Inspection methods and computing equipment for PCB panels

Abstract

This application relates to the field of data processing technology and discloses a method and computing device for inspecting PCB panels. The PCB panel includes multiple PCB individual boards. The method includes: acquiring the position coordinates of multiple feature points on the multiple PCB individual boards and panel information of the PCB panel; determining the position coordinates of at least one target feature point corresponding to a first feature point among the multiple feature points based on the position coordinates of the multiple feature points and the panel information; determining the inspection result of the PCB panel based on the position coordinates of a second feature point on at least one second PCB individual board and the position coordinates of the at least one target feature point; the at least one second PCB individual board is a PCB individual board other than the first PCB individual board among the multiple PCB individual boards, and the inspection result of the PCB panel is used to indicate whether a target feature point exists on the second PCB individual board. This application can improve the efficiency and accuracy of inspecting PCB panels.

Description

Technical Field

[0001] This application relates to the field of data processing technology, and in particular to a method and computing device for inspecting PCB panels. Background Technology

[0002] Because printed circuit boards (PCBs) are typically small and inconvenient to process, processing a single PCB can lead to low efficiency. Therefore, multiple PCBs can be combined into a single PCB panel, allowing for processing on the panel itself, thus saving time and improving efficiency. Furthermore, PCB panels usually have reference points (or mark points, optical positioning points, etc.) to allow automated equipment (such as pick-and-place machines and optical inspection equipment) to accurately identify the panel's position and orientation during processing. Therefore, PCB panels must be inspected before processing to avoid problems such as processing failures due to incorrect reference points. Summary of the Invention

[0003] This application provides a method and computing device for inspecting PCB panels, which can improve the efficiency and accuracy of inspecting feature points of PCB panels.

[0004] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0005] In a first aspect, embodiments of this application provide a method for inspecting a PCB panel, the PCB panel comprising multiple PCB boards, the method comprising: acquiring the position coordinates of multiple feature points on the multiple PCB boards and panelization information of the PCB panel; wherein the panelization information includes a panelization method; determining the position coordinates of at least one target feature point corresponding to a first feature point among the multiple feature points based on the position coordinates of the multiple feature points and the panelization information; wherein the first feature point is any feature point on a first PCB board, and the first PCB board is any PCB board among the multiple PCB boards; determining the inspection result of the PCB panel based on the position coordinates of a second feature point on at least one second PCB board and the position coordinates of at least one target feature point; wherein the at least one second PCB board is a PCB board other than the first PCB board among the multiple PCB boards, and the inspection result of the PCB panel is used to indicate whether a target feature point exists on the second PCB board.

[0006] Based on this solution, automated inspection of PCB panels can be achieved by using the position coordinates of multiple feature points on multiple PCBs and the panelization method of the PCB panels. This avoids inspection errors caused by manual inspection and improves the efficiency of PCB panel inspection.

[0007] In one possible implementation, the panelization method includes a centrally symmetric panelization method. Based on the position coordinates of multiple feature points and panelization information, the position coordinates of at least one target feature point corresponding to a first feature point among the multiple feature points are determined. This includes: determining the central symmetry point of the PCB panel based on the position coordinates of multiple feature points and the centrally symmetric panelization method; and determining the position coordinates of at least one target feature point that satisfies a central symmetry relationship with the first feature point based on the position coordinates of the first feature point and the central symmetry point.

[0008] Based on this solution, when the panelization method is a centrally symmetrical panelization method, the central symmetry point of the PCB panel can be determined, and the position coordinates of at least one target feature point that satisfies the central symmetry relationship with the first feature point can be determined based on the position coordinates of the first feature point and the central symmetry point, thereby enabling the inspection of the central symmetry relationship between each feature point on the PCB panel.

[0009] In another possible implementation, the panelization method includes a mirror-symmetric panelization method, which determines the position coordinates of at least one target feature point corresponding to a first feature point among the multiple feature points based on the position coordinates of multiple feature points and panelization information. This includes: determining the mirror symmetry axis of the PCB panel based on the position coordinates of multiple feature points and the mirror-symmetric panelization method; and determining the position coordinates of at least one target feature point that satisfies a mirror symmetry relationship with the first feature point based on the position coordinates of the first feature point and the mirror symmetry axis.

[0010] Based on this solution, when the panelization method is a mirror symmetry panelization method, the mirror symmetry axis of the PCB panel can be determined, and the position coordinates of at least one target feature point that satisfies the mirror symmetry relationship with the first feature point can be determined based on the position coordinates of the first feature point and the mirror symmetry axis, thereby enabling the inspection of the mirror symmetry relationship between each feature point on the PCB panel.

[0011] In another possible implementation, the panelization method includes a translational panelization method, and the panelization information also includes the number of multiple PCB boards. Based on the position coordinates of multiple feature points and the panelization information, the position coordinates of at least one target feature point corresponding to a first feature point among the multiple feature points are determined, including: based on the position coordinates of multiple feature points and the translational panelization method, obtaining multiple feature points to be inspected on multiple PCB boards that have the same vertical or horizontal coordinate; based on the position coordinates of the multiple feature points to be inspected, the number of multiple feature points to be inspected, and the number of multiple PCB boards, determining a target offset; based on the position coordinates of the first feature point among the multiple feature points to be inspected and the target offset, determining the position coordinates of at least one target feature point corresponding to the first feature point; wherein, the first feature point is any one of the multiple feature points to be inspected.

[0012] Based on this solution, when the panelization method is translational panelization, it is possible to determine the target offset between multiple feature points to be inspected based on multiple feature points with the same vertical or horizontal coordinate on multiple PCBs, as well as the number of feature points to be inspected and the number of PCBs. Based on the position coordinates of the first feature point among the feature points to be inspected and the target offset, the position coordinates of at least one target feature point that satisfies the translational relationship with the first feature point can be determined, thereby enabling the inspection of the translational relationship between feature points on the PCB panel.

[0013] In another possible implementation, the target offset is determined based on the position coordinates of multiple feature points to be inspected, the number of feature points to be inspected, and the number of PCB boards. This includes: determining the number of translations based on the number of feature points to be inspected and the number of PCB boards; determining the translation distance based on the position coordinates of the feature points to be inspected; and determining the target offset based on the translation distance and the number of translations.

[0014] Based on this solution, the number of translations can be determined based on the number of feature points to be inspected and the number of PCB boards, and the translation distance can be determined based on the position coordinates of the feature points to be inspected. Thus, the target offset between each feature point to be inspected can be determined based on the translation distance and the number of translations, so as to check the translation relationship between each feature point on the PCB panel based on the target offset.

[0015] In another possible implementation, the position coordinates of at least one target feature point corresponding to the first feature point are determined based on the position coordinates of the first feature point among multiple feature points to be inspected and the target offset. This includes: determining the position coordinates of at least one target feature point corresponding to the first feature point based on the position coordinates of the first feature point, the number of translations, and the target offset; wherein, at least one target feature point is the target feature point corresponding to each translation, and the number of at least one target feature point is equal to the number of translations.

[0016] Based on this scheme, when determining the position coordinates of at least one target feature point that satisfies a translation relationship with the first feature point, the position coordinates of the target feature point after each translation of the first feature point can be determined based on the position coordinates of the first feature point and the target offset.

[0017] In another possible implementation, determining the position coordinates of at least one target feature point corresponding to the first feature point based on the position coordinates of the first feature point among multiple feature points to be inspected includes: traversing multiple feature points to be inspected and determining the position coordinates of the target feature point based on the difference between the position coordinates of the first feature point and the target offset, and / or determining the position coordinates of the target feature point based on the sum of the position coordinates of the first feature point and the target offset.

[0018] Based on this scheme, when determining the position coordinates of at least one target feature point that satisfies the translation relationship with the first feature point, each feature point to be inspected can be traversed sequentially, and the target feature point corresponding to each feature point to be inspected can be determined based on the sum of the position coordinates of each feature point to be inspected and the position coordinates of the target offset, and / or the difference between the position coordinates of each feature point to be inspected and the position coordinates of the target offset.

[0019] In another possible implementation, the panelization method includes a translational panelization method. Based on the position coordinates of multiple feature points and panelization information, the position coordinates of at least one target feature point corresponding to the first feature point among the multiple feature points are determined. This includes: based on the position coordinates of multiple feature points and the translational panelization method, multiple feature points to be inspected on multiple PCBs having the same vertical or horizontal coordinate; based on the position coordinates of the multiple feature points to be inspected, the actual offset between corresponding feature points on any two adjacent PCBs is determined; if the actual offset between corresponding feature points on any two adjacent PCBs is not completely the same, then based on the position coordinates of the multiple feature points and panelization information, the position coordinates of at least one target feature point corresponding to the first feature point among the multiple feature points are determined.

[0020] Based on this scheme, when the panelization method is translational panelization, the actual offset between corresponding positions of the feature points to be inspected on any two adjacent PCBs can be determined first, and it can be determined whether the actual offsets are equal. If the actual offsets between corresponding positions of the feature points to be inspected on any two adjacent PCBs are not completely the same, the position coordinates of at least one target feature point corresponding to the first feature point among the multiple feature points can be determined based on the position coordinates of multiple feature points and the panelization information.

[0021] In another possible implementation, the inspection result of the PCB panel is determined based on the position coordinates of a second feature point on at least one second PCB and the position coordinates of at least one target feature point. This includes: if there is no second feature point on at least one second PCB with the same position coordinates as the target feature point, the inspection result of the PCB panel is determined to be that the first feature point has failed the inspection; if there is a second feature point on at least one second PCB with position coordinates equal to the position coordinates of the target feature point, the inspection result of the PCB panel is determined to be that both the first and second feature points have passed the inspection.

[0022] Based on this scheme, after determining the position coordinates of at least one target feature point corresponding to the first feature point on the first PCB board, if there is no second feature point with the same position coordinates as the at least one target feature point on at least one second PCB board other than the first PCB board, it can be determined that the first feature point has failed the inspection; if there is a second feature point with the same position coordinates as the at least one target feature point on at least one second PCB board, it indicates that the first feature point and the second feature point satisfy a symmetrical relationship or a translational relationship, and it can be determined that the first feature point and the second feature point have passed the inspection.

