Display panel, display panel preparation method and display device

Abstract

The invention discloses a display panel, a display panel preparation method and a display device. The display panel comprises a first substrate; the light-emitting layer is arranged on one side of the first substrate, and the light-emitting layer comprises a plurality of light-emitting units; the color conversion structure is arranged on the side, away from the first substrate, of the light-emitting layer, the color conversion structure comprises a plurality of color conversion units corresponding to the light-emitting units, the color conversion units are arranged at intervals, and each color conversion unit comprises a first side face; and the reflecting layer at least partially covers the first side surface. The preparation of the high PPI display panel is facilitated, and the use performance of the display panel is improved.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic products, and in particular, relates to a display panel, a method for preparing a display panel, and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) and flat panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream in display devices.

[0003] However, the performance of current OLED display products needs to be improved.

[0004] Therefore, there is an urgent need for a new display panel, a method for manufacturing a display panel, and a display device. Summary of the invention

[0005] The embodiments of the present application provide a display panel, a method for manufacturing a display panel, and a display device, which improve the performance of the display panel.

[0006] On the one hand, an embodiment of the present application provides a display panel, including: a first substrate; a light-emitting layer, arranged on one side of the first substrate, the light-emitting layer including a plurality of light-emitting units; a color conversion structure, arranged on a side of the light-emitting layer away from the first substrate, the color conversion structure including a plurality of color conversion units arranged corresponding to the light-emitting units, the color conversion units being arranged at intervals, and the color conversion unit including a first side surface; and a reflective layer, at least a portion of the reflective layer covering the first side surface.

[0007] According to one aspect of the present application, the display panel also includes a color resist structure, which is arranged on the side of the color conversion structure away from the first substrate, and the color resist structure includes at least two color resist parts of different colors; preferably, along a direction perpendicular to the plane where the first substrate is located, the color conversion unit includes a second surface opposite to the first surface, the first surface is located between the second surface and the light-emitting unit, the first surface and the second surface respectively intersect with the first side surface, and the angle between the second surface and the first side surface is greater than or equal to 30° and less than or equal to 90°; preferably, the angle between the second surface and the first side surface is equal to 80°.

[0008] According to one aspect of the present application, the light-emitting unit includes a third surface opposite to the first surface, and the orthographic projection of the first surface on the first substrate covers the orthographic projection of the third surface on the first substrate; preferably, along a direction perpendicular to the plane where the first substrate is located, the color resistance portion includes a fourth surface and a fifth surface relative to each other, the fourth surface is arranged close to the first substrate relative to the fifth surface, and the orthographic projection of the fourth surface on the first substrate covers the orthographic projection of the second surface on the first substrate; preferably, the display panel also includes a second substrate arranged on the side of the color resistance structure away from the first substrate; preferably, the display panel also includes a shading layer, which is arranged between adjacent color resistance portions; preferably, the shading layer includes a black matrix material; preferably, the color conversion unit includes a quantum dot material.

[0009] According to one aspect of the present application, it also includes a first encapsulation layer, which is arranged on the side of the color resistance structure and the light shielding layer facing the first substrate, and at least part of the structure of the first encapsulation layer is located between the color resistance structure and the color conversion structure; preferably, the material of the first encapsulation layer includes an inorganic material; preferably, the material of the first encapsulation layer includes at least one of silicon nitride, silicon oxide, and silicon oxynitride; preferably, it also includes a second encapsulation layer, on the side of the color conversion structure facing the first substrate, the second encapsulation layer covers the color conversion structure and covers the part of the first encapsulation layer exposed to the color conversion structure; preferably, at least part of the structure of the second encapsulation layer is located between the color conversion unit and the reflective layer; or, at least part of the structure of the second encapsulation layer is located on the side of the reflective layer away from the color conversion unit; preferably, the material of the second encapsulation layer includes an inorganic material; preferably, the material of the second encapsulation layer includes at least one of silicon nitride, silicon oxide, and silicon oxynitride; preferably, it also includes a third encapsulation layer arranged between the light-emitting layer and the second encapsulation layer.

[0010] According to one aspect of the present application, the reflective layer includes a first part, and the first part covers the first side; preferably, the reflective layer also includes a second part, and the second part covers the part of the first encapsulation layer exposed to the color conversion structure; preferably, the first part and the second part are an integrated structure; preferably, the thickness of the reflective layer is greater than or equal to 0.3μm and less than or equal to 2μm; preferably, the reflectivity of the material of the reflective layer is greater than or equal to 50%; preferably, the material of the reflective layer includes at least one of aluminum, molybdenum, and titanium; preferably, along a direction parallel to the plane where the first substrate is located, the distance between adjacent color conversion units is less than or equal to 5μm.

[0011] On the other hand, the present invention also provides a method for preparing a display panel, comprising the following steps: providing a first substrate; forming a light-emitting layer on one side of the first substrate, the light-emitting layer comprising a plurality of light-emitting units; forming a color conversion structure, the color conversion structure comprising a plurality of spaced-apart color conversion units, the color conversion unit comprising a first side surface; forming a reflective layer, the reflective layer at least partially covering the first side surface; bonding a stacked structure comprising the color conversion structure and the reflective layer to the light-emitting layer, the color conversion unit and the light-emitting unit being arranged correspondingly.

[0012] According to another aspect of the present application, the step of forming a light-emitting layer on one side of the first substrate and the step of forming a color conversion structure on the side of the light-emitting layer facing away from the first substrate include: providing a second substrate, forming a color block structure on one side of the second substrate; forming a shading layer, wherein the shading layer is formed between adjacent color block portions; forming a first encapsulation layer on the side of the color block structure and the shading layer facing away from the second substrate; preferably, the second substrate includes a glass substrate.

