Display device and method of manufacturing same

Abstract

The invention relates to a display device and a method of manufacturing the same. The display device according to an embodiment includes: a substrate including a first light emitting area, a second light emitting area, and a third light emitting area; the transistor is arranged on the substrate; a light emitting element connected to the transistor; and an encapsulation layer disposed on the light emitting element, a partition wall disposed on the encapsulation layer; and a scattering layer disposed on the partition wall, in which the scattering layer is continuously disposed on the entire surface of the substrate, and a concentration of a scatterer included in a scattering layer overlapping the first light emitting region, a concentration of a scatterer included in a scattering layer overlapping the second light emitting region, and a concentration of a scatterer included in a scattering layer overlapping the third light emitting region are different.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0097755 filed in the Korean Intellectual Property Office on July 26, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present disclosure relates to a display device and a method of manufacturing the display device. Background Art

[0004] A display device is a device that visually displays an image.

[0005] The display device is sometimes used as a display unit for a small product such as a mobile phone or a display unit for a large product such as a television.

[0006] The display device may include a plurality of pixels that receive electrical signals and emit light in order to display an image to the outside.

[0007] For a full-color display device, multiple pixels may emit light of different colors.

[0008] To this end, at least some of the plurality of pixels may have a color filter unit that converts a color.

[0009] Light of a first wavelength band generated from some pixels may be converted into light of a second wavelength band while passing through corresponding color filter units, and the light of the second wavelength band may be extracted to the outside. Summary of the invention

[0010] Embodiments are directed to a display device in which regions emitting light of different colors overlap with a scattering layer having scatterers of different concentrations. Embodiments are also directed to a method for manufacturing a display device in which a scattering layer continuously formed on the entire surface of a substrate has scatterers of different concentrations for each region according to emission colors.

[0011] The display device according to the present embodiment includes: a substrate including a first light-emitting area, a second light-emitting area and a third light-emitting area; a transistor arranged on the substrate; a light-emitting element connected to the transistor; an encapsulation layer arranged on the light-emitting element; a partition wall arranged on the encapsulation layer; and a scattering layer arranged on the partition wall, the scattering layer being continuously arranged on the entire surface of the substrate, and the concentration of the scatterer included in the scattering layer overlapping with the first light-emitting area, the concentration of the scatterer included in the scattering layer overlapping with the second light-emitting area, and the concentration of the scatterer included in the scattering layer overlapping with the third light-emitting area are different.

[0012] The substrate may further include a first non-light emitting region, a second non-light emitting region, and a third non-light emitting region.

[0013] The scattering layer may overlap the first non-light emitting area, the second non-light emitting area, and the third non-light emitting area, and the scattering layer may include scatterers having different concentrations in each non-light emitting area.

[0014] The concentration of the scatterer included in the scattering layer overlapping the second light-emitting area is greater than the concentration of the scatterer included in the scattering layer overlapping the first light-emitting area, and the concentration of the scatterer included in the scattering layer overlapping the third light-emitting area is greater than the concentration of the scatterer included in the scattering layer overlapping the second light-emitting area.

[0015] The concentration of the scatterer included in the scattering layer overlapping the first non-luminous area is lower than the concentration of the scatterer included in the scattering layer overlapping the second non-luminous area, and the concentration of the scatterer included in the scattering layer overlapping the second non-luminous area is lower than the concentration of the scatterer included in the scattering layer overlapping the third non-luminous area.

[0016] The scattering layer may cover a side surface and one of a top surface and a bottom surface of the partition wall, and may fill an opening of the partition wall.

[0017] The display device also includes: a color filter positioned (arranged) on the scattering layer, the color filter including: a first color filter overlapping the first light emitting area; a second color filter overlapping the second light emitting area, and a third color filter overlapping the third light emitting area.

[0018] The light emitting element emits white light, and the light emitting element may have a tandem structure.

[0019] A method for manufacturing a display device according to an embodiment includes: forming a display unit on a front side of a substrate; forming a partition wall on the display unit; forming a scattering layer on the partition wall; providing a temperature control unit on a rear surface of the substrate; and changing the temperature of the scattering layer by the temperature control unit, wherein a scatterer is included in the scattering layer and the scatterer moves in the step of changing the temperature of the scattering layer.

[0020] The substrate may include a first light emitting region, a second light emitting region, and a third light emitting region.

[0021] The temperature control unit includes: a first temperature controller overlapping the first light emitting area; a second temperature controller overlapping the second light emitting area; and a third temperature controller overlapping the third light emitting area. The first temperature controller, the second temperature controller, and the third temperature controller may have different temperatures.

[0022] The first temperature controller includes a first metal, the second temperature controller includes a second metal, and the third temperature controller includes a third metal, and thermal conductivity of the first metal, thermal conductivity of the second metal, and thermal conductivity of the third metal may be different from each other.

[0023] The scattering layer overlapping the first temperature controller is heated to a first temperature, the scattering layer overlapping the second temperature controller is heated to a second temperature lower than the first temperature, and the scattering layer overlapping the third temperature controller may be heated to a third temperature lower than the second temperature.

[0024] The scatterer included in the scattering layer may move from a high temperature region to a low temperature region.

[0025] An amount of movement of the scatterer included in the scattering layer may increase as a temperature difference with an adjacent region increases.

[0026] The first temperature controller may include a first metal layer, the second temperature controller may include a second metal layer and a second insulating layer, and the third temperature controller may include a third metal layer and a third insulating layer.

[0027] The thickness of the first metal layer is greater than that of the second metal layer, and the thickness of the second metal layer is greater than that of the third metal layer. The first metal layer, the second metal layer, and the third metal layer may include the same metal.

[0028] The thickness of the second insulating layer is smaller than the thickness of the third insulating layer.

[0029] The substrate includes: a first non-luminous area, which is arranged to be adjacent to the first emitting area; a second non-luminous area, which is arranged to be adjacent to the second emitting area; and a third non-luminous area, which is arranged to be adjacent to the third emitting area; a first temperature controller, which overlaps with the first non-luminous area; a second temperature controller, which overlaps with the second non-luminous area; and a third temperature controller, which overlaps with the third non-luminous area, and the second temperature controller and the third temperature controller can have different temperatures.

[0030] The first temperature controller includes a first metal, the second temperature controller includes a second metal, the third temperature controller includes a third metal, and the thermal conductivity of the first metal is greater than that of the second metal, and the thermal conductivity of the second metal is greater than that of the third metal.

[0031] According to example embodiments, regions emitting light of different colors overlap scattering layers having different scatterer concentrations, thereby reducing color deviation on a side surface of a display device.

[0032] A display device with improved display quality can be provided.

[0033] In addition, the embodiment may provide a method of manufacturing a display device in which a scattering layer continuously formed on the entire surface of a substrate has a different concentration for each region according to the color of emitted light.

[0034] By providing a simplified process, the occurrence of problems such as ink misalignment, ink mixing, and filling can be minimized even in the manufacturing process of a display device having a high resolution. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 is an exploded perspective view of a display device according to an embodiment.

[0036] Figure 2 is a schematic cross-sectional view of a display panel of a display device according to an embodiment.

[0037] Figure 3 is a schematic cross-sectional view of a display panel according to an embodiment.

[0038] Figure 4 and Figure 5 is a schematic cross-sectional view of a display panel according to another embodiment.

[0039] Figure 6 , Figure 7 , Figure 8 , Fig. 9 and Fig.10 Each shows a method of manufacturing a display device according to an embodiment.

[0040] Fig.11 , Fig.12 , Fig.13 and Fig.14 is a diagram of a method of manufacturing a display device according to an embodiment.

[0041] Fig.15 and Fig.16 is a diagram of a method of manufacturing a display device according to an embodiment.

[0042] Fig.17and Fig.18 is a diagram of a method of manufacturing a display device according to an embodiment.

[0043] Fig.19A and Fig.19B is a schematic cross-sectional view of a display panel according to another embodiment.

[0044] Fig. 20 , Fig.21 , Fig. 22 and Fig.23 is a diagram of a method of manufacturing a display device according to another embodiment.

[0045] Fig.24 and Fig.25 is a diagram of a method of manufacturing a display device according to another embodiment.

[0046] Fig.26A , Fig.26B , Fig.26C and Fig.26D is a schematic cross-sectional view of a scatterer according to an embodiment.

[0047] Fig. 27 is an image showing the movement of the scatterer according to the temperature difference. DETAILED DESCRIPTION

[0048] Hereinafter, various embodiments of the inventive concept will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily implement the inventive concept.

[0049] The inventive concept may be embodied in many different forms and is not limited to the embodiments set forth herein.

[0050] In order to clearly describe the inventive concept, parts irrelevant to the description are omitted, and the same reference numerals are assigned to the same or similar components throughout the specification.

[0051] In addition, since the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of explanation, the inventive concept is not necessarily limited to the shown components.

[0052] In the drawings, in order to clearly express each layer and each region, the thickness is exaggerated and shown.

[0053] Also, in the drawings, the thicknesses of some layers and regions are exaggerated for convenience of explanation.

[0054] In addition, when a part such as a layer, film, region or plate is referred to as being “above” or “on” another part, this includes not only the case where the part is “directly on” the other part, but also the case where another part exists between the part and the other part.

[0055] In contrast, when a portion is referred to as being “directly on” another portion, this means that there is no other portion between the portion and the other portion.

[0056] In addition, “above” or “on” a reference portion means being located above or below the reference portion, and does not necessarily mean being located “above” or “on” the reference portion in an opposite direction to gravity.

[0057] In addition, throughout the specification, when a certain component is referred to as “comprising”, unless otherwise specified, this means that the component may further include other components, rather than excluding other components.

[0058] Also, throughout the specification, when a “planar image” is mentioned, this means when the target portion is observed from above, and when a “cross-sectional image” is mentioned, this means when a cross section of the target portion cut vertically is observed from the side.

