Display panel, display device and preparation method of display panel

Abstract

The invention discloses a display panel, a display device and a preparation method of the display panel. The display panel comprises a substrate, an isolation layer, a light-emitting layer, a first electrode layer, a packaging layer, a conductive layer and an anti-oxidation layer. An isolation opening defined by the isolation part is used for arranging a light-emitting unit, and light-emitting display of the display panel is achieved. The orthographic projection of the light-emitting unit on the substrate is located in the orthographic projection of the first electrode on the substrate, that is, the first electrode covers the light-emitting unit to serve as the electrode of the light-emitting unit. The packaging layer is arranged on the side, away from the substrate, of the first electrode layer. The orthographic projection of the conductive part on the substrate is located in the orthographic projection of the anti-oxidation part on the substrate. The conductive layer is located on the side, away from the substrate, of the first sub-layer and comprises a conductive part, the conductive part is electrically connected with the first electrode through the via hole, the first electrode and the conductive part are arranged in parallel, overall resistance of the first electrode and the conductive part is reduced, power consumption of the first electrode is reduced, and the display effect of the display panel is improved.

Description

Technical Field

[0001] The present application relates to the field of display, and in particular to a display panel, a display device and a method for manufacturing a display panel. Background Art

[0002] With the rapid development of electronic devices, users have higher and higher requirements for display effects, making the screen display of electronic devices receive more and more attention in the industry.

[0003] In the related art, electronic devices use organic light emitting diode (OLED) display panels for light display, but the metal layer in the OLED display panel is easily oxidized, which affects the performance of the display panel. Summary of the invention

[0004] The embodiments of the present application provide a display panel, a display device and a method for manufacturing a display panel, aiming to improve the problem that a metal layer is easily oxidized.

[0005] A first aspect of the present application provides a display panel, comprising: a substrate; an isolation layer located on the substrate, the isolation layer comprising an isolation portion and an isolation opening formed by the isolation portion; a light-emitting layer comprising light-emitting units located in each isolation opening; a first electrode layer located on a side of the light-emitting layer away from the substrate, the first electrode layer comprising a first electrode, and an orthographic projection of the light-emitting unit on the substrate is located within an orthographic projection of the first electrode on the substrate; an encapsulation layer located on a side of the first electrode layer away from the substrate, the encapsulation layer comprising a first sublayer; a conductive layer located on a side of the first sublayer away from the substrate, the conductive layer comprising a conductive portion, and the conductive portion is connected to a first electrode via; an anti-oxidation layer located on a side of the conductive layer away from the substrate, the anti-oxidation layer comprising an anti-oxidation portion, and an orthographic projection of the conductive portion on the substrate is located within an orthographic projection of the anti-oxidation portion on the substrate.

[0006] According to an implementation of the first aspect of the present application, an orthographic projection of the conductive portion on the substrate is at least partially located within an orthographic projection of the isolation portion on the substrate.

[0007] According to any of the aforementioned embodiments of the first aspect of the present application, the conductive portion is in a mesh shape.

[0008] According to any of the aforementioned embodiments of the first aspect of the present application, the conductive part includes a metal conductive material or a transparent conductive material.

[0009] According to any of the aforementioned embodiments of the first aspect of the present application, the encapsulation layer includes: a second sublayer located on a side of the first sublayer facing away from the substrate, and a conductive layer located between the first sublayer and the second sublayer.

[0010] According to any of the aforementioned embodiments of the first aspect of the present application, the first sublayer includes an inorganic material.

[0011] According to any of the aforementioned embodiments of the first aspect of the present application, the second sublayer includes an organic material.

[0012] According to any of the aforementioned embodiments of the first aspect of the present application, the encapsulation layer further includes a third sublayer, and the third sublayer is located on a side of the second sublayer facing away from the substrate.

[0013] According to any of the aforementioned embodiments of the first aspect of the present application, the third sublayer includes an inorganic material.

[0014] According to any of the aforementioned embodiments of the first aspect of the present application, the anti-oxidation layer includes inorganic materials or organic materials.

[0015] According to any of the aforementioned embodiments of the first aspect of the present application, the anti-oxidation layer is made of the same material as the first sub-layer.

[0016] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the conductive portion on the substrate coincides with the orthographic projection of the anti-oxidation portion on the substrate.

[0017] According to any of the aforementioned embodiments of the first aspect of the present application, the conductive portion includes a side surface facing the isolation opening, and the anti-oxidation portion is arranged to cover at least a portion of the side surface of the conductive portion.

[0018] According to any of the aforementioned implementations of the first aspect of the present application, the display panel further includes: a protective layer located between the first electrode layer and the encapsulation layer, and the protective layer covers at least a portion of the first electrode layer.

[0019] According to any of the aforementioned embodiments of the first aspect of the present application, the protective layer includes a light extraction material.

[0020] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel also includes: an isolation structure, which is located on the substrate and encloses a plurality of isolation openings, the isolation structure includes a first layer, each light-emitting unit and each first electrode is located in the isolation opening, and the first electrode is electrically connected to the first layer.

[0021] According to any of the aforementioned embodiments of the first aspect of the present application, a plurality of mutually spaced first electrodes are all connected to the conductive portion vias.

[0022] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure further includes a second layer located on the side of the first layer facing away from the substrate, and the orthographic projection of the first layer on the substrate is located within the orthographic projection of the second layer on the substrate.

[0023] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation portion includes a pixel defining portion, and the isolation opening includes a pixel opening enclosed by the pixel defining portion.

