Water-soluble adhesive composition for capturing component, water-soluble adhesive sheet for capturing component, and method for producing electronic component

Abstract

The present invention addresses the problem of providing a water-soluble adhesive composition and a water-soluble adhesive sheet for capturing components, which have excellent impact absorbency, adhesiveness and adhesiveness and are suitable for capturing components, and also providing a method for manufacturing an electronic component that can be manufactured with high precision and high efficiency using the composition and the sheet. In order to solve the technical problem, provided are: a composition containing (A) a water-soluble adhesive and (B) a water-soluble plasticizer (excluding the component (A)), the viscosity of the (B) water-soluble plasticizer being 50000 mPa.s or less at room temperature (25 DEG C), and the viscosity of the (B) water-soluble plasticizer being 5000 mPa.s or less at room temperature (25 DEG C); the ratio ((B) / (A)) of the content of the water-soluble plasticizer (B) to the content of the water-soluble adhesive (A) is greater than 0.5 and 3.0 or less. According to the present invention, it is possible to improve shock absorbency, adhesiveness, and adhesiveness, and to suppress the occurrence of damage or positional displacement of a member (element), particularly when manufacturing a semiconductor element, and the like, and it is also easy to handle even when adhering and peeling, particularly the sheet of the present invention.

Description

Technical Field

[0001] The present invention relates to a water-soluble adhesive composition for capturing components, a water-soluble adhesive sheet for capturing components, and a method for manufacturing an electronic component. In particular, the present invention relates to a water-soluble adhesive composition for capturing components and a water-soluble adhesive sheet for capturing components for capturing elements on a substrate in the manufacture of electronic components, and a method for manufacturing an electronic component using the water-soluble adhesive composition for capturing components and the water-soluble adhesive sheet for capturing components. Background Art

[0002] In the production of electronic components such as semiconductor elements and display elements, materials having an adhesive layer (pressure-sensitive adhesive layer) are used for the purpose of preventing foreign matter from adhering or efficiently producing semiconductor chips or image display devices.

[0003] For example, Patent Document 1 proposes a method for manufacturing a display device using a light emitting diode (LED). In this manufacturing method, a method is described in which a large number of LED elements that become pixels are formed on a wafer, followed by dicing and enlargement transfer using a temporary holding member having an adhesive layer (pressure-sensitive adhesive layer).

[0004] Patent Document 2 proposes a method of separating an LED element from a substrate using laser light during enlarged transfer.

[0005] Patent Document 1: Japanese Patent Publication No. 2002-261335

[0006] Patent Document 2: Japanese Patent Publication No. 2010-161221 Summary of the invention

[0007] -Technical problem to be solved by the invention-

[0008] However, when transferring LED elements from a transfer source substrate to a transfer target substrate by transfer, the LED elements may deviate from a predetermined position on the transfer target substrate, or may collide with a component of the transfer target and rebound, making it impossible to arrange the LED elements at a desired position.

[0009] In view of this, the technical problem of the present invention is to provide a water-soluble adhesive composition for capturing parts and a water-soluble adhesive sheet for capturing parts that are excellent in impact absorption and adhesion and are suitable for capturing parts, and to provide a method for manufacturing electronic components that can be manufactured with high precision and efficiency using the water-soluble adhesive composition for capturing parts and the water-soluble adhesive sheet for capturing parts.

[0010] -Technical solutions to solve technical problems-

[0011] One aspect of the present invention provides a water-soluble adhesive composition for capturing parts, comprising (A) a water-soluble adhesive and (B) a water-soluble plasticizer (excluding the component (A)). In the water-soluble adhesive composition for capturing parts, the viscosity of the water-soluble plasticizer (B) is 50,000 mPa·s or less at room temperature (25° C.), and the ratio of the content of the water-soluble plasticizer (B) to the content of the water-soluble adhesive (A) ((B) / (A)) is greater than 0.5 and less than 3.0.

[0012] The water-soluble adhesive composition for capturing parts according to the present invention contains a water-soluble plasticizer having a viscosity of 50,000 mPa·s or less at room temperature (25°C) in a prescribed ratio relative to the content of the water-soluble adhesive. This can improve the impact absorption, adhesion and bonding properties of the water-soluble adhesive composition for capturing parts, and can suppress damage to parts (elements) or positional shifts when manufacturing electronic parts.

[0013] One aspect of the present invention provides a water-soluble adhesive composition for capturing parts, comprising (A) a water-soluble adhesive and (B) a water-soluble plasticizer (excluding the component (A)). In the water-soluble adhesive composition for capturing parts, the water-soluble plasticizer (B) is liquid at room temperature (25° C.) and has a molecular weight of 5000 or less, and the ratio of the content of the water-soluble plasticizer (B) to the content of the water-soluble adhesive (A) ((B) / (A)) is greater than 0.5 and less than 3.0.

[0014] The water-soluble adhesive composition for capturing parts according to the present invention contains a liquid water-soluble plasticizer with a molecular weight of 5000 or less at a prescribed ratio relative to the content of the water-soluble adhesive. This can improve the impact absorption, adhesion and bonding properties of the water-soluble adhesive composition for capturing parts, and can suppress the damage or positional displacement of parts (elements) when manufacturing electronic parts.

[0015] One aspect of the present invention provides a water-soluble adhesive composition for capturing parts, comprising (A) a water-soluble adhesive and (B) a water-soluble plasticizer (excluding the component (A)), wherein the weight average molecular weight of the water-soluble adhesive (A) is 1.0×10 4 Above and 1.0×10 6 Hereinafter, the ratio of the content of the (B) water-soluble plasticizer to the content of the (A) water-soluble adhesive ((B) / (A)) is greater than 0.5 and less than or equal to 3.0.

[0016] The water-soluble adhesive composition for capturing parts of the present invention contains a water-soluble adhesive having a weight average molecular weight of 1.0×10 4 Above and 1.0×10 6The following water-soluble adhesive can improve the impact absorption, tackiness and adhesiveness of the water-soluble adhesive composition for capturing parts, and can suppress the occurrence of damage or positional deviation of parts (elements) during the production of electronic parts.

[0017] In the water-soluble adhesive composition for capturing parts according to one aspect of the present invention, (A) the water-soluble adhesive preferably contains at least one water-soluble adhesive selected from the group consisting of vinyl alcohol polymers, vinyl pyrrolidone polymers, acrylic polymers and sugars.

[0018] According to the above embodiment, it is possible to provide a water-soluble adhesive composition for capturing parts which is excellent in tack and adhesiveness and has excellent water washability.

[0019] In the water-soluble adhesive composition for capturing parts according to one aspect of the present invention, it is preferred that (B) the water-soluble plasticizer is a monohydric alcohol or a polyhydric alcohol which is liquid at room temperature (25° C.).

[0020] According to the above embodiment, it is possible to provide a water-soluble adhesive composition for capturing parts which has excellent compatibility with a water-soluble adhesive, excellent tack and adhesiveness, and excellent water washability.

[0021] In the water-soluble adhesive composition for capturing parts according to one aspect of the present invention, the (B) water-soluble plasticizer preferably has a boiling point of 120° C. or higher.

[0022] According to the above embodiment, it is possible to provide a water-soluble adhesive composition for capturing components which is unlikely to evaporate and whose physical properties are unlikely to change when a bonding step involving heating and / or pressurization is performed after capturing components.

[0023] In the water-soluble adhesive composition for capturing parts according to one aspect of the present invention, the (B) water-soluble plasticizer preferably contains at least one selected from glycerin, diglycerin, polyethylene glycol, ethylene glycol, propylene glycol, and polypropylene glycol.

[0024] According to the above embodiment, glycerol, diglycerol, polyethylene glycol, ethylene glycol, propylene glycol and polypropylene glycol are all substances with high boiling points, and therefore are not easily evaporated during the bonding process accompanied by heating and / or pressurization, so that the formation of vapor bubbles (i.e., "voids") in the composition can be suppressed. It can also exert the effect of excellent water washability.

[0025] One aspect of the present invention provides a water-soluble adhesive sheet for capturing parts, comprising a layer obtained by forming the water-soluble adhesive composition for capturing parts into a sheet shape.

[0026] According to the water-soluble adhesive sheet for capturing parts of the present invention, by forming the water-soluble adhesive composition for capturing parts into a sheet, it is possible to exert the effects of excellent impact absorption and adhesiveness and adhesion, and excellent operability during pasting and peeling, and improve the working efficiency of capturing parts. The water-soluble adhesive sheet for capturing parts can significantly reduce the amount of liquid components, so it can also exert the effects of improving transportation efficiency and good storage stability.

[0027] One aspect of the present invention provides a method for producing an electronic component, comprising the step of capturing a component using the water-soluble adhesive composition for capturing the component.

[0028] According to the method for manufacturing electronic components of the present invention, since a water-soluble adhesive composition for capturing components having excellent impact absorption and adhesiveness is used, damage and rebound caused by the collision between the component (element) and the component of the transfer object in the transfer process can be suppressed, and the effect of preventing the capture (loading) of the component (element) at the desired position can be exerted. Thus, in the manufacture of electronic components, high-precision and efficient manufacturing is possible.

[0029] One aspect of the present invention provides a method for manufacturing an electronic component, comprising the step of capturing a component using the water-soluble adhesive sheet for capturing the component.

[0030] According to the method for manufacturing electronic components of the present invention, since a water-soluble adhesive sheet for capturing components having excellent impact absorption, adhesion and bonding properties is used, damage and rebound caused by the collision between the components (components) and the components of the transfer object in the transfer process can be suppressed, and the effect of preventing the capture (loading) of the components (components) at the desired position can be achieved. Since a water-soluble adhesive sheet for capturing components having excellent operability during pasting and peeling is used, the operation involved in the capture and the operation involved in the removal of the residue after the capture can be easily performed in the case of manufacturing electronic components. Thus, in the manufacture of electronic components, high-precision and efficient manufacturing is possible.