[0013] According to another aspect of the present application, after the step of forming a color conversion structure on the side of the light-emitting layer facing away from the first substrate and before the step of forming a reflective layer, it also includes: forming a second encapsulation layer, on the side of the color conversion structure facing the first substrate, the second encapsulation layer covers the color conversion structure and covers the portion of the first encapsulation layer exposed to the color conversion structure; the step of forming a reflective layer includes: forming the reflective layer on at least one surface of the second encapsulation layer facing away from the first side.

[0014] According to another aspect of the present application, the step of forming a reflective layer includes: forming a reflective layer at least on a first side of the color conversion structure; after the step of forming the reflective layer, it also includes: forming a second encapsulation layer, wherein the second encapsulation layer at least covers a surface of the reflective layer on a side away from the color conversion structure.

[0015] Another aspect of the present invention provides a display device, comprising the display panel in any one of the above embodiments.

[0016] Compared with the prior art, the display panel provided by the embodiment of the present invention includes a first substrate, a light-emitting layer, a color resistance structure, a color conversion structure and a reflective layer. At least a part of the reflective layer structure covers the first side surface. On the one hand, it can reflect the light emitted from the light-emitting unit to the reflective layer. On the other hand, it can also block the mutual interference of the incoming light of adjacent color conversion units, prevent light crosstalk, and improve the display effect. Compared with the dam structure in the prior art, the width of the reflective layer along the direction parallel to the plane where the substrate is located is smaller, that is, the distance between adjacent color conversion units can be reduced, which is conducive to the preparation of high PPI display panels and improves the performance of the display panels. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 is a schematic structural diagram of a display panel provided by an embodiment of the present invention;

[0019] Figure 2 An embodiment of the present invention provides Figure 1 Schematic diagram of the cross-sectional structure at AA in the middle;

[0020] Figure 3 Another embodiment of the present invention provides Figure 1 Schematic diagram of the cross-sectional structure at AA in the middle;

[0021] Figure 4 is a schematic diagram of an optical path of a display panel provided by an embodiment of the present invention;

[0022] Figure 5 Another embodiment of the present invention provides Figure 1 Schematic diagram of the cross-sectional structure at AA in the middle;

[0023] Figure 6 Another embodiment of the present invention provides Figure 1 Schematic diagram of the cross-sectional structure at AA in the middle;

[0024] Figure 7 is a flow chart of a method for preparing a display panel provided by an embodiment of the present invention;

[0025] Figures 8 to 18 It is a cross-sectional schematic diagram of a structure obtained in a method for preparing a display panel provided in a series of embodiments of the present invention.

[0026] In the attached figure:

[0027] 100-first substrate; 200-light-emitting layer; 210-light-emitting unit; 300-color resistance structure; 310-color resistance part; 400-color conversion structure; 410-color conversion unit; 500-reflective layer; 510-first part; 520-second part; 501-reflective material layer; 600-first encapsulation layer; 700-second encapsulation layer; 800-third encapsulation layer; C1-first side; D1-first electrode layer; D2-second electrode layer; F1-first surface; F2-second surface; F3-third surface; F4-fourth surface; F5-fifth surface; P-pixel definition layer; J-second substrate; Z-light shielding layer. DETAILED DESCRIPTION

[0028] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present application and are not configured to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.

[0029] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0030] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "on" or "over" another layer or another region, it may mean that it is directly on the other layer or another region, or that other layers or regions are included between it and the other layer or another region. Moreover, if the component is turned over, the layer or a region will be "below" or "beneath" another layer or another region.

[0031] It is obvious to those skilled in the art that various modifications and changes can be made in the present application without departing from the spirit or scope of the present application. Therefore, the present application is intended to cover modifications and changes of the present application that fall within the scope of the corresponding claims (technical solutions for protection) and their equivalents. It should be noted that the implementation methods provided in the embodiments of the present application can be combined with each other without contradiction.

[0032] In the prior art, black organic materials are usually used to form a dam structure between adjacent color conversion units to prevent light crosstalk. In order to improve the quantum dot conversion efficiency, the thickness of the color conversion unit needs to be increased, and the thickness of the dam between the color conversion units also needs to be increased synchronously, resulting in excessive spacing between pixels and failure to achieve high PPI (Pixels Per Inch, the number of pixels per inch) display. When the color conversion unit emits light, a portion of the excitation light is transmitted laterally and absorbed by the black dam material. Therefore, a portion of the excitation light cannot be emitted from the display panel, resulting in low light output efficiency.

[0033] In order to solve the above problems, the display panel provided in the embodiment of the present invention is provided with a reflective layer. Compared with the dam structure in the prior art, the width of the reflective layer in the direction parallel to the plane where the substrate is located is smaller, that is, the distance between adjacent color conversion units can be reduced, which is conducive to the preparation of high PPI display panels and improves the performance of the display panel.

[0034] The embodiments of the present application provide a display panel, a method for manufacturing a display panel, and a display device. Figures 1 to 18 Various embodiments of a display panel, a method for manufacturing a display panel, and a display device are described.

[0035] See also Figures 1 to 3 A display panel provided in an embodiment of the present application includes: a first substrate 100; a light-emitting layer 200, which is arranged on one side of the first substrate 100, and the light-emitting layer 200 includes a plurality of light-emitting units 210; a color conversion structure 400, which is arranged on a side of the light-emitting layer 200 away from the first substrate 100, and the color conversion structure 400 includes a plurality of color conversion units 410 arranged corresponding to the light-emitting units 210, and each color conversion unit 410 is arranged at intervals, and the color conversion unit 410 includes a first side surface C1; and a reflective layer 500, at least a portion of which covers the first side surface C1.

