Display device

Abstract

A display device includes: a first substrate including a first surface and a second surface opposite to each other, the first substrate including a rigid material; the second substrate is arranged on the first surface of the first substrate, and the second substrate comprises a flexible material; and a plurality of light emitting elements disposed on the second substrate, in which the first substrate further includes: a first side surface disposed between the first surface and the second surface; and a first inclined surface disposed between the first surface and the first side surface, where the first side surface and the first inclined surface are at an edge of the first substrate in a bending region where the second substrate is bent, and the display device further includes a filler disposed between the bottom surface of the second substrate and the first side surface of the first substrate in the bending area.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and all benefits arising from Korean Patent Application No. 10-2023-0102661, filed on August 7, 2023, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] Embodiments of the present disclosure relate to a display device. Background Art

[0004] As the information society progresses, there is an increasing demand for display devices for displaying images in various forms. The display device may take the form of a flat panel display device such as a liquid crystal display (LCD), a field emission display (FED), a light emitting display panel, etc.

[0005] Such a display device may include a display area for displaying an image and a non-display area disposed around the display area (e.g., arranged to surround the display area). The non-display area may be used as a dead zone. Attempts have been made to reduce the width of the dead zone to enhance the immersion of the display area and improve the aesthetic appeal of the display device.

[0006] In order to reduce the width of the non-display area, a bending area may be formed between the pad area and the display area, and may be bent to position the pad area below the display panel. In this case, a bendable or foldable flexible substrate may be used. As the size of the substrate increases, a rigid substrate may also be included to maintain the shape of the display device. Summary of the invention

[0007] Embodiments of the present disclosure provide a display device having a minimized width of a dead zone.

[0008] Embodiments of the present disclosure also provide a display device capable of minimizing an external impact applied to a bending region.

[0009] However, the embodiments of the present disclosure are not limited to those described herein. The above and other features of the embodiments of the present disclosure will become more apparent to those skilled in the art to which the present disclosure belongs by referring to the detailed description of the present disclosure given below.

[0010] According to an embodiment of the present disclosure, a display device includes: a first substrate including a first surface and a second surface opposite to each other, wherein the first substrate includes a rigid material; a second substrate arranged on the first surface of the first substrate, wherein the second substrate includes a flexible material; and a plurality of light-emitting elements arranged on the second substrate, wherein the first substrate also includes: a first side surface arranged between the first surface and the second surface; and a first inclined surface arranged between the first surface and the first side surface, wherein the first side surface and the first inclined surface are at an edge of the first substrate in a curved region where the second substrate is curved, and the display device also includes a filler arranged between the bottom surface of the second substrate and the first side surface of the first substrate in the curved region.

[0011] In an embodiment, the filler may have a hardness of Shore 70D or higher.

[0012] In an implementation, the display device may further include a panel bottom cover disposed on the second surface of the first substrate, wherein the filler may be in contact with a side surface of the panel bottom cover.

[0013] In an embodiment, the display device may further include an adhesive member disposed on the panel bottom cover on the second surface of the first substrate, wherein the filler may be in contact with a side surface of the adhesive member.

[0014] In an implementation, a side surface of the panel bottom cover and a side surface of the adhesive member may be positioned on the same line.

[0015] In an embodiment, the filler may further include an air gap, and the air gap may be disposed within the filler.

[0016] In an embodiment, the shape of the air gap may correspond to the shape of the filler.

[0017] In an embodiment, the display device may further include a panel bottom cover disposed on the second surface of the first substrate, wherein the air gap may include: a first corresponding surface facing the first side surface; a second corresponding surface corresponding to the bottom surface of the second substrate; and a third corresponding surface facing the side surface of the panel bottom cover.

[0018] In an embodiment, the first corresponding surface may be an inclined surface, and the second corresponding surface may be a curved surface.

[0019] In an implementation, the filler may further include a protrusion, and the protrusion may be disposed between the first inclined surface and the bottom surface of the second substrate.

[0020] In an implementation, a horizontal length of the first inclined surface may be about 120 micrometers (μm).

[0021] In an embodiment, a vertical length of the first inclined surface may be smaller than a vertical length of the first side surface.

[0022] In an embodiment, an end portion of the first side surface where the first inclined surface meets the first inclined surface may be located closer to the second surface than to the first surface in the thickness direction.

[0023] In an embodiment, an inner angle formed between the first inclined surface and the second surface may be greater than or equal to about 165 degrees.

[0024] In an implementation, an inner angle formed between the first inclined surface and the first surface may be greater than or equal to about 120 degrees.

[0025] According to aspects of the present disclosure, a display device is provided, comprising: a first substrate, comprising a first surface and a second surface opposite to each other and a first side surface arranged between the first surface and the second surface, wherein the first substrate comprises a rigid material; a protective layer arranged on the first surface of the first substrate; a second substrate arranged on the protective layer, wherein the second substrate comprises a flexible material; and a plurality of light-emitting elements arranged on the second substrate, wherein each of the first side surfaces is directly connected to the first surface, and the display device further comprises a filler arranged between a bottom surface of the second substrate and the first side surface of the first substrate in a bending region where the second substrate is bent.

[0026] In an embodiment, the filler may have a hardness of Shore 70D or higher.

[0027] In an embodiment, the filler may include an air gap, and the air gap may be disposed within the filler.

[0028] In an embodiment, the shape of the air gap may correspond to the shape of the filler.

[0029] In an implementation, the adhesion force of the protection layer with respect to the first substrate may be greater than the adhesion force of the second substrate with respect to the first substrate.

[0030] According to an embodiment of the present disclosure, the width of the dead zone can be minimized.

[0031] In such an embodiment, external impact applied to the bending region may be reduced or minimized. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The above and other features of the embodiments of the present disclosure will become more apparent by describing in detail the embodiments of the present disclosure with reference to the accompanying drawings, in which:

[0033] Figure 1 is a perspective view of a display device according to an embodiment of the present disclosure;

[0034] Figure 2is a plan view showing a display panel and a driver integrated circuit (IC) according to an embodiment of the present disclosure;

[0035] Figure 3 is a perspective view of a display device according to another embodiment of the present disclosure;

[0036] Figure 4 is a cross-sectional view of a display device according to an embodiment of the present disclosure;

[0037] Figure 5 It is along Figure 1 A cross-sectional view taken along the line X1-X1';

[0038] Figure 6 is shown in a bent state Figure 5 A cross-sectional view of a display device;

[0039] Figure 7 yes Figure 5 an enlarged cross-sectional view of region A;

[0040] Figure 8 is a cross-sectional view of a conventional display device;