[0031] - Effects of the Invention -

[0032] According to the present invention, there can be provided a water-soluble adhesive composition for capturing parts and a water-soluble adhesive sheet for capturing parts, which are excellent in impact absorption and adhesion and in workability during pasting or peeling and are suitable for capturing parts; and there can be provided a method for manufacturing electronic parts that can be manufactured with high precision and efficiency using the water-soluble adhesive composition for capturing parts and the water-soluble adhesive sheet for capturing parts. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1This is a schematic diagram showing an example of a component capturing step, namely, a non-contact transfer step, using the water-soluble adhesive composition for component capturing (water-soluble adhesive sheet for component capturing) of the present invention;

[0034] Figure 2 This is a schematic diagram showing a contact transfer step which is one example of a component capturing step using the water-soluble adhesive composition for component capturing (water-soluble adhesive sheet for component capturing) of the present invention. DETAILED DESCRIPTION

[0035] [Water-soluble adhesive composition for capturing parts and water-soluble adhesive sheet for capturing parts]

[0036] The water-soluble adhesive composition for capturing components and the water-soluble adhesive sheet for capturing components of the present invention are used to capture components and can be removed by washing with water after capturing. The applicable objects of the water-soluble adhesive composition for capturing components and the water-soluble adhesive sheet for capturing components of the present invention are not particularly limited, and for example, the electronic components can be captured on a substrate in the manufacture of electronic components. At this time, the captured electronic components can be exemplified by: an element selected from a semiconductor element, a liquid crystal element, a photoelectric conversion element, a piezoelectric element, a thin film transistor element, a thin film diode element, a resistor element, a switch element, a micro magnetic element, a micro optical element or a part thereof, or a combination of these elements, etc.

[0037] Hereinafter, the water-soluble adhesive composition for capturing components and the water-soluble adhesive sheet for capturing components of the present invention will be described mainly on the premise of capturing semiconductor elements on a substrate, but the present invention is not limited thereto.

[0038] In the following description, the water-soluble adhesive composition for capturing parts of the present invention is also simply referred to as a "capturing composition", and the water-soluble adhesive sheet for capturing parts is also simply referred to as a "capturing sheet".

[0039] The water-soluble adhesive composition for capturing components and the water-soluble adhesive sheet for capturing components of the present invention have, for example, impact absorption, and can receive semiconductor elements such as LED elements separated from the transfer source substrate by energy lines (laser, etc.), and have the adhesiveness, tackiness, and adhesiveness / adhesion to the substrate to capture the received semiconductor elements at the desired position of the substrate. The water-soluble adhesive composition for capturing components and the water-soluble adhesive sheet for capturing components of the present invention can dissolve the residue in water and remove it in the water washing process.

[0040] The present invention can also be composed of a liquid water-soluble adhesive composition for capturing parts, but compared to the water-soluble adhesive composition for capturing parts, by providing a water-soluble adhesive sheet for capturing parts having a layer that forms the water-soluble adhesive composition for capturing parts into a sheet shape, the coating and drying steps on the wiring substrate can be omitted, and the handling is easier, thereby improving the working efficiency. Compared to the water-soluble adhesive composition for capturing parts, the water-soluble adhesive sheet for capturing parts can significantly reduce the amount of liquid components, thereby improving the handling efficiency, and the storage stability is also relatively good.

[0041] In the case of attaching the sheet, the capturing surface (mounting surface) of the component or the like is flatter than when applying the liquid water-soluble adhesive composition for capturing the component. Therefore, the component can be stably placed on the water-soluble adhesive sheet for capturing the component of the present invention.

[0042] The shape of the water-soluble adhesive sheet for capturing components of the present invention is not particularly limited. As the shape of the water-soluble adhesive sheet for capturing components of the present invention, for example, a shape consisting of a polygon (such as a rectangle, a rectangle, a triangle, etc.), a circle, an ellipse, and an irregular shape when viewed from above can be cited. The shape of the water-soluble adhesive sheet for capturing components of the present invention can be set to a desired shape such as a shape that matches the shape of the adhesive substrate. It can also be processed into a desired shape using known methods such as cutting. It can also be used by cutting the required amount after forming it into a roll shape.

[0043] The thickness of the water-soluble adhesive sheet for capturing components of the present invention is not particularly limited, but is, for example, preferably 1 μm or more, more preferably 3 μm or more, and further preferably 5 μm or more.

[0044] When the thickness of the water-soluble adhesive sheet for capturing components of the present invention is 1 μm or more, the impact absorption can be improved, which is preferred.

[0045] The upper limit of the thickness of the water-soluble adhesive sheet for capturing components of the present invention is preferably 500 μm or less, more preferably 100 μm or less, and further preferably 50 μm or less.

[0046] If the thickness of the water-soluble adhesive sheet for capturing components of the present invention is 500 μm or less, the amount of residue is small, and thus the time for the water washing step for removing the sheet can be shortened, which is preferred.

[0047] The thickness of the water-soluble adhesive sheet for capturing components of the present invention is preferably appropriately selected based on the relationship between the thickness of the sheet and the height of the protrusion formed on the semiconductor element. When the thickness of the sheet for capturing is thicker than the height of the protrusion, the bottom and side surfaces of the semiconductor element will contact the sheet for capturing, thereby suppressing the rebound of the semiconductor element.

[0048] The water-soluble adhesive composition for capturing components and the water-soluble adhesive sheet for capturing components of the present invention contain a water-soluble plasticizer (B), which is a liquid component. When the water-soluble plasticizer (B) is contained in a high proportion, in the initial stage of rebounding after the semiconductor element has settled, the side of the semiconductor element protrusion or the side of the semiconductor element on the upper surface of the capturing sheet is easily wetted, and the surface tension or adhesive force caused by the wetting can suppress the rebound of the semiconductor element or the damage of the semiconductor element.

[0049] When the semiconductor element sinks deeply into the capturing sheet, the capturing sheet covers the upper surface of the semiconductor element, further increasing the resistance to rebound. Therefore, even when the process of capturing the semiconductor element is performed at a high speed, positional deviation can be reduced.

[0050] That is to say, with regard to the effect of suppressing the rebound of the semiconductor element, in the initial stage of the rebound, the rebound suppression effect is increased in the order of "the capturing sheet is moistened on the side of the protrusion of the semiconductor element (moistened on the protrusion of the semiconductor element)", "the capturing sheet is moistened on the side of the semiconductor element (moistened on the protrusion of the semiconductor element, the bottom surface of the semiconductor element, and the side of the semiconductor element)", and "the capturing sheet is used to cover the upper surface of the semiconductor element (moistened on the protrusion of the semiconductor element, the bottom surface of the semiconductor element, the side of the semiconductor element, and the upper surface of the semiconductor element)".

[0051] From the perspective of positional displacement when capturing semiconductor elements and damage to semiconductor elements, the ratio of the thickness of the water-soluble adhesive sheet used for component capture of the present invention to the height of the protrusion of the semiconductor element (sheet thickness / protrusion height) is preferably 1.0 or more, more preferably 1.2 or more, and further preferably 1.5 or more. If the ratio of the thickness of the water-soluble adhesive sheet used for component capture of the present invention to the height of the protrusion is above 1.0, the protrusion of the semiconductor element is not easily offset from the desired position of the electrode of the substrate in the semiconductor element capture process, and therefore it is preferred.

[0052] After the semiconductor element is captured without positional displacement, in the bonding process accompanied by heating and / or pressurization, it is necessary to soften the capture sheet to make the semiconductor element (re)sink and make the protrusion of the semiconductor element contact the substrate electrode. Therefore, when the capture sheet is significantly thicker than the height of the semiconductor element (the shortest distance between the lower surface of the protrusion of the semiconductor element and the upper surface of the semiconductor element), the (re)sinking distance of the semiconductor element becomes longer, and sometimes, the semiconductor element shakes during the sinking process, and the displacement from the substrate electrode may become larger.

[0053] In view of this, from the perspective of positional displacement caused by the sedimentation of the semiconductor element in the bonding process after the capture without positional displacement of the semiconductor element, the ratio of the thickness of the water-soluble adhesive sheet for capturing the components of the present invention to the height of the protrusion (thickness of the capturing sheet / height of the protrusion of the semiconductor element) is preferably 5.0 or less, more preferably 3.6 or less, and further preferably 2.3 or less. If the ratio of the thickness of the water-soluble adhesive sheet for capturing the components of the present invention to the height of the protrusion of the semiconductor element is less than 3.0, it is possible to suppress: in the bonding process after capturing the semiconductor element at the desired position, the positional displacement of the protrusion of the semiconductor element and the substrate electrode caused by sedimentation can be suppressed.

[0054] The height of the protrusion formed on the semiconductor element is not particularly limited, and is, for example, 1 μm or more and 50 μm or less. The lower limit of the height of the protrusion is preferably 1 μm or more, more preferably 2 μm or more, and further preferably 3 μm or more. The upper limit of the height of the protrusion is preferably 50 μm or less, more preferably 30 μm or less, and further preferably 20 μm or less.

[0055] The water-soluble adhesive composition for capturing parts and the water-soluble adhesive sheet for capturing parts of the present invention contain (A) a water-soluble adhesive and (B) a water-soluble plasticizer.

[0056] For example, when the whole capture sheet is used as a reference, the content of component (A) is 10% by mass and above and 65% by mass or below. If component (A) is above 10% by mass, it is preferred from the perspective of sheet formability. If component (A) is below 65% by mass, it is more preferred from the perspective of adhesion and bonding.

[0057] From the viewpoint of improving sheet formability, the lower limit of the content of component (A) is preferably 20% by mass or more, more preferably 25% by mass or more, and even more preferably 30% by mass or more.

[0058] From the viewpoint of tack and adhesiveness, the upper limit of the content of component (A) is preferably 65% ​​by mass or less, more preferably 60% by mass or less, and even more preferably 55% by mass or less.

[0059] For example, based on the entire capturing sheet, the content of component (B) is preferably 35% by mass or more, more preferably 40% by mass or more, and even more preferably 50% by mass or more.

[0060] If the content of component (B) is more than 35% by mass, it is preferred because it improves the prevention of positional displacement in the transfer process of the semiconductor element from the viewpoint of adhesion, bonding force, surface tension, and rheological properties. By making the content of component (B) within the range, the properties as a liquid can be improved, and the wettability to the semiconductor element can be improved, and the rebound of the semiconductor element can be suppressed. Within the range, the polymer chain of the water-soluble adhesive is easy to move and has excellent impact absorption. This can also be understood from the following aspects, that is, with respect to the rheological properties that depend on frequency, as the frequency becomes higher, the value of the elastic term, i.e., the storage elastic modulus G'(E'), is almost fixed, while the viscosity term, i.e., the loss elastic modulus G"(E"), tends to increase, and as a result, the impact absorption index, i.e., tanδ, increases, so the impact absorption is excellent.

[0061] The content of the component (B) is preferably 300% by mass or less, more preferably 250% by mass or less, and even more preferably 200% by mass or less, based on the component (A).

[0062] It is preferred from the viewpoint of sheet formability that the content of the component (B) is 300 mass % or less.