[0036] The display panel provided by the embodiment of the present invention includes a first substrate 100, a light-emitting layer 200, a color-resistance structure 300, a color conversion structure 400 and a reflective layer 500. At least a part of the structure of the reflective layer 500 covers the first side surface C1. On the one hand, it can reflect the light emitted from the light-emitting unit 210 to the reflective layer 500. On the other hand, it can also block the interference of the incoming light of adjacent color conversion units 410, prevent light crosstalk, and improve the display effect. Compared with the dam structure in the prior art, the width of the reflective layer 500 along the direction parallel to the plane where the substrate is located is smaller, that is, the distance between adjacent color conversion units 410 can be reduced, which is conducive to the preparation of a high PPI display panel and improves the performance of the display panel.

[0037] It should be noted that, in this embodiment, at least a portion of the reflective layer 500 covers the first side surface C1, wherein the covering includes direct covering and indirect covering. Direct covering means that the reflective layer 500 is in direct contact with the first side surface C1. Figure 3 As shown, indirect coverage means that the reflective layer 500 and the first side surface C1 may also be provided with other film layers, such as a packaging layer, etc. Figure 2 shown.

[0038] The first substrate 100 may be a hard substrate, such as a glass substrate, or a flexible substrate, and its material may be polyimide, polystyrene, polyethylene terephthalate, polyparaxylene, polyethersulfone or polyethylene naphthalate. The first substrate 100 is mainly used to support the device disposed thereon.

[0039] Considering that a color conversion unit 410 is provided, the light emitted by the light-emitting unit 210 can be converted into different colors after passing through the color conversion unit 410. Therefore, the light-emitting unit 210 can adopt a monochrome light-emitting unit. For example, each light-emitting unit 210 adopts a blue light-emitting unit, and then the color conversion unit 410 is excited by blue light to emit light, thereby realizing full-color display of the display panel.

[0040] Optionally, in one embodiment, the light-emitting unit 210 is a blue light-emitting unit, and the color conversion structure 400 corresponding to the blue light emission location is to use a transparent adhesive layer; in another embodiment, the light-emitting unit 210 may be a light-emitting unit 210 of other colors, such as a purple light-emitting unit. In addition, different light-emitting units 210 may also be different color conversion units 410, as long as the wavelength of the light emitted by the light-emitting unit 210 is shorter than the wavelength of the light to be converted by the color conversion unit 410, because the shorter the wavelength of the light, the higher the energy, which can stimulate the color conversion unit 410 to emit light with lower energy than it, that is, longer wavelength.

[0041] See also Figure 4The light is emitted from the light emitting unit 210. After reaching the color conversion unit 410, the material of the color conversion unit 410 is stimulated to emit light. The light emitted by the material of the color conversion unit 410 is reflected by the reflective layer 500 in all directions and finally emitted from the side of the color conversion unit 410 away from the light emitting unit 210.

[0042] Optionally, scattering particles are provided in the transparent adhesive layer to improve the viewing angle, scatter the light entering the color conversion unit 410, and increase the viewing angle; optionally, scattering particles are also provided in the color conversion unit 410 to increase blue light absorption and improve the conversion efficiency of the color conversion unit 410.

[0043] Optionally, the color conversion unit 410 includes a quantum dot material, the quantum dot material can scatter light of various wavelength bands, and the light emitted from the light emitting unit 210 can penetrate the quantum dot material.

[0044] Quantum dot materials may include materials that transmit light.

[0045] Among them, the quantum dot material may be provided as an inorganic crystal substance or may be fine pores each equal to or smaller than several tens of nanometers (nm), and may absorb light of various wavelength bands and scatter light of a desired wavelength band.

[0046] See also Figures 2 to 3 In some optional embodiments, the color resist structure 300 is disposed on the side of the light emitting layer 200 away from the first substrate 100 , and the color resist structure 300 includes at least two color resist portions 310 of different colors.

[0047] It should be noted that the color-resistance structure 300 is used to filter light to emit light of different colors, and the color-resistance structure 300 includes at least two color-resistance parts 310 of different colors, wherein different colors specifically refer to different colors of light filtered by different color-resistance parts 310. For example, the external light is white light, which is filtered into red light after passing through the red color-resistance part, filtered into green light after passing through the green color-resistance part, and filtered into blue light after passing through the blue color-resistance part.

[0048] See also Figures 2 to 3 , along a direction perpendicular to the plane where the first substrate 100 is located, the color conversion unit 410 includes a second surface F2 opposite to the first surface F1, the first surface F1 and the light-emitting unit 210 are arranged opposite to each other, the first surface F1 and the first side surface C1 intersect, and the angle α between the second surface F2 and the first side surface C1 is greater than or equal to 30° and less than or equal to 90°.

[0049] It should be noted that the angle α between the second surface F2 and the first side surface C1 will affect the size and shape of the color conversion unit 410. For example, the smaller the angle between the second surface F2 and the first side surface C1, the larger the orthographic projection area of ​​the color conversion unit 410 on the first substrate 100, the smaller the density of the color conversion unit 410, the larger the interval between the color conversion units 410, and the smaller the corresponding PPI. Therefore, the angle between the second surface F2 and the first side surface C1 should not be too small. Optionally, the angle between the second surface F2 and the first side surface C1 is greater than or equal to 60° and less than or equal to 90°. For example, the angle between the second surface F2 and the first side surface C1 can be equal to either 70° or 80°. Of course, the angle between the second surface F2 and the first side surface C1 can also adopt other values, and is not limited to the above numerical examples.

[0050] Optionally, the light emitting unit 210 includes a third surface F3 opposite to the first surface F1 , and an orthographic projection of the first surface F1 on the first substrate 100 covers an orthographic projection of the third surface F3 on the first substrate 100 .

[0051] In this embodiment, the orthographic projection of the first surface F1 of the color conversion unit 410 on the first substrate 100 covers the orthographic projection of the third surface F3 of the light emitting unit 210 on the first substrate 100, that is, the size of the color conversion unit 410 is greater than or equal to the size of the light emitting unit 210, so that the light emitted by the light emitting unit 210 can enter the color conversion unit 410 as evenly as possible to ensure the light extraction efficiency.

