Color film substrate, display panel and display device

Abstract

The invention provides a color film substrate, a display panel and a display device, and belongs to the technical field of display. The color film substrate comprises a substrate body, a light filtering layer arranged on one side of the substrate body and a heat dissipation assembly. Wherein the substrate is provided with a display area and a non-display area arranged around the display area; the filter layer comprises a plurality of color resistance layers with different colors; the heat dissipation assembly comprises a liquid cooling pipe, the liquid cooling pipe and the filter layer are located on the same side of the substrate, and cooling liquid is arranged in the liquid cooling pipe. The liquid cooling pipe comprises a heat conduction pipe and a cooling pipe which are communicated with each other; the heat conduction pipes are arranged in the display area, located between the adjacent color resistance layers and staggered with the color resistance layers. The cooling pipe is arranged in the non-display area and communicated with the heat conduction pipe. The color film substrate can improve the heat resistance of the display panel.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a color film substrate, a display panel and a display device. Background Art

[0002] In recent years, with the continuous development of thin film transistor-based liquid crystal display (TFT-LCD) technology, TFT-LCD display panels have been widely used in life and production work due to their advantages such as low cost, high reliability, low power consumption, low radiation, and wide color range.

[0003] TFT-LCD display panels usually include an array substrate, a color film substrate and a liquid crystal layer. The array substrate and the color film substrate are combined to form a liquid crystal box, into which liquid crystal is injected. When the display panel is working in some high-temperature environments, its operating temperature rises, which can easily affect the reliability and life of the panel. Moreover, since the liquid crystal box is a closed space, the temperature of the liquid crystal inside the panel will also rise and the heat is not easy to dissipate, making the liquid crystal morphology more liquid, and the fluidity of the liquid crystal is enhanced. Under the influence of gravity, it is very easy to cause gravity Mura on the display panel. Summary of the invention

[0004] The present application provides a color film substrate, a display panel and a display device, aiming to solve the problem in the prior art that the internal temperature of the display panel increases and the liquid crystal fluidity is enhanced, resulting in uneven display of the display panel.

[0005] In order to solve the above technical problems, the first technical solution provided by the present application is: to provide a color filter substrate. The color filter substrate comprises:

[0006] A substrate having a display area and a non-display area arranged around the display area;

[0007] The filter layer is arranged on one side of the substrate and includes a plurality of color resist layers of different colors;

[0008] The color film substrate further includes a heat dissipation component, which includes a liquid cooling tube, which is arranged on one side of the substrate and is located on the same side of the substrate as the filter layer, and a cooling liquid is arranged in the liquid cooling tube;

[0009] Among them, the liquid cooling pipe includes a heat conduction pipe and a cooling pipe which are interconnected; the heat conduction pipe is arranged in the display area, located between adjacent color resistance layers, and is staggered with the color resistance layers; the cooling pipe is arranged in the non-display area, and is connected with the heat conduction pipe.

[0010] In some embodiments, the filter layer further includes a black matrix, which is disposed on one side of the substrate; the black matrix includes a transverse light shielding layer extending along a first direction and a longitudinal light shielding layer extending along a second direction, and a plurality of transverse light shielding layers and a plurality of longitudinal light shielding layers are alternately disposed in the first direction and the second direction to form a plurality of pixel openings, and the color resistance layer is disposed in the pixel openings; wherein the first direction and the second direction intersect;

[0011] The heat conducting pipe is arranged on a side of the black matrix away from the substrate, and the orthographic projection of the heat conducting pipe on the substrate is located within the orthographic projection of the black matrix on the substrate.

[0012] In some embodiments, the heat conducting pipe includes a plurality of transverse heat absorbing pipes extending in a first direction or a plurality of longitudinal heat absorbing pipes extending in a second direction; wherein both ends of the plurality of transverse heat absorbing pipes or the plurality of longitudinal heat absorbing pipes are respectively connected to the cooling pipe, so that the cooling liquid in the heat conducting pipe exchanges heat with the cooling liquid in the cooling pipe after being heated; both ends of the transverse heat absorbing pipes or the longitudinal heat absorbing pipes extend to the non-display area as cooling pipes, or the cooling pipes extend along the non-display area and surround the heat conducting pipes; or,

[0013] The heat conducting pipe also includes a connecting pipe; a plurality of transverse heat absorbing pipes or longitudinal heat absorbing pipes are connected end to end through the connecting pipe, and two ends of the heat conducting pipe formed by the end to end connection are respectively connected with two ends of the cooling pipe, the connecting pipe extends along the second direction or the first direction, and the positive projection of the connecting pipe on the substrate is located within the positive projection of the black matrix on the substrate; the cooling pipe extends along the non-display area and surrounds the heat conducting pipe, and the heat dissipation assembly also includes a micro water pump arranged in the pipeline of the cooling pipe, so as to drive the coolant to circulate in the pipeline; or,

[0014] The heat conduction pipe includes a plurality of transverse heat absorption pipes and a plurality of longitudinal heat absorption pipes. The transverse heat absorption pipes and the longitudinal heat absorption pipes are interconnected to form a heat conduction pipe. The heat conduction pipe has at least two connection ports, which are connected to the cooling pipe. The cooling pipe extends along the non-display area and surrounds the heat conduction pipe.

[0015] In some embodiments, the color filter substrate further includes a spacer column, which is disposed on a side of the black matrix away from the substrate; the spacer column includes a main spacer column and an auxiliary spacer column, and the main spacer column and the auxiliary spacer column are alternately arranged; in a direction perpendicular to the substrate, the height of the main spacer column is greater than the height of the auxiliary spacer column;

[0016] The maximum width of the orthographic projection of the heat pipe on the substrate does not exceed 0.8 times the width of the orthographic projection of the black matrix on the substrate; in the direction perpendicular to the substrate, the height of the heat pipe does not exceed the height of the auxiliary spacer column.

[0017] In some embodiments, the heat conducting pipe includes a plurality of transverse heat absorbing pipes extending along a first direction and a plurality of longitudinal heat absorbing pipes extending along a second direction, the transverse heat absorbing pipes and the longitudinal heat absorbing pipes are interconnected to form the heat conducting pipe; the first direction and the second direction intersect;

[0018] The heat conducting pipe is arranged on one side of the substrate and serves as a black matrix; the longitudinal heat absorbing pipe and the transverse heat absorbing pipe intersect and surround to form a plurality of pixel openings, and the color resist layer is arranged in the pixel openings.