[0059] In the following, reference will be made to Figure 1 A display device according to the embodiment is described.

[0060] Figure 1 is an exploded perspective view of a display device according to an embodiment.

[0061] Reference Figure 1 , the display device 1000 according to the embodiment may include a display panel DP and a housing HM.

[0062] One surface of the display panel DP, in which an image is displayed, is parallel to a surface defined by the first direction DR1 and the second direction DR2.

[0063] A normal direction of a surface where an image is displayed (ie, a thickness direction of the display panel DP) is indicated by a third direction DR3.

[0064] The front surface (or upper surface) and the rear surface (or lower surface) of each member are determined by the third direction DR3.

[0065] However, the directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 are relative concepts and may be converted into other directions.

[0066] The display panel DP may be a flat rigid display panel, but is not limited thereto, and may also be a flexible display panel.

[0067] Meanwhile, the display panel DP may also be an organic light emitting display panel.

[0068] However, the type of the display panel DP is not limited thereto and may include various types of panels.

[0069] For example, the display panel DP may include a liquid crystal display panel, an electrophoretic display panel, an electrowetting display panel, or the like.

[0070] Also, the display panel DP may also include a next-generation display panel such as a micro light emitting diode (LED) display panel, a quantum dot light emitting diode display panel, and a quantum dot organic light emitting diode display panel.

[0071] The micro light emitting diode display panel is formed such that each pixel includes a light emitting diode having a size of 10 micrometers to 100 micrometers.

[0072] Such a micro LED display panel has advantages such as use of inorganic materials, omission of a backlight source, fast response speed, high brightness with low power consumption, and resistance to breakage when bent.

[0073] The quantum dot light emitting diode display panel is formed by attaching a film containing quantum dots or forming a material containing quantum dots.

[0074] The quantum dot includes an inorganic material such as indium and cadmium, and refers to a particle that emits light by itself and has a diameter of several nanometers or less.

[0075] By adjusting the particle size of quantum dots, the desired color of light can be displayed.

[0076] Quantum dot organic light-emitting diode display panels use blue organic light-emitting diodes as light sources. In quantum dot organic light-emitting diode display panels, a film containing red quantum dots and green quantum dots is attached to a substrate, or a material containing red quantum dots and green quantum dots is deposited on a substrate to achieve color.

[0077] The display panel DP according to the embodiment may further include other various display panels.

[0078] like Figure 1 As shown in FIG. 1 , the display panel DP includes a display area DA in which an image is displayed and a non-display area PA disposed adjacent to the display area DA.

[0079] The non-display area PA is an area in which no image is displayed.

[0080] The display area DA may have, for example, a rectangular shape, and the non-display area PA may have a shape surrounding the display area DA.

[0081] However, the shape of the display area DA and the shape of the non-display area PA may be relatively designed without being limited thereto.

[0082] The housing HM provides a predetermined internal space.

[0083] The display panel DP is installed inside the housing HM.

[0084] In addition to the display panel DP, various electronic components such as a power supply unit, a storage device, and an audio input / output module may be mounted inside the housing HM.

[0085] In the following, reference will be made to Figure 2 A display area of ​​a display panel according to an embodiment is described.

[0086] Figure 2 is a schematic cross-sectional view of a display panel of a display device according to an embodiment.

[0087] Reference Figure 2 , multiple pixels PA1, PA2 and PA3 can be Figure 1 The display area DA is formed on the substrate SUB in an area corresponding to the display area DA.

[0088] Each of the pixels PA1 , PA2 , and PA3 may include a plurality of transistors and a light emitting element connected to the plurality of transistors.

[0089] The encapsulation layer 400 may be positioned on the plurality of pixels PA1 , PA2 , and PA3 .

[0090] The display area DA may be protected from external air or moisture by the encapsulation layer 400 .

[0091] The encapsulation layer 400 may be integrally provided to overlap the entire surface of the display area DA, and may also be partially provided in the non-display area PA (see FIG. Figure 1 )middle.

[0092] The first color conversion cell CC1 , the second color conversion cell CC2 , and the third color conversion cell CC3 may be located on the encapsulation layer 400 .

[0093] The first color conversion unit CC1 overlaps the first pixel PA1, the second color conversion unit CC2 overlaps the second pixel PA2, and the third color conversion unit CC3 overlaps the third pixel PA3.

[0094] Light emitted from the first pixel PA1 may pass through the first color conversion unit CC1 to provide red light LR.

[0095] Light emitted from the second pixel PA2 may pass through the second color conversion unit CC2 to provide green light LG.

[0096] Light emitted from the third pixel PA3 may pass through the third color conversion unit CC3 to provide blue light LB.

[0097] In the following, reference will be made to Figure 3 The structure of the display panel according to the embodiment is described in more detail.

[0098] Figure 3 is a schematic cross-sectional view of a display panel according to an embodiment.

[0099] First, refer to Figure 3 , according to the display area DA (see Figure 1 ) includes a first light emitting area LA1 that emits red light, a second light emitting area LA2 that emits green light, and a third light emitting area LA3 that emits blue light.

[0100] The non-light emitting areas NLA1, NLA2, and NLA3 may be located between the first light emitting area LA1, the second light emitting area LA2, and the third light emitting area LA3.

[0101] Each of the light emitting areas LA1, LA2, and LA3 may correspond to a pixel.

[0102] For example, the first light emitting area LA1, the second light emitting area LA2, and the third light emitting area LA3 may correspond to a red pixel, a green pixel, and a blue pixel, respectively, but is not limited thereto.

[0103] A cross-sectional structure of the display area DA will be described below.

[0104] The display unit DC according to the embodiment includes a first substrate SUB1.

[0105] The first substrate SUB1 may include a flexible material (such as plastic) that can be easily bent, folded, or rolled.

[0106] The buffer layer BF may be positioned on the first substrate SUB1.

[0107] The buffer layer BF may include silicon nitride (SiN x ), silicon oxide (SiO x ) or silicon oxynitride (SiO x N y ).

[0108] The buffer layer BF is positioned between the first substrate SUB1 and the semiconductor layer ACT to block impurities from the first substrate SUB1 to the semiconductor layer ACT during a crystallization process for forming the semiconductor layer ACT of polycrystalline silicon, thereby improving the characteristics of polycrystalline silicon. The stress on the semiconductor layer ACT formed on the buffer layer BF can be relieved by planarizing the first substrate SUB1.

[0109] The semiconductor layer ACT is positioned on the buffer layer BF.

[0110] The semiconductor layer ACT may be formed of polysilicon or an oxide semiconductor.

[0111] The semiconductor layer ACT includes a channel region C, a source region S, and a drain region D.

[0112] The source region S and the drain region D are disposed on both sides of the channel region C, respectively.

[0113] The channel region C is an intrinsic semiconductor not doped with impurities, and the source region S and the drain region D are semiconductors doped with conductive impurities.

[0114] The semiconductor layer ACT may be formed of an oxide semiconductor, and in this case, a separate protective layer (not shown) may be added to protect the oxide semiconductor material susceptible to an external environment such as a high temperature.

[0115] The first gate insulating layer GI1 is positioned on the semiconductor layer ACT.

[0116] The first gate insulating layer GI1 may include silicon nitride (SiN x ), silicon oxide (SiO x ) and silicon oxynitride (SiO x N y ) is a single layer or multiple layers of at least one of ).

[0117] The gate electrode GE is positioned on the first gate insulating layer GI1 .

[0118] The gate electrode GE may be a single metal layer or a multi-layer metal layer including at least one of copper (Cu), copper alloy, aluminum (Al), aluminum alloy, molybdenum (Mo), and molybdenum alloy.

[0119] The second gate insulating layer GI2 is positioned on the gate electrode GE and the first gate insulating layer GI1 .

[0120] The second gate insulating layer GI2 may include silicon nitride (SiN x ), silicon oxide (SiO x ) and silicon oxynitride (SiO x N y ) is a single layer or multiple layers of at least one of ).

[0121] The capacitor electrode CE may be positioned on the second gate insulating layer GI2 .

[0122] The capacitor electrode CE may overlap the gate electrode GE and form a capacitor with the gate electrode GE and a second gate insulating layer GI2 disposed between the capacitor electrode CE and the gate electrode GE.

[0123] The interlayer insulating layer IL1 is positioned on the capacitor electrode CE and the first gate insulating layer GI1 .

[0124] The interlayer insulating layer IL1 may include silicon nitride (SiN x ), silicon oxide (SiO x) or silicon oxynitride (SiO x N y ).

[0125] Openings exposing the source region S and the drain region D are positioned in the interlayer insulating layer IL1 and the first gate insulating layer GI1 .

[0126] The source electrode SE and the drain electrode DE are positioned on the interlayer insulating layer IL1 .

[0127] The source electrode SE and the drain electrode DE are electrically connected to the source region S and the drain region D of the semiconductor layer ACT through openings formed in the interlayer insulating layer IL1 and the first gate insulating layer GI1 .

[0128] The passivation layer IL2 is positioned on the interlayer insulating layer IL1 , the source electrode SE, and the drain electrode DE.

[0129] Since the passivation layer IL2 covers and flattens the step formed by the source electrode SE and the drain electrode DE on the interlayer insulating layer IL1 , the first electrode E1 without a step may be formed on the passivation layer IL2 .

[0130] The passivation layer IL2 may be made of an organic material of polyacrylate resin or polyimide resin, or a laminated film of an organic material and an inorganic material.

[0131] The first electrode E1 is positioned on the passivation layer IL2 .

[0132] The first electrode E1 is connected to the drain electrode DE through the opening of the passivation layer IL2 .

[0133] A driving transistor including a gate electrode GE, a semiconductor layer ACT, a source electrode SE, and a drain electrode DE is connected to the first electrode E1 to supply a driving current to the light emitting element ED.

