A quantum chip package clamp

Abstract

The application relates to the technical field of quantum chip mounting, in particular to a quantum chip packaging clamp, which comprises a length-adjusting structure, width-adjusting structures are arranged at the two ends of the length-adjusting structure, a moving support structure is arranged between the length-adjusting structures, a fixing structure is arranged on the upper side of the width-adjusting structure, a clamping positioning structure is arranged on the inner side of the fixing structure, and a combination bolt is clamped on the outer side of the fixing structure. Through the length-adjusting structure and the width-adjusting structure, the overall use area of the device can be flexibly adjusted, the device can adapt to the packaging of quantum chips of different specifications, and can adapt to the internal environment of the mounting device corresponding to the chip of a specific specification, thereby improving the convenience and efficiency of overall mounting of the device, the clamping positioning structure is used to improve the fixing effect of the quantum chip in the device, the device can be flexibly combined under the cooperation of the combination bolt, the user can conveniently package and store multiple chips, the convenience of chip packaging is improved, and the functional effect of the packaging clamp is improved.

Description

Technical Field

[0001] This invention relates to the field of quantum chip mounting technology, and in particular to a quantum chip packaging fixture. Background Technology

[0002] A quantum chip is a chip that integrates quantum circuitry onto a substrate, thereby enabling quantum information processing. As a novel chip technology, quantum chips have broad application prospects and enormous development potential in fields such as quantum computing and quantum communication. However, to achieve widespread application and commercial production of quantum chips, numerous technical challenges and process difficulties still need to be overcome. In the future, with continuous technological advancements and industrial development, quantum chips are expected to bring more innovation and transformation to human society.

[0003] A quantum chip packaging fixture, with application number CN202211004666.5, includes a horizontal plate, a vertical plate below the horizontal plate, and a fixing structure above the horizontal plate. The fixing structure includes a clamping plate, a diagonal rod, a square plate, a threaded rod, a circular block, a vertical rod, a vertical cylinder, a vertical block, and a rotating rod. The bottom of the vertical rod is fixedly connected to one side of the top of the horizontal plate, and a vertical cylinder is fitted with a clearance fit on the upper outer wall of the vertical rod. This quantum chip packaging fixture, through the cooperation of the vertical plate, shell, outer shell, horizontal plate, base, baffle, bolts, and fixing structure, allows the device to be used such that rotating the threaded rod moves the vertical block upwards, which in turn moves the circular block upwards, which in turn rotates the rotating rod, which in turn moves the diagonal rod, which in turn moves the square plate downwards, and the square plate moves the clamping plate downwards. This facilitates the fixation of the packaging substrate by the operator, preventing displacement during quantum chip packaging and ensuring optimal packaging results.

[0004] The above-mentioned technology can adapt to chips of different sizes and improve the chip packaging effect. However, it occupies a large space during use, has poor adaptability to the internal environment of external devices, causes inconvenience for chip installation and fixation, and has a single usage method. It is good for the installation of a single chip, but cannot be used in combination, and cannot meet the simultaneous positioning, packaging and storage of multiple chips. Summary of the Invention

[0005] To overcome the technical defects of the existing technology, the present invention provides a quantum chip packaging fixture, so as to flexibly adjust the overall size of the device according to the chip specifications, improve the installation convenience of the device and the convenience of multi-chip packaging.

[0006] The technical solution adopted in this invention is: a quantum chip packaging fixture, including an adjustment structure, an adjustment structure at both ends of the adjustment structure, a movable support structure installed between the adjustment structures, a fixed structure on the upper side of the adjustment structure, a clamping and positioning structure on the inner side of the fixed structure, and a combination bolt fastened to the outer side of the fixed structure.

[0007] Preferably, in order to adjust the working length of the device, the length adjustment structure includes a long side baffle, a telescopic long plate, a limiting plate, and an length adjustment threaded rod. The outer side of the long side baffle is designed with a positioning mounting ring. The telescopic long plate is clamped to the upper side of the long side baffle. The length adjustment threaded rod is rotatably installed at one end of the telescopic long plate. The inner side of the long side baffle is provided with a length adjustment groove. The limiting plate is slidably clamped to the inner two sides of the length adjustment groove.

