Stamping die detection and adjustment method and system based on working conditions

Abstract

The present application relates to the technical field of mold detection, and discloses a stamping mold detection and adjustment method and system based on working conditions, the method comprising obtaining design drawings to create a stamping structure model and importing it into a physical field simulation platform, generating a stamping simulation model, and analyzing standard power-time curves of various stamping processing tasks; obtaining the operation detection parameters of the stamping mechanism in real time, drawing the measured power-time curve and comparing it with the standard power-time curve, identifying the stamping sub-action line segments with a power parameter deviation rate greater than a power deviation threshold to generate a resistance abnormality signal; generating a cooling inhibition signal based on the resistance abnormality signal and sending it to a cooling component, controlling a temperature measuring sensor to detect abnormal temperature measurement data of the stamping structure; generating fault handling information when the temperature deviation rate of the abnormal temperature measurement data relative to the theoretical temperature data is greater than the temperature deviation threshold; the present application has the effect of improving the timeliness of stamping processing quality detection.

Description

Technical Field

[0001] The present application relates to the technical field of die detection, and in particular, to a stamping die detection and adjustment method and system based on operating conditions. Background Art

[0002] Stamping is a widely used metal forming process, mainly used for forming metal sheets, with technical advantages such as high production efficiency, good product consistency, and high material utilization rate. However, stamping requires the use of stamping dies, and the stamping dies may be damaged or misaligned during use, thus affecting the product processing quality and producing unqualified products. If too many unqualified products are produced, it will cause significant economic losses. At present, the quality inspection of stamping mainly focuses on the products produced by stamping. Therefore, the above-mentioned related technologies have the problem of poor timeliness in stamping quality inspection. Summary of the Invention

[0003] In order to improve the timeliness of stamping quality inspection, the present application provides a stamping die detection and adjustment method and system based on operating conditions.

[0004] The first invention object of the present application is achieved by the following technical solutions:

[0005] A stamping die detection and adjustment method based on operating conditions includes:

[0006] Obtain the design drawings of the stamping mechanism and the stamping die to create a stamping structure model and import it into the physical field simulation platform to generate a stamping simulation model, and analyze the standard power-time curve of various stamping processing tasks based on the stamping simulation model;

[0007] Real-time obtain the operation detection parameters of the stamping mechanism to plot the measured power-time curve and compare it with the corresponding standard power-time curve, and identify the stamping sub-action segments with a power parameter deviation rate greater than the power deviation threshold to generate a resistance anomaly signal;

[0008] Generate a cooling suppression signal based on the resistance anomaly signal and send it to the cooling component, and generate a temperature measurement control signal to control the temperature measurement sensor to detect the abnormal temperature measurement data of the stamping structure;

[0009] When the temperature deviation rate of the abnormal temperature measurement data relative to the corresponding theoretical temperature data is greater than the corresponding temperature deviation threshold, generate a fault handling information;

[0010] The operation detection parameters include electrical parameters.

[0011] By adopting the above technical solutions, design drawings of the stamping mechanism and the stamping die are obtained, thereby creating a stamping structure model, which is convenient for knowing the structure of the equipment used in stamping processing and completing the modeling. The stamping structure model is imported into the physical field simulation platform to generate a stamping simulation model, which is convenient for analyzing the standard power curve of the stamping machine when performing various stamping processing tasks through physical field simulation; the operation detection parameters of the stamping mechanism are obtained in real time, the power-time curve is plotted according to the power consumption parameters and compared with the corresponding standard power-time curve, and the stamping sub-action line segments with the power parameter deviation rate greater than the power deviation threshold are identified from them to generate a resistance anomaly signal, thereby realizing the function of initially checking whether there is an abnormal working phenomenon of the stamping die by detecting the power consumption parameters; a cooling inhibition signal is generated based on the resistance anomaly signal and sent to the cooling component to control the cooling component of the stamping machine to suspend operation, so as to reduce the influence on the subsequent temperature detection, and further generate a temperature measurement control signal and send it to the temperature measurement sensor to control the temperature measurement sensor to detect the abnormal temperature measurement data of the stamping structure, which is convenient for subsequently judging whether there is a fault problem according to the temperature change of the stamping structure; calculate the temperature deviation rate of the abnormal temperature measurement data relative to the corresponding theoretical temperature data. When the temperature deviation rate is greater than the corresponding temperature deviation threshold, it is considered that there is a problem of over-squeezing the workpiece or insufficient squeezing of the workpiece at the fault location, and a fault handling information is generated, which improves the timeliness of stamping processing quality detection.

[0012] In a preferred example of the present application: the stamping mechanism includes a power component, and the electrical parameters of the power component are marked in the stamping simulation model;

[0013] The analysis of the standard power-time curve for various stamping processing tasks based on the stamping simulation model includes:

[0014] Determine the task information of the target stamping processing task and input it into the stamping simulation model. Evaluate the action stroke of the stamping structure and the acting force required at each time point during the action stroke through the physical field simulation algorithm, and then calculate the power at each time point in an action cycle of the target stamping processing task;

[0015] Based on the power requirements at each time point in several action cycles of the target stamping processing task and the die deterioration correction data, generate a standard power-time curve;

[0016] The task information includes the initial workpiece drawing, the finished workpiece drawing, workpiece parameters, and stamping parameters; the workpiece parameters include the material parameters and dimension parameters of the initial workpiece and the finished workpiece; the stamping parameters include the processing types and processing parameters of each processing mark; the die deterioration correction data is correction data determined according to the average power change situation in multiple action cycles of the measured power-time curve of the historical working state of the same type of die.

[0017] By adopting the above technical solution, the task information of the target stamping processing task is determined and input into the stamping simulation model, based on the known initial workpiece drawing, finished workpiece drawing, various workpiece parameters and stamping parameters, so as to evaluate, through the physical field simulation algorithm, the action stroke of the stamping structure and the acting force required at each time point during the action stroke when the stamping machine executes the target stamping processing task, and then calculate the power consumption at each time point during an action cycle when the stamping machine executes the target stamping processing task; since during the use of the stamping machine, factors such as the gradual failure of the lubrication effect or the gradual wear of mechanical parts may cause changes in the power consumption demand required for the execution of the target stamping processing task, therefore, based on the power demand at each time point during several action cycles of the target stamping processing task, and the die deterioration correction data determined according to the average power change of multiple action cycles in the measured power time curve of the historical working state of the same type of die, a standard power time curve is generated, which is convenient for subsequently judging the working state of the stamping die by monitoring the power consumption demand of the stamping structure.

