresist layer;

[0122] Fig.13 The cross-sectional view after removing the third isolation material layer, the second isolation material layer and the first isolation material layer not covered by the first photoresist layer provided in the embodiment of the present application;

[0123] Fig.14 The cross-sectional view after removing the first photoresist layer provided in the embodiment of the present application;

[0124] Fig.15 A cross-sectional view of a second photoresist layer patterned on a side of the fifth isolation material layer away from the substrate and a side of the exposed pixel definition material layer away from the substrate provided in an embodiment of the present application;

[0125] Fig.16 The cross-sectional view after removing the fifth isolation material layer and the fourth isolation material layer not covered by the second photoresist layer provided in the embodiment of the present application;

[0126] Fig.17 A schematic cross-sectional view of a pixel defining material layer after patterning provided in an embodiment of the present application;

[0127] Fig.18 A schematic cross-sectional view of a light-emitting material layer of a first light-emitting unit formed in a first isolation opening according to an embodiment of the present application;

[0128] Fig.19 A cross-sectional view of forming a second electrode material layer on a side of the light-emitting material layer of the first light-emitting unit away from the substrate provided in an embodiment of the present application;

[0129] Fig. 20 A cross-sectional view of forming a first encapsulation material layer of a first light-emitting unit on a side of a second electrode material layer of the first light-emitting unit away from a substrate provided in an embodiment of the present application;

[0130] Fig.21 A schematic cross-sectional view of a first etching protection layer formed in a first isolation opening and located on a side of a first packaging material layer of a first light-emitting unit away from a substrate provided in an embodiment of the present application;

[0131] Fig. 22 A schematic cross-sectional view of the embodiment of the present application after removing the first encapsulation material layer, the second electrode material layer and the light-emitting material layer of the first light-emitting unit not covered by the first etching protection layer;

[0132] Fig.23 A schematic cross-sectional view of a light-emitting material layer of a second light-emitting unit formed in a second isolation opening according to an embodiment of the present application;

[0133] Fig.24 A cross-sectional view showing that a second electrode material layer and a first encapsulation material layer of a second light-emitting unit are sequentially formed on a side of the light-emitting material layer of the second light-emitting unit away from the substrate provided in an embodiment of the present application;

[0134] Fig.25A cross-sectional schematic diagram of a second etching protection layer formed in a second isolation opening and located on a side of a first packaging material layer of a second light-emitting unit away from a substrate provided in an embodiment of the present application.

[0135] Figure numerals: 1, substrate; 2, pixel defining layer; 201, pixel opening; 3, isolation structure; 31, first isolation portion; 32, second isolation portion; 33, third isolation portion; 331, first isolation sub-portion; 332, second isolation sub-portion; 333, third isolation sub-portion; 4, first electrode; 5, light-emitting portion; 6, second electrode; 7, light-emitting unit; 8, packaging unit; 81, first packaging unit; 811, first suspended portion; 82, second packaging unit; 821, second suspended portion; 9, isolation opening; 91, first isolation opening; 92, second isolation opening; 10, recess Groove; 11, first filling layer; 12, second filling layer; 13, second encapsulation layer; 14, third encapsulation layer; 15, pixel defining material layer; 16, isolation material layer; 161, first isolation material layer; 162, second isolation material layer; 163, third isolation material layer; 164, fourth isolation material layer; 165, fifth isolation material layer; 17, first photoresist layer; 18, second photoresist layer; 19, light-emitting material layer; 20, second electrode material layer; 21, first encapsulation material layer; 22, first etching protection layer; 23, second etching protection layer; 24, recessed structure. DETAILED DESCRIPTION

[0136] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0137] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0138] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0139] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the inventive product is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0140] It should be noted that, in the absence of conflict, different features in the embodiments of the present application may be combined with each other.

[0141] Improving the density of light-emitting units in a display panel (i.e., pixel density) is an important way to improve display effects. However, the display panels currently made using fine metal evaporation mask (FMM) technology cannot further increase the density of light-emitting units due to technical limitations. The inventors have found through long-term research that in order to solve the technical problem that the density of light-emitting units cannot be further increased, an isolation structure is set in some display panels. When the light-emitting functional layer and the second electrode are evaporated in the entire layer, the light-emitting functional layer and the second electrode can be disconnected at the isolation structure. Through multiple evaporation and multiple etching processes (i.e., light-emitting unit patterning), light-emitting units of different colors can be formed in different isolation openings.

[0142] Among them, patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN20241099419, PCT / CN20241099072, CN117979755A, CN117998 900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A record relevant technical solutions of isolation structure and encapsulation layer, and their contents are incorporated into this application by reference for reference.

[0143] See also Figure 1The display panel in the related art includes a substrate 1, an isolation structure 3 located on one side of the substrate 1, a light-emitting unit 7 located in an isolation opening 9 formed by the isolation structure 3, and a packaging unit 8 located on a side of the light-emitting unit 7 away from the substrate 1. There is a gap between the packaging unit 8 located on the side of the isolation structure 3 away from the substrate 1 and the isolation structure 3. Therefore, the packaging unit 8 located on the side of the isolation structure 3 away from the substrate 1 is in a suspended state. In the subsequent preparation process of the display panel, the suspended packaging unit 8 is easily broken, thereby affecting the packaging effect and product yield of the display panel.

[0144] In order to solve the above-mentioned technical problems, the inventor innovatively designed the following technical solutions, and the specific implementation solutions of the present application will be described in detail below in conjunction with the accompanying drawings. It should be noted that the defects existing in the solutions in the above-mentioned prior art are the results obtained by the inventor after practice and careful research. Therefore, the discovery process of the above-mentioned technical problems and the solutions proposed in this embodiment below for the above-mentioned problems should all be the contributions made by the inventor to the present application in the process of invention and creation, and should not be understood as the technical content known to those skilled in the art.

[0145] See also Figure 2 and Figure 3 This embodiment provides a display panel, which includes a substrate 1, an isolation structure 3, a light-emitting unit 7 and a packaging unit 8.

[0146] The substrate 1 may include a substrate and a plurality of drive units located on one side of the substrate, and each drive unit may include one or more semiconductor switch devices. The semiconductor switch device may be formed by the cooperation of a plurality of film layers in the substrate 1, for example, the semiconductor switch device may be a thin film transistor formed by the cooperation of a plurality of film layers.

[0147] The isolation structure 3 is located on one side of the substrate 1. The isolation structure 3 encloses an isolation opening 9. A groove 10 recessed toward the substrate 1 is provided on the side of the isolation structure 3 away from the substrate 1. The isolation structure 3 includes a first isolation portion 31 and a second isolation portion 32 stacked in a direction away from the substrate 1. The groove 10 penetrates the second isolation portion 32 and penetrates at least a portion of the first isolation portion 31.