[0041] Fig. 9 is a graph showing a level of stress applied to a circuit layer of a conventional display device based on a push displacement of a bending region of the conventional display device;

[0042] Fig.10 It is shown based on Figure 1 or Figure 3 The pushing displacement of the curved region of the display device is applied to Figure 1 or Figure 3 A graph of the stress level of a circuit layer of a display device;

[0043] Fig.11 is a cross-sectional view of a display device according to another embodiment of the present disclosure;

[0044] Fig.12 is a cross-sectional view of a display device according to another embodiment of the present disclosure;

[0045] Fig.13 is a cross-sectional view of a display device according to another embodiment of the present disclosure;

[0046] Fig.14 is a cross-sectional view of a display device according to another embodiment of the present disclosure; and

[0047] Fig.15 is shown in a bent state Fig.14 A cross-sectional view of a display device. DETAILED DESCRIPTION

[0048] The present invention will now be described more fully below with reference to the accompanying drawings, in which preferred embodiments of the present invention are shown. However, the present invention may be implemented in different forms and should not be construed as being limited to the embodiments set forth herein. On the contrary, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the present invention to those skilled in the art. The same reference numerals represent the same elements throughout.

[0049] It will also be understood that when a layer is referred to as being 'on' another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may also be present. Like reference numerals refer to like components throughout the specification.

[0050] It will be understood that although the terms "first", "second", "third", etc. may be used herein to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings herein, the "first element", "first component", "first region", "first layer" or "first part" discussed below may be referred to as the second element, second component, second region, second layer or second part.

[0051] The terms used herein are only used to describe the purpose of a specific embodiment, and are not intended to be limited. As used herein, "a", "an", "the" and "at least one" do not represent a limitation on quantity, and are intended to include both singular and plural numbers, unless the context clearly indicates otherwise. Therefore, after mentioning "a" element in the claim, citing "the" element includes one element and multiple elements. For example, "an element" has the same meaning as "at least one element", unless the context clearly indicates otherwise. "At least one" should not be interpreted as limiting "a" or "an". "Or" means "and / or". As used herein, the term "and / or" includes any and all combinations of one or more of the related listed items. It will also be understood that when used in this specification, the term "including" and / or "including" or "including" and / or "including" specifies the existence of stated features, regions, entireties, steps, operations, elements and / or parts, but does not exclude the existence or addition of one or more other features, regions, entireties, steps, operations, elements, parts and / or its groups.

[0052] In addition, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe the relationship of one element to another element as shown in the accompanying drawings. It will be understood that, in addition to the orientation depicted in the accompanying drawings, relative terms are intended to include different orientations of the device. For example, if the device in one of the accompanying drawings is turned over, the element described as being on the "lower" side of the other element will then be oriented on the "upper" side of the other element. Therefore, depending on the specific orientation of the accompanying drawings, the term "lower" can include both "lower" and "upper" orientations. Similarly, if the device in one of the accompanying drawings is turned over, the element described as being "below" or "below" the other element will then be oriented "above" the other element. Therefore, the term "below" or "below" can include both upper and lower orientations.

[0053] As used herein, "about" or "approximately" is inclusive of the stated value and means within an acceptable range of deviation for the particular value as determined by one of ordinary skill in the art, in view of the measurements in question and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "about" can mean within one or more standard deviations, or within ±30%, ±20%, ±10%, ±5% of the stated value.

[0054] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present disclosure belongs. It will also be understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and the present disclosure, and will not be interpreted in an idealized or overly formal sense unless explicitly so defined herein.

[0055] Embodiments are described herein with reference to cross-sectional views as schematic diagrams of idealized embodiments. Therefore, variations in the shape of the figures, such as due to manufacturing techniques and / or tolerances, should be expected. Therefore, the embodiments described herein should not be interpreted as being limited to regions of a specific shape as shown herein, but should include deviations in shapes, such as those caused by manufacturing. For example, a region shown or described as flat may typically have rough and / or nonlinear features. In addition, the sharp corners shown may be rounded. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the precise shape of the regions, and are not intended to limit the scope of the claims.

[0056] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0057] Figure 1 is a perspective view of a display device 10 according to an embodiment of the present disclosure. Figure 22 is a plan view showing a display panel 100 and a driver integrated circuit (IC) 200 according to an embodiment of the present disclosure.

[0058] refer to Figure 1 and Figure 2 , an embodiment of the display device 10 as a device capable of displaying video or still images can be used to provide display screens for electronic devices such as mobile phones, smart phones, tablet personal computers (PCs), smart watches, watch phones, mobile communication terminals, electronic notepads, e-book readers, portable multimedia players (PMPs), navigation devices, ultra mobile PCs (UMPCs), and other various products such as televisions (TVs), laptop computers, monitors, billboards, and Internet of Things (IoT) devices.

[0059] The display device 10 may be a light-emitting display device such as an organic light-emitting display device using an organic light-emitting diode (OLED), a quantum dot light-emitting display device including a quantum dot light-emitting layer, an inorganic light-emitting display device including an inorganic semiconductor, or a micro-light-emitting display device or a nano-light-emitting display device using a micro-light-emitting diode (LED) or a nano-light-emitting diode (LED), but the present disclosure is not limited thereto.

[0060] The display device 10 may include a display panel 100 , a driver IC 200 , and a circuit board 300 .

[0061] The display panel 100 may be formed to have a rectangular planar shape having a pair of long sides in a first direction (or X-axis direction) and a pair of short sides in a second direction (or Y-axis direction) intersecting the first direction (or X-axis direction). The angle at which the long side in the first direction (or X-axis direction) meets the short side in the second direction (or Y-axis direction) may be right angled or rounded with a curvature. The planar shape of the display panel 100 is not particularly limited to a rectangle, and the display panel 100 may also be formed in various other polygonal shapes, circular shapes, or elliptical shapes.

[0062] The first direction (or X-axis direction) and the second direction (or Y-axis direction) are shown as horizontal directions intersecting each other. For example, the first direction (or X-axis direction) and the second direction (or Y-axis direction) may be orthogonal to each other. The third direction (or Z-axis direction) may be, for example, a vertical orthogonal direction intersecting the first direction (or X-axis direction) and the second direction (or Y-axis direction) or a thickness direction of the display panel 100. In this specification, the term "one side" or "first side" refers to the direction pointed to by the arrows representing each of the first direction, the second direction and the third direction (or the X-axis direction, the Y-axis direction and the Z-axis direction), and the term "the other side" or "the second side" refers to the opposite direction opposite to the side corresponding thereto.