[0024] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation portion further comprises an isolation structure, and the isolation structure is located on the substrate. According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the isolation structure on the substrate and the orthographic projection of the conductive portion on the substrate are at least partially staggered.

[0025] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure is located on a side of the isolation portion facing away from the substrate.

[0026] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the conductive portion on the substrate is located within the orthographic projection of the pixel defining portion on the substrate.

[0027] According to any of the aforementioned embodiments of the first aspect of the present application, a clearance opening is provided on the isolation portion, and the isolation structure is located in the clearance opening.

[0028] An embodiment of a second aspect of the present application provides a display device, which includes a display panel according to any of the above embodiments.

[0029] An embodiment of a third aspect of the present application provides a method for preparing a display panel, including:

[0030] preparing an isolation layer on the substrate, the isolation layer comprising an isolation portion and an isolation opening formed by the isolation portion;

[0031] A light-emitting layer is prepared on a side of the isolation layer facing away from the substrate, wherein the light-emitting layer includes light-emitting units located in each isolation opening;

[0032] A first electrode layer is prepared on the side of the light-emitting layer facing away from the substrate, and the orthographic projection of the light-emitting unit on the substrate is located within the orthographic projection of the first electrode on the substrate;

[0033] Prepare an encapsulation layer on a side of the first electrode layer facing away from the substrate, wherein the encapsulation layer comprises a first sublayer;

[0034] A conductive layer is prepared on a side of the first sublayer facing away from the substrate, wherein the conductive layer includes a conductive portion connected to the first electrode via hole;

[0035] An anti-oxidation layer is prepared on the side of the conductive layer facing away from the substrate. The anti-oxidation layer includes an anti-oxidation portion. The orthographic projection of the conductive portion on the substrate is located within the orthographic projection of the anti-oxidation portion on the substrate.

[0036] According to an embodiment of the third aspect of the present application, after the step of preparing a first electrode layer on a side of the light-emitting layer facing away from the substrate, the method further comprises:

[0037] Preparing a first sub-material layer on a side of the first electrode layer facing away from the substrate, and patterning the first sub-material layer to obtain a first sub-layer, wherein the first sub-layer includes a via hole;

[0038] A conductive layer is prepared on a side of the first sub-layer facing away from the substrate, wherein the conductive layer comprises a conductive portion, and the conductive portion is connected to the first electrode through a via hole.

[0039] According to any of the aforementioned embodiments of the third aspect of the present application, after the step of preparing a conductive layer on a side of the first sublayer facing away from the substrate, the method further includes:

[0040] An anti-oxidation material layer is prepared on the side of the conductive layer facing away from the substrate, and the anti-oxidation material layer and the conductive layer are sequentially etched using the same mask to form a conductive portion and an anti-oxidation layer. The anti-oxidation layer includes the anti-oxidation portion, and the orthographic projection of the conductive portion on the substrate coincides with the orthographic projection of the anti-oxidation portion on the substrate.

[0041] According to the display panel of the embodiment of the present application, the display panel includes a substrate, an isolation layer, a light-emitting layer, a first electrode layer, an encapsulation layer, a conductive layer and an anti-oxidation layer. The isolation opening formed by the isolation portion is used to set the light-emitting unit to realize the light-emitting display of the display panel. The orthographic projection of the light-emitting unit on the substrate is located within the orthographic projection of the first electrode on the substrate, that is, the first electrode covers the light-emitting unit to serve as the electrode of the light-emitting unit. The encapsulation layer is arranged on the side of the first electrode layer away from the substrate to encapsulate the first electrode layer and the light-emitting layer, reduce the possibility of water and oxygen intrusion, and improve the service life of the display panel. The orthographic projection of the conductive part on the substrate is located within the orthographic projection of the anti-oxidation part on the substrate, that is, the anti-oxidation part of the anti-oxidation layer covers at least part of the surface of the conductive part, so as to improve the problem that water and oxygen enter the first electrode layer and oxidize and corrode the first electrode during the process of etching the via in the first sub-layer, thereby reducing the conductivity of the first electrode, and ensuring the electrical connection between the first electrode and the conductive part. The conductive layer is located on the side of the first sublayer away from the substrate and includes a conductive part, which is electrically connected to the first electrode through a via hole, so that the first electrode and the conductive part are arranged in parallel, reducing the overall resistance of the first electrode and the conductive part, thereby reducing the power consumption of the first electrode and improving the display effect of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Other features, objects and advantages of the present application will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals represent the same or similar features and the accompanying drawings are not drawn to scale.

[0043] Figure 1 is a partial cross-sectional view of a display panel provided in an embodiment of the present application;

[0044] Figure 2 is a partial top view of a display panel provided in an embodiment of the present application;

[0045] Figure 3 is a partial cross-sectional view of a display panel in another embodiment;

[0046] Figure 4 is a partial cross-sectional view of a display panel in yet another embodiment;

[0047] Figure 5 is a partial cross-sectional view of a display panel in yet another embodiment;

[0048] Figure 6 is a partial cross-sectional view of a display panel in yet another embodiment;

[0049] Figure 7 is a partial cross-sectional view of a display panel in yet another embodiment;

[0050] Figure 8 is a partial cross-sectional view of a display panel in yet another embodiment;

[0051] Fig. 9 is a partial cross-sectional view of a display panel in yet another embodiment;

[0052] Fig.10 It is a schematic flow chart of a method for preparing a display panel provided in an embodiment of the present application.