[0148] The light-emitting unit 7 is at least partially located in the isolation opening 9; the packaging unit 8 is located on the side of the light-emitting unit 7 away from the substrate 1, and at least part of the packaging unit 8 extends from the side of the isolation structure 3 toward the isolation opening 9 to the side of the isolation structure 3 away from the substrate 1, and extends to the side wall of the isolation structure 3 toward the groove 10.

[0149] The groove 10 completely penetrates the second isolation part 32 and penetrates at least part of the first isolation part 31. For example, it can penetrate part of the first isolation part 31 or completely penetrate the first isolation part 31. In this way, a deep groove 10 is formed on the isolation structure 3, and the packaging unit 8 extends to the side wall of the groove 10 and fits tightly with the side wall of the groove 10, thereby greatly improving the adhesion between the packaging unit 8 and the isolation structure 3. In the subsequent preparation process of the display panel, it is not easy for the packaging unit 8 to fall off the isolation structure 3, thereby improving the packaging effect and product yield of the display panel.

[0150] Based on the above design, this embodiment can greatly improve the stability of the packaging unit 8 by setting a groove 10 that passes through the second isolation part 32 and at least a part of the first isolation part 31 on the side of the isolation structure 3 away from the substrate 1, and extending the packaging unit 8 into the groove 10, so that the packaging unit 8 located on the side of the isolation structure 3 away from the substrate 1 is not easily damaged, thereby improving the packaging effect of the packaging unit 8 on the light-emitting unit 7.

[0151] For some possible implementations, see again Figure 3 The display panel also includes a pixel defining layer 2 located on a side of the first electrode 4 away from the substrate 1, and the isolation structure 3 is located on a side of the pixel defining layer 2 away from the substrate 1; the pixel defining layer 2 includes a pixel opening 201 exposing at least a portion of the first electrode 4, and the orthographic projection of the pixel opening 201 on the substrate 1 is located within the orthographic projection of the isolation opening 9 on the substrate 1, and the light-emitting unit 7 includes a first electrode 4, a light-emitting portion 5, and a second electrode 6 which are sequentially stacked in a direction away from the substrate 1.

[0152] The setting of the isolation structure 3 enables the display panel to form film layers of light-emitting units 7 of different colors in different isolation openings 9 without the need for a fine metal mask. When forming the light-emitting material layer 19, the light-emitting material layer 19 will be separated by the isolation structure 3 to form a plurality of light-emitting portions 5 arranged at intervals. When forming the second electrode material layer 20, the second electrode material layer 20 will be separated by the isolation structure 3 to form a plurality of second electrodes 6 arranged at intervals. The isolation structure 3 includes a conductive material. The second electrode 6 is electrically connected to the isolation structure 3. A first electrode 4, a light-emitting portion 5 and a second electrode 6 form a light-emitting unit 7. Among them, the first electrode 4 can be an anode, and the second electrode 6 can be a cathode.

[0153] In this way, different light-emitting units 7 can be made independent of each other, thereby improving the crosstalk between adjacent light-emitting units 7 and improving the display effect of the display panel. At the same time, due to the existence of the isolation structure 3, the light-emitting material layer 19 and the second electrode material layer 20 in the light-emitting unit 7 of each color in the display panel can be first prepared on the entire surface and then patterned, thereby eliminating the fine metal mask plate, thereby saving the preparation cost of the display panel.

[0154] For some possible implementations, see again Figure 3 The orthographic projection of the side of the first isolation portion 31 away from the substrate 1 on the substrate 1 is located within the orthographic projection of the second isolation portion 32 on the substrate 1 , and the contact between the first isolation portion 31 and the second isolation portion 32 has a recessed structure 24 recessed in a direction away from the groove 10 , and the packaging unit 8 extends into the recessed structure 24 .

[0155] Since the orthographic projection of the side of the first isolation portion 31 away from the substrate 1 on the substrate 1 is located within the orthographic projection of the second isolation portion 32 on the substrate 1, when the light-emitting material layer 19 is formed, the light-emitting material layer 19 is more easily separated by the isolation structure 3 to form a plurality of spaced-apart light-emitting portions 5, and when the second electrode material layer 20 is formed, the second electrode material layer 20 is more easily separated by the isolation structure 3 to form a plurality of spaced-apart second electrodes 6.

[0156] The packaging unit 8 extends into the recessed structure 24 and is embedded with the recessed structure 24 , so that the adhesion between the packaging unit 8 and the isolation structure 3 can be further increased, thereby making it more difficult for the packaging unit 8 to fall off the isolation structure 3 .

[0157] Preferably, see again Figure 2 and Figure 3 , the orthographic projection of the groove 10 on the substrate 1 is located outside the orthographic projection of the isolation opening 9 on the substrate 1 .

[0158] Optionally, the orthographic projection of the groove 10 on the substrate 1 is located between the orthographic projections of two adjacent isolation openings 9 on the substrate 1 .

[0159] In this way, the groove 10 provided on the isolation structure 3 does not affect the light-emitting effect of the light-emitting unit 7 in the isolation opening 9 .

[0160] Preferably, the orthographic projection of the groove 10 on the substrate 1 surrounds at least part of the orthographic projection of the isolation opening 9 on the substrate 1 .

[0161] More specifically, the orthographic projection of the groove 10 on the substrate 1 completely surrounds the orthographic projection of the isolation opening 9 on the substrate 1 , and the orthographic projection of the groove 10 on the substrate 1 is mesh-shaped, so that the packaging unit 8 extending into the groove 10 can be more stably arranged on the isolation structure 3 .

[0162] For some possible implementations, see Figure 4 The isolation structure 3 further includes a third isolation portion 33 located on the side of the first isolation portion 31 facing the substrate 1 , and the orthographic projection of the groove 10 on the substrate 1 is located within the orthographic projection of the third isolation portion 33 on the substrate 1 .

[0163] Along the thickness direction Z of the substrate 1, the groove 10 sequentially penetrates the second isolation portion 32 and the first isolation portion 31, and the bottom wall of the groove 10 includes a portion of the surface of the third isolation portion 33 away from the substrate 1. Therefore, the groove 10 extends in the direction of the substrate 1 to the side of the third isolation portion 33 away from the substrate 1. The material of the third isolation portion 33 includes a conductive material, and the second electrode 6 of the light-emitting unit 7 extends to be electrically connected to the third isolation portion 33. In this way, the second electrodes 6 of different light-emitting units 7 can be electrically connected through the third isolation portion 33.