[0063] The components constituting the water-soluble adhesive composition for capturing parts and the water-soluble adhesive sheet for capturing parts of the present invention are described below.

[0064] [(A) Water-soluble adhesive]

[0065] The water-soluble adhesive component (A) is a main component of the capturing composition and the capturing sheet, and is mainly composed of a polymer. The water-soluble adhesive component (A) is a water-soluble component that exhibits adhesiveness alone or by adding a water-soluble plasticizer.

[0066] Here, water solubility refers to the property that it does not dissolve turbidly when forming a 1% by mass aqueous solution at room temperature (25°C). Adhesiveness refers to the property that, in a sheet prepared by component (A), i.e., a water-soluble adhesive alone or by adding 30 parts by mass or 50 parts by mass of component (B), i.e., a water-soluble plasticizer, at room temperature (25°C), after the sheet (1 cm×5 cm×10 μm) is pressed against, for example, a PET film (non-release treated surface), the PET film bonded with the sheet is cut into a long strip, and when the PET film cut into the long strip is vertically hung, the sheet and the PET film do not immediately peel off.

[0067] The water-soluble adhesive composition for capturing parts and the water-soluble adhesive sheet for capturing parts of the present invention contain component (A), thereby improving the adhesiveness and tackiness (pressure-sensitive adhesiveness) to semiconductor elements, the adhesiveness and adhesion to substrates, the decomposition inhibition or solubility during heating and / or pressurization in the bonding process, and the water solubility.

[0068] The polymer constituting the component (A) includes polymers having viscosity and tackiness per se and polymers that exhibit viscosity and tackiness by forming a gel.

[0069] Preferably, the water-soluble adhesive composition for capturing the components of the present invention and the water-soluble adhesive sheet for capturing the components are melted in the joining process in which the substrate is electrically connected to the semiconductor element, so that the protrusion of the semiconductor element is connected to the electrode of the substrate. In this case, the polymer constituting component (A) preferably uses a polymer that melts at the temperature of the joining process. At this time, the softening point of the polymer constituting component (A) is not particularly limited as long as the capture composition or the capture sheet is melted in the joining process.

[0070] For example, if we consider the situation in which the ratio (B / A) of the content of the water-soluble plasticizer (B) to the content of the water-soluble adhesive (A) in the capturing composition or capturing sheet is significantly reduced due to evaporation of the water-soluble plasticizer (B) (liquid component) during the bonding process, then from the perspective that the semiconductor element can be precipitated on the capturing composition or capturing sheet by softening the water-soluble adhesive (A) even in the absence of the water-soluble plasticizer (B) during the bonding process, the softening point of the polymer constituting component (A) is preferably below 200°C, more preferably below 150°C, further preferably below 100°C, and further preferably below 80°C.

[0071] On the other hand, for example, from the viewpoint of being able to form a sheet even if a large amount of (B) water-soluble plasticizer is contained, the softening point of the polymer constituting component (A) is preferably 40°C or higher, more preferably 100°C or higher, further preferably 150°C or higher, and further preferably 200°C or higher.

[0072] The polymer constituting the component (A) is soluble in water and can therefore be easily removed from the substrate by washing with water after the bonding step.

[0073] The solubility of the polymer constituting component (A) is not particularly limited as long as it can be washed with water. For example, the solubility of the polymer constituting component (A) in water at 90°C is preferably 0.05 g / g-H2O or more, more preferably 0.10 g / g-H2O or more, and further preferably 0.30 g / g-H2O or more.

[0074] It should be noted that if the concentration is 0.05 g / g-H 2 O or more, washing can be performed in a short time even at room temperature, and washing residues can be eliminated or reduced to a minimum, which is preferred.

[0075] For example, the weight average molecular weight of component (A) exceeds 1.0×10 6 When it is dissolved in water by cleaning, it takes a long time, which easily produces cleaning residues. Therefore, from the viewpoint of shortening the cleaning time and reducing the cleaning residues, it is preferably to improve the dissolution rate by decomposing the component (A) and realizing low molecular weight. As the method of low molecular weight, there is no particular restriction, as long as it is a method that does not cause damage to workpieces such as semiconductor elements and substrates. For example, when component (A) is a natural polymer, various known hydrolases can be exemplified.

[0076] For example, when component (A) contains polymers of α-glucose, such as starch and pullulan, or / and its derivatives, hydrolases such as amylase, glucoamylase, and pullulanase can be cited. For example, in the case of natural polymers containing β-glucose, such as carboxymethyl cellulose (CMC), or / and its derivatives, cellulase can be cited. For example, in the case of natural polymers derived from amino acids such as silk, protease can be cited. When using the hydrolase, it is preferred to wash in the optimal pH and temperature range for high enzyme activity. Depending on the enzyme, Ca is added. 2+ Such additives can further enhance the enzyme activity.

[0077] From the viewpoint of improving sheet formability, the weight average molecular weight Mw of the polymer constituting component (A) is preferably 1.0×10 4 More preferably, 5.0×10 4 More preferably, 1.0×10 5 The weight average molecular weight Mw of the polymer constituting the component (A) is, for example, greater than 1.0×10 6 As described above, from the viewpoint of shortening the washing time and reducing the washing residue, it is preferred to reduce the molecular weight of component (A) by hydrolysis or the like to increase the dissolution rate in water.

[0078] The weight average molecular weight Mw of the polymer constituting component (A) is preferably 1.0×10 6 Below, more preferably 8.0×10 5 Below, more preferably 4.0×10 5 the following.

[0079] The molecular weight distribution Mw / Mn (here, Mn represents the number average molecular weight) of the polymer constituting the component (A) is not particularly limited.

[0080] For example, the lower limit of the molecular weight distribution Mw / Mn is preferably 1.5 or more, and more preferably 1.8 or more.

[0081] The upper limit of the molecular weight distribution Mw / Mn is preferably 30 or less, more preferably 15 or less, and further preferably 8 or less.

[0082] By setting the molecular weight distribution Mw / Mn to be within the above range, a sheet can be formed satisfactorily, and characteristic variations in the sheet can be suppressed, thereby making the characteristics more uniform.

[0083] <Vinyl alcohol polymers>

[0084] In the present invention, the vinyl alcohol polymer is a polymer having a hydroxyvinyl repeating unit represented by the general formula (1).

[0085] Hereinafter, the structure represented by the general formula (1) is referred to as a vinyl alcohol repeating unit.

[0086] [Chemical formula 1]

[0087]

[0088] The vinyl alcohol polymer may have a homopolymer structure in which the repeating unit consists only of vinyl alcohol repeating units, or may have a copolymer structure having other repeating units.

[0089] Hereinafter, a vinyl alcohol polymer having a homopolymer structure composed only of vinyl alcohol repeating units is also simply referred to as a "homopolymer", and a vinyl alcohol polymer having a copolymer structure having other repeating units is also simply referred to as a "copolymer".

[0090] Generally, a vinyl alcohol polymer is produced by polymerizing or copolymerizing a monomer that protects the hydroxyl group of vinyl alcohol (eg, vinyl acetate) and then subjecting the monomer to modification (eg, hydrolysis) to remove the protecting group.

[0091] Therefore, as repeating units other than the vinyl alcohol repeating unit, there can be mentioned units in which the repeating units before modification remain. As repeating units before modification, there can be mentioned, for example, repeating units derived from vinyl formate, vinyl acetate, vinyl propionate, vinyl butyrate, vinyl isobutyrate, vinyl pivalate, vinyl versatate, vinyl caproate, vinyl octanoate, vinyl laurate, vinyl palmitate, vinyl stearate, vinyl oleate, vinyl trifluoroacetate, vinyl benzoate, butyl vinyl ether, and trimethylsilyl vinyl ether.

[0092] Hereinafter, a repeating unit that becomes a repeating unit in a vinyl alcohol-based polymer in a state where the functional group before modification remains without modification is also referred to as an "unmodified repeating unit".

[0093] In the vinyl alcohol polymer, the remaining unmodified repeating units may be one type or two or more types.

[0094] Vinyl alcohol polymers are generally produced by saponifying vinyl acetate polymers. Therefore, it is preferable to use a vinyl alcohol polymer obtained by modifying a vinyl acetate polymer derived from vinyl acetate, which is easily available as a repeating unit before modification.

[0095] In the vinyl alcohol polymer composed of vinyl alcohol repeating units and unmodified repeating units, the solubility in water and the adhesiveness (pressure-sensitive adhesiveness) are affected by the saponification degree and the polymerization degree.

[0096] Here, the saponification degree of the vinyl alcohol polymer composed of vinyl alcohol repeating units and unmodified repeating units is the ratio of the number of vinyl alcohol repeating units to the total number of repeating units (ratio [number of vinyl alcohol repeating units] / {[number of vinyl alcohol repeating units]+[number of unmodified repeating units]}).

[0097] When the saponification degree of the vinyl alcohol polymer composed of vinyl alcohol repeating units and unmodified repeating units is too high or too low, the solubility in water decreases. When the degree of polymerization is high, the solubility in water also decreases.

[0098] Therefore, in the vinyl alcohol polymer composed of unmodified repeating units, the saponification degree and the polymerization degree are selected according to the type of the unmodified repeating units.

[0099] For example, the lower limit of the saponification degree is preferably 30% or more, more preferably 40% or more, and further preferably 50% or more.

[0100] For example, the upper limit of the saponification degree is preferably 90% or less, more preferably 80% or less, and further preferably 70% or less.

[0101] When the content is within the above range, there is no situation in which the polyol is crystallized and becomes difficult to dissolve in water or the number of hydrophilic groups decreases and becomes difficult to dissolve in water, and thus the polyol can be preferably used.

[0102] The vinyl alcohol polymer may contain one or more other repeating units other than the vinyl alcohol repeating unit and the unmodified repeating unit. Examples of other repeating units other than the vinyl alcohol repeating unit and the unmodified repeating unit include repeating units derived from ethylene, (meth)acrylic acid, maleic acid, vinyl pyrrolidone, aminoalkyl (meth)acrylic acid, and monomers represented by the general formula (2) (e.g., oxyethylene monoallyl ether and (meth)acrylic acid ethyl carbitol, etc.).

[0103] Hereinafter, repeating units other than the vinyl alcohol repeating unit and the unmodified repeating unit are also referred to as "third repeating units".

[0104] In terms of the measurement of saponification degree, when there is a third repeating unit (oxyalkylene structure, etc.), it can be measured as 1 H-NMR measurement can be measured according to JIS K6726 in the absence of the third repeating unit.