[0019] In some embodiments, the color filter substrate further includes a spacer column, and the spacer column is arranged on a side of the black matrix away from the substrate;

[0020] The heat pipes and the spacer columns are arranged at intervals on the black matrix; or,

[0021] The wall of the heat-conducting tube protrudes in a preset position in a direction away from the substrate to form a sub-heat-absorbing portion, and the sub-heat-absorbing portion has a cavity inside that is connected to the inside of the heat-conducting tube, so that the cooling liquid in the heat-conducting tube is filled in the cavity; a groove is provided on the side of the spacer column close to the substrate, and the spacer column is set at a preset position and is interlocked with the sub-heat-absorbing portion through the groove.

[0022] In some embodiments, the heat dissipation component further includes a metal heat dissipation layer disposed in the non-display area. The metal heat dissipation layer is disposed between the substrate and the cooling tube and contacts the cooling tube. The metal heat dissipation layer extends along the non-display area and surrounds the display area.

[0023] In some embodiments, the cooling tube is extended in a continuous "S" shape in the non-display area; the metal heat dissipation layer is electrically connected to the ground signal.

[0024] In order to solve the above technical problem, the second technical solution provided by the present application is: to provide a display panel. The display panel includes:

[0025] An array substrate;

[0026] A color filter substrate is arranged in a box with the array substrate, and the color filter substrate is the color filter substrate involved in the above technical solution;

[0027] The liquid crystal layer is arranged between the array substrate and the color filter substrate.

[0028] In order to solve the above technical problems, the third technical solution provided by the present application is to provide a display device. The display device includes:

[0029] A display panel, wherein the display panel is the display panel involved in the above technical solution;

[0030] The backlight module is arranged on one side of the display panel and is used for providing backlight to the display panel.

[0031] Beneficial effects of the present application: Different from the prior art, the present application provides a color filter substrate, a display panel and a display device. The color filter substrate includes a substrate and a filter layer, which is used to form a liquid crystal box for accommodating liquid crystals with an array substrate, and is used to filter sub-pixel units, thereby realizing full-color display. By making the color filter substrate also include a heat dissipation component, the display panel is cooled, thereby reducing the impact of high temperature on the display panel. Furthermore, by making the heat dissipation component include a liquid cooling tube, and making the liquid cooling tube and the filter layer be located on the same side of the substrate, and providing a cooling liquid in the liquid cooling tube, that is, by providing the liquid cooling tube inside the panel, the liquid cooling tube can directly absorb the heat in the display panel; at the same time, by making the liquid cooling tube include a heat conducting tube and a cooling tube that are interconnected, the heat conducting tube is provided in the display area, and the cooling tube is provided in the non-display area, so that the heat absorbed by the heat conducting tube is instantly transferred to the cooling tube in the non-display area through the cooling liquid for heat dissipation, thereby effectively improving the heat dissipation rate, being able to effectively prevent the liquid crystal morphology from tending to a liquid state, and causing the display panel to have uneven display problems due to enhanced liquid crystal fluidity, effectively reducing the influence of high temperature on the reliability and service life of the display panel, and enabling the display panel to adapt to high temperature environments and operate stably in high temperature environments, thereby improving the heat resistance of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0033] Figure 1 is a schematic diagram of the structure of a display panel provided by an embodiment of the present application;

[0034] Figure 2 It is a schematic diagram of the planar structure of the color filter substrate provided in the first embodiment of the present application;

[0035] Figure 3 is a schematic diagram of the cross-sectional structure of a color filter substrate in the second direction provided by an embodiment of the present application;

[0036] Figure 4 It is a schematic diagram of the planar structure of the first embodiment of the color filter substrate in the display area provided by the present application;

[0037] Figure 5 is a schematic diagram of the planar structure of a color filter substrate provided in the second embodiment of the present application;

[0038] Figure 6 is a schematic diagram of the planar structure of a color filter substrate provided in the third embodiment of the present application;

[0039] Figure 7 is a schematic diagram of the planar structure of a color filter substrate provided in the fourth embodiment of the present application;

[0040] Figure 8 is a schematic diagram of the planar structure of a color filter substrate provided in the fifth embodiment of the present application;

[0041] Fig. 9 is a schematic diagram of the planar structure of a color filter substrate provided in the sixth embodiment of the present application;

[0042] Fig.10 This is a schematic diagram of the planar structure of the second embodiment of the color filter substrate provided by the present application in the display area;

[0043] Fig.11 This is a schematic diagram of the planar structure of the color filter substrate provided by the present application in the display area according to the third embodiment;

[0044] Fig.12 yes Fig.11 A schematic diagram of a cross-sectional structure of a color film substrate provided in an embodiment along the AA direction;

[0045] Fig.13 yes Fig.11 A schematic cross-sectional structure diagram of another embodiment of a medium color film substrate in the AA direction;

[0046] Fig.14 yes Fig.11 Schematic diagram of the cross-sectional structure of the color film substrate in the BB direction;

[0047] Fig.15 yes Fig.12 Schematic diagram of the production process corresponding to the color film substrate;

[0048] Fig.16 is a schematic diagram of the planar structure of the color filter substrate in the display area provided by the seventh embodiment of the present application;

[0049] Fig.17 yes Fig.16 A schematic diagram of a cross-sectional structure of a color film substrate provided in an embodiment along the AA direction;

[0050] Fig.18 yes Fig.16 A schematic diagram of a cross-sectional structure of another embodiment of a medium color film substrate in the AA direction;

[0051] Fig.19 It is a schematic diagram of the structure of a display device provided in one embodiment of the present application.

[0052] Reference numerals:

[0053] 100-display panel; 10-array substrate; 20-color film substrate; 21-substrate; 211-display area; 212-non-display area; 22-color resistance layer; 221-red color resistance layer; 222-green color resistance layer; 223-blue color resistance layer; 224-installation slot; 23-liquid cooling pipe; 231-heat conducting pipe; 2311-lateral heat absorbing pipe; 2312-longitudinal heat absorbing pipe; 2313-connecting pipe; 2314-sub heat absorbing part; 232-cooling pipe; 24-micro water pump; 25-metal heat dissipation layer; 26-spacer column; 261-main spacer column; 262-auxiliary spacer column; 263-groove; 30-liquid crystal box; 31-liquid crystal layer;

[0054] BM-black matrix; BM1-lateral light shielding layer; BM2-vertical light shielding layer; X-first direction; Y-second direction; G-gravity direction. DETAILED DESCRIPTION

[0055] The scheme of the embodiment of the present application is described in detail below in conjunction with the drawings of the specification.

