An inverted bonding process apparatus and process method

Abstract

The application discloses a process device and method for inverted bonding. The process device comprises: a plurality of process heads for obtaining a plurality of chips for process treatment; a plurality of micro-motion structures respectively connected to the process heads for adjusting the poses of the process heads; a linear motor module for the process heads to synchronously perform interval adjustment thereon; and a controller configured to: according to target positions of the process heads, synchronously perform initial adjustment on the intervals of the process heads through the linear motor module; and according to target poses of the process heads, synchronously perform fine adjustment on the poses of the process heads through the micro-motion structures, so that the plurality of chips meet the target poses for process treatment. The application can improve machine compatibility, expand application scenarios, and accurately and synchronously adjust the plurality of process heads in real time, thereby reducing adjustment time and improving the precision, efficiency and capacity of the machine.

Description

Technical Field

[0001] This invention relates to the technical field of semiconductor processes, and specifically to an inverted bonding process apparatus, an inverted bonding process method, and a computer-readable storage medium. Background Technology

[0002] In the field of hybrid bonding, chip-to-wafer bonding achieves performance improvements and size reductions through 3D stacking. This not only reduces costs but also further increases circuit density, enabling further reduction in linewidth from another perspective. Therefore, in the field of chip-to-wafer bonding, bonding precision and throughput per unit time are particularly important.

[0003] In flip-chip bonding, the bonding surface of the chip, used to form electrical connections with external components, faces downwards as the chip is bonded to the wafer. However, in flip-chip bonding with the wafer's front side facing upwards, particles easily accumulate on the bonding surface. During chip transfer, the wafer is in a waiting state, and as the waiting time increases, there is a risk of particle accumulation on the bonding surface. These particles can affect subsequent bonding quality, causing bubbles after bonding and reduced overlay accuracy. To improve the problem of particle accumulation on the bonding surface, an inverted bonding process can be used for chip-to-wafer bonding. In inverted bonding, the bonding surface of the wafer faces downwards, and the chip to be bonded needs to be bonded to the wafer from bottom to top, thus solving the problem of particle accumulation on the bonding surface affecting bonding quality.

[0004] However, inverted bonding processes require higher precision from the bonding equipment. Therefore, the precision of equipment suitable for inverted bonding cannot meet the process requirements. Furthermore, current bonding machines, whether single-station or dual-station, typically only have one bonding head per bonding assembly, meaning only one chip can be bonded at a time. This single bonding head means incompatibility with different types of chips, and it also limits throughput per unit time. Additionally, it's impossible to adjust the spacing between bonding heads on multiple bonding assemblies in real time when transferring chips to the pick-up head.

[0005] To address the aforementioned problems in existing technologies, there is an urgent need in the field for an improved semiconductor process technology that can process multiple different types of chips in a single operation, thereby improving machine compatibility, expanding application scenarios, and enabling precise real-time synchronous adjustment of multiple process heads according to process requirements, reducing adjustment time, and thus improving machine accuracy, efficiency, and throughput. Summary of the Invention

[0006] The following provides a brief overview of one or more aspects to offer a basic understanding of them. This overview is not an exhaustive summary of all conceived aspects, nor is it intended to identify key or decisive elements of all aspects, nor to define the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed descriptions that follow.

[0007] To overcome the aforementioned deficiencies in the prior art, this invention provides an inverted bonding process apparatus, an inverted bonding process method, and a computer-readable storage medium, capable of processing multiple different types of chips in a single operation, thereby improving machine compatibility and expanding application scenarios. Furthermore, it can precisely and synchronously adjust multiple process heads in real time according to process requirements, reducing adjustment time and thus improving the machine's precision, efficiency, and production capacity.

[0008] Specifically, the inverted bonding process apparatus provided according to the first aspect of the present invention includes: a plurality of process heads for acquiring a plurality of chips for process processing; a plurality of micro-motion structures respectively connected to each of the process heads for adjusting the pose of the plurality of process heads; a linear motor module for synchronously adjusting the spacing of the plurality of process heads thereon; and a controller configured to: perform synchronous initial adjustment of the spacing of the plurality of process heads through the linear motor module according to the target position of the plurality of process heads; and perform synchronous fine adjustment of the pose of the plurality of process heads through the plurality of micro-motion structures according to the target orientation of the plurality of process heads, so that the plurality of chips on them conform to the target orientation of the process processing.