[0053] Description of reference numerals:

[0054] 10. Display panel;

[0055] 100. Substrate;

[0056] 200, isolation layer; 210, isolation portion; 220, isolation opening;

[0057] 300, light-emitting layer; 310, light-emitting unit;

[0058] 400, first electrode layer; 410, first electrode;

[0059] 500, conductive layer; 510, conductive portion;

[0060] 600, encapsulation layer; 610, first sublayer; 620, second sublayer; 630, third sublayer;

[0061] 700, anti-oxidation layer; 710, anti-oxidation part;

[0062] 800, protective layer;

[0063] 900, isolation structure; 910, first layer; 920, second layer; 930, pixel defining portion; 940, pixel opening; 950, give way opening; 960, pixel electrode. DETAILED DESCRIPTION

[0064] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present application and are not configured to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.

[0065] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0066] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "on" or "over" another layer or another region, it may mean that it is directly on the other layer or another region, or that other layers or regions are included between it and the other layer or another region. Moreover, if the component is turned over, the layer or a region will be "below" or "beneath" another layer or another region.

[0067] Embodiments of the present application provide a display panel, a display device, and a method for manufacturing a display panel. Embodiments of the display panel, the display device, and the method for manufacturing a display panel are described below in conjunction with the accompanying drawings.

[0068] An embodiment of the present application provides a display panel, which may be an organic light emitting diode (OLED) display panel.

[0069] See also Figure 1 , Figure 1 It is a partial cross-sectional view of a display panel provided in an embodiment of the present application.

[0070] like Figure 1As shown, the first embodiment of the present application provides a display panel 10, which includes a substrate 100, an isolation layer 200, a light-emitting layer 300, a first electrode layer 400, an encapsulation layer 600, a conductive layer 500 and an anti-oxidation layer 700; the isolation layer 200 is located on the substrate 100, and the isolation layer 200 includes an isolation portion 210 and an isolation opening 220 formed by the isolation portion 210; the light-emitting layer 300 includes a light-emitting unit 310 located in each isolation opening 220; the first electrode layer 400 is located on the side of the light-emitting layer 300 away from the substrate 100, and the first electrode layer 400 includes a first electrode 410, and the light-emitting unit 310 is The orthographic projection of the substrate 100 is located within the orthographic projection of the first electrode 410 on the substrate 100; the encapsulation layer 600 is located on the side of the first electrode layer 400 facing away from the substrate 100, and the encapsulation layer 600 includes a first sublayer 610; the conductive layer 500 is located on the side of the first sublayer 610 facing away from the substrate 100, the conductive layer 500 includes a conductive portion 510, and the conductive portion 510 is connected to the first electrode 410 via a via hole; the anti-oxidation layer 700 is located on the side of the conductive layer 500 facing away from the substrate 100, the anti-oxidation layer 700 includes an anti-oxidation portion 710, and the orthographic projection of the conductive portion 510 on the substrate 100 is located within the orthographic projection of the anti-oxidation portion 710 on the substrate 100.

[0071] According to the display panel 10 of the embodiment of the present application, the display panel 10 includes a substrate 100, an isolation layer 200, a light-emitting layer 300, a first electrode layer 400 and a conductive layer 500. The isolation opening 220 formed by the isolation portion 210 is used to set the light-emitting unit 310 to realize the light-emitting display of the display panel 10. The orthographic projection of the light-emitting unit 310 on the substrate 100 is located within the orthographic projection of the first electrode 410 on the substrate 100, that is, the first electrode 410 covers the light-emitting unit 310 and is set to serve as the electrode of the light-emitting unit 310. The encapsulation layer 600 is arranged on the side of the first electrode layer 400 away from the substrate 100 to encapsulate the first electrode layer 400 and the light-emitting layer 300, reduce the possibility of water and oxygen intrusion, and improve the service life of the display panel 10. The anti-oxidation layer 700 is arranged on the side of the conductive portion 510 away from the substrate 100. The orthographic projection of the conductive portion 510 on the substrate 100 is located within the orthographic projection of the anti-oxidation portion 710 on the substrate 100. The conductive layer 500 is located on the side of the first sublayer 610 away from the substrate 100 and includes a conductive part 510, which is electrically connected to the first electrode 410 through a via hole, so that the first electrode 410 and the conductive part 510 are arranged in parallel, reducing the overall resistance of the first electrode 410 and the conductive part 510, thereby reducing the power consumption of the first electrode 410 and improving the display effect of the display panel 10. That is, the anti-oxidation part 710 of the anti-oxidation layer 700 covers at least part of the surface of the conductive part 510, so as to improve the problem that the conductive part 510 is easily oxidized after the conductive layer 500 is formed or in the process of patterning, thereby reducing the conductivity of the conductive part 510, ensuring the electrical connection between the first electrode 410 and the conductive part 510, and improving the performance of the display panel 10.

[0072] There are many ways to set the substrate 100. For example, the substrate 100 may include a substrate and an array substrate arranged on the substrate. Alternatively, the substrate 100 is the substrate. Alternatively, the substrate 100 includes a buffer layer and a support plate on a side away from the substrate.

[0073] Please also read Figure 1 and Figure 2 , Figure 2 It is a partial top view of a display panel provided in an embodiment of the present application.

[0074] like Figure 1 and Figure 2 As shown, in some optional embodiments, the orthographic projection of the conductive portion 510 on the substrate 100 is at least partially located within the orthographic projection of the isolation portion 210 on the substrate 100 .

