An electronic device

Abstract

Embodiments of the present application provide an electronic device, comprising a first sound emitting module and a second sound emitting module located in a shell. The first sound emitting module comprises a first diaphragm and a shell surrounding the first diaphragm, and the shell and the first diaphragm jointly form a sound cavity. The second sound emitting module has a second diaphragm, one side of the second diaphragm communicates with the outside of the shell, and the other side communicates with the inside of the shell. The first sound emitting module further comprises a phase adjusting member, which is used to radiate sound waves in the sound cavity to the inside of the shell and adjust the phase of the sound waves radiated to the inside of the shell to be opposite to the phase of the sound waves in the sound cavity, so that the phase of the sound waves radiated by the sound cavity to the inside of the shell is opposite to the phase of the sound waves radiated by the second diaphragm to the inside of the shell. In this way, the two sound waves with opposite phases can be mutually offset in the inside of the shell, which can effectively weaken the sound wave intensity in the inside of the shell, reduce or avoid resonance of the shell of the electronic device, and effectively reduce or avoid vibration of the shell of the electronic device.

Description

Technical Field

[0001] This application relates to the field of loudspeaker technology, and more particularly to an electronic device. Background Technology

[0002] With the miniaturization of mobile portable devices, the internal space of electronic devices is becoming increasingly compact, resulting in less room for the arrangement of internal components. Taking speakers in electronic devices as an example, as electronic devices become smaller, the cavity volume of the speaker module also decreases. An excessively small cavity volume in the speaker module can exert a greater elastic constraint on the diaphragm during low-frequency vibration, leading to poor low-frequency extension and affecting overall low-frequency performance.

[0003] Electronic devices typically include two speaker modules. To extend low-frequency response, the rear cavity of the speaker module at the top of the device is often designed to be open, connecting it to the enclosure of the electronic device to increase the volume of the speaker's rear cavity. This reduces the elastic constraint on the speaker module's diaphragm during low-frequency vibration, thus achieving extended low-frequency response.

[0004] However, the sound waves generated by the rear-cavity open speaker module will radiate into the cavity of the electronic device, which can easily cause the outer shell of the electronic device to resonate due to the sound waves inside the cavity. This can make users clearly feel the vibration of the outer shell of the electronic device, thus affecting the user experience. Summary of the Invention

[0005] This application provides an electronic device to solve the problem that in existing electronic devices, sound waves radiated from the speaker module into the housing can cause the housing to resonate, resulting in significant vibration of the electronic device and reducing the user experience.

[0006] A first aspect of this application provides an electronic device, including a housing and a first sound-emitting module and a second sound-emitting module located within the housing;

[0007] The first sound-generating module includes a first diaphragm and a shell surrounding the outer periphery of the first diaphragm. One side of the first diaphragm communicates with the outside of the shell, and the other side of the first diaphragm communicates with the inside of the shell. The shell and the first diaphragm together form a sound cavity.

[0008] The second sound-emitting module has a second diaphragm, one side of which communicates with the outside of the housing, and the other side of which communicates with the inside of the housing;

[0009] The first sound-generating module further includes a phase adjustment component, which is located at the end of the housing opposite to the first diaphragm;

[0010] The phase adjustment element is used to radiate the sound waves in the acoustic cavity to the interior of the outer shell, and to adjust the phase of the sound waves radiated to the interior of the outer shell to be opposite to the phase of the sound waves in the acoustic cavity.

[0011] This application incorporates a phase adjustment component in the first sound-emitting module. By adjusting the phase of the sound waves within the acoustic cavity, the phase of the sound waves radiated from the first sound-emitting module to the interior of the housing is made opposite to the phase of the sound waves radiated from the second sound-emitting module to the interior of the housing. This allows the two opposite sound wave phases to cancel each other out inside the housing, effectively reducing the intensity of the sound waves inside the housing. This reduces or prevents resonance in the electronic device's housing caused by internal sound waves, thereby effectively reducing or preventing vibration of the electronic device's housing and improving the user experience.

[0012] In one possible implementation, the phase adjustment element forms a resonator with the acoustic cavity, the resonator having a resonant frequency of Fb, and the phase of the sound waves radiated by the phase adjustment element in the frequency range of 0.4Fb to 1.5Fb is reversed.

[0013] In one possible implementation, the phase adjustment element includes a third diaphragm, and the housing has an opening at one end opposite to the first diaphragm, the third diaphragm being located in the opening and flexibly connected to the inner wall of the opening.

[0014] In one possible implementation, the third diaphragm satisfies the following formula:

[0015]

[0016] Wherein, Mr is the mass of the third diaphragm, and Cb is the equivalent compliance of the air inside the acoustic cavity;

[0017] The Cb satisfies the following formula:

[0018]

[0019] Wherein, Vb is the volume of the acoustic cavity, ρ is the air density, C is the air speed of sound, and Sr is the vibration area of ​​the third diaphragm.

[0020] In one possible implementation, the mass of the third diaphragm is 0.05g to 1g.

[0021] In one possible implementation, the phase adjustment element further includes a folded ring, through which the third diaphragm is flexibly connected to the inner wall of the opening.

[0022] In one possible implementation, the phase adjustment element includes a phase inverter tube, one end of which is connected to the housing and communicates with the acoustic cavity, and the other end of which is connected to the interior of the housing.

[0023] In one possible implementation, the phase inverter satisfies the following formula:

[0024]

[0025] Wherein, Mp is the mass of the air in the phase inverter, and Cb is the equivalent compliance of the air in the acoustic cavity;

[0026] The Mp satisfies the following formula:

[0027] Mp=ρ(LSp)

[0028] The Cb satisfies the following formula:

[0029]

[0030] Wherein, ρ is the air density, L is the length of the phase inverter, Vb is the volume of the acoustic cavity, C is the air velocity, and Sp is the cross-sectional area of ​​the phase inverter.

[0031] In one possible implementation, the length of the phase inverter is 5mm to 50mm.

[0032] In one possible implementation, the cross-sectional area of ​​the phase inverter is 0.3 mm². 2 ~3mm 2 .

[0033] In one possible implementation, the acoustic cavity volume is 0.2 cm³. 3 ~2cm 3 .

[0034] In one possible implementation, the housing has two sets of sound outlets, and the first diaphragm communicates with the outside of the housing through one of the two sets of sound outlets;

[0035] The second diaphragm communicates with the outside of the housing through another of the two sets of sound outlets.

[0036] In one possible implementation, the housing of the electronic device includes a rear cover, a sidewall surrounding the rear cover, and a display screen covering the sidewall.

[0037] One of the two sets of sound outlets is located between the display screen and the side wall, and the other of the two sets of sound outlets is located on the side wall, with the two sets of sound outlets located at opposite ends of the display screen.

[0038] In one possible implementation, the housing has a set of sound outlets, through which both the first diaphragm and the second diaphragm communicate with the outside of the housing.

[0039] In one possible implementation, the housing of the electronic device includes a rear cover, a sidewall surrounding the rear cover, and a display screen covering the sidewall.

[0040] The set of sound outlets is located on the side wall, and the interior of the housing also has a front cavity, which is connected to the set of sound outlets. The first diaphragm and the second diaphragm are connected to the sound outlets through the front cavity.

[0041] In one possible implementation, the first sound-generating module further includes a first magnetic circuit assembly, a first vibration assembly, and a first support;

[0042] The first bracket is connected to the outer shell, and the outer edge of the first diaphragm is connected to one end of the first bracket through a first suspension edge;

[0043] The first vibration component includes a first voice coil and a first voice coil skeleton. One end of the first voice coil skeleton is connected to the first diaphragm, and the first voice coil is sleeved on the other end of the first voice coil skeleton. At least a portion of the first voice coil and the first voice coil skeleton are located within the magnetic field of the first magnetic circuit component.

[0044] In one possible implementation, the first magnetic circuit assembly includes a first magnet, a first magnetic sheet, and a first U-shaped iron.

[0045] The first magnet and the first magnetic sheet are stacked on the bottom wall of the first U-shaped iron, and at least part of the first voice coil and the first voice coil frame are located between the first magnetic sheet and the inner sidewall of the first U-shaped iron.

[0046] In one possible implementation, the second sound-generating module further includes a second magnetic circuit assembly, a second vibration assembly, and a second support.

[0047] The second bracket is connected to the outer shell, and the outer edge of the second diaphragm is connected to one end of the second bracket through the second suspension edge;

[0048] The second vibration component includes a second voice coil and a second voice coil skeleton. One end of the second voice coil skeleton is connected to the second diaphragm, and the second voice coil is sleeved on the other end of the second voice coil skeleton. At least a portion of the second voice coil and the second voice coil skeleton are located within the magnetic field of the second magnetic circuit component.

[0049] The second bracket and the second magnetic circuit assembly are exposed inside the housing so that the interior of the housing serves as the rear cavity of the second sound-emitting module.

[0050] In one possible implementation, the second magnetic circuit assembly includes a second magnet, a second magnetic sheet, and a second U-shaped iron.

[0051] The second magnet and the second magnetic sheet are stacked on the bottom wall of the second U-shaped iron, and at least part of the second voice coil and the second voice coil frame are located between the second magnetic sheet and the inner sidewall of the second U-shaped iron.

[0052] In one possible implementation, the first sound-generating module and the second sound-generating module are arranged opposite to each other, and the front surfaces of the first diaphragm and the second diaphragm communicate with the outside of the housing through the set of sound outlets;

[0053] The front side of the first diaphragm is the side of the first diaphragm that faces away from the magnetic circuit components in the first sound-generating module, and the front side of the second diaphragm is the side of the second diaphragm that faces away from the magnetic circuit components in the second sound-generating module.

[0054] In one possible implementation, the first sound-emitting module and the second sound-emitting module are arranged opposite to each other, and the back surfaces of the first diaphragm and the back surfaces of the second diaphragm communicate with the outside of the housing through the set of sound outlets;

[0055] The back side of the first diaphragm is the side of the first diaphragm facing the magnetic circuit assembly in the first sound-generating module, and the back side of the second diaphragm is the side of the second diaphragm facing the magnetic circuit assembly in the second sound-generating module.

[0056] In one possible implementation, a magnetic circuit assembly is also included, which is shared by the first sound-generating module and the second sound-generating module;

[0057] The first sound-generating module includes a first vibration component and a first support, and the second sound-generating module includes a second vibration component and a second support, wherein the first support and the second support are respectively connected to the outer shell;

[0058] The outer edge of the first diaphragm is connected to one end of the first bracket via a first suspension edge, and the outer edge of the second diaphragm is connected to one end of the second bracket via a second suspension edge;

[0059] The first vibration component includes a first voice coil and a first voice coil skeleton. One end of the first voice coil skeleton is connected to the first diaphragm, and the first voice coil is sleeved on the other end of the first voice coil skeleton. At least a portion of the first voice coil and the first voice coil skeleton are located within the magnetic field of the magnetic circuit component.

[0060] The second vibration component includes a second voice coil and a second voice coil skeleton. One end of the second voice coil skeleton is connected to the second diaphragm, and the second voice coil is sleeved on the other end of the second voice coil skeleton. At least a portion of the second voice coil and the second voice coil skeleton are located within the magnetic field of the magnetic circuit component.

[0061] The second vibration component and the first vibration component are located at opposite ends of the magnetic circuit component.

[0062] A second aspect of this application provides an electronic device, including a housing and a sound-emitting module located within the housing. The sound-emitting module includes a first diaphragm and a shell surrounding the outer periphery of the first diaphragm. One side of the first diaphragm communicates with the outside of the housing, and the other side of the first diaphragm communicates with the inside of the shell. The shell and the first diaphragm together form a sound cavity.

[0063] The sound-generating module further includes a phase adjustment component, which is located at the end of the housing opposite to the first diaphragm.

[0064] The phase adjustment element is used to radiate the sound waves in the acoustic cavity to the interior of the outer shell, and to adjust the phase of the sound waves radiated to the interior of the outer shell to be the same as the phase of the sound waves in the acoustic cavity.