[0134] Apart from Figure 3 In addition to the driving transistor shown in the figure, the display device according to this embodiment also includes a switching transistor (not shown) connected to the data line and transmitting the data voltage in response to the scanning signal and connected to the driving transistor and driven in response to the scanning signal, and may further include a compensation transistor (not shown) for compensating for the threshold voltage of the transistor.

[0135] The pixel defining layer PDL may be positioned on the passivation layer IL2 and the first electrode E1. The pixel defining layer PDL may have a pixel opening exposing the first electrode E1 and defining an emission area.

[0136] The pixel opening may have a planar shape substantially similar to that of the first electrode E1 and may have a planar rhombus shape or an octagonal shape similar to the rhombus shape, but is not limited thereto and may have any shape such as other polygons (eg, rectangle).

[0137] The pixel defining layer PDL may include an organic material such as a polyacrylate resin or a polyimide resin, or a silicon-based inorganic material.

[0138] The light emitting layer EML is positioned in the pixel opening on the first electrode E1.

[0139] The light emitting layer EML may be formed of a low molecular weight organic material or a high molecular weight organic material such as poly 3,4-ethylenedioxythiophene (PEDOT).

[0140] In addition, the emission layer EML is disposed between the first functional layer including the hole injection layer (HIL) and the hole transport layer (HTL) and the second functional layer including the electron transport layer (ETL) and the electron injection layer (EIL). The emission layer EML may be a multilayer including at least two layers.

[0141] Most of the light emitting layer EML may be located in the pixel opening, and may also be located on a side of and / or above the pixel defining layer PDL according to embodiments.

[0142] The second electrode E2 is positioned on the light emitting layer EML.

[0143] The second electrode E2 may be positioned throughout a plurality of pixels and may be disposed in the non-display area PA (see FIG. Figure 1 ) receives the common voltage.

[0144] The first electrode E1 , the light emitting layer EML, and the second electrode E2 may constitute a light emitting element ED.

[0145] Here, the first electrode E1 may be an anode as a hole injection electrode, and the second electrode E2 may be a cathode as an electron injection electrode.

[0146] However, the present embodiment is not necessarily limited thereto, and according to a driving method of the organic light emitting display device, the first electrode E1 may serve as a cathode, and the second electrode E2 may serve as an anode.

[0147] Holes and electrons are injected into the light emitting layer EML from the first electrode E1 and the second electrode E2 , respectively, and when excitons, which are a combination of the injected holes and electrons, fall from an excited state to a ground state, light emission occurs.

[0148] Meanwhile, the light emitting element ED according to the embodiment may include a plurality of light emitting units emitting different lights.

[0149] Each of the light emitting units may include a light emitting layer, and adjacent light emitting layers may be in contact with each other, or may include an intermediate layer positioned between adjacent light emitting layers.

[0150] The first electrode E1 and the second electrode E2 described above may be disposed on the lower surface and the upper surface of each of the plurality of light emitting cells.

[0151] At least one of the plurality of light emitting units may display a first color, and at least one of the other light emitting units may display a second color.

[0152] The first color and the second color may be different.

[0153] For example, the plurality of light emitting units may include a first light emitting unit EL1, a second light emitting unit EL2, a third light emitting unit EL3, and a fourth light emitting unit EL4 that independently emit red light, green light, or blue light.

[0154] The light emitting element ED according to the embodiment may emit white light while having a tandem structure.

[0155] The encapsulation layer 400 is positioned on the second electrode E2.

[0156] The encapsulation layer 400 may cover not only the upper surface of the display layer including the light emitting element ED but also the side surface of the display layer including the light emitting element ED, thereby sealing the display layer.

[0157] The light emitting element ED is very susceptible to moisture and oxygen, and the encapsulation layer 400 can seal the light emitting element ED to prevent the inflow of external moisture and oxygen.

[0158] The encapsulation layer 400 may include a plurality of layers, which may be formed of a composite film including an inorganic film and an organic film. The encapsulation layer 400 may include three layers in which a first inorganic film, an organic film, and a second inorganic film are sequentially formed.

[0159] The color conversion unit CC is positioned on the encapsulation layer 400 .

[0160] The color conversion cell CC includes a second substrate SUB2 overlapping the first substrate SUB1.

[0161] The second substrate SUB2 may include a flexible material (such as plastic) that can be easily bent, folded, or rolled.

[0162] The color conversion unit CC may include a partition wall BK positioned on the encapsulation layer 400 .

[0163] The partition wall BK may include a first opening OP1 , a second opening OP2 , and a third opening OP3 disposed in a region corresponding to a pixel opening.

[0164] The size of the first opening OP1 , the size of the second opening OP2 , and the size of the third opening OP3 may be different or the same.

[0165] The scattering layer SC may be positioned on the partition wall BK.

[0166] The scattering layer SC may overlap the entire surface of the first substrate SUB1 or the entire surface of the second substrate SUB2.

[0167] The scattering layer SC may be positioned in the first opening OP1 , the second opening OP2 , and the third opening OP3 .

[0168] The scattering layer SC may cover the side surfaces and the top surface of the partition wall BK.

[0169] The scattering layer SC may be continuously formed in the display area DA.

[0170] The scattering layer SC may include a polymer resin such as polyacrylate (PA), polyurethane (PU), polyethylene (PE), an epoxy-based compound, an ester-based compound, and a scatterer SCa included in the polymer resin.

[0171] According to an embodiment, the scattering layer SC may include a light curing agent or a heat curing agent.

[0172] For example, the scattering layer SC may include hexamethylene diacrylate, tetramethylene diacrylate, dipropylene glycol diacrylate, dipropylene glycol trimethylene diacrylate, etc., and the material may be included in an amount of 0.1 wt % to 99 wt % based on the total weight of the scattering layer SC.

[0173] According to an embodiment, the ink forming the scattering layer SC may have a -6 Up to 10 -1 Vapor pressure of mmHg, surface energy of 1 to 40 dyne / cm, and viscosity of approximately 1 to 40 cps.

[0174] Alternatively, as another example, the scattering layer SC may be formed of ink containing a binder (containing an acrylic group), a monomer, and a solvent.

[0175] The solvent may include at least one of propylene glycol methyl ether acetate (PGMEA), dimethylamine (DMA), a chemical hybridization agent (CHA), dipropylene glycol methyl ether acetate (DPMA), and hexane.

[0176] The ink may have a vapor pressure of 1 mmHg or less and a viscosity of 0.1 to 20 cps.

[0177] The scattering layer SC may include a plurality of scatterers SCa.

[0178] The scattering layer SC may include less than about 70 wt % of the scatterer SCa.

[0179] The diameter of each scatterer SCa may be about 50 nanometers to about 300 nanometers.

[0180] The scatterer SCa may include a 2 ,BaSO 4 、Al 2 O 3 、ZnO、ZrO 2 and TiO 2 One or more of the groups.

[0181] As an example, the scatterer SCa may include TiO 2 , but not limited to this.

[0182] Will refer to later Fig.26A , Fig.26B , Fig.26C and Fig.26D The scatterer SCa is described in more detail.

[0183] The scattering layer SC may include a plurality of regions having different concentrations (or contents) of the scatterer SCa.

[0184] For example, the concentration of the scatterer SCa in the scattering layer SC overlapping the first light emitting area LA1, the concentration of the scatterer SCa in the scattering layer SC overlapping the second light emitting area LA2, and the concentration of the scatterer SCa in the scattering layer SC overlapping the third light emitting area LA3 may be different.

[0185] The content of the scatterer SCa included in the scattering layer SC overlapping the first light emitting area LA1 may be less than the content of the scatterer SCa included in the scattering layer SC overlapping the second light emitting area LA2.

[0186] In addition, the content of the scatterer SCa included in the scattering layer SC overlapping the second light emitting area LA2 may be less than the content of the scatterer SCa included in the scattering layer SC overlapping the third light emitting area LA3.

[0187] However, the present embodiment is not limited thereto, and the scattering layer SC may have different concentrations of the scatterer SCa according to regions.

[0188] Also, the concentrations of the scatterers SCa of the scattering layer SC overlapping the non-light emitting areas NLA1, NLA2, and NLA3 may be different.

[0189] For example, the content of the scatterer SCa in the scattering layer SC overlapping the first non-luminous area NLA1, the content of the scatterer SCa in the scattering layer SC overlapping the second non-luminous area NLA2, and the content of the scatterer SCa in the scattering layer SC overlapping the third non-luminous area NLA3 may be different.

[0190] The content of the scatterer SCa included in the scattering layer SC overlapping the first non-light emitting area NLA1 may be greater than the content of the scatterer SCa included in the scattering layer SC overlapping the second non-light emitting area NLA2 .

[0191] Also, the content of the scatterer SCa included in the scattering layer SC overlapping the second non-light emitting area NLA2 may be greater than the content of the scatterer SCa included in the scattering layer SC overlapping the third non-light emitting area NLA3.

[0192] However, the present embodiment is not limited thereto, and the scattering layer SC may have different concentrations of the scatterer SCa according to regions.

[0193] The filling layer FL may be positioned on the partition wall BK and the scattering layer SC.

[0194] The filling layer FL may combine components positioned on the first substrate SUB1 and components positioned on the second substrate SUB2.

[0195] A display panel may be formed by the filling layer FL.

[0196] The color conversion unit CC includes a first color filter CF1, a second color filter CF2, and a third color filter CF3 positioned between the second substrate SUB2 and the display unit DC.

[0197] The first color filter CF1 may overlap the first light emitting area LA1.

[0198] The first color filter CF1 may transmit red light emitted from the light emitting element ED overlapping the first light emitting area LA1 and absorb light of other wavelengths, improving the purity of red light emitted to the outside of the display device.

[0199] The second color filter CF2 may overlap the second light emitting area LA2.

