Display panel, preparation method thereof and display device

Abstract

The invention provides a display panel, a preparation method thereof and a display device. The display panel comprises a substrate, a display function layer and an isolation structure, wherein the display function layer and the isolation structure are located on the substrate. The display function layer comprises a plurality of light-emitting devices, and each light-emitting device comprises a first electrode, a light-emitting function layer and a second electrode which are sequentially stacked on the substrate. The isolation structure is provided with a plurality of isolation openings for limiting the light-emitting device, the light-emitting function layer and the second electrode are located in the corresponding isolation openings, the isolation structure comprises a supporting part and a crown part located on the side, away from the substrate, of the supporting part, and the orthographic projection of the supporting part on the substrate is located in the orthographic projection of the crown part on the substrate. The side wall of the supporting part comprises a first side surface, the second electrode is connected with at least part of the first side surface, and the undulation degree of the first side surface is not larger than 0.1 micron. In the display panel, the flatness of the first side surface is high, and the impedance at the joint of the second electrode and the supporting part can be reduced.

Description

Technical Field

[0001] The present specification relates to the field of display technology, and in particular, to a display panel and a method for manufacturing the same, and a display device. Background Art

[0002] Organic Light-Emitting Diode (OLED) is an organic thin film electroluminescent device. It has attracted great attention and is widely used in electronic display products due to its advantages such as simple preparation process, low cost, low power consumption, high brightness, wide viewing angle, high contrast and flexible display.

[0003] However, current electronic display products are limited by their own structural design, making it difficult to further improve the display effect of OLED while further increasing the pixel density PPI. Summary of the invention

[0004] The first aspect of the present disclosure provides a display panel, which includes a substrate and a display function layer and an isolation structure located on the substrate. The display function layer includes a plurality of light-emitting devices, and the light-emitting devices include a first electrode, a light-emitting function layer, and a second electrode stacked in sequence on the substrate. The isolation structure has a plurality of isolation openings for limiting the light-emitting devices respectively, and the light-emitting function layer and the second electrode are located in the corresponding isolation openings. The isolation structure includes a support portion and a crown portion located on the side of the support portion away from the substrate, and the orthographic projection of the support portion on the substrate is located within the orthographic projection of the crown portion on the substrate. The side wall of the support portion includes a first side surface, the second electrode is connected to at least a portion of the first side surface, and the undulation of the first side surface is not greater than 0.1 μm.

[0005] In the above scheme, the first side surface has high flatness, which is conducive to the deposition of the second electrode (such as evaporation) to ensure the uniformity of the thickness of the portion of the second electrode located on the first side surface, thereby ensuring the electrical connection effect between the second electrode and the support part to reduce the impedance at the connection.

[0006] In a specific embodiment of the first aspect of the present disclosure, the entire side wall of the support portion is the first side surface. In this way, not only can the impedance between the second electrode and the support portion be reduced, but also when other film layers (such as the first encapsulation layer described below) are subsequently prepared, the thickness uniformity of these film layers deposited on the side wall of the support portion can be improved to improve the quality of these film layers.

[0007] In another specific embodiment of the first aspect of the present disclosure, the side wall of the support portion further includes a second side surface, the first side surface is located between the second side surface and the substrate, and the first side surface and the second side surface have the same undulation.

[0008] In another specific embodiment of the first aspect of the present disclosure, the side wall of the support portion further includes a second side surface, the first side surface is located between the second side surface and the substrate, and the undulation of the first side surface is smaller than the undulation of the second side surface. In this way, the first side surface can use a process such as wet etching to ensure the undulation of the first side surface, and a process such as dry etching can be used to ensure the etching speed when preparing the second side surface, thereby reducing the impedance between the support portion and the second electrode while taking into account the preparation process speed of the isolation structure.

[0009] In a specific embodiment of the first aspect of the present disclosure, the orthographic projection of the surface of the support portion facing away from the substrate on the substrate is located within the orthographic projection of the surface of the support portion facing the substrate on the substrate, and the acute angle between the surface defined by the edge of the first side surface facing the substrate and the edge facing away from the substrate and the surface where the substrate is located is not less than a first preset angle.

[0010] In the above solution, the connection area between the second electrode and the support portion is increased by increasing the inclination of the first side surface, thereby further reducing the impedance at the connection between the second electrode and the support portion.

[0011] Optionally, the first preset angle is no greater than 50 degrees and no greater than 80 degrees.

[0012] Optionally, the acute angle is not less than 50 degrees and not more than 80 degrees.

[0013] Optionally, the acute angle is not less than 60 degrees and not more than 80 degrees.

[0014] In a specific embodiment of the first aspect of the present disclosure, the entire side wall of the support portion is a first side surface, and between adjacent isolation openings, along a direction perpendicular to the surface where the substrate is located, a cross-section of the first side surface is a straight line segment.

[0015] In a specific embodiment of the first aspect of the present disclosure, the side wall of the support portion includes a second side surface, the first side surface is located between the second side surface and the substrate, and between adjacent isolation openings, along a direction perpendicular to the surface where the substrate is located, the cross section of the first side surface is a first straight line segment, the cross section of the second side surface is a second straight line segment, and the angle between the second straight line segment and the surface where the substrate is located is smaller than the angle between the first straight line segment and the surface where the substrate is located. In this way, the inclination of the second side surface relative to the first side surface is smaller, thereby increasing the edge spacing at the junction of the crown portion and the support portion, so as to increase the isolation effect of the isolation structure.

[0016] In another specific embodiment of the first aspect of the present disclosure, the side wall of the support portion includes a second side surface, the first side surface is located between the second side surface and the substrate, and between adjacent isolation openings, along a direction perpendicular to the surface where the substrate is located, the cross section of the first side surface is a straight line segment, the cross section of the second side surface is a curved line segment, the second side surface is a concave surface, and the angle between the second straight line segment and the surface where the substrate is located is smaller than the angle between the first straight line segment and the surface where the substrate is located. In this way, not only can the isolation effect of the isolation structure be increased, but also the deposition of subsequent film layers (such as the first encapsulation layer described below) at the second side surface is facilitated to ensure the film formation quality of these film layers.

[0017] In a specific embodiment of the first aspect of the present disclosure, the supporting portion includes a first sub-support portion and a second sub-support portion, the first sub-support portion is located between the second sub-support portion and the substrate, the side surface of the first sub-support portion is the first side surface, and the side surface of the second sub-support portion is the second side surface.

[0018] Optionally, the orthographic projection of the second sub-support portion on the substrate is located within the orthographic projection of the first sub-support portion on the substrate.

[0019] Optionally, the first sub-support portion and the second sub-support portion are made of different materials.

[0020] Optionally, an etching rate of the material of the first sub-support portion is lower than an etching rate of the material of the second sub-support portion.

[0021] In a specific embodiment of the first aspect of the present disclosure, the isolation structure also includes an auxiliary supporting portion, which is located on the side of the supporting portion facing away from the crown portion and is a conductive structure. The orthographic projection of the auxiliary supporting portion on the substrate is located within the orthographic projection of the crown portion on the substrate, and the orthographic projection of the end of the supporting portion facing the substrate on the substrate is located within the orthographic projection of the auxiliary supporting portion on the substrate. The second electrode is connected to a portion of the surface of the auxiliary supporting portion facing away from the substrate that is not covered by the supporting portion.