[0065] This application incorporates a phase adjustment component in the sound-generating module. This component can adjust the phase of the sound waves within the acoustic cavity, ensuring that the phase of the sound waves radiated from the sound-generating module to the outside of the housing is opposite to the phase of the sound waves radiated to the inside of the housing after adjustment. The two oppositely phased sound waves are isolated from each other by the housing, effectively reducing or preventing the cancellation of the two oppositely phased sound waves and thus reducing the acoustic short circuit. This effectively improves the sound pressure level of the electronic device.

[0066] In one possible implementation, the phase adjustment element forms a resonator with the acoustic cavity, the resonator having a resonant frequency of Fb, and the acoustic waves radiated by the phase adjustment element in the frequency range of <0.4Fb are in phase.

[0067] In one possible implementation, the phase adjustment element includes a second diaphragm, and the housing has an opening at one end opposite to the first diaphragm, with the second diaphragm located in the opening and flexibly connected to the inner wall of the opening.

[0068] In one possible implementation, the second diaphragm satisfies the following formula:

[0069]

[0070] Wherein, Mr is the mass of the second diaphragm, and Cb is the equivalent compliance of the air inside the acoustic cavity;

[0071] The Cb satisfies the following formula:

[0072]

[0073] Wherein, Vb is the volume of the acoustic cavity, ρ is the air density, C is the air speed of sound, and Sr is the vibration area of ​​the second diaphragm.

[0074] In one possible implementation, the mass of the second diaphragm is 0.05g to 1g.

[0075] In one possible implementation, the phase adjustment element further includes a folded ring, through which the second diaphragm is flexibly connected to the inner wall of the opening.

[0076] In one possible implementation, the phase adjustment element includes a phase inverter tube, one end of which is connected to the housing and communicates with the acoustic cavity, and the other end of which is connected to the interior of the housing.

[0077] In one possible implementation, the phase inverter satisfies the following formula:

[0078]

[0079] Wherein, Mp is the mass of the air in the phase inverter, and Cb is the equivalent compliance of the air in the acoustic cavity;

[0080] The Mp satisfies the following formula:

[0081] Mp=ρ(LSp)

[0082] The Cb satisfies the following formula:

[0083]

[0084] Wherein, ρ is the air density, L is the length of the phase inverter, Vb is the volume of the acoustic cavity, C is the air velocity, and Sp is the cross-sectional area of ​​the phase inverter.

[0085] In one possible implementation, the length of the phase inverter is 5mm to 50mm.

[0086] In one possible implementation, the cross-sectional area of ​​the phase inverter is 0.3 mm². 2 ~3mm 2 .

[0087] In one possible implementation, the acoustic cavity volume is 0.2 cm³. 3 ~2cm 3 .

[0088] In one possible implementation, the housing has a sound outlet, through which the first diaphragm communicates with the outside of the housing.

[0089] In one possible implementation, the sound-generating module further includes a magnetic circuit assembly, a vibration assembly, and a support.

[0090] The bracket is connected to the outer shell, and the outer edge of the first diaphragm is connected to one end of the bracket through a first suspension edge;

[0091] The vibration assembly includes a voice coil and a voice coil skeleton. One end of the voice coil skeleton is connected to the first diaphragm, and the voice coil is sleeved on the other end of the voice coil skeleton. At least a portion of the voice coil and the voice coil skeleton are located within the magnetic field of the magnetic circuit assembly.

[0092] In one possible implementation, the magnetic circuit assembly includes a magnet, a magnetic sheet, and a U-shaped iron.

[0093] The magnet and the magnetic conductive sheet are stacked on the bottom wall of the U-shaped iron, and the voice coil and the voice coil frame are at least partially located between the magnetic conductive sheet and the inner sidewall of the U-shaped iron. Attached Figure Description

[0094] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0095] Figure 2 An exploded view of an electronic device provided in an embodiment of this application;

[0096] Figure 3 This is a schematic diagram of an electronic device without a display screen, provided in an embodiment of this application.

[0097] Figure 4 A working circuit diagram of a sound-generating module provided in an embodiment of this application;

[0098] Figure 5 This is a schematic diagram of the structure of a sound-generating module in an electronic device in related technologies;

[0099] Figure 6 This is a schematic diagram of the structure of the first type of sound-generating module provided in the embodiments of this application;

[0100] Figure 7 A phase curve diagram of a phase adjustment device provided in an embodiment of this application;

[0101] Figure 8 This is a frequency response curve of a phase adjustment device according to an embodiment of this application;

[0102] Figure 9 This is a schematic diagram of the structure of the second type of sound-generating module provided in the embodiments of this application;

[0103] Figure 10 for Figure 6 A magnified view of region A in the middle;

[0104] Figure 11 for Figure 6 A magnified view of region B in the middle;

[0105] Figure 12 This is a schematic diagram of the structure of the third type of sound-generating module provided in the embodiments of this application;

[0106] Figure 13 for Figure 12 A magnified view of region C in the middle;

[0107] Figure 14 This is a schematic diagram of the structure of the fourth sound-generating module provided in the embodiments of this application;

[0108] Figure 15 for Figure 14 A magnified view of region D in the middle;

[0109] Figure 16 This is a schematic diagram of the structure of another electronic device provided in an embodiment of this application;

[0110] Figure 17 A phase curve diagram of another phase adjustment device provided in the embodiments of this application;

[0111] Figure 18 for Figure 16 A magnified view of region E in the middle;

[0112] Figure 19 This is a schematic diagram of another phase adjustment component provided in an embodiment of this application;

[0113] Figure 20 for Figure 19 A magnified view of region F in the middle;

[0114] Figure 21 A comparison diagram of the frequency response curves of the sound-generating module provided in the embodiments of this application and the sound-generating module with a closed rear cavity in the related art;

[0115] Figure 22A comparison chart of the frequency response curves of the sound-emitting module provided in this application embodiment radiating to the outside of the housing and the sound-emitting module with a closed rear cavity in related technologies radiating to the outside of the housing.

[0116] Explanation of reference numerals in the attached figures:

[0117] 100 - Electronic devices;

[0118] 110 - Outer casing; 111 - Receiving cavity; 112 - Back cover; 113 - Side wall; 114 - Display screen;

[0119] 115, 115a, 115b, 115c - Sound outlet; 116a, 116b - Sound transmission cavity; 117 - Front cavity;

[0120] 120 - First sound-producing module; 121 - First diaphragm; 122 - Housing; 1221 - Acoustic cavity;

[0121] 123-Phase adjustment element; 1231-Third diaphragm; 1232-Boom; 1233-Phase inverter;

[0122] 124-First magnetic circuit assembly; 1241-First magnet; 1242-First magnetic conductive sheet; 1243-First U-shaped iron;

[0123] 125a, 125b - First resonant assembly; 1251a, 1251b - First voice coil; 1252a, 1252b - First voice coil frame;

[0124] 126a, 126b - First support; 127 - First suspension edge;

[0125] 130 - Second sound-generating module; 131 - Second diaphragm; 132 - Second magnetic circuit assembly;

[0126] 1321 - Second magnet; 1322 - Second magnetic sheet; 1323 - Second U-shaped iron;

[0127] 133a, 133b - Second resonant assembly; 1331a, 1331b - Second voice coil; 1332a, 1332b - Second voice coil frame;

[0128] 134a, 134b - Second bracket; 135 - Second suspension edge; 136 - Magnetic circuit assembly;

[0129] 140 - Battery; 150 - Circuit board; 160 - Antenna; 170 - Camera module; 180 - Signal processor; 190 - Power amplifier;

[0130] 200 - Electronic devices;

[0131] 210 - Outer shell; 211 - Receiving cavity; 212 - Back cover; 213 - Side wall; 214 - Display screen; 215 - Sound outlet;

[0132] 220 - Sound-generating module; 221 - First diaphragm; 222 - Housing; 2221 - Acoustic cavity;

[0133] 223-Phase adjustment element; 2231-Second diaphragm; 2232-Boom; 2233-Phase inverter;

[0134] 224-Magnetic circuit assembly; 2241-Magnetic steel; 2242-Magnetic conductive sheet; 2243-U-iron;

[0135] 225 - Vibrating assembly; 2251 - Voice coil; 2252 - Voice coil frame;

[0136] 226 - Bracket; 227 - First suspension edge. Detailed Implementation

[0137] The terminology used in the implementation section of this application is for the purpose of explaining specific embodiments of this application only, and is not intended to limit this application.

[0138] This application provides an electronic device, which can be any device with a sound-emitting device, such as a mobile phone, television, smart screen, laptop computer, tablet computer, ultra-mobile personal computer (UMPC), personal digital assistant (PDA), handheld computer, walkie-talkie, netbook, etc. In this application embodiment, a mobile phone will be used as an example for description.

[0139] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Figure 2 This is an exploded view of an electronic device provided in an embodiment of this application. Figure 3 This is a schematic diagram of an electronic device without a display screen, provided in an embodiment of this application. Figure 4 This is a working circuit diagram of a sound-generating module provided in an embodiment of this application.

[0140] See Figure 1 and Figure 2 As shown, the electronic device 100 may include a housing 110 and a first sound-emitting module 120 and a second sound-emitting module 130 located within the housing 110. For example, the housing 110 may have a receiving cavity 111, and the first sound-emitting module 120 and the second sound-emitting module 130 may be disposed within the receiving cavity 111. See, for example, [link to documentation]. Figure 2As shown, the housing 110 may include a rear cover 112, a side wall 113 surrounding the rear cover 112, and a display screen 114 covering the side wall 113. The rear cover 112, side wall 113, and display screen 114 can together form a receiving cavity 111. For example, the side wall 113 may be the mid-frame of the electronic device 100, and the display screen 114 may be used to display videos, photos, etc. Figure 3 As shown, a battery 140, a circuit board 150, an antenna 160, and a camera module 170 may also be installed inside the housing 110 of the electronic device 100 to realize the full functionality of the electronic device 100.

[0141] The first sound-emitting module 120 and the second sound-emitting module 130 can be speaker modules in the electronic device 100, which can convert electrical energy into sound signals so that the electronic device 100 can play sound. For example, during the operation of the electronic device 100, the two sound-emitting modules can work simultaneously, or only one sound-emitting module can work. For example, combined with Figure 4 As shown, the first sound module 120 can be electrically connected to the right channel of the electronic device 100, and the first sound module 120 can receive the right channel signal. The second sound module 130 can be electrically connected to the left channel, and the second sound module 130 can receive the left channel signal. The sound modules (first sound module 120 and second sound module 130) and the channel signals can be electrically connected through the signal processor 180 and the power amplifier 190. When an audio signal is input, it can first be processed by the signal processor 180, then by the power amplifier 190, and then transmitted to the sound module to emit sound.

[0142] For example, when the electronic device 100 is playing videos, music, or playing games, both sound modules can work simultaneously, and sound can be radiated to the outside of the casing 110 through both sound modules. In this case, it can be understood that the electronic device 100 is playing through external speakers. Alternatively, when the electronic device 100 is answering a phone call or listening to voice messages through the handset, only one sound module in the electronic device 100 can work. In this case, it can be understood that the electronic device 100 is playing through bass.

[0143] With the miniaturization of electronic devices, the internal space of these devices has become increasingly compact. This has resulted in a reduction in the space available for housing the sound-generating module within the device's casing, significantly decreasing the cavity volume of the sound-generating module. An excessively small cavity volume in the sound-generating module can exert significant elastic constraints on the speaker diaphragm during low-frequency vibrations, leading to poor low-frequency extension and impacting overall low-frequency performance.

[0144] Figure 5 This is a schematic diagram of the structure of a sound-generating module in an electronic device in related technologies.

[0145] Currently, in order to extend the low-frequency range, in related technologies, see [link to relevant technologies]. Figure 5 As shown, typically, the rear cavity of one of the sound-generating modules in electronic device 1 is designed to be open, while the rear cavity of the other sound-generating module is designed to be closed. For example, in the figure, the first sound-generating module 20 can be configured as a closed rear cavity structure, and the second sound-generating module 30 can be configured as an open rear cavity structure. The rear cavity of the open-rear-cavity second sound-generating module 30 communicates with the receiving cavity 11 of the outer casing 10 of electronic device 1, which can increase the rear cavity volume of the sound-generating modules. This can reduce the elastic constraint force on the diaphragm of the speaker module during low-frequency vibration, thereby achieving an extended low-frequency response.