[0063] The display panel 100 may be formed to be flat, but the present disclosure is not limited thereto. In an embodiment, for example, the display panel 100 may include a curved portion formed at the left and right ends of the display panel 100 and having a constant or varying curvature. In an embodiment, the display panel 100 may be flexibly formed to be bendable, foldable, or rollable.

[0064] The display panel 100 may include a main area MA, a bending area BA, and a pad area PDA. The main area MA may include a display area DA displaying an image and a non-display area NDA disposed around the display area DA.

[0065] The display area DA may occupy a main portion of the display panel 100. The display area DA may be disposed at the center of the display panel 100. Pixels each including a plurality of emission areas for displaying an image may be disposed within the display area DA.

[0066] The non-display area NDA may be disposed adjacent to the display area DA. The non-display area NDA may be positioned outside the display area DA. The non-display area NDA may surround the display area DA. The non-display area NDA may correspond to an edge of the display panel 100.

[0067] The bending area BA may be disposed between the display area DA and the pad area PDA in the second direction (or the Y-axis direction). The bending area BA may extend in the first direction (or the X-axis direction). The bending area BA refers to a portion of the display panel 100 that is bent downward and toward the bottom of the display panel 100. In a state where the bending area BA is bent toward the bottom of the display panel 100, the driver IC 200 and the circuit board 300 may be positioned below the display panel 100.

[0068] The pad area PDA may correspond to a lower edge of the display panel 100. The pad area PDA may include display pads PD, and the display pads PD may be connected to the circuit board 300 and first and second driving pads connected to the driver IC 200.

[0069] In the pad area PDA, the display pad PD may be arranged to be connected with the circuit board 300. The display pad PD may be disposed along one edge of the display panel 100. In an embodiment, the display pad PD may be disposed along a lower edge of the display panel 100, for example.

[0070] The driver IC 200 may generate a data voltage, a power voltage, and a scan timing signal. The driver IC 200 may also output a data voltage, a power voltage, and a scan timing signal.

[0071] The driver IC 200 may be disposed on the display panel 100 in the pad area PDA. The driver IC 200 may be positioned between the display pad PD and the display area DA in the non-display area NDA. In an embodiment, the driver IC 200 may be attached to the non-display area NDA of the display panel 100 using a chip on glass (COG) method. Alternatively, the driver IC 200 may be attached to the circuit board 300 using a chip on plastic (COP) method.

[0072] The circuit board 300 may be disposed on the display pad PD arranged along one edge of the display panel 100. In an embodiment, the circuit board 300 may be attached to the display pad PD using a conductive adhesive material such as an anisotropic conductive film or an anisotropic conductive adhesive. In such an embodiment, the circuit board 300 may be electrically connected to a signal line of the display panel 100. The circuit board 300 may be a flexible film such as a flexible printed circuit board (FPCB) or a chip on film (COF).

[0073] Figure 3 is a perspective view of a display device 10 according to another embodiment of the present disclosure.

[0074] In addition to the shape of the display panel 100, Figure 3 The embodiment of the display device 10 is similar to the above reference Figure 1 and Figure 2 The described embodiments of the display device 10 are essentially the same.

[0075] In an embodiment, reference Figure 3 , the length of the main area MA of the display panel 100 in the first direction (or X-axis direction) may be greater than the lengths of the bending area BA and the pad area PDA of the display panel 100 in the first direction (or X-axis direction). The bending area BA and the pad area PDA may protrude from one of the sides of the main area MA.

[0076] The shape of the display panel 100 is not particularly limited and may vary depending on the type of the display device 10 .

[0077] Figure 4 is a cross-sectional view of a display device 10 according to an embodiment of the present disclosure. In particular, Figure 4 The display device 10 shown in FIG. 1 may correspond to Figure 1 or Figure 3 The display device 10 shown in FIG.

[0078] refer to Figure 4 , an embodiment of the display device 10 may include a display panel 100 , a polarizing film PF, and a cover window CW.

[0079] In an embodiment, the display panel 100 may be an organic light emitting display panel including a light emitting element LEL including an organic light emitting layer, but the present disclosure is not limited thereto. Alternatively, the display panel 100 may be a quantum dot light emitting display panel including a quantum dot light emitting layer, an inorganic light emitting display panel including an inorganic semiconductor, or a micro light emitting display panel using micro LEDs or a nano light emitting display panel using nano LEDs. For convenience, an embodiment in which the display panel 100 is an organic light emitting display panel will be described in detail below.

[0080] In an implementation, the display panel 100 may include a substrate SUB, a display layer DISL, an encapsulation layer ENC, and a sensor electrode layer SENL.

[0081] The substrate SUB may include a first substrate SUB1 including or formed of a rigid material and a second substrate SUB2 including or formed of a flexible material such as a polymer resin.

[0082] The first substrate SUB1 may include or be formed of a rigid material. In an embodiment, for example, the substrate SUB may include or be formed of glass. In an embodiment, for example, the substrate SUB may be formed of ultra-thin glass (UTG) having a thickness of about 500 micrometers (μm) or less.

[0083] The second substrate SUB2 may include or be formed of a flexible material. The second substrate SUB2 may include or be formed of a polymer resin and have a thickness smaller than that of the first substrate SUB1. In an embodiment, for example, the second substrate SUB2 may have a thickness of about 20 μm or less. The second substrate SUB2 may include or be formed of an organic material such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin. In an embodiment in which the second substrate SUB2 is formed of a polymer resin, the second substrate SUB2 may also be referred to as a plastic substrate. In some embodiments, the second substrate SUB2 may have a multilayer structure.

[0084] The display layer DISL may include a thin film transistor (TFT) layer TFTL (or circuit layer) including a plurality of thin film transistors TFT and a light emitting element layer EML including a plurality of light emitting elements LEL.

[0085] The TFT layer TFTL (or circuit layer) may include a first buffer film BF1 , a thin film transistor TFT, a gate insulating film 130 , a first interlayer insulating film 141 , a capacitor Cst, a second interlayer insulating film 142 , a first data metal layer, a first organic film 160 , a second data metal layer, and a second organic film 180 .

[0086] The first buffer film BF1 may be disposed on the substrate SUB. The first buffer film BF1 may include or be formed of an inorganic material such as silicon nitride, silicon oxynitride, silicon oxide, titanium oxide, or aluminum oxide. Alternatively, the first buffer film BF1 may have a multilayer structure in which silicon nitride layers, silicon oxynitride layers, silicon oxide layers, titanium oxide layers, and / or aluminum oxide layers are alternately stacked.

[0087] An active layer including a channel region TCH, a source region TS, and a drain region TD of the thin film transistor TFT may be disposed on the first buffer film BF1. The active layer may include or be formed of polycrystalline silicon, single crystal silicon, low temperature polycrystalline silicon, amorphous silicon, or an oxide semiconductor material. In an embodiment in which the active layer includes polycrystalline silicon or an oxide semiconductor material, the source region TS and the drain region TD in the active layer may be conductive regions doped with ions or impurities.