[0023] Secondly, embodiments of this application also provide a PCB panel inspection device, the device comprising: an acquisition module configured to acquire the position coordinates of multiple feature points on multiple PCBs included in the PCB panel and panel information of the PCB panel; wherein the panel information includes a panel arrangement; a first determination module configured to determine the position coordinates of at least one target feature point corresponding to a first feature point among the multiple feature points based on the position coordinates of the multiple feature points and the panel information; wherein the first feature point is any feature point on a first PCB, and the first PCB is any PCB among the multiple PCBs; and a second determination module configured to determine the inspection result of the PCB panel based on the position coordinates of a second feature point on at least one second PCB and the position coordinates of at least one target feature point; wherein the at least one second PCB is a PCB other than the first PCB among the multiple PCBs, and the inspection result of the PCB panel is used to indicate whether a target feature point exists on the second PCB.

[0024] In one possible implementation, the panelization method includes a centrally symmetric panelization method. The first determining module is specifically configured to: determine the central symmetry point of the PCB panelization based on the position coordinates of multiple feature points and the centrally symmetric panelization method; and determine the position coordinates of at least one target feature point that satisfies a central symmetry relationship with the first feature point based on the position coordinates of the first feature point and the central symmetry point.

[0025] In another possible implementation, the panelization method includes a mirror symmetry panelization method. The first determining module is specifically configured to: determine the mirror symmetry axis of the PCB panelization based on the position coordinates of multiple feature points and the mirror symmetry panelization method; and determine the position coordinates of at least one target feature point that satisfies a mirror symmetry relationship with the first feature point based on the position coordinates of the first feature point and the mirror symmetry axis.

[0026] In another possible implementation, the panelization method includes a translational panelization method, and the panelization information also includes the number of multiple PCB boards; the first determining module is specifically configured to: obtain multiple feature points to be inspected on multiple PCB boards that have the same vertical or horizontal coordinate based on the position coordinates of multiple feature points and the translational panelization method; determine the target offset based on the position coordinates of the multiple feature points to be inspected, the number of multiple feature points to be inspected, and the number of multiple PCB boards; and determine the position coordinates of at least one target feature point corresponding to the first feature point based on the position coordinates of the first feature point among the multiple feature points to be inspected and the target offset; wherein, the first feature point is any one of the multiple feature points to be inspected.

[0027] In another possible implementation, the first determining module is further configured to: determine the number of translations based on the number of multiple feature points to be inspected and the number of multiple PCB boards; determine the translation distance based on the position coordinates of the multiple feature points to be inspected; and determine the target offset based on the translation distance and the number of translations.

[0028] In another possible implementation, the first determining module is specifically configured to: determine the position coordinates of at least one target feature point corresponding to the first feature point based on the position coordinates of the first feature point, the number of translations, and the target offset; wherein, the at least one target feature point is the target feature point corresponding to each translation, and the number of at least one target feature point is equal to the number of translations.

[0029] In another possible implementation, the first determining module is specifically configured to: traverse multiple feature points to be inspected, and determine the position coordinates of the target feature point based on the difference between the position coordinates of the first feature point and the target offset, and / or determine the position coordinates of the target feature point based on the sum of the position coordinates of the first feature point and the target offset.

[0030] In another possible implementation, the panelization method includes a translational panelization method. The first determining module is specifically configured to: obtain multiple feature points to be inspected on multiple PCBs with the same vertical or horizontal coordinates based on the position coordinates of multiple feature points and the translational panelization method; determine the actual offset between corresponding feature points on any two adjacent PCBs based on the position coordinates of the multiple feature points to be inspected; if the actual offset between corresponding feature points on any two adjacent PCBs is not completely the same, then determine the position coordinates of at least one target feature point corresponding to the first feature point among the multiple feature points based on the position coordinates of the multiple feature points and the panelization information.

[0031] In another possible implementation, the second determining module is specifically configured as follows: if there is no second feature point on at least one second PCB board with the same position coordinates as the target feature point, then the inspection result of the PCB panel is determined to be that the first feature point has failed the inspection; if there is a second feature point on at least one second PCB board with position coordinates equal to the target feature point, then the inspection result of the PCB panel is determined to be that the first feature point and the second feature point have passed the inspection.

[0032] Thirdly, embodiments of this application also provide a computing device, including: a processor and a memory; the processor and the memory are coupled; the memory is used to store program instructions; the processor is used to execute the program instructions to perform the method as described in any of the first aspects above.

[0033] Fourthly, embodiments of this application provide a chip for performing the methods described in any of the first aspects above.

[0034] Fifthly, embodiments of this application provide a computer-readable storage medium storing computer-executable instructions, which, when executed by a computer, implement the method as described in any of the first aspects.

[0035] In a sixth aspect, embodiments of this application provide a program product including a computer program that, when executed by a processor, implements the method as described in any of the first aspects. Attached Figure Description

[0036] Figure 1 A flowchart illustrating a method for inspecting a PCB panel, as provided in an embodiment of this application;

[0037] Figure 2 A schematic diagram of a PCB panel provided in an embodiment of this application;

[0038] Figure 3A A schematic diagram illustrating a centrally symmetrical panel arrangement provided in an embodiment of this application;

[0039] Figure 3B A schematic diagram illustrating a mirror-symmetric panel arrangement provided in an embodiment of this application;

[0040] Figure 3C A schematic diagram illustrating a translational panel assembly method provided in an embodiment of this application;

[0041] Figure 3D A schematic diagram illustrating a modular assembly method provided in an embodiment of this application;

[0042] Figure 4 A flowchart for determining the position coordinates of at least one target feature point is provided in an embodiment of this application;

[0043] Figure 5 A schematic diagram illustrating another centrally symmetrical panel arrangement provided in an embodiment of this application;

[0044] Figure 6 A flowchart illustrating another method for determining the position coordinates of at least one target feature point, as provided in this application embodiment;

[0045] Figure 7 A schematic diagram illustrating another mirror-symmetric panel arrangement provided in an embodiment of this application;

[0046] Figure 8 A flowchart illustrating another method for determining the position coordinates of at least one target feature point, as provided in this application embodiment;

[0047] Figure 9 A schematic diagram of another translational panel provided in an embodiment of this application;

[0048] Figure 10 A flowchart for determining a target offset is provided in an embodiment of this application;

[0049] Figure 11 A schematic diagram of another translational panel provided in an embodiment of this application;

[0050] Figure 12 A flowchart illustrating another method for determining the position coordinates of at least one target feature point, as provided in this application embodiment;

[0051] Figure 13 A flowchart for determining the inspection results of a PCB panel, provided as an embodiment of this application;

[0052] Figure 14 This is a schematic diagram of the interface of a PCB panel inspection system provided in an embodiment of this application;

[0053] Figure 15 A flowchart illustrating another method for inspecting PCB panels provided in this application embodiment;

[0054] Figure 16 A schematic diagram of a PCB panel inspection device provided in an embodiment of this application;

[0055] Figure 17 This is a schematic diagram of a computing device provided in an embodiment of this application. Detailed Implementation

[0056] The technical solutions of the embodiments of this application will now be described with reference to the accompanying drawings. To facilitate a clear description of the technical solutions of the embodiments of this application, the use of terms such as "first," "second," etc., in the embodiments of this application is for illustrative purposes and to distinguish the objects being described. There is no particular order between them, nor does it indicate a specific limitation on the number of devices in the embodiments of this application, and they do not constitute any limitation on the embodiments of this application.

[0057] This application provides a method and computing device for inspecting PCB panels. It can inspect PCB panels based on the position coordinates of multiple feature points on multiple PCB single boards and the panelization method of the PCB panels to determine whether there are errors in the position of each feature point on the PCB panels, thereby improving the efficiency and accuracy of inspecting the feature points of PCB panels.

[0058] The PCB panel inspection method provided in this application embodiment can be applied to computing devices, which can be servers or terminal devices. In practical applications, a PCB panel inspection system can be deployed on the computing device, allowing users to inspect the PCB panel to determine if there are any errors in the positions of various feature points on the PCB panel; furthermore, the inspection results can be displayed through the user interface of the PCB panel inspection system for user convenience.

[0059] Figure 1 This is a flowchart illustrating a method for inspecting a PCB panel, as provided in an embodiment of this application. Figure 1 As shown, the method includes steps 110 to 130.

[0060] Step 110: Obtain the position coordinates of multiple feature points on multiple PCBs included in the PCB panel and the panel information of the PCB panel.

[0061] A PCB panel may include multiple PCB boards, and this application embodiment does not limit the number of PCB boards included in the PCB panel. In some embodiments, the engineering file of the PCB panel to be inspected can be obtained first. The engineering file typically includes identification information and feature point information corresponding to multiple feature points, as well as identification information and component information corresponding to other components besides the feature points. The multiple identification information in the engineering file can be traversed by the preset library functions in the PCB panel inspection system, and the identification information corresponding to the feature points can be filtered out from the multiple identification information, thereby obtaining the feature point information corresponding to the feature points in the engineering file based on the identification information corresponding to the feature points.

[0062] For example, feature points on a PCB may include reference points, solid connection points, and the center point of components. Reference points are used to position the PCB on the processing equipment during manufacturing, while solid connection points are used to connect the PCB to the frame of a PCB panel or other PCBs. (Reference) Figure 2 The diagram shown is a schematic of a PCB panel, as follows: Figure 2 As shown, the PCB panel includes two PCB boards, namely the first PCB board and the second PCB board. Feature points A and B on the first PCB board and feature points A' and B' on the second PCB board are connected to the panel frame of the PCB panel. Feature point C on the first PCB board is connected to the second PCB board, and feature point C' on the second PCB board is connected to the first PCB board. That is, feature points A, A', B, B', C, and C' are real connection points. Feature points D and E on the first PCB board and feature points D' and E' on the second PCB board are reference points.

[0063] For example, the feature point information corresponding to a feature point may include information such as the initial position coordinates of the feature point, where the initial position coordinates of the feature point may be the position coordinates of a reference point, a real connection point, or the center point of a device. The feature point information may also include information such as pins and device dimensions. Since each device has corresponding pins, after obtaining multiple pins corresponding to multiple devices, deduplication can be performed on the multiple pins, that is, deduplication can be performed on multiple devices to remove duplicate devices.