[0018] In a preferred example of the present application: The method for obtaining the operation detection parameters of the stamping mechanism in real time to draw the measured power time curve and compare it with the corresponding standard power time curve, and identifying the stamping sub-action line segment with the power parameter deviation rate greater than the power deviation threshold to generate a resistance anomaly signal includes:

[0019] Obtain the power consumption parameters of the stamping mechanism in real time to draw the measured power time curve according to the power consumption parameters and the corresponding time nodes;

[0020] Calculate the average power of the most recent action cycle in the measured power time curve and define it as the measured cycle power, and calculate the average power of the action cycle with the same cycle identifier in the corresponding standard power time curve and define it as the comparison cycle power;

[0021] Calculate the power parameter deviation rate based on the measured cycle power and the comparison cycle power. When the power parameter deviation rate is greater than the preset power deviation threshold, generate a resistance anomaly signal based on the cycle identifier corresponding to the stamping sub-action line segment;

[0022] Each of the action cycles is marked with a corresponding cycle identifier, which is used to mark the order of the action cycles in a continuous stamping processing task; the stamping sub-action line segment corresponds to a curve segment of an action cycle in the measured power time curve;

[0023] The calculation formula for the power parameter deviation rate is:

[0024]

[0025] By adopting the above technical solution, the power consumption parameters of the stamping mechanism are obtained in real time, and the measured power-time curve is drawn according to the power consumption parameters and the corresponding time nodes, so as to compare with the standard power-time curve subsequently to detect possible faults of the stamping die; calculate the average power of the most recent action cycle in the measured power-time curve and define it as the measured cycle power, and calculate the average power of the action cycle with the same cycle identifier in the corresponding standard power-time curve and define it as the comparison cycle power, which is convenient for comparing the average power of the same action cycle subsequently and improves the accuracy of detecting stamping die faults through the power consumption; calculate the power parameter deviation rate based on the measured cycle power and the comparison cycle power. When the power parameter deviation rate is greater than the preset power deviation threshold, generate a resistance anomaly signal based on the cycle identifier of the stamping sub-action segment corresponding to the measured cycle power, which is convenient for knowing the possible situation of stamping die faults, so as to promptly perform further fault location and troubleshooting work.

[0026] In a preferred example of the present application: The generation of the temperature measurement control signal to control the temperature measurement sensor to detect abnormal temperature measurement data of the stamping structure includes:

[0027] Generate a temperature measurement control signal and send it to the temperature measurement sensor to control the temperature measurement sensor to perform the temperature measurement task for the stamping structure;

[0028] Receive the temperature measurement information from the target temperature measurement sensor, generate abnormal temperature measurement data by summarizing the abnormal temperature measurement values, temperature measurement target points, and temperature measurement time points in each temperature measurement information, and generate theoretical temperature data by summarizing the temperature measurement target points and the comparison temperature sequence in each temperature measurement information;

[0029] The temperature measurement information includes abnormal temperature measurement values, temperature measurement target points, temperature measurement time points, and a comparison temperature sequence; the comparison temperature sequence records the temperature values measured at the temperature measurement target point during several action cycles in continuous stamping work when the stamping die and the stamping mechanism are normal and the stamping machine is cooled and inhibited.

[0030] By adopting the above technical solution, after cooling and inhibiting the stamping machine, generate a temperature measurement control signal and send it to the temperature measurement sensor to control the temperature measurement sensor to perform the temperature measurement task for the stamping structure, which is convenient for subsequently analyzing the possible fault types and fault locations by detecting the temperature value changes at various parts of the stamping die; receive the temperature measurement information from the target temperature measurement sensor, generate abnormal temperature measurement data by summarizing the abnormal temperature measurement values, temperature measurement target points, and temperature measurement time points in the target temperature measurement information, so as to know the actual temperature change situation of the stamping mechanism during continuous stamping work after cooling and inhibition, and generate theoretical temperature data by summarizing the temperature measurement target points and the comparison temperature sequence in the temperature measurement information of the target temperature measurement sensor, so as to know the theoretical temperature change situation of the stamping mechanism during continuous stamping work after cooling and inhibition.

[0031] In a preferred example of the present application: the abnormal temperature measurement data includes a number of abnormal temperature measurement values, and each abnormal temperature measurement value is associated with a cycle identifier generated according to the corresponding temperature measurement time point; the comparison temperature sequence includes a number of comparison temperature values, and each comparison temperature value is associated with a cycle identifier;

[0032] When the temperature deviation rate of the abnormal temperature measurement data relative to the corresponding theoretical temperature data is greater than the corresponding temperature deviation threshold, fault handling information is generated, including:

[0033] Obtain the abnormal temperature measurement data and the theoretical temperature data, and perform time alignment processing on the abnormal temperature measurement values in the abnormal temperature measurement data and the comparison temperature values in the theoretical temperature data; calculate the absolute value of the quotient of all abnormal temperature measurement values and the corresponding comparison temperature values to obtain a number of temperature quotient values, and calculate the temperature deviation rate based on the number of temperature quotient values and the preset temperature deviation calculation rule;

[0034] When the temperature deviation rate exceeds the corresponding preset temperature deviation threshold range, fault handling information is generated based on the temperature measurement target point of the target temperature measurement sensor.

[0035] By adopting the above technical solutions, the abnormal temperature measurement data and the theoretical temperature data are obtained, and further time alignment processing is performed on the abnormal temperature measurement values in the abnormal temperature measurement data and the comparison temperature values in the theoretical temperature data according to the cycle identifier; calculate the absolute value of the quotient of all abnormal temperature measurement values and the corresponding comparison temperature values to obtain a number of temperature quotient values, and calculate the temperature deviation rate based on the number of temperature quotient values and the preset temperature deviation calculation rule, so as to judge the deviation degree between the measured temperature situation and the theoretical temperature situation of the stamping structure in the subsequent stage; when the temperature deviation rate exceeds the corresponding preset temperature deviation threshold range, it means that the deviation degree between the measured temperature situation and the theoretical temperature situation of the stamping structure is relatively large, and fault handling information is generated based on the temperature measurement target point of the target temperature measurement sensor, so that the staff can orientedly check whether there are stamping die fault problems at the temperature measurement target point.