[0164] For some possible implementations, see Figure 2 and Figure 5 The light-emitting unit 7 includes a first light-emitting unit and a second light-emitting unit, and the encapsulation unit 8 includes a first encapsulation unit 81 and a second encapsulation unit 82. The first encapsulation unit 81 is located on a side of the first light-emitting unit away from the substrate 1, and the second encapsulation unit 82 is located on a side of the second light-emitting unit away from the substrate 1.

[0165] In this way, the first encapsulation unit 81 can independently encapsulate the first light-emitting unit, and the second encapsulation unit 82 can independently encapsulate the second light-emitting unit, thereby improving the encapsulation effect of the light-emitting unit 7 .

[0166] Preferably, see Figure 2 and Figure 5 The first packaging unit 81 includes a first suspended portion 811 located in the groove 10 , and a first gap is formed between a side of the first suspended portion 811 facing the substrate 1 and a side of the third isolation portion 33 away from the substrate 1 .

[0167] Along the thickness direction Z of the substrate 1 , the height H1 of the first gap is equal to the sum of the thicknesses of the light emitting portion 5 of the first light emitting unit and the second electrode 6 .

[0168] In the process of forming the first light-emitting unit, the light-emitting portion 5 and the second electrode 6 between the first suspended portion 811 and the third isolation structure 3 are removed to form a first gap. Therefore, the height H1 of the first gap is equal to the sum of the thicknesses of the light-emitting portion 5 and the second electrode 6 of the first light-emitting unit.

[0169] Preferably, see Figure 2 and Figure 5The second packaging unit 82 includes a second suspended portion 821 located in the groove 10 , and a second gap is provided between a side of the second suspended portion 821 facing the substrate 1 and a side of the third isolation portion 33 away from the substrate 1 .

[0170] Along the thickness direction Z of the substrate 1 , the height H2 of the second gap is equal to the sum of the thicknesses of the light emitting portion 5 of the second light emitting unit and the second electrode 6 .

[0171] In the process of forming the second light-emitting unit, the light-emitting portion 5 and the second electrode 6 between the second suspended portion 821 and the third isolation structure 3 are removed to form a second gap. Therefore, the height H2 of the second gap is equal to the sum of the thicknesses of the light-emitting portion 5 and the second electrode 6 of the second light-emitting unit.

[0172] Preferably, the first suspended portion 811 and the second suspended portion 821 are spaced apart, and a portion between the first suspended portion 811 and the second suspended portion 821 is removed, so that the first suspended portion 811 and the second suspended portion 821 are spaced apart.

[0173] For some possible implementations, see Figure 6 The third isolation portion 33 includes a first isolation sub-portion 331 and a second isolation sub-portion 332 which are sequentially stacked in a direction away from the substrate 1 . The first isolation sub-portion 331 includes a conductive material. The second electrode 6 of the light-emitting unit 7 extends to be electrically connected to the first isolation sub-portion 331 .

[0174] Optionally, the third isolation portion 33 also includes a third isolation sub-portion 333 located on the side of the first isolation sub-portion 331 facing the substrate 1, the third isolation sub-portion 333 includes a conductive material, and the second electrode 6 of the light-emitting unit 7 extends to be electrically connected to the first isolation sub-portion 331 and the third isolation sub-portion 333.

[0175] Optionally, the corrosion resistance of the second spacer sub-portion 332 is stronger than that of the first spacer sub-portion 331 .

[0176] Optionally, the conductivity of the first isolating sub-portion 331 is stronger than the conductivity of the second isolating sub-portion 332 .

[0177] Since the corrosion resistance of the second isolation sub-portion 332 is stronger than that of the first isolation sub-portion 331, the second isolation sub-portion 332 is not easily etched during the preparation of the display panel. The second isolation sub-portion 332 can protect the first isolation sub-portion 331, and the first isolation sub-portion 331 is not easily damaged during the preparation of the display panel (for example, the subsequent wet etching process).

[0178] Since the conductivity of the first isolating sub-portion 331 is stronger than that of the second isolating sub-portion 332 , the first isolating sub-portion 331 has good conductivity, the impedance of the electrical connection between the second electrode 6 and the first isolating sub-portion 331 is smaller, and the power signal of the second electrode 6 can be better transmitted through the first isolating sub-portion 331 .

[0179] Optionally, the material of the first isolation portion 31 includes a conductive material, and the material of the first isolation portion 31 includes aluminum or copper.

[0180] Optionally, the material of the second isolation portion 32 includes a conductive material, and the material of the second isolation portion 32 includes titanium or titanium nitride.

[0181] Optionally, the material of the first spacer portion 331 includes aluminum or copper.

[0182] Optionally, the material of the second isolating sub-portion 332 includes a conductive material, and the material of the second isolating sub-portion 332 includes indium tin oxide, indium zinc oxide, or indium gallium zinc oxide.

[0183] Optionally, the material of the third spacer portion 333 includes at least one of molybdenum, titanium nitride, molybdenum nitride, titanium, or indium tin oxide.

[0184] Reasonable selection of materials for the first isolating portion 31 , the second isolating portion 32 , the first isolating sub-portion 331 , the second isolating sub-portion 332 and the third isolating sub-portion 333 can improve the problem of the breakage of the packaging unit 8 while ensuring that the power signal of the second electrode 6 can be well transmitted through the first isolating sub-portion.

[0185] For some possible implementations, see again Figure 6 Along the direction Z away from the substrate 1 , a first filling layer 11 and a second filling layer 12 are sequentially provided between a side of the second isolation portion 32 away from the substrate 1 and the packaging unit 8 .

[0186] The first filling layer 11 and the second filling layer 12 can fill the gap between the packaging unit 8 located on the side of the isolation structure 3 away from the substrate 1 and the isolation structure 3, so that the packaging unit 8 located on the side of the isolation structure 3 away from the substrate 1 is not in a suspended state, and thus the packaging unit 8 located on the side of the isolation structure 3 away from the substrate 1 is less likely to fall off the isolation structure 3.

[0187] Preferably, the material of the first filling layer 11 is the same as that of the light-emitting portion 5 , and the first filling layer 11 is in the same layer as the light-emitting portion 5 ; the material of the second filling layer 12 is the same as that of the second electrode 6 , and the second filling layer 12 is in the same layer as the second electrode 6 .