[0056] In the following description, for the purpose of explanation rather than limitation, specific details such as specific system structures, interfaces, and technologies are provided to facilitate a thorough understanding of the present application.

[0057] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0058] The terms "first", "second", "third" in this application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second", "third" can expressly or implicitly include at least one of the features. In the description of this application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In the embodiments of this application, all directional indications (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the steps or units listed, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

[0059] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0060] The present application is described in detail below with reference to the accompanying drawings and embodiments.

[0061] See also Figure 1 , Figure 1 : is a schematic diagram of the structure of a display panel provided by an embodiment of the present application. In this embodiment, a display panel 100 is provided, and the display panel 100 includes an array substrate 10, a color filter substrate 20 and a liquid crystal layer 31; the array substrate 10 and the color filter substrate 20 are arranged in a box to form a closed space, and the liquid crystal layer 31 is arranged between the array substrate 10 and the color filter substrate 20, that is, arranged in the closed space formed by the array substrate 10 and the color filter substrate 20. Among them, the array substrate 10 is used to generate an electric field to drive the liquid crystal to deflect the preset angle, thereby controlling the light transmittance and displaying the corresponding brightness; the color filter substrate 20 is used to filter light to display the corresponding color light, thereby realizing full-color image display; in some embodiments, a common electrode is also provided on the color filter substrate 20, which is used to generate an electric field of corresponding strength with the pixel electrode opposite to the array substrate 10, and drive the liquid crystal to deflect the preset angle.

[0062] In this embodiment, the display panel 100 can be used in mobile phones, tablets, computers, televisions, notebooks, vehicles, projections and other application scenarios. The color film substrate 20 of the display panel 100 is provided with a heat dissipation component, so that the display panel 100 has better heat resistance and can operate stably in high temperature environments, such as vehicle-mounted, projection and other application scenarios. Specifically, the structure and function of the color film substrate 20 refer to the detailed description of the embodiment below.

[0063] See also Figure 2 and Figure 3 , Figure 2 is a schematic diagram of the planar structure of the color filter substrate provided in the first embodiment of the present application, Figure 3 1 is a schematic diagram of a cross-sectional structure of a color filter substrate provided in an embodiment of the present application in the second direction Y. In this embodiment, a color filter substrate 20 is provided, and the color filter substrate 20 includes a substrate 21, a filter layer and a heat dissipation component.

[0064] The substrate 21 may be an optical-grade glass substrate or a flexible substrate for carrying a filter layer and a heat dissipation component; the substrate 21 has a display area 211 and a non-display area 212 arranged around the display area 211; that is, the middle area of ​​the substrate 21 is the display area 211, and the outer frame area around the middle area is the non-display area 212. The filter layer is arranged on one side of the substrate 21, including a plurality of color resist layers 22 of different colors, which are distributed in the display area 211 of the substrate 21 according to a preset arrangement rule, so as to convert white light into color light, thereby realizing full-color display; in a specific application, the color resist layers 22 of different colors may be a red color resist layer 221, a green color resist layer 222, and a blue color resist layer 223, respectively, and each pixel includes at least the color resist layers 22 of these three colors, thereby performing mixed light display in color.

[0065] In this embodiment, the heat dissipation component includes a liquid cooling tube 23, which is arranged on one side of the substrate 21 and is located on the same side of the substrate 21 as the filter layer, and a cooling liquid is arranged in the liquid cooling tube 23. It can be understood that the liquid cooling tube 23 and the filter layer are both arranged on the side of the substrate 21 close to the liquid crystal layer 31, that is, by arranging the liquid cooling tube 23 on the side of the substrate 21 close to the liquid crystal layer 31, not only the heat absorption path of the liquid cooling tube 23 is shortened, but also the heat absorption area between the liquid cooling tube 23 and the liquid crystal layer 31 is effectively increased, thereby avoiding the problem that the heat inside the display panel 100 cannot be dissipated in time due to the heat insulation of the substrate 21 and the filter layer, and the temperature rises, so that the liquid crystal tends to be liquid, the fluidity is enhanced, and the display panel 100 has uneven display.

[0066] Specifically, the liquid cooling pipe 23 includes a heat pipe 231 and a cooling pipe 232 which are connected to each other. The heat pipe 231 is arranged in the display area 211, between adjacent color resist layers 22, and staggered with the color resist layers 22; the cooling pipe 232 is arranged in the non-display area 212, and connected to the heat pipe 231. It can be understood that the heat pipe 231 is arranged in the display area 211 and is located between adjacent color resistance layers 22, and is staggered with the color resistance layer 22, so that the heat pipe 231 can be prevented from affecting the emission of light; by connecting the heat pipe 231 with the cooling pipe 232, the cooling liquid in the heat pipe 231 of the display area 211 can absorb the heat generated inside the panel and then diffuse to the cooling pipe 232 of the non-display area 212 for heat dissipation, and the cooled cooling liquid in the cooling pipe 232 is exchanged to the heat pipe 231 of the display area 211 to continue to absorb heat, thereby realizing heat exchange for heat dissipation, effectively improving the heat dissipation efficiency, and effectively preventing the liquid crystal morphology from tending to liquid state, so that the liquid crystal fluidity is enhanced and the display panel 100 has uneven display problems, effectively reducing the influence of high temperature on the reliability and service life of the display panel 100, so that the display panel 100 can adapt to high temperature environments, such as vehicle environments, projection usage scenarios, etc., and can operate stably in high temperature environments, thereby improving the heat resistance of the display panel 100.

[0067] It should be noted that, in general, in order to ensure the transmittance of the liquid crystal, the signal lines, transistor switches and other driving components that control the deflection of the liquid crystal in the display panel 100 are all arranged on the array substrate 10. Specifically, the area where these driving components are located on the array substrate 10 is opposite to the area between the adjacent color resistance layers 22 on the color filter substrate 20; when the display panel 100 is working, the main heating area in the panel is the area where these driving components are located, so the liquid crystal temperature corresponding to the area in the liquid crystal layer 31 is relatively easier to rise. In this embodiment, by arranging the heat pipe 231 in the area on the color filter substrate 20 opposite to the area where the driving components are located on the array substrate 10, the cooling liquid in the heat pipe 231 can immediately absorb the heat of the area where the temperature is more likely to rise, so as to further improve the heat dissipation efficiency and quickly reduce the internal temperature of the panel.