[0008] Preferably, in order to control the extension length of the length-adjusting structure, a limiting groove is provided on the inner side of the long side baffle, the telescopic plate is slidably engaged in the interior of the limiting groove, the inner surface of the long side baffle and the inner side of the long side baffle are in the same plane, a transition block is provided at one end of the long side baffle, a rotating mounting hole is provided on one side of the transition block, the length-adjusting threaded rod is rotatably engaged in the interior of the rotating mounting hole, and length-adjusting threaded grooves are provided at both ends of the long side baffle, the length-adjusting threaded grooves and the length-adjusting threaded rod are mutually rotatably engaged.

[0009] Preferably, in order to support and position the quantum chip, the movable support structure includes an I-beam roller, a damping connecting block, a support frame, and an extension support plate. The working roller is installed inside the adjustable slide groove, the damping connecting block is disposed on one side of the I-beam roller, the support frame is installed on the other side of the damping connecting block at one end, and the extension support plate is disposed on one side of the damping connecting block at the other end.

[0010] Preferably, in order to adjust the position of the movable support structure, the two sides of the I-beam roller are slidably engaged with the length adjustment groove, the center of the I-beam roller is slidably engaged with the limiting plate, one end of the support frame is fixedly welded to the damping connecting block, the extension support plate is slidably engaged inside the support frame, the upper surface of the extension support plate is in the same plane as the upper surface of the support frame, and one end of the extension support plate is fixedly connected to the damping connecting block.

[0011] Preferably, in order to adjust the working width of the device, the width adjustment structure includes a wide-side baffle, a bidirectional threaded rod, a width adjustment telescopic rod, a driven bevel gear, and a width adjustment bevel gear. The wide-side baffle is designed with mounting and positioning holes on its outer side. The bidirectional threaded rod is rotatably engaged with the inside of the wide-side baffle. The width adjustment telescopic rod is respectively installed at both ends of the wide-side baffle. The driven bevel gear and the bidirectional threaded rod are fixedly connected to each other. The width adjustment bevel gear is located on one side of the driven bevel gear. The upper surface of the wide-side baffle is provided with a storage and adjustment groove.

[0012] Preferably, in order to control the length of the width-adjusting structure, the inside of the wide-side baffle is provided with an adjustment slot, which is slidably engaged with the support frame. The inside of the wide-side baffle is provided with a width-adjusting hole, the bidirectional threaded rod is rotatably engaged with the inside of the width-adjusting hole, the width-adjusting telescopic rod is slidably engaged with the inside of the width-adjusting hole, the inside of the width-adjusting telescopic rod is provided with a width-adjusting threaded hole, the width-adjusting threaded hole and the bidirectional threaded rod are rotatably engaged with each other, a drive mounting hole is provided on one side of the width-adjusting hole, the width-adjusting bevel gear is rotatably engaged with the inside of the drive mounting hole, and a width-adjusting motor is fixedly installed on the outside of the width-adjusting baffle, the output end of the width-adjusting motor is fixedly connected with the width-adjusting bevel gear.

[0013] Preferably, to control the working height of the clamping and positioning structure, the fixing structure includes a lifting motor, a lifting mirror screw, a mirror slider, a mirror support rod, and a height connecting frame. The lifting motor is embedded in one end of the storage adjustment slot. The lifting mirror screw is fixedly installed at the output end of the lifting motor. The mirror slider is slidably engaged with both sides of the inside of the storage adjustment slot. The mirror slider has a mirror threaded hole inside, which is threadedly connected to the lifting mirror screw. One end of the mirror support rod is rotatably connected to the mirror slider, and the other end of the mirror support rod is rotatably connected to both ends of the height support frame. A combined connecting ring is designed on the outside of the height connecting frame. A combined bolt is slidably engaged with the inside of the combined connecting ring, and a fixing nut is threadedly connected to one end of the combined bolt.