[0188] The first filling layer 11 is formed while the light emitting portion 5 is formed, and the second filling layer 12 is formed while the second electrode 6 is formed. Therefore, there is no need to specially set up a process for forming the first filling layer 11 and the second filling layer 12, thereby reducing the preparation cost of forming the first filling layer 11 and the second filling layer 12.

[0189] For some possible implementations, see again Figure 6 The minimum distance between the edge of the orthographic projection of the side of the first isolation portion 31 away from the substrate 1 and the edge of the orthographic projection of the second isolation portion 32 toward the isolation opening 9 on the substrate 1 is the first extension distance D1, and the minimum distance between the edge of the orthographic projection of the side of the first isolation portion 31 away from the substrate 1 and the edge of the orthographic projection of the second isolation portion 32 toward the groove 10 on the substrate 1 is the second extension distance D2, and the second extension distance D2 is smaller than the first extension distance D1.

[0190] During the formation of the isolation structure 3 , since the etching amount of the isolation structure 3 toward the isolation opening 9 is greater than the etching amount of the isolation structure 3 toward the groove 10 , the second extension distance D2 is smaller than the first extension distance D1 .

[0191] Specifically, the first extension distance D1 is greater than or equal to 0.3 μm and less than or equal to 1 μm. For example, the first extension distance D1 may be 0.3 μm, 0.5 μm, 0.7 μm, 0.9 or 1 μm, etc.

[0192] The second extension distance D2 is greater than or equal to 0.1 μm and less than or equal to 0.6 μm. For example, the second extension distance D2 may be 0.1 μm, 0.2 μm, 0.3 μm, 0.4 μm, 0.5 μm or 0.6 μm.

[0193] Reasonable setting of the first extension distance D1 and the second extension distance D2 can ensure the stability of the isolation structure 3 while enabling the packaging unit 8 to be more stably arranged on the isolation structure 3 .

[0194] For some possible implementations, see Figure 7a The display panel further includes a second encapsulation layer 13 located on a side of the encapsulation unit 8 away from the substrate 1 and a third encapsulation layer 14 located on a side of the second encapsulation layer 13 away from the substrate 1 .

[0195] Optionally, the materials of the encapsulation unit 8 and the third encapsulation layer 14 both include inorganic materials.

[0196] Optionally, the material of the second encapsulation layer 13 includes an organic material.

[0197] For example, the encapsulation unit 8 and the third encapsulation layer 14 can be formed by chemical vapor deposition (CVD), and the second encapsulation layer 13 can be formed by inkjet printing (IJP). The second encapsulation layer 13 and the third encapsulation layer 14 can provide a better encapsulation effect on the light-emitting unit 7, thereby further improving the encapsulation quality of the display panel.

[0198] For some possible implementations, see Figure 7b The present application also provides a display panel, which includes a substrate 1, an isolation structure 3 and a light-emitting unit 7.

[0199] The isolation structure 3 is located on one side of the substrate 1. The isolation structure 3 encloses an isolation opening 9. The isolation structure 3 includes a third isolation portion 33, a first isolation portion 31, and a second isolation portion 32 which are sequentially stacked in a direction away from the substrate 1. The third isolation portion 33 includes a first isolation sub-portion 331 and a second isolation sub-portion 332 which are sequentially stacked in a direction away from the substrate 1. The first isolation sub-portion 331 includes a conductive material. The corrosion resistance of the second isolation sub-portion 332 is stronger than that of the first isolation sub-portion 331.

[0200] At least part of the light emitting unit 7 is located in the isolation opening 9 . The light emitting unit 7 includes a second electrode 6 . The second electrode 6 is electrically connected to the first isolation sub-portion 331 .

[0201] In the related art, during the preparation process of the display panel (such as wet etching process), the first isolating sub-portion 331 is easily etched, resulting in poor overlap between the second electrode 6 of the light-emitting unit 7 and the first isolating sub-portion 331, affecting the light-emitting effect of the light-emitting unit and ultimately affecting the display effect of the display panel.

[0202] In this embodiment, since the corrosion resistance of the second isolating sub-portion 332 is stronger than that of the first isolating sub-portion 331, and the second isolating sub-portion 332 is located on the side of the first isolating sub-portion 331 away from the substrate 1, the second isolating sub-portion 332 is not easily etched during the preparation of the display panel, and the second isolating sub-portion 332 can protect the first isolating sub-portion 331. During the preparation of the display panel, the first isolating sub-portion 331 is not easily damaged, thereby improving the overlapping effect between the second electrode 6 and the first isolating sub-portion 331, and ultimately improving the display effect of the display panel.

[0203] For some possible implementations, see Figure 7cThe third isolation part 33 also includes a third isolation sub-part 333 located on the side of the first isolation sub-part 331 facing the substrate 1, the third isolation sub-part 333 includes a conductive material, and the second electrode 6 of the light-emitting unit 7 extends to be electrically connected to the first isolation sub-part 331 and the third isolation sub-part 333. In this way, the overlapping effect of the second electrode 6 and the isolation structure 3 can be further improved.

[0204] For some possible implementations, see Figure 7d A groove 10 recessed toward the substrate 1 is provided on a side of the isolation structure 3 away from the substrate 1 , and the groove 10 penetrates the second isolation portion 32 and penetrates at least a portion of the first isolation portion 31 .

[0205] Furthermore, along the thickness direction of the substrate 1 , the groove 10 penetrates the first isolation portion 31 .

[0206] Please see again Figure 6 The packaging unit 8 of the display panel can extend to the side wall of the groove 10 and fit tightly with the side wall of the groove 10, thereby greatly improving the adhesion between the packaging unit 8 and the isolation structure 3. In the subsequent preparation process of the display panel, it is not easy for the packaging unit 8 to fall off the isolation structure 3, thereby improving the packaging effect and product yield of the display panel.

[0207] The remaining solutions of the display panel in this embodiment are the same as those of the display panel in the above embodiment, and will not be described again.

[0208] For some possible implementations, see Figure 8 The present application also provides a method for preparing a display panel, the method comprising:

[0209] S10: providing a substrate 1.

[0210] S11: An isolation structure 3 is formed on one side of the substrate 1, and the isolation structure 3 encloses an isolation opening 9. A groove 10 recessed toward the substrate 1 is provided on the side of the isolation structure 3 away from the substrate 1. The isolation structure 3 includes a first isolation portion 31 and a second isolation portion 32 stacked in a direction away from the substrate 1, and the groove 10 penetrates the second isolation portion 32 and penetrates at least a portion of the first isolation portion 31.