[0088] The gate insulating film 130 may be disposed on the active layer. The gate insulating film 130 may be formed as (or defined by) an inorganic film including or formed of an inorganic material such as silicon nitride, silicon oxynitride, silicon oxide, titanium oxide, or aluminum oxide.

[0089] A first gate metal layer including a gate electrode TG of the thin film transistor TFT, a first capacitor electrode CAE1 of the capacitor Cst, and a scan line may be disposed on the gate insulating film 130. The gate electrode TG of the thin film transistor TFT may overlap the channel region TCH in a third direction (or Z-axis direction). The first gate metal layer may be formed as a single layer or multiple layers each of which includes molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), or an alloy thereof.

[0090] The first interlayer insulating film 141 may be disposed on the first gate metal layer. The first interlayer insulating film 141 may be formed as an inorganic film including or formed of an inorganic material such as silicon nitride, silicon oxynitride, silicon oxide, titanium oxide, or aluminum oxide. The first interlayer insulating film 141 may include a plurality of inorganic films.

[0091] The second gate metal layer including the second capacitor electrode CAE2 of the capacitor Cst may be disposed on the first interlayer insulating film 141. The second capacitor electrode CAE2 may overlap the first capacitor electrode CAE1 in the third direction (or Z-axis direction). The capacitor Cst may be formed (or defined together) by the first capacitor electrode CAE1, the second capacitor electrode CAE2, and an inorganic insulating film serving as a dielectric layer disposed between the first capacitor electrode CAE1 and the second capacitor electrode CAE2. The second gate metal layer may be formed as a single layer or multiple layers each of which includes Mo, Al, Cr, Au, Ti, Ni, Nd, Cu, or an alloy thereof.

[0092] The second interlayer insulating film 142 may be disposed on the second gate metal layer. The second interlayer insulating film 142 may be formed as an inorganic film including an inorganic material such as silicon nitride, silicon oxynitride, silicon oxide, titanium oxide, or aluminum oxide film, or may be formed of an inorganic material such as silicon nitride, silicon oxynitride, silicon oxide, titanium oxide, or aluminum oxide. The second interlayer insulating film 142 may include a plurality of inorganic films.

[0093] A first data metal layer including a first connection electrode CE1 and a data line may be disposed on the second interlayer insulating film 142. The first connection electrode CE1 may be connected to the drain region TD through a first contact hole CT1 defined or formed in the gate insulating film 130, the first interlayer insulating film 141, and the second interlayer insulating film 142. The first data metal layer may be formed as a single layer or multiple layers each of which includes Mo, Al, Cr, Au, Ti, Ni, Nd, Cu, or an alloy thereof.

[0094] A first organic film 160 for flattening or planarizing a height difference caused by the thin film transistor TFT may be disposed on the first connection electrode CE1. The first organic film 160 may include or be formed of an organic material such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin.

[0095] A second data metal layer including a second connection electrode CE2 may be disposed on the first organic film 160. The second data metal layer may be connected to the first connection electrode CE1 through a second contact hole CT2 penetrating the first organic film 160. The second data metal layer may be formed as a single layer or multiple layers each of which includes Mo, Al, Cr, Au, Ti, Ni, Nd, Cu, or an alloy thereof.

[0096] The second organic film 180 may be disposed on the second connection electrode CE2. The second organic film 180 may include or be formed of an organic material such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin.

[0097] In an implementation, the second data metal layer including the second link electrode CE2 and the second organic film 180 may be omitted.

[0098] The light emitting element layer EML is disposed on the TFT layer TFTL. The light emitting element layer EML may include a light emitting element LEL and a pixel defining layer 190 .

[0099] Each of the light emitting elements LEL may include a pixel electrode 171, a light emitting layer 172, and a common electrode 173. Each emission area EA represents a region where the pixel electrode 171, the light emitting layer 172, and the common electrode 173 are sequentially stacked so that holes from the pixel electrode 171 and electrons from the common electrode 173 are recombined in the light emitting layer 172 to emit light. In an embodiment, the pixel electrode 171 may be an anode, and the common electrode 173 may be a cathode.

[0100] A pixel electrode layer including a pixel electrode 171 may be disposed on the second organic film 180. The pixel electrode 171 may be connected to the second connection electrode CE2 through a third contact hole CT3 defined or formed in the second organic film 180. The pixel electrode layer may be formed as a single layer or multiple layers of Mo, Al, Cr, Au, Ti, Ni, Nd, Cu, or an alloy thereof.

[0101] In an embodiment having a top emission structure that emits light in a direction from the light emitting layer 172 toward the common electrode 173, the pixel electrode 171 can be formed as a single layer of Mo, Ti, Cu, or Al, or as a stacked structure of Ti / Al / Ti, indium tin oxide / aluminum / indium tin oxide (ITO / Al / ITO), silver (Ag)-palladium (Pd)-copper (Cu) alloy, or ITO / APC / ITO to enhance reflectivity.

[0102] The pixel defining layer 190 defines the emission area EA of the pixel. In an embodiment, the pixel defining layer 190 may be disposed on the second organic film 180 to expose some portions of the pixel electrode 171. The pixel defining layer 190 may also cover the edge of the pixel electrode 171. The pixel defining layer 190 may be disposed in the third contact hole CT3. That is, the third contact hole CT3 may be filled with the pixel defining layer 190. The pixel defining layer 190 may be formed of an organic material such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin, or may use an organic material such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin.

[0103] The spacer 191 may be disposed on the pixel defining layer 190. The spacer 191 may be used to support a mask during the manufacture of the light emitting layer 172. The spacer 191 may include or be formed of an organic material such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin.

[0104] The light emitting layer 172 is disposed on the pixel electrode 171. The light emitting layer 172 may include an organic material and may thereby emit light of a specific color. In an embodiment, for example, the light emitting layer 172 may include a hole transport layer, an organic material layer, and an electron transport layer. Each of the organic material layers may include a host and a dopant. Each of the organic material layers may include a material that emits light of a specific color and may be formed using a phosphorescent material or a fluorescent material.

[0105] The common electrode 173 is disposed on the light emitting layer 172. The common electrode 173 may be formed to cover the light emitting layer 172. The common electrode 173 may serve as a common layer formed across the emission area EA. A capping layer may be disposed on the common electrode 173.