[0200] The second color filter CF2 may transmit green light emitted from the light emitting element ED overlapping the second light emitting area LA2 and absorb light of other wavelengths, thereby improving the purity of green light emitted to the outside of the display device.

[0201] The third color filter CF3 may overlap the third light emitting area LA3.

[0202] The third color filter CF3 may transmit blue light emitted from the light emitting element ED overlapping the third light emitting area LA3 and absorb light of other wavelengths, thereby improving the purity of blue light emitted to the outside of the display device.

[0203] At least two of the first, second, and third color filters CF1, CF2, and CF3 may overlap in the non-light emitting areas NLA1, NLA2, and NLA3 to function as a light blocking layer.

[0204] The non-light emitting areas NLA1 , NLA2 , and NLA3 may overlap the pixel defining layer PDL of the display unit DC and the partition wall BK of the color conversion unit CC.

[0205] The third insulating layer IL3 may be positioned between the color filters CF1 , CF2 , and CF3 and the filling layer FL.

[0206] The third insulating layer IL3 may protect the color filters CF1 , CF2 , and CF3 , and may include an organic material or an inorganic material.

[0207] The display unit DC according to the embodiment includes the light emitting elements having a series structure, and white light is emitted from the light emitting elements ED.

[0208] In this case, each of the red pixel, the green pixel, and the blue pixel has a large variation in lateral brightness, and the optimum content of the scatterer SCa of the scattering layer SC required for each pixel may be different.

[0209] The scattering layer SC according to the embodiment may include a plurality of regions having different concentrations of the scatterer SCa while continuously overlapping the front surface of the first substrate SUB1 or the rear surface of the second substrate SUB2.

[0210] Although the scattering layer SC is not patterned for each pixel, a different concentration of the scatterer SCa may be provided for each region.

[0211] By providing the scatterer SCa having different densities according to the color of the emitted light, the side brightness of the display device can be improved.

[0212] In the following, reference will be made to Figure 4 and Figure 5 A display panel according to another embodiment is described.

[0213] Figure 4 and Figure 5 is a schematic cross-sectional view of a display panel according to another embodiment.

[0214] Description of the same components as those described above will be omitted.

[0215] First, refer to Figure 4 , the color conversion unit CC can be positioned on the display unit DC.

[0216] The color conversion unit CC may include a second substrate SUB2 facing the first substrate SUB1.

[0217] The first, second, and third color filters CF1, CF2, and CF3 may be positioned between the second substrate SUB2 and the display unit DC.

[0218] The third insulating layer IL3 may be positioned between the first, second, and third color filters CF1, CF2, and CF3 and the display cell DC.

[0219] The third insulating layer IL3 may include an organic material or a silicon nitride (SiN x ), silicon oxide (SiO x ) or silicon oxynitride (SiO x N y ) of inorganic materials.

[0220] The partition wall BK may be positioned between the third insulating layer IL3 and the display cell DC.

[0221] The partition wall BK may include a first opening OP1 , a second opening OP2 , and a third opening OP3 overlapping the pixel opening.

[0222] The size of the first opening OP1 , the size of the second opening OP2 , and the size of the third opening OP3 may be different or the same.

[0223] The scattering layer SC may be positioned between the third insulating layer IL3 and the display cell DC.

[0224] The scattering layer SC may overlap the entire surface of the first substrate SUB1 or the entire surface of the second substrate SUB2.

[0225] The scattering layer SC may continuously overlap the first substrate SUB1 or the second substrate SUB2.

[0226] The scattering layer SC may cover one surface (eg, bottom surface) and side surfaces of the partition wall BK facing the display cell DC, and may be positioned in the openings OP1 , OP2 , and OP3 .

[0227] The scattering layer SC may include a plurality of scatterers SCa.

[0228] The scatterer SCa may include a 2 ,BaSO 4 、Al 2 O 3 、ZnO、ZrO 2 and TiO2 One or more of the groups.

[0229] The scattering layer SC may include a polymer resin and a scatterer SCa included in the polymer resin.

[0230] For example, the scatterer SCa may include TiO 2 , but not limited to this.

[0231] The scattering layer SC may include a plurality of regions having different concentrations of the scatterer SCa.

[0232] For example, the concentration of the scatterer SCa included in the scattering layer SC overlapping the first light emitting region LA1, the concentration of the scatterer SCa included in the scattering layer SC overlapping the second light emitting region LA2, and the concentration of the scatterer SCa included in the scattering layer SC overlapping the third light emitting region LA3 may be different.

[0233] The content of the scatterer SCa included in the scattering layer SC overlapping the first light emitting area LA1 may be less than the content of the scatterer SCa included in the scattering layer SC overlapping the second light emitting area LA2.

[0234] In addition, the content of the scatterer SCa included in the scattering layer SC overlapping the second light emitting area LA2 may be less than the content of the scatterer SCa included in the scattering layer SC overlapping the third light emitting area LA3.

[0235] However, the present embodiment is not limited thereto, and the scattering layer SC may have different concentrations of the scatterer SCa according to regions.

[0236] Also, the concentrations of the scatterers SCa of the scattering layer SC overlapping the non-light emitting areas NLA1, NLA2, and NLA3 may be different.

[0237] For example, the content of the scatterer SCa in the scattering layer SC overlapping the first non-luminous area NLA1, the content of the scatterer SCa in the scattering layer SC overlapping the second non-luminous area NLA2, and the content of the scatterer SCa in the scattering layer SC overlapping the third non-luminous area NLA3 may be different.

[0238] The content of the scatterer SCa included in the scattering layer SC overlapping the first non-light emitting area NLA1 may be greater than the content of the scatterer SCa included in the scattering layer SC overlapping the second non-light emitting area NLA2 .

[0239] In addition, the content of the scatterer SCa included in the scattering layer SC overlapping the second non-light emitting area NLA2 may be greater than the content of the scatterer SCa included in the scattering layer SC overlapping the third non-light emitting area NLA3.

[0240] However, the present embodiment is not limited thereto, and the scattering layer SC may have different concentrations of the scatterer SCa according to regions.

[0241] The filling layer FL may be positioned between the scattering layer SC and the display cell DC.

[0242] The filling layer FL may combine the display unit DC and the color conversion unit CC.

[0243] Reference Figure 5 , the display device according to the embodiment may include a display unit DC and a color conversion unit CC.

[0244] Since the display unit DC is Figure 3 The descriptions are the same, so their descriptions will be omitted.

[0245] The color conversion cell CC includes a partition wall BK positioned on the display cell DC.

[0246] The partition wall BK may be positioned on the encapsulation layer 400 of the display cell DC.

[0247] The partition wall BK may include a first opening OP1 , a second opening OP2 , and a third opening OP3 overlapping the pixel opening.

[0248] The size of the first opening OP1 , the size of the second opening OP2 , and the size of the third opening OP3 may be different or the same.

[0249] The scattering layer SC may be positioned on the partition wall BK and the display cell DC.

[0250] The scattering layer SC may overlap the entire surface of the first substrate SUB1 or the entire surface of the second substrate SUB2.

[0251] The scattering layer SC may continuously overlap the first substrate SUB1 or the second substrate SUB2.

[0252] The scattering layer SC may cover the top and side surfaces of the partition wall BK, and may be positioned in the openings OP1 , OP2 , and OP3 .

[0253] The scattering layer SC may include a plurality of scatterers SCa.

[0254] The scattering layer SC may include a polymer resin and a scatterer SCa included in the polymer resin.

[0255] The scatterer SCa may include a 2 ,BaSO 4 、Al 2 O 3 、ZnO、ZrO2 and TiO 2 One or more of the groups.

[0256] For example, the scatterer SCa may include TiO 2 , but not limited to this.

[0257] The scattering layer SC may include a plurality of regions having different concentrations of the scatterer SCa.

[0258] For example, the concentration of the scatterer SCa included in the scattering layer SC overlapping the first light emitting region LA1, the concentration of the scatterer SCa included in the scattering layer SC overlapping the second light emitting region LA2, and the concentration of the scatterer SCa included in the scattering layer SC overlapping the third light emitting region LA3 may be different.

[0259] The content of the scatterer SCa included in the scattering layer SC overlapping the first light emitting area LA1 may be less than the content of the scatterer SCa included in the scattering layer SC overlapping the second light emitting area LA2.

[0260] In addition, the content of the scatterer SCa included in the scattering layer SC overlapping the second light emitting area LA2 may be less than the content of the scatterer SCa included in the scattering layer SC overlapping the third light emitting area LA3.

[0261] However, the present embodiment is not limited thereto, and the scattering layer SC may have different concentrations of the scatterer SCa according to regions.

[0262] Also, the concentrations of the scatterers SCa of the scattering layer SC overlapping the non-light emitting areas NLA1, NLA2, and NLA3 may be different.

[0263] For example, the content of the scatterer SCa in the scattering layer SC overlapping the first non-luminous area NLA1, the content of the scatterer SCa in the scattering layer SC overlapping the second non-luminous area NLA2, and the content of the scatterer SCa in the scattering layer SC overlapping the third non-luminous area NLA3 may be different.

[0264] The content of the scatterer SCa included in the scattering layer SC overlapping the first non-light emitting area NLA1 may be greater than the content of the scatterer SCa included in the scattering layer SC overlapping the second non-light emitting area NLA2 .

[0265] In addition, the content of the scatterer SCa included in the scattering layer SC overlapping the second non-light emitting area NLA2 may be greater than the content of the scatterer SCa included in the scattering layer SC overlapping the third non-light emitting area NLA3.

[0266] However, the present embodiment is not limited thereto, and the scattering layer SC may have different concentrations of the scatterer SCa according to regions.

[0267] The third insulating layer IL3 may be positioned on the scattering layer SC.

[0268] The third insulating layer IL3 may cover the entire surface of the scattering layer SC.