[0052] Optionally, along a direction perpendicular to the plane where the first substrate 100 is located, the color resist portion 310 includes a fourth surface F4 and a fifth surface F5 relative to each other, the fourth surface F4 is arranged close to the first substrate 100 relative to the fifth surface F5, and the orthographic projection of the fourth surface F4 on the first substrate 100 covers the orthographic projection of the first surface F1 on the first substrate 100.

[0053] It can be understood that since each color resist portion 310 is arranged on the light-emitting side of the color conversion unit 410, this embodiment limits the orthographic projection of the fourth surface F4 on the first substrate 100 to cover the orthographic projection of the first surface F1 on the first substrate 100, so that the size of the color resist portion 310 is greater than or equal to the size of the color conversion unit 410, so that the light output from the color conversion unit 410 can enter the color resist portion 310 as much as possible, thereby improving the light output efficiency.

[0054] Optionally, the display panel further includes a second substrate J disposed on the side of the color resist structure 300 away from the first substrate 100. The second substrate J may be a glass substrate, which can be used to protect the display panel on the one hand, and can be used to prepare the color resist structure 300 and the color conversion structure 400 on the other hand.

[0055] See also Figures 2 to 3 In some optional embodiments, the display panel further includes a light shielding layer Z, and the light shielding layer Z is disposed between adjacent color resist portions 310 .

[0056] In this embodiment, a shading layer Z is provided between adjacent color resist portions 310 to prevent the light output from the light-emitting unit 210 from crosstalking at each color resist portion 310 and ensure the display effect. Optionally, the shading layer Z includes a black matrix material, and the light output directed to the black matrix material is absorbed by utilizing the light absorption effect of the black matrix material to avoid affecting the light output at adjacent color resist portions 310.

[0057] See also Figures 2 to 3 In some optional embodiments, the display panel further includes a first encapsulation layer 600, which is disposed on the side of the color resist structure 300 and the light shielding layer Z facing the first substrate 100, and at least part of the structure of the first encapsulation layer 600 is located between the color resist structure 300 and the color conversion structure 400.

[0058] By providing the first encapsulation layer 600 , on the one hand, the color resist structure 300 and the light shielding layer Z can be encapsulated and protected, and on the other hand, the color resist structure 300 and the reflective layer 500 can be isolated to avoid mutual interference between the two, thereby facilitating preparation.

[0059] Optionally, the material of the first encapsulation layer 600 includes an inorganic material.

[0060] The inorganic material may specifically be silicon nitride, silicon oxide, silicon oxynitride and the like, and may specifically be formed by a CVD (Chemical Vapor Deposition) process.

[0061] At the same time, an encapsulation layer may also be provided to achieve encapsulation protection for the color conversion structure 400. For example, the display panel further includes a second encapsulation layer 700. On the side of the color conversion structure 400 facing the first substrate 100, the second encapsulation layer 700 covers the color conversion structure 400 and covers the portion of the first encapsulation layer 600 exposed to the color conversion structure 400.

[0062] It is understandable that the second encapsulation layer 700 can adopt a whole-layer continuous structure to improve the encapsulation effect. Optionally, the material of the second encapsulation layer 700 includes an inorganic material. The inorganic material of the second encapsulation layer 700 can specifically be silicon nitride, silicon oxide, silicon oxynitride and other materials, and can specifically be formed by a CVD (Chemical Vapor Deposition) process.

[0063] See also Figure 2Optionally, at least a portion of the second encapsulation layer 700 is located between the color conversion unit 410 and the reflective layer 500 , and at least a portion of the reflective layer 500 is located on a side of the second encapsulation layer 700 away from the color conversion unit 410 .

[0064] Optionally, the second encapsulation layer 700 located between adjacent color conversion structures 400 may directly contact the first encapsulation layer 600 to achieve individual encapsulation of each color conversion unit 410 , avoid mutual interference, and improve the encapsulation effect.

[0065] In this embodiment, the reflective layer 500 may be formed on a surface of the second encapsulation layer 700 corresponding to the first side surface C1 and located between adjacent color conversion structures 400 , so as to facilitate the formation of a patterned reflective layer 500 .

[0066] See also Figure 3 In another embodiment, at least part of the structure of the second encapsulation layer 700 is located on the side of the reflective layer 500 away from the color conversion unit 410, that is, the reflective layer 500 is directly covered by the second encapsulation layer 700 to avoid damage to the reflective layer 500, thereby improving the reliability of the display panel.

[0067] Optionally, the reflective layer 500 may be partially located between the first encapsulation layer 600 and the second encapsulation layer 700 and partially located between the first side surface C1 of the color conversion unit 410 and the second encapsulation layer 700, and may be completely encapsulated and protected by the second encapsulation layer 700, thereby improving the reliability of the display panel.

[0068] In some optional embodiments, the reflective layer 500 includes a first portion 510 , and the first portion 510 covers the first side surface C1 .

[0069] In this embodiment, the first portion 510 may directly cover the first side surface C1 and contact the color conversion unit 410 , and at least part of the structure of the second encapsulation layer 700 may be located on the side of the reflective layer 500 away from the color conversion unit 410 .

[0070] Alternatively, the first portion 510 may also indirectly cover the first side surface C1 , which may be a case where at least a portion of the structure of the second encapsulation layer 700 is located between the color conversion unit 410 and the reflective layer 500 .

[0071] See also Figures 5 and 6 Optionally, the reflective layer 500 also includes a second portion 520, which covers the portion of the first encapsulation layer 600 exposed to the color conversion structure 400. The second portion 520 is correspondingly arranged between adjacent color conversion structures 400, and can reflect the light emitted by the light-emitting unit 210 toward the second portion 520 back to the color conversion structure 400 to improve light utilization efficiency.