[0068] Please refer to Figure 3 and Figure 4 , Figure 4: is a schematic diagram of the planar structure of the first embodiment of the color filter substrate in the display area provided by the present application. In this embodiment, the filter layer also includes a black matrix BM, and the black matrix BM is arranged on one side of the substrate 21; the black matrix BM includes a transverse light shielding layer BM1 extending along the first direction X and a longitudinal light shielding layer BM2 extending along the second direction Y, and multiple transverse light shielding layers BM1 and multiple longitudinal light shielding layers BM2 are staggered in the first direction X and the second direction Y to form multiple pixel openings, and the color resistance layer 22 is arranged in the pixel opening; wherein the first direction X and the second direction Y intersect. In this embodiment, the color resistance layer 22 is arranged in an array, and the row direction of the array is the first direction X, and the column direction of the array is the second direction Y. For example, it can be understood that the horizontal direction is the first direction X, and the vertical direction is the second direction Y. For example. Specifically, the black matrix BM is used to separate the color resistance layer 22 to prevent cross-color and light leakage.

[0069] In this embodiment, the heat pipe 231 is arranged on the side of the black matrix BM away from the substrate 21, and the orthographic projection of the heat pipe 231 on the substrate 21 is located within the orthographic projection of the black matrix BM on the substrate 21. That is, the heat pipe 231 is arranged on the side of the black matrix BM close to the liquid crystal layer 31, and the heat pipe 231 does not exceed the black matrix BM in the direction parallel to the substrate 21, so as to reduce the influence of the heat pipe 231 on the light and avoid the heat pipe 231 blocking the light. Further, the maximum width of the orthographic projection of the heat pipe 231 on the substrate 21 may not exceed 0.8 times the width of the orthographic projection of the black matrix BM on the substrate 21, so as to further reduce the influence of the heat pipe 231 on the light.

[0070] Please refer to Figure 2 and Figure 4 In this embodiment, the heat pipe 231 includes a plurality of transverse heat absorbing pipes 2311 extending along the first direction X and a connecting pipe 2313. The plurality of transverse heat absorbing pipes 2311 are connected end to end through the connecting pipe 2313. The two ends of the heat pipe 231 connected end to end are respectively connected to the two ends of the cooling pipe 232 for heat exchange. The connecting pipe 2313 extends along the second direction Y, and the orthographic projection of the connecting pipe 2313 on the substrate 21 is located within the orthographic projection of the black matrix BM on the substrate 21 to avoid the connecting pipe 2313 blocking light. In a specific application, the heat pipe 231 is an integrated structure, which can be understood as the heat pipe 231 is a pipe, and the transverse heat absorbing pipe 2311 and the connecting pipe 2313 are different parts of the heat pipe 231; Figure 2 As shown, the heat pipe 231 is laid in a serpentine shape in the display area 211 to increase the length of the heat pipe 231, thereby increasing the heat absorption area of ​​the heat pipe 231, which can effectively improve the heat dissipation efficiency.

[0071] Furthermore, if Figure 2As shown, in this embodiment, the cooling pipe 232 extends along the non-display area 212 and surrounds the heat pipe 231. Specifically, the cooling pipe 232 can extend along the non-display area 212 to surround the display area 211 for at least one circle and the two ends are respectively connected to the two ends of the heat pipe 231, so that the coolant in the liquid cooling pipe 23 can circulate between the heat pipe 231 and the cooling pipe 232, thereby achieving heat exchange. In this embodiment, by extending the cooling pipe 232 along the non-display area 212 and surrounding the heat pipe 231, the length of the cooling pipe 232 is increased, thereby increasing the heat dissipation capacity of the coolant, so that more coolant in the heat pipe 231 can be instantly diffused into the cooling pipe 232 for heat dissipation, thereby improving the heat dissipation effect.

[0072] Furthermore, in this embodiment, the heat dissipation assembly further includes a micro water pump 24 disposed in the pipeline of the cooling pipe 232, for driving the coolant to circulate in the pipeline. That is, by disposing the micro water pump 24 in the pipeline of the cooling pipe 232 to drive the coolant to circulate in the pipeline, the flow speed of the coolant in the liquid cooling pipe 23 can be increased, so that the coolant in the heat conducting pipe 231 can quickly flow to the cooling pipe 232 for cooling after absorbing heat, thereby effectively improving the heat dissipation efficiency.

[0073] Furthermore, the display panel 100 provided in the present embodiment is also provided with a temperature sensor for monitoring the in-plane temperature. Specifically, the temperature sensor can be arranged on the color film substrate 20, specifically in the area where the black matrix BM is located, to improve the sensitivity of the temperature sensor; or, the temperature sensor can also be arranged on the array substrate 10, specifically in the area where the driving component described above is located, to improve the sensitivity of the temperature sensor. The temperature sensor can be electrically coupled to a driving module for driving the array substrate 10, and the control end of the micro water pump 24 is also electrically coupled to the driving module; the driving module can control the temperature sensor to monitor the temperature, and receive the temperature signal detected by the temperature sensor, and then control the micro water pump 24 to work according to the received temperature signal.

[0074] For example, in some embodiments, when the temperature is greater than a threshold, the driving module controls the micro water pump 24 to turn on and operate at a preset speed, so that the coolant in the liquid cooling pipe 23 circulates at a preset flow rate to dissipate heat from the display panel 100 and cool the display panel 100. When the temperature is less than the threshold, the driving module controls the micro water pump 24 to turn off, and the coolant in the heat conducting pipe 231 diffuses into the cooling pipe 232 after absorbing heat, and exchanges with the coolant in the cooling pipe 232 with a lower temperature.

[0075] Alternatively, in other embodiments, multiple thresholds may also be set, such as a first threshold, a second threshold, and a third threshold set in order from low to high. When the temperature is greater than the first threshold and less than the second threshold, the driving module controls the micro-water pump 24 to work at a first preset speed, so that the coolant in the liquid cooling tube 23 circulates at a first preset flow rate. When the temperature is greater than the second threshold and less than the third threshold, the driving module controls the micro-water pump 24 to work at a second preset speed, so that the coolant circulates at a second preset flow rate. When the temperature is greater than the third threshold, the driving module controls the micro-water pump 24 to work at a third preset speed, so that the coolant circulates at a third preset flow rate; by setting a temperature range, so that the micro-water pump 24 works at a corresponding speed, so that the coolant circulates at a corresponding flow rate, thereby controlling the heat dissipation rate according to the temperature, and then controlling the temperature of the display panel 100, and cooling the display panel 100 to a corresponding degree, which can not only accurately control the heat dissipation effect, but also save power consumption.