[0064] In some embodiments, the panelization information of the PCB panel includes the panelization method of the PCB panel. The panelization method may include a symmetrical panelization method and a panning copy panelization method. The symmetrical panelization method may include a central symmetry panelization method and a mirror symmetry panelization method. This embodiment does not limit the specific form of the panelization method.

[0065] For example, the PCB panel layout can be a single layout method or a combination of multiple layout methods. For instance, the PCB panel layout method can be any one of a mirror symmetry layout method, a central symmetry layout method, or a translational layout method, or a combination of at least two of the above three layout methods.

[0066] refer to Figure 3A This is a schematic diagram of a centrally symmetrical panel arrangement. (As shown...) Figure 3A As shown, the first PCB board can be rotated 180° around the central symmetry point O to obtain the second PCB board. That is, the first PCB board and the second PCB board satisfy the central symmetry relationship, and this PCB panel is a central symmetric panel.

[0067] refer to Figure 3B This diagram illustrates a mirror-symmetric panel arrangement. (As shown...) Figure 3B As shown, the first PCB board and the second PCB board are symmetrical about the line m, that is, the first PCB board and the second PCB board satisfy a mirror symmetry relationship (or an axisymmetric relationship). This PCB panel is a mirror symmetric panel (or an axisymmetric panel).

[0068] refer to Figure 3C This is a schematic diagram of a sliding panel assembly method. (As shown) Figure 3C As shown, the second PCB board can be obtained by translating the first PCB panel. That is, the first PCB board and the second PCB board satisfy the translation relationship, and the PCB panel is a translation panel.

[0069] refer to Figure 3D This is a schematic diagram of a modular assembly method. (As shown) Figure 3D As shown, the first PCB board A and the second PCB board B are centrally symmetrical, and the first PCB board A' and the second PCB board B' are centrally symmetrical; and the first PCB board A and the first PCB board A' are translated, and the first PCB board B and the first PCB board B' are translated. That is, the PCB panel is a combination of a centrally symmetrical panel and a translated panel.

[0070] For example, the PCB panel layout can be determined based on information input by the user. That is, the user can determine the PCB panel layout based on the PCB panel's engineering file and then input the PCB panel layout into the PCB panel inspection system.

[0071] Step 120: Based on the position coordinates of multiple feature points and the panel information, determine the position coordinates of at least one target feature point corresponding to the first feature point among the multiple feature points.

[0072] In some embodiments, after obtaining the position coordinates and panelization information of multiple feature points on multiple PCB boards, a target inspection algorithm can be determined based on the panelization method of the PCB boards, and then a corresponding coordinate model (hereinafter referred to as the target coordinate system) can be established based on the target inspection algorithm. After determining the target coordinate system, multiple feature points can be inspected based on the target inspection algorithm to determine whether there are errors in the position of the feature points, such as whether the feature points conform to symmetry or translation relationships.

[0073] For example, the target inspection algorithm may include a centrally symmetric inspection algorithm, a mirror symmetric inspection algorithm, and a translational copy inspection algorithm. For instance, when the puzzle is played using a centrally symmetric method, a centrally symmetric inspection algorithm can be used; when the puzzle is played using a mirror symmetric method, a mirror symmetric inspection algorithm can be used; and when the puzzle is played using a translational copy inspection algorithm, a translational copy inspection algorithm can be used.

[0074] For example, during the inspection of multiple feature points, the position coordinates of at least one target feature point corresponding to the first feature point on the first PCB can be determined based on the aforementioned target inspection algorithm. Here, the PCB panel includes multiple PCBs, the first PCB is any one of the multiple PCBs, and the first feature point is any feature point on the first PCB; the target feature point and the first feature point satisfy a symmetrical relationship or translational relationship corresponding to the panel arrangement.

[0075] For example, when inspecting PCB panels, any feature point (i.e., the first feature point) on any PCB panel can be used as a reference feature point. Based on the target inspection algorithm corresponding to the panel arrangement of the PCB panel, at least one target feature point that satisfies the symmetry or translation relationship with the reference feature point corresponding to the panel arrangement can be determined.

[0076] For example, the PCB panel inspection system can respond to the panelization method input by the user, determine the corresponding target inspection algorithm, and inspect the feature points on the PCB panel based on the target inspection algorithm. Alternatively, the user can select the corresponding target inspection algorithm in the PCB panel inspection system after determining the panelization method, so that the PCB panel inspection system responds to the target inspection algorithm input by the user and inspects the feature points on the PCB panel based on the target inspection algorithm.

[0077] Step 130: Determine the inspection result of the PCB panel based on the position coordinates of the second feature point on at least one second PCB panel and the position coordinates of at least one target feature point.

[0078] In some embodiments, after determining the position coordinates of the at least one target feature point, the presence of a feature point with the same position coordinates as the at least one target feature point on the at least one second PCB board can be determined based on the position coordinates of the second feature point on the at least one second PCB board and the position coordinates of the at least one target feature point, thereby determining the inspection result of the PCB panel. For example, if there is no second feature point with the same position coordinates as the at least one target feature point on at least one second PCB board other than the first PCB board, it can be determined that the first feature point has failed the inspection; if there is a second feature point with the same position coordinates as the at least one target feature point on at least one second PCB board, it can be determined that both the first and second feature points have passed the inspection. Here, at least one second PCB board refers to a PCB board other than the first PCB board among a plurality of PCB boards.

[0079] The PCB panel inspection method provided in this application can automatically inspect the feature points on the PCB panel and determine the inspection results based on the panelization method and the position coordinates of multiple feature points on multiple PCBs in the PCB panel. No manual intervention is required in this process, thereby improving the inspection efficiency and accuracy of the PCB panel.

[0080] Figure 4 This is a flowchart illustrating how to determine the position coordinates of at least one target feature point, as provided in an embodiment of this application. Figure 4 As shown, when the panel arrangement is a centrally symmetrical arrangement, step 120 includes steps 410 to 420.

[0081] Step 410: Determine the center symmetry point of the PCB panel based on the position coordinates of multiple feature points and the center symmetry panelization method.

[0082] In some embodiments, when the panelization method is a centrally symmetric panelization method, the central symmetry point of the PCB panel and the position coordinates of the central symmetry point can be determined based on the central symmetry checking algorithm, and the central symmetry point can be determined as the origin of the target coordinate system, thereby establishing the target coordinate system based on the origin.

[0083] For example, the midpoint coordinates corresponding to each feature point on the first PCB board and all feature points on the second PCB board can be calculated using the position coordinates of multiple feature points. The midpoint coordinate with the highest frequency among these midpoint coordinates is then determined as the position coordinate of the central symmetry point. Alternatively, cluster analysis can be performed on the multiple midpoint coordinates, and the densest cluster can be selected from the cluster analysis results. The average value of the midpoint coordinates in this cluster is then determined as the position coordinate of the central symmetry point of the PCB panel. Alternatively, the feature points on the PCB panel can also include points on the edges of the PCB boards. The geometric center point of each PCB board can be determined based on the position coordinates of the feature points on the edges of multiple PCB boards, and the central symmetry point of the PCB panel can be determined based on the geometric center points of each PCB board. It should be noted that the embodiments of this application do not limit the method for determining the central symmetry point of the PCB panel; the above is merely an illustrative example.

[0084] Step 420: Based on the position coordinates of the first feature point and the central symmetry point, determine the position coordinates of at least one target feature point that satisfies the central symmetry relationship with the first feature point.

[0085] In some embodiments, when the PCB panel is centrally symmetrically panelized, a central symmetry check algorithm can be used to check whether the feature points on each PCB panel conform to the central symmetry relationship.

[0086] For example, the position coordinates of at least one target feature point that satisfies a central symmetry relationship with the first feature point can be determined first, based on the position coordinates of the first feature point on the first PCB and the target coordinate system. For instance, the position coordinates (x', y') of at least one target feature point that satisfies a central symmetry relationship with the first feature point can be determined according to formula (1):

[0087]

[0088] Where (x0, y0) are the position coordinates of the origin O of the target coordinate system, and (x, y) are the position coordinates of the first feature point. Formula (1) indicates that the distance x0-x′ between the abscissa x' of the target feature point and the y-axis is equal to the abscissa x' of the first feature point A. A The distance between the y-axis and the x0-x A And x' and x AThey are opposites; and the distance y0-y′ between the ordinate y' of the target feature point and the x-axis is equal to the ordinate y of the first feature point A. A The distance y0-y between the x-axis and the x-axis A , and y' and y A They are opposites.

[0089] refer to Figure 5 A schematic diagram of another centrally symmetrical panel arrangement is shown. (See diagram below.) Figure 5 As shown, the first feature point on the first PCB board is taken as feature point A, and the position coordinates of the first feature point A are (x, y, y). A y A For example, since the PCB panel is centrally symmetrical, the first feature point A(x) can be determined based on the above formula (1). A y A The position coordinates (x', y') of the target feature point that satisfies the central symmetry relationship.

[0090] For example, the position coordinates (x', y') of at least one target feature point that satisfies a central symmetry relationship with the first feature point can also be determined according to formula (2):

[0091]

[0092] Where ρ is the distance between the first feature point and the origin O (i.e., the polar radius), and θ is the angle between the line connecting the origin O and the first feature point and the x-axis of the target coordinate system (i.e., the polar angle). Formula (2) indicates that the distance between the target feature point and the origin O is equal to the distance between the first feature point and the origin O, both being ρ; and the polar angle of the target feature point is π+θ. Figure 5 As shown, the position coordinates (x, y) of the first feature point A can be determined based on the above formula (2). A y A The coordinates are converted to polar coordinates (ρ, θ), and the position coordinates (x', y') of the target feature point are determined based on the polar coordinates (ρ, θ) of the first feature point A.

[0093] With the above scheme, when the panelization method is a centrally symmetrical panelization method, the central symmetry point of the PCB panel can be determined, and the position coordinates of at least one target feature point that satisfies the central symmetry relationship with the first feature point can be determined based on the position coordinates of the first feature point and the central symmetry point, thereby enabling the inspection of the central symmetry relationship between each feature point on the PCB panel.

[0094] Figure 6 A flowchart illustrating another method for determining the position coordinates of at least one target feature point, provided as an embodiment of this application. Figure 6As shown, when the panel arrangement is a mirror symmetrical arrangement, step 120 above includes steps 610 to 620.