[0009] Furthermore, in some embodiments of the present invention, the plurality of process heads are a plurality of bonding heads, and the step of synchronously adjusting the spacing of the plurality of process heads according to the target positions of the plurality of process heads via the linear motor module includes: determining the target intersection position of the plurality of bonding heads according to the intersection position of the plurality of pickup heads; and synchronously adjusting the spacing of the plurality of bonding heads via the linear motor module.

[0010] Furthermore, in some embodiments of the present invention, the step of synchronously fine-tuning the poses of the plurality of process heads according to the target poses of the plurality of process heads through the plurality of micro-motion structures so that the plurality of chips on them conform to the target pose of the process processing includes: determining the target handover pose of the plurality of bonding heads according to the handover poses of the plurality of pickup heads; and synchronously fine-tuning the poses of the plurality of bonding heads through the plurality of micro-motion structures so that they conform to the target handover pose.

[0011] Furthermore, in some embodiments of the present invention, the step of synchronously adjusting the spacing of the plurality of process heads according to the target positions of the plurality of process heads via the linear motor module further includes: in response to the plurality of bonding heads picking up the plurality of chips, obtaining the bonding positions of the plurality of chips according to the wafer diagram of the inverted wafer to be bonded; determining the target bonding positions of the plurality of bonding heads according to the bonding positions of the plurality of chips; and synchronously adjusting the spacing of the plurality of bonding heads via the linear motor module.

[0012] Furthermore, in some embodiments of the present invention, the step of synchronously fine-tuning the poses of the plurality of process heads according to the target poses of the plurality of process heads through the plurality of micro-motion structures so that the plurality of chips on them conform to the target pose of the process processing further includes: determining the bonding pose of the plurality of chips according to the mounting area in the wafer diagram; determining the target bonding pose of the plurality of bonding heads according to the bonding pose of the plurality of chips; synchronously fine-tuning the poses of the plurality of bonding heads through the plurality of micro-motion structures so that the plurality of chips on them conform to the target bonding pose; and driving the plurality of bonding heads to rise so as to rise and bond the plurality of chips to the mounting area.

[0013] Furthermore, in some embodiments of the present invention, the plurality of process heads are a plurality of pickup heads, and the step of synchronously adjusting the spacing of the plurality of process heads according to the target positions of the plurality of process heads via the linear motor module includes: determining the target pickup positions of the plurality of pickup heads according to the positions of the multiple chips to be picked up on the wafer disk; and synchronously adjusting the spacing of the plurality of pickup heads via the linear motor module.

[0014] Furthermore, in some embodiments of the present invention, the step of synchronously fine-tuning the poses of the plurality of process heads according to the target poses of the plurality of process heads through the plurality of micro-motion structures so that the plurality of chips on them conform to the target pose of the process processing includes: determining the target pickup pose of the plurality of process heads according to the current poses of the plurality of chips to be picked up; and synchronously fine-tuning the poses of the plurality of process heads through the plurality of micro-motion structures so that they conform to the target pickup pose.

[0015] Furthermore, in some embodiments of the present invention, the plurality of bonding heads may include bonding heads of various sizes, or the plurality of pickup heads may include pickup heads of various sizes.

[0016] Furthermore, in some embodiments of the present invention, the micro-motion structure includes a first micro-motion part and a second micro-motion part, wherein the first micro-motion part drives the process head to perform translational micro-motion in the X-axis direction and / or Y-axis direction, and the second micro-motion part drives the process head to perform rotational micro-motion around the Z-axis direction.

[0017] Furthermore, in some embodiments of the present invention, the process apparatus further includes: a grating ruler located below the plurality of process heads; and a reading head located in each of the process heads, for reading the coordinates of each of the process heads via the grating ruler.

[0018] Furthermore, the inverted bonding process method provided by the second aspect of the present invention includes the following steps: adjusting the spacing of a plurality of process heads in the inverted bonding process apparatus provided by the first aspect of the present invention synchronously at their target positions using a linear motor module; and adjusting the pose of the plurality of process heads synchronously and finely using a plurality of micro-motion structures according to their target orientations, so that the multiple chips on them conform to the target orientation of the process.