[0014] Preferably, for clamping and fixing the chip from above, the clamping and positioning structure includes a positioning motor, a telescopic bidirectional screw, a positioning adjustment block, a positioning support rod, and a clamping plate. The positioning motor is fixedly installed at one end of the height connecting frame, the telescopic bidirectional screw is fixedly installed at the output end of the positioning motor, the positioning adjustment block is slidably engaged with both sides of the inside of the height connecting frame, and the positioning adjustment block has a telescopic threaded hole inside, which is rotatably engaged with both ends of the telescopic bidirectional screw. One end of the positioning support rod is rotatably connected to the positioning adjustment block, and the other end of the positioning support rod is rotatably connected to both ends of the clamping plate.

[0015] The beneficial effects of this invention are as follows: by adjusting the length and width of the structure, the overall usable area of ​​the device can be flexibly adjusted, making the device adaptable to the packaging of quantum chips of different specifications, and adapting to the internal environment of the installation device corresponding to a specific specification chip, thereby improving the convenience and efficiency of the overall installation of the device. The clamping and positioning structure improves the fixing effect of the quantum chips inside the device. With the cooperation of the combination bolts, the device can be flexibly combined and used, making it convenient for users to package and use or store multiple chips, improving the convenience of chip packaging, and increasing the functional effect of the packaging fixture. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the unfolded structure of the present invention.

[0017] Figure 2 This is a schematic diagram of the shrinkage structure of the present invention.

[0018] Figure 3 This is a schematic diagram of the combined structure of the present invention. Figure 1 .

[0019] Figure 4 This is a schematic diagram of the combined structure of the present invention. Figure 2 .

[0020] Figure 5 This is a side sectional view of the present invention.

[0021] Figure 6 This is a schematic diagram of the structure of the long side baffle in this invention.

[0022] Figure 7 This is a schematic diagram of the telescopic long plate part in this invention.

[0023] Figure 8 This is a schematic diagram of the structure of the wide-side baffle in this invention.

[0024] Figure 9 This is a schematic diagram of the movable support structure in this invention.

[0025] Figure 10 This is a schematic diagram of the fixed structure part in this invention.

[0026] Explanation of reference numerals in the attached figures: 1. Length adjustment structure; 101. Long side baffle; 102. Telescopic long plate; 103. Limiting plate; 104. Length adjustment threaded rod; 2. Width adjustment structure; 201. Wide side baffle; 202. Bidirectional threaded rod; 203. Width adjustment telescopic rod; 204. Driven bevel gear; 205. Width adjustment bevel gear; 206. Width adjustment motor; 3. Moving support structure; 301. I-beam roller; 302. Damping connecting block; 30 3. Support frame; 304. Extension support plate; 4. Fixing structure; 401. Lifting motor; 402. Lifting mirror screw; 403. Mirror slider; 404. Mirror support rod; 405. Height connecting frame; 5. Clamping and positioning structure; 501. Positioning motor; 502. Telescopic bidirectional screw; 503. Positioning adjustment block; 504. Positioning support rod; 505. Clamping plate; 6. Combination bolt; 601. Fixing nut. Detailed Implementation

[0027] The present invention will be further described below with reference to the accompanying drawings: like Figures 1-10As shown, this embodiment provides a quantum chip packaging fixture, including an adjustable structure 1. By adjusting the adjustable structure 1, it can adapt to quantum chips of different sizes, ensuring that the chip can be accurately clamped. The adjustable structure 1 includes a long side baffle 101, a telescopic long plate 102, a limiting plate 103, and an adjustable threaded rod 104. The long side baffle 101 is designed with a positioning mounting ring on its outer side. The long side baffle 101 is the main supporting part of the adjustable structure 1, and its outer side is designed with a positioning mounting ring for mounting the entire fixture onto a workbench or other fixed surface. In the fixed device, the telescopic long plate 102 is clamped on the upper side of the long side baffle 101. The length adjustment screws are rotatably installed on one end of the telescopic long plate 102. The inner side of the long side baffle 101 is provided with a length adjustment groove. The limiting plates 103 are slidably engaged with the inner sides of the length adjustment groove to limit the movement range of the telescopic long plate 102 and prevent it from over-extending or retracting. The inner side of the long side baffle 101 is provided with a limiting flat groove. The telescopic long plate 102 is slidably engaged with the inside of the limiting flat groove and can slide under the guidance of the long side baffle 101. This allows for adjustment of the overall length of the fixture. The inner surface of the long side baffle 101 and the inner side of the long side baffle 101 are in the same plane. One end of the long side baffle 101 is provided with a connecting block, and one side of the connecting block has a rotating mounting hole. The length-adjusting threaded rod 104 is rotatably engaged with the inside of the rotating mounting hole. Both ends of the long side baffle 101 have length-adjusting threaded grooves, which rotate and mesh with the length-adjusting threaded rod 104. By rotating the length-adjusting threaded rod 104, the position of the telescopic plate 102 can be adjusted, thereby achieving length adjustment. Functionally, when the length of the fixture needs to be adjusted, first loosen the limiting plate 103, then rotate the length-adjusting threaded rod 104. The rotation of the length-adjusting threaded rod 104 will cause it to move in the length-adjusting threaded groove, thereby pushing or pulling the telescopic long plate 102 to slide in the limiting flat groove of the long side baffle 101. The movement of the telescopic long plate 102 will change the overall length of the fixture to adapt to quantum chips of different sizes. After the adjustment is completed, the limiting plate 103 is fixed again to lock the position of the telescopic long plate 102 to ensure the stability of the fixture during the packaging process.