[0072] In this embodiment, the second portion 520 may directly cover or indirectly cover the first encapsulation layer 600 . For example, the second portion 520 may directly contact the first encapsulation layer 600 to achieve direct coverage.

[0073] Optionally, the first part 510 and the second part 520 are an integrated structure for ease of preparation.

[0074] Optionally, the display panel further includes a third encapsulation layer 800 disposed between the light emitting layer 200 and the second encapsulation layer 700 to achieve encapsulation protection for the light emitting layer 200. The third encapsulation layer 800 may have a single-layer structure or a multi-layer structure.

[0075] For example, the third encapsulation layer 800 includes a first sub-encapsulation layer, and a material of the first sub-encapsulation layer includes an inorganic material.

[0076] It is understandable that the inorganic material may specifically be silicon nitride, silicon oxide, silicon oxynitride and the like, and may specifically be formed by a CVD (Chemical Vapor Deposition) process.

[0077] Optionally, the third encapsulation layer 800 further includes a second sub-encapsulation layer located on the side of the first sub-encapsulation layer away from the first substrate 100, and the material of the second sub-encapsulation layer includes an organic material. The organic material can be made of resin or polymer organic material, and can be formed by IJP (Inkjet printing) process.

[0078] Optionally, the third encapsulation layer 800 also includes a third sub-encapsulation layer located on the side of the second sub-encapsulation layer away from the first substrate 100, and the material of the third sub-encapsulation layer includes an inorganic material. Continuing to add an inorganic encapsulation layer outside the organic encapsulation layer can further improve the encapsulation effect of the third encapsulation layer 800; in this embodiment, the material of the third sub-encapsulation layer can be the same as or different from the material of the first sub-encapsulation layer, and there is no special limitation.

[0079] Optionally, the material of the first sub-encapsulation layer is the same as the material of the third sub-encapsulation layer, so that the first sub-encapsulation layer and the third sub-encapsulation layer can be prepared using the same equipment, which can simplify the preparation process of the display panel.

[0080] In some optional embodiments, the thickness of the reflective layer 500 is greater than or equal to 0.3 μm and less than or equal to 2 μm.

[0081] It is understandable that the thickness of the reflective layer 500 should not be too small, otherwise it may lead to poor reflection effect, and the light emitted by the light-emitting unit 210 may be directly emitted through the reflective layer 500, and the thickness of the reflective layer 500 should not be too large, otherwise it will affect the overall thickness of the display panel and is not conducive to achieving thinness. The inventors have experimentally measured that when the thickness of the reflective layer 500 is greater than or equal to 0.3 μm and less than or equal to 2 μm, a better reflection effect can be obtained without affecting the thickness of the display panel.

[0082] Optionally, the thickness of the reflective layer 500 may be equal to any one of 0.3 μm, 0.6 μm, 0.9 μm, 1.2 μm, 1.5 μm, 1.8 μm, and 2 μm, and may be set according to actual needs without special limitation.

[0083] Optionally, the reflectivity of the material of the reflective layer 500 is greater than or equal to 50%, such as 50%, 70%, 90%, 99%, etc., so as to reflect the light emitted from the light-emitting unit 210 to the reflective layer 500, block the light entering adjacent color conversion units 410 from interfering with each other, prevent light crosstalk, and improve the display effect.

[0084] Optionally, the material of the reflective layer 500 includes at least one of aluminum, molybdenum, and titanium. It should be noted that aluminum is a metal with high reflectivity, especially in the visible light and near-infrared spectrum. Specifically, in the visible light region, the reflective film of aluminum can reach a reflectivity of about 88%. In addition, pure aluminum can have a reflectivity as high as 94% after appropriate surface treatment, such as electrolytic polishing. Therefore, the reflectivity of the aluminum material can meet the requirements.

[0085] The reflectivity of molybdenum depends on the wavelength and incident angle of light. The reflectivity of molybdenum in the visible light range is approximately 70%-80%, which can be equal to any one of 70%, 75%, and 80%.

[0086] Titanium is highly reflective, with a reflectivity between 30% and 60%. The specific value depends on the purity and surface condition of the titanium. The higher the purity, the higher the reflectivity; the smoother the surface, the higher the reflectivity.

[0087] Of course, the reflective layer 500 may also be made of other materials with a reflectivity that meets the requirements, and is not limited to metal materials, and other materials may also be used.

[0088] In some optional embodiments, along a direction parallel to the plane where the first substrate 100 is located, a distance between adjacent color conversion units 410 is less than or equal to 5 μm.

[0089] It can be understood that the present application uses a reflective layer 500 with a smaller width and a smaller thickness to achieve isolation of adjacent color conversion units 410 to avoid light crosstalk. Compared with the dam structure in the prior art, the width of the reflective layer 500 along the direction parallel to the plane where the substrate is located is smaller, that is, the distance between adjacent color conversion units 410 can be reduced. For example, along the direction parallel to the plane where the first substrate 100 is located, the distance between adjacent color conversion units 410 can be equal to any one of 1μm, 2μm, 3μm, 4μm, and 5μm. The size of the reflective layer 500 can be adjusted according to actual needs to meet the distance requirement between adjacent color conversion units 410, which is conducive to the preparation of high PPI display panels and improves the performance of the display panels.