[0146] However, the sound waves generated by the rear-cavity open speaker module will radiate into the cavity of the electronic device, which can easily cause the outer shell of the electronic device to resonate due to the sound waves inside the cavity. This allows users to clearly feel the vibration of the electronic device's casing, affecting the user experience.

[0147] To address these issues, researchers devised a method to improve the sound-emitting module of electronic devices. By incorporating a phase-adjusting component into the first sound-emitting module, the phase of the sound waves within the acoustic cavity can be adjusted. This allows the phase of the sound waves radiated from the first sound-emitting module into the casing to be opposite to the phase of the sound waves radiated from the second sound-emitting module into the casing. This allows the two opposite sound wave phases to cancel each other out within the casing, effectively reducing the intensity of the sound waves inside the casing. This reduces or prevents resonance caused by internal sound waves in the electronic device's casing, thereby effectively reducing or preventing casing vibration and improving the user experience.

[0148] The electronic device provided in the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0149] Figure 6 This is a schematic diagram of the structure of the first sound-generating module provided in the embodiments of this application.

[0150] See Figure 6 As shown, the first sound-generating module 120 in the electronic device 100 may include a first diaphragm 121 and a housing 122 surrounding the first diaphragm 121. One side of the first diaphragm 121 may communicate with the outside of the housing 110. For example, the first diaphragm 121 and the housing 122 may be flexibly connected, and the first diaphragm 121 may reciprocate relative to the housing 122. During the vibration of the first diaphragm 121, the air located on both sides of the first diaphragm 121 may vibrate, thereby generating sound waves on both sides of the first diaphragm 121. The sound waves generated on the side of the first diaphragm 121 that communicates with the outside of the housing 110 may radiate to the outside of the housing 110 for the user to hear.

[0151] The other side of the first diaphragm 121 can communicate with the interior of the housing 122, and the first diaphragm 121 and the housing 122 can jointly form a sound cavity 1221. When the first diaphragm 121 vibrates, the sound waves generated by the vibration of the side of the first diaphragm 121 that communicates with the interior of the housing 122 can radiate into the sound cavity 1221.

[0152] The second sound-generating module 130 may have a second diaphragm 131. One side of the second diaphragm 131 may communicate with the outside of the housing 110, and the other side of the second diaphragm 131 may communicate with the inside of the housing 110. The second diaphragm 131 can reciprocate to drive the air located on both sides of the second diaphragm 131 to vibrate, thereby generating sound waves on both sides of the second diaphragm 131. The sound waves generated on the side of the second diaphragm 131 that communicates with the outside of the housing 110 can radiate to the outside of the housing 110 for the user to hear. The sound waves generated on the other side of the second diaphragm 131 can radiate to the inside of the housing 110 to propagate within the receiving cavity 111 of the housing 110.

[0153] The first sound-emitting module 120 may further include a phase adjustment member 123. The phase adjustment member 123 may be located on the housing 122 at one end opposite to the first diaphragm 121. The phase adjustment member 123 may be used to radiate the sound waves in the acoustic cavity 1221 to the interior of the housing 110, and may adjust the phase of the sound waves radiated to the interior of the housing 110 so that the phase of the sound waves radiated to the interior of the housing 110 is opposite to the phase of the sound waves in the acoustic cavity 1221, so that the phase of the sound waves radiated from the acoustic cavity 1221 to the interior of the housing 110 is opposite to the phase of the sound waves radiated from the second diaphragm 131 to the interior of the housing 110.

[0154] During the operation of the sound-generating modules (first sound-generating module 120 and second sound-generating module 130), the vibration of the diaphragm (first diaphragm 121 and second diaphragm 131) can drive the air located on both sides of the diaphragm to vibrate, thereby generating sound waves. The sound waves located on both sides of the diaphragm are out of phase. For example, see [link to relevant documentation]. Figure 6 As shown, the phase of the sound wave generated by the side of the first diaphragm 121 that communicates with the outside of the outer shell 110 can be designated as positive, while the phase of the sound wave generated by the side of the first diaphragm 121 that communicates with the inside of the outer shell 122 can be designated as negative, that is, the phase of the sound wave inside the acoustic cavity 1221 is negative. Correspondingly, the phase of the sound wave generated by the side of the second diaphragm 131 that communicates with the outer shell 110 is also positive, while the phase of the sound wave generated by the side of the second diaphragm 131 that communicates with the inside of the outer shell 110 is negative.

[0155] The phase adjustment component 123 can radiate sound waves from the acoustic cavity 1221 to the interior of the housing 110, and can adjust the phase of the sound waves so that the phase of the sound waves radiated into the housing 110 is opposite to the phase of the sound waves in the acoustic cavity 1221. That is, the phase of the sound waves radiated from the acoustic cavity 1221 to the interior of the housing 110 changes from negative to positive after being adjusted by the phase adjustment component 123. At this time, the sound waves adjusted by the phase adjustment component 123 and radiated into the interior of the housing 110 are opposite in phase to the sound waves radiated from the second diaphragm 131 to the interior of the housing 110. The two sound waves with opposite phases can cancel each other out inside the housing 110, which can effectively reduce the intensity of the sound waves inside the housing 110, thereby effectively reducing or avoiding vibration of the housing 110.

[0156] It should be noted that the phase adjustment component 123 does not necessarily have to completely reverse the sound waves in the acoustic cavity 1221. It is sufficient to make the phases of the two sound waves in the outer shell 110 approximately opposite, so that the phases of the two sound waves can cancel each other out, thereby reducing the intensity of the sound waves inside the outer shell 110 and thus weakening the vibration of the outer shell 110.

[0157] Compared to the sound-emitting modules in electronic devices in related technologies, the embodiments of this application, by providing a phase adjustment member 123 in the first sound-emitting module 120, adjust the phase of the sound waves within the acoustic cavity 1221 through the phase adjustment member 123. This allows the phase of the sound waves radiated from the first sound-emitting module 120 to the interior of the housing 110 to be opposite to the phase of the sound waves radiated from the second sound-emitting module 130 to the interior of the housing 110. This allows the two opposite sound wave phases to cancel each other out inside the housing 110, effectively reducing the intensity of the sound waves inside the housing 110. This reduces or prevents resonance of the housing 110 of the electronic device 100 due to internal sound waves, thereby effectively reducing or preventing vibration of the housing 110 of the electronic device 100 and improving the user experience.

[0158] In this embodiment, the phase adjustment member 123 and the acoustic cavity 1221 can form a resonator. The resonant frequency of the resonator can be Fb, and the phase adjustment member 123 can reverse the phase of the radiated sound waves in the frequency range of 0.4Fb to 1.5Fb, so that the phase of the sound waves in the acoustic cavity 1221 is opposite to the phase of the sound waves radiated into the housing 110. For example, the value of Fb can be 100Hz to 900Hz. For example, taking Fb as 700Hz, 0.4Fb equals 280Hz, and 1.5Fb equals 1050Hz. That is, in the frequency range of 280Hz to 1050Hz, the phase of the sound waves radiated by the phase adjustment member 123 can be reversed, so that the phase of the sound waves is reversed from -90° to 90°, thereby making the phase of the sound waves in the acoustic cavity 1221 opposite to the phase of the sound waves radiated into the housing 110.

[0159] Figure 7 A phase curve diagram of a phase adjustment device provided in an embodiment of this application. Figure 8 This is a frequency response curve of a phase adjustment device according to an embodiment of this application.

[0160] For example, see Figure 7 As shown, Figure 7 The curve in the figure represents the change in phase of the sound wave radiated from the phase adjustment element 123 into the housing 110 as a function of frequency. Figure 7 As can be seen, when the operating frequency of the first sound-emitting module 120 is within the frequency range of 0.4Fb to Fb, that is, the operating frequency is 280Hz to 700Hz as shown in the figure, the phase of the sound wave radiated into the housing 110 by the phase adjustment component 123 is between -90° and -180°. When the operating frequency of the first sound-emitting module 120 is within the frequency range of Fb to 1.5Fb, that is, the operating frequency is 700Hz to 1050Hz as shown in the figure, the phase of the sound wave radiated into the housing 110 by the phase adjustment component 123 is between 180° and 90°. That is, within the frequency range of 0.4Fb to 1.5Fb, the phase of the sound wave radiated into the housing 110 by the phase adjustment component 123 is between -90° and 90°, and the phase is reversed.

[0161] Understandably, the closer the operating frequency of the first sound-emitting module 120 is to the resonant frequency Fb of the resonator, the more pronounced the phase reversal effect of the phase adjustment element 123 on the sound wave phase. Conversely, the further the operating frequency of the first sound-emitting module 120 is from the resonant frequency Fb of the resonator, the weaker the phase reversal effect of the phase adjustment element 123 on the sound wave phase. For example, from Figure 7 As can be seen, when the operating frequency of the first sound-emitting module 120 is equal to the resonant frequency Fb of the resonator, the phase adjustment component 123 can adjust the phase of the sound wave by 180°. As the operating frequency moves away from the resonant frequency Fb of the resonator, the phase adjustment effect of the phase adjustment component 123 on the phase of the sound wave gradually weakens, for example, gradually decreasing from 180° to 160°, 140°, 120°, 100°, etc. Overall, the sound waves in the acoustic cavity 1221 and the sound waves radiated into the outer shell 110 are basically out of phase and can be canceled out.

[0162] Conversely, when the operating frequency is <0.4Fb or >1.5Fb, the phase adjustment element 123 has almost no phase reversal effect on the sound wave, that is, the phase of the sound wave in the acoustic cavity 1221 is the same as the phase of the sound wave radiated into the housing 110.

[0163] When the operating frequency of the sound-emitting modules (first sound-emitting module 120 and second sound-emitting module 130) in the electronic device 100 is within the range of 0.4Fb to 1.5Fb, the phase of the sound wave radiated from the first sound-emitting module 120 into the housing 110 is opposite to the phase of the sound wave radiated from the second sound-emitting module 130 into the housing 110. This causes the two sound waves with opposite phases to cancel each other out, effectively reducing the intensity of the sound waves inside the housing 110, thereby effectively reducing or preventing the housing 110 from vibrating.

[0164] See Figure 8 As shown, Figure 8 This is a graph showing the sound pressure level of the sound wave radiated from the phase adjustment element 123 into the housing 110 as a function of frequency. Figure 8 As can be seen, in the frequency range of 700Hz to 1050Hz, the sound pressure level of the sound wave radiated by the phase adjustment element 123 into the housing 110 is relatively high. It can be seen that the closer the operating frequency is to the resonant frequency of the resonator, the higher the sound pressure level of the sound wave generated by the phase adjustment element 123.

[0165] See also Figure 6 As shown, in one possible implementation, the phase adjustment member 123 may include a third diaphragm 1231. The end of the housing 122 opposite to the first diaphragm 121 may have an opening, the third diaphragm 1231 may be located at the opening, and the third diaphragm 1231 may be flexibly connected to the inner wall of the opening. When the sound waves generated in the acoustic cavity 1221 during the vibration of the first diaphragm 121 are transmitted to the third diaphragm 1231, they can drive the third diaphragm 1231 to vibrate. During the vibration of the third diaphragm 1231, it can drive the air inside the housing 110 to vibrate, thereby generating sound waves. Furthermore, the phase of the sound waves inside the housing 110 is opposite to the phase of the sound waves inside the acoustic cavity 1221.

[0166] For example, when the first diaphragm 121 vibrates, the sound wave phase generated outside the housing 110 can be positive, while the sound wave phase generated inside the acoustic cavity 1221 by the first diaphragm 121 is negative. The sound wave phase generated inside the housing 110 by the third diaphragm 1231 is also positive. Correspondingly, the sound wave phase generated outside the housing 110 by the second diaphragm 131 is also positive, while the sound wave phase generated inside the housing 110 by the second diaphragm 131 is negative.

[0167] In this way, the phase of the sound wave radiated into the housing 110 after being adjusted by the third diaphragm 1231 is opposite to the phase of the sound wave generated by the first diaphragm 121 inside the housing 110. As a result, the phase of the sound wave generated by the first sound-emitting module 120 inside the housing 110 is opposite to the phase of the sound wave generated by the second sound-emitting module 130 inside the housing 110. The two sound waves with opposite phases can cancel each other out inside the housing 110, thereby effectively reducing the sound wave intensity inside the housing 110 and effectively reducing or avoiding vibration of the housing 110.