[0028] A movable support structure 3 is installed between the length adjustment structures 1. The movable support structure 3 includes an I-beam roller 301, a damping connecting block 302, a support frame 303, and an extension support plate 304. The working roller is installed inside the length adjustment groove, and its design allows for smooth sliding within the groove while providing stable support. The damping connecting block 302 is located on one side of the I-beam roller 301 and includes damping material or structure to reduce vibration and noise during movement. To ensure the stability of the high-clamping device, a support frame 303 is installed on the other side of one end of the damping connecting block 302, and an extension support plate 304 is set on one side of the other end of the damping connecting block 302. The two sides of the I-beam roller 301 are slidably engaged with the length adjustment groove, and the center position of the I-beam roller 301 is slidably engaged with the limiting plate 103. This further ensures the stability and accuracy of the movable support structure 3 during the length adjustment process. One end of the support frame 303 is fixedly welded to the damping connecting block 302. The sleeve frame 303 is a rigid frame used to fix and support quantum chips or other components that need to be packaged. The extension support plate 304 is slidably engaged inside the support sleeve frame 303. The upper surface of the extension support plate 304 is in the same plane as the upper surface of the support sleeve frame 303. The extension support plate 304 can be adjusted in length as needed to provide additional support area or to accommodate quantum chips of different sizes. The fact that the upper surface of the extension support plate 304 is in the same plane as the upper surface of the support sleeve frame 303 ensures the flatness and consistency of the support surface. One end of the extension support plate 304 is fixedly connected to the damping connecting block 302. When it is necessary to adjust the support position or length, it can be achieved by sliding the extension support plate 304 within the support sleeve frame 303. The presence of the damping connecting block 302 reduces vibration and noise during movement and improves the stability and reliability of the fixture. The sliding of the I-beam roller 301 in the length adjustment groove ensures that the moving support structure 3 can move smoothly following the adjustment of the length adjustment structure 1.