[0076] In this embodiment, the heat dissipation component further includes a metal heat dissipation layer 25 disposed in the non-display area 212. The metal heat dissipation layer 25 is disposed between the substrate 21 and the cooling tube 232 and contacts the cooling tube 232. The metal heat dissipation layer 25 extends along the non-display area 212 and surrounds the display area 211. Specifically, the orthographic projection of the metal heat dissipation layer 25 on the substrate 21 coincides with the non-display area 212, so that the area of ​​the metal heat dissipation layer 25 is maximized to further improve the heat dissipation efficiency of the cooling tube 232. The metal heat dissipation layer 25 can be made of a metal material with good thermal conductivity and small specific heat capacity, such as copper (Cu), silver (Ag), aluminum (Al) or alloys thereof.

[0077] Furthermore, in a specific embodiment, the metal heat dissipation layer 25 can be electrically connected to the ground signal. Such a setting can not only dissipate heat, but also can be used to shield the radiation of the gate scanning module in the display panel 100 when it is working. A charged hand or other charged parts can touch the edge of the display panel 100 to release static electricity through the metal heat dissipation layer 25, so that static electricity cannot penetrate into the interior of the display panel 100, thereby providing static protection for the gate scanning module.

[0078] See also Figure 5 , Figure 5: is a schematic diagram of the planar structure of the color film substrate 20 provided in the second embodiment of the present application. In this embodiment, the heat pipe 231 includes a plurality of longitudinal heat absorbing pipes 2312 extending along the second direction Y and a connecting pipe 2313. The plurality of longitudinal heat absorbing pipes 2312 are connected end to end through the connecting pipe 2313. The two ends of the heat pipe 231 connected end to end are respectively connected to the two ends of the cooling pipe 232 for heat exchange. Among them, the connecting pipe 2313 extends along the first direction X, and the orthographic projection of the connecting pipe 2313 on the substrate 21 is located within the orthographic projection of the black matrix BM on the substrate 21 to prevent the connecting pipe 2313 from blocking light.

[0079] Similar to the previous embodiment, in a specific application, the heat pipe 231 is an integrated structure, which can be understood as the heat pipe 231 being a whole pipe, and the longitudinal heat absorption pipe 2312 and the connecting pipe 2313 being different parts of the heat pipe 231. It can be understood that the heat pipe 231 is laid in a serpentine shape in the display area 211 to increase the length of the heat pipe 231, thereby increasing the heat absorption area of ​​the heat pipe 231, which can effectively improve the heat dissipation efficiency.

[0080] In this embodiment, the cooling pipe 232 extends along the non-display area 212 and surrounds the heat pipe 231. Specifically, the cooling pipe 232 can extend along the non-display area 212 to surround the display area 211 for at least one circle and the two ends are respectively connected to the two ends of the heat pipe 231, so that the coolant in the liquid cooling pipe 23 can circulate between the heat pipe 231 and the cooling pipe 232, thereby achieving heat exchange. In specific applications, the cooling pipe 232 and the heat pipe 231 are also an integrated structure, that is, the liquid cooling pipe 23 is a whole pipe, the part located in the display area 211 is the heat pipe 231, which is used to absorb heat, and the part located in the non-display area 212 is the cooling pipe 232, which is used to dissipate heat.

[0081] Furthermore, if Figure 5 As shown in the partial enlarged view of the cooling tube 232 in the non-display area 212, the cooling tube 232 is arranged to extend in a continuous "S" shape in the non-display area 212. That is, the cooling tube 232 is distributed in the non-display area 212 in a serpentine shape to further increase the length of the cooling tube 232, thereby increasing the heat dissipation capacity of the coolant, so that more coolant in the heat pipe 231 can be instantly diffused into the cooling tube 232 for heat dissipation, thereby improving the heat dissipation effect. It should be noted that the heat dissipation capacity in the embodiment of the present application refers to the maximum capacity of the coolant that can be accommodated in the cooling tube 232.

[0082] See also Figure 6 , Figure 62 is a schematic diagram of the planar structure of the color film substrate provided in the third embodiment of the present application. In this embodiment, the heat conducting pipe 231 includes a plurality of transverse heat absorbing pipes 2311 extending along the first direction X. The two ends of the plurality of transverse heat absorbing pipes 2311 are respectively connected to the cooling pipe 232, so that the cooling liquid in the heat conducting pipe 231 is heated and heat exchanged with the cooling liquid in the cooling pipe 232. The two ends of the transverse heat absorbing pipe 2311 extend to the non-display area 212 as the cooling pipe 232.

[0083] In this embodiment, the temperature micro water pump 24 is not provided. After the cooling liquid in the heat pipe 231 absorbs heat, its temperature rises and it diffuses toward the cooling pipes 232 of the non-display areas 212 at both ends and exchanges with the cooling liquid with lower temperature in the cooling pipes 232 to cool down the temperature in the cooling pipes 232. The cooling liquid with lower temperature in the cooling pipes 232 enters the heat pipe 231 to absorb heat to realize heat circulation, thereby cooling the display panel 100.

[0084] Furthermore, the cooling pipe 232 in the non-display area 212 is also arranged in a continuous "S" shape in the non-display area 212. That is, the cooling pipe 232 is distributed in the non-display area 212 in a serpentine shape to further increase the length of the cooling pipe 232, thereby increasing the heat dissipation capacity of the coolant, so that more coolant in the heat pipe 231 can be instantly diffused into the cooling pipe 232 for heat dissipation, thereby improving the heat dissipation effect.

[0085] In other embodiments, the heat pipe 231 may also be a longitudinal heat absorbing pipe 2312 , both ends of which extend along the second direction Y to the non-display area 212 to serve as cooling pipes 232 . Both ends of the heat pipe 231 serve as cooling pipes 232 .