[0075] In these optional embodiments, the orthographic projection of the conductive portion 510 on the substrate 100 is at least within the orthographic projection of the isolation portion 210 on the substrate 100, that is, the conductive portion 510 is at least partially arranged in the area where the isolation portion 210 is located, thereby reducing the influence of the conductive portion 510 on the light emission of the light-emitting unit 310 and ensuring the display effect of the display panel 10.

[0076] Optionally, the orthographic projection of the conductive portion 510 on the substrate 100 and the orthographic projection of the first electrode 410 on the substrate 100 are at least partially overlapped to ensure that the conductive portion 510 can be electrically connected to the first electrode 410 through the via hole. Figure 2 As shown, the conductive part 510 is mesh-shaped, and the mesh-shaped conductive part 510 is consistent with the isolation part 210 in direction, reducing the impact on the light emission of the light-emitting unit 310. The conductive part 510 is mesh-shaped and has a large area, which can better reduce the overall resistance of the first electrode 410 and the conductive part 510 and improve the display effect.

[0077] Optionally, the conductive part 510 includes a metal conductive material or a transparent conductive material. When the conductive part 510 is a metal conductive material, the transmittance of the conductive part 510 is low, so it needs to avoid the light-emitting unit 310, that is, the orthographic projection of the conductive part 510 on the substrate 100 is located within the orthographic projection of the isolation part 210 on the substrate 100. The material of the conductive part 510 includes, for example, metal silver, aluminum, magnesium, copper, etc., or the material of the conductive part 510 includes transparent conductive materials such as indium tin oxide and indium zinc oxide.

[0078] See also Figure 3 , Figure 3 is a partial cross-sectional view of a display panel in another embodiment.

[0079] like Figure 3 As shown, when the material of the conductive part 510 includes a transparent conductive material, there is no need to pattern the conductive layer 500 to obtain a mesh-shaped conductive part 510. A whole-surface continuous conductive layer 500 can be directly prepared and electrically connected to the first electrode 410 through a via hole.

[0080] See also Figure 4 , Figure 4 is a partial cross-sectional view of a display panel in yet another embodiment.

[0081] like Figure 4 As shown, in some optional embodiments, the encapsulation layer 600 includes a second sublayer 620 , which is located on a side of the first sublayer 610 facing away from the substrate 100 , and the conductive layer 500 is located between the first sublayer 610 and the second sublayer 620 .

[0082] In these optional embodiments, the encapsulation layer 600 includes a first sublayer 610 and a second sublayer 620, and the first sublayer 610 and the second sublayer 620 are used for multi-layer encapsulation to further improve the encapsulation performance of the encapsulation layer 600. The conductive layer 500 is located between the first sublayer 610 and the second sublayer 620, and the first sublayer 610 is provided between the conductive layer 500 and the first electrode layer 400, so as to facilitate patterning of the conductive layer 500 and reduce the influence of etching of the conductive layer 500 on the first electrode layer 400.

[0083] Optionally, the first sublayer 610 includes an inorganic material. The first sublayer 610 is encapsulated with the inorganic material, which makes it easier to etch the via hole and reduces the difficulty of etching the via hole. The inorganic material has good density and good barrier properties to water vapor and oxygen.

[0084] Optionally, the second sub-layer 620 includes an organic material, and the second sub-layer 620 is encapsulated by the organic material to further improve the encapsulation performance of the encapsulation layer 600 .

[0085] Optionally, the encapsulation layer 600 further includes a third sublayer 630 , which is located on the side of the second sublayer 620 away from the substrate 100 . The encapsulation layer 600 adopts three-layer encapsulation, has better encapsulation performance, and reduces the possibility of water and oxygen intrusion.

[0086] Optionally, the third sublayer 630 includes inorganic materials, and the first sublayer 610 , the second sublayer 620 and the third sublayer 630 are respectively encapsulated with inorganic materials, organic materials and inorganic materials to form a TFE (Thin Film Encapsulation, TFE) thin film encapsulation structure to further improve the encapsulation performance of the encapsulation layer 600 .

[0087] In some optional embodiments, the anti-oxidation layer 700 includes an inorganic material or an organic material.

[0088] In these optional embodiments, the anti-oxidation layer 700 includes an inorganic material, such as silicon nitride (SiN) or silicon oxide (SiO), etc. Alternatively, the anti-oxidation layer 700 includes an organic material, such as polyimide.

[0089] Optionally, the anti-oxidation layer 700 is made of the same material as the first sub-layer 610. When the anti-oxidation layer 700 and the first sub-layer 610 are made of the same material, the anti-oxidation layer 700 and the first sub-layer 610 can be prepared by the same film-forming method, that is, the same equipment can be used, thereby reducing equipment investment and reducing preparation costs.

[0090] like Figure 4 As shown, in some optional embodiments, the orthographic projection of the conductive portion 510 on the substrate 100 and the orthographic projection of the anti-oxidation portion 710 on the substrate 100 overlap.

[0091] In these optional embodiments, the conductive portion 510 and the anti-oxidation portion 710 are overlapped, so that the conductive portion 510 and the anti-oxidation portion 710 can be prepared using the same mask, thereby reducing the number of mask development times and reducing the preparation cost.

[0092] See also Figure 5 , Figure 5 is a partial cross-sectional view of a display panel in yet another embodiment.