[0022] In the above solution, compared with the side wall of the support part, the second electrode is easier to deposit on the upper surface of the second auxiliary support part and has a greater thickness, so that the impedance of the connection between the second electrode and the isolation structure can be reduced.

[0023] In a specific embodiment of the first aspect of the present disclosure, the display panel may further include a pixel defining layer, the pixel defining layer is located between the isolation structure and the substrate, and defines pixel openings corresponding to the isolation openings, respectively, and the pixel openings are connected to the corresponding isolation openings. When the pixel defining layer is provided, the size of the first electrode can be increased to ensure the light emitting area of ​​the light emitting device while avoiding the first electrode from being connected to the isolation structure.

[0024] Optionally, the pixel defining layer covers an edge of the first electrode.

[0025] Optionally, the pixel defining layer is an inorganic layer. In this way, the pollution caused by the setting of an organic material (particles easily invade the light-emitting device) can be avoided, and the inorganic layer has a smaller thickness than the organic layer, so the overall height of the isolation structure can be reduced to increase the viewing angle of the display panel. In addition, this solution is also conducive to the lightweight design of the display panel.

[0026] In a specific embodiment of the first aspect of the present disclosure, the display panel may further include a first encapsulation layer, the first encapsulation layer being located on a side of the isolation structure and the light-emitting device away from the substrate. The first encapsulation layer covers the isolation structure and the light-emitting device and is attached to an end of a side wall of the isolation structure away from the substrate.

[0027] In a specific embodiment of the first aspect of the present disclosure, the first encapsulation layer includes a plurality of encapsulation units corresponding to the isolation openings respectively, and at each isolation opening, the encapsulation unit covers a portion of the sidewalls of the light-emitting device and the isolation structure not covered by the second electrode.

[0028] During the preparation of the display panel, the light-emitting devices are prepared in batches. In the above scheme, the packaging unit can also be prepared separately along with different batches of light-emitting devices. In this way, in the process of preparing the next batch of light-emitting devices, the packaging unit can protect the light-emitting devices prepared in the previous batch.

[0029] Optionally, the display panel further includes a second encapsulation layer and a third encapsulation layer covering the isolation structure and the first encapsulation layer, and the second encapsulation layer is located between the first encapsulation layer and the third encapsulation layer.

[0030] Optionally, the first encapsulation layer and the third encapsulation layer are inorganic layers, and the second encapsulation layer is an organic layer and a planar layer.

[0031] The second aspect of the present disclosure provides a display panel, which includes a substrate and a display function layer and an isolation structure located on the substrate. The display function layer includes a plurality of light-emitting devices, the light-emitting devices include a first electrode, a light-emitting function layer, and a second electrode stacked in sequence on the substrate, the isolation structure has a plurality of isolation openings for limiting the light-emitting devices respectively, the light-emitting function layer and the second electrode are located in the corresponding isolation openings, the isolation structure includes a support portion and a crown portion located on the side of the support portion away from the substrate, and the orthographic projection of the support portion on the substrate is located within the orthographic projection of the crown portion on the substrate. The orthographic projection of the surface of the support portion away from the substrate on the substrate is located within the orthographic projection of the surface of the support portion facing the substrate on the substrate, the side wall of the support portion includes a first side surface, the second electrode is connected to at least part of the first side surface, and the surface defined by the edge of the first side surface facing the substrate and the edge away from the substrate intersects with the surface where the substrate is located at an acute angle not less than a first preset angle.

[0032] In the above solution, the connection area between the second electrode and the support portion is increased by increasing the inclination of the first side surface, thereby further reducing the impedance at the connection between the second electrode and the support portion.

[0033] In a specific embodiment of the second aspect of the present disclosure, the first preset angle is not less than 50 degrees and not more than 80 degrees.

[0034] In a specific embodiment of the second aspect of the present disclosure, the entire side wall of the support portion is a first side surface, and between adjacent isolation openings, along a direction perpendicular to the surface where the substrate is located, a cross-section of the first side surface is a straight line segment.

[0035] In a specific embodiment of the second aspect of the present disclosure, the side wall of the support portion includes a second side surface, the first side surface is located between the second side surface and the substrate, and between adjacent isolation openings, along a direction perpendicular to the surface of the substrate, the cross-section of the first side surface is a first straight line segment, and the cross-section of the second side surface is a second straight line segment.

[0036] In another specific embodiment of the second aspect of the present disclosure, the side wall of the support portion includes a second side surface, the first side surface is located between the second side surface and the substrate, and between adjacent isolation openings, along a direction perpendicular to the surface where the substrate is located, the cross-section of the first side surface is a straight line segment, the cross-section of the second side surface is a curved segment, the second side surface is a concave surface, and the angle between the second straight line segment and the surface where the substrate is located is smaller than the angle between the first straight line segment and the surface where the substrate is located.

[0037] In a specific embodiment of the second aspect of the present disclosure, the side wall of the support portion includes a second side surface, the first side surface is located between the second side surface and the substrate, the support portion includes a first sub-support portion and a second sub-support portion, the first sub-support portion is located between the second sub-support portion and the substrate, the side surface of the first sub-support portion is the first side surface, and the side surface of the second sub-support portion is the second side surface.

[0038] Optionally, the orthographic projection of the second sub-support portion on the substrate is located within the orthographic projection of the first sub-support portion on the substrate.

[0039] In a specific embodiment of the second aspect of the present disclosure, the undulation of the first side surface is no greater than 0.1 μm.

[0040] A third aspect of the present disclosure provides a display device, which includes the display panel in the first aspect or the second aspect.

[0041] The fourth aspect of the present disclosure provides a method for preparing a display panel, the method comprising: providing a substrate and forming an array-arranged first electrode on the substrate; sequentially depositing a first conductive material layer and a second conductive material layer on the substrate formed with the first electrode, and patterning the first conductive material layer and the second conductive material layer so that the first conductive material layer is formed into a support portion, and the second conductive material layer is formed into a crown portion, the orthographic projection of the support portion on the substrate is located within the orthographic projection of the crown portion on the substrate, and the support portion and the crown portion jointly limit a plurality of isolation openings; forming a light-emitting functional material layer and a second electrode material layer in the isolation openings, respectively, and patterning the light-emitting functional material layer and the second electrode material layer so that the portion of the light-emitting functional material layer located in the isolation openings is formed into a light-emitting functional layer, and the portion of the second electrode material layer located in the isolation openings is formed into a second electrode. In the preparation method, the side wall of the support portion includes a first side surface, the second electrode is connected to at least a portion of the first side surface, and in the process of patterning the first conductive material layer, the first side surface is formed by wet etching.

[0042] In the display panel obtained based on the above-mentioned preparation method, the first side surface has a high flatness, which is conducive to the deposition of the second electrode (for example, evaporation) to ensure the uniformity of the thickness of the portion of the second electrode located on the first side surface, thereby ensuring the electrical connection effect between the second electrode and the supporting part to reduce the impedance at the connection.

[0043] In a specific embodiment of the fourth aspect of the present disclosure, the entire side wall of the support portion is formed as the first side surface.

[0044] In another specific embodiment of the fourth aspect of the present disclosure, the side wall of the support portion also includes a second side surface, the first side surface is formed between the second side surface and the substrate, and the second side surface is formed by dry etching so that the undulation of the first side surface is smaller than the undulation of the second side surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 A schematic diagram of a planar structure of a display panel provided in one embodiment of the present disclosure.

[0046] Figure 2 for Figure 1 An enlarged view of area S1 of the display panel is shown.