[0019] Furthermore, according to a third aspect of the present invention, a computer-readable storage medium is provided having computer instructions stored thereon. When the computer instructions are executed by a processor, the inverted bonding process method described above, as provided in the second aspect of the present invention, is implemented. Attached Figure Description

[0020] The above-described features and advantages of the present invention will be better understood after reading the following detailed description of embodiments of the present disclosure in conjunction with the accompanying drawings. In the drawings, components are not necessarily drawn to scale, and components having similar related characteristics or features may have the same or similar reference numerals.

[0021] Figure 1 A top view of an inverted bonding process apparatus provided according to some embodiments of the present invention is shown;

[0022] Figure 2 A front view schematic diagram of an inverted bonding process apparatus provided according to some embodiments of the present invention is shown; and

[0023] Figure 3 A flowchart of an inverted bonding process method provided according to some embodiments of the present invention is shown.

[0024] Figure label:

[0025] 100 Inverted bonding process equipment;

[0026] 110 First process head;

[0027] 120 Second process head;

[0028] 130 Micro-motion structure;

[0029] 131 First micro-motion part;

[0030] 132 Second micro-motion part;

[0031] 140 Linear Motor Module;

[0032] 150 grating ruler;

[0033] 160 reading heads; and

[0034] Steps S310 to S320. Detailed Implementation

[0035] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Although the description of the present invention is presented in conjunction with preferred embodiments, this does not mean that the features of the invention are limited to these embodiments. On the contrary, the purpose of describing the invention in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of the present invention. To provide a thorough understanding of the invention, many specific details will be included in the following description. The invention may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of the invention, some specific details will be omitted in the description.

[0036] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0037] Furthermore, the terms "upper," "lower," "left," "right," "top," "bottom," "horizontal," and "vertical" used in the following description should be understood as the orientations shown in the relevant paragraphs and accompanying drawings. These relative terms are for illustrative purposes only and do not imply that the described apparatus must be manufactured or operated in a specific orientation, and therefore should not be construed as limiting the invention.

[0038] It is understood that although terms such as "first," "second," and "third" may be used herein to describe various components, regions, layers, and / or parts, these components, regions, layers, and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers, and / or parts. Therefore, the first components, regions, layers, and / or parts discussed below may be referred to as second components, regions, layers, and / or parts without departing from some embodiments of the present invention.

[0039] As mentioned above, inverted bonding processes require higher precision from the bonding equipment. Therefore, the precision of equipment suitable for inverted bonding cannot meet the process requirements. Furthermore, current bonding machines, whether single-station or dual-station, typically only mount one bonding head per bonding assembly. A single bonding head means incompatibility with different types of chips, and it also limits the throughput per unit time. Additionally, when transferring chips to the pick-up head, it is impossible to adjust the spacing between bonding heads on multiple bonding assemblies in real time.

[0040] To address the aforementioned problems in the prior art, this invention provides an inverted bonding process apparatus, an inverted bonding process method, and a computer-readable storage medium, capable of processing multiple different types of chips in a single operation, thereby improving machine compatibility and expanding application scenarios. Furthermore, it can precisely and synchronously adjust multiple process heads in real time according to process requirements, reducing adjustment time and thus improving the machine's precision, efficiency, and production capacity.

[0041] In some non-limiting embodiments, the inverted bonding process apparatus provided in the first aspect of the present invention can be used to implement the inverted bonding process method provided in the second aspect of the present invention. Specifically, in some non-limiting embodiments, the computer-readable storage medium provided in the third aspect of the present invention stores computer instructions thereon. When the computer instructions are executed by a processor, they can be used to implement the inverted bonding process method provided in the second aspect of the present invention.

[0042] The working principle of the above-described inverted bonding process apparatus will be described below with reference to some embodiments of inverted bonding process methods. Those skilled in the art will understand that these embodiments of the inverted bonding process methods are merely non-limiting implementations provided by the present invention, intended to clearly demonstrate the main concept of the invention and provide specific solutions convenient for public implementation, rather than limiting all operating methods or functions of the inverted bonding process apparatus. Similarly, the inverted bonding process apparatus is also only a non-limiting implementation provided by the present invention and does not limit the entities implementing each step in these inverted bonding process methods.