[0105] [Chemical formula 2]

[0106]

[0107] (Where R 1 and R 3 independently represent a hydrogen atom or an organic group, R 2 represents an ether bond, an ester bond, an amide bond, an alkylene group having 1 to 6 carbon atoms, or a composite group thereof, or a single bond, and A represents an alkylene group having 2 to 22 carbon atoms. n represents an integer greater than 1)

[0108] In the general formula (2), R 1 It represents a hydrogen atom or an organic group having 1 to 20 carbon atoms. The organic group may contain one or more of the elements O, N, S, Si and P.

[0109] As R 1 Examples of the organic group include an alkyl group, an acyl group, an acyloxy group, an alkoxycarbonyl group, an alkyl ester group (an acyloxy-substituted hydrocarbon group and an alkoxycarbonyl-substituted hydrocarbon group), an alkylamide alkylene group, and a sulfonate group.

[0110] Examples of the alkyl group include a methyl group, an ethyl group, an n-propyl group, an i-propyl group, a butyl group, a pentyl group, and a hexyl group.

[0111] Examples of the acyl group include methylcarbonyl, ethylcarbonyl, n-propylcarbonyl, i-propylcarbonyl, butylcarbonyl, pentylcarbonyl and hexylcarbonyl.

[0112] Examples of the alkyl ester group include methyloxycarbonylmethylene, methylcarbonyloxymethylene, ethyloxycarbonylvinyl and ethylcarbonyloxyvinyl groups.

[0113] Examples of the alkylamide alkylene group include N,N'-dimethylamide alkylene and N,N'-diethylamide alkylene.

[0114] As R 1 , preferably: a hydrogen atom; or a group having 1 to 10 carbon atoms in an alkyl group, an acyl group, an alkyl ester group or an alkyl amide alkylene group, more preferably a hydrogen atom or a methyl group, further preferably a hydrogen atom.

[0115] R 1 A hydrogen atom is preferred because it can lower the glass transition temperature of the polymer.

[0116] R in the general formula (2) 2 It represents an ether bond (-O-), an ester bond (-COO-, -OCO-), an amide bond (-NHCO-, -OCNH-), an alkylene group having 1 to 6 carbon atoms, a composite group thereof, or a single bond.

[0117] In the general formula (2), R 3 represents: a hydrogen atom; or an organic group having 1 to 20 carbon atoms, which may contain one or more of the elements O, N, S, Si and P.

[0118] As R 3 Examples of the organic group include an alkyl group, an acyl group, an alkoxycarbonyl group, an alkyl ester group (an acyloxy-substituted hydrocarbon group and an alkoxycarbonyl-substituted hydrocarbon group), an alkylamide group, an alkylamide alkylene group, and a sulfonate group.

[0119] Examples of the alkyl group include a methyl group, an ethyl group, an n-propyl group, an i-propyl group, a butyl group, a pentyl group, and a hexyl group.

[0120] Examples of the acyl group include methylcarbonyl, ethylcarbonyl, n-propylcarbonyl, i-propylcarbonyl, butylcarbonyl, pentylcarbonyl and hexylcarbonyl.

[0121] Examples of the alkyl ester group include methyloxycarbonylmethylene, methylcarbonyloxymethylene, ethyloxycarbonylvinyl and ethylcarbonyloxyvinyl groups.

[0122] Examples of the alkylamide alkylene group include N,N'-dimethylamide alkylene and N,N'-diethylamide alkylene.

[0123] As R 3 , preferably a hydrogen atom or a group having 1 to 10 carbon atoms in an alkyl group, an acyl group, an alkyl ester group or an alkylamide alkylene group, more preferably a hydrogen atom or a methyl group.

[0124] A in the general formula (2) represents a linear or branched alkylene group having 2 to 22 carbon atoms.

[0125] In the general formula (2), when n is 2 or more, a plurality of A's may be the same as or different from each other.

[0126] The number of carbon atoms in A in the general formula (2) is preferably 10 or less, more preferably 4 or less, further preferably 3 or less, and particularly preferably 2 or less.

[0127] Examples of A in the general formula (2) include dimethylene (ethylene), trimethylene, methylethylene, tetramethylene, 1-methylpropylene, 2-methylpropylene and 1-ethylethylene.

[0128] In the oxyalkylene structure, an oxyalkylene group having fewer carbon atoms, which functions as a hydrophobic group, is more hydrophilic than an oxyalkylene group having more carbon atoms.

[0129] Therefore, in the general formula (2), the oxyalkylene structure represented by "AO" is more preferably an oxyethylene structure.

[0130] The repeating number n in the general formula (2) represents the number of oxyalkylene structures represented by the hydrophilic group "AO". Therefore, generally speaking, as the number n increases, the hydrophilicity of the repeating unit represented by the general formula (2) increases.

[0131] Therefore, the lower limit of the repetition number n in the general formula (2) is preferably 2 or more, more preferably 5 or more, and further preferably 6 or more. The upper limit of the repetition number n in the general formula (2) is preferably 300 or less, more preferably 200 or less, further preferably 65 or less, and particularly preferably 20 or less.

[0132] When the number n of repeating units of the oxyalkylene group is within the above range, the solubility in water at low temperatures can be improved, and the adhesiveness can be improved.

[0133] The content ratio of the third repeating unit is not particularly limited as long as the vinyl alcohol polymer exhibits tack and adhesiveness (pressure-sensitive adhesiveness) and is soluble in water.

[0134] Therefore, from the viewpoints of tack and adhesiveness (pressure-sensitive adhesiveness), and water solubility, the ratio of the third repeating unit is selected according to the kind of the third repeating unit.

[0135] For example, the ratio of the third repeating unit in the vinyl alcohol polymer "(third repeating unit" × 100 / "vinyl alcohol repeating unit" + "unmodified repeating unit" + "third repeating unit") is preferably 0.5 mol% or more, more preferably 3.0 mol% or more, and further preferably 5.0 mol% or more.

[0136] When the content is 0.5 mol % or more, the solubility in water at low temperature and the miscibility with the (B) water-soluble plasticizer are good, and thus the polyol can be preferably used.

[0137] The ratio of the third repeating unit in the vinyl alcohol polymer is preferably 20 mol% or less, more preferably 10 mol% or less, and further preferably 5 mol% or less.

[0138] When the content is 20 mol % or less, sheet formability is good and thus it can be preferably used.

[0139] The content ratio of the vinyl alcohol repeating unit in the vinyl alcohol polymer is not particularly limited as long as the vinyl alcohol polymer exhibits tackiness (pressure-sensitive adhesiveness) and is soluble in water. For example, the content ratio of the vinyl alcohol repeating unit in the vinyl alcohol polymer is preferably 20 mol% or more, more preferably 30 mol% or more, and further preferably 40 mol% or more.

[0140] When the content is 20 mol % or more, the adhesiveness is good and thus it is preferable.

[0141] The ratio of the vinyl alcohol repeating unit in the vinyl alcohol polymer is preferably 90 mol% or less, more preferably 80 mol% or less, and even more preferably 60 mol% or less.

[0142] When the content is 90 mol % or less, the adhesiveness is good and thus it is preferred.

[0143] Among vinyl alcohol polymers, polymers containing repeating units derived from a monomer having a (poly)oxyalkylene structure have improved water solubility.

[0144] Therefore, the third repeating unit is preferably a repeating unit derived from a monomer having a (poly)oxyalkylene structure.

[0145] When the third repeating unit is water-soluble, the water solubility of the vinyl alcohol polymer can be increased even without the vinyl alcohol repeating unit. Therefore, from the viewpoint of solubility in water, the saponification degree of the vinyl alcohol polymer can be reduced compared to the saponification degree of the vinyl alcohol polymer not containing the third repeating unit.

[0146] Furthermore, by reducing the ratio of the crystalline vinyl alcohol repeating unit, the glass transition temperature of the vinyl alcohol copolymer can be lowered, and the tack and adhesiveness can be improved.

[0147] Therefore, the third repeating unit is more preferably a repeating unit derived from a monomer having a (poly)oxyalkylene structure, and is further preferably a repeating unit represented by the general formula (2).

[0148] The vinyl alcohol homopolymer or the vinyl alcohol copolymer may have a structure represented by the general formula (3) at at least one terminal of the polymer.

[0149] [Chemical formula 3]

[0150]

[0151] (Where R 4 represents an ether bond, an ester bond, an amide bond, an alkylene group having 1 to 6 carbon atoms, a composite group thereof, or a single bond, and R 5 and R6 independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, R 7 represents a hydrogen atom or an organic group having 1 to 20 carbon atoms. m represents an integer greater than 1)

[0152] R in the general formula (3) 4 , R 7 and m are respectively related to R in the general formula (2) 2 , R 3 The recorded contents are the same as those of n.

[0153] R 5 and R 6 are independently a hydrogen atom or an alkyl group having 1 to 10 carbon atoms. When m is 2 or more, a plurality of R 5 or multiple R 6 It can be the same or different.

[0154] As R 5 and R 6 The alkyl group in the above-mentioned group includes, for example, methyl, ethyl, n-propyl, i-propyl, butyl, pentyl and hexyl.

[0155] From the viewpoint of improving the water solubility of the vinyl alcohol-based polymer, a hydrogen atom is preferred.

[0156] The vinyl alcohol polymer may be used alone or in combination of two or more selected from vinyl alcohol homopolymers, vinyl alcohol copolymers, and vinyl alcohol polymers having a structure represented by the general formula (3) at least at one end. When two or more are used, two or more selected from vinyl alcohol copolymers may be used, or two or more selected from vinyl alcohol polymers having a structure represented by the general formula (3) at least at one end may be used.

[0157] <Vinyl pyrrolidone polymers>

[0158] In the present invention, the vinyl pyrrolidone polymer is a polymer having a structure represented by the general formula (4) as a main repeating unit.

[0159] [Chemical formula 4]

[0160]

[0161] The vinyl pyrrolidone polymer may be a vinyl pyrrolidone homopolymer or a copolymer.

[0162] Examples of the copolymerization component include ethylene, (meth)acrylic acid, maleic acid, vinyl pyrrolidone, aminoalkyl (meth)acrylate, and monomers represented by the general formula (2) (e.g., oxyethylene monoallyl ether and ethyl carbitol (meth)acrylate).

[0163] The proportion of the copolymer component in the vinyl pyrrolidone polymer is not particularly limited as long as it does not inhibit the effects of the present invention. For example, the proportion of the copolymer component is preferably 30 mol% or less, more preferably 10 mol% or less, and further preferably 5 mol% or less.

[0164] If it is 30 mol % or less, it is preferred because the formation of a strong hydrogen bond with water accompanying heat generation is not inhibited and the solubility in water is good.