[0047] Figure 3 for Figure 2 The display panel is shown in a cross-sectional view along MN.

[0048] Figure 4 for Figure 3 An enlarged view of a portion of the display panel is shown.

[0049] Figure 5A schematic diagram of the technical principles of a display panel provided in an embodiment of the present disclosure.

[0050] Figure 6 A cross-sectional view of a partial area of ​​a display panel provided in one embodiment of the present disclosure under a certain design.

[0051] Figure 7 A cross-sectional view of a partial area of ​​a display panel provided in another design according to an embodiment of the present disclosure.

[0052] Figure 8 A cross-sectional view of a partial area of ​​a display panel provided in another design according to an embodiment of the present disclosure.

[0053] Fig. 9 A cross-sectional view of a partial area of ​​a display panel provided in another design according to an embodiment of the present disclosure.

[0054] Fig.10 A cross-sectional view of a partial area of ​​a display panel provided by an embodiment of the present disclosure.

[0055] Fig.11 A cross-sectional view of a partial area of ​​a display panel provided by an embodiment of the present disclosure.

[0056] FIG. 12A to FIG. 12D For forming a method according to an embodiment of the present disclosure Fig.11 A process diagram of a method for preparing a display panel is shown.

[0057] Fig.13 A schematic diagram of the positional relationship between a partial film layer of a display panel and an evaporation source during evaporation provided by an embodiment of the present disclosure.

[0058] Description of reference numerals:

[0059] 10-display panel; 11-display area; 12-frame area; 100-substrate; 200-light-emitting device; 210-first electrode; 220-light-emitting functional layer; 221-first functional layer; 222-light-emitting layer; 223-second functional layer; 230-second electrode; 300-isolation structure; 301-isolation opening; 302-pixel opening; 310-supporting part; 311-first sub-supporting part; 312-second sub-supporting part; 311a-first side surface; 312a-second side surface; 320-crown; 330-pixel defining layer; 340-auxiliary supporting part; 400-packaging structure; 410-first packaging layer; 420-second packaging layer; 430-third packaging layer; 500-photoresist pattern. DETAILED DESCRIPTION

[0060] The following will be combined with the drawings in the embodiments of this specification to clearly and completely describe the technical solutions in the embodiments of this specification. Obviously, the described embodiments are only part of the embodiments of this specification, not all of the embodiments. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this specification.

[0061] In display products, some functional film layers in the light-emitting device are formed by evaporation, and there are multiple functional film layers in each light-emitting device, and the materials of some functional film layers (such as the light-emitting layer described below) in the light-emitting devices that emit different light are different. Therefore, when evaporating these functional film layers through a mask plate (such as a fine mask plate), multiple alignments are required. In order to solve the position offset problem caused by the alignment accuracy error, sufficient space (and safety margin related to the alignment error) needs to be reserved between different light-emitting devices to ensure that the position of the actual light-emitting area of ​​the light-emitting device can have a certain overlap rate with the designed position (design area), which is equivalent to compressing the design area of ​​the light-emitting area of ​​the light-emitting device, which not only limits the light-emitting area of ​​the light-emitting device, but also prevents the arrangement density of the light-emitting device from being further increased, thereby making it difficult to further improve the PPI (pixel density) of the display panel.

[0062] In the present disclosure, an isolation structure is provided at the gap between the light-emitting devices to separate the functional film layers of the adjacent light-emitting devices. Thus, in the evaporation process of the functional film layer, it is only necessary to perform evaporation on the entire surface of the display panel without using a mask plate to prepare the functional film layer of each light-emitting device separately. The process does not need to consider the alignment accuracy during evaporation, so that the gap between the light-emitting devices can be designed to be smaller in size to increase the PPI (the principle can be referred to in the following and FIG. 12A to FIG. 12D (See also the relevant description in the relevant embodiments).

[0063] It should be noted that when a light-emitting device is prepared through an isolation structure, the cathode of the light-emitting device (the second electrode described below) needs to be overlapped on the isolation structure. Therefore, the undulation of the side wall of the isolation structure will affect the formation quality of the cathode on the side wall. If the undulation of the area used to connect the cathode in the side wall of the isolation structure is large, then the film formation quality of the second electrode in this area is poor, such as uneven thickness, thereby affecting the overlap quality of the second electrode and the isolation structure, which will result in a larger impedance at the overlap position of the two, thereby limiting the further improvement of the display function of the display panel.

[0064] Patents PCT / CN2023 / 134518, 202310773656.6, 202310707209.0, 202311346196.5, 202310692671.8, and 202311499823.9 record relevant technical solutions for isolation structures, and their contents are incorporated into this application by reference for reference.

[0065] The embodiments of the present disclosure provide a display panel and a method for manufacturing the same, and a display device to at least solve the above technical problems. The display panel includes a substrate, a display function layer and an isolation structure located on the substrate. The display function layer includes a plurality of light-emitting devices, and the light-emitting devices include a first electrode, a light-emitting function layer and a second electrode stacked in sequence on the substrate. The isolation structure has a plurality of isolation openings for limiting the light-emitting devices respectively, and the light-emitting function layer and the second electrode are located in the corresponding isolation openings. The isolation structure includes a support portion and a crown portion located on the side of the support portion away from the substrate, and the orthographic projection of the support portion on the substrate is located within the orthographic projection of the crown portion on the substrate. The side wall of the support portion includes a first side surface, the second electrode is connected to at least part of the first side surface, and the undulation of the first side surface is not greater than 0.1 μm. In the display panel, the flatness of the first side surface is high, which is conducive to the deposition (e.g., evaporation) of the second electrode to ensure the uniformity of the thickness of the portion of the second electrode located on the first side surface, thereby ensuring the electrical connection effect between the second electrode and the support portion to reduce the impedance of the connection.

[0066] The structure of the display panel in at least one embodiment of the present disclosure is described in detail below with reference to the accompanying drawings. In addition, in these drawings, a spatial rectangular coordinate system is established with the substrate as a reference to more intuitively present the positional relationship of the relevant structures in the display panel, and in the spatial rectangular coordinate system, the X-axis and the Y-axis are parallel to the surface where the substrate is located, and the Z-axis is perpendicular to the surface where the substrate is located.

[0067] like Figures 1 to 4 As shown, the plane area of ​​the display panel 10 can be divided into a display area 11 and a border area 12 surrounding the display area 11. Sub-pixels (which may be called sub-pixels, etc.) may be arranged in the display area 11, such as R, G, and B sub-pixels. The physical structure of the sub-pixel may be a light-emitting device. Adjacent sub-pixels with different colors of emitted light constitute a pixel (which may be called a pixel unit, a large pixel, etc.). The arrangement density of the pixel in the display area 11 represents the pixel density PPI. It should be noted that in some embodiments of the present disclosure, part of the wiring in the border area 12 may be arranged in the display area 11, so that the border area 12 may be designed as a single-sided border.

[0068] The physical structure of the display panel 10 may include a substrate 100 and a display function layer and an isolation structure 300 located on the substrate 100 , wherein the display function layer includes a plurality of light emitting devices 200 .

[0069] The light-emitting device 200 includes a first electrode 210, a light-emitting functional layer 220, and a second electrode 230 sequentially stacked on a substrate 100, and the light-emitting functional layer 220 and the second electrode 230 of each light-emitting device 200 are located in the corresponding isolation opening 301. For example, the light-emitting functional layer 220 and the second electrode 230 are formed by evaporation based on the isolation structure 300, in which case, the orthographic projection of the edge of the crown 320 on the substrate 100 is located within the orthographic projection of the light-emitting functional layer 220 and the second electrode 230 on the substrate 100.