[0168] In this embodiment, the third diaphragm 1231 can satisfy the following formula:

[0169]

[0170] Where Mr is the mass of the third diaphragm 1231, Cb is the equivalent compliance of the air inside the acoustic cavity 1221, and Cb can satisfy the following formula:

[0171]

[0172] Where Vb is the volume of acoustic cavity 1221, and ρ is the air density, which can be 1.29 kg / m³. 3 C is the speed of sound in air, and the value of C can be 340 m / s. Sr is the vibration area of ​​the third diaphragm 1231.

[0173] From the above formulas, it can be concluded that when the phase adjustment element 123 is the third diaphragm 1231, the resonant frequency Fb of the resonator formed by the phase adjustment element 123 and the acoustic cavity 1221 is related to the mass of the third diaphragm 1231, the volume of the acoustic cavity 1221, and the vibration area of ​​the third diaphragm 1231. Therefore, in the specific design process, the resonant frequency Fb of the resonator can be adjusted by adjusting the mass of the third diaphragm 1231, the volume of the acoustic cavity 1221, and the vibration area of ​​the third diaphragm 1231. This allows the resonator to meet the resonance requirements of different frequencies, enabling the phase adjustment element 123 to adjust the phase of sound waves in different frequency bands. Consequently, sound waves of different frequency bands cancel each other out within the housing 122, thereby reducing or avoiding vibration of the outer shell 110.

[0174] For example, in this embodiment, the mass Mr of the third diaphragm 1231 can range from 0.05g to 1g. Specifically, the mass Mr of the third diaphragm 1231 can be 0.05g, 0.5g, or 1g. With the volume Vb of the acoustic cavity 1221 and the vibration area Sr of the third diaphragm 1231 remaining constant in the above formula, adjusting the mass Mr of the third diaphragm 1231 can allow the operating frequency of the sound-generating modules (first sound-generating module 120 and second sound-generating module 130) to be within the frequency range of 0.4Fb to 1.5Fb. Within the frequency range of 0.4Fb to 1.5Fb, the phase adjustment element 123 can reverse the phase of the sound waves in the acoustic cavity 1221, so that the phase of the sound waves radiated into the housing 110 is opposite to the phase of the sound waves in the acoustic cavity 1221. This causes the phases of the sound waves generated by the first sound-emitting module 120 and the second sound-emitting module 130 inside the housing 110 to be opposite and cancel each other out, thereby effectively reducing the intensity of the sound waves inside the housing 110 and reducing or avoiding vibration of the housing 110 of the electronic device 100.

[0175] Understandably, in addition to adjusting the mass Mr of the third diaphragm 1231, the volume of the acoustic cavity 1221 can also be adjusted to ensure that the operating frequency of the sound-generating module is within the frequency range of 0.4Fb to 1.5Fb. For example, the volume Vb of the acoustic cavity 1221 can be 0.2mm. 3 ~2mm 3 For example, the volume Vb of the acoustic cavity 1221 can be 0.2 mm. 3 0.5mm 3 1mm 3 2mm 3 With the mass Mr and vibration area Sr of the third diaphragm 1231 remaining constant in the above formula, the resonant frequency of the resonator can also be adjusted by adjusting the volume Vb of the acoustic cavity 1221, so that the operating frequency of the sound-generating module is within the frequency range of 0.4Fb to 1.5Fb. This allows the phase adjustment component 123 to reverse the phase of the sound waves in the acoustic cavity 1221, thereby causing the sound waves generated by the first sound-generating module 120 and the second sound-generating module 130 inside the housing 110 to have opposite phases, thus canceling each other out and effectively reducing the intensity of the sound waves inside the housing 110, reducing or avoiding vibration of the housing 110 of the electronic device 100.

[0176] See also Figure 6As shown, the phase adjustment component 123 may further include a folded ring 1232, through which one end of the third diaphragm 1231 can be flexibly connected to the inner wall of the opening. The folded ring 1232, also called a suspension edge, has a certain degree of flexibility. During the vibration of the third diaphragm 1231, it can reduce the force between the third diaphragm 1231 and the housing 122, reducing or avoiding the adverse effects of the force between the housing 122 and the third diaphragm 1231 on the vibration of the third diaphragm 1231. Furthermore, the folded ring 1232 can also isolate the air inside the acoustic cavity 1221 from the air inside the housing 110, thus preventing acoustic short circuits. In addition, the folded ring 1232 can provide some support for the third diaphragm 1231, reducing or avoiding wobbling of the third diaphragm 1231 during vibration, which is beneficial to improving the stability of the third diaphragm vibration.

[0177] Figure 9 This is a schematic diagram of the structure of the second type of sound-generating module provided in the embodiments of this application.

[0178] In another possible implementation, see Figure 9 As shown, the phase adjustment component 123 may include a phase inverter 1233. One end of the phase inverter 1233 may be connected to the housing 122 and communicate with the acoustic cavity 1221, while the other end of the phase inverter 1233 may communicate with the interior of the outer casing 110. When the sound wave generated in the acoustic cavity 1221 during the vibration of the first diaphragm 121 is transmitted to the phase inverter 1233, the sound wave can undergo phase reversal within the phase inverter 1233 and radiate to the interior of the outer casing 110 through the phase inverter 1233.

[0179] For example, when the first diaphragm 121 vibrates, the sound wave phase generated outside the housing 110 can be positive, while the sound wave phase generated inside the acoustic cavity 1221 by the first diaphragm 121 is negative. The sound wave phase radiated into the housing 110 after being reversed by the phase inverter 1233 inside the acoustic cavity 1221 is positive. Correspondingly, the sound wave phase generated outside the housing 110 by the second diaphragm 131 is also positive, while the sound wave phase generated inside the housing 110 by the second diaphragm 131 is negative.

[0180] The sound waves radiated into the housing 110 after being reversed by the phase inverter 1233 are out of phase with the sound waves generated by the second diaphragm 131 inside the housing 110. This causes the sound waves generated by the first sound-emitting module 120 inside the housing 110 to be out of phase with the sound waves generated by the second sound-emitting module 130 inside the housing 110. The two sound waves with opposite phases can cancel each other out inside the housing 110, thereby effectively reducing the sound wave intensity inside the housing 110 and effectively reducing or preventing the housing 110 from vibrating.

[0181] In this embodiment, the phase inverter 1233 can satisfy the following formula:

[0182]

[0183] Where Mp is the mass of the air in the phase inverter 1233, and Cb is the equivalent compliance of the air in the acoustic cavity 1221.

[0184] Mp can satisfy the following formula:

[0185] Mp=ρ(LSp)

[0186] Cb can satisfy the following formula:

[0187]

[0188] Where ρ is the air density, and the value of ρ can be 1.29 kg / m³. 3 L is the length of the phase inverter 1233, Sp is the cross-sectional area of ​​the phase inverter 1233, Vb is the volume of the acoustic cavity 1221, and C is the air velocity, which can be 340 m / s.

[0189] From the above formulas, it can be concluded that when the phase adjustment element 123 is a phase inverter 1233, the resonant frequency Fb of the resonator formed by the phase adjustment element 123 and the acoustic cavity 1221 is related to the length of the phase inverter 1233, the volume of the acoustic cavity 1221, and the cross-sectional area of ​​the phase inverter 1233. Therefore, in the specific design process, the resonant frequency Fb of the resonator can be adjusted by adjusting the length and cross-sectional area of ​​the phase inverter 1233 and the volume of the acoustic cavity 1221, so that the resonator can meet the resonance requirements of different frequencies, and the phase adjustment element 123 can adjust the phase of sound waves in different frequency bands, so that sound waves in different frequency bands cancel each other out in the housing 122, thereby reducing or avoiding vibration of the outer shell 110.

[0190] For example, in this embodiment, the length L of the phase inverter 1233 can range from 5mm to 50mm. For instance, the length L of the phase inverter 1233 can be 5mm, 10mm, 20mm, or 50mm. With the volume Vb of the acoustic cavity 1221 and the cross-sectional area Sp of the phase inverter 1233 remaining constant in the above formula, by adjusting the length L of the phase inverter 2233, the operating frequency of the sound-emitting module can be made within the frequency range of 0.4Fb to 1.5Fb. This allows the phase inverter 2233 to reverse the phase of the sound waves within the acoustic cavity 1221, making the phases of the sound waves generated by the first sound-emitting module 120 and the second sound-emitting module 130 inside the housing 110 opposite. This effectively reduces the intensity of the sound waves inside the housing 110, reducing or preventing vibration of the housing 110 of the electronic device 100.

[0191] Understandably, besides adjusting the length L of the bass reflex tube 1233, the cross-sectional area Sp of the bass reflex tube 1233 can also be adjusted to ensure that the operating frequency of the sound-generating module is within the frequency range of 0.4Fb to 1.5Fb. For example, the cross-sectional area Sp of the bass reflex tube 1233 can be 0.3mm². 2 ~3mm 2 For example, the cross-sectional area Sp of the phase inverter 1233 can be 0.3 mm². 2 1mm 2 2mm 2 3mm 2 With the length L of the phase inverter 1233 and the volume Vb of the acoustic cavity 1221 remaining unchanged in the above formula, the resonant frequency Fb of the resonator formed by the phase inverter 1233 and the acoustic cavity 1221 can also be adjusted by adjusting the cross-sectional area Sp of the phase inverter 1233. This allows the operating frequency of the sound-emitting module to be within the frequency range of 0.4Fb to 1.5Fb, so that the phase adjustment component 123 can reverse the phase of the sound wave in the acoustic cavity 1221. This results in the sound waves generated by the first sound-emitting module 120 and the second sound-emitting module 130 having opposite phases inside the housing 110, thereby effectively reducing the intensity of the sound waves inside the housing 110 and reducing or avoiding vibration of the housing 110 of the electronic device 100.

[0192] Alternatively, the operating frequency of the sound-generating module can be kept within the frequency range of 0.4 Fb to 1.5 Fb by adjusting the volume Vb of the acoustic cavity 1221. For example, the volume Vb of the acoustic cavity 1221 can be 0.2 cm². 3 ~2cm 3 For example, the volume Vb of the acoustic cavity 1221 can be 0.2 cm³. 3 0.5cm 3 1cm 3 2cm 3 By adjusting the volume Vb of the acoustic cavity 1221, the resonant frequency Fb of the resonator can also be adjusted, so that the operating frequency of the sound-emitting module is within the frequency range of 0.4Fb to 1.5Fb. This allows the phase adjustment component 123 to reverse the phase of the sound waves in the acoustic cavity 1221, making the phases of the sound waves generated by the first sound-emitting module 120 and the second sound-emitting module 130 inside the housing 110 opposite. This effectively reduces the intensity of the sound waves inside the housing 110 and reduces or avoids vibration of the housing 110 of the electronic device 100.

[0193] See also Figure 9 As shown, in one possible implementation, the housing 110 of the electronic device 100 may have two sets of sound outlets 115 (e.g., Figure 9The housing has two sound outlets (115a and 115b), wherein the first diaphragm 121 can communicate with the outside of the housing 110 through one of the two sets of sound outlets 115. The second diaphragm 131 can communicate with the outside of the housing 110 through the other set of sound outlets 115. For example, the two sets of sound outlets 115 can be sound outlet 115a and sound outlet 115b, wherein the first diaphragm 121 can communicate with the outside of the housing 110 through sound outlet 115a, and the second diaphragm 131 can communicate with the outside of the housing 110 through sound outlet 115b.

[0194] For example, taking an electronic device 100 as a mobile phone, one of the sound outlets 115 can be an upper sound outlet 115, also known as a handset, which can be used to answer calls and make voice calls. The other sound outlet 115 can be a lower sound outlet 115, also known as a speaker, which can be used to play videos, make video calls, play music, play games, etc. For example, sound outlet 115a can be a lower sound outlet 115, and sound outlet 115b can be an upper sound outlet 115.