[0211] S12: Prepare a light-emitting unit 7 that is at least partially located in the isolation opening 9 and a packaging unit 8 that is located on the side of the light-emitting unit 7 away from the substrate 1, wherein at least part of the packaging unit 8 extends from the side of the isolation structure 3 toward the isolation opening 9 to the side of the isolation structure 3 away from the substrate 1, and extends to the side wall of the isolation structure 3 toward the groove 10.

[0212] The groove 10 on the isolation structure 3 in the display panel formed by the above method completely penetrates the second isolation part 32 and penetrates at least part of the first isolation part 31. For example, part of the first isolation part 31 can be penetrated, or the first isolation part 31 can be completely penetrated. In this way, a groove 10 with a relatively deep depth will be formed on the isolation structure 3, and the packaging unit 8 will extend to the side wall of the groove 10 and fit tightly with the side wall of the groove 10, thereby greatly improving the bonding force between the packaging unit 8 and the isolation structure 3. In the subsequent preparation process of the display panel, it is not easy for the packaging unit 8 to fall off the isolation structure 3, thereby improving the packaging effect and product yield of the display panel.

[0213] In some possible implementations, the step of forming the isolation structure 3 on one side of the substrate 1 includes:

[0214] See also Fig. 9 A first electrode layer is formed on one side of the substrate 1 , and the first electrode layer includes a plurality of first electrodes 4 arranged at intervals.

[0215] See also Fig.10 A pixel defining material layer 15 and an isolation material layer 16 are sequentially formed on a side of the first electrode layer away from the substrate 1 .

[0216] The isolation material layer 16 is patterned to form an isolation structure 3 .

[0217] Specifically, the isolation material layer 16 includes a first isolation material layer 161 , a second isolation material layer 162 , a third isolation material layer 163 , a fourth isolation material layer 164 and a fifth isolation material layer 165 which are sequentially stacked in a direction away from the substrate 1 .

[0218] See also Fig.11 , a patterned first photoresist layer 17 is formed on a side of the fifth isolation material layer 165 away from the substrate 1 .

[0219] See also Fig.12 The fifth isolation material layer 165 and the fourth isolation material layer 164 not covered by the first photoresist layer 17 are removed by dry etching, and a portion of the third isolation material layer 163 away from the substrate 1 is exposed.

[0220] See also Fig.13 The third isolation material layer 163 , the second isolation material layer 162 and the first isolation material layer 161 not covered by the first photoresist layer 17 are removed by wet etching, and the pixel defining material layer 15 is exposed to form an isolation opening 9 .

[0221] See also Fig.14 , remove the first photoresist layer 17.

[0222] See also Fig.15 A patterned second photoresist layer 18 is formed on a side of the fifth isolation material layer 165 away from the substrate 1 and a side of the exposed pixel definition material layer 15 away from the substrate 1 .

[0223] See also Fig.16 , the fifth isolation material layer 165 and the fourth isolation material layer 164 not covered by the second photoresist layer 18 are removed, and the second photoresist layer 18 is removed to form an isolation structure 3 including a groove 10 .

[0224] The fourth isolation material layer 164 is easier to be side-etched than the fifth isolation material layer 165 . Therefore, the orthographic projection of the side of the first isolation portion 31 that is finally formed away from the substrate 1 on the substrate 1 is located within the orthographic projection of the second isolation portion 32 on the substrate 1 .

[0225] The third isolation material layer 163 is not easily etched, so it is not easy to remove the third isolation material layer 163 when removing the fifth isolation material layer 165 and the fourth isolation material layer 164 . Therefore, the third isolation material layer 163 can protect the first isolation material layer 161 and the second isolation material layer 162 .

[0226] Finally, the first isolation material layer 161 is patterned to form the third isolation sub-section 333, the second isolation material layer 162 is patterned to form the first isolation sub-section 331, the third isolation material layer 163 is patterned to form the second isolation sub-section 332, the fourth isolation material layer 164 is patterned to form the first isolation section 31, and the fifth isolation material layer 165 is patterned to form the second isolation section 32.

[0227] See also Fig.17 The pixel defining material layer 15 is patterned to form a pixel defining layer 2 . The pixel defining layer 2 includes a pixel opening 201 . The pixel opening 201 is connected to the isolation opening 9 .

[0228] In this embodiment, the isolation structure 3 including the groove 10 can be formed more easily by the above method.

[0229] In some possible implementations, the isolation opening 9 includes a first isolation opening 91 and a second isolation opening 92, and the steps of preparing the light-emitting unit 7 at least partially located in the isolation opening 9 and the packaging unit 8 located on the side of the light-emitting unit away from the substrate 1 include:

[0230] See also Fig.18 A light-emitting material layer 19 of the first light-emitting unit is formed in the first isolation opening 91 , and the light-emitting material layer 19 of the first light-emitting unit extends to a side of the isolation structure 3 away from the substrate 1 and extends into the groove 10 .

[0231] The light-emitting material layer 19 is disconnected at the isolation structure 3 , so that at least part of the light-emitting material layer 19 is located in the first isolation opening 91 to form a light-emitting portion 5 . By controlling the evaporation angle, the light-emitting portion 5 is prevented from contacting the isolation structure 3 .

[0232] See also Fig.19 A second electrode material layer 20 is formed on a side of the light-emitting material layer 19 of the first light-emitting unit away from the substrate 1 .

[0233] The second electrode material layer 20 is disconnected at the isolation structure 3, so that at least part of the second electrode material layer 20 is located in the first isolation opening 91 to form the second electrode 6. By controlling the evaporation angle, the second electrode 6 can be extended from the isolation opening 9 to electrically contact the isolation structure 3 to connect adjacent second electrodes 6 or connect the second electrode 6 to other circuits. In this way, the manufacturing difficulty of the display panel can be reduced.

[0234] See also Fig. 20 A first encapsulation material layer 21 of the first light-emitting unit is formed on a side of the second electrode material layer 20 of the first light-emitting unit away from the substrate 1 .

[0235] See also Fig.21 A first etching protection layer 22 is formed in the first isolation opening 91 on the side of the first packaging material layer 21 of the first light-emitting unit away from the substrate 1, and the orthographic projection of the first etching protection layer 22 on the substrate 1 covers the orthographic projection of the first isolation opening 91 on the substrate 1 and covers the orthographic projection of part of the groove 10 on the substrate 1.

[0236] The first etching protection layer 22 can protect the corresponding light emitting material layer 19 , the second electrode material layer 20 and the encapsulation unit of the first light emitting unit.

[0237] See also Fig. 22 , remove the first packaging material layer 21, the second electrode material layer 20 and the light-emitting material layer 19 of the first light-emitting unit that are not covered by the first etching protection layer 22, and remove the first etching protection layer 22 to form the light-emitting portion 5 and the second electrode 6 of the first light-emitting unit in the first isolation opening 91, and form a first packaging unit 81 located on the side of the second electrode 6 away from the substrate 1.