[0029] The length adjustment structure 1 has width adjustment structures 2 at both ends, enabling the fixture to adapt to quantum chips or packaging requirements of different widths, further enhancing the fixture's versatility and flexibility. The width adjustment structure 2 includes a wide-side baffle 201, a bidirectional threaded rod 202, a width adjustment telescopic rod 203, a driven bevel gear 204, and a width adjustment bevel gear 205. The wide-side baffle 201 has mounting and positioning holes on its outer side. The wide-side baffle 201 is the main support part of the width adjustment structure 2, and its outer side is designed with mounting and positioning holes for mounting the entire width adjustment structure 2 onto a workbench or other fixed device. The bidirectional threaded rod 202 is rotatably engaged with the wide-side baffle 205. Inside the side baffle 201, two width-adjusting telescopic rods 203 are simultaneously driven to move in opposite directions. The width-adjusting telescopic rods 203 are respectively installed at both ends of the wide side baffle 201. The driven bevel gear 204 and the bidirectional threaded rod 202 are fixedly connected to each other for transmitting power or torque. The width-adjusting bevel gear 205 is located on one side of the driven bevel gear 204 and is used to transmit the power of the width-adjusting motor 206 to the bidirectional threaded rod 202. A storage and adjustment groove is provided on the upper surface of the wide side baffle 201, and an adjustment slot is provided inside the wide side baffle 201 to accommodate and conceal the movable support structure 3 during the width adjustment process. The positioning slot and the support frame 303 are slidably engaged. The wide-side baffle 201 has an adjustment hole inside, and the bidirectional threaded rod 202 is rotatably engaged inside the adjustment hole. The adjustment telescopic rods 203 are slidably engaged inside the adjustment holes. The adjustment telescopic rods 203 have adjustment threaded holes inside, which rotate and mesh with the bidirectional threaded rods 202, allowing for telescopic movement driven by the bidirectional threaded rods 202. A drive mounting hole is provided on one side of the adjustment hole, and the adjustment bevel gear 205 is rotatably engaged inside the drive mounting hole. An adjustment motor 2 is fixedly mounted on the outer side of the adjustment baffle. 06. The output end of the width adjustment motor 206 is fixedly connected to the width adjustment bevel gear 205. When the width of the fixture needs to be adjusted, the width adjustment motor 206 is started. The output end of the width adjustment motor 206 drives the width adjustment bevel gear 205 to rotate, which provides power for the width adjustment process. In turn, through meshing, it drives the driven bevel gear 204 and the bidirectional threaded rod 202 to rotate. The rotation of the bidirectional threaded rod 202 will simultaneously drive the two width adjustment telescopic rods 203 to move in opposite directions, thereby changing the overall width of the fixture. The sliding of the width adjustment telescopic rod 203 in the width adjustment hole ensures the smoothness and accuracy of the movement.

[0030] The inner side of the fixing structure 4 is provided with a clamping and positioning structure 5 for fixing the clamping and positioning structure 5 and the combination bolt 6. The outer side of the fixing structure 4 is fitted with the combination bolt 6. The fixing structure 4 includes a lifting motor 401, a lifting mirror screw 402, a mirror slider 403, a mirror support rod 404, and a height connecting frame 405. The lifting motor 401 is embedded in one end of the storage adjustment slot and serves as the main power source in the fixing structure 4. The lifting mirror screw 402 is fixedly installed at the output end of the lifting motor 401 and is used to drive the lifting mirror screw 402 to rotate. The rotation of the mirror slider 403 drives its lifting and lowering movement. The mirror slider 403 is slidably engaged with both sides of the storage adjustment slot. The mirror slider 403 has a mirror threaded hole inside, which is threadedly connected to the lifting mirror screw 402. The design of the lifting mirror screw 402 matches the mirror threaded hole to achieve smooth threaded connection and movement. One end of the mirror support rod 404 is rotatably connected to the mirror slider 403, and the other end of the mirror support rod 404 is rotatably connected to both ends of the height support frame. The connection allows the mirror slider 403 to swing accordingly when it is raised and lowered, thereby changing the height of the height support frame. The outer side of the height connection frame 405 is designed with a combined connecting ring to achieve a stable connection between the two devices. The combined bolt 6 is slidably engaged inside the combined connecting ring. One end of the combined bolt 6 is threadedly connected to a fixing nut 601, which can stably connect the two devices through the combined bolt 6, ensuring stability and accuracy during the packaging process. When the height of the device needs to be adjusted, the lifting motor 401 is started. The output end of the lifting motor 401 drives the lifting mirror screw 402 to rotate, which in turn drives the mirror slider 403 to move up and down in the storage adjustment slot through the threaded connection. The up and down movement of the mirror slider 403 will drive the mirror support rod 404 to swing accordingly, thereby changing the height of the height support frame. By adjusting the height of the height support frame, it can adapt to quantum chips of different sizes or other packaging requirements. When the two devices need to be connected, the combined bolt 6 is slidably engaged inside the combined connecting ring, and the fixing nut 601 is rotated to tighten it, so as to achieve a stable connection.