[0043] Please refer to Figure 1 , Figure 1 A top view of an inverted bonding process apparatus provided according to some embodiments of the present invention is shown.

[0044] like Figure 1 As shown, in some embodiments of the present invention, the inverted bonding process apparatus 100 may include multiple process heads, such as a first process head 110 and a second process head 120, which can be used to acquire multiple chips for process processing. The multiple process heads can be integrated onto a linear motor module 140, which allows the multiple process heads to synchronously adjust their spacing. A micro-motion structure 130 is connected below each process head, which can be used to adjust the pose of the multiple process heads.

[0045] The inverted bonding process apparatus 100 may further include a controller (not shown in the figures) connected to multiple process heads, micro-motion structures 130, and linear motor modules 140. The controller can be configured to execute various steps in the inverted bonding process method. First, the controller can perform synchronous initial adjustment of the spacing between the multiple process heads via the linear motor module 140, based on the target positions of the multiple process heads. Then, the controller can perform synchronous fine adjustment of the pose of the multiple process heads via the multiple micro-motion structures 130, based on the target orientation of the multiple process heads, so that the multiple chips on them conform to the target orientation for the process.

[0046] Furthermore, in some optional embodiments, the multiple process heads integrated on the linear motor module 140 can be multiple pick-up heads, wherein the pick-up heads are preferably non-contact suction heads. The chip pick-up process involves using multiple pick-up heads to pick up the front side of the chip from above multiple diced chips placed on the wafer disk. Since the front side of the chip includes bumps that form electrical connections with the outside, in order to facilitate the pick-up operation without damaging the circuit structure on the front side of the chip, a non-contact suction head can be used to directly pick up the front side of the chip, with the back side of the chip facing the bonding head.

[0047] Since the pick-up head picks up the chip from the diced wafer disk, it picks up the front side of the chip (i.e. the bonding side). The pick-up head cannot directly complete the bonding. Therefore, it needs to work with the bonding head to transfer the chip, flipping the front side of the chip over so that it can be bonded to the wafer to be bonded.

[0048] In some alternative embodiments, the multiple process heads integrated on the linear motor module 140 can be replaced with multiple bonding heads, wherein the bonding heads are preferably vacuum pick-up heads. During the process of transferring the chip from the pick-up head to the bonding head, the bonding head picks up the back side of the chip; therefore, vacuum pick-up of the back side of the chip can be used to ensure the front side of the chip faces upwards. In the inverted bonding process, the bonding surface (front side) of the wafer to be bonded faces downwards, and bonding is completed by pressing the chip onto it.

[0049] Furthermore, in some optional embodiments, a process apparatus integrating multiple pick-up heads and a process apparatus integrating multiple bonding heads can be used in combination. The process apparatus integrating multiple pick-up heads performs synchronous pick-up of multiple chips, and then the process apparatus integrating multiple bonding heads performs synchronous bonding of multiple chips.

[0050] Preferably, the multiple bonding heads can be bonding heads of various different sizes; similarly, the multiple pickup heads can also be pickup heads of various different sizes, used for bonding or picking up chips of different sizes and / or types respectively. Different chip sizes refer to chips with different length and width values, for example... Figure 1 The smaller first process head 110 can pick up chips with a size of 9.8 × 10.2 mm, while the larger second process head 120 can pick up chips with a size of 13 × 16.5 mm. The specific chip size can be selected according to requirements. Different types of chips refer to differences in the circuitry or thickness on the chip, which necessitates the use of different bonding heads for bonding. In other words, the inverted bonding apparatus 100 can simultaneously accommodate multiple chips of different sizes and types, performing bonding or pick-up processes concurrently, thus improving process efficiency.

[0051] Please refer to Figure 2 , Figure 2 A front view schematic diagram of an inverted bonding process apparatus provided according to some embodiments of the present invention is shown.

[0052] like Figure 2 As shown, in some embodiments of the present invention, the linear motor module 140 is provided with multiple movers, which are driven to perform linear motion by electromagnetic force. Multiple process heads can be mounted on corresponding movers, and the linear motor module 140 performs macro-motion in the X-axis direction. Further, preferably, the inverted bonding process apparatus 100 may also include a linear motor module in another direction, connected to the linear motor module 140, to provide macro-motion in the Y-axis direction for the multiple process heads. The linear motor module 140 allows for real-time synchronous macro-motion initial adjustment of the spacing between the multiple process heads integrated thereon, achieving micron-level positional accuracy control, thereby improving the efficiency of the multiple process heads reaching the target position.