[0095] Step 610: Determine the mirror symmetry axis of the PCB panel based on the position coordinates of multiple feature points and the mirror symmetry panelization method.

[0096] In some embodiments, when the panelization method is a mirror symmetry panelization method, the mirror symmetry axis of the PCB panel can be determined based on the mirror symmetry inspection algorithm, and the coordinate axes (such as the x-axis and y-axis) of the target coordinate system can be determined based on the mirror symmetry axis, thereby establishing the target coordinate system based on the coordinate axes.

[0097] For example, taking horizontal mirror symmetry as an example, candidate mirror symmetry axes corresponding to each feature point on the first PCB board and all feature points on the second PCB board can be calculated based on the position coordinates of multiple feature points. The candidate mirror symmetry axis with the most identical values ​​among the multiple candidate mirror symmetry axes is determined as the mirror symmetry axis of the PCB panel. Alternatively, the feature points on the PCB panel can also include points on the edges of the PCB boards. The geometric center point of each PCB board can be determined based on the position coordinates of the feature points on the edges of multiple PCB boards, and the mirror symmetry axis of the PCB panel can be determined based on the line connecting the geometric center points of each PCB board and the straight line perpendicular to the line connecting them. It should be noted that the above method for determining the mirror symmetry axis of the PCB panel is only an example, and this embodiment does not limit it.

[0098] Step 620: Based on the position coordinates of the first feature point and the mirror symmetry axis, determine the position coordinates of at least one target feature point that satisfies the mirror symmetry relationship with the first feature point.

[0099] In some embodiments, when the PCB panel is mirror-symmetric, a mirror-symmetry checking algorithm can be used to check whether the feature points on each PCB panel conform to the mirror-symmetry relationship.

[0100] For example, the position coordinates of at least one target feature point that satisfies a mirror symmetry relationship with the first feature point can be determined first based on the position coordinates of the first feature point on the first PCB board and the target coordinate system. For example, when the mirror symmetry axis is the y-axis, the position coordinates (x', y') of the target feature point can be determined according to formula (3):

[0101]

[0102] Where x0 is the abscissa of the origin O of the target coordinate system, and (x, y) is the coordinate of the first feature point. Formula (3) indicates that the distance x0-x′ between the abscissa x' of the target feature point and the y-axis is equal to the abscissa x' of the first feature point A. AThe distance between the y-axis and the x0-x A And x' and x A They are opposites; and the ordinate y' of the target feature point is the same as the ordinate y' of the first feature point A. A equal.

[0103] refer to Figure 7 This is a schematic diagram of another mirror-symmetric panel arrangement. (See diagram below.) Figure 7 As shown, the first feature point on the first PCB board is taken as feature point A, and the position coordinates of the first feature point A are (x, y, y). A y A For example, since the PCB panel is a mirror-symmetric panel and the mirror symmetry axis is the y-axis, the position coordinates (x', y') of the target feature point that satisfies the mirror symmetry relationship with the first feature point A about the y-axis can be determined based on the above formula (3).

[0104] For example, when the axis of mirror symmetry is the y-axis, the position coordinates (x', y') of the target feature point can also be determined according to formula (4):

[0105]

[0106] Where ρ is the distance between the first feature point A and the origin O, and θ is the angle between OA (i.e., the line connecting the origin O and the first feature point A) and the x-axis of the target coordinate system. Formula (4) indicates that the distance between the target feature point and the origin O is equal to the distance between the first feature point A and the origin O, both being ρ; and the polar angle of the target feature point is π-θ.

[0107] For example, when the axis of mirror symmetry is the x-axis, the position coordinates (x', y') of the target feature point can be determined according to formula (5):

[0108]

[0109] When the axis of mirror symmetry is the x-axis, the position coordinates (x', y') of the target feature point can also be determined according to formula (6):

[0110]

[0111] The method for determining the position coordinates of the target feature point when the mirror symmetry axis is the x-axis is based on the same principle as the method for determining the position coordinates of the target feature point when the mirror symmetry axis is the y-axis, and will not be elaborated here.

[0112] With the above scheme, when the panelization method is a mirror symmetry panelization method, the mirror symmetry axis of the PCB panel can be determined, and the position coordinates of at least one target feature point that satisfies the mirror symmetry relationship with the first feature point can be determined based on the position coordinates of the first feature point and the mirror symmetry axis, thereby enabling the inspection of the mirror symmetry relationship between each feature point on the PCB panel.

[0113] In some embodiments, when the panelization method is a translational panelization method, the position coordinates of the origin of the target coordinate system can be arbitrarily selected, and the target coordinate system can be established based on the origin. For example, the point with position coordinates (0, 0) in the PCB panel can be used as the origin of the target coordinate system, but this embodiment does not limit this.

[0114] Figure 8 A flowchart illustrating another method for determining the position coordinates of at least one target feature point, as provided in an embodiment of this application. Figure 8 As shown, when the panel assembly method is a translational panel assembly method, the above step 120 includes steps 810 to 830.

[0115] Step 810: Based on the position coordinates and translation panelization of multiple feature points, obtain multiple feature points to be inspected on multiple PCB boards that have the same vertical or horizontal coordinate.

[0116] In some embodiments, when the PCB panel is assembled using a translational panelization method, a translational replication symmetry check algorithm can be used to check whether the feature points on each PCB conform to a translational relationship. Specifically, the translational relationship between feature points on each PCB can be defined as follows: the translational distance (hereinafter referred to as offset) between corresponding feature points on adjacent PCBs is equal.

[0117] For example, in the process of checking whether the feature points on each PCB board conform to the translation relationship, multiple feature points to be checked on multiple PCB boards with the same vertical or horizontal coordinate can be obtained based on the position coordinates of multiple feature points. For example, when the PCB panel is arranged in a horizontal translation panel, multiple feature points to be checked on multiple PCB boards with the same vertical coordinate can be obtained; when the PCB boards are arranged in a vertical translation panel, multiple feature points to be checked on multiple PCB boards with the same horizontal coordinate can be obtained.

[0118] refer to Figure 9 A schematic diagram of another type of sliding panel is shown. (As shown) Figure 9As shown, taking a horizontal translation panelization method as an example, the PCB panel includes four PCB boards: PCB board 1, PCB board 2, PCB board 3, and PCB board 4. Multiple feature points with the same vertical coordinate on PCB boards 1, 2, 3, and 4 can be identified for inspection. For example, feature points A1, D1, A2, D2, A3, D3, A4, and D4 can be identified as a group of feature points to be inspected; feature points B1, B2, B3, and B4 can be identified as another group; and feature points C1, C2, C3, and C4 can be identified as yet another group.

[0119] Step 820: Determine the target offset based on the position coordinates of multiple feature points to be inspected, the number of multiple feature points to be inspected, and the number of multiple PCB boards.

[0120] In some embodiments, after acquiring multiple feature points to be inspected, the target offset can be determined based on the position coordinates of the multiple feature points to be inspected, the number of the multiple feature points to be inspected, and the number of the multiple PCB boards. The panel information also includes the number of the multiple PCB boards; the target offset is the correct offset between the corresponding feature points to be inspected on each adjacent PCB board.

[0121] Step 830: Based on the position coordinates of the first feature point among multiple feature points to be inspected and the target offset, determine the position coordinates of at least one target feature point corresponding to the first feature point.

[0122] In some embodiments, after determining the target offset, the position coordinates of at least one target feature point corresponding to the first feature point can be determined based on the position coordinates of any one of the multiple feature points to be inspected (i.e., the first feature point) and the target offset. The target feature point and the first feature point satisfy a translation relationship, meaning the offset between the position coordinates of the target feature point and the position coordinates of the first feature point is N times the target offset, such as 1 time (i.e., the offset between the position coordinates of the target feature point and the position coordinates of the first feature point equals the target offset), 2 times, 3 times, etc.

[0123] With the above scheme, when the panelization method is translational panelization, the target offset between each feature point to be inspected can be determined based on multiple feature points with the same vertical or horizontal coordinate on multiple PCBs, as well as the number of feature points to be inspected and the number of PCBs. Based on the position coordinates of the first feature point among the feature points to be inspected and the target offset, the position coordinates of at least one target feature point that satisfies the translational relationship with the first feature point can be determined, thereby enabling the inspection of the translational relationship between each feature point on the PCB panel.

[0124] Figure 10 This is a flowchart illustrating how to determine a target offset, as provided in an embodiment of this application. Figure 10 As shown, step 820 above includes steps 1010 to 1030.

[0125] Step 1010: Determine the number of translation steps based on the number of multiple feature points to be inspected and the number of multiple PCB boards.

[0126] In some embodiments, when the PCB panel is assembled using a translational panel method, the PCB panel is obtained by translating a single PCB board N times. Therefore, the number of translations of the single PCB board can be determined first, and the total translation distance (hereinafter referred to as translation distance) can be determined based on the position coordinates of multiple feature points to be inspected, thereby determining the target offset based on the translation distance and the number of translations.

[0127] For example, there may be multiple quantitative relationships between the obtained feature points to be inspected and the PCB board. Therefore, the number of translations of the PCB board can be determined based on the number of multiple feature points to be inspected and the number of multiple PCB boards.

[0128] For example, if the number of feature points to be inspected equals the number of PCB boards, the number of translations is the number of feature points minus 1, which is the number of PCB boards minus 1. Figure 9 As shown, there are 4 feature points C1, C2, C3 and C4 to be inspected, and there are 4 PCB boards. That is, the number of feature points to be inspected is equal to the number of PCB boards. Therefore, the number of translations is the number of feature points minus 1 or the number of PCB boards minus 1, which means the number of translations is 3.

[0129] For example, when the number of feature points to be inspected is N times the number of PCB boards (N is a positive integer and N is greater than 1), the number of translations is the number of PCB boards minus 1. Figure 9As shown, there are 8 feature points to be inspected: A1, D1, A2, D2, A3, D3, A4, and D4. There are 4 PCB boards, meaning the number of feature points to be inspected is twice the number of PCB boards. Therefore, the translation count is 3 times.