[0086] See also Figure 7 , Figure 7 Schematic diagram of the planar structure of the color filter substrate provided in the fourth embodiment of the present application. Figure 6 The difference from the embodiment is that in this embodiment, the cooling pipe 232 extends along the display area 211 and surrounds the heat pipe 231, and both ends of each transverse heat absorption pipe 2311 are connected to the cooling pipe 232, so that the cooling liquid in the transverse heat absorption pipe 2311 diffuses into the cooling pipe 232 after being heated, and exchanges with the cooling liquid with a lower temperature in the cooling pipe 232, thereby achieving cooling. In this embodiment, the cooling pipe 232 is extended along the display area 211 and surrounds the heat pipe 231 to increase the length of the cooling pipe 232, thereby increasing the heat dissipation capacity of the cooling liquid, so that more cooling liquid in the heat pipe 231 can be instantly diffused into the cooling pipe 232 for heat dissipation. Furthermore, the cooling pipe 232 in the non-display area 212 is also extended in a continuous "S" shape in the non-display area 212 to further increase the length of the cooling pipe 232, thereby increasing the heat dissipation capacity of the cooling liquid.

[0087] See also Figure 8 , Figure 8 Schematic diagram of the planar structure of the color filter substrate provided in the fifth embodiment of the present application. Figure 7 The difference between the embodiments is that in this embodiment, the heat conducting pipe 231 includes both a transverse heat absorbing pipe 2311 extending along the first direction X and a longitudinal heat absorbing pipe 2312 extending along the second direction Y, and the transverse heat absorbing pipe 2311 and the longitudinal heat absorbing pipe 2312 are connected to each other to form a longitudinal heat absorbing pipe 2312 heat conducting pipe 231, and the longitudinal heat absorbing pipe 2312 heat conducting pipe 231 has at least two connection ports, and the longitudinal heat absorbing pipe 2312 connection port is connected to the longitudinal heat absorbing pipe 2312 cooling pipe 232, and the longitudinal heat absorbing pipe 2312 cooling pipe 232 extends along the longitudinal heat absorbing pipe 2312 non-display area 212 and surrounds the longitudinal heat absorbing pipe 2312 heat conducting pipe 231. By such a configuration, the diffusion path of the coolant in the heat conducting pipe 231 can be increased to further improve the heat dissipation efficiency and the heat dissipation effect.

[0088] See also Fig. 9 , Fig. 9 : is a schematic diagram of the planar structure of the color film substrate provided in the sixth embodiment of the present application. In this embodiment, in the display area 211, along the gravity direction G, the distribution density of the transverse heat absorption pipe 2311 gradually increases, so that the heat dissipation efficiency of the heat dissipation component gradually increases along the gravity direction G, thereby further reducing the fluidity of the liquid crystal in the lower area of ​​the display panel 100 along the gravity direction G, so as to further reduce the gravity Mura caused by the enhanced fluidity of the liquid crystal in the display panel 100 under the influence of gravity.

[0089] Alternatively, in other embodiments, in the display area 211, along the gravity direction G, the diameter of the heat pipe 231 gradually increases, so that more cooling liquid is provided in the lower area along the gravity direction G, so that the heat dissipation efficiency of the heat dissipation assembly gradually increases along the gravity direction G, thereby further reducing the fluidity of the liquid crystal in the lower area along the gravity direction G in the display panel 100, so as to further reduce the gravity Mura caused by the enhanced liquid crystal fluidity in the display panel 100 under the influence of gravity. It should be noted that the diameter of the heat pipe 231 gradually increases along the gravity direction G, but the maximum width of the positive projection of the heat pipe 231 on the substrate 21 does not exceed the width of the positive projection of the black matrix BM on the substrate 21; that is, the positive projection of the heat pipe 231 on the substrate 21 is located within the positive projection of the black matrix BM on the substrate 21 to avoid the heat pipe 231 blocking light.

[0090] See also Fig.10 , Fig.10It is a schematic diagram of the planar structure provided by the second embodiment of the color filter substrate in the display area provided by the present application. In the embodiment of the present application, the color filter substrate 20 also includes a spacer column 26, and the spacer column 26 is arranged on the side of the black matrix BM away from the substrate 21. Among them, the longitudinal heat absorption tube 2312, the heat conduction tube 231 and the longitudinal heat absorption tube 2312 spacer column 26 are arranged at intervals on the longitudinal heat absorption tube 2312 black matrix BM to facilitate the arrangement of the spacer column 26. For example, in the present embodiment, the heat conduction tube 231 includes a plurality of transverse heat absorption tubes 2311 arranged along the first direction X, and the spacer columns 26 are arranged in rows along the first direction X on the transverse light shielding layer BM1 of the black matrix BM; along the second direction Y, the transverse heat absorption tube 2311 and the spacer columns 26 are arranged alternately, to facilitate the arrangement of the spacer columns 26.

[0091] Furthermore, the spacer column 26 includes a main spacer column 261 and an auxiliary spacer column 262 (see Fig.12 ), the main spacer columns 261 and the auxiliary spacer columns 262 are alternately arranged; in the direction perpendicular to the substrate 21, the height of the main spacer columns 261 is greater than the height of the auxiliary spacer columns 262; and, in the direction perpendicular to the substrate 21, the height of the heat pipe 231 does not exceed the height of the auxiliary spacer columns 262, so as to avoid the heat pipe 231 affecting the emission of light and at the same time avoid the heat pipe 231 affecting the supporting function of the spacer columns 26.

[0092] See also Fig.11 and Fig.12 , Fig.11 is a schematic diagram of a planar structure of a color filter substrate provided in the third embodiment of the display area provided by the present application, Fig.12 yes Fig.11 A schematic diagram of a cross-sectional structure of an embodiment of a medium color film substrate in the AA direction. In this embodiment, the wall of the heat pipe 231 bulges away from the substrate 21 at a preset position to form a sub-heat absorbing portion 2314, and the sub-heat absorbing portion 2314 has a cavity connected to the inside of the heat pipe 231, so that the cooling liquid in the heat pipe 231 is filled in the cavity; a groove 263 is provided on the side of the spacer column 26 close to the substrate 21, and the spacer column 26 is arranged at a preset position, and is mutually engaged with the sub-heat absorbing portion 2314 through the groove 263. Through the above arrangement, the cooling liquid can be arranged inside the spacer column 26, so that the liquid crystal can be cooled in a direction perpendicular to the substrate 21. Moreover, this arrangement enables the heat pipe 231 to be arranged row by row at the black matrix BM, thereby increasing the distribution density of the heat pipe 231 in the display area 211 and increasing the volume of the cooling liquid in the heat pipe 231, so as to further improve the heat dissipation efficiency.