[0195] See Figure 9 As shown, the housing 110 of the electronic device 100 may include a rear cover 112, a side wall 113 surrounding the rear cover 112, and a display screen 114 covering the side wall 113. One of the two sets of sound outlets 115 may be located between the display screen 114 and the side wall 113, and the other sound outlet 115 may be located on the side wall 113. The two sets of sound outlets 115 may be located at opposite ends of the display screen 114. For example, sound outlet 115a may be located on the side wall 113 of the electronic device 100, and sound outlet 115b may be located between the display screen 114 and the side wall 113. Furthermore, sound outlet 115a may be located below the display screen 114, and sound outlet 115b may be located above the display screen 114. Here, "above" and "below" refer to the position of the display screen 114 when it is directly facing the user.

[0196] Figure 10 for Figure 6 A magnified view of region A in the middle.

[0197] See Figure 10 As shown, the first sound-generating module 120 may include a first magnetic circuit assembly 124, a first vibration assembly 125a and a first support 126a, wherein the outer edge of the first diaphragm 121 can be connected to one end of the first support 126a through a first suspension edge 127.

[0198] The first resonant assembly 125a may include a first voice coil 1251a and a first voice coil skeleton 1252a. One end of the first voice coil skeleton 1252a may be connected to the first diaphragm 121, and the first voice coil 1251a may be fitted onto the other end of the first voice coil skeleton 1252a. Furthermore, at least a portion of the first voice coil 1251a and the first voice coil skeleton 1252a may be located within the magnetic field of the first magnetic circuit assembly 124. For example, at least a portion of the first voice coil 1251a and the first voice coil skeleton 1252a may be located within the magnetic gap of the first magnetic circuit assembly 124.

[0199] The first bracket 126a can be connected to the housing 110 of the electronic device 100 so that the first sound module 120 can be fixed inside the housing 110 through the first bracket 126a.

[0200] The side of the first diaphragm 121 facing away from the first voice coil skeleton 1252a can be a sound-emitting surface, which can communicate with the outside of the housing 110 through the sound outlet 115a. For example, as shown in the figure, a sound transmission cavity 116a can also be provided inside the housing 110. One end of the sound transmission cavity 116a can be connected to the sound outlet 115a opened on the housing 110, and the other end of the sound transmission cavity 116a can be connected to the first support 126a and communicate with the sound-emitting surface of the first diaphragm 121.

[0201] When an AC audio current signal is input to the first voice coil 1251a, the energized first voice coil 1251a experiences a magnetic force within the magnetic field of the first magnetic circuit assembly 124. Furthermore, the magnitude and direction of this magnetic force change constantly with the magnitude and direction of the current, causing the first voice coil 1251a and the first voice coil frame 1252a to reciprocate. During this reciprocating motion, the first diaphragm 121 is driven to reciprocate as well, causing the diaphragm 121 to vibrate and produce sound (i.e., sound waves). The sound generated on the side of the first diaphragm 121 that communicates with the outer casing 110 can be transmitted through the sound transmission cavity 116a to the sound outlet 115a, and radiated to the outside of the outer casing 110 through the sound outlet 115a for the user to hear. The sound generated by the side of the first diaphragm 121 facing the first voice coil skeleton 1252a can be radiated into the acoustic cavity 1221, and after being adjusted by the phase adjustment member 123, it can be radiated into the interior of the outer shell 110.

[0202] The first magnetic circuit assembly 124 may include a first magnet 1241, a first magnetically conductive sheet 1242, and a first U-shaped iron 1243. The first magnet 1241 and the first magnetically conductive sheet 1242 may be stacked on the bottom wall of the first U-shaped iron 1243. At least a portion of the first voice coil 1251a and the first voice coil skeleton 1252a may be located between the first magnetically conductive sheet 1242 and the inner sidewall 113 of the first U-shaped iron 1243. The first magnet 1241 may be a permanent magnet and has a magnetic field. A magnetic gap may be formed between the first magnetically conductive sheet 1242 and the inner sidewall 113 of the first U-shaped iron 1243 so that the first voice coil 1251a and the first voice coil skeleton 1252a can be subjected to a magnetic force within the gap, thereby reciprocating under the action of the magnetic force. The first magnetically conductive sheet 1242 can play a magnetic guiding role to enhance the magnetic field strength of the first magnetic circuit assembly 124.

[0203] Figure 11 for Figure 6 A magnified view of region B in the middle.

[0204] See Figure 11 As shown, the second sound-generating module 130 may include a second magnetic circuit assembly 132, a second vibration assembly 133a, and a second support 134a, wherein the outer edge of the second diaphragm 131 can be connected to one end of the second support 134a through a second suspension edge 135.

[0205] The second resonant assembly 133a may include a second voice coil 1331a and a second voice coil frame 1332a. One end of the second voice coil frame 1332a may be connected to the second diaphragm 131, and the second voice coil 1331a may be fitted onto the other end of the second voice coil frame 1332a. Furthermore, at least a portion of the second voice coil 1331a and the second voice coil frame 1332a may be located within the magnetic field of the second magnetic circuit assembly 132. For example, at least a portion of the second voice coil 1331a and the second voice coil frame 1332a may be located within the magnetic gap of the second magnetic circuit assembly 132.

[0206] The second bracket 134a and the second magnetic circuit assembly 132 can be exposed inside the housing 110 so that the inside of the housing 110 can be used as the rear cavity of the second sound-emitting module 130. For example, the second sound-emitting module 130 can be understood as an open rear cavity.

[0207] The second bracket 134a can also be connected to the housing 110 of the electronic device 100 so that the second sound module 130 can be fixed inside the housing 110 by the second bracket 134a.

[0208] The side of the second diaphragm 131 facing away from the second voice coil frame 1332a can be a sound-emitting surface, which can communicate with the outside of the housing 110 through the sound outlet 115b. For example, see Figure 11As shown, a sound transmission cavity 116b can also be provided inside the outer shell 110. One end of the sound transmission cavity 116b can be connected to the sound outlet 115b opened on the outer shell 110, and the other end of the sound transmission cavity 116b can be connected to the second bracket 134a and communicate with the sound output surface of the second diaphragm 131.

[0209] When an AC audio current signal is input to the second voice coil 1331a, the energized second voice coil 1331a experiences a magnetic force within the magnetic field of the second magnetic circuit assembly 132. The magnitude and direction of this magnetic force change constantly with the magnitude and direction of the current, causing the second voice coil 1331a and the second voice coil frame 1332a to reciprocate. During this reciprocating motion, the second diaphragm 131 reciprocates along with the second voice coil frame 1332a, causing the surrounding air to vibrate and produce sound (i.e., sound waves). The sound generated on the side of the second diaphragm 131 that communicates with the outer casing 110 can be transmitted through the sound transmission cavity 116b to the sound outlet 115b, and radiated to the outside of the outer casing 110 for the user to hear. The sound generated on the side of the second diaphragm 131 facing the second voice coil frame 1332a can radiate into the interior of the outer casing 110.

[0210] The second magnetic circuit assembly 132 may include a second magnet 1321, a second magnetically conductive sheet 1322, and a second U-shaped iron 1323. The second magnet 1321 and the second magnetically conductive sheet 1322 may be stacked on the bottom wall of the second U-shaped iron 1323. At least a portion of the second voice coil 1331a and the second voice coil skeleton 1332a may be located between the second magnetically conductive sheet 1322 and the inner sidewall 113 of the second U-shaped iron 1323. The second magnet 1321 may be a permanent magnet and has a magnetic field. A magnetic gap may be formed between the second magnetically conductive sheet 1322 and the inner sidewall 113 of the second U-shaped iron 1323, so that the second voice coil 1331a and the second voice coil skeleton 1332a can be subjected to a magnetic force within the gap, thereby reciprocating under the action of the magnetic force. The second magnetically conductive sheet 1322 can play a magnetic guiding role to enhance the magnetic field strength of the second magnetic circuit assembly 132.

[0211] Figure 12 This is a schematic diagram of the structure of the third type of sound-generating module provided in the embodiments of this application. Figure 13 for Figure 12 A magnified view of region C in the middle.

[0212] In another possible implementation, see Figure 12 and Figure 13As shown, a set of sound outlets 115 can be provided on the outer casing 110, and the first diaphragm 121 and the second diaphragm 131 can both communicate with the outside of the outer casing 110 through the set of sound outlets 115. For example, a sound outlet 115c can be provided on the outer casing 110, and the first diaphragm 121 and the second diaphragm 131 can both communicate with the sound outlet 115. During the vibration of the first diaphragm 121 and the second diaphragm 131, the sound waves emitted by the side of the first diaphragm 121 and the second diaphragm 131 that communicates with the outer casing 110 can be radiated to the outside of the outer casing 110 through the sound outlet 115c so that the user can listen.

[0213] For example, see Figure 13 As shown, the housing 110 of the electronic device 100 may include a rear cover 112, a side wall 113 surrounding the rear cover 112, and a display screen 114 covering the side wall 113. A sound outlet 115c may be formed on the side wall 113 of the housing 110. The housing 110 may also have a front cavity 117 inside, which can communicate with the sound outlet 115c. The first diaphragm 121 and the second diaphragm 131 can communicate with the sound outlet 115c through the front cavity 117, thereby communicating with the outside of the housing 110 through the front cavity 117 and the sound outlet 115c. During vibration, the sound waves generated by the side of the first diaphragm 121 and the second diaphragm 131 facing the front cavity 117 can be transmitted through the front cavity 117 to the sound outlet 115c, and radiated to the outside of the housing 110 through the sound outlet 115c, so that the user can hear them.

[0214] See also Figure 12 and Figure 13 As shown, the first sound-generating module 120 and the second sound-generating module 130 can be arranged opposite to each other, and the front of the first diaphragm 121 and the front of the second diaphragm 131 can communicate with the outside of the housing 110 through the sound outlet 115c. For example, the front of the first diaphragm 121 and the front of the second diaphragm 131 can communicate with the sound outlet 115c through the front cavity 117 inside the housing 110, and also communicate with the outside of the housing 110 through the sound outlet 115c.

[0215] In this context, the front side of the first diaphragm 121 refers to the side of the first diaphragm 121 that faces away from the magnetic circuit assembly in the first sound-generating module 120. In other words, the front side of the first diaphragm 121 can be understood as the side of the first diaphragm 121 that faces away from the first magnetic circuit assembly 124. Conversely, the back side of the first diaphragm 121 can be understood as the side of the first diaphragm 121 that faces the first magnetic circuit assembly 124. The back side of the first diaphragm 121 is opposite to its front side, and the back side of the first diaphragm 121 can communicate with the acoustic cavity 1221.

[0216] The front side of the second diaphragm 131 refers to the side of the second diaphragm 131 that faces away from the magnetic circuit assembly in the second sound-generating module 130. In other words, the front side of the second diaphragm 131 can be understood as the side of the second diaphragm 131 that faces away from the second magnetic circuit assembly 132. Conversely, the back side of the second diaphragm 131 can be understood as the side of the second diaphragm 131 that faces the second magnetic circuit assembly 132, and the back side of the second diaphragm 131 is opposite to the front side of the second diaphragm 131. That is, in this embodiment, the first sound-generating module 120 and the second sound-generating module 130 can be understood as being arranged face-to-face.

[0217] During the vibration of the first diaphragm 121 and the second diaphragm 131, the sound waves generated on their front surfaces can be transmitted to the front cavity 117, and then transmitted through the front cavity 117 to the sound outlet 115c, and finally radiated to the outside of the housing 110 through the sound outlet 115c so that the user can listen.

[0218] The sound waves generated by the side of the first diaphragm 121 facing the first magnetic circuit assembly 124 (i.e., the back side of the first diaphragm 121) can radiate into the acoustic cavity 1221. These sound waves can be phase-reversed by the phase adjustment member 123 and radiated into the interior of the housing 110. The sound waves generated by the side of the second diaphragm 131 facing the second magnetic circuit assembly 132 (i.e., the back side of the second diaphragm 131) can radiate into the interior of the housing 110. Furthermore, the sound waves radiated into the interior of the housing 110 by the second diaphragm 131 are out of phase with the sound waves radiated into the interior of the housing 110 by the phase adjustment member 123, so that the two out-of-phase sound waves can cancel each other out.

[0219] Figure 14 This is a schematic diagram of the structure of the fourth sound-generating module provided in the embodiments of this application. Figure 15 for Figure 14 A magnified view of region D in the middle.