[0269] The third insulating layer IL3 may include an organic material or a silicon nitride (SiN x ), silicon oxide (SiO x ) or silicon oxynitride (SiO x N y ) of inorganic materials.

[0270] Color filters CF1 , CF2 , and CF3 may be positioned on the third insulating layer IL3 .

[0271] In the following, reference will be made to Figures 6 to 10 A method of manufacturing a display device according to an embodiment is described.

[0272] Figure 6 , Figure 7 , Figure 8 , Fig. 9 and Fig.10 Each shows a method of manufacturing a display device according to an embodiment.

[0273] Description of the same components as those described above will be omitted.

[0274] First refer to Figure 6 , in the method of manufacturing the display device according to the embodiment, the display unit DC is formed on the first substrate SUB1.

[0275] The display unit DC may have a previous reference Figure 3 The stacking structure described herein is omitted and a detailed description thereof will be omitted below.

[0276] The partition wall BK is formed on the display cell DC.

[0277] The partition wall BK may include a first opening OP1 , a second opening OP2 , and a third opening OP3 respectively overlapping the pixel openings.

[0278] The size of the first opening OP1 , the size of the second opening OP2 , and the size of the third opening OP3 may be different or the same.

[0279] The method of manufacturing the display device according to the embodiment has been described as forming the partition wall BK on the display cell DC and based on Figures 3 to 5 The structure of the partition wall BK is not limited to this embodiment. The position of the partition wall BK can be changed in various ways.

[0280] A scattering layer SC including a scatterer is formed on the partition wall BK.

[0281] A scattering layer SC may be formed on the entire surface of the first substrate SUB1.

[0282] The scattering layer SC may cover the top surface and the side surface of the partition wall BK and fill each of the openings OP1 , OP2 , and OP3 .

[0283] The scattering layer SC may be formed through a coating process, an inkjet process, or a photolithography process.

[0284] The method of forming the scattering layer SC may not be limited.

[0285] The initially formed scattering layer SC may have substantially the same content of the scatterer throughout the entire surface of the first substrate SUB1.

[0286] like Figure 7 As shown in FIG. 1 , a temperature control unit TU is provided on the rear surface of the first substrate SUB1 .

[0287] The temperature control unit TU may include a first temperature controller TU1 , a second temperature controller TU2 , a third temperature controller TU3 , and a plate PL.

[0288] The plate PL may heat or cool the first temperature controller TU1 , the second temperature controller TU2 , and the third temperature controller TU3 .

[0289] The plate PL may heat or cool the first temperature controller TU1 , the second temperature controller TU2 , and the third temperature controller TU3 to predetermined temperatures.

[0290] The plate PL may include a heater or a cooler, but is not limited thereto.

[0291] The first temperature controller TU1 , the second temperature controller TU2 , and the third temperature controller TU3 may have different temperatures or the same temperature.

[0292] For example, the first temperature controller TU1, the second temperature controller TU2, and the third temperature controller TU3 may be in direct contact with the first substrate SUB1 and may have a higher temperature than the first substrate SUB1 to heat components disposed on the first substrate SUB1 and may have a lower temperature than the first substrate SUB1 to cool components disposed on the first substrate SUB1.

[0293] Reference Figure 8 , each of the first temperature controller TU1 , the second temperature controller TU2 , and the third temperature controller TU3 may include metal.

[0294] The first temperature controller TU1 , the second temperature controller TU2 , and the third temperature controller TU3 may include metals having different thermal conductivities.

[0295] Therefore, even if the plate PL (for example, see Figure 7 ) supply the same amount of heat, the temperature of the first temperature controller TU1, the temperature of the second temperature controller TU2 and the temperature of the third temperature controller TU3 may also be different.

[0296] According to an embodiment, the metal included in the first temperature controller TU1 may have better thermal conductivity than the metal included in the second temperature controller TU2 .

[0297] In addition, the metal included in the second temperature controller TU2 may have better thermal conductivity than the metal included in the third temperature controller TU3.

[0298] The metal according to the embodiment may include silver (Ag), Cu, Mo, titanium (Ti), and the like.

[0299] When the same amount of heat is supplied from the panel PL, the first temperature controller TU1 may have a higher temperature than the second and third temperature controllers TU2 and TU3 , and the second temperature controller TU2 may have a higher temperature than the third temperature controller TU3 .

[0300] Meanwhile, gaps between the first temperature controller TU1 , the second temperature controller TU2 , and the third temperature controller TU3 may be filled with an insulating material or air.

[0301] Reference Fig. 9 , the first light emitting area LA1 may overlap with the first temperature controller TU1.

[0302] The second light emitting area LA2 may overlap with the second temperature controller TU2.

[0303] The third light emitting area LA3 may overlap with the third temperature controller TU3.

[0304] The scattering layer SC overlapping the first light emitting area LA1 may be heated to a first temperature by the first temperature controller TU1.

[0305] The scattering layer SC overlapping the second light emitting area LA2 may be heated to a second temperature by the second temperature controller TU2.

[0306] The scattering layer SC overlapping the third light emitting area LA3 may be heated to a third temperature by the third temperature controller TU3.

[0307] For example, the first temperature, the second temperature, and the third temperature may be different from each other.

[0308] The non-light emitting areas NLA1 , NLA2 , and NLA3 positioned between the light emitting areas LA1 , LA2 , and LA3 do not contact the temperature controllers TU1 , TU2 , and TU3 , and do not directly receive heat.

[0309] The scattering layer SC overlapping the non-light emitting areas NLA1, NLA2, and NLA3 may not overlap the temperature controllers TU1, TU2, and TU3.

[0310] The scattering layer SC overlapped with the non-light emitting areas NLA1, NLA2, and NLA3 may have a fourth temperature.

[0311] The fourth temperature may be lower than the third temperature.

[0312] A temperature difference between the scattering layer SC overlapping the first light emitting area LA1 and the first non-light emitting area NLA1 is greater than a temperature difference between the scattering layer SC overlapping the second light emitting area LA2 and the second non-light emitting area NLA2.

[0313] A temperature difference between the scattering layer SC overlapping the second light emitting area LA2 and the second non-light emitting area NLA2 is greater than a temperature difference between the scattering layer SC overlapping the third light emitting area LA3 and the third non-light emitting area NLA3.

[0314] The temperature difference according to an embodiment may be about 2 degrees (° C.) to about 100 degrees (° C.).

[0315] Due to this temperature difference, the scatterer included in the scattering layer SC may move.

[0316] Reference Fig. 9 and Fig.10 As shown by the arrow in , the scatterer may move by a first movement amount between the scattering layer SC overlapping the first light emitting area LA1 and the scattering layer SC overlapping the first non-light emitting area NLA1 having the largest temperature difference.

[0317] Next, the scatterer may move a second movement amount smaller than the first movement amount between the scattering layer SC overlapping the second light emitting area LA2 and the scattering layer SC overlapping the second non-light emitting area NLA2.

[0318] Finally, the scatterer may move a third movement amount smaller than the second movement amount between the scattering layer SC overlapping the third light emitting area LA3 and the scattering layer SC overlapping the third non-light emitting area NLA3.

[0319] Fig.10The thickness of the arrow in represents the amount of movement of the scatterer.

[0320] The thicker the arrow, the greater the movement of the scatterer.

[0321] In one embodiment, the amount of the scatterer included in the scattering layer SC overlapping the third light emitting area LA3 may be greater than the amount of the scatterer included in the scattering layer SC overlapping the second light emitting area LA2.

[0322] The amount of the scatterer included in the scattering layer SC overlapping the second light emitting area LA2 may be greater than the amount of the scatterer included in the scattering layer SC overlapping the first light emitting area LA1.

[0323] In addition, among the scattering layers SC overlapping the non-emission regions NLA1, NLA2, and NLA3, the amount of scatterer included in the scattering layer SC overlapping the first non-emission region NLA1 is greater than that in the scattering layer SC overlapping the second non-emission region NLA2.

[0324] The amount of the scatterer included in the scattering layer SC overlapping the second non-light emitting area NLA2 may be greater than the amount of the scatterer included in the scattering layer SC overlapping the third non-light emitting area NLA3.

[0325] Although an embodiment in which the temperature control unit TU heats the scattering layer SC is shown, it is not limited thereto, and an embodiment in which the temperature control unit TU cools the scattering layer SC is also possible.

[0326] The scattering layer SC according to the embodiment may include a plurality of regions having different concentrations of scatterers while continuously overlapping the entire surface of the first substrate SUB1.

[0327] By providing diffusers having different densities according to the color of emitted light, the side brightness of the display device can be improved.

[0328] In the following, reference will be made to Figures 11 to 14 A method of manufacturing a display device according to an embodiment is described.

[0329] Fig.11 , Fig.12 , Fig.13 and Fig.14 is a diagram of a method of manufacturing a display device according to an embodiment.

[0330] Description of the same components as those described above will be omitted.

[0331] Reference Fig.11 , in the method of manufacturing the display device according to the embodiment, the display unit DC is formed on the first substrate SUB1.

[0332] The display unit DC may have a previous reference Figure 3 The stacking structure described herein is omitted and a detailed description thereof will be omitted below.

[0333] The partition wall BK is formed on the display cell DC.

[0334] The partition wall BK may include a first opening OP1 , a second opening OP2 , and a third opening OP3 disposed in a region corresponding to a pixel opening.

[0335] The size of the first opening OP1 , the size of the second opening OP2 , and the size of the third opening OP3 may be different or the same.

[0336] A scattering layer SC including a scatterer is formed on the partition wall BK.

[0337] The scattering layer SC may be formed on the entire surface of the first substrate SUB1.

[0338] The scattering layer SC may cover the top surface and the side surface of the partition wall BK and fill each of the openings OP1 , OP2 , and OP3 .

[0339] The scattering layer SC may be formed through a coating process, an inkjet process, or a photolithography process.

[0340] The method of forming the scattering layer SC may not be limited.