[0093] like Figure 5 As shown, optionally, the conductive part 510 includes a side facing the isolation opening 220, and the anti-oxidation part 710 is arranged to cover at least a portion of the side of the conductive part 510, so that more surface of the conductive part 510 is protected by the anti-oxidation part 710, thereby reducing the possibility of oxidation of the conductive part 510 and ensuring the conductivity of the conductive part 510.

[0094] See also Figure 6 , Figure 6 is a partial cross-sectional view of a display panel in yet another embodiment.

[0095] like Figure 6 As shown, in some optional embodiments, the display panel 10 further includes a protective layer 800 , and the protective layer 800 is located between the first electrode layer 400 and the encapsulation layer 600 , and the protective layer 800 covers at least a portion of the first electrode layer 400 .

[0096] In these optional embodiments, the protective layer 800 is located on the side of the first electrode layer 400 facing away from the substrate 100, and the protective layer 800 covers at least a portion of the first electrode layer 400 to reduce the intrusion of water and oxygen, making it difficult for the first electrode 410 to be oxidized, thereby ensuring the conductivity of the first electrode 410. When the display panel 10 includes the protective layer 800, when etching the via hole in the first sub-layer 610, the protective layer 800 needs to be etched so that the first electrode 410 is exposed from the protective layer 800 and can contact the conductive part 510, thereby ensuring the electrical connection between the first electrode 410 and the conductive part 510.

[0097] Optionally, the protective layer 800 includes a light extraction material having a high refractive index, thereby effectively improving the coupling efficiency of the protective layer 800 and further improving the luminous efficiency of the display panel 10 .

[0098] Please also read Figure 7 , Figure 7 is a partial cross-sectional view of a display panel in yet another embodiment.

[0099] like Figure 7As shown, in some optional embodiments, the isolation portion 210 includes an isolation structure 900, which is located on the substrate 100 and encloses a plurality of isolation openings 930, the isolation structure 900 includes a first layer 910, each light-emitting unit 310 and each first electrode 410 is located in the isolation opening 930, and the first electrode 410 is electrically connected to the first layer 910.

[0100] In these optional embodiments, the isolation structure 900 is disposed on the substrate 100 and encloses a plurality of isolation openings 930 to separate the light-emitting layer 300 to form mutually disconnected light-emitting units 310, thereby reducing the crosstalk of carriers in the light-emitting layer 300 and improving the display effect of the display panel 10. In addition, the light-emitting unit 310 does not need to be prepared using a precision mask, which can reduce the development and use of precision masks and reduce the preparation cost. The mutually spaced first electrodes 410 are electrically connected through the first layer 910 to form a whole-surface electrode, and the first electrode 410 is easier to overlap with the first layer 910, thereby improving the overlap efficiency of the first electrode 410.

[0101] Optionally, a plurality of mutually spaced first electrodes 410 are all connected to the conductive portion 510 via holes, and each first electrode 410 is electrically connected to the conductive portion 510 , so that each first electrode 410 is interconnected to form a whole-surface electrode.

[0102] In some optional embodiments, the isolation structure 900 further includes a second layer 920 located on a side of the first layer 910 facing away from the substrate 100 , and an orthographic projection of the first layer 910 on the substrate 100 is located within an orthographic projection of the second layer 920 on the substrate 100 .

[0103] In these optional embodiments, the first layer 910 and the second layer 920 are arranged to form an isolation structure 900, the orthographic projection of the first layer 910 arranged close to the substrate 100 on the substrate 100 is located within the orthographic projection of the second layer 920 on the substrate 100, the area of ​​the second layer 920 is larger than the area of ​​the first layer 910, and the second layer 920 covers the surface of the first layer 910 close to the second layer 920, and at this time, the first layer 910 is recessed relative to the second layer 920 in a direction away from the isolation opening 220. When preparing the light-emitting layer 300, the light-emitting layer 300 has a large drop at the edge of the isolation structure 900, and the first layer 910 is recessed relative to the second layer 920, and the light-emitting layer 300 is difficult to connect at the edge of the isolation structure 900, so it breaks, and the light-emitting layer 300 breaks to form mutually disconnected light-emitting units 310.

[0104] In some optional embodiments, the first layer 910 and the second layer 920 are both made of metal materials, and the materials of the first layer 910 and the second layer 920 are different.

[0105] In these optional embodiments, when both the first layer 910 and the second layer 920 are made of metal materials, the first layer 910 may be wet-etched with an etching solution, and the etching rate of the second layer 920 may be set to be lower than the etching rate of the first layer 910 by setting the etching solution. Since the etching rate of the first layer 910 is relatively high, when the etching solution is used for wet etching, even if the second layer 920 is etched to a certain extent, the first layer 910 is etched faster, so that the first layer 910 is set concave relative to the second layer 920.

[0106] Optionally, the second layer 920 includes a non-metallic material, for example, the second layer 920 is a non-metallic conductive material or an insulating material. When the second layer 920 is a non-metallic material, the second layer 920 is difficult to be etched during the wet etching of the first layer 910 using an etching solution, so that the first layer 910 is more easily concavely arranged relative to the second layer 920.

[0107] Optionally, the cross-sectional shape of the first layer 910 along the thickness direction includes a trapezoid. When the cross-sectional shape of the first layer 910 is a trapezoid, on the one hand, it can stably support the second layer 920, and on the other hand, the first layer 910 is equivalent to the concave setting of the second layer 920, which facilitates the disconnection of the light-emitting layer 300 at the isolation structure 900.

[0108] Please also read Figure 8 and Fig. 9 , Figure 8 is a partial cross-sectional view of a display panel in yet another embodiment; Fig. 9 is a partial cross-sectional view of a display panel in yet another embodiment.