[0053] Please continue as follows Figure 2 As shown, in some embodiments of the present invention, the micro-motion structure 130 may further include a first micro-motion part 131 and a second micro-motion part 132. The first micro-motion part 131 can drive the process head to perform translational micro-motion in the X-axis and / or Y-axis directions, and the second micro-motion part 132 can drive the process head to perform rotational micro-motion around the Z-axis direction. Through the micro-motion structure 130, the position and orientation of each process head can be precisely adjusted in real time and synchronously, achieving nanometer-level pose accuracy control, thereby improving the efficiency of each process head reaching the target orientation.

[0054] like Figure 2 As shown, in some preferred embodiments, the inverted bonding process apparatus 100 may further include a grating ruler 150 and a reading head 160. The grating ruler 150 may be located below multiple process heads (such as the first process head 110 and the second process head 120). Each process head is provided with a reading head 160, and the coordinates of each process head can be read through the grating ruler 150. That is, in this embodiment, by using the grating ruler 150 in conjunction with the reading head 160 mounted on the process head, the position of each process head can be accurately obtained, thereby determining the relative positional relationship between the process heads, so that the accuracy of the spacing adjustment mechanism can reach the micrometer level through the linear motor module combined with the grating ruler.

[0055] To better understand the inverted bonding process apparatus 100 described above, please refer to the following... Figure 3 , Figure 3 A flowchart illustrating an inverted bonding process method according to some embodiments of the present invention is shown. Figure 3 The inverted bonding process shown.

[0056] like Figure 3 As shown, in some embodiments of the present invention, the inverted bonding process method may include the following steps: step S310: according to the target positions of multiple process heads in the inverted bonding process apparatus, the spacing of the multiple process heads is initially adjusted synchronously using a linear motor module; and step S320: according to the target orientation of the multiple process heads, the orientation of the multiple process heads is finely adjusted synchronously using multiple micro-motion structures so that the multiple chips on them conform to the target orientation of the process.

[0057] Specifically, please combine Figure 2It is understood that, optionally, in the first embodiment, the multiple process heads configured on the linear motor module 140 can be multiple pick-up heads. Multiple diced chips (dies) are placed on a wafer disk, and the multiple pick-up heads are located above the wafer disk. The controller can obtain the positions of the multiple chips to be picked up on the wafer disk through a first vision component, thereby determining the target pick-up positions of the multiple pick-up heads.

[0058] Subsequently, as Figure 2 As shown, the controller can acquire the current real-time spacing information of the two pickup heads, and then control the first and second pickup heads mounted on the linear motor module 140 to perform macro-motion in the X-axis and / or Y-axis directions, thereby achieving real-time synchronous macro-motion initial adjustment of the spacing between the two pickup heads. The linear motor module 140 can achieve micrometer-level positional accuracy control for the real-time synchronous spacing adjustment of the two pickup heads, thereby improving the efficiency of multiple pickup heads reaching the target pickup position.

[0059] Then, the controller can further acquire the current posture of the multiple chips to be picked up through the first vision component, thereby determining the target picking posture of the multiple picking heads. Afterwards, the controller can control the micro-motion structures 130 corresponding to the first and second picking heads respectively to synchronously and finely adjust the posture of the first and second picking heads. For example, the first micro-motion unit 131 can be used to perform translational micro-motion in the X-axis and / or Y-axis directions of the picking head, and the second micro-motion unit 132 can be used to perform rotational micro-motion around the Z-axis direction of the picking head, so as to align the multiple chips to be picked up on the wafer disk before picking. Then, the two chips are picked up simultaneously, thereby quickly completing the picking of two chips. The micro-motion structure 130 enables real-time synchronous fine-tuning of the position and posture of the two picking heads, achieving nanometer-level posture accuracy control, thereby improving the efficiency of each picking head reaching the target picking posture.

[0060] In the second embodiment of the present invention, after completing the chip picking process in the first embodiment, another set of inverted bonding process apparatus can be used to perform the chip bonding process, wherein the multiple picking heads configured on the linear motor module 140 are multiple bonding heads.