[0036] The second invention object of the present application is realized by adopting the following technical solutions:

[0037] A stamping die detection and adjustment system based on the usage condition, which is applied to the stamping die detection and adjustment method based on the usage condition described in any one of the above, includes:

[0038] A standard power-time relationship analysis module, which is used to obtain the design drawings of the stamping mechanism and the stamping die, create a stamping structure model and import it into the physical field simulation platform to generate a stamping simulation model, and analyze the standard power-time curve of various stamping processing tasks based on the stamping simulation model;

[0039] A resistance anomaly evaluation module is used to obtain the operation detection parameters of the stamping mechanism in real time, draw the measured power-time curve and compare it with the corresponding standard power-time curve, and identify the stamping sub-action segments with a power parameter deviation rate greater than the power deviation threshold to generate a resistance anomaly signal;

[0040] An abnormal temperature measurement module is used to generate a cooling inhibition signal based on the resistance anomaly signal and send it to the cooling component, and generate a temperature measurement control signal to control the temperature measurement sensor to detect the abnormal temperature measurement data of the stamping structure;

[0041] A fault handling evaluation module is used to generate fault handling information when the temperature deviation rate of the abnormal temperature measurement data relative to the corresponding theoretical temperature data is greater than the corresponding temperature deviation threshold;

[0042] The operation detection parameters include electrical parameters.

[0043] In a preferred example of the present application: The standard power-time relationship analysis module includes:

[0044] A stamping power evaluation sub-module is used to determine the task information of the target stamping processing task and input it into the stamping simulation model, evaluate the action stroke of the stamping structure and the force required at each time point during the action stroke through the physical field simulation algorithm, and then calculate the power at each time point in an action cycle of the target stamping processing task;

[0045] A standard power-time curve generation sub-module is used to generate a standard power-time curve based on the power requirements at each time point in several action cycles of the target stamping processing task and the die deterioration correction data;

[0046] The stamping mechanism includes a power component, and the stamping simulation model marks the electrical parameters of the power component; the task information includes the initial workpiece drawing, the finished workpiece drawing, the workpiece parameters and the stamping parameters; the workpiece parameters include the material parameters and size parameters of the initial workpiece and the finished workpiece; the stamping parameters include the processing types and processing parameters of each processing mark; the die deterioration correction data is correction data determined according to the average power change situation of multiple action cycles in the measured power-time curve of the historical working state of the same type of die.

[0047] In a preferred example of the present application: The resistance anomaly evaluation module includes:

[0048] A measured power-time curve generation sub-module is used to obtain the electrical parameters of the stamping mechanism in real time, and draw the measured power-time curve according to the electrical parameters and the corresponding time nodes;

[0049] A periodic power calculation sub-module is used to calculate the average power of the most recent action period in the measured power time curve and define it as the measured periodic power, and calculate the average power of the action period with the same period identifier in the corresponding standard power time curve and define it as the comparison periodic power;

[0050] A resistance anomaly signal generation sub-module is used to calculate the power parameter deviation rate based on the measured periodic power and the comparison periodic power. When the power parameter deviation rate is greater than the preset power deviation threshold, a resistance anomaly signal is generated based on the period identifier corresponding to the stamping sub-action segment;

[0051] Each of the action periods is marked with a corresponding period identifier, which is used to mark the order of the action periods in a continuous stamping processing task; the stamping sub-action segment corresponds to a curve segment of an action period in the measured power time curve;

[0052] The calculation formula of the power parameter deviation rate is:

[0053]

[0054] The third invention object of the present application is realized by adopting the following technical solution:

[0055] A computer device includes a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, the steps of the above-mentioned stamping die detection and adjustment method based on the operating conditions are realized.

[0056] The fourth invention object of the present application is realized by adopting the following technical solution:

[0057] A computer-readable storage medium stores a computer program. When the computer program is executed by a processor, the steps of the above-mentioned stamping die detection and adjustment method based on the operating conditions are realized.

[0058] In summary, the present application includes at least one of the following beneficial technical effects:

[0059] 1. Obtain the design drawings of the stamping mechanism and stamping die, thereby creating a stamping structure model to facilitate understanding the structure of the equipment used in stamping processing and completing the modeling. Import the stamping structure model into the physical field simulation platform to generate a stamping simulation model, which is convenient for analyzing the standard power curve of the stamping machine when performing various stamping processing tasks through physical field simulation; obtain the operation detection parameters of the stamping mechanism in real time, plot the power-time curve based on the electricity consumption parameters and compare it with the corresponding standard power-time curve, and identify the stamping sub-action segments with a power parameter deviation rate greater than the power deviation threshold from it to generate a resistance anomaly signal, thereby realizing the function of initially detecting whether there is an abnormal working phenomenon of the stamping die by detecting the electricity consumption parameters; generate a cooling inhibition signal based on the resistance anomaly signal and send it to the cooling component to control the cooling component of the stamping machine to suspend work to reduce the impact on subsequent temperature detection, and further generate a temperature measurement control signal and send it to the temperature measurement sensor to control the temperature measurement sensor to detect the abnormal temperature measurement data of the stamping structure, which is convenient for subsequently judging whether there is a fault problem according to the temperature change of the stamping structure; calculate the temperature deviation rate of the abnormal temperature measurement data relative to the corresponding theoretical temperature data. When the temperature deviation rate is greater than the corresponding temperature deviation threshold, it is considered that there is a problem of over-extruding the workpiece or insufficient extrusion of the workpiece at the fault location, and a fault disposal information is generated, which improves the timeliness of stamping processing quality detection.

[0060] 2. Determine the task information of the target stamping processing task and input it into the stamping simulation model. Based on the known initial workpiece drawing, finished workpiece drawing, various workpiece parameters and stamping parameters, in order to evaluate the action stroke of the stamping structure and the force required at each time point during the action stroke of the stamping machine during the execution of the target stamping processing task through the physical field simulation algorithm, and then calculate the electricity consumption power at each time point in an action cycle when the stamping machine executes the target stamping processing task; since during the use of the stamping machine, factors such as the gradual failure of the lubrication effect or the gradual wear of mechanical parts of the stamping mechanism and stamping die may cause changes in the electricity consumption power required for the execution of the target stamping processing task, therefore, based on the power requirements at each time point in several action cycles of the target stamping processing task, and the die deterioration correction data determined according to the average power change situation of multiple action cycles in the measured power-time curve of the historical working state of the same type of die, a standard power-time curve is generated, which is convenient for subsequently judging the working state of the stamping die by monitoring the electricity consumption demand of the stamping structure.