[0090] See also Figure 7 The embodiment of the present invention further provides a method for preparing a display panel, comprising the following steps:

[0091] S110: Provide a first substrate 100, such as Figure 8 As shown;

[0092] S120: forming a light-emitting layer 200 on one side of the first substrate 100, wherein the light-emitting layer 200 includes a plurality of light-emitting units 210, such as Fig. 9 As shown;

[0093] S130: forming a color conversion structure 400 on the side of the light emitting layer 200 away from the first substrate 100, the color conversion structure 400 comprising a plurality of color conversion units 410 arranged at intervals, the color conversion unit 410 comprising a first side surface C1, such as Fig.10 As shown, optionally, the display panel further includes a second encapsulation layer 700, and the second encapsulation layer 700 is located on the side of the color conversion structure 400 facing the first substrate 100 and between adjacent color conversion structures 400;

[0094] S140: forming a reflective layer 500, wherein at least a portion of the reflective layer 500 covers the first side surface C1. Fig.11 As shown;

[0095] S150: attaching the stacked structure including the color conversion structure 400 and the reflective layer 500 to the light-emitting layer 200, and the color conversion structure 400 and the light-emitting unit 210 are arranged correspondingly, such as Figure 2 or Figure 3 shown.

[0096] In the display panel manufacturing method provided by the embodiment of the present invention, the reflective layer 500 at least partially covers the first side surface C1, which can reflect the light emitted from the light-emitting unit 210 to the reflective layer 500 on the one hand, and on the other hand, can also block the light entering the adjacent color conversion units 410 from interfering with each other, prevent light crosstalk, and improve the display effect. Compared with the dam structure in the prior art, the width of the reflective layer 500 along the direction parallel to the plane where the substrate is located is smaller, that is, the distance between adjacent color conversion units 410 can be reduced, which is conducive to the preparation of a high PPI display panel and improves the performance of the display panel.

[0097] In step S110, the first substrate 100 can be formed by coating, curing, forming and other processes. The first substrate 100 can be a hard substrate, such as a glass substrate; or a flexible substrate, and its material can be polyimide, polystyrene, polyethylene terephthalate, polyparaxylene, polyethersulfone or polyethylene naphthalate. The first substrate 100 is mainly used to support the device disposed thereon.

[0098] In step S120, the light-emitting layer 200 may be formed by an evaporation process. Optionally, the light-emitting layer 200 includes one or more of an electron injection layer, an electron transport layer, a light-emitting material layer, a hole blocking layer, an electron blocking layer, a hole transport layer, and a hole injection layer. The specific type of the light-emitting layer 200 may be selected without special limitation.

[0099] Optionally, the display panel further includes a first electrode layer D1 located on the side of the light-emitting layer 200 facing the first substrate 100 and a second electrode layer D2 located on the side of the light-emitting layer 200 facing away from the first substrate 100, and the electron injection layer, the electron transport layer, and the hole blocking layer may be disposed between the second electrode layer D2 and the light-emitting material layer. The electron blocking layer, the hole transport layer, and the hole injection layer may be disposed between the first electrode layer D1 and the light-emitting material layer.

[0100] The material of the first electrode layer D1 is generally a material with a high work function to improve the hole injection efficiency, and may be gold (Au), platinum (Pt), titanium (Ti), silver (Ag), indium tin oxide (ITO), zinc tin oxide (IZO) or a transparent conductive polymer (such as polyaniline), etc. For example, the first electrode layer D1 may be made of an ITO-Ag-ITO composite material, without special limitation.

[0101] The material of the second electrode layer D2 can be one of the metal materials such as silver (Ag), aluminum (Al), lithium (Li), magnesium (Mg), ytterbium (Yb), calcium (Ca) or indium (In), or it can be an alloy of the aforementioned metal materials, such as magnesium-silver alloy (Mg / Ag) and lithium-aluminum alloy (Li / Al), but this embodiment does not limit this.

[0102] Optionally, the display panel further includes a pixel definition layer P, which is disposed on one side of the first substrate 100 and has a pixel opening; and the first electrode layer D1 is at least partially disposed in the pixel opening.

[0103] In this embodiment, a light emitting unit 210 may be disposed in the pixel opening to achieve light emitting display of the display panel.

[0104] In step S130 , the color conversion unit 410 and the light emitting unit 210 are at least partially arranged to be opposite to each other.

[0105] Optionally, the color conversion unit 410 includes a quantum dot material, the quantum dot material can scatter light of various wavelength bands, and the light emitted from the light emitting unit 210 can penetrate the quantum dot material.

[0106] In step S140 , a whole layer of reflective material layer 501 may be prepared first, and then the required patterned reflective layer 500 may be formed by photolithography or other processes.

[0107] Optionally, the reflective layer 500 includes a first portion 510 , and the first portion 510 covers the first side surface C1 .

[0108] In this embodiment, the first portion 510 may directly cover the first side surface C1 and contact the color conversion unit 410 , and at least part of the structure of the second encapsulation layer 700 may be located on the side of the reflective layer 500 away from the color conversion unit 410 .

[0109] Alternatively, the first portion 510 may also indirectly cover the first side surface C1 , which may be a case where at least a portion of the structure of the second encapsulation layer 700 is located between the color conversion unit 410 and the reflective layer 500 .

[0110] Optionally, the reflective layer 500 also includes a second portion 520, which covers the portion of the first encapsulation layer 600 exposed to the color conversion structure 400. The second portion 520 is correspondingly arranged between adjacent color conversion structures 400, and can reflect the light emitted by the light-emitting unit 210 toward the second portion 520 back to the color conversion structure 400 to improve light utilization efficiency.

[0111] In this embodiment, the second portion 520 may directly cover or indirectly cover the first encapsulation layer 600 . For example, the second portion 520 may directly contact the first encapsulation layer 600 to achieve direct coverage.

[0112] Optionally, the first part 510 and the second part 520 are an integrated structure for ease of preparation.

[0113] In step S150 , the color conversion structure 400 may be indirectly bonded to the light emitting layer 200 , that is, other film layers, such as an encapsulation layer, may be disposed between the two.

[0114] Optionally, the color resist structure 300 can be prepared by a process such as evaporation, and a desired pattern can be formed by a photolithography process.