[0109] like Figure 8 and Fig. 9 As shown, optionally, the isolation portion 210 includes a pixel defining portion 930, and the isolation opening 220 includes a pixel opening 940 enclosed by the pixel defining portion 930, the pixel defining portion 930 defines a light-emitting area of ​​the display panel 10, and the pixel opening 940 is used to set the light-emitting unit 310 to realize the light emission of the display panel 10.

[0110] Optionally, the isolation portion 210 also includes an isolation structure 900, which is located on the substrate 100. The isolation portion 210 includes both a pixel defining portion 930 and an isolation structure 900, so that the light-emitting layer 300 is isolated by the isolation structure 900 and falls into the pixel opening 940, thereby realizing the light-emitting display of the display panel 10, and the light-emitting units 310 are spaced apart from each other to reduce crosstalk of carriers in the light-emitting layer 300.

[0111] Optionally, the orthographic projection of the isolation structure 900 on the substrate 100 and the orthographic projection of the conductive part 510 on the substrate 100 are at least partially offset, so that the portion where the conductive part 510 is offset from the isolation structure 900 can be connected to the first electrode 410 through a via, so that the first electrode 410 is electrically connected to the conductive part 510, thereby reducing the overall resistance of the first electrode 410 and the conductive part 510, thereby reducing the power consumption of the first electrode 410 and improving the display effect of the display panel 10.

[0112] like Figure 8 As shown, in some optional embodiments, the isolation structure 900 is located on a side of the pixel defining portion 930 facing away from the substrate 100 .

[0113] In these optional embodiments, the isolation structure 900 is disposed on the pixel defining portion 930, and the isolation structure 900 has a large height difference equivalent to the pixel opening 220. When preparing the light-emitting layer 300, due to the large height difference, the light-emitting layer 300 is more easily disconnected at the isolation structure 900, thereby reducing the difficulty of preparing the light-emitting layer 300.

[0114] Optionally, the orthographic projection of the conductive portion 510 on the substrate 100 is located within the orthographic projection of the pixel defining portion 930 on the substrate 100, that is, the conductive portion 510 is arranged in the area where the pixel defining portion 930 is located, thereby reducing the influence of the conductive portion 510 on the light emission of the light-emitting unit 310 and ensuring the display effect of the display panel 10.

[0115] like Fig. 9 As shown, in some optional embodiments, a clearance opening 950 is opened on the pixel defining portion 930 , and the isolation structure 900 is located in the clearance opening 950 .

[0116] In these optional embodiments, the isolation structure 900 is disposed in a relief opening 950 on the pixel defining portion 930. During the preparation process, the preparation step of the isolation structure 900 is performed before the preparation of the pixel electrode 960. That is, after the isolation structure 900 is prepared on the substrate 100, the pixel electrode 960 is prepared on the substrate 100 to reduce the impact of the preparation of the isolation structure 900 on the pixel electrode 960 and ensure that the pixel electrode 960 is not damaged.

[0117] Optionally, the light-emitting unit 310 and the isolation structure 900 are spaced apart, and the light-emitting layer 300 and the isolation structure 900 are spaced apart, that is, the light-emitting units 310 are spaced apart from each other, thereby reducing the crosstalk of carriers between the light-emitting units 310 and improving the cross-color problem of the light-emitting units 310.

[0118] Optionally, the display panel 10 further includes a pixel electrode 960 exposed by the pixel opening 940, and one of the pixel electrode 960 and the first electrode 410 serves as an anode of the light-emitting unit 310, and the other serves as a cathode of the light-emitting unit 310. In the embodiment of the present application, the pixel electrode 960 is used as the anode of the light-emitting unit 310, and the first electrode 410 is used as the cathode of the light-emitting unit 310 for illustration.

[0119] Optionally, the light emitting layer 300 includes an electron injection layer (EIL), an electron transport layer (ETL), a light emitting material layer, a hole injection layer (HIL) and a hole transport layer (HTL).

[0120] The structural design in this embodiment can be applied to other display panels 10 , and the specific selection can be made according to actual conditions, and this application does not impose any specific restrictions on it.

[0121] The embodiment of the second aspect of the present application also provides a display device, including the display panel 10 of any of the above-mentioned first aspect embodiments. Since the display device provided by the embodiment of the second aspect of the present application includes the display panel 10 of any of the above-mentioned first aspect embodiments, the display device provided by the embodiment of the second aspect of the present application has the beneficial effects of the display panel 10 of any of the above-mentioned first aspect embodiments, which will not be repeated here.

[0122] The display device in the embodiments of the present application includes but is not limited to mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, consoles, and other devices with display functions.

[0123] The third aspect of the present application also provides a method for preparing a display panel 10. The display panel 10 may be any of the display panels 10 provided in the first aspect of the present application. Figures 1 to 9 , and see Fig.10 , Fig.10 1 is a schematic flow chart of a method for preparing a display panel provided in an embodiment of the present application. The preparation method comprises:

[0124] Step S01: preparing an isolation layer on a substrate, wherein the isolation layer comprises an isolation portion and an isolation opening formed by the isolation portion.

[0125] Step S02: preparing a light-emitting layer on the side of the isolation layer facing away from the substrate, wherein the light-emitting layer includes light-emitting units located in each isolation opening.

[0126] Step S03: preparing a first electrode layer on the side of the light-emitting layer facing away from the substrate, and the orthographic projection of the light-emitting unit on the substrate is located within the orthographic projection of the first electrode on the substrate.