[0106] In an embodiment having a top emission structure, the common electrode 173 may be formed using a transparent conductive oxide (TCO) such as ITO or indium zinc oxide (IZO) that allows light to pass therethrough, or a semi-transmissive conductive material such as magnesium (Mg), Ag, or an alloy thereof. In an embodiment where the common electrode 173 is formed of a semi-transmissive conductive material, the emission efficiency of the light emitting element LEL may be improved due to the presence of the microcavity.

[0107] The encapsulation layer ENC may be disposed on the light emitting element layer EML. The encapsulation layer ENC may include at least one inorganic film to prevent oxygen or moisture from penetrating into the light emitting element layer EML. The encapsulation layer ENC may also include at least one organic film to protect the light emitting element layer EML from contaminants such as dust. In an embodiment, for example, the encapsulation layer ENC may include a first inorganic encapsulation film TFE1, an organic encapsulation film TFE2, and a second inorganic encapsulation film TFE3.

[0108] The first inorganic encapsulation film TFE1 may be disposed on the common electrode 173, the organic encapsulation film TFE2 may be disposed on the first inorganic encapsulation film TFE1, and the second inorganic encapsulation film TFE3 may be disposed on the organic encapsulation film TFE2. The first inorganic encapsulation film TFE1 and the second inorganic encapsulation film TFE3 may be formed as a multilayer in which one or more inorganic films including an inorganic material such as silicon nitride, silicon oxynitride, silicon oxide, titanium oxide, and / or aluminum oxide are alternately stacked. The organic encapsulation film TFE2 may include an organic material such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin, or be formed of an organic material such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin.

[0109] The sensor electrode layer SENL may be positioned on the encapsulation layer ENC. The sensor electrode layer SENL may include a second buffer film BF2, a first connector BE1, a first sensor insulating film TINS1, sensor electrodes TE and RE, and a second sensor insulating film TINS2.

[0110] The second buffer film BF2 may be disposed on the encapsulation layer ENC. The second buffer film BF2 may include at least one inorganic film. In an embodiment, for example, the second buffer film BF2 may be formed as a multilayer in which one or more inorganic films including inorganic materials such as silicon nitride, silicon oxynitride, silicon oxide, titanium oxide, and / or aluminum oxide are alternately stacked. Optionally, the second buffer film BF2 may be omitted.

[0111] The first connector BE1 may be disposed on the second buffer film BF2. The first connector BE1 may be formed as a single layer of Mo, Ti, Cu, or Al, or as a stacked structure of Ti / Al / Ti, ITO / Al / ITO, APC alloy, or ITO / APC / ITO.

[0112] The first sensor insulating film TINS1 may be disposed on the first connector BE1. The first sensor insulating film TINS1 may be formed as an inorganic film including an inorganic material such as silicon nitride, silicon oxynitride, silicon oxide, titanium oxide, and / or aluminum oxide.

[0113] The sensor electrodes TE and RE (i.e., the drive electrode TE and the sensing electrode RE) may be disposed on the first sensor insulating film TINS1. In an embodiment, a dummy pattern may be disposed on the first sensor insulating film TINS1. The drive electrode TE, the sensing electrode RE, and the dummy pattern may not overlap with the emission area EA in the third direction (Z-axis direction). The drive electrode TE, the sensing electrode RE, and the dummy pattern may be formed as a single layer including Mo, Ti, Cu, or Al, or as a stacked structure of Ti / Al / Ti, ITO / Al / ITO, APC alloy, or ITO / APC / ITO.

[0114] The second sensor insulating film TINS2 may be disposed on the driving electrode TE, the sensing electrode RE, and the dummy pattern. The second sensor insulating film TINS2 may include at least one selected from an inorganic film and an organic film. The inorganic film may be a film including silicon nitride, silicon oxynitride, silicon oxide, titanium oxide, or aluminum oxide. The organic film may be a film including acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin.

[0115] The polarizing film PF may be disposed on the sensor electrode layer SENL. The polarizing film PF may be disposed on the display panel 100 to reduce external glare. The polarizing film PF may include a first base member, a linear polarizer, a phase delay film such as a quarter wavelength (λ / 4) plate, and a second base member. The first base member, the phase delay film, the linear polarizer, and the second base member of the polarizing film PF may be sequentially stacked on the display panel 100.

[0116] The cover window CW may be disposed on the polarizing film PF. The cover window CW may be attached to the polarizing film PF using a transparent adhesive material such as an optically clear adhesive (OCA) film.

[0117] Figure 5 It is along Figure 1 A cross-sectional view taken along line X1-X1'. Figure 6 is shown in a bent state Figure 5 10 is a cross-sectional view of a display device 10. Figure 7 yes Figure 5 An enlarged cross-sectional view of area A.

[0118] refer to Figures 5 to 7 In addition to the display panel 100, the polarizing film PF, the cover window CW, the driver IC 200, and the circuit board 300, the embodiment of the display device 10 may further include a protection film PRTL, a panel bottom cover PB, and a filler FLL. The display panel 100 may include a substrate SUB, a display layer DISL, an encapsulation layer ENC, and a sensor electrode layer SENL.

[0119] In such an embodiment, the display layer DISL, the encapsulation layer ENC, the sensor electrode layer SENL, the polarization film PF and the cover window CW are substantially the same as the above-mentioned display layer DISL, the encapsulation layer ENC, the sensor electrode layer SENL, the polarization film PF and the cover window CW, and therefore, any repeated detailed description thereof will be omitted.

[0120] The substrate SUB may include a first substrate SUB1 including a rigid material and a second substrate SUB2 including a flexible material such as a polymer resin. The first substrate SUB1 may not overlap with the entire portion of the bending area BA, that is, at least a portion of the bending area BA may not overlap with the first substrate SUB1 in a third direction (or Z-axis direction). In an embodiment, for example, the first substrate SUB1 may define an opening BOP exposing a portion of the second substrate SUB2 corresponding to the bending area BA. Therefore, since the rigid material of the first substrate SUB1 does not exist in the bending area BA, Figure 6 As shown in , the substrate SUB can be easily bent.

[0121] The protective film PRTL may be disposed on the TFT layer TFTL to overlap the bending area BA, that is, a portion of the TFT layer TFTL corresponding to the bending area BA is covered by the protective film PRTL. The protective film PRTL may be a layer for protecting a portion of the TFT layer TFTL exposed in the bending area BA. The protective film PRTL may include an organic material such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin, or may be formed of an organic material such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin.

[0122] The panel cover bottom PB may be disposed on a second surface of the substrate SUB of the display panel 100. The second surface of the substrate SUB may be opposite to the first surface of the substrate SUB. In an embodiment, for example, the panel cover bottom PB may be disposed on the bottom surface BS of the substrate SUB. The panel cover bottom PB may be attached to the second surface of the substrate SUB of the display panel 100 by an adhesive material. The adhesive material may be a pressure sensitive adhesive (PSA).