[0061] 3. Obtain the power consumption parameters of the stamping mechanism in real time, draw the measured power-time curve according to the power consumption parameters and the corresponding time nodes, so as to compare with the standard power-time curve subsequently to detect possible faults of the stamping die; calculate the average power of the most recent action cycle in the measured power-time curve and define it as the measured cycle power, and calculate the average power of the action cycle with the same cycle identifier in the corresponding standard power-time curve and define it as the comparison cycle power, which is convenient for subsequent comparison of the average power of the same action cycle, improving the accuracy of detecting stamping die faults through power consumption; calculate the power parameter deviation rate based on the measured cycle power and the comparison cycle power. When the power parameter deviation rate is greater than the preset power deviation threshold, generate a resistance anomaly signal based on the cycle identifier of the stamping sub-action segment corresponding to the measured cycle power, which is convenient for knowing the possible situation of stamping die faults, so as to timely perform further fault location and troubleshooting work. Description of the Drawings

[0062] Figure 1 is a flowchart of the stamping die detection and adjustment method based on the working conditions in Embodiment 1 of the present application.

[0063] Figure 2 is a schematic block diagram of a stamping die detection and adjustment system based on the working conditions in Embodiment 2 of the present application.

[0064] Figure 3 is a schematic diagram of the equipment in Embodiment 3 of the present application. Detailed Description of the Embodiment

[0065] The following is a further detailed description of the present application in combination with the attached Figures 1 to 3 drawings.

[0066] Embodiment 1

[0067] Refer to Figure 1 , the present application discloses a stamping die detection and adjustment method based on the working conditions, which specifically includes the following steps:

[0068] S10: Obtain the design drawings of the stamping mechanism and the stamping die, create a stamping structure model and import it into the physical field simulation platform to generate a stamping simulation model, and analyze the standard power-time curve of various stamping processing tasks based on the stamping simulation model.

[0069] In this embodiment, the physical field simulation platform is ANSYS; each stamping processing task corresponds to a production task of stamping a kind of workpiece.

[0070] Specifically, obtain the design drawings of the stamping mechanism and the stamping die, so as to create a stamping structure model, which is convenient for knowing the structure of the equipment used in stamping processing and completing the modeling. Import the stamping structure model into the physical field simulation platform to generate a stamping simulation model, which is convenient for analyzing the standard power curve of the stamping machine when performing various stamping processing tasks through physical field simulation.

[0071] Among them, in step S10, it includes:

[0072] S11: Determine the task information of the target stamping processing task and input it into the stamping simulation model. Evaluate the action stroke of the stamping structure and the force required at each time point during the action stroke through the physical field simulation algorithm, and then calculate the power at each time point in one action cycle of the target stamping processing task.

[0073] In this embodiment, the stamping mechanism includes a power component. The stamping simulation model marks the electrical parameters of the power component, and the electrical parameters are power parameters or parameters such as voltage and current that can be used to calculate electric power; the task information includes the initial workpiece drawing, the finished workpiece drawing, workpiece parameters, and stamping parameters; the workpiece parameters include the material parameters and size parameters of the initial workpiece and the finished workpiece. The material parameters include several performance parameters of the material, and the material parameters can also be stored in the form of material models so as to automatically match several performance parameters of the material from relevant technical manuals. The size parameters include the shape and size data of the workpiece; the stamping parameters include the processing type and processing parameters of each processing mark; among them, the processing parameters correspond to the processing type. For example, when the processing type is a sharp corner crease, the corresponding processing parameters include the bending angle and the springback angle; when the processing type is a rounded corner crease, the corresponding processing parameters include the bending radian and the bending curve data, etc.; the processing parameters also include the position and deformation degree parameters of the stretching / compression deformation area; the physical field simulation algorithm refers to the simulation algorithm built into the physical field simulation platform; the stamping structure includes a stamping mechanism and a stamping die.

[0074] Specifically, determine the task information of the target stamping processing task and input it into the stamping simulation model, based on the known initial workpiece drawing, finished workpiece drawing, various workpiece parameters, and stamping parameters, so as to evaluate the action stroke of the stamping structure and the force required at each time point during the process of the stamping machine performing the target stamping processing task through the physical field simulation algorithm, and then calculate the electric power consumption at each time point in one action cycle when the stamping machine performs the target stamping processing task.

[0075] S12: Generate a standard power-time curve based on the power requirements at each time point in several action cycles of the target stamping processing task and the die deterioration correction data.

[0076] In this embodiment, the die deterioration correction data is correction data determined according to the average power change of multiple action cycles in the measured power-time curve of the same type of die in its historical working state.

[0077] Specifically, during the use of a stamping machine, factors such as the gradual failure of the lubrication effect or the gradual wear of mechanical parts may cause changes in the power demand required for the execution of the target stamping processing task in the stamping mechanism and stamping die. Therefore, based on the power demand at each time point of the target stamping processing task in several action cycles, and the die deterioration correction data determined according to the average power change of multiple action cycles in the measured power-time curve of the same type of die in its historical working state, a standard power-time curve is generated to facilitate subsequent judgment of the working state of the stamping die by monitoring the power demand of the stamping structure.

[0078] S20: Real-time obtain the operation detection parameters of the stamping mechanism to draw the measured power-time curve and compare it with the corresponding standard power-time curve, and identify the stamping sub-action segments with a power parameter deviation rate greater than the power deviation threshold to generate a resistance anomaly signal.

[0079] In this embodiment, the operation detection parameters include electrical parameters.

[0080] Specifically, when the stamping die has faults such as wear or deformation, it is easy to cause abnormal resistance in the stamping process due to factors such as changes in the extrusion and friction degrees between the die and the workpiece. Therefore, real-time obtain the operation detection parameters of the stamping mechanism, draw the power-time curve according to the electrical parameters and compare it with the corresponding standard power-time curve, and identify the stamping sub-action segments with a power parameter deviation rate greater than the power deviation threshold from it to generate a resistance anomaly signal, thereby realizing the function of initially checking whether there is an abnormal working phenomenon in the stamping die by detecting the electrical parameters.