[0165] In addition, vinyl pyrrolidone is particularly useful and preferred because of its easy availability and excellent water solubility and adhesiveness.

[0166] <Acrylic polymer>

[0167] The acrylic polymer refers to a polymer having a structure obtained by addition polymerization of a monomer having a (meth)acryloyloxy structure as a main repeating unit.

[0168] As a water-soluble acrylic polymer, it is preferred to have a hydroxyl group, a carboxyl group (including salts of a carboxyl group, such as sodium carboxylate, ammonium carboxylate and other functional groups), an oxyalkylene group (for example, an oxyethylene structure or an oxypropylene structure, etc.), or an amino group (including salts of an amino group, such as ammonium hydrochloride, ammonium sulfate and other functional groups).

[0169] It is more preferable that the acrylic polymer has a hydroxyl group or an oxyalkylene group because the water solubility is improved.

[0170] The acrylic polymer used in the present invention has tackiness (pressure-sensitive adhesiveness) alone or by containing (B) a water-soluble plasticizer, and therefore has a glass transition temperature of preferably 120° C. or less, more preferably 80° C. or less, and even more preferably 50° C. or less.

[0171] The glass transition temperature is measured in accordance with JIS K6240 (DSC method).

[0172] Examples of acrylic polymers include polymers obtained by copolymerizing one or more selected from hydrophilic acrylic monomers (acrylic acid, carboxyethyl acrylate, hydroxyethyl acrylate, 2-(2-ethoxyethoxy)ethyl acrylate, polyoxyethylene acrylate, polyoxypropylene acrylate, and polyoxyethylene polyoxypropylene acrylate), with one or more selected from alkyl acrylates (methyl acrylate, ethyl acrylate, propyl acrylate, butyl acrylate, 2-ethylhexyl acrylate, etc.), methacrylic monomers (methacrylic acid, alkyl methacrylates, hydroxyalkyl methacrylates, and poly(oxyalkylene) methacrylates), and acrylonitrile.

[0173] In the acrylic polymer, the proportion of monomers other than the hydrophilic acrylic monomer is not particularly limited as long as it is soluble in water and has a glass transition temperature of preferably 120° C. or less. The proportion of the monomer is, for example, preferably 30 mol % or less, more preferably 10 mol % or less, and further preferably 5 mol % or less.

[0174] Examples of acrylic polymers include: polymers obtained by copolymerizing a hydrophilic acrylic monomer from which a homopolymer having a low glass transition temperature is derived, a (meth)acrylic monomer having a polar group (carboxyl group and hydroxyl group) for improving adhesion to metal (pressure-sensitive adhesiveness), and an alkyl (meth)acrylate.

[0175] <Sugars>

[0176] In the present invention, the saccharide is a polymer including the properties of the water-soluble adhesive.

[0177] For example, pullulan which is a repeating unit represented by the general formula (5), hydroxyethyl cellulose which is a repeating unit represented by the general formula (6), carboxymethyl cellulose which is a repeating unit represented by the general formula (7), and starch can be cited.

[0178] [Chemical formula 5]

[0179]

[0180] [Chemical formula 6]

[0181]

[0182] (Where R 8 independently represents a hydrogen atom or a mono- or poly-oxyalkylene group having a hydrogen atom at the terminal.)

[0183] [Chemical formula 7]

[0184]

[0185] (Where R 9 independently represents a hydrogen atom or CH2COONa or CH2COONH4. )

[0186] [(B) Water-soluble plasticizer]

[0187] Component (B), i.e., a water-soluble plasticizer, acts as a plasticizer of component (A) and has the effect of making the main component of the capture composition and the capture sheet of the present invention, i.e., component (A), more flexible. Thus, the impact when the semiconductor element separated from the transfer source substrate contacts the capture composition and the capture sheet of the present invention can be absorbed, and the positional displacement caused by damage and rebound of the semiconductor element can be prevented.

[0188] Therefore, in order to make the component (A) more flexible, the water-soluble plasticizer (B) is preferably in a liquid state during the capturing and joining of the parts. For example, it is preferably in a liquid state at room temperature (25° C.).

[0189] The (B) water-soluble plasticizer in the present invention is a substance other than the component (A). The (B) water-soluble plasticizer in the present invention contains water.

[0190] The boiling point of the water-soluble plasticizer (B) is not particularly limited, and is, for example, 120° C. or higher, preferably 150° C. or higher, and more preferably 180° C. or higher. When the boiling point of the water-soluble plasticizer (B) is 120° C. or higher, it is less likely to evaporate during capture, and thus the properties of the water-soluble adhesive composition for capturing parts and the water-soluble adhesive sheet for capturing parts of the present invention during capture and bonding are less likely to change.

[0191] The water-soluble adhesive composition for capturing parts and the water-soluble adhesive sheet for capturing parts of the present invention are used in a joining process accompanied by heating and / or pressurization, so (B) the water-soluble plasticizer is preferably a liquid plasticizer whose vapor pressure at the temperature during the joining process is less than the atmospheric pressure. In the case of a liquid plasticizer whose vapor pressure at the temperature is less than the atmospheric pressure, no evaporation occurs, so it is possible to suppress the formation of bubbles (i.e., "voids") of vapor in the capturing composition and the capturing sheet.

[0192] In addition, the upper limit of the boiling point of the (B) water-soluble plasticizer is not particularly limited, and is, for example, 500° C. or lower.

[0193] The (B) water-soluble plasticizer is removed by water washing after the bonding process. Therefore, it can be used without particular limitation as long as it is soluble in water. In order to enable efficient water washing, the solubility of the (B) water-soluble plasticizer in water at room temperature (25°C) is preferably 0.10 g / g-H2O or more, more preferably 0.30 g / g-H2O or more, and even more preferably 0.50 g / g-H2O or more.

[0194] The water-soluble plasticizer (B) preferably has a property of not inhibiting the meltability of the component (A) in the joining step and having excellent water solubility, and an aqueous solution of the water-soluble plasticizer (B) is preferably a low-viscosity aqueous solution.

[0195] Therefore, the water-soluble plasticizer (B) is preferably in liquid form at room temperature (25°C). The upper limit of the viscosity of the water-soluble plasticizer (B) is preferably 50,000 mPa·s or less at room temperature (25°C), more preferably 40,000 mPa·s or less, further preferably 1,000 mPa·s or less, and further preferably 600 mPa·s or less. On the other hand, the lower limit is not particularly limited, but is preferably 0.8 mPa·s or more, and more preferably 1.0 mPa·s or more.

[0196] The viscosity of the aqueous solution depends on the molecular weight of the solute, and therefore, for example, the molecular weight of the compound used as the (B) water-soluble plasticizer is preferably 5000 or less, more preferably 3000 or less, further preferably 1000 or less, further preferably 800 or less, and particularly preferably 600 or less. It should be noted that in the description of the present invention, the molecular weight of the water-soluble plasticizer having a molecular weight distribution refers to the weight average molecular weight.

[0197] As the type of the (B) water-soluble plasticizer, a water-soluble plasticizer is selected that does not reduce solvent solubility, meltability, and surface tension due to reaction or interaction with the component (A) to impair the effects of the present invention.

[0198] For example, when the component (A) and the component (B) react to form a three-dimensional crosslinked structure, solvent solubility, meltability, and surface tension are impaired.

[0199] As the water-soluble plasticizer as component (B) of the present invention, monohydric alcohols or polyhydric alcohols and alkanolamines are preferred, because they have a plurality of hydrophilic functional groups and are therefore excellent in terms of water solubility.

[0200] More specifically, as the (B) water-soluble plasticizer, for example, glycerin, diglycerin, ethylene glycol, diethylene glycol, propane-1,2-diol, 1,3-propylene glycol, diethylene glycol monomethyl ether, ethanolamine, trimethanolamine, and the like can be mentioned.

[0201] Examples of the high molecular weight water-soluble plasticizer include polyethylene glycol, terminal monoalkoxy polyethylene glycol, terminal dialkoxy polyethylene glycol, polyglycerol, propylene glycol, and polypropylene glycol.

[0202] Here, (B) the water-soluble plasticizer is preferably glycerol, diglycerol, polyethylene glycol, polypropylene glycol and triethanolamine. Glycerol, diglycerol, polyethylene glycol, polypropylene glycol and triethanolamine have excellent miscibility with water and a high boiling point. Therefore, the meltability and surface tension of the capture sheet in the joining process and the water washability in the washing process are excellent. From the viewpoint of easy availability and handling, glycerol, diglycerol, polyethylene glycol and polypropylene glycol are more preferred, and glycerol and polyethylene glycol are further preferred.

[0203] The ratio of the content of the water-soluble plasticizer (B) to the content of the water-soluble adhesive (A) ((B) / (A)) is greater than 0.5 and less than 3.0. As shown in the examples described below, if this value is not satisfied, sufficient impact absorption, tackiness and adhesiveness cannot be obtained, and the workability during pasting and peeling may be poor.

[0204] [Other ingredients]

[0205] The capturing sheet of the present invention may contain 10% by mass or less of water based on the entire capturing sheet, within a range not impairing the effects of the present invention.

[0206] The capturing composition and capturing sheet of the present invention may contain other components within a range not inhibiting the effects of the present invention.

[0207] Examples of other components include lubricants, antioxidants, antistatic agents, surfactants, heat stabilizers, rust preventives, and surface conditioners (leveling agents).

[0208] It should be noted that the capturing composition and capturing sheet of the present invention preferably do not contain a thermosetting resin because a thermosetting resin solidifies during the bonding step and may not be removed by washing with water or the like.

[0209] [Method for producing a water-soluble adhesive composition for capturing parts]

[0210] The water-soluble adhesive composition for capturing parts of the present invention can be produced by a known production method.

[0211] For example, the raw materials in Table 1 and Table 2 described later can be used and kneaded with a mixer or the like to produce the product.

[0212] [Method for producing a water-soluble adhesive sheet for capturing parts]

[0213] The water-soluble adhesive sheet for capturing components of the present invention can be produced using a known production method for producing a sheet containing an adhesive.

[0214] For example, it can be produced by forming a layer using the water-soluble adhesive composition for capturing components of the present invention on a prepared release sheet.

[0215] The base material of the release sheet is not particularly limited as long as it can release the water-soluble adhesive composition for capturing parts of the present invention. Examples of the base material of the release sheet include polyester, polyolefin, and polyamide.

[0216] Examples of the polyester include polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, and polybutylene terephthalate.