[0115] See also Figure 12 to Figure 14 To facilitate the preparation of the color-blocking structure 300, optionally, between the step of forming the light-emitting layer 200 on one side of the first substrate 100 and the step of forming the color conversion structure 400 on the side of the light-emitting layer 200 away from the first substrate 100, the following steps are included:

[0116] A second substrate J is provided, and a color resist structure 300 is formed on one side of the second substrate J. Fig.12 As shown; forming a light shielding layer Z, the light shielding layer Z is formed between adjacent color blocking portions 310, such as Fig.13 As shown; a first encapsulation layer 600 is formed on the side of the color resist structure 300 and the light shielding layer Z away from the second substrate J.

[0117] The second substrate J is used to carry the color resist structure 300 , so as to facilitate the preparation of the color resist structure 300 , and to facilitate the subsequent bonding of the film layers such as the color resist structure 300 and the light-emitting layer 200 .

[0118] Optionally, the second substrate J includes a glass substrate to ensure that the second substrate J has good flatness.

[0119] By providing the first encapsulation layer 600 , on the one hand, the color resist structure 300 and the light shielding layer Z can be encapsulated and protected, and on the other hand, the color resist structure 300 and the reflective layer 500 can be isolated to avoid mutual interference between the two, thereby facilitating preparation.

[0120] Optionally, the material of the first encapsulation layer 600 includes an inorganic material.

[0121] The inorganic material may specifically be silicon nitride, silicon oxide, silicon oxynitride and the like, and may specifically be formed by a CVD (Chemical Vapor Deposition) process.

[0122] See also Fig. 9 In some optional embodiments, after the step of forming the color conversion structure 400 on the side of the light emitting layer 200 away from the first substrate 100 and before the step of forming the reflective layer 500, the method further includes:

[0123] forming a second encapsulation layer 700 , on a side of the color conversion structure 400 facing the first substrate 100 , the second encapsulation layer 700 covers the color conversion structure 400 and covers a portion of the first encapsulation layer 600 exposed to the color conversion structure 400 ;

[0124] The step of forming the reflective layer 500 includes: forming the reflective layer 500 on at least one surface of the second encapsulation layer 700 which is away from the first side surface C1 .

[0125] It can be understood that, in this embodiment, the second encapsulation layer 700 is first prepared and formed. Fig.15 As shown, a reflective layer 500 is then formed on a surface of the second encapsulation layer 700 that is away from the first side surface C1 , so as to facilitate the preparation of the reflective layer 500 .

[0126] In this embodiment, the second encapsulation layer 700 may directly cover the surface of the color conversion structure 400 facing the first substrate 100 , and the surface of the first encapsulation layer 600 between adjacent color conversion structures 400 that is exposed to the color conversion structure 400 .

[0127] In another optional embodiment, the step of forming the reflective layer 500 includes:

[0128] A reflective layer 500 is formed at least on the first side surface C1 of the color conversion structure 400;

[0129] After the step of forming the reflective layer 500, the method further includes:

[0130] A second encapsulation layer 700 is formed, and the second encapsulation layer 700 at least covers a surface of the reflective layer 500 that is away from the color resist structure 300 , and a surface of the color conversion structure 400 that is exposed by the reflective layer 500 .

[0131] In this embodiment, a reflective material layer 501 is first formed. Fig.16 As shown, the reflective material layer 501 is patterned to form a reflective layer 500, as shown in FIG. Fig.17 As shown, a second encapsulation layer 700 is then formed on the surface of the reflective layer 500 facing away from the color blocking structure 300 and the surface of the color conversion structure 400 exposed by the reflective layer 500. Fig.18 As shown, specifically, when the reflective layer 500 only includes the first portion 510 covering the first side surface C1, in addition to covering the reflective layer 500, the second encapsulation layer 700 also covers the surface of the color conversion structure 400 facing the first substrate 100 and the portion of the first encapsulation layer 600 exposed to the color conversion structure 400. When the reflective layer 500 includes the first portion 510 and the second portion 520, in addition to covering the reflective layer 500, the second encapsulation layer 700 also covers the surface of the color conversion structure 400 facing the first substrate 100.

[0132] Optionally, an encapsulation layer may be provided to achieve encapsulation protection for the color conversion structure 400 . For example, the display panel further includes a second encapsulation layer 700 . The second encapsulation layer 700 is located on the side of the color conversion structure 400 facing the first substrate 100 and between adjacent color conversion structures 400 .

[0133] Optionally, a third encapsulation layer 800 is further included between the light-emitting layer 200 and the second encapsulation layer 700 to achieve encapsulation protection for the light-emitting layer 200. The third encapsulation layer 800 may have a single-layer structure or a multi-layer structure.

[0134] After the stacked structure including the color resist structure 300 , the color conversion structure 400 and the reflective layer 500 is attached to the light emitting layer 200 , the second encapsulation layer 700 may be in contact with the third encapsulation layer 800 to improve the encapsulation effect.

[0135] An embodiment of the present invention further provides a display device, comprising the display panel in any of the above embodiments.

[0136] The display device provided in the embodiment of the present application can be applied to a mobile phone, or it can be any electronic product with a display function, including but not limited to the following categories: televisions, laptops, desktop displays, tablet computers, digital cameras, smart bracelets, smart glasses, car displays, medical equipment, industrial control equipment, touch interactive terminals, etc. The embodiment of the present application does not make any special limitations on this.

[0137] The above are only specific implementation methods of the present application. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working processes of the systems, modules and units described above can refer to the corresponding processes in the aforementioned method embodiments, and will not be repeated here. It should be understood that the protection scope of the present application is not limited to this. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in this application, and these modifications or replacements should be included in the protection scope of this application.

[0138] It should also be noted that the exemplary embodiments mentioned in this application describe some methods or systems based on a series of steps or devices. However, this application is not limited to the order of the above steps, that is, the steps can be performed in the order mentioned in the embodiment, or in a different order from the embodiment, or several steps can be performed simultaneously.