[0093] See also Fig.13 and Fig.14 , Fig.13 yes Fig.11A schematic cross-sectional structure diagram of another embodiment of the color film substrate in the AA direction is provided, Fig.14 yes Fig.11 Schematic diagram of the cross-sectional structure of the color film substrate in the BB direction. Further, in order to facilitate the thinness of the display panel 100 and the combination of the heat pipe 231 and the black matrix BM, a mounting groove 224 can be opened on the black matrix BM, and the heat pipe 231 is arranged in the mounting groove 224. Moreover, this arrangement can further increase the diameter of the heat pipe 231 in the direction perpendicular to the substrate 21, thereby further increasing the capacity of the coolant in the heat pipe 231, so as to further improve the heat dissipation efficiency.

[0094] Specifically, the material of the liquid cooling tube 23 can be an organic material, such as resin. The liquid cooling tube 23 can be formed on the black matrix BM by using a semi-film deposition process, or can be first formed by using a 3D printing method, and then laid on the black matrix BM area by an adhesive.

[0095] See also Fig.15 , Fig.15 yes Fig.12 Schematic diagram of the manufacturing process of the color filter substrate. In this embodiment, a method for manufacturing a color filter substrate 20 is provided, and the manufacturing method includes:

[0096] S11: providing a substrate 21;

[0097] S12: making a black matrix BM on the substrate 21;

[0098] S13: forming a color resist layer 22 on the black matrix BM;

[0099] S14: manufacturing the liquid cooling tube 23: using a semi-film deposition process to manufacture the liquid cooling tube 23 on the black matrix BM; or, using a 3D printing method to manufacture the formed liquid cooling tube 23, and laying the formed liquid cooling tube 23 on the black matrix BM;

[0100] S15 : forming spacer columns 26 by deposition on the sub-heat absorbing portion 2314 of the heat pipe 231 .

[0101] Among them, in the liquid cooling tube 23 manufactured in step S14, the tube wall of the liquid cooling tube 23 protrudes at a preset position in a direction away from the substrate 21 to form a sub-heat absorbing portion 2314, and the sub-heat absorbing portion 2314 has a cavity in communication with the inside of the heat conducting tube 231, so that the cooling liquid in the heat conducting tube 231 is filled in the cavity. In step S15, a spacer column 26 is deposited on the sub-heat absorbing portion 2314 of the heat conducting tube 231, and a groove 263 is formed on the side of the spacer column 26 close to the substrate 21, and the groove 263 is mutually embedded with the corresponding sub-heat absorbing portion 2314.

[0102] Furthermore, the color filter substrate 20 generally also includes a planarization layer and an alignment layer (not shown). The planarization layer is arranged on the side of the color resist layer 22 away from the substrate 21 to planarize the side of the color filter substrate 20 close to the liquid crystal layer 31, so as to reinforce the spacer column 26 and make the alignment layer relatively flat to improve the alignment effect on the liquid crystal.

[0103] Correspondingly, the production method further includes:

[0104] S16: forming a flat layer on the color resist layer 22;

[0105] S17: forming an alignment layer on the planar layer.

[0106] See also Fig.16 and Fig.17 , Fig.16 2 is a schematic diagram of the planar structure of the color filter substrate in the display area 211 provided in the seventh embodiment of the present application. Fig.17 yes Fig.16 A schematic diagram of a cross-sectional structure of an embodiment of a color film substrate in the AA direction. In this embodiment, the heat pipe 231 includes a plurality of transverse heat absorbing pipes 2311 extending along a first direction X and a plurality of longitudinal heat absorbing pipes 2312 extending along a second direction Y. The transverse heat absorbing pipes 2311 and the longitudinal heat absorbing pipes 2312 are interconnected to form the heat pipe 231. The heat pipe 231 is disposed on one side of the substrate 21 and serves as a black matrix BM; the longitudinal heat absorbing pipes 2312 and the transverse heat absorbing pipes 2311 intersect and surround to form a plurality of pixel openings, and the color resist layer 22 is disposed in the pixel openings.

[0107] It is easy to understand that in the present embodiment, the heat pipe 231 is not only used for absorbing heat, but also serves as the black matrix BM by setting the shape of the heat pipe 231 to the shape of the black matrix BM and setting it at the position of the black matrix BM. In this way, the process of the black matrix BM can be omitted in the production process, and the structure of the color film substrate 20 can be simplified, which is beneficial to the lightweight design of the display panel 100.

[0108] Please see Fig.18 , Fig.18 yes Fig.16 A schematic cross-sectional structure diagram of another embodiment of a medium color film substrate in the AA direction. Figure 12-14Similar to the embodiment in, in this embodiment, the wall of the heat pipe 231 bulges away from the substrate 21 at a preset position to form a sub-heat absorbing portion 2314, and the sub-heat absorbing portion 2314 has a cavity in communication with the inside of the heat pipe 231, so that the cooling liquid in the heat pipe 231 is filled in the cavity; a groove 263 is provided on the side of the spacer column 26 close to the substrate 21, and the spacer column 26 is arranged at a preset position, and is interlocked with the sub-heat absorbing portion 2314 through the groove 263. Through the above arrangement, the cooling liquid can be arranged inside the spacer column 26, so that the liquid crystal can be cooled in a direction perpendicular to the substrate 21. Moreover, this arrangement enables the heat pipe 231 to be arranged row by row at the black matrix BM, thereby improving the distribution density of the heat pipe 231 in the display area 211 and increasing the volume of the cooling liquid in the heat pipe 231, so as to further improve the heat dissipation efficiency.

[0109] See also Fig.19 , Fig.19 1 is a schematic diagram of a display device according to an embodiment of the present application. In this embodiment, a display device is provided, which includes a display panel 100 and a backlight module. The backlight module is arranged opposite to the display panel 100 to provide backlight to the display panel 100, thereby displaying an image.

[0110] The display panel 100 is a liquid crystal panel. The specific structure of the display panel 100 is as follows: Figure 1 As shown, the display panel 100 includes an array substrate 10, a color film substrate 20 and a liquid crystal layer 31; the array substrate 10 and the color film substrate 20 are arranged in a box to form a closed space, and the liquid crystal layer 31 is arranged between the array substrate 10 and the color film substrate 20, that is, arranged in the closed space formed by the array substrate 10 and the color film substrate 20.

[0111] Specifically, the specific structure and function of the color filter substrate 20 are the same or similar to the specific structure and function of the color filter substrate 20 involved in the above embodiment, and can achieve the same technical effect. Please refer to the detailed introduction above for details, which will not be repeated here.