[0217] Examples of the polyolefin include linear low-density polyethylene, low-density polyethylene, medium-density polyethylene, and polypropylene.

[0218] Examples of the polyamide include polycaprolactam, polyhexamethylene adipamide, polybutylene adipamide, polyhexamethylene isophthalamide, polyhexamethylene sebacamide, polyhexamethylene dodecanamide, polyhexamethylene terephthalamide, polynonamethylene terephthalamide, polydecamethylene terephthalamide, polyundecanelactam, polydodecanelactam, and polymeta-xylylene adipamide.

[0219] At least one surface of the release sheet may be subjected to a known release treatment.

[0220] The layer using the water-soluble adhesive composition for capturing parts of the present invention may be formed on one side or both sides of the release sheet.

[0221] The method for providing the layer using the capturing composition of the present invention is not particularly limited, and a known method can be used.

[0222] For example, it can be produced by dissolving or dispersing a composition containing all or part of the components constituting the capturing sheet in a solvent and applying the resultant composition on the release sheet.

[0223] Examples of the solvent include water, an organic solvent, and a mixture of water and an organic solvent. Examples of the organic solvent include methanol, ethanol, 1-propanol, 2-propanol, 1-butanol, 2-butanol, 2-methyl-1-propanol, 2-methyl-2-propanol, 1-pentanol, 2-pentanol, 3-pentanol, 2-methyl-1-butanol, 2-methyl-2-butanol, 3-methyl-1-butanol, 3-methyl-2-butanol, and 2,2-dimethyl-1-propanol.

[0224] There are no particular limitations on the coating method, as long as the layer formed using the capturing composition of the present invention is formed into a uniform thickness. Examples of the method for forming a uniform thickness layer include spin coating, blade coating, slit coating, and slot die coating.

[0225] When a composition containing a part of the components constituting the capturing sheet is used, for example, after the layer is formed, the liquid component (e.g., component (B)) may be impregnated with or replaced with the liquid component (e.g., component (B)) before or after the capturing sheet is dried.

[0226] At this time, the drying temperature is 60°C to 140°C, preferably 80°C to 120°C.

[0227] [Method of using the water-soluble adhesive composition for capturing parts (water-soluble adhesive sheet for capturing parts)]

[0228] The water-soluble adhesive composition for capturing components and the water-soluble adhesive sheet for capturing components of the present invention can be used, for example, in the production of electronic components having the following steps.

[0229] Hereinafter, the method for using the water-soluble adhesive sheet for capturing components of the present invention will be mainly described. It should be noted that the following description related to the method for using the water-soluble adhesive composition for capturing components (water-soluble adhesive sheet for capturing components) can be replaced with the description of the method for manufacturing the electronic component of the present invention.

[0230] (1) Step of placing and laminating (applying) the capturing sheet (capturing composition) of the present invention on the electrode surface side of the wiring substrate

[0231] (2) Step of capturing semiconductor elements on the capturing sheet (capturing composition) of the present invention

[0232] (3) Joining step of electrically joining the semiconductor element to the wiring substrate

[0233] (4) Cleaning process to remove residue

[0234] (5) Drying process of wiring substrate

[0235] <(1) Lamination process>

[0236] The capturing sheet of the present invention is placed on the electrode surface side of the wiring substrate, and in the laminating step, the capturing sheet of the present invention formed on the release sheet is laminated to the wiring substrate. If the capturing sheet of the present invention has a release sheet, the release sheet is peeled off.

[0237] The electrode surface of the wiring substrate may be cleaned before attaching the capturing sheet of the present invention. Cleaning may be performed using an organic solvent, an acidic aqueous solution, an alkaline aqueous solution, or the like.

[0238] The wiring substrate is not particularly limited as long as it is a substrate having wiring, and examples thereof include a glass substrate, ie, a TFT backplane, a glass epoxy substrate, ie, FR-4, a ceramic substrate, and a silicon wafer.

[0239] Instead of the step of laminating the capturing sheet of the present invention, a step of directly applying the capturing composition of the present invention to the electrode surface side of the wiring board and drying the same may be performed.

[0240] <(2) Capturing process>

[0241] In the step of capturing semiconductor elements on the capturing sheet of the present invention, a component (element) is placed at a desired position on a substrate. This capturing step may also serve as a step called a transfer step in semiconductor manufacturing.

[0242] The transfer process is a process in which the position of the semiconductor element in the wiring substrate is determined, and the semiconductor element is moved from a substrate on which the semiconductor element is formed or a substrate temporarily holding the semiconductor element as a transfer source to the capture sheet of the present invention as a transfer target. It should be noted that as the transfer process, a non-contact transfer process and a contact transfer process are known, but there is no particular limitation.

[0243] Non-contact transfer process

[0244] As one method of the transfer process, a non-contact transfer process is used as an example. Figure 1 The transfer process using the capture sheet of the present invention is not limited to the illustrated embodiment. In the drawings, some parts are enlarged or reduced for easier understanding of the description.

[0245] (i) arranging the following two surfaces to face each other with a gap therebetween, one of which is the surface produced in the bonding step (1) Figure 1 In the transfer target substrate 1A shown in (a), the surface opposite to the surface of the water-soluble adhesive sheet 11A on which the component of the present invention is bonded to the wiring substrate 12A is captured, and the other surface is the surface of the transfer source substrate 2A having the semiconductor element 21A.

[0246] Here, Figure 1 The transfer source substrate 2A shown in (a) has a semiconductor element 21A, and the semiconductor element 21A is held by an adhesive layer 22A formed on one surface of a holding substrate 23A that temporarily holds the element.

[0247] (ii) If Figure 1 As shown in (b), in the transfer source substrate 2A, energy beam (laser, etc.) 3 is irradiated to the positions of one or more desired semiconductor elements from the surface opposite to the surface on which the semiconductor element 21A is formed. By irradiating the energy beam (laser, etc.) 3, as shown in FIG. Figure 1 As shown in (c), the semiconductor element 21A is separated from the transfer source substrate 2A, and the separated semiconductor element 21A is adhered to the capture sheet 11A of the transfer target to perform the transfer.

[0248] (iii) Then, if Figure 1As shown in (d), the transfer source substrate 2B is moved to a desired position relative to the transfer target substrate 1A, and the transfer source substrate 2B includes a holding substrate 23B for temporarily holding other semiconductor elements 21B other than the semiconductor element 21A. Figure 1 (e) and Figure 1 As shown in (f), repeat the steps involved in (ii).

[0249] (iv) Repeat the above steps (ii) and (iii), and repeat the above step (i) as necessary, and transfer and arrange the semiconductor elements at all desired positions on the transfer target substrate 1A. (Not shown)

[0250] The holding substrate 23A and the holding substrate 23B in the transfer source substrate 2A and the transfer source substrate 2B may be, for example, any one of a sapphire substrate, quartz glass, glass, and plastic. By irradiating the energy line (laser, etc.) 3, the components constituting the adhesive layer 22A and the adhesive layer 22B are decomposed (and foamed), condensed, softened, or melted, thereby separating the holding substrate 23A from the semiconductor element 21A and separating the holding substrate 23B from the semiconductor element 21B.

[0251] Therefore, in order to allow the adhesive layers 22A and 22B to efficiently absorb the energy of the energy beam (laser or the like) 3, the holding substrates 23A and 23B are preferably substrates that transmit the energy beam 3 or have low absorption.

[0252] The components constituting the adhesive layer 22A and the adhesive layer 22B in the transfer source substrate 2A and the transfer source substrate 2B include an adhesive component. As the adhesive component, for example, silicone, acrylic polymer, polyvinyl alcohol polymer, and vinyl pyrrolidone polymer can be cited. The components constituting the adhesive layer 22A and the adhesive layer 22B may include a component that promotes foaming or a cross-linking component that aggregates by the energy line (laser) 3.

[0253] As the energy beam 3, for example, laser light can be cited. As the laser light, for example, excimer laser light and high-harmonic YAG laser light can be cited.

[0254] Contact transfer process

[0255] Next, as another method of the transfer process, according to Figure 2 The contact transfer process is described.

[0256] In this method, the semiconductor element in the holding substrate for temporarily holding the element is brought into contact with the capture sheet of the present invention in the substrate and transferred, and other than that, the process is the same as the non-contact transfer process. Therefore, the following (i) to (iv) are described, and the description of other contents common to the non-contact transfer process is omitted.

[0257] (i)If Figure 2 (a) and Figure 2 As shown in (b), the semiconductor element 21C in the transfer source substrate 2C is brought into contact with the component capturing water-soluble adhesive sheet 11B in the transfer target substrate 1B.

[0258] (ii) If Figure 2 As shown in (c), an energy beam (laser, etc.) 3 is irradiated to the positions of one or more desired semiconductor elements from the surface of the transfer source substrate 2C opposite to the surface on which the semiconductor element 21C is formed. By irradiating the energy beam (laser, etc.) 3, as shown in Figure 2 As shown in (d), the semiconductor element 21C is separated from the transfer source substrate 2C, which is the transfer source, and the separated semiconductor element 21C is adhered to the transfer target, which is the capture sheet 11B, and transferred.

[0259] (iii) After the separated semiconductor element 21C is transferred, Figure 2 As shown in (e), in the transfer source substrate 2D, the transfer source substrate 2D is moved to a desired position so that the semiconductor element 21D in the transfer source substrate 2D contacts the capture sheet 11B, wherein the transfer source substrate 2D holds the other semiconductor elements 21D other than the semiconductor element 21C on the holding substrate 23D. After contact, as shown in FIG. Figure 2 (f)~ Figure 2 As shown in (h), repeat the above step (ii).

[0260] (iv) Repeat the above steps (ii) and (iii), and repeat the above step (i) as necessary, and transfer and arrange the semiconductor elements at all desired positions on the transfer target substrate 1B. (Not shown)

[0261] · Variations in the transfer process

[0262] The method in the transfer step is not limited to the above-described method, and modifications and improvements can be included within the scope of achieving the object of the present invention.

[0263] All the semiconductor elements formed on the holding substrate in the non-contact transfer step or the contact transfer step may be irradiated with energy beams (laser) to transfer the semiconductor elements all at once.

[0264] In (iii) of the non-contact transfer process or the contact transfer process, the transfer target substrate 1A and the transfer target substrate 1B may be moved instead of moving the holding substrate (23B and 23D), or the holding substrate (23B or 23D) and the transfer target substrate 1A and the transfer target substrate 1B may be moved together.