[0220] Or see Figure 14 and Figure 15 As shown, the first sound-generating module 120 and the second sound-generating module 130 can also be arranged back-to-back, and the back surfaces of the first diaphragm 121 and the second diaphragm 131 can communicate with the outside of the housing 110 through the sound outlet 115c. For example, the back surfaces of the first diaphragm 121 and the second diaphragm 131 can communicate with the sound outlet 115c through the front cavity 117 inside the housing 110, and also communicate with the outside of the housing 110 through the sound outlet 115c. That is, in this embodiment, the first sound-generating module 120 and the second sound-generating module 130 can be understood as being arranged back-to-back.

[0221] During the vibration of the first diaphragm 121 and the second diaphragm 131, the sound waves generated on their back sides can be transmitted to the front cavity 117, and then transmitted through the front cavity 117 to the sound outlet 115c, and finally radiated to the outside of the outer shell 110 through the sound outlet 115c so that the user can listen.

[0222] The sound waves generated on the front of the first diaphragm 121 can radiate into the acoustic cavity 1221. These sound waves can be phase-reversed by the phase adjustment member 123 and radiated into the interior of the housing 110. The sound waves generated on the front of the second diaphragm 131 can radiate into the interior of the housing 110. Furthermore, the sound waves radiated into the interior of the housing 110 by the second diaphragm 131 are out of phase with the sound waves radiated into the interior of the housing 110 by the phase adjustment member 123, so that the two out-of-phase sound waves can cancel each other out.

[0223] For example, in the embodiments of this application, see also... Figure 15 As shown, the electronic device 100 may further include a magnetic circuit assembly 136, and the first sound-generating module 120 and the second sound-generating module 130 may share the magnetic circuit assembly 136. For example, the first sound-generating module 120 may include a first vibration assembly 125b and a first support 126b, and the second sound-generating module 130 may include a second vibration assembly 133b and a second support 134b. The outer edge of the first diaphragm 121 can be connected to one end of the first support 126b via a first suspension edge 127, and the outer edge of the second diaphragm 131 can be connected to one end of the second support 134b via a second suspension edge 135.

[0224] The first resonant assembly 125 may include a first voice coil 1251b and a first voice coil skeleton 1252b, wherein one end of the first voice coil skeleton 1252b may be connected to the first diaphragm 121, and the first voice coil 1251b may be sleeved on the other end of the first voice coil skeleton 1252b. Furthermore, at least a portion of the first voice coil 1251b and the first voice coil skeleton 1252b may be located within the magnetic field of the magnetic circuit assembly 136. For example, at least a portion of the first voice coil 1251b and the first voice coil skeleton 1252b may be located within the magnetic gap of the magnetic circuit assembly 136.

[0225] Correspondingly, the second vibration component 133b may include a second voice coil 1331b and a second voice coil skeleton 1332b. One end of the second voice coil skeleton 1332b may be connected to the second diaphragm 131, and the second voice coil 1331b may be fitted onto the other end of the second voice coil skeleton 1332b. Furthermore, at least a portion of the second voice coil 1331b and the second voice coil skeleton 1332b may be located within the magnetic field of the magnetic circuit component 136. For example, at least a portion of the second voice coil 1331b and the second voice coil skeleton 1332b may be located within the magnetic gap of the magnetic circuit component 136. Moreover, the second vibration component 133b and the first vibration component 125b are located at opposite ends of the magnetic circuit component 136.

[0226] The first bracket 126b and the second bracket 134b can be connected to the outer shell 110 respectively, so that the first sound module 120 can be fixed inside the outer shell 110 through the first bracket 126b, and the second sound module 130 can be fixed inside the outer shell 110 through the second bracket 134b.

[0227] The first vibration component 125b and the second vibration component 133b can share the magnetic circuit component 136. When an AC audio signal is input to the first voice coil 1251b and the second voice coil 1331b, the energized components experience magnetic forces within the magnetic field at both ends of the magnetic circuit component 136. These magnetic forces can change with the magnitude and direction of the current, causing the first vibration component 125b and the second vibration component 133b to reciprocate. During this reciprocating motion, the first vibration component 125b and the second vibration component 133b can respectively drive the first diaphragm 121 and the second diaphragm 131 to reciprocate together, thereby causing the first diaphragm 121 and the second diaphragm 131 to move with the surrounding air and produce sound.

[0228] During the vibration of the first diaphragm 121 and the second diaphragm 131, the sound waves generated by their respective sides facing the magnetic circuit assembly 136 can be transmitted to the front cavity 117, and then to the sound outlet 115c through the front cavity 117. Finally, the sound waves are radiated to the outside of the housing 110 through the sound outlet 115c so that the user can listen to them.

[0229] The side of the first diaphragm 121 facing away from the magnetic circuit assembly 136 communicates with the acoustic cavity 1221. The sound waves generated by the diaphragm facing away from the magnetic circuit assembly 136 can be transmitted into the acoustic cavity 1221 and radiated into the interior of the housing 110 after the phase is adjusted by the phase adjustment member 123. The sound waves generated by the side of the second diaphragm 131 facing away from the magnetic circuit assembly 136 can radiate into the interior of the housing 110. Furthermore, the phase of the sound waves radiated into the interior of the housing 110 by the second diaphragm 131 is opposite to the phase of the sound waves radiated into the interior of the housing 110 by the phase adjustment member 123, so that the two sound waves with opposite phases can cancel each other out, thereby reducing or avoiding vibration of the housing 110 of the electronic device 100.

[0230] Figure 16 This is a schematic diagram of the structure of another electronic device provided in an embodiment of this application.

[0231] This application also provides an electronic device, which can be any device with a sound-emitting device, such as a mobile phone, television, smart screen, laptop computer, tablet computer, ultra-mobile personal computer (UMPC), personal digital assistant (PDA), handheld computer, walkie-talkie, netbook, etc. In this application embodiment, a mobile phone will be used as an example for description.

[0232] See Figure 16 As shown, the electronic device 200 may include a housing 210 and a sound-emitting module 220 located within the housing 210. For example, the housing 210 may have a receiving cavity 211, and the sound-emitting module 220 may be disposed within the receiving cavity 211. For example, the housing 210 of the electronic device 200 may include a rear cover 212, a side wall 113 surrounding the rear cover 212, and a display screen 214 covering the side wall 213. For example, the side wall 213 may be the mid-frame of the electronic device 200, and the display screen 214 may be used to display videos, photos, etc.

[0233] The sound-generating module 220 may include a first diaphragm 221 and a housing 222 surrounding the outer periphery of the first diaphragm 221. One side of the first diaphragm 221 communicates with the outside of the housing 210, and the other side of the first diaphragm 221 may communicate with the inside of the housing 222. Furthermore, the housing 222 and the first diaphragm 221 may be arranged together to form a sound cavity 2221.

[0234] For example, the first diaphragm 221 can be flexibly connected to the housing 222, allowing the first diaphragm 221 to reciprocate relative to the housing 222. During the vibration of the first diaphragm 221, the air on both sides of the first diaphragm 221 vibrates, thereby generating sound waves on both sides of the first diaphragm 221. The sound waves generated on the side of the first diaphragm 221 that communicates with the outside of the housing 210 can radiate to the outside of the housing 210 for the user to hear. The sound waves generated on the side of the first diaphragm 221 that communicates with the inside of the housing 222 can radiate into the acoustic cavity 2221.

[0235] The sound-generating module 220 may also include a phase adjustment element 223. The phase adjustment element 223 may be located at the end of the housing 222 opposite to the first diaphragm 221. The phase adjustment element 223 may be used to radiate the sound waves in the acoustic cavity 2221 to the interior of the housing 210, and may adjust the phase of the sound waves inside the housing 210 so that the phase of the sound waves radiated to the interior of the housing 210 is the same as the phase of the sound waves in the acoustic cavity 2221. It can be understood that the phase adjustment element 223 does not reverse the phase of the sound waves in the acoustic cavity 2221.

[0236] During the operation of the sound-generating module 220, the first diaphragm 221 can drive the air on both sides to vibrate, thereby generating sound waves. The sound waves on both sides of the first diaphragm 221 are out of phase. For example, for ease of understanding, the sound wave phase generated by the side of the first diaphragm 221 that communicates with the outside of the housing 210 can be designated as positive (positive) phase. Conversely, the sound wave phase generated by the side of the first diaphragm 221 that communicates with the inside of the housing 222 can be designated as negative (negative) phase, meaning the sound wave phase inside the acoustic cavity 2221 is negative. Phase adjustment can radiate the sound waves from the acoustic cavity 2221 to the inside of the housing 210, and the phase of the sound waves can be adjusted so that the phase of the sound waves from the acoustic cavity 2221 is the same as the phase of the sound waves radiated into the inside of the housing 210; that is, the phase of the sound waves radiated from the acoustic cavity 2221 to the inside of the housing 210 is also negative. At this time, the phase of the sound wave radiated by the first diaphragm 221 to the outside of the housing 210 is opposite to the phase of the sound wave radiated to the inside of the housing 210 after being adjusted by the phase adjustment component 223. The two sound waves with opposite phases are isolated by the housing 210, which can effectively avoid the problem of acoustic short circuit caused by the sound waves outside the housing 210 and the sound waves inside the housing 210 having opposite phases, and can effectively improve the broadcasting performance of the electronic device 200.

[0237] The electronic device 200 provided in this application embodiment, by setting a phase adjustment member 223 in the sound-emitting module 220, can adjust the phase of the sound waves in the sound cavity 2221. This can make the phase of the sound waves radiated from the sound-emitting module 220 to the outside of the housing 210 opposite to the phase of the sound waves radiated to the inside of the housing 210 after adjustment by the phase adjustment member 223. The two sound waves with opposite phases are isolated from each other by the housing 210, which can effectively reduce or avoid the cancellation of the two sound waves with opposite phases and the generation of acoustic short circuit, thereby effectively improving the sound pressure level of the electronic device 200.

[0238] Figure 17 A phase curve diagram of another phase adjustment device provided in an embodiment of this application.

[0239] In this embodiment, the phase adjustment member 223 and the acoustic cavity 2221 can form a resonator. The resonant frequency of the resonator can be Fb, and the phase adjustment member 223 can radiate sound waves in phase within a frequency range <0.4Fb, so that the phase of the sound waves radiated into the housing 210 is the same as the phase of the sound waves in the acoustic cavity 2221. For example, the value of Fb can be 100Hz to 900Hz. For example, taking Fb as 700Hz as an example, see [reference needed]. Figure 17 As shown, 0.4Fb equals 280Hz, meaning that in the low frequency range <280Hz, the deflection angle of the sound wave phase by the phase adjustment element 223 is 0° to 90°. This can be understood as the sound wave phase before adjustment by the phase adjustment element 223 being in phase with the sound wave phase after adjustment by the phase adjustment element 223. Alternatively, in the frequency range of operating frequency <0.4Fb, the phase adjustment element 223 will not reverse the phase of the sound wave radiated into the housing 210; the phase of the sound wave radiated from the acoustic cavity 2221 into the housing 210 is the same as the phase of the sound wave inside the acoustic cavity 2221. That is, in the low frequency range, the phase of the sound wave radiated by the sound-generating module 220 to the outside of the housing 210 is opposite to the phase of the sound wave radiated to the inside of the housing 210 after being adjusted by the phase adjustment component 223. Furthermore, the two sound waves with opposite phases are isolated from each other by the housing 210, which can effectively avoid the problem of acoustic short circuit of the sound-generating module 220 at low frequencies. This can effectively reduce or avoid the impact of acoustic short circuit on the low frequency sound pressure level of the electronic device 200, thereby effectively improving the low frequency performance of the electronic device 200.

[0240] Figure 18 for Figure 16 A magnified view of region E in the middle.