[0130] For example, if the number of feature points to be inspected is one more than the number of PCB boards, the number of translation steps is the number of feature points minus one, which equals the number of PCB boards. Figure 9 As shown, there are 5 feature points B1, B2, B3, B4 and B5 to be inspected, and 4 PCB boards. That is, the number of feature points to be inspected is 1 more than the number of PCB boards. Therefore, the number of translations is the number of feature points minus 1 or equal to the number of PCB boards, which is 4 translations.

[0131] For example, if the number of feature points to be inspected is one less than the number of PCB boards, the number of translation steps is the number of feature points - 1, which is equivalent to the number of PCB boards - 2. (Reference) Figure 11 The diagram shows another type of translation panel. There are 3 feature points B2, B3 and B4 to be inspected, and 4 PCB boards. That is, the number of feature points to be inspected is 1 less than the number of PCB boards. Therefore, the number of translations is the number of feature points - 1 or the number of PCB boards - 2, which means the number of translations is 2.

[0132] Step 1020: Determine the translation distance based on the position coordinates of multiple feature points to be inspected.

[0133] For example, after determining the number of translations, the translation distance can be determined based on the position coordinates of the feature point to be inspected with the smallest x-coordinate or y-coordinate value, and the position coordinates of the feature point to be inspected with the largest x-coordinate or y-coordinate value.

[0134] For example, taking the horizontal translation panel method as an example, when the number of feature points to be inspected is equal to the number of PCB boards, or the number of feature points to be inspected is one more than the number of PCB boards, or the number of feature points to be inspected is one less than the number of PCB boards, the translation distance can be determined based on the difference between the position coordinates of the feature point to be inspected with the smallest horizontal coordinate value and the position coordinates of the feature point to be inspected with the largest horizontal coordinate value.

[0135] like Figure 9As shown, taking feature points B1, B2, B3, B4, and B5 to be inspected as examples, the translation distance between feature points B1 and B5 can be determined based on the difference between the position coordinates of feature point B5 and the position coordinates of feature point B1.

[0136] For example, when the number of feature points to be inspected is N times the number of PCB boards (N is a positive integer and N is greater than 1), the position coordinates of multiple feature points to be inspected can be sorted from smallest to largest, and the translation distance can be determined based on the difference between the position coordinates of the Nth feature point to be inspected and the position coordinates of the last feature point to be inspected (i.e., the position coordinates of the feature point to be inspected with the largest x-coordinate value). Alternatively, the translation distance can be determined based on the difference between the position coordinates of the Nth feature point to be inspected from the end of the sorted sequence and the position coordinates of the first feature point to be inspected (i.e., the position coordinates of the feature point to be inspected with the smallest x-coordinate value).

[0137] like Figure 9 As shown, taking feature points A1, D1, A2, D2, A3, D3, A4, and D4 to be inspected as examples, the number of feature points to be inspected is twice the number of PCB boards, i.e., N = 2. After sorting the position coordinates of the aforementioned feature points to be inspected from smallest to largest, we can determine that the second feature point to be inspected is feature point D1, and the last feature point to be inspected is feature point D4. Then, based on the difference between the position coordinates of feature point D1 and feature point D4, we can determine the translation distance between feature points D1, D2, D3, and D4. Furthermore, we can determine that the second-to-last feature point to be inspected is feature point A4, and the first feature point to be inspected is feature point A1. Then, based on the difference between the position coordinates of feature point A4 and feature point A1, we can determine the translation distance between feature points A1, A2, A3, and A4.

[0138] Step 1030: Determine the target offset based on the translation distance and the number of translations.

[0139] For example, after determining the translation distance and the number of translations, the translation distance (including the lateral translation distance L) can be used as a basis for further analysis. x and longitudinal translation distance L y The target offset ΔL is determined by the number of translations n. x or ΔL y Wherein, target offset = translation distance / number of translations.

[0140] For example, such as Figure 9 As shown, the translation distance between feature points A1, A2, A3, and A4 to be inspected is L. x For example, since the number of translations corresponding to the above-mentioned feature point to be inspected is 3, the target offset ΔL corresponding to the above-mentioned feature point to be inspected is... x =L x / 3.

[0141] The above scheme can determine the number of translations based on the number of feature points to be inspected and the number of PCB boards, and determine the translation distance based on the position coordinates of the feature points to be inspected. Thus, the target offset between each feature point to be inspected can be determined based on the translation distance and the number of translations, so as to check the translation relationship between each feature point on the PCB panel based on the target offset.

[0142] In some embodiments, step 830 includes: determining the position coordinates of at least one target feature point corresponding to the first feature point based on the position coordinates of the first feature point, the number of translations, and the target offset.

[0143] In some embodiments, the position coordinates of the target feature point corresponding to the first feature point at each translation can be determined based on the position coordinates of the first feature point, the number of translations, and the target offset. That is, at least one target feature point is the target feature point corresponding to each translation, and the number of at least one target feature point is equal to the number of translations.

[0144] For example, in the case of a horizontal translation panel method, the position coordinates of at least one target feature point corresponding to the first feature point can be determined according to formula (7):

[0145]

[0146] Where, ΔL x Let n be the target offset, n be the number of translations, and (x, y) be the position coordinates of the first feature point. n y n ) represents the position coordinates of the target feature points corresponding to each translation.

[0147] like Figure 9 As shown, the first feature point is taken as the feature point to be inspected, B1, and the position coordinates of the first feature point B1 are (x... B y B Taking feature point B1, B2, B3, B4, and B5 as an example, the number of translations corresponding to these feature points is 4. Therefore, based on the position coordinates (x, y) of the first feature point B1... B y BGiven the target offset ΔLx, the position coordinates of the target feature point corresponding to the first translation can be determined as (x) B +ΔLx, y B The position coordinates of the target feature point corresponding to the second translation are (x...). B +2ΔLx, y B The position coordinates of the target feature point corresponding to the third translation are (x...). B +3ΔLx, y B The position coordinates of the target feature point corresponding to the 4th translation are (x...). B +4ΔLx, y B ).

[0148] For example, in the case of longitudinal translation paneling, the position coordinates of at least one target feature point corresponding to the first feature point can be determined according to formula (8):

[0149]

[0150] Where Ly is the target offset, n is the number of translations, and (x, y) are the position coordinates of the first feature point. n y n ) represents the position coordinates of the target feature point corresponding to each translation. The principle for determining the position coordinates of at least one target feature point corresponding to the first feature point in the longitudinal translation panel method is the same as that in the transverse translation panel method, and will not be elaborated here.

[0151] Using the above scheme, when determining the position coordinates of at least one target feature point that satisfies a translation relationship with the first feature point, the position coordinates of the target feature point after each translation of the first feature point can be determined based on the position coordinates of the first feature point and the target offset.

[0152] In some embodiments, step 830 includes: traversing multiple feature points to be inspected, and determining the position coordinates of the target feature point based on the difference between the position coordinates of the first feature point and the target offset, and / or determining the position coordinates of the target feature point based on the sum of the position coordinates of the first feature point and the target offset.

[0153] In some embodiments, after determining the target offset, in addition to determining the position coordinates of the target feature point according to the method described in the above embodiments, it is also possible to traverse multiple feature points to be inspected and determine the position coordinates of target feature points adjacent to the first feature point based on the position coordinates of the first feature point and the target offset. For example, the position coordinates of the target feature point can be determined based on the difference between the position coordinates of the first feature point and the target offset, and / or, based on the sum of the position coordinates of the first feature point and the target offset.

[0154] For example, such as Figure 9 As shown, taking feature points B1, B2, B3, B4, and B5 to be inspected as examples, the above feature points can be traversed sequentially. For example, based on the position coordinates (x, y) of the first feature point B1... B1 y B1 The sum of the x and y values ​​and the target offset ΔLx determines the position coordinates of the target feature point as (x + y). B1 +ΔLx, y B1 Then, based on the position coordinates (x, y) of the first feature point B2... B2 y B2 The difference between (x) and the target offset ΔLx determines the position coordinates of the target feature point as (x) B1 -ΔLx, y B2 ), and / or, based on the position coordinates (x, y) of the first feature point B2 B2 y B2 The sum of the x and y values ​​and the target offset ΔLx determines the position coordinates of the target feature point as (x + y). B2 +ΔLx, y B2 ...and so on, until all the above-mentioned feature points to be checked have been traversed. It is understandable that if the target feature point corresponding to the first feature point B1 is determined, then when traversing to the first feature point B2, it is not necessary to determine the target feature point again based on the difference between the position coordinates of the first feature point B2 and the target offset.

[0155] Using the above scheme, when determining the position coordinates of at least one target feature point that satisfies the translation relationship with the first feature point, each feature point to be inspected can be traversed sequentially, and the target feature point corresponding to each feature point to be inspected can be determined based on the sum of the position coordinates of each feature point to be inspected and the position coordinates of the target offset, and / or the difference between the position coordinates of each feature point to be inspected and the position coordinates of the target offset.

[0156] Figure 12 This is a flowchart illustrating another method for determining the position coordinates of at least one target feature point, as provided in an embodiment of this application. Figure 12 As shown, when the panel assembly method is a translational panel assembly method, the above step 120 includes steps 1210 to 1230.

[0157] Step 1210: Based on the position coordinates and translation panelization of multiple feature points, obtain multiple feature points to be inspected on multiple PCB boards that have the same vertical or horizontal coordinate.

[0158] In some embodiments, during the process of checking whether feature points on each PCB board conform to the translation relationship based on the translation replication symmetry checking algorithm, it can be first determined whether the actual offsets between corresponding positions of the feature points to be checked on any two adjacent PCB boards are all the same. If the actual offsets are all the same, it means that each feature point to be checked conforms to the translation relationship; if the actual offsets are not completely the same, it means that there are feature points to be checked that do not conform to the translation relationship. Then, steps 810 to 830 above can be executed to further determine the feature points to be checked that do not conform to the translation relationship.

[0159] Understandably, the implementation method of step 1210 can refer to the relevant description of step 810, and will not be repeated here.

[0160] Step 1220: Based on the position coordinates of multiple feature points to be inspected, determine the actual offset between corresponding feature points on any two adjacent PCB boards.

[0161] In some embodiments, the actual offset can be determined based on the different quantitative relationships between the feature points to be inspected and the PCB board, as well as the position coordinates of multiple feature points to be inspected.