[0081] Among them, in step S20, it includes:

[0082] S21: Real-time obtain the electrical parameters of the stamping mechanism to draw the measured power-time curve according to the electrical parameters and the corresponding time nodes.

[0083] Specifically, real-time obtain the electrical parameters of the stamping mechanism to draw the measured power-time curve according to the electrical parameters and the corresponding time nodes, so as to compare it with the standard power-time curve subsequently to detect possible faults of the stamping die.

[0084] S22: Calculate the average power of the most recent action cycle in the measured power-time curve and define it as the measured cycle power, and calculate the average power of the action cycle with the same cycle identifier in the corresponding standard power-time curve and define it as the comparison cycle power.

[0085] In this embodiment, each action cycle is marked with a corresponding cycle identifier, which is used to mark the order of the action cycle in a continuous stamping processing task.

[0086] Specifically, calculate the average power of the most recent action cycle in the measured power-time curve and define it as the measured cycle power, and calculate the average power of the action cycle with the same cycle identifier in the corresponding standard power-time curve and define it as the comparison cycle power, which is convenient for subsequent comparison of the average power of the same action cycle, improving the accuracy of detecting stamping die failures through power consumption.

[0087] S23: Calculate the power parameter deviation rate based on the measured cycle power and the comparison cycle power. When the power parameter deviation rate is greater than the preset power deviation threshold, generate a resistance anomaly signal based on the cycle identifier corresponding to the stamping sub-action segment.

[0088] In this embodiment, the stamping sub-action segment corresponds to a curve segment of an action cycle in the measured power-time curve;

[0089] The calculation formula for the power parameter deviation rate is:

[0090]

[0091] Specifically, calculate the power parameter deviation rate based on the measured cycle power and the comparison cycle power. When the power parameter deviation rate is greater than the preset power deviation threshold, generate a resistance anomaly signal based on the cycle identifier of the stamping sub-action segment corresponding to the measured cycle power, which is convenient for knowing the possible situation of stamping die failures, so as to timely perform further fault location and troubleshooting work.

[0092] S30: Generate a cooling inhibition signal based on the resistance anomaly signal and send it to the cooling component, and generate a temperature measurement control signal to control the temperature measurement sensor to detect the abnormal temperature measurement data of the stamping structure.

[0093] Specifically, generate a cooling inhibition signal based on the resistance anomaly signal and send it to the cooling component to control the cooling component of the stamping machine to suspend operation, so as to reduce the influence on subsequent temperature detection. Further, generate a temperature measurement control signal and send it to the temperature measurement sensor to control the temperature measurement sensor to detect the abnormal temperature measurement data of the stamping structure, which is convenient for subsequent judgment of whether there are fault problems according to the temperature change of the stamping structure.

[0094] Among them, in step S30, it includes:

[0095] S31: Generate a temperature measurement control signal and send it to the temperature measurement sensor to control the temperature measurement sensor to perform the temperature measurement task for the stamping structure.

[0096] Specifically, after cooling suppression is performed on the stamping machine, a temperature measurement control signal is generated and sent to the temperature measurement sensor to control the temperature measurement sensor to perform the temperature measurement task for the stamping structure, facilitating subsequent analysis of possible fault types and fault locations by detecting the temperature value changes at various parts of the stamping die.

[0097] S32: Receive the temperature measurement information from the target temperature measurement sensor, aggregate and generate abnormal temperature measurement data based on the abnormal temperature measurement values, temperature measurement target points, and temperature measurement time points in each temperature measurement information, and aggregate and generate theoretical temperature data based on the temperature measurement target points and comparison temperature sequences in each temperature measurement information.

[0098] In this embodiment, the temperature measurement information includes abnormal temperature measurement values, temperature measurement target points, temperature measurement time points, and comparison temperature sequences; the comparison temperature sequence records the temperature values measured at this temperature measurement target point during several action cycles in continuous stamping work under the condition that the stamping die and stamping mechanism are normal and the stamping machine is cooled and suppressed; the comparison temperature sequence is specifically obtained through regular analysis of the data simulated by experiments or a multi-physical field simulation platform.

[0099] Specifically, receive the temperature measurement information from the target temperature measurement sensor, aggregate and generate abnormal temperature measurement data based on the abnormal temperature measurement values, temperature measurement target points, and temperature measurement time points in the target temperature measurement information, so as to know the actual temperature change of the stamping mechanism during continuous stamping work after cooling suppression, and aggregate and generate theoretical temperature data based on the temperature measurement target points and comparison temperature sequences in the temperature measurement information of the target temperature measurement sensor, so as to know the theoretical temperature change of the stamping mechanism during continuous stamping work after cooling suppression.

[0100] S40: When the temperature deviation rate of the abnormal temperature measurement data relative to the corresponding theoretical temperature data is greater than the corresponding temperature deviation threshold, generate fault handling information.

[0101] Specifically, calculate the temperature deviation rate of the abnormal temperature measurement data relative to the corresponding theoretical temperature data. When the temperature deviation rate is greater than the corresponding temperature deviation threshold, it is considered that there is a problem of over-squeezing the workpiece or insufficient squeezing of the workpiece at the fault location, and fault handling information is generated, improving the timeliness of stamping processing quality detection.

[0102] Among them, in step S40, it includes:

[0103] S41: Obtain the abnormal temperature measurement data and the theoretical temperature data, and perform time alignment processing on the abnormal temperature measurement values in the abnormal temperature measurement data and the comparison temperature values in the theoretical temperature data.

[0104] In this embodiment, the abnormal temperature measurement data includes a number of abnormal temperature measurement values, and each abnormal temperature measurement value is associated with a cycle identifier generated according to the corresponding temperature measurement time point; the comparison temperature sequence includes a number of comparison temperature values, and each comparison temperature value is associated with a cycle identifier.

[0105] Specifically, obtain the abnormal temperature measurement data and the theoretical temperature data, and further perform time alignment processing on the abnormal temperature measurement values in the abnormal temperature measurement data and the comparison temperature values in the theoretical temperature data according to the cycle identifier.

