Surface element hydrophone array design method based on rigid insulation backing

Abstract

The invention relates to a surface element hydrophone array design method based on a rigid insulating backing. A rigid insulating material is used as the rigid insulating backing; designing a plurality of electrodes on the rigid insulating backing as required, and enabling the plurality of electrodes formed on the surface of the rigid insulating backing to be mutually insulated; a through hole is formed in each electrode, the through holes penetrate through the electrodes from outside to inside and extend into the rigid insulation backing on the back face, and conductive materials are arranged in the through holes so that the corresponding electrodes can be led out. According to the invention, a patterned electrode structure can be freely customized on the rigid insulating backing according to requirements, and a plurality of electrodes are led out by directly utilizing the rigid insulating backing, so that the problem of device cutting and reassembling is avoided, and the difficulty of an arraying process is greatly reduced.

Description

Technical Field

[0001] The invention belongs to the technical field of hydrophones, and in particular relates to a design method for a surface element hydrophone array based on a rigid insulating backing. Background Art

[0002] Piezoelectric copolymer facet hydrophones require a rigid backing structure to improve sensitivity. Common backing materials include metal materials such as copper. As described in a design method for lightweight backing of a piezoelectric film facet hydrophone disclosed in Chinese patent application No. 202311688601.1, alumina ceramics are used instead of copper as the backing material, which reduces the weight of the hydrophone. However, the above scheme requires the entire device to be cut and then assembled when arranging the array, which requires a lot of processing costs and process steps, increases the complexity of the system and the risk of failure, especially when making large-scale high-frequency arrays of small elements densely packed, the process is extremely difficult. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide a method for designing a surface-based hydrophone array based on a rigid insulating backing. This method can freely customize the patterned electrode structure on the rigid insulating backing according to needs, and directly use the rigid insulating backing to lead out multiple electrodes, thereby avoiding the problem of device cutting and reassembly, and greatly reducing the difficulty of the array process.

[0004] The technical solution of the present invention is to provide a method for designing a panel hydrophone array based on a rigid insulating backing, and the specific design is as follows: Using rigid insulation material as rigid insulation backing; Designing multiple electrodes on the rigid insulating backing as required, and insulating the multiple electrodes formed on the surface of the rigid insulating backing from each other; A through hole is opened on each electrode, the through hole penetrates the electrode from outside to inside and extends into the rigid insulating backing on the back, and a conductive material is arranged in the through hole to realize the lead-out of the corresponding electrode.

[0005] Preferably, the rigid insulating material is an alumina ceramic material.

[0006] Preferably, the electrode is formed on the surface by printing using a metal material.

[0007] Preferably, the electrode is formed on the surface of the rigid insulating backing by sputtering a metal material.

[0008] Preferably, the through hole formed on the electrode is a screw hole, the conductive material is a metal screw, and the metal screw is threadedly connected in the screw hole to realize the lead-out of the corresponding electrode.

[0009] Preferably, the cross-section of the rigid insulating backing is square, wherein one side of the rigid insulating backing is a bonding surface, and each electrode is formed on at least the bonding surface of the rigid insulating backing and at least one side adjacent to the bonding surface; the piezoelectric device is directly bonded to the bonding surface of the rigid insulating backing, and there is no electrode design on the surface of the piezoelectric device bonded to the bonding surface, and the piezoelectric device draws out signals through the electrodes on the rigid insulating backing.

[0010] Compared with the prior art, the present invention has the following advantages: The present invention provides a method for designing a surface-based hydrophone array based on a rigid insulating backing, which utilizes alumina ceramics and other rigid insulating materials instead of copper and other metal materials as the backing, and freely customizes a patterned electrode structure on the backing. Under the premise of ensuring the sensitivity enhancement effect of the rigid backing, multiple electrodes formed on the surface are insulated from each other. In this way, multiple electrodes are directly led out using the rigid insulating backing, avoiding the problem of cutting and reassembling the devices when forming the array, and greatly reducing the system complexity and the difficulty of the array layout process. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a schematic diagram of the rigid insulating backing patterned electrode structure of the present invention.