[0127] Step S04: preparing an encapsulation layer on a side of the first electrode layer facing away from the substrate, wherein the encapsulation layer includes a first sub-layer.

[0128] Step S05: preparing a conductive layer on a side of the first sub-layer facing away from the substrate, wherein the conductive layer comprises a conductive portion connected to the first electrode via.

[0129] Step S06: preparing an anti-oxidation layer on the side of the conductive layer facing away from the substrate, the anti-oxidation layer comprising an anti-oxidation portion, and the orthographic projection of the conductive portion on the substrate is located within the orthographic projection of the anti-oxidation portion on the substrate.

[0130] According to the preparation method of the third aspect of the present application, an isolation layer 200 is prepared on the substrate 100 through step S01, and the isolation opening 220 formed by the isolation portion 210 is used to set the light-emitting unit 310 to realize the light-emitting display of the display panel 10. Then, the light-emitting layer 300 is prepared through step S02. The first electrode layer 400 is prepared through step S03, and the orthographic projection of the light-emitting unit 310 on the substrate 100 is located within the orthographic projection of the first electrode 410 on the substrate 100, that is, the first electrode 410 covers the light-emitting unit 310 to serve as the electrode of the light-emitting unit 310. The encapsulation layer 600 is prepared through step S04, and the encapsulation layer 600 is arranged on the side of the first electrode layer 400 away from the substrate 100 to encapsulate the first electrode layer 400 and the light-emitting layer 300, reduce the possibility of water and oxygen intrusion, and improve the service life of the display panel 10. The conductive layer 500 is prepared by step S05. The conductive layer 500 is located on the side of the first sub-layer 610 away from the substrate 100 and includes a conductive part 510. The conductive part 510 is electrically connected to the first electrode 410 through a via hole, so that the first electrode 410 and the conductive part 510 are arranged in parallel, reducing the overall resistance of the first electrode 410 and the conductive part 510, thereby reducing the power consumption of the first electrode 410 and improving the display effect of the display panel 10. Finally, the anti-oxidation layer 700 is prepared by step S06, and the orthographic projection of the conductive part 510 on the substrate 100 is located within the orthographic projection of the anti-oxidation part 710 on the substrate 100. That is, the anti-oxidation part 710 of the anti-oxidation layer 700 covers at least part of the surface of the conductive part 510, so as to improve the problem that water and oxygen enter the first electrode layer 400 during the process of etching the via hole in the first sub-layer 610, thereby oxidizing and corroding the first electrode 410 and reducing the conductivity of the first electrode 410, and ensure the electrical connection between the first electrode 410 and the conductive part 510.

[0131] In some optional embodiments, after the step of preparing the first electrode layer 400 on the side of the light-emitting layer 300 facing away from the substrate 100, the method further includes:

[0132] A first sub-material layer is prepared on a side of the first electrode layer 400 facing away from the substrate 100 , and the first sub-material layer is patterned to obtain a first sub-layer 610 , wherein the first sub-layer 610 includes vias.

[0133] A conductive layer 500 is prepared on a side of the first sub-layer 610 facing away from the substrate 100 . The conductive layer 500 includes a conductive portion 510 . The conductive portion 510 is connected to the first electrode 410 through a via hole.

[0134] In these optional embodiments, after preparing the first sub-layer 610, the first sub-layer 610 is etched to obtain a via hole, and then the conductive layer 500 is prepared, and the conductive portion 510 of the conductive layer 500 can be electrically connected to the first electrode 410 through the via hole. The first sub-layer 610 is arranged between the conductive layer 500 and the first electrode layer 400, so as to facilitate patterning of the conductive layer 500 and reduce the influence of etching of the conductive layer 500 on the first electrode layer 400.

[0135] In some optional embodiments, after the step of preparing the conductive layer 500 on the side of the first sub-layer 610 facing away from the substrate 100, the method further includes:

[0136] An anti-oxidation material layer is prepared on the side of the conductive layer 500 facing away from the substrate 100, and the anti-oxidation material layer and the conductive layer 500 are etched in sequence using the same mask to form a conductive portion 510 and an anti-oxidation layer 700, wherein the anti-oxidation layer 700 includes an anti-oxidation portion 710, and the orthographic projection of the conductive portion 510 on the substrate 100 coincides with the orthographic projection of the anti-oxidation portion 710 on the substrate 100.

[0137] In these optional embodiments, after the conductive layer 500 and the anti-oxidation layer 700 are prepared, the anti-oxidation material layer is first etched, and then the conductive layer 500 is etched, and the etching is performed sequentially, but the same mask is used to reduce the number of mask development times and reduce the preparation cost.

[0138] According to the embodiments described above, these embodiments do not describe all the details in detail, nor do they limit the invention to the specific embodiments described. Obviously, many modifications and changes can be made based on the above description. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present application, so that those skilled in the art can make good use of the present application and the modifications based on the present application. The present application is limited only by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized in that: The display panel comprises: substrate; An isolation layer, located on the substrate, the isolation layer comprising an isolation portion and an isolation opening formed by the isolation portion; a light-emitting layer, the light-emitting layer comprising light-emitting units located in each of the isolation openings; A first electrode layer is located on a side of the light-emitting layer away from the substrate, the first electrode layer comprises a first electrode, and the orthographic projection of the light-emitting unit on the substrate is located within the orthographic projection of the first electrode on the substrate; an encapsulation layer, located on a side of the first electrode layer away from the substrate, the encapsulation layer comprising a first sublayer; A conductive layer, located on a side of the first sub-layer away from the substrate, the conductive layer comprising a conductive portion, and the conductive portion is connected to the first electrode via; The anti-oxidation layer is located on a side of the conductive layer away from the substrate, the anti-oxidation layer comprises an anti-oxidation portion, and the orthographic projection of the conductive portion on the substrate is located within the orthographic projection of the anti-oxidation portion on the substrate.