[0070] For example, the light-emitting functional layer 220 may also include a first functional layer 221, a light-emitting layer 222, and a second functional layer 223 sequentially stacked on the first electrode 210. The first functional layer 221 may include a hole injection layer, a hole transport layer, an electron blocking layer, etc. The second functional layer 223 may include an electron injection layer, an electron transport layer, a hole blocking layer, etc. It should be noted that since carriers (holes, electrons) mainly crosstalk between adjacent light-emitting devices 200 through the first functional layer 221, the isolation structure 300 needs to be set so that the first functional layers 221 of each light-emitting device 200 are electrically disconnected from each other.

[0071] For example, in at least one embodiment of the present disclosure, the first electrode 210 may be provided as an anode, and the second electrode 230 may be provided as a cathode.

[0072] The isolation structure 300 is located on the substrate 100 and defines a plurality of isolation openings 301, that is, the planar shape of the isolation structure 300 is a grid pattern, and the isolation openings 301 are meshes of the grid pattern. The isolation structure 300 includes a support portion 310 facing the substrate 100 and a crown portion 320 on the side away from the substrate 100, and the orthographic projection of the support portion 310 on the substrate 100 is located within the orthographic projection of the crown portion 320 on the substrate 100, that is, the isolation structure 300 (at least when only including the support portion 310 and the crown portion 320) is generally wide at the top and narrow at the bottom, so that when a part of the film layer (such as the light-emitting functional layer described below) in the light-emitting device 200 is evaporated, it is disconnected at the edge of the isolation structure 300 to reduce the risk of crosstalk between adjacent light-emitting devices.

[0073] The side wall of the support portion 310 includes a first side surface 311a, the second electrode 230 is connected to at least a portion of the first side surface 311a, and the undulation of the first side surface 311a is not greater than 0.1 μm. For example, the first side surface 311a is connected to the bottom surface of the support portion 310 facing the substrate 100. In this way, the first side surface 311a has a high flatness, which is conducive to the deposition (e.g., evaporation) of the second electrode 230 to ensure the uniformity of the thickness of the portion of the second electrode 230 located on the first side surface 311a, thereby ensuring the electrical connection effect between the second electrode 230 and the support portion 310 to reduce the impedance of the connection.

[0074] It should be noted that “undulation” refers to the size (such as the maximum diameter) of the protrusions and / or depressions on the surface, and when the undulation is close to zero, it can be considered that there are no protrusions or depressions on the surface.

[0075] In at least one embodiment of the present disclosure, the support portion 310 is a conductive structure, and the edge of the second electrode 230 extends to the side wall of the support portion 310. In this way, the support portion 310 and the second electrode 230 can together constitute a common electrode, and the support portion 310 can have a larger thickness, thereby reducing the impedance of the common electrode.

[0076] In some embodiments of the present disclosure, the isolation structure 300 is wide at the top and narrow at the bottom, and the first functional layer 221 will be disconnected at the edge of the crown 320 during the evaporation process, that is, the first functional layer 221 will not be connected to the conductive part (such as the support part 310) of the isolation structure 300 to cause crosstalk between adjacent light-emitting devices 200. In the above scheme, different evaporation angles can be used to evaporate the light-emitting functional layer 220 and the second electrode 230. In this process, the isolation structure 300 limits the evaporation range of the evaporated light-emitting functional layer 220 and the second electrode 230, so that the edges of the evaporated light-emitting functional layer 220 and the second electrode 230 are at different positions, so that the isolation structure 300 can separate the light-emitting functional layer 220 while still being connected to the second electrode 230.

[0077] In other embodiments of the present disclosure, after the isolation structure 300 is set, the first functional layer 221 may also contact the isolation structure 300. In this case, its carriers will also be preferentially introduced into the adjacent isolation structure 300 (the support portion 310 included therein) through the isolation structure 300 (for example, its support portion 310). Because the isolation structure 300 and the second electrode 230 share a common voltage (low voltage), the first functional layer 221 will rarely or will not enter the adjacent light-emitting device 200. Therefore, in this case, it can also be regarded as the first functional layers 221 of each light-emitting device 200 being electrically disconnected from each other.

[0078] In at least one embodiment of the present disclosure, the substrate 100 may include a substrate and a driving circuit layer located on the substrate, the driving circuit layer includes a plurality of pixel driving circuits located in the display area, and the display function layer is located on the driving circuit layer. For example, the pixel driving circuit may include a plurality of transistors TFT, capacitors, etc., for example, formed in various forms such as 2T1C (i.e., 2 transistors (TFT) and 1 capacitor (C)), 3T1C or 7T1C. The pixel driving circuit is connected to the light-emitting device 200 to control the switching state and light brightness of the light-emitting device 200.

[0079] In the embodiment of the present disclosure, a portion of the side wall of the support portion 310 can be set as the first side surface 311a, or the entire side wall can be set as the first side surface 311a. The specific design can be based on actual process requirements and is not limited to this.

[0080] For example, in some embodiments of the present disclosure, Figure 3 As shown, the entire sidewall of the support portion 310 is the first side surface 311a. In this way, not only can the impedance between the second electrode 230 and the support portion 310 be reduced, but also when other film layers (such as the first encapsulation layer 410 described below) are subsequently prepared, the thickness uniformity of these film layers deposited on the sidewall of the support portion 310 can be improved to improve the quality of these film layers.

[0081] For example, in some other embodiments of the present disclosure, Figure 4 As shown, the side wall of the support portion 310 further includes a second side surface 312a, the first side surface 311a is located between the second side surface 312a and the substrate 100, and the first side surface 311a and the second side surface 312a have the same undulation. The boundary between the first side surface 311a and the second side surface 312a corresponds to Figure 4 In this embodiment, the entire support portion 310 may be prepared by a wet etching process, so that the entire sidewall of the support portion 310 has a small undulation for connecting the second electrode 230 .

[0082] For example, in some other embodiments of the present disclosure, Figure 4The structure shown in the figure is modified, the side wall of the support part 310 also includes a second side surface 312a, the first side surface 311a is located between the second side surface 312a and the substrate 100, and the undulation of the first side surface 311a is smaller than the undulation of the second side surface 312a. In this way, the first side surface 311a can use a process such as wet etching to ensure the undulation of the first side surface 311a, and can use a process such as dry etching to ensure the etching speed when preparing the second side surface 312a, thereby reducing the impedance between the support part 310 and the second electrode 230 while taking into account the preparation process speed of the isolation structure 300. In these embodiments, the boundary between the first side surface 311a and the second side surface 312a corresponds to Figure 4 The dotted line in .

[0083] It should be noted that the impedance at the connection between the support portion 310 and the second electrode 230 is not only related to the film forming quality of the second electrode 230 on the support portion 310, but also related to the connection area between the support portion 310 and the second electrode 230. The larger the connection area between the support portion 310 and the second electrode 230, the smaller the impedance at the connection between the support portion 310 and the second electrode 230.