[0238] After removing the first packaging unit 81, the light-emitting material layer 19 and the second electrode material layer 20 that are not covered by the first etching protection layer 22, the first electrode 4, the light-emitting portion 5 of the first light-emitting unit and the second electrode 6 form a first light-emitting unit, and the first light-emitting unit is completely covered by the first packaging unit 81, thereby reducing the risk of the evaporation material entering the evaporation equipment after being exposed to the air, causing equipment contamination and film layer disconnection.

[0239] In this way, the light-emitting portion 5, the second electrode 6 and the first packaging unit 81 can be formed only in the first isolation opening 91 without the need for a precise mask, and the second electrode 6 can be electrically connected to the isolation structure 3, so that the first light-emitting unit can be formed in the first isolation opening 91 at a lower cost.

[0240] Since the orthographic projection of the first etching protection layer 22 on the substrate 1 covers part of the orthographic projection of the groove 10 on the substrate 1 , after patterning the first light-emitting unit and the first packaging material layer 21 of the first light-emitting unit, the first packaging unit 81 will extend into the groove 10 and fit with the side wall of the groove 10 .

[0241] See also Fig.23 A light-emitting material layer 19 of the second light-emitting unit is formed in the second isolation opening 92 , and the light-emitting material layer 19 of the second light-emitting unit extends to a side of the first encapsulation unit 81 away from the substrate 1 .

[0242] On the basis of forming the first light-emitting unit, the light-emitting material layer 19 of the second light-emitting unit is continuously formed. The light-emitting material layer 19 of the second light-emitting unit will cover the first packaging unit 81 corresponding to the first light-emitting unit. At the same time, the light-emitting portion 5 of the second light-emitting unit will be formed in the second isolation opening 92 .

[0243] See also Fig.24 A second electrode material layer 20 and a first packaging material layer 21 of the second light-emitting unit are sequentially formed on the side of the light-emitting material layer 19 of the second light-emitting unit away from the substrate 1 .

[0244] See also Fig.25 A second etching protection layer 23 is formed in the second isolation opening 92 on the side of the first packaging material layer 21 of the second light-emitting unit away from the substrate 1, and the orthographic projection of the second etching protection layer 23 on the substrate 1 covers the orthographic projection of the second isolation opening 92 on the substrate 1 and covers the orthographic projection of part of the groove 10 on the substrate 1.

[0245] Please see again Figure 6 , remove the first packaging material layer 21, the second electrode material layer 20 and the light-emitting material layer 19 of the second light-emitting unit not covered by the second etching protection layer 23, and remove the second etching protection layer 23 to form the light-emitting portion 5 and the second electrode 6 of the second light-emitting unit in the second isolation opening 92, and form a second packaging unit 82 located on the side of the second electrode 6 away from the substrate 1.

[0246] Since the orthographic projection of the second etching protection layer 23 on the substrate 1 covers part of the orthographic projection of the groove 10 on the substrate 1 , after patterning the second light-emitting unit and the first packaging material layer 21 of the second light-emitting unit, the second packaging unit 82 will extend into the groove 10 and fit with the side wall of the groove 10 .

[0247] Since the first packaging unit 81 extends into the groove 10 and fits against the side wall of the groove 10, the adhesion between the first packaging unit 81 and the isolation structure 3 can be increased. Therefore, in the process of forming the second light-emitting unit, it is not easy to damage the first packaging unit 81 located on the side of the isolation structure 3 away from the substrate 1, so that the first packaging unit 81 can better encapsulate the first light-emitting unit.

[0248] Since the second packaging unit 82 extends into the groove 10 and fits against the side wall of the groove 10, the adhesion between the second packaging unit 82 and the isolation structure 3 can be increased. Therefore, in the subsequent preparation process of the display panel, the second packaging unit 82 located on the side of the isolation structure 3 away from the substrate 1 is not easily damaged, so that the second packaging unit 82 can better encapsulate the second light-emitting unit, thereby improving the yield of the final product.

[0249] In some possible implementations, the present application further provides a display device, which includes the display panel of the present application, or includes a display panel prepared by the method for preparing a display panel of the present application. The display device may include a device with image processing capabilities, such as a server, a personal computer, a notebook computer, etc. Since the display device includes the display panel of the present application, the display quality of the display device is better.

[0250] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0251] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A display panel, characterized in that: The display panel comprises: substrate; an isolation structure, located on one side of the substrate, the isolation structure encloses an isolation opening, a groove recessed toward the substrate is provided on a side of the isolation structure away from the substrate, the isolation structure comprises a first isolation portion and a second isolation portion stacked in a direction away from the substrate, the groove penetrates the second isolation portion and penetrates at least a portion of the first isolation portion; a light emitting unit, at least partly located in the isolation opening; The packaging unit is located on a side of the light-emitting unit away from the substrate, and at least part of the packaging unit extends from the side of the isolation structure toward the isolation opening to the side of the isolation structure away from the substrate, and extends to the side wall of the isolation structure toward the groove.

2. The display panel according to claim 1, characterized in that: The orthographic projection of a side of the first isolation portion away from the substrate on the substrate is located within the orthographic projection of the second isolation portion on the substrate, a contact portion between the first isolation portion and the second isolation portion has a recessed structure recessed in a direction away from the groove, and the packaging unit extends into the recessed structure; Preferably, the orthographic projection of the groove on the substrate is outside the orthographic projection of the isolation opening on the substrate; Preferably, the orthographic projection of the groove on the substrate is located between the orthographic projections of two adjacent isolation openings on the substrate; Preferably, the orthographic projection of the groove on the substrate surrounds at least part of the orthographic projection of the isolation opening on the substrate; Preferably, the material of the first isolation portion includes a conductive material; Preferably, the material of the first isolation portion includes aluminum or copper; Preferably, the material of the second isolation portion includes a conductive material; Preferably, the material of the second isolation portion includes titanium or titanium nitride.

3. The display panel according to claim 1, characterized in that: The isolation structure further includes a third isolation portion located on a side of the first isolation portion facing the substrate, and an orthographic projection of the groove on the substrate is located within an orthographic projection of the third isolation portion on the substrate; Preferably, along the thickness direction of the substrate, the groove penetrates the first isolation portion; Preferably, the bottom wall of the groove includes a portion of the surface of the third isolation portion on a side away from the substrate.