2. The display panel according to claim 1, characterized in that: The orthographic projection of the conductive portion on the substrate is at least partially located within the orthographic projection of the isolation portion on the substrate; Preferably, the conductive part is in a mesh shape; Preferably, the conductive part includes a metal conductive material or a transparent conductive material.

3. The display panel according to claim 1, characterized in that: The encapsulation layer further comprises: a second sublayer, located on a side of the first sublayer away from the substrate, wherein the conductive layer is located between the first sublayer and the second sublayer; Preferably, the first sublayer comprises an inorganic material; Preferably, the second sublayer comprises an organic material; Preferably, the encapsulation layer further comprises a third sublayer, and the third sublayer is located on a side of the second sublayer away from the substrate; Preferably, the third sublayer comprises an inorganic material.

4. The display panel according to claim 1, characterized in that: The anti-oxidation layer comprises an inorganic material or an organic material; Preferably, the anti-oxidation layer is made of the same material as the first sub-layer; Preferably, the orthographic projection of the conductive portion on the substrate coincides with the orthographic projection of the anti-oxidation portion on the substrate; Preferably, the conductive portion includes a side surface facing the isolation opening, and the anti-oxidation portion is arranged to cover at least a portion of the side surface of the conductive portion.

5. The display panel according to claim 1, characterized in that: The display panel further includes: A protective layer, located between the first electrode layer and the encapsulation layer, wherein the protective layer covers at least a portion of the first electrode layer; Preferably, the protective layer comprises a light extraction material.

6. The display panel according to claim 1, characterized in that: The isolation portion includes an isolation structure, the isolation structure is located on the substrate and encloses a plurality of isolation openings, the isolation structure includes a first layer, each of the light-emitting units and each of the first electrodes is located in the isolation opening, and the first electrode is electrically connected to the first layer; Preferably, a plurality of mutually spaced first electrodes are all connected to the conductive portion via holes; Preferably, the isolation structure further comprises a second layer located on a side of the first layer away from the substrate, and an orthographic projection of the first layer on the substrate is located within an orthographic projection of the second layer on the substrate.

7. The display panel according to claim 1, characterized in that: The isolation portion includes a pixel defining portion, and the isolation opening includes a pixel opening formed by being surrounded by the pixel defining portion; Preferably, the isolation portion further comprises an isolation structure, and the isolation structure is located on the substrate; Preferably, the orthographic projection of the isolation structure on the substrate and the orthographic projection of the conductive portion on the substrate are at least partially staggered; Preferably, the isolation structure is located on a side of the pixel defining portion away from the substrate; Preferably, the orthographic projection of the conductive portion on the substrate is located within the orthographic projection of the pixel defining portion on the substrate; Preferably, a clearance opening is provided on the pixel defining portion, and the isolation structure is located in the clearance opening.

8. A display device, characterized in that: A display panel comprising any one of claims 1 to 7.

9. A method for preparing a display panel, characterized in that: include: preparing an isolation layer on a substrate, wherein the isolation layer comprises an isolation portion and an isolation opening formed by the isolation portion; A light-emitting layer is prepared on a side of the isolation layer away from the substrate, wherein the light-emitting layer includes light-emitting units located in each of the isolation openings; A first electrode layer is prepared on a side of the light-emitting layer away from the substrate, and the orthographic projection of the light-emitting unit on the substrate is located within the orthographic projection of the first electrode on the substrate; Preparing an encapsulation layer on a side of the first electrode layer facing away from the substrate, wherein the encapsulation layer comprises a first sublayer; A conductive layer is prepared on a side of the first sublayer facing away from the substrate, wherein the conductive layer includes a conductive portion, and the conductive portion is connected to the first electrode via hole; An anti-oxidation layer is prepared on a side of the conductive layer away from the substrate, wherein the anti-oxidation layer comprises an anti-oxidation portion, and an orthographic projection of the conductive portion on the substrate is located within an orthographic projection of the anti-oxidation portion on the substrate; Preferably, after the step of preparing a first electrode layer on a side of the light-emitting layer facing away from the substrate, the method further comprises: Preparing a first sub-material layer on a side of the first electrode layer facing away from the substrate, and patterning the first sub-material layer to obtain a first sub-layer, wherein the first sub-layer includes a via hole; A conductive layer is prepared on a side of the first sub-layer facing away from the substrate, wherein the conductive layer includes the conductive portion, and the conductive portion is connected to the first electrode through the via hole.

10. The preparation method according to claim 9, characterized in that: After the step of preparing the conductive layer on the side of the first sub-layer facing away from the substrate, the method further comprises: An anti-oxidation material layer is prepared on the side of the conductive layer away from the substrate, and the anti-oxidation material layer and the conductive layer are sequentially etched using the same mask to form the conductive portion and the anti-oxidation layer, wherein the anti-oxidation layer includes the anti-oxidation portion, and the orthographic projection of the conductive portion on the substrate coincides with the orthographic projection of the anti-oxidation portion on the substrate.

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