[0031] The clamping and positioning structure 5 is responsible for clamping and positioning the chip. The clamping and positioning structure 5 includes a positioning motor 501, a telescopic bidirectional screw 502, a positioning adjustment block 503, a positioning support rod 504, and a clamping plate 505. The positioning motor 501 is fixedly installed at one end of the height connecting frame 405, serving as the main power source in the clamping and positioning structure 5. The telescopic bidirectional screw 502 is fixedly installed at the output end of the positioning motor 501, and its rotation drives the positioning adjustment block 503 to move in opposite directions, matching the telescopic threaded hole inside the positioning adjustment block 503 to achieve smooth thread connection. The positioning adjustment blocks 503 are slidably engaged with the inner sides of the height connecting frame 405. The positioning adjustment blocks 503 have internal telescopic threaded holes that rotatably engage with both ends of the telescopic bidirectional screw 502, allowing for movement towards or away from each other under the drive of the telescopic bidirectional screw 502. The positioning adjustment blocks 503 also have internal telescopic threaded holes that rotatably engage with both ends of the telescopic bidirectional screw 502, thus achieving clamping and releasing functions. One end of the positioning support rod 504 is rotatably connected to the positioning adjustment blocks 503. The other end of 04 is rotatably connected to both ends of the clamping plate 505, allowing it to swing accordingly when the positioning adjustment block 503 moves, thereby changing the distance between the clamping plates 505 to achieve chip clamping and positioning. The clamping plate 505 is used to directly clamp and position the chip. The design of the clamping plate 505 includes anti-slip and anti-scratch features to ensure that the chip is not damaged during clamping. When it is necessary to clamp the chip, the positioning motor 501 is activated. The output end of the positioning motor 501 drives the telescopic bidirectional screw 502 to rotate, which in turn drives the chip through the threaded connection. The positioning adjustment blocks 503 move towards each other within the height connecting frame 405. This movement causes the positioning support rod 504 to swing accordingly, thereby reducing the distance between the clamping plates 505 and clamping the chip. By adjusting the rotation direction and time of the positioning motor 501, the distance between the clamping plates 505 can be precisely controlled to accommodate chips of different sizes. When it is necessary to release the chip, the positioning motor 501 is rotated in the opposite direction, causing the positioning adjustment blocks 503 to move away from each other, thereby increasing the distance between the clamping plates 505 and releasing the chip.

[0032] The foregoing has shown and described the basic principles and main features of the present invention, as well as its advantages. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the present invention. Various changes and modifications can be made to the present invention without departing from its spirit and scope. All such changes and modifications fall within the scope of the present invention as claimed, which is defined by the appended claims and their equivalents.

Claims

1. A quantum chip packaging fixture, comprising an elongation structure (1), characterized in that: The length adjustment structure (1) includes a long side baffle (101), a telescopic long plate (102), a limiting plate (103), and an length adjustment threaded rod (104). A positioning mounting ring is designed on the outer side of the long side baffle (101). The telescopic long plate (102) is clamped onto the upper side of the long side baffle (101). The length adjustment threaded rod is rotatably mounted on one end of the telescopic long plate (102). An length adjustment groove is opened on the inner side of the long side baffle (101). The limiting plate (103) is slidably clamped onto both sides of the inner side of the length adjustment groove. A width adjustment structure (2) is provided at both ends of the length adjustment structure (1). A movable support structure (3) is installed between the length adjustment structures (1). The movable support structure (3) includes an I-beam roller. The structure comprises a wheel (301), a damping connecting block (302), a support sleeve (303), and an extension support plate (304). The I-beam roller is installed inside the length adjustment groove. The damping connecting block (302) is located on one side of the I-beam roller (301). The support sleeve (303) is installed on the other side of one end of the damping connecting block (302). The extension support plate (304) is located on one side of the other end of the damping connecting block (302). The width adjustment structure (2) includes a wide-side baffle (201), a bidirectional threaded rod (202), a width adjustment telescopic rod (203), a driven bevel gear (204), and a width adjustment bevel gear (205). The wide-side baffle (201) has a mounting positioning hole on its outer side. The bidirectional threaded rod... (202) Rotary latching is engaged inside the wide-side baffle (201). The width-adjusting telescopic rod (203) is respectively installed at both ends of the wide-side baffle (201). The driven bevel gear (204) and the bidirectional threaded rod (202) are fixedly connected to each other. The width-adjusting bevel gear (205) is set on one side of the driven bevel gear (204). The upper surface of the wide-side baffle (201) is provided with a storage adjustment groove. The upper side of the width-adjusting structure (2) is designed with a fixing structure (4). The inner side of the fixing structure (4) is provided with a clamping and positioning structure (5). The outer side of the fixing structure (4) is fitted with a combination bolt (6). The fixing structure (4) includes a lifting motor (401), a lifting mirror screw (402), and a mirror. The components include a slider (403), a mirror support rod (404), and a height connecting frame (405). The lifting motor (401) is embedded in one end of the storage adjustment slot. The lifting mirror screw (402) is fixedly installed at the output end of the lifting motor (401). The mirror slider (403) is slidably engaged with both sides of the inside of the storage adjustment slot. A mirror threaded hole is provided inside the mirror slider (403), and the mirror threaded hole is threadedly connected to the lifting mirror screw (402). One end of the mirror support rod (404) is rotatably connected to the mirror slider (403), and the other end of the mirror support rod (404) is rotatably connected to both ends of the height support frame.The outer side of the height connecting frame (405) is designed with a combined connecting ring, and the combined bolt (6) is slidably engaged inside the combined connecting ring. One end of the combined bolt (6) is threadedly connected to a fixing nut (601).