[0341] like Fig.11 As shown in FIG, a temperature control unit TU is provided on the rear surface of the first substrate SUB1. The temperature control unit TU including the first, second and third temperature controllers TU1, TU2 and TU3 may overlap the first, second and third non-emission areas NLA1, NLA2 and NLA3.

[0342] The temperature control unit TU may include a first temperature controller TU1 , a second temperature controller TU2 , a third temperature controller TU3 , and a plate PL.

[0343] The plate PL may heat or cool the first temperature controller TU1 , the second temperature controller TU2 , and the third temperature controller TU3 .

[0344] The plate PL may heat or cool the first temperature controller TU1 , the second temperature controller TU2 , and the third temperature controller TU3 to predetermined temperatures.

[0345] The first temperature controller TU1 , the second temperature controller TU2 , and the third temperature controller TU3 may have different temperatures or the same temperature.

[0346] For example, the first temperature controller TU1, the second temperature controller TU2, and the third temperature controller TU3 have higher temperatures than the first substrate SUB1 and the first temperature controller TU1, the second temperature controller TU2, and the third temperature controller TU3 are in direct contact with the first substrate SUB1. The plate PL may heat components disposed on the first substrate SUB1 or may cool components disposed on the first substrate SUB1.

[0347] Reference Fig.12 , each of the first temperature controller TU1 , the second temperature controller TU2 , and the third temperature controller TU3 may include metal.

[0348] The first temperature controller TU1 , the second temperature controller TU2 , and the third temperature controller TU3 may include metals having different thermal conductivities.

[0349] Therefore, even if the plate PL (for example, see Fig.11 ) supply the same heat, the temperatures of the first temperature controller TU1, the second temperature controller TU2 and the third temperature controller TU3 may also be different from each other.

[0350] According to an embodiment, the metal included in the first temperature controller TU1 may have better thermal conductivity than the metal included in the second temperature controller TU2 .

[0351] In addition, the metal included in the second temperature controller TU2 may have higher thermal conductivity than the metal included in the third temperature controller TU3.

[0352] Therefore, when the same amount of heat is supplied from the panel PL, the temperature of the first temperature controller TU1 is higher than that of the second temperature controller TU2 , and the temperature of the second temperature controller TU2 is higher than that of the third temperature controller TU3 .

[0353] Meanwhile, gaps between the first temperature controller TU1 , the second temperature controller TU2 , and the third temperature controller TU3 may be filled with an insulating material or air.

[0354] Reference Fig.13 , according to the temperature control unit TU contacting the first substrate SUB1, the first non-light emitting area NLA1 may overlap with the first temperature controller TU1.

[0355] The second non-light emitting area NLA2 may overlap with the second temperature controller TU2.

[0356] The third non-light emitting area NLA3 may overlap with the third temperature controller TU3.

[0357] The scattering layer SC overlapping the first non-luminous area NLA1 may be heated to a first temperature, the scattering layer SC overlapping the second non-luminous area NLA2 may be heated to a second temperature lower than the first temperature, and the scattering layer SC overlapping the third non-luminous area NLA3 may be heated to a third temperature lower than the second temperature.

[0358] The metal included in each of the first, second, and third temperature controllers TU1, TU2, and TU3 may not overlap with the light emitting areas LA1, LA2, and LA3.

[0359] Each of the first, second, and third temperature controllers TU1, TU2, and TU3 may include an opening disposed in a region corresponding to the light emitting regions LA1, LA2, and LA3.

[0360] The openings may be filled with insulating material, or the openings may be empty spaces with air gaps located therein.

[0361] The light emitting areas LA1, LA2, and LA3 do not overlap with the metal of the temperature controllers TU1, TU2, and TU3 transferring heat and do not directly receive heat.

[0362] The scattering layer SC overlapping the light emitting area LA may have a fourth temperature.

[0363] The fourth temperature may be lower than the third temperature.

[0364] A first temperature difference between the scattering layer SC overlapping the first non-emission area NLA1 and the first emission area LA1 is greater than a second temperature difference between the scattering layer SC overlapping the second non-emission area NLA2 and the second emission area LA2.

[0365] The second temperature difference between the scattering layer SC overlapping the second non-luminous area NLA2 and the second luminous area LA2 is greater than the third temperature difference between the scattering layer SC overlapping the third non-luminous area NLA3 and the third luminous area LA3.

[0366] Due to the temperature difference, the scatterer included in the scattering layer SC may move.

[0367] The greater the temperature difference, the greater the amount of scatterers that move.

[0368] Reference Fig.13 and Fig.14, the amount of the scatterer moving from the scattering layer SC overlapping the first non-light emitting area NLA1 to the scattering layer SC overlapping the first light emitting area LA1 may be greater than the amount of the scatterer moving from the scattering layer SC overlapping the second non-light emitting area NLA2 to the scattering layer SC overlapping the second light emitting area LA2.

[0369] The amount of the scatterer moving from the scattering layer SC overlapping the second non-light emitting area NLA2 to the scattering layer SC overlapping the second light emitting area LA2 may be greater than the amount of the scatterer moving from the scattering layer SC overlapping the third non-light emitting area NLA3 to the scattering layer SC overlapping the third light emitting area LA3.

[0370] The amount of moving scatterers is expressed as Fig.14 The thickness of the arrow in .

[0371] The scattering layer SC overlaps the first light emitting area LA1, the scattering layer SC overlaps the second light emitting area LA2, and the scattering layer SC overlaps the third light emitting area LA3. The amount of scatterers included in the scattering layer SC overlapping the first light emitting area LA1 is greater than the amount of scatterers included in the scattering layer SC overlapping the second light emitting area LA2, and the amount of scatterers included in the scattering layer SC overlapping the second light emitting area LA2 is greater than the amount of scatterers included in the scattering layer overlapping the third light emitting area LA3.

[0372] The amount of the scatterer moving from the scattering layer SC overlapping the first non-emission area NLA1 to the scattering layer SC overlapping the first emission area LA1 is greater than the amount of the scatterer moving from the scattering layer SC overlapping the second non-emission area NLA2 to the scattering layer SC overlapping the second emission area LA2.

[0373] The scattering layer SC according to the embodiment may include a plurality of regions having different concentrations of scatterers while continuously overlapping the entire surface of the first substrate SUB1.

[0374] By providing scatterers having different concentrations according to regions according to the color of emitted light, the side brightness of the display device can be improved.

[0375] In the following, reference will be made to Fig.15 and Fig.16 A method of manufacturing a display device according to another embodiment is described.

[0376] Fig.15 and Fig.16 is a diagram of a method of manufacturing a display device according to an embodiment.

[0377] First, if Fig.15 As shown in FIG. 1 , in the method of manufacturing the display device according to the embodiment, the partition wall BK is formed on the display cell DC.

[0378] A scattering layer SC including a scatterer is formed on the partition wall BK.

[0379] The scattering layer SC may be formed on the entire surface of the display cell DC.

[0380] The scattering layer SC may cover the top surface and the side surfaces of the partition wall BK.

[0381] The scattering layer SC may be formed through a coating process, an inkjet process, or a photolithography process.

[0382] The method of forming the scattering layer SC may not be limited.

[0383] Then, a temperature control unit TU is provided on the plate PL.

[0384] Although this specification shows a configuration in which the temperature control unit TU is in direct contact with the rear surface of the display unit DC for the sake of convenience, as described above, the temperature control unit TU may be in direct contact with the rear surface of the first substrate SUB1.

[0385] The temperature control unit TU may include a first temperature controller TU1 , a second temperature controller TU2 , a third temperature controller TU3 , and a plate PL.

[0386] The first temperature controller TU1 , the second temperature controller TU2 , and the third temperature controller TU3 may have different temperatures or the same temperature.

[0387] For example, the first temperature controller TU1, the second temperature controller TU2, and the third temperature controller TU3 have a higher temperature than the display unit DC, and the first temperature controller TU1, the second temperature controller TU2, and the third temperature controller TU3 are in direct contact with the display unit DC. The component disposed on the display unit DC may be heated by the temperature control unit TU, or the component disposed on the display unit DC may be cooled by the temperature control unit TU.

[0388] The first temperature controller TU1 , the second temperature controller TU2 , and the third temperature controller TU3 may include metal layers ML1 , ML2 , and ML3 including the same metal.

[0389] However, the first temperature controller TU1 , the second temperature controller TU2 , and the third temperature controller TU3 may include metal layers ML1 , ML2 , and ML3 having different thicknesses, respectively.

[0390] The thickness of the metal layer included in the first temperature controller TU1 (i.e., the first metal layer ML1) may be greater than the thickness of the metal layer included in the second temperature controller TU2 (i.e., the second metal layer ML2). The thickness of the metal layer included in the second temperature controller TU2 (i.e., the second metal layer ML2) may be greater than the thickness of the metal layer included in the third temperature controller TU3 (i.e., the third metal layer ML3).

[0391] Also, the second temperature controller TU2 and the third temperature controller TU3 may include insulating layers IIL2 and IIL3 having different thicknesses, respectively.

[0392] The first temperature controller TU1 includes no insulating layer, the second temperature controller TU2 includes a second insulating layer IIL2 having a first thickness, and the third temperature controller TU3 includes a third insulating layer IIL3 having a second thickness.

[0393] The first thickness may be smaller than the second thickness.

[0394] The second insulating layer IIL2 and the third insulating layer IIL3 may include a heat insulating material (eg, a silicon-based compound, a carbon-based compound, or a polymer-based compound).

[0395] According to an embodiment, the first temperature controller TU1 includes a first metal layer ML1 disposed on the board PL. And the second temperature controller TU2 includes a second metal layer ML2 disposed on the board PL and an insulating layer IIL2 disposed on the second metal layer ML2. The third temperature controller TU3 includes a third metal layer ML3 disposed on the board PL and a third insulating layer IIL3 disposed on the third metal layer ML3.