[0061] Specifically, the controller can determine the target junction position of multiple bonding heads based on the junction position of multiple pickup heads, i.e., the current real-time spacing information of the first pickup head. Then, as... Figure 2As shown, the controller can control the first and second bonding heads mounted on the linear motor module 140 to perform macroscopic movements in the X-axis and / or Y-axis directions, thereby achieving real-time synchronous macroscopic initial adjustment of the distance between the two bonding heads, so that the first bonding head corresponds one-to-one with the first pickup head, and the second bonding head corresponds one-to-one with the second pickup head. The linear motor module 140 can achieve micrometer-level positional precision control for the real-time synchronous distance adjustment of the two bonding heads, thereby improving the efficiency of multiple bonding heads reaching the target bonding position.

[0062] Then, the controller can determine the target handover posture of multiple bonding heads based on the handover posture of multiple pickup heads. Afterwards, the controller can control the micro-motion structures 130 corresponding to the first and second bonding heads respectively to synchronously and finely adjust the posture of the first and second bonding heads. For example, the first micro-motion part 131 can be used to perform translational micro-motion in the X-axis and / or Y-axis directions, and the second micro-motion part 132 can be used to perform rotational micro-motion around the Z-axis direction to align the bonding head with the chip to be handed over before handover. Then, the two chips are handed over simultaneously, thereby quickly completing the handover of the two chips. The micro-motion structure 130 enables real-time synchronous fine-tuning of the position and posture of the two bonding heads, achieving nanometer-level posture accuracy control, thereby improving the efficiency of each bonding head reaching the target handover posture.

[0063] Following this, in the chip bonding process, after multiple bonding heads pick up multiple chips, an optical system scans the inverted wafer to be bonded, obtaining a wafer map. A wafer map is a pattern created by fabricating circuitry onto the wafer using various complex physical and chemical methods. In the final stages of production, different electrical functional tests are performed to ensure product functionality. The wafer map is generated using these test results and the wafer's shape. The wafer map can be displayed chip-by-chip, marking the test results with different colors, shapes, or codes at the location of each chip. The controller uses the wafer map to determine the bonding positions of multiple chips. Then, based on the bonding positions of the multiple chips, the controller can determine the target bonding positions for multiple bonding heads.

[0064] Subsequently, as Figure 2As shown, the controller can acquire the current real-time spacing information of the two bonding heads, and then control the first and second bonding heads mounted on the linear motor module 140 to perform macro-motion in the X-axis and / or Y-axis directions again, thereby achieving real-time synchronous macro-motion initial adjustment of the spacing between the two bonding heads. The linear motor module 140 can achieve micron-level positional precision control for the real-time synchronous spacing adjustment of the two bonding heads, thereby improving the efficiency of multiple bonding heads reaching the target bonding position. In this step, by acquiring the relative position information of the two bonding heads at their upcoming bonding positions, the spacing between the two bonding heads is adjusted to match the spacing at the target bonding position for bonding pre-alignment, which facilitates the subsequent rapid simultaneous bonding of the two chips.

[0065] The controller can then continue scanning the inverted wafer image through the optical system, passing through multiple bonding areas to determine the bonding orientation of the multiple chips. The bonding area is the region on the wafer where the chips are to be bonded, and these areas can be distributed at multiple locations on the bonding surface of the wafer. Different bonding areas correspond to different bonding orientations for the chips. For example, a bonding position located in the center of the wafer corresponds to a horizontal bonding orientation, while a bonding position located at the edge of the wafer corresponds to an inclined bonding orientation.

[0066] Then, based on the bonding posture of the multiple chips, the controller can determine the target bonding posture of the first and second bonding heads respectively. Afterwards, the controller can control the micro-motion structures 130 corresponding to the first and second bonding heads respectively to perform synchronized fine adjustment of their positions and postures. Specifically, the first micro-motion unit 131 can perform translational micro-motion in the X-axis and / or Y-axis directions, and the second micro-motion unit 132 can perform rotational micro-motion around the Z-axis direction, so that the two chips can conform to their respective target bonding postures before bonding, and can be aligned with their respective mounting areas on the wafer. Finally, the controller can drive the two bonding heads to rise simultaneously to press and bond the multiple chips onto their respective mounting areas, achieving simultaneous bonding of the two chips. The micro-motion structure 130 enables real-time synchronized fine adjustment of the position and posture of the two bonding heads, achieving nanometer-level posture accuracy control, thereby improving the efficiency of each bonding head reaching the target bonding posture.