2. The quantum chip packaging fixture according to claim 1, characterized in that: The inner side of the long side baffle (101) is provided with a limiting groove, and the telescopic long plate (102) is slidably engaged in the interior of the limiting groove. The inner surface of the long side baffle (101) and the inner side of the long side baffle (101) are in the same plane. One end of the long side baffle (101) is provided with a connecting block, and one side of the connecting block is provided with a rotating mounting hole. The length-adjusting threaded rod (104) is rotatably engaged in the interior of the rotating mounting hole. Both ends of the long side baffle (101) are provided with length-adjusting threaded grooves, and the length-adjusting threaded grooves and the length-adjusting threaded rod (104) are mutually rotatably engaged.

3. The quantum chip packaging fixture according to claim 2, characterized in that: The two sides of the I-beam roller (301) are slidably engaged with the length adjustment groove, the center of the I-beam roller (301) is slidably engaged with the limiting plate (103), one end of the support frame (303) is fixedly welded to the damping connecting block (302), the extension support plate (304) is slidably engaged inside the support frame (303), the upper surface of the extension support plate (304) is in the same plane as the upper surface of the support frame (303), and one end of the extension support plate (304) is fixedly connected to the damping connecting block (302).

4. The quantum chip packaging fixture according to claim 3, characterized in that: The wide-side baffle (201) is provided with an adjustment slot inside, which is slidably engaged with the support frame (303). The wide-side baffle (201) is provided with a width adjustment hole inside, and the bidirectional threaded rod (202) is rotatably engaged with the inside of the width adjustment hole. The width adjustment telescopic rod (203) is slidably engaged with the inside of the width adjustment hole. The width adjustment telescopic rod (203) is provided with a width adjustment threaded hole inside, and the width adjustment threaded hole and the bidirectional threaded rod (202) are rotatably engaged with each other. A drive mounting hole is provided on one side of the width adjustment hole, and the width adjustment bevel gear (205) is rotatably engaged with the inside of the drive mounting hole. A width adjustment motor (206) is fixedly installed on the outside of the width adjustment baffle, and the output end of the width adjustment motor (206) is fixedly connected with the width adjustment bevel gear (205).

5. The quantum chip packaging fixture according to claim 4, characterized in that: The clamping and positioning structure (5) includes a positioning motor (501), a telescopic bidirectional screw (502), a positioning adjustment block (503), a positioning support rod (504), and a clamping plate (505). The positioning motor (501) is fixedly installed at one end of the height connecting frame (405). The telescopic bidirectional screw (502) is fixedly installed at the output end of the positioning motor (501). The positioning adjustment block (503) is slidably engaged with the two sides inside the height connecting frame (405). The positioning adjustment block (503) has a telescopic threaded hole inside. The telescopic threaded hole is rotatably engaged with both ends of the telescopic bidirectional screw (502). One end of the positioning support rod (504) is rotatably connected to the positioning adjustment block (503). The other end of the positioning support rod (504) is rotatably connected to both ends of the clamping plate (505).

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