[0123] The panel cover bottom PB may include at least one selected from a light absorbing material for absorbing incident light from the outside, a buffer material for absorbing impact from the outside, and a heat dissipating material for effectively releasing heat from the display panel 100 .

[0124] like Figure 6 As shown in FIG. 1 , the driver IC 200 and the circuit board 300 may be bent downward and toward the underside of the display panel 100. The circuit board 300 may be attached to the bottom surface of the panel cover bottom PB using an adhesive member 310.

[0125] The adhesive member 310 may be a PSA. When the display device 10 is in a bent state, the adhesive member 310 may be positioned between a portion of the first substrate SUB1 disposed in the main area MA and a portion of the first substrate SUB1 disposed in the pad area PDA. The adhesive member 310 may also be disposed under the panel cover bottom PB.

[0126] In some embodiments, the end of the adhesive member 310 adjacent to the bending area BA may be disposed on the same line or plane as the end of the panel bottom cover PB adjacent to the bending area BA. In an embodiment, for example, the ends of the adhesive member 310 and the panel bottom cover PB may be aligned with each other or together define a substantially continuous flat surface.

[0127] In an embodiment, if Figure 7 As shown in , the first substrate SUB1 may include a top surface US, a bottom surface BS, a first side surface SS1, and a first inclined surface IP1_1. The top surface US of the first substrate SUB1 may be a surface of the first substrate SUB1 on one side of the third direction (or Z-axis direction) (or facing the third direction (or Z-axis direction)), and the bottom surface BS of the first substrate SUB1 may be a surface of the first substrate SUB1 on one side of the third direction (or Z-axis direction) (or facing the opposite direction of the third direction (or Z-axis direction)).

[0128] The first side surface SS1 may be located at (or adjacent to) an edge BEG of the bending area BA. The edge BEG of the bending area BA may refer to an edge formed by etching a portion of the first substrate SUB1 in the bending area BA.

[0129] The first side surface SS1 may be positioned between the top surface US and the bottom surface BS. The first side surface SS1 may be located at the edge BEG of the bending area BA. The first side surface SS1 may be inclined. In an embodiment, for example, the angle formed between the first side surface SS1 and the top surface US may be an acute angle, while the angle between the first side surface SS1 and the bottom surface BS may be an obtuse angle.

[0130] The first side surface SS1 formed at the edge BEG of the bending area BA may be an inclined surface. Figure 7 As shown in FIG, the first angle θ1, which is an outer angle formed between the bottom surface BS and the first side surface SS1 of the first substrate SUB1, may be less than about 60 degrees. That is, the inner angle (i.e., 180°-θ1) between the bottom surface BS and the first side surface SS1 of the first substrate SUB1 may be greater than or equal to about 120 degrees.

[0131] The first side surface SS1 may be formed during the manufacture of the display device 10 by attaching a protective film and etching the portion of the first substrate SUB1 in the bending area BA. In an embodiment, for example, the protective film may be attached to the entire first substrate SUB1 except for the bending area BA, allowing only the portion of the first substrate SUB1 located in the bending area BA to be partially etched first. Due to the isotropic characteristics of the wet etching process, the portion of the first substrate SUB1 in the bending area BA may become inclined. In such an embodiment, after the portion of the first substrate SUB1 in the bending area BA is partially etched to a certain thickness, the protective film may be removed, and the remaining portion of the portion of the first substrate SUB1 in the bending area BA may be completely etched. Therefore, in such an embodiment, the thickness of the first substrate SUB1 may be reduced, and at the same time, an opening BOP exposing the portion of the second substrate SUB2 in the bending area BA may be formed.

[0132] The first inclined surface IP1_1 may be positioned between the top surface US and the first side surface SS1. The first inclined surface IP1_1 may be an undercut formed between the first substrate SUB1 and the second substrate SUB2. The first inclined surface IP1_1 may be formed due to over-etching in which an etchant penetrates into an interface between the first substrate SUB1 and the second substrate SUB2 during etching of the first substrate SUB1 as performed during manufacturing of the display device 10.

[0133] In an embodiment, if Figure 7 As shown in , the length IP1_L of the first inclined surface IP1_1 in the second direction (or Y-axis direction) may be approximately 120 μm. The length IP1_L of the first inclined surface IP1_1 may refer to the distance from the end P2 of the edge BEG to the boundary P1 where the first inclined surface IP1_1 meets the top surface US of the first substrate SUB1. Angle θ2, which is an outer angle formed between the top surface US of the first substrate SUB1 and the first inclined surface IP1_1, may be less than about 15 degrees. That is, the inner angle (i.e., 180°-θ2) between the top surface US of the first substrate SUB1 and the first inclined surface IP1_1 may be greater than or equal to about 165 degrees.

[0134] The end P2 of the edge BEG may be located closer to the top surface US than to the bottom surface BS. In an embodiment, for example, a length (or height) IP1_H of the first inclined surface IP1_1 in the third direction (or Z-axis direction) may be smaller than a length (or height) SS1_H of the first side surface SS1 in the third direction (or Z-axis direction).

[0135] If over-etching occurs during the manufacture of the display device 10, causing the lengths IP1_L and IP1_H of the first inclined surface IP1_1 to become too large, the first inclined surface IP1_1 may overlap the display area DA. However, if the first inclined surface IP1_1 overlaps the display area DA, cracks may occur in the TFT layer TFTL during bending of the display device 10.

[0136] In an embodiment, the end P2 of the edge BEG is positioned closer to the top surface US than to the bottom surface BS, the size of the first inclined surface IP1_1 may be adjusted, and cracks may be effectively prevented from occurring in the TFT layer TFTL.

[0137] In an embodiment, if Figure 6 As shown in , the display device 10 may include a filler FLL. The filler FLL may be disposed within the opening BOP of the first substrate SUB1 (or disposed in a space defined by the opening BOP of the first substrate SUB1). In an embodiment, for example, the filler FLL may be surrounded by (or in contact with) the bottom surface of the second substrate SUB2, the first side surface SS1 of the first substrate SUB1, the side surface of the panel bottom cover PB, and the side surface of the adhesive member 310.

[0138] The filler FLL can reduce or minimize the external impact transmitted to the TFT layer TFTL near the bending area BA. The hardness of the filler FLL can be Shore 70D or higher, that is, the filler FLL can have 70 in the Shore D hardness scale. Here, the Shore D hardness can be measured by a Shore durometer known in the art. By ensuring that the hardness of the filler FLL is Shore 70D or higher, the display device 10 can achieve an improvement in external impact resistance. In some embodiments, the filler FLL may include silicone, but the present disclosure is not limited thereto.