[0067] For bonding components, since one bonding head can only be used for bonding one type of chip, the combination of multiple bonding heads is essential in this invention. This reduces the frequency of bonding head replacement and also supports the simultaneous bonding of multiple different types of chips.

[0068] Those skilled in the art will understand that the above-described process head assembly including two bonding heads or two pickup heads is merely a non-limiting embodiment provided by the present invention, intended to clearly demonstrate the main concept of the invention and provide a specific solution convenient for public implementation, rather than being used to limit the scope of protection of the invention. Optionally, in other embodiments, those skilled in the art can also appropriately increase the number of process heads, replace or make compatible with different types of process heads based on the concept of the present invention, to meet the requirements of different process flows, thereby achieving the technical effects of reducing adjustment time, improving work efficiency, being compatible with chips of different sizes and types, and expanding application scenarios.

[0069] Although the methods described above are illustrated and depicted as a series of actions for the sake of simplicity, it should be understood and appreciated that these methods are not limited by the order of the actions, as some actions may occur in a different order and / or concurrently with other actions from the illustrations and descriptions herein or not illustrated and described herein but which may be understood by those skilled in the art, according to one or more embodiments.

[0070] Those skilled in the art will further appreciate that the steps of the methods or algorithms described in connection with the embodiments disclosed herein can be embodied directly in hardware, in a software module executed by a processor, or in a combination of both. The software module may reside in RAM memory, flash memory, ROM memory, EPROM memory, EEPROM memory, registers, hard disk, removable disk, CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to a processor so that the processor can read and write information to / from the storage medium. In an alternative, the storage medium may be integrated into the processor. The processor and storage medium may reside in an ASIC. The ASIC may reside in a user terminal. In an alternative, the processor and storage medium may reside as discrete components in the user terminal.

[0071] In one or more exemplary embodiments, the described functionality may be implemented in hardware, software, firmware, or any combination thereof. If implemented in software as a computer program product, the functionality may be stored or transmitted as one or more instructions or code on or through a computer-readable medium. A computer-readable medium includes both computer storage media and communication media, encompassing any medium that facilitates the transfer of a computer program from one location to another. A storage medium may be any available medium accessible to a computer. By way of example and not limitation, such a computer-readable medium may include RAM, ROM, EEPROM, CD-ROM or other optical disc storage, disk storage or other magnetic storage devices, or any other medium that can be used to carry or store desired program code in the form of instructions or data structures and is accessible to a computer. Any connection is also legitimately referred to as a computer-readable medium. For example, if the software is transmitted from a website, server, or other remote source using coaxial cable, fiber optic cable, twisted pair, digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwave, then the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave are included in the definition of a medium. As used in this article, disk and disc include compact discs (CDs), laser discs, optical discs, digital multi-purpose discs (DVDs), floppy disks, and Blu-ray discs. Disks typically reproduce data magnetically, while discs reproduce data optically using lasers. Combinations of these should also be included within the scope of computer-readable media.

[0072] In summary, this invention provides an inverted bonding process apparatus, an inverted bonding process method, and a computer-readable storage medium, which can process multiple different types of chips in a single operation, thereby improving machine compatibility and expanding application scenarios. At the same time, it can also accurately and synchronously adjust multiple process heads in real time according to process requirements, reducing adjustment time and thus improving the accuracy, efficiency, and production capacity of the machine.

[0073] The prior description of this disclosure is provided to enable any person skilled in the art to make or use this disclosure. Various modifications to this disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of this disclosure. Therefore, this disclosure is not intended to be limited to the examples and designs described herein, but should be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A process apparatus for inverted bonding, characterized in that, include: Multiple process heads are used to acquire multiple chips for process processing, wherein the multiple process heads are multiple bonding heads or multiple pick-up heads; Multiple micro-motion structures are connected to each of the process heads respectively, for adjusting the position and pose of the multiple process heads. Each micro-motion structure includes a first micro-motion part and a second micro-motion part. The first micro-motion part drives the process head to perform translational micro-motion in the X-axis direction and / or Y-axis direction, and the second micro-motion part drives the process head to perform rotational micro-motion around the Z-axis direction. A linear motor module for synchronously adjusting the spacing of the multiple process heads; and The controller is configured to: perform synchronous initial adjustment of the spacing between the plurality of process heads via the linear motor module according to the target position of the plurality of process heads; and perform synchronous fine adjustment of the pose of the plurality of process heads via the plurality of micro-motion structures according to the target pose of the plurality of process heads, so that the plurality of chips on them conform to the target pose of the process processing.