[0112] The display device provided in this embodiment can adapt to high temperature environments, such as high temperature application scenarios such as vehicle-mounted display and projection display, and can operate stably in high temperature usage scenarios, significantly improving heat resistance.

[0113] The above are only implementation methods of the present application, and are not intended to limit the patent protection scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A color film substrate, comprising: A substrate having a display area and a non-display area arranged around the display area; A filter layer, disposed on one side of the substrate, comprising a plurality of color resist layers of different colors; The color filter substrate further comprises a heat dissipation component, the heat dissipation component comprises a liquid cooling tube, the liquid cooling tube is arranged on one side of the substrate and is located on the same side of the substrate as the filter layer, and a coolant is arranged in the liquid cooling tube; Among them, the liquid cooling pipe includes a heat conducting pipe and a cooling pipe which are interconnected; the heat conducting pipe is arranged in the display area, located between adjacent color resistance layers, and is staggered with the color resistance layers; the cooling pipe is arranged in the non-display area, and is connected with the heat conducting pipe.

2. The color film substrate according to claim 1, characterized in that: The filter layer further includes a black matrix, and the black matrix is ​​arranged on one side of the substrate; the black matrix includes a transverse light shielding layer extending along a first direction and a longitudinal light shielding layer extending along a second direction, and a plurality of the transverse light shielding layers and a plurality of the longitudinal light shielding layers are staggered in the first direction and the second direction to form a plurality of pixel openings, and the color resistance layer is arranged in the pixel openings; wherein the first direction and the second direction intersect; The heat conducting pipe is arranged on a side of the black matrix away from the substrate, and the orthographic projection of the heat conducting pipe on the substrate is located within the orthographic projection of the black matrix on the substrate.

3. The color film substrate according to claim 2, characterized in that: The heat-conducting pipe comprises a plurality of transverse heat-absorbing pipes extending along the first direction or a plurality of longitudinal heat-absorbing pipes extending along the second direction; wherein both ends of the plurality of transverse heat-absorbing pipes or the plurality of longitudinal heat-absorbing pipes are respectively connected to the cooling pipe, so that the cooling liquid in the heat-conducting pipe can exchange heat with the cooling liquid in the cooling pipe after being heated; both ends of the transverse heat-absorbing pipes or the longitudinal heat-absorbing pipes extend to the non-display area as the cooling pipes, or the cooling pipes extend along the non-display area and surround the heat-conducting pipes; or, The heat-conducting pipe also includes a connecting pipe; a plurality of the transverse heat-absorbing pipes or the longitudinal heat-absorbing pipes are connected end to end through the connecting pipe, and the two ends of the heat-conducting pipe connected end to end are respectively connected to the two ends of the cooling pipe, the connecting pipe extends along the second direction or the first direction, and the orthographic projection of the connecting pipe on the substrate is located within the orthographic projection of the black matrix on the substrate; the cooling pipe extends along the non-display area and surrounds the heat-conducting pipe, and the heat dissipation component also includes a micro water pump arranged in the pipeline of the cooling pipe, so as to drive the coolant to circulate in the pipeline; or, The heat conduction pipe includes a plurality of transverse heat absorption pipes and a plurality of longitudinal heat absorption pipes, the transverse heat absorption pipes and the longitudinal heat absorption pipes are interconnected to form the heat conduction pipe, and the heat conduction pipe has at least two connection ports, the connection ports are connected to the cooling pipe, and the cooling pipe extends along the non-display area and surrounds the heat conduction pipe.

4. The color film substrate according to claim 2, characterized in that: The color filter substrate further comprises a spacer column, which is arranged on a side of the black matrix away from the substrate; the spacer column comprises a main spacer column and an auxiliary spacer column, and the main spacer column and the auxiliary spacer column are alternately arranged; in a direction perpendicular to the substrate, the height of the main spacer column is greater than the height of the auxiliary spacer column; The maximum width of the orthographic projection of the heat pipe on the substrate does not exceed 0.8 times the width of the orthographic projection of the black matrix on the substrate; in the direction perpendicular to the substrate, the height of the heat pipe does not exceed the height of the auxiliary spacer column.

5. The color film substrate according to claim 1, characterized in that: The heat-conducting pipe comprises a plurality of transverse heat-absorbing pipes extending in a first direction and a plurality of longitudinal heat-absorbing pipes extending in a second direction, wherein the transverse heat-absorbing pipes and the longitudinal heat-absorbing pipes are interconnected to form the heat-conducting pipe; the first direction and the second direction intersect; The heat conducting pipe is arranged on one side of the substrate and serves as a black matrix; the longitudinal heat absorbing pipe and the transverse heat absorbing pipe intersect and surround to form a plurality of pixel openings, and the color resist layer is arranged in the pixel openings.

6. The color film substrate according to claim 2 or 5, characterized in that: The color filter substrate further comprises a spacer column, wherein the spacer column is arranged on a side of the black matrix away from the substrate; The heat conducting pipe and the spacer column are arranged on the black matrix at intervals; or, The tube wall of the heat-conducting tube protrudes in a preset position in a direction away from the substrate to form a sub-heat-absorbing portion, and the sub-heat-absorbing portion has a cavity connected to the inside of the heat-conducting tube so that the cooling liquid in the heat-conducting tube is filled in the cavity; the spacer column is provided with a groove on one side close to the substrate, and the spacer column is arranged at the preset position and is interlocked with the sub-heat-absorbing portion through the groove.

7. The color film substrate according to claim 1, characterized in that: The heat dissipation component also includes a metal heat dissipation layer arranged in the non-display area. The metal heat dissipation layer is arranged between the substrate and the cooling tube and contacts the cooling tube. The metal heat dissipation layer extends along the non-display area and surrounds the display area.

8. The color film substrate according to claim 7, characterized in that: The cooling pipe is extended in the non-display area in a continuous "S" shape; The metal heat dissipation layer is electrically connected to a ground signal.

9. A display panel, characterized in that: include: An array substrate; A color filter substrate, arranged in a box with the array substrate, wherein the color filter substrate is the color filter substrate according to any one of claims 1 to 8; The liquid crystal layer is arranged between the array substrate and the color filter substrate.

10. A display device, characterized in that: include: A display panel, wherein the display panel is the display panel according to claim 9; The backlight module is arranged at one side of the display panel and is used for providing backlight to the display panel.

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