[0084] In at least one embodiment of the present disclosure, the orthographic projection of the surface of the support portion 310 facing away from the substrate 100 on the substrate 100 is located within the orthographic projection of the surface of the support portion 310 facing the substrate 100 on the substrate 100, and the acute angle of the surface defined by the edge of the first side surface 311a facing the substrate 100 and the edge facing away from the substrate 100 intersecting with the surface where the substrate 100 is located is not less than the first preset angle. In this way, by increasing the inclination of the first side surface 311a, the connection area between the second electrode 230 and the support portion 310 is increased, thereby further reducing the impedance at the connection between the second electrode 230 and the support portion 310.

[0085] The first preset angle may be the inclination angle of the side wall of the support portion in the current display panel, for example, the first preset angle is not greater than 50 degrees and not greater than 80 degrees. For example, further, the surface defined by the edge of the first side surface 311a facing the substrate 100 and the edge away from the substrate 100 intersects with the surface where the substrate 100 is located at an acute angle of not less than 50 degrees and not greater than 80 degrees. For example, further, the surface defined by the edge of the first side surface 311a facing the substrate 100 and the edge away from the substrate 100 intersects with the surface where the substrate 100 is located at an acute angle of not less than 60 degrees and not greater than 80 degrees.

[0086] The principle of the technical solution in the above embodiment can be found in Figure 5, the first side surface 311a of the support portion 310 is changed from the dotted line position to the solid line position. In the dotted line position, the first side surface 311a has a small inclination (the acute angle intersecting with the substrate surface P2 is small, and the slope of the first side surface 311a is gentle), and in the solid line position, the first side surface 311a has a large inclination (the acute angle intersecting with the substrate surface P2 is large, and the slope of the first side surface 311a is steep). Due to the shielding of the crown 320, the material diffusion boundary when evaporating the second electrode 230 is P1. When in the dotted line position, the distance O1O2 from the intersection O1 of P1 and the first side surface 311a to the bottom O1 of the support portion 310 is the climbing height of the second electrode 230 on the side wall of the support portion 310 (indicating the connection area); correspondingly, when in the solid line position, the distance O1O3 from the intersection O3 of P1 and the first side surface 311a to the bottom O1 of the support portion 310 is the climbing height of the second electrode 230 on the side wall of the support portion 310. The distance O1O3 is greater than the distance O1O2, that is, after switching from the dotted line position to the solid line position, the climbing height of the second electrode 230 on the support portion 310 increases, that is, the contact area between the second electrode 230 and the support portion 310 increases.

[0087] In some embodiments of the present disclosure, it can be referred to again Figure 3 The entire side wall of the supporting portion 310 is a first side surface 311a. Between adjacent isolation openings 301, along a direction perpendicular to the surface of the substrate 100, a cross-section of the first side surface 311a is a straight line segment, that is, without considering the planar shape of the isolation opening, the first side surface 311a is roughly an inclined plane.

[0088] In other embodiments of the present disclosure, Figure 6 or Figure 7 As shown, the side wall of the support portion 310 includes a second side surface 312a, and the first side surface 311a is located between the second side surface 312a and the substrate 100. Between adjacent isolation openings 301, along the direction perpendicular to the surface where the substrate 100 is located, the cross section of the first side surface 311a is a first straight line segment, and the cross section of the second side surface 312a is a second straight line segment, and the angle between the second straight line segment and the surface where the substrate 100 is located is smaller than the angle between the first straight line segment and the surface where the substrate 100 is located. In this way, the inclination of the second side surface 312a relative to the first side surface 311a is smaller, thereby increasing the edge spacing at the junction of the crown portion 320 and the support portion 310, so as to increase the isolation effect of the isolation structure 300.

[0089] For example, the first side surface 311a and the second side surface 312a may be as follows. Figure 6, that is, the orthographic projection of one end of the second side surface 312a facing the substrate 100 on the substrate 100 coincides with the orthographic projection of one end of the first side surface 311a facing away from the substrate 100 on the substrate 100; or, the first side surface 311a and the second side surface 312a may be as shown. Figure 7 The structure shown forms a step shape, that is, the orthographic projection of one end of the second side surface 312 a facing the substrate 100 on the substrate 100 is located within the orthographic projection of one end of the first side surface 311 a facing away from the substrate 100 on the substrate 100 .

[0090] In some further embodiments of the present disclosure, Figure 8 As shown, the side wall of the support portion 310 includes a second side surface 312a, the first side surface 311a is located between the second side surface 312a and the substrate 100, and between adjacent isolation openings 301, along the direction perpendicular to the surface where the substrate 100 is located, the cross section of the first side surface 311a is a straight line segment, the cross section of the second side surface 312a is a curved line segment, the second side surface 312a is a concave surface, and the angle between the second straight line segment and the surface where the substrate 100 is located is smaller than the angle between the first straight line segment and the surface where the substrate 100 is located. In this way, not only can the isolation effect of the isolation structure 300 be increased, but also the deposition of subsequent film layers (such as the first encapsulation layer 410 described below) at the second side surface 312a is facilitated to ensure the film formation quality of these film layers.

[0091] For example, in the case where the cross section of the second side surface 312a is a curved segment, the first side surface 311a and the second side surface 312a may be as follows: Figure 8 , that is, the orthographic projection of one end of the second side surface 312a facing the substrate 100 on the substrate 100 coincides with the orthographic projection of one end of the first side surface 311a facing away from the substrate 100 on the substrate 100; or Figure 8 The structure shown is modified so that the first side surface 311a and the second side surface 312a can form a stepped shape, that is, the orthographic projection of the end of the second side surface 312a facing the substrate 100 on the substrate 100 is located within the orthographic projection of the end of the first side surface 311a facing away from the substrate 100 on the substrate 100.

[0092] In at least one embodiment of the present disclosure, when the side wall of the support portion 310 includes a first side surface 311a and a second side surface 312a, the first side surface 311a and the second side surface 312a may be respectively formed of different film layers to facilitate adjusting the inclination angle and shape of the first side surface 311a and the second side surface 312a. Figures 6 to 8As shown, the support portion 310 includes a first sub-support portion 311 and a second sub-support portion 312. The first sub-support portion 311 is located between the second sub-support portion 312 and the substrate 100. The side surface of the first sub-support portion 311 is a first side surface 311a, and the side surface of the second sub-support portion 312 is a second side surface 312a.

[0093] In at least one embodiment of the present disclosure, Figures 6 to 8 As shown, the orthographic projection of the second sub-support portion 312 on the substrate 100 is located within the orthographic projection of the first sub-support portion 311 on the substrate 100 , so that the entire side wall of the support portion 310 is roughly inclined to ensure the partition effect of the support portion 310 .

[0094] In at least one embodiment of the present disclosure, the first sub-support portion 311 and the second sub-support portion 312 may be made of different materials to facilitate the preparation of first side surfaces 311 a and second side surfaces 312 a with different inclinations and / or shapes, respectively.

[0095] In at least one embodiment of the present disclosure, the etching rate of the material of the first sub-support portion 311 is lower than that of the material of the second sub-support portion 312 , so that the size of the first sub-support portion 311 is smaller than that of the second sub-support portion 312 .

[0096] In at least one embodiment of the present disclosure, Fig. 9 As shown, the isolation structure 300 further includes an auxiliary support portion 340, which is located on the side of the support portion 310 away from the crown portion 320 and is a conductive structure. The orthographic projection of the auxiliary support portion 340 on the substrate 100 is located within the orthographic projection of the crown portion 320 on the substrate 100, and the orthographic projection of the end of the support portion 310 facing the substrate 100 on the substrate 100 is located within the orthographic projection of the auxiliary support portion 340 on the substrate 100. The second electrode 230 is connected to a portion of the surface of the auxiliary support portion 340 away from the substrate 100 that is not covered by the support portion 310. Compared with the side wall of the support portion 310, the second electrode 230 is easier to deposit on the upper surface of the second auxiliary support portion 340 and has a greater thickness, so that the impedance at the connection between the second electrode 230 and the isolation structure 300 can be reduced.