[0241] In one possible implementation, see Figure 18As shown, the phase adjustment component 223 may include a second diaphragm 2231. The end of the housing 222 opposite to the first diaphragm 221 may have an opening, and the second diaphragm 2231 may be located at the opening and flexibly connected to the inner wall of the opening. In the low-frequency range of the sound-generating module (<0.4Fb), when the sound waves generated in the acoustic cavity 2221 during the vibration of the first diaphragm 221 are transmitted to the second diaphragm 2231, they can drive the second diaphragm 2231 to vibrate. During the vibration of the second diaphragm 2231, it can drive the air inside the housing 210 to vibrate, thereby generating sound waves. Furthermore, the phase of the sound waves inside the housing 210 is the same as the phase of the sound waves inside the acoustic cavity 2221. At this time, the phase adjustment component 223 will not reverse the sound waves in the acoustic cavity 2221. The phase of the sound waves radiated into the housing 210 after adjustment by the second diaphragm 2231 is opposite to the phase of the sound waves radiated into the housing 210 by the first diaphragm 221. The two sound waves with opposite phases are isolated by the housing 210, which can effectively prevent the two sound waves from canceling each other and causing an acoustic short circuit, thereby effectively improving the low-frequency performance of the electronic device 200.

[0242] In this embodiment, the second diaphragm 2231 can satisfy the following formula:

[0243]

[0244] Where Mr is the mass of the second diaphragm 2231, Cb is the equivalent compliance of the air inside the acoustic cavity 2221, and Cb can satisfy the following formula:

[0245]

[0246] Where Vb is the volume of the acoustic cavity 2221, and ρ is the air density, which can be 1.29 kg / m³. 3 C is the speed of sound in air, and the value of C can be 340 m / s. Sr is the vibration area of ​​the second diaphragm 2231.

[0247] From the above formulas, it can be concluded that when the phase adjustment element 223 is the second diaphragm 2231, the resonant frequency Fb of the resonator formed by the phase adjustment element 223 and the acoustic cavity 2221 is related to the mass of the second diaphragm 2231, the volume of the acoustic cavity 2221, and the vibration area of ​​the second diaphragm 2231. Therefore, in the specific design process, the resonant frequency Fb of the resonator can be adjusted by adjusting the mass of the second diaphragm 2231, the volume of the acoustic cavity 2221, and the vibration area of ​​the second diaphragm 2231, so that the resonator can meet the resonance requirements of different frequencies. This allows the phase adjustment element 223 to adjust the phase of sound waves in different frequency bands in the same phase, so that the phase of the sound wave generated by the phase adjustment element 223 inside the housing 210 is opposite to the phase of the sound wave outside the housing 210. The two sound waves with opposite phases can be isolated by the housing 210 to prevent acoustic short circuit, thereby effectively improving the sound pressure level of the sound-generating module 220 in the corresponding low-frequency band.

[0248] For example, in this embodiment, the mass Mr of the second diaphragm 2231 can be in the range of 0.05g to 1g. For example, the mass Mr of the second diaphragm 2231 can be 0.05g, 5g, or 1g. With the volume Vb of the acoustic cavity 2221 and the vibration area Sr of the second diaphragm 2231 remaining unchanged in the above formula, the operating frequency of the sound-generating module 220 can be made <0.4Fb by adjusting the mass Mr of the second diaphragm 2231. In the low-frequency band <0.4Fb, the second diaphragm 2231 can prevent the phase reversal of the sound waves in the acoustic cavity 2221, so that the phase of the sound waves radiated into the housing 210 is in phase with the phase of the sound waves in the acoustic cavity 2221. This makes the phase of the sound waves generated by the sound-generating module 220 outside the housing 210 opposite to the phase of the sound waves generated by the phase adjustment component 223 inside the housing 210. Furthermore, the two sound waves with opposite phases can be isolated by the housing 210, thereby effectively avoiding acoustic short circuits and improving the low-frequency extension performance of the electronic device 200.

[0249] See also Figure 18As shown, the phase adjustment component 223 may further include a folded ring 2232, through which one end of the second diaphragm 2231 can be flexibly connected to the inner wall of the opening. The folded ring 2232 has a certain degree of flexibility, which can reduce the force between the second diaphragm 2231 and the housing 222 during the vibration of the second diaphragm 2231, reducing or avoiding the adverse effects of the force between the housing 222 and the second diaphragm 2231 on the vibration of the second diaphragm 2231. Furthermore, the folded ring 2232 can also isolate the air inside the housing 210 inside the acoustic cavity 2221, thus preventing acoustic short circuits. In addition, the folded ring 2232 can also provide some support for the second diaphragm 2231, reducing or avoiding wobbling of the second diaphragm 2231 during vibration, which is beneficial to improving the stability of the second diaphragm vibration.

[0250] Figure 19 This is a schematic diagram of another phase adjustment component provided in an embodiment of this application.

[0251] In another possible implementation, as shown in the figure, the phase adjustment element 223 may include a phase inverter 2233. One end of the phase inverter 2233 may be connected to the housing 222 and communicate with the acoustic cavity 2221, while the other end of the phase inverter 2233 may communicate with the interior of the outer casing 210. In the low-frequency range where the operating frequency of the sound-generating module is <0.4Fb, when the sound wave generated in the acoustic cavity 2221 during the vibration of the first diaphragm 221 is transmitted to the phase inverter 2233, the sound wave can maintain phase in the phase inverter 2233 and radiate to the interior of the outer casing 210. This ensures that the phase of the sound wave radiated from the phase adjustment element 223 to the interior of the outer casing 210 is the same as the phase of the sound wave in the acoustic cavity 2221, and that the phase of the sound wave radiated from the phase inverter 2233 to the interior of the outer casing 210 is opposite to the phase of the sound wave radiated from the first diaphragm 221 to the exterior of the outer casing 210. For example, the air pressure inside the acoustic cavity 2221 can be transmitted to the air inside the housing 210 through the phase inverter 2233. This reduces the elastic constraint force of the air inside the acoustic cavity 2221 on the first diaphragm 221, allowing the front of the first diaphragm 221 to emit sound waves with a lower frequency response. When the sound-generating module operates in the low-frequency range, the two sound waves with opposite phases, after being isolated by the housing 210, can effectively prevent acoustic short circuits in the sound-generating module 220, thereby effectively improving the low-frequency performance of the electronic device 200.

[0252] In this embodiment, the phase inverter 2233 can satisfy the following formula:

[0253]

[0254] Where Mp is the mass of the air in the phase inverter 2233, and Cb is the equivalent compliance of the air in the acoustic cavity 2221.

[0255] Mp can satisfy the following formula:

[0256] Mp=ρ(LSp)

[0257] Cb can satisfy the following formula:

[0258]

[0259] Where ρ is the air density, and the value of ρ can be 1.29 kg / m³. 3 L is the length of the phase inverter 2233, Sp is the cross-sectional area of ​​the phase inverter 2233, Vb is the volume of the acoustic cavity 2221, and C is the air velocity, which can be 340 m / s.

[0260] From the above formulas, it can be concluded that when the phase adjustment element 223 is a phase inverter 2233, the resonant frequency Fb of the resonator formed by the phase adjustment element 223 and the acoustic cavity 2221 is related to the length of the phase inverter 2233, the volume of the acoustic cavity 2221, and the cross-sectional area of ​​the phase inverter 2233. Therefore, in the specific design process, the resonant frequency Fb of the resonator can be adjusted by adjusting the length and cross-sectional area of ​​the phase inverter 2233 and the volume of the acoustic cavity 2221, so that the resonator can meet the resonance requirements of different frequencies, and the phase adjustment element 223 can adjust the phase of the sound wave in different frequency bands, thereby improving the performance of the electronic device 200 in different low-frequency bands.

[0261] For example, in this embodiment, the length L of the phase inverter 2233 can range from 5mm to 50mm. For instance, the length L of the phase inverter 2233 can be 5mm, 10mm, or 50mm. With the volume Vb of the acoustic cavity 2221 and the cross-sectional area Sp of the phase inverter 2233 remaining constant in the above formula, adjusting the length L of the phase inverter 2233 can make the operating frequency of the sound-generating module 220 < 0.4Fb. In the low-frequency band < 0.4Fb, the phase inverter 2233 can prevent phase reversal of the sound waves within the acoustic cavity 2221, ensuring that the phase of the sound waves radiated into the housing 210 remains in phase with the phase of the sound waves within the acoustic cavity 2221. This results in the sound wave phase outside the housing 210 of the sound-generating module 220 being opposite to the phase of the sound waves radiated into the housing 210 by the phase adjustment member 223. Two sound waves with opposite phases can be isolated by the housing 210, thereby effectively preventing acoustic short circuits in the sound-generating module 220 and effectively improving the low-frequency response performance of the electronic device 200.

[0262] Understandably, besides adjusting the length L of the bass reflex tube 2233, the cross-sectional area Sp of the bass reflex tube 2233 can also be adjusted to ensure that the operating frequency of the sound-generating module 220 is <0.4Fb. For example, the cross-sectional area Sp of the bass reflex tube 2233 can be in the range of 0.3mm.2 ~3mm 2 For example, the cross-sectional area Sp of the phase inverter 2233 can be 0.3 mm². 2 0.1mm 2 2mm 2 3mm 2 With the length L of the inverter 2233 and the volume Vb of the acoustic cavity 2221 remaining constant in the above formula, the operating frequency of the sound-generating module 220 can also be made <0.4Fb by adjusting the cross-sectional area Sp of the inverter 2233. In the low-frequency band <0.4Fb, the inverter 2233 can prevent the phase reversal of the sound waves in the acoustic cavity 2221, so that the phase of the sound waves radiated into the housing 210 remains in phase with the phase of the sound waves in the acoustic cavity 2221, and the two sound waves with opposite phases can be isolated by the housing 210, thereby effectively preventing acoustic short circuits in the sound-generating module 220 and effectively improving the low-frequency response performance of the electronic device 200.

[0263] Alternatively, the operating frequency of the sound-generating module 220 can be made <0.4Fb by adjusting the volume Vb of the acoustic cavity 2221. For example, the volume Vb of the acoustic cavity 2221 can be in the range of 0.2cm. 3 ~2cm 3 For example, the volume Vb of the acoustic cavity 2221 can be 0.2 cm³. 3 0.5cm 3 1cm 3 2cm 3 With the length L and cross-sectional area Sp of the phase inverter 2233 remaining constant in the above formula, the resonant frequency Fb of the resonator can also be adjusted by adjusting the volume of the acoustic cavity 2221, so that the operating frequency of the sound-generating module 220 is <0.4Fb. This ensures that in the low-frequency band <0.4Fb, the phase inverter 2233 does not reverse the phase of the sound waves in the acoustic cavity 2221, so that the phase of the sound waves radiated into the housing 210 remains in phase with the phase of the sound waves in the acoustic cavity 2221, and the two sound waves with opposite phases can be isolated by the housing 210, thereby effectively preventing acoustic short circuits in the sound-generating module 220 and improving the low-frequency performance of the electronic device 200.

[0264] A sound outlet 215 can be provided on the outer casing 210, and the first diaphragm 221 can communicate with the outside of the outer casing 210 through the sound outlet 215. For example, the sound outlet 215 can be provided on the side wall 213 of the electronic device 200. Taking the electronic device 200 as a mobile phone as an example, the sound outlet 215 can be the lower sound outlet 115 of the electronic device 200, that is, the speaker of the electronic device 200.

[0265] Figure 20 for Figure 19 A magnified view of region F in the middle.

[0266] See Figure 20 As shown, the sound-generating module 220 may include a magnetic circuit assembly 224, a vibration assembly 225, and a support 226. The outer edge of the first diaphragm 221 can be connected to one end of the support 226 via a first suspension edge 227. The vibration assembly 225 may include a voice coil 2251 and a voice coil skeleton 2252. One end of the voice coil skeleton 2252 can be connected to the first diaphragm 221, and the voice coil 2251 can be fitted onto the other end of the voice coil skeleton 2252. Furthermore, at least a portion of the voice coil 2251 and the voice coil skeleton 2252 can be located within the magnetic field of the magnetic circuit assembly 224. For example, at least a portion of the voice coil 2251 and the voice coil skeleton 2252 can be located within the magnetic gap of the magnetic circuit assembly 224. The support 226 can be connected to the housing 210 of the electronic device 200 so that the sound-generating module 220 can be fixed within the housing 210 via the support 226.