[0396] Even if the same heat is supplied from the plate PL connected to the first, second, and third temperature controllers TU1, TU2, and TU3, the temperatures provided by the first, second, and third temperature controllers TU1, TU2, and TU3 may be different.

[0397] When the same temperature is provided from the panel PL, the temperature provided by the first temperature controller TU1 is greater than the temperature provided by the second temperature controller TU2, and the temperature provided by the second temperature controller TU2 is greater than the temperature provided by the third temperature controller TU3.

[0398] According to the temperature control unit TU contacting the display unit DC, the first light emitting area LA1 may overlap with the first temperature controller TU1.

[0399] The second light emitting area LA2 may overlap with the second temperature controller TU2.

[0400] The third light emitting area LA3 may overlap with the third temperature controller TU3.

[0401] The scattering layer SC overlapping the first light emitting area LA1 may be heated to a first temperature by the first temperature controller TU1.

[0402] The scattering layer SC overlapping the second light emitting area LA2 may be heated to a second temperature lower than the first temperature by the second temperature controller TU2.

[0403] The scattering layer SC overlapping the third light emitting area LA3 may be heated to a third temperature lower than the second temperature by the third temperature controller TU3.

[0404] The non-light emitting areas NLA1 , NLA2 , and NLA3 positioned between the light emitting areas LA1 , LA2 , and LA3 do not overlap with the temperature controllers TU1 , TU2 , and TU3 , and do not directly receive heat.

[0405] The scattering layer SC overlapped with the non-light emitting areas NLA1, NLA2, and NLA3 may have a fourth temperature.

[0406] The fourth temperature may be lower than the third temperature.

[0407] A temperature difference between the scattering layer SC overlapping the first light emitting area LA1 and the first non-light emitting area NLA1 is greater than a temperature difference between the scattering layer SC overlapping the second light emitting area LA2 and the second non-light emitting area NLA2.

[0408] A temperature difference between the scattering layer SC overlapping the second light emitting area LA2 and the second non-light emitting area NLA2 is greater than a temperature difference between the scattering layer SC overlapping the third light emitting area LA3 and the third non-light emitting area NLA3.

[0409] Due to the temperature difference, the scatterer included in the scattering layer SC may move.

[0410] exist Fig.16 When the difference between the first temperature and the fourth temperature, the difference between the second temperature and the fourth temperature, and the difference between the third temperature and the fourth temperature are not large enough to cause movement of the scatterer, heat or light is applied to the scattering layer SC and an additional heat gradient may be induced.

[0411] For example, light in the near infrared wavelength range may be supplied to the scattering layer SC at 4000 Mw for less than 1 minute.

[0412] According to this, the scatterer may be moved by a first amount from the scattering layer SC overlapping the first light emitting area LA1 to the scattering layer SC overlapping the first non-light emitting area NLA1.

[0413] Next, the scatterer may be moved by a second amount from the scattering layer SC overlapping the second light emitting area LA2 to the scattering layer SC overlapping the second non-light emitting area NLA2.

[0414] Finally, the scatterer may be moved by a third amount from the scattering layer SC overlapping the third light emitting area LA3 to the scattering layer SC overlapping the third non-light emitting area NLA3.

[0415] The first amount may be greater than the second amount, and the second amount may be greater than the third amount.

[0416] In the following, reference will be made to Fig.17 and Fig.18 A method of manufacturing a display device according to another embodiment is described.

[0417] Fig.17 and Fig.18 is a diagram of a method of manufacturing a display device according to an embodiment.

[0418] In addition to the locations of the metal layers ML1, ML2 and ML3 and the locations of the insulating layers, Fig.17 and Fig.18 The embodiments can be used with Fig.15 and Fig.16 The second temperature controller TU2 comprises a second insulating layer IIL2 positioned between the plate PL and the second metal layer ML2. The third temperature controller TU3 comprises a third insulating layer IIL3 positioned between the plate PL and the third metal layer ML3.

[0419] The rest of the contents may be the same as above.

[0420] In the following, reference will be made to Fig.19A and Fig.19B A structure of a display device according to another embodiment is described.

[0421] Fig.19A and Fig.19B is a schematic cross-sectional view of a display panel according to another embodiment.

[0422] Description of the same components as those described above will be omitted.

[0423] First, refer to Fig.19A , the display device according to the embodiment may include a display unit DC and a color conversion unit CC disposed on the display unit DC.

[0424] The color conversion unit CC may include an auxiliary metal layer MT positioned on the display unit DC.

[0425] The auxiliary metal layer MT may be in a floating state without being connected to a separate voltage source.

[0426] The auxiliary metal layer MT may overlap a partition wall BK which will be described later.

[0427] The auxiliary metal layer MT may be positioned between the partition wall BK and the pixel defining layer PDL.

[0428] The thickness of the auxiliary metal layer MT may be about 20 micrometers or less, and the width of the auxiliary metal layer MT may be about 80 micrometers or less.

[0429] When the auxiliary metal layer MT overlaps the partition wall BK, the metal constituting the auxiliary metal layer MT may have a transmittance of 90% or less.

[0430] Alternatively, although not shown, when the auxiliary metal layer MT overlaps the light emitting region, the transmittance may be 90% or more.

[0431] The auxiliary metal layer MT may include Al, Ag, or Cu.

[0432] In addition, the auxiliary metal layer MT may also include silicon carbide, nickel-chromium (Ni-Cr), tungsten, quartz, TiO 2 and SiO 2 At least one of them can absorb near-infrared rays.

[0433] The insulating layer IL may be positioned between adjacent auxiliary metal layers MT.

[0434] The insulating layer IL may include an inorganic material or an organic material.

[0435] This specification shows an embodiment in which the insulating layer IL is located between adjacent auxiliary metal layers MT, but is not limited thereto, and the insulating layer IL may be provided in a form of completely covering the plurality of auxiliary metal layers MT.

[0436] That is, the insulating layer IL may be positioned to cover upper surfaces of the plurality of auxiliary metal layers MT.

[0437] The partition wall BK may be positioned on the auxiliary metal layer MT.

[0438] The scattering layer SC may be positioned on the partition wall BK and the insulating layer IL.

[0439] The scattering layer SC may overlap the entire surface of the first substrate SUB1.

[0440] The scattering layer SC may continuously overlap the first substrate SUB1.

[0441] The scattering layer SC may cover the top and side surfaces of the partition wall BK, and may be positioned in the openings OP1 , OP2 , and OP3 .

[0442] The third insulating layer IL3 may be positioned on the scattering layer SC, and the color filters CF1 , CF2 , and CF3 may be positioned on the third insulating layer IL3 .

[0443] Next, refer to Fig.19B , the display device according to the embodiment may include a display unit DC and a color conversion unit CC located on the display unit DC.

[0444] The color conversion cell CC may include an auxiliary metal layer MT positioned on the partition wall BK.

[0445] The auxiliary metal layer MT may be in a floating state without being connected to a separate voltage source.

[0446] A portion of the scattering layer SC may cover the upper surface of the auxiliary metal layer MT.

[0447] The third insulating layer IL3 may be positioned on the scattering layer SC.

[0448] Color filters CF1 , CF2 , and CF3 may be positioned on the third insulating layer IL3 .

[0449] Although this specification shows Fig.19A and Fig.19B Among them Figure 5 In the embodiment of the present invention, the auxiliary metal layer MT is added to the display device, but the auxiliary metal layer MT is not limited thereto and can also be applied to Figure 3 and Figure 4 Embodiment of the invention.

[0450] In the following, reference will be made to Figure 20 to Figure 23 A method of manufacturing a display device according to an embodiment is described.

[0451] Fig. 20 , Fig.21 , Fig. 22 and Fig.23 is a diagram of a method of manufacturing a display device according to another embodiment.

[0452] Description of the same components as those described above will be omitted.

[0453] Reference Fig. 20 , the display device according to the embodiment may include an auxiliary metal layer MT positioned on the display cell DC.

[0454] The auxiliary metal layer MT according to an embodiment may be in a floating state not connected to a separate voltage source.

[0455] Reference Fig.19A The detailed structure is described and in the following, Figure 20 to Figure 23 is a schematic diagram showing only some components.

[0456] like Fig.21 As shown in , the auxiliary metal layer MT may have different widths.

[0457] For example, the auxiliary metal layer MT1 surrounding the first light emitting area LA1 has a first width, the auxiliary metal layer MT2 surrounding the second light emitting area LA2 has a second width smaller than the first width, and the auxiliary metal layer MT3 surrounding the third light emitting area LA3 may have a third width smaller than the second width.

[0458] exist Fig. 22 and Fig.23 In the embodiment, the widths of the auxiliary metal layer MT surrounding the light emitting areas LA1, LA2, and LA3 may be different.

[0459] Reference Fig. 22 , a panel PL is provided under the display cell DC under the first substrate SUB1.

[0460] The panel PL may supply heat to the display panel according to the embodiment.

[0461] In particular, the plate PL may supply heat to the auxiliary metal layer MT.

[0462] When the same amount of heat is supplied to the auxiliary metal layer MT, the first auxiliary metal layer MT1 having a relatively large width (see Fig.21 ) has the highest temperature, and the second auxiliary metal layer MT2 (see Fig.21 ) has the second highest temperature. Finally, the third auxiliary metal layer MT3 may have a relatively low temperature.

[0463] Since the auxiliary metal layers MT1 and MT2 have different widths, the temperature difference between the scattering layer SC overlapping the first light emitting area LA1 and the scattering layer SC overlapping the non-light emitting area NLA is greater than the temperature difference between the scattering layer SC overlapping the second light emitting area LA2 and the scattering layer SC overlapping the non-light emitting area NLA.