[0097] In the embodiment of the present disclosure, the etching resistance of the auxiliary support portion 340 may be greater than the etching resistance of the support portion 310, and less than the etching resistance of the crown portion 320. In this way, in the etching process, a Fig. 9 An isolation structure 300 is shown.

[0098] For example, the materials of the crown portion 320 , the support portion 310 , and the auxiliary support portion 340 may include titanium, aluminum, and molybdenum in sequence, and the corrosion resistance (eg, relative to acid liquid) of titanium, aluminum, and molybdenum decreases in sequence.

[0099] In some embodiments of the present disclosure, Fig. 9 As shown, the display panel may further include a pixel defining layer 330, the pixel defining layer 330 is located between the isolation structure 300 and the substrate 100, and defines pixel openings 302 corresponding to the isolation openings 301, respectively, and the pixel openings 302 are connected to the corresponding isolation openings 301. For example, the pixel defining layer 330 covers the edge of the first electrode 210. In the case of providing the pixel defining layer 330, the size of the first electrode 210 can be increased to ensure the light emitting area of ​​the light emitting device 200, while avoiding the first electrode 210 from being connected to the isolation structure 300.

[0100] For example, the pixel defining layer 330 is an inorganic layer. In this way, the pollution caused by the organic material (particles easily invade the light emitting device 200) can be avoided, and the inorganic layer has a smaller thickness than the organic layer, so the overall height of the isolation structure 300 can be reduced to increase the viewing angle of the display panel. In addition, this solution is also conducive to the thin and light design of the display panel.

[0101] In a specific embodiment of the first aspect of the present disclosure, Fig.10 As shown, the display panel may further include a first encapsulation layer 410, which is located on a side of the isolation structure 300 and the light emitting device 200 away from the substrate 100. The first encapsulation layer 410 covers the isolation structure 300 and the light emitting device 200 and is attached to an end of the sidewall of the isolation structure 300 away from the substrate 100.

[0102] In a specific embodiment of the first aspect of the present disclosure, Fig.10 As shown, the first encapsulation layer 410 includes a plurality of encapsulation units 411 corresponding to the isolation openings 301, respectively. At each isolation opening 301, the encapsulation unit 411 covers the portion of the sidewall of the light-emitting device 200 and the isolation structure 300 that is not covered by the second electrode 230. In the process of manufacturing the display panel, the light-emitting devices 200 are manufactured in batches. In the above scheme, the encapsulation units 411 can also be manufactured separately following different batches of light-emitting devices 200. In this way, in the process of preparing the next batch of light-emitting devices 200, the encapsulation units 411 can protect the light-emitting devices 200 manufactured in the previous batch.

[0103] In at least one embodiment of the present disclosure, Fig.10As shown, the display panel may further include a second encapsulation layer 420 and a third encapsulation layer 430 covering the isolation structure 300 and the first encapsulation layer 410, wherein the second encapsulation layer 420 is located between the first encapsulation layer 410 and the third encapsulation layer 430, and the first encapsulation layer 410, the second encapsulation layer 420 and the third encapsulation layer 430 constitute the encapsulation structure 400. For example, the first encapsulation layer 410 and the third encapsulation layer 430 are inorganic layers, and the inorganic layers have high density to isolate water and oxygen, and the second encapsulation layer 420 is an organic layer, so as to have a large thickness to flatten the surface of the display panel.

[0104] At least one embodiment of the present disclosure provides a display panel, which includes a substrate, a display function layer and an isolation structure located on the substrate. The display function layer includes a plurality of light-emitting devices, the light-emitting devices include a first electrode, a light-emitting function layer and a second electrode stacked in sequence on the substrate, the isolation structure has a plurality of isolation openings for limiting the light-emitting devices respectively, the light-emitting function layer and the second electrode are located in the corresponding isolation openings, the isolation structure includes a support portion and a crown portion located on the side of the support portion away from the substrate, and the orthographic projection of the support portion on the substrate is located within the orthographic projection of the crown portion on the substrate. The orthographic projection of the surface of the support portion away from the substrate on the substrate is located within the orthographic projection of the surface of the support portion facing the substrate on the substrate, the side wall of the support portion includes a first side surface, the second electrode is connected to at least part of the first side surface, and the surface defined by the edge of the first side surface facing the substrate and the edge away from the substrate intersects with the surface where the substrate is located at an acute angle not less than a first preset angle. In the display panel, by increasing the inclination of the first side surface, the connection area between the second electrode and the support portion is increased, thereby further reducing the impedance at the connection between the second electrode and the support portion. The specific structural design of the display panel, the technical problems solved and the corresponding technical effects, further designs, etc. can be found in the relevant descriptions in the aforementioned embodiments and will not be elaborated here.

[0105] At least one embodiment of the present disclosure provides a method for preparing a display panel, the method comprising: providing a substrate and forming an array-arranged first electrode on the substrate; sequentially depositing a first conductive material layer and a second conductive material layer on the substrate on which the first electrode is formed, and patterning the first conductive material layer and the second conductive material layer so that the first conductive material layer is formed into a support portion, and the second conductive material layer is formed into a crown portion, the orthographic projection of the support portion on the substrate is located within the orthographic projection of the crown portion on the substrate, and the support portion and the crown portion jointly limit a plurality of isolation openings; forming a light-emitting functional material layer and a second electrode material layer in the isolation openings, respectively, and patterning the light-emitting functional material layer and the second electrode material layer so that the portion of the light-emitting functional material layer located in the isolation openings is formed into a light-emitting functional layer, and the portion of the second electrode material layer located in the isolation openings is formed into a second electrode. In the preparation method, the side wall of the support portion includes a first side surface, the second electrode is connected to at least a portion of the first side surface, and in the process of patterning the first conductive material layer, the first side surface is formed by wet etching. In the display panel obtained based on the above-mentioned preparation method, the flatness of the first side surface is high, which is conducive to the deposition (e.g., evaporation) of the second electrode to ensure the uniformity of the thickness of the portion of the second electrode located on the first side surface, thereby ensuring the electrical connection effect between the second electrode and the support portion to reduce the impedance of the connection. The specific structure of the display panel obtained by the preparation method can be referred to the relevant description in the above-mentioned embodiment, which will not be repeated here.

[0106] In the method for manufacturing a display panel provided in some embodiments of the present disclosure, the entire side wall of the support portion is formed as the first side surface, that is, the entire support portion can be formed by a wet etching process. The specific structure of the display panel obtained by the manufacturing method can refer to the relevant description in the aforementioned embodiment, which will not be repeated here.

[0107] In the manufacturing method of the display panel provided in some other embodiments of the present disclosure, the side wall of the support portion further includes a second side surface, the first side surface is formed between the second side surface and the substrate, and the second side surface is formed by dry etching so that the undulation of the first side surface is smaller than that of the second side surface. The specific structure of the display panel obtained by the manufacturing method can refer to the relevant description in the aforementioned embodiment, which will not be repeated here.