[0106] S42: Calculate the absolute value of the quotient of all abnormal temperature measurement values and the corresponding comparison temperature values to obtain a number of temperature quotient values, and calculate the temperature deviation rate based on the number of temperature quotient values and a preset temperature deviation calculation rule.

[0107] In this embodiment, the temperature deviation calculation rule can be set and adjusted according to actual needs. Preferably, a temperature deviation calculation rule is to take the latest N temperature quotient values of the cycle identifier, and average M of the largest / smallest temperature quotient values to obtain the temperature deviation rate.

[0108] Specifically, calculate the absolute value of the quotient of all abnormal temperature measurement values and the corresponding comparison temperature values to obtain a number of temperature quotient values, and calculate the temperature deviation rate based on the number of temperature quotient values and a preset temperature deviation calculation rule, so as to judge the deviation degree between the measured temperature situation and the theoretical temperature situation of the stamping structure subsequently.

[0109] S43: When the temperature deviation rate exceeds the corresponding preset temperature deviation threshold range, generate a fault handling message based on the temperature measurement target point of the target temperature measurement sensor.

[0110] Specifically, when the temperature deviation rate exceeds the corresponding preset temperature deviation threshold range, it means that the deviation degree between the measured temperature situation and the theoretical temperature situation of the stamping structure is large, and a fault handling message is generated based on the temperature measurement target point of the target temperature measurement sensor, so that the staff can directionally check whether there are stamping die fault problems at the temperature measurement target point.

[0111] It should be understood that the sequence numbers of the steps in the above embodiments do not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation to the implementation process of the embodiments of the present application.

[0112] Embodiment 2

[0113] A stamping die detection and adjustment system based on the operating conditions, and the stamping die detection and adjustment system based on the operating conditions corresponds to the stamping die detection and adjustment method based on the operating conditions in the above embodiment.

[0114] Such as Figure 2As shown in the figure, a stamping die detection and adjustment system based on operating conditions includes a standard power-time relationship analysis module, a resistance anomaly evaluation module, an abnormal temperature measurement module, and a fault handling evaluation module. The detailed descriptions of each functional module are as follows:

[0115] The standard power-time relationship analysis module is used to obtain the design drawings of the stamping mechanism and the stamping die, create a stamping structure model and import it into the physical field simulation platform to generate a stamping simulation model, and analyze the standard power-time curve of various stamping processing tasks based on the stamping simulation model;

[0116] The resistance anomaly evaluation module is used to obtain the operation detection parameters of the stamping mechanism in real time, draw the measured power-time curve and compare it with the corresponding standard power-time curve, and identify the stamping sub-action segments with a power parameter deviation rate greater than the power deviation threshold to generate a resistance anomaly signal;

[0117] The abnormal temperature measurement module is used to generate a cooling suppression signal based on the resistance anomaly signal and send it to the cooling component, generate a temperature measurement control signal to control the temperature measurement sensor to detect the abnormal temperature measurement data of the stamping structure;

[0118] The fault handling evaluation module is used to generate fault handling information when the temperature deviation rate of the abnormal temperature measurement data relative to the corresponding theoretical temperature data is greater than the corresponding temperature deviation threshold.

[0119] Among them, the standard power-time relationship analysis module further includes:

[0120] The stamping power evaluation sub-module is used to determine the task information of the target stamping processing task and input it into the stamping simulation model, evaluate the action stroke of the stamping structure and the force required at each time point during the action stroke through the physical field simulation algorithm, and then calculate the power at each time point in an action cycle of the target stamping processing task;

[0121] The standard power-time curve generation sub-module is used to generate a standard power-time curve based on the power requirements at each time point in several action cycles of the target stamping processing task and the die deterioration correction data.

[0122] Among them, the resistance anomaly evaluation module further includes:

[0123] The measured power-time curve generation sub-module is used to obtain the power consumption parameters of the stamping mechanism in real time and draw the measured power-time curve according to the power consumption parameters and the corresponding time nodes;

[0124] The cycle power calculation sub-module is used to calculate the average power of the most recent action cycle in the measured power-time curve and define it as the measured cycle power, and calculate the average power of the action cycle with the same cycle identifier in the corresponding standard power-time curve and define it as the comparison cycle power;

[0125] A resistance anomaly signal generation sub-module, configured to calculate a power parameter deviation rate based on the measured cycle power and the comparison cycle power. When the power parameter deviation rate is greater than a preset power deviation threshold, generate a resistance anomaly signal based on the cycle identifier corresponding to the stamping sub-action segment.

[0126] Among them, the abnormal temperature measurement module further includes:

[0127] A temperature measurement task execution sub-module, configured to generate a temperature measurement control signal and send it to the temperature measurement sensor to control the temperature measurement sensor to execute the temperature measurement task for the stamping structure;

[0128] A comparison temperature data summarization sub-module, configured to receive the temperature measurement information from the target temperature measurement sensor, summarize and generate abnormal temperature measurement data based on the abnormal temperature measurement values, temperature measurement target points, and temperature measurement time points in each temperature measurement information, and summarize and generate theoretical temperature data based on the temperature measurement target points and the comparison temperature sequence in each temperature measurement information.

[0129] Among them, the fault handling evaluation module further includes:

[0130] A time alignment processing sub-module, configured to obtain the abnormal temperature measurement data and the theoretical temperature data, and perform time alignment processing on the abnormal temperature measurement values in the abnormal temperature measurement data and the comparison temperature values in the theoretical temperature data;

[0131] A temperature deviation rate calculation sub-module, configured to calculate the absolute value of the quotient of all abnormal temperature measurement values and the corresponding comparison temperature values to obtain a number of temperature quotient values, and calculate the temperature deviation rate based on the number of temperature quotient values and a preset temperature deviation calculation rule;

[0132] A temperature deviation rate comparison sub-module, configured to generate fault handling information based on the temperature measurement target point of the target temperature measurement sensor when the temperature deviation rate exceeds the corresponding preset temperature deviation threshold range.

[0133] For the specific limitations of the stamping die detection and adjustment system based on the operating conditions, reference can be made to the limitations of the stamping die detection and adjustment method based on the operating conditions described above, which will not be elaborated here; each module in the above stamping die detection and adjustment system based on the operating conditions can be implemented in whole or in part by software, hardware, and their combination; the above modules can be embedded in or independent of the processor in the computer device in the form of hardware, or can be stored in the memory of the computer device in the form of software, so that the processor can call and execute the operations corresponding to the above modules.