[0012] Figure 2 It is a schematic diagram of the structure of the facet hydrophone array based on a rigid insulating backing according to the present invention. DETAILED DESCRIPTION

[0013] The present invention will be further described below with regard to specific embodiments: A design method for a facet hydrophone array based on a rigid insulating backing, such as Figure 1 As shown, the specific design is as follows: A rigid insulating material is used as the rigid insulating backing 1. In this embodiment, the rigid insulating backing 1 is an alumina ceramic material, which has the characteristics of high rigidity and good insulation. A plurality of electrodes 2 are designed on the rigid insulating backing 1 as required, and the plurality of electrodes 2 formed on the surface of the rigid insulating backing 1 are insulated from each other; the electrodes 2 can be formed on the surface of the rigid insulating backing 1 by printing or sputtering; A through hole 3 is provided on each electrode 2, the through hole 3 penetrates the electrode 2 from outside to inside and extends into the rigid insulating backing 1 on the back, and a conductive material is arranged in the through hole 3 to realize the lead-out of the corresponding electrode 2. In this embodiment, the through hole 3 provided on the electrode 2 is a screw hole, the conductive material is a metal screw, and the metal screw is threadedly connected in the screw hole to realize the lead-out of the corresponding electrode 2.

[0014] Further, such as Figure 2As shown, the piezoelectric device 4 is directly bonded to the rigid insulating backing 1 . The bonding surface of the piezoelectric device 4 itself has no electrodes, but the signal is led out by means of the electrodes 2 on the rigid insulating backing 1 .

[0015] Specifically, in this embodiment, the cross section of the rigid insulating backing 1 is a rectangle, wherein one side of the rigid insulating backing 1 is a bonding surface, which is used to bond with the piezoelectric device 4, and each electrode 2 on the rigid insulating backing 1 is formed on the bonding surface of the rigid insulating backing 1 and one of the side surfaces adjacent to the bonding surface; thus, the piezoelectric device 4 is directly bonded to the bonding surface of the rigid insulating backing 1, and the surface on one side of the piezoelectric device 4 bonded to the bonding surface does not need an electrode design, and the piezoelectric device 4 directly leads out the signal through the electrode 2 on the rigid insulating backing 1. If necessary, each electrode can also be formed around the rigid insulating backing, so that electrodes are formed on all four sides of the rigid insulating backing.

[0016] The present invention utilizes rigid insulating materials such as alumina ceramics instead of metal materials such as copper as a backing, and can freely customize a patterned electrode structure on the rigid insulating backing as required. Multiple electrodes are directly led out using the rigid insulating backing, thus avoiding the problem of device cutting and reassembly, and greatly reducing the difficulty of the array process.

[0017] The above is only an explanation of the preferred embodiments of the present invention, which should not be construed as a limitation on the claims. Any equivalent process changes made using the present invention specification are included in the patent protection scope of the present invention.

Claims

1. A method for designing a faceted hydrophone array based on a rigid insulating backing, characterized in that: Using rigid insulation material as rigid insulation backing; Designing multiple electrodes on the rigid insulating backing as required, and insulating the multiple electrodes formed on the surface of the rigid insulating backing from each other; A through hole is opened on each electrode, the through hole penetrates the electrode from outside to inside and extends into the rigid insulating backing on the back, and a conductive material is arranged in the through hole to realize the lead-out of the corresponding electrode.

2. The method for designing a panel hydrophone array based on a rigid insulating backing according to claim 1, characterized in that: The rigid insulating material is alumina ceramic material.

3. The method for designing a panel hydrophone array based on a rigid insulating backing according to claim 1, characterized in that: The rigid insulating material is alumina ceramic material.

4. The method for designing a panel hydrophone array based on a rigid insulating backing according to claim 1, characterized in that: The electrodes are formed on the surface by printing metal materials.

5. The method for designing a panel hydrophone array based on a rigid insulating backing according to claim 1, characterized in that: The electrode is formed on the surface of a rigid insulating backing by sputtering a metal material.

6. The method for designing a panel hydrophone array based on a rigid insulating backing according to claim 1, characterized in that: The through hole opened on the electrode is a screw hole, the conductive material is a metal screw, and the metal screw is threadedly connected in the screw hole to realize the lead-out of the corresponding electrode.

7. The method for designing a panel hydrophone array based on a rigid insulating backing according to claim 1, characterized in that: The cross-section of the rigid insulating backing is square, wherein one side of the rigid insulating backing is a bonding surface, and each electrode is formed on at least the bonding surface of the rigid insulating backing and at least one side adjacent to the bonding surface; the piezoelectric device is directly bonded to the bonding surface of the rigid insulating backing, and there is no electrode design on the surface of the piezoelectric device bonded to the bonding surface, and the piezoelectric device draws out signals through the electrodes on the rigid insulating backing.

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