[0265] Furthermore, an element forming substrate may be used instead of the transfer source substrate (2A, 2B, 2C and 2D) in the non-contact transfer process or the contact transfer process, or the transfer source substrate (2A, 2B, 2C and 2D) and the element forming substrate may be used together.

[0266] For example, the element forming substrate can be exemplified by forming a laminate having various layers such as a conductive layer on a sapphire substrate, and growing a semiconductor crystal on the laminate, thereby forming a substrate for a light emitting diode. If a laser is irradiated to the crystal through the sapphire substrate, the surface of the layer located at the interface with the sapphire substrate is decomposed, thereby being able to separate the light emitting diode.

[0267] <(3) Joining process>

[0268] In the joining process of electrically joining the element to the wiring substrate, heating and / or pressurization are performed to soften or melt the capture composition and the capture sheet of the present invention. By softening or melting the capture composition and the capture sheet of the present invention between the element and the wiring substrate, the element and the wiring substrate are electrically joined.

[0269] The temperature of the bonding step is selected according to the characteristics of the resin and solder, and is, for example, 150° C. or 160° C., or may be heated in multiple stages.

[0270] The maximum temperature of the bonding step is selected according to the heat resistance of the semiconductor element, and is, for example, preferably 260° C. or lower, more preferably 240° C. or lower, and further preferably 230° C. or lower.

[0271] <(4) Cleaning process>

[0272] The capturing composition and capturing sheet of the present invention may remain after the joining step, and therefore, the residue is removed by washing.

[0273] Deionized water (ultrapure water, ion exchange water, distilled water, etc.) may be used for cleaning, or a mixture of a water-soluble organic solvent and water may be used. From the viewpoint of low environmental load and easy availability, it is preferred to use only deionized water. Hereinafter, deionized water and a mixture of a water-soluble organic solvent and water are also referred to as "water, etc.". Additives that hydrolyze the water-soluble adhesive may be added to the water, etc. For example, hydrolases such as amylase, glucoamylase, pullulanase, cellulase, and protease may be cited. When using the hydrolase, it is preferred to clean in the optimal pH and temperature range for high enzyme activity, or, Ca may be added according to different enzymes. 2+ Additives such as glycerol can further improve enzyme activity.

[0274] As the water-soluble organic solvent, alcohol and ketone can be cited, and alcohol is preferred. When a water-soluble organic solvent is used, it can be used alone or in combination of two or more. As alcohol, for example, methanol, ethanol, n-propanol, n-butanol, etc. can be cited, and as ketone, acetone, methyl ethyl ketone, etc. can be cited. It can also be a mixture of deionized water and a water-soluble organic solvent, and the mixing ratio is not particularly limited. From the viewpoint of reducing the environmental load, a mixture with a low ratio of the water-soluble organic solvent is preferred.

[0275] In order to improve the penetration of water etc. into narrow gaps, a surfactant may be added as an additive to the water etc. Other additives that improve the cleaning properties may also be added.

[0276] In the washing step, the temperature of the water or the like used is selected according to the solubility of component (A) and component (B). For example, the temperature of the water or the like used in the washing is preferably 10°C or higher, more preferably 20°C or higher, and even more preferably 30°C or higher.

[0277] If the temperature is 10° C. or higher, there is a tendency that there is no residue or little residue after washing, and therefore it is preferred.

[0278] The temperature of water or the like used for washing is preferably 80° C. or lower, more preferably 70° C. or lower, and further preferably 60° C. or lower.

[0279] If the temperature is 80° C. or lower, energy consumption is small and environmental load is low, so it is preferred.

[0280] When a hydrolase is used, since each enzyme has an optimal temperature range in which its activity is high, it is preferable to perform washing at the above temperature.

[0281] <(5) Drying process>

[0282] The drying process of the wiring substrate may also be performed by the following method: a method of dehydrating by centrifugal force (spin dryer), or a method of using a highly evaporative water-miscible organic solvent (isopropyl alcohol, etc.) and washing with the organic solvent followed by drying.

[0283] The drying temperature can be appropriately designed according to the boiling point of the solvent and the like.

[0284] Example

[0285] Hereinafter, the present invention will be specifically described by way of examples, but the technical scope of the present invention is not limited to these examples.

[0286] The measurement method and evaluation method used in the present invention are as follows.

[0287] [1] Measurement method

[0288] (1) Calculation of the composition of the capture sheet

[0289] In the capture sheets in Tables 3 and 4, the amount of water contained in the capture sheets was measured by the Karl Fischer method. The composition was calculated by assuming that (A) the water-soluble adhesive and (B) the water-soluble plasticizer were substances that were not removed from the system by evaporation or the like during the drying process of the capture sheet production, and the solvent other than water was a substance that was completely removed from the system.

[0290] (2) Viscosity measurement

[0291] The viscosity of the sample at 25° C. was measured using a rotational viscometer (TVE-25H viscometer manufactured by Toki Sangyo Co., Ltd.) at 1 rpm (polyglycerol), 50 rpm (glycerol, PEG600, PPG3000), and 100 rpm (diethylene glycol, ethylene glycol, propylene glycol, PEG400, diethylene glycol monomethyl ether).

[0292] [2] Evaluation Method

[0293] (1) Evaluation method of adhesion

[0294] After the glass plate (AS ONE, product name: Slide Glass, thickness 1.0-1.2 mm, weight 5 g) and the water-soluble adhesive sheet (thickness 5 μm) for component capture were pressed together at room temperature (25°C) using a roller, the polyethylene terephthalate film was peeled off. The bottom of a cylindrical glass tube with a diameter of 10 mm was pressed against the center of the glass plate with the capture sheet attached, and it was directly picked up by hand. Next, the time until the bottom of the glass tube was peeled off from the capture sheet and the glass plate fell was measured.

[0295] ○: No drop for more than 41 seconds.

[0296] △: Falls within 21 to 40 seconds.

[0297] ×: Falls within 20 seconds.

[0298] (2) Viscosity evaluation method

[0299] Using a rolling ball device with an inclined plane with an inclination angle of 10° and a horizontal plane connected to the bottom of the inclined plane, a capturing sheet (thickness 5 μm) is pasted on the horizontal plane, and a test ball (made of alumina, weight 0.1 g, diameter 4 mm) is rolled down from a position above the inclined plane (height 9 mm), and the distance until the test ball stops is measured.

[0300] ○: Stops within 9 mm.

[0301] △: Stop within 10 to 20 mm.

[0302] ×: Did not stop within 20 mm.

[0303] It should be noted that both the adhesive force and the tackiness are for evaluating the capturing property of the water-soluble adhesive sheet for capturing components.

[0304] (3) Evaluation method of workability during sticking and peeling

[0305] After a glass plate (AS ONE, product name: Slide Glass, thickness 1.0-1.2 mm, weight 5 g) and a water-soluble adhesive sheet for capturing parts (thickness 5 μm) were pressed together at room temperature (25° C.) using a roller, the release film (polyethylene terephthalate film) was peeled off. At this time, it was visually confirmed whether the capture sheet remained on the release film, whether stringing or separation (incomplete separation) occurred.

[0306] ○: No stringing or separation occurred.

[0307] △: Stringing and separation were slightly generated.

[0308] ×: Multiple wire drawing and separation occurred, or the bonding itself could not be achieved.

[0309] Tables 1 and 2 show the components and ratios of the raw materials (water-soluble adhesive compositions for capturing parts) used in the production of sheets of Examples and Comparative Examples. Tables 3 and 4 show the mass ratios and evaluation results of the components of the sheets (water-soluble adhesive sheets for capturing parts) produced using the raw materials (water-soluble adhesive compositions for capturing parts).

[0310] [Example 1]

[0311] (Manufacturing of Capture Sheet)

[0312] 50 parts by mass of polyvinyl pyrrolidone (K-30 manufactured by Daiichi Kogyo Seiyaku Co., Ltd.) and 35 parts by mass of polyethylene glycol (PEG#400 manufactured by NOF Corporation) were dissolved in 350 parts by mass of ion-exchanged water to obtain a polyvinyl pyrrolidone solution.

[0313] The polyvinyl pyrrolidone solution was applied onto a release-treated polyethylene terephthalate film (6502, manufactured by Lintec Corporation) using an applicator.

[0314] The obtained capture sheet was dried at 100° C. to obtain a film thickness of 5 μm. The drying temperature in the following Examples and Comparative Examples was 100° C. when the solvent was ion-exchanged water or ethanol, and 120° C. when the solvent was 1-butanol.

[0315] [Example 2]

[0316] (Manufacturing of Capture Sheet)

[0317] A capturing sheet was obtained in the same manner except that a polyvinyl pyrrolidone solution prepared by dissolving 50 parts by mass of polyvinyl pyrrolidone (K-50, manufactured by Daiichi Kogyo Seiyaku Co., Ltd.) and 45 parts by mass of diethylene glycol in 350 parts by mass of ethanol was used instead of the polyvinyl pyrrolidone solution in Example 1.

[0318] [Example 3]

[0319] (Manufacturing of Capture Sheet)

[0320] A capturing sheet was obtained in the same manner except that a polyvinyl pyrrolidone solution prepared by dissolving 50 parts by mass of polyvinyl pyrrolidone (K-85N, Nippon Shokubai Co., Ltd.) and 60 parts by mass of ethylene glycol in 350 parts by mass of 1-butanol was used instead of the polyvinyl pyrrolidone solution in Example 1.

[0321] [Example 4]

[0322] (Manufacturing of Capture Sheet)

[0323] A capture sheet was obtained in the same manner except that a polyvinyl pyrrolidone solution obtained by dissolving 50 parts by mass of polyvinyl pyrrolidone (Nippon Shokubai Co., Ltd., K-85N) and 70 parts by mass of polyethylene glycol (manufactured by NOF Corporation, PEG#400) in 350 parts by mass of ethanol was used instead of the polyvinyl pyrrolidone solution in Example 1.

[0324] [Example 5]

[0325] (Manufacturing of Capture Sheet)

[0326] A capture sheet was obtained in the same manner except that a polyvinyl pyrrolidone solution obtained by dissolving 50 parts by mass of polyvinyl pyrrolidone (Nippon Shokubai Co., Ltd., K-85N) and 80 parts by mass of polyethylene glycol (FUJIFILM Wako Pure Chemical Industries, Ltd., PEG#600) in 350 parts by mass of 1-butanol was used instead of the polyvinyl pyrrolidone solution in Example 1.