[0134] Embodiment III

[0135] A computer device, which can be a server, and its internal structure diagram can be as Figure 3As shown in the figure. The computer device includes a processor, a memory, a network interface, and a database connected by a system bus. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, computer programs, and a database. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage medium. The database of the computer device is used to store data such as design drawings of stamping mechanisms and stamping dies, stamping structure models, physical field simulation platforms, stamping simulation models, standard power-time curves, operation detection parameters, measured power-time curves, standard power-time curves, power parameter deviation rates, power deviation thresholds, stamping sub-action line segments, resistance anomaly signals, cooling suppression signals, temperature measurement control signals, abnormal temperature measurement data, theoretical temperature data, temperature deviation rates, temperature deviation thresholds, and fault handling information. The network interface of the computer device is used to communicate with an external terminal through a network connection. The computer program, when executed by the processor, implements a method for detecting and adjusting a stamping die based on operating conditions.

[0136] In one embodiment, a computer device is provided, including a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, the following steps are implemented:

[0137] S10: Obtain the design drawings of the stamping mechanism and the stamping die to create a stamping structure model and import it into the physical field simulation platform to generate a stamping simulation model, and analyze the standard power-time curve of various stamping processing tasks based on the stamping simulation model;

[0138] S20: Real-time obtain the operation detection parameters of the stamping mechanism to plot the measured power-time curve and compare it with the corresponding standard power-time curve, and identify the stamping sub-action line segment with a power parameter deviation rate greater than the power deviation threshold to generate a resistance anomaly signal;

[0139] S30: Generate a cooling suppression signal based on the resistance anomaly signal and send it to the cooling component, generate a temperature measurement control signal to control the temperature measurement sensor to detect the abnormal temperature measurement data of the stamping structure;

[0140] S40: When the temperature deviation rate of the abnormal temperature measurement data relative to the corresponding theoretical temperature data is greater than the corresponding temperature deviation threshold, generate fault handling information.

[0141] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by the processor, the following steps are implemented:

[0142] S10: Obtain the design drawings of the stamping mechanism and the stamping die to create a stamping structure model and import it into the physical field simulation platform to generate a stamping simulation model, and analyze the standard power-time curve of various stamping processing tasks based on the stamping simulation model;

[0143] S20: Real-time obtain the operation detection parameters of the stamping mechanism to plot the measured power-time curve and compare it with the corresponding standard power-time curve, and identify the stamping sub-action segments with a power parameter deviation rate greater than the power deviation threshold to generate a resistance anomaly signal;

[0144] S30: Generate a cooling suppression signal based on the resistance anomaly signal and send it to the cooling component, and generate a temperature measurement control signal to control the temperature measurement sensor to detect the abnormal temperature measurement data of the stamping structure;

[0145] S40: When the temperature deviation rate of the abnormal temperature measurement data relative to the corresponding theoretical temperature data is greater than the corresponding temperature deviation threshold, generate a fault handling message.

[0146] Those of ordinary skill in the art can understand that all or part of the processes of implementing the methods in the above embodiments can be completed by instructing relevant hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above methods. Among them, any reference to a memory, storage, database, or other medium used in the various embodiments provided in the present application can include non-volatile and / or volatile memories. Non-volatile memories can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memories can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in various forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink), DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0147] Those skilled in the art can clearly understand that for the convenience and simplicity of description, only the above division of each functional unit and module is used as an example. In actual applications, the above functions can be allocated to different functional units and modules according to needs, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above.

[0148] The above-described embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some of the features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the various embodiments of the present application, and should all be included within the protection scope of the present application.

Claims

1. A stamping die detection and adjustment method based on working conditions, characterized in that: include: Obtain the design drawings of the stamping mechanism and stamping die to create a stamping structure model and import it into the physical field simulation platform to generate a stamping simulation model. Based on the stamping simulation model, analyze the standard power-time curves of various stamping processing tasks; Acquire the running detection parameters of the punching mechanism in real time to draw the measured power-time curve and compare it with the corresponding standard power-time curve, identify the punching sub-action line segment with a power parameter deviation rate greater than the power deviation threshold to generate a resistance abnormality signal; A cooling inhibition signal is generated based on the abnormal resistance signal and sent to the cooling component, and a temperature measurement control signal is generated to control the temperature measurement sensor to detect abnormal temperature measurement data of the stamping structure; When the temperature deviation rate of the abnormal temperature measurement data relative to the corresponding theoretical temperature data is greater than the corresponding temperature deviation threshold, fault handling information is generated; The operation detection parameters include power consumption parameters.

2. The method for detecting and adjusting a stamping die based on working conditions according to claim 1 is characterized in that: The stamping mechanism includes a power component, and the stamping simulation model marks the electrical parameters of the power component; The standard power-time curves of various stamping processing tasks analyzed based on the stamping simulation model include: Determine the task information of the target stamping task and input it into the stamping simulation model, evaluate the action stroke of the stamping structure and the force required at each time point in the action stroke through the physical field simulation algorithm, and then calculate the power at each time point in an action cycle of the target stamping task; Based on the power requirements of the target stamping task at each time point in several action cycles and the die degradation correction data, a standard power-time curve is generated; The task information includes initial workpiece drawings, finished workpiece drawings, workpiece parameters and stamping parameters; the workpiece parameters include material parameters and size parameters of the initial workpiece and the finished workpiece; the stamping parameters include the processing type and processing parameters of each processing mark; the mold degradation correction data is correction data determined based on the average power changes of multiple action cycles in the measured power time curve of the same mold in the historical working state.