4. The display panel according to claim 3, characterized in that: The light-emitting unit includes a first light-emitting unit and a second light-emitting unit, the encapsulation unit includes a first encapsulation unit and a second encapsulation unit, the first encapsulation unit is located at a side of the first light-emitting unit away from the substrate, and the second encapsulation unit is located at a side of the second light-emitting unit away from the substrate; Preferably, the first packaging unit comprises a first suspended portion located in the groove, and a first gap is formed between a side of the first suspended portion facing the substrate and a side of the third isolation portion away from the substrate; Preferably, the second packaging unit comprises a second suspended portion located in the groove, and a second gap is formed between a side of the second suspended portion facing the substrate and a side of the third isolation portion away from the substrate; Preferably, the first suspended portion and the second suspended portion are arranged at an interval.

5. The display panel according to claim 4, characterized in that: The light-emitting unit includes a first electrode, a light-emitting portion, and a second electrode which are sequentially stacked in a direction away from the substrate; Preferably, along the thickness direction of the substrate, the height of the first gap is equal to the sum of the thickness of the light-emitting portion of the first light-emitting unit and the second electrode; Preferably, along the thickness direction of the substrate, the height of the second gap is equal to the sum of the thicknesses of the light-emitting portion of the second light-emitting unit and the second electrode.

6. The display panel according to claim 3, characterized in that: The material of the third isolation portion includes a conductive material, and the second electrode of the light emitting unit extends to be electrically connected to the third isolation portion; Preferably, the third isolating portion comprises a first isolating sub-portion and a second isolating sub-portion stacked in sequence in a direction away from the substrate, the first isolating sub-portion comprises a conductive material, and the second electrode of the light-emitting unit extends to be electrically connected to the first isolating sub-portion; Preferably, the third isolating portion further comprises a third isolating sub-portion located on the side of the first isolating sub-portion facing the substrate, the third isolating sub-portion comprises a conductive material, and the second electrode of the light-emitting unit extends to be electrically connected to the first isolating sub-portion and the third isolating sub-portion; Preferably, the corrosion resistance of the second isolating sub-portion is stronger than that of the first isolating sub-portion; Preferably, the conductivity of the first isolating sub-portion is stronger than the conductivity of the second isolating sub-portion; Preferably, the material of the first isolating sub-portion includes aluminum or copper; Preferably, the material of the second isolating sub-portion includes a conductive material; Preferably, the material of the second isolation sub-portion includes indium tin oxide, indium zinc oxide or indium gallium zinc oxide; Preferably, the material of the third spacer portion includes at least one of molybdenum, titanium nitride, molybdenum nitride, titanium or indium tin oxide.

7. The display panel according to claim 1, characterized in that: Along the direction away from the substrate, a first filling layer and a second filling layer are sequentially provided between a side of the second isolation portion away from the substrate and the packaging unit; Preferably, the light-emitting unit comprises a first electrode, a light-emitting portion and a second electrode which are sequentially stacked in a direction away from the substrate; Preferably, the material of the first filling layer is the same as that of the light-emitting portion; Preferably, the first filling layer is in the same layer as the light-emitting portion; Preferably, the material of the second filling layer is the same as that of the second electrode; Preferably, the second filling layer is in the same layer as the second electrode; Preferably, the display panel further comprises a pixel defining layer located on a side of the first electrode away from the substrate, and the isolation structure is located on a side of the pixel defining layer away from the substrate; the pixel defining layer comprises a pixel opening exposing at least a portion of the first electrode; Preferably, the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the isolation opening on the substrate.

8. The display panel according to any one of claims 1 to 7, characterized in that: The minimum distance between the edge of the orthographic projection of the side of the first isolation portion away from the substrate on the substrate and the orthographic projection of the edge of the second isolation portion facing the isolation opening on the substrate is a first extension distance, and the minimum distance between the edge of the orthographic projection of the side of the first isolation portion away from the substrate on the substrate and the orthographic projection of the edge of the second isolation portion facing the groove on the substrate is a second extension distance, and the second extension distance is smaller than the first extension distance; Preferably, the first extension distance is greater than or equal to 0.3 μm and less than or equal to 1 μm; Preferably, the second extension distance is greater than or equal to 0.1 μm and less than or equal to 0.6 μm.

9. The display panel according to any one of claims 1 to 7, characterized in that: The display panel further comprises a second encapsulation layer located at a side of the encapsulation unit away from the substrate; Preferably, the display panel further comprises a third encapsulation layer located on a side of the second encapsulation layer away from the substrate; Preferably, the materials of the encapsulation unit and the third encapsulation layer both include inorganic materials; Preferably, the material of the second encapsulation layer includes organic material.

10. A display panel, characterized in that: The display panel comprises: substrate; an isolation structure, located at one side of the substrate, the isolation structure encloses an isolation opening, the isolation structure comprises a third isolation portion, a first isolation portion, and a second isolation portion which are sequentially stacked in a direction away from the substrate, the third isolation portion comprises a first isolation sub-portion and a second isolation sub-portion which are sequentially stacked in a direction away from the substrate, the first isolation sub-portion comprises a conductive material, and the corrosion resistance of the second isolation sub-portion is stronger than that of the first isolation sub-portion; A light emitting unit is at least partially located in the isolation opening, and the light emitting unit includes a second electrode, and the second electrode is electrically connected to the first isolation sub-portion.

11. The display panel according to claim 10, characterized in that: A groove recessed toward the substrate is provided on a side of the isolation structure away from the substrate, and the groove penetrates the second isolation portion and penetrates at least a portion of the first isolation portion; Preferably, along the thickness direction of the substrate, the groove penetrates the first isolation portion; Preferably, the orthographic projection of the groove on the substrate is located within the orthographic projection of the second isolating sub-portion on the substrate; Preferably, the bottom wall of the groove includes a partial surface of the second isolating sub-portion away from the substrate; Preferably, the orthographic projection of the groove on the substrate is outside the orthographic projection of the isolation opening on the substrate; Preferably, the orthographic projection of the groove on the substrate is located between the orthographic projections of two adjacent isolation openings on the substrate; Preferably, the orthographic projection of the groove on the substrate surrounds at least part of the orthographic projection of the isolation opening on the substrate; Preferably, an orthographic projection of a side of the first isolation portion away from the substrate on the substrate is located within an orthographic projection of the second isolation portion on the substrate.