[0327] [Example 6]

[0328] (Manufacturing of Capture Sheet)

[0329] A capture sheet was obtained in the same manner except that a polyvinyl pyrrolidone solution obtained by dissolving 50 parts by mass of polyvinyl pyrrolidone (Nippon Shokubai Co., Ltd., K-85N) and 90 parts by mass of polypropylene glycol (FUJIFILM Wako Pure Chemical Industries, Ltd., PEG#3000) in 350 parts by mass of 1-butanol was used instead of the polyvinyl pyrrolidone solution in Example 1.

[0330] [Example 7]

[0331] (Manufacturing of Capture Sheet)

[0332] A capturing sheet was obtained in the same manner except that a polyvinyl pyrrolidone solution prepared by dissolving 50 parts by mass of polyvinyl pyrrolidone (K-85N, Nippon Shokubai Co., Ltd.) and 110 parts by mass of propylene glycol in 350 parts by mass of 1-butanol was used instead of the polyvinyl pyrrolidone solution in Example 1.

[0333] [Example 8]

[0334] (Manufacturing of Capture Sheet)

[0335] A capture sheet was obtained in the same manner except that a polyvinyl pyrrolidone solution obtained by dissolving 50 parts by mass of polyvinyl pyrrolidone (K-90N manufactured by Nippon Shokubai Co., Ltd.) and 130 parts by mass of polyglycerol (PGL 20PW manufactured by Daicel Co., Ltd.) in 350 parts by mass of ethanol was used instead of the polyvinyl pyrrolidone solution in Example 1.

[0336] [Example 9]

[0337] (Manufacturing of Capture Sheet)

[0338] A capture sheet was obtained in the same manner except that a polyvinyl pyrrolidone solution obtained by dissolving 50 parts by mass of polyvinyl pyrrolidone (K-90N manufactured by Nippon Shokubai Co., Ltd.) and 140 parts by mass of polyglycerol (PGL 20PW manufactured by Daicel Co., Ltd.) in 350 parts by mass of ethanol was used instead of the polyvinyl pyrrolidone solution in Example 1.

[0339] [Example 10]

[0340] (Manufacturing of Capture Sheet)

[0341] A capture sheet was obtained in the same manner except that a polyvinyl alcohol solution obtained by dissolving 50 parts by mass of polyvinyl alcohol (GOHSENOL (registered trademark) GR-14 manufactured by Nippon Synthetic Chemical Industry Co., Ltd.) and 40 parts by mass of diethylene glycol monomethyl ether in 350 parts by mass of ion-exchanged water was used instead of the polyvinyl pyrrolidone solution in Example 1.

[0342] [Example 11]

[0343] (Manufacturing of Capture Sheet)

[0344] A capturing sheet was obtained in the same manner except that a polyacrylic acid solution prepared by dissolving 50 parts by mass of polyacrylic acid (AS-58, manufactured by Nippon Shokubai Co., Ltd.) and 100 parts by mass of glycerol in 350 parts by mass of ion-exchanged water was used instead of the polyvinyl pyrrolidone solution in Example 1.

[0345] [Example 12]

[0346] (Manufacturing of Capture Sheet)

[0347] A capture sheet was obtained in the same manner except that a pullulan solution prepared by dissolving 50 parts by mass of pullulan (manufactured by Hayashibara Co., Ltd.), 80 parts by mass of polyethylene glycol (FUJIFILM Wako Pure Chemical Industries, Ltd., PEG#600), and 20 parts by mass of glycerol in 350 parts by mass of ethanol was used instead of the polyvinyl pyrrolidone solution in Example 1.

[0348] [Example 13]

[0349] (Manufacturing of Capture Sheet)

[0350] Instead of the polyvinyl pyrrolidone solution in Example 1, a mixed solution was used, in which 30 parts by mass of polyvinyl pyrrolidone (K-85N, Nippon Shokubai Co., Ltd.), 20 parts by mass of polyvinyl alcohol (GOHSENOL (registered trademark) GR-14, manufactured by Nippon Synthetic Chemical Industry Co., Ltd.), and 90 parts by mass of glycerol were dissolved in 100 parts by mass of ion exchange water and 250 parts by mass of 1-butanol. A capture sheet was obtained in the same manner, except that

[0351] [Comparative Example 1]

[0352] A comparative sheet was obtained in the same manner except that a polyvinyl pyrrolidone solution obtained by dissolving 50 parts by mass of polyvinyl pyrrolidone (K-30 manufactured by Daiichi Kogyo Seiyaku Co., Ltd.) and 25 parts by mass of polyethylene glycol (PEG#400 manufactured by NOF Corporation) in 350 parts by mass of ethanol was used instead of the polyvinyl pyrrolidone solution in Example 1.

[0353] [Comparative Example 2]

[0354] A comparative sheet was obtained in the same manner except that a polyvinyl pyrrolidone solution prepared by dissolving 50 parts by mass of polyvinyl pyrrolidone (K-90N, Nippon Shokubai Co., Ltd.) and 160 parts by mass of polyglycerol in 350 parts by mass of ethanol was used instead of the polyvinyl pyrrolidone solution in Example 1.

[0355] The weight average molecular weight Mw of the water-soluble adhesive as the component (A) used in the Examples and Comparative Examples is as follows.

[0356] Polyvinyl pyrrolidone

[0357] K-30: 45,000, K-50: 250,000

[0358] K-85N: 340,000, K-90N: 360,000

[0359] Polyvinyl alcohol (GR-14): 29,000

[0360] Polyacrylic acid (AS-58): 800,000

[0361] Pullulan: 200,000

[0362] [Table 1]

[0363]

[0364] PEG: Polyethylene glycol PPG: Polypropylene glycol [Table 2]

[0365]

[0366] [Table 3]

[0367]

[0368] [Table 4]

[0369]

[0370] When comparing each embodiment (embodiments 1 to 13) with comparative example 1, it can be seen from the viscosity evaluation results that the ratio of the content of the water-soluble plasticizer (B) to the content of the water-soluble adhesive (A) ((B) / (A)) is less than 0.5, and the ratio of the solid content, i.e., component (A), is higher than the specified value, so the viscosity is reduced and the test ball cannot be stopped. In other words, it is shown that the ability to catch the parts that have collided is low in comparative example 1 because the viscosity is small and the sheet properties are closer to elasticity. On the other hand, sufficient impact absorption is exerted in each embodiment.

[0371] When comparing each of the examples (Examples 1 to 13) and Comparative Example 2, the evaluation results of the adhesive force and the workability show that when the ratio of the content of the water-soluble plasticizer (B) to the content of the water-soluble adhesive (A) ((B) / (A)) is greater than 3.0, the ratio of the liquid component, i.e., component (B), is higher than the specified value, and thus the sheet will stretch. Therefore, it is shown that in Comparative Example 2, the adhesiveness and workability of the sheet will be reduced, and industrial use will be difficult. On the other hand, in each of the examples, sufficient adhesive force is exerted and the workability is also good.

[0372] - Industrial Applicability -

[0373] The water-soluble adhesive composition for capturing components and the water-soluble adhesive sheet for capturing components of the present invention can be well used as a composition for capturing components and a sheet for capturing components. In particular, in the manufacture of electronic components, they can be well used as components when semiconductor elements are arranged on a substrate.

[0374] The method for manufacturing an electronic component of the present invention can easily capture a component (semiconductor element, etc.) at a desired position on a substrate, and can be preferably used in a manufacturing method capable of manufacturing with high accuracy and high efficiency.

[0375] - Explanation of symbols -

[0376] 1A, 1B...substrate to be transferred

[0377] 11A, 11B... Water-soluble adhesive sheet for capturing parts

[0378] 12A, 12B... Wiring board

[0379] 2A, 2B, 2C, 2D···Transfer source substrate

[0380] 21A, 21B, 21C, 21D...Semiconductor devices

[0381] 22A, 22B, 22C, 22D... Adhesive layer

[0382] 23A, 23B, 23C, 23D... Holding substrate

[0383] 3. Energy Line

Claims

1. A water-soluble adhesive composition for capturing parts, comprising (A) a water-soluble adhesive and (B) a water-soluble plasticizer (excluding the component (A)), characterized in that: The viscosity of the water-soluble plasticizer (B) is 50,000 mPa·s or less at room temperature (25° C.), and the ratio of the content of the water-soluble plasticizer (B) to the content of the water-soluble adhesive (A) ((B) / (A)) is greater than 0.5 and less than 3.

0.

2. A water-soluble adhesive composition for capturing parts, comprising (A) a water-soluble adhesive and (B) a water-soluble plasticizer (excluding the component (A)), characterized in that: The (B) water-soluble plasticizer is liquid at room temperature (25° C.) and has a molecular weight of 5000 or less, and the ratio of the content of the (B) water-soluble plasticizer to the content of the (A) water-soluble adhesive ((B) / (A)) is greater than 0.5 and less than 3.

0.

3. A water-soluble adhesive composition for capturing parts, comprising (A) a water-soluble adhesive and (B) a water-soluble plasticizer (excluding the component (A)), characterized in that: The weight average molecular weight of the water-soluble adhesive (A) is 1.0×10 4 Above and 1.0×10 6 Hereinafter, the ratio of the content of the (B) water-soluble plasticizer to the content of the (A) water-soluble adhesive ((B) / (A)) is greater than 0.5 and less than or equal to 3.

0.

4. The water-soluble adhesive composition for capturing parts according to claim 1, 2 or 3, characterized in that: The (A) water-soluble adhesive contains at least one water-soluble adhesive selected from the group consisting of vinyl alcohol polymers, vinyl pyrrolidone polymers, acrylic polymers and sugars.

5. The water-soluble adhesive composition for capturing parts according to claim 1, 2 or 3, characterized in that: The (B) water-soluble plasticizer is a monohydric alcohol or a polyhydric alcohol that is liquid at room temperature (25° C.).

6. The water-soluble adhesive composition for capturing parts according to claim 1, 2 or 3, characterized in that: The boiling point of the (B) water-soluble plasticizer is above 120°C.

7. The water-soluble adhesive composition for capturing parts according to claim 1, 2 or 3, characterized in that: The (B) water-soluble plasticizer contains at least one selected from glycerol, diglycerol, polyethylene glycol, ethylene glycol, propylene glycol and polypropylene glycol.

8. A water-soluble adhesive sheet for capturing parts, characterized in that: have: The water-soluble adhesive composition for capturing parts according to claim 1, 2 or 3 is formed into a sheet-like layer.

9. A method for manufacturing an electronic component, characterized in that: include: A step of capturing a component using the water-soluble adhesive composition for capturing a component according to claim 1, 2 or 3.

10. A method for manufacturing an electronic component, characterized in that: include: A step of capturing components using the water-soluble adhesive sheet for capturing components according to claim 8.

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