3. The method for detecting and adjusting a stamping die based on working conditions according to claim 1, characterized in that: The real-time acquisition of the operation detection parameters of the stamping mechanism to draw the measured power time curve and compare it with the corresponding standard power time curve, identify the stamping sub-action line segment whose power parameter deviation rate is greater than the power deviation threshold to generate a resistance abnormality signal, including: Acquire the power consumption parameters of the stamping mechanism in real time, so as to draw the measured power time curve according to the power consumption parameters and the corresponding time nodes; Calculate the average power of the most recent action cycle in the measured power time curve and define it as the measured cycle power; calculate the average power of the action cycle with the same cycle mark in the corresponding standard power time curve and define it as the comparison cycle power; The power parameter deviation rate is calculated based on the measured cycle power and the comparison cycle power. When the power parameter deviation rate is greater than the preset power deviation threshold, a resistance abnormality signal is generated based on the cycle mark corresponding to the punching sub-action line segment; Each of the action cycles is marked with a corresponding cycle identifier, which is used to mark the action cycle sequence of the action cycle in a continuous stamping task; the stamping sub-action line segment corresponds to a curve segment of an action cycle in the measured power-time curve; The calculation formula of the power parameter deviation rate is:

4. The method for detecting and adjusting a stamping die based on working conditions according to claim 1, characterized in that: The generating of the temperature measurement control signal to control the temperature measurement sensor to detect abnormal temperature measurement data of the stamping structure includes: Generate a temperature measurement control signal and send it to the temperature measurement sensor to control the temperature measurement sensor to perform a temperature measurement task for the stamping structure; Receive temperature measurement information from the target temperature measurement sensor, generate abnormal temperature measurement data based on the abnormal temperature measurement value, temperature measurement target point and temperature measurement time point in each temperature measurement information, and generate theoretical temperature data based on the temperature measurement target point and comparison temperature series in each temperature measurement information; The temperature measurement information includes abnormal temperature measurement values, temperature measurement target points, temperature measurement time points and comparative temperature series; the comparative temperature series records the temperature values ​​measured at the temperature measurement target points during several action cycles of continuous stamping work when the stamping die and stamping mechanism are normal and the stamping machine cooling is suppressed.

5. The method for detecting and adjusting a stamping die based on working conditions according to claim 4 is characterized in that: The abnormal temperature measurement data includes a number of abnormal temperature measurement values, each of which is associated with a period identifier generated according to a corresponding temperature measurement time point; the comparative temperature series includes a number of comparative temperature values, each of which is associated with a period identifier; When the temperature deviation rate of the abnormal temperature measurement data relative to the corresponding theoretical temperature data is greater than the corresponding temperature deviation threshold, fault handling information is generated, including: Acquire abnormal temperature measurement data and theoretical temperature data, and perform time alignment processing on the abnormal temperature measurement value in the abnormal temperature measurement data and the comparison temperature value in the theoretical temperature data; Calculate the absolute values ​​of the quotients of all abnormal temperature measurement values ​​and the corresponding comparison temperature values ​​to obtain a number of temperature quotient values, and calculate the temperature deviation rate based on the number of temperature quotient values ​​and a preset temperature deviation calculation rule; When the temperature deviation rate exceeds the corresponding preset temperature deviation threshold range, fault handling information is generated based on the temperature measurement target point of the target temperature measurement sensor.

6. The stamping die detection and adjustment system based on the working conditions is characterized by: The stamping die detection and adjustment method based on the use condition as described in any one of claims 1 to 5 comprises: The standard power-time relationship analysis module is used to obtain the design drawings of the stamping mechanism and stamping die to create a stamping structure model and import it into the physical field simulation platform to generate a stamping simulation model. Based on the stamping simulation model, the standard power-time curves of various stamping processing tasks are analyzed; The resistance anomaly assessment module is used to obtain the operation detection parameters of the stamping mechanism in real time, to draw the measured power-time curve and compare it with the corresponding standard power-time curve, to identify the stamping sub-action line segments whose power parameter deviation rate is greater than the power deviation threshold to generate resistance anomaly signals; An abnormal temperature measurement module is used to generate a cooling inhibition signal based on the abnormal resistance signal and send it to the cooling component, and generate a temperature measurement control signal to control the temperature measurement sensor to detect abnormal temperature measurement data of the stamping structure; A fault handling evaluation module is used to generate fault handling information when the temperature deviation rate of abnormal temperature measurement data relative to the corresponding theoretical temperature data is greater than the corresponding temperature deviation threshold; The operation detection parameters include power consumption parameters.

7. The stamping die detection and adjustment system based on the use condition according to claim 6 is characterized in that: The standard power time relationship analysis module includes: The stamping power evaluation submodule is used to determine the task information of the target stamping task and input it into the stamping simulation model. The action stroke of the stamping structure and the force required at each time point in the action stroke are evaluated through the physical field simulation algorithm, and then the power at each time point in an action cycle of the target stamping task is calculated; A standard power-time curve generation submodule is used to generate a standard power-time curve based on the power requirements of the target stamping task at each time point in a number of action cycles and the die degradation correction data; The stamping mechanism includes a power component, and the stamping simulation model marks the electrical parameters of the power component; the task information includes an initial workpiece drawing, a finished workpiece drawing, workpiece parameters and stamping parameters; the workpiece parameters include material parameters and size parameters of the initial workpiece and the finished workpiece; the stamping parameters include the processing type and processing parameters of each processing mark; the mold degradation correction data is correction data determined based on the average power changes of multiple action cycles in the measured power time curve of the same mold in the historical working state.

8. The stamping die detection and adjustment system based on working conditions according to claim 6 is characterized in that: The resistance abnormality assessment module comprises: The measured power time curve generation submodule is used to obtain the power consumption parameters of the stamping mechanism in real time, so as to draw the measured power time curve according to the power consumption parameters and the corresponding time nodes; The cycle power calculation submodule is used to calculate the average power of the most recent action cycle in the measured power time curve and define it as the measured cycle power, and calculate the average power of the action cycle with the same cycle mark in the corresponding standard power time curve and define it as the comparison cycle power; The resistance abnormality signal generating submodule is used to calculate the power parameter deviation rate based on the measured cycle power and the comparison cycle power. When the power parameter deviation rate is greater than the preset power deviation threshold, the resistance abnormality signal is generated based on the cycle mark corresponding to the punching sub-action line segment; Each of the action cycles is marked with a corresponding cycle identifier, which is used to mark the action cycle sequence of the action cycle in a continuous stamping task; the stamping sub-action line segment corresponds to a curve segment of an action cycle in the measured power-time curve; The calculation formula of the power parameter deviation rate is:

9. A computer device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the computer program, the steps of the stamping die detection and adjustment method based on the usage conditions as described in any one of claims 1 to 5 are implemented.

10. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the steps of the stamping die detection and adjustment method based on the usage conditions as described in any one of claims 1 to 5 are implemented.

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