[0162] For example, taking the horizontal translation panelization method as an example, when the number of feature points to be inspected is equal to the number of PCB boards, or the number of feature points to be inspected is one more than the number of PCB boards, or the number of feature points to be inspected is one less than the number of PCB boards, the actual offset between the feature points to be inspected on any two adjacent PCB boards can be determined based on the position coordinates of multiple feature points to be inspected.

[0163] like Figure 9 As shown, taking feature points B1, B2, B3, B4, and B5 to be inspected as examples, the actual offset between feature points B1 and B2, between feature points B3 and B4, and between feature points B4 and B5 can be determined based on the position coordinates of the aforementioned feature points.

[0164] For example, when the number of feature points to be inspected is N times the number of PCB boards (N is a positive integer and N is greater than 1), the position coordinates of multiple feature points to be inspected can be sorted, and the corresponding feature points on two adjacent PCB boards can be determined based on the sorting results, thereby determining the actual offset between these two feature points. This includes determining the actual offset between the 1st and (N+1th)th feature points to be inspected, and the actual offset between the (N+1th)th and (2N+1th)th feature points to be inspected.

[0165] like Figure 9 As shown, taking feature points A1, D1, A2, D2, A3, D3, A4, and D4 to be inspected as examples, after sorting the position coordinates of multiple feature points from smallest to largest, the actual offsets between feature points A1 and A2, A2 and A3, and A3 and A4 can be determined; and the actual offsets between feature points D1 and D2, D2 and D3, and D3 and D4 can also be determined.

[0166] Step 1230: If the actual offset between the corresponding positions of the feature points to be inspected on any two adjacent PCB boards is not exactly the same, then based on the position coordinates of multiple feature points and the panel information, determine the position coordinates of at least one target feature point corresponding to the first feature point among the multiple feature points.

[0167] In some embodiments, if the actual offset between the corresponding positions of the feature points to be inspected on any two adjacent PCB boards is not exactly the same, it indicates that there are feature points to be inspected that do not conform to the translation relationship among the multiple feature points to be inspected. Then, steps 810 to 830 above can be executed to further determine the feature points to be inspected that do not conform to the translation relationship.

[0168] Following the previous example, if the actual offset between feature point B3 and feature point B4 is different from the actual offset between the other feature points B1, B2, B3, B4 and B5, then steps 810 to 830 can be executed to further determine whether the position coordinates of feature point B3 or feature point B4 are incorrect.

[0169] In some embodiments, if the actual offset between the corresponding positions of the feature points to be inspected on any two adjacent PCB boards is the same, it means that the feature points to be inspected all conform to the translation relationship, and the inspection result of the PCB panel can be determined as the feature points to be inspected passing the inspection.

[0170] Continuing with the previous example, if the actual offsets between the feature points B1, B2, B3, B4, and B5 to be inspected are all the same, then it can be determined that the inspection result of the PCB panel is that all feature points B1, B2, B3, B4, and B5 have passed the inspection.

[0171] Using the above method, when the panelization method is translational panelization, the actual offset between corresponding positions of the feature points to be inspected on any two adjacent PCBs can be determined first, and it can be determined whether the actual offsets are equal. If the actual offsets between corresponding positions of the feature points to be inspected on any two adjacent PCBs are not completely the same, the position coordinates of at least one target feature point corresponding to the first feature point among the multiple feature points can be determined based on the position coordinates of multiple feature points and the panelization information.

[0172] Figure 13 This is a flowchart illustrating the process of determining the inspection results of a PCB panel, as provided in an embodiment of this application. Figure 13 As shown, step 130 above includes steps 1310 to 1320.

[0173] Step 1310: If there is no second feature point on at least one second PCB board with the same position coordinates as the target feature point, then the inspection result of the PCB panel is determined to be that the first feature point has failed the inspection.

[0174] In some embodiments, if there is no second feature point on at least one second PCB board with the same position coordinates as the target feature point, it means that there is no second feature point on at least one second PCB board that satisfies a symmetrical or translational relationship with the first feature point on the first PCB board. Therefore, it can be determined that the first feature point has failed the inspection.

[0175] For example, such as Figure 5 As shown, in the case of a centrally symmetrical PCB panel, the coordinates (x, y) of the first feature point A on the first PCB are used. A y ATaking the position coordinates of the target feature point determined as (x', y') as an example, if the position coordinates of the feature points on the second PCB are not equal to (x', y'), then it can be determined that the first feature point A has failed the check, and the remaining feature points can be traversed.

[0176] like Figure 7 As shown, in the case of a mirror-symmetric PCB panel, the coordinates (x, y) of the first feature point A on the first PCB are used. A y A Taking the position coordinates of the target feature point determined as (x', y') as an example, if the position coordinates of the feature points on the second PCB are not equal to (x', y'), then it can be determined that the first feature point A has failed the check, and the remaining feature points can be traversed.

[0177] In the case where the position coordinates of at least one target feature point corresponding to the first feature point are determined based on the position coordinates of the first feature point, the number of translations, and the target offset, such as Figure 9 As shown, the position coordinates (x, y) of the first feature point A1 on PCB board 1 are used. A y A The position coordinates of the target feature point determined by the target offset ΔLx are (x) A +ΔLx, y A For example, if there is no position coordinate (x, y) of the target feature point on PCB board 2, then... A +ΔLx, y A If the second feature point is the same, then it can be determined that the first feature point A1 has failed the check, and the feature point to be checked A2 can be used as the first feature point to determine the position coordinates of at least one target feature point corresponding to the first feature point A2; or, it can be determined that the first feature point A2 corresponding to the number of translations has failed the check.

[0178] In the case of traversing multiple feature points to be inspected and determining the position coordinates of target feature points adjacent to the first feature point based on the position coordinates of the first feature point and the target offset, such as Figure 9 As shown, based on the position coordinates (x, y) of the first feature point A1 A1 y A1 The sum of the x-axis and the target offset ΔLx determines the position coordinates (x-axis) of the target feature point. A1 +ΔLx, y A1 After that, if there is no second feature point on PCB board 2 with the same position coordinates as the target feature point, then it can be determined that the first feature point A1 has failed the inspection; based on the position coordinates (x, y) of the first feature point A2 on PCB board 2... A2 y A2The sum of the x and y values ​​and the target offset ΔLx determines the position coordinates of the target feature point as (x + y). A2 +ΔLx, y A2 After that, if there is no position coordinate (x, y) on PCB board 3 that corresponds to the target feature point... A1 -ΔLx, y A2 If the second feature point is the same as the first feature point A2, then it can be determined that the first feature point A2 failed the check.

[0179] Step 1320: If at least one second PCB board has a second feature point whose position coordinates are equal to the position coordinates of the target feature point, then the inspection result of the PCB panel is determined to be that the first feature point and the second feature point have passed the inspection.

[0180] In some embodiments, if there is a second feature point on at least one second PCB board whose position coordinates are equal to the position coordinates of the target feature point, it means that there is a second feature point on at least one second PCB board that satisfies a symmetrical or translational relationship with the first feature point on the first PCB board. Therefore, it can be determined that the first feature point and the corresponding second feature point of the PCB panel have passed the inspection.

[0181] like Figure 5 As shown, in the case of a centrally symmetrical PCB panel, the coordinates (x, y) of the first feature point A on the first PCB are used. A y A Taking the position coordinates of the target feature point determined as (x', y') as an example, if the position coordinates of the second feature point A' on the second PCB board are (x', y')... A ',y A If the coordinates (x', y') of the target feature point are the same, then it can be determined that the first feature point A and the second feature point A' have passed the inspection.

[0182] like Figure 7 As shown, in the case of a mirror-symmetric PCB panel, the coordinates (x, y) of the first feature point A on the first PCB are used. A y A Taking the position coordinates of the target feature point determined as (x', y') as an example, if the position coordinates of the second feature point A' on the second PCB board are (x', y')... A ',y A If the coordinates (x', y') of the target feature point are the same, then it can be determined that the first feature point A and the second feature point A' have passed the inspection.

[0183] In the case where the position coordinates of at least one target feature point corresponding to the first feature point are determined based on the position coordinates of the first feature point, the number of translations, and the target offset, such as Figure 9As shown, the coordinates (x, y) of the first feature point B1 on PCB board 1 are used. A y A The position coordinates of the target feature point determined by the target offset ΔLx are (x) A +ΔLx, y A For example, if the position coordinates of the second feature point A2 on PCB board 2 are the same as the position coordinates of the target feature point, then it can be determined that the first feature point A1 and the second feature point A2 have passed the inspection.

[0184] In the case of traversing multiple feature points to be inspected and determining the position coordinates of target feature points adjacent to the first feature point based on the position coordinates of the first feature point and the target offset, such as Figure 9 As shown, based on the position coordinates (x, y) of the first feature point A1 A1 y A1 The sum of the x-axis and the target offset ΔLx determines the position coordinates (x-axis) of the target feature point. A1 +ΔLx, y A1 If the position coordinates of the second feature point A2 on the PCB board 2 are the same as the position coordinates of the target feature point, then it can be determined that the first feature point A1 and the second feature point A2 have passed the inspection.

[0185] Using the above scheme, after determining the position coordinates of at least one target feature point corresponding to the first feature point on the first PCB board, if there is no second feature point with the same position coordinates as the at least one target feature point on at least one second PCB board other than the first PCB board, it can be determined that the first feature point has failed the inspection; if there is a second feature point with the same position coordinates as the at least one target feature point on at least one second PCB board, it indicates that the first feature point and the second feature point satisfy a symmetrical relationship or a translational relationship, and it can be determined that the first feature point and the second feature point have passed the inspection.

[0186] In some embodiments, in addition to checking the position coordinates of the feature points, if the feature point is the center point of the device, the device size corresponding to the feature point can also be checked. For example, after determining the first and second feature points that satisfy a symmetry or translation relationship, it can be determined whether the device sizes corresponding to the first and second feature points are the same, thereby further determining the inspection result.

[0187] Figure 14 This is a schematic diagram of the interface of a PCB panel inspection system provided in an embodiment of this application. Figure 14As shown, the PCB panel inspection system 1400 can inspect multiple feature points on the PCB panel based on the steps shown in the above embodiments to obtain inspection results; and can display the PCB panel and the inspection results of the PCB panel through the display interface 14.