[0108] Next, combine FIG. 12A to FIG. 12D , to prepare Figure 3 Taking the display panel shown as an example, the manufacturing process of the display panel is exemplarily described.

[0109] like Fig. 12AAs shown, a substrate 100 is provided and an array-arranged first electrode 210 is formed on the substrate 100; an insulating material film layer (for example, an inorganic material film layer) is deposited on the substrate 100 on which the first electrode 210 is formed; conductive layers for forming a support portion 310 and a crown portion 320 are respectively deposited on the display panel, and these conductive layers are subjected to a composition process to obtain the support portion 310 and the crown portion 320, the support portion 310 and the crown portion 320 are used to constitute an isolation structure 300, and the isolation structure 300 defines a plurality of isolation openings 301; a composition process is performed on the insulating material film layer to form a pixel defining layer 330 (the plane shape is a grid shape), the pixel defining layer 330 covers the gaps between adjacent first electrodes 210, and defines a plurality of pixel openings 302, so that the plane shape of the pixel defining layer 330 is a grid shape.

[0110] In the above process, wet etching may be used to pattern the conductive layer, so that at least one conductive layer is formed into the support portion 310 .

[0111] In the above process, when the isolation structure is prepared first and then the pixel defining layer is prepared, the insulating material film layer used to form the pixel defining layer can protect the first electrode 210. It should be noted that in the embodiment of the present disclosure, there is no restriction on the preparation order of the isolation structure 300 and the pixel defining layer 330, which can be selected according to actual process conditions.

[0112] In an embodiment of the present disclosure, the patterning process may be a photolithography patterning process, which may include, for example, coating a photoresist on a structure layer to be patterned, exposing the photoresist using a mask, developing the exposed photoresist to obtain a photoresist pattern, etching the structure layer using the photoresist pattern (optionally wet etching or dry etching), and then optionally removing the photoresist pattern. It should be noted that, in the case where the material of the structure layer (such as the photoresist pattern 500 described below) includes photoresist, the structure layer may be directly exposed through a mask to form a desired pattern.

[0113] like Fig. 12B As shown, the light-emitting functional layer 220 and the second electrode 230 are evaporated on the substrate 100 to form a light-emitting device 200 in each isolation opening 301 of the isolation structure 300. The evaporation in the process does not use a mask plate, so the evaporated material is also deposited on the crown 320; then, the first packaging material film layer 410a is deposited to cover the light-emitting device 200 and the isolation structure 300. For example, the light-emitting layer in the evaporated light-emitting functional layer 220 can emit red light, that is, at this stage, a light-emitting device 200 emitting red light is formed in each isolation opening 301 of the isolation structure 300.

[0114] like Fig. 12CAs shown, a photoresist is formed (e.g., coated) on a substrate 100 formed with a first packaging material film layer 410a, and then a composition process is performed to form a photoresist pattern 500, which only covers a portion of the isolation opening 301 of the isolation structure 300 (used to accommodate a light-emitting device emitting red light R in the final product).

[0115] like Fig.12D As shown, the surface of the display panel is etched using the photoresist pattern 500 as a mask to remove the first packaging material film layer 410a, the second electrode 230 and the light-emitting functional layer 220 that are not covered by the photoresist pattern 500; then the remaining photoresist pattern 500 is removed. In this way, at the isolation opening 301 originally covered with the photoresist pattern 500, the second electrode 230 and the light-emitting functional layer 220 and the first electrode 210 form the light-emitting device 200, and the remaining part of the first packaging material film layer 410a forms a packaging unit covering the light-emitting device 200.

[0116] Repeat the above FIG. 12A to FIG. 12D Steps are performed to form a light emitting device 200 emitting green light G and a light emitting device 200 emitting blue light B in other isolation openings 301, and to form Fig.11 The display panel shown.

[0117] like Fig.13 As shown, when evaporating the light-emitting functional layer (for example, the first functional layer), if the evaporation source P moves to face the isolation structure 300, the boundary of the evaporation angle corresponds to the line L1 and the line L2 on the display panel, that is, the area before the line L1 and the line L2 will not be evaporated in this case, while the area on the side of the line L1 and the line L2 away from the isolation structure 300 will be evaporated no matter where the evaporation source P moves. That is, starting from the line L1 or the line L2 area, the closer to the isolation structure 300, the smaller the thickness of the light-emitting functional layer.

[0118] At least one embodiment of the present disclosure provides a display device, which may be the display panel in the above embodiment. For example, the display device may include a touch structure, an optical film (such as a microlens, a polarizer), a cover plate, etc., which are arranged on the light-emitting side of the display panel.

[0119] For example, the display device may be any product or component having a display function, such as a television, a digital camera, a mobile phone, a watch, a tablet computer, a notebook computer, a navigator, or the like.

[0120] At least one embodiment of the present disclosure provides a display device, which may be the display panel in the above embodiment. For example, the display device may include a touch structure, an optical film (such as a microlens, a polarizer), a cover plate, etc., which are arranged on the light-emitting side of the display panel.

[0121] For example, the display device may be any product or component having a display function, such as a television, a digital camera, a mobile phone, a watch, a tablet computer, a notebook computer, a navigator, or the like.

[0122] The above description is only a preferred embodiment of this specification and is not intended to limit this specification. Any modifications, equivalent substitutions, etc. made within the spirit and principles of this specification should be included in the protection scope of this specification.

Claims

1. A display panel, characterized in that: include: substrate; A display function layer is located on the substrate and includes a plurality of light-emitting devices, wherein the light-emitting devices include a first electrode, a light-emitting function layer, and a second electrode sequentially stacked on the substrate; an isolation structure, located on the substrate and having a plurality of isolation openings for respectively limiting the light-emitting devices, wherein the light-emitting functional layer and the second electrode are located in the corresponding isolation openings, the isolation structure comprising a support portion and a crown portion located on a side of the support portion away from the substrate, and an orthographic projection of the support portion on the substrate is located within an orthographic projection of the crown portion on the substrate; The side wall of the support portion includes a first side surface, the second electrode is connected to at least a portion of the first side surface, and the undulation of the first side surface is no greater than 0.1 μm.

2. The display panel according to claim 1, characterized in that: The entire side wall of the support portion is the first side surface.

3. The display panel according to claim 1, characterized in that: The side wall of the support portion further includes a second side surface, the first side surface is located between the second side surface and the substrate, and The first side surface and the second side surface have the same undulation; or The undulation of the first side surface is smaller than that of the second side surface.

4. The display panel according to claim 1, characterized in that: The orthographic projection of the surface of the support portion facing away from the substrate on the substrate is located within the orthographic projection of the surface of the support portion facing the substrate on the substrate, and The acute angle between a surface defined by an edge of the first side surface facing the substrate and an edge away from the substrate and a surface where the substrate is located is not less than a first preset angle; Preferably, the first preset angle is not greater than 50 degrees and not greater than 80 degrees; Further preferably, the acute angle is not less than 50 degrees and not more than 80 degrees; Still further preferably, the acute angle is not less than 60 degrees and not more than 80 degrees.

5. The display panel according to claim 4, characterized in that: The entire side wall of the support portion is the first side surface, and Between adjacent isolation openings, along a direction perpendicular to the surface where the substrate is located, a cross section of the first side surface is a straight line segment.