12. The display panel according to claim 11, characterized in that: The minimum distance between the edge of the orthographic projection of the side of the first isolation portion away from the substrate on the substrate and the orthographic projection of the edge of the second isolation portion facing the isolation opening on the substrate is a first extension distance, and the minimum distance between the edge of the orthographic projection of the side of the first isolation portion away from the substrate on the substrate and the orthographic projection of the edge of the second isolation portion facing the groove on the substrate is a second extension distance, and the second extension distance is smaller than the first extension distance; Preferably, the first extension distance is greater than or equal to 0.3 μm and less than or equal to 1 μm; Preferably, the second extension distance is greater than or equal to 0.1 μm and less than or equal to 0.6 μm.

13. The display panel according to any one of claims 10 to 12, characterized in that: The third isolating portion further includes a third isolating sub-portion located on a side of the first isolating sub-portion facing the substrate, the third isolating sub-portion includes a conductive material, and the second electrode of the light-emitting unit extends to be electrically connected to the first isolating sub-portion and the third isolating sub-portion; Preferably, the conductivity of the first isolating sub-portion is stronger than the conductivity of the second isolating sub-portion; Preferably, the material of the first isolating sub-portion includes aluminum or copper; Preferably, the material of the second isolating sub-portion includes a conductive material; Preferably, the material of the second isolation sub-portion includes indium tin oxide, indium zinc oxide or indium gallium zinc oxide; Preferably, the material of the third isolating sub-portion includes at least one of molybdenum, titanium nitride, molybdenum nitride, titanium or indium tin oxide; Preferably, the material of the first isolation portion includes a conductive material; Preferably, the material of the first isolation portion includes aluminum or copper; Preferably, the material of the second isolation portion includes a conductive material; Preferably, the material of the second isolation portion includes titanium or titanium nitride.

14. A method for preparing a display panel, characterized in that: The method comprises: providing a substrate; An isolation structure is formed on one side of the substrate, the isolation structure encloses an isolation opening, a groove recessed toward the substrate is provided on a side of the isolation structure away from the substrate, the isolation structure comprises a first isolation portion and a second isolation portion stacked in a direction away from the substrate, the groove penetrates the second isolation portion and penetrates at least a portion of the first isolation portion; A light-emitting unit at least partially located in the isolation opening and a packaging unit located on a side of the light-emitting unit away from the substrate are prepared, wherein at least part of the packaging unit extends from the side of the isolation structure toward the isolation opening to the side of the isolation structure away from the substrate, and extends to the side wall of the isolation structure toward the groove.

15. The method for preparing a display panel according to claim 14, characterized in that: The step of forming an isolation structure on one side of the substrate comprises: forming a first electrode layer on one side of the substrate, wherein the first electrode layer includes a plurality of first electrodes arranged at intervals; forming a pixel defining material layer and an isolation material layer in sequence on a side of the first electrode layer away from the substrate; Patterning the isolation material layer to form an isolation structure; The pixel definition material layer is patterned to form a pixel definition layer, wherein the pixel definition layer includes a pixel opening, and the pixel opening is connected to the isolation opening.

16. The method for preparing a display panel according to claim 15, characterized in that: The isolation material layer comprises a first isolation material layer, a second isolation material layer, a third isolation material layer, a fourth isolation material layer and a fifth isolation material layer which are sequentially stacked in a direction away from the substrate, and the step of patterning the isolation material layer to form an isolation structure comprises: forming a patterned first photoresist layer on a side of the fifth isolation material layer away from the substrate; removing the fifth isolation material layer and the fourth isolation material layer not covered by the first photoresist layer by dry etching, and exposing a portion of the third isolation material layer away from the substrate; Removing the third isolation material layer, the second isolation material layer and the first isolation material layer not covered by the first photoresist layer by wet etching, and exposing the pixel defining material layer to form the isolation opening; removing the first photoresist layer; forming a patterned second photoresist layer on a side of the fifth isolation material layer away from the substrate and a side of the exposed pixel definition material layer away from the substrate; The fifth isolation material layer and the fourth isolation material layer not covered by the second photoresist layer are removed, and the second photoresist layer is removed to form an isolation structure including a groove.

17. The method for preparing a display panel according to claim 14, characterized in that: The isolation opening includes a first isolation opening and a second isolation opening, and the step of preparing a light-emitting unit at least partially located in the isolation opening and a packaging unit located on a side of the light-emitting unit away from the substrate includes: forming a light-emitting material layer of a first light-emitting unit in the first isolation opening, wherein the light-emitting material layer of the first light-emitting unit extends to a side of the isolation structure away from the substrate and extends into the groove; forming a second electrode material layer on a side of the light-emitting material layer of the first light-emitting unit away from the substrate; forming a first packaging material layer of the first light-emitting unit on a side of the second electrode material layer of the first light-emitting unit away from the substrate; A first etching protection layer is formed in the first isolation opening and is located on a side of the first packaging material layer of the first light-emitting unit away from the substrate, wherein the orthographic projection of the first etching protection layer on the substrate covers the orthographic projection of the first isolation opening on the substrate and covers a portion of the orthographic projection of the groove on the substrate; The first packaging material layer, the second electrode material layer and the light-emitting material layer of the first light-emitting unit that are not covered by the first etching protection layer are removed, and the first etching protection layer is removed to form a light-emitting portion and a second electrode of the first light-emitting unit in the first isolation opening, and to form a first packaging unit located on the side of the second electrode away from the substrate.

18. The method for preparing a display panel according to claim 17, characterized in that: After the step of removing the first encapsulation material layer, the second electrode material layer and the light-emitting material layer of the first light-emitting unit that are not covered by the first etching protection layer and removing the first etching protection layer, the method further includes: forming a light-emitting material layer of a second light-emitting unit in the second isolation opening, wherein the light-emitting material layer of the second light-emitting unit extends to a side of the first packaging unit away from the substrate; Sequentially forming a second electrode material layer and a first packaging material layer of the second light-emitting unit on a side of the light-emitting material layer of the second light-emitting unit away from the substrate; A second etching protection layer is formed in the second isolation opening and is located on a side of the first packaging material layer of the second light-emitting unit away from the substrate, wherein the orthographic projection of the second etching protection layer on the substrate covers the orthographic projection of the second isolation opening on the substrate and covers a portion of the orthographic projection of the groove on the substrate; The first packaging material layer, the second electrode material layer and the light-emitting material layer of the second light-emitting unit that are not covered by the second etching protection layer are removed, and the second etching protection layer is removed to form a light-emitting portion and a second electrode of the second light-emitting unit in the second isolation opening, and to form a second packaging unit located on the side of the second electrode away from the substrate.

19. A display device, characterized in that: The display device comprises the display panel described in any one of claims 1 to 13, or comprises a display panel prepared by the method for preparing a display panel described in any one of claims 14 to 18.

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