[0139] Hereinafter, a display device 10 having a filler FLL having a hardness of Shore 70D or higher will be described in comparison with a conventional display device 10 ′ having no filler FLL.

[0140] Figure 8 is a cross-sectional view of a conventional display device 10 ′. Fig. 9 is a graph showing the level of stress applied to the circuit layer of the conventional display device 10 ′ based on the push displacement of the bending area BA of the conventional display device 10 ′. Fig.10 is a graph showing a level of stress applied to a circuit layer of the display device 10 based on a push displacement of the bending area BA according to an embodiment of the display device 10 of the present disclosure.

[0141] refer to Figures 8 to 10 And further reference Figures 5 to 7 , in both the display device 10 and the conventional display device 10 ′, stress may be applied to the TFT layer TFTL or TFTL′ due to impact from outside the bending area BA.

[0142] like Figure 6 As shown in FIG. 1 , in an embodiment of the display device 10 , the TFT layer TFTL may include first and second partitions Z1 and Z2 positioned on each of the first inclined surfaces IP1_1 and a third partition Z3 positioned at the center of the bending area BA.

[0143] refer to Figure 8 , in the conventional display device 10 ′, the TFT layer TFTL′ may include first and second partitions Z1 ′ and Z2 ′ positioned on each of the first inclined surfaces IP1_1 and a third partition Z3 ′ positioned at the center of the bending area BA.

[0144] Fig. 9 Variations of maximum stress levels applied to the first zone Z1 ′, the second zone Z2 ′, and the third zone Z3 ′ according to a push displacement in the bending area BA of the conventional display device 10 ′ are shown. Fig.10 Changes in maximum stress levels applied to the first zone Z1 , the second zone Z2 , and the third zone Z3 according to a push displacement in the bending area BA of the display device 10 are shown.

[0145] refer to Fig. 9 , for the conventional display device 10 ', when the pushing displacement is 0.05 millimeters (mm), the maximum stress level of the third subarea Z3 'is approximately 175 megapascals (MPa) or more. Fig.10 , for the embodiment of the display device 10 , when the pushing displacement is 0.05 mm, the maximum stress level of the third zone Z3 is within approximately 160 MPa.

[0146] In addition, for the conventional display device 10', when the push displacement is 0.01mm, the maximum stress level of the first partition Z1' and the second partition Z2' is approximately 40MPa or more. On the other hand, for the embodiment of the display device 10, when the push displacement is 0.01mm, the maximum stress level of the first partition Z1 and the second partition Z2 is within approximately 15MPa.

[0147] Furthermore, for the entire range of push displacement, the maximum stress levels for the first, second and third zones Z1, Z2 and Z3 of the display device 10 are lower than those for the first, second and third zones Z1', Z2' and Z3' of the conventional display device 10'.

[0148] Therefore, it will be understood that the display device 10 can reduce or minimize the external impact applied to the bending area BA by using the filler FLL having a hardness of Shore 70D or higher as described herein.

[0149] Other embodiments of the present disclosure will be described below focusing on features different from the above-mentioned embodiments. In the specification and drawings, the same or similar reference numerals are used for the same or similar components, and any repeated detailed description thereof will be omitted.

[0150] Fig.11 is a cross-sectional view of a display device 10 according to another embodiment of the present disclosure.

[0151] In addition to the air gap GAP defined in the filler FLL, Fig.11 The display device 10 and Figure 6 The display device 10 is basically the same.

[0152] In an embodiment, if Fig.11 As shown in , the filler FLL may include an air gap GAP defined therein. The air gap GAP may refer to an empty space that is not filled with the filler FLL.

[0153] The air gap GAP may be defined or disposed within the filler FLL. The air gap GAP may be located at the center of the filler FLL, but the present disclosure is not limited thereto. In an embodiment, the air gap GAP may have a Fig.11 The elliptical shape shown in FIG. 1 is shown in FIG. 2 , but the present disclosure is not limited thereto.

[0154] In an embodiment, the display device 10 can further reduce the maximum stress level of the bending area BA for the push displacement by incorporating an air gap GAP. In an embodiment, for example, when the push displacement is 0.05 mm, the maximum stress level of the third zone Z3 of the display device 10 can be within approximately 150 MPa.

[0155] Fig.12 is a cross-sectional view of a display device 10 according to another embodiment of the present disclosure.

[0156] In addition to the shape of the air gap GAP, Fig.12 The display device 10 and Fig.11 The display device 10 is basically the same.

[0157] In an embodiment, if Fig.12As shown in , the shape of the air gap GAP may correspond to (or be similar to) the shape of the filler FLL. Here, the correspondence between the shape of the air gap GAP and the shape of the filler FLL means that the air gap GAP has the same shape as the outer contour of the filler FLL, but has a different size from the filler FLL.

[0158] In an implementation, for example, the air gap GAP may include a first corresponding surface SD1 , a second corresponding surface SD2 , and a third corresponding surface SD3 .

[0159] The first corresponding surface SD1 may face the first side surface SS1. The second corresponding surface SD2 may face the bottom surface of the second substrate SUB2. The third corresponding surface SD3 may face the side surfaces of the panel bottom cover PB and the adhesive member 310.

[0160] In some embodiments, the first corresponding surface SD1 may be an inclined surface along the first side surface SS1 . The second corresponding surface SD2 may be curved along the bending area BA . The third corresponding surface SD3 may be a vertical surface extending along the side surfaces of the panel bottom cover PB and the adhesive member 310 .

[0161] In an embodiment, by ensuring that the shape of the air gap GAP corresponds to the shape of the filler FLL, external force from a specific direction may be uniformly distributed to all directions. Therefore, in such an embodiment, stress applied to the TFT layer TFTL may be further minimized.

[0162] Fig.13 is a cross-sectional view of a display device 10 according to another embodiment of the present disclosure.

[0163] In addition, the filler FLL is even disposed between the second substrate SUB2 and the first inclined surface IP1_1. Fig.13 The display device 10 is basically the same as that in the above-mentioned embodiment.

[0164] In an embodiment, if Fig.13 As shown in FIG. 1 , the filler FLL may be disposed between the second substrate SUB2 and the first inclined surface IP1_1 .

[0165] In an embodiment, for example, the filler FLL may include a first protrusion PT1 positioned in the main area MA and a second protrusion PT2 positioned in the pad area PDA. The first protrusion PT1 and the second protrusion PT2 may be disposed between the second substrate SUB2 and the first inclined surface IP1_1. In such an embodiment, the first protrusion PT1 and the second protrusion PT2 of the filler FLL may be disposed in an undercut formed between the first substrate SUB1 and the second substrate SUB2.