[0188] For example, a user can input a command to perform an inspection via a button on the display interface 14, causing the PCB panel inspection system 1400 to respond to the command and inspect multiple feature points on the acquired PCB panel. After determining the inspection result of the PCB panel, the display interface 14 can be used to display the feature points that failed the inspection and the feature points that passed the inspection.

[0189] Furthermore, users can adjust the positions of multiple feature points on the PCB panel through the display interface 14. Even after the position coordinates of the feature points have changed, users can still directly input the command to perform the inspection through the buttons in the display interface 14, so that the PCB panel inspection system 1400 responds to the command and inspects the multiple feature points based on the adjusted position coordinates.

[0190] For example, when a user clicks on a feature point in the inspection results, the PCB panel inspection system 1400 can respond to the user's click operation and locate the feature point in the PCB panel so that the user can view the position of the feature point in the PCB panel and adjust the position of the feature point; similarly, when a user clicks on the corresponding feature point in the PCB panel, the PCB panel inspection system 100 can respond to the user's click operation and locate the feature point in the inspection results so that the user can view the inspection results of the feature point.

[0191] The above solution utilizes computer software to perform feature point inspections on PCB panels and displays the inspection results through a visual interface. This allows users to easily operate and view the results, thereby further improving the inspection efficiency of PCB panels.

[0192] Figure 15 A flowchart illustrating another method for inspecting PCB panels provided in this application embodiment. Figure 15 As shown, the method includes steps 1501 to 1510.

[0193] Step 1501: Obtain the position coordinates of multiple feature points on multiple PCBs included in the PCB panel and the panel information of the PCB panel.

[0194] Understandably, the implementation of step 1501 can be found in the description of step 110, and will not be repeated here.

[0195] Step 1502: If the PCB panel is a centrally symmetrical panel, then based on the centrally symmetrical panel and the position coordinates of the first feature point, determine the position coordinates of at least one target feature point that satisfies the central symmetry relationship with the first feature point.

[0196] Understandably, the implementation of step 1502 can be found in the descriptions of steps 410 and 420, and will not be repeated here.

[0197] Step 1503: If the PCB panel is a mirror-symmetric panel, then based on the mirror-symmetric panel and the position coordinates of the first feature point, determine the position coordinates of at least one target feature point that satisfies the mirror-symmetric relationship with the first feature point.

[0198] Understandably, the implementation of step 1503 can be found in the descriptions of steps 410 and 420, and will not be repeated here.

[0199] Step 1504: If the PCB panel is a translational panel, then obtain multiple feature points to be inspected on multiple PCBs with the same vertical or horizontal coordinate, and determine the actual offset between the corresponding feature points on any two adjacent PCBs.

[0200] Understandably, the implementation of step 1504 can be found in the descriptions of steps 1210 and 1220, and will not be repeated here.

[0201] Step 1505: Determine whether the actual offset between the corresponding positions of the feature points to be inspected on any two adjacent PCB boards is exactly the same.

[0202] For example, if the actual offset between the corresponding positions of the feature points to be inspected on any two adjacent PCB boards is not exactly the same, then step 1506 is executed; if the actual offset between the corresponding positions of the feature points to be inspected on any two adjacent PCB boards is the same, then step 1510 is executed.

[0203] Step 1506: If the actual offsets between corresponding positions of the feature points to be inspected on any two adjacent PCB boards are not exactly the same, then the target offset is determined based on the position coordinates of multiple feature points to be inspected, the number of multiple feature points to be inspected, and the number of multiple PCB boards.

[0204] Understandably, the implementation of step 1506 can be found in the description of step 820, and will not be repeated here.

[0205] Step 1507: Based on the position coordinates of the first feature point, the number of translations, and the target offset, determine the position coordinates of at least one target feature point corresponding to the first feature point.

[0206] Understandably, the implementation of step 1507 can be found in the description of step 830, and will not be repeated here.

[0207] Step 1508: Traverse multiple feature points to be inspected, and determine the position coordinates of the target feature point based on the difference between the position coordinates of the first feature point and the target offset, and / or determine the position coordinates of the target feature point based on the sum of the position coordinates of the first feature point and the target offset.

[0208] Understandably, the implementation of step 1508 can be found in the description of step 830, and will not be repeated here.

[0209] Step 1509: Determine the inspection result of the PCB panel based on the position coordinates of the second feature point on at least one second PCB panel and the position coordinates of at least one target feature point.

[0210] Understandably, the implementation of step 1509 can be found in the description of step 140, and will not be repeated here.

[0211] Step 1510: If the actual offset between the corresponding feature points to be inspected on any two adjacent PCB boards is the same, then the inspection result of the PCB panel is determined to be that each feature point to be inspected has passed the inspection.

[0212] Understandably, the implementation of step 1510 can be found in the description of step 1150, and will not be repeated here.

[0213] By applying the technical solution of this application, based on the PCB panelization method and the position coordinates of multiple feature points on multiple PCBs in the PCB panel, the position coordinates of at least one target feature point that satisfies a symmetric or translational relationship with any feature point (i.e., a first feature point) on any PCB (i.e., a first PCB) can be determined. Furthermore, based on the position coordinates of a second feature point on at least one second PCB and the position coordinates of at least one target feature point, the inspection result of the PCB panel can be determined. This application enables automated inspection of feature points on PCB panels without manual intervention, thereby improving the inspection efficiency and accuracy of PCB panels. Moreover, this application is applicable to various panelization methods and combinations of multiple panelization methods, further improving the inspection efficiency of PCB panels.

[0214] Furthermore, the technical solution of this application can also be applied to other scenarios such as image feature analysis, 3D modeling applications, and PCB design. For example, in image feature analysis, the distribution of feature points in an image can be analyzed to check whether the feature points satisfy symmetry or translation relationships; in 3D modeling applications, feature points such as the geometric center and centroid of a 3D model can be calculated, and the rotation, translation, and axial / plane symmetry of the 3D model can be checked based on these feature points; in PCB design, the symmetry of the component layout on the PCB can be checked, the symmetry of the wiring about a certain axis or center line can be checked, and the symmetry of the distribution of pads and holes can be verified.

[0215] refer to Figure 16 As shown, corresponding to the aforementioned embodiments of the PCB panel inspection method, this application also provides embodiments of a PCB panel inspection apparatus. The PCB panel inspection apparatus 1600 includes an acquisition module 1610, a first determination module 1620, and a second determination module 1630.

[0216] The acquisition module 1610 is configured to acquire the position coordinates of multiple feature points on multiple PCBs included in the PCB panel and the panel information of the PCB panel.

[0217] The panel information includes the panel arrangement method.

[0218] The first determining module 1620 is configured to determine the position coordinates of at least one target feature point corresponding to a first feature point among the multiple feature points based on the position coordinates of multiple feature points and the panel information.

[0219] Wherein, the first feature point is any feature point on the first PCB board, and the first PCB board is any PCB board among multiple PCB boards.

[0220] The second determining module 1630 is configured to determine the inspection result of the PCB panel based on the position coordinates of a second feature point on at least one second PCB panel and the position coordinates of at least one target feature point.

[0221] Among them, at least one second PCB board is a PCB board other than the first PCB board among multiple PCB boards, and the inspection result of the PCB panel is used to indicate whether there are target feature points on the second PCB board.

[0222] In some embodiments, the panelization method includes a centrally symmetric panelization method, and the first determining module 1620 is specifically configured to: determine the central symmetry point of the PCB panel based on the position coordinates of multiple feature points and the centrally symmetric panelization method; and determine the position coordinates of at least one target feature point that satisfies the central symmetry relationship with the first feature point based on the position coordinates of the first feature point and the central symmetry point.

[0223] In some embodiments, the panelization method includes a mirror symmetry panelization method, and the first determining module 1620 is specifically configured to: determine the mirror symmetry axis of the PCB panel based on the position coordinates of multiple feature points and the mirror symmetry panelization method; and determine the position coordinates of at least one target feature point that satisfies a mirror symmetry relationship with the first feature point based on the position coordinates of the first feature point and the mirror symmetry axis.

[0224] In some embodiments, the panelization method includes a translational panelization method, and the panelization information also includes the number of multiple PCB boards; the first determining module 1620 is specifically configured to: obtain multiple feature points to be inspected on multiple PCB boards that have the same vertical or horizontal coordinate based on the position coordinates of multiple feature points and the translational panelization method; determine a target offset based on the position coordinates of the multiple feature points to be inspected, the number of multiple feature points to be inspected, and the number of multiple PCB boards; and determine the position coordinates of at least one target feature point corresponding to the first feature point based on the position coordinates of the first feature point among the multiple feature points to be inspected and the target offset; wherein, the first feature point is any one of the multiple feature points to be inspected.

[0225] In some embodiments, the first determining module 1620 is further configured to: determine the number of translations based on the number of multiple feature points to be inspected and the number of multiple PCB boards; determine the translation distance based on the position coordinates of the multiple feature points to be inspected; and determine the target offset based on the translation distance and the number of translations.

[0226] In some embodiments, the first determining module 1620 is specifically configured to: determine the position coordinates of at least one target feature point corresponding to the first feature point based on the position coordinates of the first feature point, the number of translations, and the target offset; wherein, the at least one target feature point is the target feature point corresponding to each translation, and the number of at least one target feature point is equal to the number of translations.

[0227] In some embodiments, the first determining module 1620 is specifically configured to: traverse multiple feature points to be inspected, and determine the position coordinates of the target feature point based on the difference between the position coordinates of the first feature point and the target offset, and / or determine the position coordinates of the target feature point based on the sum of the position coordinates of the first feature point and the target offset.

[0228] In some embodiments, the panelization method includes a translational panelization method. The first determining module 1620 is specifically configured to: obtain multiple feature points to be inspected on multiple PCBs with the same vertical or horizontal coordinate based on the position coordinates of multiple feature points and the translational panelization method; determine the actual offset between corresponding feature points on any two adjacent PCBs based on the position coordinates of the multiple feature points to be inspected; if the actual offset between corresponding feature points on any two adjacent PCBs is not completely the same, determine the position coordinates of at least one target feature point corresponding to the first feature point among the multiple feature points based on the position coordinates of the multiple feature points and the panelization information.