[0267] The side of the first diaphragm 221 facing away from the voice coil skeleton 2252 can be the sound-emitting surface, which can communicate with the outside of the housing 210 through the sound outlet 215. When an AC audio current signal is input to the voice coil 2251, the energized voice coil 2251 can be subjected to a magnetic force within the magnetic field of the magnetic circuit assembly 224. Furthermore, the magnitude and direction of this magnetic force change constantly with the magnitude and direction of the current, causing the voice coil 2251 and the voice coil skeleton 2252 to reciprocate. During the reciprocating motion of the voice coil 2251 and the voice coil skeleton 2252, the first diaphragm 221 can reciprocate along with it, thereby causing the first diaphragm 221 to vibrate and produce sound (i.e., sound waves). The sound generated on the side of the first diaphragm 221 that communicates with the housing 210 can be radiated to the outside of the housing 210 through the sound outlet 215 for the user to hear. The sound generated by the side of the first diaphragm 221 facing the voice coil skeleton 2252 can be radiated into the acoustic cavity 2221, and after being adjusted by the phase adjustment member 223, it can be radiated into the interior of the outer shell 210.

[0268] See also Figure 20As shown, the magnetic circuit assembly 224 may include a magnet 2241, a magnetic sheet 2242, and a U-shaped iron 2243. The magnet 2241 and the magnetic sheet 2242 may be stacked on the bottom wall of the U-shaped iron 2243. At least a portion of the voice coil 2251 and the voice coil frame 2252 may be located between the magnetic sheet 2242 and the inner sidewall 213 of the U-shaped iron 2243. The magnet 2241 may be a permanent magnet with a magnetic field. A magnetic gap may be formed between the magnetic sheet 2242 and the inner sidewall 213 of the U-shaped iron 2243, allowing the voice coil 2251 to be subjected to a magnetic force within this gap, thus reciprocating under the action of the magnetic force. The magnetic sheet 2242 serves to conduct magnetism, enhancing the magnetic field strength of the first magnetic circuit assembly 224.

[0269] The low-frequency performance of the sound-emitting module 220 of the electronic device 200 provided in the embodiments of this application will be tested below with reference to the accompanying drawings.

[0270] Figure 21 A comparison diagram of the frequency response curves of the sound-generating module provided in the embodiments of this application and the sound-generating module with a closed rear cavity in the related art. Figure 22 A comparison chart of the frequency response curves of the sound-emitting module provided in this application embodiment radiating to the outside of the housing and the sound-emitting module with a closed rear cavity in related technologies radiating to the outside of the housing.

[0271] See Figure 21 As shown, in this test, taking a resonant frequency Fb of 700Hz as an example, curve 1 in the figure is the frequency response curve of the sound wave radiated from the sound-emitting module 220 to the outside of the housing 210 in the electronic device 200 provided in this application embodiment. Curve 2 is the frequency response curve of the sound wave radiated from the phase adjustment member 223 to the inside of the housing 210. Curve 3 is the frequency response curve of the sound wave radiated from the rear-cavity closed sound-emitting module 220 to the outside of the housing 210 in the related art. See also Figure 22 As shown, for ease of observation, Figure 22 Only curves 1 and 3 are shown, from Figure 21 and Figure 22 As can be seen, in the frequency range of <280Hz (i.e. <0.4Fb), the value of the vertical axis of curve 3 is greater than that of curve 3. It can be seen that the sound pressure level of the sound wave radiated to the outside of the housing 210 by the sound-emitting module 220 provided in this application embodiment is higher than the sound pressure level of the sound wave radiated to the outside of the housing 210 by the rear cavity closed sound-emitting module 220 in the related art. Therefore, the sound-emitting module 220 of the electronic device 200 provided in this application embodiment has better low-frequency performance.

[0272] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection or an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. The directional terms mentioned in the embodiments of this application, such as "upper," "lower," "left," "right," "inner," and "outer," are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the referred device or component must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. "Multiple" refers to at least two. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances. The terms "first," "second," "third," "fourth," etc. (if present) are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0273] In the embodiments of this application, "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0274] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0275] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them. Although the embodiments of this application have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. An electronic device, characterized in that, It includes a housing and a first sound-emitting module and a second sound-emitting module located within the housing; The first sound-generating module includes a first diaphragm and a shell surrounding the outer periphery of the first diaphragm. One side of the first diaphragm communicates with the outside of the shell, and the other side of the first diaphragm communicates with the inside of the shell. The shell and the first diaphragm together form a sound cavity. The second sound-emitting module has a second diaphragm, one side of which communicates with the outside of the housing, and the other side of which communicates with the inside of the housing; The first sound-generating module further includes a phase adjustment component, which is located at the end of the housing opposite to the first diaphragm; The phase adjustment element is used to radiate the sound waves in the acoustic cavity to the interior of the outer shell, and to adjust the phase of the sound waves radiated to the interior of the outer shell to be opposite to the phase of the sound waves in the acoustic cavity.

2. The electronic device according to claim 1, characterized in that, The phase adjustment element and the acoustic cavity form a resonator with a resonant frequency of Fb, and the phase of the sound wave radiated by the phase adjustment element in the frequency range of 0.4 Fb to 1.5 Fb is reversed.

3. The electronic device according to claim 1 or 2, characterized in that, The phase adjustment component includes a third diaphragm, and the housing has an opening at one end opposite to the first diaphragm. The third diaphragm is located at the opening and is flexibly connected to the inner wall of the opening.

4. The electronic device according to claim 3, characterized in that, The third diaphragm satisfies the following formula: Wherein, Mr is the mass of the third diaphragm, and Cb is the equivalent compliance of the air inside the acoustic cavity; The Cb satisfies the following formula: Wherein, Vb is the volume of the acoustic cavity, ρ is the air density, C is the air speed of sound, and Sr is the vibration area of ​​the third diaphragm.

5. The electronic device according to claim 3, characterized in that, The mass of the third diaphragm is 0.05 g to 1 g.

6. The electronic device according to claim 3, characterized in that, The phase adjustment component also includes a folded ring, through which the third diaphragm is flexibly connected to the inner wall of the opening.

7. The electronic device according to claim 1 or 2, characterized in that, The phase adjustment component includes a phase inverter tube, one end of which is connected to the housing and communicates with the acoustic cavity, and the other end of which is connected to the interior of the housing.

8. The electronic device according to claim 7, characterized in that, The phase inverter satisfies the following formula: Wherein, Mp is the mass of the air in the phase inverter, and Cb is the equivalent compliance of the air in the acoustic cavity; The Mp satisfies the following formula: The Cb satisfies the following formula: Wherein, ρ is the air density, L is the length of the phase inverter, Vb is the volume of the acoustic cavity, C is the air velocity, and Sp is the cross-sectional area of ​​the phase inverter.

9. The electronic device according to claim 7, characterized in that, The length of the phase inverter is 5 mm to 50 mm.

10. The electronic device according to claim 7, characterized in that, The cross-sectional area of ​​the phase inverter is 0.3 mm² to 3 mm².

11. The electronic device according to any one of claims 1, 2, 4-6, 8-10, characterized in that, The volume of the acoustic cavity is 0.2 cm³ to 2 cm³.

12. The electronic device according to any one of claims 1, 2, 4-6, 8-10, characterized in that, The outer shell has two sets of sound outlets, and the first diaphragm communicates with the outside of the outer shell through one of the two sets of sound outlets; The second diaphragm communicates with the outside of the housing through another of the two sets of sound outlets.

13. The electronic device according to claim 12, characterized in that, The housing of the electronic device includes a rear cover, a side wall surrounding the rear cover, and a display screen covering the side wall. One of the two sets of sound outlets is located between the display screen and the side wall, and the other of the two sets of sound outlets is located on the side wall, with the two sets of sound outlets located at opposite ends of the display screen.

14. The electronic device according to any one of claims 1, 2, 4-6, 8-10, characterized in that, The outer casing has a set of sound outlets, and both the first diaphragm and the second diaphragm are connected to the outside of the outer casing through the set of sound outlets.

15. The electronic device according to claim 14, characterized in that, The housing of the electronic device includes a rear cover, a side wall surrounding the rear cover, and a display screen covering the side wall. The set of sound outlets is located on the side wall, and the interior of the housing also has a front cavity, which is connected to the set of sound outlets. The first diaphragm and the second diaphragm are connected to the sound outlets through the front cavity.

16. The electronic device according to any one of claims 12, characterized in that, The first sound-generating module further includes a first magnetic circuit assembly, a first vibration assembly, and a first support; The first bracket is connected to the outer shell, and the outer edge of the first diaphragm is connected to one end of the first bracket through a first suspension edge; The first vibration component includes a first voice coil and a first voice coil skeleton. One end of the first voice coil skeleton is connected to the first diaphragm, and the first voice coil is sleeved on the other end of the first voice coil skeleton. At least a portion of the first voice coil and the first voice coil skeleton are located within the magnetic field of the first magnetic circuit component.

17. The electronic device according to claim 16, characterized in that, The first magnetic circuit assembly includes a first magnet, a first magnetic sheet, and a first U-shaped iron. The first magnet and the first magnetic sheet are stacked on the bottom wall of the first U-shaped iron, and at least part of the first voice coil and the first voice coil frame are located between the first magnetic sheet and the inner sidewall of the first U-shaped iron.

18. The electronic device according to any one of claims 12, characterized in that, The second sound-generating module also includes a second magnetic circuit assembly, a second vibration assembly, and a second support. The second bracket is connected to the outer shell, and the outer edge of the second diaphragm is connected to one end of the second bracket through the second suspension edge; The second vibration component includes a second voice coil and a second voice coil skeleton. One end of the second voice coil skeleton is connected to the second diaphragm, and the second voice coil is sleeved on the other end of the second voice coil skeleton. At least a portion of the second voice coil and the second voice coil skeleton are located within the magnetic field of the second magnetic circuit component. The second bracket and the second magnetic circuit assembly are exposed inside the housing so that the interior of the housing serves as the rear cavity of the second sound-emitting module.

19. The electronic device according to claim 18, characterized in that, The second magnetic circuit assembly includes a second magnet, a second magnetic sheet, and a second U-shaped iron. The second magnet and the second magnetic sheet are stacked on the bottom wall of the second U-shaped iron, and at least part of the second voice coil and the second voice coil frame are located between the second magnetic sheet and the inner sidewall of the second U-shaped iron.

20. The electronic device according to claim 14, characterized in that, The first sound-generating module and the second sound-generating module are arranged opposite to each other, and the front surfaces of the first diaphragm and the second diaphragm are connected to the outside of the housing through the set of sound outlets; The front side of the first diaphragm is the side of the first diaphragm that faces away from the magnetic circuit components in the first sound-generating module, and the front side of the second diaphragm is the side of the second diaphragm that faces away from the magnetic circuit components in the second sound-generating module.

21. The electronic device according to claim 14, characterized in that, The first sound-emitting module and the second sound-emitting module are arranged opposite to each other, and the back surfaces of the first diaphragm and the second diaphragm are connected to the outside of the housing through the set of sound outlets; The back side of the first diaphragm is the side of the first diaphragm facing the magnetic circuit assembly in the first sound-generating module, and the back side of the second diaphragm is the side of the second diaphragm facing the magnetic circuit assembly in the second sound-generating module.

22. The electronic device according to claim 21, characterized in that, It also includes a magnetic circuit assembly, which is shared by the first sound-generating module and the second sound-generating module; The first sound-generating module includes a first vibration component and a first support, and the second sound-generating module includes a second vibration component and a second support, wherein the first support and the second support are respectively connected to the outer shell; The outer edge of the first diaphragm is connected to one end of the first bracket via a first suspension edge, and the outer edge of the second diaphragm is connected to one end of the second bracket via a second suspension edge; The first vibration component includes a first voice coil and a first voice coil skeleton. One end of the first voice coil skeleton is connected to the first diaphragm, and the first voice coil is sleeved on the other end of the first voice coil skeleton. At least a portion of the first voice coil and the first voice coil skeleton are located within the magnetic field of the magnetic circuit component. The second vibration component includes a second voice coil and a second voice coil skeleton. One end of the second voice coil skeleton is connected to the second diaphragm, and the second voice coil is sleeved on the other end of the second voice coil skeleton. At least a portion of the second voice coil and the second voice coil skeleton are located within the magnetic field of the magnetic circuit component. The second vibration component and the first vibration component are located at opposite ends of the magnetic circuit component.

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