Claims

1. A display panel, characterized in that: include: a first substrate; A light-emitting layer, disposed on one side of the first substrate, the light-emitting layer comprising a plurality of light-emitting units; A color conversion structure is arranged on a side of the light-emitting layer away from the first substrate, the color conversion structure includes a plurality of color conversion units arranged corresponding to the light-emitting units, the color conversion units are arranged at intervals, and the color conversion unit includes a first side surface; A reflective layer, at least a portion of which covers the first side surface.

2. The display panel according to claim 1, characterized in that: The display panel further comprises a color resist structure, wherein the color resist structure is arranged on a side of the color conversion structure away from the first substrate, and the color resist structure comprises at least two color resist portions of different colors; Preferably, along a direction perpendicular to the plane where the first substrate is located, the color conversion unit includes a second surface opposite to the first surface, the first surface is located between the second surface and the light-emitting unit, the first surface and the second surface intersect with the first side surface respectively, and an angle between the second surface and the first side surface is greater than or equal to 30° and less than or equal to 90°; Preferably, the angle between the second surface and the first side surface is equal to 80°.

3. The display panel according to claim 2, characterized in that: The light emitting unit comprises a third surface opposite to the first surface, and an orthographic projection of the first surface on the first substrate covers an orthographic projection of the third surface on the first substrate; Preferably, along a direction perpendicular to the plane where the first substrate is located, the color resist portion includes a fourth surface and a fifth surface opposite to each other, the fourth surface is arranged close to the first substrate relative to the fifth surface, and the orthographic projection of the fourth surface on the first substrate covers the orthographic projection of the second surface on the first substrate; Preferably, the display panel further comprises a second substrate provided on a side of the color-resistance structure away from the first substrate; Preferably, the display panel further comprises a light shielding layer, and the light shielding layer is arranged between adjacent color resistance portions; Preferably, the light shielding layer comprises a black matrix material; Preferably, the color conversion unit comprises quantum dot material.

4. The display panel according to claim 3, characterized in that: It also includes a first encapsulation layer, which is disposed on the side of the color-resistance structure and the light-shielding layer facing the first substrate, and at least a portion of the structure of the first encapsulation layer is located between the color-resistance structure and the color conversion structure; Preferably, the material of the first encapsulation layer includes an inorganic material; Preferably, the material of the first encapsulation layer includes at least one of silicon nitride, silicon oxide, and silicon oxynitride; Preferably, it further comprises a second encapsulation layer, on the side of the color conversion structure facing the first substrate, the second encapsulation layer covers the color conversion structure and covers the portion of the first encapsulation layer exposed to the color conversion structure; Preferably, at least a portion of the structure of the second encapsulation layer is located between the color conversion unit and the reflective layer; or, at least a portion of the structure of the second encapsulation layer is located on a side of the reflective layer away from the color conversion unit; Preferably, the material of the second encapsulation layer includes an inorganic material; Preferably, the material of the second encapsulation layer includes at least one of silicon nitride, silicon oxide, and silicon oxynitride; Preferably, the method further comprises a third encapsulation layer disposed between the light-emitting layer and the second encapsulation layer.

5. The display panel according to claim 4, characterized in that: The reflective layer includes a first portion, and the first portion covers the first side surface; Preferably, the reflective layer further comprises a second portion, wherein the second portion covers a portion of the first encapsulation layer exposed to the color conversion structure; Preferably, the first part and the second part are an integrated structure; Preferably, the thickness of the reflective layer is greater than or equal to 0.3 μm and less than or equal to 2 μm; Preferably, the reflectivity of the material of the reflective layer is greater than or equal to 50%; Preferably, the material of the reflective layer includes at least one of aluminum, molybdenum and titanium; Preferably, along a direction parallel to the plane where the first substrate is located, a distance between adjacent color conversion units is less than or equal to 5 μm.

6. A method for preparing a display panel, characterized in that: The following steps are involved: providing a first substrate; forming a light-emitting layer on one side of the first substrate, wherein the light-emitting layer includes a plurality of light-emitting units; forming a color conversion structure, the color conversion structure comprising a plurality of color conversion units disposed at intervals, the color conversion unit comprising a first side surface; forming a reflective layer, wherein at least a portion of the reflective layer covers the first side surface; The stacked structure including the color conversion structure and the reflective layer is attached to the light-emitting layer, and the color conversion unit and the light-emitting unit are arranged correspondingly.

7. The method for preparing a display panel according to claim 6, wherein: Between the step of forming the light-emitting layer on one side of the first substrate and the step of forming a color conversion structure on the side of the light-emitting layer away from the first substrate, the method includes: Providing a second substrate, and forming a color resist structure on one side of the second substrate; forming a light shielding layer, wherein the light shielding layer is formed between adjacent color resist portions; forming a first encapsulation layer on a side of the color resist structure and the light shielding layer away from the second substrate; Preferably, the second substrate comprises a glass substrate.

8. The method for preparing a display panel according to claim 7, characterized in that: After the step of forming a color conversion structure on the side of the light-emitting layer away from the first substrate and before the step of forming a reflective layer, the method further includes: forming a second encapsulation layer, on a side of the color conversion structure facing the first substrate, the second encapsulation layer covering the color conversion structure and covering a portion of the first encapsulation layer exposed to the color conversion structure; The step of forming a reflective layer comprises: The reflective layer is formed at least on a surface of the second encapsulation layer that is away from the first side surface.

9. The method for preparing a display panel according to claim 7, characterized in that: The step of forming a reflective layer comprises: forming a reflective layer at least on a first side of the color conversion structure; After the step of forming the reflective layer, the method further comprises: A second encapsulation layer is formed, wherein the second encapsulation layer at least covers a surface of the reflective layer that is away from the color conversion structure.

10. A display device, characterized in that: A display panel comprising any one of claims 1 to 5.

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