[0166] In an embodiment, by filling the undercut formed between the first substrate SUB1 and the second substrate SUB2 with the filler FLL, potential lifting of the second substrate SUB2 can be effectively prevented. In such an embodiment, any damage to the TFT layer TFTL caused by the tip formed at the end P2 of the edge BEG of the bending area BA can be minimized.

[0167] Fig.14 is a cross-sectional view of a display device 10 according to another embodiment of the present disclosure. Fig.15 is shown in a bent state Fig.14 1 is a cross-sectional view of a display device 10.

[0168] In addition to the display device 10 including the protective layer PTT, Fig.14 and Fig.15 The display device 10 is basically the same as that in the above-mentioned embodiment.

[0169] In an embodiment, if Fig.14 As shown in , the display device 10 may further include a protective layer PTT.

[0170] The substrate SUB of the display device 10 may include a first substrate SUB1 , a protection layer PTT disposed on the first substrate SUB1 , and a second substrate SUB2 disposed on the protection layer PTT.

[0171] The first substrate SUB1 may define an opening BOP exposing the protective layer PTT. The second substrate SUB2 may be positioned on the protective layer PTT.

[0172] The protective layer PTT may be disposed between the first substrate SUB1 and the second substrate SUB2. The protective layer PTT may have a thickness of approximately 0.1 μm or less. The protective layer PTT may include a material having greater (higher or stronger) adhesive force with respect to the first substrate SUB1 than with respect to the second substrate SUB2.

[0173] In some embodiments, the protective layer PTT may include silicon (Si). In an embodiment, for example, the protective layer PTT may include amorphous silicon (a-Si), silicon oxide (SiO x ), silicon nitride (SiN x ) and silicon oxynitride (SiO x N y )

[0174] The protective layer PTT can effectively prevent the first substrate SUB1 from being over-etched, and thus the formation of undercuts can be prevented. That is, the formation of the first inclined surface IP1_1 in the display device 10 can be effectively prevented. In an embodiment, for example, the adhesion of the protective layer PTT to the first substrate SUB1 can be greater (higher or stronger) than the adhesion of the protective layer PTT to the second substrate SUB2. In such an embodiment, during the manufacture of the display device 10, the reactivity of the protective layer PTT to the etchant can be lower than the reactivity of the second substrate SUB2 to the etchant. Therefore, by minimizing the penetration of the etchant into the interface between the first substrate SUB1 and the protective layer PTT, the formation of undercuts can be effectively prevented.

[0175] In such an embodiment, since the formation of an undercut at the edge BEG of the bending area BA can be effectively prevented, both damage to the edge BEG of the bending area BA and lifting of the second substrate SUB2 can be effectively prevented.

[0176] The present invention should not be interpreted as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the present invention to those skilled in the art.

[0177] While the invention has been particularly shown and described with reference to embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit or scope of the invention as defined by the appended claims.

Claims

1. A display device, comprising: A first substrate including a first surface and a second surface opposite to each other in a thickness direction thereof, wherein the first substrate includes a rigid material; A second substrate disposed on the first surface of the first substrate, wherein the second substrate comprises a flexible material; and A plurality of light emitting elements are arranged on the second substrate, Wherein, the first substrate further comprises: a first side surface disposed between the first surface and the second surface; and a first inclined surface disposed between the first surface and the first side surface, wherein the first side surface and the first inclined surface are at an edge of the first substrate in a curved region where the second substrate is curved, and The display device further includes a filler disposed between a bottom surface of the second substrate and the first side surface of the first substrate in the bending region.

2. The display device according to claim 1, wherein: The filler has a hardness of Shore 70D or higher.

3. The display device according to claim 1, further comprising: A panel bottom cover is arranged on the second surface of the first substrate, Wherein, the filler contacts the side surface of the panel bottom cover.

4. The display device according to claim 3, further comprising: an adhesive member disposed on the panel bottom cover on the second surface of the first substrate, wherein the filler is in contact with a side surface of the adhesive member.

5. The display device according to claim 4, wherein: The side surface of the panel bottom cover and the side surface of the adhesive member are positioned on the same plane.

6. The display device according to claim 1, wherein: The filler includes an air gap, and the air gap is disposed within the filler.

7. The display device according to claim 6, wherein: The shape of the air gap corresponds to the shape of the filler.

8. The display device according to claim 7, further comprising: A panel bottom cover, disposed on the second surface of the first substrate; Wherein, the air gap comprises: a first corresponding surface, facing the first side surface; a second corresponding surface corresponding to the bottom surface of the second substrate; and The third corresponding surface faces the side surface of the panel bottom cover.

9. The display device according to claim 8, wherein: The first corresponding surface is an inclined surface, and The second corresponding surface is a curved surface.

10. The display device according to claim 1, wherein: The filler further includes a protrusion, and the protrusion is disposed between the first inclined surface and the bottom surface of the second substrate.

11. The display device according to claim 1, wherein: The horizontal length of the first inclined surface is 120 micrometers.

12. The display device according to claim 1, wherein: A vertical length of the first inclined surface is smaller than a vertical length of the first side surface.

13. The display device according to claim 12, wherein: An end portion of the first side surface where the first inclined surface meets the first inclined surface is located closer to the second surface than to the first surface in the thickness direction.

14. The display device according to claim 1, wherein: An interior angle formed between the first inclined surface and the second surface is greater than or equal to 165 degrees.

15. The display device according to claim 1, wherein: An interior angle formed between the first inclined surface and the first surface is greater than or equal to 120 degrees.

16. A display device, comprising: The first substrate comprises: A first surface and a second surface, facing each other; and a first side surface disposed between the first surface and the second surface, wherein the first substrate comprises a rigid material; a protective layer, disposed on the first surface of the first substrate; A second substrate, disposed on the protective layer, wherein the second substrate comprises a flexible material; and A plurality of light emitting elements are arranged on the second substrate, wherein each of the first side surfaces is directly connected to the first surface, and The display device further includes a filler disposed between a bottom surface of the second substrate and the first side surface of the first substrate in a bending region where the second substrate is bent.

17. The display device according to claim 16, wherein: The filler has a hardness of Shore 70D or higher.

18. The display device according to claim 16, wherein: The filler includes an air gap, and the air gap is disposed within the filler.

19. The display device according to claim 18, wherein: The shape of the air gap corresponds to the shape of the filler.

20. The display device according to claim 16, wherein: The adhesive force of the protective layer relative to the first substrate is greater than the adhesive force of the second substrate relative to the first substrate.

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