[0229] In some embodiments, the second determining module 1630 is specifically configured to: if there is no second feature point on at least one second PCB board whose position coordinates are the same as the position coordinates of the target feature point, then determine that the inspection result of the PCB panel is that the first feature point has failed the inspection; if there is a second feature point on at least one second PCB board whose position coordinates are equal to the position coordinates of the target feature point, then determine that the inspection result of the PCB panel is that the first feature point and the second feature point have passed the inspection.

[0230] Figure 17 This is a schematic diagram of a computing device provided for some embodiments of this application. In some embodiments, the computing device may include a server, a terminal, or other devices; the computing device includes one or more processors and a memory. The memory is configured to store one or more programs. When the one or more programs are executed by the one or more processors, the one or more processors implement the PCB panel inspection method described in the above embodiments.

[0231] like Figure 17 As shown, the computing device 1700 includes a processor 1701 and a memory 1702. Exemplarily, the computing device 1700 may also include a communications interface 1703 and a communications bus 1704.

[0232] The processor 1701, memory 1702, and communication interface 1703 communicate with each other via communication bus 1704. Communication interface 1703 is used to communicate with other network elements such as clients or other servers.

[0233] In some embodiments, the processor 1701 is used to execute program 1705, specifically performing the relevant steps in the above-described PCB panel inspection method embodiments. Specifically, program 1705 may include program code, which includes computer-executable instructions.

[0234] For example, processor 1701 may be a central processing unit (CPU), an application-specific integrated circuit (ASIC), or one or more integrated circuits configured to implement some embodiments of this application. Computing device 1700 may include one or more processors, which may be processors of the same type, such as one or more CPUs; or they may be processors of different types, such as one or more CPUs and one or more ASICs.

[0235] In some embodiments, memory 1702 is used to store program 1705. Memory 1702 may include high-speed RAM memory and may also include non-volatile memory (NVM), such as at least one disk storage device.

[0236] Specifically, program 1705 can be called by processor 1701 to cause computing device 1700 to perform PCB panel inspection operations.

[0237] Some embodiments of this application provide a computer-readable storage medium storing at least one executable instruction that, when executed on a computing device 1700, causes the computing device 1700 to perform the PCB panel inspection method described in the above embodiments.

[0238] Specifically, the executable instructions can be used to enable the computing device 1700 to perform PCB panel inspection operations.

[0239] For example, the computer-readable storage medium may be a read-only memory (ROM), a random access memory (RAM), a compact disc read-only memory (CD-ROM), magnetic tape, floppy disk, and optical data storage device, etc.

[0240] The beneficial effects that the readable storage medium provided in some embodiments of this application can achieve can be referred to the beneficial effects in the corresponding PCB panel inspection method provided above, and will not be repeated here.

[0241] It should be noted that in this application, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes the element.

[0242] The various embodiments in this specification are described in a related manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the apparatus embodiments are basically similar to the method embodiments, so the description is relatively simple; relevant parts can be referred to the descriptions of the method embodiments.

[0243] The logic and / or steps represented in the flowchart or otherwise described herein, for example, can be considered as a sequenced list of executable instructions for implementing logical functions, and can be embodied in any computer-readable medium for use by, or in conjunction with, an instruction execution system, apparatus or device (such as a computer-based system, a processor-included system or other system that can fetch and execute instructions from, an instruction execution system, apparatus or device).

[0244] For the purposes of this specification, "computer-readable medium" can mean any means that can contain, store, communicate, propagate, or transmit programs for use by or in conjunction with an instruction execution system, apparatus, or device.

[0245] More specific examples (a non-exhaustive list) of computer-readable media include the following: electrical connections having one or more wires (electronic devices), portable computer disks (magnetic devices), random access memory (RAM), read-only memory (ROM), erasable and editable read-only memory (EPROM or flash memory), fiber optic devices, and portable optical disc read-only memory (CDROM).

[0246] Furthermore, the computer-readable medium can even be paper or other suitable media on which the program can be printed, because the program can be obtained electronically, for example, by optically scanning the paper or other medium, followed by editing, interpreting, or otherwise processing as necessary, and then stored in computer memory. It should be understood that various parts of this application can be implemented using hardware, software, firmware, or a combination thereof.

[0247] In the above embodiments, multiple steps or methods can be implemented using software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, it can be implemented using any one or a combination of the following techniques known in the art: discrete logic circuits having logic gates for implementing logical functions on data signals, application-specific integrated circuits (ASICs) having suitable combinational logic gates, programmable gate arrays (PGAs), field-programmable gate arrays (FPGAs), etc.

[0248] The embodiments described above are merely specific embodiments of this application and are not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, improvements, etc., made based on the technical solution of this application should be included within the scope of protection of this application.

Claims

1. A method for inspecting PCB panels, characterized in that, The PCB panel comprises multiple PCB boards, and the method includes: Obtain the position coordinates of multiple feature points on the multiple PCB single boards and the panelization information of the PCB panel; wherein, the panelization information includes the panelization method; Based on the position coordinates of the plurality of feature points and the panel information, the position coordinates of at least one target feature point corresponding to a first feature point among the plurality of feature points are determined; wherein, the first feature point is any feature point on the first PCB board, and the first PCB board is any PCB board among the plurality of PCB boards. Based on the position coordinates of a second feature point on at least one second PCB board and the position coordinates of the at least one target feature point, the inspection result of the PCB panel is determined; wherein, the at least one second PCB board is a PCB board other than the first PCB board among the plurality of PCB boards, and the inspection result of the PCB panel is used to indicate whether the target feature point exists on the second PCB board.

2. The method according to claim 1, characterized in that, The panel arrangement includes a centrally symmetric panel arrangement. The step of determining the position coordinates of at least one target feature point corresponding to a first feature point among the plurality of feature points, based on the position coordinates of the plurality of feature points and the panel information, includes: Based on the position coordinates of the multiple feature points and the central symmetry panelization method, the central symmetry point of the PCB panel is determined; Based on the position coordinates of the first feature point and the central symmetry point, determine the position coordinates of at least one target feature point that satisfies a central symmetry relationship with the first feature point.

3. The method according to claim 1, characterized in that, The panel arrangement includes a mirror-symmetric panel arrangement. The step of determining the position coordinates of at least one target feature point corresponding to a first feature point among the plurality of feature points, based on the position coordinates of the plurality of feature points and the panel information, includes: Based on the position coordinates of the multiple feature points and the mirror symmetry panelization method, the mirror symmetry axis of the PCB panel is determined; Based on the position coordinates of the first feature point and the mirror symmetry axis, determine the position coordinates of at least one target feature point that satisfies a mirror symmetry relationship with the first feature point.

4. The method according to claim 1, characterized in that, The panelization method includes a translational panelization method, and the panelization information also includes the number of the plurality of PCB boards; determining the position coordinates of at least one target feature point corresponding to a first feature point among the plurality of feature points based on the position coordinates of the plurality of feature points and the panelization information includes: Based on the position coordinates of the multiple feature points and the translation panelization method, multiple feature points to be inspected on the multiple PCB single boards that have the same vertical or horizontal coordinate are obtained. The target offset is determined based on the position coordinates of the multiple feature points to be inspected, the number of the multiple feature points to be inspected, and the number of the multiple PCB boards. Based on the position coordinates of the first feature point among the plurality of feature points to be inspected and the target offset, the position coordinates of at least one target feature point corresponding to the first feature point are determined; wherein, the first feature point is any one of the plurality of feature points to be inspected.

5. The method according to claim 4, characterized in that, The determination of the target offset based on the position coordinates of the plurality of feature points to be inspected, the number of the plurality of feature points to be inspected, and the number of the plurality of PCB boards includes: The number of translation steps is determined based on the number of the multiple feature points to be inspected and the number of the multiple PCB boards. Based on the position coordinates of the multiple feature points to be inspected, the translation distance is determined; The target offset is determined based on the translation distance and the number of translations.

6. The method according to claim 5, characterized in that, The step of determining the position coordinates of at least one target feature point corresponding to the first feature point based on the position coordinates of the first feature point among the plurality of feature points to be inspected and the target offset includes: Based on the position coordinates of the first feature point, the number of translations, and the target offset, the position coordinates of at least one target feature point corresponding to the first feature point are determined; wherein, the at least one target feature point is the target feature point corresponding to each translation, and the number of the at least one target feature point is equal to the number of translations.

7. The method according to claim 5, characterized in that, The step of determining the position coordinates of at least one target feature point corresponding to the first feature point based on the position coordinates of the first feature point among the plurality of feature points to be inspected and the target offset includes: The system iterates through the plurality of feature points to be inspected, and determines the position coordinates of the target feature point based on the difference between the position coordinates of the first feature point and the target offset, and / or determines the position coordinates of the target feature point based on the sum of the position coordinates of the first feature point and the target offset.

8. The method according to claim 1, characterized in that, The panel arrangement method includes a translational panel arrangement method. The step of determining the position coordinates of at least one target feature point corresponding to a first feature point among the multiple feature points, based on the position coordinates of the multiple feature points and the panel information, includes: Based on the position coordinates of the multiple feature points and the translation panelization method, multiple feature points to be inspected on the multiple PCB single boards that have the same vertical or horizontal coordinate are obtained. Based on the position coordinates of the multiple feature points to be inspected, the actual offset between the corresponding feature points on any two adjacent PCB boards is determined. If the actual offsets between the corresponding positions of the feature points to be inspected on any two adjacent PCB boards are not exactly the same, then based on the position coordinates of the multiple feature points and the panel information, the position coordinates of at least one target feature point corresponding to the first feature point among the multiple feature points are determined.

9. The method according to any one of claims 1-8, characterized in that, The determination of the inspection result of the PCB panel based on the position coordinates of the second feature point on at least one second PCB and the position coordinates of the at least one target feature point includes: If at least one of the second PCB boards does not have a second feature point with the same position coordinates as the target feature point, then the inspection result of the PCB panel is determined to be that the first feature point has failed the inspection. If at least one of the second PCB boards has a second feature point whose position coordinates are equal to the position coordinates of the target feature point, then the inspection result of the PCB panel is determined to be that the first feature point and the second feature point pass the inspection.

10. A computing device, characterized in that, include: One or more processors; and The memory is configured to store one or more programs. When the one or more programs are executed by the one or more processors, the one or more processors implement the PCB panel inspection method according to any one of claims 1-9.

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