6. The display panel according to claim 4, characterized in that: The side wall of the support portion includes a second side surface, the first side surface is located between the second side surface and the substrate, and Between adjacent isolation openings, along a direction perpendicular to the surface where the substrate is located, a cross section of the first side surface is a first straight line segment, a cross section of the second side surface is a second straight line segment, and an angle between the second straight line segment and the surface where the substrate is located is smaller than an angle between the first straight line segment and the surface where the substrate is located; or Between adjacent isolation openings, along a direction perpendicular to the surface where the substrate is located, the cross-section of the first side surface is a straight line segment, the cross-section of the second side surface is a curved line segment, the second side surface is a concave surface, and the angle between the second straight line segment and the surface where the substrate is located is smaller than the angle between the first straight line segment and the surface where the substrate is located.

7. The display panel according to claim 6, characterized in that: The supporting portion includes a first sub-supporting portion and a second sub-supporting portion, the first sub-supporting portion is located between the second sub-supporting portion and the substrate, and The side surface of the first sub-support portion is the first side surface, and the side surface of the second sub-support portion is the second side surface; Preferably, the orthographic projection of the second sub-support portion on the substrate is located within the orthographic projection of the first sub-support portion on the substrate; Preferably, the first sub-support portion and the second sub-support portion are made of different materials; Further preferably, an etching rate of the material of the first sub-support portion is lower than an etching rate of the material of the second sub-support portion.

8. The display panel according to any one of claims 1 to 7, characterized in that: The isolation structure further comprises an auxiliary support portion, wherein the auxiliary support portion is located on a side of the support portion away from the crown portion and is a conductive structure. The orthographic projection of the auxiliary support portion on the base plate is located within the orthographic projection of the crown portion on the base plate, and the orthographic projection of the end of the support portion facing the base plate on the base plate is located within the orthographic projection of the auxiliary support portion on the base plate, and The second electrode is connected to a portion of a surface of the auxiliary supporting portion facing away from the substrate and not covered by the supporting portion.

9. The display panel according to any one of claims 1 to 7, characterized in that: Also included is a pixel defining layer, wherein the pixel defining layer is located between the isolation structure and the substrate and defines pixel openings corresponding to the isolation openings, respectively, and the pixel openings are connected to the corresponding isolation openings; Preferably, the pixel defining layer covers the edge of the first electrode; Preferably, the pixel defining layer is an inorganic layer.

10. The display panel according to any one of claims 1 to 7, characterized in that: Also includes: A first encapsulation layer is located on a side of the isolation structure and the light-emitting device away from the substrate; The first encapsulation layer covers the isolation structure and the light-emitting device and is attached to an end of the side wall of the isolation structure away from the substrate.

11. The display panel according to claim 10, characterized in that: The first packaging layer includes a plurality of packaging units corresponding to the isolation openings respectively, and At each of the isolation openings, the encapsulation unit covers the light-emitting device and the portion of the side wall of the isolation structure that is not covered by the second electrode; Preferably, the display panel further comprises a second encapsulation layer and a third encapsulation layer covering the isolation structure and the first encapsulation layer, and the second encapsulation layer is located between the first encapsulation layer and the third encapsulation layer; Preferably, the first encapsulation layer and the third encapsulation layer are inorganic layers, and the second encapsulation layer is an organic layer and a planar layer.

12. A display panel, characterized in that: include: substrate; A display function layer is located on the substrate and includes a plurality of light-emitting devices, wherein the light-emitting devices include a first electrode, a light-emitting function layer, and a second electrode sequentially stacked on the substrate; an isolation structure, located on the substrate and having a plurality of isolation openings for respectively limiting the light-emitting devices, wherein the light-emitting functional layer and the second electrode are located in the corresponding isolation openings, the isolation structure comprising a support portion and a crown portion located on a side of the support portion away from the substrate, and an orthographic projection of the support portion on the substrate is located within an orthographic projection of the crown portion on the substrate; wherein an orthographic projection of a surface of the support portion facing away from the substrate on the substrate is located within an orthographic projection of a surface of the support portion facing the substrate on the substrate, and The side wall of the supporting portion includes a first side surface, the second electrode is connected to at least a portion of the first side surface, and a surface defined by an edge of the first side surface facing the substrate and an edge away from the substrate intersects a surface where the substrate is located at an acute angle that is not less than a first preset angle.

13. The display panel according to claim 12, characterized in that: The first preset angle is not greater than 50 degrees and not greater than 80 degrees; Further preferably, the acute angle is not less than 50 degrees and not more than 80 degrees; Still further preferably, the acute angle is not less than 60 degrees and not more than 80 degrees.

14. The display panel according to claim 12 or 13, characterized in that: The entire side wall of the support portion is the first side surface, and Between adjacent isolation openings, along a direction perpendicular to the surface where the substrate is located, a cross section of the first side surface is a straight line segment.

15. The display panel according to claim 12 or 13, characterized in that: The side wall of the support portion includes a second side surface, the first side surface is located between the second side surface and the substrate, and Between adjacent isolation openings, along a direction perpendicular to the surface where the substrate is located, a cross section of the first side surface is a first straight line segment, a cross section of the second side surface is a second straight line segment, and an angle between the second straight line segment and the surface where the substrate is located is smaller than an angle between the first straight line segment and the surface where the substrate is located; or Between adjacent isolation openings, along a direction perpendicular to the surface where the substrate is located, the cross-section of the first side surface is a straight line segment, the cross-section of the second side surface is a curved line segment, the second side surface is a concave surface, and the angle between the second straight line segment and the surface where the substrate is located is smaller than the angle between the first straight line segment and the surface where the substrate is located.

16. The display panel according to claim 15, characterized in that: The supporting portion includes a first sub-supporting portion and a second sub-supporting portion, the first sub-supporting portion is located between the second sub-supporting portion and the substrate, and The side surface of the first sub-support portion is the first side surface, and the side surface of the second sub-support portion is the second side surface; Preferably, the orthographic projection of the second sub-support portion on the substrate is located within the orthographic projection of the first sub-support portion on the substrate.

17. The display panel according to claim 12 or 13, characterized in that: The first side surface has an undulation of no more than 0.1 μm.

18. A display device, characterized in that: A display panel comprising any one of claims 1 to 17.

19. A method for preparing a display panel, characterized in that: include: Providing a substrate and forming an array of first electrodes on the substrate; Depositing a first conductive material layer and a second conductive material layer in sequence on the substrate formed with the first electrode, and performing a patterning process on the first conductive material layer and the second conductive material layer, so that the first conductive material layer is formed into a support portion, and the second conductive material layer is formed into a crown portion, the orthographic projection of the support portion on the substrate is located within the orthographic projection of the crown portion on the substrate, and the support portion and the crown portion jointly limit a plurality of isolation openings; Forming a light-emitting functional material layer and a second electrode material layer in the isolation opening respectively, and performing a patterning process on the light-emitting functional material layer and the second electrode material layer so that a portion of the light-emitting functional material layer located in the isolation opening is formed as a light-emitting functional layer, and a portion of the second electrode material layer located in the isolation opening is formed as a second electrode; The side wall of the support portion includes a first side surface, the second electrode is connected to at least a portion of the first side surface, and the first side surface is formed by wet etching during the patterning process of the first conductive material layer.

20. The preparation method according to claim 19, characterized in that: The entire side wall of the support portion is formed as the first side surface; or The side wall of the support portion further includes a second side surface, the first side surface is formed between the second side surface and the substrate, and the second side surface is formed by dry etching so that the undulation of the first side surface is smaller than that of the second side surface.

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