[0464] Since the widths of the auxiliary metal layers MT2 and MT3 are different, the temperature difference between the scattering layer SC overlapping the second light emitting area LA2 and the scattering layer SC overlapping the non-light emitting area NLA is greater than the temperature difference between the scattering layer SC overlapping the third light emitting area LA3 and the scattering layer SC overlapping the non-light emitting area NLA.

[0465] Due to this temperature difference, the scatterer included in the scattering layer SC may move.

[0466] The movement amount of the scatterer may be greatest between the scattering layer SC overlapping the first light emitting area LA1 and the non-light emitting area NLA having the greatest temperature difference.

[0467] Next, the scatterer may be moved between the second light emitting area LA2 and the scattering layer SC overlapping the non-light emitting area NLA.

[0468] Finally, a relatively small amount of scatterer may be moved between the scattering layer SC overlapping the third light emitting area LA3 and the non-light emitting area NLA.

[0469] In addition, if Fig.23 As shown in FIG. 1 , when the temperature difference between the light emitting areas LA1 , LA2 , and LA3 and the non-light emitting area NLA is not large, heat or light is applied to the scattering layer SC to generate additional movement of the scatterer.

[0470] Will refer to Fig.24 and Fig.25 A method of manufacturing a display device according to another embodiment is described.

[0471] Fig.24 and Fig.25 is a diagram of a method of manufacturing a display device according to another embodiment.

[0472] Description of the same components as those described above will be omitted.

[0473] Reference Fig.24 , the display device according to the embodiment may include an auxiliary metal layer MT positioned on the partition wall BK.

[0474] The auxiliary metal layer MT according to an embodiment may be in a floating state not connected to a separate voltage source.

[0475] Reference Fig.19B Describes the specific structure, Fig.24 and Fig.25 is a schematic diagram showing only some components.

[0476] As mentioned above Fig.21 As shown in , the auxiliary metal layer MT may have different widths.

[0477] For example, the auxiliary metal layer MT1 surrounding the first light emitting area LA1 has a first width, the auxiliary metal layer MT2 surrounding the second light emitting area LA2 has a second width smaller than the first width, and the auxiliary metal layer MT3 surrounding the third light emitting area LA3 may have a third width smaller than the second width.

[0478] Reference Fig.24 And combined with Fig.21 , a panel PL is provided under the first substrate SUB1 and the display cell DC.

[0479] According to an embodiment, the board PL may supply heat to the display panel.

[0480] The plate PL may provide heat to the auxiliary metal layer MT.

[0481] When the same heat is provided to the auxiliary metal layers MT, the first auxiliary metal layer MT1 having a relatively large width has a first temperature, and the second auxiliary metal layer MT2 has a second temperature lower than the first temperature. Finally, the third auxiliary metal layer MT3 may have a third temperature lower than the second temperature.

[0482] Since the auxiliary metal layers MT1 and MT2 have different widths, the temperature difference between the scattering layer SC overlapping the first light emitting area LA1 and the scattering layer SC overlapping the non-light emitting area NLA is greater than the temperature difference between the scattering layer SC overlapping the second light emitting area LA2 and the non-light emitting area NLA.

[0483] Since the auxiliary metal layers MT2 and MT3 have different widths, the temperature difference between the scattering layer SC overlapping the second light emitting area LA2 and the scattering layer SC overlapping the non-light emitting area NLA is greater than the temperature difference between the scattering layer SC overlapping the third light emitting area LA3 and the scattering layer SC overlapping the non-light emitting area NLA.

[0484] Due to this temperature difference, the scatterer included in the scattering layer SC may move.

[0485] The movement amount of the scatterer may be greatest between the scattering layer SC overlapping the first light emitting area LA1 and the non-light emitting area NLA having the greatest temperature difference.

[0486] Next, the scatterer may be moved between the scattering layer SC overlapping the second light emitting area LA2 and the scattering layer SC overlapping the non-light emitting area NLA.

[0487] Finally, a relatively small amount of the scatterer may be moved between the scattering layer SC overlapping the third light emitting area LA3 and the scattering layer SC overlapping the non-light emitting area NLA.

[0488] In addition, when the temperature difference between the light-emitting areas LA1, LA2 and LA3 and the non-light-emitting area NLA is not large, as shown in FIG. Fig.25 As shown in , heat or light is applied to the scattering layer SC, so additional movement of the scatterer can be induced.

[0489] Hereinafter, various embodiments of the scatterer included in the above-mentioned scattering layer will be described.

[0490] Fig.26A , Fig.26B , Fig.26C and Fig.26D is a schematic cross-sectional view of a scatterer according to an embodiment.

[0491] like Fig.26A As shown in FIG. 1 , the scatterer SCa may have a core structure and a shell structure, wherein the structure includes a material selected from SiO 2 , Fe 2 O 3 ,BaSO 4 、Al 2 O 3 、ZnO、ZrO 2 and TiO 2 A core SCa1 ​​of one or more of the group consisting of and a shell MTL including a metal and surrounding the core SCa1.

[0492] Alternatively, if Fig.26B As shown in FIG. 1 , the scatterer SCa may have a core structure and a shell structure, wherein the structure includes a metal core MTL and a shell SCa1, wherein the shell SCa1 ​​includes a metal selected from SiO 2 , Fe 2 O 3 ,BaSO 4 、Al 2 O 3 、ZnO、ZrO 2 and TiO 2 One or more of the groups.

[0493] Alternatively, if Fig.26C As shown in FIG. , the scatterer SCa may be a metal and a material selected from SiO 2 , Fe 2 O 3 ,BaSO 4 、Al 2 O 3 、ZnO、ZrO 2 A mixture of at least one scattering substance from the group consisting of.

[0494] In addition, if Fig.26D As shown in , the scatterer SCa, which is a mixture of scattering material and metal, can be transformed into various shapes.

[0495] When the scattering layer SC (see Figure 3 ) Fig.26A , Fig.26B , Fig.26C and Fig.26D The scatterer SCa shown in FIG. 1 can be accelerated from the plate PL (see Figure 7 The conduction of heat provided by the

[0496] Since the movement of the scatterer SCa is easy, a scattering layer having a different concentration can be easily provided for each region.

[0497] Fig. 27is an image showing the movement of the scatterer according to the temperature difference.

[0498] Fig. 27 (a) shows that when a plate PL (see Figure 7 Image of a scatterer that moves strongly (strong visibility) when the scatterer is attached to a substrate with a temperature of 22 degrees (°C).

[0499] Fig. 27 (b) in FIG. 1 is an image showing that when the plate PL having 20 degrees (° C.) is attached to the substrate having 22 degrees (° C.), the movement of the scatterer is not obvious (weak visibility).

[0500] Fig. 27 (c) in FIG. 1 is an image showing that when the plate PL having 30 degrees (° C.) is attached to the substrate having 22 degrees (° C.), the scatterer is strongly moved.

[0501] That is, it was determined that the temperature gradient between the substrate and the plate accelerated the movement of the scatterer.

[0502] Although the embodiments of the inventive concept have been described in detail above, the scope of the inventive concept is not limited thereto, and various modifications and improvements made by those skilled in the art using the basic concepts of the inventive concept defined in the appended claims are also included in the scope of the inventive concept.

Claims

1. A display device, wherein: The display device comprises: A substrate, comprising a first light emitting region, a second light emitting region and a third light emitting region; A transistor is disposed on the substrate; a light emitting element connected to the transistor; An encapsulation layer, disposed on the light-emitting element; a partition wall, disposed on the encapsulation layer; and a scattering layer, disposed on the partition wall, wherein the scattering layer is continuously disposed on the entire surface of the substrate, and The concentration of the scatterer in the scattering layer overlapping the first light emitting region, the concentration of the scatterer in the scattering layer overlapping the second light emitting region, and the concentration of the scatterer in the scattering layer overlapping the third light emitting region are different.

2. The display device according to claim 1, wherein: The substrate further includes a first non-luminescent region, a second non-luminescent region, and a third non-luminescent region.

3. The display device according to claim 2, wherein: The scattering layer overlaps the first non-light emitting area, the second non-light emitting area, and the third non-light emitting area, and includes a scatterer having a different concentration in each non-light emitting area.

4. The display device according to claim 3, wherein: The concentration of the scatterer included in the scattering layer overlapping the second light-emitting area is greater than the concentration of the scatterer included in the scattering layer overlapping the first light-emitting area, and the concentration of the scatterer included in the scattering layer overlapping the third light-emitting area is greater than the concentration of the scatterer included in the scattering layer overlapping the second light-emitting area.

5. The display device according to claim 4, wherein: The concentration of the scatterer included in the scattering layer overlapping the first non-luminous area is lower than the concentration of the scatterer included in the scattering layer overlapping the second non-luminous area, and the concentration of the scatterer included in the scattering layer overlapping the second non-luminous area is lower than the concentration of the scatterer included in the scattering layer overlapping the third non-luminous area.

6. The display device according to claim 1, wherein: The scattering layer covers a side surface and one of a top surface and a bottom surface of the partition wall, and fills an opening of the partition wall.

7. The display device according to claim 1, wherein: The display device further includes: a color filter, disposed on the scattering layer, Wherein, the color filter comprises: a first color filter overlapping the first light emitting region; a second color filter overlapping the second light emitting region; and The third color filter overlaps with the third light emitting area.

8. The display device according to claim 1, wherein: The light emitting element emits white light; and The light emitting elements have a series structure.

9. A method for manufacturing a display device, wherein: The method comprises: forming a display unit on the front side of the substrate; forming a partition wall on the display unit; forming a scattering layer on the partition wall; providing a temperature control unit on a rear side of the substrate; and changing the temperature of the scattering layer by the temperature control unit, and Wherein, a scatterer is included in the scattering layer, and the scatterer moves in the step of changing the temperature of the scattering layer.

10. The method for manufacturing a display device according to claim 9, wherein: The substrate includes a first light emitting region, a second light emitting region, and a third light emitting region.

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