2. The process apparatus as described in claim 1, characterized in that, The step of synchronously adjusting the spacing between the multiple process heads using the linear motor module based on their target positions includes: Based on the intersection positions of the multiple pickup heads, determine the target intersection positions of the multiple bonding heads; and The linear motor module is used to synchronously adjust the spacing between the multiple bonding heads.

3. The process apparatus as described in claim 2, characterized in that, The step of synchronously and precisely adjusting the poses of the multiple process heads according to their target poses, using the multiple micro-motion structures, so that the multiple chips on them conform to the target pose of the process, includes: Based on the handover posture of multiple pickup heads, determine the target handover posture of the multiple bonding heads; and The poses of the multiple bonding heads are synchronously and precisely adjusted using the multiple micro-motion structures to conform to the target handover posture.

4. The process apparatus as described in claim 3, characterized in that, The step of synchronously adjusting the spacing between the multiple process heads using the linear motor module based on their target positions further includes: In response to the multiple bonding heads receiving the multiple chips, the bonding positions of the multiple chips are obtained according to the wafer diagram of the inverted wafer to be bonded. Based on the bonding positions of the multiple chips, determine the target bonding positions of the multiple bonding heads; and The linear motor module is used to synchronously adjust the spacing between the multiple bonding heads.

5. The process apparatus as described in claim 4, characterized in that, The step of synchronously and precisely adjusting the poses of the multiple process heads according to their target poses, using the multiple micro-motion structures, so that the multiple chips on them conform to the target pose of the process processing, further includes: The bonding orientation of the multiple chips is determined based on the multiple patch areas in the wafer diagram; Based on the bonding orientation of the multiple chips, determine the target bonding orientation of the multiple bonding heads; The poses of the multiple bonding heads are synchronously and precisely adjusted using the multiple micro-motion structures to ensure that the multiple chips on them conform to the target bonding posture; and The multiple bonding heads are driven to rise so as to bond the multiple chips to the patch area.

6. The process apparatus as described in claim 1, characterized in that, The step of synchronously adjusting the spacing between the multiple process heads using the linear motor module based on their target positions includes: Based on the positions of the multiple chips to be picked up on the wafer disk, the target pickup positions of the multiple pickup heads are determined; and The linear motor module is used to synchronously adjust the spacing between the multiple pickup heads.

7. The process apparatus as described in claim 6, characterized in that, The step of synchronously and precisely adjusting the poses of the multiple process heads according to their target poses, using the multiple micro-motion structures, so that the multiple chips on them conform to the target pose of the process, includes: Based on the current orientation of the multiple chips to be picked up, the target picking orientation of the multiple process heads is determined; and The poses of the multiple process heads are synchronously and precisely adjusted using the multiple micro-motion structures to conform to the target picking posture.

8. The process apparatus as described in claim 2 or 6, characterized in that, The plurality of bonding heads may include bonding heads of various sizes, or the plurality of pickup heads may include pickup heads of various sizes.

9. The process apparatus as described in claim 1, characterized in that, Also includes: A grating ruler is located below the plurality of process heads; as well as A reading head, located in each of the process heads, reads the coordinates of each process head through the grating ruler.

10. A method for inverted bonding, characterized in that, Includes the following steps: According to the target positions of multiple process heads in the inverted bonding process apparatus as described in any one of claims 1 to 9, the spacing between the multiple process heads is synchronously initially adjusted by a linear motor module. as well as Based on the target orientation of the multiple process heads, the orientation of the multiple process heads is synchronously and precisely adjusted through multiple micro-motion structures so that the multiple chips on them conform to the target orientation of the process.

11. A computer-readable storage medium storing computer instructions thereon, characterized in that, When the computer instructions are executed by the processor, the inverted bonding process method as described in claim 10 is implemented.

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